Package, chip, and electronic device

Abstract

Embodiments of the present application provide a package, a chip, and an electronic device. The package comprises a substrate, and a first die, a second die, a first structural member and a second structural member which are arranged on the substrate, and a first dielectric material is arranged between the first die and the second die; the first structural member is arranged on the side of the first die distant from the substrate, and the first die is located within an orthographic projection area of the first structural member on a surface of the substrate; and the second structural member is arranged on the side of the second die distant from the substrate, the second die is located within an orthographic projection area of the second structural member on the surface of the substrate, and an air gap is arranged between the first structural member and the second structural member. The first structural member and the second structural member in the package may respectively assist in heat dissipation of the first die and the second die. Since the first die and the second die are not directly connected or in contact, and the first structural member and the second structural member are not directly connected or in contact, the influence of thermal crosstalk between the dies can be reduced, thereby improving the heat dissipation effect.

Description

Package, chip and electronic device

[0001] This application claims priority to the Chinese patent application with application number 202310827009.9 filed with the State Intellectual Property Office of China on July 6, 2023, and priority to the Chinese patent application with the invention name “A package, chip and electronic device”, all contents of which are incorporated by reference into this application. Technical Field

[0002] Embodiments of the present application relate to the field of chips, and more specifically, to a package, a chip, and an electronic device. Background Art

[0003] Currently, multiple dies can be integrated within a single chip, such as in a multi-chip module (MCM) or a 2.5-dimensional (2.5D) package with an interposer. Because each die is a heat source, thermal crosstalk is easily generated between the dies. If a component is packaged in a 3D (3D) format, thermal crosstalk can further exacerbate the thermal issues of the 3D component, adversely affecting it. To facilitate chip thermal management, one existing solution is to install a heat dissipation structure above multiple dies within a chip, allowing them to share the same heat dissipation resources. However, when the power consumption and / or junction temperature specifications of different dies vary significantly, allocating heat dissipation resources to the die with higher power consumption or lower junction temperature specifications can easily result in wasted heat dissipation resources. Another existing solution is to remove the metal protective cover (lid) and thermal interface material (TIM) above the multiple dies within a chip, thereby reducing the package thermal resistance. However, the chip in this solution still needs to contact the heat sink outside the chip through the TIM, resulting in thermal crosstalk between the multiple dies inside the chip and suboptimal heat dissipation.

[0004] Therefore, how to reduce the impact of thermal crosstalk between multiple dies in a chip and thus improve the heat dissipation effect has become an urgent problem to be solved.

[0005] Summary of the Invention

[0006] Embodiments of the present application provide a package, a chip, and an electronic device. The package can reduce the impact of thermal crosstalk between multiple tube cores inside the package through multiple structural components, thereby improving the heat dissipation effect.

[0007] In a first aspect, a package is provided. The package includes: a substrate, and a first tube die, a second tube die, a first structural member, and a second structural member disposed on the substrate, wherein a first dielectric material is disposed between the first tube die and the second tube die; the first structural member is disposed on a side of the first tube die away from the substrate, and the first tube die is located within an orthographic projection area of ​​the first structural member on the substrate surface; the second structural member is disposed on a side of the second tube die away from the substrate, and the second tube die is located within an orthographic projection area of ​​the second structural member on the substrate surface; an air gap is provided between the first structural member and the second structural member.

[0008] In the embodiment of the present application, the first structural member in the package can assist in heat dissipation of the first die, and the second structural member can assist in heat dissipation of the second die. Since the first die and the second die are not directly connected or in direct contact, and the first structural member and the second structural member are not directly connected or in direct contact, thermal isolation between the first die and the second die can be achieved, thereby reducing the impact of thermal crosstalk between the first die and the second die, thereby improving the heat dissipation effect.

[0009] In combination with the first aspect, in certain implementations of the first aspect, the edge of the first structural member includes a first bending portion bent toward the substrate, and the first bending portion is connected to the substrate; and / or, the edge of the second structural member includes a second bending portion bent toward the substrate, and the second bending portion is connected to the substrate.

[0010] In the embodiment of the present application, the first structural member can be connected to the substrate via the first bend of the edge, thereby being fixed to the substrate and preventing it from moving or sliding on the substrate surface. Similarly, the second structural member can be connected to the substrate via the second bend of the edge, thereby being fixed to the substrate and preventing it from moving or sliding on the substrate surface.

[0011] In combination with the first aspect, in certain implementations of the first aspect, the first bending portion and / or the second bending portion is stepped.

[0012] In the embodiments of the present application, the first structural member can be connected to the substrate via a first stepped bend, increasing the contact area at the connection with the substrate, thereby adjusting the stress of the substrate and preventing substrate warpage or deformation. Similarly, the second structural member can be connected to the substrate via a second stepped bend, increasing the contact area at the connection with the substrate, thereby adjusting the stress of the substrate and preventing substrate warpage or deformation.

[0013] In combination with the first aspect, in certain implementations of the first aspect, the first structural member includes a first protruding structure protruding toward the substrate, and the first protruding structure is connected to the substrate; and / or the second structural member includes a second protruding structure protruding toward the substrate, and the second protruding structure is connected to the substrate.

[0014] In the embodiment of the present application, in addition to the first bend, the first structural member may also be connected to the substrate via a first protruding structure, thereby adjusting the stress of the substrate and preventing it from warping or deformation. Similarly, the second structural member may also be connected to the substrate via a second bend and a second protruding structure, thereby achieving the effect of adjusting the stress of the substrate.

[0015] In combination with the first aspect, in certain implementations of the first aspect, the second structural member is provided with an opening, and the first structural member is located in the opening of the second structural member.

[0016] In combination with the first aspect, in some implementations of the first aspect, the package further includes a third die, which is disposed on the substrate and is located within an orthographic projection area of ​​the first structural component or the second structural component on the substrate surface.

[0017] In an embodiment of the present application, tube cores with relatively small differences in performance (such as power consumption and / or junction temperature specifications) can be divided into a group, so that when multiple tube cores are included in a package, the number of structural parts can be reduced, avoiding the inability to provide air gaps between the structural parts due to the large number of structural parts, resulting in the inability to reduce the impact of thermal crosstalk between the tube cores.

[0018] In combination with the first aspect, in some implementations of the first aspect, the package further includes a first heat sink, which is disposed on a side of the first structural member away from the substrate, and a surface of the first heat sink close to the substrate is connected to a surface of the first structural member away from the substrate.

[0019] In the embodiment of the present application, the heat dissipated by the first tube core can be transferred to the first structural member, and the heat dissipated by the first structural member can be transferred to the first heat sink, so that the first heat sink can assist the first tube core in dissipating heat.

[0020] In combination with the first aspect, in certain implementations of the first aspect, the first heat sink is not in contact with the second structural member.

[0021] In the embodiment of the present application, the first heat sink and the second structural member are not in direct contact or direct connection, so that the first heat sink can be used only to assist the first tube core in dissipating heat, thereby avoiding the mutual transfer of heat dissipated by the first tube core and the heat dissipated by the second tube core, thereby reducing the impact of thermal crosstalk between the tube cores.

