Light source module

Abstract

A light source module (1) comprises: a light-emitting body (4) that uses a light-emitting diode as a light source; a heat sink (2) to which the light-emitting body is attached and which radiates heat generated during driving of the light-emitting body; and a wiring board (3) which is attached to the heat sink and in which a power supply circuit (3a) for supplying power to the light-emitting body is formed. The heat sink is formed by bending an aluminum plate. The heat sink is provided with a base part (5) to which the light-emitting body and the wiring board are attached, and heat radiation fin parts (6) which are connected to at least both ends of the base part and are bent with respect to the base part.

Description

Light Source Module

[0001] The present invention relates to the technical field of a light source module comprising a light emitter having a light source and a heat sink to which the light emitter is attached.

[0002] Some vehicle lamps have a light source module that is used by being coupled to optical components such as a reflector or a lens holder, and the light emitted from the light source of the light source module is irradiated toward the outside (see, for example, Patent Document 1).

[0003] In such vehicle lamps, the heat generated when the light source is driven is transferred to and released by a heat sink having heat dissipation fins, ensuring good heat dissipation of the heat generated when the light source is driven and ensuring proper driving of the light source. Heat sinks are often formed by extrusion molding using metal materials such as aluminum.

[0004] Japanese Patent Application Laid-Open No. 2019-153723

[0005] However, in recent years, it has often become necessary to increase the amount of luminous flux in order to ensure high brightness (illuminance), and in such light source modules, even higher heat dissipation properties are required to ensure good operating conditions of the light source.

[0006] On the other hand, if the heat dissipation fins of the heat sink formed by extrusion molding are enlarged in order to ensure even higher heat dissipation performance in the light source module, the overall size of the heat sink will increase, which may result in an increase in the size of the light source module.

[0007] Therefore, an object of the light source module of the present invention is to improve heat dissipation while ensuring miniaturization.

[0008] The light source module of the present invention comprises a light-emitting body using a light-emitting diode as a light source, a heat sink to which the light-emitting body is attached and which dissipates heat generated when the light-emitting body is operated, and a wiring board attached to the heat sink and on which a power supply circuit for supplying power to the light-emitting body is formed, the heat sink being formed by bending an aluminum plate, and the heat sink having a base portion to which the light-emitting body and the wiring board are attached, and heat dissipation fin portions that are continuous with at least both ends of the base portion and bent relative to the base portion.

[0009] As a result, the aluminum plate is bent to form the heat sink, and the heat dissipation fin portion is formed by bending it relative to the base portion.

[0010] Another light source module according to the present invention comprises a light-emitting body using a light-emitting diode as a light source, a heat sink to which the light-emitting body is attached and which dissipates heat generated when the light-emitting body is operated, and a wiring board attached to the heat sink and on which a power supply circuit for supplying power to the light-emitting body is formed, and the light-emitting body is attached by being bonded to the heat sink with a sintered bonding material.

[0011] As a result, most of the heat generated when the light source is driven is transferred from the sintered bonding material, which has high thermal conductivity, to the heat sink, increasing the amount of heat dissipated from the heat sink.

[0012] Another light source module according to the present invention comprises a light-emitting body using a light-emitting diode as a light source, and a heat sink to which the light-emitting body is attached and which dissipates heat generated when the light-emitting body is operated, and a recognition mark that serves as a reference for positioning is formed on the heat sink, and the recognition mark is used as a mark for positioning the light-emitting body relative to the heat sink and also as a mark for positioning an optical component relative to the heat sink.

[0013] As a result, both the optical component and the light emitter can be attached to the heat sink using the recognition marks as a reference for positioning.

[0014] According to the present invention, the heat sink is formed by bending a plate of aluminum, and the heat dissipation fin portion is formed by bending it relative to the base portion, which makes it possible to miniaturize the heat sink and ensure a sufficient heat dissipation area, thereby improving heat dissipation performance while ensuring miniaturization.

[0015] 2 to 9 show a first embodiment of the present invention, and this figure is a cross-sectional view of a vehicle lamp in which a light source module is arranged.

[0033] FIG. 1 is a perspective view of a light source module.

[0034] FIG. 2 is a perspective view of a light source module in which a first surface portion is formed into a curved shape.

[0035] FIG. 3 is a perspective view of a light source module in which a slit is formed.

[0036] FIG. 4 is a perspective view of a light source module in which a slit is formed in a heat sink formed from a block-shaped material.

[0037] FIG. 5 is a perspective view of a light source module in which a heat sink having four bent portions is provided.

[0038] FIG. 6 is a perspective view of a light source module in which a heat dissipation protrusion is formed by drawing.

[0039] FIG. 7 is a perspective view of a light source module in which a heat sink configured by attaching a heat sink to a base portion is provided.

[0039] FIG. 8 is a perspective view of a light source module in which a heat sink configured by attaching a heat sink to a base portion is provided, viewed from a direction different from that of FIG.

[0039] FIG. 11 to 22 show a second embodiment of the present invention, and this figure is a cross-sectional view of a vehicle lamp in which a light source module is arranged.

[0039] FIG. 12 is a perspective view of a light source module.

[0039] FIG. 13 is a cross-sectional view showing a state in which a light emitter is bonded to a heat sink.

[0039] FIG. 14 is a perspective view showing a state in which a thermistor is mounted on a wiring board.

[0039] FIG. 15 is a cross-sectional view showing a state in which a thermistor is mounted on a wiring board.

