Wafer polishing system and wafer processing method

Abstract

Disclosed in the present invention is a wafer polishing system, comprising a wafer polishing unit, a wafer cleaning unit which is arranged adjacent to the wafer polishing unit, a wafer transport channel, and a wafer transfer mechanism, at least part thereof being located in the wafer cleaning unit. A docking station is formed on the wafer transport channel, and at least part of the wafer transfer mechanism can move to the docking station, so as to transport wafers between the wafer polishing unit and the wafer cleaning unit. Further disclosed in the present invention is a wafer processing method of the wafer polishing system. In the present invention, part of the wafer transfer mechanism is located in the wafer cleaning unit, and said part can move to the docking station so as to achieve direct interaction between the wafer polishing unit and the wafer cleaning unit without any intermediate interaction link. Moreover, shortening the transfer path of wafers also reduces devices needed for wafer transferring, thereby minimizing the damage to wafers and achieving high efficiency of wafer transferring.

Description

Wafer polishing system and wafer processing method Technical Field

[0001] The present invention belongs to the technical field of semiconductor integrated circuit chip manufacturing, and in particular relates to a wafer polishing system and a wafer processing method. Background Art

[0002] Chemical Mechanical Planarization (CMP) equipment typically consists of a semiconductor front-end module (EFEM), a cleaning unit, and a polishing unit. The EFEM primarily includes a wafer cassette, a wafer transfer robot, and an air purification system. The cleaning unit primarily comprises varying numbers of megasonic cleaning components, roller brush cleaning components, drying components, and a device for transferring wafers between components. The polishing unit typically includes a workbench, polishing pad, polishing head, polishing arm, dresser, and polishing fluid arm, with each component arranged on the workbench according to the processing location.

[0003] Because CMP equipment is divided into different functional units, wafer transfer between these units significantly impacts equipment production efficiency and wafer quality. Existing wafer transfer between the polishing and cleaning units utilizes a polishing turntable and a dual-claw robot. The dual-claw robot uses different grippers to grasp polished and unpolished wafers, placing unpolished wafers on the turntable and removing polished wafers from the turntable, thereby loading and unloading wafers from the polishing unit. In other words, the process of transferring polished wafers from the polishing area to the cleaning area involves placing the polished wafers on the turntable after polishing. A wet robot removes the wafers from the turntable and places them on the base of the cleaning unit's buffer unit, where they are retrieved by the robot in the cleaning area for further processing. In other words, the turntable, wet robot, and base are required to coordinate wafer transfer between the polishing and cleaning areas. This complex structure results in low transfer efficiency, a high potential for impurities to be introduced during transfer, and a greater likelihood of impurities being deposited due to the time and space required for transfer.

[0004] Summary of the Invention

[0005] In order to overcome the shortcomings of the existing technology, the present invention provides a wafer polishing system with a simplified structure and a wafer processing method using the wafer polishing system, which can be moved to a docking station using a wafer transfer mechanism, wherein part of the wafer transfer mechanism is located in a wafer cleaning unit, thereby realizing efficient transfer of the wafer between the polishing area and the cleaning area.

[0006] The technical solution adopted by the present invention to solve the technical problem is: a wafer polishing system, comprising:

[0007] Wafer polishing unit;

[0008] a wafer cleaning unit, disposed adjacent to the wafer polishing unit;

[0009] Wafer transfer channel;

[0010] Also included is a wafer transfer mechanism, at least partially located in the wafer cleaning unit;

[0011] A docking station is formed on the wafer transmission channel, and at least a portion of the wafer transfer mechanism can be moved to the docking station to realize the transfer of the wafer between the wafer polishing unit and the wafer cleaning unit.

[0012] Furthermore, the wafer transfer mechanism is also used to adjust the position and posture of the wafer.

[0013] Furthermore, there is an intersection area between the wafer transmission channel and an extension line of the position of the wafer cleaning unit closest to the wafer polishing unit, and the docking station is located in the intersection area.

[0014] Furthermore, the wafer transfer mechanism adjusts the wafer position and posture to:

[0015] Flip the wafer to a vertical state or a nearly vertical state;

[0016] and / or, the wafer is flipped to a horizontal state or a nearly horizontal state;

[0017] and / or, moving horizontally with the wafer;

[0018] and / or, moving vertically with the wafer;

[0019] And / or, swinging the wafer along an arc.

[0020] Furthermore, the wafer transmission channel is located in the wafer polishing unit or on the side of the wafer polishing unit, and the docking station is located in the wafer transmission channel.

[0021] Furthermore, it also includes,

[0022] A clamping device for clamping a wafer;

[0023] Fixed-point docking position, located in the wafer cleaning unit;

[0024] The clamping device and the wafer transfer mechanism can be moved to a docking station to achieve wafer transfer between the clamping device and the wafer transfer mechanism;

[0025] After acquiring the wafer, the wafer transfer mechanism can move to a fixed docking position.

[0026] Furthermore, it also includes,

[0027] The wafer transfer unit includes at least a transfer table, which can be moved to a docking station to achieve wafer transfer between the clamping device and the transfer table.

[0028] Furthermore, it also includes a first transmission track, and the clamping device can reciprocate along the first transmission track; the wafer transfer unit also includes a second transmission track, and the transfer platform can reciprocate along the second transmission track; the transfer platform can be docked with the clamping device.

[0029] Furthermore, it also includes a first guide rail, and the wafer transfer mechanism can move along the first guide rail; the wafer transfer mechanism, the clamping device, and the wafer transfer unit can be moved until the projections of two or three of them at least partially overlap.

[0030] Furthermore, the projections of the first transfer track, the second transfer track and the first guide track at least partially overlap; or the projections of the first transfer track, the second transfer track and the wafer transfer mechanism at least partially overlap.

[0031] Furthermore, at least part of the second transfer track is arranged above the wafer transfer channel, and its extension direction is the same as that of the wafer transfer channel and the first transfer track, and is arranged at an angle to the extension direction of the first guide track in the horizontal plane.

[0032] Furthermore, the second transmission track is perpendicular to the first guide track.

[0033] Furthermore, the wafer transfer mechanism includes a swing arm, a flip arm connected to the swing arm, and a claw for clamping the wafer. The flip arm can rotate around its own axis to drive the claw to switch between a horizontal state or a horizontal state and a vertical state or a vertical state of the wafer. The swing arm is used to drive the flip arm and the claw to swing.

[0034] Furthermore, the swing arm has a swing axis body, which extends in a direction parallel to the wafer transmission channel, and the swing arm drives the flip arm and the claw to swing around the swing axis body.

[0035] Furthermore, the swing arm and the flip arm are coaxially arranged and telescopically connected.

