Electronic device comprising optical module

Abstract

The electronic device may include a camera module and an optical module. The optical module may comprise: a substrate; a plurality of light-emitting elements disposed on the substrate; and a first light-receiving element disposed on the substrate and configured to operate independently of the plurality of light-emitting elements.

Description

Electronic device including an optical module

[0001] The disclosure generally relates to an electronic device comprising an optical module, for example, an electronic device comprising an optical module comprising a light emitting element and a light receiving element.

[0002] An optical module, which may be referred to as a flash or strobe, may include a light-emitting element, such as a light-emitting diode (LED), configured to illuminate a space outside the light-emitting element. Electronic devices including one or more camera modules and light modules are being developed to support various photographic environments or conditions. The background art described above is possessed or acquired during the process of deriving the present disclosure and cannot necessarily be considered as publicly known art prior to the filing of the present disclosure.

[0003] An electronic device may include a camera module and an optical module. The optical module may include a substrate, a plurality of light-emitting elements disposed on the substrate, and a first light-receiving element disposed on the substrate and configured to be driven independently of the plurality of light-emitting elements.

[0004] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become apparent from the following detailed description with reference to the accompanying drawings.

[0005] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0006] FIG. 2 is a block diagram illustrating a camera module according to one embodiment.

[0007] FIG. 3 is a perspective view of a one-way electronic device according to one embodiment.

[0008] FIG. 4 is a perspective view of an electronic device in another direction according to one embodiment.

[0009] Figure 5 is a plan view of an optical module according to one embodiment.

[0010] Fig. 6 is a cross-sectional view taken along line 6-6 of the optical module of Fig. 5.

[0011] FIG. 7 is a plan view of an optical module with optical elements removed according to one embodiment.

[0012] Fig. 8 is a cross-sectional view along line 8-8 of the light emitting element of Fig. 7.

[0013] Fig. 9 is a cross-sectional view taken along line 9-9 of the light-receiving element of Fig. 7.

[0014] Figure 10 is a block diagram of an electronic device according to one embodiment.

[0015] Figure 11 is a block diagram of an electronic device according to one embodiment.

[0016] Figure 12 is a block diagram of an electronic device according to one embodiment.

[0017] FIG. 13 is a diagram illustrating an optical module according to one embodiment.

[0018] FIG. 14 is a diagram illustrating an optical module according to one embodiment.

[0019] FIG. 15 is a diagram illustrating an optical module according to one embodiment.

[0020] Figure 16 is a plan view of an optical module according to one embodiment.

[0021] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0022] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0023] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0024] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0025] The memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134).

[0026] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0027] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0028] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0029] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0030] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0031] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0032] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0033] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., the electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0034] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0035] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0036] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0037] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0038] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0039] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0040] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0041] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0042] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0043] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0044] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0045] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0046] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0047] Embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0048] According to one embodiment, the method according to the embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0049] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0050] FIG. 2 is a block diagram illustrating a camera module according to one embodiment.

[0051] Referring to FIG. 2, the camera module (180) may include a lens assembly (210), a flash (220), an image sensor (230), an image stabilizer (240), a memory (250) (e.g., a buffer memory), or an image signal processor (260). The lens assembly (210) may collect light emitted from a subject that is a target of image capturing. The lens assembly (210) may include one or more lenses. According to one embodiment, the camera module (180) may include a plurality of lens assemblies (210). In this case, the camera module (180) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (210) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties that are different from the lens properties of the other lens assemblies. A lens assembly (210) may include, for example, a wide-angle lens or a telephoto lens.

[0052] The flash (220) can emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash (220) can include one or more light-emitting diodes (e.g., red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor (230) can acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (210) into an electrical signal. According to one embodiment, the image sensor (230) can include one image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same property, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (230) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0053] The image stabilizer (240) can move at least one lens or image sensor (230) included in the lens assembly (210) in a specific direction or control the operating characteristics of the image sensor (230) (e.g., adjusting the read-out timing, etc.) in response to the movement of the camera module (180) or the electronic device (101) including the same. This allows compensating for at least some of the negative effects of the movement on the captured image. In one embodiment, the image stabilizer (240) can detect such movement of the camera module (180) or the electronic device (101) by using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module (180). In one embodiment, the image stabilizer (240) can be implemented as, for example, an optical image stabilizer. The memory (250) can temporarily store at least a portion of the image acquired through the image sensor (230) for the next image processing task. For example, when image acquisition is delayed due to the shutter, or when multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (250), and a corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (160). Thereafter, when a specified condition is satisfied (e.g., a user input or a system command), at least a portion of the original image stored in the memory (250) can be acquired and processed, for example, by the image signal processor (260). According to one embodiment, the memory (250) can be configured as at least a portion of the memory (130) or as a separate memory that operates independently therefrom.

[0054] The image signal processor (260) can perform one or more image processing operations on an image acquired through an image sensor (230) or an image stored in a memory (250). The one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor (260) may perform control (e.g., exposure time control, read-out timing control, etc.) on at least one of the components included in the camera module (180) (e.g., image sensor (230)). An image processed by the image signal processor (260) may be stored back in the memory (250) for further processing or provided to an external component of the camera module (180) (e.g., memory (130), display module (160), electronic device (102), electronic device (104), or server (108)). According to one embodiment, the image signal processor (260) may include at least one of the processors (120). It may be configured as a separate processor that is configured as a part of the processor (120) or operates independently of the processor (120). If the image signal processor (260) is configured as a separate processor from the processor (120), at least one image processed by the image signal processor (260) may be displayed through the display module (160) as is or after undergoing additional image processing by the processor (120).

[0055] According to one embodiment, the electronic device (101) may include a plurality of camera modules (180), each having different properties or functions. In this case, for example, at least one of the plurality of camera modules (180) may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (180) may be a front camera, and at least another may be a rear camera.

[0056] Figure 3 is a perspective view of an electronic device in one direction according to one embodiment. Figure 4 is a perspective view of an electronic device in another direction according to one embodiment.

