Printed circuit board structure accommodating thermal interface material, and electronic device comprising same

Abstract

A printed circuit board structure (200) according to an embodiment may comprise: a first printed circuit board (210); an interposer (230); a second printed circuit board (220); and a mounting layer (241) having a base hole connected to the second printed circuit board, a support layer (242) provided on the opposite side of the mounting layer with respect to the second printed circuit board, and a visible layer (243) connected to the support layer and having a material having transparency.

Description

Printed circuit board structure containing thermal interface material and electronic device including same

[0001] Various embodiments of the present disclosure relate to printed circuit board structures and electronic devices, for example, to printed circuit board structures that accommodate thermal interface materials and electronic devices including the same.

[0002] Electronic devices can generate significant heat due to their high performance and diverse functionality. The heat dissipation performance of electronic devices is essential to ensuring product stability and reliability. Accordingly, technologies for heat dissipation within electronic devices within confined spaces are actively being researched.

[0003] A heat dissipation technology is known that involves injecting a liquid thermal interface material (TIM) into the internal space of an electronic device and hardening the thermal interface material injected into the internal space.

[0004] According to one embodiment, an electronic device includes a printed circuit board structure that accommodates a thermal interface material (TIM), the printed circuit board structure (200) includes a first printed circuit board (210), an interposer (230) connected to the first printed circuit board, a cover body (221) connected to the interposer, a second printed circuit board (220) including a nozzle hole (222) formed through the cover body, and a monitoring hole (223) formed through the cover body, and a mounting layer (241) connected to the second printed circuit board and having a base hole (2412) communicating with the monitoring hole, a support layer (242) provided on an opposite side of the mounting layer with respect to the second printed circuit board and having a body hole (2422) communicating with the base hole, and a viewer including a material that is connected to the support layer and covers the monitoring hole and has transparency. It may include a cover structure (240) including a layer (243).

[0005] According to one embodiment, a printed circuit board structure accommodating a thermal interface material (TIM) may include a first printed circuit board (210), an interposer (230) connected to the first printed circuit board, a cover body (221) connected to the interposer, a second printed circuit board (220) including a nozzle hole (222) formed through the cover body, and a monitoring hole (223) formed through the cover body, and a cover structure (240) including a mounting layer (241) connected to the second printed circuit board and having a base hole (2412) communicating with the monitoring hole, a support layer (242) provided on an opposite side of the mounting layer with respect to the second printed circuit board and having a body hole (2422) communicating with the base hole, and a visibility layer (243) connected to the support layer, covering the monitoring hole, and including a material having transparency.

[0006] According to one embodiment, an electronic device includes a printed circuit board structure that accommodates a thermal interface material (TIM), the printed circuit board structure including a first printed circuit board (210), an interposer (230) connected to the first printed circuit board, a cover body (221) connected to the interposer, a second printed circuit board (220) including a nozzle hole (222) formed through the cover body, and a monitoring hole (223) formed through the cover body, and a mounting layer (241) connected to the second printed circuit board and having a base hole (2412) communicating with the monitoring hole, a support layer (242) provided on an opposite side of the mounting layer with respect to the second printed circuit board and having a body hole (2422) communicating with the base hole, and a cover including a visibility layer (243) that is connected to the support layer and covers the monitoring hole and includes a material having transparency. The structure (240) includes a sensor layer (243), which blocks the thermal interface material from being discharged to the outside through the monitoring hole, includes a non-conductive material, and may have a height higher than the height of the mounting layer.

[0007] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become apparent from the following detailed description with reference to the accompanying drawings.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0009] FIG. 2 is a plan view of a printed circuit board structure that accommodates a thermal interface material (TIM) according to one embodiment.

[0010] Figure 3 is a cross-sectional view taken along the cut line Ⅲ-Ⅲ of Figure 2.

[0011] Figure 4 is a cross-sectional view taken along the cut line Ⅳ-Ⅳ of Figure 2.

