Computing device

Abstract

A computing device (100). The computing device (100) comprises: a case (110), and a backplane (120), a main board (130), and a first memory bank (141), which are located in the case (110), wherein the case (110) comprises an opening (1101) and a rear panel (1102), which are respectively located on opposite sides of the case (110); the backplane (120) has a first surface (1201) and a second surface (1202) which are opposite each other; the first surface (1201) of the backplane (120) faces away from the opening (1101), the second surface (1202) of the backplane (120) faces towards the opening (1101), and the main board (130) is located between the backplane (120) and the rear panel (1102) of the case (110); the main board (130) comprises a processor; and the first memory bank (141) is arranged on the second surface (1202) of the backplane (120), and the first memory bank (141) is electrically connected to the processor by means of the backplane (120) and the main board (130). Memory expansion can be realized, thereby effectively enhancing the computing power of the computing device (100).

Description

computing devices

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on June 27, 2023, with application number 202310771263.1 and application name “Computing Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of server technology, and in particular to a computing device. Background Art

[0003] Hot-swapping, or "hot-plugging," means plugging and unplugging hardware while the device is operating. With the appropriate software, hot-swappable peripherals can be inserted and removed without powering down the system, preventing damage to the host or peripherals and enabling real-time detection and use of new devices. Compared to plug-and-play, hot-swapping also requires a specific hardware and software sequence for connecting power, signal, and ground wires.

[0004] Taking servers as an example, hot-swappable technology is now widely used in server components, including storage, power supplies, and networking. As a core component of servers, memory reliability and maintainability significantly impact server availability. Hot-swappable memory technology can significantly improve server maintainability. In related technologies, server memory modules are typically installed on the server's motherboard.

[0005] However, the usage scenarios of servers are gradually tending towards computing power servers, and the above solutions cannot meet the memory requirements of computing power servers.

[0006] Summary of the Invention

[0007] The embodiments of the present application provide a computing device that can implement memory expansion and effectively improve the computing capability of the computing device.

[0008] To achieve the above objectives, the present invention provides the following technical solutions:

[0009] An embodiment of the present application provides a computing device, comprising: a chassis, a backplane, a motherboard and a first memory stick; wherein the backplane, the motherboard and the first memory stick are located inside the chassis; the chassis comprises an opening and a rear panel; wherein the opening and the rear panel are respectively located on opposite sides of the chassis; the backplane has a first surface and a second surface relative to each other; the first surface of the backplane faces away from the opening, and the second surface of the backplane faces the opening, and the motherboard is located between the backplane and the rear panel of the chassis; the motherboard comprises a processor; the first memory stick is arranged on the second surface of the backplane, and the first memory stick is electrically connected to the processor through the backplane and the motherboard.

[0010] The computing device provided by the present application comprises a backplane and a first memory stick arranged in a chassis, wherein the motherboard is located between the backplane and the rear panel of the chassis, the backplane has a first surface facing away from the opening and a second surface facing the opening, and the first memory stick is inserted on the second surface of the backplane, thereby enabling memory expansion and effectively improving the memory capacity of the computing device, thereby avoiding the problem in the prior art that the memory capacity of the server is limited and the memory demand of the computing power server cannot be met.

[0011] In addition, the first memory stick is inserted on the side of the backplane facing the opening. When the first memory stick needs to be replaced, the first memory stick can be directly pulled out or inserted, which facilitates online replacement and fault repair of the memory stick and avoids the problem in the prior art that the chassis needs to be opened when hot-swapping the memory stick, which is inconvenient and slows down the replacement process. In this way, the embodiment of the present application not only achieves memory expansion but also solves the problem in the prior art that the chassis needs to be opened when hot-swapping the memory stick, which is inconvenient and slows down the replacement process.

[0012] In one possible implementation, at least one first memory slot is provided on the second surface of the backplane; the first memory slot is used to insert the first memory module;

[0013] The first memory slot includes: a slot body portion, and buckling portions located on both sides of the slot body portion; the buckling portions are rotatably connected to the slot body portion; the buckling portions are used to fix the first memory module in the first memory slot;

[0014] When the first memory bar is located in the first memory slot, the buckling portion is buckled with the first memory bar. When the first memory bar is removed from the first memory slot, the buckling portion and the first memory bar are separated from each other.

