Lighting device and lamp

Abstract

A lighting device according to an embodiment of the present invention comprises: a support plate; a circuit board disposed on the support plate; a plurality of pads disposed on one side of the circuit board: a light source unit disposed on the support plate and having a light-emitting device and a plurality of bonding pads; a plurality of connection members connecting the plurality of pads to the plurality of bonding pads, respectively; and a plurality of molding portions covering different regions of at least one of the plurality of connection members, wherein the uppermost end of at least one of the plurality of molding portions may be disposed higher than the position of the highest point of the plurality of connection members with respect to the upper surface of the circuit board.

Description

Lighting devices and lamps

[0001] Embodiments of the invention relate to lighting devices and lamps.

[0002] Lighting applications include vehicle lighting, display, and signage backlighting. Light-emitting diodes (LEDs) offer advantages over light sources such as fluorescent and incandescent lamps, including low power consumption, a near-permanent lifespan, fast response times, safety, and environmental friendliness. LEDs are used in various lighting devices, including displays, indoor and outdoor lighting. Recently, lamps using LEDs as vehicle light sources have been proposed. Compared to incandescent lamps, LEDs offer the advantage of lower power consumption. Furthermore, their small size allows for greater design flexibility, and their near-permanent lifespan makes them economical. However, because the light emitted from LEDs has a small angle of incidence, there is a need to increase the light-emitting area of ​​LED lamps when using LEDs in vehicle lamps.

[0003] Embodiments of the invention provide a lighting module and a lighting device having a member that secures at least a portion of a connecting member that electrically connects a light source unit and a circuit board. Embodiments of the invention provide a lighting module and a lighting device having a member that secures at least a portion of a plurality of connecting members that electrically connects a light source unit and a circuit board.

[0004] Embodiments of the invention provide a lighting module and a lighting device having a member for fixing the position of a portion of one or more wires on at least one area of ​​an upper surface of a circuit board or an upper surface of a support plate. Embodiments of the invention provide a lighting device and a lamp or an automobile lamp having the same.

[0005] A lighting device according to an embodiment of the invention comprises: a support plate; a circuit board disposed on the support plate; a plurality of pads disposed on one side of the circuit board; a light source portion disposed on the support plate and having a light emitting element and a plurality of bonding pads; a plurality of connecting members respectively connecting the plurality of pads to the plurality of bonding pads; and a plurality of molding members covering different regions of at least one of the plurality of connecting members, wherein an uppermost portion of at least one of the plurality of molding members may be disposed higher than a position of a highest point of the plurality of connecting members based on an upper surface of the circuit board.

[0006] According to an embodiment of the invention, the plurality of pads include a first pad and a second pad adjacent to the light source unit, the plurality of bonding pads include a first bonding pad and a second bonding pad adjacent to the circuit board, the plurality of connecting members include a first connecting member connecting the first pad and the first bonding pad, and a second connecting member connecting the second pad and the second bonding pad, and the uppermost portion of at least one of the plurality of molding members may be arranged higher than the highest points of the first and second connecting members.

[0007] According to an embodiment of the invention, the plurality of molding parts may include a first molding part disposed on a first end of the first connecting member connected to the first pad of the light source part, and a second molding part disposed on a first end of the second connecting member connected to the second pad of the light source part.

[0008] According to an embodiment of the invention, the first and second molding parts may be connected to each other on an area between the first pad and the second pad.

[0009] According to an embodiment of the invention, the area of ​​the first and second molding parts connected to each other may extend to an area between the light source part and the circuit board and cover the intermediate wire part of the first and second connecting members.

[0010] According to an embodiment of the invention, the plurality of molding parts may include a third molding part disposed on a second end of the first connecting member connected to the first bonding pad of the circuit board, and a fourth molding part disposed on a second end of the second connecting member connected to the second bonding pad of the circuit board.

[0011] According to an embodiment of the invention, the third molding portion and the fourth molding portion may be connected to each other in an area between the first bonding pad and the second bonding pad of the circuit board. The area of ​​the third and fourth molding portions that are connected to each other may extend to an area between the light source portion and the circuit board and cover the intermediate wire portions of the first and second connecting members. The plurality of molding portions may include a central molding portion arranged on an intermediate connecting portion between the first and second ends of the first and second connecting members.

[0012] According to an embodiment of the invention, the first and second connecting members include a first end connected to each of the first and second pads of the light source unit, a second end connected to each of the first and second bonding pads of the circuit board, and an intermediate wire portion between the first and second ends, and the plurality of molding parts may include a first molding part covering the first end of the first connecting member, the intermediate wire portion, and the second end, and a second molding part covering the first end of the second connecting member, the intermediate wire portion, and the second end.

[0013] According to an embodiment of the invention, the light source unit may include a first connecting portion that connects the first and second molding portions to each other. The light source unit may include a second connecting portion that connects the first and second molding portions to each other on the circuit board. The support plate may include a concave receiving portion for receiving the circuit board. According to an embodiment of the invention, each of the plurality of connecting members may be a ribbon wire having a width greater than twice its thickness.

[0014] A lamp according to an embodiment of the invention comprises a lighting device emitting white light; and a light guide module or reflector on the lighting device, wherein the lighting device may include the lighting device disclosed above.

[0015] An embodiment of the invention can prevent deformation of the connecting member and cracks in the connecting member by supporting and fixing part or all of the connecting member connecting between the light source unit and the circuit board, thereby improving electrical reliability due to the connecting member. An embodiment of the invention can prevent movement of the connecting member and block electrical contact between the connecting members by molding part or all of the connecting member connecting between the light source unit and the circuit board, and suppress openings or cracks that may occur in the bonding portion between the connecting member and the pad.

[0016] Embodiments of the invention can improve the reliability of a lighting module and a lighting device having the same.

[0017] Figure 1a is a perspective view of a lighting device according to the invention.

[0018] Figure 1b is a side cross-sectional view of the lighting device of Figure 1a.

[0019] Fig. 2 is an enlarged view showing the light source unit, circuit board, and connecting member of Fig. 1a.

[0020] Figures 3 (A) and (B) are drawings showing examples of a pulling test and crack occurrence for the connecting member of Figure 2.

[0021] FIG. 4a is a perspective view of a lighting device according to a first embodiment of the invention.

[0022] Fig. 4b is an example of a plan view of the lighting device of Fig. 4a.

[0023] Fig. 4c is a perspective view showing the connecting member and the fixing frame of the lighting device of Fig. 4a.

[0024] FIG. 5 is an example of a side cross-sectional view of the lighting device of FIG. 4a.

[0025] FIG. 6a is a first modified example of a lighting device according to the first embodiment of the invention.

[0026] Figure 6b is a drawing showing the light source unit and fixed frame of Figure 6.

[0027] Fig. 7 is a second modified example of a lighting device according to the first embodiment of the invention.

[0028] Fig. 8 is a drawing showing an example of a fixed frame of the lighting device of Fig. 7.

[0029] Fig. 9 is a plan view of a lighting device according to a second embodiment of the invention.

[0030] Fig. 10 is a drawing illustrating the molding part, connecting member, and pads of the lighting device of Fig. 9.

[0031] Fig. 11 is an example of a side cross-sectional view of the lighting device of Fig. 9.

[0032] Fig. 12 is a first modified example of the lighting device of Fig. 9.

[0033] Fig. 13 is a second modified example of the lighting device of Fig. 9.

[0034] Fig. 14 is a third modified example of the lighting device of Fig. 9.

[0035] Fig. 15 is a fourth modified example of the lighting device of Fig. 9.

[0036] Fig. 16 is an example of a side cross-sectional view of the lighting device of Fig. 15.

[0037] Fig. 17 is a fifth modified example of the lighting device of Fig. 9.

[0038] Fig. 18 is a sixth modified example of the lighting device of Fig. 9.

[0039] Fig. 19 is a seventh modified example of the lighting device of Fig. 9.

[0040] Fig. 20 is an eighth variation example of the lighting device of Fig. 9.

[0041] Fig. 21 is a ninth modified example of the lighting device of Fig. 9.

[0042] Fig. 22a is another example of the lighting device of Fig. 11.

[0043] Fig. 22b is another example of the light source part of the lighting device of Fig. 11.

[0044] Figures 23 (A)-(D) are plan views showing examples of shapes of a molding part covering an end of a connecting member on a pad according to a second embodiment of the invention.

[0045] Fig. 24 is an example of a light guide module combined with a lighting device of the first embodiment of the invention.

[0046] Fig. 25 is an example of a side cross-sectional view of the lighting device of Fig. 24.

[0047] Fig. 26 is an example of a side cross-sectional view of a light guide module coupled to the lighting device of Fig. 11.

[0048] Fig. 27 is a perspective view of a headlamp to which a lighting device according to an embodiment of the invention is applied.

[0049] Fig. 28 is a cross-sectional view of a lighting device having a reflector according to an embodiment of the invention.

[0050] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The technical idea of ​​the invention is not limited to some of the embodiments described, but can be implemented in various different forms, and one or more of the components between the embodiments can be selectively combined or substituted within the scope of the technical idea of ​​the present invention. In addition, terms (including technical and scientific terms) used in the embodiments of the present invention can be interpreted as having a meaning that can be generally understood by a person having ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, can be interpreted in consideration of the contextual meaning of the related technology.

[0051] The terminology used in the embodiments of the present invention is for the purpose of describing the embodiments and is not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when it is described as “A and (or at least one (or more) of B, C)”, it may include one or more of all combinations that can be combined with A, B, and C. In addition, when describing components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the components from other components, and the nature, order, or sequence of the components are not determined by the terms. In addition, when it is described that a component is “connected,” “coupled,” or “connected” to another component, it may include not only cases where the component is directly connected, coupled, or connected to the other component, but also cases where the component is “connected,” “coupled,” or “connected” due to another component between the component and the other component. Additionally, when it is described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when it is expressed as "above" or "below", it can include the meaning of a downward direction as well as an upward direction based on one component.

[0052] Lighting device

[0053] FIG. 1a is a perspective view of a lighting device according to the invention, FIG. 1b is a side cross-sectional view of the lighting device of FIG. 1a, and FIG. 2 is an enlarged view showing a light source unit, a circuit board, and a connecting member of FIG. 1a.

[0054] Referring to FIGS. 1A, 1B, and 2, a lighting device (1000) may include a support plate (101), a circuit board (110) disposed on a first area of ​​the support plate (101), a light source unit (130) disposed on a second area of ​​the support plate (101), and a connecting member (141, 142) electrically connecting the light source unit (130) and the circuit board (110). The lighting device (1000) may be applied to various lamp devices requiring lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps, it may be applied to head lamps, side mirror lights, side maker lights, fog lights, tail lamps, brake lights, daytime running lights, vehicle interior lights, door scuffs, rear combination lamps, backup lamps, etc. The above lighting device can be applied to indoor and outdoor advertising devices, display devices, and various types of electric vehicles. The lighting device (1000) can be applied to, for example, headlamps.

[0055] Within the lighting device (1000), the light source unit (130) and the circuit board (110) may be spaced apart in one direction, for example, in the second direction (Y) among the first and second directions (X, Y). The first and second directions (X, Y) are directions that are orthogonal to each other, and the direction orthogonal to the first and second directions (X, Y) is a third direction (Z), and the third direction (Z) may be a vertical direction.

[0056] The support plate (101) supports the circuit board (110) and the light source unit (130), and can conduct heat generated from the circuit board (110) and the light source unit (130). The support plate (101) may be a heat dissipation plate. The support plate (101) may be formed of a metal, or may be formed with a laminated structure of a thermally conductive material and a metal layer. The support plate (101) may be formed in a single layer or multiple layers. The thermally conductive material may include a ceramic material, AlN, or an aluminum material having an anodized surface layer. The metal may include at least one of Al, Ni, Mo, Cu, Cu-alloy, Cu-W, Ag, or Au, and may be formed in a single layer or in a multiple layer of two or more metals. The support plate (101) may further include a heat dissipation fin at the bottom.

