Optical module

Abstract

An optical module (200), comprising a circuit board (105) and a light emitting component (400). The light emitting component (400) comprises a housing (410), a first flexible circuit board (440), an electrical connector (420), and a support member (450). A first wire bonding area is formed on the surface of the first flexible circuit board (440). One end of the electrical connector (420) is separately provided with a first step (422a1) and a second step (423a1). A wire bonding area is formed on the surface of the first step (422a1). In order to achieve wire bonding between the first flexible circuit board (440) and the first step (422a1), a support member (450) is provided on the second step (423a1), the support member (450) is fixedly connected to the second step (423a1), and the first flexible circuit board (440) is supported by means of the support member (450), so that the first wire bonding area on the surface of the first flexible circuit board (440) is flush with the second wire bonding area on the surface of the first step (422a1), thereby implementing a wire bonding process between the first flexible circuit board (440) and the first step (422a1). The high-frequency signal transmission quality can be improved.

Description

optical modules

[0001] This application claims the priority of application number 202310863127.5 filed with the China Patent Office on July 13, 2023; the priority of application number 202310777682.6 filed with the China Patent Office on June 29, 2023; the priority of application number 202321706782.1 filed with the China Patent Office on June 30, 2023; the priority of application number 202310779792.6 filed with the China Patent Office on June 29, 2023; and the priority of application number 202321845090.5 filed with the China Patent Office on July 13, 2023; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, advances in optical communication technology are becoming increasingly important. As a key component in optical communication equipment, optical modules enable photoelectric signal conversion. As optical communication technology evolves, the data transmission rate of these modules continues to increase.

[0004] Summary of the Invention

[0005] The present disclosure provides an optical module, comprising:

[0006] circuit boards;

[0007] The light emitting component is electrically connected to the circuit board and includes:

[0008] The tube shell has a bottom plate extending relative to the top plate so that the bottom plate forms an extended surface;

[0009] A first flexible circuit board has a first bonding area formed on its surface for transmitting high-frequency signals and / or low-frequency signals;

[0010] An electrical connector, one end of which extends into the tube shell and the other end of which is outside the tube shell and is disposed on the surface of the extension surface, wherein the end outside the tube shell is respectively formed with a first step surface and a second step surface, wherein the surface of the first step surface has a second wiring area;

[0011] a support member disposed on the surface of the second step surface, the support member being fixedly connected to the second step surface and configured to support the first flexible circuit board so that the first bonding area and the second bonding area are flush with each other, thereby enabling bonding connection between the first flexible circuit board and the first step surface;

[0012] And / or, the support member is arranged between the first flexible circuit board and the extension surface and is connected to the electrical connector to support the first flexible circuit board so that the first wiring area and the second wiring area surface are flush, thereby connecting the first step surface and the first flexible circuit board by wiring. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] FIG1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure;

[0014] FIG2 is a partial structural diagram of a host computer according to some embodiments of the present disclosure;

[0015] FIG3 is a structural diagram of an optical module according to some embodiments of the present disclosure;

[0016] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0017] FIG5 is a structural diagram of a first light emitting component according to some embodiments of the present disclosure;

[0018] FIG6 is a structural diagram 1 of a first electrical connector according to some embodiments of the present disclosure;

[0019] FIG7 is a second structural diagram of a first electrical connector according to some embodiments of the present disclosure;

[0020] FIG8 is a side view of a first light emitting component according to some embodiments of the present disclosure;

[0021] FIG9 is an exploded view of a first light emitting component according to some embodiments of the present disclosure;

[0022] FIG10 is a second exploded view of a first light emitting component according to some embodiments of the present disclosure;

[0023] FIG11 is a side view of a first light emitting component according to some embodiments of the present disclosure;

[0024] FIG12 is a partial diagram of a first light emitting component according to some embodiments of the present disclosure;

[0025] FIG13 is a schematic diagram of bonding between the surface of a first flexible circuit board and the surface of a first stepped surface according to some embodiments of the present disclosure;

[0026] FIG14 is a schematic diagram illustrating a connection between a first tube housing and a first electrical connector according to some embodiments of the present disclosure;

[0027] FIG15 is a schematic diagram illustrating connections between a first housing, a first electrical connector, and a flexible printed circuit board according to some embodiments of the present disclosure;

[0028] FIG16 is a schematic diagram illustrating a connection between a first tube housing and a second electrical connector according to some embodiments of the present disclosure;

[0029] FIG17 is a schematic diagram illustrating connections between a first housing, a second electrical connector, and a flexible printed circuit board according to some embodiments of the present disclosure;

[0030] FIG18 is a structural diagram of a second light emitting component according to some embodiments of the present disclosure;

[0031] FIG19 is a structural diagram of a third electrical connector according to some embodiments of the present disclosure;

[0032] FIG20 is an exploded view of a second light emitting component according to some embodiments of the present disclosure;

[0033] FIG21 is a schematic diagram illustrating a connection between a second tube housing and a third electrical connector according to some embodiments of the present disclosure;

[0034] FIG22 is a side view of a second light emitting component according to some embodiments of the present disclosure;

[0035] FIG23 is a cross-sectional view of a second light emitting component according to some embodiments of the present disclosure;

[0036] FIG24 is a structural diagram of a third light emitting component according to some embodiments of the present disclosure;

[0037] FIG25 is an exploded view of a third light emitting component according to some embodiments of the present disclosure;

[0038] FIG26 is a partial exploded view of a third light emitting component according to some embodiments of the present disclosure;

[0039] FIG27 is a side view of a third light emitting component according to some embodiments of the present disclosure;

[0040] FIG28 is a cross-sectional view of a third light emitting component according to some embodiments of the present disclosure;

[0041] FIG39 is a cross-sectional view of a fourth light emitting component according to some embodiments of the present disclosure;

[0042] FIG30 is an exploded view of a fourth light emitting component according to some embodiments of the present disclosure;

[0043] FIG31 is a structural diagram of a fourth tube shell according to some embodiments of the present disclosure;

[0044] FIG32 is an exploded schematic diagram of another optical emitting component, an optical receiving component, and a circuit board according to some embodiments of the present disclosure;

[0045] FIG33 is an exploded schematic diagram of another optical emitting component, optical receiving component, and circuit board according to some embodiments of the present disclosure;

[0046] FIG34 is an exploded schematic diagram of another light emitting component provided according to some embodiments of the present disclosure;

[0047] FIG35 is a schematic structural diagram of a launch housing according to some embodiments of the present disclosure;

[0048] FIG36 is a schematic structural diagram of another electrical connector provided according to some embodiments of the present disclosure;

[0049] FIG37 is a schematic structural diagram of a backing plate provided according to some embodiments of the present disclosure;

[0050] FIG38 is a partial cross-sectional schematic diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0051] FIG39 is a second partial cross-sectional schematic diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0052] FIG40 is an exploded schematic diagram of another light emitting component provided according to some embodiments of the present disclosure;

[0053] FIG41 is a schematic structural diagram of another launch housing provided according to some embodiments of the present disclosure;

[0054] FIG42 is a third partial cross-sectional schematic diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0055] FIG43 is a fourth partial cross-sectional schematic diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0056] FIG44 is an exploded diagram of another light emitting component and a circuit board according to some embodiments of the present disclosure;

[0057] FIG45 is an exploded schematic diagram of another light emitting component provided according to some embodiments of the present disclosure;

[0058] FIG46 is a schematic structural diagram of a launch shell according to some embodiments of the present disclosure;

[0059] FIG47 is a partial cross-sectional diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0060] FIG48 is a schematic structural diagram of a transfer block provided according to some embodiments of the present disclosure;

[0061] FIG49 is a schematic structural diagram of another adapter block provided according to some embodiments of the present disclosure;

[0062] FIG50 is an exploded schematic diagram 1 of an adapter block provided according to some embodiments of the present disclosure;

[0063] FIG51 is a second exploded schematic diagram of an adapter block provided according to some embodiments of the present disclosure;

[0064] FIG52 is a schematic diagram of a structure in which a protective cover and a circuit board are decomposed according to some embodiments of the present disclosure;

[0065] FIG53 is a first structural diagram of an upper protective cover and a lower protective cover according to some embodiments of the present disclosure;

[0066] FIG54 is a second structural diagram of an upper protective cover and a lower protective cover according to some embodiments of the present disclosure;

[0067] Figure 55 is a schematic cross-sectional view of a portion of an optical module provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0068] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0069] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0070] FIG1 is a partial structural diagram of an optical communication system according to some embodiments. As shown in FIG1 , the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 , and a network cable 103 .

[0071] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0072] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0073] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0074] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0075] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0076] Figure 2 is a partial structural diagram of a host computer according to some embodiments. To clearly illustrate the connection between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has raised structures such as fins to increase the heat dissipation area.

[0077] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0078] Figure 3 is a structural diagram of an optical module according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes either the light emitting component 400 or the light receiving component 500.

[0079] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0080] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0081] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0082] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200. Opening 204 is an electrical interface. The gold finger 301 of the circuit board 300 extends from opening 204 and is inserted into the electrical connector of the host computer 100. Opening 205 is an optical port, configured to connect to the external optical fiber 101, so that the optical fiber 101 connects the light emitting component 400 and the light receiving component 500 in the optical module 200.

[0083] The combined assembly of the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, and the like within the housing. The upper housing 201 and the lower housing 202 provide encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300, the light emitting component 400, and the light receiving component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0084] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0085] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0086] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0087] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0088] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0089] The circuit board 300 also includes a gold finger 301 formed on its end surface, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0090] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0091] In some embodiments, the light emitting component 400 and / or the light receiving component are located on the side of the circuit board 300 away from the gold finger 301; the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0092] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0093] In some embodiments, the light emitting component 400 includes a tube shell, and the electrical connection between the tube shell and the circuit board 300 is achieved through an electrical connector and a flexible circuit board. For example, one end of the electrical connector is electrically connected to the tube shell, and the other end is electrically connected to one end of the flexible circuit board, and the other end of the flexible circuit board is electrically connected to the circuit board 300, thereby achieving electrical connection between the tube shell and the circuit board 300.

[0094] In the electrical connection method between the electrical connector and the flexible circuit board, for example, the flexible circuit board and the electrical connector are connected by soldering. In this method, it is difficult to control the uniformity of the solder material thickness between the connecting surface of the flexible circuit board and the electrical connector, resulting in uneven solder coating. When the solder material thickness is uneven, the high-frequency signal transmission quality is easily reduced. For example, the high-frequency signal transmission quality is poor at the location where the solder material thickness is large. The uneven solder material thickness affects the stability of the high-frequency signal transmission quality, thereby affecting the transmission performance of the high-frequency signal.

[0095] In order to improve the transmission quality of high-frequency signals and ensure the transmission performance of high-frequency signals, the optical module provided in the embodiment of the present disclosure mainly has the concept of supporting the electrical connection between the first metal layer provided on the electrical connector of the optical emitting component and the circuit board through a support member, thereby reducing the wire bonding length of the electrical connection between the electrical connector and the circuit board, thereby reducing impedance; and protecting the electrical connection between the first metal layer and the circuit board through a protective cover to avoid interference from other components.