[0039] 22 is a perspective view showing a light source module in which a sintered bonding material is filled in a bonding recess and a light emitter is attached to a heat sink. FIG. 23 is a cross-sectional view showing a state in which a sintered bonding material is filled in a bonding recess and a light emitter is attached to a heat sink. FIG. 24 is a perspective view showing a light source module in which a space is formed in a heat dissipation fin portion. FIG. 25 is a perspective view showing a light source module having a heat sink to which two heat sinks are coupled together with FIG. 20, and this view is a perspective view showing a state in which the two heat sinks are separated. FIG. 26 is a perspective view showing a state in which the two heat sinks are coupled together. FIG. 27 is a perspective view showing a light source module having another heat sink to which two heat sinks are coupled together with FIG. 22, and this view is a perspective view showing a state in which the two heat sinks are separated. FIG. 28 is a perspective view showing a state in which the two heat sinks are coupled together. FIG. 29 is a perspective view showing a light source module according to a third embodiment of the present invention together with FIG. 24 to FIG. 28.FIG. 1 is a perspective view showing a state in which a reflector provided as an optical component is attached to a light source module. FIG. 2 is a perspective view showing a state in which a reflector integrated with a lens provided as an optical component is attached to a light source module. FIG. 3 is a plan view showing an example in which a recognition mark is formed at a position other than the left or right of a light emitter. FIG. 4 is a perspective view showing an example in which a resin sheet is attached to a heat sink. FIG. 5 is a perspective view showing an example in which a resin sheet consisting of an attachment portion and a circuit forming portion is attached to a heat sink.

[0016] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, the front, back, up, down, left and right directions are indicated with the direction of light emitted from the light source module toward the outside as the front. Note that the front, back, up, down, left and right directions shown below are for the sake of convenience, and the present invention is not limited to these directions when it comes to implementing the invention.

[0017] <General Configuration of Vehicle Lamp> First, the general configuration of a vehicle lamp will be described (see FIG. 1).

[0018] The vehicle lamp 100 is, for example, a vehicle headlamp, and includes a lamp housing 101 having an opening at the front end and a cover 102 that closes the opening of the lamp housing 101 (see FIG. 1). The lamp housing 101 and the cover 102 form a lamp outer casing 103, and the space inside the lamp outer casing 103 forms a lamp chamber 104.

[0019] A bracket 106 supported by an aiming mechanism 105 is disposed in the lamp chamber 104. The aiming mechanism 105 is supported at the rear end of the lamp housing 101 and includes an adjusting screw, a pivot member, etc. The bracket 106 is formed with an insertion hole 106a.

[0020] A connecting member 107 is attached to the rear end of the lamp housing 101, and a connector 108 disposed in the lamp chamber 104 is connected to the connecting member 107 via a cable. A power supply circuit (not shown) is also connected to the connecting member 107 via a cable. The power supply circuit is located outside the vehicle lamp 100.

[0021] The light source module 1 is disposed in the lamp chamber 104, and is attached to a bracket 106. The light source module 1 is attached with optical components 109 such as a reflector, a lens holder, and a reflector integrated with a lens.

[0022] First Embodiment A light source module 1 according to a first embodiment will be described below (see FIGS. 1 to 9).

[0023] The light source module 1 includes a heat sink 2 for dissipating heat, a wiring board 3 attached to the heat sink 2, and a light emitter 4 attached to the heat sink 2 (see FIG. 2).

[0024] The heat sink 2 is formed by bending, for example, an aluminum plate into a predetermined shape using a bending process. The heat sink 2 comprises a base portion 5 formed in the shape of a rectangular flat plate facing up and down, and a pair of heat dissipation fin portions 6 connected to both left and right ends of the base portion 5. The heat dissipation fin portions 6 are formed by bending the base portion 5.

[0025] The heat dissipation fin section 6 is composed of a pair of first surfaces 7 connected to both left and right ends of the base section 5, and a pair of second surfaces 8 connected to the lower ends of the first surfaces 7. The first surfaces 7 are bent downward at a right angle relative to the base section 5 so as to face left and right. The second surfaces 8 are bent at a right angle relative to the first surfaces 7 so as to approach each other so as to face up and down.

[0026] Therefore, the second surface portion 8 is located directly below the base portion 5, and is located inside the left and right ends of the base portion 5 while being spaced apart from the base portion 5 in the thickness direction (vertical direction). Note that as long as the second surface portion 8 is located directly below the base portion 5, the bending angle of the second surface portion 8 relative to the first surface portion 7 is not limited to 90 degrees, and the bending angle of the second surface portion 8 relative to the first surface portion 7 may be, for example, greater than 90 degrees.

[0027] The pair of second surface portions 8 may be arranged such that the leading edges 8a thereof in the left-right direction are in contact with or close to each other. By having the leading edges 8a of the second surface portions 8 in contact with or close to each other, the surface area of ​​the second surface portions 8 is increased, and the overall surface area of ​​the heat dissipation fin portion 6 is also increased, thereby improving heat dissipation.

[0028] The wiring board 3 is formed as a rigid board with a poor flexibility, with a base material such as resin. Examples of the base material for the wiring board 3 include glass epoxy and alumina (ceramics). However, a flexible printed wiring board with high flexibility may also be used as the wiring board 3. By using a flexible printed wiring board, it is possible to reduce the thickness (vertical width) of the light source module 1.

[0029] A power supply circuit 3a that supplies power to the light emitter 4 is formed on the upper surface of the wiring board 3. A connection terminal 3b, which may be, for example, a card edge connector, is provided at the rear end of the wiring board 3. A thermistor 9 is mounted on the front end of the wiring board 3.

[0030] The wiring board 3 is attached by adhesive or the like to the center of the base 5 in the left-right direction, with the connection terminal 3b protruding rearward from the base 5. The connection terminal 3b is inserted into an insertion hole 106a of the bracket 106 and connected to a connector 108 (see FIG. 1). This allows current to be supplied from the power supply circuit to the power supply circuit 3a of the wiring board 3 via the connection member 107 and the connector 108.

[0031] The light emitter 4 is attached to the front side of the wiring board 3 on the upper surface of the base portion 5 (see FIG. 2). The light emitter 4 is connected to the power supply circuit 3a by, for example, so-called wire bonding using a metal wire 10.

[0032] The light emitter 4 is configured as an LED package using a light emitting diode (LED) as a light source 11. The light emitter 4 is configured by mounting, for example, two light sources 11 on a package substrate 12. The light source 11 emits light, for example, as a low beam for illuminating a short distance or a high beam for illuminating a long distance.

