Laminated substrate, cable and electronic device

Abstract

A laminated substrate (101) comprises a laminate (4) which is formed by laminating an insulating layer and a conducting layer. The laminate (4) has a curved part (1) and curved part continuation parts (2, 3) which are continuous with the curved part (1). The laminate (4) also has, on a section of the curved part (1), a protruding part (5) which protrudes towards the inside of the curve of the curved part (1).

Description

Laminated substrates, cables and electronic devices

[0001] The present invention relates to a laminated substrate, a cable having the laminated substrate, and an electronic device having the laminated substrate.

[0002] A flexible substrate that is bent at predetermined positions is disclosed, for example, in Patent Document 1. The flexible substrate described in Patent Document 1 includes: a first sheet portion having a first main surface; a second sheet portion formed at a different position in a normal direction of the first main surface with respect to the first main surface, the second sheet portion having a second main surface; a plurality of folded sheet portions each connecting ends of the first and second sheet portions and having a main surface non-parallel to the first and second main surfaces, the plurality of folded sheet portions being positioned at different positions in a direction perpendicular to the normal direction; a plurality of signal lines each arranged to pass through the first sheet portion and the second sheet portion, the plurality of signal lines being arranged to pass through different ones of the plurality of folded sheet portions; and ground conductors provided on the first sheet portion, each of the folded sheet portions, and the second sheet portion, the ground conductors being parallel to the plurality of signal lines.

[0003] International Publication No. 2014 / 109135

[0004] The flexible substrate described in Patent Document 1 is a flexible substrate in which a folded sheet portion is provided at the bending portion, and therefore has the effect of improving isolation between different signals.

[0005] However, because the bending line of the bent portion and the bending line of the folded sheet portion are parallel, the bent portion is easily mechanically deformed, and therefore, depending on the direction and form of use, there is a risk of fatigue failure of the wiring at the bent portion.

[0006] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a flexible laminated substrate having improved mechanical and / or electrical properties at bent portions, a cable including this laminated substrate, and an electronic device including this laminated substrate.

[0007] (1) A flexible laminated substrate as an example of the present disclosure is characterized in that it comprises a laminate formed by laminating an insulating layer and a conductor layer, the laminate having a bent portion and a bent portion contiguous to the bent portion, and the laminate having a protruding portion in a part of the bent portion that protrudes toward the inside of the bend of the bent portion.

[0008] (2) A cable as an example of the present disclosure is characterized in that it includes a component mounted on a continuous portion of the bent portion of the laminate of the flexible laminated substrate, or has a flat portion on the surface of the bent portion and includes a component mounted on the flat portion, and this component is a connector.

[0009] (3) An electronic device as an example of the present disclosure includes a housing, and the laminated substrate is disposed within the housing.

[0010] According to the present invention, it is possible to obtain a flexible laminated substrate having improved mechanical and / or electrical properties at a bent portion, a cable including this laminated substrate, and an electronic device including this laminated substrate.

[0011] FIG. 1 is a perspective view of a main portion of a laminated substrate according to a first embodiment of the present invention. FIG. 2 is a diagram showing a cross section of the center of a bent portion 1 of a laminate 4 of the laminated substrate. The upper part of FIG. 3 is a cross-sectional view of the bent portion 1 of the laminate 4 at the center along the width direction. The lower part of FIG. 3 is a cross-sectional view of the bent portion 1 of the laminate 4 at the center along the length direction. FIG. 4 is a perspective view showing an example of the size relationship between the bent portion 1 of the laminate 4 and the protruding portion 5. FIG. 5 is a view showing several example shapes of the bent portion of the protruding portion 5. FIG. 6 is a diagram showing an example of a structure in which components are mounted using the protruding portion. FIG. 7 is a view of a laminated substrate 102 viewed from a cutting position of the flat portion (the bent portion continuous portion) toward the protruding portion 5. FIG. 8 is a view of the laminated substrate 102 cut at the center of the protruding portion 5, looking at the cutting position and the flat portion (the bent portion continuous portion) behind it. FIG. 9 is a cross-sectional view showing the laminated structure of an insulating layer and a conductor layer of the laminated substrate 102. FIG. 10 is a view of the laminated substrate 103 viewed from the cutting position of the flat portion (bend portion continuous portion) toward the protruding portion 5. FIG. 11 is a view of the laminated substrate 103 cut at the center of the protruding portion 5, viewing the cut position and the flat portion (bend portion continuous portion) behind it. FIG. 12 is a view of the laminated substrate 104 viewed from the cutting position of the flat portion (bend portion continuous portion) toward the protruding portion 5. FIG. 13 is a view of the laminated substrate 104 cut at the center of the protruding portion 5, viewing the cut position and the flat portion (bend portion continuous portion) behind it. FIG. 14 is a cross-sectional view of the laminated substrate 105 according to the fifth embodiment, taken along the longitudinal direction of the bent portion 1, passing through the protruding portion 5 of the laminate 4. FIG. 15 is a perspective view of the laminated substrate 106 according to this embodiment. Fig. 16 is a view of the laminated substrate 106 cut at the center of the protruding portions 5A and 5B, showing the cut position and the flat portion (the portion continuing from the bent portion) behind the cut position. Fig. 17 is a perspective view of the component-mounted laminated substrate 107A according to this embodiment, seen from two directions. Fig. 18 is a view showing a cut surface of the center of the bent portion 1 of the laminate 4 of the laminated substrate 107.

