Electronic device comprising crack prevention structure

Abstract

According to an embodiment of the present disclosure, an electronic device can be provided. The electronic device may comprise a side structure forming part of the exterior of the electronic device, and a first support structure. The side structure may comprise at least one slit formed through a conductive portion in the side structure in at least one axial direction. The first support structure may comprise a first portion arranged in the at least one slit, and a second portion extending to the inside of the electronic device from the first portion. The first portion may be partially exposed to the outside of the electronic device. The first support structure may comprise at least one recess that is recessed in part of the second portion so as to at least partially overlap the first portion, when seen in the at least one axial direction.

Description

Electronic devices comprising crack-resistant structures

[0001] Examples disclosed in this document relate to electronic devices including crack-resistant structures (e.g., recesses).

[0002] Advances in information and communication technology and semiconductor technology are integrating diverse functions into a single portable electronic device. For example, electronic devices can implement not only communication functions but also entertainment functions such as gaming, multimedia functions such as music and video playback, communication and security functions for mobile banking, or even calendar management and electronic wallet functions. These electronic devices are becoming smaller and more portable for users.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] According to one embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a side structure forming a part of an exterior of the electronic device and a first support structure. The side structure may include at least one slit formed penetrating through a conductive portion of the side structure in at least one axial direction. The first support structure may include a first portion disposed in the at least one slit and a second portion extending inwardly from the first portion to the electronic device. A portion of the first portion may be exposed to the exterior of the electronic device. The first support structure may include at least one recess formed in a portion of the second portion so as to at least partially overlap the first portion when viewed in at least one axial direction.

[0005] According to one embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a side structure forming a part of an exterior of the electronic device and a first support structure. The side structure may include at least one slit formed penetrating through a conductive portion of the side structure in at least one axial direction. The first support structure may include a first portion disposed in the at least one slit and a second portion extending inwardly from the first portion to the electronic device. The first support structure may include at least one recess formed in a portion of the second portion so as to at least partially overlap a portion of the side structure around the first portion and the at least one slit when viewed in the at least one axial direction.

[0006] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0008] FIG. 2 is a perspective view illustrating an electronic device according to one embodiment disclosed in this document.

[0009] Figure 3 is a perspective view showing the electronic device illustrated in Figure 2.

[0010] FIG. 4 is an exploded perspective view showing an electronic device according to one embodiment disclosed in this document.

[0011] FIG. 5A is a plan view showing a portion of a configuration of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 5b is a rear view of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 6 is a perspective view illustrating a support structure and recess of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 7a is a plan view of portion A of FIG. 5a according to one embodiment of the present disclosure.

[0015] FIG. 7b is a cross-sectional perspective view taken along line B-B' of FIG. 7a according to one embodiment of the present disclosure.

[0016] FIG. 7C is a cross-sectional perspective view taken along line C-C' of FIG. 7A, according to one embodiment of the present disclosure.

[0017] FIG. 8A is a perspective view illustrating a recess of an electronic device according to one embodiment of the present disclosure.

[0018] FIG. 8b is a perspective view illustrating a recess of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 9 is a cross-sectional side view of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 10A is a perspective view illustrating a recess of an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 10b is a cross-sectional view taken along line D-D' of FIG. 10a, according to one embodiment of the present disclosure.

[0022] FIG. 10c is a cross-sectional view taken along line E-E' of FIG. 10a according to one embodiment of the present disclosure.

[0023] FIG. 11A is a plan view illustrating a recess and a fill member of an electronic device according to one embodiment of the present disclosure.

[0024] FIG. 11b is a cross-sectional view taken along line F-F' of FIG. 11a, according to one embodiment of the present disclosure.

[0025] FIG. 11c is a cross-sectional view of a display disposed in the electronic device of FIG. 11b according to one embodiment of the present disclosure.

[0026] FIG. 12A is a perspective view illustrating a recess and a fill member of an electronic device according to one embodiment of the present disclosure.

[0027] FIG. 12b is a cross-sectional view taken along line G-G' of FIG. 12a, according to one embodiment of the present disclosure.

[0028] FIG. 13a is a cross-sectional view taken along line G-G' of FIG. 12a, according to one embodiment of the present disclosure.

[0029] Figure 13b is a cross-sectional view of the electronic device of Figure 13a in a flipped state.

[0030] FIG. 14A is a perspective view illustrating a recess and a fill member of an electronic device according to one embodiment of the present disclosure.

[0031] FIG. 14b is a schematic diagram illustrating a recess and fill member of an electronic device according to one embodiment of the present disclosure.

[0032] FIG. 15 is a plan view of an electronic device according to one embodiment of the present disclosure.

[0033] FIG. 16 is a cross-sectional view taken along line H-H' of FIG. 15, according to one embodiment of the present disclosure.

[0034] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0035] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0036] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0037] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0038] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0039] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0040] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0041] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0042] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0043] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0044] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0045] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0046] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall-area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0047] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0048] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0049] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0050] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0051] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0052] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0053] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0054] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0055] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0056] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0057] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0058] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0059] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0060] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0061] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the rectangular coordinate system illustrated in the drawings. For example, the front of the electronic device or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. Also, in one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the rectangular coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit one embodiment of the present disclosure. For example, the aforementioned front or rear facing direction may vary depending on whether the electronic device is unfolded or folded, and the aforementioned direction may be interpreted differently depending on the user's gripping habits.

[0062] FIG. 2 is a three-dimensional view illustrating an electronic device (101) according to one embodiment disclosed in this document. FIG. 3 is a perspective view illustrating the electronic device (101) illustrated in FIG. 2. The configuration of the electronic device (101) of FIGS. 2 and 3 may be all or part of the same as the configuration of the electronic device (101) of FIG. 1.

[0063] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment may include a display (201), a front plate (202), and a housing (210) including a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) surrounding a space between the first side (210A) and the second side (210B), and the display (201). In one embodiment (not shown), the housing (210) may also refer to a structure forming a portion of the first side (210A) of FIG. 2, the second side (210B) of FIG. 3, and the side surface (210C).

[0064] In one embodiment, the front plate (202) may form at least a portion of the first surface (210A). In one embodiment, the front plate (202) may be a glass plate or a polymer plate, at least a portion of which is substantially transparent, and may include various coating layers. The front plate (202) may be referred to as, for example, a display (e.g., a display (220) of FIG. 4), a window, and / or a window plate (e.g., a window plate (221) of FIG. 4), and may form an exterior of the electronic device (101) together with the housing (210). In one embodiment, a display panel (e.g., a display panel (223) of FIG. 4) may be disposed on an inner surface of the front plate (202), and, depending on the embodiment, the front plate (202) itself and / or a combination of the front plate (202) and the display panel (e.g., the display panel (223) of FIG. 4) may be referred to as a 'display'.

[0065] According to one embodiment, the second side (or back) (210B) of the electronic device (101) may be formed by a back plate (212) provided as part of the housing (210) (e.g., the back plate (212) of FIG. 4). The back plate (212) may be formed by a substantially opaque material, for example, a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.