[0096] For example, in some embodiments, this can be achieved by improving the electrical connector, or by improving the housing. In addition, in some embodiments, the electrical connector and the circuit board can be connected by metal wires to reduce impedance.

[0097] Below, some optional examples of the light emitting components in the embodiments of the present disclosure are introduced in detail in conjunction with the drawings of the present disclosure.

[0098] Figure 5 is a structural diagram of a first optical transmitter according to some embodiments of the present disclosure. As shown in Figure 5, in some embodiments, the optical transmitter 400 includes a first housing 410a (also referred to as a housing in some examples), an electrical connector 420a, and a flexible printed circuit board. The electrical connection between the first housing 410a and the printed circuit board 300 is achieved through the electrical connector 420a and the flexible printed circuit board.

[0099] For example, first tube housing 410a is a transmitting tube housing, internally housing a laser array 411a, a lens array 412a, an optical multiplexing assembly 413a, and a collimating lens 414a. Laser array 411a emits light of varying wavelengths, each of which is sequentially processed by the converging lens in lens array 412a, transitioning from a divergent state to a convergent state. The light is then combined by optical multiplexing assembly 413a into a single beam. This beam is then collimated by collimating lens 414a and converted into parallel light, which is then emitted from first tube housing 410a as parallel light.

[0100] In some embodiments, the number of flexible circuit boards is not limited. When there is one flexible circuit board, the flexible circuit board is described as a first flexible circuit board. The first flexible circuit board can transmit both low-frequency signals and high-frequency signals. A first bonding area is formed on the surface of the first flexible circuit board.

[0101] One end of the electrical connector 420a extends into the first tube shell 410a, and the other end is outside the first tube shell 410a. The end outside the first tube shell 410a is formed with a first step surface and a second step surface, and the first step surface has a second wiring area.

[0102] In some embodiments, a wire bonding connection is formed between the first flexible circuit board and the first step surface. In order to make the surfaces of the first wiring area and the second wiring area flush and provide a flat surface and support force for the wiring, a support member is fixedly provided on the surface of the second step surface. The support member is used to support the first flexible circuit board so that the surfaces of the first wiring area and the second wiring area are flush, thereby facilitating the wire bonding connection between the first flexible circuit board and the first step surface.

[0103] In some embodiments, the number of the above-mentioned flexible circuit boards can be two, respectively described as a first flexible circuit board 440 and a second flexible circuit board 430. In this case, low-frequency signals can be transmitted through one of the flexible circuit boards, and high-frequency signals can be transmitted through the other flexible circuit board, which can reduce the area of ​​the flexible circuit board width used. At the same time, the second flexible circuit board 430 and the first flexible circuit board 440 are stacked up and down, which can make full use of the longitudinal space.

[0104] Exemplarily, the second flexible circuit board 430 is used to transmit low-frequency signals, and the first flexible circuit board 440 is used to transmit high-frequency signals.

[0105] When the flexible circuit board includes a first flexible circuit board 440 and a second flexible circuit board 430 , the electrical connector 420 a correspondingly further includes a third step surface, and the third step surface is used for electrically connecting to the second flexible circuit board 430 .

[0106] The following is an exemplary description using an example in which the flexible circuit board may include a second flexible circuit board 430 and a first flexible circuit board 440 .

[0107] In some embodiments, an end portion of the first tube housing 410 a is connected to the electrical connector 420 a , and the second flexible printed circuit board 430 and the first flexible printed circuit board 440 are connected to the upper and lower surfaces of the electrical connector 420 a , respectively.

[0108] In order to improve the transmission performance of high-frequency signals by improving the electrical connector 420a, multiple stepped surfaces are formed at one end of the electrical connector 420a outside the first tube shell 410a to respectively connect to the second flexible circuit board 430 and the first flexible circuit board 440, thereby making the electrical connector 420a compatible with two flexible circuit boards.

[0109] In some examples, the second flexible circuit board 430 can be electrically connected to one step surface of the electrical connector 420 a ; and the first flexible circuit board 440 can be electrically connected to the other step surface of the electrical connector.

[0110] To balance process complexity and high-frequency signal transmission quality, in some embodiments, if the second flexible circuit board 430 is used to transmit low-frequency signals, the second flexible circuit board 430 and one of the stepped surfaces of the electrical connector 420a may be connected by soldering. If the first flexible circuit board 440 is used to transmit high-frequency signals, the first flexible circuit board 440 and the other stepped surface of the electrical connector 420a may be connected by bonding. Bonding can avoid the problem of uneven solder coating during the soldering process and is more conducive to high-frequency signal transmission than soldering. It is understood that bonding can also be used to achieve electrical connection between the second flexible circuit board 430 and one of the stepped surfaces of the electrical connector 420a. In this case, the bonding method for the second flexible circuit board 430 can refer to the bonding method for the first flexible circuit board 440.

[0111] The ends of the electrical connector 420a can be configured in various configurations to connect to the second flexible printed circuit board 430 and the first flexible printed circuit board 440, respectively. In some embodiments, the electrical connector 420a includes a first electrical connector 420a1, with the second flexible printed circuit board 430 and the first flexible printed circuit board 440 disposed on the upper and lower surfaces of the first electrical connector 420a1, respectively. Of course, in some embodiments, the electrical connector 420a can also be configured as a second electrical connector, a third electrical connector, or the like.

[0112] When the end of the electrical connector presents different shapes, the direction of providing a flat surface and supporting force for the bonding operation between the first flexible circuit board 440 and the electrical connector is correspondingly different. In some embodiments, a flat surface and supporting force can be provided from above the first flexible circuit board 440 for the bonding operation of the first flexible circuit board 440. In some embodiments, a flat surface and supporting force can also be provided from below the first flexible circuit board 440 for the bonding operation of the first flexible circuit board 440.

[0113] Figure 6 is a structural diagram of a first electrical connector according to some embodiments of the present disclosure; Figure 7 is a structural diagram of a first electrical connector according to some embodiments of the present disclosure. As shown in Figures 6 and 7, for ease of distinction, in the present embodiment, the electrical connector is referred to as a first electrical connector 420a1. A third stepped surface 421a1 and a first stepped surface 422a1 are formed on one end of the first electrical connector 420a1, located outside the first housing 410a. Both the third stepped surface 421a1 and the first stepped surface 422a1 are provided with solder pads. For example, the second flexible printed circuit board 430 is connected to the third stepped surface 421a1, and the first flexible printed circuit board 440 is connected to the first stepped surface 422a1. The third stepped surface 421a1 is used for soldering to the second flexible printed circuit board 430, while the first stepped surface 422a1 is used for bonding to the first flexible printed circuit board 440.

[0114] A first solder pad area 424a1 and a second solder pad area 425a1 are formed at one end of the first electrical connector 420a1 located on the inner side of the first tube shell 410a. Solder pads are provided on the surfaces of the first solder pad area 424a1 and the second solder pad area 425a1. The first solder pad area 424a1 is used to transmit low-frequency signals, and the second solder pad area 425a1 is used to transmit high-frequency signals. The solder pads on the surface of the first solder pad area 424a1 are electrically connected to the solder pads on the surface of the third step surface 421a1, thereby realizing the transmission of low-frequency signals; the solder pads on the surface of the second solder pad area 425a1 are electrically connected to the solder pads on the surface of the first step surface 422a1, thereby realizing the transmission of high-frequency signals.

[0115] In some embodiments, as shown in Figures 6 and 7, the length of the third step surface 421a1 is greater than the length of the first step surface 422a1, so that a second step surface 423a1 is formed between the third step surface 421a1 and the first step surface 422a1. The second step surface 423a1 is used to support the support member. In some embodiments, the second step surface may not be formed between the third step surface 421a1 and the first step surface 422a1.

[0116] The heights of the third step surface 421a1, the second step surface 423a1 and the first step surface 422a1 decrease in sequence to form a stepped structure.

[0117] The third stepped surface 421a1 is provided with solder pads to achieve a solder connection between the second flexible printed circuit board 430 and the third stepped surface 421a1. The first stepped surface 422a1 is also provided with solder pads, and bonding wires extend from the first stepped surface 422a1 to achieve a bonding connection between the first flexible printed circuit board 440 and the first stepped surface 422a1.

[0118] Figure 8 is a side view of the first light emitting component according to some embodiments of the present disclosure. As shown in Figure 8, one end of the first electrical connector 420a1 is inserted into the first tube shell 410a, and the other end is located outside the first tube shell 410a.

[0119] Since the flexible circuit board is relatively soft, the support force for the gold wire during bonding is insufficient, resulting in a certain degree of bending of the gold wire, which is not conducive to the transmission of high-frequency signals. In addition, the bonding operation requires a certain flat surface. Therefore, a certain support force needs to be provided to the first flexible circuit board 440 to support the bonding. At the same time, a flat surface needs to be provided for the bonding operation to realize the bonding process.

[0120] If the second step surface 423a1 is not formed between the third step surface 421a1 and the first step surface 422a1, that is, a solid step surface is formed where the second step surface 423a1 would otherwise be, this solid structure can provide a certain amount of support for the first flexible circuit board 440. In this case, a groove is dug into the surface of the solid step surface to accommodate the first flexible circuit board 440. The first flexible circuit board 440 is then lowered toward the third step surface 421a1 so that the surface of the first flexible circuit board 440 is flush with the surface of the first step surface 422a1. Flexible circuit boards are typically relatively thin, approximately 0.2 mm. To ensure that the flexible circuit board is flush with the step surface and shorten the bonding length, the corresponding groove is shallow. When the first flexible circuit board 440 is bonded to the surface of the groove with glue, the glue bonding surface is close to the bonding area, so glue easily overflows into the bonding area between the surface of the first flexible circuit board 440 and the first step surface 422a1, which can affect the transmission quality of high-frequency signals.

[0121] When the second step surface 423a1 is formed between the third step surface 421a1 and the first step surface 422a1, a support member 450 can be set in the second step surface 423a1, and the support member 450 is respectively connected to the first electrical connector 420a1 and the first flexible circuit board 440. At this time, the support member 450 serves as a carrier of the first flexible circuit board 440, and the support member 450 is connected to the first flexible circuit board 440 to support the first flexible circuit board 440.

[0122] Exemplarily, the support member 450 is a metal structural member, and the first electrical connector 420a1 is a ceramic structural member. The hardness of the support member 450 is greater than that of the ceramic structural member, and can provide a larger rigid support force for the first flexible circuit board 440, thereby supporting the wire bonding and ensuring the stability of the wire bonding; at the same time, it provides a flat surface for the wire bonding operation to realize the wire bonding process.

[0123] Exemplarily, the support member 450 and the second step surface 423a1 are connected by glue, for example, the contact surface between the support member 450 and the second step surface 423a1 is coated with glue for bonding.

