Dimming device and preparation method, and dimming structure

Abstract

A preparation method for a dimming device (100). The preparation method comprises: forming a first laminated structure (10); forming a plastic frame (20) on one side of the first laminated structure (10); attaching a second laminated structure (40) to the side of the plastic frame (20) away from a first substrate (11); laminating the first laminated structure (10), the plastic frame (20) and the second laminated structure (40); injecting a liquid adhesive into a first gap (2) through at least one first opening (21); and curing the liquid adhesive to form a second adhesive layer (50).

Description

Dimming device and preparation method, dimming structure

[0001] This application claims priority to Chinese patent application No. 202310790689.1, filed on June 29, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of dimming technology, and in particular to a dimming device and a preparation method thereof, and a dimming structure. Background Art

[0003] Laminated glass is a composite glass product consisting of two or more sheets of glass and one or more layers of an organic polymer interlayer between them. The glass and interlayer undergo a special high-temperature pre-pressing (or vacuuming) and high-temperature, high-pressure process, permanently bonding them together. Laminated glass can withstand impacts of a certain energy or temperature fluctuations without shattering. Even if it does break, the fragments adhere to the interlayer, minimizing injury and providing a certain level of safety. Therefore, laminated glass is widely used in architecture, transportation, and other fields.

[0004] Summary of the Invention

[0005] In one aspect, a method for preparing a dimming device is provided. The method includes forming a first laminated structure; the first laminated structure includes a first substrate, a first adhesive layer, and a first functional layer arranged in a stacked manner. A glue frame is formed on one side of the first laminated structure; the glue frame is located on a side of the first substrate close to the first functional layer and surrounds the first functional layer; the glue frame has at least one first opening. A second laminated structure is attached to a side of the glue frame away from the first substrate; a first gap is defined between the second laminated structure and the first laminated structure; wherein the first opening is connected to the first gap. The first laminated structure, the glue frame, and the second laminated structure are assembled so that the first adhesive layer bonds the first substrate and the first functional layer, and the glue frame bonds the first laminated structure and the second laminated structure. Liquid glue is injected into the first gap through the at least one first opening. The liquid glue is cured to form a second adhesive layer; the second adhesive layer bonds the first laminated structure and the second laminated structure.

[0006] In some embodiments, the orthographic projection of the first adhesive layer on the reference surface is within the range of the orthographic projection of the first substrate on the reference surface and is spaced from the boundary of the first substrate. The orthographic projection of the first adhesive layer on the reference surface coincides with the orthographic projection of the first functional layer on the reference surface. In a direction perpendicular to the first substrate, the thickness of the adhesive frame is greater than the sum of the thickness of the first adhesive layer and the thickness of the first functional layer. The reference surface is parallel to the surface of the first substrate proximal to the first functional layer. Between forming the first laminated structure and forming the adhesive frame on one side of the first laminated structure, the preparation method further includes: applying a force to the first laminated structure to expel air between the first adhesive layer and the first substrate. The first laminated structure is then assembled so that the first adhesive layer bonds the first substrate to the first functional layer.

[0007] In some embodiments, the orthographic projection of the first adhesive layer on the reference surface coincides with the orthographic projection of the first substrate on the reference surface, the orthographic projection of the first functional layer on the reference surface is located within the range of the orthographic projection of the first adhesive layer on the reference surface, and is spaced apart from the boundary of the first adhesive layer; along a direction perpendicular to the first substrate, the thickness of the adhesive frame is greater than the thickness of the first functional layer; wherein the reference surface is parallel to the surface of the first substrate close to the first functional layer.

[0008] In some embodiments, the first stacked structure further includes a second functional layer and a third adhesive layer, the second functional layer is located on a side of the first functional layer away from the first substrate, and the third adhesive layer is located between the first functional layer and the second functional layer.

[0009] In some embodiments, the second laminated structure includes a second substrate, a fourth adhesive layer, and a third functional layer, the orthographic projection of the fourth adhesive layer on a reference surface being within the range of the orthographic projection of the second substrate on the reference surface and spaced from the boundary of the second substrate. The orthographic projection of the fourth adhesive layer on the reference surface coincides with the orthographic projection of the third functional layer on the reference surface. The reference surface is parallel to the surface of the first substrate proximal to the first functional layer. Between forming a plastic frame on one side of the first laminated structure and attaching the second laminated structure to the side of the plastic frame distal to the first substrate, the preparation method further includes: applying pressure to the second laminated structure to expel air between the fourth adhesive layer and the second substrate. The second laminated structure is then assembled so that the fourth adhesive layer bonds the second substrate to the third functional layer.

[0010] On the other hand, a dimming device is provided. The display device includes a first stacked structure, a second stacked structure, a second adhesive layer, a frame, and a sealing block. The first stacked structure includes a first substrate, a first adhesive layer, and a first functional layer arranged in a stacked manner. The second stacked structure is located on a side of the first substrate close to the first adhesive layer, and the second stack includes a second substrate. The second adhesive layer is located between the first and second stacked structures and is configured to bond the first and second stacked structures. The frame is located between the first and second substrates and surrounds the first functional layer and the second adhesive layer. The frame has at least one first opening, the projection of the first opening along a first direction at least partially overlapping with the projection of the second adhesive layer along the first direction; wherein the first direction is perpendicular to the side of the frame in which the first opening is located. The sealing block is located within the first opening and seals the first opening.

[0011] In some embodiments, the thickness of the first adhesive layer is M×d1, and the thickness of the adhesive frame is N×d2; wherein M and N are both positive integers less than 6, and N is greater than M; d1 and d2 are 0.3 mm to 0.5 mm, and d1 is less than or equal to d2.

[0012] In some embodiments, the thickness of the first functional layer is d3, which is less than or equal to 1.1 mm; and the thickness of the second adhesive layer is N×d2-M×d1-d3.

[0013] In some embodiments, the material of the adhesive frame is the same as that of the first adhesive layer and different from that of the sealing block. The material of the first adhesive layer is different from that of the second adhesive layer.

[0014] In some embodiments, the orthographic projection of the first adhesive layer on the reference surface is located within the range of the orthographic projection of the first substrate on the reference surface, and is spaced apart from the boundary of the first substrate. The orthographic projection of the first adhesive layer on the reference surface coincides with the orthographic projection of the first functional layer on the reference surface, and the adhesive frame abuts against the first substrate; wherein, the reference surface is parallel to the surface of the first substrate close to the first functional layer.

[0015] In some embodiments, the orthographic projection of the first adhesive layer on the reference surface coincides with the orthographic projection of the first substrate on the reference surface, the orthographic projection of the first functional layer on the reference surface is located within the range of the orthographic projection of the first adhesive layer on the reference surface, and is spaced apart from the boundary of the first adhesive layer, and the adhesive frame abuts against the first adhesive layer; wherein the reference surface is parallel to the surface of the first substrate close to the first functional layer.

[0016] In some embodiments, the first functional layer is a dimming functional layer configured to adjust light transmittance, and the material of the first adhesive layer is PVB or SGP. Alternatively, the first functional layer is a display functional layer configured to display images, and the material of the first adhesive layer is OCA, OCR, or EVA.

[0017] In some embodiments, the first laminate structure further includes a second functional layer and a third adhesive layer. The second functional layer is located on a side of the first functional layer away from the first substrate. The third adhesive layer is located between the first functional layer and the second functional layer and is configured to bond the first functional layer and the second functional layer.

[0018] In some embodiments, the second stacked structure further includes a fourth adhesive layer located on a side of the second substrate close to the second adhesive layer.

[0019] In some embodiments, the orthographic projection of the fourth adhesive layer on the reference surface coincides with the orthographic projection of the second substrate on the reference surface, and the adhesive frame abuts against the fourth adhesive layer; wherein the reference surface is parallel to the surface of the first substrate close to the first functional layer.

[0020] In some embodiments, the orthographic projection of the fourth adhesive layer on the reference surface is located within the range of the orthographic projection of the second substrate on the reference surface, and is spaced apart from the boundary of the second substrate. The orthographic projection of the fourth adhesive layer on the reference surface coincides with the orthographic projection of the second adhesive layer on the reference surface, and the adhesive frame abuts against the second substrate; wherein the reference surface is parallel to the surface of the first substrate close to the first functional layer.

[0021] In some embodiments, the second stacked structure further includes a third functional layer, the third functional layer is located on a side of the fourth adhesive layer away from the second substrate, and the adhesive frame further surrounds the third functional layer.

[0022] In some embodiments, the dimming device further includes a first light-shielding layer and a second light-shielding layer. The first light-shielding layer is located on a side of the first substrate away from the second substrate and is disposed along an edge of the first substrate. The outer boundary of the orthographic projection of the first light-shielding layer on the first substrate coincides with the boundary of the first substrate, and the inner boundary is located within the inner boundary of the orthographic projection of the plastic frame on the first substrate. The second light-shielding layer is located on a side of the second substrate closer to the first substrate and is disposed along an edge of the second substrate. The second light-shielding layer is at least partially located between the second substrate and the plastic frame.

[0023] In some embodiments, the first functional layer includes a flexible circuit board, and the flexible circuit board and the first opening are located on the same side of the plastic frame.

[0024] In some embodiments, there are multiple first functional layers, and the multiple first functional layers are all bonded to the first adhesive layer, and there is a gap between two adjacent first functional layers.

[0025] In some embodiments, the dimming device further includes a limiting bar, wherein the limiting bar is located in a gap between two adjacent first functional layers, and a gap exists between the limiting bar and the second stacked structure.

[0026] In some embodiments, the dimming device further includes a limiting strip, the limiting strip being located in the gap between two adjacent first functional layers and in contact with the second stacked structure. The limiting strip has a plurality of third openings, with at least one third opening being included between two adjacent first functional layers.

