Power supply module and energy storage system

Abstract

The present application provides a power supply module and an energy storage system. The power supply module comprises a housing, a connector, inductors, cold plates, and an air-liquid heat exchanger. In a first direction, the connector, the air-liquid heat exchanger, the cold plates, and the inductors are successively arranged inside the housing. The housing comprises a front plate and a rear plate, and the front plate and the rear plate are oppositely arranged in the first direction. In the first direction, the connector is arranged between the air-liquid heat exchanger and the front plate. The connector comprises a cold plate inlet, a heat exchanger inlet, a cold plate outlet, and a heat exchanger outlet. In a second direction, the cold plate inlet is arranged adjacent to the cold plate outlet, and the heat exchanger inlet is arranged adjacent to the heat exchanger outlet. In a third direction, one of the cold plate inlet and the cold plate outlet is arranged adjacent to the heat exchanger inlet, and the other of the cold plate inlet and the cold plate outlet is arranged adjacent to the heat exchanger outlet. The third direction, the second direction, and the first direction are perpendicular to one another. The power supply module of the present application has a small size and a good heat dissipation effect on various heating devices, and can reduce the heat dissipation cost.

Description

Power modules and energy storage systems

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on June 7, 2023, with application number 202310673189.X, and priority to the Chinese patent application entitled “Power Module and Energy Storage System”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of power conversion technology, and in particular to a power supply module and an energy storage system. Background Art

[0003] With the rapid development of the new energy industry, the output power of power converters is gradually increasing, thus placing higher demands on their heat dissipation capabilities. Power converters contain a variety of components, each of which generates heat differently. Existing heat dissipation systems are unable to meet the heat dissipation requirements of these multiple components. Or, even when a heat dissipation system can meet the heat dissipation requirements of multiple components, it consumes a lot of energy, is costly, and is bulky, making it difficult to miniaturize the power converter.

[0004] Summary of the Invention

[0005] The present application provides a power supply module and an energy storage system.

[0006] In a first aspect, an embodiment of the present application provides a power module, which includes a shell and a connector, an inductor, a cold plate and an air-to-liquid heat exchanger, wherein the connector, the air-to-liquid heat exchanger, the cold plate and the inductor are arranged in sequence inside the shell along a first direction, the shell includes a front plate and a rear plate, the front plate and the rear plate are arranged relative to each other along the first direction, the connector is arranged between the air-to-liquid heat exchanger and the front plate along the first direction, the connector includes a cold plate inlet, a heat exchanger inlet, a cold plate outlet and a heat exchanger outlet, wherein, along a second direction, the cold plate inlet is arranged adjacent to the cold plate outlet, and the heat exchanger inlet is arranged adjacent to the heat exchanger outlet, and the second direction is perpendicular to the first direction; along a third direction, one of the cold plate inlet and the cold plate outlet is arranged adjacent to the heat exchanger inlet, and the other of the cold plate inlet and the cold plate outlet is arranged adjacent to the heat exchanger outlet, and the third direction is perpendicular to the second direction and the first direction.

[0007] In the power module provided in the present application, on the one hand, the cold plate in the power module is used to dissipate heat for high-heat-generating devices, which can meet the heat dissipation requirements of high-heat-generating devices and have a good heat dissipation effect on high-heat-generating devices. The air-to-liquid heat exchanger in the power module is used to dissipate heat for medium and low-heat-generating devices. The power module in the present application adopts a composite heat dissipation method combining a cold plate and an air-to-liquid heat exchanger, which not only meets the heat dissipation requirements of various heat-generating devices and can have a good heat dissipation effect on the power module, but also reduces the heat dissipation cost of the power module and reduces the total volume of the cold plate and the air-to-liquid heat exchanger. The heat dissipation system composed of the cold plate and the air-to-liquid heat exchanger has a simple structure, fewer parts, and is easy to install in the shell.

[0008] On the other hand, the cold plate and the air-liquid heat exchanger are connected to the same connector and receive and discharge the heat exchange medium through the same connector. The cold plate and the air-liquid heat exchanger are centrally connected to the connector, which reduces the number of connectors and makes the heat dissipation pipeline layout in the power module more regular.

[0009] Furthermore, the connector, air-to-liquid heat exchanger, cold plate, and inductor are sequentially arranged within the housing along a first direction. This arrangement fully utilizes the housing's internal space, reducing the size of the power module. The rational layout of components within the housing improves the reliability of the power module.

[0010] In one possible implementation, the shell includes a first side plate and a second side plate, the first side plate and the second side plate are arranged relative to each other along the second direction, the connector, the air-liquid heat exchanger, the cold plate, and the inductor are arranged between the first side plate and the second side plate, wherein, along the second direction, the distance between the connector and the first side plate is smaller than the distance between the connector and the second side plate, the distance between the connector and the first side plate is smaller than the distance between the air-liquid heat exchanger and the first side plate, the distance between the connector and the second side plate is larger than the distance between the air-liquid heat exchanger and the second side plate, and at least one of the distance between the cold plate inlet and the cold plate outlet or the distance between the heat exchanger inlet and the heat exchanger outlet is smaller than the distance between the air-liquid heat exchanger and the first side plate.

[0011] First, the connector is positioned closer to the first side panel to facilitate installation of the power module and its application within the energy storage cabinet. Second, the distance between the heat exchanger inlet and outlet is small, and the heat exchanger inlet and outlet are compactly arranged. The distance between the cold plate inlet and outlet is small, and the cold plate inlet and outlet are compactly arranged, which facilitates reducing the size of the connector along the second direction. In addition, the connector is located in the corner between the first side panel and the front panel, which improves the utilization of the internal space of the housing and reduces the impact on the layout of other components and pipelines.

[0012] In one possible implementation, the connector includes a first sub-cavity and a second sub-cavity, wherein the first sub-cavity and the second sub-cavity are adjacent to and spaced apart from each other along the second direction, the first sub-cavity is used to connect the cold plate inlet and the heat exchanger inlet, and the second sub-cavity is used to connect the cold plate outlet and the heat exchanger outlet.

[0013] By providing a first and second sub-cavity, the cold plate and air-to-liquid heat exchanger operate in parallel, improving the power module's heat dissipation efficiency. The cold plate inlet and heat exchanger inlet receive heat exchange medium through the first sub-cavity, while the cold plate outlet and heat exchanger outlet discharge heat exchange medium through the second sub-cavity. This not only reduces the number of joints and pipes connecting the connector to the outside world, but also reduces the connector's size, facilitating a smaller power module.

[0014] In one possible implementation, the connector includes a connecting seat, a first cover plate, and a partition plate, and the connecting seat includes a first groove. Along the first direction, the cold plate inlet, the cold plate outlet, the heat exchanger inlet, and the heat exchanger outlet respectively pass through the bottom of the first groove. The partition plate is located in the first groove and is used to separate the first groove along the second direction. The outer peripheral surface of the first cover plate is fixedly connected to the groove wall of the first groove, and the side of the first cover plate facing the groove bottom of the first groove is fixedly connected to the partition plate. The groove bottom of the first groove and the first cover plate are spaced apart along the first direction. A first cavity is formed between the connecting seat and the first cover plate, and the partition plate separates the first cavity into a first sub-cavity and a second sub-cavity.

[0015] In one possible implementation, the connector includes a first sub-cavity, a second sub-cavity, and a third sub-cavity. The first sub-cavity and the third sub-cavity are adjacent to and spaced apart from each other along the third direction. The first sub-cavity or the third sub-cavity is adjacent to and spaced apart from the second sub-cavity along the second direction. The first sub-cavity is used to connect the heat exchanger inlet, the second sub-cavity is used to connect the heat exchanger outlet and the cold plate inlet, and the third sub-cavity is used to connect the cold plate outlet.

[0016] By providing a first, second, and third sub-cavity, the cold plate and the air-to-liquid heat exchanger operate in series, reducing the power module's heat dissipation energy consumption. The first and third sub-cavities are used to receive and discharge the heat exchange medium, respectively, while the second sub-cavity provides communication between the cold plate and the air-to-liquid heat exchanger. This reduces the number of connector connections and pipes, and also reduces the connector's size, facilitating a smaller power module.

[0017] Furthermore, because the cold plate primarily dissipates heat for high-heat devices, and the air-to-liquid heat exchanger primarily dissipates heat for medium- and low-heat devices, the temperature difference between the heat transfer medium before and after the cold plate is larger, while the temperature difference between the heat transfer medium before and after the air-to-liquid heat exchanger is smaller. In this application, by controlling the heat transfer medium's flow through the air-to-liquid heat exchanger and the cold plate, both heat transfer methods can be used to dissipate heat for the heat-generating devices, facilitating better heat dissipation for all heat-generating devices.

[0018] In one possible implementation, the connector further includes a second cavity and a drainage hole. The second cavity is adjacent to and spaced apart from the first sub-cavity or the second sub-cavity along the first direction, and the drainage hole communicates with the second cavity. A second cavity is provided on the side of the connector facing away from the first cavity. If the connector leaks, the leaked heat exchange medium is collected in the second cavity and discharged out of the second cavity through the drainage hole. The provision of the second cavity provides a secondary seal for the connector, reducing the risk of leakage damaging components within the housing. The heat exchange medium discharged from the drainage hole can be discharged out of the housing through a pipeline.

[0019] In a possible implementation, the connector includes a first cover plate, a connecting seat, a second cover plate and a partition plate, the first cover plate and the second cover plate are respectively arranged on both sides of the connecting seat along the first direction, and are respectively surrounded by the two sides of the connecting seat to form a first cavity and a second cavity, the partition plate is located in the first cavity and is used to separate the first cavity into the first sub-cavity and the second sub-cavity, the connecting seat includes the cold plate inlet, the cold plate outlet, the heat exchanger inlet and the heat exchanger outlet, the cold plate inlet, the cold plate outlet, the heat exchanger inlet and the heat exchanger outlet pass through the connecting seat along the first direction; wherein, the first cover plate includes a liquid inlet and The liquid outlet hole, the liquid inlet hole and the liquid outlet hole respectively penetrate the first cover plate along the first direction, the liquid inlet hole is used to connect at least one of the cold plate inlet or the heat exchanger inlet, and the liquid outlet hole is used to connect at least one of the cold plate outlet or the heat exchanger outlet; the second cover plate includes a first opening, a second opening, a third opening and a fourth opening, the first opening, the second opening, the third opening and the fourth opening respectively penetrate the second cover plate along the first direction, and along the first direction, the first opening, the second opening, the third opening and the fourth opening are respectively arranged opposite to the cold plate inlet, the cold plate outlet, the heat exchanger inlet and the heat exchanger outlet.

[0020] The power module further includes a cold plate inlet pipe, a cold plate outlet pipe, a heat exchanger inlet pipe, and a heat exchanger outlet pipe. One end of the cold plate inlet pipe, the cold plate outlet pipe, the heat exchanger inlet pipe, and the heat exchanger outlet pipe are connected to the cold plate inlet, the heat exchanger inlet, the cold plate outlet, and the heat exchanger outlet, respectively. The other end of the cold plate inlet pipe extends into the second cavity through the first opening and is fixed to the inner wall of the cold plate inlet. The other end of the cold plate outlet pipe extends into the second cavity through the second opening and is fixed to the inner wall of the cold plate outlet. The other end of the heat exchanger inlet pipe extends into the second cavity through the third opening and is fixed to the inner wall of the heat exchanger inlet. The other end of the heat exchanger outlet pipe extends into the second cavity through the fourth opening and is fixed to the inner wall of the heat exchanger outlet.

[0021] Along the first direction, the first opening is arranged opposite the cold plate inlet. The distance between the first opening and the cold plate inlet is short, so the cold plate liquid inlet pipe is connected to the cold plate inlet with a shorter pipe length and no bends are required. This not only saves costs but also reduces the risk of bending and breaking the cold plate liquid inlet pipe, and improves the reliability of the connection between the cold plate liquid inlet pipe and the cold plate inlet. Similarly, along the first direction, the second opening is arranged opposite the cold plate outlet, the third opening is arranged opposite the heat exchanger inlet, and the fourth opening is arranged opposite the heat exchanger outlet. This also saves costs and improves the reliability of the connection between the cold plate liquid outlet pipe, the heat exchanger liquid inlet pipe, and the heat exchanger liquid outlet pipe and the connector.

[0022] In one possible implementation, the power module includes a liquid inlet connector and a liquid outlet connector, the liquid inlet connector and the liquid outlet connector are fixed to the first cover plate and are respectively connected to the liquid inlet hole and the liquid outlet hole, the front plate includes a through hole, and the through hole passes through the front plate along the first direction, wherein along the first direction, the projection of the through hole covers the projection of the liquid inlet connector and the projection of the liquid outlet connector, and the projection of the first cover plate covers the projection of the through hole; along the third direction, the length of the liquid inlet connector and the liquid outlet connector is greater than the distance between the first cover plate and the front plate.

[0023] In the first direction, the liquid inlet and outlet connectors extend from the interior of the housing through the through-holes to the exterior of the housing. The power module can be connected to an external cooling assembly outside the housing. This provides greater access space outside the housing, facilitating connection of the cooling assembly's two liquid cooling pipes to the liquid inlet and outlet connectors. Furthermore, positioning the connection between the power module and the liquid cooling pipes outside the housing allows for the possibility of heat exchange medium leakage due to loose connections during long-term operation of the power module. This leakage is retained outside the housing, preventing damage to components within the housing.

[0024] In addition, the projection of the first cover plate along the first direction covers the projection of the through hole, and the area of ​​the first cover plate is larger than the area of ​​the through hole. The area of ​​the through hole is small, which facilitates ensuring the sealing of the housing.

[0025] In one possible implementation, when the cold plate and the air-to-liquid heat exchanger are connected in parallel, the liquid inlet and outlet connectors are adjacent and spaced apart along the second direction. When the cold plate and the air-to-liquid heat exchanger are connected in series, the liquid inlet and outlet connectors are adjacent and spaced apart along the third direction.

