Dresser cleaning device and substrate polishing device

Abstract

A dresser cleaning device includes a cleaning nozzle that sprays a cleaning fluid for cleaning a dresser onto the dresser, a movement mechanism that moves at least one of the dresser and the cleaning nozzle in a direction in which the dresser and the cleaning nozzle approach each other or separate from each other, a load sensor that detects a load applied to the dresser when the cleaning nozzle sprays the cleaning fluid onto the dresser, and a distance control unit that adjusts a distance between the dresser and the cleaning nozzle using the movement mechanism based on a detection value of the load sensor.

Description

CROSS-REFERENCE TO RELATED APPLICATION

[0001] Priority is claimed on Japanese Patent Application No. 2024-059926, filed on Apr. 3, 2024, the content of which is incorporated herein by reference.BACKGROUND OF THE INVENTIONField of the Invention

[0002] The present invention relates to a dresser cleaning device and a substrate polishing device.Description of Related Art

[0003] A chemical mechanical polishing (CMP) device used for polishing a substrate such as a semiconductor wafer includes a polishing table on which a polishing pad is attached on an upper surface of a turntable, and a top ring that holds the substrate between the polishing table and the top ring.

[0004] In the CMP device, while rotating each of the polishing table and the top ring, the substrate is pressed against the polishing surface (upper surface) of the polishing pad at a predetermined pressure by the top ring, and the surface of the substrate is polished to be flat and mirror-surface while supplying a polishing liquid to the polishing surface. As the polishing liquid, a liquid in which abrasive grains consisting of fine particles such as silica are suspended in an alkaline solution is normally used. The substrate is polished (chemically and mechanically polished) by a combined action of a chemical polishing action by alkali and a mechanical polishing action by abrasive grains.

[0005] The polishing performance of the polishing surface of the polishing pad deteriorates due to the attachment of abrasive grains or polishing debris, and the like, as the substrate is polished. Therefore, the CMP device has a dressing device that regenerates a polishing surface of a deteriorated polishing pad.

[0006] The dressing device removes abrasive grains and cutting debris attached to the polishing surface by pressing the dresser driven to rotate against the polishing surface of the polishing table while moving the dresser along the polishing surface and performs flattening and dressing of the polishing surface.

[0007] The dresser is cleaned by a dresser cleaning device. The dresser cleaning device sprays a cleaning fluid onto the dresser with a nozzle to clean the dresser (for example, refer to Japanese Unexamined Patent Application, First Publication No. H9-254018 and Japanese Unexamined Patent Application, First Publication No. H11-347917).SUMMARY OF THE INVENTION

[0008] The cleaning power in the dresser cleaning is determined by cleaning conditions such as a distance between the nozzle and the dresser, a flow rate, a pressure, or the like of the cleaning fluid. In the dresser cleaning device, cleaning conditions are set so that a certain cleaning power can be obtained, but the actual cleaning effect may vary depending for each device.

[0009] An object of an aspect of the present invention is to provide a dresser cleaning device and a substrate polishing device that can obtain a stable cleaning effect.

[0010] A dresser cleaning device according to Aspect 1 of the present invention is a dresser cleaning device that cleans a dresser dressing a polishing surface of a polishing pad for polishing a substrate, the device including: a cleaning nozzle that sprays a cleaning fluid for cleaning the dresser onto the dresser; a movement mechanism that moves at least one of the dresser and the cleaning nozzle in a direction in which the dresser and the cleaning nozzle approach each other or separate from each other; a load sensor that detects a load applied to the dresser when the cleaning nozzle sprays the cleaning fluid onto the dresser; and a distance control unit that adjusts a distance between the dresser and the cleaning nozzle using the movement mechanism based on a detection value of the load sensor.

[0011] In a dresser cleaning device according to Aspect 2 of the present invention, in the dresser cleaning device according to Aspect 1, the cleaning nozzle is disposed to face a dressing surface of the dresser that is in sliding contact with the polishing surface, and the movement mechanism is a dresser lifting and lowering mechanism that adjusts a height position of the dresser.

