Three-terminal multilayer ceramic capacitor

Abstract

Provided is a three-terminal multilayer ceramic capacitor capable of improving moisture resistance reliability. In this three-terminal multilayer ceramic capacitor 10: a first internal electrode layer 16a has a first facing electrode part 26a, and first and second extracting electrode parts 28a1, 28a2 extending from the first facing electrode part 26a to a first end surface 12e and a second end surface 12f, respectively; and a second internal electrode layer 16b has a second facing electrode part 26b facing the first facing electrode part 26a, and third and fourth extracting electrode parts 28b1, 28b2 extending from the second facing electrode part 26b to a first side surface 12c and a second side surface 12d, respectively, and where thicknesses tb1, tb2 of the third and fourth extracting electrode parts 28b1, 28b2 in the height direction x > thicknesses ta1, ta2 of the first and second extracting electrode parts 28a1, 28a2 in the height direction x ≥ at least one among thicknesses t1, t2 of the first and second facing electrode parts 26a, 26b in the height direction.

Description

3-terminal multilayer ceramic capacitor

[0001] The present invention relates to a three-terminal multilayer ceramic capacitor.

[0002] Patent Document 1 discloses a multilayer feedthrough ceramic capacitor having a typical structure, i.e., a three-terminal multilayer ceramic capacitor. This three-terminal multilayer ceramic capacitor includes a laminate and external electrodes arranged on the outer surfaces of the laminate. The laminate includes inner layer portions and outer layer portions sandwiching the inner layer portion in the stacking direction. Multiple internal electrode layers are arranged alternately in the inner layer portions, sandwiching multiple ceramic layers, and connected to the external electrodes. More specifically, the laminate has an outer surface including first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other. The internal electrode layers include multiple first internal electrode layers and multiple second internal electrode layers. The multiple first internal electrode layers and multiple second internal electrode layers are alternately stacked in a predetermined stacking direction, sandwiching multiple ceramic layers between them. The first internal electrode layers are exposed at the first and second end surfaces, and the second internal electrode layers are exposed at the first and second side surfaces. The first internal electrode layer is connected to the first and second external electrodes at the first and second end faces, respectively. The second internal electrode layer is connected to the third and fourth external electrodes at the first and second side faces, respectively. In Patent Document 1, the thickness of the lead-out regions exposed on the first and second side faces of the second internal electrode layer is made thicker than the thickness of the central portion sandwiched between the lead-out regions. This improves the connectivity between the second internal electrode layer and the third and fourth external electrodes.

[0003] Japanese Patent Application Laid-Open No. 2022-39808

[0004] However, it is desirable to further improve the moisture-resistant reliability of three-terminal multilayer ceramic capacitors. Therefore, a primary object of the present invention, which has been made in view of the above-mentioned problems, is to provide a three-terminal multilayer ceramic capacitor that can improve the moisture-resistant reliability.

[0005] A three-terminal multilayer ceramic capacitor according to the present invention comprises a laminate having a plurality of laminated ceramic layers, the laminate having first and second main surfaces opposing each other in a height direction, first end faces and second end faces opposing each other in a length direction perpendicular to the height direction, and first and second side faces opposing each other in a width direction perpendicular to the height and length directions; a plurality of first internal electrode layers arranged on the plurality of ceramic layers and drawn out to the first end faces and second end faces; a plurality of second internal electrode layers arranged on the plurality of ceramic layers and drawn out to the first side faces and second side faces; a first external electrode arranged on the first end face and connected to the first internal electrode layer; a second external electrode arranged on the second end face and connected to the first internal electrode layer; and a second external electrode arranged on the first side face and connected to the second internal electrode layer. the first internal electrode layer has a first opposing electrode portion opposing the second internal electrode layer, a first lead electrode portion extending from the first opposing electrode portion to the first end face, and a second lead electrode portion extending from the first opposing electrode portion to the second end face; the second internal electrode layer has a second opposing electrode portion opposing the first opposing electrode portion, a third lead electrode portion extending from the second opposing electrode portion to the first side face, and a fourth lead electrode portion extending from the second opposing electrode portion to the second side face; and the thickness in the height direction of the third lead electrode portion and the fourth lead electrode portion > the thickness in the height direction of the first lead electrode portion and the second lead electrode portion ≥ at least one of the thickness in the height direction of the first opposing electrode portion and the second opposing electrode portion.