[0066] In one embodiment, the side surface (210C) of the electronic device (101) may be formed by a side structure (211) (or “bezel structure”) that at least partially surrounds a space between the front plate (202) and the back plate (212). For example, the front plate (202) may be coupled to the side structure (211) so as to face the back plate (212) with a predetermined gap therebetween. In one embodiment, the side structure (211) may be provided as a separate component from the back plate (212) and may be coupled to the back plate (212) through a separate assembly process to form the housing (210). In one embodiment, the side structure (211) may be manufactured or formed integrally with the back plate (212) and may comprise the same material (e.g., a metal material such as aluminum). In one embodiment, the back plate (212) and / or the side structure (211) may at least partially comprise an electrically conductive material, a metal material, and / or a polymer material. When the back plate (212) and / or the side structure (211) include an electrically conductive material, the housing (210) can function at least partially as a radiating conductor of an antenna that transmits and receives wireless signals, and / or can function as a ground or electromagnetic shielding structure of the electronic device (101).

[0067] In the illustrated embodiment, the front plate (202) and / or the back plate (212) are substantially flat plate-shaped, but it should be noted that the embodiments disclosed herein are not limited thereto. For example, the front plate (202) and / or the back plate (212) may have a generally flat plate-shaped shape, but at least a portion of an edge may have a curved shape, and a side structure (211) connecting the edge of the front plate (202) and the back plate (212) may have a curved shape. In one embodiment, the thickness of the electronic device (101) at the center of the front plate (202), for example, the thickness measured along the Z-axis direction, may be greater than the thickness measured at the edge of the front plate (202). For example, the thickness of the electronic device (101) may gradually decrease as it approaches the edge on the first surface (210A). When the front plate (202), the rear plate (212) and / or the side structure (211) of the electronic device (101) have a curved shape, a comfortable grip can be provided to the user.

[0068] According to one embodiment, the electronic device (101) may include a display (e.g., the display (220) of FIG. 4), an audio module (e.g., the audio module (170) of FIG. 1), and / or a key input device (218), and may include at least one of a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (e.g., the camera module (180) of FIG. 1 or the camera module (231) of FIG. 5), a light-emitting element (e.g., the light-emitting element (232) of FIG. 5B), and a connector hole (e.g., the connection terminal (178) of FIG. 1), which is not shown. In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (218) or the light-emitting element) or may additionally include other components.

[0069] The display (201) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (201) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the corners of the display (201) may be formed to be substantially identical to the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially identical in order to expand the area over which the display (201) is visually exposed.

[0070] According to one embodiment, the display (201) may include, for example, a display panel (e.g., display panel (223) of FIG. 4) disposed on the inside of the front plate (202) and may output visual information such as characters, images, and / or videos through a significant portion of the front plate (202). In one embodiment, substantially the entire area of ​​the front plate (202) may be set as an area for outputting a screen. The area for outputting a screen may be formed to have a shape substantially identical to an edge of the front plate (202). In one embodiment (not shown), the gap between the area for outputting a screen and the outer edge of the front plate (202) may be formed to be substantially identical, thereby increasing the ratio of the area for outputting a screen to the area provided by the front plate (202).

[0071] In one embodiment, a recess or opening is formed in a portion of a screen display area of ​​the display (201), and the electronic device (101) may include at least one of an audio module, a sensor module, a camera module, and a light-emitting element aligned with the recess or opening. In one embodiment, the electronic device (101) may include at least one of an audio module, a sensor module, a camera module, a fingerprint sensor, and a light-emitting element arranged to face in a direction opposite to a screen output direction of the display (201). In one embodiment, the electronic device may include at least one of an audio module, a sensor module, a camera module, and a light-emitting element arranged inside the screen display area of ​​the display (201) while facing in the same direction as the screen output direction. For example, the camera module may be arranged to overlap the screen display area and may not be visually exposed to the outside, and may include a hidden under-display camera (UDC).

[0072] In one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic stylus pen. In one embodiment, at least a portion of the sensor module and / or at least a portion of the key input device may be disposed inside the display.

[0073] In one embodiment, the display (201) may include a display (e.g., a flexible display) that is arranged to slide on the housing (210) to provide a screen (e.g., a screen display area). For example, the screen display area of ​​the electronic device (101) is an area that is visually exposed and capable of outputting an image, and the electronic device (101) may reduce or expand the screen display area according to the movement of a sliding plate (not shown) or the movement of the display (201). For example, the electronic device (101) may include a rollable electronic device in which at least a portion (e.g., the housing) is configured to at least partially slide to selectively expand the screen display area. For example, the display (201) may also be referred to as a slide-out display or an expandable display.

[0074] According to one embodiment, an audio module (e.g., audio module (170) of FIG. 1) may include an audio hole (213). In one embodiment, the audio hole (213) may include a microphone hole and a speaker hole. A microphone may be disposed inside the microphone hole to acquire external sounds, and in one embodiment, multiple microphones may be disposed to detect the direction of sounds. The speaker hole may include an external speaker hole and a receiver hole for calls. In one embodiment, the speaker hole and the microphone hole may be implemented as a single hole, or a speaker may be included without a speaker hole (e.g., a piezo speaker). In the illustrated embodiment, the audio hole (213) is illustrated as a hole that penetrates a side surface (210C) of the electronic device, for example, a side structure (211) (e.g., a side structure (211) of FIG. 4), but it should be noted that one embodiment disclosed in this document is not limited thereto. For example, when providing a voice call function, the electronic device (101) may further include an audio hole (not shown) in the form of a hole penetrating the front plate (202). The number and location of the audio holes may be varied in consideration of the shape, function, and / or actual usage environment of the electronic device (101).

[0075] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module may include sensors that detect the operating environment of the electronic device (101), such as a proximity sensor, an illuminance sensor, and a temperature / barometric pressure sensor, and may include sensors that obtain a user's biometric information, such as a fingerprint sensor or an HRM sensor. In addition, various other types of sensors, such as a gesture sensor, a gyro sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, or a humidity sensor, may be mounted on the electronic device (101). The arrangement of these sensor modules may be appropriately selected in consideration of the actual usage environment of the electronic device and the functions mounted on the electronic device.

[0076] According to one embodiment, a camera module (e.g., a camera module (231) of FIG. 5) may be disposed on at least one of a first surface (210A), which is the front surface, and a second surface (210B), which is the rear surface, of the electronic device (101), and, depending on the embodiment, a plurality of camera modules may be disposed to face the same direction. In one embodiment, the camera module may include a flash that provides illumination toward a subject. The camera module may include, for example, one or more lenses, an image sensor, and / or an image signal processor. The flash (e.g., a light-emitting element (232) of FIG. 5B) may include, for example, a light-emitting diode or a xenon lamp.

[0077] According to one embodiment, the key input device (218) may be disposed on a side surface (210C) of the electronic device (101) and / or the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (218), and the key input devices (218) that are not included may be implemented in other forms, such as soft keys, on the display (220). The number or location of the key input devices (218) is not limited to the illustrated embodiment, and may be additionally installed on the first side (210A), the second side (210B) and / or the non-illustrated side surface (210C) of the electronic device. In one embodiment, some of the key input devices (218) of FIG. 2 may be replaced with slots or connector holes. For example, the electronic device (101) can accommodate a user identification module card or a memory card through a slot formed to penetrate the side structure (211), and can transmit and receive power, sound signals, and / or data to and from an external electronic device through a connector hole.

[0078] According to one embodiment, a light-emitting element (e.g., light-emitting element (232) of FIG. 5B) may be disposed on the first side (210A) and / or the second side (210B) of the electronic device (101). The light-emitting element may, for example, provide status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element may, for example, provide a light source that is linked to the operation of a camera module. The light-emitting element may include, for example, an LED, an IR LED, and a xenon lamp.

