Lighting device and head lamp

Abstract

A lighting device according to an embodiment comprises: a heat dissipation plate which includes a recess portion; a circuit board which is disposed in the recess portion and has a pad; a light source part which is disposed on the heat dissipation plate and includes a bonding pad and a light-emitting element; a connection member which connects the pad of the circuit board and the bonding pad of the light source part to each other; and a sealing part which is disposed on the connection member, wherein: the sealing part includes a first sealing portion forming an outer edge, and a second sealing portion disposed inside the outer edge; and the first sealing portion and the second sealing portion comprise the same resin composition.

Description

Lighting devices and headlamps

[0001] The embodiment relates to a lighting device and a headlamp having the same.

[0002] Lighting applications include vehicle lighting, display, and signage backlighting. Light-emitting diodes (LEDs) offer advantages over light sources such as fluorescent and incandescent lamps: low power consumption, a near-permanent lifespan, fast response times, safety, and environmental friendliness. These LEDs are used in various lighting devices, including display devices, indoor lighting, and outdoor lighting.

[0003] Recently, lamps using light-emitting diodes (LEDs) have been proposed as vehicle lighting sources. Compared to incandescent lamps, LEDs offer the advantage of lower power consumption. Furthermore, their small size allows for greater design flexibility, and their semi-permanent lifespan makes them economical. However, because the light emitted from LEDs has a small angle of incidence, there is a need to increase the light-emitting area of ​​LED lamps when using LEDs in vehicle lighting. Korean Patent Publication No. KR10-2023-0010550 (January 19, 2023) discloses prior art related to lighting devices.

[0004] The embodiment provides a lighting device having improved reliability. The embodiment provides a headlamp having a lighting device.

[0005] A lighting device according to an embodiment includes a heat dissipation plate including a recessed portion; a circuit board disposed in the recessed portion and having a pad; a light source portion disposed on the heat dissipation plate and including a bonding pad and a light emitting element; a connecting member connecting the pad of the circuit board and the bonding pad of the light source portion; and a sealing member disposed on the connecting member, wherein the sealing member includes a first sealing member forming an outer edge; and a second sealing member disposed inside the outer edge, wherein the first sealing member and the second sealing member may include the same resin composition.

[0006] According to an embodiment of the invention, the resin composition includes a base resin and a filler, the base resin includes an oligomer, a monomer, and a photoinitiator, the oligomer is included in an amount of 45 wt% to 65 wt% based on the total weight of the resin composition, the monomer is included in an amount of 30 wt% to 50 wt% based on the total weight of the resin composition, the photoinitiator is included in an amount of 1 wt% to 5 wt% based on the total weight of the resin composition, and the filler may be included in an amount of 2 wt% to 10 wt% based on the total weight of the resin composition. The modulus of the resin composition after curing may be in a range of 100 MPa to 8000 MPa. The thixotropic property of the resin composition before curing may be in a range of 2 to 4. The particle size of the filler may be in a range of 5 μm to 30 μm.

[0007] According to an embodiment of the invention, the connecting member includes one end connected to the bonding pad of the light source unit; the other end connected to the pad of the circuit board; and a center portion extending from the one end toward the other end, and the first sealing portion includes a 1-1 sealing portion arranged close to the one end, a 1-2 sealing portion arranged close to the other end, and a 1-3 sealing portion connecting the 1-1 sealing portion and the 1-2 sealing portion, and the 1-1 sealing portion, the 1-2 sealing portion, and the 1-3 sealing portion may be formed integrally.

[0008] According to an embodiment of the invention, the maximum height of the second sealing portion may be in a range of 1 to 5 times the maximum height of the first sealing portion.

[0009] According to an embodiment of the invention, the maximum height of the first-second sealing portion may be greater than or equal to the maximum height of the first-first sealing portion. The maximum height of the first-second sealing portion may be in a range of 1 to 2.5 times the maximum height of the first-first sealing portion.

[0010] According to an embodiment of the invention, the second sealing portion and the connecting member are spaced apart by a first interval, the first interval being defined as a interval between a maximum height of the connecting member and the second sealing portion, and the first interval may be in a range of 100 μm to 200 μm.

[0011] According to an embodiment of the invention, the first-first sealing portion and the light-emitting element are spaced apart by a second interval, and the second interval may be in the range of 0.8 mm to 1 mm.

[0012] According to an embodiment of the invention, light emitted from the light-emitting element and the first sealing portion form a first angle, light emitted from the light-emitting element and the second sealing portion form a second angle, and at least one of the first angle and the second angle may be 30° or less.

[0013] According to an embodiment of the invention, the connecting member comprises: one end connected to the bonding pad of the light source unit; the other end connected to the pad of the circuit board; And a center portion extending from the first end toward the other end, the first sealing portion includes a 1-1 sealing portion arranged close to the first end, a 1-2 sealing portion arranged close to the other end, and a 1-3 sealing portion connecting the 1-1 sealing portion and the 1-2 sealing portion, the 1-1 sealing portion includes a 1-1a sealing portion and a 1-1b sealing portion, the 1-1a sealing portion is arranged closer to the first end than the 1-1b sealing portion, the 1-2 sealing portion includes a 1-2a sealing portion and a 1-2b sealing portion, the 1-2a sealing portion is arranged closer to the other end than the 1-2b sealing portion, and the 1-1 sealing portion may include a 1-3a sealing portion and a 1-3b sealing portion. According to an embodiment of the invention, the 1-1a sealing portion, the 1-2a sealing portion, and the 1-3a sealing portion form a first outer edge portion, the 1-1b sealing portion, the 1-2b sealing portion, and the 1-3b sealing portion form a second outer edge portion, and the first outer edge and the second outer edge can be spaced apart from each other.

[0014] According to an embodiment of the invention, the second sealing portion may be positioned inside the first outer edge. The height of the first outer edge may be greater than the height of the second outer edge.

[0015] A headlamp according to an embodiment of the invention comprises a housing; and a light source module disposed inside the housing, wherein the light source module may include the lighting device disclosed above.

[0016] A lighting device according to an embodiment includes a sealing member. The sealing member protects a connecting member connected to a light source unit and prevents the connecting member from being damaged by external impact. This improves the reliability of the lighting device.