[0036] Furthermore, the wafer transfer mechanism includes at least a rotating shaft and a clamping jaw assembly, and the rotating shaft drives the clamping jaw assembly to switch between a horizontal state or a state tending to be horizontal and a vertical state or a state tending to be vertical.

[0037] Furthermore, the contact point between the clamping jaw assembly and the wafer and the contact point between the clamping device and the wafer are offset from each other.

[0038] Furthermore, the clamping jaw assembly includes at least one rotating clamping jaw, which includes a shaft parallel to the wafer and a claw body rotatably connected to the shaft body, and the side surface of the claw body can be against the side wall of the wafer.

[0039] Furthermore, the clamping jaw assembly also includes a fixed clamping jaw, the inner side wall of which is in an arc shape that can fit with the side wall of the wafer.

[0040] Furthermore, when the wafer is flipped to a vertical state or tending to a vertical state, the rotating clamp is located on the top of the wafer.

[0041] Furthermore, it also includes a second guide rail, which is arranged at an angle with the first guide rail on a vertical plane. The wafer transfer mechanism can move along the second guide rail, and the second guide rail can move along the first guide rail.

[0042] Furthermore, the clamping device, wafer transfer mechanism and transfer table can be located at the docking station at the same time.

[0043] Furthermore, the number of the clamping devices is two or more, and at least one clamping device is docked with the turntable and the wafer transfer mechanism respectively at the same time, or at least one clamping device is docked with two wafer transfer mechanisms respectively at the same time.

[0044] Furthermore, the wafer transfer mechanism is used to adjust the wafer from a horizontal or nearly horizontal state to a vertical or nearly vertical state.

[0045] The present invention also discloses a wafer processing method of a wafer polishing system, comprising the following steps:

[0046] The wafer to be polished is transferred to the wafer polishing unit;

[0047] After the wafer is polished, it is transferred to the docking station and docked with the wafer transfer mechanism at the docking station to realize the wafer transfer between the wafer polishing unit and the wafer transfer mechanism;

[0048] After the wafer is received, the wafer transfer mechanism flips the wafer to a vertical state or a state close to vertical state and moves the wafer to the wafer cleaning unit.

[0049] Further, the following steps are included:

[0050] The clamping device clamps the wafer to be polished and transfers the wafer to the wafer polishing unit;

[0051] After the wafer is polished, the clamping device clamps the wafer to the docking station and docks with the wafer transfer mechanism at the docking station to realize the wafer transfer between the clamping device and the wafer transfer mechanism;

[0052] After the wafer is received, the wafer transfer mechanism flips the wafer to a vertical state or a state close to vertical state and moves the wafer to a fixed docking position in the wafer cleaning unit.

[0053] Furthermore, in the step where the wafer transfer mechanism flips the wafer to a vertical state or a vertical state and moves it to a fixed docking position in the wafer cleaning unit after acquiring the wafer, the wafer transfer mechanism flips the wafer first after acquiring the wafer and then moves it to the fixed docking position, or the wafer transfer mechanism first moves to the fixed docking position and then flips it, or the wafer transfer mechanism moves to the fixed docking position and flips simultaneously.

[0054] Furthermore, in the step of transferring the wafer to the wafer polishing unit after the clamping device clamps the wafer to be polished, the turntable of the wafer transfer unit moves to the docking station, and the clamping device clamps the wafer from the turntable.

[0055] Furthermore, in the step of transferring the wafer to the wafer polishing unit after the clamping device clamps the wafer to be polished,

[0056] The clamping device transfers the wafer to be polished from the turntable to the wafer stage;

[0057] The wafer on the carrier is transferred to the polishing area by the polishing head;

[0058] After the wafer is polished, the polishing head transfers the polished wafer to the wafer stage;

[0059] The clamping device takes the wafer from the wafer carrier and takes it out of the wafer polishing unit.

[0060] Furthermore, after the wafer is polished, the clamping device clamps the wafer to the docking station and docks with the wafer transfer mechanism at the docking station to realize the step of wafer transfer between the clamping device and the wafer transfer mechanism. The transfer table of the wafer transfer unit is reset to achieve avoidance, and the wafer transfer mechanism moves to the fixed docking position through the cooperation of the first guide rail and / or the second guide rail.

[0061] Furthermore, in the step of moving the wafer to the fixed docking position, through the cooperation of the first guide rail and the second guide rail, the wafer moves to the fixed docking position under the superposition of the two motion trajectories of horizontal movement and vertical lifting, or the wafer swings along an arc to the fixed docking position, or moves horizontally to the fixed docking position through the first guide rail.

[0062] Furthermore, the fixed docking position is set in the wafer cleaning unit.

[0063] Furthermore, the method also includes the following steps: at least a portion of the wafer cleaning unit can be moved to a fixed docking position to transfer the wafer in a vertical state or a wafer tending to be vertical.

[0064] The beneficial effects of the present invention are: 1) part of the wafer transfer mechanism is located in the wafer cleaning unit, and part of it can be moved to the docking station, thereby realizing direct interaction between the wafer polishing unit and the wafer cleaning unit, eliminating the intermediate interaction link, simplifying the interaction structure, shortening the wafer transfer path, reducing the number of devices required for wafer transfer, and minimizing damage to the wafer; 2) The docking station is at the intersection of the wafer transmission channel and the extension line of the wafer cleaning unit closest to the wafer polishing unit. The wafer travel path between the wafer cleaning unit and the wafer polishing unit through the wafer transfer mechanism is the shortest, the wafer transmission efficiency is high, and the adverse effects of the environment on the wafer are minimized; 3) The wafer transfer mechanism integrates the wafer posture adjustment and the wafer transmission together, with rich functions and simple structure; 4) The structure of the prior art that requires the cooperation of the turntable, wet manipulator and base is simplified. The wafer transfer can be realized by docking the wafer transfer mechanism at the docking station, the structure is simplified, and the wafer polishing system can transmit the polished wafer out of the polishing system. Efficiency is improved, the risk of introducing impurities is reduced, and the possibility of impurities being precipitated due to the time and space of wafer transmission is smaller; 5) The movement of the wafer transfer mechanism in the horizontal and vertical directions realizes the transfer of the wafer from the clamping device to the fixed docking position. The wafer transfer mechanism can also flip the wafer from a horizontal state to a vertical state, reducing the number of wafer dockings and making wafer transmission faster and more convenient; 6) The wafer transfer mechanism can flip the wafer in different directions to adapt to different orientation requirements when the wafer enters the cleaning unit; 7) The structural integration is high, reducing the number of positions that need to be debugged and reducing the debugging workload; 8) The clamping jaw assembly includes a fixed clamping jaw and a rotating clamping jaw. When the rotating clamping jaw releases the clamping of the wafer, the wafer can move freely in the plane where the clamping jaw assembly is located, making wafer transfer more convenient; 9) In the process of transferring the polished wafer out of the wafer polishing unit by the clamping device, the transfer table of the wafer transfer unit can prepare the unpolished wafer to be entered into the wafer polishing unit in advance in the reset state, thereby increasing the efficiency of the wafer polishing system in transferring unprocessed wafers into the wafer polishing unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] FIG1 is a simplified diagram of the present invention.