[0079] FIG. 4 is an exploded perspective view illustrating an electronic device (101) (e.g., the electronic device (101) of FIG. 2 and / or FIG. 3) according to one embodiment disclosed in the present document.

[0080] Referring to FIG. 4, the electronic device (101) may include a housing (210) (e.g., the housing (210) of FIG. 2 and / or FIG. 3), a display (220), a printed circuit board (203) (e.g., a printed circuit board (PCB), a printed board assembly (PBA), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (204), a speaker module (251), and an antenna (253). In one embodiment, the electronic device (101) may omit at least one of the components or additionally include another component (e.g., a bracket that supports or protects the display (220). According to one embodiment, the electronic device (101) may have a structure in which housings divided into a plurality of regions are folded by including at least one hinge structure. For example, depending on the change in state of the hinge structure (e.g., folded state, intermediate state, or unfolded state), the state of the display operatively connected to the housing may change. For example, a first display corresponding to a first housing and a second display corresponding to a second housing may change to a state facing or spaced apart from each other. According to one embodiment, at least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description thereof will be omitted below.

[0081] According to one embodiment, the housing (210) may include a back plate (212) (e.g., the back plate (212) of FIG. 2) and a side structure (211) (e.g., the side structure (211) of FIG. 2) extending from the back plate (212) in the thickness direction (e.g., the Z-axis direction). In one embodiment, the side structure (211) may be manufactured as a separate component from the back plate (212) and may be coupled with the back plate (212) to form the housing (210). In one embodiment, the side structure (211) and the back plate (212) may be manufactured and formed as an integral component. Although not shown, the housing (210) may further include a support member (not shown) that isolates the display (220) (e.g., the display panel (223)) from a space in which the printed circuit board (203) or the battery (204) is accommodated, and the support member may be in the form of a flat plate formed integrally with the side structure (211). In the embodiments described below, the rear plate (212) of FIG. 4 and the rear plate (212) of FIG. 3 can be interpreted as being substantially the same.

[0082] According to one embodiment, the back plate (212) and / or the side structure (211) may be formed of a metallic material and / or a non-metallic (e.g., polymer) material. For example, the housing (210) may at least partially include an electrically conductive material. In one embodiment, when the back plate (212) includes an electrically conductive material, the housing (210) may be utilized as a structure that provides an electromagnetic shielding structure at least partially. In one embodiment, when the side structure (211) includes an electrically conductive material, at least a portion of the side structure (211) may be utilized as a radiating conductor for transmitting and receiving wireless radio waves. In one embodiment, when a support member (not shown) is disposed between the printed circuit board (203) and the display panel (223), and the support member includes an electrically conductive material, the support member may provide a ground conductor or an electromagnetic shielding structure of the electronic device (101).

[0083] According to one embodiment, the display (220) may include a window plate (221) (e.g., the front plate (202) of FIG. 2 or FIG. 3) and a display panel (223). The display panel (223) is disposed on the inner surface of the window plate (221) and may output visual information by utilizing substantially the entire area of ​​the window plate (221).

[0084] According to one embodiment, the electronic device (101) may include an audio hole (213) (e.g., audio hole (231) of FIGS. 2 and 3) and a key input device (218) (e.g., key input device (218) of FIGS. 2 and 3) disposed in a side structure (211). A plurality of through holes (213, 218) may be formed to pass through the side structure (211). In one embodiment, a slot or connector hole for accommodating a storage medium may be disposed in the side structure (211), and for example, at least some of the audio hole (213) or the key input device (218) illustrated in the drawing may be replaced with a connector hole. Depending on the embodiment, additional slots and / or connector holes may be formed to pass through the side structure (211).

[0085] According to one embodiment, a printed circuit board (203) disposed as a first circuit board or a main circuit board may have disposed thereon a processor (e.g., a processor (120) of FIG. 1), a memory (e.g., a memory (130) of FIG. 1), and / or an interface (e.g., an interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. In one embodiment, the processor or the communication module may be mounted on an electronic component (255), such as an integrated circuit chip, and disposed on the printed circuit board (203). For example, the electronic component (255) may be disposed on the printed circuit board (203) through a surface mount process and may perform wireless communication using an antenna (253) and / or a portion of a side structure (211). According to one embodiment, the electronic device (101) may include a storage device (e.g., memory) such as a hard disk drive (HDD) or a solid state drive (SSD).

[0086] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0087] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0088] According to one embodiment, the battery (204) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (204) may be disposed substantially on the same plane as, for example, the printed circuit board (203). The battery (204) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0089] According to one embodiment, the antenna (253) may be disposed within the housing (210) adjacent to an edge, for example, a side structure (211). In one embodiment, a plurality of antennas (253) may be arranged at appropriate locations along the edge within the housing (210). In one embodiment, the illustrated antenna (253) may perform millimeter wave (mmWave) communication using a frequency of several tens of GHz or more. In one embodiment, although not illustrated, the electronic device (101) may further include a flat antenna disposed between the back plate (212) and the battery (204). The flat antenna may include wires or printed circuit patterns arranged in a plane to form a loop structure and may function as, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the flat antenna may be capable of performing short-range communication with an external device or wirelessly transmitting and receiving power required for charging.

[0090] FIG. 5A is a plan view illustrating a portion of an electronic device according to an embodiment of the present disclosure. FIG. 5B is a rear view of an electronic device according to an embodiment of the present disclosure. FIG. 6 is a perspective view for explaining a support structure and a recess of an electronic device according to an embodiment of the present disclosure. FIG. 7A is a plan view of portion A of FIG. 5A according to an embodiment of the present disclosure. FIG. 7B is a cross-sectional perspective view taken along line B-B' of FIG. 7A according to an embodiment of the present disclosure. FIG. 7C is a cross-sectional perspective view taken along line C-C' of FIG. 7A according to an embodiment of the present disclosure.

[0091] FIG. 5A may be a plan view of an electronic device (101) with a display (e.g., display (220) of FIG. 4) removed. The electronic device (101) of FIG. 5B may be referred to as the electronic device (101) of FIGS. 1 to 4. The configuration of the housing (210) of FIG. 5B may be all or part of the same or similar to the configuration of the housing (210) of FIGS. 3 and 4.

[0092] Referring to FIGS. 5A to 7C, in one embodiment, an electronic device (101) (e.g., a tablet PC) may include a housing (210) and a support structure (260).

[0093] In one embodiment, the housing (210) may include a side structure (211) (e.g., the side structure (211) of FIGS. 2 to 4) and a rear plate (212) (e.g., the rear plate (212) of FIGS. 2 to 4). In one embodiment, the side structure (211) and the rear plate (212) are described separately for convenience of explanation, but may be formed or manufactured integrally as a single member. In one embodiment, the side structure (211) and the rear plate (212) may be formed or manufactured separately and then coupled to each other.

[0094] According to one embodiment, the side structure (211) may form a side surface of the electronic device (101) (e.g., side surface (210C) of FIG. 3). For example, the side structure (211) may include a portion extending from the side surface of the electronic device (101) (e.g., side surface (210C) of FIG. 3) to the front surface (e.g., first surface (210A) of FIGS. 2 and 3) and / or the back surface (e.g., second surface (210B) of FIGS. 2 and 3) of the electronic device (101).