[0017] The sealing portion includes a first sealing portion and a second sealing portion. The first sealing portion forms an outer edge of the sealing portion. The second sealing portion is disposed inside the outer edge. The first sealing portion and the second sealing portion are formed by a resin composition. The resin composition includes an oligomer, a monomer, a photoinitiator, and a filler. The oligomer, the monomer, the photoinitiator, and the filler are included in a set weight %. Accordingly, the thixotropy and elasticity of the resin composition can be controlled. Specifically, the resin composition can satisfy the thixotropy required by the first sealing portion. In addition, the resin composition can satisfy the elasticity required by the second sealing portion. Therefore, the first sealing portion and the second sealing portion can be formed by the same resin composition. In addition, the first sealing portion and the second sealing portion can be formed by the same process. Accordingly, the process efficiency of forming the sealing portion is improved.

[0018] The height of the first sealing portion and the height of the second sealing portion have set heights, and the first sealing portion can protect the surface of the light-emitting element and suppress light interference. The second sealing portion can cover the surface of the connecting member and protect the connecting member. Accordingly, the reliability of the lighting device can be improved and its size can be reduced.

[0019] Fig. 1 is a perspective view showing a connection member arranged between a light source and a circuit board in a lighting device according to an embodiment.

[0020] Fig. 2 is a side cross-sectional view of a lighting device having a sealing portion in Fig. 1.

[0021] Fig. 3 is a partially enlarged view showing the light source unit, circuit board, and connecting member in the lighting device of Fig. 1.

[0022] Fig. 4 is a plan view of a lighting device having a sealing portion in Fig. 3.

[0023] Fig. 5 is a plan view of a lighting device having multiple sealing portions in Fig. 3.

[0024] Fig. 6 is a side cross-sectional view for explaining the connection of the light source, connecting member, and heat dissipation plate of the lighting device of Fig. 5.

[0025] Figure 7 is an enlarged view of area A of Figure 6.

[0026] Fig. 8 is a photograph showing a light source, a connecting member, and a heat dissipation plate of a lighting device according to an embodiment.

[0027] Fig. 9 is a drawing for explaining the thickness ratio of the sealing portion in the AA' area of ​​Fig. 9.

[0028] Fig. 10 is another plan view of the lighting device of Fig. 3.

[0029] Fig. 11 is a side cross-sectional view for explaining the connection of the light source, connecting member, and heat dissipation plate of the lighting device of Fig. 10.

[0030] Figure 12 is an enlarged view of area B of Figure 11.

[0031] Fig. 13 is a perspective view of a headlamp to which a lighting device according to an embodiment is applied.

[0032] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and one or more of the components between the embodiments can be selectively combined or substituted within the scope of the technical idea of ​​the present invention. Terms (including technical and scientific terms) used in the embodiments of the present invention can be interpreted as having a meaning that can be generally understood by a person having ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, can be interpreted in consideration of the contextual meaning of the related technology.

[0033] The terminology used in the embodiments of the present invention is for the purpose of describing the embodiments and is not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when it is described as “A and (or at least one) of B, C”, it may include one or more of all combinations that can be combined with A, B, and C. In addition, when describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the components from other components, and the nature, order, or sequence of the components are not limited by the terms.

[0034] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0035] Additionally, when it is described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when it is expressed as "above" or "below", it can include the meaning of the downward direction as well as the upward direction based on one component.

[0036] Below, a lighting device according to an embodiment is described with reference to the drawings.

[0037] Referring to FIGS. 1 to 9, a lighting device according to an embodiment may include a heat dissipation plate (101), a circuit board (110) disposed on the heat dissipation plate (101), a light source unit (130) disposed on the heat dissipation plate (101) and including a light emitting element (131), a connecting member (141, 142) connecting the light source unit (130) and the circuit board (110), and a sealing member (200) sealing the connecting member (141, 142).

[0038] The lighting device described above is applicable to various lamp devices requiring lighting. For example, the lighting device can be applied to vehicle lamps, household lighting devices, and industrial lighting devices. For example, the lighting device can be applied to the vehicle lamp. The lighting device can be applied to headlamps, side mirror lights, side marker lights, fog lights, tail lights, brake lights, daytime running lights, vehicle interior lights, door scars, rear combination lamps, and backup lamps. The lighting device can also be applied to indoor or outdoor advertising devices, display devices, and electric vehicle fields.

[0039]

[0040] The heat dissipation plate (101) supports a circuit board (110). Heat generated in the circuit board (110) can be transferred by the heat dissipation plate (101). The heat dissipation plate (101) includes metal. For example, the heat dissipation plate (101) may be formed by a laminated structure of a plurality of metal layers. The heat dissipation plate (101) may be formed as a single layer or multiple layers. The heat dissipation plate (101) may include a ceramic material, AlN, or an aluminum material having an anodized surface layer. The metal layer may include at least one of Al, Ni, Mo, Cu, Cu-alloy, Cu-W, Ag, or Au. The heat dissipation plate (101) includes a heat dissipation portion (102) and a side portion (103). The heat dissipation portion (102) includes a recess portion (108). The circuit board (110) is placed in the recessed portion (108). The area of ​​the heat dissipation portion (102) may be larger than the area of ​​the circuit board (110). The side portion (103) is bent backward from the edge of the heat dissipation portion (102). One or more of the side portions (103) may be placed along the outer side of the heat dissipation portion (102). An empty space (109) may be provided on the inner side of the side portion (103) and the lower part of the heat dissipation portion (102), or another structure may be combined therewith. The heat dissipation plate (101) may be a support plate.

[0041] The recessed portion (108) is formed at a predetermined depth on the upper surface of the heat dissipation portion (102) of the heat dissipation plate (101). The depth of the recessed portion (108) may be the same as or different from the thickness of the circuit board (110). For example, the depth of the recessed portion (108) may be smaller than the thickness of the circuit board (110). The top view shape of the recessed portion (108) may be the same as the top view shape of the circuit board (110). For example, the top view shape of the recessed portion (108) may include a polygonal shape.