[0057] Referring to FIGS. 3 and 4, an electronic device (301) (e.g., the electronic device (101) of FIG. 1) may include a housing (310) having a first side (310A) (e.g., a front side), a second side (310B) (e.g., a back side), and a third side (310C) (e.g., a side side) surrounding a space between the first side (310A) and the second side (310B). The first side (310A) may be formed by a first plate (311A) that is at least partially transparent. For example, the first plate (311A) may include a glass plate or a polymer plate that includes at least one coating layer. The second side (310B) may be formed by a second plate (311B) that is substantially opaque. For example, the second plate (311B) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination thereof. The third surface (310C) may be formed by a frame (311C) that is joined to the first plate (311A) and the second plate (311B) and includes a metal and / or polymer. The second plate (311B) and the frame (311C) may be formed monolithically. The second plate (311B) and the frame (311C) may be formed of substantially the same material (e.g., aluminum).

[0058] The electronic device (301) may include an input module (350) (e.g., the input module (150) of FIG. 1). The input module (350) may be disposed on the third surface (310C). The input module (350) may include at least one key input device. For example, the key input device may include one or more mechanical actuators (e.g., buttons), one or more capacitors, and / or one or more inductors.

[0059] The electronic device (301) may include an audio output module (355) (e.g., the audio output module (155) of FIG. 1). The audio output module (355) may be disposed on the third surface (310C). The audio output module (355) may include one or more holes.

[0060] The electronic device (301) may include a display module (361) (e.g., the display module (160) of FIG. 1). The display module (361) may be disposed on the first surface (310A). The display module (361) may be visible through at least a portion of the first plate (311A). The display module (361) may have a shape substantially the same as the shape of the outer edge of the first plate (311A). The edge of the display module (361) may substantially coincide with the outer edge of the first plate (311A). The display module (361) may include a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic stylus pen. The display module (361) may include a screen display area (361A) that is visually exposed and displays content through pixels. The display area (361A) may include a sensing area (361A-1). The sensing area (361A-1) may overlap with at least a portion of the display area (361A). The sensing area (361A-1) may allow transmission of an input signal related to the sensor module (376) (e.g., the sensor module (176) of FIG. 1 ). The sensing area (361A-1) may display content similarly to the display area (361A) that does not overlap with the sensing area (361A-1). For example, the sensing area (361A-1) may display content while the sensor module (376) is not operating. At least a portion of the camera area (361A-2) may overlap with the display area (361A). The display area (361A) may include the camera area (361A-2). The camera area (361A-2) may allow transmission of an optical signal associated with a first camera module (380A) (e.g., camera module (180) of FIG. 1 and / or camera module (180) of FIG. 2).At least a portion of the camera area (361A-2) overlapping the screen display area (361A) may display content similarly to the screen display area (361A) that does not overlap the camera area (361A-2). For example, the camera area (361A-2) may display content while the first camera module (380A) is not operating.

[0061] The electronic device (301) may include an audio module (370) (e.g., the audio module (170) of FIG. 1). The audio module (370) may be positioned on the third surface (310C). The audio module (370) may obtain sound through at least one hole.

[0062] The electronic device (301) may include a sensor module (376). The sensor module (376) may be disposed on the first surface (310A). The sensor module (376) may form a sensing area (361A-1) in at least a portion of the screen display area (361A). The sensor module (376) may receive an input signal passing through the sensing area (361A-1) and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). The input signal may include a signal related to a user's biometric information (e.g., a fingerprint).

[0063] The electronic device (301) may include a connection terminal (378) (e.g., the connection terminal (178) of FIG. 1). The connection terminal (378) may be positioned on the third surface (310C). For example, when the electronic device (301) is viewed in one direction (e.g., the +Y direction), the connection terminal (378) may be positioned substantially in the center of the third surface (310C), and the audio output module (355) may be positioned on one side (e.g., the right) with respect to the connection terminal (378).

[0064] The electronic device (301) may include a first camera module (380A) (e.g., the camera module (180) of FIG. 1 and / or the camera module (180) of FIG. 2). The first camera module (380A) may be disposed on the first surface (310A). At least a portion of the first camera module (380A) may be disposed below the display module (361). The first camera module (380A) may receive an optical signal that passes through the camera area (361A-2).

[0065] The electronic device (301) may include a plurality of second camera modules (380B) (e.g., the camera module (180) of FIG. 1 and / or the camera module (180) of FIG. 2). The plurality of second camera modules (380B) may be disposed on the second surface (310B). The plurality of second camera modules (380B) may be arranged in one direction (e.g., the Y direction) of the second plate (311B). The plurality of second camera modules (380B) may have different fields of view. For example, the plurality of second camera modules (380B) may include an ultra wide-angle camera, a wide-angle camera, and / or a tele camera.

[0066] The electronic device (301) may include an optical module (380C) (e.g., the flash (220) of FIG. 2). The optical module (380C) may be disposed on the second surface (310B). The optical module (380C) may include one or more light-emitting diodes or xenon lamps. The optical module (380C) may include a sensor configured to detect external light. For example, the sensor may include a flicker sensor.

[0067] Meanwhile, the embodiments disclosed in this document can be applied to electronic devices of various shapes / forms (e.g., foldable electronic devices, slideable electronic devices, rollable electronic devices, digital cameras, digital video cameras, tablets, note-shaped electronic devices, and other electronic devices) in addition to the electronic devices illustrated in FIGS. 3 and 4.

[0068] In this document, terms such as "substantially," "approximately," "typically," and "about" when referring to a given parameter, property, or condition may include the extent to which a person of ordinary skill in the art would understand the given parameter, property, or condition to be satisfied with a small degree of variance, such as within acceptable manufacturing tolerances. For example, a particular parameter that is substantially satisfied may be satisfied at least about 90% of the time, or at least about 95% of the time, or at least 99% of the time.

[0069] Fig. 5 is a plan view of an optical module according to one embodiment. Fig. 6 is a cross-sectional view taken along line 6-6 of the optical module of Fig. 5.

[0070] Referring to FIGS. 5 and 6, an electronic device (400) (e.g., the electronic device (101) of FIG. 1 , the electronic device (101) of FIG. 2 , and / or the electronic device (301) of FIGS. 3 and 4 ) may include a housing (310). The housing (310) may include a hole (H). The hole (H) may be circular or oval. In an example not shown, the hole (H) may be polygonal. The hole (H) may penetrate the second plate (311B) from a first side (e.g., the -Z direction side) of the second plate (311B) to a second side (e.g., the +Z direction side). In an example not shown, the hole (H) may be included in an optical module (480). For example, the optical module (480) may include a plate (not shown) configured to be coupled (e.g., assembled) to a second plate (311B), and a hole (H) arranged in the plate.

