Filtering apparatus, combining apparatus, antenna and base station

Abstract

The present application provides a filtering apparatus, a combining apparatus, an antenna, and a base station. The filtering apparatus comprises a first filtering unit circuit. The first filtering unit circuit comprises a first metal wire and a second metal wire, and the first metal wire comprises a first coupling area, a first connecting area, and a second coupling area which are connected in sequence; the second metal wire comprises a third coupling area, a second connecting area, and a fourth coupling area which are connected in sequence. The orthographic projection of the first coupling area on the plane where the surface of the third coupling area is located is at least partially located on the surface of the third coupling area, and the first coupling area and the third coupling area are coupled; the orthographic projection of the second coupling area on the plane where the surface of the fourth coupling area is located is at least partially located on the surface of the fourth coupling area, and the second coupling area and the fourth coupling area are coupled; the first coupling area is directly and electrically connected to the fourth coupling area. According to this scheme, the size of a filtering apparatus is reduced, and the working efficiency of a filtering apparatus is improved.

Description

Filtering device, combining device, antenna and base station

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of the People's Republic of China on April 21, 2023, with application number 202310460103.5 and application name "A filtering device, a combining device, an antenna and a base station", the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the technical field of electronic equipment, and in particular to a filtering device, a combining device, an antenna, and a base station. Background Art

[0004] In wireless communication systems, filtering devices effectively allow useful signals to pass through while attenuating unwanted signals. Wireless communication signals often contain interference signals. Therefore, antenna communication systems incorporate filtering devices to allow signals within the antenna's operating frequency band to pass through them, enabling communication. Interference signals are also attenuated, reducing interference with antenna signals. As wireless devices become increasingly integrated, the demand for miniaturized and lightweight filtering devices is also increasing.

[0005] In addition, the filter device in the prior art usually has many accessories, which results in more intermodulation points in the filter device and more interference to the signal.

[0006] Summary of the Invention

[0007] The present application provides a filtering device, a combining device, an antenna, and a base station, which reduce the size of the filtering device and improve the working efficiency of the filtering device.

[0008] In a first aspect, the present application provides a filtering device comprising a first filtering unit circuit and a supporting structure. The first filtering unit circuit is arranged on the supporting structure, and the supporting structure is used to support the first filtering unit circuit and install the first filtering unit circuit to a set position. Specifically, the first filtering unit circuit comprises a first metal wire and a second metal wire, wherein: the first metal wire comprises a first coupling region, a second coupling region and a first connection region, the first connection region is connected between the first coupling region and the second coupling region, or the first coupling region, the first connection region and the second connection region are connected in sequence; the second metal wire comprises a third coupling region, a fourth coupling region and a second connection region, the second connection region is connected between the third coupling region and the fourth coupling region, or the third coupling region, the second connection region and the fourth coupling region. The orthographic projection of the first coupling region on the plane where the surface of the third coupling region lies is at least partially located on the surface of the third coupling region. The first and third coupling regions are stacked and separated by a first preset dimension, and the first and third coupling regions are coupled together. The orthographic projection of the second coupling region on the plane where the surface of the fourth coupling region lies is at least partially located on the surface of the fourth coupling region. The second and fourth coupling regions are stacked and separated by a preset dimension, and the second and fourth coupling regions are coupled together. The first coupling region is directly electrically connected to the fourth coupling region. The filter device in this solution has a relatively simple structure and is relatively small in size, which facilitates miniaturization and low cost of the filter device. In addition, the filter device has fewer accessories and fewer intermodulation points, resulting in less interference with the signal, which facilitates improved operating efficiency of the filter device.

[0009] The filtering device may further include a housing, which is a one-piece structure. The housing has an inner cavity and an opening communicating with the inner cavity. The inner cavity of the housing is provided with a slot extending toward the opening, into which the support structure is inserted. Because the housing is an integrated structure, the structure of the filtering device is relatively simple, with fewer components and fewer intermodulation points, resulting in less interference with the signal, which is beneficial for improving the operating efficiency of the filtering device. Furthermore, the installation process of the support structure is relatively simple.

[0010] The housing may be a metal housing, which may serve as a reference ground for the first filtering unit.

[0011] In one possible implementation, the support structure is a dielectric substrate, and the first filter unit circuit is formed on the dielectric substrate. Specifically, the first filter unit circuit is formed on the surface or a different layer of the dielectric substrate. In this case, it can be considered that the orthographic projection of the first coupling region on the plane of the dielectric substrate at least partially overlaps with the orthographic projection of the third coupling region on the plane of the dielectric substrate; and the orthographic projection of the second coupling region on the plane of the dielectric substrate at least partially overlaps with the orthographic projection of the fourth coupling region on the plane of the dielectric substrate.

[0012] When the supporting structure is a dielectric substrate, a metal layer can also be formed on the surface of the dielectric substrate. The above-mentioned metal layer avoids the first metal wire and the second metal wire, or in other words, the metal layer avoids the first filter unit circuit, specifically making the metal layer disconnected from the first metal wire and the second metal wire. Specifically, the above-mentioned metal layer and the first metal wire can be set on the same layer; or, the above-mentioned metal layer and the second metal wire can be set on the same layer; or, two metal layers can be formed on the dielectric substrate, and the two metal layers are respectively set on the same layer as the above-mentioned first metal wire and the second metal wire, so as to simplify the preparation process of the filter device. The above-mentioned metal layer can be used as a reference ground for the filter device. The reference ground structure of the filter in this embodiment is simple. In addition, the filter device can be provided with no housing as a reference ground, thereby further reducing the volume of the filter device.

[0013] In one possible implementation, the filtering device includes a first filtering unit and two transmission ports, wherein the two transmission ports are a first transmission port and a second transmission port for connecting to an external device. The first metal wire of the first filtering unit is connected to the first transmission port, and the second metal wire is connected to the second transmission port. The first transmission port and the second transmission port are used to connect to an external device. This solution can utilize the form of cascaded self-coupling of metal wires for filtering, and can achieve a double-pole in-band and double-zero out-of-band band-stop filtering effect, and has a smaller size than filtering devices with equivalent functions.

[0014] When specifically forming the above-mentioned first metal wire and second metal wire, the above-mentioned first coupling region, second coupling region, third coupling region, and fourth coupling region are sheet-shaped, and the first connector and second connection region are linear. In this solution, the width dimensions of the above-mentioned coupling region and the connection region are different. Among them, the impedance of the sheet-shaped first coupling region, second coupling region, third coupling region, and fourth coupling region is low, while the impedance of the linear first connector and second connection region is high. This solution adopts the form of a dual high-low metal wire cascade self-coupling line to achieve an in-band dual-pole and out-band dual-zero band-stop filtering effect. In addition, the coupling area of ​​the above-mentioned sheet-shaped first coupling region, second coupling region, third coupling region, and fourth coupling region is large, and the coupling effect is good, so that the volume of the filtering device can be small.

