Optical module

Abstract

An optical module (200), the optical module (200) comprising: a circuit board (300), a surface of which is provided with an optical transmitting chip (310) and an optical receiving chip (320); and a lens assembly (400), wherein the bottom of the lens assembly (400) is connected to the circuit board (300) and the lens assembly (400) covers the optical transmitting chip (310) and the optical receiving chip (320); the lens assembly (400) comprises a lens assembly body (430), a first optical fiber adapter (410) and a second optical fiber adapter (420); the first optical fiber adapter (410) and the second optical fiber adapter (420) are arranged at a first end of the lens assembly body (430), the first optical fiber adapter (410) is configured to transmit an emitted-light signal, and the second optical fiber adapter (420) is configured to transmit a received-light signal; the distance between the center of the optical transmitting chip (310) and the center of the optical receiving chip (320) in a direction perpendicular to the optical axis of the first optical fiber adapter (410) and the optical axis of the second optical fiber adapter (420) is less than the distance between the optical axis of the first optical fiber adapter (410) and the optical axis of the second optical fiber adapter (420); and the lens assembly body (430) is provided with a first optical face (4311), a second optical face (4321), a third optical face (4331) and a fourth optical face (4341).

Description

optical modules

[0001] This application claims the priority of application number 202310790220.8 filed with the China Patent Office on June 30, 2023; the priority of application number 202310791657.3 filed with the China Patent Office on June 30, 2023; and the priority of application number 202321691824.9 filed with the China Patent Office on June 30, 2023; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. Within optical communication technology, optical modules are tools for converting optical and electrical signals. They are key components in optical communication equipment and occupy a central position in optical communications. Currently, optical module packaging options include coaxial (Transistor-Outline, TO) and chip-on-board (COB) packaging.

[0004] In the optical module with COB packaging structure, the optical transmitter chip and the optical receiver chip are directly mounted on the circuit board, and a lens assembly is arranged above the optical transmitter chip and the optical receiver chip to change the transmission direction of the optical signal transmitted by the optical transmitter chip and the transmission direction of the optical signal to be received by the optical receiver chip through the lens assembly, thereby realizing the optical module to transmit and receive optical signals.

[0005] Summary of the Invention

[0006] The optical module provided by the present disclosure includes:

[0007] A circuit board, with a light emitting chip and a light receiving chip arranged on its surface;

[0008] A lens assembly, the bottom of which is connected to the circuit board and covers the light emitting chip and the light receiving chip; wherein:

[0009] The lens assembly includes a lens assembly body, a first fiber optic adapter, and a second fiber optic adapter; the first fiber optic adapter and the second fiber optic adapter are arranged at a first end of the lens assembly body, the first fiber optic adapter is configured to transmit a transmitted optical signal, and the second fiber optic adapter is configured to transmit a received optical signal;

[0010] The distance between the center of the light emitting chip and the center of the light receiving chip in a direction perpendicular to the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter is smaller than the distance between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter;

[0011] A first optical surface, a second optical surface, a third optical surface and a fourth optical surface are formed on the lens assembly body; the first optical surface faces the first optical fiber adapter, the second optical surface faces the first optical surface and the light emitting chip, and the second optical surface is located above the light emitting chip and between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter; the third optical surface faces the second optical fiber adapter, the fourth optical surface faces the third optical surface and the light receiving chip, and the light receiving chip is located below the fourth optical surface and between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0013] FIG1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0014] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0015] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0016] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0017] FIG5 is a schematic diagram of an assembly of a lens assembly and a circuit board according to some embodiments of the present disclosure;

[0018] FIG6 is a schematic diagram of a partial structure of a circuit board provided according to some embodiments of the present disclosure;

[0019] FIG7 is an exploded schematic diagram of a lens assembly and a circuit board according to some embodiments of the present disclosure;

[0020] FIG8 is a first structural diagram of a lens assembly according to some embodiments of the present disclosure;

[0021] FIG9 is a second structural schematic diagram of a lens assembly according to some embodiments of the present disclosure;

[0022] FIG10 is a third structural diagram of a lens assembly according to some embodiments of the present disclosure;

[0023] FIG11 is a fourth structural diagram of a lens assembly according to some embodiments of the present disclosure;

[0024] FIG12 is a first cross-sectional view of a lens assembly according to some embodiments of the present disclosure;

[0025] FIG13 is a second cross-sectional view of a lens assembly according to some embodiments of the present disclosure;

[0026] FIG14 is a schematic diagram of a partial structure of a lens assembly body according to some embodiments of the present disclosure;

[0027] FIG15 is a first cross-sectional view of a lens assembly in use according to some embodiments of the present disclosure;

[0028] FIG16 is a second cross-sectional view of a lens assembly in use according to some embodiments of the present disclosure;

[0029] FIG17 is a first cross-sectional view of another lens assembly in use according to some embodiments of the present disclosure;

[0030] FIG18 is a second cross-sectional view of another lens assembly in use according to some embodiments of the present disclosure;

[0031] FIG19 is a cross-sectional view of a lens assembly according to some embodiments of the present disclosure;

[0032] FIG20 is a first cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure;

[0033] FIG21 is a second cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure;

[0034] FIG22 is a perspective view of yet another lens assembly according to some embodiments of the present disclosure;

[0035] FIG23 is a second perspective view of yet another lens assembly provided according to some embodiments of the present disclosure;

[0036] FIG24 is a first cross-sectional view of yet another lens assembly according to some examples of the present disclosure;

[0037] FIG25 is a third perspective view of yet another lens assembly according to some embodiments of the present disclosure;

[0038] FIG26 is a partial enlarged view of point O in FIG25;

[0039] FIG27 is a second cross-sectional view of yet another lens assembly according to some embodiments of the present disclosure;

[0040] FIG28 is a partial enlarged view of point P in FIG27;

[0041] FIG29 is a third cross-sectional view of yet another lens assembly according to some embodiments of the present disclosure;

[0042] FIG30 is a fourth cross-sectional view of yet another lens assembly according to some embodiments of the present disclosure;

[0043] FIG31 is a fifth cross-sectional view of yet another lens assembly according to some embodiments of the present disclosure;

[0044] FIG32 is a bottom view 1 of yet another lens assembly in use according to some embodiments of the present disclosure;

[0045] Figure 33 is a second bottom view of another lens assembly in use according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0046] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0047] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0048] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0049] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0050] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0051] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0052] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0053] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0054] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0055] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0056] Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0057] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0058] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0059] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0060] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0061] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0062] Figure 2 is a partial structural diagram of a host computer according to some embodiments. To clearly illustrate the connection between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has raised structures such as fins to increase the heat dissipation area.