[0071] The electronic device (400) may include an optical module (480) (e.g., the optical module (380C) of FIGS. 3 and 4). The optical module (480) may be disposed within the housing (310). The optical module (480) may be disposed to face the second plate (311B). In an embodiment not shown, the optical module (480) may be disposed to face the first plate (not shown) opposite the second plate (311B) (e.g., the first plate (311A) of FIGS. 3 and 4).

[0072] The optical module (480) may include a substrate (481). The substrate (481) may be referred to as a “printed circuit board” or a “flexible printed circuit board.” The substrate (481) may include electrical circuitry for one or more elements (e.g., a light emitting element (482) and / or a light receiving element (483)) disposed on the substrate (481). The substrate (481) may have a surface facing the hole (H) (e.g., a −Z-direction surface).

[0073] The optical module (480) may include one or more light-emitting elements (482). The one or more light-emitting elements (482) may be configured to illuminate light of a specific wavelength band. For example, the light-emitting elements (482) may include light-emitting diodes (LEDs). The specific wavelength band may be an infrared band or a visible light band. The one or more light-emitting elements (482) may be disposed on a surface of the substrate (481) facing the hole (H) (e.g., a -Z direction surface).

[0074] The optical module (480) may include one or more light-receiving elements (483). The one or more light-receiving elements (483) may be configured to receive light (e.g., ambient light) coming from a space in which the electronic device (400) is placed. For example, the light-receiving elements (483) may include a photodiode.

[0075] The light-emitting element (482) may be configured to be driven independently of the light-receiving element (483). Here, “independently driven” may mean that the operation of the light-emitting element (482) and the operation of the light-receiving element (483) do not substantially affect each other. For example, when the light-emitting element (482) is in an operated state (e.g., an ON state), the light-receiving element (483) may remain in an inoperative state (e.g., an OFF state). Conversely, when the light-emitting element (482) is in an inoperative state (e.g., an OFF state), the light-receiving element (483) may be in an operated state (e.g., an ON state). Light from the light-emitting element (482) may not directly enter the light-receiving element (483).

[0076] The plurality of light emitting elements (482) may be configured to operate substantially simultaneously. For example, the plurality of light emitting elements (482) may have substantially the same duty cycle.

[0077] The number of light-emitting elements (482) may be significantly larger than the number of light-receiving elements (483). Here, “substantially larger” may mean that the number of light-emitting elements (482) is at least three times, at least four times, at least five times, at least six times, at least seven times, at least eight times, or more than the number of light-receiving elements (483). The area occupied by the plurality of light-emitting elements (482) on the substrate (481) may be larger than the area occupied by one or more light-receiving elements (483) on the substrate (481). Increasing the number of light-emitting elements (482) relative to the number of light-receiving elements (483) may not substantially increase the size of the light module (480). This may increase the degree of design freedom of the plurality of light-emitting elements (482) and the one or more light-receiving elements (483).

[0078] The electronic device (400) may include a lens (L). In this document, the lens (L) may be referred to as an “optical element.” The lens (L) may provide a required field of view (FOV) for one or more light-emitting elements (482) and one or more light-receiving elements (483). For example, the lens (L) may include a Fresnel lens. However, the shape and / or type of the lens (L) is not limited thereto, and various shapes and / or types of lenses may be applied. An optical element such as the lens (L) may provide light distribution of one or more light-emitting elements (482).

[0079] The lens (L) may have an optical axis (OA) (e.g., a Z-axis). The optical axis (OA) may be defined as an extended line connecting the center of curvature of a first surface of the lens (L) (e.g., a +Z-direction surface of the lens body (L1)) and the center of curvature of a second surface of the lens (L) opposite to the first surface (e.g., a -Z-direction surface of the lens body (L1)).

[0080] The lens (L) may include a lens body (L1). The lens body (L1) may be configured to align with the hole (H). For example, the lens body (L1) may be configured to be substantially aligned with the optical axis (OA) and the hole axis (HA) (e.g., the Z-axis). The lens body (L1) may extend within the hole (H) and beyond the hole (H) toward the interior of the housing (310).

[0081] The lens (L) may include a lens flange (L2). The lens flange (L2) may extend radially from the lens body (L1). The lens flange (L2) may be disposed within the housing (310). The lens flange (L2) may be spaced apart from the second plate (311B) by a gap. The lens flange (L2) may be attached to the second plate (311B) via one or more suitable adhesives (AD).

[0082] In an embodiment not shown, the electronic device (400) may not include a lens (L). For example, light from one or more light-emitting elements (482) may escape outside the housing (310) without an optical system. Light outside the housing (310) (e.g., ambient light) may enter one or more light-receiving elements (483) without an optical system.

[0083] In an embodiment not shown, the lens (L) may be integrally integrated into the optical module (480). In an embodiment not shown, the lens (L) may be a separate component from the optical module (480).

[0084] In an embodiment not shown, the electronic device (400) may include a reflector (not shown), which may be referred to as an “optical element.” The reflector may be positioned between the optical module (480) and the hole (H). The reflector may be integrally integrated into the optical module (480). The reflector may be a separate component from the optical module (480).

[0085] FIG. 7 is a plan view of an optical module with optical elements removed according to one embodiment.

[0086] Referring to FIG. 7, the light module (480) may include a plurality of light-emitting elements (482). For example, the number of light-emitting elements (482) is illustrated as nine, but may not be limited thereto. The light module (480) including a plurality of light-emitting elements (482) enables adjustment of the light-emitting area and implements a light source suitable for various conditions.

[0087] A plurality of light-emitting elements (482) can form an array. The plurality of light-emitting elements (482) can be arranged in a first direction (e.g., + / - X direction) of the substrate (481) and in a second direction (e.g., + / - Y direction) of the substrate (481) that is different from the first direction. The first direction and the second direction can be substantially orthogonal to each other.

[0088] The array of multiple light-emitting elements (482) may be in the form of an N x M matrix. Here, N and M may be natural numbers greater than or equal to 1, N may be the number of light-emitting elements (482) in a first direction (e.g., + / -X direction) of the substrate (481), and M may be the number of light-emitting elements (482) in a second direction (e.g., + / -Y direction) of the substrate (481). In a non-limiting example, the array may be in the form of a 3 x 3 matrix.

