Circuit module

Abstract

This circuit module comprises: a circuit board including a circuit board body having a first upper end surface and a first lower end surface arranged in the vertical direction and a conductor provided on the first upper end surface; an insulating member disposed on the first upper end surface; and an electronic component that is disposed on the insulating member, and that includes a first electrode, an electronic component body, and a second electrode, the first electrode being electrically connected to the conductor, and having a second upper end surface and a second lower end surface arranged in the vertical direction and a first side surface connected to the second upper end surface. The second upper end surface is covered with the insulating member, and the second electrode is electrically connected to the first electrode by exposing at least a part of the first side surface from the insulating member.

Description

Circuit Module

[0001] The present invention relates to a circuit module.

[0002] A known example of a conventional circuit module invention is the circuit module described in Patent Document 1. The circuit module described in Patent Document 1 includes a substrate module having an upper main surface, an electronic component disposed on the substrate module, and a bonding adhesive for fixing the electronic component to the upper main surface of the substrate module. The electronic component includes a first electrode. The substrate module includes a second electrode. The first electrode is electrically connected to the second electrode via solder.

[0003] Japanese Patent Application Laid-Open No. 2022-189354

[0004] The manufacturing of the circuit module described in Patent Document 1 may include a step (polishing step) of polishing the upper main surface of the substrate module to expose the second electrode from the upper main surface of the substrate module. In this case, the productivity of the circuit module described in Patent Document 1 deteriorates. Therefore, in the field of the circuit module described in Patent Document 1, there is a demand to eliminate the polishing step during manufacturing.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a circuit module that can eliminate the polishing step during manufacturing.

[0006] A circuit module according to one embodiment of the present invention comprises: a circuit board including a circuit board main body having a first upper end surface and a first lower end surface aligned in the vertical direction, and a conductor provided on the first upper end surface; an insulating member arranged on the first upper end surface; a first electrode having a second upper end surface and a second lower end surface aligned in the vertical direction and a first side surface connected to the second upper end surface, the first electrode being electrically connected to the conductor; and an electronic component including an electronic component main body and a second electrode, the electronic component being arranged on the insulating member; wherein the second upper end surface is covered by the insulating member, and the second electrode is electrically connected to the first electrode as at least a portion of the first side surface is exposed from the insulating member.

[0007] According to the circuit module of the present invention, the polishing step during manufacturing can be eliminated.

[0008] FIG. 1 is a perspective view of the circuit module 1. FIG. 2 is a cross-sectional view of the circuit module 1 taken along line A-A. FIG. 3 is a plan view of the insulating member 3 viewed from above. FIG. 4 is a perspective view of the insulating member 3 and the first electrodes 4L and 4R. FIG. 5 is a cross-sectional view of the insulating member 3 and the first electrodes 4L and 4R taken along line B-B. FIG. 6 is a perspective view of the electronic component 5. FIG. 7 is a cross-sectional view showing an example of a manufacturing method for the circuit module 1. FIG. 8 is a cross-sectional view of the circuit module 1a taken along line A-A. FIG. 9 is a cross-sectional view of the circuit module 1b taken along line A-A.

[0009] [First Embodiment] [Structure of Circuit Module 1] A circuit module 1 according to a first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of the circuit module 1. FIG. 2 is a cross-sectional view of the circuit module 1 taken along line A-A. FIG. 3 is a plan view of the insulating member 3 viewed from above. FIG. 4 is a perspective view of the insulating member 3 and the first electrodes 4L and 4R. FIG. 5 is a cross-sectional view of the insulating member 3 and the first electrodes 4L and 4R taken along line B-B. FIG. 6 is a perspective view of an electronic component 5.

[0010] In this specification, directions are defined as follows. As shown in FIG. 1 , the direction in which the bottom end surface S2 and the top end surface S1 of the circuit board main body 21 are arranged in this order is defined as the upward direction. The opposite direction of the upward direction is defined as the downward direction. As shown in FIG. 2 , the direction in which the first electrodes 4L and the first electrodes 4R are arranged in this order is defined as the rightward direction. The opposite direction of the rightward direction is defined as the leftward direction. The rightward and leftward directions are perpendicular to the upward and downward directions. The direction perpendicular to the upward and rightward directions is defined as the forward direction. The opposite direction of the forward direction is defined as the rearward direction. The direction perpendicular to the up-down direction is defined as the horizontal direction. The rightward, leftward, frontward, and rearward directions are examples of the horizontal direction. However, the upward, downward, rightward, leftward, frontward, and rearward directions in this specification are defined for convenience of explanation and may not coincide with the upward, downward, rightward, leftward, frontward, and rearward directions when the circuit module 1 is in use. In addition, in each drawing, the upward and downward directions may be interchanged, the rightward and leftward directions may be interchanged, and the forward and backward directions may be interchanged.