[0066] FIG2 is a schematic diagram of the three-dimensional structure of the wafer polishing system in the first embodiment of the present invention, where the clamping device and the wafer transfer mechanism are at the docking station.

[0067] FIG3 is a schematic diagram of the three-dimensional structure of the wafer transfer mechanism in the first embodiment of the present invention, where the wafer is in a horizontal state.

[0068] FIG4 is a schematic diagram of the three-dimensional structure of the wafer transfer mechanism in the first embodiment of the present invention, where the wafer is in a vertical state.

[0069] FIG5 is a schematic diagram of the three-dimensional structure of the clamping jaw assembly in the first embodiment of the present invention.

[0070] FIG6 is a perspective structural diagram of a wafer clamped by a clamping jaw assembly in the first embodiment of the present invention.

[0071] FIG7 is a perspective structural diagram of the wafer clamped by the clamping jaw assembly in the first embodiment of the present invention, wherein the clamping jaw is rotated to release the wafer.

[0072] FIG8 is a perspective structural diagram of a wafer detachment clamping assembly in the first embodiment of the present invention.

[0073] FIG9 is a second structural diagram of the clamping jaw assembly clamping a wafer in the first embodiment of the present invention, wherein the clamping jaw is rotated to release the clamping of the wafer.

[0074] FIG10 is a first schematic diagram of the coordination structure between the wafer transfer mechanism and the first guide rail and the second guide rail in the first embodiment of the present invention.

[0075] FIG11 is a second schematic diagram of the coordination structure between the wafer transfer mechanism and the first guide rail and the second guide rail in the first embodiment of the present invention.

[0076] FIG12 is a schematic diagram of the structure of the area where the fixed-point docking position is located in the first embodiment of the present invention.

[0077] FIG13 is a first schematic diagram of the swing-type wafer transfer mechanism in the first embodiment of the present invention.

[0078] FIG14 is a second schematic diagram of the swing-type wafer transfer mechanism in the first embodiment of the present invention.

[0079] FIG15 is a schematic diagram of the swing-type wafer transfer mechanism in the first embodiment of the present invention converting the wafer from a horizontal state to a vertical state.

[0080] FIG16 is a schematic diagram of the swinging of the swing-type wafer transfer mechanism in the first embodiment of the present invention, at which time the wafer is synchronously flipped.

[0081] FIG17 is a schematic diagram of the swinging of the swing-type wafer transfer mechanism in the first embodiment of the present invention.

[0082] FIG18 is a schematic diagram of the three-dimensional structure of the wafer polishing system in the second embodiment of the present invention, where the clamping device and the turntable are at the docking station.

[0083] FIG19 is a schematic diagram of the three-dimensional structure of the wafer polishing system in the second embodiment of the present invention, where the clamping device and the wafer transfer mechanism are at the docking station.

[0084] FIG20 is a schematic diagram of the top view of the structure of the wafer polishing system in the second embodiment of the present invention, where the clamping device and the turntable are at the docking station.

[0085] FIG21 is a schematic diagram of the top view of the structure of the wafer polishing system in the second embodiment of the present invention, where the clamping device, wafer transfer mechanism and turntable are all at the docking station.

[0086] FIG22 is a side structural diagram of the wafer polishing system in the second embodiment of the present invention, where the clamping device, wafer transfer mechanism and turntable are all at the docking station.

[0087] FIG23 is a schematic diagram of the top view of the structure of the wafer polishing system in the second embodiment of the present invention, where the clamping device, wafer transfer mechanism and turntable are all at the docking station.

[0088] FIG24 is a first schematic diagram of the wafer transfer mechanism in the second embodiment of the present invention moving the wafer to the fixed docking position.

[0089] FIG25 is a second schematic diagram of the wafer transfer mechanism in the second embodiment of the present invention moving the wafer to the fixed docking position.

[0090] FIG26 is a third schematic diagram of the wafer transfer mechanism in the second embodiment of the present invention moving the wafer to the fixed docking position.

[0091] FIG27 is a schematic diagram of the partial structure of the wafer transfer mechanism with a swing axis in the second embodiment of the present invention.

[0092] FIG28 is a schematic diagram of the three-dimensional structure of the wafer polishing system in the third embodiment of the present invention.

[0093] FIG29 is a schematic diagram of the top view of the structure of the wafer polishing system in the third embodiment of the present invention.

[0094] FIG30 is a schematic diagram of a partial three-dimensional structure of the wafer polishing system in the third embodiment of the present invention, in which a wafer transfer mechanism moves the wafer to a fixed docking position.

[0095] FIG31 is a partial side view of the state shown in FIG30.

[0096] FIG32 is a schematic diagram of the three-dimensional structure of the wafer polishing system in the third embodiment of the present invention. At this time, one clamping device is docked with the turntable, and one clamping device is docked with the wafer transfer mechanism.

[0097] Among them, 1-wafer polishing unit, 11-first transmission track, 12-wafer transmission channel, 2-wafer cleaning unit, 21-cleaning unit robot, 3-clamping device, 4-wafer, 5-wafer transfer mechanism, 51-first guide track, 52-second guide track, 53-rotating shaft, 54-clamping claw assembly, 541-rotating claw, 542-axis body, 543-claw body, 544-fixed claw, 55-swing arm, 551-swinging axis body, 552-power source, 56-flip arm, 57-claw part, 61-docking station, 62-fixed docking position, 7-wafer transfer unit, 71-transfer table, 72-second transmission track. DETAILED DESCRIPTION

[0098] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will provide a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0099] As shown in Figure 1, a wafer polishing system includes a wafer polishing unit 1, a wafer cleaning unit 2 arranged adjacent to the wafer polishing unit 1, a wafer transmission channel 12, and a wafer transfer mechanism 5. At least a portion of the wafer transfer mechanism 5 is located in the wafer cleaning unit 2, and is used to adjust the position and posture of the wafer 4. The position and posture of the wafer 4 include the tilt angle of the wafer 4 and the position of the wafer 4. A docking station 61 is formed on the wafer transmission channel 12. At least a portion of the wafer transfer mechanism 5 can be moved to the docking station 61, thereby realizing the transmission of the wafer 4 between the wafer polishing unit 1 and the wafer cleaning unit 2, that is, the wafer 4 can be transmitted from the wafer polishing unit 1 to the wafer cleaning unit 2 without passing through any other transmission mechanism except the wafer transfer mechanism 5. The transmission structure is simple, the transmission path of the wafer 4 is shortened, and the damage to the wafer 4 during the transmission process is minimized.