[0015] By providing at least one first memory slot on the second surface of the backplane, the first memory module can be easily inserted into the first memory slot, thereby enabling the first memory module to be inserted into the second surface of the backplane. Thus, when the first memory module needs to be replaced, the first memory module can be directly removed from or inserted into the first memory slot, making online memory replacement and fault repair more convenient.

[0016] In addition, when the first memory stick is located in the first memory slot, the snap-fitting portion snaps into engagement with the first memory stick, facilitating the accommodation and fixation of the first memory stick. When the first memory stick is removed from the first memory slot, the snap-fitting portion separates from the first memory stick, enabling the first memory slot to be opened, facilitating the removal or reinsertion of the first memory stick.

[0017] In one possible implementation manner, the computing device further includes a motion detection unit, which is configured to detect the motion of the buckling portion and trigger the generation of a power-on signal or a power-off signal.

[0018] In one possible implementation, the computing device further includes a logic control device; the logic control device is located on the mainboard; the motion detection unit is electrically connected to the logic control device;

[0019] When the buckle portion rotates away from the first memory bar toward the second surface, the buckle portion triggers the motion detection portion to send a power-off signal to the logic control device; when the buckle portion rotates away from the second surface toward the first memory bar, the buckle portion triggers the motion detection portion to send a power-on signal to the logic control device.

[0020] In one possible implementation, the motion detection portion is a control button; the control button is disposed on the second surface of the back plate, and the control button is located on the motion path of the buckling portion.

[0021] In this way, when the first memory stick needs to be removed from the first memory slot, the snap-fit ​​portion rotates away from the first memory stick, that is, one end of the snap-fit ​​portion moves in a direction close to the second surface of the back plate. By providing a control button at a position corresponding to the snap-fit ​​portion on the second surface of the back plate, the snap-fit ​​portion will trigger the control button when it contacts the control button, causing the control button to send a power-off signal to the mainboard through the back plate, thereby powering off the first memory stick that needs to be replaced.

[0022] In one possible implementation, the computing device further includes an indicator light; the indicator light is disposed on the second surface of the backplane; when the first memory bar fails, the logic control device controls the indicator light to indicate that the first memory bar is faulty.

[0023] In this way, when the first memory stick fails, the logic control device can control the backplane to power off the first memory stick according to the acquired fault signal, and the indicator light on the second surface of the backplane lights up, indicating a warning state and the need to replace the first memory stick.

[0024] In one possible implementation, the computing device further includes a first connector and a second connector; the first connector is arranged on the first surface of the backplane and is electrically connected to the first memory stick through the backplane, and the second connector is arranged on the mainboard and is electrically connected to the processor through the mainboard; the first connector and the second connector are electrically connected through a cable.

[0025] In this way, the mainboard and the backboard are electrically connected via the first connector and the second connector to ensure electrical connectivity and signal transmission between the mainboard and the backboard.

[0026] In one possible implementation manner, the first connector and the second connector are PCIE connectors; and the first memory bar and the processor communicate with each other through a CXL protocol.

[0027] In one possible implementation, the computing device further includes: a memory management chip; the memory management chip is disposed on the second surface of the backplane, and the memory management chip is electrically connected to the first memory bar through the backplane.

[0028] The memory management chip is electrically connected to the backplane, and the memory management chip and the first memory stick can be electrically connected through internal wiring of the backplane, so that the memory management chip can easily manage and control the first memory stick.

[0029] In one possible implementation, the system further includes: a second memory stick and a second memory slot; the second memory slot is provided on the mainboard; and the second memory stick is inserted into the second memory slot.

[0030] The second memory stick and the first memory stick can jointly expand the memory to meet the computing power requirements of the computing device, thereby improving the competitiveness of the computing device.

[0031] By inserting the second memory stick into the second memory slot, when the second memory stick needs to be replaced, the chassis is opened and the second memory stick is pulled out or inserted into the second memory slot in the first accommodation space, thereby achieving online replacement and fault repair of the second memory stick.

[0032] In one possible implementation, the computing device further includes: a hard disk and a hard disk slot; the hard disk slot is provided on the mainboard, and the hard disk is plugged into the hard disk slot.