[0012] FIG. 5 is a cross-sectional view of a printed circuit board structure showing a state in which a thermal interface material is filled inside the printed circuit board structure according to one embodiment.

[0013] Figure 6 is a cross-sectional perspective view of a cover structure according to one embodiment.

[0014] Figure 7 is an exploded perspective view of a cover structure according to one embodiment.

[0015] FIG. 8a is a plan view of a cover structure according to one embodiment.

[0016] FIG. 8b is a plan view of a cover structure with a thermal interface material filled inside the printed circuit board structure according to one embodiment.

[0017] Figure 9 is a cross-sectional view of a printed circuit board structure according to one embodiment.

[0018] FIG. 10 is a cross-sectional view of a printed circuit board structure showing a state in which a thermal interface material is filled inside the printed circuit board structure according to one embodiment.

[0019] Fig. 11 is an exploded perspective view of a cover structure according to one embodiment.

[0020] FIG. 12a is a plan view of a cover structure according to one embodiment.

[0021] FIG. 12b is a plan view of a cover structure with a thermal interface material filled inside the printed circuit board structure according to one embodiment.

[0022] Figure 13 is an exploded perspective view of a cover structure according to one embodiment.

[0023] Fig. 14 is a plan view of a cover structure according to one embodiment.

[0024] FIG. 15 is a plan view of a cover structure according to one embodiment.

[0025] Fig. 16 is a plan view of a cover structure according to one embodiment.

[0026] Figure 17 is an exploded perspective view of a cover structure according to one embodiment.

[0027] Fig. 18 is a cross-sectional view of a printed circuit board structure according to one embodiment.

[0028] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0029] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0030] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0031] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0032] The memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134).

[0033] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0034] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0035] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0036] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0037] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0038] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0040] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0042] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0043] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0044] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0045] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0046] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0047] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0048] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0049] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0050] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0051] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0052] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0053] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0054] Embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0055] According to one embodiment, the method according to the embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0056] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0057] FIG. 2 is a plan view of a printed circuit board structure accommodating a thermal interface material (TIM) according to one embodiment. FIG. 3 is a cross-sectional view taken along line Ⅲ-Ⅲ of FIG. 2. FIG. 4 is a cross-sectional view taken along line Ⅳ-Ⅳ of FIG. 2. FIG. 5 is a cross-sectional view of a printed circuit board structure according to one embodiment, showing a state in which a thermal interface material is filled inside the printed circuit board structure. FIG. 6 is a cross-sectional perspective view of a cover structure according to one embodiment. FIG. 7 is an exploded perspective view of a cover structure according to one embodiment.

[0058] Referring to FIGS. 2 to 7, a printed circuit board structure (200) according to one embodiment may be provided in an electronic device (e.g., an electronic device (101) of FIG. 1). For example, among electronic devices (e.g., electronic devices (101) of FIG. 1), at least one of a processor (e.g., processor (120) of FIG. 1), an input module (e.g., input module (150) of FIG. 1), an audio output module (e.g., audio output module (155) of FIG. 1), a display module (e.g., display module (160) of FIG. 1), an audio module (e.g., audio module (170) of FIG. 1), a sensor module (e.g., sensor module (176) of FIG. 1), a haptic module (e.g., haptic module (179) of FIG. 1), a camera module (e.g., camera module (180) of FIG. 1), a power management module (e.g., power management module (188) of FIG. 1), a communication module (e.g., communication module (190) of FIG. 1), a subscriber identification module (e.g., subscriber identification module (196) of FIG. 1), or an antenna module (e.g., antenna module (197) of FIG. 1)) is formed on a printed circuit board. It may include a structure (200).

[0059] In one embodiment, the printed circuit board structure (200) can accommodate a thermal interface material (T, TIM). The thermal interface material (T) can be injected into the interior of the printed circuit board structure (200). The thermal interface material (T) can be injected into the interior of the printed circuit board structure (200) in a liquid state and can be cured after injection. The thermal interface material (T) can assist in better heat transfer within the interior of the printed circuit board structure (200).