[0089] The plurality of light-emitting elements (482) can be configured to be driven by specific regions (AR). In a non-limiting example, the array can be divided into regions (AR) in a 2 x 2 matrix form, regions (AR) in a 3 x 1 matrix form, and regions (AR) in a 1 x 2 matrix form. The brightness of light emitted by one or more light-emitting elements (482) arranged in one region (AR) can be different from the brightness of light emitted by one or more light-emitting elements (482) arranged in another region (AR).

[0090] The plurality of light-emitting elements (482) may have various combinations of optical characteristics. In one example, the illumination angle of one light-emitting element (482) may be different from the illumination angle of another light-emitting element (482). In one example, the wavelength band of light emitted by one light-emitting element (482) may be different from the wavelength band of light emitted by another light-emitting element (482).

[0091] The plurality of light-emitting elements (482) may be arranged symmetrically. For example, the plurality of light-emitting elements (482) may be symmetrical with respect to a first direction (e.g., + / - X direction) of the substrate (481). The plurality of light-emitting elements (482) may be symmetrical with respect to a second direction (e.g., + / - Y direction) of the substrate (481). The plurality of light-emitting elements (482) may be point-symmetrical with respect to a point (e.g., a center point) where the hole axis (HA) passes through the substrate (481). The symmetrical structure of the light-emitting elements (482) may provide natural external visibility without a sense of incongruity when viewing the inside of the electronic device (400) and / or aesthetics when viewing the electronic device (400) from the outside.

[0092] The optical module (480) may include one or more (e.g., four) light-receiving elements (483). The light-receiving elements (483) may be disposed on a substrate (481) on which an array of a plurality of light-emitting elements (482) is disposed. In one example, the one or more light-receiving elements (483) may be disposed within an array area of ​​the substrate (481) defined by the array of the plurality of light-emitting elements (482) (e.g., an array area defined by a 3 x 3 matrix configuration). In some examples, the one or more light-receiving elements (483) may not overlap with the light-emitting elements (482) when the substrate (481) is viewed in one direction (e.g., in the + / -X direction and / or the + / -Y direction). In a further example, a light-receiving element (483) may overlap a pair of adjacent light-emitting elements (482) when viewed diagonally across the substrate (481) (e.g., + / -45 degrees and / or + / -135 degrees about the hole axis (HA) in FIG. 7). In an example not shown, one or more light-receiving elements (483) may overlap one or more light-emitting elements (482) when viewed in one direction across the substrate (481).

[0093] The one or more light-receiving elements (483) can be arranged substantially coaxially with the plurality of light-emitting elements (482). The directionality of the cone of view (FOV) of the one or more light-receiving elements (483) can be substantially coincident with or parallel to the directionality of the cone of view (FOV) of each of the plurality of light-emitting elements (482). The plurality of light-emitting elements (482) and the one or more light-receiving elements (483) can be substantially aligned with the hole (H) of the electronic device (400). The plurality of light-emitting elements (482) and the one or more light-receiving elements (483) can be substantially non-eccentric with respect to the hole axis (HA) of the hole (H). This allows the angle of light incident on the light-receiving elements (483) to be constant (e.g., within a range of about 30 degrees to about 60 degrees with respect to the centerline of the cone of light-receiving elements (483)) regardless of the direction in which the substrate (481) is viewed. Additionally, this may enable not only the ability to detect ambient light, such as a flicker sensor, but also absolute measurement of ambient light, such as a light sensor. Furthermore, this may increase the degree of design freedom in the arrangement of multiple light-emitting elements (482) and one or more light-receiving elements (483), as well as the associated optical system (e.g., an optical element such as the lens (L) of FIG. 6).

[0094] One or more light-receiving elements (483) can be at a first distance from the hole axis (HA), and at least some of the light-emitting elements (482) of the plurality of light-emitting elements (482) can be at a second distance from the hole axis (HA) that is greater than the first distance. One or more light-receiving elements (483) can be disposed in a central region among the regions of the substrate (481) that are aligned with the hole (HA). At least some of the light-emitting elements (482) can be disposed in a peripheral region outside the central region among the regions of the substrate (481) that are aligned with the hole (H). Any at least one light-emitting element (482) can be disposed on the hole axis (HA). In an embodiment not shown, one or more light-receiving elements (483) can be disposed on the hole axis (HA).

[0095] A plurality (e.g., four) of light-receiving elements (483) may be arranged symmetrically. For example, the plurality of light-receiving elements (483) may be symmetrical with respect to a first direction (e.g., + / - X direction) of the substrate (481). The plurality of light-receiving elements (483) may be symmetrical with respect to a second direction (e.g., + / - Y direction) of the substrate (481). The plurality of light-receiving elements (483) may be point-symmetrical with respect to a point (e.g., a center point) where the hole axis (HA) passes through the substrate (481). The symmetrical structure of the light-receiving elements (483) may provide natural external visibility without a sense of incongruity when viewing the inside of the electronic device (400) and / or aesthetics when viewing the electronic device (400) from the outside.

[0096] Fig. 8 is a cross-sectional view along line 8-8 of the light emitting element of Fig. 7.

[0097] Referring to FIG. 8, an optical module (480) may include a substrate (481) including an at least partially formed recess (SR). The optical module (480) may include a light-emitting element (482). The light-emitting element (482) may be disposed in the recess (SR). In an embodiment not shown, the light-emitting element (482) may be disposed in an area of ​​the substrate (481) where the recess (SR) is not formed. The optical module (480) may include a phosphor (484) disposed on the light-emitting element (482). The phosphor (484) may be configured to emit light in the visible light band by absorbing light in a specific band of light emitted by the light-emitting element (e.g., a band close to ultraviolet in the visible light band, which may be referred to as a “deep blue band,” or an ultraviolet band) when exposed to that band. For example, the phosphor (484) can be made of powdered cerium-doped yttrium aluminum garnet (YAG:Ce) crystals. The phosphor (484) can substantially surround the entire light-emitting element (482). The recess (SR) can be filled with the phosphor (484).

[0098] In an embodiment not shown, the optical module (480) may include an optical element (not shown) disposed on a light emitting element (482). For example, the optical element may include a lens or a reflector. In one embodiment, the optical element may be disposed for each individual light emitting element (482). In one embodiment, the optical element may be disposed corresponding to one or more light emitting elements (482) disposed in a specific area on the substrate (481). In one embodiment, the optical element may be disposed corresponding to one or more light emitting elements (482) disposed in substantially the entire area on the substrate (481).

