Wiring circuit substrate, kit, and method for producing wiring circuit substrate

Abstract

A wiring circuit substrate (1) comprises a frame (2), a mounting part (3), and a joint (4). The mounting part (3) is surrounded by the frame (2). The mounting part (3) is separated from the frame (2) by a gap. The joint (4) couples the frame (2) and the mounting part (3). The joint (4) is separate from the frame (2) and / or the mounting part (3).

Description

Wired circuit board, kit, and method for manufacturing a wired circuit board

[0001] The present invention relates to a wired circuit board, a kit, and a method for manufacturing a wired circuit board.

[0002] A wired circuit board for mounting an imaging element is known (see, for example, Patent Document 1 below). The wired circuit board described in Patent Document 1 includes a frame, a mounting portion surrounded by the frame, and a support member connecting them. The support member is integrated with the frame and the mounting portion. In the wired circuit board described in Patent Document 1, the frame elastically supports the mounting portion via the support member.

[0003] Special Publication No. 2020-30306

[0004] The shape of the support member needs to be adapted to the application and purpose of the printed circuit board. However, if the support member is integrated with the frame and the mounting portion, it may be difficult to adapt the support member to the application and purpose, or the support member may be easily damaged. This may result in a problem of reduced reliability of the support member.

[0005] The present invention provides a wired circuit board having a joint suited to the application and purpose of the wired circuit board while improving the reliability of the joint, a method for manufacturing the same, and a kit.

[0006] The present invention [1] includes a wired circuit board comprising a frame, a mounting portion surrounded by the frame and spaced apart from the frame, and a joint connecting the frame and the mounting portion, the joint being separate from the frame and / or the mounting portion.

[0007] In this wired circuit board, the joint is separate from the frame and / or the mounting portion, so that the reliability of the joint is improved while providing a joint suited to the use and purpose of the wired circuit board.

[0008] The present invention [2] includes the wired circuit board according to [1], wherein each of the frame and the mounting portion includes a base insulating layer, a wiring layer arranged on one side of the base insulating layer in the thickness direction, and a cover insulating layer arranged on one side of the base insulating layer in the thickness direction, the cover insulating layer covering a part of the wiring layer, and may include a support layer arranged on the other side of the base insulating layer in the thickness direction, and the joint does not include the support layer, but includes a joint base layer, a joint wiring layer arranged on one side of the joint base layer in the thickness direction, and a joint cover layer arranged on one side of the joint base layer in the thickness direction, the joint cover layer covering a part of the joint wiring layer.

[0009] In this printed circuit board, the joint does not include a support layer, which reduces the rigidity of the joint, allowing the mounting portion to be corrected for vibration with a small force.

[0010] The present invention [3] includes the wired circuit board according to [1] or [2], further comprising a connector that connects the joint to the frame and / or the mounting portion.

[0011] In this wired circuit board, the joint and the frame and / or the mounting portion can be easily coupled and electrically connected via the connector.

[0012] The present invention [4] includes the wired circuit board according to [1] or [2], further comprising solder connecting the joint to the frame and / or the mounting portion.

[0013] In this wired circuit board, the joints can be easily joined to the frame and / or the mounting portion via solder, and electrical connection can be achieved.

[0014] The present invention [5] includes the wired circuit board according to [1] or [2], further comprising an anisotropic conductive film connecting the joint to the frame and / or the mounting portion.

[0015] In this wired circuit board, the joint and the frame and / or the mounting portion can be easily joined and electrically connected via the anisotropic conductive film.

[0016] The present invention [6] includes the wired circuit board according to any one of [1] to [5], wherein the mounting portion has a substantially rectangular shape and has a side at the outer periphery of the mounting portion, the frame has a substantially rectangular frame shape and has an opposing side facing the side and a non-opposing side adjacent to the opposing side and not facing the side, and the joint connects the side and the non-opposing side.

[0017] In this wired circuit board, the joint connects a side and a non-opposing side that does not face the side, so the joint can be made longer, thereby reducing the rigidity of the joint.

[0018] The present invention [7] includes the wired circuit board according to [2], wherein the joint wiring layer has a plurality of joint wirings spaced apart from each other, and the joint base layer and the joint cover layer in the joint have slits arranged between the plurality of joint wirings.

[0019] In this wired circuit board, the joint base layer and the joint cover layer have slits, so that the rigidity of the joint can be further reduced.

[0020] The present invention [8] includes the wired circuit board according to [7], wherein the slits extend along the plurality of joint wirings, and the joints are sub-joints that divide the slits in the direction in which the slits extend and that connect the plurality of joint wirings.

[0021] In this wired circuit board, the sub-joints can prevent the rigidity of the joints from being excessively reduced due to the slits, thereby preventing excessive deformation of the joints.

[0022] The present invention [9] includes the wired circuit board according to [7], wherein the joint includes a plurality of wiring body portions separated by the slits, and one of the wiring body portions includes at least two of the joint wirings.

[0023] The present invention

[10] includes the wired circuit board according to [9], wherein the slit extends along the plurality of wiring body portions, and the joint is a sub-joint that divides the slit in the direction in which the slit extends and connects the plurality of wiring body portions.

[0024] The present invention

[11] includes the wired circuit board according to any one of [1] to

[10] , wherein the joint has a curved shape.

[0025] In this wired circuit board, the joints have a curved shape, so they are less susceptible to damage and have superior joint reliability compared to embodiments having a straight and / or bent shape.

[0026] The present invention

[12] includes the wired circuit board according to [2], wherein the support layer is a metal supporting board.

[0027] In this wired circuit board, the support layer is a metal supporting board, and therefore the frame and the mounting portion each have excellent rigidity, so that the wired circuit board can reliably mount elements on the mounting portion while reliably supporting them with the frame.

[0028] The present invention

[13] includes the wired circuit board according to [2], wherein the support layer is a hard substrate.

[0029] In this wired circuit board, the support layer is a hard substrate, so the frame and the mounting portion each have excellent rigidity, allowing the wired circuit board to reliably mount elements on the mounting portion while reliably supporting them with the frame.

[0030] The present invention

[14] includes the wired circuit board according to [1], wherein each of the frame and the mounting portion includes a third base insulating layer, a third wiring layer arranged on one side of the third base insulating layer in the thickness direction, a third cover insulating layer arranged on one side of the third base insulating layer in the thickness direction and covering a part of the third wiring layer, a fourth wiring layer arranged on the other side of the third base insulating layer in the thickness direction, and a fourth cover insulating layer arranged on the other side of the third base insulating layer in the thickness direction and covering the fourth wiring layer, and may include a support layer arranged on the other side of the fourth cover insulating layer in the thickness direction, and the joint does not include the support layer, but includes the third base insulating layer, the third wiring layer, the third cover insulating layer, the fourth wiring layer, and the fourth cover insulating layer.