[0095] According to one embodiment, at least one slit (217) (or segment) may be formed in a portion of the side structure (211) of the housing (210). For example, the slit (217) may be formed to penetrate at least one axial direction (e.g., Y-axis direction) in a portion of the side structure (211). In other words, the slit (217) may be a portion in which a portion of the side structure (211) is deleted or disconnected. For example, referring to FIG. 5B, the electronic device (101) may include a plurality of slits (217) formed at the top (+Y-direction end) and / or the bottom (-Y-direction end). Referring to FIG. 7a, a slit (217) may be defined as a space between a first surface (2112) and a second surface (2113) of a side structure (211) that face each other via a portion (e.g., a first portion (261a)) of a first support structure (261). According to one embodiment, at least a portion of the side structure (211) may be formed of a conductive material, such as a metal, and may function as an antenna (e.g., a slit antenna or a slot antenna) radiator. For example, at least a portion of the side structure (211) disposed between adjacent slits (217) in the side structure (211) may function as an antenna radiator. However, depending on the criteria for distinguishing the side structure (211) and the rear plate (212), the slit (217) may be defined as being formed to extend from the side structure (211) to a portion of the rear plate (212), in which case at least a portion of the side structure (211) and at least a portion of the rear plate (212) may function as an antenna radiator as a conductive element. The slits (217) illustrated in the drawings are merely examples and are not limiting, and the number and position of the slits (217) may be changed as needed.

[0096] Referring to FIG. 5B, according to one embodiment, the electronic device (101) may further include an insulating region (241) (or insulating tape) and / or a camera module (231) (e.g., the camera module (180) of FIG. 1) disposed on the rear plate (212). For example, the insulating region (241) may be formed integrally with a first portion (261a) and / or a second portion (261b) of a non-conductive first support structure (261) disposed on the inside of the housing (210). Depending on the embodiment, a part of the configuration of the electronic device (101) (e.g., the insulating region (241)) may be omitted.

[0097] In one embodiment, the support structure (260) may include a first support structure (261) and a second support structure (262). For example, the first support structure (261) and the second support structure (262) may be formed or manufactured separately and then joined to each other, or may be formed or manufactured integrally.

[0098] According to one embodiment, the first support structure (261) may include a first portion (261a) disposed in the slit (217) of the housing (210) and a second portion (261b) extending inwardly from the first portion (261a) of the electronic device (101). The first portion (261a) and the second portion (261b) of the first support structure (261) are formed integrally, but may be referred to separately for convenience of description. Referring to FIG. 7A, for example, the first portion (261a) may refer to a portion of the first support structure (261) located between the first surface (2112) and the second surface (2113) of the side structure (211). For example, at least a portion of the first support structure (261) may be in contact with or connected to a portion of the inner surface of the side structure (211). In one embodiment, the first support structure (261) may be formed of a non-conductive material, such as a polymer. For example, the first support structure (261) may be formed or manufactured by injection molding. In one embodiment (see FIGS. 14A and 14B ), the first support structure (261) may be formed of a metal.

[0099] According to one embodiment, the second support structure (262) can be connected to the first support structure (261) and can be disposed inside the electronic device (101) to support components of the electronic device (101). According to one embodiment, a front plate (e.g., the front plate (202) of FIGS. 2 and 3 and the window plate (221) of FIG. 4) can be disposed on one side (e.g., the +Z direction side) of the second support structure (262), and a printed circuit board (e.g., the printed circuit board (203) of FIG. 4) can be disposed on the other side (e.g., the -Z direction side). For example, the second support structure (262) can be formed of a conductive material such as a metal and / or a non-conductive material such as a polymer.

[0100] According to one embodiment, the first support structure (261) may include at least one recess (2611) (or recessed portion or trench) formed in the second portion (261b). According to one embodiment, the recess (2611) may be in the form in which a portion of the second portion (261b) is sunken in the thickness direction (e.g., Z-axis direction) of the electronic device (101). Referring to FIG. 7A, the recess (2611) may provide a crack prevention function that blocks the propagation of a crack (C) that occurs in the first portion (261a) of the first support structure (261) and extends into the interior of the electronic device (101). According to one embodiment, the recess (2611) may overlap with the slit (217) or the first portion (2112) disposed in the slit (217) when viewed in one axial direction (e.g., Y-axis direction) through which the slit (217) is formed. For example, the center of the recess (2611) may be aligned with the center of the slit (217) and / or the center of the first portion (261a) disposed in the slit (217) in one axial direction (e.g., Y-axis). For example, referring to FIGS. 7A to 7C, the recess (2611) may include a side wall (2611a) extending from an opening formed in a surface of the second portion (261b) and a bottom surface (2611b) connected to the side wall and at least partially facing the opening.

[0101] In one embodiment, the recess (2611) may overlap a portion of the side structure (211) surrounding the slit (217) when viewed in one axial direction (e.g., the Y-axis direction) through which the slit (217) is formed. In other words, the recess (2611) may extend, for example, from an area of ​​the second portion (261b) facing the first portion (261a) to an area of ​​the second portion (261b) beyond the first surface (2112) and / or the second surface (2113) of the side structure (211). Referring to FIG. 7A, for example, the length (d1) (e.g., the length in the X-axis direction) of the recess (2611) may be greater than or equal to the length (d2) (e.g., the length in the X-axis direction) of the slit (217). According to one embodiment, the length (d1) of the recess (2611) may be longer than the length (d2) of the slit (217). For example, when the length (d1) of the recess (2611) is formed to be longer than the length (d2) of the slit (217), the range of contact between the recess (2611) and the path of the crack (C) progressing toward the inside of the electronic device (101) can be further expanded, and the progress of the crack (C) can be more effectively restricted, compared to the case where the length (d1) of the recess (2611) is less than or equal to the length (d2) of the slit (217). Referring to FIG. 7A, for example, the recess (2611) may be formed to extend along the side structure (211) so as to be spaced apart from the adjacent side structure (211) by a predetermined distance (t1). For example, the extension direction or longitudinal direction (e.g., Y-axis direction) of the recess (2611) may be parallel to a portion of the facing or adjacent side structure (211) or to the longitudinal direction (e.g., Y-axis direction) of the side structure (211). As illustrated in FIGS. 6 to 7c, the recess (2611) may be formed in a single slot type, but this is only an example, and the shape and number of the recesses (2611) are not limited, and may be formed in multiple pieces, for example, and may be formed in various shapes such as circular, polygonal, or irregular shapes.

[0102] FIG. 8A is a perspective view illustrating a recess of an electronic device according to an embodiment of the present disclosure. FIG. 8B is a perspective view illustrating a recess of an electronic device according to an embodiment of the present disclosure. FIG. 9 is a cross-sectional side view of an electronic device according to an embodiment of the present disclosure. FIG. 10A is a perspective view illustrating a recess of an electronic device according to an embodiment of the present disclosure. FIG. 10B is a cross-sectional view taken along line D-D' of FIG. 10A according to an embodiment of the present disclosure. FIG. 10C is a cross-sectional view taken along line E-E' of FIG. 10A according to an embodiment of the present disclosure.

[0103] FIGS. 8A to 10C may illustrate some configurations of an electronic device (e.g., the electronic device (101) of FIGS. 1 to 5B ). The side structure (211) and the first support structure (261) of FIGS. 8A to 10B may be referred to as the side structure (211) and the first support structure (261) of the embodiments of FIGS. 6 to 7C.

[0104] The description of the recess (2611) of FIGS. 8A and 8B may be mainly focused on differences (e.g., shape) from the recess (2611) according to the embodiments of FIGS. 5A to 7C. All or part of the description of the recess (2611) of the embodiments of FIGS. 5A to 7C may also be applied to the recess (2611) of FIGS. 8A and 8B. The recess (2611) of FIGS. 9A to 10B may be referred to as the recess (2611) of the embodiments of FIGS. 5A to 7C.