[0022] In combination with the first aspect, in some implementations of the first aspect, the package further includes a second heat sink, which is arranged on a side of the second structural member away from the substrate, and a surface of the second heat sink close to the substrate is connected to a surface of the second structural member away from the substrate.

[0023] In the embodiment of the present application, the heat dissipated by the second tube core can be transferred to the second structural member, and the heat dissipated by the second structural member can be transferred to the second heat sink, so that the second heat sink can assist the second tube core in dissipating heat.

[0024] In combination with the first aspect, in certain implementations of the first aspect, the second heat sink does not contact the first structural component.

[0025] In the embodiment of the present application, the second heat sink is not in direct contact or direct connection with the first structural member, so that the second heat sink can be used only to assist the second tube core in dissipating heat, thereby avoiding the mutual transfer of heat dissipated by the first tube core and the heat dissipated by the second tube core, thereby reducing the impact of thermal crosstalk between the tube cores.

[0026] In combination with the first aspect, in some implementations of the first aspect, an air gap is provided between the first heat sink and the second heat sink.

[0027] In the embodiment of the present application, the first heat sink and the second heat sink are not in direct contact or directly connected, so that no heat is transferred between the first heat sink and the second heat sink, thereby reducing the impact of thermal crosstalk between the tube cores.

[0028] In combination with the first aspect, in certain implementations of the first aspect, the second heat sink includes a first heat dissipation portion and a second heat dissipation portion, the surface of the first heat dissipation portion close to the substrate is connected to the surface of the second structural member away from the substrate, and the second heat dissipation portion is arranged at an angle to the first heat dissipation portion in a plane parallel to the substrate.

[0029] In the embodiment of the present application, the second heat sink can be provided with a first heat sink portion and a second heat sink portion, thereby increasing the heat dissipation area and improving the heat dissipation effect. Furthermore, by adjusting the angle between the first heat sink portion and the second heat sink portion, the heat dissipation air ducts of the second heat sink and the first heat sink can be decoupled, thereby further improving the heat dissipation effect.

[0030] In combination with the first aspect, in certain implementations of the first aspect, the second radiator forms a first avoidance space, and the first radiator is located in the first avoidance space.

[0031] In the embodiment of the present application, the first radiator can be arranged in the first avoidance space of the second radiator so that the heat dissipation ducts of the two radiators do not affect each other, and the space can be reasonably utilized, thereby reducing the overall volume of the package.

[0032] In combination with the first aspect, in some implementations of the first aspect, the first heat sink includes a protruding portion protruding toward the substrate, and the protruding portion is accommodated in the first avoidance space.

[0033] In combination with the first aspect, in certain implementations of the first aspect, a surface of the protrusion close to the substrate is connected to a surface of the first structure away from the substrate.

[0034] In the embodiment of the present application, the first heat sink can be connected to the first structural member via a protrusion accommodated in the first avoidance space, thereby assisting the first tube core in dissipating heat. The first heat sink can also include other parts besides the protrusion, thereby increasing the heat dissipation area and improving the heat dissipation effect.

[0035] In a second aspect, a chip is provided, comprising the package as described in the first aspect or any possible implementation of the first aspect.

[0036] In a third aspect, an electronic device is provided. The electronic device includes the package described in the first aspect or any possible implementation of the first aspect. Alternatively, the electronic device includes the chip described in the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] FIG1 is a schematic cross-sectional view of a package.

[0038] FIG. 2 is a schematic top view of a package according to an embodiment of the present application.

[0039] FIG3 is a schematic cross-sectional view of a package according to an embodiment of the present application.

[0040] FIG4 is a schematic cross-sectional view of a package according to another embodiment of the present application.

[0041] FIG5 is a schematic top view of a package according to another embodiment of the present application.

[0042] FIG6 is a schematic top view of a package according to another embodiment of the present application.

[0043] FIG7 is a schematic cross-sectional view of a package according to another embodiment of the present application.

[0044] FIG8 is a schematic top view of a package according to another embodiment of the present application.

[0045] FIG9 is a schematic cross-sectional view of a package according to another embodiment of the present application.

[0046] FIG. 10 is a schematic top view of a package according to another embodiment of the present application.

[0047] FIG. 11 is a schematic top view of a package according to another embodiment of the present application.

[0048] FIG12 is a schematic cross-sectional view of a package according to another embodiment of the present application.

[0049] FIG13 is a schematic top view of a package according to another embodiment of the present application.

[0050] FIG14 is a schematic structural diagram of a heat sink according to an embodiment of the present application.

[0051] FIG15 is a schematic structural diagram of a heat sink and a connector according to an embodiment of the present application. DETAILED DESCRIPTION

[0052] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

[0053] In the embodiments of this application, words such as "exemplary" and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" in the embodiments of this application should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of the word "exemplary" is intended to present concepts in a concrete manner.

[0054] The business scenarios described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that, as technology evolves, the technical solutions provided in the embodiments of the present application are equally applicable to similar technical problems.

[0055] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0056] In the embodiments of the present application, "at least one" refers to one or more, and "more" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: including the existence of A alone, the existence of A and B at the same time, and the existence of B alone, where A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, c can be single or multiple.

[0057] The technical solutions in the embodiments of the present application can be applied to a package or chip containing multiple dies. The embodiments of the present application do not limit the type of each die in the multiple dies, and can be, for example, a logic chip, a high bandwidth memory chip (HBM), etc.

[0058] Figure 1 is a schematic diagram of a package. Package 100 in Figure 1 includes a substrate 110, a first die 120, and a second die 130. The first die 120 or the second die 130 may be, for example, a logic chip or an HBM. The first die 120 and the second die 130 are disposed on and connected to the substrate 110. Both the first die 120 and the second die 130 generate heat during operation, resulting in thermal crosstalk between the two dies.

[0059] In FIG. 1 , a direction from the first tube die 120 to the second tube die 130 is a y-axis direction, and a direction from the substrate 110 to the first tube die 120 is a z-axis direction.

[0060] FIG2 is a schematic top view of a package provided in an embodiment of the present application. The package 200 in FIG2 includes a substrate 210, a first die 220, a second die 230, a first structural member 240, and a second structural member 250. The first die 220, the second die 230, the first structural member 240, and the second structural member 250 are all disposed on the substrate 210.

[0061] As shown in FIG2 , the direction from the first tube core 220 to the second tube core 230 is the y-axis direction, and the direction perpendicular to the y-axis direction on the plane where the substrate 210 is located is the x-axis direction. In addition, the direction from the substrate 210 to the first tube core 220 is the z-axis direction (not shown in FIG2 ).

[0062] The embodiment of the present application does not limit the specific type of the substrate 210. For example, the substrate 210 can be a substrate, a printed circuit board (PCB), etc.

[0063] The embodiments of the present application do not limit the specific types of the first die 220 and the second die 230. For example, the first die 220 and / or the second die 230 may be a logic chip or an HBM. The first die 220 and the second die 230 may be of the same type or different types. The package 200 may include multiple first dies and / or multiple second dies.

[0064] A first dielectric material may be filled between the first tube die 220 and the second tube die 230, i.e., the first tube die 220 and the second tube die 230 are not directly connected or in direct contact. This first dielectric material can secure the first tube die 220 and the second tube die 230, preventing them from moving. This first dielectric material can also provide thermal insulation, preventing heat dissipated from the first tube die 220 and the second tube die 230 from transferring to each other. The specific type or composition of this first dielectric material is not limited in this embodiment of the present application.

