Wiring circuit board

Abstract

A wiring circuit board (1) comprises: a frame (2); a mounting part (3); and a joint (4). The frame (2) and the mounting part (3) each include: a base insulating layer (11); a wiring layer (12); a cover insulating layer (13); a second wiring layer (14); and a second cover insulating layer (15). The wiring layer (12) is disposed on one surface of the base insulating layer (11). The cover insulating layer (13) is disposed on the one surface of the base insulating layer (11). The second wiring layer (14) is disposed on the other surface of the base insulating layer (11). The second cover insulating layer (15) is disposed on the other surface of the base insulating layer (11). Each of the frame (2) and the mounting part (3) may include a support layer (17). The support layer (17) is disposed on the other side of the second cover insulating layer (15). The joint (4) does not include the support layer (17). The joint (4) includes: the base insulating layer (11); the wiring layer (12); the cover insulating layer (13); the second wiring layer (14); and the second cover insulating layer (15).

Description

Wired circuit board

[0001] The present invention relates to a printed circuit board.

[0002] A wired circuit board for mounting an imaging element is known (see, for example, Patent Document 1 below). The wired circuit board described in Patent Document 1 includes a frame, a mounting portion surrounded by the frame, and a support member connecting them. The support member is made of a rigid material. The rigid material includes stainless steel. The wired circuit board described in Patent Document 1 is provided in an imaging device with an imaging element mounted on the mounting portion. In the wired circuit board described in Patent Document 1, the frame elastically supports the mounting portion via the support member.

[0003] When the imaging device moves (vibrates), the frame also moves (vibrates). This causes the mounting part to shake (vibrate) in conjunction with the movement (vibration) of the frame. However, the support member corrects the above-mentioned shaking (vibration) of the mounting part. This correction is called shake correction (shake correction).

[0004] Special Publication No. 2020-30306

[0005] Depending on the application and purpose of the wired circuit board, there is a demand for correcting the vibration of the mounting portion with a small force. However, the wired circuit board described in Patent Document 1 has a drawback in that it cannot satisfy the above-mentioned demand.

[0006] In particular, a wired circuit board including a support layer, a second insulating cover layer, a second wiring, a base insulating layer, a wiring layer, and a cover insulating layer in that order toward one side in the thickness direction is thicker than a second wired circuit board including a support layer, a base insulating layer, and a wiring layer but not including the second insulating cover layer and the second wiring layer. Therefore, it becomes clear that the wired circuit board described above cannot satisfy the above-mentioned requirements.

[0007] The present invention provides a printed circuit board capable of correcting the vibration of a mounting portion with a small force.

[0008] The present invention [1] comprises a frame, a mounting portion surrounded by the frame and spaced apart from the frame, and a joint connecting the frame and the mounting portion, wherein each of the frame and the mounting portion comprises a base insulating layer, a wiring layer arranged on one side of the base insulating layer in the thickness direction, a cover insulating layer arranged on one side of the base insulating layer in the thickness direction and covering a part of the wiring layer, a second wiring layer arranged on the other side of the base insulating layer in the thickness direction, and a second cover insulating layer arranged on the other side of the base insulating layer in the thickness direction and covering the second wiring layer, and may also include a support layer arranged on the other side of the second cover insulating layer in the thickness direction, and the joint does not include the support layer, and comprises a wired circuit board including the base insulating layer, the wiring layer, the cover insulating layer, the second wiring layer, and the second cover insulating layer.

[0009] In this wired circuit board, the joint does not include a support layer. Therefore, the rigidity of the joint is reduced. More specifically, the joint includes a base insulating layer, a wiring layer, a cover insulating layer, a second wiring layer, and a second cover insulating layer, and even if it is thick, as described above, the joint does not include a support layer, so the rigidity of the joint is reduced. As a result, the vibration of the mounting portion can be corrected with a small force.

[0010] The present invention [2] includes the wired circuit board according to [1], wherein the support layer is a metal supporting board.

[0011] In this wired circuit board, the support layer is a metal supporting board, and therefore the frame and the mounting portion each have excellent rigidity, so that the wired circuit board can reliably mount elements on the mounting portion while reliably supporting them with the frame.

[0012] The present invention [3] includes the wired circuit board according to [2], wherein the thickness of the second wiring layer is different from the thickness of the wiring layer.

[0013] In this printed circuit board, the second wiring layer can be used for a purpose different from that of the wiring layer.

[0014] The present invention [4] includes the wired circuit board according to [3], wherein each of the frame and the mounting portion further includes a third adhesive layer that bonds the support layer and the second insulating cover layer.

[0015] The present invention [5] includes the wired circuit board according to [4], wherein the third adhesive layer is a conductive adhesive layer, the second cover insulating layers in the frame and the joint have second cover through-holes, the second wiring layer includes a ground wiring, and the ground wiring is grounded to the metal supporting board via the conductive adhesive layer, a portion of which fills the second cover through-hole.

[0016] The present invention [6] includes the wired circuit board according to [1], wherein the support layer is a hard substrate having a hard third insulating base layer and a third wiring layer in that order toward the other side in the thickness direction.

[0017] In this wired circuit board, the support layer is a hard substrate, so the frame and the mounting portion each have excellent rigidity, allowing the wired circuit board to reliably mount elements on the mounting portion while reliably supporting them with the frame.

[0018] The present invention [7] includes the wired circuit board described in [6], wherein each of the frame and the mounting portion further comprises a second rigid substrate having a hard fourth base insulating layer, a fourth wiring layer and a fourth cover insulating layer in that order toward one side in the thickness direction.

[0019] In this wired circuit board, the rigidity of the frame and the mounting portion can be further improved.

[0020] The present invention [8] includes the wired circuit board according to [1] or [2], wherein the cover insulating layer includes an adhesive layer and a cover layer, in that order, toward one side in the thickness direction, and the second cover insulating layer includes a second adhesive layer and a second cover layer, in that order, toward the other side in the thickness direction.

[0021] The present invention [9] includes the wired circuit board according to [1] or [2], wherein the mounting portion has a substantially rectangular shape and has a side at the outer periphery of the mounting portion, the frame has a substantially rectangular frame shape and has an opposing side facing the side and a non-opposing side adjacent to the opposing side and not facing the side, and the joint connects the side and the non-opposing side.

[0022] In this wired circuit board, the joint connects a side and a non-opposing side that does not face the side, so the joint can be made longer, thereby reducing the rigidity of the joint.

[0023] The present invention

[10] includes the wired circuit board according to [1] or [2], wherein the joint has a curved shape.

[0024] In this wired circuit board, the joints have a curved shape, and therefore the accuracy of vibration correction can be improved compared to an embodiment in which the joints have a straight and / or bent shape.

[0025] The present invention

[11] includes the wired circuit board according to [1] or [2], wherein the mounting portion has a side at an outer peripheral edge of the mounting portion, the joint includes a connection portion to which the joint connects at the side, and the ratio of the length of the connection portion in a direction along the side to the length of the side (length of the connection portion / length of the side) is 0.3 or less.

[0026] In this wired circuit board, the ratio of the length of the connection portion in the direction along the side to the length of the side is 0.3 or less, which prevents the connection portion from widening, thereby reliably reducing the rigidity of the joint.

[0027] Furthermore, when the frame moves and the joint bends, the connection part widens, increasing the difference between the force applied to the center of the joint in the width direction and the force applied to one end of the joint in the width direction, which may make it impossible to accurately control the shaking of the mounting part.

[0028] However, in this wired circuit board, when the frame moves and the joint bends, the connection portion is prevented from widening, so the difference between the force applied to the center of the joint in the width direction and the force applied to one end of the joint in the width direction is reduced, and therefore the shaking of the mounting portion can be controlled with precision.

[0029] The present invention

[12] includes the wired circuit board according to [1] or [2], wherein the mounting portion has a side at the outer periphery of the mounting portion, and the joint is a central region including a central portion of the side, and is connected to the central region having a length that is half the length of the side.

[0030] In this printed circuit board, the joint is connected to the central region, so that the vibration of the mounting portion can be controlled with high precision.

[0031] The present invention

[13] includes the wired circuit board according to

[12] , wherein the joint is connected to the center portion of the side.

[0032] In this wired circuit board, the joint is connected to the center, so that the vibration of the mounting portion can be controlled with high precision.

[0033] The present invention

[14] includes the wired circuit board according to [1] or [2], wherein the mounting portion has a plurality of sides on the outer periphery of the mounting portion, a plurality of the joints are provided corresponding to the plurality of sides, and the difference in length between the longest joint and the shortest joint among the plurality of joints is 3 mm or less.

[0034] In this wired circuit board, the difference in length between the longest joint and the shortest joint is 3 mm or less, which improves the accuracy of vibration compensation of the mounting portion.