[0033] In the light source module 1 configured as described above, when the light source 11 is driven, heat is generated in the light emitter 4 and the wiring board 3, and the generated heat is transferred to the heat sink 2. The heat transferred to the heat sink 2 is released to the outside from the heat dissipation fin section 6 as well as the base section 5, thereby suppressing a temperature rise in the light source 11 and ensuring good light emission from the light source 11.

[0034] As described above, in the light source module 1, an aluminum plate is used as the heat sink 2, and the heat sink 2 is provided with a base portion 5 to which the light emitter 4 and the wiring board 3 are attached, and heat dissipation fin portions 6 that are continuous with both ends of the base portion 5 and bent relative to the base portion 5.

[0035] Therefore, since the heat sink 2 is formed by bending a plate of aluminum and the heat dissipation fin portion 6 is formed by bending it relative to the base portion 5, it is possible to make the heat sink 2 smaller and ensure a sufficient heat dissipation area, thereby improving heat dissipation performance while ensuring compactness.

[0036] Furthermore, a part of the heat dissipation fin portion 6 is located inside the outer periphery of the base portion 5 while being separated from the base portion 5 in the thickness direction of the base portion 5 .

[0037] Therefore, since a portion of the heat dissipation fin portion 6 is located inside the outer periphery of the base portion 5, it is possible to increase the area of ​​the heat dissipation fin portion 6 without increasing the external shape of the heat sink 2, thereby improving heat dissipation performance without increasing the size of the light source module 1.

[0038] Furthermore, the heat dissipation fin portion 6 consists of a first surface portion 7 connected to both ends of the base portion 5 and a second surface portion 8 connected to the first surface portion 7, and the second surface portion 8 is positioned facing the base portion 5 in the thickness direction of the base portion 5.

[0039] Therefore, since the heat dissipation fin portion 6 is composed of the first surface portion 7 and the second surface portion 8 formed by bending, a large heat dissipation area can be secured with a simple configuration, thereby improving heat dissipation performance.

[0040] Although the above example shows a configuration in which the heat dissipation fin portion 6 of the heat sink 2 has a first surface portion 7 facing left and right, the heat sink 2 may also be configured to have a heat dissipation fin portion 6A having, for example, an arc-shaped first surface portion 7A (see Figure 3).

[0041] When the heat sink 2 is configured to have the first surface 7A having an arcuate surface, the heat dissipation fin portion 6A can be formed by a single bending process, thereby shortening the manufacturing time of the light source module 1. In addition, stress concentration is less likely to occur in the continuous portion between the first surface 7A and the base portion 5 and in the heat dissipation fin portion 6A, and the strength of the heat sink 2 can also be improved.

[0042] Furthermore, in the light source module 1, a blasting process may be applied to the surface of the heat sink 2. The blasting process is a surface processing process in which a large number of granular abrasives are collided with a workpiece to roughen the surface.

[0043] By subjecting the surface of the heat sink 2 to blasting treatment, the surface area of ​​the heat sink 2 is increased, and the heat dissipation area is increased, thereby further improving the heat dissipation performance.

[0044] Furthermore, the surface of the heat sink 2 may be coated with a dark color such as black anodized aluminum. By coating the surface of the heat sink 2 with a dark color, the heat emissivity (emission rate) is increased, thereby further improving the heat dissipation performance.

[0045] Although the above example shows the heat sink 2 made of aluminum, the heat sink 2 may be made of a metal material with a higher thermal conductivity than aluminum, such as copper. However, if the heat sink 2 is made of copper, the surface of the heat sink 2 must be painted to prevent oxidation. In this case, painting the surface of the heat sink 2 with a dark color such as black increases the thermal emissivity, thereby further improving heat dissipation.

[0046] Furthermore, the base portion 5 of the heat sink 2 may have one or more slits 13 extending in the front-to-rear direction (see FIG. 4). By forming the slits 13 in the base portion 5, the surface area of ​​the heat sink 2 is further increased and air flow is improved, thereby further improving heat dissipation by increasing the heat dissipation area and improving air flow. The slits 13 may also be formed in the heat dissipation fin portion 6 or the heat dissipation fin portion 6A.

[0047] Furthermore, in the light source module 1, a heat sink 2A ​​formed of a thick block-shaped material may be used instead of a plate-shaped material (see FIG. 5). The heat sink 2A ​​does not have a heat dissipation fin portion 6 and is composed only of a thick base portion 5A, and has a plurality of slits 13.

[0048] The use of the heat sink 2A ​​formed from a block-shaped material increases the heat capacity, and the slits 13 increase the heat dissipation area and increase the air flow rate, thereby improving heat dissipation.

[0049] Furthermore, although the above example shows a heat sink 2 in which both the left and right portions are bent, a heat sink 2B in which three or four portions are bent may be used instead of the heat sink 2 (see FIG. 6).

[0050] The heat sink 2B is composed of a base 5 and three or four first surfaces 7 formed by bending downward from the base 5. The first surfaces 7 are formed by bending from any three portions of the left and right ends and the front and rear ends of the base 5, or by bending from four portions of the left and right ends and the front and rear ends of the base 5.

[0051] By using the heat sink 2B having such a configuration, it is possible to increase the heat dissipation area, and it is possible to improve the heat dissipation performance while ensuring the miniaturization of the light source module 1.

[0052] The heat sink 2B may also be configured to have two second surface portions 8 that are continuous with the two first surface portions 7, respectively.

[0053] Furthermore, instead of the heat sink 2, a heat sink 2C having a base portion 5, a first surface portion 7, and a heat dissipation protrusion 14 may be used (see FIG. 7). The heat dissipation protrusion 14 is formed by drawing to have a shape that protrudes downward from the base portion 5, for example, a cylindrical shape. For example, multiple heat dissipation protrusions 14 are provided and positioned at intervals in the front, back, left, and right directions.