[0057] The support plate (101) includes an upper portion (102) and a side portion (103), and the upper surface area of ​​the upper portion (102) may be provided as a larger area, for example, twice or more, for example, ten times or more, than the area of ​​the circuit board (110). The side portions (103) may be bent downward from an edge of the upper portion (102) and may be arranged one or more along the outer side of the upper portion (102). Here, the downward direction is a direction facing the opposite side to the direction in which the circuit board (110) is arranged on the upper surface of the support plate (101). An empty space may be provided on the inner side of the side portion (103) and the lower side of the upper portion (102), or a structure such as a heat dissipation fin may be combined. Among the areas of the upper portion (102), a plurality of coupling holes (105, 106) arranged on both sides of the second direction (Y) based on the light source unit (130) may be arranged in the first direction (X). An external structure, for example, a light guide module (500, see FIG. 24), may be coupled to the support plate (101) through the coupling holes (105, 106).

[0058]

[0059] The light source unit (130) is disposed on one side of the upper portion (102) of the support plate (101), and the circuit board (110) is disposed on the other side of the upper portion (102). The light source unit (130) may be disposed on one side of the circuit board (110). The light source unit (130) is disposed on the support plate (101) and may be adhered to it with an adhesive member (138). The adhesive member (138) includes a thermally conductive adhesive member and may be an electrically insulating material such as silicone or epoxy. The lower surface of the light source unit (130) may be adhered to the upper surface of the support plate (101) or may be adhered to an area lower than the upper surface of the support plate (101). The adhesive member (138) may adhere the light source unit (130) to the upper portion (102). The adhesive member (138) is arranged on the lower surface of the light source unit (130), protrudes outward from the side surfaces of the light source unit (130), and can be adhered to the lower portion of the side surface of the light source unit (130). The adhesive member (138) can conduct heat generated from the light source unit (130) to the support plate (101).

[0060]

[0061] The circuit board (110) may include a resin material or a metal material. The circuit board (110) may be formed of any one of a ceramic-based PCB, a metal core PCB (MCPCB), a flexible PCB (FPCB), and a resin-based PCB. As shown in FIG. 5, the circuit board (110) may include a metal layer (110A) at the bottom, a circuit layer (not shown) having pads (111, 112) at the top, a protective layer (110B) made of an insulating material for protecting the circuit layer, and an insulating layer (110C) between the metal layer (110A) and the pads (111, 112). The circuit board (110) may be provided as an MCPCB having a metal layer at the bottom, and may transfer heat to the support plate (101).

[0062] Here, the circuit board (110) can be fastened to the upper part (102) by a fastening means (119), and the fastening means (119) can include one or more screws that fasten and tightly attach the circuit board (110) to the upper part (102). The fastening means (119) may, as another example, include a fastening structure and / or a hooking structure. The adhesive film (118) can adhere the circuit board (110) to the upper part (102) and may be a thermally conductive tape. When the circuit board (110) is fixed by the fastening means (119), the adhesive film (118) can be removed, and the circuit board (110) can be easily separated. The circuit board (110) can be fixed to the upper surface of the support plate (101) by using at least one or both of the fastening means (119) or the adhesive film (118).

[0063]

[0064] The pads (111, 112) of the circuit board (110) may include first and second pads (111, 112) spaced apart from each other. The first and second pads (111, 112) may be connected to a connector (115) disposed on an upper portion of the circuit board (110) through a circuit layer of the circuit board (110). The connector (115) may receive a driving signal and power from the outside. The pads (111, 112) may be disposed on one side of the circuit board (110), and the connector (115) may be coupled to the other side of the circuit board (110). The fastening means (119) may be disposed in an area between the pads (111, 112) and the connector (115). The first and second pads (111, 112) are arranged adjacent to one side of the circuit board (110) and may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Au and optional alloys thereof. Each of the first and second pads (111, 112) includes a single layer or multiple layers, and in the case of multiple layers, may include the same or different metals. The circuit board (110) has the protective layer (110B) on the metal layer (110A), and the protective layer (110B) can protect the pads (111, 112) and the circuit layer, and can open the bonding area or the upper surface area of ​​the pads (111, 112). The above protective layer (110B) may be an insulating material, such as a solder resist material, that partially exposes the pads (111, 112).

[0065]

[0066] The light source unit (130) may be bonded to the upper portion (102) of the support plate (101) with the adhesive member (138). The adhesive member (138) conducts heat generated from the light source unit (130) to the support plate (101). The adhesive member (138) may include a thermally conductive adhesive member, such as a TIM (Thermal interface material), having metal powder or inorganic powder in a resin material. A side surface of the light source unit (130) may face a portion of a side surface of the circuit board (110). The light source unit (130) and the circuit board (110) may be electrically connected. The light source unit (130) and the circuit board (110) may be connected by at least one connecting member (141, 142). The light source unit (130) may include an OLED or an LED. The light source unit (130) is driven when power is supplied through the circuit board (110) and emits light of at least one or two colors of blue, green, red, and white. For example, the light source unit (130) can emit white light.

[0067] The bonding pads (134, 135) of the light source unit (130) are positioned adjacent to one side of the circuit board (110). The pads (111, 112) of the circuit board (110) are positioned adjacent to the other side of the light source unit (130). The bonding pads (134, 135) of the light source unit (130) may be positioned close to the circuit board (110) within the area of ​​the light source unit (130).

[0068] The upper surface of the circuit board (110) may be positioned higher than the upper surface of the light source unit (130) due to the thickness of the circuit board (110). In addition, the upper surfaces of the pads (111, 112) of the circuit board (110) may be positioned higher than the upper surface positions of the bonding pads (134, 135) of the light source unit (130). As another example, as shown in FIG. 22a, the lower surface of the circuit board (110) may be positioned within a receiving portion (108) that is lower than the upper surface of the support plate (101) on which the light source unit (130) is positioned.

[0069]

[0070] The pads of the circuit board (110) may include first and second pads (111, 112) that are spaced apart from each other, and the bonding pads of the light source unit (130) may include first and second bonding pads (134, 135) that are spaced apart from each other. The connecting members (141, 142) may include a first connecting member (141) and a second connecting member (142) that are spaced apart from each other. The first pad (111) and the first bonding pad (134) may be connected to each other by the first connecting member (141), and the second pad (112) and the second bonding pad (135) may be connected to each other by the second connecting member (142). The above pads (111, 112), the bonding pads (134, 135), and the connecting members (141, 142) are described as two each, but may be changed to one, three, or four depending on the connection form. In addition, the pads (111, 112), the bonding pads (134, 135), and the connecting members (141, 142) are described as having the same number each, but at least one may be a different number. For example, the lower end of the light source unit (130) may be electrically connected to the support plate (101) through a via structure, and in this case, the number of the bonding pads (134, 135), the pads (111, 112), and the connecting members (141, 142) may be implemented as one.

[0071] The first bonding pad (134) may function as a cathode terminal, and the second bonding pad (135) may function as an anode terminal. The first bonding pad (134) and the second bonding pad (135) may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Au, and optional alloys thereof. The first and second bonding pads (134, 135) may include a single layer or multiple layers, and in the case of multiple layers, may include the same or different metals.

[0072] The first connecting member (141) and the second connecting member (142) may include electrically conductive wires, and may include at least one of metals such as Au, Cu, Al, and Ag, or an optional alloy thereof. The first connecting member (141) and the second connecting member (142) are wires having a width wider than a thickness, for example, a ribbon-shaped wire, and the width (W) of each may be 0.4 mm or more, for example, in the range of 0.4 mm to 0.9 mm, and the thickness may be 0.15 mm or less, for example, in the range of 0.07 mm to 0.15 mm. The width (W) of each of the first and second connecting members (141, 142) may be more than twice the thickness of the connecting member (141, 142), for example, more than twice and less than 15 times. If it is less than the above range, the connecting member (141, 142) may be bent downward, and the bonding force may be reduced, the available current may be lowered, and the resistance to external force may be weakened. In addition, if the width (W) of the connecting member (141, 142) is greater than the above range, there is a problem that the size of the bonding pad (134, 135) or the pad (111, 112) increases or materials are wasted.

[0073]

[0074] The first connecting member (141) and the second connecting member (142) include a first end (41), a second end (43), and an intermediate wire portion (42). The first end (41) is bonded to the first bonding pad (134) and the second bonding pad (135), respectively, and the second end (43) is bonded to the first pad (111) and the second pad (112), respectively. The intermediate wire portion (42) is connected between the first end (41) and the second end (43) and may have a curved shape. The intermediate wire portion (42) may have, for example, a convex curved shape. The intermediate wire portion (42) of the first connecting member (141) connects the first end (41) bonded to the first bonding pad (134) and the second end (43) bonded to the first pad (111). The intermediate wire portion (42) of the second connecting member (142) connects the first end (41) bonded to the second bonding pad (135) and the second end (43) bonded to the second pad (112). The intermediate wire portion (42) may extend from the other side of the light source portion (130) to one side of the circuit board (110). The intermediate wire portion (42) may have a length longer than the gap between the circuit board (110) and the light source portion (130).

[0075] The upper surface heights of the first end (41) and the second end (43) of the connecting member (141, 142) may be different from each other. For example, the upper surface height of the first end (41) of the connecting member (141, 142) may be arranged lower than the upper surface height of the second end (43), and the height of the highest point of the intermediate wire portion (42) may be arranged higher than the upper surface position of the first end (41). The height of the highest point of the intermediate wire portion (42) may be arranged higher than the upper surface position of the second end (43).

[0076] The first connecting member (141) and the second connecting member (142) may or may not be parallel to each other. When the first connecting member (141) and the second connecting member (142) are parallel to each other, the spacing between the first ends (41) of the first connecting member (141) and the second connecting member (142) and the spacing between the second ends (43) may be the same. The spacing between the middle wire portions (42) of the first and second connecting members (141, 142) may be the same as the spacing between the first ends (41) and the spacing between the second ends (43).

[0077] When the first connecting member (141) and the second connecting member (142) are not parallel to each other, the distance between the first ends (41) of the first connecting member (141) and the second connecting member (142) may be different from the distance between the second ends (43). For example, as shown in FIG. 10, the distance (E1) between the first ends (41) of the first connecting member (141) and the second connecting member (142) may be smaller than the distance (E2) between the second ends (43). In this case, imaginary straight lines extending along the first connecting member (141) and the second connecting member (142) may intersect each other.

[0078]

[0079] As shown in FIGS. 2 and 3, with respect to the upper surface of the support plate (101), the first connecting member (141) and the second connecting member (142) each have a height difference between the first end (41) and the second end (43). When the first and second ends (41, 43) are bonded to the pads (111, 112) and the bonding pads (134, 135), respectively, a bonding failure or an open failure may occur at each end (41, 43) due to the height difference between the first end (41) and the second end (43) of the first and second connecting members (141, 142). The bonding may be performed through an ultrasonic soldering process, and heat of 200 degrees or more is generated.

[0080] In addition, as shown in (A) of FIG. 3, when a wire pull-off test is performed after bonding of the connecting member (141, 142), an open defect due to a heel crack or the like may occur at the connection portion between the first end (41) and the intermediate wire portion (42) of the connecting member (141, 142) and / or the connection portion or bend portion between the second end (43) and the intermediate wire portion (42), or a bound crack or the like may occur at the boundary portion between the first end (41) or the second end (43) and the pad (111, 112) or the bonding pad (134, 135). In order to prevent open defects of these connecting members (141, 142), the design is made by taking into consideration the straight line distance between the first end (41) and the second end (43), the inclination angle extending from the first end (41) to the intermediate wire part (42), and the inclination angle extending from the second end (43) to the intermediate wire part (42). However, when the temperature change is large or there is an external impact, cracks may occur at the boundary between the intermediate wire part (42) and the first and second ends (41, 43) due to the flow of the intermediate wire part (42) of the connecting member (141, 142). That is, it can be seen that the joint where the wire is bent during soldering is most vulnerable to external force and the environment.