[0035] The present invention

[15] includes the wired circuit board according to [1] or [2], wherein the joint includes the wiring layer and the second wiring layer, the wiring layer in the joint has joint wiring, the second wiring layer in the joint has second joint wiring spaced apart from the joint wiring when projected in the thickness direction, and the base insulating layer, the cover insulating layer and the second cover insulating layer in the joint have slits arranged between the joint wiring and the second joint wiring.

[0036] In this wired circuit board, the insulating base layer, the insulating cover layer and the second insulating cover layer at the joint have slits, so that the rigidity of the joint can be further reduced.

[0037] The present invention

[16] includes the wired circuit board according to

[15] , wherein the slit extends along the joint wiring and the second joint wiring, and the joint has a sub-joint that divides the slit in the direction in which the slit extends and connects the joint wiring and the second joint wiring.

[0038] In this wired circuit board, the sub-joints can prevent the rigidity of the joints from being excessively reduced due to the slits, thereby preventing excessive deformation of the joints.

[0039] The wired circuit board of the present invention can correct the vibration of the mounting portion with a small force.

[0040] 1 is a plan view of an embodiment of the wired circuit board of the present invention; FIG. 2 is an enlarged view of the wired circuit board shown in FIG. 1; and FIG. 3 is a cross-sectional view taken along line AA in FIG. 4A to FIG. 4E are part of a manufacturing process diagram for the wired circuit board shown in FIG. 3. FIG. 4A shows a process for preparing a three-layer base material. FIG. 4B shows a process for forming a through hole. FIG. 4C shows a process for forming a via. FIG. 4D shows a process for forming a wiring layer and a second wiring layer. FIG. 4E shows a process for adhering a cover layer and a second cover layer to a base film. FIGS. 5A to 5D are part of a manufacturing process diagram for the wired circuit board shown in FIG. 3, continuing from FIG. 4E. FIG. 5A shows a process for forming a protective layer. FIG. 5B shows a process for forming a joint. FIG. 5C shows a process for adhering a support layer to a second cover insulating layer. FIG. 5D shows a process for mounting an imaging element and an external board on the wired circuit board. FIGS. 6A to 6E are manufacturing process diagrams for a first modified wired circuit board. Fig. 6A shows a step of adhering a cover layer and a second cover layer to a frame and a base film in a mounting portion. Fig. 6B shows a step of adhering a solder resist to a base film in a joint. Fig. 6C shows a step of forming a protective layer. Fig. 6D shows a step of adhering a support layer to a frame and a mounting portion. Fig. 6E shows a step of forming a joint. Cross-sectional views of a wired circuit board of a second modified example. Figs. 8A to 8E are manufacturing process diagrams of a wired circuit board of a second modified example. Fig. 8A shows a step of preparing a laminate. Fig. 8B shows a step of adhering a rigid substrate and a second rigid substrate to the laminate. Fig. 8C shows a step of forming a through hole. Fig. 8D shows a step of forming a via. Fig. 8E shows a step of forming a fourth insulating base layer. Cross-sectional views of a wired circuit board of a third modified example. Plan views of a wired circuit board of a fourth modified example. Cross-sectional views along line AA in Fig. 10.

[0041] 1. One Embodiment of the Wired Circuit Board One embodiment of the wired circuit board of the present invention will be described with reference to FIGS.

[0042] 1.1 Configuration of the Wired Circuit Board As shown in Fig. 1, the wired circuit board 1 has a sheet shape. As shown in Fig. 3, the wired circuit board 1 has a thickness. As shown in Fig. 1, the wired circuit board 1 extends in a planar direction. The planar direction is perpendicular to the thickness direction. The wired circuit board 1 includes a frame 2, a mounting portion 3, and a joint 4.

[0043] 1.2 Frame 2 In this embodiment, the frame 2 has a substantially rectangular frame shape. The frame 2 includes an inner peripheral edge 20. In this embodiment, the frame 2 has four sides 23A, 23B, 23C, and 23D at the inner peripheral edge 20. The four sides 23A, 23B, 23C, and 23D are arranged in counterclockwise order in a plan view. Sides 23A and 23C face each other. Side 23B connects one end of side 23A to one end of side 23C. Side 23D connects the other end of side 23A to the other end of side 23C. Sides 23B and 23D face each other.

[0044] As shown in Figure 3, the frame 2 includes a base insulating layer 11, a wiring layer 12, a cover insulating layer 13, a second wiring layer 14, a second cover insulating layer 15, a third adhesive layer 16, and a support layer 17.

[0045] 1.2.1 Base insulating layer 11 of frame 2 In the frame 2, the base insulating layer 11 extends in the planar direction. The base insulating layer 11 in the frame 2 is flexible. The base insulating layer 11 in the frame 2 has a plurality of through holes 111. In this embodiment, the four through holes 111 are provided corresponding to the four sides 23A, 23B (see FIG. 1), 23C (see FIG. 1), and 23D (see FIG. 1), respectively.

[0046] The material of the insulating base layer 11 of the frame 2 may be, for example, a resin, and preferably a polyimide resin.

[0047] The insulating base layer 11 in the frame 2 has a thickness of, for example, 1 μm or more, or preferably 5 μm or more, and for example, 20 μm or less, or preferably 15 μm or less.

[0048] 1.2.2 Wiring Layer 12 in Frame 2 In the frame 2, the wiring layer 12 is disposed on one surface of the insulating base layer 11 in the thickness direction. The wiring layer 12 contacts one surface of the insulating base layer 11. As shown in FIG. 2 , the wiring layer 12 includes a plurality of frame terminals 121 and a plurality of frame wires 122.

[0049] 1.2.2.1 Frame Terminals 121 A plurality of frame terminals 121 are provided corresponding to each of the four sides 23A, 23B (see FIG. 1), 23C (see FIG. 1), and 23D (see FIG. 1). The plurality of frame terminals 121 corresponding to side 23A are spaced apart from one another along side 23A. The plurality of frame terminals 121 are lined up along side 23A.

[0050] The plurality of frame terminals 121 include a plurality of frame differential terminals 121D and a frame ground terminal 121G. In this embodiment, the frame ground terminal 121G is disposed between two frame differential terminals 121D.

[0051] 3, the frame terminal 121 includes, in order toward one side in the thickness direction, a frame terminal body 1211 and a protective layer 1212. The protective layer 1212 covers one surface of the frame terminal body 1211 in the thickness direction.

[0052] Although not shown, the plurality of frame terminals 121 corresponding to each of sides 23B (see FIG. 1), 23C (see FIG. 1), and 23D (see FIG. 1) have the same configuration as the plurality of frame terminals 121 corresponding to side 23A.

[0053] 2, each of the frame wirings 122 includes a frame differential wiring 122D. Each of the frame differential wirings 122D corresponds to each of the frame differential terminals 121D. Specifically, each of the frame differential wirings 122D is connected to each of the frame differential terminals 121D. The frame differential wirings 122D are spaced apart from one another. In this embodiment, the frame differential wirings 122D extend from each of the frame terminals 121, bend, converge, and then reach the side 23A.

[0054] The frame wirings 122 corresponding to the sides 23B (see FIG. 1), 23C (see FIG. 1), and 23D (see FIG. 1) have the same configuration as the frame wiring 122 corresponding to the side 23A.

[0055] The wiring layer 12 (frame terminal body 1211) of the frame 2 may be made of, for example, a conductor. A preferred example of the conductor is copper. The protective layer 1212 may be a single layer or multiple layers. Examples of the material for the protective layer 1212 include gold and nickel.

[0056] The thickness of the wiring layer 12 in the frame 2 is, for example, 35 μm or less, or preferably 25 μm or less, and for example, 1 μm or more, or preferably 5 μm or more.

[0057] 1.2.3 Cover Insulating Layer 13 in Frame 2 As shown in Figure 3, in the frame 2, the cover insulating layer 13 is disposed on one surface of the base insulating layer 11 in the thickness direction. The cover insulating layer 13 covers the frame wiring 122 (frame differential wiring 122D, see Figure 2), which is part of the wiring layer 12. The cover insulating layer 13 exposes the frame terminals 121 (frame ground terminal 121G and frame differential terminal 121D), which are the remaining parts of the wiring layer 12. The cover insulating layer 13 is flexible. The cover insulating layer 13 includes an adhesive layer 131 and a cover layer 132, which are arranged in this order toward one side in the thickness direction.

[0058] 1.2.3.1 Adhesive Layer 131 The adhesive layer 131 in the frame 2 contacts the frame wiring 122 and the periphery of the frame wiring 122 in the base insulating layer 11. The other surface of the adhesive layer 131 in the thickness direction follows the frame wiring 122. One surface of the adhesive layer 131 in the thickness direction has a flat shape.