[0065] In some embodiments, the top surface of the first die 220 and / or the second die 230 may be planar or non-planar. The top surface of the first die 220 is the surface of the first die 220 away from the substrate 210. The top surface of the second die 230 is the surface of the second die 230 away from the substrate 210.

[0066] When the upper surfaces of the first tube core 220 and the second tube core 230 are flat, the height of the upper surface of the first tube core 220 relative to the upper surface of the substrate 210 and the height of the upper surface of the second tube core 230 relative to the upper surface of the substrate 210 can be the same or different, and the embodiments of the present application are not limited to this.

[0067] The first structural member 240 is disposed on a side of the first tube core 220 away from the substrate 210. That is, in the z-axis direction, the substrate 210 is disposed at the bottom layer, the first tube core 220 is disposed on the upper layer of the substrate 210, and the first structural member 240 is disposed on the upper layer of the first tube core 220. The first tube core 220 is located within the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210. The orthographic projection is the projection produced by a parallel projection line perpendicular to the substrate 210, and the orthographic projection area is the area formed by the orthographic projection. In other words, the upper surface of the first tube core 220 can be covered by the orthographic projection of the first structural member 240 toward the substrate 210.

[0068] The first structural member 240 can be used for heat conduction or heat dissipation, and thus can be used to receive heat from the first die 220. The embodiment of the present application does not limit the specific material of the first structural member 210.

[0069] In some embodiments, a first thermally conductive material is filled between the first structure 240 and the first tube core 220. The first thermally conductive material is used to transfer heat emitted by the first tube core 220 to the first structure 240. The embodiment of the present application does not limit the specific type or composition of the first thermally conductive material.

[0070] The second structure 250 is disposed on a side of the second die 230 away from the substrate 210. That is, in the z-axis direction, the substrate 210 is disposed at the bottom layer, the second die 230 is disposed on an upper layer of the substrate 210, and the second structure 250 is disposed on an upper layer of the second die 230. The second die 230 is located within the orthographic projection area of ​​the second structure 250 on the surface of the substrate 210. In other words, the upper surface of the second die 230 can be covered by the orthographic projection of the second structure 250 toward the substrate 210.

[0071] The second structural member 250 can be used for heat conduction or heat dissipation, thereby receiving heat from the second die 230. The present embodiment of the application does not limit the specific material of the second structural member 250. The first structural member 240 and the second structural member 250 can be made of the same or different materials, which is not limited in the present embodiment of the application. The package 200 may include multiple first structural members and / or multiple second structural members, with air gaps provided between each structural member.

[0072] In some embodiments, a second thermally conductive material is filled between the second structural member 250 and the second tube core 230. The second thermally conductive material is used to transfer heat dissipated by the second tube core 230 to the second structural member 250. The specific type or composition of the second thermally conductive material is not limited in this embodiment of the application. The first thermally conductive material and the second thermally conductive material can be the same or different.

[0073] An air gap is provided between the first structural member 240 and the second structural member 250. That is, the first structural member 240 and the second structural member 250 are not directly connected or in direct contact with each other, thereby achieving a heat insulation effect, thereby preventing the heat generated by the first tube die 220 and the second tube die 230 from being transferred to each other, that is, reducing the impact of thermal crosstalk between the first tube die 220 and the second tube die 230.

[0074] In some embodiments, the upper surface of the first structural member 240 and / or the second structural member 250 may be planar or non-planar. The upper surface of the first structural member 240 is the surface of the first structural member 240 away from the substrate 210. The upper surface of the second structural member 250 is the surface of the second structural member 250 away from the substrate 210.

[0075] When the upper surfaces of the first structural member 240 and the second structural member 250 are planes, the height of the upper surface of the first structural member 240 relative to the upper surface of the substrate 210 and the height of the upper surface of the second structural member 250 relative to the upper surface of the substrate 210 may be the same or different, and this embodiment of the present application is not limited to this.

[0076] Optionally, the edge of the first structure 240 may include a first bending portion bent toward the substrate 210 , and the first bending portion is connected to the substrate 210 .

[0077] In some embodiments, the first structure 240 may include at least one first bending portion, and each first bending portion may be bent toward the substrate 210. Each first bending portion may be connected to the substrate 210.

[0078] In some embodiments, a cross-section of the first bent portion along the plane where the x-axis and the z-axis lie can be a straight line, as shown in Figure 3. When a cross-section of the first bent portion along the plane where the x-axis and the z-axis lie is a straight line, the first bent portion can be arranged at an angle with the substrate, which can be an acute angle, a right angle, or an obtuse angle.

[0079] Figure 3 is a schematic cross-sectional view of a package provided by an embodiment of the present application. Figure 3 is a schematic cross-sectional view along the plane where the x-axis and the z-axis are located. Figure 3 includes a substrate 210, a first tube core 220, and a first structural member 240. The first tube core 220 is arranged on the substrate 210, and the first tube core 220 is located in the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210. The two edges of the first structural member 240 each include a first bending portion 241, and each first bending portion 241 is bent toward the substrate 210. The cross-sectional view of each first bending portion 241 along the plane where the x-axis and the z-axis are located is linear, and each first bending portion 241 is arranged at a right angle to the substrate 210. That is, each first bending portion 241 is vertically connected to the substrate 210 in a "one" shape.

[0080] In some embodiments, the cross section of the first bend along the plane where the x-axis and the z-axis lie can be non-linear, including a zigzag shape and a curved shape. A schematic diagram of the cross section of the first bend along the plane where the x-axis and the z-axis lie is a zigzag shape is shown in FIG4 .

[0081] FIG4 is another schematic cross-sectional view of a package provided in an embodiment of the present application. FIG4 is a schematic cross-sectional view taken along a plane containing the x-axis and the z-axis. FIG4 includes a substrate 210, a first tube core 220, and a first structural member 240. The first tube core 220 is disposed on the substrate 210, and the first tube core 220 is located within the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210. The two edges of the first structural member 240 each include a first bend 241, each of which bends toward the substrate 210. Each first bend 241 is stepped, and the bottom of each first bend 241 in the z-axis direction is connected to the substrate 210. Alternatively, each first bend 241 can be L-shaped, with the bottom of the L-shaped portion connected to the substrate 210. That is, the cross-sectional view of each first bend 241 along the plane containing the x-axis and the z-axis is a broken line.

[0082] When the first structural member 240 includes a plurality of first bending portions, each first bending portion may have the same shape. Alternatively, at least two of the plurality of first bending portions may have different shapes, which is not limited in this embodiment of the present application.

[0083] Optionally, the edge of the second structure 250 may include a second bent portion bent toward the substrate 210 , and the second bent portion is connected to the substrate 210 .

[0084] In some embodiments, the second structural member 250 may include at least one second bending portion, and each second bending portion may have the same shape. Alternatively, at least two of the plurality of second bending portions may have different shapes.

[0085] In some embodiments, similar to the first bend, the second bend can be linear or non-linear along the plane where the x-axis and the z-axis lie. For example, the second bend can be similar to the first bend 241 in FIG. 3 or FIG. 4 , and will not be described in detail here.