[0054] By using the heat sink 2C, it is possible to freely set the number and size of the heat dissipation protrusions 14 to increase the heat dissipation area, thereby improving heat dissipation performance while ensuring the miniaturization of the light source module 1.

[0055] Also, instead of the heat sink 2, a heat sink 2D having a heat sink plate 15 attached to the base portion 5 may be used (see FIGS. 8 and 9).

[0056] A plurality of screw holes (not shown) are formed in the base portion 5, and the screw holes are positioned, for example, at intervals in the front, rear, left and right directions.

[0057] The heat sink 15 comprises a connecting surface 16 facing in the vertical direction, a pair of fins 17 protruding downward from both the left and right ends of the connecting surface 16, and a plurality of heat dissipation protrusions 18 protruding downward from the connecting surface 16. The heat dissipation protrusions 18 are formed by drawing and have, for example, a cylindrical shape. For example, a plurality of heat dissipation protrusions 18 are provided between the fins 17, and are positioned at a distance in the front, back, left, and right directions.

[0058] The heat sink 15 is attached to the base 5 by inserting metal mounting screws 19 into the heat dissipation protrusions 18 and threading them into the screw holes. When the heat sink 15 is attached to the base 5, the upper surface of the coupling surface 16 is in surface contact with the lower surface of the base 5.

[0059] Use of such a heat sink 2D makes it possible to freely set the number and size of the heat dissipation protrusions 18 to increase the heat dissipation area, thereby improving heat dissipation while ensuring the compactness of the light source module 1. Furthermore, in the heat sink 2D, the mounting screws 19 inserted into the heat dissipation protrusions 18 also function as heat dissipation parts, so that a simple configuration can further improve heat dissipation.

[0060] Second Embodiment Next, a light source module 31 according to a second embodiment will be described (see FIGS. 10 to 22).

[0061] The light source module 31 is disposed in the lamp chamber 104 of the vehicle lamp 100 in place of the light source module 1, and is attached to a bracket 106 (see FIG. 10). The light source module 31 is fitted with optical components 109 such as a reflector, a lens holder, and a reflector integrated with a lens.

[0062] The light source module 31 includes a heat sink 32 for dissipating heat, a wiring board 3 attached to the heat sink 32, and a light emitter 4 attached to the heat sink 32 (see FIG. 11).

[0063] The heat sink 32 is formed, for example, by extrusion molding of aluminum, and is composed of a base portion 33 formed in the shape of a rectangular flat plate facing the vertical direction, and a plurality of heat dissipation fin portions 34 protruding downward from the base portion 33. The plurality of heat dissipation fin portions 34 are formed, for example, in the shape of a plate extending in the front-rear direction, and are positioned apart from each other on the left and right while facing the left and right direction.

[0064] The light emitter 4 is attached to the base portion 33 by bonding with a sintered bonding material 35 (see FIG. 12). For example, silver nanopaste is used as the sintered bonding material 35. Generally, adhesives with high heat dissipation properties used to bond light emitters have a thermal conductivity of 5 to 10 W / m·K, but the thermal conductivity of silver nanopaste is approximately 200 W / m·K, which is very high.

[0065] The thermistor 9 mounted on the wiring board 3 is bonded onto two lands 36 of the wiring board 3 (see FIGS. 13 and 14). The thermistor 9 is a temperature detection element and has the function of detecting the temperature of the light source module 31, particularly the temperature of the heat sink 32. Temperature information detected by the thermistor 9 is input to a control circuit (not shown), which enables the control circuit to control the current value to the light emitter 4 based on the input temperature information.

[0066] A filling hole 3c is formed in the wiring board 3 directly below the land 36, and the filling hole 3c is filled with a heat transfer material 37 made of a metal material such as copper. A resist layer 3d is formed on the underside of the wiring board 3. The upper surface of the heat transfer material 37 is connected to the land 36, and the lower surface is in contact with the resist layer 3d. Therefore, the heat transfer material 37 is in a state close to the base portion 33 of the heat sink 32. The lower surface of the heat transfer material 37 is in contact with the resist layer 3d and not with the base portion 33, thereby preventing the occurrence of a short circuit. Note that the heat transfer material 37 and the land 36 may be integrally formed from the same material.

[0067] In this way, in the light source module 31, a filling hole 3c filled with a heat transfer material 37 is formed in the wiring board 3, and a land 36 formed on the wiring board 3 and connected to a thermistor 9 is connected to the heat transfer material 37.

[0068] Therefore, since the land 36 to which the thermistor 9 is connected is connected to the heat transfer material 37 filled in the filling hole 3c, the thermal conductivity from the heat sink 32 to the thermistor 9 is increased, thereby improving the detection accuracy of the thermistor 9.

[0069] The thermistor 9 may not be bonded to the land 36, but may be connected to the land 36 by wire bonding using a metal wire 38 (see FIG. 15). In this case, the thermistor 9 is bonded to the wiring board 3 by a sintered bonding material 35, for example, silver nanopaste.

[0070] In this way, the thermistor 9 is bonded to the wiring board 3 with the sintered bonding material 35 and connected to the land 36 by wire bonding, so that the light emitter 4 is bonded to the heat sink 32 with the sintered bonding material 35 and the thermistor 9 is bonded to the wiring board 3 with the sintered bonding material 35. Therefore, processes such as solder printing and reflow are not required to bond the light emitter 4 and the thermistor 9, thereby reducing the manufacturing cost and time of the light source module 31. Note that an adhesive with high heat dissipation properties may be used to bond the thermistor 9 instead of the sintered bonding material 35.

[0071] In the light source module 31 configured as described above, heat is generated in the light emitter 4 and the wiring board 3 when the light source 11 is driven, and the generated heat is transferred to the heat sink 32. The heat transferred to the heat sink 32 is dissipated to the outside from the heat dissipation fin portion 34 in addition to the base portion 33, thereby suppressing a temperature rise in the light source 11 and ensuring good light emission from the light source 11.