[0059] Examples of materials for the adhesive layer 131 include adhesive compositions. Examples of adhesive compositions include polyimide adhesive compositions, epoxy adhesive compositions, silicone adhesive compositions, urethane adhesive compositions, and acrylic adhesive compositions. Preferably, the adhesive composition is a polyimide adhesive composition.

[0060] 1.2.3.2 Cover Layer 132 The cover layer 132 is disposed on one surface of the adhesive layer 131 in the thickness direction. The cover layer 132 does not have tack. The cover layer 132 is adhered to the insulating base layer 11 and the frame wiring 122 via the adhesive layer 131.

[0061] Examples of materials for the cover layer 132 include polyimide resin, maleimide resin, epoxy resin, polybenzoxazole resin, and polyester resin. A preferred material for the cover layer 132 is polyimide resin.

[0062] The thickness of the insulating cover layer 13 in the frame 2 is, for example, 8 μm or more, preferably 15 μm or more, and for example, 100 μm, preferably 60 μm or less. The thickness of the insulating cover layer 13 is the length from one surface of the insulating base layer 11 in the thickness direction to one surface of the insulating cover layer 13 in the thickness direction.

[0063] The thickness of the adhesive layer 131 in the frame 2 is, for example, 3 μm or more, preferably 5 μm or more, and for example, 50 μm or less, preferably 30 μm or less. The thickness of the adhesive layer 131 is the length from one surface of the base insulating layer 11 in the thickness direction to one surface of the adhesive layer 131 in the thickness direction.

[0064] The cover layer 132 in the frame 2 has a thickness of, for example, 5 μm or more, or preferably 10 μm or more, and for example, 50 μm or less, or preferably 30 μm or less.

[0065] 1.2.4 Second Wiring Layer 14 in Frame 2 In the frame 2, the second wiring layer 14 is disposed on the other surface of the base insulating layer 11 in the thickness direction. The second wiring layer 14 contacts the other surface of the base insulating layer 11 in the thickness direction. As shown by the dashed lines in Figure 2, the second wiring layer 14 includes second frame wiring 142.

[0066] 1.2.4.1 Second Frame Wiring 142 When projected in the thickness direction, the second frame wiring 142 is aligned with the multiple frame wirings 122. Specifically, when projected in the thickness direction, the second frame wiring 142 is disposed between two frame wirings 122. The second frame wiring 142 includes a frame ground wiring 142G.

[0067] The frame ground wiring 142G is connected to the frame ground terminal 121G. One end 1421 of the frame ground wiring 142G has a land shape. As shown in FIG. 3 , the one end 1421 contacts a frame conductive connecting portion 1422. The frame conductive connecting portion 1422 fills the through hole 111. The frame conductive connecting portion 1422 contacts the other surface of the frame ground terminal 121G in the thickness direction.

[0068] The thickness of the second wiring layer 14 in the mounting portion 3 is the same as or different from the thickness of the wiring layer 12 in the frame 2. The thickness of the second wiring layer 14 in the mounting portion 3 is preferably different from the thickness of the wiring layer 12 in the frame 2. In this embodiment, the second wiring layer 14 is thicker than the wiring layer 12. The thickness of the second wiring layer 14 is, for example, 5 μm or more, preferably 10 μm or more, more preferably 20 μm or more, and for example, 100 μm or less, preferably 50 μm or less. The ratio of the thickness of the second wiring layer 14 to the thickness of the wiring layer 12 is, for example, 1.1 or more, preferably 1.2 or more, more preferably 1.5 or more, and for example, 10 or less.

[0069] 1.2.5 Second Cover Insulating Layer 15 of Frame 2 The second cover insulating layer 15 is disposed on the other surface of the base insulating layer 11 in the thickness direction. The second cover insulating layer 15 covers the second frame wiring 142. In other words, the second cover insulating layer 15 covers the second wiring layer 14. The second cover insulating layer 15 is flexible. The second cover insulating layer 15 has a second cover through-hole 151. When projected in the thickness direction, the second cover through-hole 151 is included in one end 1421 of the second frame wiring 142. The second cover insulating layer 15 includes a second adhesive layer 152 and a second cover layer 153, arranged in this order toward the other side in the thickness direction. 1.2.5.1 Second Adhesive Layer 152 The second adhesive layer 152 contacts the second frame wiring 142 and the periphery of the second frame wiring 142 in the base insulating layer 11. One surface of the second adhesive layer 152 in the thickness direction conforms to the second frame wiring 142. The other surface of the second adhesive layer 152 in the thickness direction has a flat shape. Examples of materials for the second adhesive layer 152 include the materials exemplified for the adhesive layer 131.

[0070] 1.2.5.2 Second Cover Layer 153 The second cover layer 153 is disposed on the other surface of the second adhesive layer 152 in the thickness direction. The second cover layer 153 does not have tack. The second cover layer 153 is adhered to the base insulating layer 11 and the second frame wiring 142 via the second adhesive layer 152. Examples of materials for the second cover layer 153 include the materials exemplified for the cover layer 132.

[0071] The thickness of the second insulating cover layer 15 in the frame 2 is, for example, 8 μm or more, preferably 15 μm or more, and for example, 100 μm or less, preferably 60 μm or less. The thickness of the second insulating cover layer 15 is the length from the other surface of the insulating base layer 11 in the thickness direction to the other surface of the second insulating cover layer 15 in the thickness direction.

[0072] The thickness of the second adhesive layer 152 in the frame 2 is, for example, 3 μm or more, preferably 5 μm or more, and for example, 50 μm or less, preferably 30 μm or less. The thickness of the second adhesive layer 152 is the length from the other surface of the base insulating layer 11 in the thickness direction to the other surface of the second adhesive layer 152 in the thickness direction.

[0073] The second cover layer 153 in the frame 2 has a thickness of, for example, 5 μm or more, or preferably 10 μm or more, and for example, 50 μm or less, or preferably 30 μm or less.

[0074] 1.2.6 Third adhesive layer 16 of frame 2 The third adhesive layer 16 is disposed on the other surface of the second cover insulating layer 15 in the thickness direction. A portion of the third adhesive layer 16 fills the second cover through-hole 151. A portion of the third adhesive layer 16 contacts one end 1421 of the frame ground wiring 142G within the second cover through-hole 151. The other surface of the third adhesive layer 16 in the thickness direction has a flat shape.

[0075] In this embodiment, the third adhesive layer 16 is a conductive adhesive layer 161. In other words, a portion of the conductive adhesive layer 161 fills the second cover through-hole 151. Examples of materials for the conductive adhesive layer include a composition containing metal particles and a resin, and a composition containing conductive polymer particles and a resin.

[0076] The thickness of the third adhesive layer 16 is, for example, 5 μm or more, preferably 10 μm or more, and for example, 100 μm or less, preferably 50 μm or less. The thickness of the third adhesive layer 16 is the length from the other surface of the second cover insulating layer 15 in the thickness direction to the other surface of the third adhesive layer 16 in the thickness direction.

[0077] 1.2.7 Support Layer 17 of Frame 2 The support layer 17 of the frame 2 is disposed on the other side of the second insulating cover layer 15 in the thickness direction. In the present embodiment, the support layer 17 contacts the other side of the third adhesive layer 16 in the thickness direction. As a result, the support layer 17 is adhered to the other side of the second insulating cover layer 15 in the thickness direction via the third adhesive layer 16. In other words, in the frame 2, the third adhesive layer 16 adheres the support layer 17 and the second insulating cover layer 15. The support layer 17 extends in the planar direction. The support layer 17 has rigidity. In the present embodiment, the support layer 17 is a metal supporting board 171. One end 1421 of the frame ground wiring 142G is grounded to the metal supporting board 171 via the conductive adhesive layer 161.

[0078] The material of the metal supporting board 171 is, for example, a rigid material. Examples of the rigid material include stainless steel, 42 alloy, aluminum, copper-beryllium, phosphor bronze, copper, silver, nickel, chromium, titanium, tantalum, platinum, gold, and copper alloy. From the viewpoint of ensuring the strength of the frame 2 and the mounting portion 3, stainless steel and copper alloy are preferable as the rigid material.

[0079] The thickness of the support layer 17 in the frame 2 is in a range of, for example, 30 μm or more, or preferably 100 μm or more, and for example, 10,000 μm or less, or preferably 1,000 μm or less.