[0086] When the first structural member 240 includes a first bend and the second structural member 250 includes a second bend, the shapes of the first bend and the second bend may be the same or different. When the first structural member 240 includes a first bend and the second structural member 250 includes a plurality of second bends, the first bend may be the same or different in shape from at least one of the plurality of second bends. Similarly, when the first structural member 240 includes a plurality of first bends and the second structural member 250 includes a second bend, the second bend may be the same or different in shape from at least one of the plurality of first bends. When the first structural member 240 includes a plurality of first bends and the second structural member 250 includes a plurality of second bends, each first bend may be the same or different in shape from at least one of the plurality of second bends.

[0087] Optionally, the first structure 240 may include a first protruding structure protruding toward the substrate 210 , and the first protruding structure is connected to the substrate 210 .

[0088] In some embodiments, the first structure 240 may include at least one first protruding structure, each of which is connected to the substrate 210 .

[0089] In some embodiments, a cross-section of the first protrusion structure along the plane where the x-axis and the z-axis lie can be a straight line, as shown in Figure 4. When a cross-section of the first protrusion structure along the plane where the x-axis and the z-axis lie is a straight line, the first protrusion structure can be disposed at an angle to the substrate, which can be an acute angle, a right angle, or an obtuse angle.

[0090] As shown in FIG4 , the first structural member 240 further includes a first protruding structure 242. The first protruding structure 242 protrudes toward the substrate 210. A cross-section of the first protruding structure 242 along the plane containing the x-axis and the z-axis is linear, and the first protruding structure 242 is disposed at a right angle to the substrate 210. In other words, the first protruding structure 242 is perpendicularly connected to the substrate 210 in a straight line.

[0091] In some embodiments, the cross-section of the first protrusion structure along the plane where the x-axis and the z-axis lie can be non-linear, including a zigzag shape and a curved shape. When the cross-section of the first protrusion structure along the plane where the x-axis and the z-axis lie is a zigzag shape, the structure is similar to that shown in the first bend 241 in FIG. 4 and will not be further described here.

[0092] When the first structural member 240 includes a plurality of first protruding structures, each of the first protruding structures may have the same shape. Alternatively, at least two of the plurality of first protruding structures may have different shapes, which is not limited in this embodiment of the present application.

[0093] Optionally, the second structure 250 may include a second protruding structure protruding toward the substrate 210 , and the second protruding structure is connected to the substrate 210 .

[0094] In some embodiments, the second structural member 250 may include at least one second protruding structure, and each second protruding structure may have the same shape. Alternatively, at least two of the plurality of second protruding structures may have different shapes.

[0095] In some embodiments, similar to the first protrusion structure, the second protrusion structure can be linear or non-linear along the plane where the x-axis and the z-axis lie. For example, the second protrusion structure can be similar to the first protrusion structure 242 or the first bend 241 in FIG. 4 , and further description thereof is omitted.

[0096] When the first structural member 240 includes one first protruding structure and the second structural member 250 includes one second protruding structure, the shapes of the first protruding structure and the second protruding structure may be the same or different. When the first structural member 240 includes one first protruding structure and the second structural member 250 includes multiple second protruding structures, the shape of the first protruding structure may be the same as or different from the shape of at least one of the multiple second protruding structures. Similarly, when the first structural member 240 includes multiple first protruding structures and the second structural member 250 includes one second protruding structure, the shape of the second protruding structure may be the same as or different from the shape of at least one of the multiple first protruding structures. When the first structural member 240 includes multiple first protruding structures and the second structural member 250 includes multiple second protruding structures, each first protruding structure may be the same as or different from the shape of at least one of the multiple second protruding structures.

[0097] Optionally, the orthographic projection areas of the first structural member 240 and the second structural member 250 on the surface of the substrate 210 may partially overlap or not overlap at all. When the orthographic projection areas of the first structural member 240 and the second structural member 250 on the surface of the substrate 210 do not overlap at all, as shown in FIG2 or FIG5 . When the orthographic projection areas of the first structural member 240 and the second structural member 250 on the surface of the substrate 210 partially overlap, as shown in FIG6 .

[0098] In some embodiments, the first structure member 240 and the second structure member 250 may be arranged side by side so that the orthographic projection areas of the first structure member 240 and the second structure member 250 on the surface of the substrate 210 do not overlap at all, as shown in FIG. 2 .

[0099] In some embodiments, the second structural member 250 may be provided with an opening, and the first structural member 240 may be located in the opening of the second structural member 250, so that the orthographic projection areas of the first structural member 240 and the second structural member 250 on the surface of the substrate 210 do not overlap at all or partially overlap, as shown in Figure 5 or Figure 6.

[0100] FIG5 is a schematic top view of a package provided by an embodiment of the present application. FIG5 includes a substrate 210, a first tube core 220, a second tube core 230, a first structural member 240, and a second structural member 250. The orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210 is the first area, and the orthographic projection area of ​​the opening of the second structural member 250 on the surface of the substrate 210 is the second area. The first tube core 220 is located in the first area. The second tube core 230 is located in the orthographic projection area of ​​the second structural member 250 excluding the opening on the surface of the substrate 210. The first area is located in the second area. The length of the first area in the x-axis direction is less than the length of the second area in the x-axis direction, and the length of the first area in the y-axis direction is less than the length of the second area in the y-axis direction. In other words, the area of ​​the first area is less than the area of ​​the second area. That is, the orthographic projection areas of the first structural member 240 and the second structural member 250 on the surface of the substrate 210 do not overlap at all.

[0101] Figure 6 is a schematic top view of a package provided by an embodiment of the present application. Figure 6 includes a substrate 210, a first tube core 220, a second tube core 230, a first structural member 240 and a second structural member 250. Among them, the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210 is the first area, and the orthographic projection area of ​​the opening of the second structural member 250 on the surface of the substrate 210 is the second area. The first tube core 220 is located in the first area. The second tube core 230 is located in the orthographic projection area of ​​the second structural member 250 except the opening on the surface of the substrate 210. A part of the first area is located in the second area, and another part of the first area is located in the second area. The length of the first area in the x-axis direction is greater than or equal to the length of the second area in the x-axis direction, that is, the orthographic projection areas of the first structural member 240 and the second structural member 250 on the surface of the substrate 210 partially overlap.

[0102] For example, when the orthographic projection areas of the first structural member 240 and the second structural member 250 on the surface of the substrate 210 partially overlap, the length of the first region in the x-axis direction may be greater than or equal to the length of the second region in the x-axis direction, as shown in FIG6 . Alternatively, when the orthographic projection areas of the first structural member 240 and the second structural member 250 on the surface of the substrate 210 partially overlap, the length of the first region in the y-axis direction may be greater than or equal to the length of the second region in the y-axis direction. Alternatively, when the orthographic projection areas of the first structural member 240 and the second structural member 250 on the surface of the substrate 210 partially overlap, the area of ​​the first region may be greater than or equal to the area of ​​the second region.