[0105] Referring to FIG. 8A, in one embodiment, the recess (2611) may include a plurality (e.g., two) of recesses (2611-1, 2611-2). The recesses (2611-1, 2611-2) may be spaced apart from each other. For example, the direction in which the recesses (2611-1, 2611-2) are spaced apart from each other may be parallel to the direction (e.g., Y-axis direction) in which the first surface (2112) and the second surface (2113) of the side structure (211) defining the slit (217) are spaced apart from each other. According to one embodiment, the recesses (2611-1, 2611-2) may at least partially overlap the first portion (261a) when viewed in one axial direction (e.g., Y-axis direction) through which the slit (217) is formed. In one embodiment, the recess (2611) may overlap a portion of the side structure (211) surrounding the slit (217) when viewed in one axial direction (e.g., Y-axis direction) through which the slit (217) is formed. In other words, the recesses (2611-1, 2611-2) may extend, for example, from an area of ​​the second portion (261b) facing the first portion (261a) to an area of ​​the second portion (261b) beyond the first surface (2112) and / or the second surface (2113) of the side structure (211). When the recesses (2611-1, 2611-2) are formed in an area of ​​the second portion (261b) beyond the first surface (2112) and / or the second surface (2113), the range of contact with the path of the crack (C) progressing toward the inside of the electronic device (e.g., the electronic device (101) of FIGS. 1 to 5B) can be further expanded, and the progress of the crack (C) can be more effectively restricted, compared to the case where the recesses (2611-1, 2611-2) are formed only in an area of ​​the second portion (261b) facing the first portion (261a). For example, the centers of the recesses (2611-1, 2611-2) can be arranged to be aligned with the first surface (2112) and / or the second surface (2113) of the side structure (211), for example, when viewed in one axial direction (e.g., the Y-axis direction).As illustrated in FIG. 8a, the recesses (2611-1, 2611-2) may be formed as a pair of circles, but this is only an example, and the shape and number of the recesses (2611-1, 2611-2) are not limited, and for example, the recesses (2611-1, 2611-2) may be formed singly or in groups of three or more, and may be formed in various shapes such as a perforated shape, a polygonal shape, or an irregular shape.

[0106] Referring to FIG. 8B, in one embodiment, the recess (2611) may be formed such that the sidewall (2611a) facing the slit (217) or the first portion (261a) includes a curved surface. According to one embodiment, the recess (2611) may have an arc shape. According to one embodiment, the recess (2611) may be shaped to be curved toward the slit (217) (e.g., toward the +Y direction). However, the direction in which the recess (2611) is curved is not limited, and in one embodiment, the recess (2611) may be shaped to be curved in the opposite direction (e.g., the -Y direction) to the direction in which the slit (217) is positioned. According to one embodiment, the recess (2611) may at least partially overlap the first portion (261a) when viewed in one axial direction (e.g., the Y-axis direction) through which the slit (217) is formed. In one embodiment, the recess (2611) may overlap a portion of the side structure (211) surrounding the slit (217) when viewed in one axial direction (e.g., Y-axis direction) through which the slit (217) is formed. In other words, the recess (2611) may extend from, for example, an area of ​​the second portion (261b) facing the first portion (261a) to an area of ​​the second portion (261b) beyond the first surface (2112) and / or the second surface (2113) of the side structure (211). When the recess (2611) is formed to extend beyond the first surface (2112) and / or the second surface (2113) to the area of ​​the second portion (261b), compared to when it is formed only in the area of ​​the second portion (261b) facing the first portion (261a), the range of contact with the path of the crack (C) progressing toward the inside of the electronic device (e.g., the electronic device (101) of FIGS. 1 to 5b) can be further expanded, and the progress of the crack (C) can be more effectively restricted. For example, the center of the recess (2611) can be arranged to be aligned with the center of the slit (217) or the center of the first portion (261a) when viewed in, for example, one axial direction (e.g., the Y-axis direction).As illustrated in FIG. 8b, the recess (2611) may be formed in a single arc shape, but this is only an example, and the shape and number of the recesses (2611) are not limited. For example, the recesses (2611) may be formed in multiples and may be formed in various shapes such as circular, rectangular, polygonal, or irregular.

[0107] Referring to FIGS. 9 to 10c, in one embodiment, the electronic device (e.g., the electronic device (101) of FIGS. 1 to 5b) may further include a display (220) (e.g., the display (220) of FIG. 4) and an adhesive member (281, 281-1) (e.g., a double-sided tape) disposed between the display (220) and the second portion (261b) of the first support structure (261). According to one embodiment, the adhesive member (281, 281-1) may be formed to close a gap between the display (220) and the first support structure (261). For example, the adhesive member (281, 281-1) may be configured to provide a waterproof or water-resistant function to electrical / electronic components (e.g., the printed circuit board (203) of FIG. 4) disposed inside the electronic device (101). Referring to FIGS. 9 to 10c, for example, the adhesive member (281, 281-1) may be formed to prevent moisture flowing in from the outside of the electronic device (101) through the crack (C) formed from the first portion (261a) to the recess (2611) from penetrating toward the inside of the electronic device (101). Referring to FIG. 9, in one embodiment, the adhesive member (281-1) may be formed to cover or close the recess (2611) formed in the second portion (261b). Referring to FIGS. 10a to 10c, in one embodiment, the adhesive member (281) may be formed to not close the recess (2611) of the second portion (261b) and the second portion (261b) located between the first portion (261a) and the recess (2611). For example, the adhesive member (281) may be formed in an open or cut form in an area overlapping the recess (2611) in the second portion (261b) and a portion of the second portion (261b) located between the first portion (261a) and the recess (2611). For example, the adhesive member (281) of FIGS. 10A to 10C may enable moisture that has entered the recess (2611) to be discharged to the outside of the electronic device (101).Referring to FIG. 10b, moisture (W) flowing in from the outside of the electronic device (101) through the crack (C) formed from the first portion (261a) to the recess (2611) can accumulate in the recess (2611) and then be discharged to the outside of the electronic device (101) through the crack (C).

[0108] FIG. 11A is a plan view illustrating a recess and a filler member of an electronic device according to an embodiment of the present disclosure. FIG. 11B is a cross-sectional view taken along line F-F' of FIG. 11A according to an embodiment of the present disclosure. FIG. 11C is a cross-sectional view of the electronic device of FIG. 11B with a display disposed therein according to an embodiment of the present disclosure. FIG. 12A is a perspective view illustrating a recess and a filler member of an electronic device according to an embodiment of the present disclosure. FIG. 12B is a cross-sectional view taken along line G-G' of FIG. 12A according to an embodiment of the present disclosure. FIG. 13A is a cross-sectional view taken along line G-G' of FIG. 12A according to an embodiment of the present disclosure. FIG. 13B is a cross-sectional view of the electronic device of FIG. 13A in a flipped state. FIG. 14A is a perspective view illustrating a recess and a filler member of an electronic device according to an embodiment of the present disclosure. FIG. 14b is a schematic diagram illustrating a recess and fill member of an electronic device according to one embodiment of the present disclosure.