[0012] Hereinafter, several specific examples will be given with reference to the drawings to illustrate multiple embodiments for carrying out the present invention. The same reference numerals are used for the same parts in each drawing. For ease of explanation and understanding of the main points, the embodiments are shown divided into multiple embodiments for convenience of explanation, but partial substitution or combination of the configurations shown in different embodiments is possible. From the second embodiment onwards, a description of matters common to the first embodiment will be omitted, and only the differences will be described. In particular, similar effects resulting from similar configurations will not be mentioned in each embodiment.

[0013] 1 is a perspective view of a main part of a laminated substrate according to a first embodiment of the present invention, in which (a) in FIG. 1 is a perspective view of a laminated substrate 101, and (b) in FIG. 1 is a perspective view of a main part of a component-equipped laminated substrate configured by mounting a component 11 on the laminated substrate 101.

[0014] The laminated substrate 101 includes a laminated body 4 formed by laminating layers of insulating material and conductive films. A detailed example of the structure of this laminated body 4 will be shown later.

[0015] The laminate 4 has a bent portion 1 and bent portion continuing portions 2 and 3 that are continuous with the bent portion 1. Here, the reference numeral "bent portion continuing portion" refers to the portion that extends from and continues to the bent portion 1. In the example shown in Fig. 1, the bent portion continuing portions 2 and 3 are both flat-shaped portions.

[0016] The laminate 4 has a protruding portion 5 at a part of the bent portion 1, protruding toward the inside of the bend of the bent portion 1. This protruding portion 5 can also be called a rib or a bead.

[0017] 1, conductor layers 21 and 22 are provided as inner layers of the laminate 4. Terminal electrodes 31, 32, 33, 34, 35, and 36 are formed and exposed at component mounting positions near the end of the flat bent portion continuous portion 3.

[0018] 1, the front side of the laminated substrate 101 is cut away to show the main portion of the laminated substrate 101. The portion of the laminated substrate 101 where the conductor layers 21 and 22 are exposed, as shown in (a) of FIG. 1, is the cut portion of the laminated substrate 101. A plurality of conductor layers are formed inside (inner layers) of the laminate 4, and the conductor layers 21 and 22 are electrically connected to the terminal electrodes 31 and 32, respectively, via these conductor layers.

[0019] 1(b), component 11 has six terminals on its bottom surface, including terminals 61, 62, and 63. Terminals 61, 62, and 63 are soldered to terminal electrodes 31, 32, and 33, respectively, of laminated substrate 101. The remaining three terminals are soldered to terminal electrodes 34, 35, and 36, respectively. Not all of terminal electrodes 31 to 36 are necessarily electrically connected to the conductor layers formed on laminate 4, and in some cases, they may be used only for mounting component 11 on laminated substrate 101.

[0020] 2 is a diagram showing a cross section of the center of a bent portion 1 of a laminate 4 of a laminated substrate. A protruding portion 5 is a portion of the bent portion 1 that protrudes toward the inside of the bend of the bent portion 1, and a cavity 6 is formed on the surface opposite to the protruding direction of the protruding portion 5. Conductor layers 21 and 22 are provided inside (inner layers) of the laminate 4. As shown (in this example), the conductor layers 21 and 22 are conductor layers for signal transmission that extend in a direction that passes beyond the bent portion 1. Also, in this example, the conductor layers 21 and 22 for signal transmission are arranged in positions that avoid the protruding portion 5. In other words, the conductor layers 21 and 22 for signal transmission are formed so that the signal transmission path is a non-protruding portion of the laminate 4.

[0021] The upper part of Fig. 3 is a cross-sectional view of the central part along the width direction of the bent portion 1 of the laminate 4. The lower part of Fig. 3 is a cross-sectional view of the central part along the length direction of the bent portion 1 of the laminate 4.

[0022] The width W shown at the top of Figure 3 is the maximum dimension of the width of the cavity 6 on the opposite side of the protruding direction of the protruding portion 5 (Z direction in Figure 3), along the extension direction of the valley of the laminate 4 formed by folding the laminate 4 (X direction in Figure 3).

[0023] The height H shown in the upper part of FIG. 3 is the height of the protrusion, which is the dimension of the highest protrusion among the protrusions.

[0024] The thickness T shown in the upper part of FIG. 3 is the thickness dimension of the laminate 4 at the portion where the protrusion 5 of the laminate 4 is formed.

[0025] The length L shown at the bottom of Fig. 3 is the protrusion length, which is the maximum length among the lengths in the direction perpendicular to the direction of the protrusion height H and the direction of the protrusion width W. The bent portion 1 of the laminate 4 shown in Fig. 3 is the portion between the boundary between the curved surface and the flat surface on the inside of the bend of the bent portion 1 of the laminate 4.