[0103] When the first structural member 240 and the second structural member 250 partially overlap in the orthographic projection area of ​​the surface of the substrate 210, a schematic cross-sectional view of the package is shown in Figure 7. Figure 7 is a schematic cross-sectional view of the package provided in an embodiment of the present application. Figure 7 is a schematic cross-sectional view of the plane along the x-axis and the z-axis. Figure 7 includes a substrate 210, a first tube core 220, a first structural member 240, and a second structural member 250. The first tube core 220 is located in the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210. The edge of the first structural member 240 includes a first bending portion 241, and the first bending portion 241 is stepped. The first bending portion 241 is formed with a second avoidance space 243, and the second avoidance space 243 is located on the side of the first bending portion 241 away from the first tube core 220. The edge portion of the second structural member 250 can be accommodated in the second avoidance space 243. Furthermore, an air gap exists between the edge portion of the second structure member 250 and the first bending portion 241 , that is, the edge portion of the second structure member 250 is not directly connected to or in direct contact with the first bending portion 241 .

[0104] Optionally, the package 200 may further include at least one third die. The third die may be disposed on the substrate 210. The third die is located within the orthographic projection area of ​​the first structural member 240 or the second structural member 250 on the surface of the substrate 210. That is, the first structural member 240 or the second structural member 250 may be provided with at least one die within the orthographic projection area of ​​the surface of the substrate 210. Similar to the first die 220 and the second die 230, the embodiments of the present application do not limit the specific type of the third die. The third die may be of the same or different type as the first die 220 and / or the second die 230.

[0105] When the third tube core is arranged in the orthographic projection area of ​​the second structure 250 on the surface of the substrate 210, the third tube core and the second tube core 230 can be arranged on the same side or different sides of the first tube core 220, which is not limited in the embodiment of the present application.

[0106] For example, the third die can be disposed on a side of the first die 220 away from the second die 230, as shown in FIG6 . FIG6 also includes a third die 260. The third die 260 is disposed within the orthographic projection area of ​​the second structure 250 on the surface of the substrate 210. Furthermore, the first die 220 is disposed between the second die 230 and the third die 260.

[0107] In some embodiments, the specific positions of the first die, the second die, and the third die can be determined based on any one or more properties of the first die, the second die, and the third die, such as power consumption, junction temperature specifications, height, etc. The junction temperature specifications of each die may include the long-term maximum operating temperature specifications, the extreme maximum operating temperature specifications, or the high reliability recommended temperature specifications of each die, etc., which are not limited in the embodiments of the present application. It should be understood that the specific positions of the first die, the second die, and the third die can also be determined based on other properties or other performances of the first die, the second die, and the third die, and the embodiments of the present application do not limit the specific properties or specific performances.

[0108] For example, assuming that the power consumption difference between the third die 260 and the first die 220 is less than a first preset threshold, the third die 260 can be disposed together with the first die 220 within the orthographic projection area of ​​the first structure member 240 on the surface of the substrate 210. Alternatively, assuming that the junction temperature difference between the third die 260 and the first die 220 is less than a second preset threshold, the third die 260 can be disposed together with the first die 220 within the orthographic projection area of ​​the first structure member 240 on the surface of the substrate 210. Alternatively, assuming that the power consumption difference between the third die 260 and the first die 220 is less than the first preset threshold, and the junction temperature difference between the third die 260 and the first die 220 is less than a second preset threshold, the third die 260 can be disposed together with the first die 220 within the orthographic projection area of ​​the first structure member 240 on the surface of the substrate 210. Alternatively, assuming that the heights of the third tube core 260 and the first tube core 220 are both less than the third preset threshold, and the height of the second tube core 230 is greater than or equal to the third preset threshold, the third tube core can be arranged together with the first tube core 220 in the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210. The embodiment of the present application does not limit the specific values ​​of the first preset threshold, the second preset threshold, and the third preset threshold, and can be set according to actual needs. The first preset threshold, the second preset threshold, and the third preset threshold can be the same, or at least two of the first preset threshold, the second preset threshold, and the third preset threshold can be different.

[0109] In some embodiments, the material, volume, thermal conductivity, and other parameters of the structural component corresponding to each die can be adjusted based on any one or more properties of each die, such as power consumption, junction temperature specification, or height, thereby adjusting the heat dissipation resources corresponding to each die as needed, thereby achieving a better heat dissipation effect without wasting heat dissipation resources. For example, the material, volume, thermal conductivity, and other parameters of the first structural component can be adjusted based on any one or more properties of the first die, such as function, junction temperature specification, or height, to achieve a better heat dissipation effect.

[0110] Optionally, the package 200 may further include at least one first heat sink. The first heat sink is disposed on a side of the first structure 240 away from the substrate 210. The surface of the first heat sink close to the substrate 210 is connected to the surface of the first structure 240 away from the substrate 210. The first heat sink can receive heat from the first structure 240, thereby assisting in heat dissipation of the first die 220.

[0111] In some embodiments, the first structural member 240 partially overlaps with the orthographic projection area of ​​the first heat sink on the surface of the substrate 210. The embodiment of the present application does not limit the size relationship between the first heat sink and the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210. For example, the area of ​​the orthographic projection area of ​​the first heat sink on the surface of the substrate 210 can be less than or equal to the area of ​​the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210. Alternatively, the area of ​​the orthographic projection area of ​​the first heat sink on the surface of the substrate 210 can be greater than the area of ​​the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210, as shown in Figure 8.

[0112] FIG8 is a schematic top view of a package provided in an embodiment of the present application. FIG8 includes a substrate 210, a first tube core 220, a first structural member 240, and a first heat sink 270. The first tube core 220 is located within the orthographic projection area of ​​the first structural member 240 on the surface of the substrate 210, and the first structural member 240 is located within the orthographic projection area of ​​the first heat sink 270 on the surface of the substrate 210.

[0113] In some embodiments, the first heat sink 270 and the second structure 250 are not in contact. That is, the first heat sink 270 and the second structure 250 are not in direct or indirect contact, so that the first heat sink 270 does not receive heat from the second die 230, thereby reducing the impact of thermal crosstalk between the first die 220 and the second die 230.

[0114] In some embodiments, the second structural member 250 and the first heat sink 270 partially overlap or completely do not overlap in their orthographic projection areas on the substrate 210 surface. When the second structural member 250 and the first heat sink partially overlap in their orthographic projection areas on the substrate 210 surface, an air gap exists between the adjacent portions of the second structural member 250 and the first heat sink 270. When the second structural member 250 and the first heat sink 270 completely do not overlap in their orthographic projection areas on the substrate 210 surface, as shown in FIG8 .

[0115] As shown in FIG8 , FIG8 also includes a second tube core 230 and a second structural member 250. The second tube core 230 is located in the orthographic projection area of ​​the second structural member 250 on the surface of the substrate 210. The second structural member 250 and the first structural member 240 are arranged side by side, and an air gap is provided in the portion where the second structural member 250 and the first structural member 240 are close to each other, so that the orthographic projection areas of the second structural member 250 and the first heat sink 270 on the surface of the substrate 210 do not overlap at all.

[0116] In some embodiments, the first heat sink 270 is directly connected to the first structural member 240. Alternatively, the first heat sink 270 is connected to the first structural member 240 via a third thermally conductive material, as shown in FIG9 .