[0033] Hard disks can play a role in storage and provide good storage capacity for computing devices.

[0034] In addition to the technical problems solved by the embodiments of the present application, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0036] FIG1 is a schematic diagram of the structure of a computing device provided in one embodiment of the present application;

[0037] FIG2 is a schematic diagram of a partial structure of a computing device provided in an embodiment of the present application;

[0038] FIG3 is a schematic diagram of a partial structure of a computing device provided in an embodiment of the present application;

[0039] FIG4 is a schematic diagram of a partial structure of a computing device provided in an embodiment of the present application;

[0040] FIG5 is a schematic diagram of a partial structure of a computing device provided in one embodiment of the present application;

[0041] FIG6 is a schematic diagram of the structure of a first memory slot and a control button in a computing device provided in an embodiment of the present application;

[0042] FIG7 is a schematic diagram of the structure of a first memory slot and a control button in a computing device provided in an embodiment of the present application;

[0043] FIG8 is a schematic diagram of the structure of a first memory slot, a first memory bank, and a control button in a computing device provided in an embodiment of the present application;

[0044] FIG9 is a schematic structural diagram of a first memory slot, a first memory bar, and a control button in a computing device provided in an embodiment of the present application.

[0045] Description of reference numerals:

[0046] 100-Computing device;

[0047] 110 - chassis; 1101 - opening; 1102 - rear panel; 111 - first storage space; 112 - second storage space;

[0048] 120 - back panel; 1201 - first surface of back panel; 1202 - second surface of back panel; 121 - first memory slot; 1211 - slot body; 1212 - buckle portion; 122 - control button; 1221 - base; 1222 - telescopic portion;

[0049] 130-motherboard; 1311-second memory module; 132-hard disk;

[0050] 141-first memory bank;

[0051] 150-first connector;

[0052] 160-second connector;

[0053] 170-memory management chip;

[0054] 180-Central Server.

[0055] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0056] An embodiment of the present application provides a computing device, which is described by taking a server as an example.

[0057] It should be noted that the servers involved in the implementation of this application can be various types such as desktop servers, blade servers, rack servers, cabinet servers, etc., and the embodiments of this application are not limited to this.

[0058] In the server industry, server height and width have standard dimensions. For example, a server's height can be 1U, 2U, 4U, or 6U, where 1U = 44.45mm. A server's width can be 482.6mm.

[0059] It should be noted that the computing device provided in the embodiments of the present application can be applied to scenarios that require high computing power, high-performance computer clusters (High Performance Computing, HPC), etc. that require expanded memory resources, and can also be applied to application scenarios that require online replacement of memory, such as fault repair, such as big data, artificial intelligence (Artificial Intelligence, AI), cloud services, and other scenarios.

[0060] Hot swapping, or hot swapping, refers to inserting or removing modules or boards from a system without turning off the system power, thereby improving system reliability, rapid maintainability, redundancy, and timely disaster recovery capabilities.

[0061] Currently, with the increasing use of servers, server availability has received significant attention. As computing device application scenarios diversify, the use of memory of different forms and specifications is becoming increasingly common. Consequently, the memory on computing devices needs to be frequently swapped out and replaced. Alternatively, if a server fails, it's often impossible to shut down the machine for extended repairs, requiring only online replacement of faulty parts. To prevent data loss in memory, memory requires hot-swappability. This means that components such as memory can be removed from the computing device without shutting down the power.

[0062] Server usage scenarios are gradually shifting towards computing-based servers, with demand for storage-based servers decreasing. However, computing-based servers require a large amount of memory. Commonly used memory is typically installed inside the server, which places heavy demands on troubleshooting and online replacement. If, based on existing technology, memory sticks are added to the server's motherboard, hot-swapping the sticks typically requires opening the server chassis, removing the sticks, replacing them with new ones, and then closing the chassis. This process requires repeated opening of the chassis, making replacement inconvenient and slow.

[0063] Moreover, the space on the motherboard inside the server is limited, and installing too many memory modules can easily affect the layout of other components on the motherboard.