[0099] Fig. 9 is a cross-sectional view taken along line 9-9 of the light-receiving element of Fig. 7.

[0100] Referring to FIG. 9, the optical module (480) may include one or more light-receiving elements (483) arranged on a substrate (481). For example, the optical module (480) may include a first light-receiving element (483A) and a second light-receiving element (483B).

[0101] The optical module (480) may include an optical filter (F) configured to convert light entering one or more light-receiving elements (483) into light of a specific band. For example, the optical filter (F) may be implemented as an optical film. The optical filter (F) may include a first optical filter (F1) disposed over a first light-receiving element (483A), and a second optical filter (F2) disposed over a second light-receiving element (483B). The first optical filter (F1) and the second optical filter (F2) may have different optical characteristics. In a non-limiting example, the first optical filter (F1) may convert incident light into light of a wavelength band of about 660 nm, and the second optical filter (F2) may convert incident light into light of a wavelength band of about 340 nm. This may enable measurement of the amount of light for each wavelength. Light converted by passing through the first optical filter (F1) and / or the second optical filter (F2) can be transmitted to the first light-receiving element (483A) and / or the second light-receiving element (483B).

[0102] In an embodiment not shown, the optical filter (F) may be implemented as a single optical filter. In an embodiment not shown, the optical filter (F) may include a number of optical filters greater than the number of light-receiving elements (483). The increased number of optical filters may improve the sensitivity of the light-receiving elements (483).

[0103] The optical module (480) may include one or more optical elements (ML). For example, the optical elements (ML) may include a first microlens (ML1) disposed on a first optical filter (F1) and a second microlens (ML2) disposed on a second optical filter (F2). As illustrated, the first microlens (ML1) and the second microlens (ML2) may be disposed corresponding to the first light-receiving element (483A) and the second light-receiving element (483B). In an embodiment not illustrated, the optical elements (ML) may be disposed corresponding to one or more light-receiving elements (483) disposed in a specific area on the substrate (481). In an embodiment not illustrated, the optical elements (ML) may be disposed corresponding to one or more light-receiving elements (483) disposed in substantially the entire area on the substrate (481). In an embodiment not illustrated, the optical elements (ML) may include a reflector.

[0104] Figure 10 is a block diagram of an electronic device according to one embodiment.

[0105] Referring to FIG. 10, an electronic device (500) (e.g., the electronic device (101) of FIG. 1, the electronic device (101) of FIG. 2, the electronic device (301) of FIGS. 3 and 4, and / or the electronic device (400) of FIGS. 5 to 7) may include a processor (120) and an optical module (580) (e.g., the optical module (380C) of FIGS. 3 and 4, and / or the optical module (480) of FIGS. 5 to 9). The optical module (580) may include one or more light-emitting elements (582) (e.g., the light-emitting elements (482) of FIGS. 5 to 8), one or more light-receiving elements (583) (e.g., the light-receiving elements (483) of FIGS. 5 to 7 and 9), and a controller (530). The controller (530) may be configured to control the operation of one or more light-emitting elements (582) and / or the operation of one or more light-receiving elements (583). For example, the controller (530) may include a microcontroller unit (MCU).

[0106] The controller (530) may include a first channel (CH1) configured to individually control a plurality of light-emitting elements (582). For example, the controller (530) may be configured to control the ON / OFF operation timing of each of the plurality of light-emitting elements (582) and / or the distribution of current to be applied to the plurality of light-emitting elements (582) through the first channel (CH1).

[0107] The controller (530) may include a second channel (CH2) configured to control a plurality of light-emitting elements (582) according to a specific area. For example, the controller (530) may control an area (AR) of an array of light-emitting elements (482) in a 2 x 2 matrix form, an area (AR) of an array of light-emitting elements (482) in a 3 x 1 matrix form, and an area (AR) of an array of light-emitting elements (482) in a 1 x 2 matrix form, as illustrated in FIG. 7. The controller (530) may supply a first power to the light-emitting elements (482) arranged in one area (AR) so that the light-emitting elements (482) emit light of a first brightness, and may supply a second power different from the first power to the light-emitting elements (482) arranged in another area (AR) so that the light-emitting elements (482) emit light of a second brightness different from the first brightness.

[0108] The controller (530) may include a third channel (CH3) configured to control the plurality of light-emitting elements (582) as a whole. The controller (530) may be configured to control the ON / OFF operation timing of the plurality of light-emitting elements (582) arranged substantially over the entire area or the distribution of current to be applied thereto through the third channel (CH3).

[0109] The controller (530) may be configured to control one or more specific light emitting elements (582) in response to commands from the processor (120). For example, the processor (120) may transmit a command signal to the controller (530) to cause one or more specific light emitting elements (582) to operate at a specific brightness.

[0110] In an embodiment not shown, the controller (530) may include more channels than the number of channels (CH1, CH2, CH3) shown. In an embodiment not shown, the controller (530) may control the light emitting element (582) through a single channel.

[0111] The controller (530) may be configured to compute various result values ​​using electrical signals converted by the light-receiving elements (583) from one or more light-receiving elements (583). For example, the controller (530) may be configured to perform binning, skipping, and / or weighting.

[0112] The controller (530) may be configured to receive a request from the processor (120) and obtain information (e.g., RGB values) regarding one or more light-receiving elements (583). The obtained information regarding the light-receiving elements (583) may be transmitted to the processor (120).

[0113] One or more light-emitting elements (582) and one or more light-receiving elements (583) can be controlled by a single stand-alone controller (530). Considering the integrated environment of the electronic device (500), it may be advantageous to use a controller (530) separately from the processor (120) to control the operation of multiple light-emitting elements (582) and / or light-receiving elements (583).

[0114] Figure 11 is a block diagram of an electronic device according to one embodiment.

[0115] Referring to FIG. 11, an electronic device (500-1) (e.g., the electronic device (101) of FIG. 1, the electronic device (101) of FIG. 2, the electronic device (301) of FIGS. 3 and 4, the electronic device (400) of FIGS. 5 to 7, and / or the electronic device (500) of FIG. 10) may include a processor (120), an optical module (580-1) (e.g., the optical module (380C) of FIGS. 3 and 4, the optical module (480) of FIGS. 5 to 9, and / or the optical module (580) of FIG. 10), and a controller (530). The optical module (580-1) may include one or more light-emitting elements (582) and one or more light-receiving elements (583). The controller (530) may be disposed outside the optical module (580-1). The controller (530) may be placed in the electronic device (500-1) separately from the processor (120).