[0109] The housing (210), the side structure (211), the first support structure (261), and the adhesive member (281) of the embodiments of FIGS. 11A to 14B may be referred to as the side structure (211), the first support structure (261), and the adhesive member (281) of the embodiments of FIGS. 5A to 10C. The recesses (2611, 2612) of FIGS. 11A to 14B may have the same or similar configuration as or in part to the recess (2611) of the embodiments of FIGS. 5A to 10C. The embodiments of FIGS. 11A to 14B do not technically conflict with the embodiments of FIGS. 5A to 10C and may be combined with each other. Hereinafter, any description that overlaps with the descriptions given above with reference to FIGS. 5A to 10C may be omitted.

[0110] FIGS. 11A to 14B may illustrate some configurations of an electronic device (e.g., the electronic device (101) of FIGS. 1 to 5B ). Referring to FIGS. 11A to 14B , in one embodiment, the electronic device (101) may further include a filler (e.g., an adhesive material) disposed in a recess (2611) formed in a second portion (261b) of the first support structure (261). According to one embodiment, the filler (271, 272, 273) may be configured to provide a buffering function, a reinforcing function, and / or a self-repairing function to the first support structure (261). As described below, the filling member (271, 272, 273) may include a material having greater elasticity and / or flexibility (e.g., rubber, bond, silicone, urethane, bond) than the second portion (261b) composed of a non-conductive material such as a polymer, or a material having greater rigidity (e.g., metal) than the second portion (261b), and may be, for example, a solid, liquid, or semi-solid state material. For example, the filling member (271, 272, 273) may be placed in the recess (2611, 2612) in various ways, such as by injection, insertion, or injection molding.

[0111] Referring to FIG. 11A, in one embodiment, the filling member (271) may include an adhesive material. For example, the adhesive material constituting the filling member (271) may have fluidity. Referring to FIG. 11B, in one embodiment, the recess (2612) formed in the second portion (261b) may include a side wall (2612a) and a bottom surface (2612b), and the side wall (2612a) may be formed as a display slant surface (s1). For example, the slant surface (s1) of the side wall (2612a) may be inclined with respect to one surface of the back plate (212) of the electronic device (e.g., the electronic device (101) of FIGS. 1 to 5B) or the display (220). For example, the inclined surface (s1) of the side wall (2612a) may be formed on one side of the side wall (2612a) facing the slit (217) of the side structure (211) or the first portion (261a), but the position of the inclined surface (s1) of the side wall (2612a) may be changed. For example, the inclined surface (s1) of the side wall (2612a) may be formed so that the area of ​​the bottom surface (2612b) is smaller than the area of ​​the opening of the second portion (261b) connected to the side wall (2612a). In other words, the inclined surface (s1) of the side wall (2612a) may be formed so that the internal space of the recess (2612) becomes tapered from the opening of the second portion (261b) connected to the side wall (2612a) toward the bottom surface (2612b).

[0112] Referring to FIG. 11c, in one embodiment, the electronic device (e.g., the electronic device (101) of FIGS. 1 to 5b) may further include a display (220) (e.g., the display (220) of FIG. 4) disposed on a first support structure (261). According to one embodiment, the display (220) may be disposed on the second portion (261b) and may include a protrusion (227) that is at least partially engaged with an inner space of the recess (2612). For example, the protrusion (227) of the display (220) may guide an assembly or coupling position of the display (220) with respect to the first support structure (261), and may strengthen a coupling force between the first support structure (261) and the display (220). In one embodiment, the protrusion (227) of the display (220) may include an inclined surface (s2) that engages with an inclined surface (s1) of the side wall (2612a). For example, when the display (220) is coupled to the first support structure (261), the inclined surface (s2) of the protrusion (227) may slide on the inclined surface (s1) of the side wall (2612a) of the recess (2612). For example, the protrusion (227) may slide on the inclined surface (s1) and press the filler (271), which is an adhesive material, disposed in the recess (2612). The filling material (271), which is an adhesive material, can be pushed around the slit (217) or the first part (261a) by the pressing force of the protrusion (227), thereby reinforcing the strength of the first part (261a) and reducing the occurrence of cracks (e.g., cracks (C) in FIG. 11a) in the first part (261a).

[0113] Referring to FIGS. 12A and 13B , in one embodiment, the filling member (272) may include a material (e.g., rubber, bond, silicone, urethane, bond) having greater elasticity and / or flexibility than the second portion (261b), and may provide a cushioning function against external impact. For example, the filling member (272) may be disposed in various ways, such as by injection, insertion, or injection molding, into the recess (2611). Referring to FIGS. 13A and 13B , in one embodiment, the filling member (272) may include a phase change material that is solid below a phase change temperature and changes from a solid to a liquid state above the phase change temperature. For example, the phase change material of the filling member (272) may have a property of thermal expansion at high temperatures. For example, the phase change temperature may be about 40 degrees or more, or about 60 degrees or more and about 100 degrees or less. For example, the phase change material of the filling member (272) may include paraffin having a phase change temperature of about 60 degrees to about 80 degrees, naphthalene having a phase change temperature of about 80 degrees, petrolatum having a phase change temperature of about 40 degrees, or a combination thereof. Referring to FIG. 13A, the recess (2611) may primarily block the progression of a crack (C) formed toward the inside of an electronic device (e.g., the electronic device (101) of FIGS. 1 to 5B). Referring to FIG. 13B, by applying a temperature higher than the phase change temperature to the filling member (272) including the phase change material in a state in which the electronic device (101) of FIG. 13A is turned over, the phase change material, which has been changed into a liquid state, may penetrate into the crack (C). The phase change material that has penetrated the crack (C) can change back to a solid state, and by filling the crack (C), can provide a self-repair function of the electronic device (101) for the crack (C) and help restore the waterproof function.

[0114] Referring to FIGS. 14a and 14b, in one embodiment, the filling member (273) may include a material (e.g., metal) having greater rigidity than the second portion (261b) and may reinforce the strength of the first support structure (261) (e.g., the second portion (261b)). For example, the filling member (273) may include a shape memory alloy. Referring to FIG. 14b, in one embodiment, the first support structure (261) may be formed of a material having a property of shrinking or expanding due to temperature changes, such as a metal. In this case, the filling member (273) may provide a repulsive force (f2) against a force (f1) that bends the first support structure (261), thereby reducing or preventing deformation of the first support structure (261).

[0115] According to the embodiments of FIGS. 5A to 14B, the recesses (2611, 2612) can reduce the defect rate due to cracks (C) during the manufacturing of the housing (210) of the electronic device (101). For example, the side structure (211) and / or the rear plate (212) of the housing (210) may be formed of metal, and warpage may occur during the manufacturing process. To compensate for the warpage of the housing (210), a warpage compensation process may be performed to pressurize the side structure (211) and / or the rear plate (212), and during this process, a crack (C) may occur in the first portion (261a) of the first support structure (261) disposed in the slit (217) of the side structure (211). In one embodiment, the first support structure (261) formed with recesses (2611, 2612) may have a pressure amount for pressing the side structure (211) and the first support structure (261) for the same correction effect in the warpage correction process as the thickness of the member decreases. If the pressure amount decreases, the occurrence rate of cracks (C) may decrease. According to one experimental example, in the case where the recesses (2611, 2612) are not formed and in the case where they are formed, the pressure amounts for implementing substantially the same warpage correction amount (e.g., about 0.25 mm) in the warpage correction process may be about 4 mm and about 3 mm, respectively, and the defect rate due to the occurrence of cracks (C) may be reduced by about 70% or more.

[0116] FIG. 15 is a plan view of an electronic device according to one embodiment of the present disclosure. FIG. 16 is a cross-sectional view taken along line H-H' of FIG. 15 according to one embodiment of the present disclosure.