[0012] A dresser cleaning device according to Aspect 3 of the present invention further includes, in the dresser cleaning device according to Aspect 1 or 2, a cleaning fluid supply unit that supplies the cleaning fluid to the cleaning nozzle, in which the cleaning fluid is a mixed fluid containing a cleaning liquid and a gas.

[0013] A substrate polishing device according to Aspect 4 of the present invention includes the dresser cleaning device according to any one of Aspect 1 to Aspect 3, and a polishing table that holds the polishing pad.

[0014] An aspect of the present invention provides a dresser cleaning device and a substrate polishing device that can obtain a stable cleaning effect.BRIEF DESCRIPTION OF THE DRAWINGS

[0015] FIG. 1 is a perspective view of a substrate polishing device according to an embodiment.

[0016] FIG. 2 is a plan view for describing operations of a dresser swing arm and a dresser of the substrate polishing device according to the embodiment.

[0017] FIG. 3 is a configuration diagram of a dressing device.

[0018] FIG. 4 is a configuration diagram of a dresser cleaning device according to a first embodiment.

[0019] FIG. 5 is a partial configuration diagram of the dresser cleaning device according to the first embodiment.

[0020] FIG. 6 is a configuration diagram of a dresser cleaning device according to a second embodiment.

[0021] FIG. 7 is a configuration diagram showing a first modification example of the dresser cleaning device.

[0022] FIG. 8 is a configuration diagram showing a second modification example of the dresser cleaning device.DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, a dresser cleaning device and a substrate polishing device according to an embodiment of the present invention will be described with reference to the drawings.[Substrate Polishing Device]

[0024] FIG. 1 is a perspective view of a substrate polishing device 1. FIG. 2 is a plan view for describing operations of the dresser swing arm 33 and the dresser 31. FIG. 3 is a configuration diagram of a dressing device 30. FIG. 4 is a configuration diagram of a dresser cleaning device 50. FIG. 5 is a partial configuration diagram of the dresser cleaning device 50.

[0025] As shown in FIG. 1, the substrate polishing device 1 according to an embodiment is provided with a polishing table 10, a top ring device 20, a dressing device 30, a liquid supply mechanism 40, and a dresser cleaning device 50. The substrate polishing device 1 polishes a substrate such as a semiconductor wafer. For example, the substrate polishing device 1 is part of a CMP device that performs polishing, cleaning, and drying of a substrate.

[0026] The polishing table 10 is provided with a turntable 12. The polishing table 10 can be rotated in a direction of the arrow A by a driving force of a motor (not shown). The turntable 12 has a disk shape. A polishing pad 11 can be attached to an upper surface of the turntable 12. Therefore, the polishing table 10 can hold the polishing pad 11. The polishing pad 11 rotates integrally with the turntable 12.

[0027] The top ring device 20 includes a top ring head 21, a top ring drive shaft 22, and a top ring swing arm 23. The top ring head 21 holds the substrate and presses the substrate against the upper surface of the polishing pad 11. The top ring drive shaft 22 is connected to the top ring head 21.

[0028] The top ring swing arm 23 rotatably holds the top ring drive shaft 22. The top ring swing arm 23 is supported by a top ring swing shaft 24. A motor (not shown) connected to the top ring drive shaft 22 is installed inside the top ring swing arm 23. The rotation of the motor is transmitted to the top ring head 21 via the top ring drive shaft 22. As a result, the top ring head 21 is rotated in the direction of the arrow B about the top ring drive shaft 22.

[0029] The top ring drive shaft 22 is connected to a vertical movement actuator (for example, an air cylinder) provided in the top ring swing arm 23. The top ring head 21 vertically moves together with the top ring drive shaft 22 by the vertical movement actuator.