[0011] In this specification, the positional relationship of the members is defined as follows: The first member to the third member constitute the circuit module 1. In this specification, when the first member is arranged on the second member, this refers to the following state: At least a portion of the first member is located directly above the second member. Therefore, when viewed in the vertical direction, the first member overlaps with the second member. This definition also applies to directions other than the vertical direction.

[0012] In this specification, "a first member being positioned above a second member" includes a case where at least a portion of the first member is positioned directly above the second member, and a case where the first member is not positioned directly above the second member but is positioned diagonally above the second member. In this case, the first member does not have to overlap with the second member when viewed in the vertical direction. "Diagonally above" refers to, for example, the upper left or upper right. This definition also applies to directions other than the upward direction.

[0013] In this specification, unless otherwise specified, the various parts of the first member are defined as follows: The upper part of the first member means the upper half of the first member. The upper end of the first member means the upper end of the first member. The upper end part of the first member means the upper end of the first member and its vicinity. These definitions also apply to directions other than the upward direction.

[0014] In this specification, "the first member and the second member are electrically connected" means that electricity is conducted between the first member and the second member. Therefore, the first member and the second member may be in direct contact with each other, or may not be in direct contact with each other. When the first member and the second member are not in direct contact with each other, a third member having electrical conductivity is disposed between the first member and the second member.

[0015] 1 and 2, the circuit module 1 includes a circuit board 2, an insulating member 3, first electrodes 4L, 4R, electronic components 5, solder 6L, and solder 6R. In this embodiment, the circuit module 1 has a bilaterally symmetrical structure.

[0016] As shown in FIG. 2 , the circuit board 2 includes a circuit board main body 21, a conductor 22L, and a conductor 22R. In this embodiment, the conductor 22L has a structure that is bilaterally symmetrical to the conductor 22R. Therefore, a description of the conductor 22L will be omitted. The circuit board 2 has upper and lower main surfaces that are aligned in the vertical direction. The upper main surface of the circuit board 2 is located above the lower main surface of the circuit board 2. As shown in FIG. 1 , the circuit board 2 has a rectangular shape with long sides extending in the left-right direction and short sides extending in the front-rear direction when viewed in the vertical direction.

[0017] The circuit board main body 21 has an upper end surface S1 and a lower end surface S2 aligned in the vertical direction. The upper end surface S1 is located above the lower end surface S2. Here, the upper end surface S1 is defined as the surface located at the upper end of the circuit board main body 21. This definition also applies to end surfaces other than the upper end surface. This definition also applies to components other than the circuit board main body 21. In this embodiment, the circuit board main body 21 has a bilaterally symmetrical structure. Therefore, a description of the left side of the circuit board main body 21 will be omitted. The upper end surface S1 is a portion of the upper main surface of the circuit board 2. The lower end surface S2 is a portion of the lower main surface of the circuit board 2. An electric circuit is formed inside the circuit board main body 21 by a conductor layer. When viewed in the vertical direction, the circuit board main body 21 has a rectangular shape with long sides extending in the left-right direction and short sides extending in the front-rear direction. The right end surface of the circuit board main body 21 is a portion of the right surface of the circuit board 2. The front end surface of the circuit board main body 21 is the same as the front surface of the circuit board 2. The rear end surface of the circuit board main body 21 is the same as the rear surface of the circuit board 2. The upper end surface S1 corresponds to the "first upper end surface" of the present invention. The lower end surface S2 corresponds to the "first lower end surface" of the present invention.

[0018] The conductor 22R is provided on the circuit board main body 21. The conductor 22R is also provided at the right end of the circuit board main body 21. The conductor 22R is conductive. The conductor 22R has an upper surface and a lower surface that are aligned in the vertical direction. The upper surface of the conductor 22R is located above the lower surface of the conductor 22R. The upper surface of the conductor 22R is part of the upper main surface of the circuit board 2. The lower surface of the conductor 22R is located above the lower main surface of the circuit board 2. The conductor 22R is electrically connected to the electrical circuit inside the circuit board main body 21. When viewed in the vertical direction, the conductor 22R has a rectangular shape with short sides extending in the left-right direction and long sides extending in the front-rear direction. The right surface of the conductor 22R is part of the right surface of the circuit board 2. The material of the conductor 22R is a metal such as copper.