[0006] According to the above configuration, the moisture-resistant reliability of a three-terminal multilayer ceramic capacitor can be improved. The inventors discovered a new finding regarding the relationship between the thicknesses of the first and second lead electrode portions, the third and fourth lead electrode portions, and the first and second counter electrode portions: the relationship that adversely affects moisture-resistant reliability, increases the dimensions of the three-terminal multilayer ceramic capacitor, and structural defects is when the thickness of the third and fourth lead electrode portions is less than the thickness of the first and second lead electrode portions and less than the thickness of the first or second counter electrode portion. Based on this new finding, the inventors newly discovered a thickness relationship that satisfies the relationship: the thickness of the third and fourth lead electrode portions > the thickness of the first and second lead electrode portions ≥ the thickness of at least one of the first and second counter electrode portions. In this way, by forming the internal electrode layer after taking into consideration all of the thicknesses of the third and fourth lead electrode portions, the first and second lead electrode portions, and at least one of the thicknesses of the first and second opposing electrode portions and defining the magnitude relationship among them, it has been discovered that it is possible to suppress a decrease in moisture resistance reliability, an increase in the dimensions of the three-terminal multilayer ceramic capacitor, structural defects, etc.

[0007] According to the present invention, it is possible to provide a three-terminal multilayer ceramic capacitor capable of improving the moisture resistance reliability.

[0008] The above and other objects, features, and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments of the present invention, which proceeds with reference to the accompanying drawings.

[0009] 1 is an external perspective view showing an example of a three-terminal multilayer ceramic capacitor according to an embodiment of the present invention; FIG. 2 is a top view showing an example of a three-terminal multilayer ceramic capacitor according to an embodiment of the present invention; FIG. 3 is a front view showing an example of a three-terminal multilayer ceramic capacitor according to an embodiment of the present invention; FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 1; FIG. 5 is a cross-sectional view taken along line VV in FIG. 1; FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 4; FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 4; FIG. 8 is a schematic enlarged view of a portion of FIG. 4; FIG. 9 is a schematic enlarged view of another embodiment of FIG. 4; FIG. 11 is a schematic enlarged view showing a diffusion state of Ni;

[0010] 1. Three-Terminal Multilayer Ceramic Capacitor A three-terminal multilayer ceramic capacitor according to an embodiment of the present invention will now be described.

[0011] FIG. 1 is an external perspective view showing an example of a three-terminal multilayer ceramic capacitor according to an embodiment of the present invention. FIG. 2 is a top view showing an example of a three-terminal multilayer ceramic capacitor according to an embodiment of the present invention. FIG. 3 is a front view showing an example of a three-terminal multilayer ceramic capacitor according to an embodiment of the present invention. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 1. FIG. 5 is a cross-sectional view taken along line V-V in FIG. 1. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 4. FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 4. FIG. 8 is a schematic enlarged view of a portion of FIG. 4. FIG. 9 is a schematic enlarged view of a portion of FIG. 5. FIG. 10 is a schematic enlarged view of another embodiment of FIG. 4. FIG. 11 is a schematic enlarged view showing the diffusion state of Ni.

[0012] As shown in FIG. 1, a three-terminal multilayer ceramic capacitor 10 includes, for example, a laminate 12 having a substantially rectangular parallelepiped shape and external electrodes 30 .

[0013] (1) Laminate The laminate 12 has a plurality of laminated ceramic layers 14 and a plurality of internal electrode layers 16 laminated on the ceramic layers 14. The ceramic layers 14 and the internal electrode layers 16 are laminated in the height direction x.