[0124] In some embodiments, the support member 450 serves as a carrier of the first flexible circuit board 440. The first flexible circuit board 440 can be first connected to the support member 450 by glue to form a flexible board fixing assembly. After the glue is cured, the flexible board fixing assembly is bonded to the surface of the second step surface 423a1 by glue. Since the support member 450 has a certain thickness, the height of the second step surface 423a1 is relatively large at this time. The glue bonding surface between the support member 450 and the second step surface 423a1 is far away from the bonding area. When the flexible board fixing assembly is bonded to the surface of the second step surface 423a1 by glue, the glue is not easy to overflow onto the bonding area, thereby ensuring the quality of the bonding signal.

[0125] For example, the surface of the support member 450 may be formed with notches or grooves to collect overflowing glue and prevent it from spilling onto the bonding area. Therefore, on the one hand, the support member 450 can provide the first flexible circuit board 440 with relatively large rigid support and a flat surface that facilitates bonding operations. On the other hand, the support member 450 can pre-support the first flexible circuit board 440, thereby preventing glue from spilling onto the bonding area when the first flexible circuit board 440 is attached. At the same time, the second stepped surface 423a1 and the support member 450 are configured to transfer the glue bonding surface to the surface of the second stepped surface 423a1, keeping the glue bonding surface away from the bonding area. This prevents glue from spilling onto the bonding area and ensures the transmission quality of high-frequency signals.

[0126] Figure 9 is an exploded view of the first light emitting component according to some embodiments of the present disclosure. As shown in Figure 9 , a relief hole 415a is formed at the end of the first tube shell 410a to allow the first electrical connector 420a1 to extend into the first tube shell 410a.

[0127] Figure 10 is a second exploded view of the first light-emitting component according to some embodiments of the present disclosure. As shown in Figure 10 , solder pads are provided on both the upper and lower surfaces of the end portion of the second flexible printed circuit board 430. The solder pads on the lower surface are used to connect to the solder pads on the third stepped surface 421a1 through soldering, while the solder pads on the upper surface are used to align with the solder pads on the third stepped surface 421a1. For example, alignment of the solder pads can be performed from the side of the first electrical connector 420a1. Correspondingly, the solder pads on the third stepped surface 421a1 face the top of the first housing 410a to connect to the solder pads on the lower surface of the second flexible printed circuit board 430 through soldering.

[0128] In some embodiments, a via hole is provided between the upper and lower pads to electrically connect the upper and lower pads. Solder is applied to the bonding surface between the third step surface 421a1 and the second flexible printed circuit board 430. After the third step surface 421a1 and the pads on the second flexible printed circuit board 430 are aligned, the solder is heated and solidified, thereby achieving a solder connection between the two. During soldering, the solder easily overflows. The via hole allows the solder to penetrate into the via hole between the upper and lower pads.

[0129] Figure 11 is a side view of a first optical emitting component according to some embodiments of the present disclosure; Figure 12 is a partial view of the first optical emitting component according to some embodiments of the present disclosure. As shown in Figures 11 and 12, the second flexible circuit board 430 is fastened to the surface of the third stepped surface 421a1, thereby achieving a solder connection between the second flexible circuit board 430 and the first electrical connector 420a1. A wire bond is formed between the surface of the first flexible circuit board 440 and the surface of the first stepped surface 422a1. At the same time, the surface of the first flexible circuit board 440 is flush with the surface of the first stepped surface 422a1 to shorten the wire bond length between the two and improve high-frequency signal transmission performance.

[0130] The support member 450 is arranged in the second step surface 423a1, and the thickness of the support member 450 is less than the height of the second step surface 423a1, so that the first flexible circuit board 440 is arranged within this height difference, and the first flexible circuit board 440 is bonded to the bottom surface of the support member 450, and the top surface of the support member 450 is bonded to the surface of the second step surface 423a1, thereby achieving a fixed connection between the first flexible circuit board 440 and the support member 450, and a fixed connection between the support member 450 and the second step surface 423a1.

[0131] The height of the second step surface 423a1 and the height of the support member 450 are respectively preset heights. Exemplarily, the height of the second step surface 423a1 is such that after the support member 450 and the first flexible circuit board 440 are stacked together, the surface of the first flexible circuit board 440 is flush with the surface of the first step surface 422a1, thereby shortening the wiring length between the surface of the first flexible circuit board 440 and the first step surface 422a1 and improving the high-frequency signal transmission performance.

[0132] Because the second flexible circuit board 430 is mounted on the surface of the third stepped surface 421a1, the surface of the first flexible circuit board 440 is flush with the surface of the first stepped surface 422a1, enabling a wire bond connection. Therefore, the second flexible circuit board 430 is closer to the first electrical connector 420a1 than the first flexible circuit board 440. For example, a gap is provided between the second flexible circuit board 430 and the side of the first electrical connector 420a1 to collect solder that overflows between the second flexible circuit board 430 and the third stepped surface 421a1.

[0133] Figure 13 illustrates a schematic diagram of bonding wires between the surface of a first flexible circuit board and the surface of a first stepped surface, according to some embodiments of the present disclosure. As shown in Figure 13 , bonding wires are formed between pads on the surface of the first flexible circuit board 440 and pads on the first stepped surface 422a1, thereby achieving electrical connection between the first flexible circuit board 440 and the first electrical connector 420a1.

[0134] The surface of the first flexible circuit board 440 is flush with the surface of the first stepped surface 422a1, and the soldering pads on the surface of the first flexible circuit board 440 are connected to the soldering pads on the first stepped surface 422a1 to shorten the wiring length between the surface of the first flexible circuit board 440 and the first stepped surface 422a1, thereby improving high-frequency signal transmission performance.

[0135] The soldering pads on the surface of the first flexible circuit board 440 and the soldering pads on the first stepped surface 422a1 are oriented in the same direction, both toward the bottom end of the first tube shell 410a. This provides a relatively large bonding area for wiring, which is not interfered with by other structures, facilitates the bonding operation, and can protect the wiring from being entangled by other structures.

[0136] Figure 14 illustrates a schematic diagram of the connection between a first housing and a first electrical connector according to some embodiments of the present disclosure; Figure 15 illustrates a schematic diagram of the connection between a first housing, a first electrical connector, and a flexible printed circuit board according to some embodiments of the present disclosure. As shown in Figures 14 and 15 , as described above, the ends of the electrical connectors can be configured in different configurations to connect to the second flexible printed circuit board 430 and the first flexible printed circuit board 440, respectively. In some embodiments, the electrical connectors include a first electrical connector 420a1.

[0137] A third step surface 421a1, a second step surface 423a1, and a first step surface 422a1 are formed on the end surface of the first electrical connector 420a1 located outside the first tube housing 410a. As described above, the surface length of the third step surface 421a1 is relatively longer than the length of the first step surface 422a1, thereby forming a second step surface 423a1 between the third step surface 421a1 and the first step surface 422a1. A support member 450 is disposed within the second step surface 423a1. In this case, the support member 450 provides rigid support for the first flexible printed circuit board 440 from above.

[0138] Because the flexible circuit board has a certain length and flexibility, the bonding wire may bend with it when the flexible circuit board is bent. The support of the support member 450 can increase the stability of the bonding wire. To further enhance the stability of the bonding wire, a reinforcing member 460 is provided between the second flexible circuit board 430 and the first flexible circuit board 440. The reinforcing member 460 binds the second flexible circuit board 430 and the first flexible circuit board 440, thereby increasing the connection force between the second flexible circuit board 430 and the first flexible circuit board 440 and thereby increasing the stability of the first flexible circuit board 440. The reinforcing member 460 is relatively close to the bonding area between the first flexible circuit board 440 and the first step surface 422a1.

[0139] In some embodiments, to facilitate the placement of the reinforcement member 460, the width of the support member 450 is aligned with the width of the second stepped surface 423a1, aligning the support member 450 with the end surface of the second stepped surface 423a1. The side surface of the reinforcement member 460 can then be connected to the surface of the support member 450 aligned with the second stepped surface 423a1, bringing the reinforcement member 460 closer to the bonding area. This allows the reinforcement member 460 to secure and support the bonding wires at the base of the bonding area, thereby increasing bonding support and stability. For example, the reinforcement member 460 can be formed by applying and curing glue between the second flexible circuit board 430 and the first flexible circuit board 440. This connection between the second flexible circuit board 430 and the first flexible circuit board 440 further enhances the support and stability of the first flexible circuit board 440. It is understood that the width of the second stepped surface 423a1 can also differ from the width of the support member 450.

[0140] Figure 16 is a schematic diagram illustrating the connection between a first housing and a second electrical connector according to some embodiments of the present disclosure; Figure 17 is a schematic diagram illustrating the connection between a first housing, a second electrical connector, and a flexible printed circuit board according to some embodiments of the present disclosure. As shown in Figures 16 and 17, in some embodiments, the electrical connector includes a second electrical connector 420a2.

[0141] In some embodiments, the second electrical connector 420a2 is formed with a third stepped surface 421a2 and a first stepped surface 422a2 on the end surface outside the first housing 410a. The third stepped surface 421a2 and the first stepped surface 422a2 are located at successively lower heights, forming a stepped structure. The third stepped surface 421a2 is used for soldering to the second flexible printed circuit board 430, while the first stepped surface 422a2 is used for bonding to the first flexible printed circuit board 440.

[0142] The height difference between the third step surface 421a2 and the first step surface 422a2 provides a larger space for wire bonding operations. Therefore, the solder pads on the surface of the first flexible circuit board 440 and the solder pads on the surface of the first step surface 422a2 are both oriented toward the top of the first tube shell 410a. As a result, wire bonding can be performed within the space formed by the height difference between the third step surface 421a2 and the first step surface 422a2. The space formed by the height difference is relatively large, thereby preventing the wire bonding from being affected by other structures and ensuring the stability of the wire distribution.

[0143] In order to provide rigid support for the first flexible circuit board 440, a second step surface 423a2 is hollowed out below the first step surface 422a2. The second step surface 423a2 is used to set the support member 450. Correspondingly, the support member 450 is also set within the second step surface 423a2. At this time, the support member 450 provides a flat surface and rigid support force for the first flexible circuit board 440 from below, thereby ensuring the stability of the wire bonding and realizing the wire bonding process.

[0144] The heights of the third step surface 421a2, the first step surface 422a2, and the second step surface 423a2 decrease successively. The second step surface 423a2 is located below the projection area of ​​the root of the first flexible circuit board 440 to provide a rigid support force from the root of the first flexible circuit board 440 to ensure the stability of the first flexible circuit board 440.

[0145] In some embodiments, to further enhance bonding stability, a reinforcing member 460 is provided on the side of the connection surface between the first flexible circuit board 440 and the support member 450 . The reinforcing member 460 is relatively close to the bonding area between the first flexible circuit board 440 and the first step surface 422 a 2 .

[0146] For example, a reinforcing member 460 is provided between the bottom of the first flexible circuit board 440 and the end face of the rigid connector 450. The reinforcing member 460 binds the supporting member 450 and the first flexible circuit board 440, thereby increasing the connection force between the supporting member 450 and the first flexible circuit board 440, thereby increasing the supporting force and stability of the first flexible circuit board 440.