[0019] The insulating member 3 has insulating properties. In this embodiment, the insulating member 3 has a bilaterally symmetrical structure. The insulating member 3 has an upper end surface S3 and a lower end surface S4 aligned in the vertical direction. The upper end surface S3 is located above the lower end surface S4. The insulating member 3 is disposed on the upper end surface S1 of the circuit board main body 21. In this embodiment, the insulating member 3 covers the entire upper end surface S1 of the circuit board main body 21. The insulating member 3 is made of, for example, resin. When viewed in the vertical direction, each of the upper end surface S3 and the lower end surface S4 has a rectangular shape with short sides extending in the left-right direction and long sides extending in the front-rear direction. However, in this embodiment, as shown in FIG. 3 , the lower end surface S4 has an area A1 that does not overlap with the upper end surface S3 when viewed in the vertical direction. The upper end surface S3 corresponds to the "third upper end surface" in this invention. The lower end surface S4 corresponds to the "third lower end surface" in this invention.

[0020] As shown in Figures 3 and 4, the right end of the insulating member 3 is provided with protrusions 31RB and 31RF. Furthermore, the left end of the insulating member 3 is provided with protrusions 31LB and 31LF. In this embodiment, the protrusions 31LB and 31LF are symmetrical to the protrusions 31RB and 31RF, respectively. Therefore, a description of the protrusions 31LB and 31LF will be omitted. The protrusions 31RB and 31RF are aligned in this order toward the rear. The protrusions 31RB and 31RF are located in region A1 when viewed in the vertical direction. In other words, the protrusions 31RB and 31RF are provided at the right end of the insulating member 3, so that the lower end surface S4 has region A1. The protrusions 31RB and 31RF are parts of the insulating member 3 that are located in an area that does not overlap with the upper end surface S3 when the insulating member 3 is viewed from below. Furthermore, the upper surfaces of the protrusions 31RB and 31RF are not connected to the upper end surface S3. The upper surfaces of the protrusions 31RB and 31RF are located between the upper end surface S3 and the lower end surface S4 in the vertical direction. On the other hand, the lower surfaces of the protrusions 31RB and 31RF are part of the lower end surface S4.

[0021] The first electrode 4L and the first electrode 4R are conductive. In this embodiment, the first electrode 4L has a structure that is bilaterally symmetrical to the first electrode 4R. Therefore, a description of the first electrode 4L will be omitted. The first electrode 4R is disposed on the conductor 22R. The material of the first electrode 4R is, for example, a metal such as copper.

[0022] The first electrode 4R is provided at the right end of the insulating member 3. The first electrode 4R has an upper end surface S5 and a lower end surface S6 aligned in the vertical direction, and a side surface SS1 connected to the upper end surface S5. The upper end surface S5 is located above the lower end surface S6. As shown in FIGS. 4 and 5 , the first electrode 4R includes an electrode portion 4RE and a protrusion 4RP. The electrode portion 4RE has a rectangular shape extending in the vertical direction. The upper surface of the electrode portion 4RE is the upper end surface S5. The lower surface of the electrode portion 4RE is a portion of the lower end surface S6. The upper surface of the electrode portion 4RE is not exposed because it is covered by the insulating member 3. In other words, the upper end surface S5 is not exposed because it is covered by the insulating member 3. On the other hand, the lower surface of the electrode portion 4RE is exposed from the insulating member 3. In other words, the lower end surface S6 is exposed from the insulating member 3. As a result, the electrode portion 4RE is fixed to the upper surface of the conductor 22R by solder (not shown). Therefore, the first electrode 4R is electrically connected to the conductor 22R. In addition, the right surface of the electrode portion 4RE is exposed from the insulating member 3. In other words, at least a portion of the side surface SS1 is exposed from the insulating member 3. The first electrode 4R is embedded in the right part of the insulating member 3 so that the right surface of the electrode portion 4RE is exposed. The upper end surface S5 corresponds to the "second upper end surface" in the present invention. The lower end surface S6 corresponds to the "second lower end surface" in the present invention. The side surface SS1 corresponds to the "first side surface" in the present invention.

[0023] The protrusion 4RP is located to the right of the electrode portion 4RE. More specifically, the protrusion 4RP extends rightward from the lower portion of the electrode portion 4RE. As a result, the protrusion 4RP does not overlap the upper end surface S5 of the first electrode 4R when viewed in the vertical direction. The protrusion 4RP is located below the upper end surface S5. The upper surface of the protrusion 4RP is exposed from the insulating member 3. The lower surface of the protrusion 4RP is exposed from the insulating member 3. As a result, the protrusion 4RP is fixed to the upper surface of the conductor 22R by solder (not shown). The right surface of the electrode portion 4RE is exposed from the insulating member 3. Meanwhile, the protrusion 4RP is located between the protrusions 31RB and 31RF of the insulating member 3 in the front-to-rear direction. As a result, the front and rear surfaces of the protrusion 4RP are not exposed from the insulating member 3.