[0026] In the example shown in FIG. 3, the width W of the protrusion, the height H of the protrusion, and the length L of the protrusion are all equal to or greater than the thickness T of the laminate 4.

[0027] Note that any one of the protrusion width W, protrusion height H, and protrusion length L may be equal to or greater than the thickness T of the laminate 4. This provides the laminate substrate 101 or the component-equipped laminate substrate 101A having improved mechanical properties such as the rigidity of the bending portion 1.

[0028] Fig. 4 is a perspective view showing an example of the size relationship between the bent portion 1 and the protruding portion 5 of the laminate 4. In the example shown in Fig. 4, a portion of the protruding portion 5 protrudes from the boundaries B2, B3 between the bent portion 1 and the bent portion continuing portions 2, 3 toward the bent portion continuing portions 2, 3, respectively. The two circles in Fig. 4 indicate the start points of the protrusion. This can also be said to mean that the length L of the protruding portion 5 shown in Fig. 4 is longer than the length of the bent portion 1 (the length between the bent portion continuing portion 2 and the bent portion continuing portion 3). This structure enhances the effect of improving the rigidity of the bent portion.

[0029] According to this embodiment, it is possible to obtain a laminated substrate 101 having improved mechanical properties such as rigidity at the bending portion 1. Furthermore, by mounting a component 11 on the laminated substrate 101, it is possible to obtain a component-equipped laminated substrate 101A having improved mechanical properties such as rigidity at the bending portion 1.

[0030] 5 is a diagram showing some example shapes of the bent portion of the protruding portion 5. Here, the cross section is shown in a plane passing through the center of the protruding portion 5 (a plane along the extension direction (X direction) of the valley of the laminate 4 formed by bending the laminate 4).

[0031] 5A, the protrusion 5 has a flat portion FP at its apex. In this way, the apex of the protrusion 5 does not have to be a curved surface.

[0032] In the example shown in (b) of Figure 5, the protrusion 5 has an asymmetric cross section. In this way, the shape of the protrusion 5 may be asymmetric in a plane perpendicular to the longitudinal direction of the protrusion 5. This allows the rigidity characteristics of the bending portion to be intentionally made asymmetric. Furthermore, when arranging the conductor layers (not shown in Figure 5) to be arranged in the laminate 4 according to their electrical characteristics, it becomes easier to arrange them asymmetrically.

[0033] 5(c), the protrusion 5 has a larger width W relative to its height H than the examples shown in Figures 2, 3, etc. With this structure, the height of the protrusion 5 is low, so that when the bending angle at the bending portion 1 of the bending portion continuation portions 2, 3 (see Figure 1) is small, the protrusion becomes small in volume, thereby enabling space saving.

[0034] 2, 3, etc., the example shown in (d) of Fig. 5 has a protrusion 5 in which the width W and height H are approximately equal, or the height H is greater than the width W. This structure makes it easy to increase the rigidity of the bending portion. Furthermore, as will be exemplified later, it is easy to increase the shielding and isolation between conductor layers for signal transmission that are arranged in positions that avoid the protrusion.

[0035] As illustrated above, the shape, width, and height of the protrusion 5 can be determined as appropriate.

[0036] 6 is a diagram illustrating a structure in which components are mounted using a protrusion 5. Here, the cross section is shown taken along a plane passing through the center of the protrusion 5 (a plane along the extension direction (X direction) of the valley of the laminate 4 formed by bending the laminate 4).

[0037] In the example shown in FIG. 6A, the protrusion 5 has a flat portion FP on its outer surface, and a component 12 is mounted on this flat portion FP. This structure allows the component 12 to be mounted without using the surface of the bent portion continuation portion, such as the flat portion, of the laminate 4. It also suppresses electrical influences on the conductor layer disposed in the bent portion continuation portion, such as the flat portion, of the laminate 4. Furthermore, as will be exemplified later, connection or coupling with a transmission line passing through the protrusion 5 can be easily performed.

[0038] In the example shown in Fig. 6(b), the protrusion 5 has a flat portion FP on its inner surface, and the component 13 is mounted on this flat portion FP. This structure provides the same effects as the example shown in Fig. 6(a). Furthermore, because the component 13 is mounted in the hollow portion 6, the overall space can be used efficiently.

[0039] In the example shown in Figure 6(c), the protrusion 5 has a flat portion FP on its outer surface, and components 14 and 15 are mounted on this flat portion FP. This structure provides the same effects as the example shown in Figure 6(a). Furthermore, because the components 14 and 15 are mounted within the height range of the protrusion 5, the overall space can be used efficiently.

[0040] The component 11 included in the component-equipped laminated substrate 101A shown in the first embodiment is, for example, a connector. That is, the connector of this component-equipped laminated substrate 101A is connected to a connector on another circuit board. This component-equipped laminated substrate 101A can be used as a cable.

[0041] 1, one end of the laminate 4 is used as a mounting location for the component 11, and the other end is not shown, but this other end may also be used as a mounting location for the component. Also, the laminate 4 may be directly connected to another circuit board.

[0042] Second Embodiment In a second embodiment, a laminated substrate 102 in which a signal transmission conductor layer is provided in a laminate 4 will be exemplified.