[0147] For example, the reinforcing piece 460 can be formed by applying glue and curing between the bottom of the first flexible circuit board 440 and the end face of the rigid connector 450, thereby further increasing the support and stability of the first flexible circuit board 440 by relying on the connecting force between the first flexible circuit board 440 and the rigid connector 450.

[0148] The above-mentioned embodiments improve the structure of the electrical connector to be compatible with two flexible circuit boards, and realize the solder connection between the second flexible circuit board 430 and the electrical connector, and the wire connection between the first flexible circuit board 440 and the electrical connector, thereby improving the quality of high-frequency signal transmission and ensuring high-frequency signal transmission performance. At the same time, a flat surface and rigid support force are provided to the first flexible circuit board 440 from different directions of the first flexible circuit board 440 to ensure the stability of the wire bonding. Among them, the support member 450 serves as a carrier of the first flexible circuit board 440. On the one hand, it can provide a flat surface and rigid support force for its wire bonding operation. On the other hand, the first flexible circuit board 440 can be supported in advance by the support member 450, thereby preventing glue from overflowing onto the wire bonding area when the first flexible circuit board 440 is pasted, thereby ensuring high-frequency signal transmission performance.

[0149] The following embodiments achieve wire bonding connection between the flexible circuit board and the electrical connector by improving the structure of the tube shell, and provide a flat surface and rigid support for the wire bonding operation of the flexible circuit board.

[0150] Figure 18 is a structural diagram of a second optical transmission component according to some embodiments of the present disclosure. As shown in Figure 18, in some embodiments, the optical transmission component includes a second housing (also referred to as a housing in some examples) 410b, which is electrically connected to the circuit board 300 via an electrical connector and a flexible circuit board. To distinguish between the first electrical connector 420a1 and the second electrical connector 420a2 described above, the electrical connector electrically connected to the second housing 410b is referred to as the third electrical connector 420b. To distinguish between the second flexible circuit board 430 and the first flexible circuit board 440 described above, the flexible circuit board electrically connected to the second housing 410b is referred to as the flexible circuit board 430b (in some examples, it may also be referred to as the first flexible circuit board 440).

[0151] In some embodiments, low-frequency signals and high-frequency signals are transmitted simultaneously through the flexible circuit board 430b. The surface of the flexible circuit board 430b is provided with low-frequency signal pads and high-frequency signal pads, which can reduce the number of flexible circuit boards used.

[0152] To improve high-frequency signal transmission quality, the flexible printed circuit board 430b is bonded to the third electrical connector 420b. For example, pads on the surface of the flexible printed circuit board 430b are bonded to pads on the surface of the third electrical connector 420b, thereby ensuring high-frequency signal transmission performance. The surfaces of the flexible printed circuit board 430b and the third electrical connector 420b should be flush to shorten the bonding length.

[0153] Figure 19 is a structural diagram of a third electrical connector according to some embodiments of the present disclosure. As shown in Figure 19, since both low-frequency and high-frequency signals are transmitted simultaneously via the flexible printed circuit board 430b, the surface of the third electrical connector 420b located inside the second housing 410b can be formed with a third pad area 422b, and the surface of the third electrical connector 420b located outside the second housing 410b can be formed with a first pad area 421b (also referred to as a second bonding area in some examples). The first pad area 421b is electrically connected to the third pad area 422b, thereby enabling signal transmission inside and outside the second housing 410b, including both low-frequency and high-frequency signals.

[0154] The surface of the flexible circuit board 430b is formed with a second pad area 431b (also referred to as a first bonding area in some examples). The second pad area 431b includes pads for transmitting both low-frequency and high-frequency signals. The second pad area 431b is bonded to the first pad area 421b to facilitate transmission of both low-frequency and high-frequency signals between the flexible circuit board 430b and the third electrical connector 420b. When the surfaces of the second pad area 431b and the first pad area 421b are flush, bonding time between the two is shortened, resulting in improved transmission quality of high-frequency signals.

[0155] In order to provide a flat surface and a certain amount of support for the bonding between the flexible circuit board 430b and the third electrical connector 420b, the bottom plate of the second tube shell 410b extends relatively to form an extension surface, and a support member (in some examples, it can also be called a support structure) is provided on the extension surface to support the bonding between the flexible circuit board 430b and the third electrical connector 420b. At this time, the support member is provided on the surface of the extension surface, and the support member provides a certain amount of support and a flat surface for the bonding operation from the bottom of the flexible circuit board 430b. Exemplarily, the support member is used to support the flexible circuit board so that the second pad area 431b is flush with the surface of the first pad area 421b, thereby realizing the bonding process between the flexible circuit board 430b and the third electrical connector 420b. The support member provides a rigid support force and a flat surface for the bonding of the flexible circuit board, improves the stability of the bonding, and thus ensures the transmission performance of high-frequency signals.

[0156] In some embodiments, the support member may be a support block 440b. In some embodiments, the support member may also be other structures.

[0157] Figure 20 is an exploded view of a second optical emitting component according to some embodiments of the present disclosure. As shown in Figure 20 , the base plate of the second housing 410b extends outward, forming an extended surface 411b. The third electrical connector 420b is partially located within the second housing 410b and partially on the extended surface 411b. Therefore, the extended surface 411b supports the third electrical connector 420b.

[0158] The length of the extension surface 411b is relatively longer than the width of the third electrical connector 420b. When the third electrical connector 420b is arranged on the extension surface 411b, there is still a certain distance between the end of the extension surface 411b and the end of the third electrical connector 420b. The end of the extension surface 411b is further away from the second tube shell 410b, so that there is still residual space on the extension surface 411b. The support block 440b is arranged on the surface of the residual space. The flexible circuit board 430b is arranged on the surface of the support block 440b, providing a certain flat surface and support force from the bottom of the flexible circuit board 430b for the bonding operation of the flexible circuit board 430b.

[0159] In some embodiments, the width of the support block 440b is the same as the width of the third electrical connector 420b, so that the support block 440b is flush with the third electrical connector 420b in width; the support block 440b has a preset height, which makes the surface of the flexible circuit board 430b flush with the surface of the third electrical connector 420b, that is, the surface of the second pad area 431b is flush with the surface of the first pad area 421b, which can shorten the wiring length.

[0160] Figure 21 is a schematic diagram illustrating the connection between a second housing and a third electrical connector according to some embodiments of the present disclosure. As shown in Figure 21 , in some embodiments, the second housing 410b includes an extension surface 411b and a clearance hole 412b. The bottom plate of the second housing 410b extends relative to the bottom plate, forming the extension surface 411b. The clearance hole 412b allows the third electrical connector 420b to extend into the interior of the second housing 410b.

[0161] The length of the extension surface 411b is sufficient to install the third electrical connector 420b and the support block 440b. The flexible circuit board 430b is installed on the surface of the support block 440b, providing a certain flat surface and support force for the wiring operation of the flexible circuit board 430b from the bottom of the flexible circuit board 430b.

[0162] A row of solder pads is provided on one end surface of the third electrical connector 420b located outside the second tube shell 410b, and bonding wires extend therefrom, thereby achieving a bonding connection between the third electrical connector 420b and the flexible circuit board 430b. At the same time, the support block 440b provides a certain flat surface and support force for the bonding operation of the flexible circuit board 430b.

[0163] Figure 22 is a side view of a second optical emitting component according to some embodiments of the present disclosure. Figure 23 is a cross-sectional view of a second optical emitting component according to some embodiments of the present disclosure. As shown in Figures 22 and 23, one end of the third electrical connector 420b extends into the interior of the second tube shell 410b and one end is placed on the surface of the extension surface 411b. A support block 440b is provided on the surface of the extension surface 411b. The support block 440b supports the flexible printed circuit board 430b, which is then bonded to the first pad area 421b.

[0164] When fixing the third electrical connector 420b to the second tube shell 410b, metal solder is used to weld the third electrical connector 420b to the surface of the extension surface 411b. During the welding process, the metal solder easily overflows and overflows to the vicinity of the support block 440b, affecting the flatness of the support block 440b and thus affecting the wire bonding.

[0165] In some embodiments, to ensure the integrity of the third electrical connector 420b, a small corner of the bottom of the support block 440b adjacent to the third electrical connector 420b can be cut off to form a missing corner 441b to collect the overflowing metal solder. The overflowing metal solder is concentrated at the position of the missing corner 441b, so that the bottom surface of the support block 440b is not affected by the metal solder, thereby ensuring the flatness of the support block 440b and thus ensuring the stability of the wire bonding.

[0166] The presence of the notched corner 441b creates a certain gap between the bottom of the third electrical connector 420b and the bottom of the support block 440b. When fixing the third electrical connector 420b, the metal solder that overflows can be concentrated in the gap, so that the bottom surface of the support block 440b is not affected by the metal solder, thereby ensuring the flatness of the support block 440b and thus ensuring the stability of the wire bonding.

[0167] The width of the support block 440b can be set according to the length and bendability of the flexible circuit board 430b. When the length of the flexible circuit board 430b is long, or the bending degree of the flexible circuit board 430b is large, the width of the support block 440b can be set larger, thereby providing a larger flat surface and rigid support force for the wiring operation of the flexible circuit board 430b, thereby ensuring the stability of the wiring.

[0168] In some embodiments, the integrity of the support block 440b can also be ensured by cutting off a small corner from the bottom of the third electrical connector 420b on the side adjacent to the support block 440b to form a notch. The notch has the same function as the notch 441b and can also collect the overflowed metal solder.

[0169] Figure 24 is a structural diagram of a third light emitting component according to some embodiments of the present disclosure. Unlike the previous embodiments of the present disclosure, Figure 25 is an exploded view of the third light emitting component according to some embodiments of the present disclosure. As shown in Figures 24 and 25, unlike the previous embodiments of the present disclosure, the bottom plate of the third tube shell 410c also extends relative to the top plate, forming an extended surface. For example, the tail of the extended surface protrudes upward to form a boss 412c. The boss 412c forms a support structure, providing a flat surface and support for bonding wires between the flexible circuit board 430c and the third electrical connector 420c.

[0170] The surface of the boss 412c is relatively lower than the surface of the third electrical connector 420c with the solder pad, so that the flexible circuit board 430b is arranged on the surface of the boss 412c to ensure that the surface of the third electrical connector 420c with the solder pad is flush with the surface of the flexible circuit board 430b.

[0171] In some embodiments, the third electrical connector 420c is positioned between the avoidance hole 413c and the boss 412c. The third electrical connector 420c is a split structure, and the split parts are assembled to form the third electrical connector 420c. For example, when the third electrical connector 420c is secured between the avoidance hole 413c and the boss 412c using metal solder, the metal solder easily overflows. Therefore, a solder collection structure is provided between the third electrical connector 420c and the boss 412c. In some embodiments, the solder collection structure can be in the form of a gap 450c between the third electrical connector 420c and the boss 412c, through which overflowing metal solder can be collected. In some embodiments, the solder collection structure can also have other forms.