[0024] As shown in FIG. 6 , the electronic component 5 includes an electronic component body 51, a second electrode 5L, and a second electrode 5R. The second electrode 5L and the second electrode 5R are conductive. The electronic component 5 is, for example, an inductor. In this embodiment, the second electrode 5L has a bilaterally symmetrical structure to the second electrode 5R. Therefore, a description of the second electrode 5L will be omitted. As shown in FIG. 6 , the electronic component body 51 has a rectangular parallelepiped shape. Therefore, the electronic component body 51 has an upper main surface S7 and a lower main surface S8 aligned in the vertical direction, and a side surface SS2 connecting the upper main surface S7 and the lower main surface S8. The upper main surface S7 is located on the lower main surface S8. Furthermore, the electronic component 5 is disposed on the insulating member 3 as shown in FIG. 1 . The electronic component body 51 overlaps the insulating member 3 when viewed in the vertical direction. Furthermore, the electronic component body 51 overlaps the first electrode 4L and the first electrode 4R when viewed in the vertical direction. 2, the lower main surface S8 is not in contact with the upper end surface S3 of the insulating member 3. The side surface SS2 corresponds to the "second side surface" of the present invention.

[0025] As shown in FIG. 6 , the second electrode 5R is provided on the right end of the electronic component body 51. More specifically, the second electrode 5R has a shape extending from the right surface of the electronic component body 51 in a downward and rightward direction. That is, the second electrode 5R has a shape extending from at least a portion of the side surface SS2 of the electronic component body 51 in a downward and rightward direction. The second electrode 5R has a first electrode portion 52R1 extending rightward from the right surface of the electronic component body 51 and a second electrode portion 52R2 extending downward from the right end of the first electrode portion 52R1. As a result, the lower end of the second electrode 5R is located below the lower main surface S8 of the electronic component body 51. Furthermore, the second electrode 5R overlaps with the protruding portion 4RP of the first electrode 4R when viewed in the vertical direction. The second electrode 5R is made of a metal such as copper. The second electrode portion 52R2 corresponds to the "electrode portion" in the present invention.

[0026] As shown in FIGS. 1 and 2 , the electronic component 5 is fixed to the first electrode 4L and the first electrode 4R by solder 6L and solder 6R. In this embodiment, the solder 6L has a bilaterally symmetrical structure to the solder 6R. Therefore, a description of the solder 6L will be omitted. The solder 6R is provided between the first electrode 4R and the second electrode 5R. More specifically, the solder 6R is located between the right surface of the electrode portion 4RE and the left surface of the second electrode portion 52R2, and is in contact with both the right surface of the electrode portion 4RE and the left surface of the second electrode portion 52R2. This fixes the left surface of the second electrode portion 52R2 to the right of the right surface of the electrode portion 4RE. The solder 6R is also located between the upper surface of the protrusion 4RP and the lower surface of the second electrode portion 52R2, and is in contact with both the upper surface of the protrusion 4RP and the lower surface of the second electrode portion 52R2. As a result, the solder 6R fixes the lower surface of the second electrode portion 52R2 onto the upper surface of the protrusion 4RP. That is, the second electrode 5R is electrically connected to the first electrode 4R because the right surface of the electrode portion 4RE of the first electrode 4R is exposed from the insulating member 3. Therefore, the second electrode 5R is electrically connected to the conductor 22R.

[0027] [Method of Manufacturing Circuit Module 1] Next, an example of a method of manufacturing the circuit module 1 will be described with reference to the drawings. Fig. 7 is a cross-sectional view showing an example of a method of manufacturing the circuit module 1.

[0028] First, a circuit board 2a having a plurality of conductors 22a provided on the upper end surface S1 of the circuit board main body 21, an insulating member 3a, and a plurality of electrodes 4a are prepared. Solder paste (not shown) is applied to the upper surface of each of the plurality of conductors 22a. At this time, the plurality of conductors 22a are arranged in the left-right direction. The plurality of electrodes 4a are also arranged in the left-right direction. Furthermore, the insulating member 3a is disposed on the circuit board 2a. Each of the plurality of electrodes 4a is disposed on each of the plurality of conductors 22a.