[0060] In one embodiment, the printed circuit board structure (200) may include a plurality of components requiring cooling. For example, the printed circuit board structure (200) may include an application processor (AP) or a power amplifier (PA). These components generate heat and thus may be heat sources. Sufficient cooling is required for these components to operate normally. A thermal interface material (T) filled within the printed circuit board structure (200) can absorb heat from the heat source and spread the heat over a wide area.

[0061] In one embodiment, a printed circuit board structure (200) may include a first printed circuit board (210), a second printed circuit board (220), an interposer (230), and a cover structure (240). The first printed circuit board (210), the second printed circuit board (220), and the interposer (230) may define an internal space (S1). The internal space (S1) may be a space surrounded by the first printed circuit board (210), the second printed circuit board (220), and the interposer (230).

[0062] In one embodiment, the first printed circuit board (210) may include a printed circuit board. For example, the first printed circuit board (210) may be a printed circuit board made of a rigid material. For example, the first printed circuit board (210) may be a flexible printed circuit board (FPCB) made of a flexible material. The first printed circuit board (210) may have a flat plate shape. Although the shape of the first printed circuit board (210) is illustrated as a rectangular parallelepiped, it should be noted that the shape is not limited thereto.

[0063] In one embodiment, the second printed circuit board (220) may be provided at a position spaced apart from the first printed circuit board (210). The second printed circuit board (220) may be spaced apart from the first printed circuit board (210) in the z-axis direction. The stacking direction of the first printed circuit board (210), the interposer (230), and the second printed circuit board (220) may be parallel to the z-axis direction. A nozzle hole (222) and a monitoring hole (223) may be formed through the second printed circuit board (220). The second printed circuit board (220) may include a cover body (221), a nozzle hole (222), and a monitoring hole (223).

[0064] In one embodiment, the cover body (221) may include a printed circuit board. For example, the cover body (221) may be a printed circuit board made of a rigid material. For example, the cover body (221) may be a flexible printed circuit board (FPCB) made of a flexible material. The cover body (221) may have a flat plate shape.

[0065] In one embodiment, a nozzle hole (222) may be formed penetrating the cover body (221). Through the nozzle hole (222), a thermal interface material (T) may be injected into the internal space (S1). The thermal interface material (T) injected into the internal space (S1) may proceed in the x-axis direction and / or the y-axis direction. A nozzle block (290) may be arranged in the nozzle hole (222).

[0066] In one embodiment, the nozzle block (290) may be disposed on the second printed circuit board (220). The nozzle block (290) may assist the nozzle (N) to stably inject the thermal interface material (T) into the printed circuit board structure (200). The nozzle block (290) may have a hole that accommodates a portion of the nozzle (N). The hole of the nozzle block (290) may be connected to the nozzle hole (222). The nozzle (N) may inject the thermal interface material (T) into the interior of the printed circuit board structure (200) while being mounted on the nozzle block (290).

[0067] In one embodiment, a monitoring hole (223) may be formed through the cover body (221). Through the monitoring hole (223), the internal space (S1) may be exposed to the outside. Here, exposure means that the internal space (S1) can be confirmed from the outside. The monitoring hole (223) may be covered by a cover structure (240).

[0068] In one embodiment, an interposer (230) may be disposed between a first printed circuit board (210) and a second printed circuit board (220). The interposer (230) may be connected to the first printed circuit board (210). The second printed circuit board (220) may be connected to the second printed circuit board (220). The interposer (230) may electrically connect a component disposed on the first printed circuit board (210) to a component disposed on the second printed circuit board (220). The interposer (230) may be connected to the first printed circuit board (210) and the second printed circuit board (220) via solder balls.