[0116] Figure 12 is a block diagram of an electronic device according to one embodiment.

[0117] Referring to FIG. 12, an electronic device (500-2) (e.g., the electronic device (101) of FIG. 1, the electronic device (101) of FIG. 2, the electronic device (301) of FIGS. 3 and 4, the electronic device (400) of FIGS. 5 to 7, the electronic device (500) of FIG. 10, and / or the electronic device (500-1) of FIG. 11) may include a processor (120) and an optical module (580-2) (e.g., the optical module (380C) of FIGS. 3 and 4, the optical module (480) of FIGS. 5 to 9, the optical module (580) of FIG. 10, and / or the optical module (580-1) of FIG. 11). The processor (120) may be configured to perform the function of the controller (530) described above with reference to FIGS. 11 and 12. The processor (120) can control one or more light-emitting elements (582) and / or one or more light-receiving elements (583) using allocated resources without a standalone controller. For example, the processor (120) can cause one or more light-emitting elements (582) to operate at a specific brightness. The processor (120) can receive information regarding one or more light-receiving elements (583). The processor (120) can calculate various result values ​​using electrical signals from one or more light-receiving elements (583).

[0118] FIG. 13 is a diagram illustrating an optical module according to one embodiment.

[0119] Referring to FIG. 13, an optical module (680) (e.g., an optical module (380C) of FIGS. 3 and 4, an optical module (480) of FIGS. 5 to 9, an optical module (580) of FIG. 10, an optical module (580-1) of FIG. 11, and / or an optical module (580-2) of FIG. 12) may include a plurality of light-emitting elements (682) (e.g., an optical element (482) of FIGS. 5 to 8, and / or an optical element (582) of FIGS. 10 to 12) and a plurality of light-receiving elements (683) (e.g., an optical element (483) of FIGS. 5 to 7 and 9, and / or an optical element (583) of FIGS. 10 to 12).

[0120] The optical module (680) may include a plurality of first optical elements (685) individually arranged on each of the plurality of light-emitting elements (682). For example, the plurality of first optical elements (685) may each include a lens or a reflector, or may be formed of a combination thereof. The plurality of first optical elements (685) may each cover an area in which a corresponding light-emitting element (682) is arranged. A plurality of first optical elements (685) may be arranged for a corresponding light-emitting element (682). The plurality of first optical elements (685) may provide optical characteristics (e.g., FOV) required for the plurality of light-emitting elements (682).

[0121] The optical module (680) may include a plurality of second optical elements (686) individually arranged on each of the plurality of light-receiving elements (683). For example, the plurality of second optical elements (686) may each include a lens or a reflector, or may be formed of a combination thereof. The plurality of second optical elements (686) may each cover an area in which a corresponding one light-receiving element (683) is arranged. A plurality of second optical elements (686) may be arranged for a corresponding one light-receiving element (683). The plurality of second optical elements (686) may provide optical characteristics (e.g., FOV) required for the plurality of light-receiving elements (683).

[0122] FIG. 14 is a diagram illustrating an optical module according to one embodiment.

[0123] Referring to FIG. 14, an optical module (680-1) (e.g., an optical module (380C) of FIGS. 3 and 4, an optical module (480) of FIGS. 5 to 9, an optical module (580) of FIG. 10, an optical module (580-1) of FIG. 11, an optical module (580-2) of FIG. 12, and / or an optical module (680) of FIG. 13) may include a plurality of light-emitting elements (682) (e.g., an optical element (482) of FIGS. 5 to 8, and / or an optical element (582) of FIGS. 10 to 12) and a plurality of light-receiving elements (683) (e.g., an optical element (483) of FIGS. 5 to 7 and 9, and / or an optical element (583) of FIGS. 10 to 12).

[0124] An optical module (680-1) may include a plurality of first optical elements (685-1) (e.g., the first optical element (685) of FIG. 13) arranged in a plurality of regions having one or more light-emitting elements (682). A plurality of first optical elements (685) may be arranged for a corresponding region. In the exemplary array of FIG. 14, a given first optical element (685-1) may cover three light-emitting elements (682) arranged in a row. A given first optical element (685-1) may cover two light-emitting elements (682) arranged in a row. A given first optical element (685-1) may cover a single light-emitting element (682). In an embodiment not shown, a given first optical element (685-1) may cover four or more light-emitting elements (682) arranged in a row. In an embodiment not shown, any first optical element (685-1) can cover four or more light-emitting elements (682) in an N x M matrix configuration. In an embodiment not shown, any first optical element (685-1) can cover a plurality of light-emitting elements (682) in an area of ​​any shape.

[0125] An optical module (680-1) may include a plurality of second optical elements (686-1) (e.g., the second optical elements (686) of FIG. 13) arranged in a plurality of regions with one or more light-receiving elements (683). A plurality of second optical elements (686) may be arranged for a corresponding region. In the exemplary array of FIG. 14, any second optical element (686-1) may cover two light-receiving elements (683) arranged in a row. Any second optical element (686-1) may cover a single light-receiving element (683). In an embodiment not shown, any second optical element (686-1) may cover three or more light-receiving elements (683) arranged in a row. In an embodiment not shown, any second optical element (686-1) may cover four or more light-receiving elements (683) in an N x M matrix configuration. In an embodiment not shown, any second optical element (686-1) may cover a plurality of light-receiving elements (683) in an area of ​​any shape.

[0126] FIG. 15 is a diagram illustrating an optical module according to one embodiment.

[0127] Referring to FIG. 15, an optical module (680-2) (e.g., an optical module (380C) of FIGS. 3 and 4, an optical module (480) of FIGS. 5 to 9, an optical module (580) of FIG. 10, an optical module (580-1) of FIG. 11, an optical module (580-2) of FIG. 12, an optical module (680) of FIG. 13, and / or an optical module (680-1) of FIG. 14) may include a plurality of light-emitting elements (682) (e.g., an optical element (482) of FIGS. 5 to 8, and / or an optical element (582) of FIGS. 10 to 12) and a plurality of light-receiving elements (683) (e.g., an optical element (483) of FIGS. 5 to 7 and 9, and / or an optical element (583) of FIGS. 10 to 12).