[0029] Next, the insulating member 3a and the electrodes 4a are half-cut. More specifically, in a vertical view, the electrodes 4a and the insulating member 3a are cut so that the regions overlapping with the electrodes 4a include the entire outer edges of the upper surfaces of the electrodes 4a and the lower ends of the electrodes 4a. This forms a plurality of recesses aR.

[0030] Next, solder paste 6a is filled into each of the recesses aR. The vertical positions of the upper ends of the solder pastes 6a are the same as the vertical positions of the upper ends of the electrodes 4a. Note that the upper ends of the solder pastes 6a may be lower than the upper ends of the electrodes 4a.

[0031] Next, the electronic components 5 are placed on the insulating member 3 so that the second electrodes 5L and 5R are inserted into the solder pastes 6a, respectively. The circuit board 2a, insulating member 3a, electrodes 4a, electronic components 5, and solder pastes 6a are then placed in a reflow furnace and heated. This melts the solder pastes 6a. The circuit board 2a, insulating member 3a, electrodes 4a, electronic components 5, and solder pastes 6a are then removed from the reflow furnace and allowed to cool naturally. This solidifies the melted solder pastes 6a. As a result, the solder pastes 6a fix the second electrodes 5L and 5R, respectively.

[0032] Next, the circuit board 2a, insulating member 3a, and multiple solder paste layers 6a are fully cut. More specifically, the circuit board 2a, insulating member 3a, and multiple solder paste layers 6a located in the region between the second electrode 5R of a certain electronic component 5 and the second electrode 5L of the electronic component 5 located immediately to the right of it are cut. This separates the circuit board 2a, insulating member 3a, and multiple solder paste layers 6a. As a result, the circuit module 1 is completed.

[0033] [Effect] The circuit module 1 can eliminate the polishing step during manufacturing. More specifically, the upper end surface S5 of the first electrode 4R is covered by the insulating member 3. Therefore, the upper end surface S5 of the first electrode 4R is not exposed from the insulating member 3. Meanwhile, at least a portion of the side surface SS1 of the first electrode 4R is exposed from the insulating member 3. By half-cutting the insulating member 3a and the electrode 4a during manufacturing the circuit module 1, at least a portion of the side surface SS1 of the first electrode 4R can be exposed from the insulating member 3. This allows the first electrode 4R and the second electrode 5R to be electrically connected. Therefore, the circuit module 1 can eliminate the polishing step of exposing the first electrode 4R from the insulating member 3 by polishing the insulating member 3.

[0034] Furthermore, the circuit module 1 can easily improve the heat dissipation of the first electrode. More specifically, at least a portion of the side surface SS1 of the first electrode 4R is exposed from the insulating member 3. Therefore, the area of ​​the portion of the first electrode 4R exposed from the insulating member 3 can be easily made larger than the area of ​​the portion of the first electrode exposed from the insulating member when only the upper end surface of the first electrode is exposed from the insulating member. Furthermore, the electronic component body 51 can be prevented from reducing the heat dissipation of the first electrode 4R. As a result, the circuit module 1 can easily improve the heat dissipation of the first electrode.

[0035] Furthermore, the circuit module 1 can be made smaller. More specifically, the electronic component body 51 overlaps the first electrodes 4L and 4R in a vertical view. Therefore, the left-right length of the circuit module 1 can be made shorter than the left-right length of a circuit module in which the electronic component body does not overlap the first electrodes in a vertical view. As a result, the circuit module 1 can be made smaller.

[0036] Furthermore, the circuit module 1 can prevent the electronic component 5 from shifting out of position. More specifically, when the upper end surface of the first electrode is exposed from the insulating member, solder paste is applied to the upper end surface of the first electrode, and the second electrode of the electronic component is mounted on the solder paste. Subsequently, heating melts the solder paste, causing the second electrode to slide on the solder paste, potentially resulting in misalignment of the second electrode. On the other hand, the circuit module 1 exposes at least a portion of the side surface SS1 of the first electrode 4R from the insulating member 3. Furthermore, the lower end of the second electrode 5R is located below the lower main surface S8 of the electronic component body 51. As a result, the second electrode 5R is electrically connected to the first electrode 4R. The solder paste 6a is located between the right surface of the electrode portion 4RE of the first electrode 4R and the left surface of the second electrode portion 52R2 of the second electrode 5R. Therefore, it is possible to prevent the second electrodes 5R from sliding on the solder paste 6a, thereby preventing the position of the second electrodes 5R from being displaced. As a result, the circuit module 1 can prevent the position of the electronic component 5 from being displaced.