[0030] The top ring swing shaft 24 is provided on the radially outer side of the polishing pad 11. A central axis of the top ring swing shaft 24 extends in the up-down direction. The top ring swing shaft 24 is rotated about a central axis of the top ring swing shaft 24 by a motor (not shown). The top ring device 20 causes the top ring swing arm 23 to swing by rotating the top ring swing shaft 24 about the axis. The top ring device 20 switches the position of the top ring head 21 between a polishing position and a standby position. The polishing position is a position on the polishing pad 11. The standby position is a position outside the polishing pad 11.

[0031] The liquid supply mechanism 40 supplies a polishing liquid and a dressing liquid to a polishing surface of the polishing pad 11. The liquid supply mechanism 40 is provided with a plurality of supply nozzles. The supply nozzle supplies the polishing liquid and the dressing liquid to the polishing surface of the polishing pad 11. The liquid supply mechanism 40 serves as both a polishing liquid supply mechanism and a dressing liquid supply mechanism. The polishing liquid supply mechanism supplies the polishing liquid to the polishing pad 11. The dressing liquid supply mechanism supplies the dressing liquid (for example, pure water) to the polishing pad 11.

[0032] In order to polish the substrate by the substrate polishing device 1, the substrate is held on the lower surface of the top ring head 21, and the top ring head 21 and the polishing table 10 are rotated. In this state, the polishing liquid is supplied to the polishing surface of the polishing pad 11, and the substrate is pressed against the polishing surface of the polishing pad 11 by the top ring head 21. The surface (lower surface) of the substrate is polished (chemically and mechanically polished) by a combined action of a mechanical polishing action by abrasive grains contained in the polishing liquid and a chemical polishing action of the polishing liquid.

[0033] As shown in FIG. 3, the dressing device 30 flattens the polishing surface 11a of the polishing pad 11 and dresses the polishing surface 11a. The dressing device 30 is provided with a dresser 31, a dresser drive shaft 32, a dresser swing arm 33 (dresser support portion), a dresser swing shaft 38, a rotation motor 39, and a swing motor 51.

[0034] The dresser 31 has a plate shape (for example, a disk shape). The dresser 31 is in sliding contact with the polishing surface 11a of the polishing pad 11. A lower surface 31a of the dresser 31 is a dressing surface that is in sliding contact with the polishing surface 11a of the polishing pad 11. Abrasive grains such as diamond particles or the like are fixed to the dressing surface. The dresser 31 is attached to a lower end portion of the dresser drive shaft 32. The dresser drive shaft 32 protrudes downward from the dresser swing arm 33.

[0035] The rotation motor 39 (drive source) is provided in the dresser swing arm 33. The rotation motor 39 is connected to the dresser drive shaft 32. The rotational force of the rotation motor 39 is transmitted to the dresser 31 via the dresser drive shaft 32. The rotation motor 39 rotates the dresser 31 in the direction of the arrow C about the dresser drive shaft 32 (refer to FIG. 1).

[0036] The dresser swing arm 33 is supported by a dresser swing shaft 38. The dresser swing shaft 38 is provided on the radially outer side of the polishing pad 11. A central axis of the dresser swing shaft 38 extends in the up-down direction. The swing motor 51 (drive source) rotates the dresser swing shaft 38 about the central axis.

[0037] As shown in FIG. 2, the dresser swing arm 33 swings (pivots) by the rotation about the axis of the dresser swing shaft 38. The dresser swing arm 33 moves the dresser 31 along the polishing surface 11a by swinging (pivoting). The dresser 31 can switch between a dressing position (refer to FIG. 3) and a standby position (refer to FIG. 4) by the swing (pivoting) of the dresser swing arm 33. The dressing position is a position on the polishing pad 11. The standby position is a position outside the polishing pad 11.[Dresser Cleaning Device] (First Embodiment)

[0038] As shown in FIG. 4, the dresser cleaning device 50 according to the first embodiment is provided with a cleaning nozzle 34, a dresser lifting and lowering mechanism 35, a load sensor 36, a distance control unit 37, and a cleaning fluid supply unit 60.