[0064] To solve the above technical problems, while achieving memory expansion and improving the memory capacity of computing devices, the present application provides the following technical solutions, which solve the problem in the prior art that hot-swapping memory requires opening the chassis, making replacement inconvenient and slow.

[0065] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0066] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0067] 1 and 2 , an embodiment of the present application provides a computing device 100, which may include: a chassis 110, a backplane 120, and a motherboard 130, wherein the backplane 120 and the motherboard 130 are located inside the chassis 110, and the backplane 120 divides the space inside the chassis 110 into a first accommodating space 111 and a second accommodating space 112 (see FIG3 ). The backplane 120 has a first surface (i.e., a first surface 1201 of the backplane) and a second surface (i.e., a second surface 1202 of the backplane) relative to each other, the first surface 1201 of the backplane facing away from the opening 1101, and the second surface 1202 of the backplane facing the opening 1101, the motherboard 130 is located in the first accommodating space 111, and the opening 1101 is connected to the second accommodating space 112. Specifically, the motherboard 130 is located between the backplane 120 and the rear panel 1102 of the chassis 110.

[0068] The computing device 100 may further include: a first memory bar 141 , wherein the first memory bar 141 is arranged on the second surface 1202 of the backplane, the motherboard 130 includes a processor, and the first memory group 140 is electrically connected to the processor through the backplane 120 and the motherboard 130 .

[0069] In the computing device 100, a backplane 120 and a first memory stick 141 are arranged in the chassis 110, and the motherboard 130 is located between the backplane 120 and the rear panel 1102 of the chassis 110. The backplane 120 has a first surface facing away from the opening 1101 and a second surface facing the opening 1101. The first memory stick 141 is inserted into the second surface 1202 of the backplane, which can realize memory expansion and effectively improve the memory capacity of the computing device 100.

[0070] In addition, the first memory stick 141 is inserted into the side of the backplane 120 facing the opening 1101. Thus, when the first memory stick 141 needs to be replaced, it can be directly pulled out or inserted through the opening 1101. This facilitates online replacement and fault repair of the memory stick 141, reduces the impact of power failure on HPC high-performance computing, saves costs, and meets computing power requirements. Moreover, the replacement operation is convenient and fast, without opening the chassis 110, and can be performed directly. This avoids the problem in the prior art of needing to open the chassis 110 when hot-swapping the memory stick, which is inconvenient and slows down the replacement process.

[0071] As shown in FIG. 4 , in the embodiment of the present application, at least one first memory slot 121 may be provided on the second surface 1202 of the backplane, and the first memory slot 121 is used to insert the first memory stick 141 .

[0072] By providing at least one first memory slot 121 on the second surface 1202 of the backplane, the first memory module 141 can be easily inserted into the first memory slot 121, thereby enabling the first memory module 141 to be inserted into the second surface 1202 of the backplane. Thus, when the first memory module 141 needs to be replaced, the first memory module 141 can be directly removed from or inserted into the first memory slot 121, making online memory replacement and fault repair easier.

[0073] Exemplarily, the number of first memory slots 121 can be one, two, three or more, which is not limited in the embodiment of the present application. Correspondingly, the number of first memory sticks 141 can also be one, two, three or more, which is not limited in the embodiment of the present application.

[0074] It can be understood that, as shown in Figure 5, in actual application scenarios, the embodiment of the present application can place backplanes 120 with different numbers of first memory slots 121 in the computing device 100 according to different needs, that is, the backplane 120 can be designed according to different needs.

[0075] It should be noted that in the embodiment of the present application, before the first memory stick 141 needs to be replaced, the first memory stick 141 needs to be powered off (i.e., powered off), and after the first memory stick 141 is replaced, the first memory stick 141 needs to be powered on (i.e., powered on). The specific triggering mechanisms of the power-off signal and the power-on signal may include, but are not limited to, the following possible implementations:

[0076] One possible implementation method is: as shown in Figures 6 and 7, the first memory slot 121 may include: a slot body portion 1211 and a snap-fit ​​portion 1212, wherein the snap-fit ​​portion 1212 is located on both sides of the slot body portion 1211, and the snap-fit ​​portion 1212 is rotatably connected to the slot body portion 1211, and the snap-fit ​​portion 1212 is used to fix the first memory stick 141 in the first memory slot 121.