[0027] In some embodiments, along the second direction, the size of the first opening is less than or equal to half the size of the first substrate; wherein the second direction is parallel to the side surface of the plastic frame where the first opening is located.

[0028] On the other hand, a dimming structure is provided, which includes the dimming device as described in any of the above embodiments, and the dimming structure includes one of a curtain wall, a skylight, a rail transportation vehicle and a passenger car. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0030] 1 to 6 are diagrams showing the steps of a method for preparing a dimming device according to some embodiments;

[0031] FIG7 is a structural diagram of a dimming device according to some embodiments;

[0032] FIG8 is a structural diagram of a first functional layer according to some embodiments;

[0033] FIG9 is another structural diagram of the first functional layer according to some embodiments;

[0034] FIG10 is a structural diagram of a plastic frame including multiple sub-layers according to some embodiments;

[0035] FIG11 is a structural diagram illustrating relative positions of a first opening and a flexible circuit board according to some embodiments;

[0036] FIG12 is another structural diagram illustrating relative positions of a first opening and a flexible circuit board according to some embodiments;

[0037] FIG13 is another structural diagram illustrating relative positions of a first opening and a flexible circuit board according to some embodiments;

[0038] FIG14 is a structural diagram illustrating relative positions of a first opening, an exhaust port, and a flexible circuit board according to some embodiments;

[0039] FIG15 is another structural diagram illustrating relative positions of a first opening, an exhaust port, and a flexible circuit board according to some embodiments;

[0040] FIG16 is a block diagram illustrating the position of a baffle according to some embodiments;

[0041] FIG17 is a diagram illustrating steps for sealing a first opening according to some embodiments;

[0042] FIG18 is another structural diagram of a dimming device according to some embodiments;

[0043] FIG19 is a diagram illustrating a structure for applying a force to a first stacked structure according to some embodiments;

[0044] FIG20 is a structural diagram of a first stacked junction including a first functional layer and a second functional layer according to some embodiments;

[0045] FIG21 is a structural diagram of a dimming device including a second adhesive layer according to some embodiments;

[0046] FIG22 is a structural diagram illustrating that a fourth adhesive layer is flush with a second substrate according to some embodiments;

[0047] FIG23 is a structural diagram of a second stacked structure including a third functional layer according to some embodiments;

[0048] FIG24 is a structural diagram illustrating a force applied to a second stacked structure according to some embodiments;

[0049] FIG25 is a structural diagram of forming a first light-shielding layer and a second light-shielding layer according to some embodiments;

[0050] FIG26 is a diagram illustrating steps for forming a first light shielding layer and a second light shielding layer according to some embodiments;

[0051] FIG27 is a structural diagram of a dimming device including a plurality of first functional layers according to some embodiments;

[0052] FIG28 is a cross-sectional view taken along section line CC in FIG27;

[0053] FIG29 is a structural diagram of a dimming device including a limit bar according to some embodiments;

[0054] FIG30 is a cross-sectional view along section line DD in FIG29;

[0055] FIG31 is a structural diagram of a limiting strip provided with a third opening according to some embodiments;

[0056] FIG32 is a cross-sectional view taken along section line EE in FIG31;

[0057] FIG33 is a block diagram of a car according to some embodiments. DETAILED DESCRIPTION

[0058] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0059] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0060] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0061] When describing some embodiments, the word "connected" and its derivatives may be used. The term "connected" should be understood broadly. For example, "connected" can mean fixed, removable, or integrated; it can be directly connected or indirectly connected through an intermediary. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0062] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0063] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0064] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0065] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0066] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0067] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0068] The directional words such as "upper", "lower", "left", and "right" described in the embodiments of the present application are described from the perspectives shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it is also necessary to understand that when it is mentioned that an element is connected to another element "on" or "under", it can not only be directly connected to the other element "on" or "under", but also be indirectly connected to the other element "on" or "under" through an intermediate element.

[0069] In the related art, the dimming device can be prepared using the following preparation process: first, an initial dimming device is formed, and the initial dimming device includes a first substrate, a first adhesive layer, a first functional layer, a second adhesive layer, and a second substrate that are stacked. The initial dimming device also includes a glue frame, and the glue frame surrounds the first functional layer. The initial dimming device is then combined to form a dimming device. Since at least one of the first adhesive layer and the second adhesive layer may have inconsistent thickness, there is no gap between the first functional layer and the first substrate, and there is no gap between the first functional layer and the second substrate during the combination process, resulting in the first functional layer not being able to deform accordingly with changes in the thickness of the first adhesive layer and / or the second adhesive layer. In this way, the stress exerted on the first functional layer by the first adhesive layer and / or the second adhesive layer cannot be released, resulting in some areas of the first functional layer being subjected to heavier stress and some areas being subjected to lighter stress, and mura phenomenon occurring in the first functional layer. For example, the first functional layer is a dye liquid crystal dimming functional layer, and the first and second adhesive layers are made of polyvinyl butyral (PVB). The initial dimming device is assembled under high temperature and high pressure. PVB is fluid at high temperatures, which may cause the thickness of at least one of the first and second adhesive layers to be inconsistent. This can lead to inconsistent stress on the dye liquid crystal dimming functional layer, causing liquid crystal molecules in areas with heavier stress to migrate toward areas with lighter stress. The liquid crystal molecules stack in the lighter stress areas, resulting in dark spots on the first functional layer. Assembly refers to the process of permanently bonding the first substrate (first film layer) on one side of the adhesive layer to the second substrate (second film layer) on the other side of the adhesive layer through a special high-temperature pre-pressing (or vacuuming) and high-temperature and high-pressure process. For example, the first and second substrates are made of tempered glass, which can be flat glass, single-curved glass, or double-curved glass. The inventors discovered that when the first substrate is made of hyperbolic glass, the dimming device exhibits significant mura. Single-curved glass refers to glass that has curvature in a third direction. Hyperbolic glass refers to glass that has curvature in both the third direction and a fourth direction, where the third direction intersects the fourth direction, for example, is perpendicular to the fourth direction.

[0070] In order to solve the above problems, an embodiment of the present disclosure provides a method for preparing a dimming device 100 , which includes steps S100 to S600 .

[0071] As shown in FIG. 1 , S100 , a first stacked structure 10 is formed.

[0072] The first laminated structure 10 includes a stacked first substrate 11, a first adhesive layer 12, and a first functional layer 13. The first substrate 11 may be made of a rigid material or a flexible material with high light transmittance (eg, light transmittance greater than 85%).

[0073] As shown in FIG. 2 , S200 , a plastic frame 20 is formed on one side of the first stacked structure 10 .

[0074] The first adhesive layer 12 may include a plurality of stacked adhesive layers, that is, the thickness of the first adhesive layer 12 is M×d, where M is the number of adhesive layers and d is the thickness of the adhesive layer. The number of adhesive layers is less than six, for example, the number of adhesive layers is one to three, that is, M is 1 to 3. For example, the number of adhesive layers is one or three, and the embodiments of the present disclosure are not listed one by one. The thickness of the adhesive layer is 0.3mm to 0.5mm, for example, the thickness of the adhesive layer is 0.3mm, 0.35mm, 0.38mm, 0.4mm, 0.45mm, 0.48mm or 0.5mm, and the embodiments of the present disclosure are not listed one by one.

[0075] The thickness of the first functional layer is d3, where d3 is less than or equal to 1.1 mm. For example, d3 is 1.1 mm, 1 mm, 0.78 mm, 0.38 mm or 0.15 mm, which are not listed one by one in the embodiments of the present disclosure.

[0076] The end of the plastic frame 20 that is distal to the first substrate 11 is further distal than the end of the first functional layer 13 that is distal to the first substrate 11. That is, along the thickness direction of the first laminated structure 10, the upper surface of the plastic frame 20 is higher than the upper surface of the first functional layer 13. This allows, on the one hand, the plastic frame 20 to create a first gap between the first laminated structure 10 and the second laminated structure during the subsequent bonding process. On the other hand, the larger portion of the plastic frame 20 surrounding the first functional layer 13 further reduces the risk of moisture entering the first functional layer 13. The plastic frame 20 has at least one first opening 21.

[0077] In some embodiments, as shown in FIG2 , a telescopic gap 1 is defined between the plastic frame 20 and the first functional layer 13. This telescopic gap 1 provides space for the thermal expansion and contraction of the first functional layer 13, thereby reducing the risk of damage to the first functional layer 13 caused by compression between the plastic frame 20 and the plastic frame 20, and thereby increasing the service life of the first functional layer 13. When the plastic frame 20 is made of PVB, the plastic frame 20 material is fluid during the lamination process. The telescopic gap 1 provides space for the plastic frame 20 to flow, reducing the risk of the plastic frame 20 flowing to the surface of the first functional layer 13 away from the first substrate 11. Exemplarily, the telescopic gap 1 is 1 mm to 5 mm, for example, 1 mm, 2.5 mm, or 5 mm, which prevents the first functional layer 13 from being compressed by the plastic frame 20 during thermal expansion and contraction.

[0078] The glue frame 20 may include a plurality of stacked glue layers, that is, the thickness of the glue frame is N×d, where N is the number of glue layers, and the number of glue layers is less than six layers. For example, the number of glue layers is two to five layers, that is, N is 2 to 5. For example, the number of glue layers is two, four or five layers, and the embodiments of the present disclosure are not listed one by one. The thickness of the glue layer is 0.3mm to 0.5mm. For example, the thickness of the glue layer is 0.3mm, 0.35mm, 0.38mm, 0.4mm, 0.45mm, 0.48mm or 0.5mm, and the embodiments of the present disclosure are not listed one by one. Among them, the thickness of the glue frame 20 refers to: the distance between the surface of the glue frame 20 away from the first substrate 11 and the surface of the first substrate 11 close to the glue frame 20.