[0014] The laminate 12 has a first main surface 12a and a second main surface 12b that face each other in the height direction x, a first side surface 12c and a second side surface 12d that face each other in the width direction y that is perpendicular to the height direction x, and a first end surface 12e and a second end surface 12f that face each other in the length direction z that is perpendicular to the height direction x and the width direction y. The laminate 12 has rounded corners and ridges. Note that a corner refers to a portion where three adjacent surfaces of the laminate intersect, and a ridge refers to a portion where two adjacent surfaces of the laminate intersect. Furthermore, unevenness may be formed on some or all of the first main surface 12a and the second main surface 12b, the first side surface 12c and the second side surface 12d, and the first end surface 12e and the second end surface 12f. Note that the dimension L of the laminate 12 in the length direction z is not necessarily longer than the dimension W in the width direction y.

[0015] The laminate 12 has an inner layer portion 18, and a first outer layer portion 20a and a second outer layer portion 20b arranged to sandwich the inner layer portion 18 in the stacking direction.

[0016] The inner layer portion 18 includes a plurality of ceramic layers 14 and a plurality of internal electrode layers 16. The inner layer portion 18 includes the internal electrode layer 16 located closest to the first main surface 12a in the stacking direction to the internal electrode layer 16 located closest to the second main surface 12b. The internal electrode layers 16 have first internal electrode layers 16a extending to the first end face 12e and the second end face 12f and second internal electrode layers 16b extending to the first side face 12c and the second side face 12d, and in the inner layer portion 18, the plurality of first internal electrode layers 16a and second internal electrode layers 16b face each other with the ceramic layers 14 interposed therebetween. The inner layer portion 18 generates electrostatic capacitance and essentially functions as a capacitor.

[0017] The first main surface side outer layer portion 20a is located on the first main surface 12a side and is formed from a plurality of ceramic layers 14 located between the first main surface 12a and the outermost surface of the inner layer portion 18 on the first main surface 12a side and a straight line on that outermost surface (an extension line from the outermost surface to the first side surface 12c, the second side surface 12d, the first end face 12e, and the second end face 12f). In other words, the first main surface side outer layer portion 20a is an assembly of a plurality of ceramic layers 14 located between the first main surface 12a and the internal electrode layer 16 closest to the first main surface 12a. The ceramic layers 14 used in the first main surface side outer layer portion 20a may be the same as the ceramic layers 14 used in the inner layer portion 18. Similarly, the second main surface side outer layer portion 20b is located on the second main surface 12b side and is formed from a plurality of ceramic layers 14 located between the second main surface 12b and the outermost surface of the inner layer portion 18 on the second main surface 12b side and a straight line on that outermost surface (an extension line from the outermost surface to the first side surface 12c, the second side surface 12d, the first end face 12e, and the second end face 12f). In other words, the second main surface side outer layer portion 20b is an assembly of a plurality of ceramic layers 14 located between the second main surface 12b and the internal electrode layer 16 closest to the second main surface 12b. The ceramic layers 14 used in the second main surface side outer layer portion 20b may be the same as the ceramic layers 14 used in the inner layer portion 18.

[0018] The laminate 12 also has a first side surface side outer layer portion 22a located on the first side surface 12c side and formed from a plurality of ceramic layers 14 located between the first side surface 12c and the outermost surface of the inner layer portion 18 on the first side surface 12c side. Similarly, the laminate 12 has a second side surface side outer layer portion 22b located on the second side surface 12d side and formed from a plurality of ceramic layers 14 located between the second side surface 12d and the outermost surface of the inner layer portion 18 on the second side surface 12d side. The first side surface side outer layer portion 22a and the second side surface side outer layer portion 22b are also referred to as W gaps or side gaps.

[0019] Furthermore, the laminate 12 has a first end face side outer layer portion 24a located on the first end face 12e side and formed from a plurality of ceramic layers 14 located between the first end face 12e and the outermost surface of the inner layer portion 18 on the first end face 12e side. Similarly, the laminate 12 has a second end face side outer layer portion 24b located on the second end face 12f side and formed from a plurality of ceramic layers 14 located between the second end face 12f and the outermost surface of the inner layer portion 18 on the second end face 12f side. The first end face side outer layer portion 24a and the second end face side outer layer portion 24b are also referred to as L gaps or end gaps.

[0020] The dimensions of the laminate 12 are not particularly limited.