[0077] When the first memory stick 141 is located in the first memory slot 121 , the buckling portion 1212 is buckled with the first memory stick 141 . When the first memory stick 141 is removed from the first memory slot 121 , the buckling portion 1212 and the first memory stick 141 are separated from each other. The buckling portion 1212 is used to fix the first memory stick 141 .

[0078] That is to say, when the first memory stick 141 is located in the first memory slot 121, the snap-fitting portion 1212 is snapped with the first memory stick 141, which can fix the first memory stick 141 and facilitate the accommodation and fixation of the first memory stick 141. When the first memory stick 141 is removed from the first memory slot 121, the snap-fitting portion 1212 is separated from the first memory stick 141, which can open the first memory slot 121 and facilitate the removal or reinsertion of the first memory stick 141.

[0079] In the embodiment of the present application, the computing device 100 further includes a motion detection unit, which is used to detect the movement of the snap-fit ​​portion 1212 and trigger the generation of a power-on signal or a power-off signal.

[0080] In addition, in some embodiments, the computing device 100 may further include a logic control device, which is located on the motherboard 130. The motion detection unit is electrically connected to the logic control device. When the snap-fit ​​portion 1212 rotates away from the first memory module 141 and toward the second surface 1202 of the backplane, the snap-fit ​​portion 1212 triggers the motion detection unit to send a power-down signal to the logic control device. When the snap-fit ​​portion 1212 rotates away from the second surface 1202 of the backplane and toward the first memory module 141, the snap-fit ​​portion 1212 triggers the motion detection unit to send a power-up signal to the logic control device.

[0081] Specifically, the motion detection portion can be a control button 122, which is disposed on the second surface 1202 of the back panel and located on the motion path of the buckling portion 1212. The control button 122 is used to trigger the generation of a power-on signal or a power-off signal.

[0082] Specifically, a control button 122 is provided on the second surface 1202 of the backplane at a position corresponding to the snap-fit ​​portion 1212. For example, when the snap-fit ​​portion 1212 rotates away from the first memory stick 141, that is, when the first memory stick 141 is removed from the first memory slot 121, the snap-fit ​​portion 1212 and the first memory stick 141 are separated from each other, the snap-fit ​​portion 1212 triggers the control button 122, so that the control button 122 sends a power-off signal to the motherboard 130 through the backplane 120.

[0083] As shown in Figure 8, when the first memory stick 141 needs to be removed from the first memory slot 121, the snap-fit ​​portion 1212 rotates away from the first memory stick 141, that is, one end of the snap-fit ​​portion 1212 moves in a direction close to the second surface 1202 of the backplane. Since a control button 122 is provided at a position corresponding to the snap-fit ​​portion 1212 on the second surface 1202 of the backplane, the snap-fit ​​portion 1212 will trigger the control button 122 after contacting the control button 122. Specifically, the snap-fit ​​portion 1212 will press the control button 122 to generate a force, so that the control button 122 sends a power-off signal to the motherboard 130 through the backplane 120, thereby powering off the first memory stick 141 that needs to be replaced.

[0084] In some embodiments, as shown in FIG9 , when the first memory stick 141 is removed from the first memory slot 121 and a new first memory stick 141 is reinstalled, the snap-fit ​​portion 1212 rotates closer to the first memory stick 141, that is, the snap-fit ​​portion 1212 is relatively away from the control button 122 and does not trigger the control button 122. The control button 122 is restored, thereby allowing the control button 122 to send a power-on signal to the motherboard 130 through the backplane 120 to power on the replaced first memory stick 141.

[0085] Specifically, in Figures 8 and 9, control buttons 122 are set on both sides of the first memory slot 121 of the backplane 120. When the first memory stick 141 is removed or installed, the two ends of the first memory slot 121 touch the control buttons 122. The control buttons 122 can send a signal to the logic control device through the backplane 120, and the logic control device controls the power off.

[0086] 8 and 9 , the control button 122 may include a base 1221 and a telescopic portion 1222 , wherein the base 1221 is disposed on the second surface 1202 of the back plate, and the telescopic portion 1222 is telescopically disposed relative to the base 1221 .