[0079] As shown in FIG. 3 , in S300 , the second stacked structure 40 is attached to a side of the plastic frame 20 away from the first substrate 11 .

[0080] 3 , the second stacked structure 40 is located on a side of the first functional layer 13 away from the first substrate 11 and has a first gap 2 between it and the first stacked structure 10. The first gap 2 is connected to the first opening 21. The plastic frame 20 is bonded to the second stacked structure 40.

[0081] The thickness of the first gap 2 is N×d2-M×d1-d3. For example, the thickness of the first gap 2 is 0.1 mm to 1 mm. For example, the thickness of the first gap 2 is 0.1 mm, 0.38 mm, 0.5 mm, 0.78 mm, or 1 mm, which are not listed in detail in the embodiments of the present disclosure.

[0082] As shown in FIG. 4 , in S400 , the first stacked structure 10 , the plastic frame 20 and the second stacked structure 40 are assembled.

[0083] The first adhesive layer 12 bonds the first substrate 11 and the first functional layer 13 , and the adhesive frame 20 bonds the first stacked structure 10 and the second stacked structure 40 . The adhesive frame 20 abuts against the first functional layer 13 .

[0084] The material of the plastic frame 20 includes PVB, and the lamination process conditions are high temperature and high pressure. For example, the first laminated structure 10, the plastic frame 20 and the second laminated structure 40 are laminated in an autoclave.

[0085] Under high temperature and high pressure conditions, the material of the adhesive layer exhibits fluidity, so the thickness d of the adhesive frame 20 may remain unchanged or decrease. That is, the thickness of the first adhesive layer 12 changes from M×d to M×d1, and the thickness of the adhesive frame 20 changes from N×d to N×d2, where d1 is less than or equal to d, d2 is less than or equal to d, and d1 and d2 are 0.3mm to 0.5mm. For example, d1 is 0.3mm, 0.35mm, 0.38mm, 0.4mm, 0.45mm, 0.48mm, or 0.5mm, and d2 is 0.3mm, 0.35mm, 0.38mm, 0.4mm, 0.45mm, 0.48mm, or 0.5mm. The embodiments of the present disclosure are not listed one by one.

[0086] Since the thickness of the plastic frame 20 is greater than the thickness of the first adhesive layer 12, the fluidity of the material of the adhesive layer included in the plastic frame 20 is less than or equal to the fluidity of the material of the adhesive layer included in the first adhesive layer 12. That is, the reduction value of the thickness of the adhesive layer included in the plastic frame 20 is less than or equal to the reduction value of the adhesive layer included in the first adhesive layer 12. In other words, the thickness d2 of the adhesive layer included in the plastic frame 20 is greater than or equal to the thickness d1 of the adhesive layer included in the first adhesive layer 12.

[0087] Illustratively, the thickness d2 of the adhesive layer included in the adhesive frame 20 is equal to the thickness d1 of the adhesive layer included in the first adhesive layer 12 , that is, d1 and d2 are both 0.3mm, 0.35mm, 0.38mm, 0.4mm, 0.45mm, 0.48mm or 0.5mm, which are not listed one by one in the embodiments of the present disclosure.

[0088] Alternatively, illustratively, the thickness d2 of the adhesive layer included in the adhesive frame 20 is greater than the thickness d1 of the adhesive layer included in the first adhesive layer 12. For example, d2 is 0.38 mm and d1 is 0.35 mm, d2 is 0.4 mm and d1 is 0.35 mm, d2 is 0.48 mm and d1 is 0.4 mm, or d2 is 0.5 mm and d1 is 0.48 mm. The embodiments of the present disclosure are not listed one by one.

[0089] When the thickness of the first adhesive layer 12 is inconsistent, the thicker portion of the first adhesive layer 12 arches in the direction from the first substrate 11 to the second laminated structure 40. Accordingly, the portion of the first functional layer 13 bonded to this portion arches in the direction from the first substrate 11 to the second laminated structure 40. The thinner portion of the first adhesive layer 12 is concave in the direction from the second laminated structure 40 to the first substrate 11. Accordingly, the portion of the first functional layer 13 bonded to this portion moves in the direction from the second laminated structure 40 to the first substrate 11. This releases the stress applied by the first adhesive layer 12 on the first functional layer 13, reducing the risk of uneven stress on the first functional layer 13 due to the inconsistent thickness of the first adhesive layer 12.

[0090] As shown in FIG. 5 , at S500 , liquid glue is injected into the first gap through at least one first opening of the glue frame 20 .

[0091] The liquid glue may be a glue with relatively high light transmittance, for example, the liquid glue may be an optical glue (English: Optical Clear Resin, abbreviated: OCR) or an ultraviolet glue (English: Ultraviolet, abbreviated: UV).

[0092] As shown in FIG. 6 , S600 , the liquid adhesive is cured to form a second adhesive layer 50 .

[0093] The second adhesive layer 50 bonds the first laminate structure 10 to the second laminate structure 40. The second adhesive layer 50 is prepared by a glue pouring and curing process. The second adhesive layer 50 has no force on the first functional layer 13 or has a relatively small force.

[0094] The cell thickness (the distance between the first substrate 11 and the second substrate 41 ) of the dimming device 100 prepared according to the above steps is highly consistent. For example, the variation of the cell thickness of the dimming device 100 is less than or equal to 0.1 mm.

[0095] The thickness of the second adhesive layer 50 is equal to the thickness of the first gap 2, that is, the thickness of the second adhesive layer 50 is N×d2-M×d1-d3. For example, the thickness of the second adhesive layer 50 is 0.1 mm to 1 mm. For example, the thickness of the second adhesive layer 50 is 0.1 mm, 0.38 mm, 0.5 mm, 0.78 mm, or 1 mm, which are not listed in detail in the embodiments of the present disclosure.

[0096] An embodiment of the present disclosure further provides a dimming device 100 . As shown in FIG. 7 , the dimming device 100 includes a first stacked structure 10 , a second stacked structure 40 , a second adhesive layer 50 , a plastic frame 20 and a sealing block 80 .

[0097] As shown in Figure 7, the first laminated structure 10 includes a stacked first substrate 11, a first adhesive layer 12, and a first functional layer 13. The first substrate 11 can be made of a material with high light transmittance (e.g., greater than 85%), such as tempered glass.

[0098] The first adhesive layer 12 may be made of other adhesive materials with high light transmittance, such as optically clear adhesive (OCA), PVB, ethylene vinyl acetate (EVA), Sentry Glas Plus (SGP), or optically clear resin (OCR). For example, the first adhesive layer 12 may be made of PVB.

[0099] In some embodiments, the first adhesive layer 12 may include multiple stacked adhesive layers, with the number of adhesive layers being less than six, for example, one to three adhesive layers, which are not listed in detail in the embodiments disclosed herein. The adhesive layer has a thickness of 0.3 mm to 0.5 mm, for example, 0.3 mm, 0.35 mm, 0.38 mm, 0.4 mm, 0.45 mm, 0.48 mm, or 0.5 mm, which are not listed in detail in the embodiments disclosed herein.

[0100] During the preparation of the dimming device 100, the first adhesive layer 12 needs to undergo a high-temperature, high-pressure lamination process. Under high-temperature, high-pressure conditions, the adhesive layer material has fluidity, which can ensure that the thickness of the adhesive layer after high-temperature, high-pressure is less than or equal to the thickness of the adhesive layer before high-temperature, high-pressure. In other words, the thickness of the first adhesive layer 12 before high-temperature, high-pressure is M×d, where M is the number of adhesive layers and d is the thickness of the adhesive layer. The thickness of the first adhesive layer 12 after high-temperature, high-pressure is N×d1, where d1 is less than or equal to d, and d1 is 0.3mm to 0.5mm. For example, d1 is 0.3mm, 0.35mm, 0.38mm, 0.4mm, 0.45mm, 0.48mm, or 0.5mm. The embodiments of the present disclosure are not listed one by one.

[0101] The thickness of the first adhesive layer 12 can be designed according to the thickness of the dimming device 100. For example, if the thickness of the dimming device 100 is less than or equal to 5 mm, the thickness of the first adhesive layer 12 is 0.3 mm to 0.35 mm. For example, the thickness of the first adhesive layer 12 is 0.3 mm, 0.33 mm or 0.35 mm.

[0102] The thickness of the first functional layer is d3, where d3 is less than or equal to 1.1 mm. For example, d3 is 1.1 mm, 1 mm, 0.78 mm, 0.38 mm or 0.15 mm, which are not listed one by one in the embodiments of the present disclosure.

[0103] Figure 8 illustrates a structure in which the first functional layer 13 is a dimming layer. In some embodiments, as shown in Figure 8 , the first functional layer 13 is a dimming layer 13A, which is used to adjust light transmittance. In this case, the first adhesive layer is made of PVB or SGP. The first adhesive layer 12 exhibits excellent adhesion, enhancing the bond between the first functional layer 13 and the first substrate 11.

[0104] The dimming functional layer 13A can be a polymer dispersed liquid crystal (PDLC) functional layer, an electrochromic (EC) functional layer, a dye liquid crystal functional layer, or a suspended particle (SP) functional layer. The present disclosure uses the dye liquid crystal functional layer as an example for description of the dimming functional layer 13A.

[0105] As shown in Figure 8, the dimming function layer 13A includes a dye liquid crystal panel 131 and a first flexible circuit board 132. The dye liquid crystal panel 131 is used to adjust light transmittance, and the first flexible circuit board 132 is used to drive the dye liquid crystal panel 131 to adjust light transmittance.