[0021] The ceramic layer 14 can be formed, for example, from a dielectric material as the ceramic material. Examples of such dielectric materials include dielectric ceramics containing components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3. When the dielectric material is a primary component, it may contain a secondary component, such as a manganese compound, an iron compound, a chromium compound, a cobalt compound, or a nickel compound, in a smaller amount than the primary component, depending on the desired characteristics of the laminate 12.

[0022] The thickness of the ceramic layers 14 after firing is preferably 0.3 μm or more and 5.0 μm or less. The number of laminated ceramic layers 14 is preferably 75 to 1500. Note that this number of ceramic layers 14 is the total number of ceramic layers 14 in the inner layer portion 18 and the first and second outer layer portions 20 a and 20 b.

[0023] The laminate 12 has a plurality of first internal electrode layers 16a and a plurality of second internal electrode layers 16b as the plurality of internal electrode layers 16. The plurality of first internal electrode layers 16a are arranged on the plurality of ceramic layers 14 and extend to the first end face 12e and the second end face 12f. The plurality of second internal electrode layers 16b are arranged on the plurality of ceramic layers 14 and extend to the first side face 12c and the second side face 12d. The plurality of first internal electrode layers 16a and the plurality of second internal electrode layers 16b may be alternately stacked with the ceramic layers 14 interposed therebetween, or a plurality of ceramic layers 14 each having the first internal electrode layer 16a arranged thereon may be stacked, followed by a ceramic layer 14 each having the second internal electrode layer 16b arranged thereon. In this way, the stacking pattern can be changed depending on the capacitance value to be achieved.

[0024] 6 , the first internal electrode layer 16a includes a first opposing electrode portion 26a facing the second internal electrode layer 16b, a first extraction electrode portion 28a extending from the first opposing electrode portion 26a to the surface of the first end face 12e of the laminate 12, and a second extraction electrode portion 28a extending from the first opposing electrode portion 26a to the surface of the second end face 12f of the laminate 12. Specifically, the first extraction electrode portion 28a is exposed on the surface of the first end face 12e of the laminate 12, and the second extraction electrode portion 28a is exposed on the surface of the second end face 12f of the laminate 12. Therefore, the first internal electrode layer 16a is not exposed on the surfaces of the first side face 12c and the second side face 12d of the laminate 12. The first lead-out electrode portion 28a1 is connected to the first external electrode 30a, and the second lead-out electrode portion 28a2 is connected to the second external electrode 30b.

[0025] The shapes of the first opposing electrode portion 26a and the first and second lead electrode portions 28a1 and 28a2 are not particularly limited, but are preferably rectangular, although the corners may be rounded.

[0026] The length in the width direction y of the first extracted electrode portion 28a1 and the second extracted electrode portion 28a2 may be the same as the length in the width direction y of the first opposing electrode portion 26a, or may be shorter. The shape of the first extracted electrode portion 28a1 and the second extracted electrode portion 28a2 may be tapered.

[0027] 7 , the second internal electrode layer 16b is generally cross-shaped and includes a second opposing electrode portion 26b opposing the first opposing electrode portion 26a, a third leading electrode portion 28b extending from the second opposing electrode portion 26b to the surface of the first side surface 12c of the laminate 12, and a fourth leading electrode portion 28b extending from the second opposing electrode portion 26b to the surface of the second side surface 12d of the laminate 12. Specifically, the third leading electrode portion 28b is exposed on the surface of the first side surface 12c of the laminate 12, and the fourth leading electrode portion 28b is exposed on the surface of the second side surface 12d of the laminate 12. Therefore, the second internal electrode layer 16b is not exposed on the surface of the first end surface 12e or the surface of the second end surface 12f of the laminate 12. The third lead electrode portion 28b1 is connected to the third external electrode 30c, and the fourth lead electrode portion 28b2 is connected to the fourth external electrode 30d.

[0028] The second opposing electrode portion 26b and the third and fourth lead electrode portions 28b1 and 28b2 are preferably rectangular in shape, although the corners may be rounded.