[0015] When forming the aforementioned coupling regions, their shapes are not restricted. Specifically, the orthographic projection of the first coupling region onto the plane containing the surface of the third coupling region can be the same as the surface shape of the third coupling region, and the orthographic projection of the second coupling region onto the plane containing the surface of the fourth coupling region can be the same as the surface shape of the fourth coupling region. Specifically, when forming the aforementioned first and second metal wires on a dielectric substrate, the shape of the surface of the first coupling region facing the third coupling region can be the same as the surface shape of the third coupling region facing the first coupling region, and the shape of the surface of the second coupling region facing the fourth coupling region can be the same as the surface shape of the fourth coupling region facing the second coupling region. When coupling the aforementioned first and third coupling regions, the coupling area between the first and third coupling regions can be equal to the area of ​​the aforementioned surface of the first coupling region. Similarly, when coupling the aforementioned second and fourth coupling regions, the coupling area between the second and fourth coupling regions can be equal to the area of ​​the aforementioned surface of the second coupling region. This solution facilitates full coupling between the first and third coupling regions, fully utilizing the areas of the first and third coupling regions. Similarly, it also facilitates full coupling between the second and fourth coupling regions, fully utilizing the areas of the second and fourth coupling regions.

[0016] Specifically, the surfaces of the first coupling region, the second coupling region, the third coupling region, and the fourth coupling region may be regular shapes such as square or circular, which facilitates preparation and simulation analysis to determine the operating frequency band.

[0017] Furthermore, to increase the coupling area, the orthographic projection of the first coupling region onto the plane containing the surface of the third coupling region can be completely located on the surface of the third coupling region. This allows the coupling area between the first and third coupling regions to equal the area of ​​the first coupling region, fully utilizing the size of the first coupling region. The orthographic projection of the second coupling region onto the plane containing the surface of the fourth coupling region can be completely located on the surface of the fourth coupling region. This allows the coupling area between the second and fourth coupling regions to equal the area of ​​the second coupling region, fully utilizing the size of the second coupling region.

[0018] To enhance the functionality of the aforementioned filtering device, the filtering device may further include a second filtering unit circuit. The second filtering unit circuit also includes two metal wires, namely a third metal wire and a fourth metal wire. Specifically, the third metal wire includes a fifth coupling region and a third connection region connected to each other, and the fourth metal wire includes a sixth coupling region and a fourth connection region connected to each other. Similar to the third unit circuit, the orthographic projection of the fifth coupling region on the plane containing the surface of the sixth coupling region is at least partially located on the surface of the sixth coupling region, and the fifth and sixth coupling regions are coupled to each other. An end of the third connection region distal to the fifth coupling region is directly electrically connected to an end of the fourth connection region distal to the sixth coupling region, and the third metal wire is directly electrically connected to the second metal wire. This electrically connects the first and second filtering unit circuits to form an integrated structure that operates in coordination. This filtering device utilizes cascaded self-coupling of metal wires for filtering, achieving a three-pole in-band and three-zero out-of-band band-stop filtering effect. Compared to filtering devices with equivalent functionality, it is smaller in size.

[0019] In addition to the above embodiments, the filtering device may also include at least two first filtering unit circuits, which are electrically connected to form an integral structure and work in coordination. Specifically, the first metal wires of two adjacent first filtering unit circuits are directly electrically connected, or the second metal wires of two adjacent filtering unit circuits are directly electrically connected. For example, if the first metal wires of two adjacent first filtering unit circuits are close to each other, the first metal wires of the two adjacent first filtering unit circuits can be directly electrically connected; if the second metal wires of two adjacent first filtering unit circuits are close to each other, the second metal wires of the two adjacent first filtering unit circuits can be directly electrically connected. When three first filtering unit circuits are connected in sequence, one side of the middle first filtering unit circuit is directly electrically connected to the first metal wire of the adjacent first filtering unit circuit via the first metal wire, and the other side is directly electrically connected to the second metal wire of the adjacent first filtering unit circuit via the second metal wire. In short, for each first filtering unit circuit, one of the first and second metal wires inputs a signal and the other outputs a signal. It can be considered that the multiple first filtering unit circuits are connected in series and perform filtering in coordination. The filtering device in this solution can perform multi-order filtering and has a simple structure and a small size.

[0020] In a second aspect, the present application provides a combining device, which includes a first total transmission port, at least two second total transmission ports, and at least two filtering devices of the first aspect. The second metal wires of the at least two filtering devices are electrically connected to the same first total transmission port, and the first metal wire of each filtering device is electrically connected to a second total transmission port. It can be considered that the at least two filtering devices are arranged in parallel. The combining device in this solution can combine multiple signals into one for transmission, and can filter the multiple signals to remove interference signals. Since the filtering device has a simple structure and a small size, the combining device also has a simple structure and a small size.

[0021] When the signal is input from the second main transmission port and output from the first main transmission port, the above-mentioned combining device functions as a combiner. When the signal is transmitted in the reverse direction, specifically, the signal is input from the first main transmission port and output from the second main transmission port, the above-mentioned combining device functions as a splitter.

[0022] In a third aspect, the present application provides an antenna comprising a radiating element and the filtering device of the first aspect. The filtering device is electrically connected to the radiating element and is configured to filter signals transmitted by the radiating element. This solution improves filtering effectiveness and reduces the size of the antenna.

[0023] In a fourth aspect, the present application further provides another antenna comprising a radiating element and a combiner device according to the second aspect. The combiner device is electrically connected to the radiating element and is configured to combine signals of different frequencies into one signal. This solution facilitates reducing the size of the antenna.

[0024] In a fifth aspect, the present application provides a base station comprising a mounting frame and the antenna of the third aspect or the antenna of the fourth aspect, wherein the antenna is mounted on the mounting frame. This solution is beneficial for improving the operating performance of the base station and, due to the small size of the antenna, also improves the integration of the base station. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] FIG1 is a schematic diagram of a communication system architecture applicable to an embodiment of the present application;

[0026] FIG2 is a schematic diagram of a possible structure of a base station in an embodiment of the present application;

[0027] FIG3 is a schematic diagram of a possible composition of an antenna in an embodiment of the present application;

[0028] FIG4 is a schematic structural diagram of a combining device in an embodiment of the present application;

[0029] FIG5 is a schematic diagram of a top view of the structure of a combiner device in an embodiment of the present application;

[0030] FIG6 is a schematic structural diagram of a filtering device according to an embodiment of the present application;

[0031] FIG7 is a schematic diagram of a partial top view of the structure of the filter device in an embodiment of the present application;

[0032] FIG8 is a schematic structural diagram of a first metal wire in an embodiment of the present application;

[0033] FIG9 is a schematic structural diagram of a second metal wire in an embodiment of the present application;

[0034] FIG10 is another partial top view of the structure of the filter device according to an embodiment of the present application;

[0035] FIG11 is another partial top view of the structure of the filter device according to an embodiment of the present application;

[0036] FIG12 is another partial top view schematic diagram of the filter device according to an embodiment of the present application;

[0037] FIG13 is a schematic circuit diagram of a first filter unit on a layer of a dielectric substrate in an embodiment of the present application;

[0038] FIG14 is a schematic circuit diagram of a first filter unit on another layer of a dielectric substrate in an embodiment of the present application;

[0039] FIG15 is another partial top view schematic diagram of the filter device in an embodiment of the present application.