[0069] In one embodiment, the cover structure (240) may be disposed on the second printed circuit board (220). The cover structure (240) may overlap the monitoring hole (223). For example, the cover structure (240) may overlap the monitoring hole (223) in the z-axis direction. The cover structure (240) may include a mounting layer (241), a support layer (242), and a viewing layer (243).

[0070] In one embodiment, a plurality of cover structures (240, 240A, 240B, 240C) may be provided. The plurality of cover structures (240, 240A, 240B, 240C) may include a first cover structure (240A), a second cover structure (240B), a third cover structure (240C), and a fourth cover structure (240). It should be noted that in the present specification, the fourth cover structure (240) may be referred to as a cover structure (240).

[0071] In one embodiment, a plurality of cover structures (240, 240A, 240B, 240C) may be provided at positions spaced apart from each other on the second printed circuit board (220). The first cover structure (240A) and the second cover structure (240B) may be provided on opposite sides with respect to the nozzle block (290). The distances at which the second cover structure (240B) and the third cover structure (240C) are spaced apart from the nozzle block (290) may be different from each other.

[0072] In one embodiment, the mounting layer (241) may be connected to a second printed circuit board (220). The mounting layer (241) may include, for example, a metal material. For example, the mounting layer (241) may include lead on the second printed circuit board (220). For example, the mounting layer (241) may be surface-mounted on the second printed circuit board (220).

[0073] In one embodiment, the mounting layer (241) may include a base layer (2411) and a base hole (2412) formed through the base layer (2411). The base hole (2412) may be connected to a monitoring hole (223). When the internal space (S1) is sufficiently filled with a thermal interface material (T), the thermal interface material (T) may move through the monitoring hole (223). The thermal interface material (T) passing through the monitoring hole (223) may enter the interior of the cover structure (240).

[0074] In one embodiment, the support layer (242) may be disposed on the second printed circuit board (220). The support layer (242) may be disposed directly on the second printed circuit board (220) or may be disposed on the second printed circuit board (220) with another layer interposed therebetween. For example, a mounting layer (241) may be provided between the support layer (242) and the second printed circuit board (220). A hole may be formed through the support layer (242) to overlap the monitoring hole (223). The support layer (242) may be provided on the opposite side of the mounting layer (241) with respect to the second printed circuit board (220). The support layer (242) may include a flexible material. For example, the support layer (242) may include rubber. It should be noted that the material of the support layer (242) is not limited thereto. For example, the support layer (242) may include a rigid material. The support layer (242) may include a non-conductive material. For example, the support layer (242) may include a glass fiber epoxy laminate. The support layer (242) may include, for example, an insulating material. The support layer (242) may be attached to the mounting layer (241). In one embodiment, the support layer (242) is described as being directly connected to the mounting layer (241), but it should be understood that this is not limiting. For example, other configurations may be provided between the support layer (242) and the mounting layer (241). The support layer (242) may include a body part (2421) and a body hole (2422) formed through the body part (2421). The body hole (2422) may be in communication with the base hole (2412).

[0075] In one embodiment, the height of the support layer (242) may be greater than the height of the mounting layer (241). The thermal interface material (T) may move along the support layer (242). As the thermal interface material (T) fills the inside of the support layer (242), the color of the inside of the support layer (242) exposed to the outside may change.

[0076] In one embodiment, the visible layer (243) may be connected to the support layer (242) and cover the monitoring hole (223). The visible layer (243) may prevent the thermal interface material (T) passing through the monitoring hole (223) from being discharged to the outside. The visible layer (243) may include a material having transparency. For example, the visible layer (243) may include a transparent or translucent material. The visible layer (243) may physically block the movement path of the thermal interface material (T). The visible layer (243) may block the thermal interface material (T) from being discharged to the outside through the monitoring hole (223). Through the visible layer (243), a user may observe the inside of the printed circuit board structure (200). The visible layer (243) may close the base hole (2412).

[0077] FIG. 8A is a plan view of a cover structure according to one embodiment. FIG. 8B is a plan view of a cover structure with a thermal interface material filled inside a printed circuit board structure according to one embodiment.