[0172] Figure 26 is a partially exploded view of the third light emitting component according to some embodiments of the present disclosure, Figure 27 is a side view of the third light emitting component according to some embodiments of the present disclosure, and Figure 28 is a cross-sectional view of the third light emitting component according to some embodiments. As shown in Figures 26 and 27, a relief hole 413c is formed at the end of the third tube shell 410c, and the third electrical connector 420c extends into the relief hole 413c, so that one end of the third electrical connector 420c extends into the interior of the third tube shell 410c.

[0173] The bottom plate of the third tube shell 410c also extends relative to the top plate to form an extended surface 411c. The third electrical connector 420c is fixed to the surface of the extended surface 411c. The tail of the extended surface 411c protrudes upward to form a boss 412c. The boss 412c forms a support structure, providing a flat surface and support for bonding between the flexible circuit board 430c and the third electrical connector 420c.

[0174] As mentioned above, a gap 450c is provided between the third electrical connector 420c and the boss 412c, and overflowing metal solder is collected through the gap 450c.

[0175] To this end, a support plate 440c is provided on the surface of the boss 412c, and the end of the support plate 440c is connected to the surface of the third electrical connector 420c. The support plate 440c spans the gap 450c to cover the gap 450c, and then the flexible circuit board 430c is supported by the support plate 440c, thereby preventing the lower surface of the wiring area of ​​the flexible circuit board 430c from being suspended.

[0176] That is, the flexible circuit board 430c and the support plate 440c are stacked on the surface of the boss 412c.

[0177] The boss 412c has a preset height, which allows the surface of the flexible circuit board 430c to be flush with the surface of the third electrical connector 420c on which the pads are provided after the support plate 440c and the flexible circuit board 430c are sequentially arranged on the surface of the boss 412c, that is, the surface of the first pad area 421c is flush with the surface of the second pad area 431c, so as to shorten the wiring length and improve the high-frequency signal transmission performance.

[0178] Figure 29 is a cross-sectional view of a fourth light emitting component according to some embodiments of the present disclosure; Figure 30 is an exploded view of a fourth light emitting component according to some embodiments of the present disclosure; and Figure 31 is a structural view of a fourth tube shell according to some embodiments of the present disclosure. As shown in Figures 29-31, in some examples of the present disclosure,

[0179] Alternatively, the top surface of boss 412d may protrude relative to the body of boss 412d, with the protruding portion covering gap 440d. Flexible circuit board 430d may then be placed on the surface of boss 412d. Because the top surface of boss 412d protrudes relative to the body of boss 412d, the protruding portion covers gap 440d, thereby preventing overhang below the bonding area of ​​the flexible circuit board and shortening bonding length.

[0180] In some embodiments, a corner may be dug out from the bottom of the boss on the side adjacent to the third electrical connector. In this case, the corner serves as a solder collection structure to collect overflowing metal solder.

[0181] In other examples, a corner can be hollowed out at the bottom of the third electrical connector on the side adjacent to the boss. In this case, the corner serves as a solder collection structure to collect spilled metal solder. When the third electrical connector and the boss are connected, they are in close contact. Since the third electrical connector is an assemblable structure, installation of the third electrical connector is facilitated.

[0182] Of course, in some examples, a notch may be provided at the bottom of the side adjacent to the dot-dot connector and the boss, and a notch may be provided at the bottom of the side adjacent to the boss and the third electrical connector to collect the metal solder.

[0183] In the above embodiments, by improving the tube shell, a wire bonding connection between a flexible circuit board and an electrical connector is achieved. Currently, when the number of flexible circuit boards is one, the tube shell structure remains unchanged, and the bottom end of the electrical connector is extended in the same manner as the tube shell is extended, so that a support structure for supporting the wire bonding operation of the flexible circuit board can be set on the extended structure, thereby ensuring the stability of the wire bonding.

[0184] In summary, a first pad area is formed on the surface of each third electrical connector outside the tube shell; a second pad area is formed on the surface of the flexible circuit board, and the second pad area is connected to the first pad area by wire bonding. The flexible circuit board is used to simultaneously transmit low-frequency signals and high-frequency signals between the circuit board and the light-emitting component. Since the flexible circuit board and the third electrical connector are connected by wire bonding, the wire bonding method is more conducive to improving the transmission quality of high-frequency signals and ensuring the transmission performance of high-frequency signals. A support structure is provided between the flexible circuit board and the extension surface, and the support structure is connected to the third electrical connector. The support structure is used to support the flexible circuit board, provide a flat surface and a rigid support force for the wiring of the flexible circuit board, improve the stability of the wiring, and thus ensure the transmission performance of the high-frequency signal. The present disclosure improves the tube shell and sets a corresponding support structure on the surface of the tube shell, thereby providing a flat surface and a certain rigid support force for the wiring operation of the flexible circuit board, ensuring the stability of the wiring, which is beneficial to the transmission of high-frequency signals.

[0185] In other embodiments of the present disclosure, the connection between the electrical connector and the circuit board can also be improved to reduce impedance and ensure the transmission quality of high-frequency signals. The main concept can be as follows: a first avoidance opening and a signal pin area are provided on the circuit board, and the light emitting component is positioned in the first avoidance opening and the second pad area of ​​the first metal layer on the electrical connector; a support member is provided on the side of the circuit board opposite the signal pin area to support the signal pin area. This can reduce the bonding length between the second pad area and the signal pin area, thereby reducing impedance.

[0186] Figure 32 is a schematic diagram of the decomposition of another optical emitting component, an optical receiving component, and a circuit board according to some embodiments of the present disclosure. Figure 33 is a schematic diagram of the decomposition of another optical emitting component, an optical receiving component, and a circuit board according to some embodiments of the present disclosure. As shown in Figures 32 and 33, in some examples of the present disclosure, the circuit board 300 is provided with a first avoidance opening 310, and the optical emitting component is located in the first avoidance opening 310. The optical emitting component and the optical receiving component are both located on the upper surface of the circuit board. The optical module also has a pad 420, the optical emitting component is located on the pad 420, and a portion of the pad 420 is located below the circuit board corresponding to the optical receiving component.

[0187] In some embodiments, a first relief opening 310 is located on one side of the circuit board 300, with its opening communicating with the outside. A signal pin area 320 is provided on the circuit board 300, and the light emitting component is wiredly connected to the signal pin area 320. A narrow plate area 330 is located adjacent to the first relief opening 310, parallel to the first relief opening 310 in the width direction of the circuit board 300. The light receiving component 500 is located within the narrow plate area 330.

[0188] In some examples, the width of the narrow board area 330 is less than or equal to 1 / 3 of the width of other areas of the circuit board 300 .

[0189] Figure 34 is an exploded schematic diagram of another optical transmitter assembly according to some embodiments of the present disclosure. As shown in Figure 34 , the optical transmitter assembly includes a transmitter housing 410a and an electrical connector 430. A first through-hole 4103 is defined on one sidewall of the transmitter housing 410a, and the electrical connector 430 is located on the sidewall opposite the first through-hole 4103. The optical transmitter assembly is housed within the transmitter housing 410a.

[0190] FIG35 is a schematic diagram of the structure of a launch housing according to some embodiments of the present disclosure. As shown in FIG35 , a first through hole 4103 is provided on the launch housing 410a. The first through hole 4103 communicates with the inner cavity of the launch housing 410a and is connected to the fiber optic adapter 700.

[0191] A first opening 4101 is provided on the launching shell 410a, and the first through hole 4103 and the first opening 4101 are located on opposite sides of the launching shell.

[0192] In some embodiments, the electrical connector 430 is located at the first opening 4101. One side of the electrical connector 430 is inserted into the launch housing 410a, and the other side is exposed outside the launch housing 410a, so that the launch housing 410a and the electrical connector are assembled to form a light emitting cavity. The end of the electrical connector 430 located inside the launch housing is connected to the laser array 411 via a gold wire, and the end of the electrical connector 430 located outside the launch housing is connected to the circuit board via a gold wire (e.g., a wire bonding connection). The electrical signals and operating signals generated by the circuit board 300 are transferred to the laser array 411 to drive each laser to emit laser beams of different wavelengths.

[0193] In some embodiments, the bottom 4102 of the launch housing 410a is connected to the electrical connector 430 to support the electrical connector 430. The lower surface of the electrical connector 430 is higher than the bottom 4102.

[0194] Figure 36 is a schematic diagram of the structure of another electrical connector provided according to some embodiments of the present disclosure. As shown in Figure 36, the surface of the electrical connector 430 located inside the launch housing 410a is formed with a first solder pad area 431, and the surface of the electrical connector 430 located outside the launch housing 410a is formed with a second solder pad area 432. The first solder pad area 431 is electrically connected to the second solder pad area 432, thereby enabling signal transmission inside and outside the launch housing 410a, including the transmission of low-frequency and high-frequency signals. The second solder pad area 432 includes low-frequency signal lines and high-frequency signal lines. The low-frequency signal lines are used to transmit low-frequency signals, and the high-frequency signal lines are used to transmit high-frequency signals.

[0195] The circuit board 300 has a signal pin area 320 formed on its surface. This area includes pads for transmitting both low-frequency and high-frequency signals. Bonding wires are formed between the signal pin area 320 and the second pad area 432, enabling transmission of both low-frequency and high-frequency signals between the circuit board and the electrical connector 430. When the surfaces of the signal pin area 320 and the second pad area 432 are flush, the bonding wire between them is shorter, resulting in better transmission quality for high-frequency signals.

[0196] In order to provide a certain support force for the metal bond between the launch shell 410a and the electrical connector 430, the pad 420 has a first support portion 421, a second support portion 422 and a third support portion 423. For example, the first support portion 421, the second support portion 422 and the third support portion 423 are an integrated structure.

[0197] The thickness of the electrical connector 430 is greater than that of the circuit board 300. To shorten the length of the metal wires between the electrical connector 430 and the signal pin area 320, a second support portion 422 is positioned between the signal pin area 320 and the lower housing. The second support portion 422 elevates the height of the signal pin area 320, so that the top surface of the electrical connector 430 is flush with the top surface of the signal pin area 320. In some embodiments, the top surface of the electrical connector 430 being flush with the top surface of the signal pin area 320 means that the height difference between the top surface of the electrical connector 430 and the top surface of the signal pin area 320 is less than 0.2 mm.

[0198] Figure 37 is a schematic diagram of the structure of a backing plate provided according to some embodiments of the present disclosure. As shown in Figure 37, the upper surfaces of the second support portion 422 and the third support portion 423 are connected to the circuit board to support the circuit board. The upper surface of the second support portion 422 protrudes from the upper surface of the first support portion 421 and is located below the signal pin area 320. The second support portion 422 supports the circuit board so that the signal pin area 320 and the second pad area 432 are located in the same plane.