[0042]

[0043] The circuit board (110) is inserted into the recessed portion (108). The circuit board (110) and the bottom surface of the recessed portion (108) can be bonded by an adhesive member (155). The adhesive member (155) can include a thermally conductive adhesive. The upper surface of the circuit board (110) can be arranged on the same plane as the upper surface of the heat dissipation plate (101). As another example, the upper surface of the circuit board (110) can be arranged higher than the upper surface of the heat dissipation plate (101). As shown in Fig. 6, the adhesive member (155) is arranged on the outer periphery of the recessed portion (108). Accordingly, the surface of the heat dissipation portion (102) can be bonded to the circuit board (110).

[0044] The circuit board (110) may include a resin material or a metal material. For example, the circuit board (110) may include any one of a ceramic-based PCB, an MCPCB (Metal Core PCB), a flexible PCB (FPCB, Flexible PCB), and a resin-based PCB. The circuit board (110) may include a metal layer at the bottom, a circuit layer having a pad at the top, a protective layer made of an insulating material for protecting the circuit layer at the top, and an insulating layer between the metal layer and the circuit layer. The circuit board (110) may be provided as an MCPCB having a metal layer at the bottom. In addition, the circuit board (110) may transfer heat to the heat dissipation plate (101).

[0045] The circuit board (110) may be fastened to the heat dissipation unit (102) by a fastening means (119). The fastening means (119) may include one or more screws. The circuit board (110) and the heat dissipation unit (102) may be fastened and tightly attached by the screws. When the circuit board (110) is fixed by the fastening means (119), the adhesive member (155) may be removed. Accordingly, the circuit board (110) may be easily separated.

[0046] The circuit board (110) may include a plurality of pads. The pads (111, 112) may include a first pad (111) and a second pad (112) that are spaced apart from each other. The first pad (111) and the second pad (112) may be connected to a connector (115) disposed on an upper portion of the circuit board (110) by a circuit layer of the circuit board (110). The connector (115) may receive a driving signal and power from the outside. The pads (111, 112) and the connector (115) may be disposed on both edges of the circuit board (110). The fastening means (119) may be disposed in an area between the pads (111, 112) and the connector (115). The first pad (111) and the second pad (112) are disposed adjacent to one side of the circuit board (110). The above pads (111, 112) can be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, and Au and optional alloys thereof.

[0047]

[0048] The light source unit (130) may be disposed on the heat dissipation unit (102). The light source unit (130) may be adjacent to the recessed unit (108). The light source unit (130) may be adjacent to one side of the circuit board (110). One side of the circuit board (110) may be disposed between the pads (111, 112) and the light source unit (130). The light source unit (130) may include a support member (133) and at least one light emitting element (131) disposed on the support member (133). A plurality of light emitting elements (131) may be sealed by a resin member (132). The support member (133) may include a ceramic substrate or a semiconductor substrate. The support member (133) may support the plurality of light emitting elements (131). In addition, the support member (133) may include a conductive pattern. The plurality of light-emitting elements (131) may be electrically connected by the conductive pattern. The support member (133) may electrically connect each of the plurality of light-emitting elements (131) to a bonding pad (134, 135). The anode terminal and the cathode terminal of each of the plurality of light-emitting elements (131) may be electrically connected to the first and second bonding pads (134, 135).

[0049] A protection element (not shown) for protecting the light emitting elements (131) may be disposed on the support member (133). The protection element may be implemented with a thyristor, a zener diode, or a TVS (transient voltage suppression). By this, the light emitting elements (131) may be protected from ESD (electro static discharge). The support member (133) may be formed of a ceramic material or an MCPCB material. The light source unit (130) may transfer heat generated from the light emitting elements (131) to the heat dissipation plate (101) by the support member (133). The support member (133) and the heat dissipation plate (101) may be bonded by an adhesive. The adhesive (138) may include a thermally conductive adhesive having metal powder or inorganic powder in a resin material. For example, the adhesive (138) may include a TIM (thermal interface material).

[0050] The adhesive (138) may be arranged along the lower surface and the lower side surface of the support member (133). The adhesive (138) may be arranged on the outer side surface of the support member (133) and may be in contact with each side surface of the support member (133).

[0051]

[0052] The light emitting elements (131) are arranged in a plurality in one direction or in at least one row. The plurality of light emitting elements (131) may be connected to each other in series. The plurality of light emitting elements (131) may include at least one of a blue, green, or red LED chip. The plurality of light emitting elements (131) may be flip-chip or wire-bonded. The light emitting element (131) may include a plurality of semiconductor layers made of a compound semiconductor of group II and group VI elements or / and a compound semiconductor of group III and group V elements. At least one or all of the plurality of semiconductor layers may include a compound semiconductor of a series such as AlInGaN, InGaN, AlGaN, GaN, GaAs, InGaP, AllnGaP, InP, or InGaAs.

[0053] The resin member (132) may include silicone or epoxy. The resin member (132) may include a transparent layer and / or a phosphor layer (not shown) on the light-emitting element (131). A reflective wall (not shown) may be included around the transparent layer and / or the phosphor layer. The resin member (132) may further include a convex lens (not shown). The phosphor layer may include at least one or two or more of a yellow phosphor, a green phosphor, a blue phosphor, and a red phosphor. When the phosphor layer is disposed on the light-emitting element (131), the phosphor layer may be exposed to the upper surface of the light source unit (130). The light source unit (130) may emit white light.

[0054]

[0055] Referring to FIGS. 3 to 5, the light-emitting element (131) is disposed on an upper portion of one side of the support member (133). Bonding pads (134, 135) are exposed on the upper portion of the other side of the support member (133). The bonding pads (134, 135) may include a first bonding pad (134) connected to the cathodes of the plurality of light-emitting elements (131) and a second bonding pad (135) connected to the anodes of the plurality of light-emitting elements (131). The first bonding pad (134) may have a color-coded mark and function as a cathode terminal, and the second bonding pad (135) may function as an anode terminal. The first bonding pad (134) and the second bonding pad (135) may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, and Au and optional alloys thereof.