[0043] Fig. 7 is a view of the laminated substrate 102 viewed from the cutting position of the flat portion (continuation of the bent portion) toward the protruding portion 5. Fig. 8 is a view of the laminated substrate 102 cut at the center of the protruding portion 5, looking at the cutting position and the flat portion (continuation of the bent portion) behind the cutting position.

[0044] The laminated substrate 102 according to the second embodiment includes a conductor layer for signal transmission that extends in a direction that passes beyond the bent portion in the laminate 4. As shown in Figures 7 and 8, conductor layers 21, 21G1, and 21G2 and conductor layers 22, 22G1, and 22G2 are formed in the laminate 4. All of these conductor layers extend in the direction of the bent portion continuous portion (flat portion) 2, the bent portion 1, and the bent portion continuous portion (flat portion) 3 shown in Figure 1 in the first embodiment.

[0045] The conductor layer 21 is a signal line layer, the conductor layer 21G1 is a lower ground wiring layer, and the conductor layer 21G2 is an upper ground wiring layer. These conductor layers 21, 21G1, and 21G2 form a first stripline.

[0046] The conductor layer 22 is a signal line layer, the conductor layer 22G1 is a lower ground wiring layer, and the conductor layer 22G2 is an upper ground wiring layer. These conductor layers 22, 22G1, and 22G2 form a second stripline.

[0047] As shown in FIGS. 7 and 8, an electrically insulating protective film 7 is formed on the top and bottom surfaces of the laminate 4 .

[0048] 8 shows the patterns between the conductor layers 21 and 22 constituting the signal line layers and the terminal electrodes 31 and 32. Of the first strip line constituted by the conductor layers 21, 21G1, and 21G2, the conductor layer 21 is connected to the terminal electrode 31. Similarly, of the second strip line constituted by the conductor layers 22, 22G1, and 22G2, the conductor layer 22 is connected to the terminal electrode 32. A cavity 6 is formed on the opposite side of the protrusion 5.

[0049] Fig. 9 is a cross-sectional view showing the laminated structure of the insulating layers and conductor layers of the laminated substrate 102. The upper part of Fig. 9 shows the insulating layers and conductor layers of each layer before the laminate is formed, and the lower part of Fig. 9 shows the state after the laminate 4 is formed.

[0050] The manufacturing process of the laminated substrate 102 is as follows.

[0051] (1) In the orientation shown in the upper part of Figure 9, conductor layers 21G1 and 22G1 are formed as ground conductor layers on the lower surface of insulator layer 10. Conductor layers 21 and 22 for signal transmission are formed on the upper surface of insulator layer 42. Conductor layers 21G2 and 22G2 are formed as ground conductor layers on the upper surface of insulator layer 43. The material of insulator layers 41, 42, and 43 is, for example, LCP (liquid crystal polymer). The conductor layers 21G1, 21, 21G2, 22G1, 22, and 22G2 are, for example, Cu film or Al film. These conductor layers are formed by attaching them to the entire surface of the insulator layer and patterning them.

[0052] (2) The insulating layer on which the conductor layer is patterned is laminated and heated and pressed to form the laminate 4 shown in the lower part of FIG.

[0053] 7, 8, etc., a protective film 7 is then applied to the top and bottom surfaces of the laminate 4. The material of this protective film 7 is, for example, PI (polyimide).

[0054] (4) The laminate 4 coated with the protective film 7 is heated while bending predetermined locations with a jig to form the bent portion 1. Furthermore, the protrusion 5 is formed simultaneously with bending the laminate 4 with the jig. Note that the protrusion 5 may also be formed by punching from the outside of the bent portion after bending the predetermined locations of the laminate 4 with the jig. However, forming the protrusion 5 simultaneously with bending the laminate 4 can suppress abnormal deformation and deterioration of the insulating layer and the conductor layer.

[0055] According to this embodiment, the high mechanical rigidity of the bent portion 1 stabilizes the distance between the bent portion continuous portion 2 and the bent portion continuous portion 3, which are continuous with the bent portion 1. This suppresses the extension and contraction of the conductor layer for signal transmission and its vibration (vibration such as springback), thereby suppressing fluctuations in the electrical resistance of the conductor layer. Furthermore, fluctuations in electrical resistance due to heat generated by friction between the insulator layer and the conductor layer are suppressed. These factors suppress electrical noise in the electrical signal to be transmitted. Furthermore, the distance between the conductor layer formed in the bent portion continuous portion 2 and the conductor layer formed in the bent portion continuous portion 3 is stabilized, thereby suppressing capacitance changes between the conductor layer formed in the bent portion continuous portion 2 and the conductor layer formed in the bent portion continuous portion 3. This suppresses electrical noise in the electrical signal to be transmitted. Furthermore, fluctuations in the distance between the conductor layer for signal transmission and the ground conductor layer at the bent portion are suppressed. This suppresses electrical noise in the electrical signal to be transmitted.

[0056] If the conductor layer 21G1 and the conductor layer 22G1 are formed from a continuous conductor layer, the isolation between the first strip line and the second strip line can be improved.