[0117] Figure 9 is a schematic cross-sectional view of a package provided in an embodiment of the present application. Figure 9 is a schematic cross-sectional view taken along the planes containing the x-axis and the z-axis. Figure 9 includes a substrate 210, a first die 220, a first structural member 240, a third thermally conductive material, and a first heat sink 270. In the z-axis direction, the substrate 210 is located at the bottom layer, the first die 220 and the first structural member 240 are located above the substrate 210, and the first die 220 is located within the orthographic projection of the first structural member 240 on the surface of the substrate 210. The third thermally conductive material is located above the first structural member 240 and can connect the first structural member 240 and the first heat sink 270. That is, the first heat sink 270 is located above the third thermally conductive material. The third thermally conductive material can be used to transfer heat from the first structural member 240 to the first heat sink 270, thereby helping to dissipate heat from the first die 220. The embodiments of the present application do not limit the specific type or composition of the third thermally conductive material.

[0118] Optionally, the package 200 may further include at least one second heat sink. The second heat sink is disposed on a side of the second structural member 250 away from the substrate 210. The surface of the second heat sink close to the substrate 210 is connected to the surface of the second structural member 250 away from the substrate 210. The second heat sink can receive heat from the second structural member 250, thereby assisting in dissipating heat from the second die 230.

[0119] In some embodiments, the second structural member 250 partially overlaps with the orthographic projection area of ​​the second heat sink on the surface of the substrate 210. The embodiment of the present application does not limit the size relationship between the second heat sink and the orthographic projection area of ​​the second structural member 250 on the surface of the substrate 210. For example, the orthographic projection area of ​​the second heat sink on the surface of the substrate 210 can be less than or equal to the orthographic projection area of ​​the second structural member 250 on the surface of the substrate 210. Alternatively, the orthographic projection area of ​​the second heat sink on the surface of the substrate 210 can be greater than the orthographic projection area of ​​the second structural member 250 on the surface of the substrate 210, as shown in Figure 8.

[0120] 8 also includes a second heat sink 280 . The second die 230 in FIG8 is located in the orthographic projection area of ​​the second structure 250 on the surface of the substrate 210 , and the second structure 250 is located in the orthographic projection area of ​​the second heat sink 280 on the surface of the substrate 210 .

[0121] In some embodiments, the second heat sink 280 is not in contact with the first structure 240. That is, the second heat sink 280 is not in direct or indirect contact with the first structure 240, so that the second heat sink 280 does not receive heat from the first die 220, thereby reducing the impact of thermal crosstalk between the first die 220 and the second die 230.

[0122] In some embodiments, the first structural member 240 and the second heat sink 280 partially overlap or completely do not overlap in their orthographic projection areas on the surface of the substrate 210. When the first structural member 240 and the second heat sink 280 partially overlap in their orthographic projection areas on the surface of the substrate 210, an air gap exists between the first structural member 240 and the second heat sink 280. FIG8 shows an example of the first structural member 240 and the second heat sink 280 completely not overlapping in their orthographic projection areas on the surface of the substrate 210. In FIG8 , the second structural member 250 and the first structural member 240 are arranged side by side, and the first structural member 240 and the second heat sink 280 completely do not overlap in their orthographic projection areas on the surface of the substrate 210.

[0123] In some embodiments, the second heat sink 280 is directly connected to the second structural member 250. Alternatively, the second heat sink 280 is connected to the second structural member 250 via a fourth thermally conductive material. The method of connecting the second heat sink 280 and the second structural member 250 via the fourth thermally conductive material is similar to the method shown in Figure 9 and will not be repeated here. The fourth thermally conductive material can be used to transfer heat from the second structural member 250 to the second heat sink 280, thereby helping to dissipate heat from the second tube core 230. The embodiments of the present application do not limit the specific type or composition of the fourth thermally conductive material.

[0124] It should be understood that the first, second, third, and fourth thermally conductive materials may be the same thermally conductive material. Alternatively, at least two of the first, second, third, and fourth thermally conductive materials may be different thermally conductive materials, which is not limited in this embodiment of the present application.

[0125] In some embodiments, an air gap is provided between the first heat sink 270 and the second heat sink 280. That is, the first heat sink 270 and the second heat sink 280 are not in direct contact or connection, so that the first heat sink 270 does not receive heat from the second heat sink 280, thereby reducing the impact of thermal crosstalk between the first die 220 and the second die 230.

[0126] In some embodiments, the orthographic projection areas of the first heat sink 270 and the second heat sink 280 on the surface of the substrate 210 partially overlap or do not overlap at all. For example, a schematic diagram showing that the orthographic projection areas of the first heat sink 270 and the second heat sink 280 on the surface of the substrate 210 do not overlap at all is shown in FIG8 or FIG10. A schematic diagram showing that the orthographic projection areas of the first heat sink 270 and the second heat sink 280 on the surface of the substrate 210 partially overlap is shown in FIG11, FIG12, or FIG13.

[0127] In FIG8 , the first heat sink 270 and the second heat sink 280 are arranged side by side, and an air gap is provided in the portion where the first heat sink 270 and the second heat sink 280 are close to each other, so that the orthographic projection areas of the first heat sink 270 and the second heat sink 280 on the surface of the substrate 210 do not overlap at all.

[0128] In some embodiments, the second heat sink may form a first avoidance space, and the first heat sink may be located in the first avoidance space. For example, the entire structure of the first heat sink may be located in the first avoidance space, such that the orthographic projection areas of the first heat sink and the second heat sink on the substrate surface do not overlap at all, as shown in FIG10 . Alternatively, a portion of the structure of the first heat sink may be located in the first avoidance space, and another portion of the structure of the first heat sink may be located on the side of the second heat sink away from the substrate, such that the orthographic projection areas of the first heat sink and the second heat sink on the substrate surface partially overlap, as shown in FIG11 .

[0129] When the second heat sink can form the first avoidance space, the second heat sink can include a first heat sink portion and a second heat sink portion. The surface of the first heat sink portion close to the substrate is connected to the surface of the second structural member away from the substrate, and the second heat sink portion is arranged at an angle to the first heat sink portion in a plane parallel to the substrate, as shown in Figures 10, 11, and 13. This angle can be acute, right, or obtuse.

[0130] Figure 10 is a schematic top view of a package provided by an embodiment of the present application. Figure 10 includes a substrate 210, a first die 220, a second die 230, a first structural member 240, a second structural member 250, a first heat sink 270, and a second heat sink 280. The second heat sink 280 can form a first escape space. Specifically, the second heat sink 280 can include a first heat dissipation portion and a second heat dissipation portion, which are arranged at an angle to form the first escape space. The first heat dissipation portion is connected to the second structural member 250, that is, the surface of the first heat dissipation portion closest to the substrate 210 is connected to the surface of the second structural member 250 away from the substrate 210. The entire structure of the first heat sink 270 is located within the first escape space, and the first heat sink 270 is connected to the first structural member 240. An air gap is provided between the first and second heat sinks 270, 280, so that the orthographic projections of the first and second heat sinks 270, 280 on the substrate 210 surface do not overlap.

[0131] In some embodiments, the second heat dissipation portion of the second heat sink 280 may or may not be connected to the second structure 250. That is, the surface of the second heat dissipation portion close to the substrate 210 and the surface of the second structure 250 away from the substrate 210 may or may not be connected.