[0080] 1.2.8 Dimensions of Frame 2 As shown in FIG. 1 , the distance between sides 23A and 23C and the distance between sides 23B and 23D are each, for example, 5 mm or more, preferably 8 mm or more, and for example, 50 mm or less, preferably 30 mm or less. The length of each of sides 23A, 23B, 23C, and 23D is, for example, 5 mm or more, preferably 8 mm or more, and for example, 50 mm or less, preferably 30 mm or less. The width of frame 2 is, for example, 0.1 mm or more, preferably 0.3 mm or more, and for example, 50 mm or less, preferably 30 mm or less. The width of frame 2 is the length between inner peripheral edge 20 and outer peripheral edge.

[0081] 2, the width of each of the plurality of frame terminals 121 is, for example, 10 μm or more, preferably 30 μm or more, and for example, 3000 μm or less, preferably 1000 μm or less. The width of the frame wiring 122 is, for example, 1 μm or more, preferably 5 μm or more, and for example, 3000 μm or less, preferably 1000 μm or less.

[0082] The width of one end 1421 of the second frame wiring 142 is, for example, 10 μm or more, preferably 30 μm or more, and for example, 3000 μm or less, preferably 1000 μm or less. The width of the second frame wiring 142 other than the one end 1421 is, for example, 1 μm or more, preferably 5 μm or more, and for example, 3000 μm or less, preferably 1000 μm or less.

[0083] 1.3 Mounting Section 3 As shown in FIG. 1 , the mounting section 3 is surrounded by the frame 2. The mounting section 3 is spaced apart from the frame 2. In this embodiment, the mounting section 3 has a substantially rectangular shape. Preferably, the mounting section 3 has a substantially rectangular outer shape, specifically, a substantially rectangular frame shape. The mounting section 3 includes an outer peripheral edge 30 and an inner peripheral edge 39. In this embodiment, the mounting section 3 includes four sides 33A, 33B, 33C, and 33D at the outer peripheral edge 30.

[0084] The four sides 33A, 33B, 33C, and 33D of the mounting portion 3 are arranged counterclockwise in this order in a plan view. The sides 33A, 33B, 33C, and 33D of the mounting portion 3 face the sides 23A, 23B, 23C, and 23D of the frame 2, respectively.

[0085] In other words, the side 33B of the mounting portion 3 faces (opposes) the side 23B of the frame 2. In other words, the side 23B is the opposing side to the side 33B. The side 33B extends in the same direction as the side 23B.

[0086] The side 33B of the mounting portion 3 does not face (oppose) the side 23A of the frame 2. In other words, the side 23A is a non-opposing side to the side 33B. The side 33B is adjacent to the side 33A. The side 33B extends in a direction intersecting the side 23A. Preferably, the side 33B extends in a direction perpendicular to the side 23A.

[0087] Side 33C extends in the same direction as side 33A. Side 33B connects one end of side 33A to one end of side 33C. Side 33D connects the other end of side 33A to the other end of side 33C. Side 33D extends in the same direction as side 33B.

[0088] As shown in Figure 3, the mounting portion 3 includes a base insulating layer 11, a wiring layer 12, a cover insulating layer 13, a second wiring layer 14, a second cover insulating layer 15, a third adhesive layer 16, and a support layer 17.

[0089] 1.3.1 Base insulating layer 11 in mounting portion 3 In the mounting portion 3, the base insulating layer 11 extends in the planar direction. The base insulating layer 11 in the mounting portion 3 has a plurality of through holes 112. In this embodiment, the four through holes 112 are provided corresponding to the four sides 33A (see FIG. 1), 33B, 33C (see FIG. 1), and 33D (see FIG. 1), respectively. The base insulating layer 11 in the mounting portion 3 is flexible. The material and thickness of the base insulating layer 11 in the mounting portion 3 are the same as those of the base insulating layer 11 in the frame 2.

[0090] 1.3.2 Wiring Layer 12 in Mounting Portion 3 In the mounting portion 3, the wiring layer 12 is disposed on one surface of the insulating base layer 11 in the thickness direction. The wiring layer 12 is in contact with one surface of the insulating base layer 11. As shown in FIG. 2 , the wiring layer 12 in the mounting portion 3 includes a plurality of terminals 123 and a plurality of wires 124.

[0091] 1.3.2.1 Terminals 123 A plurality of terminals 123 are provided corresponding to each of the four sides 33A (see FIG. 1), 33B, 33C (see FIG. 1), and 33D (see FIG. 1). Specifically, the plurality of terminals 123 corresponding to side 33B are spaced apart from one another in the direction along side 33B. The plurality of terminals 123 are lined up in the direction along side 33B.

[0092] The plurality of terminals 123 include a plurality of differential terminals 123D and a ground terminal 123G. In this embodiment, the ground terminal 123G is disposed between the two differential terminals 123D. Although not shown, the plurality of terminals 123 corresponding to each of sides 33A (see FIG. 1), 33C (see FIG. 1), and 33D (see FIG. 1) have the same configuration as the terminal 123 corresponding to side 33B.

[0093] 3, the terminal 123 includes, in order toward one side in the thickness direction, a terminal body 1231 and a protective layer 1232. The protective layer 1232 covers one surface of the terminal body 1231 in the thickness direction.

[0094] 2, each of the multiple wirings 124 includes a differential wiring 124D. Each of the multiple differential wirings 124D corresponds to each of the multiple differential terminals 123D. Specifically, each of the multiple differential wirings 124D is connected to each of the multiple differential terminals 123D. The multiple differential wirings 124D are spaced apart from one another. In this embodiment, each of the multiple differential wirings 124D extends from each of the multiple differential terminals 123D, then converges to each other, and then reaches the side 33B.

[0095] The wiring 124 corresponding to each of the sides 33A (see FIG. 1), 33C (see FIG. 1), and 33D (see FIG. 1) has the same configuration as the wiring 124 corresponding to the side 33B described above.

[0096] The material and thickness of the wiring 124 in the mounting portion 3 are the same as those of the wiring 124 in the frame 2 .

[0097] 1.3.3 Cover insulating layer 13 in mounting portion 3 Although not shown, in the mounting portion 3, the cover insulating layer 13 is disposed on one surface of the base insulating layer 11 in the thickness direction. The cover insulating layer 13 covers the wiring 124 (differential wiring 124D, see FIG. 2 ) which is part of the wiring layer 12. The cover insulating layer 13 exposes the terminals 123 (differential terminal 123D, ground terminal 123G, see FIG. 2 ) which are the remaining parts of the wiring layer 12. The cover insulating layer 13 is flexible. The cover insulating layer 13 includes an adhesive layer 131 and a cover layer 132, which are arranged in this order toward one side in the thickness direction.

[0098] 1.3.3.1 Adhesive Layer 131 The adhesive layer 131 (not shown) in the mounting portion 3 contacts the wiring 124 and the periphery of the wiring 124 in the base insulating layer 11. The other surface of the adhesive layer 131 in the thickness direction follows the wiring 124. One surface of the adhesive layer 131 in the thickness direction has a flat shape. The material and thickness of the adhesive layer 131 in the mounting portion 3 are the same as the material and thickness of the adhesive layer 131 in the frame 2, respectively.

[0099] The cover layer 132 (not shown) in the mounting portion 3 is disposed on one surface of the adhesive layer 131 in the thickness direction. The cover layer 132 is adhered to the insulating base layer 11 and the wiring 124 via the adhesive layer 131. The material and thickness of the cover layer 132 in the mounting portion 3 are the same as those of the cover layer 132 in the frame 2.

[0100] The thickness of the insulating cover layer 13 in the mounting portion 3 is the same as the thickness of the cover layer 132 in the frame 2 .

[0101] 1.3.4 Second wiring layer 14 in mounting portion 3 In the mounting portion 3, the second wiring layer 14 is disposed on the other surface of the base insulating layer 11 in the thickness direction. The second wiring layer 14 contacts the other surface of the base insulating layer 11 in the thickness direction. As shown by the dashed line in FIG. 2 , the second wiring layer 14 includes second wiring 143.

[0102] 1.3.4.1 Second Wiring 143 When projected in the thickness direction, the second wiring 143 is aligned with the multiple wirings 124. Specifically, when projected in the thickness direction, the second wiring 143 is disposed between two wirings 124. The second wiring 143 includes a ground wiring 143G.

[0103] The ground wiring 143G is connected to the ground terminal 123G. One end 1431 of the second wiring 143 has a land shape. As shown in FIG. 3 , the one end 1431 is in contact with a conductive connection portion 1432. The conductive connection portion 1432 is filled in the through hole 112. The conductive connection portion 1432 is in contact with the ground terminal 123G.

[0104] The thickness of the second wiring layer 14 in the mounting portion 3 is the same as the thickness of the second wiring layer 14 in the frame 2 .