[0040] Figures: 01-antenna; 011-radome; 012-radiating element; 013-reflector; 014-feeding network; 0141-calibration network; 0142-feeding device; 0143-combining device; 0144-filtering device; 02-mounting frame; 03-antenna adjustment bracket; 04-RF processing unit; 05-baseband processing unit; 06-cable; 1-first main transmission port; 2-second main transmission port; 31-first filtering unit circuit; 311-first metal line; 3111-first coupling region; 3112-second coupling region; 3113-first connecting region; 3114-first branch line; 312-second metal line; 3121-third coupling region; 3122-fourth coupling region; 3123-second connecting region; 3124-second branch line; 313 - First transmission line; 314 - Second transmission line; 315 - First transmission port; 316 - Second transmission port; 317 - Metal via; 318 - Metal layer; 32 - Support structure; 321 - First surface; 322 - Second surface; 33 - Housing; 331 - Opening; 332 - Card slot; 34 - Second filtering unit circuit; 341 - Third metal line; 3411 - Fifth coupling region;3412 - third connection region; 3413 - third transmission line; 342 - fourth metal line; 3421 - sixth coupling region; 3422 - fourth connection region; 3423 - fourth transmission line. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0042] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "said", "above", "the", and "this" are intended to also include expressions such as "one or more", unless the context clearly indicates otherwise.

[0043] References in this specification to "one embodiment" or "a specific embodiment" mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. The terms "including," "comprising," "having," and their variations all mean "including but not limited to," unless otherwise specifically stated.

[0044] To facilitate understanding of the filtering device, combining device, antenna, and base station provided in the embodiments of the present application, the following first introduces their application scenarios.

[0045] Figure 1 exemplarily shows a schematic diagram of a communication system architecture applicable to an embodiment of the present application. As shown in Figure 1, the communication system may be a base station antenna feed system. The application scenario may include a communication device and a terminal. In this scenario, the communication device may also be referred to as a base station. Wireless communication can be achieved between the base station and the terminal. The base station may be located in a base station subsystem (BBS), a terrestrial radio access network (UMTS terrestrial radio access network, UTRAN) or an evolved universal terrestrial radio access (E-UTRAN), and is used to provide cell coverage of wireless signals to achieve communication between the terminal device and the wireless network. Specifically, the base station can be a base transceiver station (BTS) in a global system for mobile communication (GSM) or a code division multiple access (CDMA) system, or a node B (NB) in a wideband code division multiple access (WCDMA) system, or an evolutionary node B (eNB or eNodeB) in a long term evolution (LTE) system, or a wireless controller in a cloud radio access network (CRAN) scenario. Alternatively, the base station can also be a relay station, an access point, an on-board device, a wearable device, a g-node (gNodeB or gNB) in a new radio (NR) system, or a base station in a future evolved network, etc., and the embodiments of the present application are not limited thereto.

[0046] FIG2 shows a schematic diagram of a possible structure of a base station. As shown in FIG2 , the base station, as a communication device, may generally include structures such as an antenna 01, a mounting bracket 02, and an antenna adjustment bracket 03. The antenna 01 may include an antenna cover 011. The antenna cover 011 has good electromagnetic wave penetration characteristics in terms of electrical performance and can withstand the influence of harsh external environments in terms of mechanical performance, thereby protecting the antenna 01 from external environmental influences. The antenna 01 can be mounted on the mounting bracket 02 via the antenna adjustment bracket 03 to facilitate the reception or transmission of signals by the antenna 01. Of course, the embodiment shown in FIG2 is merely an optional implementation method. In specific implementations, the antenna and communication equipment in the embodiments of the present application may be different from the embodiment shown in FIG2 .

[0047] In addition, the communication device may further include a radio frequency processing unit 04 and a baseband processing unit 05. For example, the radio frequency processing unit 04 may be used to perform frequency selection, amplification, and down-conversion processing on the signal received by the antenna 01, and convert it into an intermediate frequency signal or a baseband signal and send it to the baseband processing unit 05, or the radio frequency processing unit 04 may be used to convert the baseband processing unit 05 or the intermediate frequency signal into an electromagnetic wave through the antenna 01 after up-conversion and amplification processing and send it out. The baseband processing unit 05 can be connected to the feeding network of the antenna 01 through the radio frequency processing unit 04. In some embodiments, the radio frequency processing unit 04 may also be called a remote radio unit (RRU), or it may also be a radio frequency device in an active antenna unit (AAU), and the baseband processing unit 05 may also be called a baseband unit (BBU).

[0048] In one possible embodiment, as shown in FIG2 , the RF processing unit 04 may be integrated with the antenna 01, and the baseband processing unit 05 may be located at the remote end of the antenna 01. In other embodiments, the RF processing unit 04 and the baseband processing unit 05 may be located at the remote end of the antenna 01. The RF processing unit 04 and the baseband processing unit 05 may be connected via a cable 06.

[0049] More specifically, Figures 2 and 3 may be referred to together. Figure 3 is a schematic diagram of a possible composition of the antenna in an embodiment of the present application. As shown in Figure 3, the antenna 01 of the communication device may include a radiation unit 012 and a reflector 013. The above-mentioned radiation unit 012 may also be called an antenna vibrator, a vibrator, etc., which can effectively send or receive antenna signals. In the antenna 01, the frequencies of different radiation units 012 may be the same or different. The reflector 013 may also be called a base plate, an antenna panel or a reflective surface, etc., which may be made of metal. When the antenna 01 receives a signal, the reflector 013 may reflect the antenna signal to the target coverage area. When the antenna 01 transmits a signal, the reflector 013 may reflect the signal incident on the reflector 013 and transmit it out. The radiation unit 012 is usually placed on one side surface of the reflector 013, which not only greatly enhances the reception or transmission capability of the antenna 01 signal, but also blocks and shields the interference of other radio waves from the back side of the reflector 013 (the back side of the reflector 013 in this application refers to the side opposite to the reflector 013 used to set the radiation unit 012) on the antenna signal reception.