[0039] The cleaning nozzle 34 is positioned below the dresser 31 at the standby position. The cleaning nozzle 34 is disposed to face the lower surface 31a of the dresser 31. The cleaning nozzle 34 is provided with a nozzle base portion 61 and a plurality of nozzle portions 62. For example, the nozzle base portion 61 is formed in a plate shape (for example, a disk shape). The nozzle base portion 61 is located at a position facing the lower surface 31a of the dresser 31. For example, the upper surface of the nozzle base portion 61 is parallel to the lower surface 31a of the dresser 31.

[0040] The nozzle base portion 61 is located at a position spaced downward from the dresser 31.

[0041] The nozzle portion 62 is provided on the upper surface of the nozzle base portion 61. The nozzle portion 62 protrudes in a direction (for example, upward) approaching the dresser 31 from the upper surface of the nozzle base portion 61. The nozzle portion 62 ejects the cleaning fluid and sprays the cleaning fluid onto the lower surface 31a of the dresser 31.

[0042] For example, the plurality of the nozzle portions 62 are located at different positions on the upper surface of the nozzle base portion 61. For example, the plurality of the nozzle portions 62 include one or a plurality of central nozzle portions 62A and one or a plurality of peripheral nozzle portions 62B. The central nozzle portion 62A is provided at a central portion of the nozzle base portion 61. The peripheral nozzle portion 62B is provided in a peripheral portion surrounding the central portion of the nozzle base portion 61.

[0043] The cleaning fluid supply unit 60 is provided with a cleaning liquid storage unit 63, a gas supply source 64, a cleaning fluid supply control unit 65, and an input device 66. The cleaning fluid supply unit 60 supplies a cleaning fluid to the cleaning nozzle 34.

[0044] For example, the cleaning fluid ejected from the nozzle portion 62 is a mixed fluid (gas-liquid mixed fluid) containing a cleaning liquid and a gas. The cleaning liquid storage unit 63 supplies the cleaning liquid to the cleaning nozzle 34. For example, the cleaning liquid is water. The gas supply source 64 supplies a gas to the cleaning nozzle 34. For example, the gas is air. The cleaning fluid is not limited to the gas-liquid mixed fluid and may be only the cleaning liquid or only the gas.

[0045] The supply control unit 65 ejects the cleaning fluid from the nozzle portion 62 according to a predetermined cleaning condition. The input device 66 is connected to the supply control unit 65. The user can input the cleaning condition to the supply control unit 65 by the input device 66. For example, the input device 66 is a keyboard, or the like.

[0046] The cleaning power when the dresser 31 is cleaned with the cleaning fluid is determined by cleaning conditions such as a distance between the nozzle portion 62 and the dresser 31, a flow rate of the cleaning fluid, a pressure of the cleaning fluid, an ejecting time of the cleaning fluid, and the like. The cleaning nozzle 34 may continuously eject the cleaning fluid or may intermittently eject the cleaning fluid. In a case where the cleaning fluid is intermittently ejected, the ejecting time, the ejecting interval, the number of times of ejecting, and the like are also mentioned as cleaning conditions.

[0047] The dresser lifting and lowering mechanism 35 is provided with a support base portion 52, a connecting portion 53, a main body portion 54, and a lifting and lowering motor 55 (drive source). The dresser lifting and lowering mechanism 35 lifts and lowers the dresser 31.

[0048] The support base portion 52 supports the swing motor 51 provided at the lower end of the dresser swing shaft 38.

[0049] The connecting portion 53 is connected to the support base portion 52. The main body portion 54 extends in the up-down direction. The support base portion 52 can be lifted and lowered along the main body portion 54. For example, the main body portion 54 lifts and lowers the support base portion 52 by a mechanism using a ball screw operated by the lifting and lowering motor 55.

[0050] When the support base portion 52 is lifted, the dresser 31 is lifted together with the swing motor 51, the dresser swing shaft 38, and the dresser swing arm 33. When the support base portion 52 is lowered, the dresser 31 is lowered together with the swing motor 51, the dresser swing shaft 38, and the dresser swing arm 33.