[0056] The first bonding pad (134) and the first pad (111) are connected by a first connecting member (141), and the second bonding pad (135) and the second pad (112) are connected by a second connecting member (142). The first connecting member (141) and the second connecting member (142) may be formed of a wire. The first connecting member (141) and the second connecting member (142) may include at least one of Au, Al, Ag, and Ni. The first connecting member (141) and the second connecting member (142) have one end (41) bonded to the first bonding pad (134) and the second bonding pad (135), respectively, and the other end (43) bonded to the first pad (111) and the second pad (112), respectively. The first connecting member (141) and the second connecting member (142) include a center portion (42) extending from one end (41) toward the other end (43). The center portion (42) may extend from the other side of the light source portion (130) to one side of the circuit board (110). The center portion (42) may extend onto a recess portion (108) between the circuit board (110) and the heat dissipation portion (102). The height of the one end (41) may be arranged higher than the height of the other end (43). The height of the center portion (42) may be arranged higher than the one end (41).

[0057]

[0058] The light source unit (310) and the circuit board (110) are electrically connected by the first connecting member (141) and the second connecting member (142). The connecting members (141, 142) include wires having a width greater than a thickness, i.e., a ribbon shape. Accordingly, the connecting members (141, 142) may be damaged by external impact. In addition, when the connecting members (141, 142) are exposed to the outside, they may react with substances in the air and corrode. Accordingly, the electrical connection characteristics of the light source unit (310) and the circuit board (110) may be reduced. In order to prevent the above-described problems, the lighting device according to the embodiment includes a sealing member.

[0059] Referring to FIGS. 4 to 7, a lighting device according to an embodiment includes the sealing member (200). The sealing member (200) is disposed on the connecting member (141, 142). The sealing member (200) surrounds the connecting member (141, 142). The sealing member (200) includes a resin composition. Specifically, the sealing member (200) includes a base resin and a plurality of fillers disposed inside the base resin. The base resin may include an acrylic resin. The base resin may include a photocurable resin. The base resin may include an oligomer, a monomer, and a photoinitiator. The resin composition may be cured by a reaction of the oligomer, the monomer, and the photoinitiator. The oligomer may include a urethane acrylate, and the additive monomer may include an acrylate. In addition, the photoinitiator may include a known photoinitiator for UV curing. The filler is disposed within the base resin. The filler is dispersed within the base resin. The filler may include particles having a spherical or (nano)wire shape. The particle diameter of the filler may be 5 μm or more. Specifically, the particle diameter of the filler may be 5 μm to 30 μm. The filler may include a metal or a non-metal. For example, the filler may include aluminum (Al) or silica (Si). The oligomer, the monomer, and the filler may be included in a set weight % relative to the total weight % of the resin composition.

[0060] The weight of the oligomer, the monomer, and the filler is related to the thixotropic property (TI), elasticity, viscosity, and adhesiveness of the resin composition. Specifically, the thixotropic property of the resin composition before curing and the elasticity and viscosity of the resin composition after curing may vary depending on the weight range of the oligomer, the monomer, and the filler. The oligomer may be included in an amount of 40 wt% or more based on the total weight of the resin composition (100 wt%). Specifically, the oligomer may be included in an amount of 45 wt% to 65 wt% based on the total weight% of the resin composition. Since the oligomer is included in the above weight% range, the viscosity of the resin composition after curing may decrease and the elasticity may increase. The monomer may be included in an amount of 30 wt% or more based on the total weight% of the resin composition. Specifically, the monomer may be included in an amount of 30 wt% to 50 wt% based on the total weight% of the resin composition. Since the monomer is included in the above weight% range, the viscosity of the resin composition after curing may decrease. In addition, the adhesive strength between the sealing portion and the heat dissipation plate (101) and the circuit board (110) is increased.

[0061] The filler may be included in an amount of 1 wt% or more based on the total weight of the resin composition. Specifically, the filler may be included in an amount of 2 wt% to 10 wt% based on the total weight of the resin composition. Since the filler is included in the above weight % range, the thixotropic properties of the resin composition before curing are increased. This facilitates the manufacturing process of the sealing portion. In addition, the viscosity of the resin composition after curing is reduced.

[0062] The photoinitiator may be included in an amount of 1 wt% or more based on the total weight of the resin composition. Specifically, the photoinitiator may be included in an amount of 1 wt% to 5 wt% based on the total weight of the resin composition. The properties of the resin composition are controlled by the weight ratios of the oligomer, the monomer, the filler, and the photoinitiator.

[0063] In detail, the thixotropy of the resin composition before curing is controlled. In detail, the thixotropy of the resin composition before curing may be 2 to 4. Since the thixotropy satisfies the above range, the sealing portion can be easily formed. This will be described in detail below. The elasticity of the resin composition after curing is controlled. In detail, the modulus of the resin composition after curing may be 100 MPa or more. More specifically, the modulus of the resin composition after curing may be 100 MPa to 8000 MPa. Thereby, the sealing portion can be prevented from being damaged by external impact.

[0064]

[0065] Referring to Fig. 4, the sealing portion (200) includes a first sealing portion (210) and a second sealing portion (220). The first sealing portion (210) is disposed at the edge of the sealing portion (200). The first sealing portion (210) may form an outer rim of the sealing portion (200). The sealing portion (200) may form an inner region in which the second sealing portion (220) is disposed by the first sealing portion (210). The first sealing portion (210) is divided into a first-first sealing portion (211), a first-second sealing portion (212), and a first-third sealing portion (213) depending on the position.

[0066] The first-first sealing portion (211) is positioned close to the light source portion (130). The first-first sealing portion (211) is positioned close to the first end (41). The first-second sealing portion (212) is positioned close to the circuit board (110). The first-second sealing portion (213) is positioned close to the other end (43). The first-third sealing portion (213) connects the first-first sealing portion (211) and the first-second sealing portion (212). The first-first sealing portion (211), the first-second sealing portion (212), and the first-third sealing portion (213) are distinguished by position and formed integrally. The first-first sealing portion (211), the first-second sealing portion (212), and the first-third sealing portion (213) form the outer edge of the sealing portion (200). Accordingly, the first sealing portion (210) can serve as a dam of the sealing portion (200).

[0067] The first sealing portion (210) includes the resin composition. Specifically, the first sealing portion (210) is formed by curing the resin composition. The resin composition has the physical properties described above. Specifically, the resin composition has a thixotropic property within a set range. Accordingly, the flowability of the first sealing portion (210) can be controlled before curing the first sealing portion. Accordingly, after the second sealing portion (220) is arranged on the inside of the first sealing portion (210), the first sealing portion (210) and the second sealing portion (220) can be cured simultaneously. In addition, the material of the first sealing portion (210) and the material of the second sealing portion (220) can be used as the same material. Therefore, the process efficiency of forming the sealing portion (200) can be improved.