[0050] In antenna 01 of a communication device, radiating element 012 is connected to a feed network 014. Feed network 014 typically consists of controlled impedance signal lines. Feed network 014 can feed signals to radiating element 012 at a specific amplitude and phase, or transmit received signals to baseband processing unit 05 of the communication device at a specific amplitude and phase. Specifically, in some embodiments, feed network 014 can be used to implement different radiation beam directions or connect to calibration network 0141 to obtain calibration signals required by the system. Feed network 014 can also include a feed device 0142 to change the phase of antenna signal radiation. Some modules for expanding performance may also be provided in the feed network 014, such as a combiner 0143 (also referred to as a combiner), which is electrically connected to the radiating unit 012 and can be used to combine signals of different frequencies into one path for transmission through the antenna 01; or, when used in reverse, can be used to divide the signal received by the antenna 01 into multiple paths according to different frequencies and send them to the baseband processing unit 05 for processing; another example is a filtering device 0144 (also referred to as a filter), which is electrically connected to the radiating unit 012 and can be used to filter out interference signals.

[0051] It is worth noting that the embodiments involving the word "specific", "specific setting" and "specific design" that appear in this application all refer to optional embodiments, that is, the embodiment is a possible specific embodiment under the conception of this application, but also includes other possible embodiments.

[0052] In addition, the present application involves the description of several connection methods, and various connection methods are introduced below. The "coupling connection" in the embodiment of the present application refers to indirect coupling, which can be understood as two conductors being electrically conductive in an airless / non-contact manner. In one embodiment, indirect coupling can also be referred to as capacitive coupling, for example, by coupling between the gaps between two conductive parts to form an equivalent capacitor to achieve signal transmission. The "direct electrical connection" in the embodiment of the present application refers to the physical contact and electrical conduction between the two parts; it can also be understood as a form of connection between different components in a circuit structure through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals.

[0053] Figure 4 is a schematic diagram of the structure of a combiner device according to an embodiment of the present application, and Figure 5 is a schematic diagram of a top view of the structure of a combiner device according to an embodiment of the present application. As shown in Figures 4 and 5, in one embodiment, the combiner device includes a first main transmission port 1, a second main transmission port 2, and at least two filter devices 0144. One end of at least two of the filter devices 0144 is connected to the same first main transmission port 1, and the other end of each filter device 0144 is connected to a second main transmission port 2, thereby realizing signal combining or branching of the combiner device.

[0054] For example, taking the above-mentioned combining device including a first filtering device and a second filtering device as an example, the combining device includes a first total transmission port 1 and two second total transmission ports 2. One end of the above-mentioned first filtering device is connected to one second total transmission port 2, one end of the above-mentioned second filtering device is connected to another second total transmission port 2, and the other ends of the above-mentioned first filtering device and the other ends of the above-mentioned second filtering device are both connected to the above-mentioned first total transmission port 1. In this solution, the second total transmission port 2 can be used as a signal input port and the first total transmission port 1 can be used as a signal output port to achieve the combination of two signals.

[0055] During specific operation, the first filter device in the combiner device has a passband frequency band of the first frequency band, and signals in other frequency bands cannot be transmitted through the first filter device. The second filter device has a passband frequency band of the second frequency band, and signals in other frequency bands cannot be transmitted through the second filter device. This combiner device can combine signals in the first frequency band and signals in the second frequency band.

[0056] In a specific embodiment, a filtering device 0144 can be added to the combining device as needed to achieve combining of signals in more frequency bands, which is not limited in this application.

[0057] The first main transmission port 1 and the second main transmission port 2 may be plug-in interfaces, so as to simplify the connection method of the combiner device.

[0058] Furthermore, compared to the above embodiment, by using the combiner device in reverse, the combiner device can also achieve signal splitting. For example, by using the second main transmission port 2 in the above embodiment as a signal output port and the first main transmission port 1 as a signal input port, two signals can be split. In this case, the combiner device can also be referred to as a splitter device.

[0059] Figure 6 is a schematic diagram of the structure of a filter device in an embodiment of the present application, Figure 7 is a schematic diagram of a partial top view of the structure of the filter device in an embodiment of the present application, Figure 8 is a schematic diagram of the structure of a first metal wire in an embodiment of the present application, and Figure 9 is a schematic diagram of the structure of a second metal wire in an embodiment of the present application. As shown in Figures 6 to 9, the filter device in an embodiment of the present application includes a first filter unit circuit 31 and a support structure 32. The first filter unit circuit 31 is disposed on the support structure 32. The first filter unit circuit 31 includes a first metal wire 311 and a second metal wire 312. Specifically, the first metal wire 311 includes a first coupling region 3111, a second coupling region 3112, and a first connection region 3113. The first connection region 3113 is connected between the first coupling region 3111 and the second coupling region 3112. Similarly, the second metal wire 312 includes a third coupling region 3121, a fourth coupling region 3122, and a second connection region 3123. The second connection region 3123 is connected between the third coupling region 3121 and the fourth coupling region 3122. The orthographic projection of the first coupling region 3111 on the plane where the surface of the third coupling region 3121 lies is at least partially located on the surface of the third coupling region 3121. Specifically, the first coupling region 3111 and the second coupling region 3112 overlap, and the gap between the first coupling region 3111 and the third coupling region 3121 is smaller than a first predetermined size, thereby coupling the first coupling region 3111 and the third coupling region 3121. Similarly, the orthographic projection of the second coupling region 3112 on the plane where the surface of the fourth coupling region 3122 lies is at least partially located on the surface of the fourth coupling region 3122. Specifically, the first coupling region 3111 and the second coupling region 3122 overlap, and the gap between the second coupling region 3112 and the fourth coupling region 3122 is smaller than a second predetermined size, thereby coupling the second coupling region 3112 and the fourth coupling region 3122. Furthermore, the first coupling region 3111 is directly electrically connected to the fourth coupling region 3122; the first metal line 311 is connected to the first transmission line 313, and the second metal line 312 is connected to the second transmission line 314. The first transmission line 313 and the second transmission line 314 are used for inputting and outputting signals, respectively. For example, a signal may be input from the first transmission line 313 and output via the first metal line 311, the second metal line 312, and the second transmission line 314; or a signal may be input from the second transmission line 314 and output via the second metal line 312, the first metal line 311, and the first transmission line 313. In short, the signal must pass through the first metal line 311 and the second metal line 312 for filtering, and this is not limited in this application.

[0060] The filter device 0144 in this embodiment has a relatively simple structure and is relatively small in size, which facilitates miniaturization and low cost of the filter device 0144. Furthermore, the filter device 0144 has fewer components and fewer intermodulation points, resulting in less interference with the signal, which helps improve the operating efficiency of the filter device 0144.