[0026] In one possible implementation, the power module further includes a circuit board and a plurality of power tubes, the shell includes a top plate and a bottom plate, the top plate and the bottom plate are arranged relative to each other along the third direction, the circuit board is arranged at intervals between the top plate and the bottom plate, the plurality of power tubes and the cold plate are arranged on a side of the circuit board facing the bottom plate, and the cold plate is in contact with at least one of the power tubes along the first direction.

[0027] In the power module provided herein, the power tubes are high-heat-generating devices. A cold plate is used to dissipate heat from the power tubes, improving cooling efficiency. The cold plate aligns with the power tubes along the first direction, parallel to the circuit board, reducing the size of the power module along the third direction.

[0028] In one possible implementation, the power module includes a plurality of connected cold plates, the plurality of cold plates are arranged at intervals along the first direction, the plurality of power tubes include a plurality of columns of power tubes arranged at intervals along the first direction, each column of power tubes includes a plurality of power tubes arranged in sequence along the second direction, and the plurality of power tubes in each column of power tubes are in contact with the same cold plate.

[0029] In the power module provided by the present application, a single cold plate can be used to cool at least one column of power tubes, thereby improving the utilization of the cold plate. Furthermore, in the present application, by providing multiple cold plates to cool multiple columns of power tubes, heat can be better dissipated from the multiple columns of power tubes within the power module, thereby improving the reliability of the power module.

[0030] In one possible implementation, at least one cold plate is arranged between two adjacent rows of power tubes. The at least one cold plate includes two sides along the first direction. One side of the at least one cold plate contacts the multiple power tubes in one row of power tubes, and the other side of the at least one cold plate contacts the multiple power tubes in the other row of power tubes. Both sides of the cold plate along the first direction are used to cool the power tubes. One cold plate can cool two rows of power tubes, thereby improving cold plate utilization.

[0031] In one possible implementation, along the third direction, the distance between the air-to-liquid heat exchanger and the top plate is greater than the distance between the cold plate and the top plate; the distance between at least one of the cold plate inlet or the cold plate outlet and the top plate is smaller than the distance between the air-to-liquid heat exchanger and the top plate; and the distance between at least one of the heat exchanger inlet or the heat exchanger outlet and the bottom plate is smaller than the distance between the cold plate and the bottom plate. The air-to-liquid heat exchanger and the cold plate are staggered along the third direction, and the cold plate inlet, cold plate outlet, heat exchanger inlet, and heat exchanger outlet are relatively concentrated, thereby reducing the size of the connector.

[0032] In one possible implementation, the air-to-liquid heat exchanger includes a plurality of interconnected heat exchange plates. When the air-to-liquid heat exchanger is located between the connector and the circuit board along the first direction, and the air-to-liquid heat exchanger is arranged between the top plate and the bottom plate along the third direction, the plurality of heat exchange plates are arranged at intervals along the first direction.

[0033] Along the third direction, the projection of the air-to-liquid heat exchanger does not overlap with the projection of the circuit board. By staggering the air-to-liquid heat exchanger and the circuit board, the air-to-liquid heat exchanger does not interfere with components mounted on the circuit board, effectively utilizing the circuit board space and improving the performance of the power module.

[0034] Generally, circuit boards are larger in size to accommodate more onboard components. Furthermore, because the inductor is located on the side of the circuit board closer to the rear plate along the first direction X, the distance between the air-to-liquid heat exchanger and the front plate is smaller, and no components are typically placed between them. In this case, the multiple heat exchange plates of the air-to-liquid heat exchanger are spaced apart along the first direction, and the air is ventilated along the third direction. Air within the housing passes through the gaps between adjacent heat exchange plates along the third direction, exchanging heat with the plates and thereby cooling the air within the housing. Arranging multiple heat exchange plates along the first direction further facilitates heat dissipation from the power module.

[0035] In one possible implementation, the air-to-liquid heat exchanger includes a plurality of interconnected heat exchange plates. When the projection of the air-to-liquid heat exchanger along the third direction coincides with the projection of the circuit board along the third direction, and the projection of the air-to-liquid heat exchanger along the third direction is staggered with the projection of the cold plate along the third direction, the plurality of heat exchange plates are arranged at intervals along the third direction.

[0036] The air-liquid heat exchanger is arranged overlapping with the circuit board along the third direction, and on-board components are arranged on both sides of the air-liquid heat exchanger in the front and back directions along the first direction. At this time, multiple heat exchange plates are arranged in the third direction, and the air-liquid heat exchanger is ventilated in the first direction, which can take into account the heat dissipation of the on-board components in front and back of the circuit board in the first direction.

[0037] In one possible implementation, the power module includes multiple inductors and multiple fans. The inductors are spaced apart along the second direction, and the fans are spaced apart along the second direction. Along the first direction, the fans are located between the inductors and the circuit board. The fans act as air turbulence, providing power to the air-to-liquid heat exchanger, thereby improving the heat dissipation of the air-to-liquid heat exchanger. Positioning the fans between the inductors and the circuit board not only does not interfere with the installation of various components, but also achieves better heat dissipation.

[0038] In a possible implementation, the power module further includes a first baffle, a second baffle, and a third baffle, the first baffle and the second baffle being respectively located on both sides of the circuit board along the second direction, and the third baffle being located between the top plate and the fan along the third direction; the first baffle being respectively connected to the circuit board and the first side plate along both sides of the second direction, and the second baffle being respectively connected to the circuit board and the second side plate along both sides of the second direction; when the third baffle being respectively connected to the circuit board and the inductor along both sides of the first direction, the air-to-liquid heat exchanger being located between the connector and the circuit board along the first direction or the projection of the air-to-liquid heat exchanger along the third direction coincides with the projection of the circuit board along the third direction.

[0039] The first, second, and third baffles guide air circulation below and above the circuit board. The third baffle covers the gap between the inductor and the circuit board, preventing air flowing in the first direction through the gap between the circuit board and the base plate from being blocked by the inductor and bypassing it, resulting in poor heat dissipation from the inductor. Once in place, the third baffle blocks air from flowing from the gap between the inductor and the circuit board toward the top plate, improving the inductor's heat dissipation.

[0040] The first baffle and the second baffle are respectively used to cover the gaps between the circuit board and the first side plate and the second side plate, so as to prevent air flowing in the gap between the circuit board and the top plate along the first direction from directly passing through the gaps between the circuit board and the first side plate and the gaps between the circuit board and the second side plate to flow to the gap between the circuit board and the bottom plate, thereby resulting in poor heat dissipation of the front-end heating components. By providing the first baffle and the second baffle, the air flowing above the circuit board must flow through the gap between the circuit board and the front plate to flow below the circuit board. The air flows within the entire interior of the housing, which is more conducive to achieving heat dissipation of various heating components by the air-to-liquid heat exchanger.

[0041] In one possible implementation, the power module also includes a first baffle, a second baffle and a third baffle, the first baffle and the second baffle are respectively located on both sides of the circuit board along the second direction, and the third baffle is located between the top plate and the fan along the third direction; the first baffle is respectively connected to the circuit board and the first side plate along both sides of the second direction, and the second baffle is respectively connected to the circuit board and the second side plate along both sides of the second direction. When the third baffle is respectively connected to the circuit board and the rear plate along both sides of the first direction, the projection of the air-to-liquid heat exchanger along the third direction coincides with the projection of the circuit board along the third direction.

[0042] When the projection of the air-to-liquid heat exchanger along the third direction coincides with the projection of the circuit board along the third direction, the arrangement of the first baffle, the second baffle and the third baffle can guide the air to flow in the gap between the circuit board and the bottom plate along the first direction from the front plate toward the rear plate, and then flow in the gap between the circuit board and the first side plate and the gap between the circuit board and the second side plate along the first direction from the rear plate toward the front plate.

[0043] The third baffle is used to cover the gap between the rear plate and the circuit board. The third baffle restricts the flow of air under the circuit board. At this time, the air first passes through the inductor and flows toward the rear plate along the first direction, and then flows toward the first side plate and the second side plate, which is beneficial to improving the heat dissipation effect of the inductor and ensuring the heat dissipation effect of other heating components.

[0044] The first baffle and the second baffle are used to cover the gaps between the circuit board and the first and second side plates, respectively, restricting air flow beneath the circuit board and circulating air through the circuit board and on both sides of the circuit board along the second direction, thereby facilitating heat dissipation from various heat-generating components by the air-to-liquid heat exchanger. In this heat dissipation mode, since air primarily flows in the first direction, setting the ventilation direction of the air-to-liquid heat exchanger in the first direction, i.e., arranging multiple heat exchange plates in intervals along the third direction, facilitates achieving better heat dissipation from the air-to-liquid heat exchanger.

[0045] In a second aspect, an embodiment of the present application provides an energy storage system, comprising an energy storage cabinet, a battery pack, and the power module as described above, wherein the battery pack is connected to the power module and supplies power to a load through the power module, the energy storage cabinet comprising a cabinet body, a cabinet door, and a cooling assembly, the cabinet door being used to close the cabinet body, the power module and the battery pack being stacked and placed inside the cabinet body, and the cooling assembly being connected to the cold plate inlet, the heat exchanger inlet, the cold plate outlet, and the heat exchanger outlet of the connector via two liquid cooling pipes. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] FIG1 is a schematic diagram of an energy storage system provided in one embodiment of the present application;

[0047] FIG2 is a schematic diagram of an energy storage cabinet provided in one embodiment of the present application;

[0048] FIG3 is a perspective view of a power module provided in one embodiment of the present application;

[0049] FIG4 is a schematic diagram of a power module provided in one embodiment of the present application;

[0050] FIG5 is an exploded view of a connector provided in one embodiment of the present application;

[0051] FIG6 is an exploded view of a connector provided in one embodiment of the present application;

[0052] FIG7 is a schematic diagram of a first cover plate provided in one embodiment of the present application;

[0053] FIG8 is an exploded view of a connector provided in one embodiment of the present application;

[0054] FIG9 is an exploded view of a connector provided in one embodiment of the present application;

[0055] FIG10 is a perspective view of a circuit board, a cold plate, and an air-to-liquid heat exchanger provided in one embodiment of the present application;

[0056] FIG11 is a front view of a circuit board, a cold plate, and an air-to-liquid heat exchanger provided in one embodiment of the present application;

[0057] FIG12 is a rear view of a circuit board, a cold plate, and an air-to-liquid heat exchanger provided in one embodiment of the present application;

[0058] FIG13 is a top view of a circuit board, a cold plate, and an air-to-liquid heat exchanger provided in one embodiment of the present application;

[0059] FIG14 is a schematic diagram of a power module provided in one embodiment of the present application;

[0060] FIG15 is a schematic diagram of a power module provided in one embodiment of the present application;

[0061] FIG16 is a front view of a circuit board, a cold plate, and an air-to-liquid heat exchanger provided in one embodiment of the present application;

[0062] FIG17 is a top view of a circuit board, a cold plate, and an air-to-liquid heat exchanger provided in one embodiment of the present application;

[0063] FIG18 is a schematic diagram of a power module provided in one embodiment of the present application;

[0064] FIG19 is a schematic diagram of a power module provided in one embodiment of the present application;

[0065] FIG20 is a schematic diagram of a power module provided in accordance with an embodiment of the present application. DETAILED DESCRIPTION

[0066] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0067] As used herein, the terms "first," "second," and the like are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more.

[0068] In addition, in this article, directional terms such as "upper" and "lower" are defined relative to the orientation of the structure schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the structure.

[0069] For ease of understanding, the English abbreviations and related technical terms involved in the embodiments of this application are explained and described below.

[0070] DC: Direct Current. DC-DC stands for direct current to direct current conversion, meaning direct current is input and direct current is output.

[0071] AC: Alternating Current. AC-DC stands for alternating current to direct current, DC-AC stands for direct current to alternating current, and AC-AC stands for alternating current to alternating current.

[0072] IGBT: It is the abbreviation of Insulated Gate Bipolar Transistor, which refers to insulated gate bipolar transistor.

[0073] MOSFET: The abbreviation of Metal-Oxide-Semiconductor Field-Effect Transistor, which refers to metal-oxide semiconductor field-effect transistor, also known as MOS tube.

[0074] Figure 1 is a schematic diagram of an energy storage system provided in one embodiment of the present application. The energy storage system includes an energy storage cabinet 1, a battery pack 11, and a power module 10. The battery pack 11 is connected to the power module 10 and supplies power to a load 2 through the power module 10.

[0075] Among them, the energy storage system may include one or more battery packs 11. The battery pack 11 is used to store electrical energy and supply power to the load 2. The power module 10 is a module that can realize the power conversion function. The power module 10 can realize at least one function of DC-DC conversion, AC-AC conversion, AC-DC conversion, and DC-AC conversion. Exemplarily, the power module 10 can be a converter or other power conversion device. Among them, the converter includes a rectifier (AC-DC), an inverter (DC-AC), an AC converter (AC-AC), and a DC converter (DC-DC). The power module 10 is used to convert the electrical energy output by the battery pack 11 into the DC power or AC power required by the load 2.

[0076] The load 2 can be any electrical device powered by the energy storage system, such as a vehicle, a communication base station, or a household or industrial energy storage device. For example, the power module 10 can implement AC-DC conversion. The DC power output by the battery pack 11 is converted into AC power by the power module 10 and then used for daily life and production. Alternatively, the power module 10 can implement AC-AC conversion and AC-DC conversion. The DC power output by the battery pack 11 is converted into AC-AC power and then AC-DC power and then used for daily life and production.