[0078] Referring to FIGS. 8A and 8B , the cover structure (240) may include a visibility layer (243). The visibility layer (243) may include a material having transparency. Since the visibility layer (243) includes a material having transparency, the appearance of the internal space may be displayed to the outside.

[0079] In one embodiment, when the inside of the cover structure (240) is filled with a thermal interface material (T), the color of the portion exposed to the outside through the visible layer (243) may change. The operator may check the color of the visible layer (243) while injecting the thermal interface material (T) into the inside of the printed circuit board structure using a nozzle. For example, the user may check the color of the visible layer (243) with the naked eye or check the color change of the visible layer (243) using a vision device. For example, when using a vision device, the vision device may irradiate light into the inside of the printed circuit board structure and detect the degree of reflection to detect whether the thermal interface material (T) is sufficiently filled in the printed circuit board structure. The color of the inside of the support layer (242) displayed through the visible layer (243) may change as the thermal interface material (T) is filled in the printed circuit board structure.

[0080] Fig. 9 is a cross-sectional view of a printed circuit board structure according to one embodiment. Fig. 10 is a cross-sectional view of a printed circuit board structure according to one embodiment, showing a state in which a thermal interface material is filled within the printed circuit board structure.

[0081] Referring to FIGS. 9 and 10, the printed circuit board structure may include a first printed circuit board (310), a second printed circuit board (320), an interposer (330), and a cover structure (340). The cover structure (340) may include a mounting layer (341), a support layer (342), a visibility layer (343), and a mesh layer (344). The cover structure (340) may indicate to the outside whether the internal space (S1) is filled with a thermal interface material (T). The cover structure (340) may prevent the thermal interface material (T) from being discharged to the outside. When the thermal interface material (T) is sufficiently filled in the printed circuit board structure, the thermal interface material (T) may enter the inside of the cover structure (340). The thermal interface material (T) may pass through the mesh layer (344). Before the thermal interface material (T) passes through the mesh layer (344), the mesh layer (344) can be observed from the outside through the viewing layer (343). When the thermal interface material (T) passes through the mesh layer (344) and fills the support layer (342), the mesh layer (344) can be covered by the thermal interface material (T). In other words, the mesh layer (344) cannot be observed from the outside.

[0082] Fig. 11 is an exploded perspective view of a cover structure according to one embodiment. Fig. 12a is a plan view of a cover structure according to one embodiment. Fig. 12b is a plan view of a cover structure with a thermal interface material filled inside a printed circuit board structure according to one embodiment.

[0083] Referring to FIGS. 11 to 12B, the cover structure (340) may include a mounting layer (341), a support layer (342), a recognition layer (343), and a mesh layer (344). The mounting layer (341) may include a base layer (3411) and a base hole (3412) formed through the base layer (3411). The support layer (342) may include a body part (3421) and a body hole (3422) formed through the body part (3421). The mesh layer (344) may be disposed between the mounting layer (341) and the support layer (342). The mesh layer (344) may include a mesh layer body (3441) and a plurality of mesh holes (3442) formed through the mesh layer body (3441). The size of the plurality of mesh holes (3442) may be smaller than the size of the base hole (3412) or the body hole (3422). The plurality of mesh holes (3442) are observable from the outside when the cover structure (340) is not filled with a thermal interface material (T). When the support layer (342) is filled, the plurality of mesh holes (3442) may be covered by the thermal interface material (T). In other words, the mesh layer (344) may not be observable from the outside.

[0084] Fig. 13 is an exploded perspective view of a cover structure according to one embodiment. Fig. 14 is a plan view of a cover structure according to one embodiment.

[0085] Referring to FIGS. 13 and 14, the cover structure (440) may include a mounting layer (441), a support layer (442), and a viewing layer (443). The mounting layer (441) may include a base layer (4411) and a base hole (4412) formed through the base layer (4411). The support layer (442) may include a body part (4421) and a body hole (4422) formed through the body part (4421).