[0072] As described above, in the light source module 31, the light emitter 4 is attached to the heat sink 32 by being bonded with the sintered bonding material 35.

[0073] Therefore, much of the heat generated when the light source 11 is operated is transferred from the highly thermally conductive sintered bonding material 35 to the heat sink 32, increasing the amount of heat dissipation from the heat sink 32. This makes it possible to increase the amount of heat dissipation from the heat sink 32 without increasing the size of the heat sink 32, thereby improving heat dissipation while ensuring the miniaturization of the light source module 31.

[0074] Furthermore, by using silver nanopaste as the sintered bonding material 35, the light emitter 4 is bonded to the heat sink 32 by silver nanopaste, which has a particularly high thermal conductivity among the sintered bonding materials 35, thereby increasing the amount of heat generated when the light source 11 is operated and transmitted from the light emitter 4 to the heat sink 32, thereby further improving heat dissipation.

[0075] Although the above example shows the base portion 33 of the heat sink 32 formed in a flat plate shape, the base portion 33 may have a bonding recess 39 that opens upward, and the bonding recess 39 may be filled with the sintered bonding material 35 (see FIGS. 16 and 17 ). The outer shape of the bonding recess 39 is made larger than the outer shape of the light emitter 4, and the sintered bonding material 35 is attached to the entire bottom surface 12 a and at least a part of the outer peripheral surface 12 b of the package substrate 12 of the light emitter 4.

[0076] With this configuration, the light emitter 4 is attached to the heat sink 32 with the sintered bonding material 35 filled in the bonding recess 39 attached to the outer peripheral surface 12b of the package substrate 12, thereby increasing the amount of heat generated when the light source 11 is driven and transmitted from the light emitter 4 to the heat sink 32, thereby further improving heat dissipation.

[0077] Furthermore, the adhesion area (contact area) of the sintered bonding material 35 to the light emitter 4 is increased, and the bonding strength of the light emitter 4 to the heat sink 32 can be improved.

[0078] In addition, in the case of a configuration in which the light-emitting body 4 is placed in the bonding recess 39 and filled with the sintered bonding material 35, it is possible to improve heat dissipation properties and bonding strength, so a commonly used adhesive with high heat dissipation properties may be used instead of the sintered bonding material 35.

[0079] Although the example above shows the heat dissipation fin portion 34 of the heat sink 32 formed in a plate shape extending in the front-rear direction, in the light source module 31, the heat dissipation fin portion 34 may be formed by a plurality of protrusions 34a spaced apart in the front-rear direction (see FIG. 18 ). By configuring the heat dissipation fin portion 34 in this way, a space 34b through which air flows is formed between adjacent protrusions 34a in the front-rear direction.

[0080] Therefore, a flow path is formed between adjacent heat dissipation fin sections 34 in the left-right direction, allowing air to flow in the front-to-back direction, and a space 34b is formed between adjacent protrusions 34a in the front-to-back direction, allowing air to flow in the left-to-right direction, resulting in a high air flow state and ensuring high heat dissipation performance of the heat sink 32.

[0081] Furthermore, the light source module 31 may be provided with a heat dissipation body to which a plurality of heat sinks are coupled (see FIGS. 19 to 22).

[0082] For example, the heat sink 32 and the heat sink 32A may be joined together to form the heat dissipation body 40 (see FIGS. 19 and 20).

[0083] The heat sink 32A is formed by, for example, extrusion molding of aluminum, and includes a rectangular parallelepiped block portion 41 in addition to the structure of the heat sink 32. The block portion 41 is located in the center of the base portion 33 in the left-right direction.

[0084] The heat sink 32A is joined to the heat sink 32 from below, and the block portion 41 is fitted between the two heat dissipation fin portions 34 of the heat sink 32. The top surface of the block portion 41 is in surface contact with the base portion 33 of the heat sink 32, and both left and right surfaces are in surface contact with the heat dissipation fin portions 34 of the heat sink 32. The heat dissipator 40 is larger in size vertically than the heat sink 32, but is the same in size horizontally.

[0085] By using the heat sink 40 in which the heat sink 32 and the heat sink 32A are combined, the heat dissipation area is increased, and higher heat dissipation performance can be ensured.

[0086] By adopting such a configuration, for example, when a light emitter 4 with a high luminous flux specification that requires higher heat dissipation is used, high heat dissipation can be ensured by using a configuration having a heat sink 32 and a heat sink 32A coupled together, and when a light emitter 4 other than a high luminous flux specification is used, sufficient heat dissipation can be ensured by using a configuration having a heat sink 32 and no heat sink 32A coupled together.

[0087] Therefore, there is no need to design different heat sinks when a light emitter 4 with high luminous flux specifications is used and when a light emitter 4 with specifications other than high luminous flux specifications is used, and the heat sink 32 can be shared in either case, thereby reducing the manufacturing cost of the light source module 31.

[0088] Furthermore, the heat sink 32 and the heat sink 32B may be joined together to form the heat dissipator 42 (see FIGS. 21 and 22).

[0089] The heat sink 32B is formed, for example, by extrusion molding of aluminum, and has a structure that is the same as the heat sink 32 but upside down, with a rectangular parallelepiped block portion 41 and a pair of heat dissipation ends 43 at both left and right ends. The heat dissipation end 43 consists of a horizontal portion 43a that protrudes outward from the structure of the heat sink 32 to the side and a vertical portion 43b that protrudes downward from the outer end of the horizontal portion 43a in the left-right direction. The structure of the heat sink 32 in the heat sink 32B may be formed with, for example, two flow holes 44 that penetrate vertically and extend front-to-rear. The flow holes 44 form a flow path for air to flow vertically, improving heat dissipation.