[0029] It is preferable that the relationship between the dimension A in the longitudinal direction z connecting the side of the second opposing electrode portion 26b on the first end face 12e side and the side on the second end face 12f side and the dimension B in the longitudinal direction z connecting the side of the third extraction electrode portion 28b1 and the fourth extraction electrode portion 28b2 on the first end face 12e side and the side on the second end face 12f side satisfies A≧B.

[0030] The third extraction electrode portion 28b1 may have a tapered shape in which the width narrows toward the first side surface 12c, and the fourth extraction electrode portion 28b2 may have a tapered shape in which the width narrows toward the second side surface 12d.

[0031] Here, the thickness tb1 in the height direction x of the third extracted electrode portion 28b1 and the thickness tb2 in the height direction x of the fourth extracted electrode portion 28b2 are in the following thickness relationship: the thickness ta1 in the height direction x of the first extracted electrode portion 28a1 and the thickness ta2 in the height direction x of the second extracted electrode portion 28a2 are in the height direction x > at least one of the thickness t1 in the height direction x of the first opposing electrode portion 26a and the thickness t2 in the height direction x of the second opposing electrode portion 26b. At least one of the thicknesses t1 and t2 may be only the thickness t1, only the thickness t2, or both the thicknesses t1 and t2.

[0032] As shown in FIG. 8, the thickness ta1 is determined from a starting point Pa where the thickness of the first opposing electrode portion 26a starts to increase in the longitudinal direction z. 13 from the end point Pa exposed on the first end surface 12e 11 The thickness ta2 is the thickness at any point up to the first end surface 12e (which is also the position of the first end surface 12e). The thickness ta2 is the thickness at the starting point Pa where the thickness starts to increase relative to the first opposing electrode portion 26a in the longitudinal direction z. 23 from the end point Pa exposed on the second end surface 12f 21 9, the thickness tb1 is the thickness at any point up to the second end surface 12f (which is also the position of the second end surface 12f). As shown in FIG. 9, the thickness tb1 is the thickness at a starting point Pb 13 to the end point Pb exposed on the first side surface 12c 11 The thickness tb2 is the thickness at any point up to the starting point Pb where the thickness starts to increase relative to the second opposing electrode portion 26b in the width direction y (which is also the position of the first side surface 12c). 23 to the end point Pb exposed on the second side surface 12d 21The thicknesses ta1 and ta2 are, but are not limited to, the thickness at a position W / 2 on the LT cross section, where W is the dimension of the three-terminal multilayer ceramic capacitor 10 in the width direction y. The thicknesses t1, t2, tb1, and tb2 are, but are not limited to, the thickness at a position L / 2 on the WT cross section, where L is the dimension of the three-terminal multilayer ceramic capacitor 10 in the length direction z.

[0033] The thickness ta1 of the first extracted electrode portion 28a1 and the thickness ta2 of the second extracted electrode portion 28a2 are preferably 1.0 to 1.3 times the thickness t1 of the first opposing electrode portion 26a. It can also be said that the thickness ta1 of the first extracted electrode portion 28a1 and the thickness ta2 of the second extracted electrode portion 28a2 are preferably 1.0 to 1.3 times the thickness t1 of the first opposing electrode portion 26a and the thickness t2 of the second opposing electrode portion 26b. Furthermore, the thickness tb1 of the third extracted electrode portion 28b1 and the thickness tb2 of the fourth extracted electrode portion 28b2 are preferably 1.3 to 1.7 times the thickness t2 of the second opposing electrode portion 26b. It can also be said that it is preferable that the thickness tb1 of the third extraction electrode portion 28b1 and the thickness tb2 of the fourth extraction electrode portion 28b2 be 1.3 to 1.7 times the thickness of at least one of the thickness t1 of the first opposing electrode portion 26a and the thickness t2 of the second opposing electrode portion 26b.

[0034] In this embodiment, the first and second lead electrode portions 28a and 28a have thicknesses that increase toward the first principal surface 12a relative to the first opposing electrode portion 26a. The thicknesses ta and ta increase in a single step relative to the thicknesses t and t, and the upper surfaces of the thicknesses ta and ta are formed along the first and second principal surfaces 12a and 12b. Similarly, the third and fourth lead electrode portions 28b and 28b have thicknesses that increase in a single step relative to the thicknesses t and t, and the upper surfaces of the thicknesses t and t are formed along the first and second principal surfaces 12a and 12b.