[0068] When the thixotropy of the resin composition is 2 or less, when the second sealing portion (220) is placed inside the first sealing portion (210), the first sealing portion (210) may be pushed outward. Accordingly, it becomes difficult for the first sealing portion (210) to function as a dam. Accordingly, a process of separately curing the first sealing portion (210) is required. Alternatively, a process of increasing the height of the first sealing portion (210) is required. Accordingly, the process efficiency of forming the sealing portion (200) may be reduced. In addition, when the thixotropy of the resin composition exceeds 4, the viscosity and modulus of the cured resin composition may change. Accordingly, the sealing portion (200) may be damaged by external impact.

[0069]

[0070] The second sealing portion (220) is disposed in the inner region of the sealing portion (200). Specifically, the second sealing portion (220) is disposed in the inner region of the first sealing portion (210). The first sealing portion (210) forms an outer edge of the sealing portion (200). The second sealing portion (220) is disposed inside the outer edge. The second sealing portion (220) may be a protective layer that protects the connecting members (141, 142). The second sealing portion (220) is disposed to surround the connecting members (141, 142). This prevents the connecting members (141, 142) from being damaged by external impact. The second sealing portion (220) includes the resin composition. Specifically, the second sealing portion (220) is formed by curing the resin composition. In detail, the resin composition forming the second sealing portion (220) is the same as the resin composition forming the first sealing portion (210).

[0071] The above resin composition has the physical properties described above. Specifically, the resin composition has a viscosity and modulus within a set range. Specifically, the modulus of the second sealing portion (220) formed by curing the resin composition may be 100 MPa to 8000 MPa. Accordingly, the elasticity of the second sealing portion can be controlled. Accordingly, the connecting members (141, 142) can be protected by the sealing portion (200). That is, since the sealing portion (200) is protected from external impact, the connecting members (141, 142) can be easily protected by the sealing portion (200). The first sealing portion (210) and the second sealing portion (220) are formed of the same resin composition. Specifically, the resin composition has thixotropy, viscosity, and modulus within a set range. Accordingly, the resin composition can satisfy both the physical properties required by the first sealing portion (210) and the physical properties required by the second sealing portion (220). Specifically, the resin composition satisfies the thixotropic properties required by the first sealing portion (210). In addition, the resin composition satisfies the modulus required by the second sealing portion (220).

[0072] Accordingly, the first sealing portion (210) and the second sealing portion (220) can be formed in the same process using the same resin composition. For example, the first sealing portion (210) is applied to form the outer edge of the sealing portion (200). Subsequently, the second sealing portion (220) is applied to the inside of the outer edge. Subsequently, the first sealing portion (210) and the second sealing portion (220) can be cured simultaneously. Therefore, the process time for forming the sealing portion (200) is shortened. Accordingly, the process efficiency is improved.

[0073]

[0074] The first sealing portion (210) and the second sealing portion (220) may have set heights based on the upper surface of the circuit board (110) or the upper surface of the heat dissipation plate (101). The height of the first sealing portion (210) may be defined by the thickness of the first sealing portion (210). In addition, the height of the second sealing portion (220) may be defined by the thickness of the second sealing portion (220). The height (H2) of the first sealing portion (210) and the height (H2) of the second sealing portion (220) may be different. In detail, the height (H2) of the second sealing portion (220) is greater than the height of the first sealing portion (210) based on the upper surface of the circuit board (110) or the upper surface of the heat dissipation plate (101). In detail, the maximum height of the second sealing portion (220) is greater than the maximum height of the first sealing portion (210). The height (H2) of the second sealing portion may be at least two, three, or four times the height of the first sealing portion (210). In detail, the height (H2) of the second sealing portion (220) may be more than one to five times the height of the first sealing portion (210).

[0075] If the height (H2) of the second sealing portion is less than one time the height of the first sealing portion, the second sealing portion (220) may not completely surround the connecting member (141, 142). As a result, the connecting member (141, 142) may expose the sealing portion (200) to the outside. Alternatively, if the height (H2) of the second sealing portion (220) is less than one time the height of the first sealing portion (210), the distance between the connecting member (141, 142) and the second sealing portion (220) may become small. As a result, an external impact may be transmitted to the connecting member (141, 142). As a result, the connecting member (141, 142) may be damaged by the external impact. The height (H1-1) of the 1-1 sealing portion and the height (H1-2) of the 1-2 sealing portion may be the same or different. For example, the height (H1-2) of the 1-2 sealing portion may be greater than or equal to the height (H1-1) of the 1-1 sealing portion. That is, the height (H1-2) of the 1-2 sealing portion may be the same as or greater than the height (H1-1) of the 1-1 sealing portion. In detail, the height (H1-2) of the 1-2 sealing portion may be 1 to 1.5 times, 1 to 2 times, or 1 to 2.5 times the height (H1-1) of the 1-1 sealing portion. When the height (H1-1) of the 1-1 sealing portion and the height (H1-2) of the 1-2 sealing portion are formed to be the same or similar, the process of forming the first sealing portion (210) can be facilitated. If the height (H1-2) of the first-second sealing portion is made greater than the height (H1-1) of the first-first sealing portion, the height deviation of the second sealing portion is reduced. The first-first sealing portion (211) is positioned higher than the first-second sealing portion (212). Accordingly, a step may be formed in the outer region of the second sealing portion (220). Since the height (H1-2) of the first-second sealing portion is positioned greater than the height (H1-1) of the first-first sealing portion, the height difference of the second sealing portion (220) may be reduced.