[0063] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0064] Figure 3 is a structural diagram of an optical module according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, and a lens assembly 400.

[0065] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 203 and 204 . The outer contour of the housing is generally a square.

[0066] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0067] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0068] The direction of the line connecting the two openings 203 and 204 can be consistent with the length of the optical module 200, or it can be inconsistent with the length of the optical module 200. For example, opening 203 is located at the end of the optical module 200 (the left end in Figure 3), and opening 204 is also located at the end of the optical module 200 (the right end in Figure 3). Alternatively, opening 203 is located at the end of the optical module 200, while opening 204 is located on the side of the optical module 200. Opening 203 is an electrical port, from which the gold finger of the circuit board 300 extends and is inserted into the host computer (for example, the optical network terminal 100); opening 204 is an optical port, configured to receive the optical fiber 101, so that the optical fiber 101 is connected to the optical module 200.

[0069] The combined assembly of the upper housing 201 and the lower housing 202 facilitates the installation of components such as the circuit board 300 and the lens assembly 400 into the housing, with the upper housing 201 and the lower housing 202 providing encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300 and the lens assembly 400, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0070] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0071] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0072] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0073] The circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips together according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, lasers, photodetectors, microcontroller units (MCUs), laser driver chips, limiting amplifiers (LAs), clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0074] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0075] The circuit board 300 also includes a gold finger formed on the surface of its end, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0076] In some embodiments, the lens assembly 400 is connected to the circuit board 300 and positioned above the optical transmitter chip and / or optical receiver chip. The lens assembly 400 includes a transmissive surface and a reflective surface. The transmissive and reflective surfaces are combined to adjust the transmission direction of the transmitted and / or received optical signals, allowing the transmitted optical signals generated by the optical transmitter chip to be output from the optical module and the optical signals input to the optical module to be transmitted to the optical receiver chip. The optical transmitter chip can be, for example, a laser, and the optical receiver chip can be, for example, a photodetector. The area below the lens assembly 400 is not limited to being the optical transmitter chip and / or the optical receiver chip; optoelectronic monitoring components, driver chips, and the like can also be located.

[0077] In some embodiments, the optical module 200 includes a lens assembly 400. The lens assembly 400 covers the optical transmitter chip and the optical receiver chip to adjust the transmission direction of the transmitted and received optical signals. Of course, in some embodiments, the number of lens assemblies 400 in the optical module 200 is not limited to one. Two lens assemblies 400 may be included, each with a light transmitter chip and / or a light receiver chip disposed below it.

[0078] In some embodiments, the lens assembly 400 is disposed at the end of the circuit board 300, such as near the light port; however, some embodiments of the present disclosure are not limited to disposing the lens assembly 400 at the end of the circuit board 300, and the lens assembly 400 can also be disposed in the middle of the circuit board 300.

[0079] FIG5 is a schematic diagram illustrating the assembly of a lens assembly and a circuit board according to some embodiments of the present disclosure. In some embodiments, as shown in FIG5 , the lens assembly 400 includes a first fiber optic adapter 410, a second fiber optic adapter 420, and a lens assembly body 430. The first fiber optic adapter 410 is connected to one side of the first end of the lens assembly body 430, and the second fiber optic adapter 420 is connected to the other side of the first end of the lens assembly body 430. In other words, the first fiber optic adapter 410 and the second fiber optic adapter 420 are arranged side by side at the first end of the lens assembly body 430. The first fiber optic adapter 410 and the second fiber optic adapter 420 are each configured to connect to the optical fiber 101 to transmit a transmitted optical signal to the optical fiber 101 or to transmit a received optical signal to the lens assembly body 430. For example, the first fiber optic adapter 410 is configured to transmit a transmitted optical signal to the optical fiber 101, and the second fiber optic adapter 420 is configured to transmit a received optical signal to the optical fiber 101. In some embodiments, one fiber optic adapter is provided on the lens assembly 400, and two lens assemblies 400 are provided within the optical module 200.

[0080] In some embodiments, the distance between the optical axis of the first fiber optic adapter 410 and the optical axis of the second fiber optic adapter 420 is a preset value, such as a distance L between the optical axis of the first fiber optic adapter 410 and the optical axis of the second fiber optic adapter 420 of 6.25 mm. Even if two lens assemblies 400 are provided in the optical module 200, the distance between the optical axes of the fiber optic adapters on the two lens assemblies 400 should also be a fixed value.

[0081] FIG6 is a schematic diagram of a partial structure of a circuit board provided according to some embodiments of the present disclosure. In some embodiments, as shown in FIG6 , a light emitting chip 310 and a light receiving chip 320 are provided on the top surface of the circuit board 300. The center of the light emitting chip 310 is located on the straight line projected by the optical axis of the first optical fiber adapter 410 on the top surface of the circuit board 300, and the center of the light receiving chip 320 is located on the straight line projected by the optical axis of the second optical fiber adapter 420 on the top surface of the circuit board 300. The distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 is set to a preset value. It should be noted that the center of the light emitting chip 310 mainly refers to the center of the effective light emitting surface, and the center of the light receiving chip 320 mainly refers to the center of the effective detection surface.

[0082] In some embodiments, the optical transmitter chip 310 and the optical receiver chip 320 need to share a driver chip, and the length of the driver chip is less than the spacing L. In order to ensure the performance of signal transmission, the bonding wires between the optical transmitter chip 310 and the driver chip and the bonding wires between the optical receiver chip 320 and the driver chip cannot be too long, for example, they need to be controlled within 0.1 mm, etc. Therefore, the distance between the center of the optical transmitter chip 310 and the center of the optical receiver chip 320 needs to be less than the spacing L.

[0083] In some embodiments, even if the light emitting chip 310 and the light receiving chip 320 do not share a common driver chip, in order to facilitate the layout of other devices, it is necessary to reduce the distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 to less than the spacing L. In order to ensure that the distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 is less than the spacing L, a lens assembly is provided in an embodiment of the present application.