[0090] The heat sink 32B is joined to the heat sink 32 from below, and the block portion 41 is fitted between the two heat dissipation fin portions 34 of the heat sink 32, with the heat dissipation fin portions 34 of the heat sink 32 positioned adjacent to the heat dissipation fin portions 34 of the heat sink 32B, and the heat dissipation end portion 43 positioned outside the heat sink 32 in the left-right direction. The upper surface of the block portion 41 is in surface contact with the base portion 33 of the heat sink 32, and both left and right surfaces are in surface contact with the heat dissipation fin portions 34 of the heat sink 32. The heat dissipator 42 is larger in left-right dimension than the heat sink 32, but is approximately the same in top-bottom dimension.

[0091] By using the heat sink 42 in which the heat sink 32 and the heat sink 32B are combined, the heat dissipation area is increased, and higher heat dissipation performance can be ensured.

[0092] By adopting such a configuration, for example, when a light emitter 4 with a high luminous flux specification that requires higher heat dissipation is used, high heat dissipation can be ensured by using a configuration having a heat sink 32 and a heat sink 32B coupled together, and when a light emitter 4 other than one with a high luminous flux specification is used, sufficient heat dissipation can be ensured by using a configuration having a heat sink 32 and no heat sink 32B coupled together.

[0093] Therefore, there is no need to design different heat sinks when a light emitter 4 with high luminous flux specifications is used and when a light emitter 4 with specifications other than high luminous flux specifications is used, and the heat sink 32 can be shared in either case, thereby reducing the manufacturing cost of the light source module 31.

[0094] The base portion 33 of the heat sink 32, heat sink 32A, and heat sink 32B may have one or more slits (not shown) extending in the front-to-rear direction. By forming the slits in the base portion 33, the surface area of ​​the heat sink 32 is further increased and an air flow path is formed, thereby further improving heat dissipation by increasing the heat dissipation area and improving air flow. However, the slits may also be formed in the heat dissipation fin portion 34.

[0095] Third Embodiment Next, a light source module 51 according to a third embodiment will be described (see FIGS. 10 and 23 to 28).

[0096] The light source module 51 is disposed in the lamp chamber 104 of the vehicle lamp 100 in place of the light source module 1, and is attached to a bracket 106 (see FIG. 10). The light source module 51 is fitted with optical components 109 such as a reflector, a lens holder, and a reflector integrated with a lens.

[0097] The light source module 51 includes a heat sink 52 for dissipating heat, a wiring board 3 attached to the heat sink 52, and a light emitter 4 attached to the heat sink 52 (see FIG. 23).

[0098] The heat sink 52 is formed, for example, by extrusion molding of aluminum, and is composed of a base portion 53 formed in the shape of a rectangular flat plate facing the vertical direction, and a plurality of heat dissipation fin portions 54 protruding downward from the base portion 53. The plurality of heat dissipation fin portions 54 are formed, for example, in the shape of a plate extending in the front-rear direction, and are positioned apart from each other on the left and right while facing the left and right direction.

[0099] Recognition marks 55 are formed on the base portion 53 of the heat sink 52, for example, on the left and right sides of the light emitter 4. The recognition marks 55 may be marks or holes (recognition holes) marked on the base portion 53. The recognition marks 55 are used as positioning marks when the light emitter 4 is attached to the heat sink 52, and are also used as positioning marks when the optical component 109 is attached to the heat sink 52.

[0100] Therefore, when the light emitter 4 is attached to the heat sink 52, the positions of the two recognition marks 55 are detected by an automatic mounting machine, and the light emitter 4 is attached to the base portion 53 by adhesive or the like based on the positional information of the detected two recognition marks 55. Furthermore, when the optical component 109 is attached to the heat sink 52, the positions of the two recognition marks 55 are detected by the same automatic mounting machine, and the optical component 109 is attached to the base portion 53 by adhesive or the like based on the positional information of the detected two recognition marks 55.

[0101] The optical component 109 has a pair of adhesive protrusions 109b spaced apart on the left and right sides that protrude rearward from the lower end of the main body 109a, and the optical component 109 is attached to the wiring board 3 on the base portion 53 by gluing the pair of adhesive protrusions 109b at left and right positions (see Figure 24).

[0102] Furthermore, the optical component 109 may be, for example, a reflector that reflects the light emitted from the light source 11 (see FIG. 24). However, a reflector integrated with a lens 110 that functions as a lens holder may also be used as the optical component 109 (see FIG. 25). When the optical component 109 is a reflector, the vehicle lamp 100 reflects light and irradiates it forward, which is a so-called parabolic type. When the optical component 109 is a reflector integrated with the lens 110, the vehicle lamp 100 controls the light using the lens 110 and irradiates it forward, which is a so-called PES (Projector Ellipsoid System) type.

[0103] In the light source module 51 configured as described above, heat is generated in the light emitter 4 and the wiring board 3 when the light source 11 is driven, and the generated heat is transferred to the heat sink 52. The heat transferred to the heat sink 52 is released to the outside from the heat dissipation fin portion 54 in addition to the base portion 53, thereby suppressing a temperature rise in the light source 11 and ensuring good light emission from the light source 11.

[0104] As shown in Patent Document 1, the light source module is used by being coupled to optical components such as a reflector and a lens holder. However, the mounting position of the optical components relative to the heat sink and the mounting position of the light emitter relative to the heat sink affect the control state of the light emitted from the light source, so it is necessary to improve the mounting accuracy of the optical components and the light emitter relative to the heat sink.

[0105] As described above, in the light source module 51, a recognition mark 55 that serves as a positioning reference is formed on the heat sink 52, and the recognition mark 55 is used as a mark for positioning the light emitter 4 relative to the heat sink 52, and also as a mark for positioning the optical component 109 relative to the heat sink 52.

[0106] Therefore, since both the light emitter 4 and the optical component 109 are attached to the heat sink 52 using the recognition mark 55 as a positioning reference, it is possible to attach the light emitter 4 and the optical component 109 to the heat sink 52 using the same equipment (automatic mounting machine), thereby improving the attachment accuracy of the light emitter 4 and the optical component 109 to the heat sink 52.