[0199] The second support portion 422 is located on one side of the first support portion 421, and the third support portion 423 is located on a side adjacent to the second support portion 422. The light receiving component 500 is located within the projection range of the third support portion 423. The width of the circuit board 300 is narrow at the position where the first avoidance opening 310 is provided, which causes the circuit board to be easily deformed under force. The third support portion 423 is located on one side of the first avoidance opening 310, and the third support portion 423 reinforces the narrow plate area 330 of the circuit board. At the same time, the light receiving component is connected to the circuit board, the upper surface of the third support portion 423 is connected to the circuit board, and the lower surface of the pad 420 is connected to the lower shell, which increases the heat dissipation effect of the light receiving component.

[0200] For example, the third supporting portion 423 has an escape groove 4231 , and the escape groove 4231 accommodates the electrical components on the circuit board.

[0201] In some embodiments of the present application, the second support portion 422 is located below the signal pin area 320 . The hardness of the second support portion 422 is greater than the hardness of the circuit board, providing rigid support for the metal of the signal pin area 320 and the second pad area 432 .

[0202] Figure 38 is a partial cross-sectional schematic diagram (I) of an optical emitting component and a circuit board according to some embodiments of the present disclosure. Figure 39 is a partial cross-sectional schematic diagram (II) of an optical emitting component and a circuit board according to some embodiments of the present disclosure. As shown from different angles in Figures 38 and 39, the upper surface of the second solder pad area 432 of the electrical connector 430 is higher than the upper surface of the second support portion 422, so that the signal pin area 320 and the second solder pad area 432 are located in the same plane. The signal pin area 320 and the second solder pad area 432 are connected via wire bonding, which helps reduce impedance.

[0203] In some embodiments, the second support portion, the third support portion and the circuit board are glued and fixed, and the first support portion and the shell bottom 4102 can be glued or welded.

[0204] In some embodiments, to reduce the length of the gold wire between the electrical connector 430 and the circuit board 300, the sidewalls of the electrical connector 430 abut against the sidewalls of the second support portion 422. The lower surface of the electrical connector 430 is higher than the shell base 4102, and the second solder pad area 432 of the electrical connector 430 is located outside the launch shell. A first gap 424 is formed between the shell base 4102 and the second support portion 422. The first gap 424 receives excess solder or glue during soldering between the launch shell and the first support portion 421, preventing the launch shell from tilting due to excessive solder or glue, thereby helping to improve coupling efficiency. The second solder pad area 432 is located above the first gap 424, and the sidewalls of the electrical connector 430 abut against the sidewalls of the second support portion 422. The sidewalls of the launch shell 410a are connected to the third support portion 423.

[0205] The third support portion 423 is connected to the lower surface of the circuit board, providing support for the circuit board 300. The light receiving component is also connected to the circuit board. The lower surface of the backing plate 420 is connected to the lower housing. The backing plate 420 is thermally connected to the light emitting component, increasing the heat dissipation area and improving the heat dissipation effect of the light receiving and light emitting components.

[0206] FIG40 is a schematic diagram of an exploded view of another light emitting component provided according to some embodiments of the present disclosure. As shown in FIG40,

[0207] In some optional examples of the present disclosure, the pad 420 is provided with a groove 4221, which is located at the connection between the second support portion and the third support portion. The groove 4221 can be used for installation and positioning, or the groove 4221 can be used to support overflow glue or overflow solder.

[0208] For example, the groove 4221 is arc-shaped, and the groove 4221 is recessed toward the second support portion and the third support portion. The groove 4221 can also be other shapes. The groove 4221 is a chamfered structure at the connection between the second support portion and the third support portion, which is convenient for preparation and molding.

[0209] Figure 41 is a schematic diagram of another launch housing structure provided in accordance with some embodiments of the present disclosure. As shown in Figure 41 , in some embodiments, the bottom of launch housing 410b is an opening, referred to for convenience as bottom opening 4104, with a backing plate 420 positioned below launch housing 410b. Bottom opening 4104 communicates with first opening 4101.

[0210] The launch housing 410b includes a first side wall 4107 and a second side wall 4105 and a third side wall 4106 located on either side of the first side wall. The first through hole 4103 is located on the first side wall 4107, and the first opening 4101 is located on the opposite side of the first side wall 4107.

[0211] After the backing plate 420 is connected to the launch shell 410b, the first support portion 421 blocks the bottom opening 4104. The electrical connector 430 is located at the first opening 4101. The sidewalls of the electrical connector 430 are respectively connected to the second sidewall 4105 and the third sidewall 4106 of the launch shell 410b, and the bottom of the electrical connector 430 is connected to the first support portion 421.

[0212] Figure 42 is a third schematic partial cross-sectional view of an optical emitting component and a circuit board according to some embodiments of the present disclosure. Figure 43 is a fourth schematic partial cross-sectional view of an optical emitting component and a circuit board according to some embodiments of the present disclosure. As shown from different angles in Figures 42 and 43, the upper surface of the second solder pad area 432 of the electrical connector 430 is higher than the upper surface of the second support portion 422, so that the signal pin area 320 and the second solder pad area 432 are located in the same plane. The signal pin area 320 and the second solder pad area 432 are connected via wire bonding, which helps reduce impedance.

[0213] In some embodiments, to reduce the length of the gold wire between the electrical connector 430 and the circuit board 300, the sidewalls of the electrical connector 430 are positioned close to the sidewalls of the second support portion 422. However, to prevent excess glue or solder from flowing out when the electrical connector is connected to the pad 420 and affecting the optical module, a third gap 426 is provided between the sidewalls of the electrical connector 430 and the sidewalls of the second support portion 422. The third gap 426 receives excess solder when the electrical connector is soldered to the first support portion 421, preventing the emitter housing from tilting due to excessive solder, thereby improving coupling efficiency.

[0214] A second gap 425 exists between the third sidewall 4106 and the third support portion 423. This gap absorbs any excess solder or glue during soldering between the emitting housing and the first support portion 421, preventing the emitting housing from tilting due to excessive solder. This gap also provides a platform for the optoelectronic components of the light emitting assembly, helping to improve coupling efficiency. The circuit board 300 rests against the sidewall 4106 of the emitting housing 410b, securing the emitting housing 410b in place.

[0215] In other embodiments of the present disclosure, a protective cover may be used to protect the metal wire to prevent external objects from contacting the metal wire.

[0216] Figure 44 is a schematic diagram of the decomposition of another optical emitting component and a circuit board provided according to some embodiments of the present disclosure. Figure 45 is a schematic diagram of the decomposition of another optical emitting component provided according to some embodiments of the present disclosure. As shown in Figures 44 and 45, the optical emitting component includes a transmitting shell 411 and a transmitting upper cover 412. An inner cavity is formed on the transmitting shell 411, and the transmitting upper cover 412 covers and connects the transmitting shell 411 to form a cavity structure with an opening on one side with the transmitting shell 411. A fiber optic adapter 700 is provided on one side wall of the transmitting shell 411, and a transition block 413 (which may also be called an electrical connector in some examples) is provided on the opposite side wall of the fiber optic adapter 700. An optical emitting assembly is provided in the transmitting shell 411. The transition block 413 blocks the transmitting upper cover 412 and the transmitting shell 411 to form a cavity structure with an opening on one side.

[0217] In some embodiments of the present application, a second high-frequency signal line is provided on the upper surface of the adapter block, and a second low-frequency signal line is provided on the lower surface of the adapter block. One end of the adapter block is located inside the transmitting housing 411, and the other end is located outside the transmitting housing 411. The adapter block 413 is connected to the circuit board 300 via metal wires.

[0218] Typically, the metal wires between the adapter and the circuit board protrude from the surface of the circuit board, making them susceptible to contact and pressure from external objects, resulting in poor connection. To protect the metal wires, a protective cover is installed on the circuit board. This cover is placed over the metal wires to prevent external objects from coming into contact with them, thus preventing the wires from breaking under stress or external conductive materials from falling between the wires and causing a short circuit.

[0219] For convenience of expression, in the embodiment of the present application, the length direction of the circuit board is called the X direction (refer to Figure 45), the width direction of the circuit board is called the Y direction (refer to Figure 45), and the direction perpendicular to the circuit board is called the Z direction (refer to Figure 45).

[0220] Figure 46 is a schematic diagram of the structure of a transmitter housing according to some embodiments of the present disclosure. Figure 47 is a schematic diagram of a partial cross-section of an optical transmitter component and circuit board according to some embodiments of the present disclosure. As shown in Figures 46 and 47, a fixing surface 4101 is provided on the top of the transmitter housing 411, and a transmitter cover 412 is fixedly connected to the fixing surface 4101. A first through hole 4103 is provided in the transmitter housing 411, which communicates with the inner cavity of the transmitter housing 411 and is connected to the fiber optic adapter 700.

[0221] In some embodiments, the optical transmission assembly includes a first isolator. Exemplarily, the first isolator is disposed in the first through hole 4103 , and the first isolator seals the first through hole 4103 , thereby preventing external optical signals from entering the transmission housing 411 .

[0222] In some embodiments, an adapter block 413 is provided at the opposite end of the first through hole 4103 of the launch shell 411, one side of the adapter block 413 is inserted into the launch shell 411, and the other side is exposed outside the launch shell 411, so that the launch shell 411, the launch cover 412 and the adapter block are assembled to form a second cavity.

[0223] The outer wall of the launch shell 411 is provided with a ridge that protrudes from the outer wall of the launch shell. The lower surface of the ridge is connected to the upper surface of the circuit board to limit the launch shell on the circuit board. In some embodiments, the launch shell 411 has a first ridge 4111 and a second ridge 4112, wherein the first ridge 4111 and the second ridge 4112 are symmetrically arranged on the outer wall of the launch shell 411. The first ridge 4111 is located on the first side wall 4413 of the launch shell 411, and the first side wall 4113 is adjacent to the side wall where the first through hole 4103 is located. The second ridge 4112 is located on the second side wall 4114 of the launch shell, and the second side wall 4114 is located on the opposite side of the first side wall 4113. The ridge is integrally formed with the launch shell.

[0224] The laser assembly 440 and the lens assembly 450 are arranged in the transmitting housing 411. In the present application example, the laser assembly 440 is hoisted on the bottom of the transmitting upper cover 412 for the convenience of heat dissipation.

[0225] One end of the adapter block 413 located inside the transmitting shell is connected to each laser of the laser assembly 440 through a gold wire, and the other end of the adapter block 413 located outside the transmitting shell is connected to the circuit board through a gold wire, so as to transfer the electrical signals, working signals, etc. generated by the circuit board 300 to each laser to drive each laser to emit laser beams of different wavelengths.

[0226] In order to achieve electrical connection between the inside and outside of the shell through the adapter block 413, a metal layer is plated on the adapter block 413. Signal pads and ground pads are provided on the metal layer of the adapter block 413 located on the inner side of the shell. Signal pads and ground pads are also provided on the metal layer of the adapter block 413 located on the outer side of the shell. The signal pads inside and outside the adapter block 413 are connected to achieve electrical connection between the inside and outside of the adapter block 413, thereby achieving the transfer of electrical signals, working signals, etc. through the adapter block 413.