[0084] FIG7 is a schematic diagram of an exploded view of a lens assembly and a circuit board provided according to some embodiments of the present disclosure. As shown in FIG7 , a light emitting chip 310 and a light receiving chip 320 are provided on the circuit board 300. The distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 is less than the spacing L. The lens assembly 400 is provided above the light emitting chip 310 and the light receiving chip 320. Exemplarily, the bottom of the lens assembly 400 is connected to the circuit board 300, and the bottom of the lens assembly 400 and the surface of the circuit board 300 form a receiving cavity, and the light emitting chip 310 and the light receiving chip 320 are located in the receiving cavity. The lens assembly 400 can not only adjust the transmission direction of the light emitting chip 310 emitting the light signal and the light receiving chip 320 receiving the light signal, but also protect the light emitting chip 310 and the light receiving chip 320.

[0085] In some embodiments, the optical axis of the first optical fiber adapter 410 is projected onto the circuit board 300 as a straight line M, the optical axis of the second optical fiber adapter 420 is projected onto the circuit board 300 as a straight line N, the distance between the straight lines M and N is L, and the optical transmitter chip 310 and the optical receiver chip 320 are located between the straight lines M and N. Of course, in some embodiments, the center of the optical transmitter chip 310 is located on the straight line M or the center of the optical receiver chip 320 is located on the straight line N.

[0086] In some embodiments, a driver chip 330 is further provided on the circuit board 300. The driver chip 330 is disposed in a receiving cavity formed by the bottom of the lens assembly 400 and the circuit board 300. The driver chip 330 is located on a side of the light emitting chip 310 and the light receiving chip 320 that is away from the optical port of the optical module 200. Exemplarily, the driver chip 330 is disposed on a side of the light emitting chip 310 and the light receiving chip 320 that is away from the optical port. The driver chip 330 is electrically connected to the light emitting chip 310 and the light receiving chip 320, respectively. That is, the light emitting chip 310 and the light receiving chip 320 share the driver chip 330. Of course, in some embodiments, two driver chips are provided on the circuit board, one driver chip being wired to the light emitting chip 310, and the other driver chip being wired to the light receiving chip 320.

[0087] Figure 8 is a schematic diagram of the structure of a lens assembly according to some embodiments of the present disclosure, and Figure 9 is a schematic diagram of the structure of a lens assembly according to some embodiments of the present disclosure. As shown in Figures 8 and 9, in some embodiments, the lens assembly 400 includes a first fiber optic adapter 410, a second fiber optic adapter 420, and a lens assembly body 430. The lens assembly body 430 is formed with multiple optical surfaces, which are used to transmit or reflect light signals. The first end of the lens assembly body 430 is adjacent to the optical port of the optical module 200, and the second end of the lens assembly body 430 is adjacent to the electrical port of the optical module 200.

[0088] In some embodiments, the lens assembly 400 is a transparent plastic part that is integrally injection molded.

[0089] The first fiber optic adapter 410 is connected to one side of the first end of the lens assembly body 430, and the second fiber optic adapter 420 is connected to the other side of the first end of the lens assembly body 430. That is, the first fiber optic adapter 410 and the second fiber optic adapter 420 are arranged side by side at the first end of the lens assembly body 430. The first fiber optic adapter 410 and the second fiber optic adapter 420 have hollow structures and are configured to connect to the optical fiber 101 to transmit optical signals.

[0090] In some embodiments, the first fiber optic adapter 410 and the second fiber optic adapter 420 are respectively provided with fiber optic ferrules therein, and the fiber optic ferrules are used to improve the coupling efficiency of the optical signal between the optical fiber 101 and the lens assembly body 430 .

[0091] As shown in FIG8 , in some embodiments, a first recess 440 is formed on the top of the lens assembly body 430, and a plurality of optical surfaces are formed at the bottom of the first recess 440. Exemplarily, the first recess 440 is formed by recessing the top of the lens assembly body 430 toward the bottom of the lens assembly body 430. The first recess 440 is formed on the lens assembly body 430, and the bottom of the first recess 440 forms the optical surface. This facilitates adjustment of the thickness of the lens assembly body 430 at locations where the optical surfaces are located, thereby facilitating machining of the optical surfaces.

[0092] As shown in Figure 9, in some embodiments, a second recess 450 is formed at the bottom of the lens assembly body 430. The second recess 450 forms a receiving cavity with the surface of the circuit board 300, facilitating the placement of the light emitting chip 310 and the light receiving chip 320 below the lens assembly 400. Exemplarily, the second recess 450 is formed by the bottom surface of the lens assembly body 430 being recessed toward the top of the lens assembly body 430. In some embodiments, an optical surface is also formed on the top surface of the second recess 450, which is primarily used to transmit optical signals, such as focusing optical signals.

[0093] Figure 10 is a third schematic diagram of the structure of a lens assembly according to some embodiments of the present disclosure, and Figure 11 is a fourth schematic diagram of the structure of a lens assembly according to some embodiments of the present disclosure. As shown in Figures 10 and 11, a first groove 431 is formed at the top of the lens assembly body 430, and a first optical surface 4311 is formed on the sidewall of the first groove 431. The first optical surface 4311 is located in the extension direction of the first fiber optic adapter 410. The first optical surface 4311 is used to reflect the transmitted light signal, changing the transmission direction of the transmitted light signal.

[0094] In some embodiments, the projection of the first optical surface 4311 along the extension direction of the first optical fiber adapter 410 covers the end face of the optical fiber ferrule in the first optical fiber adapter 410. Exemplarily, the first optical surface 4311 changes the transmission direction of the transmitted optical signal from the AB direction to the CD direction. In some embodiments, a reflective film is provided on the first optical surface 4311 to improve the reflection efficiency of the transmitted optical signal by the first optical surface 4311.

[0095] In some embodiments, the AB direction of the lens assembly 400 is the width direction of the lens assembly 400, the CD direction of the lens assembly 400 is the length direction of the lens assembly 400, and the EF direction of the lens assembly 400 is the height direction of the lens assembly 400. Exemplarily, the width direction of the lens assembly 400 is parallel to the width direction of the circuit board 300, the length direction of the lens assembly 400 is parallel to the length direction of the circuit board 300, and the height direction of the lens assembly 400 is perpendicular to the top surface of the circuit board 300, thereby changing the transmission direction of the transmitted light signal in the width and length directions of the circuit board 300.