[0057] Furthermore, since there is a cavity 6 between both sides (left and right in Figure 8, etc.) of the protrusion 5, the low dielectric constant and low dielectric loss can improve the isolation between the first strip line and the second strip line.

[0058] Third Embodiment In a third embodiment, a laminated substrate having a conductor layer on a protruding portion for improving rigidity will be exemplified.

[0059] Fig. 10 is a view of the laminated substrate 103 viewed from the cutting position of the flat portion (continuation of the bent portion) toward the protruding portion 5. Fig. 11 is a view of the laminated substrate 103 cut at the center of the protruding portion 5, looking at the cutting position and the flat portion (continuation of the bent portion) behind it.

[0060] The conductor layer 21 is a signal line layer, the conductor layer 21G1 is a lower ground wiring layer, and the conductor layer 21G2 is an upper ground wiring layer. The conductor layers 21, 21G1, and 21G2 form a first stripline.

[0061] The conductor layer 22 is a signal line layer, the conductor layer 22G1 is a lower ground wiring layer, and the conductor layer 22G2 is an upper ground wiring layer. These conductor layers 22, 22G1, and 22G2 form a second stripline.

[0062] The laminated substrate 103 according to the third embodiment includes a conductor layer inside (inner layer) the protruding portion 5 of the laminate 4. In this embodiment, a conductor layer 23 is arranged not only inside (inner layer) the protruding portion 5 but also between the two striplines. This conductor layer 23 may be used as a conductor for signal transmission separate from the first and second striplines.

[0063] According to this embodiment, since a conductor layer is provided inside (inner layer) of the protrusion, the rigidity of the protrusion 5 is increased, and the mechanical properties such as rigidity of the bending portion 1 including this protrusion 5 can be further improved.

[0064] Fourth Embodiment In a fourth embodiment, a laminated substrate 104 having a signal transmission conductor layer on the protruding portion 5 will be exemplified.

[0065] Fig. 12 is a view of the laminated substrate 104 viewed from the cutting position of the flat portion (continuation of the bent portion) toward the protruding portion 5. Fig. 13 is a view of the laminated substrate 104 cut at the center of the protruding portion 5, looking at the cutting position and the flat portion (continuation of the bent portion) behind it.

[0066] The conductor layer 21 is a signal line layer, the conductor layer 21G1 is a lower ground wiring layer, and the conductor layer 21G2 is an upper ground wiring layer. The conductor layers 21, 21G1, and 21G2 form a first stripline.

[0067] The conductor layer 22 is a signal line layer, the conductor layer 22G1 is a lower ground wiring layer, and the conductor layer 22G2 is an upper ground wiring layer. These conductor layers 22, 22G1, and 22G2 form a second stripline.

[0068] The conductor layer 23 is a signal line layer, the conductor layer 23G1 is a lower ground wiring layer, and the conductor layer 23G2 is an upper ground wiring layer. These conductor layers 23, 23G1, and 23G2 form a third stripline. This third stripline passes through the protruding portion 5.

[0069] According to this embodiment, the signal transmission conductor layers are not provided so as to avoid the positions of the protrusions 5, so that the number of signal transmission lines per width in the direction perpendicular to the signal transmission direction can be increased.

[0070] Furthermore, since the overall line length of the signal transmission line passing through the protruding portion 5 can be shortened, loss of the transmitted signal can be reduced.

[0071] Fifth Embodiment In a fifth embodiment, a laminated substrate including a conductor layer having an interlayer connection conductor will be exemplified.

[0072] FIG. 14 is a cross-sectional view taken along the longitudinal direction of the bent portion 1 and passing through the protruding portion 5 of the laminate 4 of the laminated substrate 105 according to the fifth embodiment.

[0073] The conductor layers 23A and 23B are connected to each other by a plurality of interlayer connection conductors 8. The conductor layer 23G1 is a lower ground wiring layer, and the conductor layer 23G2 is an upper ground wiring layer. The conductor layers 23A and 23B, the interlayer connection conductors 8, the conductor layer 23G1, and the conductor layer 23G2 form a stripline that passes through the inner layer of the protrusion 5.

[0074] In this way, by configuring the conductor layer for signal transmission with a plurality of conductor layers and interlayer connection conductors that connect these layers, it is possible to increase the conductivity and reduce the loss of the transmitted signal.

[0075] Furthermore, in the conventional structure without the protrusion 5, it was difficult to arrange the interlayer connection conductor at the curved bend, but according to this embodiment, a flat area is created in the protrusion 5, so that the interlayer connection conductor can be easily arranged in that flat area.

[0076] Incidentally, even in the case of a strip line that does not pass through the protruding portion 5, the conductor layer for signal transmission may be configured with a plurality of conductor layers and interlayer connection conductors that connect these layers.

[0077] Sixth Embodiment In a sixth embodiment, a laminated substrate in which a plurality of protrusions are provided at a bent portion will be exemplified.

[0078] Fig. 15 is a perspective view of the laminated substrate 106 according to this embodiment. Fig. 16 is a view of the laminated substrate 106 cut at the center of the protruding portions 5A and 5B, looking at the cut position and the flat portion (the portion continuing from the bent portion) behind the cut position.