[0100] Specifically, there are multiple wafer cleaning units 2, and there is an intersection between the wafer transfer channel 12 and the extension line of the location of the wafer cleaning unit 2 closest to the wafer polishing unit 1. In other words, in Figure 1, the wafer transfer channel 12 is located on line O1, and the extension line of the location of the wafer cleaning unit 2 closest to the wafer polishing unit 1 is O2. Then O1 and O2 have an intersection, and the docking station 61 is located at this intersection. Of course, O1 here is not necessarily the centerline of the wafer transfer channel 12, and O2 is not necessarily the centerline of the wafer cleaning unit 2 closest to the wafer polishing unit 1. It is just to indicate the general direction. In other words, the above-mentioned intersection is not just a point, but an intersection area, and the docking station 61 is located within this intersection area.

[0101] More specifically, the wafer transfer mechanism 5 is used to adjust the position and posture of the wafer 4. For example, the wafer transfer mechanism 5 flips the wafer 4 to a vertical state or a state tending to vertical, and the initial state of the wafer 4 can be horizontal or in any posture; or, the wafer transfer mechanism 5 flips the wafer 4 to a horizontal state or a state tending to horizontal, and the initial state of the wafer 4 can be vertical or in any posture; or, the wafer transfer mechanism 5 moves the wafer 4 horizontally; or, the wafer transfer mechanism 5 moves the wafer 4 vertically; or, the wafer transfer mechanism 5 swings the wafer 4 along an arc; or, two or three or four of the above four actions of flipping, horizontal movement, vertical movement, and swinging along an arc are performed simultaneously, without specific limitation.

[0102] In this embodiment, the wafer transfer mechanism 5 includes at least a rotating shaft 53 and a clamping jaw assembly 54. The rotating shaft 53 drives the clamping jaw assembly 54 to switch between a horizontal or nearly horizontal wafer position and a vertical or nearly vertical wafer position. In other words, the wafer transfer mechanism 5 is used to adjust the wafer 4 from a horizontal or nearly horizontal position to a vertical or nearly vertical position.

[0103] As shown in Figures 3-9, the clamping assembly 54 includes at least one rotating clamping jaw 541. The rotating clamping jaw 541 includes an axis 542 parallel to the wafer 4 and a claw 543 rotatably connected to the axis 542. The side of the claw 543 can abut the side wall of the wafer 4. As shown in Figures 7 and 8, the rotation of the rotating clamping jaw 541 here refers to its ability to rotate within a vertical plane perpendicular to the wafer 4. It can be rotated below the wafer 4. When the wafer 4 is translated in the direction of the arrow, the rotating clamping jaw 541 will not interfere with or hinder the wafer 4, thereby facilitating the transfer of the wafer 4.

[0104] The clamping jaw assembly 54 also includes a fixed jaw 544, whose inner sidewall is arc-shaped and can be aligned with the sidewall of the wafer 4. The central angle of the fixed jaw 544 is larger than the central angle of the claw body 543 of the rotating jaw 541, thereby increasing the contact area between the fixed jaw 544 and the wafer 4. To maintain a secure grip on the wafer 4, the centers of the fixed jaw 544 and the claw body 543 are located at radial ends of the wafer 4.

[0105] As shown in FIG9 , in order to ensure that the wafer 4 is in a vertical state or tending to be vertical, the clamping jaw assembly 54 firmly clamps it, and at this time, the rotating clamping jaw 541 is located on the top of the wafer 4. That is, the fixed clamping jaw 544 supports the wafer 4 upward.

[0106] The wafer polishing system also includes a clamping device 3 for holding a wafer 4 and a fixed docking position 62 located in the wafer cleaning unit 2. The clamping device 3 and wafer transfer mechanism 5 can be moved to a docking station 61, thereby transferring the wafer between the clamping device 3 and the wafer transfer mechanism 5. Figure 2 shows the clamping device 3 and the wafer transfer mechanism 5 transferring the wafer at the docking station 61. After receiving the wafer 4, the wafer transfer mechanism 5 can be moved to the fixed docking position 62 in the wafer cleaning unit 2.

[0107] The docking process may be that the clamping device 3 descends and docks with the wafer transfer mechanism 5, or that the wafer transfer mechanism 5 ascends and docks with the clamping device 3, or that both move toward each other.

[0108] To achieve both lifting and translational movement of the wafer transfer mechanism 5, as shown in Figures 10 and 11, the mechanism further includes a first guide rail 51 and a second guide rail 52. The first guide rail 51 and the second guide rail 52 are arranged at an angle to each other in a vertical plane, specifically, in this embodiment, being perpendicular to each other. The wafer transfer mechanism 5 can move along the second guide rail 52, and the second guide rail 52 can move along the first guide rail 51, thereby indirectly enabling the wafer transfer mechanism 5 to move along the first guide rail 51.

[0109] The clamping device 3 is any structure in the prior art, which has the functions of lifting, translating and grabbing the wafer, and will not be described in detail.

[0110] As shown in FIG12 , a fixed docking position 62 is located within the wafer cleaning unit 2, and specifically can be a wafer buffer box of the wafer cleaning unit 2. At the fixed docking position 62, the cleaning unit robot 21 can clamp the wafer 4 on the wafer transfer mechanism 5, where the wafer 4 is in a vertical position or is nearly vertical, for the next process step, such as wafer cleaning.

[0111] The wafer transfer mechanism 5 can also be a swinging structure, as shown in Figures 13, 14-17. The wafer transfer mechanism 5 includes a swing arm 55, a flip arm 56 connected to the swing arm 55, and a claw 57 for clamping the wafer 4. The flip arm 56 can rotate around its own axis, thereby driving the claw 57 to switch between the horizontal state or the horizontal state and the vertical state or the vertical state of the wafer 4, as shown in Figure 15, and the swing arm 55 can drive the flip arm 56 and the claw 57 to swing together.

[0112] Specifically, the swing arm 55 includes a swing axis 551 extending parallel to the wafer transfer channel 12. Driven by an external power source 552, the swing arm 55 drives the flip arm 56 and claw 57 to swing about the swing axis 551. As shown in FIG17 , the wafer 4 swings along an arc; as shown in FIG16 , the wafer 4 can also be flipped while swinging along the arc.