[0096] As shown in Figures 10 and 11, a second groove 432 is formed at the top of the lens assembly body 430. This groove 432 is located between the optical axis of the first fiber optic adapter 410 and the optical axis of the second fiber optic adapter 420. A second optical surface 4321 is formed at the bottom of the second groove 432. This second optical surface 4321 is used to reflect the transmitted light signal, thereby changing its transmission direction. The second optical surface 4321 is located above the light emitting chip 310 and changes the direction of the light signal generated by the light emitting chip 310. In some embodiments, the projection of the second optical surface 4321 toward the circuit board 300 covers the light emitting chip 310. In some embodiments, a reflective film is provided on the second optical surface 4321 to improve its reflection efficiency.

[0097] In some embodiments of the present disclosure, the first optical surface 4311 and the second optical surface 4321 are combined so that the light emitting chip 310 is arranged between the projection of the optical axis of the first optical fiber adapter 410 on the circuit board 300 and the projection of the optical axis of the second optical fiber adapter 420 on the circuit board 300. Therefore, even if the center of the light emitting chip 310 is not on the straight line M, the emission light signal generated by the light emitting chip 310 can be transmitted through the first optical fiber adapter 410.

[0098] As shown in Figures 10 and 11 , a third groove 433 is formed at the top of the lens assembly body 430, and a third optical surface 4331 is formed on the sidewall of the third groove 433. The third optical surface 4331 is located in the extension direction of the second optical fiber adapter 420. The third optical surface 4331 is used to reflect the received optical signal and change the transmission direction of the received optical signal.

[0099] In some embodiments, the projection of the third optical surface 4331 along the extension direction of the second optical fiber adapter 420 covers the end face of the optical fiber ferrule in the second optical fiber adapter 420. Exemplarily, the third optical surface 4331 changes the transmission direction of the received optical signal from the CD direction to the AB direction. That is, the third optical surface 4331 changes the transmission direction of the transmitted optical signal along the length and width of the circuit board 300. In some embodiments, a reflective film is provided on the third optical surface 4331 to improve the reflection efficiency of the received optical signal by the third optical surface 4331.

[0100] As shown in Figures 10 and 11 , a fourth groove 434 is formed on the top of the lens assembly body 430. This groove 434 is located between the optical axis of the first fiber optic adapter 410 and the optical axis of the second fiber optic adapter 420. A fourth optical surface 4341 is formed on the sidewall of the fourth groove 434. This surface is used to reflect the received optical signal, thereby changing its transmission direction. The fourth optical surface 4341 is located above the optical receiving chip 320 and reflects the received optical signal back to the optical receiving chip 320. In some embodiments, the projection of the fourth optical surface 4341 toward the circuit board 300 covers the optical receiving chip 320. In some embodiments, a reflective film is provided on the fourth optical surface 4341 to improve its reflection efficiency of the received optical signal.

[0101] In some embodiments of the present disclosure, the third optical surface 4331 and the fourth optical surface 4341 are combined so that the optical receiving chip 320 is arranged between the projection of the optical axis of the first optical fiber adapter 410 on the circuit board 300 and the projection of the optical axis of the second optical fiber adapter 420 on the circuit board 300. Therefore, even if the center of the optical receiving chip 320 is not on the straight line N, the received optical signal input through the second optical fiber adapter 420 can be transmitted to the optical receiving chip 320.

[0102] In some embodiments, a fifth optical surface 4322 is further formed at the bottom of the second groove 432, and the fifth optical surface 4322 can both transmit and reflect the transmitted light signal. The transmitted light signal transmitted by the fifth optical surface 4322 is transmitted in the direction of the first optical surface 4311, and the light signal reflected by the fifth optical surface 4322 is used to monitor the transmitted light power of the optical module. In some embodiments, the second optical surface 4321 and the fifth optical surface 4322 intersect within the second groove 432. Exemplarily, a backlight detection chip is provided on the circuit board 300, and the lens assembly 400 is located above the backlight detection chip. The backlight detection chip receives the light signal reflected by the fifth optical surface 4322 to monitor the transmitted light power of the optical module.

[0103] In some embodiments, a sixth optical surface 4323 is further formed on the sidewall of the second groove 432 . The sixth optical surface 4323 is configured to transmit the emission light signal transmitted through the fifth optical surface 4322 to transmit the emission light signal toward the first optical surface 4311 .

[0104] In some embodiments of the present disclosure, by opening a first groove 431, a second groove 432, a third groove 433 and a fourth groove 434 on the lens assembly body 430, it is convenient to control the thickness of each position of the lens assembly body 430, so as to facilitate the molding of the corresponding optical surface and make the optical surface easy to process.

[0105] Figure 12 is a cross-sectional view of a lens assembly according to some embodiments of the present disclosure. As shown in Figure 12 , a first fiber optic adapter 410 is provided with a first through hole 411, within which a first fiber optic ferrule 460 is disposed. First fiber optic ferrule 460 is used to couple optical signals from the lens assembly body 430 into the optical fiber 101, thereby improving the coupling efficiency of the transmitted optical signal into the optical fiber 101.

[0106] In some embodiments, a first blind hole 435 is further provided on the lens assembly body 430, one end of the first blind hole 435 is connected to the first through hole 411, and a first lens 4351 is provided at the other end of the first blind hole 435. The first lens 4351 is used to converge the transmitted light signal reflected by the first optical surface 4311 to the end face of the first optical fiber ferrule 460.

[0107] In some embodiments, the end face of the first optical fiber ferrule 460 is an inclined surface, and the inclination angle of the end face of the first optical fiber ferrule 460 is 4-7 degrees, which reduces the optical signal reflected by the end face of the first optical fiber ferrule 460 from returning along the transmission optical path of the transmitted optical signal.

[0108] Figure 13 is a second cross-sectional view of a lens assembly according to some embodiments of the present disclosure. As shown in Figure 13 , the second fiber optic adapter 420 is provided with a second through hole 421, within which a second fiber optic ferrule 470 is disposed. Second fiber optic ferrule 470 is used to couple optical signals from optical fiber 101 into the lens assembly body 430, thereby improving the coupling efficiency of received optical signals into the lens assembly body 430.

[0109] In some embodiments, a second blind hole 436 is further provided on the lens assembly body 430, one end of the second blind hole 436 is connected to the second through hole 421, and a second lens 4361 is provided at the other end of the second blind hole 436. The second lens 4361 is used to collimate the received light signal output through the end face of the second optical fiber ferrule 470 to the third optical surface 4331.

[0110] In some embodiments, the end face of the second optical fiber ferrule 470 is an inclined surface, and the inclination angle of the end face of the second optical fiber ferrule 470 is 4-7°, which reduces the received light signal reflected by the third optical surface 4331 from being reflected again by the end face of the second optical fiber ferrule 470 back into the transmission optical path of the received light signal.