[0077] Please refer to Figure 2, which is a schematic diagram of an energy storage cabinet 1 provided in one embodiment of the present application. In one embodiment, the energy storage cabinet 1 further includes a cabinet body 12, a cabinet door 13, and a cooling assembly 14. The cabinet door 13 is used to close the cabinet body 12. The power module 10 and the battery pack 11 are stacked and placed inside the cabinet body 12, with the front plate 110 of the housing 100 of the power module 10 facing the cabinet door 13. The cooling assembly 14 is connected to the cold plate inlet 211, heat exchanger inlet 213, cold plate outlet 212, and heat exchanger outlet 214 of the connector 200 via two liquid cooling pipes 15 (see also Figures 5 and 6).

[0078] The cabinet door 13 can be closed or opened relative to the cabinet body 12. Generally, the cabinet body 12 includes a battery compartment and a power compartment. The battery compartment houses the battery pack 11, and the power compartment houses the power module 10. In one embodiment, the power compartment also houses a power distribution module for power distribution. In one embodiment, the battery compartment and the power compartment are arranged side by side along the height of the energy storage cabinet 1.

[0079] The cooling assembly 14 is used to cool the heat exchange medium discharged from the cold plate outlet 212 and heat exchanger outlet 214 of the connector 200 and transport the cooled heat exchange medium into the power module 10 through the cold plate inlet 211 and heat exchanger inlet 213. Exemplarily, the two liquid cooling pipes 15 are respectively a liquid cooling pipe 15a and a liquid cooling pipe 15b. The liquid cooling pipe 15a connects the cooling assembly 14 with the cold plate outlet 212 and heat exchanger outlet 214. The heat exchange medium discharged from the cold plate outlet 212 and heat exchanger outlet 214 is transported to the cooling assembly 14 through the liquid cooling pipe 15a. The liquid cooling pipe 15b connects the cooling assembly 14 with the cold plate inlet 211 and heat exchanger inlet 213. The cooling assembly 14 transports the cooled heat exchange medium to the cold plate inlet 211 and heat exchanger inlet 213 through the liquid cooling pipe 15b.

[0080] In one embodiment, the cooling assembly 14 is fixed to the side of the cabinet door 13 facing the power module 10. That is, the cooling assembly 14 is fixed to the inner side of the cabinet door 13, which can fully utilize the internal space of the energy storage cabinet 1.

[0081] In one embodiment, the cabinet door 13 is rotatably connected to the cabinet body 12 via a rotating member. The rotating member is provided to facilitate closing and opening of the cabinet door 13.

[0082] In one embodiment, the connector 200 is disposed near the rotating member (as shown in FIG2 ). The liquid cooling pipe 15 is connected to the connector 200 near the connection between the cabinet door 13 and the cabinet body 12 . The liquid cooling pipe 15 does not interfere with the closing and opening of the cabinet door 13 , making the closing and opening of the cabinet door 13 more convenient.

[0083] In one embodiment, the power module 10 can also be connected to an external power source 3 (as shown in FIG1 ). The power module 10 receives power from the external power source 3 and converts the received power to charge the battery pack. The external power source 3 can be a mains electricity source, a generator, solar energy, wind energy, a battery, etc.

[0084] In one embodiment, the energy storage cabinet 1 includes two power modules 10, which are respectively power module 10a and power module 10b in the figure (as shown in Figure 1). Among them, power module 10a is a power conversion system (PCS), which is a DC-AC bidirectional converter, that is, the energy storage converter has AC-DC conversion and DC-AC conversion functions. Power module 10b is a module that can perform DC-DC conversion. Exemplarily, the external power supply 3 is a power grid, and power module 10a is connected to the power grid and the battery pack 11. Power module 10a converts the AC power provided by the power grid into DC power and then charges the battery pack 11. The power output of the battery pack 11 is supplied to the load 2 through power module 10a or power module 10b. In one embodiment, power module 10a is connected to power module 10b, and the power output of the battery pack 11 is processed by power module 10b and power module 10a in sequence before being used to power the load 2.

[0085] In one embodiment, the battery pack 11 can be charged when utility electricity prices are low and power the load 2 when utility prices are high, thereby reducing electricity costs. In one embodiment, during periods of low electricity demand, excess power from the grid can be stored in the battery pack 11 via the power module 10. During peak electricity demand periods, the power from the battery pack 11 is fed back into the grid via the power module 10.

[0086] In one embodiment, the external power supply 3 is a photovoltaic panel (as shown in FIG1 ). The energy storage cabinet 1 is connected to the photovoltaic panel, which converts solar energy into electrical energy, and charges the battery pack 11 after power conversion through the power module 10. The photovoltaic panel can be connected to the power grid to connect the generated electricity to the grid. The photovoltaic panel can also be directly connected to the electrical equipment to directly power the electrical equipment with the generated electricity. In one embodiment, when the electrical energy output by the photovoltaic panel exceeds the demand of the power grid or the demand of the electrical equipment for electrical energy, the energy storage cabinet 1 can store the excess electrical energy generated by the photovoltaic panel in the battery pack 11 through the power module 10. When the electrical energy output by the photovoltaic panel is less than the demand of the power grid or the demand of the electrical equipment for electrical energy, the battery pack 11 outputs the stored electrical energy to the power grid through the power module 10.

[0087] In one embodiment, the power module 10 can also be applied to other energy storage systems besides the energy storage system described above. For example, the power module 10 can be applied to a vehicle-mounted energy storage system. The vehicle-mounted energy storage system includes a vehicle-mounted battery pack 11 and a power module 10. The power module 10 can realize AC-AC conversion. The DC power output by the vehicle-mounted battery pack 11 is converted by the power module 10 and then supplied to the corresponding vehicle-mounted load 2. Among them, the vehicle-mounted load 2 includes at least one of a compressor, a battery heating module, a seat heating module, a power system, a dashboard, a control display, a headlight, and a USB interface.

[0088] The power module 10 can also be applied to other scenarios where power conversion is performed. For example, the power module 10 can be applied to a charging pile. The power module 10 is a charging module in the charging pile. The charging pile receives 220V AC power from the mains or 380V AC power for industrial use. The power module 10 converts 220V AC power or 380V AC power into DC power and then powers energy storage devices in electronic equipment such as vehicles.

[0089] The power module 10 generates heat during operation. In order to ensure the stable operation of the power module 10, it is usually necessary to dissipate heat from the power module. However, a variety of components are provided in the power module 10, and the heat generation conditions of different components are different. For example, the power module 10 includes components such as power tubes, inductors, and capacitors. Generally, the heat flux density of power tubes is the largest, the heat flux density of inductors is second, and the heat flux density of capacitors is the smallest. Existing heat dissipation systems cannot take into account the heat dissipation requirements of multiple components, or when the heat dissipation system can meet the heat dissipation requirements of multiple components, the energy consumption and cost of the heat dissipation system are high, and the heat dissipation system is large in size, which makes it difficult to miniaturize the power module 10.

[0090] The power module 10 provided in the present application can not only meet the heat dissipation requirements of different devices, but also save costs.

[0091] The power module 10 in this application is described in detail below.

[0092] Please refer to Figures 3, 4, 5, and 6. Figure 3 is a perspective view of a power module 10 provided in one embodiment of the present application. Figure 4 is a schematic diagram of a power module 10 provided in one embodiment of the present application. Figures 5 and 6 are both exploded views of a connector 200 provided in one embodiment of the present application.

[0093] The present application provides a power module 10, which includes a housing 100, a connector 200, an inductor 500, a cold plate 300, and an air-to-liquid heat exchanger 400 (as shown in Figures 3 and 4). The connector 200, the air-to-liquid heat exchanger 400, the cold plate 300, and the inductor 500 are sequentially arranged within the housing 100 along a first direction X. The housing 100 includes a front plate 110 and a rear plate 120, which are arranged relative to each other along the first direction X. Along the first direction X, the connector 200 is arranged between the air-to-liquid heat exchanger 400 and the front plate 110. The connector 200 includes a cold plate inlet 211, a heat exchanger inlet 213, a cold plate outlet 212, and a heat exchanger outlet 214 (as shown in Figures 5 and 6). Along a second direction Y, the cold plate inlet 211 and the cold plate outlet 212 are arranged adjacent to each other, and the heat exchanger inlet 213 and the heat exchanger outlet 214 are arranged adjacent to each other. The second direction Y is perpendicular to the first direction X. Along the third direction Z, one of the cold plate inlet 211 and the cold plate outlet 212 is arranged adjacent to the heat exchanger inlet 213, and the other of the cold plate inlet 211 and the cold plate outlet 212 is arranged adjacent to the heat exchanger outlet 214. The third direction Z is perpendicular to the second direction Y and the first direction X.

[0094] The housing 100 forms a sealed space to house components such as the connector 200, inductor 500, cold plate 300, and air-to-liquid heat exchanger 400. The housing 100 isolates the components within the housing 100 from the external environment, preventing long-term contact between components such as the inductor 500 and corrosive substances, dust, and moisture, which could reduce the long-term reliability of the power module 10, increase failure rates, and shorten component lifespan. The provision of the housing 100 improves the reliability of the power module 10.

[0095] The inductor 500 is one of the components used to achieve power conversion in the power module 10. Along the first direction X, the inductor 500 is located between the rear plate 120 and the cold plate 300 (as shown in FIG4 ). Generally, the inductor 500 is relatively large. Placing the inductor 500 at one end of the housing 100, closer to the rear plate 120, along the first direction X, avoids obstruction of the arrangement of other components within the housing 100, thereby facilitating miniaturization of the power module 10.

[0096] The cold plate 300 is used to cool the heat-generating components within the power module 10, particularly those with high heat generation. For example, the cold plate 300 can be used to cool the power tube 700 (as shown in FIG4 ). A heat exchange medium flows through the cold plate 300. The heat exchange medium within the cold plate 300 adheres to the heat-generating components and exchanges heat with the components to cool the components. In one embodiment, the cold plate 300 can also cool the heat-generating components by cooling the air within the housing 100 and then passing the air within the housing 100.

[0097] The air-to-liquid heat exchanger 400 is used to cool the heat-generating components in the power module 10. A heat exchange medium circulates in the air-to-liquid heat exchanger 400. The heat exchange medium in the air-to-liquid heat exchanger 400 can exchange heat with the air in the housing 100 to cool the air in the housing 100. The lower-temperature air can cool the heat-generating components when it flows through the heat-generating components. The lower-temperature air absorbs heat from the heat-generating components and its temperature rises. The higher-temperature air can be cooled again when it flows through the air-to-liquid heat exchanger 400. In one embodiment, the power module 10 further includes heat-generating components such as capacitors, relays, transformers, lightning arresters, and Hall sensors. The air-to-liquid heat exchanger 400 can be used to cool heat-generating components such as the inductor 500, capacitors, relays, transformers, lightning arresters, and Hall sensors.

[0098] The cold plate 300 and the air-to-liquid heat exchanger 400 are both connected to a connector 200 (as shown in FIG4 ). The connector 200 is located within the housing 100 and is positioned at one end of the housing 100 near the front plate 110 along a first direction X. In one embodiment, the connector 200 is fixed to the front plate 110. Generally, a gap is provided between the air-to-liquid heat exchanger 400 and the front plate 110 to facilitate installation and prevent damage to the air-to-liquid heat exchanger 400 due to contact with the front plate 110. In this case, placing the connector 200 within the gap between the air-to-liquid heat exchanger 400 and the front plate 110 allows for full utilization of the interior space of the housing 100.

[0099] The cold plate inlet 211 in the connector 200 is used to communicate with the inlet of the cold plate 300 and is used to deliver heat exchange medium to the cold plate 300. The cold plate outlet 212 is used to communicate with the outlet of the cold plate 300 and is used to receive heat exchange medium discharged from the cold plate 300. The heat exchanger inlet 213 is used to communicate with the inlet of the air-to-liquid heat exchanger 400 and is used to deliver heat exchange medium to the air-to-liquid heat exchanger 400. The heat exchanger outlet 214 is used to communicate with the outlet of the air-to-liquid heat exchanger 400 and is used to receive heat exchange medium discharged from the air-to-liquid heat exchanger 400.

[0100] The cold plate inlet 211 and the cold plate outlet 212 are arranged in a direction parallel to the direction of the heat exchanger inlet 213 and the heat exchanger outlet 214 (as shown in Figures 5 and 6). Alternatively, the cold plate inlet 211 and the heat exchanger inlet 213 are arranged along the third direction Z, and the cold plate outlet 212 and the heat exchanger outlet 214 are arranged along the third direction Z. Alternatively, the cold plate inlet 211 and the heat exchanger outlet 214 are arranged along the third direction Z, and the cold plate outlet 212 and the heat exchanger inlet 213 are arranged along the third direction Z. The cold plate inlet 211, the heat exchanger inlet 213, the cold plate outlet 212, and the heat exchanger outlet 214 in the connector 200 are arranged in a relatively regular pattern. The regular arrangement of the various inlets and outlets on the connector 200 helps reduce the size of the connector 200.

[0101] In one embodiment, the first direction X is the length direction of the power module 10 , the second direction Y is the width direction of the power module 10 , and the third direction Z is the height direction of the power module 10 .

[0102] The power module 10 provided herein includes a cold plate 300 and an air-to-liquid heat exchanger 400, which effectively dissipate heat from the power module 10. The cold plate 300 has a strong heat dissipation capability for heat-generating components and is used to dissipate heat from high-heat-generating components, meeting their heat dissipation requirements and providing excellent heat dissipation for these components. The air-to-liquid heat exchanger 400 dissipates heat from various heat-generating components within the housing 100.

[0103] It is understandable that if the power module 10 only includes the air-to-liquid heat exchanger 400 for heat dissipation, the air-to-liquid heat exchanger 400 would require a large volume to meet the heat dissipation requirements of the various heat-generating components within the housing 100. However, in the present application, since the high-heat-generating components are cooled by the cold plate 300, the heat generation of other heat-generating components within the housing 100 is relatively low. In this case, the air-to-liquid heat exchanger 400, with its smaller volume, can achieve a better heat dissipation effect for the other heat-generating components.