[0037] Furthermore, the circuit module 1 allows the electronic component 5 to be easily positioned. More specifically, the second electrode 5R overlaps the protrusion 4RP of the first electrode 4R when viewed in the vertical direction. The electronic component 5 can be positioned by arranging the electronic component 5 so that the second electrode 5R overlaps the protrusion 4RP of the first electrode 4R when viewed in the vertical direction. Therefore, the circuit module 1 allows the electronic component 5 to be easily positioned.

[0038] Furthermore, according to the circuit module 1, the first electrode 4R includes the protrusion 4RP extending rightward, so that the solder 6R can be secured on the protrusion 4RP of the first electrode 4R.

[0039] [First Modification] The structure of a circuit module 1a according to a first modification of the present invention will be described below with reference to the drawings. Fig. 8 is a cross-sectional view of the circuit module 1a taken along line A-A. Note that for the circuit module 1a according to the first modification, only the differences from the circuit module 1 according to the first embodiment will be described, and the rest will be omitted.

[0040] The circuit module 1 a differs from the circuit module 1 in that it further includes an adhesive member 7 .

[0041] 8 , the adhesive member 7 is provided between the electronic component 5 and the insulating member 3 in the front-rear direction. More specifically, the adhesive member 7 is provided between the upper end surface S3 of the insulating member 3 and the lower main surface S8 of the electronic component body 51. The adhesive member 7 fixes the electronic component 5 onto the insulating member 3. The adhesive member 7 may be conductive or insulating.

[0042] The circuit module 1a described above also achieves the same effects as the circuit module 1. Furthermore, the circuit module 1a allows for a larger area to be coated with the adhesive material and prevents the adhesive material from coming into contact with solder. More specifically, the adhesive material 7 is provided between the upper end surface S3 of the insulating member 3 and the lower main surface S8 of the electronic component body 51. Meanwhile, in the circuit module 1a, no solder is present between the upper end surface S3 of the insulating member 3 and the lower main surface S8 of the electronic component body 51. Therefore, the area to be coated with the adhesive material 7 can be increased. This allows the electronic component 5 to be more firmly fixed to the insulating member 3. Furthermore, even if the area to be coated with the adhesive material 7 is increased, the adhesive material 7 is less likely to come into contact with the solder 6L and the solder 6R because no solder is present between the upper end surface S3 of the insulating member 3 and the lower main surface S8 of the electronic component body 51. Therefore, contact between the adhesive material 7 and the solder 6L and the solder 6R can be prevented. As a result, with the circuit module 1a, the area to which the adhesive material is applied can be increased, and the adhesive material can be prevented from coming into contact with the solder.

[0043] [Second Modification] The structure of a circuit module 1b according to a second modification of the present invention will be described below with reference to the drawings. Fig. 9 is a cross-sectional view of the circuit module 1b taken along line A-A. Regarding the circuit module 1b according to the second modification, only the differences from the circuit module 1 according to the first embodiment will be described, and the rest will be omitted.

[0044] Circuit module 1b differs from circuit module 1 in that protrusions 31RB and 31RF are not provided at the right end of insulating member 3, protrusions 31LB and 31LF are not provided at the left end of insulating member 3, insulating member 3 has a slope S9 located between the upper end surface S3 and the lower end surface S4 in the vertical direction, first electrode 4L has a second electrode portion 52L2 extending in the second direction DIR2 from the left end of first electrode portion 52L1, and first electrode 4R has a second electrode portion 52R2 extending in the first direction DIR1 from the right end of first electrode portion 52R1.

[0045] The insulating member 3 has a quadrangular pyramid shape with an upper end surface S3 as the upper base and a lower end surface S4 as the lower base. Furthermore, as shown in Fig. 9, the insulating member 3 has a slope S9 located between the upper end surface S3 and the lower end surface S4 in the up-down direction. More specifically, the angle θ1 formed between the slope S9 and the lower end surface S4 in the front-to-rear direction is greater than 0 degrees and less than 90 degrees.

[0046] The second electrode portion 52R2 extends in a first direction DIR1 from the right end of the first electrode portion 52R1. The first direction DIR1 is a direction that includes a downward component and is different from the downward direction. Specifically, the first direction DIR1 is a downward and rightward direction. When viewed in the front-to-back direction, the angle formed by the first direction DIR1 and the left-to-right direction can be either an acute angle or an obtuse angle. Of these, the acute angle is defined as the angle θ2 formed by the first direction DIR1 and the left-to-right direction. When viewed in the front-to-back direction, the angle θ2 formed by the first direction DIR1 and the left-to-right direction is greater than the angle θ1 formed between the slope S9 and the lower end surface S4 and is smaller than 90 degrees. As a result, the solder 6R fixes the left surface of the second electrode portion 52R2 to the upper right of the slope S9.