[0087] When the snap-fitting portion 1212 rotates away from the first memory bar 141 toward the second surface 1202 of the backplane, the snap-fitting portion 1212 presses the telescopic portion 1222 to retract to the base 1221 to send a power-off signal to the logic control device. When the snap-fitting portion 1212 rotates away from the second surface 1202 of the backplane toward the first memory bar 141, the telescopic portion 1222 extends to an initial state relative to the base 1221 to send a power-on signal to the logic control device.

[0088] It is understandable that the logic control device can be a complex programmable logic device (CPLD) or a field programmable gate array (FPGA). Users can construct logic functions on the logic control device according to their actual needs.

[0089] It should be noted that, in the embodiment of the present application, the power on and off of the first memory bank 141 may be controlled by a CPLD on the motherboard 130 or by a CPLD on the backplane.

[0090] Alternatively, in some embodiments, the motion detection portion may be an infrared sensor, which is used to detect the movement of the snap-fit ​​portion 1212. For example, the transmitter and receiver of the infrared sensor are respectively located on the groove walls on both sides of the snap-fit ​​portion 1212. When the snap-fit ​​portion 1212 is closed, the infrared sensor receiver cannot detect light, and when the snap-fit ​​portion 1212 is open, the infrared sensor detector can detect light.

[0091] Another possible implementation is that an indicator light (not shown) may be provided on the second surface 1202 of the backplane. When the first memory stick 141 fails, the logic control device controls the indicator light to indicate that the first memory stick 141 is in failure.

[0092] Specifically, the CPLD on the motherboard 130 can be used to control the first memory stick 141 to power off and light up the indicator light according to the acquired fault signal. For example, the motherboard 130 can control the indicator light to flash red to indicate a warning state and the first memory stick 141 needs to be replaced.

[0093] During actual operation, when the first memory stick 141 fails, the CPLD can control the backplane 120 to power off the first memory stick 141 based on the acquired fault signal, and the indicator light on the second surface 1202 of the backplane flashes red, indicating a warning status and the first memory stick 141 needs to be replaced.

[0094] After replacing the first memory stick 141 , the motherboard 130 can control the backplane 120 to power on the first memory stick 141 , and the indicator light on the second surface 1202 of the backplane flashes green, indicating that the first memory stick 141 is in normal working condition.

[0095] Specifically, in an actual application scenario, the computing device 100 couples the first memory stick 141 fault alarm command and the first memory stick 141 power-off command, and sets an indicator light on the memory backplane 120. When the first memory stick 141 fault alarm occurs, the first memory stick 141 is controlled to automatically power off, and the indicator light flashes red. After replacing the first memory stick 141, it returns to normal and the indicator light returns to green.

[0096] It can be understood that the fault alarm command of the first memory stick 141 and the power-off command of the first memory stick 141 can be coupled to each other through software settings within the computing device 100. Specifically, when a fault alarm command appears in the first memory stick 141, a power-off command will be synchronously issued to the first memory stick 141.

[0097] In addition, in an embodiment of the present application, the computing device 100 may further include: a first connector 150 and a second connector 160, wherein the first connector 150 is arranged on the first surface of the backplane 120, and the first connector 150 is electrically connected to the first memory stick 141 through the backplane 120, and the second connector 160 is arranged in the first accommodating space 111 of the chassis 110. Specifically, the second connector 160 is arranged on the motherboard 130 and is electrically connected to the processor through the motherboard 130, and the first connector 150 is electrically connected to the second connector 160.

[0098] It is understandable that the first connector 150 and the second connector 160 may be electrically connected via a cable or the like.

[0099] In this way, the mainboard 130 and the backplane 120 are electrically connected via the first connector 150 and the second connector 160 to ensure electrical connectivity and signal transmission between the mainboard 130 and the backplane 120 .

[0100] In one possible implementation, the first connector 150 and the second connector 160 can be a PCIE connector, a Slimline connector, an MCIO connector, a Gen-Z connector, a UBC connector, or a UBCDD connector, etc. The specific types of the first connector 150 and the second connector 160 are not limited in the embodiment of the present application, nor are they limited to the above examples.

[0101] In the embodiment of the present application, the first memory bank 141 and the processor may communicate via a Compute Express Link (CXL) protocol.