[0104] It is understood that if the power module 10 only includes a cold plate 300 for heat dissipation, each heat-generating component requires a cold plate 300, resulting in a large number of cold plates 300, which increases the cost of the power module 10 and the complexity of the heat dissipation system formed by the cold plates 300. In the present application, however, the cold plate 300 is used to cool high-heat-generating components, while other heat-generating components can be cooled by the air-to-liquid heat exchanger 400, reducing the heat dissipation cost of the power module 10. The heat dissipation system formed by the cold plate 300 and the air-to-liquid heat exchanger 400 has a simple structure, fewer components, and is easy to install within the housing 100.

[0105] The power module 10 provided in the present application dissipates heat from the power module 10 through a composite heat dissipation system of a cold plate 300 combined with an air-to-liquid heat exchanger 400. This not only provides a good heat dissipation effect on various heat-generating components in the housing 100, but also reduces the heat dissipation cost of the power module 10, reduces the complexity of the heat dissipation system in the power module 10, and reduces the size of the power module 10.

[0106] On the other hand, the cold plate 300 and the air-liquid heat exchanger 400 are connected to the same connector 200 and receive and discharge the heat exchange medium through the same connector 200. The cold plate 300 and the air-liquid heat exchanger 400 are centrally connected to the connector 200, which reduces the number of connectors 200 and makes the heat dissipation pipeline arrangement in the power module 10 more regular.

[0107] On the other hand, the connector 200, the air-to-liquid heat exchanger 400, the cold plate 300, and the inductor 500 are sequentially arranged inside the housing 100 along the first direction X. This arrangement fully utilizes the internal space of the housing 100 and facilitates reducing the size of the power module 10. The rational layout of the components within the housing 100 helps improve the reliability of the power module 10.

[0108] In one possible implementation, the housing 100 includes a first side plate 130 and a second side plate 140. The first side plate 130 and the second side plate 140 are arranged relative to each other along a second direction Y. The connector 200, the air-to-liquid heat exchanger 400, the cold plate 300, and the inductor 500 are arranged between the first side plate 130 and the second side plate 140. In the second direction Y, the distance between the connector 200 and the first side plate 130 is smaller than the distance between the connector 200 and the second side plate 140. In the second direction Y, the connector 200 is closer to the first side plate 130 than to the second side plate 140.

[0109] In one embodiment, the power module 10 is mounted to the energy storage cabinet 1 (see Figures 2 and 4 ). The first side panel 130 is closer to the rotating member between the cabinet door 13 and the cabinet body 12 than the second side panel 140. The connector 200 is positioned closer to the first side panel 130 to facilitate communication between the connector 200 and the cooling assembly 14.

[0110] In one possible implementation, along the second direction Y, the distance between the connector 200 and the first side plate 130 is smaller than the distance between the air-to-liquid heat exchanger 400 and the first side plate 130 (as shown in FIG4 ), and the distance between the connector 200 and the second side plate 140 is larger than the distance between the air-to-liquid heat exchanger 400 and the second side plate 140. The air-to-liquid heat exchanger 400 is spaced apart from both the first side plate 130 and the second side plate 140 along the second direction Y. The gap between the air-to-liquid heat exchanger 400 and the first side plate 130 is used to install the air-to-liquid heat exchanger 400 and to route the connecting pipes between the air-to-liquid heat exchanger 400 and the connector 200. The gap between the air-to-liquid heat exchanger 400 and the second side plate 140 is used to install the air-to-liquid heat exchanger 400.

[0111] Generally, in order to ensure the heat dissipation effect of the air-to-liquid heat exchanger 400, the length of the air-to-liquid heat exchanger 400 along the second direction Y is longer, and the distance between the air-to-liquid heat exchanger 400 and the first side plate 130 and the second side plate 140 is smaller. In the power module 10 provided in the present application, the distance between the connector 200 and the first side plate 130 is smaller than the distance between the air-to-liquid heat exchanger 400 and the first side plate 130. The distance between the connector 200 and the first side plate 130 is smaller and the distance between the connector 200 and the second side plate 140 is larger. The connector 200 is arranged closer to the first side plate 130. On the one hand, the connector 200 is located in the corner between the first side plate 130 and the front plate 110, which improves the utilization rate of the internal space of the shell 100 and reduces the impact on other devices and pipeline layout. On the other hand, the connection route between the connector 200 and the cooling assembly 14 is shorter, making the pipeline layout in the energy storage cabinet 1 more concise.

[0112] In one possible implementation, along the second direction Y, at least one of the distance between the cold plate inlet 211 and the cold plate outlet 212 or the distance between the heat exchanger inlet 213 and the heat exchanger outlet 214 is smaller than the distance between the air-to-liquid heat exchanger 400 and the first side plate 130 (combined with Figures 4 and 5).

[0113] In one embodiment, along the second direction Y, the distance between the cold plate inlet 211 and the cold plate outlet 212 is smaller than the distance between the air-to-liquid heat exchanger 400 and the first side plate 130. Because the distance between the air-to-liquid heat exchanger 400 and the first side plate 130 is smaller, the distance between the cold plate inlet 211 and the cold plate outlet 212 is smaller than the distance between the air-to-liquid heat exchanger 400 and the first side plate 130. This allows the cold plate inlet 211 and the cold plate outlet 212 to be arranged compactly, thereby reducing the size of the connector 200 along the second direction Y.

[0114] In one embodiment, along the second direction Y, the distance between the heat exchanger inlet 213 and the heat exchanger outlet 214 is smaller than the distance between the air-to-liquid heat exchanger 400 and the first side plate 130. Because the distance between the air-to-liquid heat exchanger 400 and the first side plate 130 is smaller, the distance between the heat exchanger inlet 213 and the heat exchanger outlet 214 is smaller than the distance between the air-to-liquid heat exchanger 400 and the first side plate 130. This allows the heat exchanger inlet 213 and the heat exchanger outlet 214 to be arranged compactly, thereby reducing the size of the connector 200 along the second direction Y.

[0115] In one embodiment, along the second direction Y, the distance between the cold plate inlet 211 and the cold plate outlet 212, and the distance between the heat exchanger inlet 213 and the heat exchanger outlet 214 are both smaller than the distance between the air-to-liquid heat exchanger 400 and the first side plate 130, so that the size of the connector 200 along the second direction Y can be smaller.

[0116] In one embodiment, the power module 10 further includes a cold plate liquid inlet pipe 310 and a cold plate liquid outlet pipe 320 (as shown in Figures 4 and 5). The cold plate liquid inlet pipe 310 is used to connect the inlet of the cold plate 300 and the cold plate inlet 211 of the connector 200. The cold plate liquid outlet pipe 320 is used to connect the outlet of the cold plate 300 and the cold plate outlet 212 of the connector 200. The distance between the cold plate inlet 211 and the cold plate outlet 212 is small, so that the cold plate liquid inlet pipe 310 and the cold plate liquid outlet pipe 320 are relatively concentrated, which facilitates the joint sealing of the cold plate liquid inlet pipe 310 and the connector 200, and the joint sealing of the cold plate liquid outlet pipe 320 and the connector 200.

[0117] In one embodiment, the power module 10 further includes a heat exchanger inlet pipe 430 and a heat exchanger outlet pipe 440 (as shown in Figures 4 and 5). The heat exchanger inlet pipe 430 is used to connect the inlet of the air-to-liquid heat exchanger 400 and the heat exchanger inlet 213 of the connector 200. The heat exchanger outlet pipe 440 is used to connect the outlet of the air-to-liquid heat exchanger 400 and the heat exchanger outlet 214 of the connector 200. The distance between the heat exchanger inlet 213 and the heat exchanger outlet 214 is small, so that the heat exchanger inlet pipe 430 and the heat exchanger outlet pipe 440 are relatively concentrated, which facilitates the joint sealing of the heat exchanger inlet pipe 430 and the connector 200, and the joint sealing of the heat exchanger outlet pipe 440 and the connector 200.

[0118] In one possible implementation, the connector 200 includes a first sub-cavity 201 and a second sub-cavity 202 (as shown in Figures 5 and 6). Along the second direction Y, the first sub-cavity 201 and the second sub-cavity 202 are adjacent and spaced apart. The first sub-cavity 201 is used to connect the cold plate inlet 211 and the heat exchanger inlet 213, and the second sub-cavity 202 is used to connect the cold plate outlet 212 and the heat exchanger outlet 214. The flow path of the cold plate 300 and the flow path of the air-to-liquid heat exchanger 400 operate in parallel. The cold plate 300 and the air-to-liquid heat exchanger 400 receive heat exchange medium through the first sub-cavity 201 and discharge the heat exchange medium through the second sub-cavity 202. Along the third direction Z, the cold plate inlet 211 and the heat exchanger inlet 213 are adjacent, and the cold plate outlet 212 and the heat exchanger outlet 214 are adjacent.

[0119] By providing the first sub-cavity 201 and the second sub-cavity 202 to enable parallel operation of the cold plate 300 and the air-to-liquid heat exchanger 400, the heat dissipation efficiency of the power module 10 is improved. The two liquid cooling pipes 15 of the cooling assembly 14 are connected to the first sub-cavity 201 and the second sub-cavity 202, respectively, thereby connecting the cooling assembly 14 with the cold plate inlet 211, the heat exchanger inlet 213, the cold plate outlet 212, and the heat exchanger outlet 214. This reduces the number of pipes between the cooling assembly 14 and the connector 200, and the number of connectors on the connector 200 for connecting to the liquid cooling pipes 15 of the cooling assembly 14. This reduces the size of the connector 200 and facilitates the miniaturization of the power module 10.

[0120] In one embodiment, the connector 200 includes a connection base 210, a first cover plate 220, and a partition plate 240 (as shown in Figures 5 and 6). The connection base 210 includes a first groove. The cold plate inlet 211, the cold plate outlet 212, the heat exchanger inlet 213, and the heat exchanger outlet 214 respectively pass through the bottom of the first groove along the first direction X. The partition plate 240 is located in the first groove and is used to separate the first groove along the second direction Y. The outer peripheral surface of the first cover plate 220 is fixedly connected to the groove wall of the first groove, and the side of the first cover plate 220 facing the groove bottom of the first groove is fixedly connected to the partition plate 240. The groove bottom of the first groove and the first cover plate 220 are arranged at intervals along the first direction X. A first cavity 251 is formed between the connection base 210 and the first cover plate 220, and the partition plate 240 divides the first cavity 251 into a first sub-cavity 201 and a second sub-cavity 202.

[0121] In one possible implementation, the connector 200 further includes a second cavity 252 and a drainage hole 215 (as shown in Figures 5 and 6). The second cavity 252 is adjacent to the first sub-cavity 201 or the second sub-cavity 202 and is arranged spaced apart along the first direction X, and the drainage hole 215 is connected to the second cavity 252. The second cavity 252 and the first cavity 251 are arranged along the first direction. The second cavity 252 is isolated from the first cavity 251. The power module 10 further includes a cold plate inlet pipe 310, a cold plate outlet pipe 320, a heat exchanger inlet pipe 410, and a heat exchanger outlet pipe 440. One end of the cold plate inlet pipe 310, the cold plate outlet pipe 320, the heat exchanger inlet pipe 430, and the heat exchanger outlet pipe 440 are all connected to the connection base 210 of the connector 200.

[0122] Generally, to prevent leakage of the heat exchange medium from affecting the normal operation of the components within the power module 10, a sealing process is typically performed at the connection points between the cold plate inlet pipe 310, the cold plate outlet pipe 320, the heat exchanger inlet pipe 430, and the heat exchanger outlet pipe 440 and the connector 210. In one embodiment, the cold plate inlet pipe 310, the cold plate outlet pipe 320, the heat exchanger inlet pipe 430, and the heat exchanger outlet pipe 440 are welded to the connector 210, and a seal with the connector 210 is achieved through the welds.

[0123] However, during use of the power module 10, the connection between the cold plate liquid inlet pipe 310, the cold plate liquid outlet pipe 320, the heat exchanger liquid inlet pipe 430, and the heat exchanger liquid outlet pipe 440 and the connector 210 may be poorly sealed, and the heat exchange medium may leak to the side of the connector 210 that is away from the first cavity 251. In the power module 10 provided in the present application, a second cavity 252 is provided on the side of the connector 210 that is away from the first cavity 251. The leaked heat exchange medium will be collected in the second cavity 252 and discharged to the outside of the second cavity 252 through the drain hole 215. The provision of the second cavity 252 provides a secondary seal for the connector 200, reducing the risk of leakage damaging the components in the housing 100. In one embodiment, the heat exchange medium discharged from the drain hole 215 can be discharged to the outside of the housing 100 through a pipeline.

[0124] In one embodiment, the volume of the second cavity 252 is smaller than that of the first cavity 251. The larger volume of the first cavity 251 ensures that the heat exchange medium can be smoothly supplied to the cold plate 300 and the air-to-liquid heat exchanger 400, and that the heat exchange medium discharged from the cold plate 300 and the air-to-liquid heat exchanger 400 can be smoothly discharged outside the connector 200. The second cavity 252 is primarily used to prevent leaked heat exchange medium from entering the housing 100. The second cavity 252 is used to temporarily store the heat exchange medium. The heat exchange medium in the second cavity 252 is quickly discharged outside the housing 100 through the drain hole 215. The smaller volume of the second cavity 252 also prevents leaked heat exchange medium from damaging components within the housing 100. Reducing the volume of the second cavity 252 helps reduce the size of the connector 200.