[0132] When the second heat sink can form the first escape space, the first heat sink 270 can include a protrusion protruding toward the base plate 210. The protrusion can be accommodated in the first escape space, as shown in Figures 11, 12, and 13.

[0133] Figure 11 is a schematic top view of a package provided in an embodiment of the present application. Figure 11 includes a substrate 210, a first tube die 220, a second tube die 230, a first structural member 240, a second structural member 250, a first heat sink 270, and a second heat sink 280. A schematic cross-sectional view of the package in Figure 11 is shown in Figure 12, which is a schematic cross-sectional view taken along the plane containing the y-axis and the z-axis. In other words, the packages in Figures 11 and 12 are identical.

[0134] As shown in Figures 11 and 12, the second heat sink 280 may include a first heat sink portion and a second heat sink portion, which are arranged at an angle to form a first clearance space. The first heat sink portion is connected to the second structural member 250, namely, the surface of the first heat sink portion proximal to the substrate 210 is connected to the surface of the second structural member 250 distal to the substrate 210. The first heat sink 270 includes a raised portion protruding toward the substrate 210 and accommodated in the first clearance space. The raised portion may be connected to the first structural member 240, namely, the surface of the raised portion proximal to the substrate 210 is connected to the surface of the first structural member 240 distal to the substrate 210. An air gap is provided between the first heat sink 270 and the second heat sink 280. As can also be seen from Figures 11 and 12, the orthographic projection area of ​​the first heat sink 270 on the substrate 210 surface partially overlaps with the orthographic projection area of ​​the first heat sink portion of the second heat sink 280 on the substrate 210 surface. The orthographic projection area of ​​the first heat sink 270 on the surface of the substrate 210 and the orthographic projection area of ​​the second heat dissipating portion of the second heat sink 280 on the surface of the substrate 210 do not overlap at all.

[0135] When the second heat sink can form a first avoidance space, the second heat sink can include at least one first heat dissipation portion and at least one second heat dissipation portion, so that the second heat sink can form at least one first avoidance space. Schematic diagrams of a second heat sink including one first heat dissipation portion, one second heat dissipation portion, and one first avoidance space are shown in Figures 11 and 12. Schematic diagrams of a second heat sink including multiple first heat dissipation portions, multiple second heat dissipation portions, and multiple first avoidance spaces are shown in Figures 13 and 14.

[0136] FIG13 is a schematic top view of a package provided in an embodiment of the present application. FIG13 includes a substrate 210, a first tube core 220, a second tube core 230, a first structural member 240, a second structural member 250, a third tube core 260, a first heat sink 270, and a second heat sink 280. The second heat sink 280 includes a first heat dissipation portion 281, a first heat dissipation portion 282, a second heat dissipation portion 283, and a second heat dissipation portion 284, so that the second heat sink 280 can form a first avoidance space 285, a first avoidance space 286, and a first avoidance space 287. The first heat dissipation portion 281 and the first heat dissipation portion 282 are arranged side by side, and the second heat dissipation portion 283 and the second heat dissipation portion 284 are arranged side by side, and the two opposite sides of each first heat dissipation portion are respectively connected to a second heat dissipation portion. The first avoidance space 285, the first avoidance space 286, and the first avoidance space 287 are located between the second heat dissipation portion 283 and the second heat dissipation portion 284. Furthermore, the first escape space 285 is located on a side of the first heat dissipation portion 281 away from the first heat dissipation portion 282, the first escape space 286 is located between the first heat dissipation portion 281 and the first heat dissipation portion 282, and the first escape space 287 is located on a side of the first heat dissipation portion 282 away from the first heat dissipation portion 281. The first heat sink 270 may include a protrusion protruding toward the substrate 210, which is accommodated in the first escape space 286 and connected to the first structural member 240. Alternatively, the first heat sink may include three protrusions protruding toward the substrate 210, which are respectively accommodated in the first escape space 285, the first escape space 286, and the first escape space 287, with the protrusion accommodated in the first escape space 286 being connected to the first structural member 240. As can also be seen from FIG13 , the orthographic projection area of ​​the first heat sink 270 on the surface of the substrate 210 partially overlaps with the orthographic projection areas of the first heat dissipation portion 281 and the first heat dissipation portion 282 on the surface of the substrate 210. The orthographic projection area of ​​the first heat sink 270 on the surface of the substrate 210 does not overlap with the orthographic projection areas of the second heat dissipation portion 283 and the second heat dissipation portion 284 on the surface of the substrate 210.

[0137] Exemplarily, a three-dimensional schematic diagram of the first radiator 270 and the second radiator 280 is shown in Figure 14. Figure 14 is a structural schematic diagram of the radiator provided in an embodiment of the present application. (a) in Figure 14 is a structural schematic diagram of the first radiator 270. The first radiator 270 includes three protrusions protruding toward the substrate 210. (b) in Figure 14 is a structural schematic diagram of the second radiator 280, and the second radiator 280 includes two first heat dissipation parts and two second heat dissipation parts, thereby forming three first avoidance spaces. (c) in Figure 14 is a schematic diagram of the upper surface of the structure after the first radiator 270 and the second radiator 280 are combined (i.e., the radiator combination), and there is an air gap between the first radiator 270 and the second radiator 280. The upper surface of the radiator combination is the surface away from the substrate 210. (d) in Figure 14 is a schematic diagram of the lower surface of the radiator combination, and the lower surface of the radiator combination is the surface close to the substrate 210. The first radiator 270 in FIG. 14 has a similar structure to the first radiator 270 in FIG. 13 , and the second radiator 280 in FIG. 14 has a similar structure to the second radiator 280 in FIG. 13 , which will not be described in detail here.

[0138] Optionally, the first heat sink 270 can be connected to the second structural member 250 via a first connector, thereby being fixed to a side of the second structural member 250 away from the substrate 210. Alternatively, the first heat sink 270 can be connected to the second heat sink 280 via a first connector, thereby being fixed to a side of the second heat sink 280 away from the substrate 210. Alternatively, the first heat sink 270 can be connected to the substrate 210 via a first connector, thereby being fixed to the substrate 210.

[0139] Optionally, the second heat sink 280 may be connected to the substrate 210 via a second connecting member, thereby being fixed on the substrate 210 .

[0140] The embodiments of the present application do not limit the specific types of the first and second connectors. For example, the first and / or second connectors may be screws, screws with springs, etc. The first and second connectors may be the same or different, and the embodiments of the present application do not limit this.

[0141] When the first and second connecting members are spring-loaded screws, the bottom of the screws may be springs. The screws may be made of a low-thermal-conductivity material, such as hard plastic. Since the spring-loaded screws have poor thermal conductivity, heat transfer between two structures (e.g., the first heat sink and the second structural member, or the first heat sink and the second heat sink) through the spring-loaded screws can be reduced, thereby providing thermal insulation.

[0142] Figure 15 is a schematic diagram of the structure of a heat sink and connectors provided in an embodiment of the present application. The first heat sink 270 in Figure 15 can be fastened to the second structural member 250, the second heat sink 280, or the substrate 210 via four first connectors. The second heat sink 280 in Figure 15 can be fastened to the substrate 210 via four second connectors.