[0061] In a specific embodiment, the first coupling region 3111, the first connection region 3113 and the second coupling region 3112 of the above-mentioned first metal wire 311 are connected in sequence, so that the first coupling region 3111, the first connection region 3113 and the second coupling region 3112 are an integrated structure corresponding to different regions of the first metal wire 311; similarly, the third coupling region 3121, the second connection region 3123 and the fourth coupling region 3122 of the above-mentioned second metal wire 312 are connected in sequence, so that the third coupling region 3121, the second connection region 3123 and the fourth coupling region 3122 are an integrated structure corresponding to different regions of the second metal wire 312.

[0062] When the filter devices 0144 in the embodiments of the present application form a combining device, the second metal lines 312 of at least two filter devices 0144 can be electrically connected to the same first main transmission port 1, and the first metal line 311 of each filter device 0144 can be electrically connected to a second main transmission port 2. In a specific embodiment, the combining device includes a first main transmission port 1, at least two second main transmission ports 2, and at least two of the filter devices 0144. The second metal lines 312 of all filter devices 0144 are connected to the first main transmission port 1, and the first metal line 311 of each filter device is electrically connected to a second main transmission port 2. Specifically, the at least two second main transmission ports 2 can be electrically connected to at least two filter devices.

[0063] In the embodiment shown in Figures 6 and 7, the filter device 0144 includes a first filter unit circuit 31 and two transmission ports, namely a first transmission port 315 and a second transmission port 316. The first transmission line 313 of the first filter unit circuit 31 is connected to the first transmission port 315, thereby connecting the first metal line 311 to the first transmission port 315; the second transmission line 314 is connected to the second transmission port 316, thereby connecting the second metal line 312 to the second transmission port 316. The first transmission port 315 and the second transmission port 316 are used to connect to external devices. In this embodiment, filtering can be performed using a cascaded self-coupling method of metal lines, achieving a double-pole in-band and double-zero out-of-band band-stop filtering effect. Compared with the filter device 0144 with equivalent functionality, the filter device 0144 has a smaller size.

[0064] Specifically, the transmission port may be a plug-in interface for plugging and unplugging the transmission port with an external device, so as to simplify the connection method of the filter device 0144 .

[0065] The specific values ​​of the first preset size and the second preset size are not limited and can be selected and designed according to the operating frequency of the filter device 0144. In addition, the first preset sizes can be the same or different, and this application does not impose any limitation.

[0066] In a specific embodiment, there is no limitation on the formation of the first filtering unit circuit 31 and the structure of the supporting structure 32. For example, the first filtering unit circuit 31 may be a sheet metal microstrip line, and the supporting structure 32 may be used to support the sheet metal microstrip line.

[0067] In the embodiments shown in Figures 6 and 7 , the support structure 32 may be a dielectric substrate, and the first filter unit circuit 31 may be formed on the surface or within the dielectric substrate. In the embodiments of the present application, the technical solution of the present application is illustrated by taking the first filter unit circuit 31 formed on the surface of the dielectric substrate as an example.

[0068] As shown in Figures 6 and 7, the orthographic projection of the first coupling region 3111 on the plane of the dielectric substrate at least partially overlaps with the orthographic projection of the third coupling region 3121 on the plane of the dielectric substrate, and the gap between the first coupling region 3111 and the third coupling region 3121 is smaller than a first predetermined dimension, thereby coupling the first coupling region 3111 and the third coupling region 3121. Furthermore, the orthographic projection of the second coupling region 3112 on the plane of the dielectric substrate at least partially overlaps with the orthographic projection of the fourth coupling region 3122 on the plane of the dielectric substrate, and the gap between the second coupling region 3112 and the fourth coupling region 3122 is smaller than a second predetermined dimension, thereby coupling the second coupling region 3112 and the fourth coupling region 3122. In this case, the first predetermined dimension and the second predetermined dimension may correspond to the thickness of the dielectric substrate.

[0069] Referring to Figures 6 to 9 , in a specific embodiment, the first metal wire 311 and the second metal wire 312 can be disposed on different layers of the dielectric substrate. This facilitates the following: the orthographic projection of the first coupling region 3111 on the dielectric substrate plane at least partially overlaps with the orthographic projection of the third coupling region 3121 on the dielectric substrate plane, and the gap between the first coupling region 3111 and the third coupling region 3121 is smaller than a first predetermined dimension. Furthermore, the orthographic projection of the second coupling region 3112 on the dielectric substrate plane at least partially overlaps with the orthographic projection of the fourth coupling region 3122 on the dielectric substrate plane, and the gap between the second coupling region 3112 and the fourth coupling region 3122 is smaller than a second predetermined dimension. In a specific embodiment, the gap between the first coupling region 3111 and the third coupling region 3121 is the same as the gap between the second coupling region 3112 and the fourth coupling region 3122.

[0070] In a further embodiment, the first metal wire 311 and the second metal wire 312 can be provided on both sides of the dielectric substrate, which is conducive to simplifying the manufacturing process. In this case, the first preset size and the second preset size can be equivalent to the thickness of the dielectric substrate.

[0071] When the first metal wire 311 and the second metal wire 312 are disposed on different layers of the dielectric substrate, the first coupling region 3111 and the fourth coupling region 3122 can be directly electrically connected through the metal via 317 .

[0072] Furthermore, to achieve electrical connection between the first coupling region 3111 and the fourth coupling region 3122, a first branch line 3114 may be connected to the first coupling region 3111, and a second branch line 3124 may be connected to the fourth coupling region 3122. The first branch line 3114 and the second branch line 3124 are directly electrically connected. Furthermore, the first branch line 3114 and the second branch line 3124 may be directly electrically connected via a metal via 317.

[0073] Continuing with Figure 6 , in a specific embodiment, the filter device 0144 may further include a housing 33, which is a one-piece structure. The housing 33 has an inner cavity, within which a support structure 32 (a dielectric substrate in the figure) is disposed. To accommodate the support structure 32, the housing 33 has an opening 331 communicating with the inner cavity. Furthermore, the inner cavity of the housing 33 has a slot 332 extending toward the opening 331, allowing the support structure 32 to be inserted into the slot 332. In this embodiment, the one-piece structure of the housing 33 simplifies the structure of the filter device 0144, reduces the number of components, and reduces intermodulation points, resulting in less signal interference and improving the operating efficiency of the filter device 0144. Furthermore, the installation process for the support structure 32 is relatively simple. The housing 33 provides a certain degree of protection for the support structure 32 and the first filter unit circuit 31 disposed therein.

[0074] In a further embodiment, the housing 33 may be made of metal, so that the entire metal housing 33 can serve as the reference ground for the filter device 0144. This further reduces the number of components of the filter device 0144. Furthermore, this embodiment allows the filter device 0144 to form a suspended microstrip structure.