[0105] 1.3.5 Second cover insulating layer 15 in mounting portion 3 The second cover insulating layer 15 in the mounting portion 3 is disposed on the other surface of the base insulating layer 11 in the thickness direction. The second cover insulating layer 15 covers the second wiring 143. In other words, the second cover insulating layer 15 covers the second wiring layer 14. The second cover insulating layer 15 is flexible. The second cover insulating layer 15 has a second cover through hole 154. The second cover through hole 154 is included in one end 1431 of the second wiring 143 when projected in the thickness direction. The second cover insulating layer 15 in the mounting portion 3 includes a second adhesive layer 152 and a second cover layer 153, which are arranged in this order toward the other side in the thickness direction.

[0106] 1.3.5.1 Second Adhesive Layer 152 The second adhesive layer 152 contacts the second wiring 143 and the periphery of the second wiring 143 in the base insulating layer 11. One surface of the second adhesive layer 152 in the thickness direction conforms to the ground wiring 143G. The other surface of the second adhesive layer 152 in the thickness direction has a flat shape. The material and thickness of the second adhesive layer 152 in the mounting portion 3 are the same as the material and thickness of the second adhesive layer 152 in the frame 2, respectively.

[0107] 1.3.5.2 Second Cover Layer 153 The second cover layer 153 is disposed on the other surface of the second adhesive layer 152 in the thickness direction. The second cover layer 153 is bonded to the insulating base layer 11 and the second wiring 143 via the second adhesive layer 152. In other words, the second adhesive layer 152 bonds the second cover layer 153 to the insulating base layer 11 and the second wiring 143. The material and thickness of the second cover layer 153 in the mounting portion 3 are the same as the material and thickness of the second cover layer 153 in the frame 2, respectively.

[0108] The thickness of the second insulating cover layer 15 in the mounting portion 3 is the same as the thickness of the second insulating cover layer 15 in the frame 2 .

[0109] 1.3.6 Third adhesive layer 16 in mounting portion 3 The third adhesive layer 16 is disposed on the other surface of the second cover insulating layer 15 in the thickness direction. A portion of the third adhesive layer 16 fills the second cover through-hole 154. A portion of the third adhesive layer 16 contacts one end 1431 of the second wiring 143 within the second cover through-hole 154. One surface of the third adhesive layer 16 in the thickness direction follows the shape of the second cover insulating layer 15. The other surface of the third adhesive layer 16 in the thickness direction has a flat shape.

[0110] In this embodiment, the third adhesive layer 16 is a conductive adhesive layer 162. In other words, a portion of the conductive adhesive layer 162 fills the second cover through-hole 154. The material and thickness of the third adhesive layer 16 on the mounting portion 3 are the same as the material and thickness of the third adhesive layer 16 on the frame 2, respectively.

[0111] 1.3.7 Support Layer 17 in Mounting Portion 3 The support layer 17 in the mounting portion 3 is disposed on the other side of the second insulating cover layer 15 in the thickness direction. In the present embodiment, the support layer 17 contacts the other surface of the third adhesive layer 16 in the thickness direction. As a result, the support layer 17 is adhered to the other surface of the second insulating cover layer 15 in the thickness direction via the third adhesive layer 16. In other words, in the mounting portion 3, the third adhesive layer 16 adheres the support layer 17 and the second insulating cover layer 15 together. One end 1431 of the ground wiring 143G is grounded to the metal supporting board 171 via the conductive adhesive layer 162. The support layer 17 extends in the planar direction. The support layer 17 has rigidity. In the present embodiment, the support layer 17 is a metal supporting board 172. The material and thickness of the support layer 17 in the mounting portion 3 are the same as those of the support layer 17 in the frame 2.

[0112] 1, the distance between sides 33A and 33C and the distance between sides 33B and 33D are each, for example, 3 mm or more, preferably 5 mm or more, and for example, 50 mm or less, preferably 30 mm or less. The length of each of sides 33A, 33B, 33C, and 33D is, for example, 3 mm or more, preferably 5 mm or more, and for example, 50 mm or less, preferably 30 mm or less.

[0113] The width of the mounting portion 3 is, for example, 0.3 mm or more, preferably 0.5 mm or more, and for example, 30 mm or less, preferably 20 mm or less. The width of the mounting portion 3 is the length between the outer peripheral edge 30 and the inner peripheral edge 39.

[0114] 2, the width of each of the plurality of terminals 123 is the same as the width of each of the plurality of frame terminals 121. The width of the wiring 124 is the same as the width of the frame wiring 122. The width of the second wiring 143 is the same as the width of the second frame wiring 142.

[0115] 1.4 Joint 4 The joint 4 is disposed between the frame 2 and the mounting portion 3. The joint 4 connects the frame 2 and the mounting portion 3. A plurality of joints 4 are provided corresponding to the plurality of sides 33 of the mounting portion 3. As shown in FIG. 1 , in this embodiment, the plurality of joints 4A, 4B, 4C, and 4D correspond to the plurality of sides 33B, 33C, 33D, and 33A of the mounting portion 3, respectively. Specifically, the joint 4A connects the side 23A of the frame 2 to the side 33B of the mounting portion 3. The joint 4B connects the side 23B of the frame 2 to the side 33C of the mounting portion 3. The joint 4C connects the side 23C of the frame 2 to the side 33D of the mounting portion 3. The joint 4D connects the side 23D of the frame 2 to the side 33A of the mounting portion 3.

[0116] The joint 4A will be described in detail below. The joints 4B, 4C, and 4D have the same configuration as the joint 4A, and therefore their details will be omitted.

[0117] 1.4.1 Shape of Joint 4A As shown in FIG. 2, in this embodiment, joint 4A has a curved shape in a plan view. Preferably, joint 4A does not have a linear shape and / or a bent shape, but has only a curved shape. Specifically, joint 4A has an S-shape or a hook shape. If joint 4A has a curved shape, stress can be evenly alleviated without being locally concentrated, thereby improving the accuracy of vibration correction of the mounting unit 3.

[0118] 1.4.2 Connection of Joint 4 to Mounting Unit 3 The joint 4A connects to the converging portion 32 of the mounting unit 3. At the converging portion 32, the multiple wirings 124 converge.

[0119] The joint 4A includes a connection portion 45. As shown in Fig. 1, for example, the connection portion 45 connects to the central region 34 of the side 33B of the mounting portion 3.

[0120] The central region 34 is a region of the side 33B that includes a central portion 35. The central portion 35 is the midpoint of the side 33B and the area surrounding it. The central region 34 has a length that is half the length of the side 33B. The central region 34 preferably has a length that is one-third the length of the side 33B, and more preferably has a length that is one-quarter the length of the side 33B.

[0121] Preferably, joint 4A connects to center 35 of side 33B.

[0122] The ratio of the length of the connection portion 45 in the direction along the side 33B to the length of the side 33B (length of the connection portion 45 / length of the side 33B) is, for example, 0.3 or less, preferably 0.25 or less, more preferably 0.2 or less, and is, for example, 0.01 or more.

[0123] When the ratio of the length of the connecting portion 45 in the direction along the side 33B to the length of the side 33B is equal to or less than the above-mentioned upper limit, the connecting portion 45 is prevented from widening in the direction in which the side 33B extends, thereby reliably reducing the rigidity of the joint 4A.

[0124] 1.4.3 Connection of Joint 4 to Frame 2 As shown in Figure 2, joint 4A connects to frame converging portion 26 of frame 2. Joint 4A includes a second connection portion 46. As shown in Figure 1, for example, second connection portion 46 connects to second central region 29 of side 23A of frame 2.

[0125] The second central region 29 is a region of the side 23A that includes the second central portion 28. The second central portion 28 is the midpoint of the side 23A and the area surrounding it. The second central region 29 has a length that is half the length of the side 23A. Preferably, the second central region 29 has a length that is one-third the length of the side 23A. More preferably, the second central region 29 has a length that is one-quarter the length of the side 23A.

[0126] Preferably, joint 4A connects to second central portion 28 of side 23A.

[0127] The ratio of the length of the second connection portion 46 in the direction along the side 23A to the length of the side 23A (length of the second connection portion 46 / length of the side 23A) is, for example, 0.3 or less, preferably 0.25 or less, more preferably 0.2 or less, and is, for example, 0.01 or more.

[0128] When the ratio of the length of second connection portion 46 in the direction along side 23A to the length of side 23A is equal to or less than the above-mentioned upper limit, expansion of second connection portion 46 in the direction of extension of side 23A is suppressed, thereby making it possible to reliably reduce the rigidity of joint 4A.

[0129] 1.4.4 Layer Configuration of Joint 4A As shown in FIG. 3, the joint 4A includes a base insulating layer 11, a wiring layer 12, a cover insulating layer 13, a second wiring layer 14, and a second cover insulating layer 15.

[0130] The joint 4A does not include at least the support layer 17. In this embodiment, the joint 4A does not include the third adhesive layer 16 and the support layer 17.