[0035] The shapes of the first, second, third, and fourth extracted electrode portions 28a, 28b, 28b are not limited as long as they are thick at least on the surface exposed from the laminate 12, and may be, for example, shapes whose thickness gradually increases toward the end faces 12e, 12f or the side faces 12c, 12d. Specifically, as shown in Fig. 10, the first extracted electrode portion 28a gradually becomes thicker than the first counter electrode portion 26a toward the first end face 12e. Furthermore, the first extraction electrode portion 28a1, the second extraction electrode portion 28a2, the third extraction electrode portion 28b1, and the fourth extraction electrode portion 28b2 are not limited to a shape having a greater thickness on the first main surface 12a side than the first opposing electrode portion 26a and the second opposing electrode portion 26b, but may have a shape having a greater thickness on the second main surface 12b side, or may have a greater thickness toward both the first main surface 12a side and the second main surface 12b side.

[0036] Furthermore, the first lead electrode portion 28a1 only needs to have a large thickness ta1 at least at the first end face 12e, and the distance La1 (end point Pa1) in the length direction z of the part of the thickness ta1 of the first lead electrode portion 28a1 11 From the starting point Pa 13 For example, the distance La1 is the distance Lg1 of the L gap (the distance to the end point Pa 11 from the point Pa at the end of the second internal electrode layer 16b on the first end face 12e side 12 The distance La1 may be equal to the distance Lg1 of the L gap. Alternatively, the distance La1 may be smaller than the distance Lg1 of the L gap. In this case, the portion of the first lead electrode portion 28a1 with the thickness ta1 does not overlap the second opposing electrode portion 26b, which prevents the dimension of the three-terminal multilayer ceramic capacitor 10 in the height direction x from increasing. Alternatively, the portion of the thickness ta1 may extend toward the second end face 12f up to the position where it overlaps the second opposing electrode portion 26b.

[0037] Similarly, the second extraction electrode portion 28a2 only needs to have a large thickness ta2 at least at the second end surface 12f, and the distance La2 (end point Pa2) in the length direction z of the part of the thickness ta2 of the second extraction electrode portion 28a2 21 From the starting point Pa 23For example, the distance La2 is the distance Lg2 of the L gap (the distance to the end point Pa 21 from the point Pa at the end of the second internal electrode layer 16b on the second end face 12f side 22 The distance La2 may be equal to the distance Lg2 of the L gap. Alternatively, for example, the distance La2 may be smaller than the distance Lg2 of the L gap. In this case, the portion of the second extraction electrode portion 28a2 with the thickness ta2 does not overlap the second opposing electrode portion 26b, which prevents the dimension of the three-terminal multilayer ceramic capacitor 10 in the height direction x from increasing. Alternatively, the portion of the thickness ta2 may extend toward the first end face 12e to a position where it overlaps the second opposing electrode portion 26b.

[0038] The third extraction electrode portion 28b1 only needs to have a large thickness tb1 at least on the first side surface 12c, and the distance Lb1 (from the end point Pb 11 From the starting point Pb 13 For example, the distance Lb1 is the distance Wg1 of the W gap (the distance to the end point Pb 11 to point Pb at the end of the first internal electrode layer 16a on the first side surface 12c side 12 The distance Wg1 may be equal to the distance Wg1 (the distance to the first opposing electrode portion 26a). Alternatively, for example, the distance Wg1 may be smaller than the distance Wg1 of the W gap. In this case, the portion of the third extraction electrode portion 28b1 with the thickness tb1 does not overlap the first opposing electrode portion 26a, so that the dimension of the three-terminal multilayer ceramic capacitor 10 in the height direction x can be prevented from increasing. Alternatively, the portion of the thickness tb1 may extend toward the second side surface 12d up to the position where it overlaps the first opposing electrode portion 26a.