[0111] Figure 14 is a schematic diagram of a partial structure of a lens assembly according to some embodiments of the present disclosure, and Figure 15 is a first cross-sectional view of a lens assembly in use according to some embodiments of the present disclosure. The optical transmitter chip 310 and the optical receiver chip 320 are positioned between the projection of the optical axis of the first fiber optic adapter 410 on the circuit board 300 and the projection of the optical axis of the second fiber optic adapter 420 on the circuit board 300.

[0112] As shown in Figures 14 and 15 , a seventh optical surface 451 and an eighth optical surface 452 are provided on the top surface of the second recess 450. The seventh optical surface 451 is located above the light emitting chip 310 and is configured to transmit the transmitted optical signal generated by the light emitting chip 310. The eighth optical surface 452 is located above the light receiving chip 320 and is configured to transmit the received optical signal so that the received optical signal is transmitted to the light receiving chip 320.

[0113] In some embodiments, a third lens 4511 is disposed on the seventh optical surface 451 , and the third lens 4511 is used to collimate the emission light signal generated by the light emitting chip 310 .

[0114] In some embodiments, a fourth lens 4521 is disposed on the eighth optical surface 452 , and the fourth lens 4521 is configured to converge the received optical signal toward the optical receiving chip 320 .

[0115] In some embodiments, a fifth groove 453 is provided on the top surface of second recess 450, and a seventh optical surface 451 and an eighth optical surface 452 are formed on the bottom surface of fifth groove 453. Fifth groove 453 is used to adjust the relative heights of seventh optical surface 451 and eighth optical surface 452, that is, the distance between seventh optical surface 451 and the light-emitting surface of light-emitting chip 310, and the distance between eighth optical surface 452 and the light-receiving surface of light-receiving chip 320.

[0116] In some embodiments, the positions of the first optical surface 4311, the second optical surface 4321, the fifth optical surface 4322, etc. are adjusted to adjust the relative positions of the backlight detection chip and the light emitting chip 310 and the light receiving chip 320, such as making the backlight detection chip located on the connecting line between the light emitting chip 310 and the light receiving chip 320, making the backlight detection chip located between the light emitting chip 310 and the light receiving chip 320, or making the backlight detection chip located on the side of the light emitting chip 310 away from the light receiving chip 320.

[0117] In some embodiments, a first backlight detection chip 340 is also provided below the lens assembly body 430, and a ninth optical surface 454 is also formed in the fifth groove 453. The ninth optical surface 454 transmits the light signal and transmits the light signal to the first backlight detection chip 340. The first backlight detection chip 340 receives the light signal for detecting the emission light power of the light emitting chip 310.

[0118] In some examples, the first backlight detection chip 340 is located between the light emitting chip 310 and the light receiving chip 320 , and the ninth optical surface 454 is located between the seventh optical surface 451 and the eighth optical surface 452 .

[0119] In some embodiments, a fifth lens 4541 is disposed on the ninth optical surface 454 , and the fifth lens 4541 is used to converge light signals.

[0120] In some embodiments, the ninth optical surface 454 is an inclined surface, and a step surface 4324 is formed on the side wall of the second groove 432. The step surface 4324 is located above the ninth optical surface 454, so that the thickness of the lens assembly body 430 above the ninth optical surface 454 can be adjusted through the step surface 4324 to ensure the formability of the ninth optical surface 454, thereby facilitating the processing of the ninth optical surface 454.

[0121] FIG16 is a second cross-sectional view of a lens assembly in use according to some embodiments of the present disclosure. FIG16 illustrates the optical transmission path of lens assembly 400. As shown in FIG16 , the optical transmission signal generated by light emitting chip 310 is transmitted to third lens 4511, collimated by third lens 4511, and transmitted to second optical surface 4321. After being reflected from second optical surface 4321, it is transmitted to fifth optical surface 4322. The optical transmission signal transmitted to fifth optical surface 4322 partially transmits through fifth optical surface 4322 and is partially reflected by fifth optical surface 4322. The optical transmission signal transmitted through fifth optical surface 4322 is transmitted to sixth optical surface 4323, passes through and transmits through sixth optical surface 4323, and then transmits through sixth optical surface 4323 to first optical surface 4311, where it is finally reflected from first optical surface 4311. The optical transmission signal reflected from fifth optical surface 4322 is transmitted to ninth optical surface 454, converged by fifth lens 4541, and transmitted to first backlight detection chip 340.

[0122] As shown in FIG16 , the received optical signal is transmitted to the third optical surface 4331 , reflected by the third optical surface 4331 and transmitted to the fourth optical surface 4341 , reflected by the fourth optical surface 4341 and transmitted to the eighth optical surface 452 , and converged by the fourth lens 4521 and transmitted to the optical receiving chip 320 .

[0123] In some embodiments of the present disclosure, with reference to the light-emitting surface perpendicular to light-emitting chip 310, the inclination angle of second optical surface 4321 is α1, the inclination angle of fifth optical surface 4322 is α2, the inclination angle of sixth optical surface 4323 is α3, and the inclination angle of ninth optical surface 454 is α4. The inclination angles α1, α2, α3, and α4 of second optical surface 4321, fifth optical surface 4322, and sixth optical surface 4323, respectively, coordinate with each other and require reference to the spacings L1 and L2 between the optical surfaces. The specific values ​​are selected through coordination. The spacing between first backlight detection chip 340 and light-emitting chip 310 is determined by combining the inclination angles α1, α2, and α4 of second optical surface 4321, fifth optical surface 4322, and ninth optical surface 454. Accordingly, the selection of the inclination angle α1 of second optical surface 4321 , the inclination angle α2 of fifth optical surface 4322 , and the inclination angle α4 of ninth optical surface 454 needs to consider the distance between first backlight detection chip 340 and light emitting chip 310 .

[0124] FIG17 is a cross-sectional view of another lens assembly in use according to some embodiments of the present disclosure. As shown in FIG17 , in some instances, a second backlight detection chip 350 is provided on a side of the light emitting chip 310 away from the light receiving chip 320; a tenth optical surface is formed on the top surface of the second recess 450, and the tenth optical surface is located above the second backlight detection chip 350. The tenth optical surface is used to transmit the light signal and transmit the light signal to the second backlight detection chip 350; the second backlight detection chip 350 receives the light signal for detecting the light power emitted by the light emitting chip 310. Exemplarily, the light signal transmitted to the tenth optical surface is refracted by the tenth optical surface, and the light signal refracted by the tenth optical surface is transmitted to the second backlight detection chip 350.