[0051] The dresser lifting and lowering mechanism 35 moves the dresser 31 in a direction in which the dresser 31 approaches and separates from the cleaning nozzle 34 by lifting and lowering the dresser 31. Specifically, the dresser 31 is separated from the cleaning nozzle 34 by lifting. The dresser 31 approaches the cleaning nozzle 34 by lowering. The dresser lifting and lowering mechanism 35 is an example of a “movement mechanism”.

[0052] As shown in FIG. 5, the load sensor 36 detects an upward load (pressing force) applied to the dresser 31 when the cleaning nozzle 34 sprays the cleaning fluid onto the dresser 31. The load sensor 36 has an insertion hole 36a into which the dresser drive shaft 32 is inserted. The lower surface 36b of the load sensor 36 is fixed to the dresser swing arm 33. The upper surface 36c of the load sensor 36 is fixed to the rotation motor 39.

[0053] The dresser 31 can press an object (for example, the polishing surface 11a) downward with a predetermined force by the dresser lifting and lowering mechanism 35. When an upward load (pressing force) is applied to the dresser 31, the load is transmitted to the load sensor 36 through the dresser drive shaft 32 and the rotation motor 39. Therefore, the load sensor 36 can detect the upward load applied to the dresser 31. When the load sensor 36 detects the load, the load sensor 36 transmits a detection signal to the distance control unit 37 (refer to FIG. 4).

[0054] For example, the load sensor 36 is a strain gauge type load cell. As the load sensor 36, a pressure sensor, a piezoelectric element, or the like can also be used. An amplifier that amplifies the detection signal may be provided between the load sensor 36 and the distance control unit 37.

[0055] The distance control unit 37 can adjust the height position of the dresser 31 using the dresser lifting and lowering mechanism 35 based on a detection value of the load sensor 36. The distance control unit 37 controls a lifting and lowering operation of the dresser lifting and lowering mechanism 35 such that the dresser 31 presses the object (for example, the polishing surface 11a) with a predetermined force.

[0056] An input device 70 (for example, a keyboard or the like) for inputting information necessary for executing a program for determining a relationship between the detection value of the load sensor 36 and the height position of the dresser 31 may be connected to the distance control unit 37. The input device 70 can input a command including the height setting or the like of the dresser 31.[Dressing Method]

[0057] As shown in FIG. 3, when the polishing surface 11a of the polishing pad 11 is dressed, the dresser 31 is disposed at a dressing position. The lower surface 31a (dressing surface) of the dresser 31 is brought into sliding contact with the polishing surface 11a of the polishing pad 11. The dresser 31 is rotated about the axis by the rotation motor 39. The dresser swing arm 33 is swung (pivoted) by the rotation of the dresser swing shaft 38 about the axis to cause the dresser 31 to reciprocate.

[0058] By the movement (swinging) of the dresser 31, the polishing debris or the like attached to the polishing surface 11a of the polishing pad 11 is removed, and the polishing surface 11a is regenerated. During the dressing, a dressing liquid (for example, pure water) is supplied onto the polishing surface 11a of the polishing pad 11 by the liquid supply mechanism 40 (refer to FIG. 1). The operation of the dressing device 30 that dresses the polishing surface 11a of the polishing pad 11 is also referred to as a “dressing operation”.[Dresser Cleaning Method](First Step: Disposition Dresser at Standby Position)

[0059] As shown in FIG. 4, the dresser 31 is lifted by using the dresser lifting and lowering mechanism 35. The dresser lifting and lowering mechanism 35 disposes the dresser 31 at the standby position by causing the dresser swing arm 33 to pivot and lowering the dresser 31 to a predetermined height. The dresser lifting and lowering mechanism 35 can finely adjust the height of the dresser 31 as necessary based on the detection value of the load sensor 36.(Second Step: Cleaning of Dresser)<Basic Operation>