[0086] In one embodiment, the poet layer (443) may include a cover body (4431) and a printing pattern (4432) formed on the cover body (4431). The cover body (4431) may have a plate shape. The printing pattern (4432) may be formed on a portion of the cover body (4431) that overlaps the body hole of the support layer (442). For example, the printing pattern (4432) may be formed on a surface of the cover body (4431) that faces the support layer (442).

[0087] In one embodiment, when the inner side of the support layer (442) is not filled with a thermal interface material, the printed pattern (4432) may be displayed externally through the visible layer (443). When the inner side of the support layer (442) is filled with a thermal interface material, the printed pattern (4432) may be hidden by the thermal interface material and not displayed externally. The printed pattern (4432) may have a rectangular shape. It should be noted that the shape of the printed pattern (4432) is not limited thereto.

[0088] FIG. 15 is a plan view of a cover structure according to one embodiment.

[0089] Referring to FIG. 15, the cover structure (540) may include a visible layer (543). The visible layer (543) may include a material having transparency. The visible layer (543) may include a printed pattern (5432). The printed pattern (5432) may have a circular shape. The printed pattern (5432) may be covered by the thermal interface material when the thermal interface material is filled inside the cover structure (540).

[0090] Fig. 16 is a plan view of a cover structure according to one embodiment.

[0091] FIG. 16 shows a cover structure (60) that may include a visible layer (63). The visible layer (63) may include a material having transparency. The visible layer (643) may include a printed pattern (6432). The printed pattern (6432) may have a cross shape. The printed pattern (6432) may be covered by a thermal interface material when the thermal interface material is filled inside the cover structure (640).

[0092] Figure 17 is an exploded perspective view of a cover structure according to one embodiment.

[0093] Referring to FIG. 17, the cover structure (740) may include a mounting layer (741), a support layer (742), and a visible layer (743). The visible layer (743) may include a cover body (7431) made of a transparent material, and a vent hole (7432) formed through the cover body (7431) and provided in a portion overlapping the body hole of the support layer (742). The vent hole (7432) may discharge air inside the printed circuit board structure to the outside. Since the vent hole (7432) is provided in the cover structure (740), the printed circuit board structure may not have a separate vent hole on the second printed circuit board.

[0094] Fig. 18 is a cross-sectional view of a printed circuit board structure according to one embodiment.

[0095] Referring to FIG. 18, a printed circuit board structure (800) may include a first printed circuit board (810), a second printed circuit board (820), an interposer (830), and a cover structure (840). The first printed circuit board (810), the second printed circuit board (820), and the interposer (830) may define an internal space (S1). The internal space (S1) may be a space surrounded by the first printed circuit board (810), the second printed circuit board (820), and the interposer (830).

[0096] In one embodiment, the cover structure (840) may be positioned in the internal space (S1). The cover structure (840) may be positioned between the first printed circuit board (810) and the second printed circuit board (820). According to this structure, the cover structure (840) may be prevented from being exposed to the outside, thereby implementing a structurally compact form.

[0097] According to one embodiment, an electronic device includes a printed circuit board structure that accommodates a thermal interface material (TIM), the printed circuit board structure (200) includes a first printed circuit board (210), an interposer (230) connected to the first printed circuit board, a cover body (221) connected to the interposer, a second printed circuit board (220) including a nozzle hole (222) formed through the cover body, and a monitoring hole (223) formed through the cover body, and a mounting layer (241) connected to the second printed circuit board and having a base hole (2412) communicating with the monitoring hole, a support layer (242) provided on an opposite side of the mounting layer with respect to the second printed circuit board and having a body hole (2422) communicating with the base hole, and a viewer having a material that is connected to the support layer and covers the monitoring hole and has transparency. It may include a cover structure (240) including a layer (243).

[0098] In one embodiment, the poet layer (243) can block the thermal interface material from being discharged to the outside through the monitoring hole.