[0131] 2 , the base insulating layer 11 in the joint 4A includes slits 411 and 412. The slits 411 and 412 are aligned with the wiring layer 12 and the second wiring layer 14, respectively. The material and thickness of the base insulating layer 11 in the joint 4A are the same as those of the base insulating layer 11 in the frame 2, respectively.

[0132] 1.4.6 Wiring Layer 12 in Joint 4A The wiring layer 12 in the joint 4A includes a joint wiring 125. In this embodiment, the wiring layer 12 in the joint 4A includes only a joint wiring 125. As shown in FIG. 3 , the joint wiring 125 is disposed on one surface of the base insulating layer 11 in the thickness direction. The joint wiring 125 contacts one surface of the base insulating layer 11 in the thickness direction. Both ends of the joint wiring 125 are connected to the frame differential wiring 122D and the differential wiring 124D, respectively. In this embodiment, the two joint wirings 125 can function as differential wiring. For example, the two joint wirings 125 operate as a differential pair. The material and thickness of the wiring layer 12 in the joint 4A are the same as the material and thickness of the wiring layer 12 in the frame 2.

[0133] 1.4.7 Cover insulating layer 13 in joint 4A The cover insulating layer 13 in the joint 4A extends in the direction in which the wiring layer 12 and the second wiring layer 14 extend. The cover insulating layer 13 is disposed on one surface of the base insulating layer 11 in the thickness direction. The cover insulating layer 13 in the joint 4A covers the wiring layer 12. The cover insulating layer 13 in the joint 4A includes slits 411, 412 together with the base insulating layer 11. The configuration, material, and thickness of the cover insulating layer 13 in the joint 4A are the same as those of the cover insulating layer 13 in the frame 2. The cover insulating layer 13 in the joint 4A includes an adhesive layer 131 and a cover layer 132, in that order, toward one side in the thickness direction.

[0134] 1.4.8 Second Wiring Layer 14 in Joint 4A The second wiring layer 14 in the joint 4A includes a second joint wiring 144. In this embodiment, the second wiring layer 14 in the joint 4A includes only the second joint wiring 144. The second joint wiring 144 is disposed on the other surface of the base insulating layer 11 in the thickness direction. The second joint wiring 144 contacts the other surface of the base insulating layer 11 in the thickness direction. The second joint wiring 144 is spaced apart from the joint wiring 125 when projected in the thickness direction. The second joint wiring 144 is disposed between the second joint wiring 144 and the joint wiring 125. Both ends of the joint wiring 125 are connected to the frame ground wiring 142G and the ground wiring 143G, respectively. Therefore, the second joint wiring 144 functions as a joint ground wiring 144G. The material and thickness of the second wiring layer 14 in the joint 4A are the same as the material and thickness of the second wiring layer 14 in the frame 2.

[0135] 1.4.9 Second cover insulating layer 15 in joint 4A The second cover insulating layer 15 in the joint 4A extends in the direction in which the wiring layer 12 and the second wiring layer 14 extend. The second cover insulating layer 15 is disposed on the other side of the base insulating layer 11 in the thickness direction. The second cover insulating layer 15 covers the second wiring 143. The cover insulating layer 13 in the joint 4A includes slits 411, 412 together with the base insulating layer 11 and the cover insulating layer 13. The material and thickness of the second cover insulating layer 15 in the joint 4A are the same as the material and thickness of the second cover insulating layer 15 in the frame 2, respectively.

[0136] The width of each of the joint wiring 125 and the second joint wiring 144 is in the range of, for example, 10 μm or more, or preferably 30 μm or more, and for example, 3000 μm or less, or preferably 1000 μm or less.

[0137] 1.4.10 Slits 411, 412 As shown in FIG. 2 , the multiple slits 411, 412 are spaced apart from one another in a direction intersecting the direction in which the joint 4 extends (the intersecting direction, preferably the perpendicular direction). The multiple slits 411, 412 are arranged over the entire joint 4 in the direction in which the joint 4 extends. The multiple slits 411, 412 are aligned in order in the intersecting direction. The multiple slits 411, 412 separate the wiring layer 12 and the second wiring layer 14 when projected in the thickness direction. Specifically, the joint wiring 125, the slit 411, the second joint wiring 144, the slit 412, and the joint wiring 125 are aligned in order in the intersecting direction. In other words, the slits 411, 412 are aligned between the joint wiring 125 and the second joint wiring 144.

[0138] The width of each of the slits 411 and 412 is, for example, 5 μm or more, or preferably 10 μm or more, and for example, 500 μm or less, or preferably 300 μm or less.

[0139] The multiple joints 4A, 4B, 4C, and 4D may have the same or different lengths. When the multiple joints 4A, 4B, 4C, and 4D have different lengths, the difference in length between the longest joint 4 and the shortest joint 4 is, for example, 3 mm or less, preferably 2 mm or less, and more preferably 1.5 mm or less. If the difference in length between the longest joint 4 and the shortest joint 4 is equal to or less than the above-mentioned upper limit, the accuracy of vibration correction of the mounting unit 3 can be improved.

[0140] 1.5 Manufacturing Method of Wired Circuit Board 1 Next, a manufacturing method of the wired circuit board 1 and mounting of the imaging element 5 will be described with reference to FIGS. 4A to 5D.

[0141] 4A , in this method, first, a three-layer substrate 6 is prepared. The three-layer substrate 6 extends in the planar direction. The three-layer substrate 6 includes a base film 61, a conductor foil 62, and a second conductor foil 63.

[0142] The base film 61 extends in the planar direction.

[0143] The conductive foil 62 is disposed on one surface of the base film 61 in the thickness direction. The conductive foil 62 is in contact with the entire one surface of the base film 61.

[0144] The second conductor foil 63 is disposed on the other surface of the base film 61 in the thickness direction. The second conductor foil 63 is in contact with the entire other surface of the base film 61.

[0145] 4B , in this method, next, through holes 111 and 112 are formed in the three-layer base material 6. For example, laser processing is used to form the through holes 111 and 112. Each of the through holes 111 and 112 penetrates the three-layer base material 6 in the thickness direction.

[0146] 4C, in this method, the vias 113 and 114 are then formed in the through holes 111 and 112, respectively. The vias 113 and 114 are formed by, for example, through-hole plating.

[0147] The via 113 includes, at the middle portion in the thickness direction, a frame conductive connecting portion 1422. The frame conductive connecting portion 1422 is filled in the through hole 111 in the base film 61.

[0148] The via 114 includes, at a middle portion in the thickness direction, a conductive connecting portion 1432. The conductive connecting portion 1432 is filled in the through hole 112 in the base film 61.

[0149] As shown in FIG. 4D, in this method, the wiring layer 12 is then formed from a conductor foil 62, and the second wiring layer 14 is formed from a second conductor foil 63.

[0150] The wiring layer 12 and the second wiring layer 14 are formed by etching the conductor foil 62 and the second conductor foil 63, respectively. An etching resist (not shown) is used for the etching. The etching resist is prepared by exposing and developing a dry film resist (not shown).

[0151] As shown in FIG. 4E, in this method, next, the insulating cover layer 13 and the second insulating cover layer 15 are formed on one surface and the other surface of the base film 61 in the thickness direction, respectively.

[0152] For example, the cover layer 132 is attached to one surface of the base film 61 in the thickness direction and one surface of the conductor foil 62 via the adhesive layer 131. The cover layer 132 and the adhesive layer 131 are then processed to expose the frame terminals 121 and the terminals 123. The cover layer 132 and the adhesive layer 131 are processed to expose the frame terminals 121 and the terminals 123. Laser processing, for example, is used to process the cover layer 132 and the adhesive layer 131.

[0153] For example, the second cover layer 153 is attached to the other surface of the base film 61 in the thickness direction and the other surface of the second conductor foil 63 via the second adhesive layer 152. Thereafter, the second cover through holes 151, 154 are formed in the second cover layer 153 and the second adhesive layer 152. The second cover through holes 151, 154 are formed by, for example, laser processing.

[0154] 5A , in this method, protective layers 1212 and 1232 are then formed on frame terminal body 1211 and terminal body 1231, respectively. The protective layers 1212 and 1232 are formed by plating, for example. This forms frame terminal 121 and terminal 123, respectively.

[0155] 5B, in this method, next, slits 411 and 412 are formed in the insulating base layer 11, the insulating cover layer 13, and the second insulating cover layer 15. The slits 411 and 412 are formed by, for example, laser processing.

[0156] 5C , the support layer 17 is attached to the other surface of the second cover insulating layer 15 in the thickness direction via the third adhesive layer 16. At this time, part of the third adhesive layer 16 fills the second cover through-holes 151, 154. As a result, one end 1421 of the frame ground wiring 142G is grounded to the metal supporting board 171 via the third adhesive layer 16, and one end 1431 of the ground wiring 143G is grounded to the metal supporting board 172 via the third adhesive layer 16.