[0060] The cleaning nozzle 34 ejects the cleaning fluid from the nozzle portion 62 and sprays the cleaning fluid onto the lower surface 31a of the dresser 31. As a result, the lower surface 31a (dressing surface) of the dresser 31 is cleaned. The supply control unit 65 ejects the cleaning fluid from the nozzle portion 62 according to a predetermined cleaning condition. The cleaning power when cleaning the dresser 31 with the cleaning fluid is determined by the cleaning conditions. The operation of the dresser cleaning device 50 that cleans the lower surface 31a of the dresser 31 is also referred to as a “cleaning operation”.

[0061] By cleaning the dresser 31 using the cleaning nozzle 34, the polishing debris and the like attached to the dresser 31 are removed, and the dresser 31 is cleaned. Therefore, in the next dressing operation, the polishing surface 11a of the polishing pad 11 can be dressed using the dresser 31 having a high degree of cleanliness.<Adjusting Distance between Dresser and Cleaning Nozzle>

[0062] The load sensor 36 detects a load applied to the dresser 31 when the cleaning fluid is sprayed onto the dresser 31.

[0063] The distance control unit 37 adjusts the height position of the dresser 31 using the dresser lifting and lowering mechanism 35 based on the detection value of the load sensor 36. For example, in a case where the detection value of the load sensor 36 is less than a lower limit value of a set range set in advance, the dresser 31 is lowered to approach the cleaning nozzle 34. In a case where the detection value of the load sensor 36 exceeds an upper limit value of the set range set in advance, the dresser 31 is lifted to be separated from the cleaning nozzle 34.

[0064] In the dresser cleaning device 50, a distance H1 (difference in height) between the dresser 31 and the cleaning nozzle 34 when the polishing device is assembled may vary for each device due to the variation or the like in the adjustment position of the constituent components.

[0065] In the dresser cleaning device 50, the height adjustment of the dresser 31 can set the load applied to the dresser 31 in a predetermined range when the cleaning fluid is sprayed onto the dresser 31. Therefore, the cleaning fluid can be sprayed onto the dresser 31 with an appropriate force regardless of the distance H1 between the dresser 31 and the cleaning nozzle 34 in the initial setting.

[0066] The cleaning increases the degree of cleanliness of the dresser 31. In the dressing operation, since the polishing pad 11 can be dressed using the dresser 31 having a high degree of cleanliness, the performance of polishing the substrate by the substrate polishing device 1 can be enhanced.Effects of Dresser Cleaning Device of Embodiment

[0067] The dresser cleaning device 50 is provided with the dresser lifting and lowering mechanism 35 that lifts and lowers the dresser 31, the load sensor 36 that detects a load applied to the dresser 31 in a cleaning operation, and the distance control unit 37 that adjusts the distance between the dresser 31 and the cleaning nozzle 34 based on the detection value of the load sensor 36.

[0068] The dresser cleaning device 50 can set the load applied to the dresser 31 in the cleaning operation within a predetermined range based on the detection value of the load sensor 36. Therefore, the cleaning fluid can be sprayed onto the dresser 31 with an appropriate force regardless of the distance H1 between the dresser 31 and the cleaning nozzle 34 in the initial setting. As a result, when the dresser 31 is cleaned, a stable (that is, with less variation for each device) cleaning effect is obtained. Therefore, in the dressing operation, the polishing pad 11 can be dressed using the dresser 31 having a high degree of cleanliness.

[0069] The dresser cleaning device 50 can spray the cleaning fluid onto the dresser 31 with an appropriate force even in a case where the dresser 31 is consumed by the dressing operation. Therefore, when the dresser 31 is cleaned, a stable (that is, good regardless of the degree of consumption of the dresser 31) cleaning effect can be obtained.