[0117] The configuration of the electronic device (101) of FIG. 15 may be the same as all or part of the configuration of the electronic device (101) of FIGS. 1 to 5B. The housing (310), the first support structure (361), and the adhesive member (381) of the embodiments of FIGS. 15 and 16 may be referred to as the housing (210), the first support structure (261), and the adhesive member (281) of the embodiments of FIGS. 5A to 10C. The recess (3611) of FIGS. 15 and 16 may be referred to as the recesses (2611, 2612) of the embodiments of FIGS. 5A to 14B. The embodiments of FIGS. 15 and 16 do not technically conflict with the embodiments of FIGS. 5A to 14B and may be combined with each other. Hereinafter, descriptions that overlap with the descriptions described above with reference to FIGS. 5A to 14B may be omitted. In particular, all or part of the description regarding the recesses (2611, 2612) and filling members (271, 272, 273) described with reference to FIGS. 11a to 14b may be equally applied to the embodiments of FIGS. 15 and 16, and may not be described repeatedly below.

[0118] Referring to FIGS. 15 and 16 , in one embodiment, an electronic device (101) (e.g., a smart phone) may include a housing (310), a display (320), and a first support structure (361). In one embodiment, the housing (310) may include a side structure (311) and a rear plate (312). According to one embodiment, the side structure (311) and the rear plate (312) are described separately for convenience of explanation, but may be formed or manufactured integrally as a single member. According to one embodiment, the side structure (311) and the rear plate (312) may be formed or manufactured separately and then coupled to each other.

[0119] According to one embodiment, at least one slit (317) (or segment) may be formed in a portion of the side structure (311) of the housing (310). For example, the slit (317) may be formed to penetrate at least one axial direction (e.g., Y-axis direction) in a portion of the side structure (311). In other words, the slit (317) may be a portion in which a portion of the side structure (311) is deleted or disconnected. For example, referring to FIG. 16, the electronic device (101) may include a plurality of slits (317) formed at the top (+Y direction end) and / or the bottom (-Y direction end). According to one embodiment, at least a portion of the side structure (311) may be formed of a conductive material such as metal and may function as an antenna (e.g., a slit antenna or a slot antenna) radiator. For example, at least a portion of the side structure (311) positioned between adjacent slits (317) in the side structure (311) may function as an antenna radiator. However, depending on the criteria for distinguishing the side structure (311) and the rear plate (312), the slit (317) may be defined as extending from the side structure (311) to a portion of the rear plate (312), in which case at least a portion of the side structure (311) and at least a portion of the rear plate (312) may function as an antenna radiator as a conductive material. The slits (317) illustrated in the drawings are merely an example and are not limiting, and the number and position of the slits (317) may be changed as needed.

[0120] According to one embodiment, the first support structure (361) may include a first portion (361a) disposed in the slit (317) of the housing (310) and a second portion (361b) extending inwardly from the first portion (361a) of the electronic device (101). The first portion (361a) and the second portion (361b) of the first support structure (361) are formed integrally, but may be referred to separately for convenience of description. For example, at least a portion of the first support structure (361) may be in contact with or connected to a portion of the inner surface of the side structure (311). According to one embodiment, the first support structure (361) may be formed of a non-conductive material such as a polymer. For example, the first support structure (361) may be formed or manufactured by injection molding. According to one embodiment (see FIGS. 14a and 14b), the first support structure (361) may be formed of metal.

[0121] According to one embodiment, the first support structure (361) may include at least one recess (3611) (or recessed portion or trench) formed in the second portion (361b). Referring to FIG. 16, in one embodiment, the recess (3611) may be formed on both sides of the second portion (361b) facing the display (320) and the back plate (312). According to one embodiment, the recess (3611) may be in a shape in which a portion of the second portion (361b) is sunken in the thickness direction (e.g., the Z-axis direction) of the electronic device (101). Referring to FIG. 16, the recess (3611) may provide a crack prevention function that blocks the progression of a crack (C) that occurs in the first portion (361a) of the first support structure (361) and extends into the interior of the electronic device (101). In one embodiment, the recess (3611) may overlap with the slit (317) or the first portion (317a) disposed in the slit (317) when viewed in one axial direction (e.g., Y-axis direction) through which the slit (317) is formed. For example, the center of the recess (3611) may be aligned with the center of the slit (317) and / or the center of the first portion (361a) disposed in the slit (317) when viewed in one axial direction (e.g., Y-axis direction) through which the slit (317) is formed. In one embodiment, the recess (3611) may overlap with a portion of the side structure (311) around the slit (317) when viewed in one axial direction (e.g., Y-axis direction) through which the slit (317) is formed.

[0122] In one embodiment, the electronic device (101) may further include an adhesive member (381) (e.g., double-sided tape) disposed between the display (320) and the second portion (361b) of the first support structure (361). According to one embodiment, the adhesive member (381) may be formed to close a gap between the display (320) and the first support structure (361). For example, the adhesive member (381) may be configured to provide a water-proof or waterproof function to electrical / electronic components (e.g., printed circuit boards) disposed inside the electronic device (101). Referring to FIG. 16 , for example, the adhesive member (381) may be formed to prevent moisture introduced from the outside of the electronic device (101) through a crack (C) formed from the first portion (361a) to the recess (3611) from penetrating toward the inside of the electronic device (101).

[0123] Typically, the side structure (or side bezel structure or side frame) of the housing of an electronic device (e.g., a tablet PC, a smart phone) is made of a metal material and can be utilized as a radiator of an antenna. Slits may be formed in these side structures to implement a slit antenna. An insulating structure (e.g., the first portion (261a) of FIG. 6) extending from a support structure disposed inside the housing may be disposed in these slits. The insulating structure disposed in the slits of the side structures and exposed to the outside of the electronic device may be composed of a material (e.g., a polymer) that is relatively weaker than the material of the side structure (e.g., a metal) and may be vulnerable to defects or damage, such as cracks, due to external impact. If a crack generated in the insulating structure extends to the support structure disposed inside the electronic device, foreign substances, such as moisture or dust, from the outside of the electronic device may penetrate into the inside of the electronic device and cause defects. Therefore, a crack prevention structure is required to prevent cracks that occur in the insulating structure from propagating into the electronic device.

[0124] According to one embodiment of the present disclosure, a crack prevention structure formed in a support structure (e.g., a bracket) inside an electronic device may be provided, wherein the crack prevention structure uses at least one recess formed at a position corresponding to an insulating structure (e.g., a first portion (261a) of FIG. 6) arranged in a slit of a side structure of the electronic device on the support structure.

[0125] According to one embodiment of the present disclosure, the progression of a crack can be primarily prevented by forming a recess in a support structure (e.g., a bracket) inside an electronic device, and the progression of the crack can be secondarily prevented by placing a filling member that is arranged in the recess to reinforce or cushion the support structure.

[0126] However, the challenges addressed by this disclosure are not limited to those mentioned herein, and may be determined in various ways without departing from the spirit and scope of this disclosure. The benefits attainable from this disclosure are not limited to those mentioned above, and various benefits may be provided, directly or indirectly, through this document.