[0039] Similarly, the fourth extraction electrode portion 28b2 only needs to have a large thickness tb2 at least on the second side surface 12d, and the distance Lb2 (from the end point Pb 21 From the starting point Pb 23 For example, the distance Lb2 is the distance Wg2 of the W gap (the distance to the end point Pb 11 to the point Pb at the end of the first internal electrode layer 16a on the second side surface 12d side 22The distance Lb2 may be equal to the distance Wg2 of the W gap. Alternatively, for example, the distance Lb2 may be smaller than the distance Wg2 of the W gap. In this case, the portion of the fourth extraction electrode portion 28b2 with the thickness tb2 does not overlap the first opposing electrode portion 26a, thereby preventing the dimension of the three-terminal multilayer ceramic capacitor 10 in the height direction x from increasing. Alternatively, the portion of the fourth extraction electrode portion 28b2 with the thickness tb2 may extend toward the first side surface 12c to a position where it overlaps the first opposing electrode portion 26a.

[0040] As long as the above thickness relationship is satisfied, the thickness ta1 of the first extracted electrode portion 28a1 and the thickness ta2 of the second extracted electrode portion 28a2 do not necessarily have to be the same. Similarly, the thickness tb1 of the third extracted electrode portion 28b1 and the thickness tb2 of the fourth extracted electrode portion 28b2 do not necessarily have to be the same. Similarly, the thickness t1 of the first opposing electrode portion 26a and the thickness t2 of the second opposing electrode portion 26b do not necessarily have to be the same.

[0041] The first lead electrode portion 28a is connected to the first external electrode 30a, and Ni in the first lead electrode portion 28a and Cu in the first external electrode 30a are interdiffused with each other. That is, Ni contained in the first lead electrode portion 28a is diffused into the first external electrode 30a, and Cu in the first external electrode 30a is diffused into the first lead electrode portion 28a. Referring to FIG. 11 , the first external electrode 30a is formed from a first base electrode layer 32a and a first plating layer 34a, and Ni contained in the first lead electrode portion 28a is diffused into this first external electrode 30a to form a diffusion region 40. Interdiffusion also occurs between the other lead electrodes 28a, 28b, and 28b and the external electrodes 30a and 30b, forming diffusion regions 40.

[0042] Here, a region where the Ni content relative to the total of the Ni content and the Cu content is 10% or more is defined as the Ni diffusion region 40. In this case, the second Ni diffusion distance in the width direction y of Ni from the third and fourth extraction electrode portions 28b1 and 28b2 to the third and fourth external electrodes 30c and 30d, based on the first and second side faces 12c and 12d of the laminate 12, is preferably 1.05 to 1.4 times the first Ni diffusion distance in the length direction z of Ni from the first and second extraction electrode portions 28a1 and 28a2 to the first and second external electrodes 30a and 30b, based on the first and second end faces 12e and 12f of the laminate 12.

[0043] The laminate 12 has a counter electrode region 27. The counter electrode region 27 is a portion where the first counter electrode portion 26a of the first internal electrode layer 16a and the second counter electrode portion 26b of the second internal electrode layer 16b face each other. The counter electrode region 27 is configured as a part of the inner layer portion 18. The counter electrode region 27 is also called a capacitor effective portion.

[0044] The first internal electrode layer 16a and the second internal electrode layer 16b can be made of an appropriate conductive material, for example, a metal such as Cu, Ag, Pd, or Au, mainly composed of Ni, or an alloy containing at least one of these metals, such as an Ag-Pd alloy.

[0045] The number of the first internal electrode layers 16a and the second internal electrode layers 16b is not particularly limited, but is preferably, for example, about 10 to 2000 in total.

[0046] The thickness of the first internal electrode layer 16a is not particularly limited, but is preferably, for example, about 0.30 μm or more and 1.0 μm or less. The thickness of the second internal electrode layer 16b is not particularly limited, but is preferably, for example, about 0.30 μm or more and 1.0 μm or less.

[0047] (2) External Electrodes External electrodes 30 are arranged on the first end face 12e side and the second end face 12f side, the first side face 12c side and the second side face 12d side, and the first main face 12a and the second main face 12b of the laminate 12.