[0157] In this way, the wired circuit board 1 is manufactured.

[0158] 5D, the imaging element 5 is mounted on the mounting portion 3. The electrodes 51 of the imaging element 5 are electrically connected to the multiple terminals 123 on the mounting portion 3. The imaging element 5 can be mounted on the mounting portion 3 via a mounting board (not shown).

[0159] At the same time, the external substrate 7 is mounted on the frame 2. The electrodes 71 of the external substrate 7 are electrically connected to the plurality of frame terminals 121 on the frame 2. The outer edge 24 of the frame 2 (see FIG. 1 ) may be supported by an external member (not shown).

[0160] 2. Effects of an embodiment In this wired circuit board 1, the joint 4 does not include the support layer 17. Therefore, the rigidity of the joint 4 is reduced. Specifically, the joint 4 includes the base insulating layer 11, the wiring layer 12, the cover insulating layer 13, the second wiring layer 14, and the second cover insulating layer 15, and is thick. However, as described above, the joint 4 does not include the support layer 17, and therefore the rigidity of the joint 4 is reduced. As a result, the vibration of the mounting portion 3 can be corrected with a small force.

[0161] Furthermore, since the wired circuit board 1 has the wiring layer 12 and the second wiring layer 14 on both sides of the cover insulating layer 13 in the thickness direction, the routing (freedom of arrangement) of the circuit (wiring pattern) can be increased.

[0162] In this wired circuit board 1, the support layer 17 is the metal supporting board 171, and therefore the frame 2 and the mounting portion 3 each have excellent rigidity. Therefore, the wired circuit board 1 can reliably mount the imaging element 5 on the mounting portion 3 while reliably supporting it with the frame 2.

[0163] In this wired circuit board 1, the second wiring layer 14 and the wiring layer 12 have different thicknesses, so that the second wiring layer 14 can be used for a purpose different from that of the wiring layer 12. Specifically, the second wiring layer 14 can be made thicker than the wiring layer 12 to function as a ground layer capable of passing a large current.

[0164] In this wired circuit board 1, the joint 4A connects the side 33B to the non-opposing side 23A that does not face the side 33B, so that the joint 4A can be made longer, thereby reducing the rigidity of the joint 4A.

[0165] In this wired circuit board, the joint 4A has a curved shape, and therefore the accuracy of vibration correction can be improved compared to an embodiment having a linear and / or bent shape.

[0166] In this wired circuit board 1, the ratio of the length of the connection portion 45 in the direction along the side 33B to the length of the side 33B is 0.3 or less, which prevents the connection portion 45 from widening, thereby reliably reducing the rigidity of the joint 4A.

[0167] In this wired circuit board 1, the joint 4A is connected to the central region 34, so that the vibration of the mounting portion 3 can be controlled with high precision.

[0168] In this wired circuit board 1, the joint 4 is connected to the central portion 35, so that the vibration of the mounting portion 3 can be controlled with high precision.

[0169] In this wired circuit board, the base insulating layer 11, the cover insulating layer 13 and the second cover insulating layer 15 in the joint 4A have the slits 411, 412, so that the rigidity of the joint 4A can be further reduced.

[0170] 3. Modifications In the following modifications, the same components and steps as those in the above-described embodiment are denoted by the same reference numerals, and detailed descriptions thereof will be omitted. Furthermore, each modification can achieve the same effects as those in the first embodiment unless otherwise specified. Furthermore, the first embodiment and its modifications can be combined as appropriate.

[0171] 6E , the cover insulating layer 13 and the second cover insulating layer 15 may include the solder resist 8. Each of the cover insulating layer 13 and the second cover insulating layer 15 at least in the joint 4A includes only the solder resist 8, and does not include the adhesive layer 131 or the second adhesive layer 152.

[0172] A method for manufacturing the wired circuit board 1 of the first modified example will be described with reference to FIGS. 6A to 6E.

[0173] 6A , the cover layer 132 and the adhesive layer 131 are disposed on one side of the base film 61 in the frame 2 and the mounting portion 3. The second cover layer 153 and the second adhesive layer 152 are disposed on the other side of the base film 61 in the frame 2 and the mounting portion 3.

[0174] 6B, solder resist 8 is placed on one surface and the other surface of base film 61 in joint 4. Solder resist 8 is formed into a pattern by photoprocessing.

[0175] As shown in FIG. 6C, protective layers 1212 and 1232 are formed on the frame terminal body 1211 and the terminal body 1231, respectively.

[0176] As shown in FIG. 6D, the support layer 17 and the third adhesive layer 16 are placed on the frame 2 and the mounting portion 3.

[0177] As shown in FIG. 6E, slits 411 and 412 are formed in the solder resist 8.

[0178] 3.1.1 Effects of the First Modification In the first modification, the solder resist 8 in the joint 4A does not include the adhesive layer 131 or the second adhesive layer 152, so the joint 4A can be made thinner. This further reduces the rigidity of the joint 4A. As a result, the vibration of the mounting portion 3 can be corrected with a small force.

[0179] 7, in the second modification, the support layer 17 is a hard substrate 173. The hard substrate 173 is bonded to the second insulating cover layer 15 via a fourth adhesive layer 174.

[0180] The hard substrate 173 includes a third insulating base layer 1731 and a third wiring layer 1732 arranged in this order toward the other side in the thickness direction.

[0181] The third insulating base layer 1731 extends in the planar direction. The third insulating base layer 1731 is hard. An example of the material of the third insulating base layer 1731 is glass-epoxy resin. The third insulating base layer 1731 has through holes 1735. The through holes 1735 are also formed in the fourth adhesive layer 174. The third insulating base layer 1731 has a thickness of, for example, 30 μm or more and, for example, 1000 μm or less.

[0182] The third wiring layer 1732 is electrically connected to the second wiring layer 14 through the vias 175. Each of the vias 175 fills a corresponding one of the through holes 1735. The vias 175 contact the third wiring layer 1732 and the second wiring layer 14. The third wiring layer 1732 may be made of copper, for example. The thickness of the third wiring layer 1732 is, for example, 5 μm or more and, for example, 1000 μm or less.

[0183] Each of the frame 2 and the mounting portion 3 further includes a second hard substrate 176 in addition to the hard substrate 173. The second hard substrate 176 is bonded to the cover insulating layer 13 via a fifth adhesive layer 177.

[0184] The second rigid substrate 176 includes a fourth insulating base layer 1761, a fourth wiring layer 1762, and a fourth insulating cover layer 1763 in this order toward one side in the thickness direction.

[0185] The fourth insulating base layer 1761 covers a part of the fourth wiring layer 1762 .

[0186] The fourth insulating base layer 1761 has through holes 1760. The material of the fourth insulating base layer 1761 is the same as the material of the third insulating base layer 1731.

[0187] The material of the fourth wiring layer 1762 is the same as the material of the third wiring layer 1732. The fourth wiring layer 1762 is electrically connected to the wiring layer 12 through a via 178. The via 178 fills the through hole 1760.

[0188] The fourth insulating cover layer 1763 may be made of a solder resist.

[0189] A method for manufacturing the wired circuit board 1 of the second modified example will be described with reference to FIGS. 8A to 8E.

[0190] As shown in FIG. 8A, first, the cover layer 132 and the second cover layer 153 are bonded to the base film 61 on which the wiring layer 12 and the second wiring layer 14 are provided, thereby preparing the laminate 10.

[0191] 8B , the rigid substrate 173 and the second rigid substrate 176 (the fourth insulating base layer 1761 and the fourth wiring layer 1762) are then respectively bonded to one surface and the other surface of the laminate 10. Specifically, the rigid substrate 173 is bonded to the frame 2 and the other surface of the laminate 10 at the mounting portion 3 via a fourth adhesive layer 174. The second rigid substrate 176 is bonded to the frame 2 and one surface of the laminate 10 at the mounting portion 3 via a fifth adhesive layer 177.

[0192] 8C , through holes 1735 and 1760 are then formed. The through hole 1735 is formed in the rigid substrate 173, the fourth adhesive layer 174, and the second insulating cover layer 15. The through hole 1760 is formed in the second rigid substrate 176, the fifth adhesive layer 177, and the insulating cover layer 13. The through holes 1735 and 1736 are formed by, for example, drilling.

[0193] 8D, the vias 175 and 178 are then formed in the through holes 1735 and 1760, respectively. The vias 175 and 178 are formed by, for example, through-hole plating.