[0113] At the same time, the swing arm 55 and the flip arm 56 are concentrically and coaxially arranged, and the swing arm 55 and the flip arm 56 can be telescopically connected, that is, the total length of the swing arm 55 and the flip arm 56 is adjustable.

[0114] A wafer processing method of a wafer polishing system is implemented using the above-mentioned wafer polishing system structure, and includes the following steps:

[0115] The wafer to be polished is transferred to the wafer polishing unit 1;

[0116] After the wafer is polished, it is transferred to the docking station 61 and docked with the wafer transfer mechanism 5 at the docking station 61 to achieve wafer transfer between the wafer polishing unit 1 and the wafer transfer mechanism 5;

[0117] After receiving the wafer 4 , the wafer transfer mechanism 5 flips the wafer 4 to a vertical state or a state close to vertical state and moves the wafer to the wafer cleaning unit 2 .

[0118] More specifically, a wafer processing method of a wafer polishing system is implemented using the above-mentioned wafer polishing system structure, which includes the following steps:

[0119] The clamping device 3 clamps the wafer 4 to be polished and transfers the wafer 4 to the wafer polishing unit 1; specifically, the clamping device 3 clamps the wafer 4 to be polished and transfers the wafer 4 to the wafer polishing unit 1 in a horizontal state;

[0120] After the wafer 4 is polished, the clamping device 3 clamps the wafer 4 to the docking station 61 and docks with the wafer transfer mechanism 5 at the docking station 61 to realize the wafer transfer between the clamping device 3 and the wafer transfer mechanism 5; specifically, the clamping device 3 clamps the wafer 4 to the docking station 61 in a horizontal state. At the docking station 61, the contact point of the clamping jaw assembly 54 (including the rotating clamping jaw 541 and the fixed clamping jaw 544) of the wafer transfer mechanism 5 and the wafer 4 is offset from the contact point of the clamping device 3 grasping the wafer 4, that is, the two will not interfere with each other; of course, during the above-mentioned transfer process, the clamping device 3 may release the wafer 4 before the clamping jaw assembly 54 clamps the wafer 4, or the clamping device 3 may release the wafer 4 after the clamping jaw assembly 54 clamps the wafer 4, or both operations may be performed simultaneously, without specific limitation;

[0121] After the wafer transfer mechanism 5 obtains the wafer 4, it flips it to a vertical state or a state tending to be vertical, as shown in Figure 4, and moves it to a fixed docking position; specifically, after the wafer transfer mechanism 5 obtains the wafer 4, the clamping device 3 is reset (transferred to the outside of the docking station 61), and the wafer transfer mechanism 5 flips the wafer 4 to a vertical state or a state tending to be vertical, and the rotating clamping jaw 541 is located at the top of the wafer 4, and the fixed clamping jaw 544 is located at the bottom of the wafer 4, and then moves to the fixed docking position; or, after the wafer transfer mechanism 5 obtains the wafer 4, it is first transferred to the outside of the docking station 61, or it can be directly transferred to the fixed docking position, and then the wafer 4 is flipped to a vertical state or a state tending to be vertical, and the clamping device 3 may not be reset first at this time; or, the flipping action and the moving action after the wafer transfer mechanism 5 obtains the wafer 4 can be performed simultaneously;

[0122] At least a portion of the wafer cleaning unit 2 can be moved to a fixed docking position 62 to transfer a wafer 4 in a vertical or nearly vertical state. In this embodiment, the cleaning unit robot 21 can be used to perform this transfer. The cleaning unit robot 21 is conventional and will not be described in detail. The next step of the process performed by the wafer cleaning unit 2 can also be conventional and will not be described in detail.

[0123] The above process replaces the three devices of the turntable, wet robot and base in the prior art by setting up a docking station 61 and the transmission of the wafer transfer mechanism 5 between the docking station 61 and the wafer cleaning unit 2. It can interact with the cleaning area robot of the wafer cleaning unit 2 so that the cleaning area robot can obtain the wafer 4. The transfer of the wafer 4 can be achieved by docking the wafer transfer mechanism 5 at the docking station 61. The structure is simplified, and the efficiency of the wafer polishing system in transferring the polished wafer out of the polishing system is improved, the risk of introducing impurities is reduced, and the possibility of impurities precipitating from the wafer due to the time and space of transmission is smaller.

[0124] Example 2

[0125] In the first embodiment, the process of the clamping device 3 clamping the polished wafer 4 is not described in detail.

[0126] As shown in FIG18 , in this embodiment, a wafer transfer unit 7 is further included. The wafer transfer unit 7 includes at least a transfer table 71 that can be moved to the docking station 61 , and its function is to realize wafer transfer between the clamping device 3 and the transfer table 71 .

[0127] In other words, the wafer 4 to be polished is placed on the turntable 71 , waiting for the clamping device 3 to obtain the wafer 4 from the turntable 71 and then transfer the wafer 4 to the wafer polishing unit 1 .

[0128] In order to realize the movement of the transfer table 71, the wafer transfer unit 7 further includes a second transfer track 72, and the transfer table 71 can reciprocate along the second transfer track 72. At the same time, the second transfer track 72 can also realize the up and down movement of the transfer table 71.

[0129] In the first embodiment, the movement path of the clamping device 3 is not specifically described, and any structure in the prior art can be adopted. In this embodiment, as shown in Figure 19, a first transmission track 11 is also included, along which the clamping device 3 can reciprocate and also achieve the function of lifting up and down.

[0130] The second transfer track 72 is perpendicular to the first guide track 51 , and the first transfer track 11 is perpendicular to the first guide track 51 .

[0131] The first transfer track 11 and the second transfer track 72 extend in the same direction, and at least a portion of the first transfer track 11 overlaps with the projection of the second transfer track 72, allowing the transfer table 71 to dock with the clamping device 3. This projection overlap can be vertical or horizontal, as shown in FIG20 , where region L represents the overlapping region. Of course, the projections of the first transfer track 11 and the second transfer track 72 do not necessarily need to overlap; the clamping device 3 and the transfer table 71 can also be moved until their projections overlap, allowing the transfer table 71 and the clamping device 3 to dock.

[0132] In other words, the clamping device 3, the wafer transfer mechanism 5, and the transfer table 71 can be located at the docking station 61 at the same time, as shown in Figures 21 to 23. Of course, when the clamping device 3 and the transfer table 71 are docking and transferring the wafer 4 at the docking station 61, the wafer transfer mechanism 5 can also be located away from the docking station 61, as shown in Figure 20.