[0125] In one possible implementation, the connector 200 includes a first cover plate 220, a connector base 210, a second cover plate 230, and a partition plate 240 (as shown in Figures 5 and 6). The first cover plate 220 and the second cover plate 230 are respectively arranged on either side of the connector base 210 along a first direction X, and respectively enclose the two sides of the connector base 210 to form a first cavity 251 and a second cavity 252. The partition plate 240 is located within the first cavity 251 and is used to separate the first cavity 251 into a first sub-cavity 201 and a second sub-cavity 202. The connector base 210 includes a cold plate inlet 211, a cold plate outlet 212, a heat exchanger inlet 213, and a heat exchanger outlet 214. The cold plate inlet 211, the cold plate outlet 212, the heat exchanger inlet 213, and the heat exchanger outlet 214 pass through the connector base 210 along the first direction X. The first cover plate 220 includes a liquid inlet 221 and a liquid outlet 222. The liquid inlet 221 and the liquid outlet 222 respectively penetrate the first cover plate 220 along the first direction X. The liquid inlet 221 is used to connect to at least one of the cooling inlet 211 or the heat exchange inlet 213, and the liquid outlet 222 is used to connect to at least one of the cold plate outlet 212 or the heat exchanger outlet 214. The second cover plate 230 includes a first opening 231, a second opening 232, a third opening 233, and a fourth opening 234. The first opening 231, the second opening 232, the third opening 233, and the fourth opening 234 respectively penetrate the second cover plate 230 along the first direction X. Along the first direction X, the first opening 231, the second opening 232, the third opening 233, and the fourth opening 234 are respectively arranged opposite the cold plate inlet 211, the cold plate outlet 212, the heat exchanger inlet 213, and the heat exchanger outlet 214.

[0126] The liquid inlet 221 and liquid outlet 222 on the first cover plate 220 are respectively used to communicate with the two liquid cooling pipes 15 of the cooling assembly 14 (see Figures 2 and 6). The first sub-chamber 201 receives the heat exchange medium transmitted by the cooling assembly 14 through the liquid inlet 221 and delivers the received heat exchange medium to the cold plate 300 and the air-to-liquid heat exchanger 400 through the cold plate inlet 211 and the heat exchanger inlet 213, respectively. The heat exchange medium flowing out of the cold plate 300 and the air-to-liquid heat exchanger 400 flows into the second sub-chamber 202 through the cold plate outlet 212 and the heat exchanger outlet 214, respectively. The heat exchange medium in the second sub-chamber 202 is then delivered to the cooling assembly 14 through the liquid outlet 222.

[0127] The connection base 210 also includes a second groove, which is aligned with the first groove along the first direction X. The outer peripheral surface of the second cover plate 230 is fixedly connected to the groove wall of the second groove. The second cover plate 230 is spaced apart from the groove bottom of the second groove to form a second cavity 252. The connection base 210 also includes a drainage hole 215, which extends through the connection base 210 along the first direction X. The projection of the second cover plate 230 along the first direction covers the projection of the drainage hole 215 along the first direction.

[0128] In one embodiment, the projection of the first cover plate 220 along the first direction X does not overlap with the projection of the drainage hole 215 along the first direction X (as shown in FIG5 ). Along the first direction X, the projection of the first cover plate 220 on the connector 210 partially covers the connector 210, and the drainage hole 215 is provided in the area of ​​the connector 210 not covered by the projection of the first cover plate 220. The drainage hole 215 only needs to penetrate the connector 210 to drain the heat exchange medium leaking into the second cavity 252 out of the connector 200.

[0129] In one embodiment, the housing 100 includes a top plate 150 and a bottom plate 160, which are arranged relative to each other along a third direction Z. Along the third direction Z, the distance between the drain hole 215 and the bottom plate 160 is smaller than the distance between the heat exchanger inlet 213 or the heat exchanger outlet 214 and the bottom plate 160. The proximity of the drain hole 215 to the bottom plate 160 facilitates rapid discharge of the heat exchange medium within the second cavity 252 and further facilitates complete drainage of the heat exchange medium within the second cavity 252, thereby preventing accumulation of the heat exchange medium within the second cavity 252.

[0130] The second cover plate 230 is provided with a first opening 231, a second opening 232, a third opening 233, and a fourth opening 234 (as shown in Figures 5 and 6). Along the second direction Y, the first opening 231 is adjacent to the second opening 232, and the third opening 233 is adjacent to the fourth opening 234. Along the third direction Z, the first opening 231 is adjacent to the third opening 233, and the second opening 232 is adjacent to the fourth opening 234. The power module 10 also includes a cold plate inlet pipe 310, a cold plate outlet pipe 320, a heat exchanger inlet pipe 430, and a heat exchanger outlet pipe 440 (see Figure 4). The cold plate inlet pipe 310 extends into the second cavity 252 through the first opening 231 and is fixed to the inner wall of the cold plate inlet 211. The cold plate outlet pipe 320 extends into the second cavity 252 through the second opening 232 and is fixed to the inner wall of the cold plate outlet 212. The heat exchanger liquid inlet pipe 430 extends into the second cavity 252 through the third opening 233 and is fixed to the inner wall of the heat exchanger inlet 213. The heat exchanger liquid outlet pipe 440 extends into the second cavity 252 through the fourth opening 234 and is fixed to the inner wall of the heat exchanger outlet 214.

[0131] Along the first direction X, the first opening 231 is arranged opposite the cold plate inlet 211. The distance between the first opening 231 and the cold plate inlet 211 is relatively short, so the cold plate liquid inlet pipe 310 is connected to the cold plate inlet 211 with a shorter pipe length and no bends are required. This not only saves costs but also reduces the risk of bending and breaking the cold plate liquid inlet pipe 310, and improves the reliability of the connection between the cold plate liquid inlet pipe 310 and the cold plate inlet 211. Similarly, along the first direction X, the second opening 232 is arranged opposite the cold plate outlet 212, the third opening 233 is arranged opposite the heat exchanger inlet 213, and the fourth opening 234 is arranged opposite the heat exchanger outlet 214. This also saves costs and improves the reliability of the connection between the cold plate liquid outlet pipe 320, the heat exchanger liquid inlet pipe 430, and the heat exchanger liquid outlet pipe 440 and the connecting base 210.

[0132] In one possible implementation, the power module 10 includes a liquid inlet connector 223 and a liquid outlet connector 224 (as shown in Figures 5 and 6). The liquid inlet connector 223 and the liquid outlet connector 224 are fixed to the first cover plate 220 and respectively communicate with the liquid inlet hole 221 and the liquid outlet hole 222. The front plate 110 includes a through hole 111 that passes through the front plate 110 along a first direction X. Along the first direction X, the projection of the through hole 111 overlaps the projections of the liquid inlet connector 223 and the liquid outlet connector 224, and the projection of the first cover plate 220 overlaps the projection of the through hole 111. Along the third direction Z, the length of the liquid inlet connector 223 and the liquid outlet connector 224 is greater than the distance between the first cover plate 220 and the front plate 110.

[0133] The liquid inlet connector 223 connects the liquid inlet hole 221 with the cooling assembly 14, and the liquid outlet connector 224 connects the liquid outlet hole 222 with the cooling assembly. Along the first direction X, the liquid inlet connector 223 and the liquid outlet connector 224 extend from the interior of the housing 100 through the through-hole 111 to the exterior of the housing 100. The power module 10 can be connected to the cooling assembly 14 outside the housing 100. Compared to connecting inside the housing 100, the power module 10 is connected to the two liquid cooling pipes 15 of the cooling assembly 14 outside the housing 100 via the liquid inlet connector 223 and the liquid outlet connector 224, respectively. This provides more operating space outside the housing 100, making it easier to connect the two liquid cooling pipes 15 to the liquid inlet connector 223 and the liquid outlet connector 224. On the other hand, the connection between the power module 10 and the liquid cooling pipe 15 is set on the outside of the shell 100. If the heat exchange medium leaks due to loose connection between the joint and the pipe during long-term operation of the power module 10, the leaked heat exchange medium is located outside the shell 100, which can avoid damage to the components inside the shell 100.

[0134] In addition, the projection of the first cover plate 220 along the first direction X covers the projection of the through hole 111, and the area of ​​the first cover plate 220 is larger than that of the through hole 111. The small area of ​​the through hole 111 facilitates ensuring the sealing of the housing 100.

[0135] In the embodiment shown in FIG5 , the liquid inlet connector 223 and the liquid outlet connector 224 are adjacent and spaced apart along the second direction Y. In one embodiment, the liquid inlet connector 223 and the liquid outlet connector 224 can be disposed at diagonal positions of the first cover plate 220 (as shown in FIG7 ), and accordingly, the liquid inlet hole 221 and the liquid outlet hole 222 are also disposed at diagonal positions of the first cover plate 220. The liquid inlet connector 223 and the liquid outlet connector 224 are relatively far apart, providing a larger operating space when the liquid inlet connector 223 and the liquid outlet connector 224 are connected to the liquid cooling pipe 15, facilitating connection of the liquid cooling pipe 15. Furthermore, the liquid inlet connector 223 and the liquid outlet connector 224 are staggered, which can reduce the size of the connector 200 along the second direction Y while ensuring that the liquid inlet connector 223 and the liquid outlet connector 224 are sufficiently far apart for connection to the liquid cooling pipe 15.

[0136] In one embodiment, a seal is provided between the first cover plate 220 and the front plate 110 along the first direction X, and the seal surrounds the through-hole 111. The seal prevents moisture, air, dust, and other substances from the external environment from entering the housing 100 through the through-hole 111 and the gap between the first cover plate 220 and the front plate 110, thereby ensuring stable operation of the power module 10. In this application, the area of ​​the through-hole 111 is relatively small, so the corresponding seal can be made smaller and the seal is more reliable during sealing, thereby improving the sealing performance of the housing 100 and better protecting the components within the housing 100.

[0137] In the present application, since the heat dissipation through the cold plate 300 and the air-to-liquid heat exchanger 400 is carried out inside the shell 100, and the cold plate 300 and the air-to-liquid heat exchanger 400 only receive the heat exchange medium outside the shell 100 through a smaller through hole 111 and discharge the heat exchange medium to the outside of the shell 100, when a seal is set to seal the gap between the side of the through hole 111 and the first cover plate 220, the overall airtightness of the shell 100 is strong and the protection level is high, which improves the long-term working reliability of the power module 10, reduces the failure rate of the components in the shell 100 and increases the life of the components.

[0138] In one embodiment, the projection of the through hole 111 along the first direction X covers the projection of the drainage hole 215 , so that the heat exchange medium in the second cavity 252 is discharged outside the housing 100 through the drainage hole 215 and the through hole 111 .

[0139] Please refer to Figures 8 and 9, which are exploded views of a connector 200 provided in one embodiment of the present application. In one possible implementation, the connector 200 includes a first sub-cavity 201, a second sub-cavity 202, and a third sub-cavity 203. The first sub-cavity 201 and the third sub-cavity 203 are adjacent and spaced apart along the third direction Z. Along the second direction Y, the first sub-cavity 201 or the third sub-cavity 203 is adjacent and spaced apart from the second sub-cavity 202. The first sub-cavity 201 is connected to the heat exchanger inlet 213, the second sub-cavity 202 is connected to the heat exchanger outlet 214 and the cold plate inlet 211, and the third sub-cavity 203 is connected to the cold plate outlet 212.

[0140] The flow path of the cold plate 300 and the flow path of the air-to-liquid heat exchanger 400 operate in series. The inlet of the air-to-liquid heat exchanger 400 communicates with the first sub-chamber 201, through which it receives heat exchange medium. The outlet of the air-to-liquid heat exchanger 400 and the inlet of the cold plate 300 communicate with the second sub-chamber 202. The heat exchange medium discharged from the outlet of the air-to-liquid heat exchanger 400 into the second sub-chamber 202 can be transported into the cold plate 300. The outlet of the cold plate 300 communicates with the third sub-chamber 203, through which it transports the heat exchange medium to the cooling assembly 14.

[0141] By providing the first, second, and third sub-cavities 201, 202, and 203 to enable the cold plate 300 and the air-to-liquid heat exchanger 400 to operate in series, the heat dissipation energy consumption of the power module 10 can be reduced. The two liquid cooling pipes 15 of the cooling assembly 14 are connected to the first and third sub-cavities 201, 203, respectively, thereby connecting the cooling assembly 14 with the cold plate inlet 211, the heat exchanger inlet 213, the cold plate outlet 212, and the heat exchanger outlet 214. This reduces the number of pipes between the cooling assembly 14 and the connector 200, and the number of connectors on the connector 200 for connecting to the liquid cooling pipes 15 of the cooling assembly 14. This reduces the size of the connector 200 and facilitates the miniaturization of the power module 10.

[0142] On the other hand, because the cold plate 300 is primarily used to dissipate heat from high-heat generating devices, and the air-to-liquid heat exchanger 400 is primarily used to dissipate heat from medium- and low-heat generating devices, the temperature difference between the heat transfer medium before and after the cold plate 300 is relatively large, while the temperature difference between the heat transfer medium before and after the air-to-liquid heat exchanger 400 is relatively small. In this application, by controlling the heat transfer medium to flow through the air-to-liquid heat exchanger 400 and then the cold plate 300, both heat transfer methods can be used to dissipate heat from the heat generating devices, thereby effectively dissipating heat from various heat generating devices.

[0143] Generally, when the power module 10 requires high heat dissipation, the power module 10 can use the cold plate 300 and the air-to-liquid heat exchanger 400 to operate in parallel to dissipate heat from the heat-generating components. This parallel operation can quickly cool various heat-generating components. When the power module 10 requires low heat dissipation, the power module 10 can use the cold plate 300 and the air-to-liquid heat exchanger 400 to operate in series to dissipate heat from the heat-generating components, thereby saving energy.