[0031] In this wired circuit board, the joint does not include a support layer. Therefore, the rigidity of the joint is reduced. More specifically, the joint includes a third base insulating layer, a third wiring layer, a third cover insulating layer, a fourth wiring layer, and a fourth cover insulating layer, and even if it is thick, it does not include a support layer, so the rigidity of the joint is reduced. As a result, the vibration of the mounting portion can be corrected with a small force.

[0032] The present invention

[15] includes a kit comprising: a mounting portion having a substantially rectangular shape and a side at its outer periphery; a frame having a substantially rectangular frame shape and having an opposing side facing the side and a non-opposing side adjacent to the opposing side and not facing the side; and a joint configured to connect the side and the non-opposing side to couple the frame and the mounting portion; wherein when the joint couples the frame and the mounting portion, the joint is separate from the frame and / or the mounting portion.

[0033] In this kit, the joints are separate from the frame and / or mounting portion, so that it is possible to manufacture a wired circuit board having joints that are suitable for the use and purpose of the wired circuit board, while also having joints with improved reliability.

[0034] The present invention

[16] includes a method for manufacturing a wired circuit board, comprising the steps of: (1) preparing the kit according to

[15] ; and (2) connecting the frame and the mounting portion with a joint such that the joint is separate from at least one member selected from the group consisting of a frame and a mounting portion.

[0035] In this method for manufacturing a wired circuit board, the joint is separate from the frame and / or the mounting portion, so that a wired circuit board having a joint can be manufactured.

[0036] The present invention

[17] includes the method for producing a wired circuit board according to

[16] , wherein in the step (2), the joint is connected to the member via at least one connecting member selected from the group consisting of a connector, a solder, and an anisotropic conductive film.

[0037] In this method for manufacturing a wired circuit board, in step (2), the joint is connected to the member via at least one connecting member selected from the group consisting of a connector, solder, and an anisotropic conductive film, so that the joint can be easily connected to the frame and / or mounting portion.

[0038] The wired circuit board produced by the production method of the present invention using the kit of the present invention has joints suited to the use and purpose of the wired circuit board, and the reliability of the joints is improved.

[0039] 11 is a plan view of one embodiment of the wired circuit board of the present invention. FIG. 12 is an enlarged view of the wired circuit board shown in FIG. 1. FIG. 13 is a cross-sectional view taken along line AA in FIG. 2. FIG. 14 is a cross-sectional view taken along line BB in FIG. 2. FIG. 5A and FIG. 5B are process diagrams for preparing a kit. FIG. 5A is a process for preparing a frame and a mounting portion. FIG. 5B is a process for attaching a connector to the frame and the mounting portion. FIG. 6A and FIG. 6B are manufacturing process diagrams for a first modified example. FIG. 6A is a process for placing solder on a second frame terminal. FIG. 6B is a process for connecting a joint and a frame by solder. FIG. 14 is a cross-sectional view of a second modified example. FIG. 15 is a cross-sectional view of a third modified example. FIG. 16 is a cross-sectional view of a fourth modified example. FIG. 17 is a cross-sectional view of a fifth modified example. FIG. 18 is a plan view of a sixth modified example. FIG. 19 is a cross-sectional view of a sixth modified example. FIG. 20 is a cross-sectional view of a seventh modified example.

[0040] 1. One Embodiment of the Wired Circuit Board One embodiment of the wired circuit board of the present invention will be described with reference to FIGS. 1 to 5B.

[0041] As shown in Fig. 1, the wired circuit board 1 has a sheet shape. As shown in Fig. 3, the wired circuit board 1 has a thickness. As shown in Fig. 1, the wired circuit board 1 extends in a planar direction. The planar direction is perpendicular to the thickness direction. The wired circuit board 1 includes a frame 2, a mounting portion 3, a joint 4, and connectors 5 and 6.

[0042] 1.1 Frame 2 In this embodiment, the frame 2 has a substantially rectangular frame shape. The frame 2 includes an inner peripheral edge 20. In this embodiment, the frame 2 has four sides 23A, 23B, 23C, and 23D at the inner peripheral edge 20. The four sides 23A, 23B, 23C, and 23D are arranged in counterclockwise order in a plan view. Sides 23A and 23C face each other. Side 23B connects one end of side 23A to one end of side 23C. Side 23D connects the other end of side 23A to the other end of side 23C. Sides 23B and 23D face each other.

[0043] As shown in FIG. 3 , the frame 2 includes a support layer 11 , a base insulating layer 12 , a wiring layer 13 , and a cover insulating layer 14 .

[0044] 1.1.1 Support Layer 11 of Frame 2 In the frame 2, the support layer 11 extends in the planar direction. The support layer 11 forms the other surface of the frame 2 in the thickness direction. In this embodiment, the support layer 11 is a metal supporting board 111.

[0045] The material of the support layer 11 in the frame 2 is, for example, a rigid material. Examples of the rigid material include stainless steel, 42 alloy, aluminum, copper-beryllium, phosphor bronze, copper, silver, nickel, chromium, titanium, tantalum, platinum, gold, and copper alloys. From the viewpoint of ensuring the strength of the frame 2 and the mounting portion 3, preferable rigid materials include stainless steel and copper alloys. The thickness of the support layer 11 in the frame 2 is, for example, 30 μm or more, preferably 100 μm or more, and for example, 10,000 μm or less, preferably 1,000 μm or less.

[0046] 1.1.2 Insulating Base Layer 12 of Frame 2 In the frame 2, the insulating base layer 12 is disposed on one surface of the support layer 11 in the thickness direction. The insulating base layer 12 is in contact with one surface of the support layer 11.

[0047] The insulating base layer 12 of the frame 2 is made of, for example, a resin, preferably a polyimide resin. The insulating base layer 12 of the frame 2 has a thickness of, for example, 1 μm or more, preferably 5 μm or more, and for example, 20 μm or less, preferably 15 μm or less.

[0048] 1.1.3 Wiring Layer 13 in Frame 2 In the frame 2, the wiring layer 13 is disposed on one surface of the insulating base layer 12 in the thickness direction. The wiring layer 13 contacts one surface of the insulating base layer 12. The wiring layer 13 includes a frame terminal 131 and a frame wire 132.

[0049] 1.1.3.1 Frame Terminal 131 As shown in FIG. 1, the frame terminal 131 is provided on the side 23A.