[0128] The optical module (680-2) may include an optical element (687) configured to substantially cover the entire area with a plurality of light-emitting elements (682) and a plurality of light-receiving elements (683) (e.g., the first optical element (685) of FIG. 13, the second optical element (686) of FIG. 13, the first optical element (685-1) of FIG. 14, and / or the second optical element (686-1) of FIG. 14). For example, the optical element (687) may include a lens or a reflector. Various combinations of the plurality of optical elements (687) may be arranged over the entire area.

[0129] Figure 16 is a plan view of an optical module according to one embodiment.

[0130] Referring to FIG. 16, an electronic device (700) (e.g., the electronic device (101) of FIG. 1, the electronic device (101) of FIG. 2, the electronic device (301) of FIGS. 3 and 4, the electronic device (400) of FIGS. 5 to 7, the electronic device (500) of FIG. 10, the electronic device (500-1) of FIG. 11, and / or the electronic device (500-2) of FIG. 12) may include a hole (H) having a hole axis (HA). The electronic device (700) may include an optical module (780) (e.g., an optical module (380C) of FIGS. 3 and 4, an optical module (480) of FIGS. 5 to 9, an optical module (580) of FIG. 10, an optical module (580-1) of FIG. 11, an optical module (580-2) of FIG. 12, an optical module (680) of FIG. 13, an optical module (680-1) of FIG. 14, and / or an optical module (680-2) of FIG. 15). The optical module (780) may include a substrate (481), a plurality of light-emitting elements (482), and a plurality of light-receiving elements (483).

[0131] At least two of the plurality of light-emitting elements (482) may be arranged circumferentially (e.g., in a circumferential direction) around the center of the substrate (481) (e.g., the point where the hole axes (HA) meet). Any of the light-emitting elements (482) may be arranged substantially at the center of the substrate (481).

[0132] A plurality of light-receiving elements (483) may be arranged closer to the center of the substrate (481) than at least two light-emitting elements (482) arranged circumferentially around the center of the substrate (481). A distance (e.g., a first radius) between the center of the substrate (481) and one of the light-receiving elements (483) may be smaller than a distance (e.g., a second radius) between the center of the substrate (481) and one of the light-emitting elements (482). As the light-emitting elements (482) are further from the center of the substrate (481) (e.g., the point where the hole axes (HAs) meet) and as the light-receiving elements (483) are closer to the center of the substrate (481), the FOV securing performance of the required incident light (e.g., ambient light) to the light-receiving elements (483) may be improved. In addition, the degree of freedom in designing one or more optical elements for the optical module (780) may be increased.

[0133] One or more light-receiving elements (483) may be arranged on an imaginary extension connecting any one of the light-emitting elements (482) disposed at the center of the substrate (481) and the light-emitting elements (482) arranged circumferentially around the center of the substrate (481). One or more light-receiving elements (483) may not be arranged on an imaginary extension connecting adjacent light-emitting elements (482). In an embodiment not shown, the light-receiving elements (483) may be disposed at the center of the substrate (481). In an embodiment not shown, the one or more light-receiving elements (483) may be arranged circumferentially around the center of the substrate (481) with the light-emitting elements (482) (e.g., alternately, at equal intervals, or in any configuration).

[0134] One aspect of the disclosure may provide an electronic device that supports various shooting environments or conditions.

[0135] The electronic device (101; 301; 400; 500; 500-1; 500-2; 700) may include a camera module (180; 380A, 380B), and an optical module (380C; 480; 580; 580-1; 580-2; 680; 680-1; 680-2; 780). The above optical module (380C; 480; 580; 580-1; 580-2; 680; 680-1; 680-2; 780) may include a substrate (481), a plurality of light-emitting elements (482; 582; 682) arranged on the substrate (481), and a first light-receiving element (483; 583; 683) arranged on the substrate (481) and configured to be driven independently from the plurality of light-emitting elements (482; 582; 682).

[0136] The electronic device (400) may include a hole (H). The plurality of light-emitting elements (482) and the first light-receiving element (483) may be substantially aligned with the hole (H).

[0137] The electronic device (400) may include a hole (H). The first light-receiving element (483) may be placed in a central area of ​​the substrate (481) facing the hole (H).

[0138] The above light module (480) may include a phosphor (484) disposed on at least one of the plurality of light emitting elements (482).

[0139] The electronic device (500; 500-1) may include a standalone controller (530) configured to control the plurality of light-emitting elements (582) and the first light-receiving element (583).

[0140] The controller (530) may be arranged to be integrated into the optical module (580). The controller (530) may be arranged separately from the optical module (580-1).

[0141] The electronic device (500; 500-1) may include a processor (120) configured to communicate with the controller (530). The processor (120) may be configured to transmit a command to the controller (530) so that at least one of the plurality of light-emitting elements (582) is driven at a specific output level. The processor (120) may be configured to request information about the first light-receiving element (583) from the controller (530).

[0142] The controller (530) may include a channel (CH1) configured to individually control the plurality of optical elements (582). The controller (530) may include channels (CH2, CH3) configured to individually control subsets of the plurality of optical elements (582).

[0143] The optical module (480) may include a first optical filter (F; F1) disposed on the first light-receiving element (483; 483A). The optical module (480) may include a second light-receiving element (483; 483B) and a second optical filter (F; F2) disposed on the second light-receiving element (483; 483B). The first optical filter (F; F1) and the second optical filter (F; F2) may have different optical characteristics.

[0144] The electronic device (400) may include a plurality of optical elements (685, 686) respectively disposed on the plurality of light-emitting elements (682) and the first light-receiving element (683).

[0145] The electronic device (400) may include an optical element (685-1, 686-1) disposed on at least one of the plurality of light-emitting elements (682) and the first light-receiving element (683). The at least one element may be disposed on an area on the substrate.

[0146] The electronic device (400) may include an optical element (687) disposed on the plurality of light-emitting elements (682) and the first light-receiving element (683).

[0147] The above electronic device (400) may include a hole (H) and an optical element (L) arranged in the hole (H).

[0148] The plurality of light-emitting elements (482) may be arranged symmetrically. The light module (480) may include a second light-receiving element (483). The first light-receiving element (483) and the second light-receiving element (483) may be arranged symmetrically.