[0081] An embodiment of the invention may provide a member having a molding portion made of a resin material in at least one of a region (A1) of a first end (41), a region (A2) of an intermediate wire portion (42), or a region (A3) of a second end (43) of a connecting member (141, 142). The member having the molding portion molds at least one, two or more, or all of the region (A1) of the first end (41), the region (A2) of the intermediate wire portion (42), or the region (A3) of the second end (43) of the connecting member (141, 142), and may fix the position of at least a part of the connecting member (141, 142) from external impact, or may prevent metal oxidation by inhibiting moisture penetration into the regions (A1, A3) of the first and second ends (41, 42). The molding part can mold at least one or two or more regions among the first end (41), the middle wire part (42), and the second end (43) of the first connecting member (141). The molding part can mold at least one or two or more regions among the first end (41), the middle wire part (42), and the second end (43) of the second connecting member (142). The member having the molding part may be made of a material having a low elastic modulus, in which case the stress transmitted to the wire can be reduced and the bonding strength of the bonding portion can be increased. When the wire bonding strength (recognized strength) is evaluated by the full test, the reference matching strength is approximately 135 gf per bonding area, and when molded with the member having the molding part, it appears to be more than twice the reference bonding strength. The molding part or the member having the molding part will be described in detail in the embodiments described below.

[0082]

[0083] FIGS. 4A to 4C and FIG. 5 are examples of lighting devices according to the first embodiment of the invention.

[0084] As shown in FIGS. 4A to 4C and FIG. 5, the lighting device (1000) includes a fixing member (120) having a support plate (101), a circuit board (110) and a light source unit (130) on the support plate (101), a connecting member (141, 142) connecting the circuit board (110) and the light source unit (130), and a molding member (122) covering a portion of the connecting member (141, 142).

[0085] The light source unit (130) includes a support member (133) and a light emitting element (131) arranged on the support member (133). The light emitting element (131) may include, for example, one or more light emitting elements. The light source unit (130) may include a resin member (132), and the resin member (132) may be arranged around the light emitting element (131).

[0086] The above support member (133) may include a ceramic substrate or a semiconductor substrate. The support member (133) may be provided as a ceramic layer or a metal layer. The support member (133) may conduct heat generated from the light emitting element (131) through the support plate (101). The support member (133) may be bonded to the support plate (101) using the adhesive member (138). The adhesive member (138) may be in contact along the lower surface and the lower side surface of the support member (133). Since the adhesive member (138) is in contact with the lower surface and the lower side surface of the support member (133), the heat generated through the support member (133) may be conducted to the support plate (101).

[0087] The above-mentioned support member (133) can support the light-emitting element (131) and can include a conductive pattern electrically connected to the light-emitting element (131). The light source unit (130) can have the light-emitting element (131) on one side and the bonding pad (134, 135) on the other side. The light-emitting element (131) can be arranged on one side of the support member (131) and the bonding pad (134, 135) can be arranged on the other side of the support member (131). The upper surface height of the bonding pad (134, 135) can be arranged higher than the upper surface height of the resin member (132) or can be arranged at the same height as the upper surface height of the resin member (132). A protection element (not shown) for protecting the light emitting elements (131) may be placed on the support member (133). The protection element may be implemented as a thyristor, a zener diode, or a TVS (transient voltage suppression), and protects the light emitting elements (131) from ESD (electro static discharge).

[0088] The light-emitting element (131) may include at least one of a blue, green, or red LED chip. The light-emitting element (131) may be provided as any one of vertical type, horizontal type, or flip type chips. The light-emitting element (131) may include a package having an LED chip and a transparent resin molding member disposed on the LED chip. The resin member (132) may be formed of a single layer or multiple layers of a material including silicone or epoxy. The resin member (132) may further include a convex lens (not shown) on the upper portion. The light-emitting element (131) may include at least one light-emitting chip (30) disposed on the support member (133) and a wavelength conversion layer (31) disposed on the at least one light-emitting chip (30). The light-emitting chip (30) may be arranged in one or more, and may include a plurality of semiconductor layers made of compound semiconductors of group II and group VI elements and / or compound semiconductors of group III and group V elements, and at least one or all of the plurality of semiconductor layers may include a compound semiconductor of a series such as AlInGaN, InGaN, AlGaN, GaN, GaAs, InGaP, AllnGaP, InP, and InGaAs. The wavelength conversion layer (31) is arranged on the light-emitting chip (30) and may cover the entire upper surface of the light-emitting chip (30). The wavelength conversion layer (31) converts a portion of light emitted from the light-emitting chip (30). The wavelength conversion layer (31) may be in contact with the upper surface of the light-emitting chip (30) and a portion of the resin member (132). The wavelength conversion layer (31) may include at least one or two or more of a yellow phosphor, a green phosphor, a blue phosphor, and a red phosphor. The light-emitting element (131) can emit white light. The light-emitting element (131) can emit light having the highest luminous intensity in a direction perpendicular to the upper surface of the light-emitting element (131).As another example, the light emitting element (131) may have LED chips of different wavelengths, in which case the wavelength conversion layer may be removed. The LED chips of different wavelengths may include a red LED chip, a green LED chip, and a blue LED chip.

[0089]

[0090] The light emitting element (131) may be disposed on an upper portion of one side of the support member (133), and the bonding pads (134, 135) may be disposed on an upper portion of the other side of the support member (133). The bonding pads (134, 135) may include a first bonding pad (134) connected to a cathode of the light emitting element (131), and a second bonding pad (135) connected to an anode of the light emitting element (131). The support member (133) has an electrode pattern on which the first and second bonding pads (134, 135) are disposed, and the electrode pattern may electrically connect the light emitting element (131) and the first and second bonding pads (134, 135). The first and second bonding pads (134, 135) may be exposed on an upper surface of the other side of the support member (133). The distance between the light source unit (130) and the circuit board (110) may be 3 mm or more, for example, 3 mm to 10 mm or 3 mm to 8 mm. If the distance is less than the range, the buffer space due to the difference in thermal expansion between the light source unit (130) and the circuit board (110) is reduced, which may lower the electrical reliability of the first and second connecting members (141, 142) when the light source unit (130) moves. If the distance between the light source unit (130) and the circuit board (110) is greater than the range, the length or material of the first and second connecting members (141, 142) increases.

[0091]

[0092] The fixing member (120) may be disposed on one or both of the circuit board (110) and the support plate (101). The fixing member (120) includes the molding portion (122), and the molding portion (122) may mold at least one area or different areas of each of the connecting members (141, 142). The fixing member (120) may include a fixing frame (121) for fixing the molding portion (122). The fixing frame (121) may be disposed on a lower portion of the fixing member (120), and the molding portion (122) may be disposed on an upper portion of the fixing member (120). The fixing frame (121) may be disposed on at least one or both of the circuit board (110) and the support plate (101). The above-described fixed frame (121) may be adhered or bonded to the circuit board (110) or / and the support plate (101). The above-described fixed frame (121) may be fixed on the circuit board (110) or / and the support plate (101). The above-described fixed frame (121) may fix the position of the molding part (122) below the molding part (122). The above-described fixed frame (121) may be in contact with at least a portion of the molding part (122), may be coupled to at least one of the inside or the outside of the molding part (122), or may be coupled to different regions of the molding part (122). As another example, the above-described fixed member (120) may be configured as the molding part (122) without the fixed frame.

[0093]

[0094] The molding part (122) can be in contact with at least one or both of the first and second connecting members (141, 142) and can fix the position of at least a portion of each of the first and second connecting members (141, 142). The molding part (122) can fix the intermediate wire part (42) of at least one of the first and second connecting members (141, 142) on the circuit board (110). The molding part (122) wraps around and supports the periphery of the intermediate wire part (42) of the first and second connecting members (141, 142), and thus can fix the position of the intermediate wire part (42).

[0095] The above fixed frame (121) can be arranged in an area that vertically overlaps with the circuit board (110). The molding part (122) molds and supports an area that vertically overlaps with the circuit board (110) among the areas of the intermediate wire portions (42) of the first and second connecting members (141, 142). The molding part (122) molds and supports an area that vertically overlaps with the area between one side of the circuit board (110) and the pads (111, 112) among the areas of the intermediate wire portions (42) of the first and second connecting members (141, 142).

[0096]

[0097] The above-described fixed frame (121) may be attached or bonded to the circuit board (110). The above-described fixed frame (121) may be attached to a sub-pad (113) disposed within the circuit board (110) using a bonding member (not shown). The above-described fixed frame (121) may include a bottom portion (21) attached to the sub-pad (113), and support portions (22, 23) bent from one or both ends of the bottom portion (21). The support portions (22, 23) may be bent in a third direction (Z) of the circuit board (110) from one or both ends of the bottom portion (21). The bent portion between the bottom portion (21) and the support portions (22, 23) may include a curved surface. The bottom portion (21) may be disposed between the pads (111, 112) and one side of the circuit board (110). As shown in Fig. 4b, the distance (G1) between the support members (22, 23) on both sides of the fixed frame (121) may be greater than the maximum length in the first direction (X) of the area having the pads (111, 112). The distance (G1) between the support members (22, 23) in the first direction (X) may be greater than the maximum length (D2) of the area having the connecting members (141, 142).

[0098] The sub pad (113) may be formed of the same material as the pads (111, 112). The fixed frame (121) may be formed of a metal material, for example, may be formed of at least one of Cu, Ti, Al, Pd, Co, Ni, Ag, and Au, or an alloy of two or more of the above metals. The fixed frame (121) may be formed in a single layer or multiple layers using the metal. The number of the fixed frames (121) and the number of the molding parts (122) may be the same. As another example, the number of the molding parts (122) may be greater than the number of the fixed frames (121), and in this case, the molding parts (122) may be formed in different areas of the fixed frame (121). As another example, the fixed frame (121) may be made of a non-metallic material.

[0099] The molding part (122) is disposed on the fixed frame (121), and the fixed frame (121) can be disposed within the area of ​​the molding part (122). That is, the fixed frame (121) can be attached to the upper surface of the circuit board (110) and embedded in the lower portion of the molding part (122). The molding part (122) can be disposed on the surface of the bottom portion (21) of the fixed frame (121) and in the area between the support parts (22, 23). The molding part (122) can be disposed on the upper and outer sides of the support parts (22, 23). The molding part (122) can be disposed around the periphery of the support parts (22, 23). Accordingly, the molding part (122) can cover the entire upper surface of the fixed frame (121). Additionally, the molding portion (122) may be in contact with at least one or both of the surface of the fixed frame (121) and the upper surface of the circuit board (110).

[0100] The molding portion (122) may be arranged in an area between the first end (41) and the second end (43) of the first connecting member (141). The molding portion (122) may be arranged in an area between the first end (41) and the second end (43) of the second connecting member (142). The molding portion (122) may cover the highest point area of ​​the first connecting member (141), and the height of the uppermost end of the molding portion (122) may be positioned higher than the highest point of the first connecting member (141). The molding portion (122) may cover the highest point area of ​​the second connecting member (142), and the height of the uppermost end of the molding portion (122) may be positioned higher than the highest point of the second connecting member (142). That is, the molding portion (122) can cover the highest point area of ​​the intermediate wire portion (42) of the first and second connecting members (141, 142), and can cover the area of ​​the intermediate wire portion (42) that overlaps the circuit board (110) in a vertical direction on the circuit board (110).

[0101]

[0102] The molding part (122) may include a resin material such as silicone or epoxy, acrylate, urethane, polyolefin, UV resin, or an insulating material, or may be an optional mixture thereof. The molding part (122) may be dispensed on the fixed frame (121) and then cured by a method selected from high temperature curing, room temperature curing, or UV curing. The molding part (122) may be an adhesive or insulating material that is adhered to the connecting members (141, 142). The molding part (122) may include a diffusion agent or a reflective material therein. The molding part (122) has a plurality of side surfaces and an upper surface, and an edge portion between the plurality of side surfaces may include a curved surface or an angled surface, for example, a curved surface, and an edge portion between each of the side surfaces and the upper surface may have a curved surface or an angled surface, for example, a curved surface.

[0103]

[0104] The support portions (22, 23) of the fixed frame (121) may be arranged as first and second support portions (22, 23) arranged on both sides of the first direction (X) of the bottom portion (21), or may be arranged as the first support portion (22) or the second support portion (23) arranged on one or the other end of the bottom portion (21) in the first direction (X). On the upper surface of the support portions (22, 23), the corner portions in the second direction (Y) may be curved or angled. The support portions (22, 23) may protrude toward the outer region of the intermediate wire portions (42) of each of the first and second connecting members (141, 142). The fixed frame (121) may further include a support portion (not shown) protruding into the region between the first and second connecting members (141, 142). The above support members (22, 23) may be one or more, and may be positioned in an area that protrudes from the fixed frame (121) toward the upper surface of the molding member (122) and does not overlap in a direction perpendicular to the upper surface of the support plate (101) with the intermediate wire member (42) of the first and second connecting members (141, 142).