[0144] In one embodiment, the connector 200 includes a connector base 210, a first cover plate 220, and a partition plate 240. A first cavity 251 is formed between the connector base 210 and the first cover plate 220. The partition plate 240 divides the first cavity 251 into a first sub-cavity 201, a second sub-cavity 202, and a third sub-cavity 203. The connector 200 may include two connected partition plates 240, such as partition plate 240a and partition plate 240b in FIG9. Partition plate 240a is located between the cold plate inlet 211 and the cold plate outlet 212, and between the heat exchanger outlet 214 and the heat exchanger inlet 213 (see FIG8). Partition plate 240a is used to separate the cold plate inlet 211 and the heat exchanger outlet 214 from the cold plate outlet 212 and the heat exchanger inlet 213. Partition plate 240b is located between the cold plate outlet 212 and the heat exchanger inlet 213 and is used to separate the cold plate outlet 212 from the heat exchanger inlet 213.

[0145] The connector 210 includes a cold plate inlet 211, a cold plate outlet 212, a heat exchanger inlet 213, and a heat exchanger outlet 214. Along the third direction Z, the cold plate inlet 211 and the heat exchanger outlet 214 are arranged adjacent to each other, while the cold plate outlet 212 and the heat exchanger inlet 213 are arranged adjacent to each other (as shown in Figures 8 and 9).

[0146] The first cover plate 220 includes a liquid inlet 221 and a liquid outlet 222. The liquid inlet 221 and the liquid outlet 222 extend through the first cover plate 220 along the first direction X. The liquid inlet 221 communicates with the first sub-cavity 201 and thus with the heat exchanger inlet 213. The liquid outlet 222 communicates with the third sub-cavity 203 and thus with the cold plate outlet 212. The liquid inlet 221 and the liquid outlet 222 are arranged along the third direction Z.

[0147] In one embodiment, the connector 200 further includes a second cavity 252 and a drainage hole 215 (as shown in Figures 8 and 9). Along the first direction X, the second cavity 252 is adjacent to the first sub-cavity 201, the second sub-cavity 202, and the third sub-cavity 203, and is arranged in an interval. In one embodiment, the connector 200 further includes a second cover plate 230. The second cover plate 230 and the side of the connector base 210 facing away from the first cover plate 220 along the first direction X form the second cavity 252. The drainage hole 215 extends through the connector base 210 along the first direction X. The second cavity 252 and the drainage hole 215 serve to enhance the sealing performance of the connector 200 and reduce the risk of heat exchange medium leaking into the interior of the housing 100.

[0148] It is worth noting that other structural features of the connector 200 when the cold plate 300 and the air-to-liquid heat exchanger 400 operate in series can refer to the structural features of the connector 200 when the cold plate 300 and the air-to-liquid heat exchanger 400 operate in parallel as described above, and will not be repeated here.

[0149] Please refer to Figures 10, 11, 12, and 13. Figure 10 is a perspective view of a circuit board 600, a cold plate 300, and an air-to-liquid heat exchanger 400 provided in one embodiment of the present application. Figure 11 is a front view of a circuit board 600, a cold plate 300, and an air-to-liquid heat exchanger 400 provided in one embodiment of the present application. Figure 12 is a rear view of a circuit board 600, a cold plate 300, and an air-to-liquid heat exchanger 400 provided in one embodiment of the present application. Figure 13 is a top view of a circuit board 600, a cold plate 300, and an air-to-liquid heat exchanger 400 provided in one embodiment of the present application.

[0150] In one possible implementation, the power module 10 further includes a circuit board 600 and a plurality of power tubes 700. The housing 100 includes a top plate 150 and a bottom plate 160 (refer to Figures 3 and 4). The top plate 150 and the bottom plate 160 are arranged relative to each other along the third direction Z. The circuit board 600 is arranged at intervals between the top plate 150 and the bottom plate 160. The plurality of power tubes 700 and the cold plate 300 are arranged on a side of the circuit board 600 facing the bottom plate 160. The cold plate 300 is in contact with at least one power tube 700 along the first direction X.

[0151] The power tubes 700 can be IGBTs, MOSFETs, or other types of power tubes 700. Multiple power tubes 700 are connected to the circuit board 600 along the third direction Z. The power tubes 700 and the circuit board 600 are used together to achieve power conversion. At least one power tube 700 is stacked and arranged with the cold plate 300 along the first direction X (as shown in Figures 12 and 13). At least one power tube 700 is in contact with the cold plate 300 on its side along the first direction X. Both opposing side surfaces of the cold plate 300 along the first direction X can be used to contact the power tubes 700.

[0152] In one embodiment, the plurality of power tubes 700 are in contact with the cold plate 300 along the first direction X.

[0153] In the power module 10 provided herein, the power tube 700 is a high-heat-generating device. The cold plate 300 is used to dissipate heat from the power tube 700, thereby improving cooling efficiency. The first direction X is parallel to the circuit board 600. The cold plate 300 aligns with the power tube 700 along the first direction X, thereby reducing the size of the power module 10 along the third direction X.

[0154] In one embodiment, the length of the cold plate 300 along the first direction X is less than the length of the cold plate 300 along the third direction Z. The two opposing side surfaces of the cold plate 300 along the first direction X are the side surfaces with the larger area. The side surface of the cold plate 300 with the larger area contacts the power tube 700, thereby providing better cooling for the power tube 700.

[0155] In one embodiment, the length of the power tube 700 along the first direction X is shorter than the length of the power tube 700 along the second direction Y. The two side surfaces of the power tube 700 that are opposite each other along the first direction X are side surfaces with larger areas. The side surface of the power tube 700 with the larger area contacts the cold plate 300, thereby increasing the contact area between the power tube 700 and the cold plate 300 and facilitating rapid cooling of the power tube 700.

[0156] In one embodiment, along the first direction X, the projection of the cold plate 300 covers the projection of the power tube 700 . The power tube 700 and the cold plate 300 have a large contact area, which is conducive to rapid cooling of the power tube 700 .

[0157] In one embodiment, at least one of silicone grease and a ceramic sheet is further provided between the power tube 700 and the cold plate 300. The power tube 700 is bonded to the cold plate 300 via the silicone grease and / or the ceramic sheet. The silicone grease and the ceramic sheet have excellent thermal conductivity and insulation properties, and can insulate the power tube 700 from the cold plate 300 without affecting the rapid heat dissipation of the power tube 700.

[0158] In one possible implementation, the power module 10 includes a plurality of connected cold plates 300, the plurality of cold plates 300 being arranged at intervals along a first direction X, the plurality of power tubes 700 including a plurality of columns of power tubes 700 arranged at intervals along the first direction X (as shown in FIG4 and FIG13 ), each column of power tubes 700 including a plurality of power tubes 700 arranged sequentially along a second direction Y, and the plurality of power tubes 700 in each column of power tubes 700 being in contact with the same cold plate 300.

[0159] The cold plate 300 extends along the second direction Y. The length of the cold plate 300 along the second direction Y is greater than or equal to the length of each column of power tubes 700 along the second direction Y. The multiple power tubes 700 in each column of power tubes 700 contact the same side of the cold plate 300 along the first direction X on the same side of the first direction X. In the embodiment shown in FIG13 , the power module 10 includes six columns of power tubes 700, each column of power tubes 700 including 16 power tubes.

[0160] In the power module 10 provided in the present application, one cold plate 300 can be used to cool at least one column of power tubes 700, thereby improving the utilization rate of the cold plate 300. In addition, in the present application, by providing multiple cold plates 300 to cool multiple columns of power tubes 700, heat can be better dissipated from the multiple columns of power tubes 700 in the power module 10, thereby improving the reliability of the power module 10.

[0161] In one embodiment, the power module 10 further includes at least one cold plate connecting pipe 330 (as shown in FIG13 ). The at least one cold plate connecting pipe 330 is arranged alternately with the multiple cold plates 300 along a first direction X. The cold plate connecting pipe 330 is used to connect two adjacent cold plates 300. The cold plate connecting pipe 330 can be used to achieve a series connection between the multiple cold plates 300. In one embodiment, the at least one cold plate connecting pipe 330 and the multiple cold plates 300 are integrated into one structure. This not only improves the overall structural strength of the at least one cold plate connecting pipe 330 and the multiple cold plates 300, but also reduces the number of welds between the cold plate connecting pipe 330 and the cold plates 300, thereby reducing the risk of heat exchange medium leakage.

[0162] In one embodiment, the power module 10 further includes a cold plate liquid inlet pipe 310 and a cold plate liquid outlet pipe 320 (as shown in FIG13 ). One end of the cold plate liquid inlet pipe 310 is connected to the cold plate inlet 211 of the connector 200 , and one end of the cold plate liquid inlet pipe 310 is connected to the inlet of a first cold plate 300 among the multiple cold plates 300 . One end of the cold plate liquid outlet pipe 320 is connected to the cold plate outlet 212 of the connector 200 , and one end of the cold plate liquid outlet pipe 320 is connected to the outlet of a last cold plate 300 among the multiple cold plates 300 . The first cold plate 300 and the last cold plate 300 are respectively the first and last cold plates 300 along a first direction among the multiple cold plates 300 .

[0163] In one embodiment, the cold plate liquid inlet pipe 310, multiple cold plates 300, at least one cold plate connecting pipe 330 and the cold plate liquid outlet pipe 320 are an integrated structure, which not only improves the overall structural strength of the cold plate liquid inlet pipe 310, multiple cold plates 300, at least one cold plate connecting pipe 330 and the cold plate liquid outlet pipe 320, but also reduces the number of welds between the cold plate connecting pipe 330 and the multiple cold plates 300, the welds between the cold plate liquid inlet pipe 310 and the cold plate 300, and the welds between the cold plate liquid outlet pipe 320 and the cold plate 300, thereby reducing the risk of heat exchange medium leakage.

[0164] In one embodiment, the cold plate inlet pipe 310, the multiple cold plates 300, the at least one cold plate connecting pipe 330, and the cold plate outlet pipe 320 are interconnected to form a cooling pipe. This cooling pipe is formed by bending a flat tube multiple times. This integrally formed cooling pipe reduces the risk of heat exchange medium leakage.

[0165] In one possible implementation, at least one cold plate 300 is arranged between two adjacent rows of power tubes 700 (as shown in FIG. 13 ). Along a first direction X, the at least one cold plate 300 includes two sides. One side of the at least one cold plate 300 contacts each of the multiple power tubes 700 in one row of power tubes 700, while the other side of the at least one cold plate 300 contacts each of the multiple power tubes 700 in another row of power tubes 700. Both sides of the cold plate 300 along the first direction X are used to cool the power tubes 700. One cold plate 300 can cool two rows of power tubes 700, thereby improving the utilization of the cold plate 300.

[0166] In one embodiment, the distance between two adjacent cold plates 300 along the first direction X is greater than twice the thickness of the power tube 700. Two rows of power tubes 700 are provided between two adjacent cold plates 300 along the first direction X, and the two rows of power tubes 700 are in contact with different cold plates 300 respectively.

[0167] In one embodiment, the distance between two adjacent cold plates 300 along the first direction X is equal to the thickness of the power tubes 700. A row of power tubes 700 is disposed between two adjacent cold plates 300 along the first direction X. The row of power tubes 700 contacts the two cold plates 300 on both sides in the first direction X, thereby improving the cooling efficiency of the power tubes 700.

[0168] In one embodiment, along the third direction Z, the projections of the multiple cold plates 300 do not overlap with the projections of the air-to-liquid heat exchanger 400 (as shown in Figures 4 and 13). The cold plates 300 and the air-to-liquid heat exchanger 400 are staggered along the first direction X to prevent the power tubes 700 from contacting and damaging the air-to-liquid heat exchanger 400. Because the multiple cold plates 300 and the air-to-liquid heat exchanger 400 are staggered, a gap remains between the cold plates 300 and the base plate 160. In this case, a fixing member can be provided between the circuit board 600 and the base plate 160. The fixing member is used to clamp the power tubes 700 and the cold plates 300 to ensure the heat dissipation effect of the power tubes 700. The fixing member also serves to support the power tubes 700 and the cold plates 300.

[0169] In one possible implementation, along the third direction Z, the distance between the air-to-liquid heat exchanger 400 and the top plate 150 is greater than the distance between the cold plate 300 and the top plate 150 (see Figures 3, 4, and 11). The distance between at least one of the cold plate inlet 211 or the cold plate outlet 212 and the top plate 150 is smaller than the distance between the air-to-liquid heat exchanger 400 and the top plate 150, and the distance between at least one of the heat exchanger inlet 213 or the heat exchanger outlet 214 and the bottom plate 160 is smaller than the distance between the cold plate 300 and the bottom plate 160. The air-to-liquid heat exchanger 400 and the cold plate 300 are staggered along the third direction Z, and the cold plate inlet 211, cold plate outlet 212, heat exchanger inlet 213, and heat exchanger outlet 214 are relatively concentrated, thereby reducing the size of the connector 200.

[0170] In one embodiment, along the third direction Z, the distance between the cold plate inlet 211 or the cold plate outlet 212 and the heat exchanger inlet 213 or the heat exchanger outlet 214 is less than or equal to the distance between the air-to-liquid heat exchanger 400 and the cold plate 300. The size of the connector 200 along the third direction Z is small, which facilitates the miniaturization of the connector 200.

[0171] Referring to Figures 4, 13, and 14, in one possible implementation, the air-to-liquid heat exchanger 400 includes a plurality of interconnected heat exchange plates 410. The air-to-liquid heat exchanger 400 is positioned between the connector 200 and the circuit board 600 along a first direction X, and is spaced apart between the top plate 150 and the bottom plate 160 along a third direction Z. The plurality of heat exchange plates 410 are spaced apart along the first direction X. In the third direction Z, the projection of the air-to-liquid heat exchanger 400 does not overlap with the projection of the circuit board 600. The staggered arrangement of the air-to-liquid heat exchanger 400 and the circuit board 600 prevents the air-to-liquid heat exchanger 400 from interfering with the components mounted on the circuit board 600. This improves space utilization on the circuit board 600 and improves the performance of the power module 10.