[0107] Furthermore, since the recognition mark 55 is used as a reference for positioning both the light-emitting body 4 and the optical component 109, it is possible to minimize the stacking tolerance regarding the position of the light-emitting body 4 and the optical component 109 relative to the heat sink 52, thereby increasing the positional accuracy of the light-emitting body 4 and the optical component 109 relative to the heat sink 52 and improving the light distribution performance regarding the light emitted from the light source 11.

[0108] Furthermore, since it is not necessary to form a positioning hole for attaching the optical component 109 in the heat sink 52 and it is not necessary to form a positioning pin in the optical component 109, it is possible to reduce manufacturing costs.

[0109] Furthermore, when a recognition hole is formed as the recognition mark 55, the recognition mark 55 is formed by forming a hole in the heat sink 52, so the recognition mark 55 can be easily formed, which further reduces manufacturing costs and improves the accuracy of attachment of the light-emitting body 4 and the optical component 109 to the heat sink 52.

[0110] In addition, when the recognition mark 55 is a recognition hole, the recognition mark 55 may be used as a positioning hole for positioning the optical component 109. In this case, a positioning pin to be inserted into the recognition mark 55 is provided on the optical component 109.

[0111] Furthermore, when the recognition marks 55 are used as positioning holes for positioning the optical component 109, if the two recognition marks 55 are positioned directly beside the light emitter 4, there is a possibility that the light emitter 4 and the optical component 109 may interfere with each other depending on the shape of the optical component 109 and the mounting position of the optical component 109 relative to the heat sink 52. Therefore, in such a case, it is desirable that the two recognition marks 55 be formed at a position spaced rearward from the light emitter 4 (see FIG. 26).

[0112] An example of a configuration in which an optical component 109 is attached to a heat sink 52 via a resin sheet 56 will be described below (see FIGS. 27 and 28).

[0113] The resin sheet 56 is made of a material with low thermal conductivity and is formed, for example, in a vertically elongated rectangular shape (see FIG. 27 ). A pair of resin sheets 56 are provided, and are attached to the left and right sides of the light emitter 4 and the wiring board 3 on the base portion 53. When the resin sheet 56 is used, shallow recesses are formed on both the left and right ends of the base portion 53, and the resin sheet 56 is attached to the heat sink 52 with the resin sheet 56 positioned in the recesses. By forming the recesses in the base portion 53, it is possible to prevent the light source module 51 from becoming larger in the vertical direction.

[0114] An insertion hole 56a is formed in the front end of the resin sheet 56, and the resin sheet 56 is attached to the heat sink 52 with the insertion hole 56a positioned directly above the recognition mark 55. The diameter of the insertion hole 56a is larger than the diameter of the recognition mark 55, and the central axis of the insertion hole 56a is aligned with the central axis of the recognition mark 55. Therefore, the position of the recognition mark 55 is visible through the insertion hole 56a and can be recognized by an automatic mounting machine.

[0115] The resin sheet 56 may be formed from a transparent resin material, in which case light can pass through the resin sheet 56, making it possible to recognize the position of the recognition mark 55, and the insertion hole 56a does not need to be formed.

[0116] The optical component 109 is positioned on the heat sink 52 based on the position information of the recognition mark 55 detected by the automatic mounting machine, and the pair of adhesive protrusions 109b are attached to the upper surface of the resin sheet 56 by adhesive.

[0117] In this way, the resin sheet 56 is placed on the base portion 53 at a position that avoids at least the light emitter 4 , and the optical component 109 is attached to the base portion 53 via the resin sheet 56 .

[0118] Therefore, when the light source 11 is driven, the transfer of heat from the light emitter 4 to the base portion 53 to the optical component 109 is suppressed by the resin sheet 56, thereby preventing deformation of the optical component 109 due to heat and ensuring high positional accuracy of the optical component 109 relative to the heat sink 52.

[0119] Furthermore, there is no need to reduce the intensity of the light emitted from the light source 11 in consideration of the heat resistance of the optical component 109, and the degree of freedom in light distribution design can be improved.

[0120] Furthermore, an insertion hole 56 a having a diameter larger than that of the recognition mark 55 is formed in the resin sheet 56 at a position corresponding to the recognition mark 55 .

[0121] Therefore, since the recognition mark 55 can be recognized through the insertion hole 56a, deformation of the optical component 109 due to heat can be prevented and higher positional accuracy of the optical component 109 relative to the heat sink 52 can be ensured.

[0122] In the light source module 51, a single resin sheet 56A may be used instead of the pair of resin sheets 56 (see FIG. 28 ). When the resin sheet 56A is used, the wiring board 3 is not attached to the heat sink 52, and a shallow recess in which the resin sheet 56A is placed is formed in the base portion 53.

[0123] The resin sheet 56A is made of a material with low thermal conductivity, and is integrally formed with a pair of mounting portions 57 located on both the left and right sides and a circuit forming portion 58 located between the pair of mounting portions 57.

[0124] The mounting portion 57 is formed to have the same size and shape as the resin sheet 56, and has an insertion hole 57a at its front end. The diameter of the insertion hole 57a is larger than the diameter of the recognition mark 55, and the central axis of the insertion hole 57a coincides with the central axis of the recognition mark 55.

[0125] A power supply circuit 58a identical to the power supply circuit 3a formed on the wiring board 3 is formed on the circuit forming portion 58. The front edge of the circuit forming portion 58 is positioned rearward of the front edge of the mounting portion 57. The rear end of the circuit forming portion 58 is provided as a connection terminal portion 58b similar to the connection terminal portion 3b.

[0126] A resin sheet 56A is disposed on the base portion 53 at a position avoiding the light emitter 4, and a circuit forming portion 58 is positioned behind the light emitter 4.

[0127] The optical component 109 is positioned on the heat sink 52 based on the position information of the recognition mark 55 detected by the automatic mounting machine, and the pair of adhesive protrusions 109b are attached by adhesive to the upper surface of the mounting portion 57 on the resin sheet 56A.