[0099] In one embodiment, when the thermal interface material is filled on the inside of the support layer, the color of the inside of the support layer (242) displayed through the visible layer (243) can change.

[0100] In one embodiment, the support layer (242) may include a non-conductive material.

[0101] In one embodiment, the support layer (242) may include rubber.

[0102] In one embodiment, the mounting layer (241) is surface-mounted on the second printed circuit board, the identification layer (243) is bonded to the mounting layer, and the identification layer can be bonded to the mounting layer.

[0103] In one embodiment, the height of the support layer (242) may be higher than the height of the mounting layer.

[0104] In one embodiment, the cover structure (223) may further include a mesh layer disposed between the mounting layer and the support layer.

[0105] In one embodiment, the mesh layer (344) may include a plurality of mesh holes having a size smaller than the body hole.

[0106] In one embodiment, when the thermal interface material is not filled on the inside of the support layer, the plurality of mesh holes (3442) may be visible to the outside through the visible layer, and when the thermal interface material is filled on the inside of the support layer, the plurality of mesh holes (3442) may be covered by the thermal interface material and may not be visible to the outside.

[0107] In one embodiment, the poet layer (443) may include a cover body (4431) having a material having transparency, and a printed pattern (4432) formed on a portion of the cover body that overlaps the body hole.

[0108] In one embodiment, when the thermal interface material is not filled on the inside of the support layer, the print pattern (4432) may be displayed externally through the visible layer, and when the thermal interface material is filled on the inside of the support layer, the print pattern (4432) may be covered by the thermal interface material and may not be displayed externally.

[0109] In one embodiment, the poet layer (743) may include a cover body (7431) having a material having transparency, and a vent hole (7432) formed through the cover body and provided in a portion overlapping the body hole.

[0110] In one embodiment, the cover structure (840) may be provided between the first printed circuit board and the second printed circuit board.

[0111] In one embodiment, the cover structures (240, 240A, 240B, 240C) are provided in multiple numbers, and at least some of the cover structures (240, 240A, 240B, 240C) may have different distances from the nozzle hole.

[0112] According to one embodiment, a printed circuit board structure accommodating a thermal interface material (TIM) may include a first printed circuit board (210), an interposer (230) connected to the first printed circuit board, a cover body (221) connected to the interposer, a second printed circuit board (220) including a nozzle hole (222) formed through the cover body, and a monitoring hole (223) formed through the cover body, and a mounting layer (241) connected to the second printed circuit board and having a base hole (2412) communicating with the monitoring hole, a support layer (242) provided on an opposite side of the mounting layer with respect to the second printed circuit board and having a body hole (2422) communicating with the base hole, and a cover structure (240) including a visibility layer (243) connected to the support layer, covering the monitoring hole, and having a material having transparency.

[0113] In one embodiment, the poet layer (243) can block the thermal interface material from being discharged to the outside through the monitoring hole.

[0114] In one embodiment, the height of the support layer (242) may be higher than the height of the mounting layer.

[0115] In one embodiment, the poet layer (443) may include a cover body (4431) having a material having transparency, and a printed pattern (4432) formed on a portion of the cover body that overlaps the body hole.

[0116] According to one embodiment, an electronic device includes a printed circuit board structure that accommodates a thermal interface material (TIM), the printed circuit board structure including a first printed circuit board (210), an interposer (230) connected to the first printed circuit board, a cover body (221) connected to the interposer, a second printed circuit board (220) including a nozzle hole (222) formed through the cover body, and a monitoring hole (223) formed through the cover body, and a mounting layer (241) connected to the second printed circuit board and having a base hole (2412) communicating with the monitoring hole, a support layer (242) provided on an opposite side of the mounting layer with respect to the second printed circuit board and having a body hole (2422) communicating with the base hole, and a cover including a visibility layer (243) that is connected to the support layer and covers the monitoring hole and has a material having transparency. The structure (240) includes a sensor layer (243), which blocks the thermal interface material from being discharged to the outside through the monitoring hole, includes a non-conductive material, and may have a height higher than the height of the mounting layer.