[0172] Generally, the circuit board 600 is larger in size to accommodate more onboard components. Furthermore, because the inductor 500 is located on the side of the circuit board 600 near the rear plate 120 along the first direction X, the distance between the air-to-liquid heat exchanger 400 and the front plate 110 is relatively small, and no components are typically placed between the air-to-liquid heat exchanger 400 and the front plate 110. In this case, the multiple heat exchange plates 410 of the air-to-liquid heat exchanger 400 are arranged at intervals along the first direction X, and the air-to-liquid heat exchanger 400 is ventilated along the third direction Z. The air within the housing 100 passes through the gaps between adjacent heat exchange plates 410 along the third direction Z and exchanges heat with the heat exchange plates 410, thereby cooling the air within the housing 100. Arranging the multiple heat exchange plates 410 along the first direction X is more conducive to heat dissipation for the power module 10.

[0173] In one embodiment, the power module 10 further includes a fan 800 (as shown in FIG14 ). The fan 800 is used to drive air within the housing 100 toward the air-to-liquid heat exchanger 400 . The provision of the fan 800 increases the air flow rate within the housing 100 , further facilitating rapid heat dissipation from the heat-generating components within the housing 100 .

[0174] In one embodiment, as indicated by the arrows in Figure 14 , the fan 800 drives air in a first direction X through the gap between the circuit board 600 and the bottom plate 160, removing heat from the heat-generating components between the circuit board 600 and the bottom plate 160. The air then flows in a third direction Z through the gap between the circuit board 600 and the rear plate 120 and into the gap between the circuit board 600 and the top plate 150. The air flows in the first direction X through the gap between the circuit board 600 and the top plate 150, cooling the side of the circuit board 600 facing the top plate 150. The air then flows in the third direction Z toward the gap between the circuit board 600 and the front plate 110 and through the air-to-liquid heat exchanger 400. After heat exchange with the air-to-liquid heat exchanger 400, the air is converted to cooler air. The cooler air then enters the gap between the circuit board 600 and the bottom plate 160. This cycle continues, cooling the various heat-generating components within the housing 100. Air flowing below and above the circuit board 600 facilitates sufficient heat dissipation from the circuit board and other heat-generating components.

[0175] In one embodiment, the flow direction of the air in the shell 100 can also be: the air passes through the gap between the circuit board 600 and the bottom plate 160, the gap between the circuit board 600 and the front plate 110, and passes through the air-to-liquid heat exchanger 400, the gap between the circuit board 600 and the top plate 150, and the gap between the circuit board 600 and the rear plate 120 in sequence.

[0176] In one embodiment, the length of the heat exchange plate 410 along the first direction X is less than the length of the heat exchange plate 410 along the third direction Z. The heat exchange plate 410 extends along the second direction, and the two side surfaces of the heat exchange plate 410 that are opposite each other along the first direction X are the sides of the heat exchange plate 410 with the larger area. Arranging multiple heat exchange plates 410 along the first direction X results in a smaller air-to-liquid heat exchanger 400, which helps reduce the size of the power module 10. Furthermore, after entering the air-to-liquid heat exchanger 400, air comes into contact with the larger surface of the heat exchange plate 410. The larger heat exchange area between the air and the heat exchange plate 410 facilitates rapid cooling of the air by the air-to-liquid heat exchanger 400.

[0177] In one embodiment, the distance between two adjacent heat exchange plates 410 along the first direction X is smaller than the distance between two adjacent cold plates 300. The smaller distance between two adjacent heat exchange plates 410 facilitates adding heat exchange plates 410 to enhance the heat dissipation effect of the air-to-liquid heat exchanger 400 or reduce the volume of the air-to-liquid heat exchanger 400.

[0178] In one embodiment, the length of the heat exchange plate 410 is shorter than the length of the cold plate 300 along the first direction X. The heat exchange plate 410 is thinner along the first direction X, which is more conducive to improving the heat exchange efficiency between the heat exchange plate 410 and the air.

[0179] In one embodiment, the heat exchange plate 410 is longer than the cold plate 300 along the third direction Z. The longer length of the heat exchange plate 410 along the third direction Z increases the heat exchange area between the air and the heat exchange plate 410, which is more conducive to the air-to-liquid heat exchanger 400 to quickly cool the air.

[0180] In one embodiment, the power module 10 further includes at least one heat exchange plate connecting pipe 420 (as shown in FIG13 ). The at least one heat exchange plate connecting pipe 420 and the multiple heat exchange plates 410 are arranged alternately along the first direction X. The heat exchange plate connecting pipe 420 is used to connect two adjacent heat exchange plates 410. The heat exchange plate connecting pipe 420 can be used to achieve a series connection between the multiple heat exchange plates 410. In one embodiment, the at least one heat exchange plate connecting pipe 420 and the multiple heat exchange plates 410 are integrated into one structure. This not only improves the overall structural strength of the at least one heat exchange plate connecting pipe 420 and the multiple heat exchange plates 410, but also reduces the number of welds between the heat exchange plate connecting pipe 420 and the heat exchange plates 410, thereby reducing the risk of heat exchange medium leakage.

[0181] In one embodiment, the power module 10 further includes a heat exchanger inlet pipe 430 and a heat exchanger outlet pipe 440 (as shown in FIG13 ). One end of the heat exchanger inlet pipe 430 is connected to the heat exchanger inlet 213 of the connector 200 , and one end of the heat exchanger inlet pipe 430 is connected to the inlet of the first heat exchanger plate 410 among the multiple heat exchange plates 410 . One end of the heat exchanger outlet pipe 440 is connected to the heat exchanger outlet 214 of the connector 200 , and one end of the heat exchanger outlet pipe 440 is connected to the outlet of the last heat exchanger plate 410 among the multiple heat exchange plates 410 . The first heat exchanger plate 410 and the last heat exchanger plate 410 are respectively the first and last heat exchanger plates 410 along the first direction among the multiple heat exchanger plates 410 .

[0182] In one embodiment, the heat exchanger liquid inlet pipe 430, multiple heat exchange plates 410, at least one heat exchange plate connecting pipe 420 and the heat exchanger liquid outlet pipe 440 are an integrated structure, which not only improves the overall structural strength of the heat exchanger liquid inlet pipe 430, multiple heat exchange plates 410, at least one heat exchange plate connecting pipe 420 and the heat exchanger liquid outlet pipe 440, but also reduces the welding points between the heat exchange plate connecting pipe 420 and the multiple heat exchange plates 410, the welding points between the heat exchanger liquid inlet pipe 430 and the heat exchange plates 410, and the welding points between the heat exchanger liquid outlet pipe 440 and the heat exchange plates 410, thereby reducing the risk of heat exchange medium leakage.

[0183] In one embodiment, the heat exchanger inlet pipe 430, the multiple heat exchange plates 410, the at least one heat exchange plate connecting pipe 420, and the heat exchanger outlet pipe 440 are interconnected to form a heat exchange pipe. This heat exchange pipe is formed from a single flat tube through multiple bends. The integrated cooling pipe reduces the risk of heat exchange medium leakage.

[0184] In one embodiment, the heat exchange pipe and the cooling pipe are integrated. Both are welded to the connector 200. Aside from the weld points at the connector 200, neither pipe has any weld seams, reducing the risk of heat exchange medium leakage. Furthermore, the integrated design of the heat exchange pipe and the cooling pipe with the connector 200 makes the structure of the heat exchange pipe and the cooling pipe more compact, improving the reliability of the power module 10.

[0185] Please refer to Figures 15, 16, and 17. Figure 15 is a schematic diagram of a power module 10 provided in one embodiment of the present application. Figure 16 is a front view of a circuit board 600, a cold plate 300, and an air-to-liquid heat exchanger 400 provided in one embodiment of the present application. Figure 17 is a top view of a circuit board 600, a cold plate 300, and an air-to-liquid heat exchanger 400 provided in one embodiment of the present application.

[0186] In one possible implementation, the projection of the air-to-liquid heat exchanger 400 along the third direction Z coincides with the projection of the circuit board 600 along the third direction Z, and the projection of the air-to-liquid heat exchanger 400 along the third direction Z is staggered with the projection of the cold plate 300 along the third direction Z. The multiple heat exchange plates 410 are arranged at intervals along the third direction Z. The air-to-liquid heat exchanger 400 and the circuit board 600 overlap along the third direction Z, and onboard components are arranged on both sides of the air-to-liquid heat exchanger 400 along the first direction X. In this case, the multiple heat exchange plates 410 are arranged along the third direction Z, and the air-to-liquid heat exchanger 400 is ventilated along the first direction X, thereby ensuring heat dissipation for onboard components located in front of and behind the circuit board 600 along the first direction X.

[0187] Referring to Figure 15 , in one embodiment, the air flow direction within the housing 100 may be as follows: air flows along a first direction X through the gap between the circuit board 600 and the bottom plate 160 and passes through the air-to-liquid heat exchanger 400. This air then removes heat from the heat-generating components between the circuit board 600 and the bottom plate 160. After passing through the air-to-liquid heat exchanger 400, the air is converted to lower-temperature air. The air then flows along a third direction Z through the gap between the circuit board 600 and the rear plate 120 and into the gap between the circuit board 600 and the top plate 150. The air flows along the first direction X through the gap between the circuit board 600 and the top plate 150, cooling the side of the circuit board 600 facing the top plate 150. Thereafter, the air flows along the third direction Z through the gap between the circuit board 600 and the front plate 110 and along the first direction X through the gap between the circuit board 600 and the bottom plate 160. This cycle cools the various heat-generating components within the housing 100. Air flowing below and above the circuit board 600 facilitates sufficient heat dissipation from the circuit board and other heat-generating components. In one embodiment, the air flow direction may be opposite to the above-mentioned direction.

[0188] See Figure 18 . In one embodiment, the air flow direction within the housing 100 may also be as follows: the air flows along a first direction X from the front plate 110 toward the rear plate 120 and passes through the air-to-liquid heat exchanger 400 . The air changes direction at the rear plate 120 and flows along the first direction X from the rear plate 120 toward the front plate 110 . This cycle cools the components within the housing 100 . The air may first flow through the area between the circuit board 600 and the top plate 150 and bottom plate 160 , and then return air in the opposite direction through the gaps between the circuit board 600 and the first side plate 130 and second side plate 140 . In one embodiment, the air flow direction may also be opposite to the above-described flow direction.

[0189] It is worth mentioning that the above two different air flow methods can be used in combination.

[0190] In one embodiment, the air-to-liquid heat exchanger 400 further includes fins 450 (as shown in FIG16 ). Fins 450 are located between two adjacent heat exchange plates 410. Fins 450 have excellent thermal conductivity. The air within the housing 100 transfers heat through the fins 450 to the heat exchange medium within the heat exchange plates 410. The provision of fins 450 improves the heat exchange rate between the air-to-liquid heat exchanger 400 and the air within the housing 100.

[0191] In one embodiment, a plurality of microchannels are provided in both the cold plate 300 and the heat exchange plate 410 . The microchannels can improve the heat exchange efficiency of the cold plate 300 and the heat exchange plate 410 .

[0192] In one possible implementation, the power module 10 includes multiple inductors 500 and multiple fans 800 (as shown in Figures 4 and 18). The inductors 500 are spaced apart along the second direction Y, and the fans 800 are spaced apart along the second direction Y. Along the first direction X, the fans 800 are located between the inductors 500 and the circuit board 600. The fans 800 act as air turbulents, providing power to the air-to-liquid heat exchanger 400, thereby improving the heat dissipation effect of the air-to-liquid heat exchanger 400. Positioning the fans 800 between the inductors 500 and the circuit board 600 not only does not interfere with the installation of various components, but also achieves better heat dissipation.

[0193] Please refer to Figure 19. In one possible implementation, the power module 10 further includes a first baffle 910, a second baffle 920, and a third baffle 930. The first baffle 910 and the second baffle 920 are respectively located on both sides of the circuit board 600 along the second direction Y, and the third baffle 930 is located between the top plate 150 and the fan 800 along the third direction Z. The first baffle 910 is respectively connected to the circuit board 600 and the first side plate 110 on both sides along the second direction Y, and the second baffle 920 is respectively connected to the circuit board 600 and the second side plate 120 on both sides along the second direction Y. When the third baffle is respectively connected to the circuit board and the inductor on both sides along the first direction, the air-to-liquid heat exchanger 400 is located between the connector 200 and the circuit board 600 along the first direction X, or the projection of the air-to-liquid heat exchanger 400 along the third direction Z coincides with the projection of the circuit board 600 along the third direction Z.

[0194] The first baffle 910, the second baffle 920, and the third baffle 930 can guide air to circulate below and above the circuit board 600. For example, the first baffle 910, the second baffle 920, and the third baffle 930 can guide air to flow along the gap between the circuit board 600 and the bottom plate 160, the gap between the circuit board 600 and the rear plate 120, the gap between the circuit board 600 and the top plate 150, and the gap between the circuit board 600 and the front plate 110 in sequence (see FIG. 19, FIG. 4, and FIG. 14).

[0195] The third baffle 930 covers the gap between the inductor 500 and the circuit board 600. This prevents air flowing in the first direction X through the gap between the circuit board 600 and the bottom plate 160 from being blocked by the inductor 500 and then redirected along the third direction Z toward the top plate 150, bypassing the inductor 500. This would result in poor heat dissipation from the inductor 500. Once installed, the third baffle 930 blocks air from flowing through the gap between the inductor 500 and the circuit board 600 toward the top plate 150. In this case, air first passes through the inductor 500 along the first direction X and flows toward the rear plate 120 before flowing along the third direction Z toward the top plate 150, effectively improving heat dissipation from the inductor 500.