[0128] As described above, the resin sheet 56A is placed on the base portion 53 at a position avoiding the light emitter 4, and the optical component 109 is attached to the base portion 53 via the resin sheet 56A.

[0129] Therefore, when the light source 11 is driven, the transfer of heat from the light emitter 4 to the base portion 53 to the optical component 109 is suppressed by the resin sheet 56A, thereby preventing deformation of the optical component 109 due to heat and ensuring high positional accuracy of the optical component 109 relative to the heat sink 52.

[0130] Furthermore, there is no need to reduce the intensity of the light emitted from the light source 11 in consideration of the heat resistance of the optical component 109, and the degree of freedom in light distribution design can be improved.

[0131] Furthermore, an insertion hole 57 a having a diameter larger than that of the recognition mark 55 is formed in the resin sheet 56A at a position corresponding to the recognition mark 55 .

[0132] Therefore, since the recognition mark 55 can be recognized through the insertion hole 57a, deformation of the optical component 109 due to heat can be prevented and higher positional accuracy of the optical component 109 relative to the heat sink 52 can be ensured.

[0133] Furthermore, a power supply circuit 58a for supplying power to the light emitter 4 is formed on the resin sheet 56A.

[0134] Therefore, since a portion of the resin sheet 56A is provided as a wiring board, there is no need to use a dedicated wiring board, and the number of parts can be reduced while preventing deformation of the optical component 109 due to heat and ensuring high positional accuracy of the optical component 109 relative to the heat sink 52.

[0135] Furthermore, the resin sheet 56A may be formed from a transparent resin material, in which case light can pass through the resin sheet 56A, making the position of the recognition mark 55 recognizable, and the insertion hole 57a does not need to be formed.

[0136] REFERENCE SIGNS LIST 1 light source module 2 heat sink 3 wiring board 3a power supply circuit 4 light emitter 5 base portion 6 heat dissipation fin portion 7 first surface portion 8 second surface portion 9 thermistor 10 metal wire 11 light source 12 package substrate 6A heat dissipation fin portion 7A first surface portion 13 slit 2A heat sink 5A base portion 2B heat sink 2C heat sink 2D heat sink 31 light source module 32 heat sink 33 base portion 34 heat dissipation fin portion 35 sintered bonding material 36 land 37 heat transfer material 3c filling hole 38 metal wire 39 bonding recess 12b outer peripheral surface 34a protrusion 34b space 32A heat sink 32B heat sink 51 light source module 52 heat sink 53 base portion 55 Recognition mark 56 Resin sheet 56a Insertion hole 56A Resin sheet 57a Insertion hole 58a Power supply circuit

Claims

1. A light source module comprising: a light-emitting body using a light-emitting diode as a light source; a heat sink to which the light-emitting body is attached and which dissipates heat generated when the light-emitting body is operated; and a wiring board attached to the heat sink and on which a power supply circuit for supplying power to the light-emitting body is formed, the heat sink being formed by bending an aluminum plate, and the heat sink being provided with a base portion to which the light-emitting body and the wiring board are attached, and heat dissipation fin portions which are continuous with at least both ends of the base portion and are bent relative to the base portion.

2. The light source module according to claim 1, wherein a part of the heat dissipation fin portion is positioned inside the outer periphery of the base portion while being separated from the base portion in the thickness direction of the base portion.

3. A light source module as described in claim 2, wherein the heat dissipation fin portion comprises a first surface portion connected to both ends of the base portion and a second surface portion connected to the first surface portion, and the second surface portion is positioned so as to face the base portion in the thickness direction of the base portion.

4. The light source module according to claim 1, 2 or 3, wherein the surface of the heat sink is subjected to a blasting treatment.

5. The light source module according to claim 1, 2 or 3, wherein a slit is formed in the base portion.

6. A light source module comprising: a light-emitting body using a light-emitting diode as a light source; a heat sink to which the light-emitting body is attached and which dissipates heat generated when the light-emitting body is operated; and a wiring board attached to the heat sink and on which a power supply circuit for supplying power to the light-emitting body is formed, the light-emitting body being attached by bonding to the heat sink with a sintered bonding material.

7. The light source module according to claim 6, wherein silver nanopaste is used as the sintered binder.

8. A light source module as described in claim 6 or claim 7, wherein the light emitter has a package substrate on which the light emitting diode is mounted, a bonding recess is formed in the heat sink into which the sintered bonding material is filled, the light emitter is disposed in the bonding recess, and the sintered bonding material is attached to at least a portion of the outer circumferential surface of the package substrate.

9. A light source module according to claim 6 or 7, wherein a thermistor for detecting temperature is bonded to said wiring board by said sintered bonding material, and said thermistor is connected to a land formed on said wiring board by wire bonding.

10. A light source module as claimed in claim 6 or 7, wherein a thermistor for detecting temperature is bonded to a land formed on said wiring board, a filling hole is formed in said wiring board, and said filling hole is filled with a heat transfer material connected to said land.

11. A light source module comprising: a light-emitting body using a light-emitting diode as a light source; and a heat sink to which the light-emitting body is attached and which dissipates heat generated when the light-emitting body is driven, wherein a recognition mark serving as a reference for positioning is formed on the heat sink, and the recognition mark is used as a mark for positioning the light-emitting body relative to the heat sink and also as a mark for positioning an optical component relative to the heat sink.

12. The light source module according to claim 11, wherein a recognition hole is formed as the recognition mark.

13. A light source module as described in claim 11 or claim 12, wherein the heat sink is provided with a base portion on which the light emitter is attached, a resin sheet is arranged on the base portion at a position that avoids at least the light emitter, and the optical component is attached to the base portion via the resin sheet.

14. The light source module according to claim 13, wherein an insertion hole having a diameter larger than that of the recognition mark is formed in the resin sheet at a position corresponding to the recognition mark.

15. The light source module according to claim 13, wherein a power supply circuit for supplying power to the light emitter is formed on the resin sheet.

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