[0106] The dye liquid crystal panel 131 includes a first substrate layer 1311, a first electrode layer 1312, a first alignment layer 1313, a dye liquid crystal layer 1314, a second alignment layer 1315, a second electrode layer 1316, and a second substrate layer 1317, which are stacked in sequence. The dye liquid crystal panel 1311 also includes a sealant 1318. The first and second substrate layers 1311 and 1317 may be made of glass or plastic. Plastics may include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyphenylene sulfone resins (PPSU), cycloolefin polymers (COP), or polymethyl methacrylate (PMMA).

[0107] The materials of the first electrode layer 1312 and the second electrode layer 1316 include a conductive material with high light transmittance. For example, the materials of the first electrode layer 1312 and the second electrode layer 1316 include indium tin oxide (ITO).

[0108] The dye liquid crystal layer 1314 includes dye molecules 1301 and liquid crystal molecules 1302 (black ovals in FIG8 represent dye molecules, and white ovals represent liquid crystal molecules). Depending on the angle formed between the long axis of the dye molecule 1301 and the direction of the electric field between the first electrode layer 1312 and the second electrode layer 1316, the amount of light absorbed by the dye molecule 1301 varies. Changing the voltage between the first electrode layer 1312 and the second electrode layer 1316 can change the angle formed between the long axis of the liquid crystal molecule 1302 and the direction of the electric field between the first electrode layer 1312 and the second electrode layer 1316. By changing the angle formed between the long axis of the dye molecule 1301 and the direction of the electric field between the first electrode layer 1312 and the second electrode layer 1316, the amount of light absorbed by the dye molecule 1301 can be changed, thereby adjusting the light transmittance of the dye liquid crystal layer 1314. For example, when the long axis of the dye molecule 1301 is parallel to the direction of the electric field between the first electrode layer 1312 and the second electrode layer 1316, light can pass through the dye liquid crystal layer 1314, causing the dye liquid crystal functional layer to be transparent (bright state). For another example, when the long axis of the dye molecule 1301 is perpendicular to the direction of the electric field between the first electrode layer 1312 and the second electrode layer 1316, light cannot pass through the dye liquid crystal layer 1314, causing the dye liquid crystal functional layer to be dark state.

[0109] The dye liquid crystal layer 1314 further includes a plurality of spacers 1303, which are spaced apart and located between the second alignment layer 1315 and the first electrode layer 1312, and extend through the first alignment layer 1313. The spacers 1303 are used to maintain the distance between the first substrate layer 1311 and the second substrate layer 1317.

[0110] FIG9 is a structural diagram of the first functional layer 13 being a display functional layer 13B. In other embodiments, as shown in FIG9 , the first functional layer 13 may also be a display functional layer 13B, the display functional layer 13B having a high light transmittance, and the display functional layer 13B is used to display images. Exemplarily, the display functional layer 13B is an organic light emitting diode (OLED) display functional layer, a quantum dot light emitting diode (QLED) display functional layer, an active-matrix organic light emitting diode (AMOLED) display functional layer, a micro light emitting diode (Micro LED) or a sub-millimeter light emitting diode (Mini LED). Micro LED refers to an LED chip having a size of less than 50 μm, and Mini LED refers to an LED chip having a size of 50 μm to 200 μm. For example, the display function layer 13B is an OLED display function layer, and includes a display panel 133 and a second flexible circuit board 134 . The second flexible circuit board 134 is electrically connected to the display panel 133 and is used to drive the display panel 133 to display images.

[0111] As shown in FIG7 , the second laminated structure 40 is located on the side of the first substrate 11 close to the first adhesive layer 12 and includes a second substrate 41. The second substrate 41 and the first substrate 11 can be made of the same material, for example, both the first substrate 11 and the second substrate 41 include tempered glass.

[0112] The second adhesive layer 50 is located between the first laminated structure 10 and the second laminated structure 40 , and is used to bond the first laminated structure 10 and the second laminated structure 40 .

[0113] The thickness of the second adhesive layer 50 is N×d2-M×d1-d3. For example, the thickness of the second adhesive layer 50 can be designed based on the thickness of the dimming device 100. For example, if the thickness of the dimming device 100 is less than or equal to 5 mm, the thickness of the second adhesive layer 50 can be in the range of 0.1 mm to 1 mm. For example, the thickness of the second adhesive layer 50 can be 1.1 mm, 1 mm, 0.78 mm, 0.38 mm, or 0.15 mm, which are not listed in detail in the embodiments of the present disclosure.

[0114] The plastic frame 20 is located between the first substrate 11 and the second substrate 41, surrounding the first functional layer 13 and the second adhesive layer 50. This prevents moisture from entering the first functional layer 13 and the second adhesive layer 50, reducing the risk of moisture corrosion. This improves the service life of the dimming device 100. The plastic frame 20 is located on the side of the first substrate 11 near the first functional layer 13 and surrounds the first functional layer 13. This prevents moisture from entering the first functional layer 13, reduces the risk of material degradation within the first functional layer 13, and increases the service life of the first functional layer 13. For example, the width of the plastic frame 20 can be 5 mm to 50 mm. For example, the width of the plastic frame 20 can be 5 mm, 25 mm, or 50 mm, ensuring that the plastic frame blocks moisture.

[0115] The material of the plastic frame 20 includes PVB, EVA, or SGP, which are not listed one by one in the embodiments of the present disclosure. As shown in Figure 10, the plastic frame 20 may include multiple laminated plastic layers 201, with the number of plastic layers being less than six, for example, the number of plastic layers is two to five, and the thickness of the plastic layers is 0.3mm to 0.5mm, for example, the thickness of the plastic layers is 0.3mm, 0.35mm, 0.38mm, 0.4mm, 0.45mm, 0.48mm, or 0.5mm, which are not listed one by one in the embodiments of the present disclosure. In other words, the thickness of the plastic frame 20 is a multiple of the specifications of the plastic layers.

[0116] During the preparation of the dimming device 100, the adhesive frame 20 needs to undergo a high-temperature, high-pressure lamination process. Under high-temperature, high-pressure conditions, the adhesive layer material has fluidity, which can make the thickness of the adhesive layer after high-temperature, high-pressure less than or equal to the thickness of the adhesive layer before high-temperature, high-pressure. In other words, the thickness of the adhesive frame before high-temperature, high-pressure is N×d, where N is the number of adhesive layers and d is the thickness of the adhesive layer. The thickness of the adhesive layer after high-temperature, high-pressure is N×d2, where d2 is less than or equal to d, and d2 is 0.3mm to 0.5mm. For example, d2 is 0.3mm, 0.35mm, 0.38mm, 0.4mm, 0.45mm, 0.48mm, or 0.5mm. The embodiments of the present disclosure are not listed one by one.

[0117] Since the thickness of the plastic frame 20 is greater than the thickness of the first adhesive layer 12, the fluidity of the adhesive layer included in the plastic frame 20 is less than or equal to the fluidity of the material of the adhesive layer included in the first adhesive layer 12. That is, the reduction value of the thickness of the adhesive layer included in the plastic frame 20 is less than or equal to the reduction value of the adhesive layer included in the first adhesive layer 12. In other words, the thickness d2 of the adhesive layer included in the plastic frame 20 is greater than or equal to the thickness d1 of the adhesive layer included in the first adhesive layer 12.

[0118] Exemplarily, the thickness d2 of the adhesive layer included in the adhesive frame 20 is equal to the thickness d1 of the adhesive layer included in the first adhesive layer 12, that is, d1 and d2 are both 0.3 mm, 0.35 mm, 0.38 mm, 0.4 mm, 0.45 mm, 0.48 mm, or 0.5 mm, which are not listed in the embodiments of the present disclosure. Alternatively, exemplary, the thickness d2 of the adhesive layer included in the adhesive frame 20 is greater than the thickness d1 of the adhesive layer included in the first adhesive layer 12. For example, d2 is 0.38 mm and d1 is 0.35 mm, d2 is 0.4 mm and d1 is 0.35 mm, d2 is 0.48 mm and d1 is 0.4 mm, or d2 is 0.5 mm and d1 is 0.48 mm, which are not listed in the embodiments of the present disclosure.

[0119] In some embodiments, the thickness of the first adhesive layer 12 is 0.38 mm, the thickness of the second adhesive layer 50 is 0.38 mm, the thickness of the first functional layer 13 is 0.38 mm, and the thickness of the adhesive frame is 1.14 mm. In other embodiments, the thickness of the first adhesive layer 12 is 0.76 mm, the thickness of the second adhesive layer 50 is 0.38 mm, the thickness of the first functional layer 13 is 0.76 mm, and the thickness of the adhesive frame is 1.9 mm.

[0120] Based on the above structure, the thickness of the plastic frame 20 can be adjusted by changing the number of adhesive layers 201, which is relatively convenient. In the case where the first functional layer 13 includes a flexible circuit board (first flexible circuit board 132 or second flexible circuit board 134), the flexible circuit board 132 / 134 can extend straight outward and extend from between two adjacent adhesive layers 201, thus eliminating the need for the flexible circuit board 132 / 134 to bend. Compared to a plastic frame 20 using a monolithic structure, where the flexible circuit board 132 / 134 needs to bend around the plastic frame 20 to extend, the above-mentioned solution of forming the plastic frame 20 with multiple adhesive layers 201 can reduce the risk of damage to the flexible circuit board 132 / 134 due to bending.

[0121] Exemplarily, the material of the plastic frame is PVB film. Without a bonding substrate or film layer, the surface of the PVB film is rough, that is, the surface of the PVB film is uneven. On this basis, when the second laminated structure 40 includes a second substrate 41, the plastic frame 20 contacts the second substrate 41. Since the surface of the plastic frame 20 formed by the PVB film is uneven, a small gap exists between the plastic frame 20 and the second substrate 41. During the subsequent preparation process, air within the expansion gap 1 between the plastic frame 20 and the first functional layer 13 can be discharged through the small gap between the plastic frame 20 and the second substrate 41, thereby preventing the formation of bubbles in the dimming device 100.