[0105] The above-mentioned fixing member (120) and the first and second connecting members (141, 142) may overlap in a direction perpendicular to the upper surface of the support plate (101) (i.e., Z direction). Part of the fixing member (120) and the first and second connecting members (141, 142) may overlap in a direction perpendicular to the upper surface of the support plate (101). Part of the first and second connecting members (141, 142), the fixing member (120), and the circuit board (110) may overlap in a direction perpendicular to the upper surface of the support plate (101). The molding part (122) of the fixing member (120) and part of the first and second connecting members (141, 142) may overlap in a direction perpendicular to the upper surface of the support plate (101).

[0106] The above-mentioned fixing member (120) can space the position of the intermediate wire portion (42) of the first and second connecting members (141, 142) from the upper surface of the circuit board (110). The above-mentioned molding member (122) can space the position of the intermediate wire portion (42) of the first and second connecting members (141, 142) from the upper surface of the fixing frame (121). The highest point area of ​​the intermediate wire portion (42) can be arranged between the upper surface of the circuit board (110) and the upper surface of the molding member (122). The highest point area of ​​the intermediate wire portion (42) can be arranged between the lower surface of the molding member (122) and the upper surface of the molding member (122). The highest point area of ​​the intermediate wire portion (42) can be arranged between the upper surface of the fixing frame (121) and the molding member (122).

[0107] The upper height (H1) of the molding part (122) based on the upper surface of the circuit board (110) may be higher than the height of the highest point of the connecting member (141, 142). The positions of the highest points of the first and second connecting members (141, 142) based on the upper surface of the circuit board (110) may be arranged between the upper end of the molding part (122) and the fixed frame (121). The height of the highest point of the first and second connecting members (141, 142) based on the upper surface of the circuit board (110) may be higher than the bottom part (21) of the fixed frame (121) and lower than the upper height of the support part (22, 23). As another example, the position of the highest point of the first and second connecting members (141, 142) based on the upper surface of the circuit board (110) may be higher than the upper end of the support member (22, 23) of the fixed frame (121).

[0108]

[0109] At least one or both of the support parts (22, 23) of the fixed frame (121) may include holes (22A, 23A) on the inside. The molding part (122) may be coupled to the holes (22A, 23A) of the support parts (22, 23). Since the molding part (122) is coupled to the holes (22A, 23A) of the support parts (22, 23), the molding part (122) may be prevented from being detached or separated from the fixed frame (121). The holes (22A, 23A) may be circular or polygonal, and may be arranged one or more times in each support part (22, 23). As another example, the fixed frame (121) may include at least one of a groove, a catching protrusion, or a catching step for fixing the molding part (122).

[0110]

[0111] As shown in Fig. 4b, the length (D0) of the fixing member (120) is the length in the first direction (X) orthogonal to the extension direction of the connecting members (141, 142), and is the maximum length of the molding part (122) in the first direction (X). The length (D0) of the fixing member (120) in the first direction (X) may be greater than the maximum length in the first direction (X) of the region where the first and second pads (112, 111) are placed. The length (D0) of the fixing member (120) may be greater than the minimum separation distance (D3) between the first and second connecting members (141, 142) in the first direction (X) and greater than the maximum length (D2) of the region having the first and second connecting members (141, 142). The length (D1) of the fixed frame (121) in the first direction (X) may be greater than the maximum length in the first direction (X) of the area having the first bonding pad (134) and the second bonding pad (135). The length (D1) of the fixed frame (121) in the first direction (X) may be greater than the length (D5) of the light source unit (130).

[0112] The length (D0) of the fixing member (120) in the first direction (X) is different depending on the extension direction of the connecting member (141, 142), and for example, may be a length that can cover the middle area of ​​two connecting members (141, 142) spaced apart in the first direction (X), or may have a length that is 1.5 times or more greater than the length (maximum separation distance) of the area where the two connecting members (141, 142) are placed. The length (D1) of the fixing frame (121) in the first direction (X) may be greater than the maximum length in the first direction (X) of the area having the first pad (111) and the second pad (112).

[0113] The first direction (X) side surfaces of the fixing member (120) may be arranged further outward in the first direction (X) than the first direction (X) outer surfaces of each bonding pad (134, 135) and further outward than the first direction (X) outer surfaces of each pad (111, 112). The fixing member (120) may prevent vertical and horizontal movement of the first and second connecting members (141, 142) with respect to the upper surface of the circuit board (110), thereby preventing a short circuit problem caused by contact between the connecting members (141, 142) and the upper portion (102) of the support plate (101).

[0114]

[0115] In the second direction (Y), the bottom width (C2) of the fixed frame (121) may be equal to or smaller than the upper surface width of the molding portion (122), and may be smaller than the bottom width (C0) of the fixed member (120). Since the bottom width (C0) of the fixed member (120) is arranged to be larger than the bottom width (C2) of the fixed frame (121), the molding portion (122) can seal the fixed frame (121), and increase the bonding area between the molding portion (122) and the circuit board (110).

[0116] The bottom width (C0) of the fixing member (120) in the second direction (Y) is the bottom width of the molding part (122) and may be smaller than the distance (C1) between the pads (111, 112) of the circuit board (110) and one side surface of the circuit board (110). Accordingly, the fixing member (120) may be disposed between the pads (111, 112) and one side surface of the circuit board (110) on the upper surface of the circuit board (110). The fixing member (120) may be disposed between the light source unit (130) and the pads (111, 112). The distance (D4) between the light source unit (130) and the pads (111, 112) of the circuit board (110) may be more than 1 time, for example, more than 1 time and less than 3 times the bottom width (C0) of the fixing member (120). Here, the width (P2) of the first and second bonding pads (134, 135) in the second direction (Y) may be 0.7 mm or more, for example, in the range of 0.7 mm to 1 mm, and the length (P1) in the first direction (X) may be 1 mm or more, for example, in the range of 1 mm to 1.4 mm. The width (P4) of the first and second pads (111, 112) in the second direction (Y) may be arranged in the range of 80% to 120% of the width (P2) of the first and second bonding pads (134, 135), respectively. The length (P3) of the first and second pads (111, 112) in the first direction (X) may be arranged in the range of 80% to 120% of the length (P1) of the first and second bonding pads (134, 135), respectively.

[0117]

[0118] In the first direction (X), both ends of the fixed frame (121) may further protrude a predetermined distance (K1, K2) from the outer side of each of the first and second connecting members (141, 142) toward the outer side of each of the first and second bonding pads (134, 135), for example, the distance (K1, K2) may be 0.2 mm or more, for example, in the range of 0.2 mm to 0.8 mm. The distance (K1, K2) may be a distance that can prevent the problem of the middle wire part (42) of the connecting member (141, 142) and the support part (22, 23) of the fixed frame (121) from coming into contact when the middle wire part (42) of the connecting member (141, 142) moves to both sides in the first direction (X).

[0119] The above fixing member (120) fixes and supports the connecting members (141, 142) on the circuit board (110), thereby preventing movement of the connecting members (141, 142) and preventing a short circuit between the connecting members (141, 142) and the support plate (101). Since each of the support members (22, 23) of the fixing frame (121) is coupled to the inside of the molding part (122), expansion or contraction of the molding part (122) in the first direction (X) can be suppressed. In addition, by protecting the area between the two ends of the connecting members (141, 142) by an external force with the molding part (122), deformation of the connecting members (141, 142) can be reduced, external exposure can be reduced, and a short circuit problem of the intermediate wire part (42) can be prevented.

[0120]

[0121] FIGS. 6A and 6B are first modified examples of a lighting device according to the first embodiment of the invention.

[0122] Referring to FIGS. 6A and 6B, the lighting device includes a recess (105) in which the light source unit (130) is received, and the recess (105) may be concave from one side of the circuit board (110) toward the other side. A length (R2) of the recess (105) in a first direction (X) may be greater than a length (D5, see FIG. 4B) of the light source unit (130) in the first direction, and for example, the length (R2) may be more than 1 time and less than 2 times the length (D5). A length (R1) of the recess (105) in a second direction (Y) may be greater than a length (D6, see FIG. 4B) of the light source unit (130) in the second direction, and for example, the length (R1) may be more than 0.5 times and less than 2 times the length (D6). That is, the light source unit (130) may be partially or entirely stored in the first direction (X) within the recess (105). Accordingly, a portion of the light source unit (130) may be placed inside one side of the circuit board (110).

[0123] A first pad (111) and a second pad (112) may be arranged on both sides of the first direction (X) of the recess (105) of the circuit board (110). That is, the first and second pads (111, 112) may be spaced apart from each other by a distance greater than the length (R2) of the recess (105) in the first direction (X). The top view shape of the recess (105) may have a shape corresponding to the top view shape of the light source unit (130), and may be, for example, a square shape or a square shape with curved corners. In addition, the top view shape of the recess (105) may be a shape in which at least a portion of the side surface of the recess (105) has a curved surface. When the light source unit (130) is accommodated in the recess (105), the adhesive member (138) that adheres the light source unit (130) to the upper portion (102) may be placed within the recess (105). The adhesive member (138) may be spaced apart from the inner surface of the recess (105) or may be in contact with the inner surface of the recess (105). The light source unit (130) may be accommodated in the recess (105) and stably placed.

[0124]

[0125] The above fixing members (120A, 120B) may include first and second fixing members (120A, 120B) spaced apart in the first direction (X) and arranged on both sides of the light source unit (130). The first fixing member (120A) and the second fixing member (120B) may correspond to each other on both sides of the first direction (X) of the recess (105). For example, the first and second fixing members (120A, 120B) may be arranged to face each other on both sides of the first direction (X) of the recess (105).

[0126] The first bonding pad (134) of the light source unit (130) and the first pad (111) of the circuit board (110) are connected by the first connecting member (141), and the second bonding pad (135) of the light source unit (130) and the second pad (112) of the circuit board (110) are connected by the second connecting member (142). The first connecting member (141) and the second connecting member (142) can be extended in the first direction (X).

[0127] Each of the first and second fixing members (120A, 120B) includes a fixing frame (121A, 121B) and a molding part (122A, 122B). The first fixing member (120A) may be disposed in an area between the recess (105) and the first pad (111). The second fixing member (120B) may be disposed in an area between the recess (105) and the second pad (112). The gap between the first and second molding parts (122A, 122B) may be spaced apart by a length (R2) of the recess (105) in the first direction (X). As another example, each of the first and second fixing members (120A, 120B) may be configured with a molding part (122A, 122B) without a fixing frame (121A, 121B).

[0128] The first molding portion (122A) of the first fixing member (120A) fixes a portion of the first connecting member (141) on the circuit board (110), and the second molding portion (122A) of the second fixing member (120B) fixes a portion of the second connecting member (142) on the circuit board (110). The first molding portion (122A) may be disposed in an area of ​​the upper surface of the circuit board (110) that vertically overlaps with the middle wire portion (42) of the first connecting member (141). The second molding portion (122B) may be disposed in an area of ​​the upper surface of the circuit board (110) that vertically overlaps with the middle wire portion (42) of the second connecting member (142). Part of the first and second connecting members (141, 142) are molded into the molding portions (122A, 122B) of the first and second fixing members (120A, 120B), and the positions of the intermediate wire portions (42) of the first and second connecting members (141, 142) can be fixed by the molding portions (122A, 122B). Each of the fixing frames (121A, 121B) can be bonded to the circuit board (110) with an adhesive or joined to a sub pad (113 in FIG. 5).