[0050] 1.1.3.2 Frame Wiring 132 The frame wiring 132 is electrically connected to the frame terminal 131. The frame wiring 132 extends from the frame terminal 131.

[0051] The wiring layer 13 in the frame 2 may be made of a conductor, for example. Preferably, the conductor is copper.

[0052] The thickness of the wiring layer 13 in the frame 2 is in the range of, for example, 1 μm or more, or preferably 5 μm or more, and for example, 50 μm or less, or preferably 35 μm or less.

[0053] 3 , in the frame 2, the cover insulating layer 14 is disposed on one surface of the base insulating layer 12 in the thickness direction. The cover insulating layer 14 covers the frame wiring 132, which is part of the wiring layer 13. The cover insulating layer 14 exposes the frame terminal 131, which is the remaining part of the wiring layer 13. The cover insulating layer 14 in the thickness direction may include an adhesion layer (adhesive layer) (not shown) disposed on the other surface.

[0054] The insulating cover layer 14 may be made of, for example, a resin, preferably a polyimide resin. The insulating cover layer 14 in the frame 2 has a thickness of, for example, 1 μm or more, preferably 5 μm or more, and for example, 150 μm or less, preferably 90 μm or less.

[0055] 1.1.5 Dimensions of Frame 2 As shown in FIG. 1 , the distance between sides 23A and 23C and the distance between sides 23B and 23D are each, for example, 5 mm or more, preferably 8 mm or more, and for example, 50 mm or less, preferably 30 mm or less. The length of each of sides 23A, 23B, 23C, and 23D is, for example, 5 mm or more, preferably 8 mm or more, and for example, 50 mm or less, preferably 30 mm or less. The width of frame 2 is, for example, 0.1 mm or more, preferably 0.3 mm or more, and for example, 50 mm or less, preferably 30 mm or less. The width of frame 2 is the length between inner peripheral edge 20 and outer peripheral edge.

[0056] 1.2 Mounting Section 3 The mounting section 3 is surrounded by the frame 2. The mounting section 3 is spaced apart from the frame 2. In this embodiment, the mounting section 3 has a substantially rectangular shape. Preferably, the mounting section 3 has a substantially rectangular outer shape, and more specifically, a substantially rectangular frame shape. The mounting section 3 includes an outer peripheral edge 30 and an inner peripheral edge 39. In this embodiment, the mounting section 3 includes four sides 33A, 33B, 33C, and 33D at the outer peripheral edge 30.

[0057] The four sides 33A, 33B, 33C, and 33D of the mounting portion 3 are arranged counterclockwise in this order in a plan view. The sides 33A, 33B, 33C, and 33D of the mounting portion 3 face the sides 23A, 23B, 23C, and 23D of the frame 2, respectively.

[0058] In other words, the side 33B of the mounting portion 3 faces (opposes) the side 23B of the frame 2. In other words, the side 23B is the opposing side to the side 33B. The side 33B extends in the same direction as the side 23B.

[0059] The side 33B of the mounting portion 3 does not face (oppose) the side 23A of the frame 2. In other words, the side 23A is a non-opposing side to the side 33B. The side 33B is adjacent to the side 33A. The side 33B extends in a direction intersecting the side 23A. Preferably, the side 33B extends in a direction perpendicular to the side 23A.

[0060] Side 33C extends in the same direction as side 33A. Side 33B connects one end of side 33A to one end of side 33C. Side 33D connects the other end of side 33A to the other end of side 33C. Side 33D extends in the same direction as side 33B.

[0061] As shown in FIG. 3 , the mounting portion 3 includes a support layer 11 , a base insulating layer 12 , a wiring layer 13 , and a cover insulating layer 14 .

[0062] 1.2.1 Support Layer 11 in Mounting Portion 3 In the mounting portion 3, the support layer 11 extends in the planar direction. The support layer 11 forms the other surface of the mounting portion 3 in the thickness direction. The material and thickness of the support layer 11 in the mounting portion 3 are the same as the material and thickness of the support layer 11 in the frame 2. In this embodiment, the support layer 11 is a metal supporting board 111.

[0063] 1.2.2 Insulating base layer 12 in mounting portion 3 In the mounting portion 3, the insulating base layer 12 is disposed on one surface of the support layer 11 in the thickness direction. The insulating base layer 12 is in contact with one surface of the support layer 11. The material and thickness of the insulating base layer 12 in the mounting portion 3 are the same as those of the insulating base layer 12 in the frame 2.

[0064] 1.2.3 Wiring Layer 13 in Mounting Portion 3 In the mounting portion 3, the wiring layer 13 is disposed on one surface of the insulating base layer 12 in the thickness direction. The wiring layer 13 contacts one surface of the insulating base layer 12. As shown in FIG. 2 , the wiring layer 13 in the mounting portion 3 includes a terminal 133 and a plurality of wires 134.

[0065] 1.2.3.1 Terminals 133 As shown in FIG. 1, the terminals 133 are provided corresponding to the four sides 33A, 33B, 33C, and 33D, respectively.

[0066] 2, the wiring 134 is electrically connected to the terminal 133. The wiring 134 extends from the terminal 133.

[0067] 1.2.4 Cover insulating layer 14 in mounting portion 3 As shown in Fig. 3 , in the mounting portion 3, the cover insulating layer 14 is disposed on one surface of the base insulating layer 12 in the thickness direction. The cover insulating layer 14 covers the wiring 134 (see Fig. 2 ), which is part of the wiring layer 13. The cover insulating layer 14 exposes the terminal 133 (see Fig. 2 ), which is the remaining part of the wiring layer 13. The cover insulating layer 14 in the thickness direction may include an adhesion layer (not shown) disposed on the other surface.

[0068] 1, the distance between sides 33A and 33C and the distance between sides 33B and 33D are each, for example, 3 mm or more, preferably 5 mm or more, and for example, 50 mm or less, preferably 30 mm or less. The length of each of sides 33A, 33B, 33C, and 33D is, for example, 3 mm or more, preferably 5 mm or more, and for example, 50 mm or less, preferably 30 mm or less.

[0069] The width of the mounting portion 3 is, for example, 0.3 mm or more, preferably 0.5 mm or more, and for example, 30 mm or less, preferably 20 mm or less. The width of the mounting portion 3 is the length between the outer peripheral edge 30 and the inner peripheral edge 39.

[0070] 1.3 Joint 4 In this embodiment, the joint 4 is separate from the frame 2 and the mounting portion 3. Specifically, the joint 4 is prepared separately from the frame 2 and the mounting portion 3. The joint 4 bridges from the frame 2 to the mounting portion 3.