[0076]

[0077] The second sealing portion (220) and the connecting member (141, 142) may be spaced apart from each other. The distance between the second sealing portion (220) and the connecting member (141, 142) may be defined as a first gap (G1). The first gap (G1) is defined as a gap in the height direction of the second sealing portion (220). The first gap (G1) may be defined as a gap between a high point of the connecting member (141, 142) and a high point of the second sealing portion (220). The first gap (G1) may be 100 μm or more. In detail, the first gap (G1) may be 100 μm to 200 μm, 120 μm to 180 μm, or 140 μm to 160 μm. If the first gap (G1) is less than 100 μm, the amount of sealing portion arranged between the second sealing portion (220) and the connecting member (141, 142) becomes small. Accordingly, an external impact may pass through the second sealing portion (220) and be transmitted to the connecting member (141, 142). Accordingly, the reliability of the lighting device may be reduced. If the first gap (G1) exceeds 200 μm, the height of the second sealing portion (220) increases. Accordingly, the thickness of the illuminating device may be thickened by the second sealing portion (220).

[0078]

[0079] The above 1-1 sealing portion (211) and the light emitting element (131) may be spaced apart from each other. The distance between the 1-1 sealing portion (211) and the light emitting element (131) may be defined as a second gap (G2). It is defined as a gap in the longitudinal direction of the connecting members (141, 142). The second gap (G2) may be 0.8 mm or more. In detail, the second gap (G2) may be 0.8 mm to 1 mm. When the second gap (G2) is less than 0.8 mm, the 1-1 sealing portion (211) may also be placed in an area where the light emitting element (131) is placed during the process of forming the sealing portion. In addition, when the second gap (G2) exceeds 1 mm, the gap between the light emitting element (131) and the bonding pads (134, 135) may increase. By this, the size of the light source unit (130) can be increased. By this, the size of the lighting device can be increased.

[0080] The height of the first sealing portion (210) and the height (H2) of the second sealing portion (220) are limited by the light-direction angle of the light-emitting element (131). Specifically, the light-direction angle of the light-emitting element (131) may be 120° or more. Accordingly, the first angle (θ1) formed between the light emitted from the light-emitting element (131) and the first sealing portion (210) may be 30° or less. In addition, the second angle (θ2) formed between the light emitted from the light-emitting element (131) and the second sealing portion (220) may be 30° or less. Accordingly, the Lambertian emission of the light-emitting element (131) is not interfered with by the sealing portion (200). Therefore, the brightness and light efficiency of the lighting device may be improved.

[0081]

[0082] FIG. 8 and FIG. 9 are drawings for explaining a sealing portion of a lighting device according to an embodiment and a thickness profile of the sealing portion.

[0083] Referring to FIGS. 8 and 9, the sealing portion (200) includes a first sealing portion (210) and a second sealing portion (220). The first sealing portion (210) and the second sealing portion (220) are formed of the same resin composition. However, the first sealing portion (210) and the second sealing portion (220) have different application orders. In addition, the first sealing portion (210) and the second sealing portion (220) are arranged at different heights. Therefore, they are distinguished by the boundary between the first sealing portion (210) and the second sealing portion (220).

[0084] Referring to Fig. 9, the maximum height (H2) of the second sealing portion (220) is greater than the heights (H1-1, H1-2) of the first sealing portion (210). In detail, the height of the second sealing portion (220) in contact with the first sealing portion (210) is smaller than the height of the first sealing portion (210). However, the height of the second sealing portion (220) gradually increases and becomes larger than the height of the first sealing portion (210). The second sealing portion (220) is arranged in a shape that gradually increases and then decreases.

[0085] The first sealing portion (210) is formed using the resin composition. Accordingly, the first sealing portion has a thixotropic property within a set range before curing. Accordingly, when the second sealing portion is filled, the first sealing portion does not collapse. Accordingly, the second sealing portion does not overflow outside the first sealing portion. Accordingly, the second sealing portion is not disposed outside the first sealing portion.

[0086]

[0087] The lighting device according to the embodiment includes a sealing portion (200).

[0088] The sealing portion (200) protects the connecting member (141, 142). Accordingly, the connecting member (141, 142) can be prevented from being damaged by external impact. Thereby, the reliability of the lighting device is improved. The sealing portion (200) includes a first sealing portion (210) and a second sealing portion (220). The first sealing portion (210) forms an outer edge of the sealing portion (200). The second sealing portion (220) is arranged inside the outer edge.

[0089] The first sealing portion (210) and the second sealing portion (220) are formed by a resin composition. The resin composition includes an oligomer, a monomer, a photoinitiator, and a filler. The oligomer, the monomer, the photoinitiator, and the filler are included in a set weight %. Accordingly, the thixotropic property and elasticity of the resin composition can be controlled. Specifically, the resin composition can satisfy the thixotropic property required by the first sealing portion (210). In addition, the resin composition can satisfy the elasticity required by the second sealing portion (220). Therefore, the first sealing portion (210) and the second sealing portion (220) can be formed by the same resin composition. In addition, the first sealing portion (210) and the second sealing portion (220) can be formed by the same process. Accordingly, the process efficiency of forming the sealing portion (200) is improved.

[0090] In addition, the height of the first sealing portion (320) and the height of the second sealing portion (220) have sizes set based on the upper surface of the circuit board (110) or the upper surface of the heat dissipation plate (101). In addition, the first sealing portion (210) and the light-emitting element (131) are spaced apart at a set interval, and the second sealing portion (220) may have an interval for protecting the surface of the connecting member (141, 142). Accordingly, the reliability of the lighting device can be improved and its size can be reduced.

[0091]

[0092] Hereinafter, a lighting device according to another embodiment will be described with reference to FIGS. 10 to 12. Descriptions of the same content as those of the lighting device according to the previously described embodiment will be omitted. Furthermore, identical components are assigned the same drawing reference numerals.

[0093] Referring to FIGS. 10 to 12, the lighting device includes the sealing portion (200). The sealing portion (200) includes a first sealing portion (210) and a second sealing portion (220). The first sealing portion (210) is divided into a first-first sealing portion (211), a first-second sealing portion (212), and a first-third sealing portion (213) according to their positions. The first-first sealing portion (211) is disposed close to the light source portion (130). The first-first sealing portion (211) is disposed close to the first end (41). The first-second sealing portion (212) is disposed close to the circuit board (110). The first-second sealing portion (213) is disposed close to the other end (43).