[0129]

[0130] The position of the highest point of the first connecting member (141) with respect to the upper surface of the circuit board (110) may be lower than the position of the highest point of the first fixing member (120A) or the position of the highest point of the first molding part (122A). The position of the highest point of the second connecting member (142) with respect to the upper surface of the circuit board (110) may be lower than the position of the highest point of the second fixing member (120B) or the position of the highest point of the second molding part (122B). The length (D10) of each of the first and second fixing members (120A, 120B) in the first direction (X) may be greater than the length (C10) in the second direction (Y). The length (D10) of each of the first and second fixing members (120A, 120B) in the second direction (Y) may be greater than the length (P3) of each of the first and second pads (111, 112) in the second direction (Y), and the length (C10) of each of the first and second fixing members (120A, 120B) in the first direction (X) may be greater than the length (P4) of each of the first and second pads (111, 112) in the first direction (X). Here, the lengths (P3, P4) of the first and second pads (112, 112) in the first and second directions (X, Y) may vary depending on the direction in which the connecting member (141, 142) extends.

[0131]

[0132] The first and second fixing members (120A, 120B) may include a bottom portion (21) as disclosed in Fig. 6(b) and support portions (22, 23) bent on one or both sides of the second direction (Y) of the bottom portion (21). The molding portions (122A, 122B) may cover the bottom portion (21) and the support portions (22, 23). The height of the highest point of the first and second connecting members (141, 142) based on the upper surface of the circuit board (110) may be higher than the bottom portion (21) of the fixing frame (121A) and lower than the upper height of the support portions (22, 23). As another example, the height of the highest point of the first and second connecting members (141, 142) based on the upper surface of the circuit board (110) may be higher than the upper height of the support part (22, 23) of the fixing frame (121A) and lower than the high point height of the first and second molding parts (122A, 122B). The length (D10) of each of the molding parts (122A, 122B) or the fixing members (120A, 120B) in the second direction (Y) may be smaller than the length (R1) of the recess (105) in the second direction (Y). The distance in the first direction (X) between the first and second fixing members (120A, 120B) may be greater than or equal to the length (R2) of the recess (105) in the first direction (X), and may reduce interference with light emitted from the light source part (130).

[0133] The above molding portion (122A, 122B) can be formed within the hole (22A, 23A) of the support portion (22, 23). That is, the molding portion (122A, 122B) can extend to the inside of the hole (22A, 23A) of the support portion (22, 23), the inside and outside of the support portion (22, 23), and be adhered and fixed to the fixed frame (121A, 121B). In order to determine the angle of light emitted from the light emitting element (131), the inner surface of the molding portion (122A, 122B) may be inclined with respect to the upper surface of the circuit board (110), or the area between the first and second fixing members (120A, 120B) and the molding portion (122A, 122B) may not overlap with the upper area of ​​the light emitting element (131) in the first direction (X). The area between the first and second fixing members (120A, 120B) and the molding portion (122A, 122B) may not overlap with the upper area of ​​the light emitting element (131) in the second direction (Y).

[0134] The length (D10) of each of the first and second fixing members (120A, 120B) in the second direction (Y) is different depending on the extension direction of the first and second connecting members (141, 142), and may be, for example, a length that can cover a part of one connecting member (141, 142), or may be two or more times, for example, three or more times, larger than the width (W in FIG. 4b) of the one connecting member (141, 142). The first and second fixing members (120A, 120B) fix and support a portion of the first and second connecting members (141, 142), for example, a portion of the intermediate wire portion (42), on the circuit board (110), thereby preventing movement of each of the first and second connecting members (141, 142) and preventing a short circuit problem between the first and second connecting members (141, 142) and the support plate (101).

[0135]

[0136] Figures 7 and 8 are second modified examples of a lighting device according to the first embodiment of the invention.

[0137] Referring to FIGS. 7 and 8, the circuit board (110) may include a concave recess (106) on one side. The recess (106) may have a top-view shape of a circle, an oval, or a semicircle. A part or a lower portion of a fixing member (120C) may be placed in the recess (106). Since the fixing member (120C) is placed within the recess (106), the gap between the light source unit (130) and the circuit board (110) may be reduced.

[0138] The above-described fixed member (120C) includes a fixed frame (121C) and a molding part (122C), and the fixed frame (121C) can be bonded to the upper surface of the support plate (101) with an adhesive or joined with a bonding member (not shown). The fixed frame (121C) can be formed integrally with the support plate (101). The fixed frame (121C) is made of a metal material and can be bonded to the support plate (101). The fixed frame (121C) can include a lower frame (25) in a column shape and an upper frame (26) in a plate shape, and the column shape can be a circular column or a polygonal column, and the plate shape can have a circular or polygonal shape in a top view. The upper frame (26) may have a diameter (D13) or width greater than the diameter or width of the lower frame (25), and may have a diameter (D13) or width greater than the length (D2 of FIG. 4B) of the area in the first direction (X) where the connecting members (141, 142) are placed. The fixing member (120C) may be formed of a molding part (122C) without the fixing frame (121C). That is, the diameter (D13) is longer than the length of the area vertically overlapping the middle wire parts (42) of the first and second connecting members (141, 142) with respect to the upper surface of the circuit board (110), or has a length greater than the length between the two ends of the middle wire parts (42) of the first and second connecting members (141, 142) in the first direction (X).

[0139] The molding part (122C) is arranged on the periphery of the lower frame (25) of the fixing member (120C) and the surface and periphery of the upper frame (26), and is caught by the catch structure between the lower frame (25) and the upper frame (26), so that detachment or separation can be prevented by the structure or shape of the fixing frame (121C). The lower part of the molding part (122C) may have a cylindrical or polygonal cylindrical shape, and the upper surface may have a convex curved surface or a flat surface. The upper end of the molding part (122C) may be positioned higher than the upper height (H2) of the fixing frame (121C) and higher than the upper surface height of the circuit board (110) based on the upper surface of the support plate (101). The upper end of the molding portion (122C) may have a height higher than the highest point of the first and second connecting members (141, 142) based on the upper surface of the support plate (101).

[0140] A portion of the molding portion (122C) may extend to the upper surface of the circuit board (110). A portion of the molding portion (122C) may extend above at least one of the first end (41) and the second end (43) of the first connecting member (141). A portion of the molding portion (122C) may extend above at least one of the first end (41) and the second end (43) of the second connecting member (142). A portion of the molding portion (122C) may extend above at least one of the first and second bonding pads (134, 135). A portion of the molding portion (122C) may extend above at least one of the first and second pads (111, 112). The region to which the molding portion (122C) extends may include at least one or two or more of the configurations disclosed above, for example, the first end (41), the second end (43), the bonding pad (134, 135), or the pad (111, 112).

[0141]

[0142] The first and second connecting members (141, 142) are respectively connected between the bonding pads (134, 135) of the light source unit (130) and the pads (111, 112) of the circuit board (110), and extend onto the fixed frame (121C). The molding member (122C) is formed inside the recess (106) and on the surface of the fixed frame (121C), and surrounds a part of the first and second connecting members (141, 142), for example, a part of the intermediate wire part (42). The molding member (122C) can vertically overlap with the recess (106) based on the upper surface of the support plate (101), and protrudes above the highest point of the connecting member (141, 142), and supports and fixes a part of the connecting member (141, 142), that is, the intermediate wire part (42).

[0143] A part of the molding part (122C) may be in contact with the inner surface of the recess (106) of the circuit board (110) and / or the upper surface of the circuit board (110). A part of the molding part (122C) may be in contact with the other side of the light source part (130) and may be in contact with the upper surface of the support plate (101). A part of the molding part (122C) may be in contact with the surface of the adhesive member (138). The fixing member (120C) fixes and supports the connecting members (141, 142) in the area between the circuit board (110) and the light source part (110), thereby preventing movement of the connecting members (141, 142) and preventing a short circuit problem between the connecting members (141, 142) and the support plate (101).

[0144]

[0145] Figures 9 to 11 are drawings of a lighting device according to a second embodiment of the invention.

[0146] Referring to FIGS. 9 to 11, the lighting device may include a support plate (101), a circuit board (110), a light source unit (130), a connecting member (141, 142), and a molding member (151, 152, 161, 162). The configuration of the support plate (101), the circuit board (110), the light source unit (130), and the connecting member (141, 142) may include the configuration and description of the first embodiment disclosed above. The molding member (151, 152, 161, 162) may include a resin material and may include the configuration and description of the molding member disclosed in the first embodiment. That is, the material of the molding member (151, 152, 161, 162) may include a resin material such as silicone or epoxy, acrylate, urethane, polyolefin, UV resin, or an insulating material, or may be a selective mixture thereof.

[0147] The molding portion (151, 152, 161, 162) may include at least one molding portion arranged on the light source portion (130), and may include, for example, a first molding portion (151) and a second molding portion (152). The molding portion (151, 152, 161, 162) may include at least one molding portion arranged on the circuit board (110), and may include, for example, a third molding portion (161) and a fourth molding portion (162). The first and second molding portions (151) may be in contact with an area of ​​the upper surface of the light source portion (130) excluding an area of ​​the light-emitting element (131). The first and second molding portions (151, 152) may be in contact with the surface of the bonding pad (134, 135) and its surrounding area, excluding the area of ​​the light emitting element (131), among the upper surface of the light source portion (130). The third and fourth molding portions (161, 162) may be in contact with the surface of the pad (111, 112) among the upper surface of the circuit board (110), or may be in contact with the pad (111, 112) and its surrounding area.

[0148] The first molding part (151) may be disposed on the first bonding pad (134) of the light source part (130). The first molding part (151) may be disposed on the first bonding pad (134) and the first end (41) of the first connecting member (141). The first molding part (151) covers the first end (41) of the first connecting member (141) and comes into contact with the upper surface of the first bonding pad (134). The first molding part (151) may cover the surface of the first end (41) of the first connecting member (141) and up to one end (42A) of the intermediate wire part (42). A portion of the first molding part (151) may come into contact with the upper surface of the resin member (132). The lower surface area of ​​the first molding portion (151) may be 50% or more of the upper surface area of ​​the first bonding pad (134), for example, in the range of 50% to 200% or 80% to 120%. If the lower surface area of ​​the first molding portion (151) is smaller than the above range, the adhesive strength between the first end (41) of the first connecting member (141) and the first bonding pads (134) may be reduced, which may result in an open defect of the first end (41) of the first connecting member (141), and oxidation problems of metals such as pads or wires may occur due to external moisture penetration.

[0149] The second molding part (152) may be disposed on the second bonding pad (135) of the light source part (130). The second molding part (152) may be disposed on the second bonding pad (135) and the first end (41) of the second connecting member (142). The second molding part (152) covers the first end (41) of the second connecting member (142) and comes into contact with the upper surface of the second bonding pad (135). The second molding part (152) may cover the surface of the first end (41) of the second connecting member (142) and one end (42A) of the intermediate wire part (42). A part of the second molding part (152) may come into contact with the upper surface of the resin member (132). The lower surface area of ​​the second molding portion (152) may be 50% or more of the upper surface area of ​​the second bonding pad (135), for example, in the range of 50% to 200% or 80% to 120%. If the lower surface area of ​​the second molding portion (152) is smaller than the above range, the adhesive strength between the first end (41) of the second connecting member (142) and the second bonding pads (135) may be reduced, which may result in an open defect of the first end (41) of the second connecting member (142), and oxidation problems of metals such as pads or wires may occur due to external moisture penetration.

[0150] The first and second molding parts (151, 152) can cover and fix one end (42A) of the intermediate wire part (42) of the first and second connecting members (141, 142). Accordingly, the first and second molding parts (151, 152) can prevent the occurrence of cracks at the boundary portion or one end (42A) between the intermediate wire part (42) and the first end (41) of each of the first and second connecting members (141, 142).

[0151] The first and second molding parts (151, 152) may be spaced apart from the light emitting element (131) of the light source part (130). That is, the first and second molding parts (151, 152) may be positioned in an area outside the light emitting element (131)'s light beam angle. Accordingly, it is possible to prevent a decrease in the extraction efficiency of the light emitted from the light emitting element (131) or to prevent a decrease in the uniformity of the light beam angle distribution.