[0194] 8E, the fourth insulating cover layer 1763 is then formed on one surface in the thickness direction of the fourth insulating base layer 1761. The fourth insulating cover layer 1763 is patterned by photoprocessing.

[0195] Thereafter, as shown in FIG. 7, slits 421 and 422 are formed in the insulating base layer 11, the insulating cover layer 13 and the second insulating cover layer 15.

[0196] 3.2.1 Effects of the Second Modification In this wired circuit board 1, the support layer 17 is a hard substrate 173, so that the frame 2 and the mounting portion 3 each have excellent rigidity. The wired circuit board 1 can reliably mount the imaging element 5 on the mounting portion 3 while reliably supporting it with the frame 2.

[0197] Since each of the frame 2 and the mounting portion 3 further includes the second hard substrate 176, the rigidity of each of the frame 2 and the mounting portion 3 can be further improved.

[0198] 3.3 Third Modification As shown in FIG. 9, in the third modification, the hard substrate 173 further includes an additional cover insulating layer 1737 and an additional wiring layer 1738.

[0199] The additional cover insulating layer 1737 covers a part of the third wiring layer 1732. The additional cover insulating layer 1737 has an opening 1739.

[0200] The additional wiring layer 1738 is disposed on the other surface of the additional cover insulating layer 1737. A portion of the additional wiring layer 1738 fills the opening 1739.

[0201] 3.4 Fourth Modification As shown in FIGS. 10 and 11, in the fourth modification, a joint 4A includes sub-joints 4211, 4212, 4221, and 4222.

[0202] Each of the sub-joints 4211 and 4212 divides the slit 411 in the direction in which the slit 411 extends. The sub-joints 4211 and 4212 are spaced apart from each other in the direction in which the slit 411 extends.

[0203] The sub-joints 4221 and 4222 divide the slit 412 in the direction in which the slit 412 extends. The sub-joints 4221 and 4222 are spaced apart in the direction in which the slit 412 extends.

[0204] 10 , the sub-joints 4211 and 4221 are aligned in a direction intersecting (intersecting, preferably perpendicular to) the extension direction of the joint 4. The sub-joints 4212 and 4222 are aligned in a direction intersecting (intersecting, preferably perpendicular to) the extension direction of the joint 4.

[0205] Each of the sub-joints 4211 and 4212 connects the joint wire 125 and the second joint wire 144. As shown in FIG.

[0206] The sub-joints 4211, 4212, 4221, and 4222 each include a base insulating layer 11, a cover insulating layer 13, and a second cover insulating layer 15. More specifically, the sub-joints 4211, 4212, 4221, and 4222 each include only the base insulating layer 11, the cover insulating layer 13, and the second cover insulating layer 15, and do not include the wiring layer 12 or the second wiring layer 14.

[0207] According to the fourth modified example, the sub-joints 4211, 4212, 4221, and 4222 can prevent the rigidity of the joint 4 from being excessively reduced due to the slits 411 and 421. Therefore, excessive deformation of the joint 4 can be prevented.

[0208] The above invention is provided as an exemplary embodiment of the present invention, but this is merely an example and should not be interpreted as limiting. Modifications of the present invention that are obvious to those skilled in the art are intended to be included in the scope of the following claims.

[0209] The wired circuit board of the present invention is suitable for use in, for example, manufacturing an imaging device.

[0210] REFERENCE SIGNS LIST 1 Wired circuit board 2 Frame 3 Mounting portion 4, 4A, 4B, 4C, 4D Joint 11 Base insulating layer 12 Wiring layer 121 Frame terminal 122 Frame wiring 123 Terminal 124 Wiring 125 Joint wiring 13 Cover insulating layer 131 Adhesive layer 132 Cover layer 14 Second wiring layer 142 Second frame wiring 143 Second wiring 1432 Conductive connection portion 144 Second joint wiring 15 Second cover insulating layer 151 Second cover through hole 152 Second adhesive layer 153 Second cover layer 154 Second cover through hole 16 Third adhesive layer 161, 162 Conductive adhesive layer 17 Support layer 171, 172 Metal supporting board 20 Inner peripheral edge 23A, 23B, 23C, 23D Side 26 Frame converging portion 28 Second central portion 29 Second central region 30 Outer peripheral edge 33, 33A, 33B, 33C, 33D Side 34 Central region 35 Central portion 39 Inner peripheral edge 173 Hard substrate 1731 Third base insulating layer 1732 Third wiring layer 1735, 1736 Through hole 174 Fourth adhesive layer 175 Via 176 Second hard substrate 1761 Fourth base insulating layer 1762 Fourth wiring layer 1763 Fourth cover insulating layer 177 Fifth adhesive layer 178 Via 411, 412, 421, 422 Slits 4211, 4212, 4221, 4222 Sub-joint

Claims

1. A wired circuit board comprising: a frame; a mounting portion surrounded by the frame and spaced apart from the frame; and a joint connecting the frame and the mounting portion, wherein each of the frame and the mounting portion includes a base insulating layer, a wiring layer arranged on one side of the base insulating layer in the thickness direction, a cover insulating layer arranged on one side of the base insulating layer in the thickness direction and covering a part of the wiring layer, a second wiring layer arranged on the other side of the base insulating layer in the thickness direction, and a second cover insulating layer arranged on the other side of the base insulating layer in the thickness direction and covering the second wiring layer, and may include a support layer arranged on the other side of the second cover insulating layer in the thickness direction, and the joint does not include the support layer, and includes the base insulating layer, the wiring layer, the cover insulating layer, the second wiring layer, and the second cover insulating layer.

2. The wired circuit board according to claim 1, wherein the support layer is a metal supporting board.

3. The printed circuit board according to claim 2, wherein the thickness of said second wiring layer is different from the thickness of said wiring layer.

4. The wired circuit board according to claim 3, wherein each of the frame and the mounting portion further comprises a third adhesive layer that bonds the support layer and the second cover insulating layer.

5. The wired circuit board according to claim 4, wherein the third adhesive layer is a conductive adhesive layer, the second cover insulating layer in the frame and the joint has a second cover through hole, the second wiring layer includes a ground wiring, and the ground wiring is grounded to the metal supporting board via the conductive adhesive layer, a portion of which fills the second cover through hole.

6. The wired circuit board according to claim 1, wherein the support layer is a rigid substrate having a rigid third base insulating layer and a rigid third wiring layer in that order toward the other side in the thickness direction.

7. The wired circuit board according to claim 6, wherein each of the frame and the mounting portion further comprises a second rigid substrate having a rigid fourth base insulating layer, a fourth wiring layer and a fourth cover insulating layer in that order toward one side in the thickness direction.

8. A wired circuit board as described in claim 1 or claim 2, wherein the cover insulating layer comprises an adhesive layer and a cover layer, in that order, toward one side in the thickness direction, and the second cover insulating layer comprises a second adhesive layer and a second cover layer, in that order, toward the other side in the thickness direction.

9. The wired circuit board according to claim 1 or 2, wherein the mounting portion has a generally rectangular shape and has a side at the outer periphery of the mounting portion, the frame has a generally rectangular frame shape and has an opposing side facing the side and a non-opposing side adjacent to the opposing side and not facing the side, and the joint connects the side and the non-opposing side.

10. The printed circuit board according to claim 1 or 2, wherein the joint has a curved shape.

11. The wired circuit board according to claim 1 or 2, wherein the mounting portion has an edge on an outer periphery of the mounting portion, the joint includes a connection portion where the joint is connected at the edge, and the ratio of the length of the connection portion in a direction along the edge to the length of the edge (length of the connection portion / length of the edge) is 0.3 or less.

12. The wired circuit board according to claim 1 or 2, wherein the mounting portion has a side at an outer peripheral edge of the mounting portion, and the joint is connected to a central region including a central portion of the side and having a length that is 1 / 2 the length of the side.

13. The printed circuit board according to claim 12, wherein the joint connects to the center of the side.

14. A wired circuit board as described in claim 1 or claim 2, wherein the mounting portion has a plurality of sides at an outer periphery of the mounting portion, a plurality of the joints are provided corresponding to the plurality of sides, and the difference in length between the longest joint and the shortest joint among the plurality of the joints is 3 mm or less.

15. The wired circuit board according to claim 1 or 2, wherein the joint includes the wiring layer and the second wiring layer, the wiring layer in the joint has joint wiring, the second wiring layer in the joint has second joint wiring spaced apart from the joint wiring when projected in the thickness direction, and the base insulating layer, the cover insulating layer and the second cover insulating layer in the joint have slits disposed between the joint wiring and the second joint wiring.

16. The wired circuit board according to claim 15, wherein the slit extends along the joint wiring and the second joint wiring, and the joint has a sub-joint that divides the slit in the direction in which the slit extends and connects the joint wiring and the second joint wiring.

Images