[0196] The first baffle 910 and the second baffle 920 are respectively used to cover the gaps between the circuit board 600 and the first side plate 130 and the second side plate 140, so as to prevent air flowing in the gap between the circuit board 600 and the top plate 150 along the first direction X from directly passing through the gaps between the circuit board 600 and the first side plate 130 and the second side plate 140 to flow to the gap between the circuit board 600 and the bottom plate 160. This prevents the air from approaching the front end of the front plate 110 without passing through the circuit board 600 along the first direction X, thereby resulting in poor heat dissipation of the front heat-generating components. In the present application, by providing the first baffle 910 and the second baffle 920, the air flowing above the circuit board 600 is forced to pass through the gap between the circuit board 600 and the front plate 110 to flow below the circuit board 600. The air flows within the entire interior of the housing 100, which is more conducive to achieving heat dissipation of various heat-generating components by the air-to-liquid heat exchanger 400.

[0197] The air circulation pattern, which circulates air both below and above the circuit board 600, is applicable to two different placements of the air-to-liquid heat exchanger 400. Specifically, when the air-to-liquid heat exchanger 400 is positioned between the connector 200 and the circuit board 600 along the first direction X, or when the projection of the air-to-liquid heat exchanger 400 coincides with the projection of the circuit board 600 along the third direction Z, heat dissipation can be achieved by circulating air both below and above the circuit board 600. Specifically, when the air-to-liquid heat exchanger 400 is positioned between the connector 200 and the circuit board 600 along the first direction X, the multiple heat exchange plates 410 are arranged at intervals along the first direction X. When the projection of the air-to-liquid heat exchanger 400 coincides with the projection of the circuit board 600 along the third direction Z, the multiple heat exchange plates 410 are arranged at intervals along the third direction Z.

[0198] 20 . In one possible implementation, when the third baffle 930 is connected to the circuit board 600 and the rear plate 120 on both sides along the first direction X, the projection of the air-to-liquid heat exchanger 400 along the third direction Z coincides with the projection of the circuit board 600 along the third direction Z.

[0199] When the projection of the air-to-liquid heat exchanger 400 along the third direction Z coincides with the projection of the circuit board 600 along the third direction Z, the air inside the housing 100 can also adopt a flow pattern in which air circulates through the circuit board 600 and both sides of the circuit board 600 (see Figures 20 and 18). That is, the arrangement of the first baffle 910, the second baffle 920, and the third baffle 930 can guide air to flow along the first direction X from the front plate 110 toward the rear plate 120 within the gap between the circuit board 600 and the bottom plate 160, and then flow along the first direction X from the rear plate 120 toward the front plate 110 within the gap between the circuit board 600 and the first side plate 130 and the gap between the circuit board 600 and the second side plate 140.

[0200] The third baffle 930 is used to cover the gap between the rear plate 120 and the circuit board 600. This prevents air flowing in the first direction X through the gap between the circuit board 600 and the bottom plate 160 from flowing directly toward the top plate 150 and entering the gap between the circuit board 600 and the top plate 150, thereby poorly cooling the inductor 500 and components beneath the circuit board 600. Once the third baffle 930 is in place, it restricts air flow beneath the circuit board 600. Air then flows along the first direction X through the inductor 500 and toward the rear plate 120 before flowing toward the first and second side plates 130 and 140. This improves the heat dissipation of the inductor 500 and ensures heat dissipation of other heat-generating components.

[0201] The first baffle 910 and the second baffle 920 are respectively used to cover the gaps between the circuit board 600 and the first side plate 130 and the second side plate 140. This prevents air flowing in the gap between the circuit board 600 and the bottom plate 160 along the first direction X from flowing directly through the gaps between the circuit board 600 and the first side plate 130 and the second side plate 140 to the gap between the circuit board 600 and the top plate 150. This would shorten the air circulation path and result in poor heat dissipation from the heat-generating components. By providing the first baffle 910 and the second baffle 920, air flows beneath the circuit board 600 and circulates through the circuit board 600 and both sides of the circuit board 600 along the second direction Y, facilitating heat dissipation from the various heat-generating components by the air-to-liquid heat exchanger 400. In this heat dissipation mode, since air primarily flows in the first direction X, setting the ventilation direction of the air-to-liquid heat exchanger 400 in the first direction X, i.e., arranging the multiple heat exchange plates 410 in intervals along the third direction Z, facilitates achieving better heat dissipation from the air-to-liquid heat exchanger 400.

[0202] Please refer to Figure 1. The present application also provides an energy storage system, which includes an energy storage cabinet 1, a battery pack 11 and the power module 10 as described above. The battery pack 11 is connected to the power module 10 and supplies power to the load 2 through the power module 10. The energy storage cabinet 1 also includes a cabinet body 12, a cabinet door 13 and a cooling assembly 14. The cabinet door 13 is used to close the cabinet body 12. The power module 10 and the battery pack 11 are stacked and arranged inside the cabinet body 12. The front plate 110 of the shell 100 of the power module 10 faces the cabinet door 13. The cooling assembly 14 is connected to the cold plate inlet 211, the heat exchanger inlet 213, the cold plate outlet 212 and the heat exchanger outlet 214 of the connector 200 through two liquid cooling pipes 15.

[0203] The power module and energy storage system provided in the embodiments of the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and embodiments of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, according to the ideas of the present application, there may be changes in the specific embodiments and application scope. In summary, the content of this specification should not be understood as limiting the present application.

Claims

1. A power module, characterized in that: The power module includes a shell and a connector, an inductor, a cold plate and an air-liquid heat exchanger. The connector, the air-liquid heat exchanger, the cold plate and the inductor are sequentially arranged inside the shell along a first direction. The shell includes a front plate and a rear plate. The front plate and the rear plate are arranged relative to each other along the first direction. The connector is arranged between the air-liquid heat exchanger and the front plate along the first direction. The connector includes a cold plate inlet, a heat exchanger inlet, a cold plate outlet and a heat exchanger outlet, wherein: Along a second direction, the cold plate inlet is arranged adjacent to the cold plate outlet, the heat exchanger inlet is arranged adjacent to the heat exchanger outlet, and the second direction is perpendicular to the first direction; Along a third direction, one of the cold plate inlet and the cold plate outlet is arranged adjacent to the heat exchanger inlet, and the other of the cold plate inlet and the cold plate outlet is arranged adjacent to the heat exchanger outlet, and the third direction is perpendicular to the second direction and the first direction.

2. The power module according to claim 1, characterized in that: The housing includes a first side plate and a second side plate, the first side plate and the second side plate are arranged opposite to each other along the second direction, the connector, the air-to-liquid heat exchanger, the cold plate, and the inductor are arranged between the first side plate and the second side plate, wherein: Along the second direction, the distance between the connector and the first side panel is smaller than the distance between the connector and the second side panel, the distance between the connector and the first side panel is smaller than the distance between the air-liquid heat exchanger and the first side panel, the distance between the connector and the second side panel is larger than the distance between the air-liquid heat exchanger and the second side panel, and at least one of the distance between the cold plate inlet and the cold plate outlet or the distance between the heat exchanger inlet and the heat exchanger outlet is smaller than the distance between the air-liquid heat exchanger and the first side panel.

3. The power module according to claim 1, characterized in that: The connector includes a first sub-cavity and a second sub-cavity, wherein the first sub-cavity is adjacent to the second sub-cavity and arranged at an interval along the second direction, the first sub-cavity is used to connect the cold plate inlet and the heat exchanger inlet, and the second sub-cavity is used to connect the cold plate outlet and the heat exchanger outlet.

4. The power module according to claim 1, characterized in that: The connector includes a first sub-cavity, a second sub-cavity and a third sub-cavity. The first sub-cavity and the third sub-cavity are adjacent to each other and arranged at intervals along the third direction. The first sub-cavity or the third sub-cavity is adjacent to the second sub-cavity and arranged at intervals along the second direction. The first sub-cavity is used to connect the heat exchanger inlet, the second sub-cavity is used to connect the heat exchanger outlet and the cold plate inlet, and the third sub-cavity is used to connect the cold plate outlet.

5. The power module according to claim 3, characterized in that: The connector further includes a second cavity and a drainage hole. The second cavity is adjacent to the first sub-cavity or the second sub-cavity and arranged at intervals along the first direction. The drainage hole is connected to the second cavity.

6. The power module according to claim 5, characterized in that: The connector includes a first cover plate, a connection seat, a second cover plate and a partition plate. The first cover plate and the second cover plate are respectively arranged on both sides of the connection seat along the first direction, and are respectively surrounded by both sides of the connection seat to form a first cavity and a second cavity. The partition plate is located in the first cavity and is used to separate the first cavity into the first sub-cavity and the second sub-cavity. The connection seat includes the cold plate inlet, the cold plate outlet, the heat exchanger inlet and the heat exchanger outlet. The cold plate inlet, the cold plate outlet, the heat exchanger inlet and the heat exchanger outlet penetrate the connection seat along the first direction; wherein: The first cover plate comprises a liquid inlet hole and a liquid outlet hole, the liquid inlet hole and the liquid outlet hole respectively penetrate the first cover plate along the first direction, the liquid inlet hole is used to connect to at least one of the cold plate inlet or the heat exchanger inlet, and the liquid outlet hole is used to connect to at least one of the cold plate outlet or the heat exchanger outlet; The second cover plate includes a first opening, a second opening, a third opening and a fourth opening, and the first opening, the second opening, the third opening and the fourth opening respectively penetrate the second cover plate along the first direction, and along the first direction, the first opening, the second opening, the third opening and the fourth opening are respectively arranged opposite to the cold plate inlet, the cold plate outlet, the heat exchanger inlet and the heat exchanger outlet.

7. The power module according to claim 6, characterized in that: The power module includes a liquid inlet connector and a liquid outlet connector, the liquid inlet connector and the liquid outlet connector are fixed to the first cover plate and are connected to the liquid inlet hole and the liquid outlet hole respectively, the front plate includes a through hole, and the through hole passes through the front plate along the first direction, wherein: Along the first direction, the projection of the through hole covers the projection of the liquid inlet joint and the projection of the liquid outlet joint, and the projection of the first cover plate covers the projection of the through hole; Along the third direction, the length of the liquid inlet joint and the liquid outlet joint is greater than the distance between the first cover plate and the front plate.

8. The power module according to claim 1, characterized in that: The power module also includes a circuit board and a plurality of power tubes. The shell includes a top plate and a bottom plate. The top plate and the bottom plate are arranged relative to each other along the third direction. The circuit board is arranged between the top plate and the bottom plate at intervals. The plurality of power tubes and the cold plate are arranged on a side of the circuit board facing the bottom plate. The cold plate is in contact with at least one of the power tubes along the first direction.

9. The power module according to claim 8, characterized in that: The power module includes a plurality of connected cold plates, the plurality of cold plates are arranged at intervals along the first direction, the plurality of power tubes include a plurality of columns of power tubes arranged at intervals along the first direction, each column of power tubes includes a plurality of power tubes arranged in sequence along the second direction, and the plurality of power tubes in each column of power tubes are in contact with the same cold plate.

10. The power module according to claim 9, characterized in that: At least one of the cold plates is arranged between two adjacent columns of the power tubes. The at least one cold plate includes two sides along the first direction. One side of the at least one cold plate is in contact with the multiple power tubes in one column of the power tubes, and the other side of the at least one cold plate is in contact with the multiple power tubes in another column of the power tubes.

11. The power module according to claim 8, characterized in that: Along the third direction, the distance between the air-to-liquid heat exchanger and the top plate is greater than the distance between the cold plate and the top plate, the distance between at least one of the cold plate inlet or the cold plate outlet and the top plate is smaller than the distance between the air-to-liquid heat exchanger and the top plate, and the distance between at least one of the heat exchanger inlet or the heat exchanger outlet and the bottom plate is smaller than the distance between the cold plate and the bottom plate.

12. The power module according to claim 8, characterized in that: The air-liquid heat exchanger includes a plurality of interconnected heat exchange plates. When the air-liquid heat exchanger is located between the connector and the circuit board along the first direction, and the air-liquid heat exchanger is arranged between the top plate and the bottom plate at intervals along the third direction, the plurality of heat exchange plates are arranged at intervals along the first direction; when the projection of the air-liquid heat exchanger along the third direction coincides with the projection of the circuit board along the third direction, and the projection of the air-liquid heat exchanger along the third direction is staggered with the projection of the cold plate along the third direction, the plurality of heat exchange plates are arranged at intervals along the third direction.

13. The power module according to claim 8, characterized in that: The power module includes a plurality of the inductors and a plurality of fans, wherein the plurality of inductors are arranged at intervals along the second direction, and the plurality of fans are arranged at intervals along the second direction; along the first direction, the fans are located between the inductors and the circuit board.

14. The power module according to claim 13, characterized in that: The power module also includes a first baffle, a second baffle and a third baffle, the first baffle and the second baffle are respectively located on both sides of the circuit board along the second direction, and the third baffle is located between the top plate and the fan along the third direction; the first baffle is respectively connected to the circuit board and the first side plate on both sides along the second direction, and the second baffle is respectively connected to the circuit board and the second side plate on both sides along the second direction; when the third baffle is respectively connected to the circuit board and the inductor on both sides along the first direction, the air-liquid heat exchanger is located between the connector and the circuit board along the first direction or the projection of the air-liquid heat exchanger along the third direction coincides with the projection of the circuit board along the third direction; when the third baffle is respectively connected to the circuit board and the back plate on both sides along the first direction, the projection of the air-liquid heat exchanger along the third direction coincides with the projection of the circuit board along the third direction.

15. An energy storage system, characterized in that: The energy storage system comprises an energy storage cabinet, a battery pack and a power module according to any one of claims 1 to 14, wherein the battery pack is connected to the power module and supplies power to a load through the power module, the energy storage cabinet comprises a cabinet body, a cabinet door and a cooling assembly, the cabinet door is used to close the cabinet body, the power module and the battery pack are stacked and placed inside the cabinet body, and the cooling assembly is connected to the cold plate inlet, the heat exchanger inlet, the cold plate outlet and the heat exchanger outlet of the connector through two liquid cooling pipes.

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