[0122] As shown in Figures 5 and 7, the glue frame 20 has at least one first opening 21. The projection of the first opening 21 along the first direction M1 at least partially overlaps with the orthographic projection of the second adhesive layer 50 along the first direction M1. Thus, before step S500 (injecting liquid glue into the first gap 2 through the at least one first opening of the glue frame 20), the first opening 21 is in communication with the first gap 2, allowing liquid glue to be injected into the dimming device 100 through the first opening 21, and then fixed to form the aforementioned second adhesive layer 50. In other words, the second adhesive layer 50 is prepared through a glue pouring and curing process, and the second adhesive layer 50 has no or minimal force on the first functional layer 13, thereby improving the service life of the first functional layer 13. The first direction M1 is perpendicular to the side surface where the first opening 21 is located.

[0123] As shown in Figures 5 and 7 , along the second direction M2, the size of the first opening 21 is less than or equal to one-half the size of the first substrate 11. For example, the size of the first opening 21 is less than or equal to one-half, one-third, or one-quarter the size of the first substrate 11. In other words, along the second direction M2, the size of the first opening 21 is smaller than the size of the side of the plastic frame 20 where the first opening 21 is located. The second direction M2 is parallel to the side of the plastic frame 20 where the first opening 21 is located.

[0124] Exemplarily, the plastic frame 20 has one first opening 21, two first openings 21, or three first openings 21. For example, if the plastic frame 20 has one first opening 21, less of the plastic frame 20 is removed, thereby reducing the risk of poor sealing of the plastic frame 20. For another example, if the plastic frame 20 has three first openings 21, the speed of glue pouring can be increased, thereby reducing the preparation time of the dimming device 100.

[0125] Figures 11 to 13 are several schematic diagrams illustrating the positional relationship between the first opening 21 and the flexible circuit board 132 / 134. For example, as shown in Figure 11, the first opening 21 and the flexible circuit board are located on adjacent sides of the plastic frame 20. For example, the flexible circuit board is located on the upper side of the plastic frame 20, and the first opening 21 is located on the left or right side of the plastic frame 20. Alternatively, for example, as shown in Figure 12, the first opening 21 and the flexible circuit board are located on opposite sides of the plastic frame 20. Alternatively, for example, as shown in Figure 13, the first opening 21 and the flexible circuit board are located on the same side of the plastic frame 20. When the dimming device 100 is applied to a vehicle window glass, the flexible circuit board is located on the lower side. Thus, when the vehicle window glass is raised or lowered, the flexible circuit board is hidden in the vehicle door. Since the first opening 21 and the flexible circuit board are located on the same side of the plastic frame 20, the first opening 21 is also hidden in the vehicle door. Since a sealing block 80 is provided to seal the first opening 21 after the glue filling is completed, the sealing block 80 can also be hidden in the vehicle door using the above design, so that the sealing block 80 is not easily damaged, thereby reducing the risk of water vapor entering the interior of the dimming device 100 through the first opening 21.

[0126] In some embodiments, as shown in FIG14 , the adhesive frame 20 further includes at least one second opening 22. During the process of injecting liquid adhesive into the first gap, the second opening 22 can exhaust air within the first gap, thereby reducing the risk of bubbles forming in the dimming device 100. For example, the adhesive frame 20 further includes one second opening 22, two second openings 22, or three second openings 22 to ensure proper exhaust of the dimming device 100. The first opening 21 and the second opening 22 are located on the same side of the adhesive frame 20.

[0127] When the first opening 21 and the flexible circuit board are located on the same side of the plastic frame 20, the relative positions of the first opening 21, the second opening 22, and the flexible circuit board can be set according to actual conditions. For example, as shown in Figure 14, the first opening 21 and the second opening 22 are located on the same side of the flexible circuit board. For another example, as shown in Figure 15, the first opening 21 is located on one side of the flexible circuit board, and the second opening 22 is located on the other side of the flexible circuit board. When the plastic frame 20 is formed by stacking multiple adhesive layers, the flexible circuit board 132 / 134 extends from between two adjacent adhesive layers, and there is a certain distance between the flexible circuit board 132 / 134 and the first opening 21 to ensure that the portion of the flexible circuit board 132 / 134 located within the plastic frame 20 is completely wrapped by the plastic frame 20, and the multiple adhesive layers at the first opening 21 will not be separated by the flexible circuit board 132 / 134, thereby ensuring good sealing performance of the plastic frame 20. For example, the distance between the first opening 21 and the flexible circuit board is greater than 30 mm.

[0128] In some embodiments, as shown in FIG16 , a baffle 30 is used during the formation of the first opening 21 and the second opening 22. The plastic frame 20 has an opening, and the baffle 30 is located within the opening, dividing the opening into two sub-openings, one of which is the first opening 21 and the other is the second opening 22. Having a single opening in the plastic frame 20 allows for less removal of the plastic frame 20, thereby reducing the risk of poor sealing of the plastic frame 20.

[0129] As shown in Figure 7, the sealing block 80 is located at the first opening 21 and seals the first opening 21. The sealing block 80 can reduce the risk of moisture entering the second adhesive layer 50 through the first opening 21. Exemplarily, the sealing block 80 is made of hot melt butyl adhesive.

[0130] On the basis of the above embodiment, after S600 (curing the liquid glue to form the second adhesive layer 50 ), the preparation method further includes S700 .

[0131] As shown in FIG. 17 , at S700 , the first opening 21 is sealed.

[0132] Hot-melt butyl adhesive 3 is applied in the first opening 21 to seal the first opening 21 . The hot-melt butyl adhesive can reduce the risk of water vapor in the air entering the second adhesive layer.

[0133] In the case where the dimming device 100 includes a baffle 30 (as shown in FIG. 16 ), the baffle 30 needs to be removed from the first opening 21 before the first opening 21 is sealed.

[0134] In some embodiments, as shown in FIG. 7 , the material of the rubber frame 20 and the sealing block 80 is the same. For example, the material of the rubber frame 20 is PVB, and the material of the sealing block 80 is hot-melt butyl adhesive.

[0135] The material of the plastic frame 20 is the same as that of the first adhesive layer 12, which improves the material uniformity of the dimming device 100 and reduces the manufacturing cost of the dimming device 100. During the process of forming the dimming device 100, the material of the plastic frame 20 will permeate into the first adhesive layer 12, and the material of the first adhesive layer 12 will permeate into the plastic frame 20, forming a single unit with the first adhesive layer 12, thereby ensuring a more secure bond between the plastic frame 20 and the first substrate 11.

[0136] The material of the first adhesive layer 12 is different from that of the second adhesive layer 50. The material of the first adhesive layer 12 has excellent impact resistance, which can reduce the risk of the first substrate 11 being broken by external impacts of a certain energy or temperature fluctuations. The material of the second adhesive layer 50 has excellent stress absorption properties, which can absorb the stress exerted by the first functional layer 13 on the second adhesive layer 50, that is, the stress exerted on the first functional layer 13 due to the uneven thickness of the first adhesive layer 12. As a result, the second adhesive layer 50 exerts little or no stress on the first functional layer 13, reducing the risk of uneven stress on the first functional layer 13.

[0137] In some embodiments, the adhesive frame is made of PVB film. Without a substrate or film layer attached, the surface of the PVB film is rough, i.e., uneven. Based on this, as shown in FIG18 , the orthographic projection of the first adhesive layer 12 on the reference surface lies within the orthographic projection of the first substrate 11 on the reference surface, and is spaced from the boundary of the first substrate 11. The orthographic projection of the first adhesive layer 12 on the reference surface coincides with the orthographic projection of the first functional layer 13 on the reference surface. The reference surface is parallel to the surface of the first substrate 11 proximal to the first functional layer 13. In this way, after S200 (forming the glue frame 20 on one side of the first stacked structure 10), the glue frame 20 is in contact with the first substrate 11. Since the surface of the glue frame 20 formed by the PVB film is uneven, there is a small gap between the glue frame 20 and the first substrate 11. In the subsequent preparation process, the air in the expansion gap 1 between the glue frame 20 and the first functional layer 13 can be discharged through the small gap between the glue frame 20 and the first substrate 11, thereby avoiding the generation of bubbles in the dimming device 100.

[0138] In the above embodiment, during the subsequent bonding of the second laminated structure, the thickness of the adhesive frame 20 is greater than the sum of the thickness of the first adhesive layer 12 and the first functional layer 13 , thereby allowing a first gap to be formed between the second laminated structure and the first functional layer 13 .

[0139] On the basis of the above embodiment, between S100 (forming the first stacked structure 10 ) and S200 (forming the glue frame 20 on one side of the first stacked structure 10 ), the preparation method further includes S201 to S202 .

[0140] As shown in FIG. 19 , S201 , pressure is applied to the first stacked structure 10 .

[0141] In some embodiments, the first adhesive layer is made of PVB film. Without a bonding substrate or film layer, the surface of the PVB film is rough, i.e., uneven. Consequently, a small gap exists between the first adhesive layer 12 and the first substrate 11 in the first laminated structure 10. This small gap can accommodate air. Applying pressure to the first laminated structure 10 can expel the air in the small gap between the first adhesive layer 12 and the first substrate 11, thereby increasing the bonding area between the first adhesive layer 12 and the first substrate 11 and thereby ensuring a more secure connection between the first adhesive layer 12 and the first substrate 11.

[0142] S202 , assembling the first stacked structure 10 .