[0152]

[0153] The third molding portion (161) may be disposed on the first pad (111) of the circuit board (110). The third molding portion (161) may be disposed on the first pad (111) and the second end (43) of the first connecting member (141). The third molding portion (161) covers the second end (43) of the first connecting member (141) and is in contact with the upper surface of the first pad (111). The third molding portion (161) may cover the surface of the second end (43) of the first connecting member (141) and the other end (42B) of the intermediate wire portion (42). A part of the third molding portion (161) may be in contact with the upper surface of the circuit board (110), that is, the upper surface of the protective layer (110B in FIG. 11). The lower surface area of ​​the third molding portion (161) may be 50% or more of the upper surface area of ​​the first pad (111), for example, in the range of 50% to 100% or 50% to 150%. If the lower surface area of ​​the third molding portion (161) is smaller than the above range, the adhesive strength between the second end (43) of the first connecting member (141) and the first pads (111) may be reduced, which may result in an open defect of the second end (43) of the first connecting member (141), and oxidation problems of metals such as pads or wires may occur due to external moisture penetration.

[0154] The fourth molding portion (162) may be disposed on the second pad (112) of the circuit board (110). The fourth molding portion (162) may be disposed on the second pad (112) and the second end (43) of the second connecting member (142). The fourth molding portion (162) covers the second end (43) of the second connecting member (142) and is in contact with the upper surface of the second pad (112). The fourth molding portion (162) may cover the surface of the second end (43) of the second connecting member (142) and the other end (42B) of the intermediate wire portion (42). A portion of the fourth molding portion (162) may be in contact with the upper surface of the circuit board (110), that is, the upper surface of the protective layer (110B of FIG. 11). The lower surface area of ​​the fourth molding portion (162) may be 50% or more of the upper surface area of ​​the second pad (112), for example, in the range of 50% to 100% or 50% to 150%. If the lower surface area of ​​the fourth molding portion (162) is smaller than the above range, the adhesive strength between the second end (43) of the second connecting member (142) and the second pads (112) may be reduced, which may result in an open defect of the second end (43) of the second connecting member (142), and oxidation problems of metals such as pads or wires may occur due to external moisture penetration.

[0155] The third and fourth molding parts (161, 162) can cover and fix the other end (42B) of the middle wire part (42) of the first and second connecting members (141, 142). Accordingly, the third and fourth molding parts (161, 162) can prevent the occurrence of cracks at the boundary portion between the middle wire part (42) and the second end (43) of each of the first and second connecting members (141, 142) or at the second end (42B).

[0156]

[0157] The first and second molding parts (151, 152) and the third and fourth molding parts (161, 162) may be spaced apart by a distance greater than the distance (D7) between the light source part (130) and the circuit board (110). The straight length (B0) of the connecting member (141, 142) is the straight length between both ends of each connecting member (141, 142), and may be greater than the distance (D7) between the light source part (130) and the circuit board (110).

[0158] The upper height (H3) of the third and fourth molding portions (161, 162) based on the upper surface of the circuit board (110) may be higher than the upper heights of the first and second molding portions (151, 152). The upper height of the third and fourth molding portions (161, 162) based on the upper surface of the support plate (101) may be higher than the height (H0) of the highest point of the connection member (141, 142). Accordingly, the upper ends of the third and fourth molding portions (161, 162) may protect the upper portions of the connection members (141, 142). The upper ends of the first and second molding portions (151, 152) may be higher than the upper surface of the circuit board (110) based on the upper surface of the support plate (101), and may be the same height as or different from the highest point of the connection member (141, 142). The shape of the upper surface or top view of the first and second molding parts (151, 152) may be a polygonal shape, a circular shape, or an oval shape. The shape of the upper surface or top view of the third and fourth molding parts (161, 162) may be a polygonal shape, a circular shape, or an oval shape.

[0159]

[0160] The first and second molding portions (151, 152) may be spaced apart from each other, or may be in contact or formed integrally as in a modified example described below. The third and fourth molding portions (161, 162) may be spaced apart from each other, or may be in contact or formed integrally as in a modified example described below. The first and third molding portions (151, 161) may be spaced apart from each other, or may be in contact or formed integrally as in a modified example described below. The second and fourth molding portions (152, 162) may be spaced apart from each other, or may be in contact or formed integrally as in a modified example described below. As another example, at least a portion of the first and second molding portions (151, 152) may extend to the other side of the light source portion (130) and may be in contact with the upper surface of the support plate (101). At least a portion of the third and fourth molding portions (161, 162) may extend to one side of the circuit board (110) and may come into contact with the upper surface of the support plate (101).

[0161]

[0162] The minimum spacing (E1) between the first ends (41) of the first and second connecting members (141, 142) may be less than or equal to the minimum spacing (E2) between the second ends (43) of the first and second connecting members (141, 142). For example, the minimum spacing (E1, E2) may satisfy the condition of E1 ≤ E2, and preferably, E1 < E2. This may increase the area of ​​the first and second pads (111, 112) on the circuit board (110), and may also increase the spacing between the first and second pads (111, 112) more than the spacing between the first and second bonding pads (134, 135). Accordingly, within the minimum spacing (E1, E2), E2 may be more than 1 time and less than or equal to 2 times the spacing E1. If the minimum gap (E2) is larger than the above range, the material of the connecting members (141, 142) may be wasted, and each end (41, 43) may tilt due to the gap between the connecting members (141, 142), thereby making it difficult to bond and fix the equipment bonding each end (41, 43). The minimum gap (E1) between the first ends (41) of the first and second connecting members (141, 142) may be larger than the width (W) of the connecting members (141, 142), and may be, for example, 1 mm or more or in the range of 1 mm to 6 mm.

[0163] The internal angle between two imaginary straight lines extending in the longitudinal direction of the first and second connecting members (141, 142) may be 1 degree or more, for example, in the range of 1 degree to 90 degrees or 10 degrees to 60 degrees. If the internal angle is smaller than the above range, the bonding area of ​​the molding portion on the circuit board (110) may be reduced. This allows the second end (43) of the connecting member (141, 142) to be supported by the molding portion having a larger area on the circuit board (110).

[0164]

[0165] Figures 12 to 21 are modified examples of the lighting device of the second embodiment.

[0166] As shown in Fig. 12, the first molding part (153) has a shape in which the first and second molding parts (151, 152) disclosed in Fig. 9 are connected. The first molding part (153) may be disposed on the surfaces of the first and second bonding pads (134, 135) of the light source part (130). The first molding part (153) may be further disposed in the area between the first and second bonding pads (134, 135), that is, on the surface of the resin member (132). The first molding part (153) may extend from the area of ​​the first and second bonding pads (134, 135) to an area adjacent to the other side of the light source part (130). The above first molding portion (153) can cover the first end (41) of the first and second connecting members (141, 142) and one end (42A) of the intermediate wire portion (42).

[0167] The third and fourth molding portions (161, 162) may cover the second end (43) of the connecting member (141, 142) disposed on each of the third and fourth pads (111, 112) of the circuit board (110), and may cover and protect the other end (42B) of the intermediate wire portion (42) of the connecting member (141, 142). The lower surface area of ​​each of the third and fourth molding portions (161, 162) may be smaller than the lower surface area of ​​the first molding portion (153).

[0168]

[0169] As shown in Fig. 13, the third molding part (163) has a shape in which the third and fourth molding parts (161, 162) of Fig. 9 are connected. The third molding part (163) may be disposed on the surfaces of the first and second pads (111, 112) of the circuit board (110). The third molding part (163) may be further disposed in the area between the first and second pads (111, 112). The third molding part (163) may extend from the area of ​​the first and second pads (111, 112) to an area adjacent to one side of the circuit board (110), that is, to the upper surface of the protective layer (110B, see Fig. 11) of the circuit board (110). The third molding portion (163) can cover and protect the second end (43) of the first and second connecting members (141, 142) and the other end (42B), which is the boundary between the second end (43) and the intermediate wire portion (42). The sum of the lower surface areas of the first and second molding portions (151, 152) can be smaller than the lower surface area of ​​the third molding portion (163).

[0170]

[0171] Referring to Fig. 14, the first molding part (153) of the lighting device has a shape in which the first and second molding parts of Fig. 9 are connected, and the second molding part (163A) has a shape in which the third and fourth molding parts of Fig. 9 are connected. The first molding part (153) may be disposed on the surfaces of the first and second bonding pads (134, 135) of the light source part (130). The first molding part (153) may be further disposed in an area between the first and second bonding pads (134, 135), that is, on the surface of the resin member (132). The first molding part (153) may extend from the area of ​​the first and second bonding pads (134, 135) to an area adjacent to the other side of the light source part (130). The first molding portion (153) may cover the first end (41) of the first and second connecting members (141, 142) and one end (42A) of the intermediate wire portion (42). The second molding portion (163A) may be disposed on the surfaces of the first and second pads (111, 112) of the circuit board (110). The second molding portion (163A) may be further disposed in the area between the first and second pads (111, 112). The second molding portion (163A) may extend from the area of ​​the first and second pads (111, 112) to an area adjacent to one side of the circuit board (110), that is, to the upper surface of the protective layer (110B, see FIG. 11) of the circuit board (110). The second molding portion (163A) may cover the second end (43) of the first and second connecting members (141, 142) and the other end (42B) of the intermediate wire portion (42). In addition, the second molding portion (163A) may cover the other end (42B) of the intermediate wire portion (42) of the connecting member (141, 142). The lower surface area of ​​the second molding portion (163A) may be larger than the lower surface area of ​​the first molding portion (153).

[0172]

[0173] Since the first molding portion (153) is molded onto the first ends (41) of the first and second connecting members (141, 142), cracks can be prevented from occurring at the boundary between the first end (41) and the intermediate wire portion (42). Since the second molding portion (163A) is molded onto the second ends (43) of the first and second connecting members (141, 142), cracks can be prevented from occurring at the boundary between the third end (43) and the intermediate wire portion (42).

[0174]

[0175] Referring to FIGS. 15 and 16, in the lighting device, the first molding portion (155) is disposed on the first connecting member (141), and the second molding portion (156) is disposed on the second connecting member (142). At least a portion or all of the areas of the first molding portion (155) and the second molding portion (156) may be separated from each other. The gap between the first molding portion (155) and the second molding portion (156) may be smaller than the minimum gap between the first and second connecting members (141, 142). The gap between the first and second connecting members (141, 142) may satisfy the minimum gap (E1) or more or the maximum gap (E2) or less as illustrated in FIG. 10. The gap between the first molding portion (155) and the second molding portion (156) may be the same depending on the region, or may become wider as it goes from the bonding pad (134, 135) of the light source portion (130) to the region adjacent to the first and second pads (111, 112) of the circuit board (140). The first and second molding portions (155, 156) may have a length longer than the length of the first and second connecting members (141, 142) in the second direction (Y). The width of the first molding portion (155) and the second molding portion (156) in the first direction (X) may be constant, or some regions may be formed differently.

[0176]

[0177] The first molding portion (155) can cover the first end (41), the middle wire portion (42), and the second end (43) of the first connecting member (141), and can be arranged in an area between the light source portion (130) and the circuit board (110). The second molding portion (156) can cover the first end (41), the middle wire portion (42), and the second end (43) of the second connecting member (142), and can be arranged in an area between the light source portion (130) and the circuit board (110). Each of the first and second molding portions (155, 156) can be in contact with the other side of the light source portion (130), one side of the circuit board (110), and the upper surface of the support plate (101). Each of the first and second molding parts (155, 156) may be vertically overlapped with respect to the upper surface of the first and second connecting members (141, 142) and the support plate (101), for example, may be vertically overlapped with the first end (41), the middle wire part (42), and the second end (43) of the first and second connecting members (141, 142).

[0178] The height of the highest point of each of the first and second molding parts (155, 156) based on the upper surface of the support plate (101) may be higher than the height of the highest point of the first and second connecting members (141, 142). Accordingly, the first and second molding parts (155, 156) may protect the surfaces of the first and second connecting members (141, 142). The height of the uppermost points of the first and second molding parts (155, 156) based on the upper surface of the support plate (101) may be the same as or different from each other, and the cross-section in the second direction (Y) may have a circular, elliptical, or polygonal shape.