[0071] The joint 4 and the frame 2 being separate means that any layer of the joint 4 is not continuous with any layer of the frame 2, and all layers of the joint 4 have edges on the frame 2 side.

[0072] The joint 4 and the mounting portion 3 being separate means that any layer of the joint 4 is not continuous with any layer of the frame 2, and all layers of the joint 4 on the mounting portion 3 side have edges.

[0073] The joint 4 is flexible.

[0074] The multiple joints 4A, 4B, 4C, and 4D correspond to the multiple sides 23A, 23B, 23C, and 23D of the frame 2, respectively. The multiple joints 4A, 4B, 4C, and 4D correspond to the multiple sides 33B, 33C, 33D, and 33A of the mounting unit 3, respectively. Specifically, joint 4A connects side 23A of the frame 2 to side 33B of the mounting unit 3. Joint 4B connects side 23B of the frame 2 to side 33C of the mounting unit 3. Joint 4C connects side 23C of the frame 2 to side 33D of the mounting unit 3. Joint 4D connects side 23D of the frame 2 to side 33A of the mounting unit 3.

[0075] 1.3.1 Shape of the Joints 4 As shown in FIG. 2 , in this embodiment, each of the joints 4 has a curved shape in a plan view. Preferably, each of the joints 4 does not have a linear shape and / or a bent shape, but has only a curved shape. Specifically, each of the joints 4 has an S-shape or a hook shape. In this embodiment, the joints 4A, 4B, 4C, and 4D preferably have the same shape as each other, and more preferably have the same dimensions. The dimensions include length and width.

[0076] 1.3.2 Layer Configuration of Joint 4 As shown in Fig. 4, the joint 4 includes a joint base layer 41, a joint wiring layer 42, and a joint cover layer 43. The joint 4 preferably includes only the joint base layer 41, the joint wiring layer 42, and the joint cover layer 43. The joint 4 does not include a support layer 11. The joint 4 also does not include an adhesive layer.

[0077] 1.3.2.1 Joint Base Layer 41 The joint base layer 41 forms the other surface of the joint 4A in the thickness direction. The joint base layer 41 is exposed toward the other side in the thickness direction. The material of the joint base layer 41 may be the same as or different from the material of the base insulating layer 12 of the frame 2. The material of the joint base layer 41 is preferably the same as the material of the base insulating layer 12. The thickness of the joint base layer 41 may be the same as or different from the thickness of the base insulating layer 12. The thickness of the joint base layer 41 is, for example, 1 μm or more, preferably 5 μm or more, and for example, 20 μm or less, preferably 15 μm or less.

[0078] 1.3.2.2 Joint Wiring Layer 42 The joint wiring layer 42 is disposed on one surface of the joint base layer 41 in the thickness direction. The joint wiring layer 42 is in contact with one surface of the joint base layer 41. The joint wiring layer 42 includes a joint wire 421 and a joint terminal 422.

[0079] 1.3.2.3 Joint Wiring 421 A plurality of joint wirings 421 are arranged at intervals in a direction intersecting (intersecting direction, preferably orthogonal direction) the direction in which the joint 4 extends. The joint wiring 421 is arranged in the middle of the joint 4 in the direction in which the joint 4 extends. The joint wiring 421 includes signal lines 4211A, 4211B, 4212A, 4212B, 4213A, and 4213B, and ground lines 4214 and 4215.

[0080] 1.3.2.4 Signal Lines 4211A, 4211B, 4212A, 4212B, 4213A, 4213B The signal lines 4211A, 4211B, 4212A, 4212B, 4213A, and 4213B are arranged in this order in the intersecting direction. The signal lines 4211A, 4211B, 4212A, 4212B, 4213A, and 4213B are spaced apart from one another in the intersecting direction. The signal lines 4211A and 4211B function as differential wiring. The functions of the signal lines 4212A and 4212B and the signal lines 4213A and 4213B are similar to those of the signal lines 4211A and 4211B, respectively.

[0081] 1.3.2.5 Ground Lines 4214 and 4215 The ground lines 4214 and 4215 are spaced apart from each other in the intersecting direction. In this embodiment, the ground lines 4214 and 4215 are arranged outside the signal lines 4211A, 4211B, 4212A, 4212B, 4213A, and 4213B in the intersecting direction.

[0082] 1.3.3 Joint Terminal 422 The joint terminal 422 includes a first terminal 4221 and a second terminal 4222. The first terminal 4221 is disposed at one end of the joint 4 in the extension direction of the joint 4. The first terminal 4221 extends to one side from one end edge of the joint wire 421 in the extension direction of the joint 4. As shown in FIG. 2 , a plurality of first terminals 4221 are provided corresponding to the plurality of joint wires 421.

[0083] The second terminal 4222 is disposed at the other end of the joint 4 in the extension direction of the joint 4. The second terminal 4222 extends from the other end edge of the joint wire 421 to the other side in the extension direction of the joint 4. A plurality of second terminals 4222 are provided corresponding to the plurality of joint wires 421.

[0084] The material of the joint wiring layer 42 may be the same as or different from the material of the wiring layer 13 in the frame 2. The material of the joint wiring layer 42 is preferably the same as the material of the wiring layer 13 in the frame 2. The thickness of the joint wiring layer 42 may be the same as or different from the thickness of the wiring layer 13. The thickness of the joint wiring layer 42 is, for example, 1 μm or more, preferably 5 μm or more, and for example, 50 μm or less, preferably 35 μm or less.

[0085] 1.3.4 Joint Cover Layer 43 As shown in FIG. 4 , the joint cover layer 43 forms one surface of the joint 4 in the thickness direction. The joint cover layer 43 is exposed toward one side in the thickness direction. The joint cover layer 43 is disposed on one surface of the joint base layer 41 in the thickness direction. The joint cover layer 43 covers the joint wiring 421, which is part of the joint wiring layer 42, and exposes the joint terminal 422, which is the remaining part of the joint wiring layer 42. The material of the joint cover layer 43 may be the same as or different from the material of the cover insulating layer 14 in the frame 2. The material of the joint cover layer 43 is preferably the same as the material of the cover insulating layer 14. The thickness of the joint cover layer 43 may be the same as or different from the thickness of the cover insulating layer 14.

[0086] Each of the joints 4 includes a slit 44 , a wiring body 45 , and a ground wiring body 46 .