[0102] It should be noted that the second connector 160 can be electrically connected to the motherboard 130 via a PCIE bus, thereby allowing the first memory stick 141 to be connected to the PCIE resources in the server's internal CPU via the PCIE bus. In the prior art, hot-swappable memory generally occupies resources of the memory controller on the central processing unit 180 (CPU), and replacing the memory is inconvenient. In the embodiment of the present application, the backplane 120 electrically connected to the first memory stick 141 communicates at high speed via the Compute Express Link (CXL) protocol, occupying PCIE resources on the central processing unit 180 without occupying resources of the memory controller, thereby achieving memory expansion through the first memory stick 141.

[0103] It is understood that PCIE refers to a high-speed serial computer expansion bus standard. Specifically, the embodiment of the present application is connected to the PCIE resources in the CPU inside the server via the PCIE bus.

[0104] In an embodiment of the present application, the computing device 100 may further include a memory management chip 170. The memory management chip 170 is disposed on the second surface 1202 of the backplane. Furthermore, the memory management chip 170 is electrically connected to the first memory bank 141 via the backplane 120. For example, the memory management chip 170 and the first memory bank 141 may be electrically connected via internal wiring of the backplane 120. This facilitates the memory management chip 170 to manage and control the first memory bank 141.

[0105] It is easy to understand that in scenarios where high computing power, HPC high-performance computing, etc. require expanded memory resources, the embodiment of the present application uses a memory expansion board (i.e., backplane 120) to connect nodes that require memory expansion and management nodes to perform real-time memory pool resource judgment and allocation on the mainboard 130.

[0106] Specifically, the front memory expansion backplane 120 is connected to the server motherboard 130 using a PCIE connector, and memory expansion is performed through a physical PCIE link using the CXL protocol. The memory expansion backplane 120 itself is provided with a slot (i.e., a first memory slot 121) and supports hot-swapping of the first memory stick 141. Therefore, when the HPC high-performance computing center detects that the first memory stick 141 fault alarm is automatically isolated, on the one hand, it is impossible to immediately power off the computer to replace the first memory stick 141, and on the other hand, the failure of the first memory stick 141 will affect the cluster computing performance. In the embodiment of the present application, the use of this backplane 120 allows the faulty first memory stick 141 to be directly replaced from the backplane 120, thereby ensuring the cluster computing function.

[0107] In addition, when the server needs to replace the memory, the memory can be replaced directly from the front memory backplane 120, avoiding the impact of power off on computing and functions.

[0108] Based on the above embodiment, the computing device 100 may further include a second memory module 1311, wherein the second memory module 1311 is plugged into the motherboard 130. The second memory module 1311 and the first memory module 141 can serve as memory expansion to meet the computing power requirements of the computing device 100, thereby improving the competitiveness of the computing device 100.

[0109] It is understood that in some embodiments, the motherboard 130 is provided with at least one second memory slot (not shown in the figure), and the second memory module 1311 is inserted into the second memory slot. By inserting the second memory module 1311 into the second memory slot, when the second memory module 1311 needs to be replaced, the chassis 110 is opened and the second memory module 1311 is pulled out of or inserted into the second memory slot of the first storage space 111, thereby achieving online replacement and fault repair of the second memory module 1311.

[0110] In the embodiment of the present application, the computing device 100 may further include a hard disk 132 and a hard disk slot. The hard disk 132 is disposed on the motherboard 130. Specifically, the hard disk slot may be disposed on the motherboard 130, and the hard disk 132 may be inserted into the hard disk slot. This may be a built-in hard disk or a rear-mounted hard disk. The hard disk serves as a storage device, providing the computing device 100 with good storage capacity.

[0111] A front memory backplane 120 is adopted to replace the previous front hard disk backplane 120. Compared with the prior art of placing the hard disk in front of the backplane 120, the embodiment of the present application places the memory in front of the backplane 120, which facilitates the insertion and removal of the memory while expanding the memory, and can realize direct fault replacement in the chassis 110, and the system automatically alarms. In some embodiments, it can also be used with a fully automatic robot in the intelligent computer room for automatic replacement to repair the fault.