[0227] Figure 48 is a schematic diagram of the structure of an adapter block provided according to some embodiments of the present disclosure. Figure 49 is a schematic diagram of the structure of another adapter block provided according to some embodiments of the present disclosure. Figures 48 and 49 show the adapter block from different angles. Figure 50 is a first exploded schematic diagram of an adapter block provided according to some embodiments of the present disclosure. Figure 51 is a second exploded schematic diagram of an adapter block provided according to some embodiments of the present disclosure. As shown in Figures 48 and 51, the adapter block 413 includes a first adapter plate 4131, a second adapter plate 4132, and a third adapter plate 4133. The lower surface of the first adapter plate 4131 is provided with a first high-frequency metal layer 41311, which is electrically connected to the laser assembly and transmits the high-frequency signal from the circuit board to the laser assembly. In the example of the present application, the first high-frequency metal layer 41311 of the first adapter plate 4131 is located inside the transmitting shell.

[0228] The second adapter plate 4132 is located below the first adapter plate 4131, forming a stepped surface with the first adapter plate 4131. The second adapter plate 4132 does not cover the first high-frequency metal layer 41311, leaving it exposed inside the launch housing and facilitating electrical connection between the first high-frequency metal layer 41311 and the laser assembly. A first low-frequency metal layer 41324 is provided on the lower surface of the second adapter plate 4132. This layer is electrically connected to the laser assembly, transmitting the low-frequency signal from the circuit board to the laser assembly.

[0229] The lower surface of the first adapter plate 4131 is flush with the lower surface of the laser assembly, reducing the length of the connecting line between the first high-frequency metal layer 41311 and the signal line of the laser assembly, thereby reducing signal loss. A positioning portion 41312 is provided on the lower surface of the first adapter plate 4131. The second adapter plate 4132 is fixedly connected to the positioning portion 41312, facilitating the installation of the first adapter plate 4131 and the second adapter plate 4132.

[0230] For example, positioning portion 41312 includes a first positioning post 41313 and a second positioning post 41314. The first positioning post protrudes from the bottom surface of first adapter plate 4131 and is not located at the edge of first adapter plate 4131. In other words, a certain gap exists between first positioning post 41313 and the edge of first adapter plate 4131, facilitating the positioning and installation of second adapter plate 4132. The second positioning post protrudes from the bottom surface of first adapter plate 4131, and second positioning post 41314 is not located at the edge of first adapter plate 4131.

[0231] In some embodiments of the present application, the lower surface of the first adapter plate 4131 is a surface facing the lower shell.

[0232] The second adapter plate 4132 has a first stopper 41321 and a second stopper 41322 extending into the interior of the launch housing 411. The second adapter plate 4132 has a third stopper 41323 that protrudes from the lower surface of the second adapter plate 4132. The lower surface of the third stopper 41323 is flush with the lower surfaces of the first positioning post 41313 and the lower surfaces of the second positioning post 41314.

[0233] The inner wall of the first limiting portion 41321 is in contact with and connected to the first positioning post 41313, which defines the position of the first limiting portion 41321 relative to the first adapter plate 4131. The inner wall of the second limiting portion 41322 is in contact with and connected to the second positioning post 41314, which defines the position of the second limiting portion 41322 relative to the first adapter plate 4131. The first limiting portion 41321 and the second limiting portion 41322 define the front-to-back positioning of the first adapter plate 4131 and the second adapter plate 4132. The front-to-back direction is the Y direction (see FIG. 34 ).

[0234] The sidewall at one end of the third position-limiting portion 41323 contacts and connects with the first positioning post 41313, which defines the position of the second adapter plate 4132 in the X direction ( FIG. 34 ). The sidewall at the other end of the third position-limiting portion 41323 contacts and connects with the second positioning post 41314, which defines the position of the second adapter plate 4132 in the X direction.

[0235] The lower surface of the second adapter plate 4132 has a second low-frequency metal layer 41325, with the third stopper located between the first and second low-frequency metal layers 41325. The upper surface of the second adapter plate 4132 has a second high-frequency metal layer 41326. The first and second low-frequency metal layers are electrically connected, while the first and second high-frequency metal layers 41311 and 41326 are electrically connected. The second low-frequency metal layer 41325 and the second high-frequency metal layer 41326 are located outside the launch shell.

[0236] The upper surface of the circuit board has a high-frequency pin 305, which is wired to the second high-frequency metal layer 41326 to provide a high-frequency signal for the optical transmission component; the lower surface of the circuit board has a low-frequency pin 306, which is wired to the second low-frequency metal layer 41325 to provide a low-frequency signal for the optical transmission component.

[0237] In some embodiments of the present disclosure, the thickness of the circuit board is the same as or similar to the thickness of the second adapter plate 4132 , so that the metal wire between the circuit board and the second adapter plate 4132 can be shortened as much as possible to reduce loss.

[0238] The thickness of the circuit board is the same as or similar to the thickness of the second adapter plate 4132, and the ratio of the thickness of the circuit board to the thickness of the second adapter plate 4132 can be greater than or equal to 0.95, and the ratio of the thickness of the circuit board to the thickness of the second adapter plate 4132 can be less than or equal to 1.2. For example, in some examples, the ratio of the thickness of the circuit board to the thickness of the second adapter plate 4132 can be 0.95, 0.97, 1.0, 1.1 or 1.2, etc.

[0239] The third adapter plate 4133 surrounds the first low-frequency metal layer 41324 and is connected to the third adapter plate 4133. For example, the third adapter plate 4133 includes a limiting body 41331 and a first limiting plate 41332 and a second limiting plate 41333 extending into the interior of the launch shell. The two limiting plates are located on either side of the limiting body. The first limiting plate 41332 is in contact with a first positioning post, which defines the X-direction position of the second adapter plate 4132. The second limiting plate 41333 is in contact with a second positioning post, which defines the X-direction position of the second adapter plate 4132.

[0240] The third transfer plate 4133 defines a relief opening 41334 , and the third limiting portion 41323 abuts against a sidewall of the relief opening 41334 .

[0241] FIG52 is a schematic diagram of the structure of a protective cover and a circuit board according to some embodiments of the present disclosure. As shown in FIG44 and FIG52 , the protective cover includes an upper protective cover 810 and a lower protective cover 820. The upper protective cover 810 is located above the circuit board, covering the second high-frequency metal layer 41326 and the high-frequency pin 305, and protecting the metal wire between the second high-frequency metal layer 41326 and the high-frequency pin 305. The lower protective cover is located below the circuit board, covering the second low-frequency metal layer 41325 and the low-frequency pin 306, and protecting the metal wire between the second high-frequency metal layer 41326 and the high-frequency pin 305. Typically, the metal wire is a gold wire.

[0242] It is understood that in some embodiments of the present disclosure, the lower protective cover 820 can also provide support for the circuit board, ensuring that the high-frequency pins 305 on the circuit board are flush with the second high-frequency metal layer 41326. This facilitates wire bonding between the high-frequency pins and the second high-frequency metal layer. For example, in the aforementioned embodiments of the present disclosure, when the backing plate does not have a second support portion, the lower protective cover can provide support for the circuit board.

[0243] In some examples, a clamping portion 815 is provided on the upper surface of the upper protective cover 810 . The width of the clamping portion 815 is smaller than the width of the upper protective cover 810 body, which facilitates installation and clamping.

[0244] The upper protective cover 810 is detachably connected to the lower protective cover 820. For example, the circuit board is provided with a second through-hole 303 and a third through-hole 304, and the lower surface of the upper protective cover 810 is provided with a third positioning post 811 and a fourth positioning post 812. The lower protective cover 820 is provided with a fourth through-hole 821 and a fifth through-hole 822. The third positioning post 811 passes through the second through-hole 303 and the fourth through-hole 821, and the fourth positioning post 812 passes through the third through-hole 304 and the fifth through-hole 822. The third positioning post 811 and the fourth positioning post are threaded, and nuts are used to detachably connect the upper protective cover 810 to the lower protective cover 820.

[0245] The clamping portion 813 protrudes from the upper surface of the upper protective cover 810. The thickness of the clamping portion is smaller than that of the upper protective cover 810. During the installation process, a clamping device is used to clamp both sides of the clamping portion to prevent the upper protective cover 810 from slipping out of the clamping device.

[0246] Figure 53 is a structural schematic diagram 1 of the upper protective cover and the lower protective cover provided according to some embodiments of the present disclosure. Figure 54 is a structural schematic diagram 2 of the upper protective cover and the lower protective cover provided according to some embodiments of the present disclosure. Figure 55 is a partial cross-sectional schematic diagram of the optical module provided according to some embodiments of the present disclosure. Figure 55 and Figure 54 are structural schematic diagrams at different angles. As shown in Figures 53 to 55, the lower surface of the upper protective cover 810 is provided with a third positioning column 811 and a fourth positioning column 812, and the lower surface of the upper protective cover 810 is recessed and provided with a first avoidance groove 813. The first avoidance groove 813 is provided above the second high-frequency metal layer 41326 and the high-frequency pin 305 to protect the metal wire between the second high-frequency metal layer 41326 and the high-frequency pin 305.

[0247] The first avoidance groove 813 does not penetrate the width direction of the upper protective cover 810, thereby improving the pressure resistance of the upper protective cover and preventing the upper protective cover from being deformed due to external force during installation, thereby affecting product performance.

[0248] The upper surface of the lower protective cover 820 is recessed to form a second avoidance groove 823 . The second avoidance groove 823 is provided above the second low-frequency metal layer and the low-frequency pins to protect the metal wires between the second low-frequency metal layer and the low-frequency pins.

[0249] To facilitate installation, the third positioning post 811 includes a first mounting portion 8111 and a second mounting portion 8112. One end of the first mounting portion 8111 is connected to the lower surface of the upper protective cover 810, and the other end is connected to the second mounting portion 8112. The cross-sectional area of ​​the first mounting portion 8111 is larger than that of the second mounting portion 8112. During installation, the first mounting portion 8111 is inserted into the second through-hole 303, and the lower surface of the upper protective cover 810 rests against the circuit board. The second mounting portion 8112 is inserted into the fourth through-hole 821.

[0250] The fourth positioning post 812 includes a third mounting portion 8121 and a fourth mounting portion 8122. One end of the third mounting portion 8121 is connected to the lower surface of the upper protective cover 810, and the other end is connected to the fourth mounting portion 8122. The cross-sectional area of ​​the third mounting portion 8121 is larger than that of the fourth mounting portion 8122. Therefore, a mounting step surface is provided between the third mounting portion 8121 and the fourth mounting portion 8122, against which the upper surface of the lower protective cover 820 abuts. During installation, the third mounting portion 8121 is embedded in the third through-hole, and the lower surface of the upper protective cover 810 abuts the circuit board. The fourth mounting portion 8122 is embedded in the fifth through-hole.