[0075] In the embodiment of the present application, the connection position between the first transmission line 313 and the first metal line 311 is not limited, and the connection position between the second transmission line 314 and the second metal line 312 is also not limited. Referring to Figures 6 to 9, in one embodiment, the first transmission line 313 is directly electrically connected to the end of the first coupling region 3111 away from the first connection region 3113, and the second transmission line 314 is directly electrically connected to the end of the fourth coupling region 3122 away from the second connection region 3123. Figure 10 is another partial top view of the structure of the filter device in the embodiment of the present application. As shown in Figure 10, in another embodiment, the first transmission line 313 is directly electrically connected to the first connection region 3113, and the second transmission line 314 is directly electrically connected to the second connection region 3123. The positions of the first transmission line 313 and the second transmission line 314 can be adjusted according to the operating frequency band of the filter device 0144. Specifically, the operating frequency band of the filter device 0144 in the embodiment of the present application can refer to the passband frequency band of the filter device 0144 or the stopband frequency band of the filter device 0144.

[0076] Furthermore, this application does not limit the placement of the first branch line 3114 and the second branch line 3124. In one embodiment, in the embodiments shown in Figures 6 to 10 , the orthographic projection of the first branch line 3114 on the plane of the dielectric substrate at least partially overlaps with the orthographic projection of the second connection area 3123 on the plane of the dielectric substrate, and the orthographic projection of the second branch line 3124 on the plane of the dielectric substrate at least partially overlaps with the orthographic projection of the first connection area 3113 on the plane of the dielectric substrate. In other words, the first branch line 3114 is stacked directly on the second connection area 3123, and the second branch line 3124 is stacked on the first connection area 3113. The first and second coupling areas 3111 and 3112 are then electrically connected in the middle region, resulting in a symmetrical structure for the first filter unit circuit 31.

[0077] Figure 11 is a schematic diagram of another partial top view of the structure of the filter device according to an embodiment of the present application. As shown in Figure 11, in another embodiment, the first branch line 3114 and the second branch line 3124 can extend along a straight line from the first coupling region 3111 to the second coupling region 3112, and be electrically connected directly in the middle region between the first coupling region 3111 and the second coupling region 3112. The first branch line 3114 and the second branch line 3124 extend along the shortest path.

[0078] Figure 12 is a schematic diagram of another partial top view of the structure of the filter device in an embodiment of the present application. As shown in Figure 12, in another embodiment, a metal layer 318 is provided on the surface of the dielectric substrate. This metal layer 318 serves as a reference ground for the filter device 0144. The metal layer 318 is disconnected from the first metal line 311 and the second metal line 312, or in other words, the metal layer 318 is not electrically connected to either the first metal line 311 or the second metal line 312. Specifically, the metal layer 318 can be provided on the same layer as the first metal line 311 or the second metal line 312. Alternatively, the filter device can include two metal layers 318, each provided on the same layer as the first metal line 311 and the second metal line 312. Specifically, the metal layer 318 can be disconnected from the first metal line 311 and the second metal line 312 by etching a gap between the first metal line 311 and the metal layer 318, and a gap between the second metal line 312 and the metal layer 318. In this embodiment, the reference ground structure of the filter device 0144 is simple, and the housing 33 may not be provided as the reference ground, thereby further reducing the volume of the filter device 0144. The filter device 0144 in this embodiment is formed as an air microstrip structure.

[0079] In a specific embodiment, the metal layer 318 may be provided on one side of the dielectric substrate, or may be provided on both sides of the dielectric substrate. This application does not impose any limitation on this.

[0080] Of course, in some embodiments, the dielectric substrate having the metal layer 318 may also be installed in the housing 33 to protect the circuit structure of the filter device 0144 .

[0081] Figure 13 is a schematic circuit diagram of a first filter unit on one layer of a dielectric substrate in an embodiment of the present application, and Figure 14 is a schematic circuit diagram of a first filter unit on another layer of a dielectric substrate in an embodiment of the present application. In conjunction with Figures 12-14, in one specific embodiment, the first metal wire 311 and the second metal wire 312 can be disposed on opposite sides of the dielectric substrate, respectively. Specifically, the dielectric substrate includes a first surface 321 and a second surface 322. The first metal wire 311 and the metal layer 318 are disposed on the first surface 321, and the second metal wire 312 is disposed on the second surface 322. The metal layer 318 is disposed on the same layer as the first metal wire 311, on the same surface of the dielectric substrate, to disconnect the first metal wire 311 from the metal layer 318 and prevent the first metal wire 311 from connecting to the metal layer 318. The first transmission line 313 can be disposed on the same surface as the second metal wire 312, that is, on the second surface 322. The first transmission line 313 is then electrically connected to the first metal wire 311 through a metal via. In this solution, the first transmission line 313 and the second transmission line 314 can also be located on the same layer, which facilitates connection with external equipment or transmission ports.

[0082] Continuing with Figures 6 to 14, in a specific embodiment, the first coupling region 3111, second coupling region 3112, third coupling region 3121, and fourth coupling region 3122 are sheet-shaped, while the first connector and second connection region 3123 are linear. In other words, the widths of the coupling and connection regions differ. The sheet-shaped first coupling region 3111, second coupling region 3112, third coupling region 3121, and fourth coupling region 3122 have low impedance, while the linear first connector and second connection region 3123 have high impedance. This solution utilizes a dual high-low metal line cascaded self-coupling line to achieve an in-band double-pole and out-of-band double-zero band-stop filtering effect. Furthermore, the sheet-shaped first coupling region 3111, second coupling region 3112, third coupling region 3121, and fourth coupling region 3122 have a large coupling area, resulting in excellent coupling performance and a compact size for the filter device 0144.

[0083] Specifically, the extended direction of the first metal wire 311 after expansion is defined as the length direction, and the direction perpendicular to the length direction is defined as the width direction. The widths of the first coupling region 3111 and the second coupling region 3112 along the width direction are greater than the width of the first connection region 3113 along the width direction. Similarly, the widths of the third coupling region 3121 and the fourth coupling region 3122 along the width direction are greater than the width of the first connection region 3113 along the width direction.

[0084] Furthermore, in another embodiment, the widths of the first coupling region 3111 and the second coupling region 3112 along the width direction are equal to the width of the first connection region 3113 along the width direction; similarly, the widths of the third coupling region 3121 and the fourth coupling region 3122 along the width direction are equal to the width of the first connection region 3113 along the width direction. It will be appreciated that the aforementioned equality is not strictly mathematically equivalent; specifically, to accommodate manufacturing tolerances, the aforementioned widths are generally equal.

[0085] Specifically, the widths of the first coupling region 3111, the second coupling region 3112, the first connection region 3113, the third coupling region 3121, the fourth coupling region 3122, and the second connection region 3123 along the width direction have an impact on the operating frequency band of the filter device 0144. The appropriate widths of the above-mentioned parts can be designed according to actual needs.