[0149] The above optical module (480) may include an array of the plurality of light-emitting elements (482). The first light-receiving element (483) may be positioned in a defined area within the array.

[0150] The plurality of light-emitting elements (482) may be arranged in a first direction and a second direction of the substrate (481). The first direction may be different from the second direction.

[0151] Two or more of the plurality of light-emitting elements (482) may be arranged circumferentially around the center of the substrate. At least one of the plurality of light-emitting elements (482) may be arranged at the center of the substrate (481).

[0152] The first light-receiving element (483) may be positioned closer to the center of the substrate (481) than at least some of the light-emitting elements among the plurality of light-emitting elements (482).

[0153] The area of ​​the plurality of light-emitting elements (482) may be larger than the area of ​​the first light-receiving element (483).

[0154] Any one of the plurality of light-emitting elements (482) may be configured to emit light of a different wavelength band from the wavelength band of light emitted by another light-emitting element. Any one of the plurality of light-emitting elements (482) may have an irradiation angle that is different from the irradiation angle of another light-emitting element (482).

[0155] According to one embodiment, an ambient light sensing function, such as a flicker sensor or an illuminance sensor, may be implemented in the optical module. According to one embodiment, a light-emitting area may be adjusted in the optical module. According to one embodiment, various light sources may be implemented for various conditions. According to one embodiment, an integrated optical module may be provided. According to one embodiment, the degree of design freedom for the optical module may be increased. According to one embodiment, external visibility and / or aesthetics may be improved. The effects of the electronic device according to the embodiments are not limited to those mentioned above, and other effects not mentioned may be clearly understood by those skilled in the art from the description of the specification.

[0156] The embodiments described herein are intended to be illustrative and not restrictive. Various modifications may be made to the details of the disclosure, including those contained within the scope of the appended claims and their equivalents. Any of the embodiments described herein may be used in combination with any other embodiments described herein.

Claims

1. Camera module (180; 380A, 380B), and An optical module (380C; 480; 580; 580-1; 580-2; 680; 680-1; 680-2; 780) is included, and the optical module (380C; 480; 580; 580-1; 580-2; 680; 680-1; 680-2; 780) comprises: Substrate (481), A plurality of light-emitting elements (482; 582; 682) arranged on the above substrate (481), and A first light-receiving element (483; 583; 683) arranged on the substrate (481) and configured to operate independently from the plurality of light-emitting elements (482; 582; 682). Electronic device comprising (101; 301; 400; 500; 500-1; 500-2; 700).

2. In paragraph 1, An electronic device further comprising a hole (H), wherein the plurality of light-emitting elements (482) and the first light-receiving element (483) are substantially aligned with the hole (H).

3. In paragraph 1 or 2, An electronic device further comprising a hole (H), wherein the first light-receiving element (483) is disposed in a central area of ​​the substrate (481) facing the hole (H).

4. In any one of paragraphs 1 to 3, An electronic device in which the above light module (480) further includes a phosphor (484) disposed on at least one light emitting element among the plurality of light emitting elements (482).

5. In any one of paragraphs 1 to 4, Further comprising an independent controller (530) configured to control the plurality of light-emitting elements (582) and the first light-receiving element (583), Optionally, the controller (530) may be integrated into the optical module (580) or placed separately from the optical module (580-1), Optionally, further comprising a processor (120) configured to communicate with the controller (530), The above processor (120) To transmit a command to the controller (530) to drive at least one of the plurality of light emitting elements (582) to a specific output level, and / or configured to request information about the first light-receiving element (583) to the controller (530), or Optionally, the controller (530) A channel (CH1) configured to individually control the plurality of optical elements (582), and / or Channels (CH2, CH3) configured to control subsets of the above plurality of optical elements (582), respectively. An electronic device comprising:

6. In any one of paragraphs 1 to 5, The optical module (480) further comprises a first optical filter (F; F1) disposed on the first light-receiving element (483; 483A), and optionally, the optical module (480) further comprises a second optical filter (F; F2) disposed on the second light-receiving element (483; 483B) and the second light-receiving element (483; 483B), and the first optical filter (F; F1) and the second optical filter (F; F2) have different optical characteristics.

7. In any one of paragraphs 1 to 6, An electronic device further comprising a plurality of optical elements (685, 686) respectively arranged on the plurality of light-emitting elements (682) and the first light-receiving element (683).

8. In any one of paragraphs 1 to 7, An electronic device further comprising an optical element (685-1, 686-1) disposed on at least one of the plurality of light-emitting elements (682) and the first light-receiving element (683), wherein the at least one element is disposed on an area on the substrate.

9. In any one of paragraphs 1 to 8, An electronic device further comprising an optical element (687) disposed on the plurality of light-emitting elements (682) and the first light-receiving element (683).

10. In any one of paragraphs 1 to 9, An electronic device further comprising a hole (H) and an optical element (L) disposed in the hole (H).

11. In any one of paragraphs 1 to 10, The above plurality of light emitting elements (482) are arranged symmetrically and / or An electronic device in which the above optical module (480) further includes a second light-receiving element (483), and the first light-receiving element (483) and the second light-receiving element (483) are symmetrically arranged.

12. In any one of paragraphs 1 to 11, The above optical module (480) further includes an array of the plurality of light-emitting elements (482), and the first light-receiving element (483) is arranged in a defined area within the array, Optionally, the plurality of light-emitting elements (482) are arranged in the first direction and the second direction of the substrate (481), and the first direction is different from the second direction, Optionally, an electronic device wherein two or more of the plurality of light-emitting elements (482) are arranged circumferentially around the center of the substrate, and optionally, at least one of the plurality of light-emitting elements (482) is arranged at the center of the substrate (481).

13. In any one of paragraphs 1 to 12, An electronic device in which the first light-receiving element (483) is positioned closer to the center of the substrate (481) than at least some of the light-emitting elements among the plurality of light-emitting elements (482).

14. In any one of paragraphs 1 to 13, An electronic device wherein the area of ​​the plurality of light-emitting elements (482) is larger than the area of ​​the first light-receiving element (483).

15. In any one of paragraphs 1 to 14, One of the plurality of light emitting elements (482) is configured to emit light of a wavelength band different from the wavelength band of light emitted by the other light emitting element, and / or An electronic device in which one of the plurality of light-emitting elements (482) has an irradiation angle different from the irradiation angle of the other light-emitting element (482).

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