[0143] The first adhesive layer 12 bonds the first substrate 11 and the first functional layer 13. Exemplarily, the material of the first adhesive layer 12 is PVB, and the process conditions for laminating the first laminated structure 10 are high temperature and high pressure. Alternatively, exemplarily, the material of the first adhesive layer 12 is EVA, and the temperature for laminating the first laminated structure 10 is lower than that for laminating PVB, and the pressure for laminating the first laminated structure 10 is lower than that for laminating PVB. In this way, the laminating process of EVA is relatively simple, which can reduce the preparation cost of the first laminated structure 10. Alternatively, exemplarily, the material of the first adhesive layer 12 is SGP, and the strength of SGP is higher than that of PVB, and the shear modulus of SGP is higher than that of PVB. When the thickness of the first adhesive layer 12 is the same, the strength of the first adhesive layer 12 composed of SGP is higher than that of the first adhesive layer 12 composed of PVB, thereby improving the strength of the first laminated structure 10.

[0144] As shown in Figure 18, the orthographic projection of the first functional layer 13 on the reference surface coincides with the orthographic projection of the first adhesive layer 12 on the reference surface. Compared with the orthographic projection of the first functional layer 13 on the reference surface, it is located within the orthographic projection of the first adhesive layer 12 on the reference surface and is spaced from the boundary of the first adhesive layer 12. In the process of applying pressure to the first laminated structure 10 and piecing the first laminated structure 10 together, the entire first adhesive layer 12 of some embodiments of the present disclosure is compressed, which can make the thickness of the first adhesive layer 12 consistent, so that the first functional layer 13 can be subjected to more uniform force.

[0145] In other embodiments, as shown in FIG7 , the orthographic projection of the first adhesive layer 12 on the reference surface coincides with the orthographic projection of the first substrate 11 on the reference surface, and the orthographic projection of the first functional layer 13 on the reference surface is within the range of the orthographic projection of the first adhesive layer 12 on the reference surface and is spaced from the boundary of the first adhesive layer 12. In this way, the first adhesive layer 12 covers the first substrate 11. If the first substrate 11 is shattered by an external impact of a certain energy or a temperature change, any part of the first substrate 11 will adhere to the first adhesive layer 12, reducing the risk of fragments of the first substrate 11 flying around.

[0146] In the subsequent process of laminating the second stacked structure, the thickness of the plastic frame 20 is greater than the thickness of the first functional layer 13 , so that a first gap can be formed between the second stacked structure and the first functional layer 13 .

[0147] FIG20 is a structural diagram of the first stacked structure 10 further including a second functional layer 14. In some embodiments, as shown in FIG19 , the first stacked structure 10 further includes a second functional layer 14 and a third adhesive layer 15. The second functional layer 14 is located on the side of the first functional layer 13 away from the first substrate 11. The third adhesive layer 15 is located between the first and second functional layers 13, 14 and is used to bond the first and second functional layers 13, 14. After S200 (forming the adhesive frame 20 on one side of the first stacked structure 10), the end of the adhesive frame 20 away from the first substrate 11 is further away from the first substrate 11 than the end of the second functional layer 14 away from the first substrate 11. That is, along the thickness direction of the first stacked structure 10, the upper surface of the adhesive frame 20 is higher than the upper surface of the second functional layer 14.

[0148] The types of the first functional layer 13 and the second functional layer 14 can be set according to actual circumstances. For example, the first functional layer 13 is a dye liquid crystal functional layer, and the second functional layer 14 is also a dye liquid crystal functional layer. The first functional layer 13 and the second functional layer 14 can have different light transmittances. The combination of the first functional layer 13 and the second functional layer 14 can create at least two regions of different light transmittances in the dimming device 100. Alternatively, the combination of the first functional layer 13 and the second functional layer 14 can reduce the dark-state light transmittance of the dimming device.

[0149] Alternatively, for example, the first functional layer 13 is a dye liquid crystal functional layer, and the second functional layer 14 is a touch functional layer. The touch functional layer is electrically connected to the dye liquid crystal functional layer. This allows the light transmittance of the dye liquid crystal functional layer to be adjusted via the touch functional layer, facilitating operation. For example, light transmittance can be adjusted by swiping a finger.

[0150] Alternatively, illustratively, the first functional layer 13 is a display functional layer, and the second functional layer 14 is a dye liquid crystal functional layer. Alternatively, the first functional layer 13 is a display functional layer, and the second functional layer 14 is a touch functional layer.

[0151] The third adhesive layer 15 is used to connect the first functional layer 13 and the second functional layer 14. The material of the third adhesive layer 15 can be the same as that of the first adhesive layer 12. For example, the materials of the third adhesive layer 15 and the first adhesive layer 12 are both PVB.

[0152] Based on the above embodiment, as shown in FIG4 , during S400 (assembling the first laminated structure 10, the adhesive frame 20, and the second laminated structure 40), the first gap 2 provides space for the first functional layer 13 and the second functional layer 14 to move. If the thickness of the first adhesive layer 12 is inconsistent, the thicker portion of the first adhesive layer 12 arches in the direction from the first substrate 11 to the second substrate 41. Accordingly, the portion of the first functional layer 13 bonded to this portion arches in the direction from the first substrate 11 to the second substrate 41, and the corresponding portion of the second functional layer 14 arches in the direction from the first substrate 11 to the second substrate 41. The thinner portion of the first adhesive layer 12 is concave in the direction from the second substrate 41 to the first substrate 11. Accordingly, the portion of the first functional layer 13 bonded to this portion is concave in the direction from the second substrate 41 to the first substrate 11, and the corresponding portion of the second functional layer 14 is concave in the direction from the second substrate 41 to the first substrate 11. In this way, the stress exerted by the first adhesive layer 12 on the first functional layer 13 and the second functional layer 14 is released, which can reduce the risk of uneven stress on the first functional layer 13 and the second functional layer 14 due to inconsistency of the first adhesive layer 12.

[0153] When the thickness of the third adhesive layer 15 is inconsistent, the thicker portion of the third adhesive layer 15 arches in the direction from the first substrate 11 to the second substrate 41. Accordingly, the portion of the second functional layer 14 bonded to this portion arches in the direction from the first substrate 11 to the second substrate 41. The thinner portion of the third adhesive layer 15 is concave in the direction from the second substrate 41 to the first substrate 11. Accordingly, the portion of the second functional layer 14 bonded to this portion is concave in the direction from the second substrate 41 to the first substrate 11. In this way, the stress exerted by the third adhesive layer 15 on the first and second functional layers 13, 14 is released, reducing the risk of uneven stress on the first and second functional layers 13, 14 due to the inconsistency of the third adhesive layer 15.

[0154] In some embodiments, as shown in FIG21 , the second laminate structure includes a second substrate 41 and a fourth adhesive layer 42, which are stacked. The fourth adhesive layer 42 is located on the side of the second substrate 41 near the second adhesive layer 50. The fourth adhesive layer 42 can reduce the risk of the second substrate 41 being broken by external impacts of a certain energy or temperature fluctuations. Even if the second substrate 41 breaks, the fragments will adhere to the fourth adhesive layer 42, thereby reducing the risk of fragments of the second substrate 41 being scattered. The material of the fourth adhesive layer 42 includes EVA, PVB, or SGP.

[0155] For example, as shown in FIG21 , the orthographic projection of the fourth adhesive layer 42 on the reference surface coincides with the orthographic projection of the second substrate 41 on the reference surface, and the adhesive frame 20 abuts the fourth adhesive layer 42. Thus, the fourth adhesive layer 42 covers the second substrate 41. If the second substrate 41 is shattered by an external impact of a certain energy or a temperature change, any part of the second substrate 41 will adhere to the fourth adhesive layer 42, reducing the risk of fragments of the second substrate 41 flying everywhere.

[0156] Alternatively, as shown in FIG22 , the orthographic projection of the fourth adhesive layer 42 on the reference surface is within the orthographic projection of the second substrate 41 on the reference surface and is spaced from the boundary of the second substrate 41. The orthographic projection of the fourth adhesive layer 42 on the reference surface coincides with the orthographic projection of the second adhesive layer 50 on the reference surface. On the one hand, the abutment between the adhesive frame 20 and the second substrate 41 can reduce the risk of inconsistent spacing between the first substrate 11 and the second substrate 41 due to inconsistent adhesion of the fourth adhesive layer 42. On the other hand, the material of the fourth adhesive layer comprises PVB. Since the surface of the adhesive frame 20 formed of the PVB film is uneven, a slight gap exists between the adhesive frame 20 and the first substrate 11. During the subsequent manufacturing process, air within the expansion gap 1 between the adhesive frame 20 and the first functional layer 13 can be discharged through the slight gap between the adhesive frame 20 and the first substrate 11, thereby preventing the formation of bubbles in the dimming device 100.

[0157] In other embodiments, as shown in Figure 23, the second stacked structure 40 includes a stacked second substrate 41, a fourth adhesive layer 42, and a third functional layer 43. The third functional layer can be a dimming functional layer, a display functional layer, or a touch functional layer.

[0158] The surface of the second substrate 41 proximal to the third functional layer 43 is bonded to the plastic frame 20, defining a first gap 2 between the first laminated structure 10 and the third functional layer 43. The orthographic projection of the fourth adhesive layer 42 on the reference surface lies within the orthographic projection of the second substrate 41 on the reference surface, and is spaced from the boundary of the second substrate 41. The orthographic projection of the fourth adhesive layer 42 on the reference surface coincides with the orthographic projection of the third functional layer 43 on the reference surface. The plastic frame 20 also surrounds the third functional layer 43, reducing the risk of moisture entering the third functional layer 43.

[0159] Based on the above embodiment, between S200 (forming the plastic frame 20 on one side of the first laminated structure 10 ) and S300 (bonding the second laminated structure 40 on the side of the plastic frame 20 away from the first substrate 11 ), the preparation method further includes S301 to S302 .

[0160] As shown in FIG. 24 , S301 , pressure is applied to the second stacked structure 40 .