[0070] In the dresser cleaning device 50, even in a case where the pressure or flow rate of the cleaning fluid fluctuates, the distance between the dresser 31 and the cleaning nozzle 34 can be adjusted accordingly, so that the cleaning effect can be stabilized. The pressure or flow rate of the cleaning fluid may vary for each device, but in the dresser cleaning device 50, since the distance between the dresser 31 and the cleaning nozzle 34 can be adjusted, the variation in the cleaning effect can be reduced.

[0071] The cleaning nozzle 34 is disposed to face the lower surface 31a of the dresser 31. Therefore, the separation distance can be adjusted while maintaining the relative posture between the dresser 31 and the cleaning nozzle 34 by adjusting the height position of the dresser 31 using the dresser lifting and lowering mechanism 35. Since the relative posture between the dresser 31 and the cleaning nozzle 34 is unlikely to be disturbed, a good cleaning effect can be obtained.

[0072] The dresser cleaning device 50 is provided with the cleaning fluid supply unit 60. The cleaning fluid supply unit 60 supplies a cleaning fluid, which is a mixed fluid containing a cleaning liquid and a gas, to the cleaning nozzle 34. The effect of cleaning the dresser 31 can be enhanced by using the mixed fluid.

[0073] Since the substrate polishing device 1 shown in FIG. 1 is provided with the dresser cleaning device 50, a stable (that is, with less variation for each device) cleaning effect can be obtained when the dresser 31 is cleaned. Therefore, in the dressing operation, the polishing pad 11 can be dressed using the dresser 31 having a high degree of cleanliness.[Dresser Cleaning Device] (Second Embodiment)

[0074] FIG. 6 is a configuration diagram of a dresser cleaning device 150 according to a second embodiment.

[0075] As shown in FIG. 6, the dresser cleaning device 150 is provided with the cleaning nozzle 34, the dresser lifting and lowering mechanism 35, the load sensor 36, the distance control unit 37, the cleaning fluid supply unit 60, and a nozzle lifting and lowering mechanism 80.

[0076] The dresser cleaning device 150 is different from the dresser cleaning device 50 shown in FIG. 4 in that the dresser cleaning device 150 is provided with the nozzle lifting and lowering mechanism 80.

[0077] The nozzle lifting and lowering mechanism 80 supports the cleaning nozzle 34. The nozzle lifting and lowering mechanism 80 can lift and lower the cleaning nozzle 34. When the cleaning nozzle 34 is lifted, the cleaning nozzle 34 approaches the dresser 31. When the cleaning nozzle 34 is lowered, the cleaning nozzle 34 is separated from the dresser 31. The nozzle lifting and lowering mechanism 80 is an example of a “movement mechanism”.

[0078] The distance control unit 37 can adjust the height position of the cleaning nozzle 34 using the nozzle lifting and lowering mechanism 80 based on the detection value of the load sensor 36. As a result, the distance control unit 37 can adjust the distance between the dresser 31 and the cleaning nozzle 34.

[0079] The distance control unit 37 can adjust the height position of at least one of the dresser 31 and the cleaning nozzle 34. As a result, at least one of the dresser 31 and the cleaning nozzle 34 can be moved in a direction in which the dresser 31 and the cleaning nozzle 34 approach each other and separate from each other.

[0080] Specifically, the distance control unit 37 can adjust the height position of only the dresser 31 out of the dresser 31 and the cleaning nozzle 34. The distance control unit 37 can also adjust the height position of only the cleaning nozzle 34 out of the dresser 31 and the cleaning nozzle 34. The distance control unit 37 can also adjust the height positions of both the dresser 31 and the cleaning nozzle 34.[Dresser Cleaning Device] (First Modification Example)

[0081] FIG. 7 is a configuration diagram showing a first modification example of the dresser cleaning device.

[0082] The dresser cleaning device 250 is further provided with a measurement unit 90 that measures a distance between the dresser 31 and the cleaning nozzle 34. For example, the measurement unit 90 is provided in the dresser lifting and lowering mechanism 35.

[0083] The measurement unit 90 can measure the distance between the dresser 31 and the cleaning nozzle 34 based on the number of rotations of the ball screw.