[0143] In some embodiments, the upper surface of the first heat sink 270 and / or the second heat sink 280 may be planar or non-planar. The upper surface of the first heat sink 270 is the surface of the first heat sink 270 away from the substrate 210. The upper surface of the second heat sink 280 is the surface of the second heat sink 280 away from the substrate 210.

[0144] When the upper surfaces of the first heat sink 270 and the second heat sink 280 are plane, the height of the upper surface of the first heat sink 270 relative to the upper surface of the substrate 210 and the height of the upper surface of the second heat sink 280 relative to the upper surface of the substrate 210 may be the same or different, and the embodiments of the present application are not limited to this.

[0145] Optionally, when the power consumption of the first tube core 220 is less than the fourth preset threshold, the first structural member 240 may be a heat sink. When the first structural member 240 is a heat sink, the first heat sink 270 may not be included in the package. Similarly, when the power consumption of the second tube core 230 is less than the fifth preset threshold, the second structural member 250 may be a heat sink. When the second structural member 250 is a heat sink, the second heat sink 280 may not be included in the package. The embodiment of the present application does not limit the specific numerical values ​​of the fourth preset threshold and the fifth preset threshold, and they can be set according to actual needs. The fourth preset threshold and the fifth preset threshold may be the same or different.

[0146] By measuring the temperature in the package in the embodiment of the present application and the package that shares the heat dissipation resource, the temperature data shown in Table 1 can be obtained.

[0147] Table 1 Temperature data table

[0148] In Table 1, package 1 is a package in which multiple tube cores share the same heat dissipation resources, and package 2 is a package in an embodiment of the present application. The long-term maximum operating temperature specification of the first tube core is 105 degrees Celsius (℃), and the long-term maximum operating temperature specification of the second tube core is 95℃. If the temperature of the tube core exceeds the long-term maximum operating temperature specification of the tube core, the tube core is more susceptible to damage. It can be seen from Table 1 that the temperature margin of the first tube core in package 1 is 105-88.19=16.81℃, and the temperature margin of the second tube core is 95-94.85=0.15℃. The temperature margin of the first tube core in the package of the embodiment of the present application is 105-95.11=9.89℃, and the temperature margin of the second tube core is 95-89.79=5.21℃. In other words, although the temperature margin of the first tube core in package 1 is larger, the temperature margin of the second tube core is smaller, which makes the potential over-temperature risk of the second tube core greater and more susceptible to damage. In contrast, the first and second dies in the embodiment of the present application both have a greater temperature margin, resulting in a lower potential risk of overheating and less damage to the first and second dies. In other words, the package in the embodiment of the present application can reduce the impact of thermal crosstalk between the dies and improve heat dissipation.

[0149] The present application also provides a method for preparing a package. The method includes forming a substrate 210, a first die 220, a second die 230, a first structural member 240, and a second structural member 250; and combining the substrate 210, the first die 220, the second die 230, the first structural member 240, and the second structural member 250 to form a package as shown in Figures 2 to 7. Alternatively, the method includes forming a substrate 210; forming the first die 220 and the second die 230 on the substrate 210; and forming the first structural member 240 and the second structural member 250 on a side of the first die 220 and the second die 230 away from the substrate 210.

[0150] In some embodiments, the method further includes forming a first heat sink 270 and / or a second heat sink 280, and combining the first heat sink 270 and / or the second heat sink 280 with the package shown in Figures 2 to 7 to form the package shown in Figures 8 to 13. Alternatively, the method further includes forming the first heat sink 270 on a side of the first structural member 240 away from the substrate 210, and / or forming the second heat sink 280 on a side of the second structural member 250 away from the substrate 210.

[0151] The embodiment of the present application may further provide a chip, which includes a package as shown in FIG. 2 to FIG. 13 .

[0152] The present application may also provide an electronic device. The electronic device includes the package shown in Figures 2 to 13. Alternatively, the electronic device includes the above-mentioned chip.

[0153] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A package, characterized in that: include: A substrate, and a first tube core, a second tube core, a first structure member and a second structure member disposed on the substrate, wherein a first dielectric material is disposed between the first tube core and the second tube core; The first structural member is arranged on a side of the first tube core away from the substrate, and the first tube core is located in an orthographic projection area of ​​the first structural member on the surface of the substrate; The second structure member is arranged on a side of the second tube core away from the substrate, the second tube core is located in the orthographic projection area of ​​the second structure member on the surface of the substrate, and an air gap is provided between the first structure member and the second structure member.

2. The package according to claim 1, characterized in that The edge of the first structural member includes a first bent portion bent toward the substrate, and the first bent portion is connected to the substrate; and / or, The edge of the second structure member includes a second bent portion bent toward the substrate, and the second bent portion is connected to the substrate.

3. The package according to claim 2, characterized in that The first bending portion and / or the second bending portion is in a step shape.

4. The package according to any one of claims 1 to 3, characterized in that: The first structural member includes a first protruding structure protruding toward the substrate, and the first protruding structure is connected to the substrate; and / or, The second structural member includes a second protruding structure protruding toward the substrate, and the second protruding structure is connected to the substrate.

5. The package according to any one of claims 1 to 4, characterized in that: The second structural member is provided with an opening, and the first structural member is located in the opening of the second structural member.

6. The package according to any one of claims 1 to 5, characterized in that: The package also includes a third tube core, which is disposed on the substrate and is located within an orthographic projection area of ​​the first structure member or the second structure member on the surface of the substrate.

7. The package according to any one of claims 1 to 6, characterized in that: The package also includes a first heat sink, which is disposed on a side of the first structure away from the substrate, and a surface of the first heat sink close to the substrate is connected to a surface of the first structure away from the substrate.

8. The package according to claim 7, characterized in that The first heat sink is not in contact with the second structure.

9. The package according to claim 7 or 8, characterized in that: The package also includes a second heat sink, which is disposed on a side of the second structure away from the substrate, and a surface of the second heat sink close to the substrate is connected to a surface of the second structure away from the substrate.

10. The package according to claim 9, characterized in that The second heat sink does not contact the first structure.

11. The package according to claim 9 or 10, characterized in that: An air gap is provided between the first heat sink and the second heat sink.

12. The package according to any one of claims 9 to 11, characterized in that The second heat sink includes a first heat dissipation part and a second heat dissipation part. The surface of the first heat dissipation part close to the substrate is connected to the surface of the second structure away from the substrate. The second heat dissipation part is arranged at an angle with the first heat dissipation part in a plane parallel to the substrate.

13. The package according to any one of claims 9 to 12, characterized in that The second radiator forms a first avoidance space, and the first radiator is located in the first avoidance space.

14. The package according to claim 13, characterized in that The first heat sink includes a protruding portion protruding toward the substrate, and the protruding portion is accommodated in the first avoidance space.

15. The package according to claim 14, characterized in that A surface of the protrusion close to the substrate is connected to a surface of the first structure member away from the substrate.

16. A chip, characterized in that: Comprising the package as claimed in any one of claims 1 to 15.

17. An electronic device, characterized in that: A package comprising any one of claims 1 to 15, or a chip comprising the chip according to claim 16.

Images