[0079] The laminate 4 has a bent portion 1 and bent portion continuation portions 2 and 3 that are continuous with the bent portion 1. In the example shown in Fig. 15, the bent portion continuation portions 2 and 3 are both flat portions. The laminate 4 has protrusions 5A and 5B at two locations on the bent portion 1 that protrude toward the inside of the bend of the bent portion 1.

[0080] Conductor layers 21, 21G1, 21G2, 22, 22G1, 22G2, 23, 23G1, 23G2, 24, 24G1, and 24G2 are formed on the laminate 4. Further, the laminate 4 is formed with a component mounting portion PMD.

[0081] The conductor layers 21, 21G1, and 21G2 form a first stripline. The conductor layers 22, 22G1, and 22G2 form a second stripline. Similarly, the conductor layers 23, 23G1, and 23G2 form a third stripline, and the conductor layers 24, 24G1, and 24G2 form a fourth stripline.

[0082] According to this embodiment, in order to form the bent portion 1, a plurality of protruding portions 5A, 5B are formed in the extension direction (X direction) of the valley of the laminate formed by bending the laminate 4, so that the laminate substrate 106 has high rigidity of the bent portion 1 even if the extension direction of the valley of the laminate is long. Furthermore, by setting the positions of the plurality of protruding portions 5A, 5B, the degree of freedom in arranging the conductor layer as a transmission line is increased.

[0083] 15 and 16, two protrusions 5A and 5B are provided, but three or more protrusions may be provided in a similar manner. Furthermore, as in the example shown in the fourth embodiment, signal line conductors may be formed on the surfaces or inner layers of the protrusions 5A and 5B.

[0084] Furthermore, the protrusions 5A and 5B may be of various types with different sizes (width, height, length).

[0085] Seventh Embodiment In the seventh embodiment, a laminated substrate having a conductor layer with an active function on the upper surface or inner layer of the protruding portion 5 will be exemplified.

[0086] Fig. 17 is a perspective view of a component-mounted laminated substrate 107A according to this embodiment, viewed from two directions. The upper view of Fig. 17 is a perspective view from a direction in which a protruding portion 5 of the laminated substrate of the component-mounted laminated substrate 107A is visible, and the lower view of Fig. 17 is a perspective view from a direction in which a cavity portion 6 of the laminated substrate of the component-mounted laminated substrate 107A is visible. Fig. 18 is a view showing a cross section of the center of a bent portion 1 of a laminate 4 of the laminated substrate 107.

[0087] The laminate 4 has a bent portion 1 and bent portion continuation portions 2 and 3 that are continuous with the bent portion 1. The laminate 4 has a protruding portion 5 at a part of the bent portion 1 that protrudes inward of the bend of the bent portion 1.

[0088] A ground conductor G2A is formed on the flat upper surface of the bent portion continuous portion 2, and a ground conductor G2B is formed on the flat upper surface of the bent portion continuous portion 3.

[0089] 17 and 18 , a ground conductor G2A is formed on the top surface of the bent portion continuous portion 2 of the laminate 4, and a ground conductor G2B is formed on the top surface of the bent portion continuous portion 3. A ground conductor G2C is formed on the bottom surfaces of the bent portion continuous portion 2, the bent portion 1, and the bent portion continuous portion 3. Signal transmission conductor layers 21 and 22 are formed on the inner layers.

[0090] With the above-described configuration, the signal transmission conductor layer 21, the ground conductor G2C, and the ground conductor G2A form a first stripline. Similarly, the signal transmission conductor layer 22, the ground conductor G2C, and the ground conductor G2A form a second stripline.

[0091] The signal transmission conductor layer 21 is extended to the upper part of the protrusion 5 via an extension conductor layer 21E, which is an inner layer of the protrusion 5. A radiating element 51 is formed on the upper surface of the protrusion 5. The extension conductor layer 21E is connected to the feeding point of the radiating element 51 via an interlayer electrode 21C and an interlayer connection conductor 8.

[0092] Similarly, the signal transmission conductor layer 22 is extended to the upper part of the protrusion 5 via an extension conductor layer inside the protrusion 5. A radiating element 52 is formed on the upper surface of the protrusion 5. The extension conductor layer is connected to the feeding point of this radiating element 52 via an interlayer electrode and an interlayer connection conductor. The extension conductor layer, interlayer electrode, and interlayer connection conductor that are electrically connected to the radiating element 52 are not shown in the cross section shown in Figure 18.

[0093] As shown in the lower drawing of Fig. 17 , the ground conductor G2C formed on the underside of the bend portion continuous portion 2, the bend portion 1, and the bend portion continuous portion 3 is widely formed in a position excluding the cavity portion 6 (a position not facing the radiating elements 51 and 52). This ground conductor G2C and the ground conductor G2A are electrically connected via interlayer connection conductors. Similarly, the ground conductor G2C and the ground conductor G2B are electrically connected via interlayer connection conductors. These interlayer connection conductors are arranged at predetermined intervals between the signal transmission conductor layer 21 and the signal transmission conductor layer 22 and in the longitudinal direction of the bend (the continuous direction of the bend portion continuous portion 2, the bend portion 1, and the bend portion continuous portion 3).