[0087] 1.3.5 Slits 44 As shown in FIG. 2 , the slits 44 are arranged in the middle of the joint 4 in the direction in which the joint 4 extends. The slits 44 are arranged between the multiple joint wires 421. Note that the slits 44 are not arranged between the multiple first terminals 4221. The slits 44 are not arranged between the multiple second terminals 4222. As shown in FIG. 3 , the slits 44 penetrate the joint base layer 41 and the joint cover layer 43 in the thickness direction. In other words, the slits 44 are formed in the joint base layer 41 and the joint cover layer 43. The inner surfaces of the joint cover layer 43 that separate the slits 44 are flush with the inner surfaces of the joint base layer 41 that separate the slits 44. The multiple slits 44 include slits 441, 442, 443, and 444. The slits 441, 442, 443, and 444 are arranged in this order in the cross direction. The width of each of the slits 44 is, for example, 5 μm or more, or preferably 10 μm or more, and for example, 500 μm or less, or preferably 300 μm or less.

[0088] 1.3.6 Wiring Body 45 The wiring body 45 is divided by a slit 44. In this embodiment, the wiring body 45 is disposed in the middle of the joint 4 in the cross direction. The multiple wiring body 45 include wiring body 451, 452, and 453. The wiring body 451 includes a joint base layer 41, signal lines 4211A and 4211B, and a joint cover layer 43. The wiring body 452 includes a joint base layer 41, signal lines 4212A and 4212B, and a joint cover layer 43. The wiring body 453 includes a joint base layer 41, signal lines 4213A and 4213B, and a joint cover layer 43.

[0089] 1.3.7 Ground Wiring Body 46 The ground wiring body 46 is divided by the slits 44. In this embodiment, the ground wiring body 46 is disposed at both ends of the joint 4 in the intersecting direction. The multiple ground wiring bodies 46 include ground wiring bodies 461 and 462.

[0090] In this embodiment, the ground wiring body 461 is spaced apart in the cross direction on one side of the wiring body 45. The ground wiring body 461 includes a joint base layer 41, a ground line 4214, and a joint cover layer 43.

[0091] In this embodiment, the ground wiring body 462 is spaced apart in the intersecting direction on the other side of the wiring body 45. The ground wiring body 462 includes a joint base layer 41, a ground line 4215, and a joint cover layer 43.

[0092] 1.4 Connectors 5 As shown in FIG. 1, the connectors 5 are arranged on the frame 2. A plurality of connectors 5 are provided on four sides 23A, 23B, 23C, and 23D. The plurality of connectors 5 include connectors 5A, 5B, 5C, and 5D. The connectors 5A, 5B, 5C, and 5D are arranged on the sides 23A, 23B, 23C, and 23D, respectively. The connector 5A will be described in detail below. The connectors 5B, 5C, and 5D have the same configuration as the connector 5A, and their description will be omitted.

[0093] As shown in Fig. 1, the connector 5A is disposed at the center of the side 23A in the direction in which the side 23A extends. The connector 5A is disposed at the middle of the side 23A in the orthogonal direction. The orthogonal direction is the direction in which the side 23A extends. As shown in Fig. 4, the connector 5A is disposed on one side of the support layer 11 in the thickness direction. Specifically, the connector 5A is disposed on one surface of the base insulating layer 12 in the thickness direction. The other surface of the connector 5A in the thickness direction is fixed to one surface of the frame 2 in the thickness direction.

[0094] The connector 5A has a recess 51A. The recess 51A includes a connector terminal. The connector terminal is electrically connected to the wiring layer 13 of the frame 2. Specifically, the connector terminal is electrically connected to the frame wiring 132 (see FIG. 2). When the first terminal 4221 of the joint 4 contacts the connector terminal, the joint wiring layer 42 of the joint 4 and the wiring layer 13 of the frame 2 (see FIG. 3) are electrically connected via the connector terminal. The recess 51A is configured so that one end of the joint 4A can be inserted and fixed. In this embodiment, the connector 5A is a ZIF connector. The recess 51A faces the mounting portion 3. Specifically, as shown in FIG. 1, the recess 51A faces the side 33A of the mounting portion 3.

[0095] 1.5 Connector 6 The connector 6 is arranged on the mounting portion 3. The multiple connectors 6 are provided on the four sides 33A, 33B, 33C, and 33D. Each of the multiple connectors 6 corresponds to each of the multiple connectors 5. The multiple connectors 6 include connectors 6A, 6B, 6C, and 6D. Each of the connectors 6A, 6B, 6C, and 6D is arranged on each of the sides 33A, 33B, 33C, and 33D. Connector 6B will be described in detail below. Connectors 6A, 6C, and 6D have the same configuration as connector 6B, and their description will be omitted.

[0096] The connector 6B is disposed at the center of the side 33B in the direction in which the side 33B extends. As shown in Fig. 4, the connector 6B is disposed on one side of the support layer 11 in the thickness direction. Specifically, the connector 6B is disposed on one surface of the insulating base layer 12 in the thickness direction. The other surface of the connector 6B in the thickness direction is fixed to one surface of the mounting portion 3 in the thickness direction.

[0097] The connector 6B has a recess 61B. The recess 61B includes a connector terminal. The connector terminal is electrically connected to the wiring layer 13 of the mounting portion 3. Specifically, the connector terminal is electrically connected to the wiring 134 (see FIG. 2). When the second terminal 4222 of the joint 4 contacts the connector terminal, the joint wiring layer 421 of the joint 4 and the wiring layer 13 of the mounting portion 3 (see FIG. 3) are electrically connected via the connector terminal. The recess 61B is configured so that the other end of the joint 4A can be inserted therein to fix the other end of the joint 4A. In this embodiment, the connector 6B is a ZIF connector. The recess 61B faces the frame 2. Specifically, as shown in FIG. 1, the recess 61B faces the side 23B of the frame 2.

[0098] 1.6 Manufacturing Method of Wired Circuit Board 1 A manufacturing method of the wired circuit board 1 and the mounting of the imaging element 8 will be described with reference to FIGS.

[0099] The method for manufacturing the wired circuit board 1 includes steps (1) and (2). Steps (1) and (2) are performed in this order.

[0100] 1.6.1 Step (1) As shown in FIG. 5B, in step (1), a kit 7 is prepared.

[0101] The kit 7 includes the frame 2, the mounting portion 3, and the joint 4 described above. Specifically, the kit 7 includes the frame 2, the mounting portion 3, and the joint 4, which are separated from each other. In the kit 7, when the joint 4 connects the frame 2 and the mounting portion 3, the joint 4 becomes a separate entity from the frame 2 and the mounting portion 3. In other words, in step (1), the joint 4 has not yet connected the frame 2 and the mounting portion 3 to the joint 4. Specifically, one end of the joint 4 has not yet been inserted into and fixed to the connector 5 of the frame 2. The other end of the joint 4 has not yet been inserted into and fixed to the connector 6 of the mounting portion 3.