[0161] A small gap exists between the fourth adhesive layer 42 and the second substrate 41 in the second laminated structure 40, which can accommodate air. Applying pressure to the second laminated structure 40 can expel the air from the small gap between the fourth adhesive layer 42 and the second substrate 41, thereby increasing the bonding area between the fourth adhesive layer 42 and the second substrate 41 and ensuring a more secure connection between the second substrate 41 and the third functional layer 43 by the fourth adhesive layer 42.

[0162] S302 , assembling the second laminated structure 40 .

[0163] The fourth adhesive layer 42 bonds the second substrate 41 and the third functional layer 43. The orthographic projection of the third functional layer 43 on the reference surface coincides with the orthographic projection of the fourth adhesive layer 42 on the reference surface. Compared to the case where the orthographic projection of the third functional layer on the reference surface lies within the orthographic projection of the fourth adhesive layer on the reference surface and is spaced from the boundary of the fourth adhesive layer, in some embodiments of the present disclosure, the entire fourth adhesive layer 42 is compressed during the application of pressure to the second laminated structure 40 and the assembly of the second laminated structure 40. This ensures a consistent thickness of the fourth adhesive layer 42 and a more even stress on the third functional layer 43.

[0164] In some embodiments, the dimming device 100 is used for vehicle window glass, with the first adhesive layer 12 positioned closer to the interior of the vehicle than the second adhesive layer 50. As shown in FIG25 , the dimming device 100 further includes a first light-shielding layer 60 and a second light-shielding layer 70. The first light-shielding layer 60 is located on the side of the first substrate 11 away from the second substrate 41. The first light-shielding layer 60 is disposed along the edge of the first substrate 11. The outer boundary of the orthographic projection of the first light-shielding layer 60 on the first substrate 11 coincides with the boundary of the first substrate 11, and the inner boundary is located within the inner boundary of the orthographic projection of the plastic frame 20 on the first substrate 11. In other words, the inner boundary is located at the center of the dimming device relative to the inner boundary of the orthographic projection of the plastic frame 20 on the reference surface. Thus, the first light-shielding layer 60 covers the plastic frame 20, reducing the risk of ultraviolet light irradiating the plastic frame 20, reducing the risk of plastic frame 20 aging, and increasing the service life of the plastic frame 20.

[0165] The second light-shielding layer 70 is located on the side of the second substrate 41 closest to the first substrate 11. The second light-shielding layer 70 is arranged along the edge of the second substrate 41, and at least a portion of the second light-shielding layer 70 is located between the second substrate 41 and the frame 20. In other words, the outer boundary of the orthographic projection of the second light-shielding layer 70 on the second substrate 41 coincides with the boundary of the second substrate 41, and the inner boundary coincides with the inner boundary of the orthographic projection of the frame 20 on the reference surface, or the inner boundary is located at the center of the dimming device relative to the inner boundary of the orthographic projection of the frame 20 on the reference surface. In this way, the second light-shielding layer 70 covers the frame 20, reducing the risk of ultraviolet light irradiating the frame, reducing the risk of frame 20 aging, and increasing the service life of the frame 20. The second light-shielding layer 70 is located on the side of the second substrate 41 closest to the first substrate 11, thereby reducing the risk of scratches on the second light-shielding layer 70 by objects outside the vehicle.

[0166] When the dimming device 100 includes a first light-shielding layer 60 and a second light-shielding layer 70 , the first light-shielding layer 60 and the second light-shielding layer 70 can also reduce the risk of ultraviolet light irradiating the sealing block 80 , reduce the risk of aging of the sealing block 80 , and increase the service life of the sealing block 80 .

[0167] On the basis of the above embodiment, after S700 (sealing the first opening 21 ), the preparation method further includes S800 .

[0168] As shown in FIG. 26 , at S800 , a first light shielding layer 60 is formed.

[0169] The first light-shielding layer 60 is located on a side of the first stacked structure 10 away from the second stacked structure 40 and is disposed along the edge of the first stacked structure 10. The outer boundary of the orthographic projection of the first light-shielding layer 60 on the reference surface coincides with the boundary of the orthographic projection of the first stacked structure 10 on the reference surface, and the inner boundary of the orthographic projection of the plastic frame 20 on the reference surface is aligned with the center of the dimming device. That is, the first light-shielding layer 60 covers the plastic frame 20. In this way, the first light-shielding layer 60 can reduce the risk of ultraviolet light irradiating the plastic frame 20, reduce the risk of plastic frame 20 aging, and increase the service life of the plastic frame 20.

[0170] Before S300 (bonding the second stacked structure 40 on the side of the plastic frame 20 away from the first substrate 11 ), the preparation method further includes S900 .

[0171] As shown in FIG. 26 , at S900 , a second light shielding layer 70 is formed.

[0172] The second light-shielding layer 70 is located on the surface of the second substrate 41 and is disposed along its edge. During S300 (attaching the second laminated structure 40 to the side of the plastic frame 20 facing away from the first substrate 11), the second light-shielding layer 70 is located on the side of the second substrate 41 closest to the first functional layer 13, thereby reducing the risk of scratches on the second light-shielding layer 70 from objects outside the vehicle. At least a portion of the second light-shielding layer 70 is located between the second substrate 41 and the plastic frame 20. Specifically, the outer boundary of the orthographic projection of the second light-shielding layer 70 on the reference surface coincides with the boundary of the orthographic projection of the second laminated structure 40 on the reference surface, and the inner boundary coincides with the inner boundary of the orthographic projection of the plastic frame 20 on the reference surface, or the inner boundary is closer to the center of the dimming device than the inner boundary of the orthographic projection of the plastic frame 20 on the reference surface. In this way, the second light-shielding layer 70 covers the plastic frame 20. The second light-shielding layer 70 reduces the risk of ultraviolet light irradiating the plastic frame, reduces the risk of plastic frame 20 aging, and increases the service life of the plastic frame 20.

[0173] In some embodiments, as shown in Figures 27 and 28 , there are multiple first functional layers 13, each of which is bonded to the first adhesive layer 12. Generally, it is more difficult to prepare a larger first functional layer 13, while it is easier to prepare a smaller first functional layer 13. Therefore, when the dimming device 100 is large, using multiple smaller first functional layers 13 instead of a single larger first functional layer 13 can reduce the difficulty of manufacturing the dimming device 100. A gap exists between adjacent first functional layers 13, thereby reducing the risk of collision between the adjacent first functional layers 13. The second adhesive layer 50 is partially located within the gap between the adjacent first functional layers 13.

[0174] Exemplarily, the plurality of first functional layers 13 are arranged in an array, for example, a rectangular array, or a circular array.

[0175] In some embodiments, as shown in Figures 29 and 30, the dimming device further includes a limiting strip 90. The limiting strip 90 is located in the gap between two adjacent first functional layers 13. The limiting strip 90 is used to separate the two adjacent first functional layers 13 and reduce the risk of collision between the two adjacent first functional layers 13. A gap is provided between the limiting strip 90 and the second laminated structure 40. Thus, when liquid glue is injected into the dimming device 100, the liquid glue passes through the gap between the limiting strip 90 and the second laminated structure 40 and can fill the first gap between each first functional layer 13 and the second laminated structure 40.

[0176] Exemplarily, the surface of the limiting strip 90 away from the first substrate 11 is higher than the surface of the first functional layer 13 away from the first substrate. Alternatively, exemplary, the surface of the limiting strip 90 away from the first substrate 11 is approximately flush with the surface of the first functional layer 13 away from the first substrate. Alternatively, exemplary, the surface of the limiting strip 90 away from the first substrate 11 is lower than the surface of the first functional layer 13 away from the first substrate. When the surface of the limiting strip 90 away from the first substrate 11 is lower than the surface of the first functional layer 13 away from the first substrate, the second adhesive layer 50 is partially located within the gap between two adjacent first functional layers 13.

[0177] In other embodiments, as shown in Figures 31 and 32, the dimming device further includes a limiting strip 90. The limiting strip 90 is located in the gap between two adjacent first functional layers 13. The limiting strip 90 is used to separate the two adjacent first functional layers 13 and reduce the risk of collision between the two adjacent first functional layers 13. The limiting strip 90 contacts the second laminate structure 40. Thus, the limiting strip 90 can reduce the risk of moisture within the first functional layer 13 entering the adjacent first functional layer 13. The limiting strip 90 has multiple third openings 91, with at least one third opening 91 between two adjacent first functional layers 13. Thus, when liquid glue is injected into the dimming device 100, the liquid glue can flow through the third openings 91 into the first gap between each first functional layer 13 and the second laminate structure 40, thereby filling the first gap. The liquid glue also fills the third openings 91, causing the second adhesive layer 50 to be partially located within the third openings 91.

[0178] In some embodiments, the embodiments of the present disclosure further provide a dimming structure, the dimming structure including a dimming device 100, and the dimming structure includes one of a skylight, a curtain wall, a rail vehicle, a car, and a billboard.

[0179] The dimming device 100 can be used in the construction industry. For example, it can be used in skylights or curtain walls, or in partition glass. Compared to the use of brick walls to separate rooms in the construction industry, the light device 100 in the disclosed embodiments is thinner, thus saving space. It is also possible to display a company logo on the partition glass. In this case, the dimming structure including the dimming device 100 can be, for example, a skylight, curtain wall, or the like.

[0180] The dimming device 100 can also be used in the transportation field. For example, the dimming device 100 can be used in rail vehicles or automobiles. Rail vehicles can include subways, light rails, aerial rail trains, trams, and maglev trains, and the embodiments of the present disclosure do not list them one by one. Automobiles can include passenger cars, commercial vehicles, trucks, or buses, and the embodiments of the present disclosure do not list them one by one. In this case, the dimming structure including the dimming device 100 can be, for example, a rail vehicle, automobile, etc.