[0251] For example, the second through hole 303, the third through hole 304, the fourth through hole 821, and the fifth through hole 822 may be square; the second through hole 303, the third through hole 304, the fourth through hole 821, and the fifth through hole 822 may be circular. The area of ​​the second through hole 303 is larger than the cross-sectional area of ​​the first mounting portion 8111, and the area of ​​the fourth through hole 821 is larger than the cross-sectional area of ​​the second mounting portion 8112. The area of ​​the third through hole is larger than the cross-sectional area of ​​the third mounting portion 8121, and the area of ​​the fifth through hole 822 is larger than the cross-sectional area of ​​the fourth mounting portion 8122.

[0252] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. An optical module, comprising: Circuit boards; The light emitting component is electrically connected to the circuit board and comprises: A tube shell, wherein the bottom plate extends relative to the top plate so that the bottom plate forms an extended surface; A first flexible circuit board, having a first wiring area formed on the surface thereof, for transmitting high-frequency signals and / or low-frequency signals; An electrical connector, one end of which extends into the tube shell, and the other end of which is outside the tube shell and is arranged on the surface of the extension surface, wherein the end outside the tube shell is respectively formed with a first step surface and a second step surface, wherein the surface of the first step surface has a second wiring area; A support member is provided on the surface of the second step surface, the support member is fixedly connected to the second step surface, and is used to support the first flexible circuit board so that the first wiring area is flush with the surface of the second wiring area, thereby enabling the first flexible circuit board to be connected to the first step surface by wiring; And / or, the support member is arranged between the first flexible circuit board and the extension surface, and is connected to the electrical connector to support the first flexible circuit board, so that the surface of the first wiring area is flush with the surface of the second wiring area, thereby connecting the first step surface and the first flexible circuit board by wiring.

2. The optical module according to claim 1, wherein: The light emitting component further comprises a second flexible circuit board, wherein the first flexible circuit board is used to transmit the high-frequency signal, and the second flexible circuit board is used to transmit the low-frequency signal; A third step surface is also formed on one end of the electrical connector outside the tube shell; The first flexible circuit board is connected to the first step surface by wire bonding, and the second flexible circuit board is electrically connected to the third step surface.

3. The optical module according to claim 2, wherein: The heights of the third step surface, the second step surface, and the first step surface are successively reduced; The supporting member is located above the first flexible circuit board to support the first flexible circuit board from above the first flexible circuit board.

4. The optical module according to claim 2, wherein: The heights of the third step surface, the first step surface, and the second step surface are successively reduced; The supporting member is located below the first flexible circuit board to support the first flexible circuit board from below the first flexible circuit board.

5. The optical module according to claim 2, wherein: The width of the second step surface is flush with the width of the support member, a reinforcing member is arranged between the first flexible circuit board and the second flexible circuit board, and the reinforcing member is relatively close to the wiring area between the first flexible circuit board and the second step surface; The side surfaces of the reinforcing member are respectively connected to the second step surface and the end surface of the supporting member.

6. The optical module according to claim 2, wherein: A reinforcing piece is provided on the outer side of the connection surface between the supporting piece and the first flexible circuit board, and the reinforcing piece is relatively close to the wiring area between the first flexible circuit board and the second step surface.

7. The optical module according to claim 1, wherein: The support member is disposed on the surface of the extension surface, the first flexible circuit board is disposed on the top surface of the support member, and one side surface of the support member is connected to the electrical connector; The support member has a preset height so that a surface of the second bonding area is flush with a surface of the first bonding area.

8. The optical module according to claim 7, wherein: A notch is provided on one side of the support member facing the electrical connector, and the notch is located at the bottom of the support member to collect glue overflowed when the electrical connector is fixed; Alternatively, a notch is provided on a side of the electrical connector facing the support member, and the notch is located at the bottom of the electrical connector to collect glue overflowing when the electrical connector is fixed.

9. The optical module according to claim 1, wherein: The tail of the extension surface protrudes upward to form a boss, and the boss is configured as the support member to support the first flexible circuit board. The electrical connector is arranged on one side of the boss.

10. The optical module according to claim 9, wherein: A gap is provided between the boss and the electrical connector to collect glue overflowed when the electrical connector is fixed; A support plate is provided between the boss and the first flexible circuit board, and a side surface of the support plate is connected to the electrical connector; The support plate covers the gap; The surface of the support plate is used for arranging the first flexible circuit board.

11. The optical module according to claim 10, wherein: The boss has a preset height so that after the support plate is arranged, the surface of the first bonding area is flush with the surface of the second bonding area.

12. The optical module according to claim 9, wherein: There is a gap between the boss and the electrical connector to collect glue overflowing when the electrical connector is fixed; the top surface of the boss protrudes at least toward one side of the electrical connector relative to the body of the boss to cover the gap; The top surface of the boss is used to place the flexible circuit board.

13. The optical module according to claim 9, wherein: The bottom of the boss on the side adjacent to the electrical connector is provided with a notch to collect glue overflowing when the electrical connector is fixed; Alternatively, in the electrical connector, a bottom portion of a side adjacent to the boss is provided with a notch to collect glue overflowing when the electrical connector is fixed.

14. The optical module according to claim 1, wherein: A third pad area is provided on a surface of one end of the electrical connector located inside the tube shell. The third pad area is electrically connected to the second wiring area to simultaneously transmit the low-frequency signal and the high-frequency signal.

15. An optical module, comprising: A circuit board, the circuit board having a first avoidance hole and a narrow plate area, the first avoidance hole and the narrow plate area are located side by side in the width direction of the circuit board, and a signal pin area is provided on the upper surface of the circuit board; A light emitting component, the light emitting component is located in the first avoidance hole; the light emitting component comprises: An electrical connector, wherein the electrical connector has a second pad area; the second pad area is connected to the signal pin area through a metal wire; The thickness of the electrical connector is greater than the thickness of the circuit board; A light receiving component, located in the narrow plate area; A pad, comprising: a first support portion, a second support portion and a third support portion, wherein upper surfaces of the second support portion and the third support portion are higher than an upper surface of the first support portion; The light emitting component is located above the first supporting portion; the second supporting portion supports the signal pin area so that the signal pin area is flush with the second pad area; The tube shell has a bottom opening, the first supporting portion blocks the bottom opening; and the third supporting portion is located below the narrow plate area.

16. The optical module according to claim 15, wherein: The side wall of the electrical connector abuts against the side wall of the second supporting portion; the lower surface of the light emitting component is lower than the lower surface of the electrical connector, and a first gap is provided between the second pad area, the bottom of the emitting housing and the second supporting portion; The light emitting component abuts against a side wall of the third supporting portion.

17. The optical module according to claim 15, wherein: The pad is provided with a groove, and the groove is located at the connection between the second supporting part and the third supporting part.

18. The optical module according to claim 15, wherein: The lower surface of the electrical connector is connected to the first supporting portion, and a third gap is defined between the second pad region and the second supporting portion; the signal pin region covers the third gap to connect the signal pin region to the second pad region.

19. The optical module according to claim 15, wherein: A second gap is defined between the light emitting housing and the side wall of the third supporting portion.

20. The optical module according to claim 15, wherein: The tube shell comprises: Launch the upper cover; A launching shell, and the launching upper cover are arranged on the launching shell, and a first opening is formed on one side of the launching shell; The light emitting component also includes: The optical emission component is located inside the tube shell and is hoisted on the inner wall of the emission upper cover; The electrical connector is located at the first opening; the electrical connector has a first high-frequency metal layer, the first high-frequency metal layer is located inside the tube shell, and the first high-frequency metal layer is electrically connected to the optical emitting component; The electrical connector has a second high-frequency metal layer located outside the tube shell, and the second high-frequency metal layer is connected to the high-frequency pin by wire bonding; The second high-frequency metal layer is electrically connected to the first high-frequency metal layer; An upper protective cover is located at one side of the circuit board, the lower surface of the upper protective cover is recessed to form a first avoidance groove, and the second high-frequency metal layer and the high-frequency pin are located in the first avoidance groove; The lower protective cover is located on the opposite side of the circuit board facing away from the upper protective cover, and the upper protective cover is detachably connected to the lower protective cover.

21. The optical module according to claim 20, wherein: The circuit board also has a low-frequency pin, and the low-frequency pin is located on the opposite side of the high-frequency pin; The electrical connector has a second low-frequency metal layer, and the second low-frequency metal layer is connected to the low-frequency pin by wire bonding; The upper surface of the lower protective cover is recessed to form a second avoidance groove, and the second low-frequency metal layer and the low-frequency pin are located in the second avoidance groove.

22. The optical module according to claim 20, wherein: The lower surface of the upper protective cover is provided with a third positioning column and a fourth positioning column; The lower protective cover is provided with a fourth through hole and a fifth through hole; The circuit board is provided with a second through hole and a third through hole; The third positioning post is embedded in the second through hole and the fourth through hole; the fourth positioning post is embedded in the third through hole and the fifth through hole.

23. The optical module according to claim 22, wherein: The third positioning column includes: a first mounting portion and a second mounting portion; The first mounting portion is located between the lower surface of the upper protective cover and the second mounting portion, and the cross-sectional area of ​​the first mounting portion is greater than the cross-sectional area of ​​the second mounting portion; The first mounting portion is embedded in the second through hole, and the second mounting portion is embedded in the fourth through hole.

24. The optical module according to claim 20, wherein: The upper protective cover is provided with a clamping portion, and the clamping portion protrudes from the upper surface of the upper protective cover.

25. The optical module according to claim 19, wherein: The electrical connector comprises: a first adapter board, a second adapter board and a third adapter board; Wherein, the second adapter plate is located between the first adapter plate and the third adapter plate; A first high-frequency metal layer is provided on the lower surface of the first adapter plate; the first high-frequency metal layer extends to the outer side of the second adapter plate; A second high-frequency metal layer is disposed on the upper surface of the second adapter plate, and a second low-frequency metal layer is disposed on the lower surface of the second adapter plate.

26. The optical module according to claim 25, wherein: The lower surface of the first adapter plate is provided with a first positioning column and a second positioning column; The second adapter plate has a first limiting portion, a second limiting portion and a third limiting portion, the first limiting portion and the second limiting portion extend toward the inside of the launch shell, and the third limiting portion protrudes from the lower surface of the second adapter plate; The lower surface of the second adapter plate is provided with a first low-frequency metal layer and a second low-frequency metal layer, and the upper surface of the second adapter plate is provided with the second high-frequency metal layer; The inner wall of the first limiting portion is in contact with and connected to the first positioning column; The inner wall of the second limiting portion is in contact with and connected to the second positioning column; The side wall at one end of the third limiting portion is in contact with and connected to the first positioning column; the side wall at the other end of the third limiting portion is in contact with and connected to the second positioning column.

27. The optical module according to claim 26, wherein: The third adapter plate is provided with an avoidance opening, and the third limiting portion abuts against a side wall of the avoidance opening; The third adapter plate is located between the first low-frequency metal layer and the second low-frequency metal layer.

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