[0112] In addition, the computing device 100 provided in the embodiment of the present application may further include a storage module (not shown in the figure), which may be disposed in the inner cavity of the housing. The storage module may include a storage support frame, a storage adapter board, and a memory. The storage support frame may have one or more storage spaces, and the memories may be placed in the storage spaces in a one-to-one correspondence. The storage adapter board may use a CPLD (Complex Programmable Logic Device) chip to parse the storage signal light, which can realize specific prompt functions such as storage error reporting, storage positioning, and storage activity signals.

[0113] Among them, the terms "upper" and "lower" are used to describe the relative position relationship of each structure in the accompanying drawings, which is only for the convenience of description and is not used to limit the scope of implementation of this application. Changes or adjustments to their relative relationships should also be regarded as the scope of implementation of this application without substantially changing the technical content.

[0114] It should be noted that, in this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," and "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "below," "below," and "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0115] Furthermore, in this application, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be interpreted broadly. For example, they may refer to fixed connection, detachable connection, or integration. They may refer to direct connection or indirect connection through an intermediate medium. They may refer to internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0116] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0117] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein, and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A computing device, characterized in that include: Chassis, backplane, motherboard and first memory stick; Wherein, the backplane, the mainboard, and the first memory bar are located inside the chassis; The chassis comprises an opening and a rear panel; wherein the opening and the rear panel are respectively located on opposite sides of the chassis; The back plate has a first surface and a second surface opposite to each other; The first surface of the back plate faces away from the opening; The second surface of the back plate faces the opening; the main board is located between the back plate and the rear panel of the chassis; The mainboard includes a processor; The first memory bar is arranged on the second surface of the backplane; the first memory bar is electrically connected to the processor through the backplane and the mainboard.

2. The computing device according to claim 1, wherein: At least one first memory slot is arranged on the second surface of the backplane; the first memory slot is used to insert the first memory stick; the first memory slot comprises: a slot body portion, and buckling portions located on both sides of the slot body portion; The buckle portion is rotatably connected to the slot portion; the buckle portion is used to fix the first memory bar in the first memory slot; When the first memory bar is located in the first memory slot, the buckling portion buckles with the first memory bar; When the first memory bar is removed from the first memory slot, the buckling portion and the first memory bar are separated from each other.

3. The computing device according to claim 2, characterized in that The computing device further includes a motion detection unit configured to detect the motion of the buckling unit and trigger the generation of a power-on signal or a power-off signal.

4. The computing device according to claim 3, characterized in that The computing device further comprises a logic control device; the logic control device is located on the main board; The motion detection unit is electrically connected to the logic control device; When the buckling portion moves away from the first memory bar and rotates toward the second surface, the buckling portion triggers the motion detection portion to send a power-off signal to the logic control device; When the buckling portion rotates away from the second surface toward the first memory bar, the buckling portion triggers the motion detection portion to send a power-on signal to the logic control device.

5. The computing device according to claim 4, characterized in that The motion detection portion is a control button, which is disposed on the second surface of the back plate and is located on the motion path of the buckling portion.

6. The computing device according to claim 5, characterized in that The computing device also includes an indicator light; The indicator light is arranged on the second surface of the back plate; When the first memory bar fails, the logic control device controls the indicator light to indicate that the first memory bar is in failure.

7. The computing device according to claim 5 or 6, characterized in that: The computing device also includes a first connector and a second connector; The first connector is disposed on the first surface of the backplane and is electrically connected to the first memory bar through the backplane; The second connector is disposed on the mainboard and is electrically connected to the processor through the mainboard; The first connector is electrically connected to the second connector through a cable.

8. The computing device according to claim 7, characterized in that The first connector and the second connector are PCIE connectors; The first memory bar and the processor communicate with each other via a CXL protocol.

9. The computing device according to any one of claims 1 to 8, characterized in that: The computing device further includes: a memory management chip; The memory management chip is disposed on the second surface of the backplane, and the memory management chip is electrically connected to the first memory bar through the backplane.

10. The computing device according to any one of claims 1 to 9, characterized in that: The computing device further includes: a second memory bar and a second memory slot; the second memory slot is arranged on the mainboard; and the second memory bar is inserted into the second memory slot.

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