[0133] To achieve wafer docking between the clamping device 3 and the wafer transfer mechanism 5 at the docking station 61 in Example 1, as well as wafer docking between the clamping device 3 and the transfer table 71 in this embodiment, the projections of the first transfer track 11, the second transfer track 72, and the first guide track 51 at least partially overlap, as shown in Figures 22 and 23. This projection overlap does not strictly mean complete vertical overlap; it is sufficient as long as the clamping device 3, the wafer transfer mechanism 5, and the transfer table 71 can be moved to the docking station 61 to transfer the wafer 4 up and down for docking. Thus, the projections of the first transfer track 11, the second transfer track 72, and the wafer transfer mechanism 5 can also at least partially overlap, in which case the projections of the first guide track 51 and the first transfer track 11 and the second transfer track 72 do not need to overlap. Of course, the wafer transfer mechanism 5, the clamping device 3, and the wafer transfer unit 7 can also be moved so that the projections of two or all three of them at least partially overlap, as long as the docking and transfer of the wafer 4 can be achieved.

[0134] From the above description, it can be concluded that the docking station 61 is a three-dimensional concept. Its projection in the vertical direction is fixed, but it can extend upward or downward in the vertical direction and is not limited to a specific point. In other words, the docking station 61 is three-dimensional in the Z-axis direction and its position in the X-axis and Y-axis directions is relatively fixed.

[0135] A wafer transfer channel 12 is provided inside the wafer polishing unit 1 , or in other words, on the side of the wafer polishing unit 1 , and is a transfer channel for transferring the wafer 4 . The docking station 61 is provided in the wafer transfer channel 12 , as shown in FIG. 23 .

[0136] At least a portion of the second transfer track 72 is disposed above the wafer transfer channel 12 (this does not exclude the possibility that a portion of the second transfer track 72 is located within the wafer transfer channel 12). The first transfer track 11 may also be disposed above the wafer transfer channel 12. The second transfer track 72 and the first transfer track 11 extend in the same direction as the wafer transfer channel 12. The wafer transfer channel 12 and the first guide track 51 extend at an angle in the horizontal plane, specifically a 90° angle in this embodiment.

[0137] Of course, as shown in Figures 26 and 27, when the wafer transfer mechanism 5 is a swing-type structure, its swing shaft 551 can be connected to a location such as the side wall of the box of the wafer cleaning unit 2 (specifically, this is not limited, it is only an example), and the swing arm 55 swings around the swing shaft 551, and the wafer 4 can swing directly from position A to position C, that is, the wafer 4 swings along the arc to the fixed docking position 62. Of course, as shown in Figure 27, the wafer 4 can swing directly from position D to position F, or it can swing from position D to position E and then from position E to position F. There is no restriction on the movement trajectory of the wafer 4.

[0138] Of course, the swing structure of the wafer transfer mechanism 5 can also be combined with the structures in Figures 10 and 11, that is, the combination of swing and vertical translation and horizontal translation, or the combination of swing and horizontal translation.

[0139] A wafer processing method of a wafer polishing system is implemented using the above-mentioned wafer polishing system structure, and includes the following steps:

[0140] The transfer table 71 of the wafer transfer unit 7 moves along the second transfer track 72 to the docking station 61, and the clamping device 3 moves along the first transfer track 11 to the docking station 61;

[0141] After the clamping device 3 obtains the wafer 4 to be polished from the transfer table 71 of the wafer transfer unit 7, it transfers the wafer 4 to the wafer stage of the wafer polishing unit 1 in a horizontal state (the wafer stage is a prior art and will not be described in detail);

[0142] The wafer 4 on the wafer stage is transferred from the polishing head (the polishing head is of existing technology and will not be described in detail) to the polishing area (the polishing area is of existing technology and will not be described in detail);

[0143] After the wafer 4 is polished, the polishing head transfers the polished wafer 4 to the wafer stage;

[0144] The clamping device 3 clamps the wafer 4 from the wafer stage and transfers it out of the wafer polishing unit 1. Specifically, after polishing the wafer 4, the clamping device 3 clamps the wafer 4 to the docking station 61 and docks with the wafer transfer mechanism 5 at the docking station 61, thereby realizing wafer transfer between the clamping device 3 and the wafer transfer mechanism 5. Specifically, the clamping device 3 clamps the wafer 4 to the docking station 61 in a horizontal state, and the contact point between the clamping jaw assembly 54 (including the rotating clamping jaw 541 and the fixed clamping jaw 544) of the wafer transfer mechanism 5 at the docking station 61 and the wafer 4 is offset from the contact point of the clamping device 3 grasping the wafer 4, that is, the two will not interfere with each other.

[0145] At this time, the transfer table 71 of the wafer transfer unit 7 is reset to avoid the wafer, and the wafer transfer mechanism 5 moves to the fixed docking position 62 through the cooperation of the first guide rail 51 and / or the second guide rail 52;

[0146] The cooperation of the above-mentioned first guide rail 51 and / or second guide rail 52 to move to the fixed docking position 62 can be that, through the cooperation of the first guide rail 51 and the second guide rail 52, under the superposition of the two motion trajectories of horizontal movement and vertical lifting, the wafer 4 moves to the fixed docking position 62, as shown in Figure 24, the wafer 4 descends from A to B, and then moves horizontally from B to C, or the wafer 4 is first translated and then lifted, and the order is not limited; or, the wafer 4 swings along an arc to the fixed docking position 62, as shown in Figure 26, the wafer transfer mechanism 5 has a swing arm 55, and the wafer 4 can swing directly from A to C, or, as shown in Figure 27, the wafer 4 can swing from D to E, and then swing to F; or, it moves horizontally to the fixed docking position 62 through the first guide rail 51, and does not need to move in the vertical direction, as shown in Figure 25.

[0147] After the wafer transfer mechanism 5 obtains the wafer 4, it flips it to a vertical state or a state tending to be vertical, as shown in Figure 4, and moves it to a fixed docking position 62, which is set in the wafer cleaning unit 2; of course, the order of the above swinging and flipping can be reversed. Specifically, after the wafer transfer mechanism 5 obtains the wafer 4, the clamping device 3 is reset (transferred to the outside of the docking station 61), and the wafer transfer mechanism 5 flips the wafer 4 to a vertical state or a state tending to be vertical, and the rotating clamp 541 is located at the top of the wafer 4, and the fixed clamp 544 is located at the bottom of the wafer 4, and then moves to the fixed docking position; or, after the wafer transfer mechanism 5 obtains the wafer 4, it is first transferred to the outside of the docking station 61, or it can be directly transferred to the fixed docking position, and then the wafer 4 is flipped to a vertical state or a state tending to be vertical. At this time, the clamping device 3 does not need to be reset first; or, the flipping action and the moving action after the wafer transfer mechanism 5 obtains the wafer 4 can be performed simultaneously;

[0148] At least a portion of the wafer cleaning unit 2 can be moved to a fixed docking position 62 to transfer a wafer 4 in a vertical or nearly vertical state. In this embodiment, the cleaning unit robot 21 can be used to perform this transfer. The cleaning unit robot 21 is conventional and will not be described in detail. The next step of the process performed by the wafer cleaning unit 2 can also be conventional and will not be described in detail.