[0125] FIG18 is a second cross-sectional view of another lens assembly in use according to some embodiments of the present disclosure. FIG18 shows a transmission light path of another lens assembly 400 . As shown in Figure 18, the emission light signal generated by the light emitting chip 310 is transmitted to the third lens 4511, collimated by the third lens 4511 and transmitted to the second optical surface 4321, reflected by the second optical surface 4321 and transmitted to the fifth optical surface 4322, and transmitted to the sixth optical surface 4323 through the fifth optical surface 4322; the emission light signal transmitted to the sixth optical surface 4323 is partially transmitted through the sixth optical surface 4323 and partially reflected by the sixth optical surface 4323; the emission light signal transmitted through the sixth optical surface 4323 is transmitted to the first optical surface 4311, and finally reflected by the first optical surface 4311; the light signal reflected by the sixth optical surface 4323 is transmitted to the fifth optical surface 4322 and transmitted to the second optical surface 4321 through the fifth optical surface 4322, reflected by the second optical surface 4321 and transmitted to the tenth optical surface, and transmitted to the second backlight detection chip 350 through the tenth optical surface.

[0126] In some embodiments of the present disclosure, with the light emitting surface perpendicular to the light emitting chip 310 as a reference, the inclination angle of the tenth optical surface is α5. The inclination angle α5 of the tenth optical surface needs to be selected in combination with the inclination angle α1 of the second optical surface 4321, the inclination angle α2 of the fifth optical surface 4322, and the inclination angle α3 of the sixth optical surface 4323. The spacing between the second backlight detection chip 350 and the light emitting chip 310 is determined by combining the inclination angle α1 of the second optical surface 4321, the inclination angle α2 of the fifth optical surface 4322, and the inclination angle α5 of the tenth optical surface. Accordingly, the selection of the inclination angle α1 of the second optical surface 4321, the inclination angle α2 of the fifth optical surface 4322, and the inclination angle α5 of the tenth optical surface needs to take into account the spacing between the second backlight detection chip 350 and the light emitting chip 310.

[0127] Figure 19 is a cross-sectional view of a lens assembly according to some embodiments of the present disclosure, illustrating a transmission optical path of lens assembly 400. As shown in Figure 19 , an emitted optical signal passes through fifth optical surface 4322 and is transmitted to first optical surface 4311. It is then reflected by first optical surface 4311 and transmitted to first lens 4351. After being converged by first lens 4351, it is transmitted to first fiber optic ferrule 460 and then transmitted along the extension direction of first fiber optic ferrule 460.

[0128] As shown in FIG. 19 , the received optical signal is transmitted to the second lens 4361 through the second optical fiber ferrule 470 , collimated by the second lens 4361 and transmitted to the third optical surface 4331 , and reflected by the third optical surface 4331 and transmitted to the fourth optical surface 4341 .

[0129] Figure 20 is a first cross-sectional view of another lens assembly according to some embodiments of the present disclosure, and Figure 21 is a second cross-sectional view of another lens assembly according to some embodiments of the present disclosure. In some embodiments, as shown in Figures 20 and 21, the center of the optical receiving chip 320 is located on the projection of the optical axis of the second optical fiber adapter 420 in the direction of the circuit board 300. A sixth groove 437 is provided above the optical receiving chip 320, and an eleventh optical surface 4371 is formed in the sixth groove 437. The eleventh optical surface 4371 is inclined toward the second optical fiber adapter 420. The received light signal is transmitted through the second optical fiber adapter 420 to the eleventh optical surface 4371; the eleventh optical surface 4371 reflects the received light signal, changing the transmission direction of the received light signal from parallel to the circuit board 300 to perpendicular to the circuit board 300.

[0130] In some embodiments, the eleventh optical surface 4371 is located above the eighth optical surface 452 , and the light receiving chip 320 is located below the fourth lens 4521 . The received light signal reflected by the eleventh optical surface 4371 is transmitted to the fourth lens 4521 , and then converged by the fourth lens 4521 and transmitted to the light receiving chip 320 .

[0131] In order to adapt to the distance requirement between the light emitting chip 310 and the light receiving chip 320, the light emitting chip 310 moves closer to the position where the optical axis of the second optical fiber adapter 420 is projected on the circuit board 300. That is, compared with the light emitting chip 310 and the light receiving chip 320 being located between the projection of the optical axis of the first optical fiber adapter 410 and the projection of the optical axis of the second optical fiber adapter 420 on the circuit board 300, the light emitting chip 310 moves toward the direction of the second optical fiber adapter 420, and then the second optical surface 4321 and others move in the same direction.

[0132] Of course, in the embodiment of the present disclosure, the center of the light emitting chip 310 can also be close to or located at the projection of the optical axis of the first optical fiber adapter 410 on the circuit board 300 to adaptively adjust the position and combination of the optical surfaces on the lens assembly 400.

[0133] In some embodiments, the distance between the center of the optical transmitting chip 310 and the optical axis of the first optical fiber adapter 410 projected on the circuit board 300 is equal to the distance between the center of the optical receiving chip 320 and the optical axis of the second optical fiber adapter 420 projected on the circuit board 300, so that the optical path length of the optical signal transmitted inside the optical module 200 is similar to the process length of the optical signal received, so as to facilitate balancing the optical path length of the optical signal transmitted inside the optical module 200 and the optical path length of the optical signal received, and further coordinate the tolerance of the optical path of the transmission optical path of the transmitted optical signal and the optical path of the received optical signal.

[0134] In some embodiments, by adjusting the positions of the first optical surface 4311, the second optical surface 4321, the fifth optical surface 4322, etc., the backlight detection chip is not located on the connection line between the light emitting chip 310 and the light receiving chip 320, so as to facilitate the setting of the backlight detection chip, such as reducing the restrictions of the assembly space on the selection of the backlight detection chip.

[0135] Figure 22 is a perspective view of another lens assembly according to some embodiments of the present disclosure, Figure 23 is a perspective view of another lens assembly according to some embodiments of the present disclosure, and Figure 24 is a cross-sectional view of another lens assembly according to some examples of the present disclosure. In some embodiments, as shown in Figures 22 and 23, the bottom of the second groove 432 forms a second optical surface 4321, a fifth optical surface 4322, and a sixth optical surface 4323. The second optical surface 4321 and the fifth optical surface 4322 do not intersect within the second groove 432, that is, the intersection of the second optical surface 4321 and the fifth optical surface 4322 is not within the second groove 432.