[0086] In further embodiments, the shapes of the first coupling region 3111, the second coupling region 3112, the third coupling region 3121, and the fourth coupling region 3122 are not limited. In one embodiment, the first coupling region 3111 and the third coupling region 3121 have the same shape, and the second coupling region 3112 and the fourth coupling region 3122 have the same shape. Specifically, the orthographic projection of the first coupling region 3111 on the plane where the surface of the third coupling region 3121 lies can be the same as the shape of the surface of the third coupling region 3121, and the orthographic projection of the second coupling region 3112 on the plane where the surface of the fourth coupling region 3122 lies can be the same as the shape of the surface of the fourth coupling region 3122. Specifically, when the first metal wire 311 and the second metal wire 312 are formed on the dielectric substrate, the shape of the surface of the first coupling region 3111 facing the third coupling region 3121 is the same as the shape of the surface of the third coupling region 3121 facing the first coupling region 3111, and the shape of the surface of the second coupling region 3112 facing the fourth coupling region 3122 is the same as the shape of the surface of the fourth coupling region 3122 facing the second coupling region 3112. Therefore, when coupling the first coupling region 3111 and the third coupling region 3121, the coupling area between the first coupling region 3111 and the third coupling region 3121 can be equal to the area of ​​the surface of the first coupling region 3111. Similarly, when coupling the second coupling region 3112 and the fourth coupling region 3122, the coupling area between the second coupling region 3112 and the fourth coupling region 3122 can be equal to the area of ​​the surface of the second coupling region 3112. This solution facilitates full coupling between the first coupling region 3111 and the third coupling region 3121, fully utilizing the areas of the first coupling region 3111 and the third coupling region 3121. Similarly, it facilitates full coupling between the second coupling region 3112 and the fourth coupling region 3122, fully utilizing the areas of the second coupling region 3112 and the fourth coupling region 3122.

[0087] Furthermore, the first coupling region 3111, the second coupling region 3112, the third coupling region 3121, and the fourth coupling region 3122 may be in regular shapes such as square or circular, which facilitates fabrication and facilitates simulation analysis to determine the operating frequency band. Alternatively, they may be in irregular shapes, which is not limited in this application.

[0088] To ensure full coupling between the first coupling region 3111 and the third coupling region 3121, the orthographic projection of the first coupling region 3111 on the plane where the surface of the third coupling region 3121 lies entirely on the surface of the third coupling region 3121. In this case, the coupling area between the first coupling region 3111 and the third coupling region 3121 is substantially equal to the area of ​​the first coupling region 3111. Alternatively, in another embodiment, the orthographic projection of the third coupling region 3121 on the plane where the surface of the first coupling region 3111 lies entirely on the surface of the first coupling region 3111. In this case, the coupling area between the first coupling region 3111 and the third coupling region 3121 is substantially equal to the area of ​​the third coupling region 3121.

[0089] When the support structure 32 is a dielectric substrate, the orthographic projection of the first coupling region 3111 on the dielectric substrate plane completely covers the orthographic projection of the third coupling region 3121 on the dielectric substrate plane. Alternatively, the orthographic projection of the third coupling region 3121 on the dielectric substrate plane completely covers the orthographic projection of the first coupling region 3111 on the dielectric substrate plane. In other words, at least one of the first coupling region 3111 and the third coupling region 3121 completely covers the other, and the combined coupling area between the two is the area of ​​the smaller coupling region.

[0090] Similarly, to ensure full coupling between the second coupling region 3112 and the fourth coupling region 3122, the orthographic projection of the second coupling region 3112 on the plane where the surface of the fourth coupling region 3122 lies entirely on the surface of the fourth coupling region 3122. In this case, the coupling area between the second coupling region 3112 and the fourth coupling region 3122 is substantially equal to the area of ​​the second coupling region 3112. Alternatively, in another embodiment, the orthographic projection of the fourth coupling region 3122 on the plane where the surface of the second coupling region 3112 lies entirely on the surface of the second coupling region 3112. In this case, the coupling area between the second coupling region 3112 and the fourth coupling region 3122 is substantially equal to the area of ​​the fourth coupling region 3122.

[0091] When the support structure 32 is a dielectric substrate, the orthographic projection of the second coupling region 3112 on the dielectric substrate plane completely covers the orthographic projection of the fourth coupling region 3122 on the dielectric substrate plane. Alternatively, the orthographic projection of the fourth coupling region 3122 on the dielectric substrate plane completely covers the orthographic projection of the second coupling region 3112 on the dielectric substrate plane. In other words, at least one of the second coupling region 3112 and the fourth coupling region 3122 completely covers the other, and the combined coupling area between the two is the area of ​​the smaller coupling region.

[0092] In further embodiments, the area of ​​the first coupling region 3111 can be larger than that of the third coupling region 3121, or the area of ​​the third coupling region 3121 can be larger than that of the first coupling region 3111; the area of ​​the second coupling region 3112 can be larger than that of the fourth coupling region 3122, and the area of ​​the fourth coupling region 3122 can be larger than that of the second coupling region 3112. This solution helps to absorb manufacturing tolerances and ensure the coupling area of ​​the coupling regions.

[0093] Figure 15 is a schematic diagram of another partial top view of the structure of a filter device in an embodiment of the present application. As shown in Figure 15, in another embodiment, the filter device 0144 further includes a second filter unit circuit 34. This second filter unit circuit 34 includes a third metal wire 341 and a fourth metal wire 342, which are also disposed on the dielectric substrate. The third metal wire 341 includes a fifth coupling region 3411 and a third connection region 3412, which are connected to each other. The fourth metal wire 342 includes a sixth coupling region 3421 and a fourth connection region 3422, which are connected to each other. The orthographic projection of the fifth coupling region 3411 on the plane containing the surface of the sixth coupling region 3421 is at least partially located on the surface of the sixth coupling region 3421. The gap between the fifth coupling region 3411 and the sixth coupling region 3421 is smaller than a third predetermined dimension, thereby coupling the fifth coupling region 3411 to the sixth coupling region 3421. When the support structure 32 is a dielectric substrate, the orthographic projection of the fifth coupling region 3411 on the dielectric substrate plane can be considered to at least partially overlap with the orthographic projection of the sixth coupling region 3421 on the dielectric substrate plane. The end of the third connection region 3412 distal to the fifth coupling region 3411 is directly electrically connected to the end of the fourth connection region 3422 distal to the sixth coupling region 3421. The third metal wire 341 is directly electrically connected to the second metal wire 312, thereby enabling the first filter unit circuit 31 and the second filter unit circuit 34 to operate together. In a specific embodiment, the third metal wire 341 is connected to a third transmission line 3413, and the fourth metal wire 342 is connected to a fourth transmission line 3423. The third transmission line 3413 is directly electrically connected to the second transmission line 314. The first transmission line 313 is connected to the first transmission port, and the fourth transmission line 3423 is connected to the second transmission port.