[0149] Example 3

[0150] In the above-described first and second embodiments, the wafer polishing unit 1 and wafer cleaning unit 2 are arranged on one side as an example. Of course, as shown in Figures 28-31 , the wafer polishing unit 1 and wafer cleaning unit 2 can also be arranged on both sides, that is, the wafer polishing unit 1 and wafer cleaning unit 2 are arranged on both sides of the wafer transfer channel 12. There are also two wafer transfer mechanisms 5, and they share a docking station 61. The two wafer transfer mechanisms 5 can be in different operating states. As shown in Figure 31 , the left wafer transfer mechanism 5 is flipping the wafer 4 to a vertical position at the docking station 61, while the right wafer transfer mechanism 5 has already moved the wafer 4 to the fixed docking position 62.

[0151] At this time, the number of the clamping devices 3 is two or more, and the following description will be given by taking an example in which the clamping device 3 includes a first clamping device 301 and a second clamping device 302 .

[0152] A wafer processing method of a wafer polishing system is implemented using the above-mentioned wafer polishing system structure, and includes the following steps:

[0153] The transfer table 71 of the wafer transfer unit 7 moves along the second transfer track 72 to the docking station 61 , and the first clamping device 301 moves along the first transfer track 11 to the docking station 61 ;

[0154] After the first clamping device 301 obtains the wafer 4 to be polished from the transfer table 71 of the wafer transfer unit 7, it transfers the wafer 4 to the wafer carrier of the wafer polishing unit 1 in a horizontal state; the subsequent steps are the same as those in the second embodiment and will not be repeated here;

[0155] At the same time, the second clamping device 302 clamps the polished wafer 4 from the wafer stage, moves it along another first transmission track 11 to the docking station 61, and docks with the wafer transfer mechanism 5 at the docking station 61 to realize the wafer transfer between the clamping device 3 and the wafer transfer mechanism 5; the remaining action steps of the second clamping device 302 are the same as those in Example 2 and will not be repeated here.

[0156] Of course, the first clamping device 301 and the second clamping device 302 can also independently perform the entire wafer processing step and not appear at the docking station 61 at the same time. Alternatively, the clamping device 3 can dock with two wafer transfer mechanisms 5 at the same time, without specific limitation.

[0157] The above specific embodiments are used to illustrate the present invention rather than to limit the present invention. Any modifications and changes made to the present invention within the spirit of the present invention and the protection scope of the claims shall fall within the protection scope of the present invention.

Claims

1. A wafer polishing system, comprising: Wafer polishing unit (1); A wafer cleaning unit (2) is arranged adjacent to the wafer polishing unit (1); Wafer transfer channel (12); The invention is characterized in that: it also comprises a wafer transfer mechanism (5), at least part of which is located in the wafer cleaning unit (2); A docking station (61) is formed on the wafer transfer channel (12), and at least a portion of the wafer transfer mechanism (5) can be moved to the docking station (61) to achieve the transfer of the wafer (4) between the wafer polishing unit (1) and the wafer cleaning unit (2).

2. The wafer polishing system according to claim 1, characterized in that: The wafer transfer mechanism (5) is also used to adjust the position and posture of the wafer (4).

3. The wafer polishing system according to claim 1, characterized in that: There is an intersection area between the wafer transfer channel (12) and an extension line of the location of the wafer cleaning unit (2) closest to the wafer polishing unit (1), and the docking station (61) is located in the intersection area.

4. The wafer polishing system according to claim 2, characterized in that: The wafer transfer mechanism (5) adjusts the position and posture of the wafer (4) to: Turning the wafer (4) to a vertical state or a state close to a vertical state; and / or, the wafer (4) is flipped to a horizontal state or a state approaching a horizontal state; and / or, moving the wafer (4) horizontally; and / or, moving vertically with the wafer (4); And / or, swinging the wafer (4) along an arc.

5. The wafer polishing system according to claim 1, characterized in that: The wafer transmission channel (12) is located inside the wafer polishing unit (1) or on the side of the wafer polishing unit (1), and the docking station (61) is arranged in the wafer transmission channel (12).

6. The wafer polishing system according to claim 1, characterized in that: Also includes, A clamping device (3) for clamping a wafer (4); A fixed-point docking position (62) located at the wafer cleaning unit (2); The clamping device (3) and the wafer transfer mechanism (5) can be moved to a docking station (61) to achieve wafer transfer between the clamping device (3) and the wafer transfer mechanism (5); After acquiring the wafer (4), the wafer transfer mechanism (5) can move to a fixed-point docking position (62).

7. The wafer polishing system according to claim 6, characterized in that: Also includes, The wafer transfer unit (7) comprises at least a transfer table (71), and the transfer table (71) can be moved to a docking station (61) to achieve wafer transfer between the clamping device (3) and the transfer table (71).

8. The wafer polishing system according to claim 7, characterized in that: The wafer transfer unit (7) further comprises a first transfer track (11), along which the clamping device (3) can reciprocate; the wafer transfer unit (7) further comprises a second transfer track (72), along which the transfer platform (71) can reciprocate; and the transfer platform (71) can be docked with the clamping device (3).

9. The wafer polishing system according to claim 8, characterized in that: It also comprises a first guide rail (51), along which the wafer transfer mechanism (5) can move; the wafer transfer mechanism (5), the clamping device (3), and the wafer transfer unit (7) can move until the projections of two or three of them at least partially overlap.

10. The wafer polishing system according to claim 9, characterized in that: The projections of the first transfer track (11), the second transfer track (72) and the first guide track (51) at least partially overlap; or the projections of the first transfer track (11), the second transfer track (72) and the wafer transfer mechanism (5) at least partially overlap.

11. The wafer polishing system according to claim 9, characterized in that: At least part of the second transfer track (72) is arranged above the wafer transfer channel (12), has the same extension direction as the wafer transfer channel (12) and the first transfer track (11), and is arranged at an angle with the extension direction of the first guide track (51) on a horizontal plane.

12. The wafer polishing system according to claim 10, characterized in that: The second transmission track (72) and the first guide track (51) are perpendicular to each other.