[0136] Exemplarily, a first plane 4325 is formed in the second groove 432, the first plane 4325 is perpendicular to the optical axis of the light emitting chip 310, the second optical surface 4321 is located on one side of the first plane 4325, and the fifth optical surface 4322 is located on the other side of the first plane 4325, and the second optical surface 4321 and the fifth optical surface 4322 are not symmetrical about the central axis of the first plane 4325.

[0137] FIG25 is a third perspective view of another lens assembly provided according to some embodiments of the present disclosure, FIG26 is a partial enlarged view of position O in FIG25 , FIG27 is a second cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure, and FIG28 is a partial enlarged view of position P in FIG27 . As shown in FIG25-28 , a twelfth optical surface 456 is formed on the side of the seventh optical surface 451 near the front end of the lens assembly 400. The twelfth optical surface 456 is located below the second optical surface 4321 and is used to refract the transmitted light signal. Exemplarily, the twelfth optical surface 456 refracts the light signal used to monitor the optical power emitted by the light emitting chip, causing the optical axis of the light signal used to monitor the optical power emitted by the light emitting chip to deviate from the optical axis of the light emitting chip 310. In some embodiments, the twelfth optical surface 456 is formed on the bottom surface of the twelfth optical surface 456.

[0138] Figure 29 is a third cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure, Figure 30 is a fourth cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure, and Figure 31 is a fifth cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure. Figures 29-31 show the transmission light path of another lens assembly 400. As shown in Figures 29 and 30, the emission light signal generated by light emitting chip 310 is transmitted to third lens 4511, collimated by third lens 4511, and transmitted to second optical surface 4321. It is then reflected from second optical surface 4321 and transmitted to fifth optical surface 4322. The emission light signal transmitted to fifth optical surface 4322 partially transmits through fifth optical surface 4322 and is partially reflected by fifth optical surface 4322. The emission light signal that transmits through fifth optical surface 4322 is transmitted to sixth optical surface 4323, passes through and transmits through sixth optical surface 4323, and the emission light signal that transmits through sixth optical surface 4323 is transmitted to first optical surface 4311 and finally reflected from first optical surface 4311. The light signal reflected from fifth optical surface 4322 is transmitted to second optical surface 4321, reflected from second optical surface 4321, and transmitted to twelfth optical surface 456. It is then transmitted through twelfth optical surface 456 and transmitted to the backlight detection chip.

[0139] As shown in Figures 29 and 31, the received optical signal is transmitted to the third optical surface 4331, reflected by the third optical surface 4331 and transmitted to the fourth optical surface 4341, reflected by the fourth optical surface 4341 and transmitted to the eighth optical surface 452, and converged by the fourth lens 4521 and transmitted to the optical receiving chip 320.

[0140] FIG32 is a bottom view of another lens assembly in use according to some embodiments of the present disclosure. As shown in FIG32 , a third backlight detection chip 360 is further disposed below the lens assembly 400. The third backlight detection chip 360 is positioned to the right of the light emitting chip 310 and below the twelfth optical surface 456. The third backlight detection chip 360 is closer to the optical port of the optical module 200 than the light emitting chip 310. The third backlight detection chip 360 is not located on the line connecting the light emitting chip 310 and the light receiving chip 320, thus being positioned away from the driver chip 330. This effectively prevents the third backlight detection chip 360 from interfering with the layout of the driver chip 330, or vice versa. If a relatively large third backlight detection chip 360 is selected, placing it on the light emitting chip 310 can prevent assembly interference between the third backlight detection chip 360 and the driver chip 330.

[0141] FIG33 is a second bottom view of another lens assembly in use according to some embodiments of the present disclosure. As shown in FIG33 , in some embodiments, a fourth backlight detection chip 370 is further disposed below the lens assembly 400. The fourth backlight detection chip 370 is disposed diagonally opposite the light emitting chip 310, away from the light receiving chip 320, and below the twelfth optical surface 456. The fourth backlight detection chip 370 is closer to the optical port of the optical module 200 than the light emitting chip 310. The fourth backlight detection chip 370 is not located on the line connecting the light emitting chip 310 and the light receiving chip 320, thereby keeping the fourth backlight detection chip 370 away from the driver chip 330. This effectively prevents the fourth backlight detection chip 370 from interfering with the layout of the driver chip 330, or effectively prevents the driver chip 330 from interfering with the layout of the fourth backlight detection chip 370.

[0142] In the optical module provided in some embodiments of the present disclosure, the lens assembly 400 is used to arrange the light emitting chip 310 and the light receiving chip 320 between the optical axis of the first optical fiber adapter 410 and the optical axis of the second optical fiber adapter 420, so that the light emitting chip 310 and the light receiving chip 320 can be close to each other, and the light emitting chip 310 and the light receiving chip 320 can share the driving chip 330.

[0143] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, comprising: A circuit board, with a light emitting chip and a light receiving chip arranged on the surface; A lens assembly, the bottom of which is connected to the circuit board and covers the light emitting chip and the light receiving chip; wherein: The lens assembly comprises a lens assembly body, a first optical fiber adapter and a second optical fiber adapter; the first optical fiber adapter and the second optical fiber adapter are arranged at a first end of the lens assembly body, the first optical fiber adapter is configured to transmit a transmitting optical signal, and the second optical fiber adapter is configured to transmit a receiving optical signal; The distance between the center of the optical transmitting chip and the center of the optical receiving chip in the direction perpendicular to the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter is smaller than the distance between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter; A first optical surface, a second optical surface, a third optical surface and a fourth optical surface are formed on the lens assembly body; the first optical surface faces the first optical fiber adapter, the second optical surface faces the first optical surface and the light emitting chip, and the second optical surface is located above the light emitting chip and between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter; the third optical surface faces the second optical fiber adapter, the fourth optical surface faces the third optical surface and the light receiving chip, and the light receiving chip is located below the fourth optical surface and between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter.

2. The optical module according to claim 1, wherein: The first optical surface is configured to change the direction of the transmitted light signal in the width and length directions of the circuit board, and the third optical surface is configured to change the direction of the received light signal in the length and width directions of the circuit board, so as to transmit the transmitted light signal generated by the optical transmitting chip to the first optical fiber adapter, and to transmit the received light signal input through the second optical fiber adapter to the optical receiving chip.