[0102] 5A , for example, the insulating base layer 12, the wiring layer 13, and the insulating cover layer 14 are sequentially formed on one surface of a metal plate in the thickness direction. The insulating base layer 12 and the insulating cover layer 14 are formed by photoprocessing a photosensitive resin. The wiring layer 13 is formed by, for example, an additive method or a subtractive method.

[0103] Thereafter, the metal plate is processed to form the support layer 11. The processing is performed by, for example, etching.

[0104] In this manner, the frame 2 and the mounting portion 3 are prepared. In this embodiment, the frame 2 and the mounting portion 3 are prepared in a separated state.

[0105] 1.6.1.2 Preparation of Joint 4 For example, a joint wiring layer 42 and a joint cover layer 43 are formed in this order on one surface of the joint base layer 41. For example, an additive method or a subtractive method is used to form the joint wiring layer 42. For example, photoprocessing of a photosensitive resin is used to form the joint cover layer 43.

[0106] Thereafter, the slits 44 are formed in the joint base layer 41 and the joint cover layer 43. The slits 44 are formed by, for example, laser processing. In this way, the joint 4 is prepared.

[0107] 5B, the connector 5 is attached to the frame 2. The connector 6 is attached to the mounting portion 3. In this way, the kit 7 is prepared.

[0108] 1.6.2 Step (2) As shown by the arrows in FIG. 5 and FIG. 4, in step (2), the frame 2 and the mounting portion 3 are connected by the joint 4.

[0109] Specifically, one end of the joint 4 is inserted into the recess 51A of the connector 5. The other end of the joint 4 is inserted into the recess 61B of the connector 6.

[0110] Then, the first terminal 4221 comes into contact with the connector terminal of the connector 5. The second terminal 4222 comes into contact with the connector terminal of the connector 6.

[0111] One end of the joint 4 is fixed to a connector 5. The other end of the joint 4 is fixed to a connector 6.

[0112] As a result, the joint 4 connects the frame 2 and the mounting portion 3 so that the joint 4 is separate from the frame 2 and the mounting portion 3 .

[0113] In this way, the wired circuit board 1 is manufactured.

[0114] 3, the imaging element 8 is mounted on the mounting portion 3. The electrodes 81 of the imaging element 8 are electrically connected to the terminals 133 on the mounting portion 3. The imaging element 8 can be mounted on the mounting portion 3 via a mounting board (not shown).

[0115] At the same time, the external substrate 9 is mounted on the frame 2. The electrodes 91 of the external substrate 9 are electrically connected to the frame terminals 131 of the frame 2. The outer edges 24 of the frame 2 (see FIG. 1 ) may be supported by an external member (not shown).

[0116] 2. Effects of the First Embodiment As shown in FIG. 4, in this wired circuit board 1, the joint 4 is separate from the frame 2 and the mounting portion 3, so that the reliability of the joint 4 is improved.

[0117] For example, in order to improve the accuracy of shake correction of the mounting portion 3, the joint 4 may be made thinner and longer and formed integrally with the frame 2 and the mounting portion 3. By making the joint 4 longer, the repulsive force of the joint 4 can be increased. However, in this case, forming the joint 4 itself is difficult, and even if the joint 4 can be formed, the formed joint 4 is prone to damage.

[0118] However, in this wired circuit board 1, the joint 4 is separate from the frame 2 and the mounting portion 3, so that the joint 4 can be reliably formed and damage to the joint 4 can be suppressed, thereby improving the reliability of the joint 4.

[0119] In this wired circuit board 1, the joint 4 does not include the support layer 11. This reduces the rigidity of the joint 4. As a result, the vibration of the mounting portion 3 can be corrected with a small force.

[0120] When the frame 2 moves (vibrates), the mounting part 3 shakes (vibrates). However, the joint 4 corrects the above-mentioned shaking (vibration) of the mounting part 3. The above-mentioned correction is called shake correction (shake correction).

[0121] In this wired circuit board 1, the joint 4 can be lengthened and connected to the frame 2 and the mounting portion 3 via the connectors 5 and 6. This increases the repulsive force of the joint 4. As a result, the accuracy of vibration correction can be improved.

[0122] In this wired circuit board 1, the support layer 11 is the metal supporting board 111, and therefore the frame 2 and the mounting portion 3 each have excellent rigidity. Therefore, the wired circuit board 1 can reliably mount the imaging element 8 on the mounting portion 3 while reliably supporting it with the frame 2.

[0123] In this wired circuit board 1, joint 4A can be made longer because it connects side 33B to side 23A, which is a non-facing side that does not face side 33B. This increases the repulsive force of joint 4A and improves the accuracy of vibration correction.

[0124] In this wired circuit board 1, the joints 4A have a curved shape, and therefore are less susceptible to damage and have excellent reliability compared to joints 4A having a straight and / or bent shape.

[0125] In this wired circuit board 1, the joint base layer 41 and the joint cover layer 43 in the joint 4 have the slits 44, so that the rigidity of the joint 4 can be further reduced.

[0126] 3. Modifications In the following modifications, the same components and steps as those in the above-described embodiment are denoted by the same reference numerals, and detailed descriptions thereof will be omitted. Furthermore, each modification can achieve the same effects as those in the first embodiment unless otherwise specified. Furthermore, the first embodiment and its modifications can be combined as appropriate.

[0127] 3.1 First Modification As shown in FIG. 6B, the connectors 5 and 6 may be replaced with solder 51.

[0128] To connect one end of the joint 4 to the frame 2 with the solder 51, for example, as shown in Fig. 6A , the solder 51 is disposed on one surface of the second frame terminal 135 in the thickness direction. The second frame terminal 135 is included in the wiring layer 13. The second frame terminal 135 is disposed on the opposite side of the frame wiring 132 from the frame terminal 131.

[0129] Thereafter, the solder 51 is melted, and the first terminal 4221 of the joint 4 is brought into contact with the solder 51. The joint 4 and the frame 2 are electrically connected by the solder 51. The solder 51 connects the joint 4 and the frame 2.

[0130] The mounting portion 3 is also connected to the joint 4 by solder 51 in the same manner as above.

[0131] In the first modified example, the joint 4 can be lengthened and connected to the frame 2 and the mounting portion 3 via the solder 51. This increases the repulsive force of the joint 4. As a result, the accuracy of shake correction can be improved.