[0094] The radiating element 51 acts as a first patch antenna, and an antenna signal is input and output via a first strip line. Similarly, the radiating element 52 acts as a second patch antenna, and an antenna signal is input and output via a second strip line.

[0095] According to this embodiment, the radiating elements 51, 52, etc. can be formed so as to straddle the protrusion 5, so that multiple radiating elements can be easily formed. Furthermore, since the orientations of the radiating elements 51, 52 are different, multiple antennas with different directivities can be configured. Therefore, it can be used as a wide-directivity antenna.

[0096] 17 shows an example in which no ground conductor is formed on the inner surface of cavity 6, but by forming a ground conductor on the inner surface of cavity 6, a surface of the ground conductor facing radiating elements 51 and 52 may be formed. This makes it possible to suppress the influence of other conductors close to radiating elements 51 and 52 on fluctuations in the antenna characteristics.

[0097] Furthermore, if the protrusion 5 has an asymmetrical cross section, as in the example shown in FIG. 5(b), it is possible to make the directivity of the antenna asymmetric.

[0098] 17 and 18, the radiating elements 51 and 52 of the same shape are arranged in 180-degree rotational symmetry, but it is also possible to arrange multiple radiating elements with different frequency characteristics, for example, by varying their sizes, thereby configuring an antenna that can be used in multiple frequency bands.

[0099] Although two antennas are provided on the protruding portion 5 in the examples shown in FIGS. 17 and 18, a single antenna may be provided.

[0100] In the examples shown in FIGS. 17 and 18, the radiating elements 51 and 52 are formed on the surface of the protrusion 5, but the radiating elements may be provided on an inner layer.

[0101] Furthermore, the conductor layer formed on the protruding portion 5 is not limited to a radiating element, but may be a functional conductor layer such as a capacitor or an inductor.

[0102] Eighth Embodiment In the eighth embodiment, an electronic device will be described. This electronic device includes a housing that houses various boards and components. For example, a circuit board is housed in this housing, and the laminated board shown in each of the above embodiments is also disposed therein.

[0103] According to this embodiment, an electronic device having high mechanical strength against vibration can be configured, and also an electronic device having high electrical stability against vibration and suppressing noise generation can be configured.

[0104] Finally, the present invention is not limited to the above-described embodiments. Those skilled in the art can make appropriate modifications and variations. The scope of the present invention is defined not by the above-described embodiments but by the claims. Furthermore, the scope of the present invention includes modifications and variations from the embodiments within the scope of the claims and their equivalents.

[0105] For example, in each of the above-described embodiments, the bent portion continuous portion extending from the bent portion of the laminate has a flat shape, but it may also be curved. Furthermore, since the region other than the bent portion is flexible, it can be easily incorporated into the housing of an electronic device.

[0106] Furthermore, components mounted on the laminated substrate may be chip components such as microphones, ICs, chip capacitors, chip inductors, etc., in addition to connectors.

[0107] The laminated substrate, cable, and electronic device of the present invention may be provided in the following embodiments.

[0108] <1> A laminated substrate comprising a laminate formed by laminating insulating layers and conductor layers, the laminate having a bent portion and a bent portion contiguous to the bent portion, and the laminate having a protruding portion at a part of the bent portion that protrudes toward the inside of the bend of the bent portion.

[0109] <2> The laminated substrate according to <1>, wherein a portion of the conductor layer formed on the surface of the protrusion or on an inner layer of the protrusion forms a plurality of layers, and includes an interlayer connection conductor that provides electrical conduction between the plurality of conductor layers.

[0110] <3> The laminated substrate according to <1> or <2>, wherein a part of the conductor layer is a conductor layer for signal transmission that extends in a direction passing beyond the bent portion.

[0111] <4> The laminated substrate according to <3>, wherein at least a part of the conductor layer for signal transmission is disposed in a position that passes through the protruding portion.

[0112] <5> The laminated substrate according to <3>, wherein at least a part of the conductor layer for signal transmission is disposed at a position that avoids the protruding portion.

[0113] <6> The laminated substrate according to any one of <1> to <5>, wherein a protective film is formed on a surface of the laminate.

[0114] <7> The laminated substrate according to any one of <1> to <6>, wherein any one of a protrusion width, which is the maximum dimension of a width of a hollow portion on the opposite side of the protrusion direction along an extension direction of a valley of the laminate formed by bending the laminate, a protrusion height, which is the dimension of the protrusion that protrudes the highest among the protrusions, and a protrusion length, which is the maximum length among lengths in a direction perpendicular to the protrusion height direction and the protrusion width direction, is equal to or greater than a thickness of the laminate.

[0115] <8> The laminated substrate according to any one of <1> to <6>, wherein a protrusion width, which is the maximum dimension of a width of a hollow portion on the opposite side of a protrusion direction of the protrusion along an extension direction of a valley of the laminate formed by bending the laminate, a protrusion height, which is the dimension of the protrusion that protrudes the highest among the protrusions, and a protrusion length, which is the maximum length among lengths in a direction perpendicular to the protrusion height direction and the protrusion width direction, are each equal to or greater than a thickness of the laminate.