[0084] The distance control unit 37 can finely adjust the height position of the dresser 31 based on a measured value (the distance between the dresser 31 and the cleaning nozzle 34) of the measurement unit 90. As a result, the cleaning conditions can be accurately adjusted.[Dresser Cleaning Device] (Second Modification Example)

[0085] FIG. 8 is a configuration diagram showing a second modification example of the dresser cleaning device.

[0086] The dresser cleaning device 350 is further provided with a pressure sensor 100 that detects the pressure of the cleaning fluid in the cleaning fluid supply unit 60.

[0087] The distance control unit 37 can finely adjust the height position of the dresser 31 based on a measured value (the pressure of the cleaning fluid supplied to the cleaning nozzle 34) of the pressure sensor 100. As a result, the cleaning conditions can be accurately adjusted.

[0088] While preferred embodiments of the invention have been described and illustrated above, it should be understood that these are exemplary of the invention and are not to be considered as limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the invention. Accordingly, the invention is not to be considered as being limited by the foregoing description and is only limited by the scope of the appended claims.

[0089] Although the dressing device 30 shown in FIG. 4 and the like is provided with the dresser 31, the dresser drive shaft 32, the dresser swing arm 33 (dresser support portion), the dresser swing shaft 38, the rotation motor 39, and the swing motor 51, the configuration of the dressing device of the embodiment is not limited thereto. For example, the dressing device may have the configuration including the dresser 31, the dresser drive shaft 32, the dresser swing arm 33 (dresser support portion), the dresser swing shaft 38, the rotation motor 39, the swing motor 51, and the dresser cleaning device 50 in FIG. 4.

[0090] When cleaning the dresser 31, primary cleaning by high-pressure ejection and secondary cleaning by low-pressure ejection may be combined. The dresser 31 may be cleaned by selectively using a plurality of the nozzle portions 62 having different ejecting angles of the cleaning fluid. A plurality of cleaning operations using mixed fluid in which a ratio between the cleaning liquid and the gas is different from each other may be combined. By appropriately selecting these cleaning methods, it is possible to shorten the cleaning time, reduce the amount of cleaning fluid used, improve the degree of cleanliness, and the like as a whole.

[0091] The dresser lifting and lowering mechanism is not limited to the ball screw mechanism, and other lifting and lowering mechanisms may be employed. For example, a support base portion may be capable of being lifted and lowered by a cylinder mechanism provided in the main body portion.

Claims

1. A dresser cleaning device that cleans a dresser dressing a polishing surface of a polishing pad for polishing a substrate, the device comprising:a cleaning nozzle that sprays a cleaning fluid for cleaning the dresser onto the dresser;a movement mechanism that moves at least one of the dresser and the cleaning nozzle in a direction in which the dresser and the cleaning nozzle approach each other or separate from each other;a load sensor that detects a load applied to the dresser when the cleaning nozzle sprays the cleaning fluid onto the dresser; anda distance control unit that adjusts a distance between the dresser and the cleaning nozzle using the movement mechanism based on a detection value of the load sensor.

2. The dresser cleaning device according to claim 1, whereinthe cleaning nozzle is disposed to face a dressing surface of the dresser that is in sliding contact with the polishing surface, andthe movement mechanism is a dresser lifting and lowering mechanism that adjusts a height position of the dresser.

3. The dresser cleaning device according to claim 1, further comprising:a cleaning fluid supply unit that supplies the cleaning fluid to the cleaning nozzle, whereinthe cleaning fluid is a mixed fluid containing a cleaning liquid and a gas.

4. A substrate polishing device comprising:the dresser cleaning device according to claim 1; anda polishing table that holds the polishing pad.

5. A substrate polishing device comprising:the dresser cleaning device according to claim 2; anda polishing table that holds the polishing pad.

6. A substrate polishing device comprising:the dresser cleaning device according to claim 3; anda polishing table that holds the polishing pad.

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