[0132] 3.2 Second Modification As shown in FIG. 7, the connectors 5 and 6 may be replaced with an anisotropic conductive film 52.

[0133] The anisotropic conductive film 52 extends in the planar direction. The anisotropic conductive film 52 has conductivity in the thickness direction. The anisotropic conductive film 52 is in contact with the second frame terminal 135 and the first terminal 4221.

[0134] In the second modification, the joint 4 can be lengthened and connected to the frame 2 and the mounting portion 3 via the anisotropic conductive film 52. This increases the repulsive force of the joint 4. As a result, the accuracy of vibration correction can be improved.

[0135] 3.3 Third Modification As shown in FIG. 8 , in a third modification, the support layer 11 may be a rigid substrate 112. The rigid substrate 112 is adhered to the lower surface of the insulating base layer 12 in the thickness direction via an adhesive layer 113. The rigid substrate 112 includes a second insulating base layer 114 and a second wiring layer 115, arranged in this order toward the other side in the thickness direction. The second insulating base layer 114 is rigid. Examples of materials for the second insulating base layer 114 include glass-epoxy resin. The rigid substrate 112 may further include a second insulating cover layer.

[0136] 9, the joint 4 may be integral with the frame 2. In the fourth modification, the joint 4 is separate from the mounting portion 3.

[0137] The frame 2 and the joint 4 are continuous. Specifically, the base insulating layer 12 in the frame 2 and the joint base layer 41 in the joint 4 are continuous. The wiring layer 13 in the frame 2 and the joint wiring layer 42 in the joint 4 are continuous. The cover insulating layer 14 in the frame 2 and the joint cover layer 43 in the joint 4 are continuous.

[0138] 10, the joint 4 may be integral with the mounting portion 3. In the fifth modification, the joint 4 is separate from the frame 2.

[0139] The mounting portion 3 and the joint 4 are continuous. Specifically, the base insulating layer 12 in the mounting portion 3 and the joint base layer 41 in the joint 4 are continuous. The wiring layer 13 in the mounting portion 3 and the joint wiring layer 42 in the joint 4 are continuous. The cover insulating layer 14 in the mounting portion 3 and the joint cover layer 43 in the joint 4 are continuous.

[0140] 3.6 Sixth Modification As shown in FIGS. 11 and 12, in the sixth modification, the joint 4 includes sub-joints 4711, 4712, 4721, 4722, 4731, 4732, 4741, and 4742.

[0141] Each of the subjoints 4711 and 4712 divides the slit 411 in the extension direction of the slit 411. The subjoints 4711 and 4712 are spaced apart in the extension direction of the slit 411. The subjoints 4721, 4722, 4731, 4732, 4741, and 4742 have the same configuration as the subjoints 4711 and 4712.

[0142] As shown in Fig. 12, the sub-joints 4711, 4721, 4731, and 4741 are aligned in a direction intersecting (intersecting, preferably perpendicular to) the extension direction of the joint 4. As shown in Fig. 11, the sub-joints 4712, 4722, 4732, and 4742 are aligned in a direction intersecting (intersecting, preferably perpendicular to) the extension direction of the joint 4.

[0143] The subjoints 4711 and 4712 connect the wiring body 451 and the ground wiring body 461 and 462. The subjoints 4721 and 4722 connect the wiring body 451 and 452. The subjoints 4731 and 4732 connect the wiring body 452 and 453. The subjoints 4741 and 4742 connect the wiring body 453 and the ground wiring body 462.

[0144] Furthermore, subjoints 4711 and 4712 connect signal line 4211A and ground line 4214. Subjoints 4721 and 4722 connect signal lines 4211B and 4212A. Subjoints 4731 and 4732 connect signal lines 4212B and 4213A. Subjoints 4741 and 4742 connect signal line 4213A and ground line 4215.

[0145] The sub-joints 4711 , 4712 , 4721 , 4722 , 4731 , 4732 , 4741 , and 4742 include a joint base layer 41 and a joint cover layer 43 .

[0146] According to the sixth modified example, the sub-joints 4711, 4712, 4721, 4722, 4731, 4732, 4741, and 4742 can prevent the rigidity of the joint 4 from being excessively reduced due to the slits 44. Therefore, excessive deformation of the joint 4 can be prevented.

[0147] 13 , in the seventh modification, the frame 2 and the mounting portion 3 each include a third insulating base layer 15, a third wiring layer 16, a third insulating cover layer 17, a fourth wiring layer 18, a fourth insulating cover layer 19, and a support layer 11. The joint 4 does not include the support layer 11, but includes the third insulating base layer 15, the third wiring layer 16, the third insulating cover layer 17, the fourth wiring layer 18, and the fourth insulating cover layer 19.

[0148] The third insulating base layer 15 extends in the planar direction. The shape, material, and thickness of the third insulating base layer 15 may be the same as those of the insulating base layer 12 of the embodiment. The third insulating base layer 15 in the frame 2 and the mounting portion 3 has through holes 151.

[0149] The third wiring layer 16 is disposed on one surface of the third insulating base layer 15 in the thickness direction. The third wiring layer 16 includes a third wire 161. The third wiring layer 16 in the frame 2 and the mounting portion 3 includes a third terminal 162. The third terminal 162 includes a protective layer 163 on one surface in the thickness direction.

[0150] The third insulating cover layer 17 is disposed on one surface in the thickness direction of the third insulating base layer 15. The third insulating cover layer 17 covers the third wiring 161 that is part of the third wiring layer 16. The third insulating cover layer 17 may include an adhesive layer 171 on the other surface in the thickness direction.

[0151] The fourth wiring layer 18 is disposed on the other surface of the third insulating base layer 15 in the thickness direction. The fourth wiring layer 18 includes a fourth wire 181. The fourth wiring layer 18 in the frame 2 and the mounting portion 3 includes a fourth terminal 182. The fourth terminal 182 is electrically connected to the third terminal 162 via a conductive connecting portion 164. The conductive connecting portion 164 is filled in the through hole 151.

[0152] The fourth cover insulating layer 19 is disposed on the other surface of the third base insulating layer 15 in the thickness direction. The fourth cover insulating layer 19 covers the fourth wiring layer 18. The fourth cover insulating layer 19 may include an adhesive layer 191 on one surface in the thickness direction. The fourth cover insulating layer 19 has a through hole 192.

[0153] The support layer 11 in the frame 2 and the mounting portion 3 is disposed on the other side of the fourth insulating cover layer 19 in the thickness direction. The support layer 11 is adhered to the other surface of the fourth insulating cover layer 19 via an adhesive layer 111. The adhesive layer 111 is, for example, conductive. The adhesive layer 111 is disposed on the other surface of the fourth insulating cover layer 19 in the thickness direction. A portion of the adhesive layer 111 fills the through-hole 192. The joint 4 does not include the adhesive layer 111.