[0116] <9> The laminated substrate according to any one of <1> to <8>, wherein a part of the protruding portion protrudes from a boundary between the bent portion and the bent portion continuous portion toward the bent portion continuous portion.

[0117] <10> The laminated substrate according to any one of <1> to <9>, wherein the number of the protrusions is plural.

[0118] <11> The laminated substrate according to any one of <1> to <10>, wherein the laminate includes a radiating element formed on a surface of the protruding portion or at a position including a surface layer portion of the protruding portion.

[0119] <12> The laminated substrate according to any one of <1> to <11>, wherein the material of the insulating layer is a thermoplastic resin.

[0120] <13> The laminated substrate according to any one of <1> to <12>, further comprising a component mounted on the bent portion continuous portion.

[0121] <14> The laminated substrate according to any one of <1> to <12>, wherein the bent portion has a flat portion on a surface of the bent portion, and a component is mounted on the flat portion.

[0122] <15> A cable including the laminated substrate according to <13> or <14>, wherein the component is a connector.

[0123] <16> An electronic device comprising a housing, in which the laminated substrate according to any one of <1> to <14> or the cable according to <15> is disposed.

[0124] B2, B3...boundary FP...flat portion G2A, G2B...ground conductor PMD...component mounting portion H...height L...length T...thickness W...width 1...bent portion 2, 3...bent portion continuous portion 4...laminated body 5, 5A, 5B...projection portion 6...cavity portion 7...protective film 8...interlayer connecting conductor 10...insulating layer 11, 12, 13, 14, 15...components 21, 21G1, 21G2, 22, 22G1, 22G2, 23, 23G1, 23G2, 24, 24G1, 24G2...conductor layer 21C...interlayer electrode 21E...drawing conductor layer 31, 32, 33, 34, 35, 36...terminal electrode 41, 42, 43...insulating layer 51, 52...radiating element 61, 62, 63...terminal 101...Laminated substrate 101A...Laminated substrate with components 102, 103, 104, 105, 106...Laminated substrates 107A...Laminated substrate with components

Claims

1. A laminated substrate comprising a laminate formed by laminating insulating layers and conductor layers, the laminate having a bent portion and a bent portion contiguous portion that is continuous with the bent portion, and the laminate having a protrusion that protrudes inward from a part of the bent portion.

2. The laminated substrate according to claim 1, wherein a portion of the conductor layer formed on the surface of the protrusion or on the inner layer of the protrusion comprises multiple layers, and is provided with an interlayer connection conductor that provides electrical conductivity between the multiple conductor layers.

3. The laminated substrate according to claim 1 or 2, wherein a portion of the conductor layer is a conductor layer for signal transmission that extends in a direction passing beyond the bent portion.

4. The laminated board according to claim 3, wherein at least a portion of the conductor layer for signal transmission is disposed in a position passing through the protruding portion.

5. The laminated board according to claim 3, wherein at least a portion of the conductor layer for signal transmission is disposed in a position that avoids the protruding portion.

6. The laminated substrate according to any one of claims 1 to 5, wherein a protective film is formed on a surface of the laminate.

7. A laminated substrate according to any one of claims 1 to 6, wherein any one of a protrusion width, which is the maximum dimension of the width of the hollow portion on the opposite side of the protrusion direction along the extension direction of the valley of the laminate formed by bending the laminate, a protrusion height, which is the dimension of the protrusion that protrudes the highest among the protrusions, or a protrusion length, which is the maximum length among lengths in a direction perpendicular to the protrusion height direction and the protrusion width direction, is equal to or greater than the thickness of the laminate.

8. A laminated substrate as described in any one of claims 1 to 6, wherein a protrusion width, which is the maximum dimension of the width of the hollow portion on the opposite side of the protrusion direction along the extension direction of the valley of the laminate formed by bending the laminate, a protrusion height, which is the dimension of the protrusion that protrudes the highest, and a protrusion length, which is the maximum length among the lengths in a direction perpendicular to the protrusion height direction and the protrusion width direction, are each equal to or greater than the thickness of the laminate.

9. The laminated substrate according to claim 1, wherein a portion of the protruding portion protrudes from the boundary between the bent portion and the bent portion continuous portion in the direction of the bent portion continuous portion.

10. The laminated substrate according to any one of claims 1 to 9, wherein the number of said protrusions is more than one.

11. The laminated substrate according to any one of claims 1 to 10, wherein the laminate comprises a radiating element formed on a surface of the protruding portion or at a position including a surface layer portion of the protruding portion.

12. The laminated substrate according to any one of claims 1 to 11, wherein the material of the insulating layer is a thermoplastic resin.

13. The laminated substrate according to any one of claims 1 to 12, further comprising a component mounted on the continuous bent portion.

14. The laminated substrate according to any one of claims 1 to 12, wherein the bent portion has a flat portion on a surface of the bent portion, and a component is mounted on the flat portion.

15. A cable comprising the laminated substrate according to claim 13 or 14, wherein the component is a connector.

16. An electronic device comprising a housing, in which a laminated substrate according to any one of claims 1 to 14 or a cable according to claim 15 is disposed.

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