[0117] The effects of the electronic device according to the embodiments are not limited to those mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description in the specification.

[0118] The embodiments described herein are intended to be illustrative and not restrictive. Various modifications may be made to the details of the present disclosure, including those encompassed by the appended claims and their equivalents. Any of the embodiments described herein may be used in combination with any other embodiment described herein.

Claims

1. In an electronic device including a printed circuit board structure that accommodates a thermal interface material (TIM), The above printed circuit board structure (200) is First printed circuit board (210); An interposer (230) connected to the first printed circuit board; A second printed circuit board (220) connected to the interposer (230) and having a nozzle hole (222) and a monitoring hole (223) formed through it; and A cover structure (240) including a support layer (242) arranged on the second printed circuit board (220), a visibility layer (243) connected to the support layer and covering the monitoring hole and including a material having transparency, and a hole overlapping the monitoring hole (223) formed through the hole; An electronic device comprising:

2. In paragraph 1, The above poet layer (243) is an electronic device that blocks the thermal interface material from being discharged to the outside through the monitoring hole.

3. In paragraph 1 or 2, An electronic device in which the color of the inner side of the support layer (242) displayed through the light layer (243) changes while the thermal interface material is filled on the inner side of the support layer.

4. In any one of paragraphs 1 to 3, The above support layer (242) is an electronic device including a non-conductive material.

5. In any one of paragraphs 1 to 4, The above support layer (242) is an electronic device comprising a rubber or glass fiber epoxy laminate.

6. In any one of paragraphs 1 to 5, The above cover structure (240) further includes a mounting layer (241) that is placed between the second printed circuit board and the support layer and is surface-mounted on the second printed circuit board. A hole is formed through the above mounting layer, An electronic device, wherein the support layer (242) is adhered to the mounting layer, and the recognition layer (243) is adhered to the mounting layer.

7. In any one of paragraphs 1 to 6, An electronic device wherein the height of the support layer (242) is higher than the height of the mounting layer.

8. In any one of paragraphs 1 to 7, The above cover structure (223) is An electronic device further comprising a mesh layer disposed between the mounting layer and the support layer.

9. In any one of paragraphs 1 to 8, An electronic device, wherein the mesh layer (344) includes a plurality of mesh holes having a smaller size than the holes formed through the support layer.

10. In any one of paragraphs 1 to 9, In a state where the thermal interface material is not filled on the inner side of the support layer, the plurality of mesh holes (3442) are displayed externally through the poet layer, An electronic device in which the thermal interface material is filled on the inner side of the support layer, and the plurality of mesh holes (3442) are covered by the thermal interface material and are not visible to the outside.

11. In any one of paragraphs 1 to 10, The above poet layer (443) is, A cover body (4431) comprising a material having transparency; and An electronic device including a printing pattern (4432) formed in a portion overlapping a hole formed in the support layer among the cover bodies.

12. In any one of paragraphs 1 to 11, In a state where the thermal interface material is not filled on the inner side of the support layer, the printing pattern (4432) is displayed externally through the recognition layer, An electronic device in which the thermal interface material is filled on the inner side of the support layer, and the printed pattern (4432) is covered by the thermal interface material and is not displayed to the outside.

13. In any one of paragraphs 1 to 12, The above poet layer (743) is, A cover body (7431) comprising a material having transparency; and An electronic device including a vent hole (7432) formed through the cover body and provided in a portion overlapping a hole formed in the support layer.

14. In any one of paragraphs 1 to 13, The above cover structure (840) is an electronic device provided between the first printed circuit board and the second printed circuit board.

15. In any one of paragraphs 1 to 14, An electronic device further comprising an additional cover structure, wherein the cover structure and the additional cover structure are spaced apart from the nozzle hole at different distances.

Images