[0047] The circuit module 1b described above also achieves the same effects as the circuit module 1. Furthermore, the circuit module 1b allows for easy electrical connection between the first electrode 4R and the second electrode 5R. More specifically, in a front-to-rear view, the angle θ1 between the inclined surface S9 and the lower end surface S4 is greater than 0 degrees and less than 90 degrees. Furthermore, in a front-to-rear view, the angle θ2 between the first direction DIR1 in which the second electrode portion 52R2 extends and the left-to-right direction is greater than the angle θ1 between the inclined surface S9 and the lower end surface S4 and less than 90 degrees. Because the angle θ2 between the first direction DIR1 and the left-to-right direction is greater than the angle θ1 between the inclined surface S9 and the lower end surface S4 in a front-to-rear view, the second electrode portion 52R2 and the solder 6R are more likely to come into contact with each other, facilitating electrical connection between the second electrode 5R and the first electrode 4R. Furthermore, because the angle θ2 between the first direction DIR1 and the left-right direction is less than 90 degrees when viewed from the front-to-rear direction, the contact area between the second electrode 5R and the solder 6R can be increased, thereby improving the reliability of the electrical connection between the first electrode 4R and the second electrode 5R. As a result, the circuit module 1b allows the first electrode 4R and the second electrode 5R to be easily electrically connected.

[0048] Other Embodiments The circuit module according to the present invention is not limited to the circuit module 1, the circuit module 1a, and the circuit module 1b, and can be modified within the scope of the present invention. In addition, the structures of the circuit module 1, the circuit module 1a, and the circuit module 1b may be combined in any manner.

[0049] The circuit module 1, the circuit module 1a, and the circuit module 1b do not have to have a bilaterally symmetrical structure.

[0050] The conductor 22L does not have to have a structure symmetrical to that of the conductor 22R.

[0051] The circuit board body 21 does not have to have a bilaterally symmetrical structure.

[0052] The insulating member 3 does not have to have a bilaterally symmetrical structure.

[0053] It should be noted that the protrusions 31LB and 31LF do not necessarily have to have a structure symmetrical to the protrusions 31RB and 31RF, respectively.

[0054] The first electrode 4L does not have to have a structure symmetrical to the first electrode 4R.

[0055] The second electrode 5L does not have to have a structure symmetrical to the second electrode 5R.

[0056] The solder 6L does not have to have a structure symmetrical to the solder 6R.

[0057] The solder 6L and the solder 6R are not essential components.

[0058] Note that the protrusions 31RB, 31RF, 31LB, and 31LF are not essential components, and the protrusion 4RP is not an essential component.

[0059] The lower surfaces of the protrusions 31RB and 31RF may be located between the upper end surface S3 and the lower end surface S4 of the insulating member 3 in the vertical direction.

[0060] The lower end surface S4 does not necessarily have to have the area A1 that does not overlap with the upper end surface S3 when viewed in the vertical direction.

[0061] The electronic component body 51 does not have to overlap the first electrodes 4L and 4R when viewed in the vertical direction.

[0062] The present invention has the following configuration.

[0063] (1) A circuit module comprising: a circuit board including a circuit board main body having a first upper end surface and a first lower end surface aligned in a vertical direction, and a conductor provided on the circuit board main body; an insulating member arranged on the first upper end surface; a first electrode having a second upper end surface and a second lower end surface aligned in a vertical direction and a first side surface connected to the second upper end surface, the first electrode being electrically connected to the conductor; and an electronic component including an electronic component main body and a second electrode, the electronic component being arranged on the insulating member; wherein the second upper end surface is covered by the insulating member, and the second electrode is electrically connected to the first electrode by at least a portion of the first side surface being exposed from the insulating member.

[0064] (2) The circuit module according to (1), wherein the electronic component body overlaps the first electrode when viewed in the up-down direction.

[0065] (3) The circuit module according to (1) or (2), wherein the electronic component body has an upper main surface and a lower main surface aligned in the vertical direction, and a second side surface connecting the upper main surface and the lower main surface, the second electrode extends from at least a portion of the second side surface, and a lower end of the second electrode is located below the lower main surface.

[0066] (4) The circuit module according to any one of (1) to (3), further comprising an adhesive member, wherein the insulating member has a third upper end surface and a third lower end surface aligned in the vertical direction, the electronic component body has an upper main surface and a lower main surface aligned in the vertical direction, and the adhesive member is provided between the third upper end surface and the lower main surface.