13. The wafer polishing system according to claim 1 or 5, characterized in that: The wafer transfer mechanism (5) comprises a swing arm (55), a flip arm (56) connected to the swing arm (55), and a claw (57) for clamping the wafer (4); the flip arm (56) can rotate around its own axis to drive the claw (57) to switch between a horizontal state or a state tending to be horizontal and a vertical state or a state tending to be vertical of the wafer (4); the swing arm (55) is used to drive the flip arm (56) and the claw (57) to swing.

14. The wafer polishing system according to claim 13, characterized in that: The swing arm (55) has a swing shaft (551) extending in a direction parallel to the wafer transmission channel (12), and the swing arm (55) drives the flip arm (56) and the claw (57) to swing around the swing shaft (551).

15. The wafer polishing system according to claim 13, characterized in that: The swing arm (55) and the flip arm (56) are coaxially arranged and telescopically connected.

16. The wafer polishing system according to claim 1 or 5, characterized in that: The wafer transfer mechanism (5) comprises at least a rotating shaft (53) and a clamping jaw assembly (54); the rotating shaft (53) drives the clamping jaw assembly (54) to switch between a horizontal state or a state tending to be horizontal and a vertical state or a state tending to be vertical for the wafer (4).

17. The wafer polishing system according to claim 16, characterized in that: The contact point between the clamping jaw assembly (54) and the wafer (4) and the contact point of the clamping device (3) gripping the wafer (4) are offset from each other.

18. The wafer polishing system according to claim 16, characterized in that: The clamping jaw assembly (54) comprises at least one rotating clamping jaw (541), which comprises an axis (542) parallel to the wafer (4), and a claw body (543) rotatably connected to the axis (542), and the side surface of the claw body (543) can abut against the side wall of the wafer (4).

19. The wafer polishing system according to claim 18, characterized in that: The clamping jaw assembly (54) further comprises a fixed clamping jaw (544), the inner side wall of which is in an arc shape and can fit with the side wall of the wafer (4).

20. The wafer polishing system according to claim 18, characterized in that: When the wafer (4) is flipped to a vertical state or tending to a vertical state, the rotating clamp (541) is located on the top of the wafer (4).

21. The wafer polishing system according to claim 8, characterized in that: It also comprises a second guide rail (52) which is arranged at an angle with the first guide rail (51) on a vertical plane; the wafer transfer mechanism (5) can move along the second guide rail (52) and the second guide rail (52) can move along the first guide rail (51).

22. The wafer polishing system according to claim 7, characterized in that: The clamping device (3), the wafer transfer mechanism (5) and the transfer table (71) can be located at the docking station (61) at the same time.

23. The wafer polishing system according to claim 6, characterized in that: The number of the clamping devices (3) is two or more, and at least one of the clamping devices (3) is simultaneously docked with the transfer table (71) and the wafer transfer mechanism (5), or at least one of the clamping devices (3) is simultaneously docked with two wafer transfer mechanisms (5).

24. The wafer polishing system according to claim 1, characterized in that: The wafer transfer mechanism (5) is used to adjust the wafer (4) from a horizontal or nearly horizontal state to a vertical or nearly vertical state.

25. A wafer processing method of a wafer polishing system, characterized in that: The following steps are involved: The wafer to be polished is transferred to the wafer polishing unit; After the wafer is polished, it is transferred to the docking station and docked with the wafer transfer mechanism at the docking station to realize the wafer transfer between the wafer polishing unit and the wafer transfer mechanism; After the wafer is acquired, the wafer transfer mechanism flips the wafer to a vertical state or a state tending to be vertical and moves the wafer to the wafer cleaning unit.

26. The wafer processing method of the wafer polishing system according to claim 25, characterized in that: The following steps are involved: The clamping device clamps the wafer to be polished and transfers the wafer to the wafer polishing unit; After the wafer is polished, the clamping device clamps the wafer to the docking station and docks with the wafer transfer mechanism at the docking station to achieve wafer transfer between the clamping device and the wafer transfer mechanism; After the wafer is acquired, the wafer transfer mechanism flips the wafer to a vertical state or a state tending to be vertical and moves the wafer to a fixed-point docking position in the wafer cleaning unit.

27. The wafer processing method of the wafer polishing system according to claim 26, characterized in that: In the step in which the wafer transfer mechanism acquires the wafer, flips it to a vertical state or a vertically inclined state and moves it to a fixed docking position in the wafer cleaning unit, the wafer transfer mechanism first flips the wafer after acquiring the wafer, and then moves it to the fixed docking position, or the wafer transfer mechanism first moves to the fixed docking position and then flips it, or the wafer transfer mechanism moves to the fixed docking position and flips simultaneously.

28. The wafer processing method of the wafer polishing system according to claim 26, characterized in that: In the step of transferring the wafer to the wafer polishing unit after the clamping device clamps the wafer to be polished, the transfer table of the wafer transfer unit moves to the docking station, and the clamping device clamps the wafer from the transfer table.

29. The wafer processing method of the wafer polishing system according to claim 26, characterized in that: In the step of the clamping device clamping the wafer to be polished and transferring the wafer to the wafer polishing unit, The clamping device transfers the wafer to be polished from the transfer table to the wafer carrier; The wafer on the wafer stage is transferred to the polishing area by the polishing head; After the wafer is polished, the polishing head transfers the polished wafer to the wafer stage; The clamping device clamps the wafer from the wafer carrier and takes it out of the wafer polishing unit.

30. The wafer processing method of the wafer polishing system according to claim 26, characterized in that: After the wafer is polished, the clamping device clamps the wafer to the docking station and docks with the wafer transfer mechanism at the docking station. In the step of transferring the wafer between the clamping device and the wafer transfer mechanism, the transfer table of the wafer transfer unit is reset to achieve avoidance, and the wafer transfer mechanism moves to the fixed docking position through the cooperation of the first guide rail and / or the second guide rail.

31. The wafer processing method of the wafer polishing system according to claim 26, characterized in that: In the step of moving the wafer to the fixed docking position, through the cooperation of the first guide rail and the second guide rail, the wafer moves to the fixed docking position under the superposition of the two motion trajectories of horizontal movement and vertical lifting and lowering, or the wafer swings along an arc to the fixed docking position, or moves horizontally to the fixed docking position through the first guide rail.

32. The wafer processing method of the wafer polishing system according to claim 26, characterized in that: The fixed-point docking position is arranged on the wafer cleaning unit.

33. The wafer processing method of the wafer polishing system according to claim 26, characterized in that: The method also includes the following steps: at least part of the wafer cleaning unit can be moved to a fixed-point docking position to transfer a wafer in a vertical state or tending to be in a vertical state.

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