[0179]

[0180] Fig. 17 is a modified example of Fig. 15, wherein the first and second molding parts (155, 156) may be connected to each other on the light source part (130). That is, the first and second molding parts (155, 156) may include a first connecting part (51) that is connected to each other. The first connecting part (51) may be an area where the first and second molding parts (155, 156) are connected to each other on the light source part (130). The first connecting part (51) is arranged in an area between the first bonding pad (134) and the second bonding pad (135) of the light source part (130), and may be in contact with the surface of the resin member (132). The first connecting portion (51) may be arranged on the upper surface of the light source portion (130), or may extend from the upper surface of the light source portion (130) to a portion of the upper surface of the support plate (101). The first connecting portion (51) may be spaced apart from the light emitting element (131).

[0181] FIG. 18 is a modified example of FIG. 15, in which the first and second molding parts (155, 156) may be connected to each other on the circuit board (110). That is, the first and second molding parts (155, 156) may include a second connecting part (61) that is connected to each other. The second connecting part (61) may be an area where the first and second molding parts (155, 156) are connected to each other on the circuit board (110). The second connecting part (61) is arranged in an area between the first pad (111) and the second pad (112) of the circuit board (110) and may be in contact with the surface of the protective layer (110B, see FIG. 11). The second connecting portion (61) may be positioned on the upper surface of the circuit board (110) or may extend from the upper surface of the circuit board (110) to a portion of the upper surface of the support plate (101).

[0182]

[0183] Fig. 19 is a modified example of Fig. 14, and in the lighting device, the molding portions may be arranged in different regions of the connecting members (141, 142), for example, two regions or three regions or more. The first molding portion (153) may cover the first and second bonding pads (134, 135) on the light source portion (130), the first ends (41) of the first and second connecting members (141, 142), and one end (42A) of the intermediate wire portion (42). The second molding portion (163A) may cover the first and second pads (111, 112), the second ends (43) of the first and second connecting members (141, 142), and the other end (42B) of the intermediate wire portion (42) on the circuit board (110). The height of the uppermost part of the second molding part (163A) based on the upper surface of the support plate (101) may be higher than the height of the uppermost part of the intermediate wire part (42).

[0184]

[0185] The central molding portion (165) may be disposed on the area of ​​the second direction (Y) of the first and second connecting members (141, 143), and may be disposed in the central area of ​​at least one or both of the first and second connecting members (141, 143). The central molding portion (165) may cover at least a portion of the intermediate wire portion (42) of the first and second connecting members (141, 143). The central molding portion (165) may cover the highest point area of ​​the intermediate wire portions (42). The central molding portion (165) may be disposed between the first molding portion (153) and the second molding portion (163A).

[0186] The central molding portion (165) may cover the upper surface of the intermediate wire portion (42) on the support plate (101) and may have an upper end higher than the highest point of the intermediate wire portion (42). The lower portion of the central molding portion (165) may be disposed in an area between the intermediate wire portion (42) and the support plate (101). The central molding portion (165) may be spaced apart from the first and second molding portions (153, 163A) in an area between the first molding portion (153) and the second molding portion (163A). As another example, the lower portion of the central molding portion (165) may be connected to at least one or both of the first and second molding portions (153, 163A). The lower portion of the central molding portion (165) may be in contact with the adhesive member (138) and the surface of the light source portion (130). The lower part of the central molding portion (165) may be in contact with one side of the circuit board (110), or may be in contact with both one side and the upper surface of the circuit board (110).

[0187] Since the above molding parts (153, 163A, 165) are molded on different areas of the first and second connecting members (141, 142), each end (41, 43) and the highest point area of ​​the first and second connecting members (141, 142) can be protected.

[0188]

[0189] Referring to FIG. 20, in the lighting device, the molding portions may be arranged in different regions of the connecting members (141, 142), for example, in two or more regions. The first molding portion (153A) may cover the first and second bonding pads (134, 135) on the light source portion (130), the first end (41) of the first and second connecting members (141, 142), and one end (42A) of the intermediate wire portion (42). The second molding portion (163A) may cover the first and second pads (111, 112), the second end (43) of the first and second connecting members (141, 142), and the other end (42B) of the intermediate wire portion (42) on the circuit board (110).

[0190] The first molding portion (153A) may extend to the highest point area of ​​the intermediate wire portion (42) of the first and second connecting members (141, 142). The first molding portion (153A) may be in contact with the other side of the light source portion (130), the adhesive member (138), and the upper surface of the support plate (101). In addition, the lower portion of the first molding portion (153A) may be further disposed below the intermediate wire portions (42). The height of the uppermost portion of the first molding portion (153A) with respect to the upper surface of the support plate (101) may be higher than the height of the highest point of the intermediate wire portion (42). Among the areas of the first molding portion (153A), the surface closest to one side of the circuit board (110) may be spaced apart from one side of the circuit board (110), or at least a portion thereof may be in contact with one side of the circuit board (110).

[0191]

[0192] The first molding part (153A) and the second molding part (163A) may be separated from each other or at least partially in contact with each other. The lower surface area of ​​the first molding part (153A) may be arranged to be larger than the lower surface area of ​​the second molding part (163A). The first molding part (153A) may support the area of ​​one end (42A) of the connecting member (141, 142) and the other side area of ​​the light source part (130), thereby preventing movement of the one end (42A) of the connecting member (141, 142) and the light source part (130).

[0193]

[0194] Referring to Fig. 21, in the lighting device, the molding portions may be arranged in different regions of the connecting members (141, 142), for example, in two or more regions. The first molding portion (153) may cover the first and second bonding pads (134, 135) on the light source portion (130), the first ends (41) of the first and second connecting members (141, 142), and one end (42A) of the intermediate wire portion (42). The second molding portion (163B) may cover the first and second pads (111, 112), the second ends (43) of the first and second connecting members (141, 142), and the other end (42B) of the intermediate wire portion (42) on the circuit board (110).

[0195] The second molding portion (163B) may extend to the highest point area of ​​the intermediate wire portion (42) of the first and second connecting members (141, 142). The second molding portion (163B) may be in contact with one side of the circuit board (110), the upper surface of the support plate (101), and the adhesive member (138). The lower portion of the second molding portion (163B) may be further disposed below the intermediate wire portions (42). The height of the uppermost portion of the second molding portion (163B) with respect to the upper surface of the support plate (101) may be higher than the height of the highest point of the intermediate wire portion (42). Among the areas of the second molding portion (163B), the surface closest to the other side of the light source portion (130) may be spaced apart from the other side of the light source portion (130), or at least a portion thereof may be in contact with the other side of the light source portion (130).

[0196] The first molding part (153A) and the second molding part (163B) may be separated from each other or at least partially in contact with each other. The lower surface area of ​​the second molding part (163B) may be arranged to be larger than the lower surface area of ​​the first molding part (153A). The second molding part (163B) may support the area of ​​the other end (42B) of the connecting member (141, 142) and one area of ​​the circuit board (110), thereby preventing movement of the other end (42B) of the connecting member (141, 142) and the intermediate wire part (42).

[0197]

[0198] Fig. 22a is another example of a support plate of the lighting device of Fig. 11.

[0199] As shown in Fig. 22a, the support plate (101) may include a concave receiving portion (108) on the upper portion. Accordingly, the stepped bottom portion (102A) of the upper portion (102) of the support plate (101) may be positioned lower than the upper surface of the upper portion (102).

[0200] The above-described receiving portion (108) may be provided in a size in which the circuit board (110) can be inserted. The depth of the receiving portion (108) may be 0.5 times or more, for example, 0.5 to 1.5 times the thickness of the circuit board (110). If the depth of the receiving portion (108) is greater than the above range, a decrease in rigidity may occur in the stepped region of the upper portion (102), and if it is less than the above range, the effect of lowering the high point height of the wire may be reduced. The molding portions (151, 152, 161, 162) may be applied to the embodiment of FIG. 11, and may also be applied to the embodiments of FIGS. 12 to 21 disclosed above. In addition, a configuration having the receiving portion (108) may be applied to the embodiments of FIGS. 4A to 8. That is, the circuit board (110) disclosed in the above embodiment or modified example can be applied on the stepped bottom portion (102A) of the upper portion (102). Since the upper surface height of the circuit board (110) can be lowered based on the upper surface of the support plate (101), the difference between the upper surface height of the light source unit (130) and the upper surface height of the circuit board (110) can be reduced. Accordingly, the difference between the upper surface height of the bonding pads (134, 135) of the light source unit (130) and the upper surface height of the pads (111, 112) of the circuit board (110) can be reduced, and the connecting members (141, 142) can lower the inclination angle extending from each end (41, 43) to the intermediate wire portion (42), and the occurrence of cracks in the area between each end (41, 43) and the intermediate wire portion (42) can be suppressed.

[0201]

[0202] As shown in Fig. 22b, the bonding pads (134, 135) of the light source unit (130) can be positioned in an area lower than the upper surface of the resin member (132). Accordingly, the difference between the upper surface height of the bonding pads (134, 135) of the light source unit (130) and the upper surface height of the pads (111, 112) of the circuit board (110) can be reduced, and the connecting members (141, 142) can lower the inclination angle extending from each end (41, 43) to the intermediate wire unit (42), thereby suppressing the occurrence of cracks in the area between each end (41, 43) and the intermediate wire unit (42).

[0203]

[0204] Fig. 23 is an example showing the shape of the molding part of the embodiment disclosed above. The shape of the molding part is a top-view shape, and the shape extending along the outer line may include at least one or two or more of a straight line, a curve, a concave or convex shape. In the shape of the side cross-section of the molding part in the first direction (X) or the second direction (Y), the outer line may include at least one or two or more of a convex curved surface, a concave curved surface, and an uneven shape.

[0205] As shown in (A) of Fig. 23, a pad (PA1) is connected to a light source or a circuit board, and ends (41, 43) of connecting members (141, 142) are connected to the pad (PA1). A molding part (PP1) is arranged on the pad (PA1) and can seal the entire area of ​​each end (41, 43). The top view shape of the molding part (PP1) may be a circle or an oval, and the side cross-section may be a hemisphere or a bar oval.

[0206] As shown in (B) of Fig. 23, the ends (41, 43) of the connecting members (141, 142) are connected to the pads (PA1) on the light source or the circuit board, and the molding part (PP2) is arranged on the pads (PA1) and can seal the entire area of ​​each end (41, 43). The top view shape of the molding part (PP2) may be a polygonal shape, for example, a square shape or a shape larger than that (for example, a pentagon, a hexagon, an octagon), and each corner portion (Ra1) of the polygonal shape may be an angled surface or a curved surface, and each side surface (Ra2) may be a straight shape.

[0207] As shown in (C) of Fig. 23, the ends (41, 43) of the connecting members (141, 142) are connected to the pads (PA1) on the light source or the circuit board, and the molding part (PP2) is arranged on the pads (PA1) and can seal the entire area of ​​each end (41, 43). The top view shape of the molding part (PP2) may be a polygonal shape, for example, a square shape or a larger shape, and each corner portion (Ra1) of the polygonal shape may be an angled surface or a curved surface, and the side surfaces (Ra4) arranged on the pads (PA1) may be a convex curved shape, and the side surface (Sa1) outside the pads (PA) may have a straight shape or include a curved shape.

[0208] As shown in (D) of Fig. 23, the ends (41, 43) of the connecting members (141, 142) are connected to the pads (PA1) on the light source or the circuit board, and the molding part (PP4) is arranged on the pads (PA1) and can seal the entire area of ​​each end (41, 43). The top view shape of the molding part (PP4) may be symmetrical on both sides with respect to the center line, and the symmetrical shape may be a semicircle or a semi-ellipse. The outer circular line of the molding part (PP4) may be a convex curved surface (Ra5), and both ends of the center line may have concave areas (Ra7). As another example, the shapes formed on both sides with respect to the center line may be the same shape, but the formed surface areas may be different.

[0209]

[0210] In a lighting device according to an embodiment of the invention, as shown in FIG. 24, light emitted from a light source unit (130) can be extracted through a light guide module (500) made of a transparent material. The lighting device disclosed above can be defined as a light source module.

[0211] As shown in FIGS. 24 and 25, the light guide module (500) includes a transparent plate (510) and a light guide portion (520). The transparent plate (510) may be made of a transparent plastic material, and the light guide portion (520) may protrude on the transparent plate (510) and may be made of a transparent plastic material. The transparent plastic material may include PC or PMMA. The transparent plate (510) and the light guide portion (520) may be made of the same material. The transparent plate (510) and the light guide portion (520) may be formed integrally with a transparent material.