[0127] The crack-prevention structure of the present disclosure described above and the electronic device including the same are not limited to the above-described embodiments and drawings, and it will be apparent to a person skilled in the art to which the present disclosure pertains that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

[0128] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may include a side structure (211) forming a part of an exterior of the electronic device and a first support structure. The side structure may include at least one slit (217) formed penetrating through a conductive portion of the side structure in at least one axial direction. The first support structure may include a first portion (261a) disposed in the at least one slit and a second portion (261b) extending inwardly from the first portion into the electronic device. A portion of the first portion may be exposed to the outside of the electronic device. The first support structure may include at least one recess (2611; 2612; 3611) formed recessed into a portion of the second portion so as to at least partially overlap the first portion when viewed in at least one axial direction.

[0129] In one embodiment, the at least one recess may at least partially overlap a portion of the side structure around the at least one slit when viewed in at least one axial direction.

[0130] According to one embodiment, the at least one recess may be formed to extend in a direction parallel to the side structure at a predetermined interval in the at least one axial direction from the side structure.

[0131] In one embodiment, the at least one recess may include a curved portion facing the at least one slit.

[0132] According to one embodiment, the at least one recess may include a plurality of recesses (2611-1, 2611-2) spaced apart from each other.

[0133] According to one embodiment, the electronic device further comprises a filler member (271, 272, 273) disposed in the at least one recess, wherein the filler member may comprise at least one of a material having greater elasticity than the second portion, a material having greater flexibility than the second portion, or a material having greater rigidity than the second portion.

[0134] In one embodiment, the filler material may include a material that changes state from a solid to a liquid state at a temperature higher than a state change temperature ranging from 40 degrees to 100 degrees.

[0135] In one embodiment, the filler material may include a shape memory alloy.

[0136] According to one embodiment, the electronic device may further include a display (220) disposed on the second portion. The display may include at least one protrusion (227) formed to engage with a portion of the at least one recess (2612) of the second portion.

[0137] According to one embodiment, at least one protrusion may be disposed in a portion of the at least one recess (2612) and an adhesive material (271) may be disposed in the remaining portion.

[0138] According to one embodiment, the at least one recess may include a side wall (2612a) extending from an opening formed in the second portion and a bottom surface (2612b) connected to the side wall and at least partially facing the opening. The side wall may include at least one inclined surface (s1).

[0139] According to one embodiment, the at least one protrusion may include at least one inclined surface (s2) formed to engage with the at least one inclined surface of the side wall of the at least one recess.

[0140] According to one embodiment, the electronic device may further include an adhesive member disposed between the display and the second portion of the first support structure, the adhesive member connecting the display and the second portion to each other.

[0141] In one embodiment, the adhesive member may be positioned so that the adhesive member does not overlap the recess.

[0142] According to one embodiment, the side structure may include a first surface (2112) and a second surface (2113) defining at least one slit, the first surface and the second surface facing each other with the first portion therebetween.

[0143] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may include a side structure (211) forming a part of an exterior of the electronic device and a first support structure. The side structure may include at least one slit (217) formed penetrating through a conductive portion of the side structure in at least one axial direction. The first support structure may include a first portion (261a) disposed in the at least one slit and a second portion (261b) extending inwardly from the first portion to the electronic device. The first support structure may include at least one recess (2611; 2612; 3611) formed in a part of the second portion so as to at least partially overlap a part of the side structure around the first portion and the at least one slit when viewed in the at least one axial direction.

[0144] According to one embodiment, the at least one recess may be formed to extend in a direction parallel to the side structure at a predetermined interval in the at least one axial direction from the side structure.

[0145] In one embodiment, the at least one recess may include a curved portion facing the at least one slit.

[0146] According to one embodiment, the electronic device further includes a display (220) disposed on the second portion, and the display may include at least one protrusion (227) formed to engage with a portion of the at least one recess (2612) of the second portion.

[0147] According to one embodiment, the electronic device may further include an adhesive member disposed between the display and the second portion of the first support structure, the adhesive member connecting the display and the second portion to each other.

[0148] While this disclosure has illustrated and described embodiments of crack-resistant structures and electronic devices including the same, it should be understood that the embodiments are illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detailed configuration may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

[0149] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0150] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0151] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0152] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0153] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0154] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), A side structure (211) forming a part of the exterior of the electronic device, the side structure including at least one slit (217) formed penetrating at least in one axial direction in a conductive portion of the side structure; A first support structure (261) including a first portion (261a) arranged in at least one slit and a second portion (261b) extending inwardly from the first portion into the electronic device, wherein a part of the first portion includes the first support structure exposed to the outside of the electronic device, An electronic device, wherein the first support structure comprises at least one recess (2611; 2612; 3611) formed in a portion of the second portion so as to at least partially overlap the first portion when viewed in at least one axial direction.

2. In paragraph 1, An electronic device wherein said at least one recess at least partially overlaps a portion of said side structure around said at least one slit when viewed in said at least one axial direction.

3. In paragraph 1 or 2, An electronic device, wherein at least one recess is formed to extend in a direction parallel to the side structure at a predetermined interval in the at least one axial direction from the side structure.

4. In any one of paragraphs 1 to 3, An electronic device, wherein said at least one recess comprises a curved portion facing said at least one slit.

5. In any one of paragraphs 1 to 4, An electronic device, wherein said at least one recess comprises a plurality of recesses (2611-1, 2611-2) spaced apart from each other.

6. In any one of paragraphs 1 to 5, The electronic device further comprises a filling member (271, 272, 273) arranged in the at least one recess, the filling member comprising at least one of a material having greater elasticity than the second portion, a material having greater flexibility than the second portion, or a material having greater rigidity than the second portion.

7. In paragraph 6, An electronic device wherein the above-mentioned filling material includes a material that changes state from a solid state to a liquid state at a temperature higher than a state change temperature ranging from 40 degrees to 100 degrees.

8. In paragraph 6, An electronic device wherein the above filling member comprises a shape memory alloy.

9. In any one of paragraphs 1 to 6, The above electronic device, Further comprising a display (220) arranged on the second part, An electronic device, wherein the display includes at least one protrusion (227) formed to engage with a portion of at least one recess (2612) of the second portion.

10. In paragraph 9, An electronic device, wherein at least one protrusion is arranged in a portion of at least one of the recesses and an adhesive material (271) is arranged in the remaining portion.

11. In clause 9 or 10, An electronic device wherein said at least one recess comprises a side wall (2612a) extending from an opening formed in the second portion and a bottom surface (2612b) connected to the side wall and at least partially facing the opening, wherein the side wall comprises at least one inclined surface (s1).

12. In paragraph 11, An electronic device, wherein said at least one protrusion comprises at least one inclined surface (s2) formed to engage with said at least one inclined surface of said side wall of said at least one recess.

13. In any one of paragraphs 1 to 12, The above electronic device, Further comprising an adhesive member disposed between the display and the second part of the first support structure, and connecting the display and the second part to each other. An electronic device wherein the adhesive member is positioned so as not to overlap the recess.

14. In any one of paragraphs 1 to 13, An electronic device, wherein the side structure includes a first surface (2112) and a second surface (2113) defining at least one slit, the first surface and the second surface facing each other with the first portion therebetween.

15. In an electronic device (101), A side structure (211) forming a part of the exterior of the electronic device, the side structure including at least one slit (217) formed penetrating at least in one axial direction in a conductive portion of the side structure; Further comprising a first support structure (261) including a first portion (261a) arranged in at least one slit and a second portion (261b) extending inwardly from the first portion into the electronic device, An electronic device, wherein the first support structure comprises at least one recess (2611; 2612; 3611) formed in a portion of the second portion so as to at least partially overlap with a portion of the side structure around the first portion and the at least one slit when viewed in at least one axial direction.

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