[0067] (5) A circuit module described in any one of (1) to (4), wherein the first electrode includes a protrusion extending in a horizontal direction perpendicular to the vertical direction, the protrusion being located below the second upper end surface, and the second electrode overlaps with the protrusion when viewed in the vertical direction.

[0068] (6) A circuit module described in any of (1) to (5), wherein the insulating member has a third upper end surface and a third lower end surface aligned in the vertical direction, and a slope located between the third upper end surface and the third lower end surface in the vertical direction, the second electrode has an electrode portion extending in a first direction that is a direction including a downward component and different from the downward direction, the angle formed by the slope and the third lower end surface when viewed in a front-to-rear direction perpendicular to the vertical direction is greater than 0 degrees and less than 90 degrees, and the acute angle of the angle formed by the first direction and a left-right direction perpendicular to the vertical direction and the front-to-rear direction when viewed in the front-to-rear direction is greater than the angle formed by the slope and the third lower end surface and less than 90 degrees.

[0069] (7) The circuit module according to any one of (1) to (6), wherein the electronic component is an inductor.

[0070] (8) The circuit module according to any one of (1) to (7), wherein the insulating member is a resin.

[0071] 1, 1a, 1b: circuit module 2, 2a: circuit board 3, 3a: insulating member 4L, 4R: first electrode 4RE: electrode part 4RP: protruding part 4a: electrode 5: electronic component 5L, 5R: second electrode 6L, 6R: solder 6a: solder paste 7: adhesive member 21: circuit board body 22L, 22R, 22a: conductor 31LB, 31LF, 31RB, 31RF: Projection portion 51: Electronic component main body 52L1, 52R1: First electrode portion 52L2, 52R2: Second electrode portion A1: Area DIR1: First direction DIR2: Second direction S1, S3, S5: Upper end surface S2, S4, S6: Lower end surface S7: Upper main surface S8: Lower main surface S9: Slope SS1, SS2: Side surface aR: Recess θ1, θ2: Corner

Claims

1. A circuit module comprising: a circuit board including a circuit board body having a first upper end surface and a first lower end surface aligned in a vertical direction, and a conductor provided on the circuit board body; an insulating member arranged on the first upper end surface; a first electrode having a second upper end surface and a second lower end surface aligned in the vertical direction and a first side surface connected to the second upper end surface, the first electrode being electrically connected to the conductor; and an electronic component including an electronic component body and a second electrode, the electronic component being arranged on the insulating member; wherein the second upper end surface is covered by the insulating member, and the second electrode is electrically connected to the first electrode by at least a portion of the first side surface being exposed from the insulating member.

2. The circuit module according to claim 1, wherein the electronic component body overlaps with the first electrode when viewed in the up-down direction.

3. A circuit module as described in claim 1 or claim 2, wherein the electronic component body has upper and lower main surfaces aligned in the vertical direction, and a second side surface connecting the upper and lower main surfaces, the second electrode extending from at least a portion of the second side surface, and a lower end of the second electrode being located below the lower main surface.

4. A circuit module as described in any one of claims 1 to 3, further comprising an adhesive member, wherein the insulating member has a third upper end surface and a third lower end surface aligned in the vertical direction, the electronic component body has an upper main surface and a lower main surface aligned in the vertical direction, and the adhesive member is provided between the third upper end surface and the lower main surface.

5. A circuit module as described in any one of claims 1 to 4, wherein the first electrode includes a protrusion extending in a horizontal direction perpendicular to the vertical direction, the protrusion being located below the second upper end surface, and the second electrode overlaps with the protrusion when viewed in the vertical direction.

6. A circuit module as described in any of claims 1 to 5, wherein the insulating member has a third upper end surface and a third lower end surface aligned in the vertical direction, and a slope located between the third upper end surface and the third lower end surface in the vertical direction, the second electrode has an electrode portion extending in a first direction which is a direction which includes a downward component and is different from the downward direction, when viewed in a front-to-back direction perpendicular to the vertical direction, an angle formed by the slope and the third lower end surface is greater than 0 degrees and less than 90 degrees, and when viewed in the front-to-back direction, an acute angle among the angles formed by the first direction and a left-right direction perpendicular to the vertical direction and the front-to-back direction is greater than the angle formed by the slope and the third lower end surface and less than 90 degrees.

7. The circuit module according to any one of claims 1 to 6, wherein the electronic component is an inductor.

8. The circuit module according to any one of claims 1 to 7, wherein the insulating member is a resin.

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