[0212] The transparent plate (510) aligns the position between the light source unit (130) and the light guide unit (520) and can be coupled to the support plate (101). In addition, the transparent plate (510) can cover the upper periphery of the light source unit (130) so that light emitted from the light source unit (130) is effectively incident on the light guide unit (520).

[0213] The lower surface or upper surface of the transparent plate (510) may be arranged parallel to the upper surface of the support plate (101). The transparent plate (510) may be spaced apart from the upper surface of the support plate (101) by a predetermined distance, and may be located at a position higher than the height of the uppermost end of the fixing member (120) of FIG. 1, for example, 2.5 mm or more, for example, in the range of 2.5 mm to 7 mm.

[0214] The light guide unit (520) is provided in a columnar shape and may include, for example, a circular column or a polygonal column shape. The light guide unit (520) may have a shape with a narrow lower area and a wide upper area depending on the directional distribution of the light source unit (130). The directional angle of the light source unit (130) may be 70 degrees or more, for example, in the range of 70 degrees to 150 degrees.

[0215] The light guide unit (520) may overlap with the light source unit (130) in a vertical direction. The light guide unit (520) emits point light of the light source unit (130) as surface light. The light guide unit (520) may have a lower surface area or / and an upper surface area that is larger than the upper surface area of ​​the light source unit (130).

[0216] The above light guide portion (520) may have a diameter or width greater than the length of one side of the light source portion (130) (D5 in FIG. 10), for example, 1.5 times or more the length of one side of the light source portion (130), and preferably, 5 mm or more, for example, in the range of 5 mm to 10 mm. If the diameter or width of the light guide portion (520) is smaller than the above range, the amount of incident light may be reduced, and if it is larger than the above range, the luminous intensity or luminous intensity distribution may be reduced.

[0217]

[0218] The transparent plate (510) includes a first support protrusion (531) and a second support protrusion (535) at the bottom, and the first support protrusion (531) may be arranged on both sides of the outer lower portion of the transparent plate (510), and the second support protrusion (535) may be arranged on both sides of the inner lower portion. Here, the inner portion may be in the direction of the circuit board (110) arranged at the center of the support plate (101). The transparent plate (510) may be coupled to the support plate (101) by a fastening means through the first support protrusion (531) and the second support protrusion (535). A coupling portion (535A) coupled to the first and second support protrusions (531, 535) may be arranged on the upper surface of the transparent plate (510), or a washer or a nut may be coupled.

[0219] This light guide module (500) can extract light, for example, white light, emitted through the light source unit (130) of the lighting device (1000) to the outside. In addition, the light guide unit (520) is positioned in the direction in which the highest light intensity is emitted from the light source unit (130), and since the light is incident, it can be emitted to the outside without light loss.

[0220] The lighting device of Fig. 25 is an example in which a connecting member (141, 142) is fixed on a circuit board (110) as disclosed in Fig. 5 by a fixing member (120) as disclosed above. The lighting device of Fig. 26 is an example in which a connecting member (141, 142) is fixed on a light source unit (130) and a circuit board (110) as disclosed in Fig. 11 by a molding member (151, 152, 161, 162). These connecting members can be selectively applied and fixed among the embodiments or modified examples disclosed above.

[0221]

[0222] Referring to FIG. 27, a vehicle headlamp (90) having a lighting device according to an embodiment includes a light source module (93) and a housing (92), wherein the light source module (93) is disposed inside the housing (92) to irradiate light, and the irradiated light can be reflected in an emission direction through an inner surface (92A) of the housing (92). The housing (92) has a cavity (95) inside, and the cavity (95) is an area that is open in the emission direction or on one side, and the light source module (93) can be coupled inside. The light source module (93) can include the lighting device disclosed above. The shape of the cavity (95) can be a hemispherical shape, a semi-elliptical shape, a circular shape, or an elliptical shape when viewed in the emission direction or the opening direction.

[0223] The housing (92) may include a metal or non-metallic material, and the non-metallic material may include a plastic material. The housing (92) may be a reflector of a headlamp. The inner surface (92A) of the housing (92) or the inner surface (92A) of the cavity (95) may be a surface coated with a highly reflective material or may include a reflective layer having an anti-reflection (AR) material. For example, the highly reflective material may include at least one of metals such as Al, Ag, and Au, and the anti-reflection material may include at least one of MgF2, Al2O3, SiO, SiO2, TiO2+ZrO2, TiO2, and ZrO2. The reflective layer of the inner surface (92A) may be a single layer or a multi-layer. Since the cavity (95) is provided with a reflective material around its periphery, it can function as a reflective cup.

[0224] The above headlamp (90) may include an inner lens and / or an outer lens that projects light emitted through the housing (92). Depending on the shape of the inner lens or the number of light source units, the light distribution pattern of the light irradiated from the light source module (93) may be adjusted. The light source module (93) selectively irradiates light of a high beam distribution pattern and a low beam distribution pattern, and the high beam distribution pattern or the low beam distribution pattern may be automatically turned on and off depending on the driving mode or driving situation.

[0225] The inner surface (92A) of the housing (92) may comprise a partially domed or partially elliptical paraboloid. The inner surface (92A) may have a plurality of facets. The facets may be free-form, flat, and / or curved (e.g., concave or convex) members. In some examples, a single facet may have a free-form portion, and / or a flat portion, and / or a curved portion (e.g., any combination thereof). In some embodiments, the facets (or at least the inwardly facing surfaces on the facets) may be at least approximated or otherwise defined by algebraic equations. For example, the shape or inwardly facing surfaces of the facets may be expressed by one or more fifth-order algebraic equations (although other equations of any order are also possible). In at least one exemplary embodiment, the surface (or, for example, the coating) of the facets has a high reflectivity (e.g., a reflectivity of 80% or greater). Non-limiting examples of facets and / or coatings on the facets include aluminum and silver, although other reflective materials may be used.

[0226] The inner surface (92A) of the housing (92) is spaced laterally from the light source module (93), and light emitted from the light source module (93) can be reflected by the inner surface (92A) and focused toward the exit side of the housing (92), and can be irradiated as a high beam or a low beam. The outer side of the housing (92) can include various features and accessories for mounting or connecting the headlamp (90) to the interior of the vehicle, and can have an electrical interface, such as a socket, for connecting power and / or signals. The housing (92) and cavity (95) described above are examples and can be changed into various shapes. The housing (92) according to the embodiment can function as a reflector of the left / right headlamps (90).

[0227]

[0228] As another example of a lamp, there is an example in which a reflector is applied to a lighting device as in Fig. 28. The lighting device can apply the lighting device disclosed in the embodiment or modified example.

[0229] As shown in Fig. 28, the lower end of the reflector (95A) may be placed on the upper end (102) of the support plate (101). The lower end of the reflector (95A) may be placed in an area adjacent to the light source unit (130) placed on the support plate (101). The lower end of the reflector (95A) may be provided in a form that surrounds at least three sides and the upper surface of the light source unit (130). The area between the upper end of the reflector (95A) and the upper surface of the support plate (101) may be an area where light is emitted. The interior of the reflector (95A), that is, the area between the reflector (95A) and the upper end of the support plate (101), may be an open area, which may be an area where light is mixed.

[0230] The vertical distance between the upper end of the reflector (95A) and the upper surface of the support plate (101) may be greater than the distance between the upper surface of the light source unit (130) and the point where an imaginary straight line perpendicular to the upper surface of the light source unit (130) intersects the reflector (95A). Accordingly, the reflector (95A) may emit light emitted from the light source unit (130) in a lateral direction. Here, the lateral direction is a direction away from the straight line perpendicular to the light source unit (130) and is a direction in which light reflected by the reflector (95A) and light emitted from the light source unit (130) are emitted. As another example, the lower end of the reflector (95A) may be disposed on the circuit board (110). As another example, the lower end of the reflector (95A) may be placed on the circuit board (110) and the upper end (102) of the support plate (101). Depending on the position of the reflector (95A), the direction of light emission may vary, and for example, the direction of light emission between the support plate (101) and the reflector (95A) may be at least one direction among directions orthogonal to an imaginary straight line perpendicular to the light source unit (130).

[0231] The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention, and are not necessarily limited to just one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified and implemented in other embodiments by a person having ordinary skill in the art to which the embodiments pertain. Therefore, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention. Although the embodiments have been described above, these are merely examples and do not limit the present invention. Those having ordinary skill in the art to which the present invention pertains will appreciate that various modifications and applications not illustrated above are possible without departing from the essential characteristics of the embodiments. For example, each component specifically shown in the embodiments can be modified and implemented. In addition, differences related to such modifications and applications should be interpreted as being included in the scope of the present invention defined in the appended claims.

Claims

1. Support plate; A circuit board arranged on the above support plate; A plurality of pads arranged on one side of the circuit board; A light source unit disposed on the support plate and having a light emitting element and a plurality of bonding pads; A plurality of connecting members each connecting the plurality of pads to the plurality of bonding pads; and A plurality of molding parts covering different areas of at least one of the plurality of connecting members, A lighting device, wherein the uppermost portion of at least one of the plurality of molding parts is positioned higher than the highest point of the plurality of connecting members with respect to the upper surface of the circuit board.

2. In paragraph 1, The above plurality of pads include a first pad and a second pad adjacent to the light source unit, The above plurality of bonding pads include a first bonding pad and a second bonding pad adjacent to the circuit board, The plurality of connecting members include a first connecting member connecting the first pad and the first bonding pad, and a second connecting member connecting the second pad and the second bonding pad, A lighting device, wherein the uppermost portion of at least one of the plurality of molding parts is positioned higher than the highest point of the first and second connecting members with respect to the upper surface of the circuit board.

3. In paragraph 2, A lighting device, wherein the plurality of molding parts include a first molding part disposed on a first end of the first connecting member connected to the first pad of the light source part, and a second molding part disposed on a first end of the second connecting member connected to the second pad of the light source part.

4. In paragraph 3, A lighting device wherein the first and second molding portions are connected to each other in an area between the first pad and the second pad.

5. In paragraph 4, A lighting device in which the area of ​​the first and second molding parts connected to each other extends to the area between the light source part and the circuit board and covers the intermediate wire part of the first and second connecting members.

6. In paragraph 2 or paragraph 3, A lighting device, wherein the plurality of molding portions include a third molding portion arranged on a second end of the first connecting member connected to the first bonding pad of the circuit board, and a fourth molding portion arranged on a second end of the second connecting member connected to the second bonding pad of the circuit board.

7. In paragraph 6, A lighting device, wherein the third molding portion and the fourth molding portion are connected to each other in an area between the first bonding pad and the second bonding pad of the circuit board.

8. In paragraph 7, A lighting device in which the areas of the third and fourth molding parts connected to each other extend to the area between the light source part and the circuit board and cover the intermediate wire parts of the first and second connecting members.

9. In paragraph 7, A lighting device, wherein the plurality of molding parts include a central molding part disposed on an intermediate connecting part between the first and second ends of the first and second connecting members.

10. In paragraph 2, The first and second connecting members include a first end connected to each of the first and second pads of the light source unit, a second end connected to each of the first and second bonding pads of the circuit board, and an intermediate wire portion between the first and second ends. A lighting device, wherein the plurality of molding parts include a first molding part covering a first end of the first connecting member, the intermediate wire part, and the second end, and a second molding part covering a first end of the second connecting member, the intermediate wire part, and the second end.

11. In paragraph 10, A lighting device comprising a first connecting portion that connects the first and second molding portions to each other on the light source portion.

12. In paragraph 10, A lighting device comprising a second connecting portion that connects the first and second molding portions to each other on the circuit board.

13. In any one of paragraphs 1 to 5, A lighting device, wherein the support plate includes a concave receiving portion for receiving the circuit board.

14. In any one of paragraphs 1 to 5, A lighting device, wherein each of the above plurality of connecting members is a ribbon wire having a width greater than twice its thickness.

15. A lighting device that emits white light; and A light guide module or reflector is included on the above lighting device, The above lighting device is a lamp according to any one of claims 1 to 5.

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