[0094] The first-third sealing portion (213) connects the first-first sealing portion (211) and the first-second sealing portion (212). The first-first sealing portion (211), the first-second sealing portion (212), and the first-third sealing portion (213) are distinguished by their positions and are formed as one piece. The first-first sealing portion (211), the first-second sealing portion (212), and the first-third sealing portion (213) form the outer edge of the sealing portion (200). Accordingly, the first sealing portion (210) can function as a dam of the sealing portion (200). The first-first sealing portion (211), the first-second sealing portion (212), and the first-third sealing portion (213) may each include two sealing portions. For example, the first-first sealing portion (211) may include the first-1a sealing portion (211a) and the first-1b sealing portion (211b). The first-1a sealing portion (211a) is disposed inside the first-1b sealing portion (211b). In detail, the first-1a sealing portion (211a) is disposed closer to the end (41) than the first-1b sealing portion (211b). In detail, the first-1b sealing portion (211b) is disposed closer to the light source portion (130) than the first-1a sealing portion (211a). In detail,

[0095] The above-mentioned 1-2 sealing portion (212) may include the 1-2a sealing portion (212a) and the 1-2b sealing portion (221b). The 1-2a sealing portion (212a) is positioned inside the 1-2b sealing portion (212b). In detail, the 1-2a sealing portion (212a) is positioned closer to the other end (43) than the 1-2b sealing portion (212b).

[0096] The above 1-3 sealing portion (213) may include the 1-3a sealing portion and the 1-3b sealing portion. The 1-3a sealing portion (213a) is positioned inside the 1-3b sealing portion (213b).

[0097] The above 1-1a sealing portion (211a), the 1-2a sealing portion (212a), and the 1-3a sealing portion are connected. The 1-1a sealing portion (211a), the 1-2a sealing portion (212a), and the 1-3a sealing portion (213a) are formed integrally. The first sealing portion (210) forms a first outer edge by the 1-1a sealing portion (211a), the 1-2a sealing portion (212a), and the 1-3a sealing portion (213a).

[0098] The above 1-1b sealing portion (211b), the 1-2b sealing portion (212b), and the 1-3b sealing portion are connected. The 1-1b sealing portion (211b), the 1-2b sealing portion (212b), and the 1-3b sealing portion (213b) are formed integrally. The first sealing portion (210) forms a second outer edge by the 1-1b sealing portion (211b), the 1-2b sealing portion (212b), and the 1-3b sealing portion (213b). The first outer edge and the second outer edge are spaced apart from each other. The first outer edge is arranged inside the second outer edge. That is, the first outer edge is positioned closer to one end (41) and the end (43) of the connecting member (141, 142) than the second outer edge.

[0099]

[0100] The second sealing portion (220) is arranged inside the first outer rim. The first outer rim prevents the second sealing portion (220) from overflowing outside the first sealing portion (210). The second outer rim further prevents the second sealing portion (220) from overflowing. When applying the second sealing portion (220), an error in the application amount of the resin composition may occur. As a result, the second sealing portion (220) may overflow outside the first outer rim. The resin composition overflowing outside the first outer rim is prevented from flowing outside the first sealing portion (210) by the second outer rim. Accordingly, the resin composition can be prevented from flowing into the light source portion (130) during the process.

[0101] The height of the 1-1a sealing portion (211a) may be the same as the height of the 1-1b sealing portion (211b). The height of the 1-2a sealing portion (212a) may be the same as the height of the 1-2b sealing portion (211b). The height of the 1-3a sealing portion (213a) may be the same as the height of the 1-3b sealing portion (213b). As another example, the height of the 1-1a sealing portion (211a) may be different from the height of the 1-1b sealing portion (211b). In detail, the height of the 1-1a sealing portion (211a) may be greater than the height of the 1-1b sealing portion (211b). The height of the 1-2a sealing portion (212a) may be different from the height of the 1-2b sealing portion (211b). In detail, the height of the 1-2a sealing portion (212a) may be greater than the height of the 1-2b sealing portion (211b). The height of the 1-3a sealing portion (213a) and the height of the 1-3b sealing portion (213b) may be different. In detail, the height of the 1-3a sealing portion (213a) may be greater than the height of the 1-3b sealing portion (213a). That is, the height of the first outer edge may be greater than the height of the second outer edge.

[0102] The first outer rim of the sealing member serves as a main dam. In addition, the second outer rim serves as an auxiliary dam. Accordingly, the height of the first outer rim is increased to prevent overflow of the second sealing portion (220). In addition, the height of the second outer rim is relatively decreased. Accordingly, overflow of the second sealing portion (220) is further prevented. In addition, the size of the sealing portion can be reduced. A lighting device according to another embodiment includes a plurality of outer rims. Accordingly, overflow of the second sealing portion (220) caused by an error in the amount applied during the process can be prevented. Therefore, the reliability of the lighting device according to another embodiment can be improved.

[0103]

[0104] Referring to FIG. 13, a vehicle headlamp (90) having a lighting device according to an embodiment includes a light source module (10) and a housing (92). The light source module (10) is disposed inside the housing (92) and radiates light in a lateral direction. The radiated light may be reflected in an exit direction through an inner surface (92A) of the housing (92). The light source module (10) includes the lighting device described above. The housing (92) may include a metallic or non-metallic material. The non-metallic material may include a plastic material. The housing (92) may be a reflector of the headlamp. The inner surface (92A) of the housing (92) may be a surface coated with a highly reflective material or may include a reflective layer having an anti-reflection (AR) material. For example, the highly reflective material includes at least one of metals, such as Al, Ag, and Au. The above anti-reflective material may include at least one of MgF2, Al2O3, SiO, SiO2, TiO2+ZrO2, TiO2, and ZrO2. The reflective layer of the inner surface (92A) may be a single layer or a multilayer.

[0105] The above headlamp (90) may include an inner lens and / or an outer lens that projects light emitted through the housing (92). Depending on the shape of the inner lens or the number of light source units, the light distribution pattern of the light emitted from the light source module (10) may be adjusted. The light source module (10) selectively irradiates light of a high beam distribution pattern and a low beam distribution pattern. The high beam distribution pattern or the low beam distribution pattern may be automatically turned on and off depending on the driving mode or driving situation.