3. The optical module according to claim 2, wherein: A first recess is formed on the top of the lens assembly body, and a first groove, a second groove, a third groove and a fourth groove are formed on the bottom of the first recess; The first optical surface is formed on the side wall of the first groove, and the first optical surface is configured to reflect the transmitted light signal toward the first optical fiber adapter; the second optical surface is formed on the bottom of the second groove, and the second optical surface reflects the transmitted light signal toward the first optical surface; The third optical surface is formed on the side wall of the third groove, and the third optical surface is configured to reflect the optical receiving signal input by the second optical fiber adapter; the fourth optical surface is formed on the side wall of the fourth groove, and the fourth optical surface is located on the reflected light path of the third optical surface, and reflects the optical signal reflected by the third optical surface toward the direction of the optical receiving chip.

4. The optical module according to claim 3, wherein: A fifth optical surface is also formed at the bottom of the second groove, and a sixth optical surface is formed on the side wall of the second groove. The fifth optical surface and the sixth optical surface are located on the optical path from the second optical surface to the first optical surface, and the emitted light signal transmitted through the fifth optical surface is transmitted to the sixth optical surface, and the light signal transmitted through the sixth optical surface is transmitted to the first optical surface.

5. The optical module according to claim 4, wherein: A second recess is formed at the bottom of the lens assembly body, a fifth groove is arranged on the top surface of the second recess, a seventh optical surface and an eighth optical surface are formed at the bottom of the fifth groove, the seventh optical surface is located above the light emitting chip and below the second optical surface, and the eighth optical surface is located above the light receiving chip and below the fourth optical surface; A third lens is disposed on the seventh optical surface, and the third lens collimates the emission light signal generated by the light emitting chip; A fourth lens is disposed on the eighth optical surface, and the fourth lens converges the received optical signal toward the optical receiving chip.

6. The optical module according to claim 4, wherein: A first backlight detection chip is also disposed on the surface of the circuit board, and the first backlight detection chip is located between the light emitting chip and the light receiving chip; A ninth optical surface is formed at the bottom of the lens assembly body, and the ninth optical surface is located above the first backlight detection chip. The fifth optical surface is configured to reflect a portion of the emitted light signal, and the emitted light signal reflected by the fifth optical surface is transmitted to the ninth optical surface. A fifth lens is disposed on the ninth optical surface, and the fifth lens is configured to converge the emission light signal toward the first backlight detection chip.

7. The optical module according to claim 4, wherein: A second backlight detection chip is also disposed on the surface of the circuit board, and the second backlight detection chip is located on a side of the light emitting chip away from the light receiving chip; A tenth optical surface is formed at the bottom of the lens assembly body, and the tenth optical surface is located above the second backlight detection chip; The sixth optical surface is configured to reflect a partially emitted light signal; the emitted light signal reflected by the sixth optical surface is transmitted to the fifth optical surface and passes through the fifth optical surface; the light signal passing through the fifth optical surface is transmitted to the second optical surface and reflected by the second optical surface and transmitted to the tenth optical surface and then transmitted to the second backlight detection chip through the tenth optical surface.

8. The optical module according to claim 3, wherein: The first optical fiber adapter is formed with a first through hole, in which a first optical fiber ferrule is arranged; the lens assembly body is provided with a first blind hole, and the first blind hole is located on the optical path from the first optical fiber adapter to the first optical surface; One end of the first blind hole is connected to the first through hole, and a first lens is disposed at the other end of the first blind hole. The first lens converges the optical signal emitted by the first optical surface and transmits it to the first optical fiber ferrule.

9. The optical module according to claim 3, wherein: A second through hole is formed on the second optical fiber adapter, and a second optical fiber ferrule is arranged in the second through hole; a second blind hole is arranged on the lens assembly body, and the second blind hole is located on the optical path from the second optical fiber adapter to the third optical surface; One end of the second blind hole is connected to the second through hole, and a second lens is disposed at one end of the second blind hole. The second lens collimates and transmits a received optical signal transmitted through the second optical fiber ferrule to the third optical surface.

10. The optical module according to claim 1, wherein: The center of the optical transmitting chip is located between the projection of the optical axis of the first optical fiber adapter on the circuit board and the projection of the optical axis of the second optical fiber adapter on the circuit board; the center of the optical receiving chip is located between the projection of the optical axis of the first optical fiber adapter on the circuit board and the projection of the optical axis of the second optical fiber adapter on the circuit board.

11. The optical module according to claim 5, wherein: A backlight detection chip is arranged on the surface of the circuit board; A twelfth optical surface is also formed on the lens assembly body; the second optical surface is located above the twelfth optical surface, and the twelfth optical surface is located above the light emitting chip; the twelfth optical surface is located on one side of the seventh optical surface, and the twelfth optical surface is located on the side of the seventh optical surface close to the lens assembly body connected to the first optical fiber adapter; the emission light signal reflected by the fifth optical surface is transmitted to the second optical surface, and is reflected by the second optical surface and transmitted to the twelfth optical surface; The twelfth optical surface refracts the light signal to the backlight detection chip.

12. The optical module according to claim 11, wherein: A first plane is also formed in the second groove, the second optical surface is located on one side of the first plane, the fifth optical surface is located on the other side of the first plane, and the second optical surface and the fifth optical surface are not symmetrical about the central axis of the first plane. 13 . The optical module according to claim 11 , wherein the twelfth optical surface is formed on a top of the second recess.

14. The optical module according to claim 11, wherein: A sixth groove is formed at the bottom of the first recess, and an eleventh optical surface is formed in the sixth groove; The center of the light receiving chip is located on the projection of the optical axis of the second optical fiber adapter on the circuit board, the eleventh optical surface faces the second optical fiber adapter and the light receiving chip, and the eleventh optical surface is located above the light receiving chip.

15. The optical module according to claim 11, wherein: A driving chip is also arranged on the surface of the circuit board, the light emitting chip and the light receiving chip are electrically connected to the driving chip respectively, and the driving chip is arranged on a side of the light emitting chip and the light receiving chip away from the light port of the optical module; the backlight detection chip includes a third backlight detection chip or a fourth backlight detection chip; The third backlight detection chip is located on a side of the light emitting chip close to the light port, and the third backlight detection chip is located below the twelfth optical surface; The fourth backlight detection chip is located at a diagonally opposite side of the light emitting chip close to the light port and away from the light receiving chip. The fourth backlight detection chip is located below the twelfth optical surface.

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