[0154] 3.7.1 Effects of the Seventh Modification In this wired circuit board 1, the joint 4 does not include the support layer 11. Therefore, the rigidity of the joint 4 is reduced. More specifically, the joint 4 includes the third base insulating layer 15, the third wiring layer 16, the third cover insulating layer 17, the fourth wiring layer 18, and the fourth cover insulating layer 19, and although it is thick, it does not include the support layer 11, so the rigidity of the joint 4 is reduced. As a result, the vibration of the mounting portion 3 can be corrected with a small force.

[0155] 3.8 Other Modifications The connectors 5 and 6 may be BtoB connectors (board-to-board connectors).

[0156] In step (1), the kit 7 is manufactured in a state in which the frame 2 and the mounting portion 3 are connected by a second joint (not shown), and then in step (2), the frame 2 and the mounting portion 3 are further connected by a joint 4, and then the second joint may be cut.

[0157] The above invention is provided as an exemplary embodiment of the present invention, but this is merely an example and should not be interpreted as limiting. Modifications of the present invention that are obvious to those skilled in the art are intended to be included in the scope of the following claims.

[0158] The wired circuit board, the kit, and the method for manufacturing the wired circuit board of the present invention are suitably used, for example, in the manufacture of an imaging device.

[0159] REFERENCE SIGNS LIST 1 Wired circuit board 11 Support layer 111 Metal supporting board 112 Hard board 12 Base insulating layer 13 Wiring layer 14 Cover insulating layer 15 Third base insulating layer 16 Third wiring layer 17 Third cover insulating layer 18 Fourth wiring layer 19 Fourth cover insulating layer 2 Frame 23A, 23B, 23C, 23D Side 3 Mounting portion 33A, 33B, 33C, 33D Side 4, 4A, 4B, 4C, 4D Joint 41 Joint base layer 42 Joint wiring layer 43 Joint cover layer 44 Slit 45 Wiring body portion 46 Ground wiring body portion 4711, 4712, 4712, 4721, 4722, 4731, 4732 Sub-joint 5, 5A, 5B, 5C, 5D, 6, 6A, 6B, 6C, 6D Connector 51 Solder 52 Anisotropic conductive film 7 Kit

Claims

1. A wired circuit board comprising: a frame; a mounting portion surrounded by the frame and spaced apart from the frame; and a joint connecting the frame and the mounting portion, the joint being separate from the frame and / or the mounting portion.

2. The wired circuit board according to claim 1, wherein each of the frame and the mounting portion includes a base insulating layer, a wiring layer arranged on one side of the base insulating layer in the thickness direction, and a cover insulating layer arranged on one side of the base insulating layer in the thickness direction, the cover insulating layer covering a part of the wiring layer, and may include a support layer arranged on the other side of the base insulating layer in the thickness direction, and the joint includes a joint base layer, a joint wiring layer arranged on one side of the joint base layer in the thickness direction, and a joint cover layer arranged on one side of the joint base layer in the thickness direction, the joint cover layer covering a part of the joint wiring layer.

3. The wired circuit board according to claim 1 or 2, further comprising a connector for connecting said joint to said frame and / or said mounting portion.

4. The wired circuit board according to claim 1 or 2, further comprising solder connecting said joint to said frame and / or said mounting portion.

5. The wired circuit board according to claim 1 or 2, further comprising an anisotropic conductive film connecting said joint to said frame and / or said mounting portion.

6. The wired circuit board according to claim 1 or 2, wherein the mounting portion has a generally rectangular shape and has a side at the outer periphery of the mounting portion, the frame has a generally rectangular frame shape and has an opposing side facing the side and a non-opposing side adjacent to the opposing side and not facing the side, and the joint connects the side and the non-opposing side.

7. The wired circuit board according to claim 2, wherein the joint wiring layer has a plurality of joint wirings spaced apart from one another, and the joint base layer and the joint cover layer at the joint have slits disposed between the plurality of joint wirings.

8. The wired circuit board according to claim 7, wherein the slit extends along the plurality of joint wirings, and the joint has a sub-joint that divides the slit in the direction in which the slit extends and connects the plurality of joint wirings.

9. The wired circuit board according to claim 7, wherein the joint includes a plurality of wiring body parts separated by the slits, and one of the wiring body parts includes at least two of the joint wirings.

10. The wired circuit board according to claim 9, wherein the slit extends along the plurality of wiring body portions, and the joint has a sub-joint that divides the slit in the direction in which the slit extends and connects the plurality of wiring body portions.

11. The printed circuit board according to claim 1 or 2, wherein the joint has a curved shape.

12. The wired circuit board according to claim 2, wherein the support layer is a metal supporting board.

13. The printed circuit board according to claim 2, wherein the support layer is a rigid substrate.

14. The wired circuit board of claim 1, wherein each of the frame and the mounting portion includes a third base insulating layer, a third wiring layer arranged on one side of the third base insulating layer in the thickness direction, a third cover insulating layer arranged on one side of the third base insulating layer in the thickness direction, the third cover insulating layer covering a part of the third wiring layer, a fourth wiring layer arranged on the other side of the third base insulating layer in the thickness direction, and a fourth cover insulating layer arranged on the other side of the third base insulating layer in the thickness direction, the fourth cover insulating layer covering the fourth wiring layer, and may include a support layer arranged on the other side of the fourth cover insulating layer in the thickness direction, and the joint does not include the support layer, and includes the third base insulating layer, the third wiring layer, the third cover insulating layer, the fourth wiring layer, and the fourth cover insulating layer.

15. A kit comprising: a mounting portion having a generally rectangular shape and a side on its outer periphery; a frame having a generally rectangular frame shape and having an opposing side facing the side and a non-opposing side adjacent to the opposing side and not facing the side; and a joint configured to connect the side and the non-opposing side to connect the frame and the mounting portion, wherein when the joint connects the frame and the mounting portion, the joint is separate from the frame and / or the mounting portion.

16. A method for manufacturing a wired circuit board, comprising: a step (1) of preparing a kit as described in claim 15; and a step (2) of connecting the frame and the mounting portion with a joint such that the joint is separate from at least one member selected from the group consisting of a frame and a mounting portion.

17. The method for producing a wired circuit board according to claim 16, wherein in step (2), the joint is connected to the member via at least one connecting member selected from the group consisting of a connector, a solder, and an anisotropic conductive film.

Images