[0106] The inner surface (92A) of the housing (92) may comprise a partially domed or partially elliptical paraboloid. The inner surface (92A) may have a plurality of facets. The facets may be free-form, flat, and / or curved (e.g., concave or convex) members. In some examples, a single facet may have a free-form portion, and / or a flat portion, and / or a curved portion (e.g., any combination thereof). In some embodiments, the facets (or at least the inwardly facing surfaces on the facets) may be at least approximated or otherwise defined by algebraic equations. For example, the shape or inwardly facing surfaces of the facets may be expressed by one or more fifth-order algebraic equations (although other equations of any order are also possible). In at least one exemplary embodiment, the surface (or, for example, the coating) of the facets has a high reflectivity (e.g., a reflectivity of 80% or greater). Non-limiting examples of facets and / or coatings on the facets include aluminum and silver, although other reflective materials may be used.

[0107] The inner surface (92A) of the housing (92) is spaced laterally from the light source module (10), and light emitted from the light source module (10) can be reflected by the inner surface (92A) and focused toward the exit side of the housing (92), and can be irradiated as a high beam or a low beam. The outer side of the housing (92) can include various features and accessories for mounting or connecting the headlamp (90) to the interior of the vehicle. In addition, the outer side of the housing (92) can have an electrical interface, such as a socket, for connecting power and / or signals. The housing (92) and the cavity (95) described above are examples and can be changed into various shapes. The housing (92) according to the embodiment can function as a reflector of the left / right headlamps (90).

[0108]

[0109] The features, structures, effects, etc. described in the above-described embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to just one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified and implemented in other embodiments by a person skilled in the art to which the embodiments pertain. Therefore, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention. In addition, although the above description focuses on the embodiments, these are merely examples and do not limit the present invention. Those skilled in the art to which the present invention pertains will appreciate that various modifications and applications not illustrated above are possible without departing from the essential characteristics of the present embodiments. For example, each component specifically shown in the embodiments can be implemented by modification. And the differences related to such modifications and applications should be interpreted as being included in the scope of the present invention defined in the appended claims.

Claims

1. A heat dissipation plate including a recessed portion; A circuit board disposed in the recessed portion and having a pad; A light source unit disposed on the heat dissipation plate and including a bonding pad and a light emitting element; A connecting member connecting the pad of the circuit board and the bonding pad of the light source unit; and Including a sealing portion arranged on the above connecting member, The sealing portion includes a first sealing portion forming an outer border; and a second sealing portion disposed inside the outer border. A lighting device wherein the first sealing portion and the second sealing portion comprise the same resin composition.

2. In paragraph 1, The above resin composition comprises a base resin and a filler, The above base resin comprises an oligomer, a monomer and a photoinitiator, The above oligomer is included in an amount of 45 wt% to 65 wt% based on the total weight of the resin composition, The above monomer is included in an amount of 30% to 50% by weight based on the total weight of the resin composition, The photoinitiator is included in an amount of 1 to 5 wt% based on the total weight of the resin composition, A lighting device in which the filler is included in an amount of 2% to 10% by weight based on the total weight of the resin composition.

3. In paragraph 1, A lighting device having a modulus of 100 MPa to 8000 MPa after curing of the above resin composition.

4. In paragraph 3, A lighting device wherein the resin composition has a thixotropic property of 2 to 4 before curing.

5. In paragraph 2, A lighting device wherein the particle size of the above filler is 5㎛ to 30㎛.

6. In paragraph 1, The above connecting member is One end connected to the bonding pad of the above light source unit; The other end connected to the pad of the above circuit board; and Including a center portion extending from the above end toward the above end, The first sealing portion includes a first-first sealing portion arranged close to the first end, a first-second sealing portion arranged close to the other end, and a first-third sealing portion connecting the first-first sealing portion and the first-second sealing portion. A lighting device in which the first-first sealing portion, the first-second sealing portion, and the first-third sealing portion are formed integrally.

7. In paragraph 6, A lighting device in which the maximum height of the second sealing portion is 1 to 5 times the maximum height of the first sealing portion.

8. In paragraph 6, A lighting device in which the maximum height of the above 1-2 sealing portion is greater than the maximum height of the above 1-1 sealing portion.

9. In paragraph 8, A lighting device in which the maximum height of the first-second sealing portion is 1 to 2.5 times the maximum height of the first-first sealing portion.

10. In paragraph 6, The second sealing portion and the connecting member are spaced apart by a first interval, The above first gap is defined as the gap between the maximum height of the connecting member and the second sealing portion, A lighting device wherein the first interval is 100㎛ to 200㎛.

11. In paragraph 6, The above 1-1 sealing portion and the light emitting element are spaced apart by a second interval, A lighting device wherein the second gap is 0.8 mm to 1 mm.

12. In paragraph 1, The light emitted from the light emitting element and the first sealing portion form a first angle, The light emitted from the light emitting element and the second sealing portion form a second angle, A lighting device wherein at least one of the first angle and the second angle is 30° or less.

13. In paragraph 1, The above connecting member is One end connected to the bonding pad of the above light source unit; The other end connected to the pad of the above circuit board; and Including a center portion extending from the above end toward the above end, The first sealing portion includes a first-first sealing portion arranged close to the first end, a first-second sealing portion arranged close to the other end, and a first-third sealing portion connecting the first-first sealing portion and the first-second sealing portion. The above 1-1 sealing portion includes a 1-1a sealing portion and a 1-1b sealing portion, The above 1-1a sealing portion is positioned closer to the end than the 1-1b sealing portion, The above 1-2 sealing portion includes a 1-2a sealing portion and a 1-2b sealing portion, The above 1-2a sealing portion is positioned closer to the other end than the 1-2b sealing portion, A lighting device including the 1-1 sealing portion and the 1-3a sealing portion and the 1-3b sealing portion.

14. In paragraph 13, The above 1-1a sealing portion, the 1-2a sealing portion, and the 1-3a sealing portion form a first outer edge portion, The above 1-1b sealing portion, the 1-2b sealing portion, and the 1-3b sealing portion form a second outer edge portion, A lighting device in which the first outer edge and the second outer edge are spaced apart.

15. In paragraph 14, The second sealing portion is a lighting device arranged inside the first outer frame.

16. In paragraph 14, A lighting device in which the height of the first outer border is greater than or equal to the height of the second outer border.

17. Housing; and Includes a light source module placed inside the housing, The above light source module is a headlamp including a lighting device according to any one of claims 1 to 16.

Images