[0094] In the specific embodiment shown in FIG15 , the filter device 0144 includes a first filter unit circuit 31 and a second filter unit circuit 34. The second transmission line 314 is connected to one transmission port of the filter device 0144, and the fourth transmission line 3423 is connected to another transmission port of the filter device 0144. The filter device 0144 in this embodiment utilizes metal wire cascade self-coupling for filtering, achieving a three-pole in-band and three-zero out-of-band band-stop filtering effect. Compared to filter devices 0144 with equivalent functionality, the filter device 0144 is smaller in size.

[0095] In another embodiment, the filtering device includes at least two first filtering unit circuits, wherein the first transmission lines of two adjacent filtering unit circuits are directly electrically connected, and / or the second transmission lines of two adjacent first filtering unit circuits are directly electrically connected. When the filtering device includes two first filtering unit circuits, the two adjacent first transmission lines can be electrically connected, and the two second transmission lines can be respectively connected to two transmission ports of the filtering device. When the filtering device includes three first filtering unit circuits, the three first filtering unit circuits are, in order of connection, first filtering unit circuit A, first filtering unit circuit B, and first filtering unit circuit C. The first metal line of first filtering unit circuit A is directly electrically connected to one transmission port of the filtering device, the second metal line of first filtering unit circuit A is directly electrically connected to the second metal line of first filtering unit circuit B, the first metal line of first filtering unit circuit B is directly electrically connected to the first metal line of first filtering unit circuit C, and the second metal line of first filtering unit circuit C is directly electrically connected to another transmission port of the filtering device. In a specific embodiment, when the supporting structure of the filtering device is a dielectric substrate, the metal lines located on the same layer in adjacent first filtering unit circuits can be directly electrically connected.

[0096] An appropriate number of first and second filter unit circuits is selected based on specific needs to form a multi-order filter device. For example, when the filter device includes two first filter unit circuits, a band-stop filter effect with four poles in the band and four zeros outside the band can be achieved; when the filter device includes three first filter unit circuits, a band-stop filter effect with six poles in the band and six zeros outside the band can be achieved, and the filter device has a smaller size than a filter device with the same function.

[0097] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A filtering device, characterized in that: It includes a first filtering unit circuit and a supporting structure, wherein the first filtering unit circuit is arranged on the supporting structure, and the first filtering unit circuit includes a first metal wire and a second metal wire; wherein, The first metal line includes a first coupling region, a second coupling region and a first connection region, wherein the first connection region is connected between the first coupling region and the second coupling region; the second metal line includes a third coupling region, a fourth coupling region and a second connection region, wherein the second connection region is connected between the third coupling region and the fourth coupling region; The orthographic projection of the first coupling region on the plane where the surface of the third coupling region is located is at least partially located on the surface of the third coupling region, and the first coupling region and the third coupling region are coupled and connected; the orthographic projection of the second coupling region on the plane where the surface of the fourth coupling region is located is at least partially located on the surface of the fourth coupling region, and the second coupling region and the fourth coupling region are coupled and connected; The first coupling region is directly electrically connected to the fourth coupling region.

2. The filtering device according to claim 1, characterized in that It also includes a shell, which is an integrated structure. The shell has an inner cavity and an opening connected to the inner cavity. The inner cavity of the shell is provided with a slot, which extends toward the opening, and the supporting structure is inserted into the slot.

3. The filtering device according to claim 1 or 2, characterized in that: The supporting structure is a dielectric substrate, and the orthographic projection of the first coupling region on the plane where the dielectric substrate is located at least partially overlaps with the orthographic projection of the third coupling region on the plane where the dielectric substrate is located; The orthographic projection of the second coupling region on the plane where the dielectric substrate is located at least partially overlaps with the orthographic projection of the fourth coupling region on the plane where the dielectric substrate is located.

4. The filtering device according to claim 3, characterized in that A metal layer is disposed on the surface of the dielectric substrate, and the metal layer is disconnected from the first metal wire and the second metal wire.

5. The filter device according to any one of claims 1 to 4, characterized in that: The first metal wire is connected to the first transmission port; the second metal wire is connected to the second transmission port.

6. The filtering device according to any one of claims 1 to 5, characterized in that: The first coupling region, the second coupling region, the third coupling region and the fourth coupling region are in a sheet shape, and the first connector and the second connection region are in a line shape.

7. The filter device according to any one of claims 1 to 6, characterized in that: The shape of the orthographic projection of the first coupling region on the plane where the surface of the third coupling region is located is the same as the shape of the surface of the third coupling region, and the shape of the orthographic projection of the second coupling region on the plane where the surface of the fourth coupling region is located is the same as the shape of the surface of the fourth coupling region.

8. The filter device according to any one of claims 1 to 7, characterized in that: The orthographic projection of the first coupling region on the plane where the surface of the third coupling region is located is completely located on the surface of the third coupling region; The orthographic projection of the second coupling region on the plane where the surface of the fourth coupling region is located is completely located on the surface of the fourth coupling region.

9. The filter device according to any one of claims 1 to 8, characterized in that: Also includes a second filtering unit circuit, the second filtering unit circuit includes a third metal line and a fourth metal line, the third metal line includes a fifth coupling region and a third connection region connected to each other, the fourth metal line includes a sixth coupling region and a fourth connection region connected to each other; The orthographic projection of the fifth coupling region on the plane where the surface of the sixth coupling region is located is at least partially located on the surface of the sixth coupling region, and the fifth coupling region is coupled to the sixth coupling region; An end of the third connection region away from the fifth coupling region is directly electrically connected to an end of the fourth connection region away from the sixth coupling region; The third metal line is directly electrically connected to the second metal line.

10. The filter device according to any one of claims 1 to 8, characterized in that: At least two first filtering unit circuits are included, and the first metal wires of two adjacent first filtering unit circuits are directly electrically connected; or the second metal wires of two adjacent filtering unit circuits are directly electrically connected.

11. A combining device, characterized in that: The method comprises a first total transmission port, at least two second total transmission ports and at least two filtering devices according to any one of claims 1 to 10, wherein the second metal wires of at least two of the filtering devices are electrically connected to the first total transmission port, and the first metal wire of each of the filtering devices is electrically connected to one of the second total transmission ports.

12. An antenna, characterized in that: The invention comprises a radiation unit and the filtering device according to any one of claims 1 to 10, wherein the filtering device is electrically connected to the radiation unit.

13. An antenna, characterized in that: It comprises a radiation unit and the combining device as claimed in claim 11, wherein the combining device is electrically connected to the radiation unit.

14. A base station, characterized in that: It comprises a mounting frame and the antenna as claimed in claim 12 or 13, wherein the antenna is mounted on the mounting frame.

Images