[0181] The present disclosure uses a dimming device 1000 as an example. As shown in FIG33 , vehicle 1000 includes a vehicle body 1010 and a window glass 1020 mounted on vehicle body 1010. Window glass 1020 can be one or more of the vehicle's front window, sunroof, rear window, or side window. Window glass 1020 includes a dimming device 100 according to any of the aforementioned embodiments. Dimming device 100 can also be used on the central control touchscreen in vehicle 1000.

[0182] The dimming device 100 may also be applied in the field of advertising. For example, the dimming device 100 may be applied in billboards.

[0183] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0184] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A method for preparing a dimming device, comprising: forming a first stacked structure; The first laminated structure comprises a first substrate, a first adhesive layer and a first functional layer which are stacked; forming a glue frame on one side of the first stacked structure; The plastic frame is located on a side of the first substrate close to the first functional layer and surrounds the first functional layer; the plastic frame has at least one first opening; A second stacked structure is attached to a side of the plastic frame away from the first substrate; a first gap is formed between the second stacked structure and the first stacked structure; wherein the first opening is connected to the first gap; Laminating the first laminated structure, the adhesive frame and the second laminated structure, so that the first adhesive layer bonds the first substrate and the first functional layer, and the adhesive frame bonds the first laminated structure and the second laminated structure; injecting liquid glue into the first gap through the at least one first opening; The liquid adhesive is cured to form a second adhesive layer; the second adhesive layer bonds the first laminated structure to the second laminated structure.

2. The preparation method according to claim 1, wherein the orthographic projection of the first adhesive layer on the reference surface is located within the range of the orthographic projection of the first substrate on the reference surface and is spaced from the boundary of the first substrate, the orthographic projection of the first adhesive layer on the reference surface coincides with the orthographic projection of the first functional layer on the reference surface, and the thickness of the adhesive frame along the direction perpendicular to the first substrate is greater than the sum of the thickness of the first adhesive layer and the thickness of the first functional layer; wherein, The reference surface is parallel to a surface of the first substrate close to the first functional layer; Wherein, between forming the first stacked structure and forming a glue frame on one side of the first stacked structure, the preparation method further includes: Applying a force to the first stacked structure to remove air between the first adhesive layer and the first substrate; The first laminated structure is laminated so that the first adhesive layer bonds the first substrate and the first functional layer.

3. The preparation method according to claim 1, wherein The orthographic projection of the first adhesive layer on the reference plane coincides with the orthographic projection of the first substrate on the reference plane, the orthographic projection of the first functional layer on the reference plane is located within the range of the orthographic projection of the first adhesive layer on the reference plane, and is spaced apart from a boundary of the first adhesive layer, and along a direction perpendicular to the first substrate, the thickness of the adhesive frame is greater than the thickness of the first functional layer; wherein the reference plane is parallel to a surface of the first substrate close to the first functional layer.

4. The preparation method according to any one of claims 1 to 3, wherein The first stacked structure further includes a second functional layer and a third adhesive layer, the second functional layer is located on a side of the first functional layer away from the first substrate, and the third adhesive layer is located between the first functional layer and the second functional layer.

5. The preparation method according to any one of claims 1 to 4, wherein The second laminated structure comprises a second substrate, a fourth adhesive layer and a third functional layer which are stacked, the orthographic projection of the fourth adhesive layer on the reference surface is located within the range of the orthographic projection of the second substrate on the reference surface, and is spaced from the boundary of the second substrate, and the orthographic projection of the fourth adhesive layer on the reference surface coincides with the orthographic projection of the third functional layer on the reference surface; wherein the reference surface is parallel to the surface of the first substrate close to the first functional layer; Between forming a glue frame on one side of the first stacked structure and attaching the second stacked structure to a side of the glue frame away from the first substrate, the preparation method further includes: applying pressure to the second laminate structure to remove air between the fourth adhesive layer and the second substrate; The second laminated structure is laminated so that the fourth adhesive layer bonds the second substrate and the third functional layer.

6. A dimming device, comprising: A first laminated structure comprises a first substrate, a first adhesive layer and a first functional layer which are stacked; A second laminate structure is located on a side of the first substrate close to the first adhesive layer, the second laminate comprising a second substrate; a second adhesive layer, located between the first laminated structure and the second laminated structure, and configured to bond the first laminated structure and the second laminated structure; a glue frame, located between the first substrate and the second substrate and surrounding the first functional layer and the second adhesive layer, the glue frame having at least one first opening, the projection of the first opening along a first direction at least partially overlapping with the projection of the second adhesive layer along the first direction; wherein the first direction is perpendicular to the side of the glue frame where the first opening is located; The sealing block is located in the first opening and seals the first opening.

7. The dimming device according to claim 6, wherein: The thickness of the first adhesive layer is M×d1, and the thickness of the adhesive frame is N×d2; wherein M and N are both positive integers less than 6, and N is greater than M; d1 and d2 are 0.3 mm to 0.5 mm, and d1 is less than or equal to d2.

8. The dimming device according to claim 7, wherein: The thickness of the first functional layer is d3, and d3 is less than or equal to 1.1 mm; The thickness of the second adhesive layer is N×d2-M×d1-d3.

9. The dimming device according to any one of claims 6 to 8, wherein: The material of the adhesive frame is the same as that of the first adhesive layer, and different from that of the sealing block; and the material of the first adhesive layer is different from that of the second adhesive layer.

10. The dimming device according to any one of claims 6 to 9, wherein: The orthographic projection of the first adhesive layer on the reference surface is located within the range of the orthographic projection of the first substrate on the reference surface and is spaced apart from the boundary of the first substrate. The orthographic projection of the first adhesive layer on the reference surface coincides with the orthographic projection of the first functional layer on the reference surface, and the adhesive frame abuts against the first substrate; wherein the reference surface is parallel to a surface of the first substrate close to the first functional layer.

11. The dimming device according to any one of claims 6 to 9, wherein: The orthographic projection of the first adhesive layer on the reference surface coincides with the orthographic projection of the first substrate on the reference surface, the orthographic projection of the first functional layer on the reference surface is located within the range of the orthographic projection of the first adhesive layer on the reference surface, and is spaced apart from the boundary of the first adhesive layer, and the adhesive frame abuts against the first adhesive layer; wherein the reference surface is parallel to the surface of the first substrate close to the first functional layer.

12. The dimming device according to any one of claims 6 to 11, wherein: The first functional layer is a dimming functional layer, the dimming functional layer is configured to adjust light transmittance, and the material of the first adhesive layer is PVB or SGP; or The first functional layer is a display functional layer, and the display functional layer is configured to display an image. The material of the first adhesive layer is OCA, OCR or EVA.

13. The dimming device according to any one of claims 6 to 12, wherein: The first stacked structure further comprises: a second functional layer, located on a side of the first functional layer away from the first substrate; The third adhesive layer is located between the first functional layer and the second functional layer, and is configured to bond the first functional layer and the second functional layer.

14. The dimming device according to any one of claims 6 to 13, wherein: The second stacked structure further comprises: The fourth adhesive layer is located on a side of the second substrate close to the second adhesive layer.

15. The dimming device according to claim 14, wherein: The orthographic projection of the fourth adhesive layer on the reference surface coincides with the orthographic projection of the second substrate on the reference surface, and the adhesive frame abuts against the fourth adhesive layer; wherein the reference surface is parallel to the surface of the first substrate close to the first functional layer.

16. The dimming device according to claim 14, wherein: The orthographic projection of the fourth adhesive layer on the reference surface is located within the range of the orthographic projection of the second substrate on the reference surface and is spaced apart from the boundary of the second substrate. The orthographic projection of the fourth adhesive layer on the reference surface coincides with the orthographic projection of the second adhesive layer on the reference surface, and the adhesive frame abuts against the second substrate; wherein the reference surface is parallel to the surface of the first substrate close to the first functional layer.

17. The dimming device according to claim 16, wherein: The second stacked structure further comprises: The third functional layer is located on a side of the fourth adhesive layer away from the second substrate, and the adhesive frame also surrounds the third functional layer.

18. The dimming device according to any one of claims 6 to 17, further comprising: A first light shielding layer is located on a side of the first substrate away from the second substrate and is arranged along an edge of the first substrate, wherein an outer boundary of an orthographic projection of the first light shielding layer on the first substrate coincides with a boundary of the first substrate, and an inner boundary of the first light shielding layer is located within an inner boundary of an orthographic projection of the rubber frame on the first substrate; The second light shielding layer is located on a side of the second substrate close to the first substrate and is arranged along an edge of the second substrate. The second light shielding layer is at least partially located between the second substrate and the glue frame.

19. The dimming device according to any one of claims 6 to 18, wherein: The first functional layer includes a flexible circuit board, and the flexible circuit board and the first opening are located on the same side of the plastic frame.

20. The dimming device according to any one of claims 6 to 19, wherein: There are a plurality of first functional layers, and the plurality of first functional layers are all bonded to the first adhesive layer, and there is a gap between two adjacent first functional layers.

21. The dimming device according to any one of claims 6 to 19, further comprising: The limiting strip is located in the interval between two adjacent first functional layers, and there is an interval between the limiting strip and the second stacked structure.

22. The dimming device according to any one of claims 6 to 19, further comprising: a limiting bar, located in a gap between two adjacent first functional layers, the limiting bar being in contact with the second laminated structure; The limiting strip has a plurality of third openings, and at least one third opening is included between two adjacent first functional layers.

23. The dimming device according to any one of claims 6 to 22, wherein along the second direction, the size of the first opening is less than or equal to half of the size of the first substrate; The second direction is parallel to the side surface of the plastic frame where the first opening is located.

24. A dimming structure, comprising the dimming device according to any one of claims 6 to 23; the dimming structure comprises one of a curtain wall, a skylight, a rail transportation vehicle and a passenger car.

Images