[0048] The external electrodes 30 include a first external electrode 30a, a second external electrode 30b, a third external electrode 30c, and a fourth external electrode 30d.

[0049] The first external electrode 30a is connected to the first internal electrode layer 16a and is arranged on the surface of the first end face 12e. In this embodiment, the first external electrode 30a extends from the first end face 12e of the laminate 12 and is arranged on part of the first main surface 12a, part of the second main surface 12b, and part of the first side surface 12c, part of the second side surface 12d. In this case, the first external electrode 30a is electrically connected to the first extraction electrode portion 28a1 of the first internal electrode layer 16a. The first external electrode 30a may be arranged only on the surface of the first end face 12e.

[0050] The second external electrode 30b is connected to the first internal electrode layer 16a and is disposed on the surface of the second end face 12f. In this embodiment, the second external electrode 30b extends from the second end face 12f of the laminate 12 and is disposed on part of the first main surface 12a and part of the second main surface 12b, as well as part of the first side surface 12c and part of the second side surface 12d. In this case, the second external electrode 30b is electrically connected to the second extraction electrode portion 28a2 of the first internal electrode layer 16a. The second external electrode 30b may be disposed only on the surface of the second end face 12f.

[0051] The third external electrode 30c is connected to the second internal electrode layer 16b and is arranged on the surface of the first side surface 12c. In this embodiment, the third external electrode 30c extends from the first side surface 12c of the laminate 12 and is arranged on part of the first main surface 12a and part of the second main surface 12b. In this case, the third external electrode 30c is electrically connected to the third extraction electrode portion 28b1 of the second internal electrode layer 16b. The third external electrode 30c may be arranged only on the surface of the first side surface 12c.

[0052] The fourth external electrode 30d is connected to the second internal electrode layer 16b and is arranged on the surface of the second side surface 12d. In this embodiment, the fourth external electrode 30d extends from the second side surface 12d of the laminate 12 and is arranged on part of the first main surface 12a and part of the second main surface 12b. In this case, the fourth external electrode 30d is electrically connected to the fourth extraction electrode portion 28b2 of the second internal electrode layer 16b. The fourth external electrode 30d may be arranged only on the surface of the second side surface 12d.

[0053] In the laminate 12, capacitance is formed by the first opposing electrode portion 26a of the first internal electrode layer 16a and the second opposing electrode portion 26b of the second internal electrode layer 16b facing each other via the ceramic layer 14. Therefore, capacitance can be obtained between the first external electrode 30a and the second external electrode 30b to which the first internal electrode layer 16a is connected, and the third external electrode 30c and the fourth external electrode 30d to which the second internal electrode layer 16b is connected, and the characteristics of a capacitor are exhibited.

[0054] The external electrode 30 includes a base electrode layer 32 containing a metal component and a glass component, and a plating layer 34 disposed on the surface of the base electrode layer 32 .

[0055] The base electrode layer 32 includes a first base electrode layer 32a, a second base electrode layer 32b, a third base electrode layer 32c, and a fourth base electrode layer 32d.

[0056] The first base electrode layer 32a is connected to the first internal electrode layer 16a and is disposed on the surface of the first end face 12e. The first base electrode layer 32a also extends from the first end face 12e and is disposed on a portion of the first principal surface 12a, a portion of the second principal surface 12b, and a portion of the first side face 12c and a portion of the second side face 12d. The first base electrode layer 32a may be disposed only on the surface of the first end face 12e. The second base electrode layer 32b is connected to the first internal electrode layer 16a and is disposed on the surface of the second end face 12f. The second base electrode layer 32b also extends from the second end face 12f and is disposed on a portion of the first principal surface 12a, a portion of the second principal surface 12b, and a portion of the first side face 12c and a portion of the second side face 12d. The second base electrode layer 32b may be disposed only on the surface of the second end face 12f.

[0057] The third base electrode layer 32c is connected to the second internal electrode layer 16b and is disposed on the surface of the first side surface 12c. The third base electrode layer 32c also extends from the first side surface 12c and is disposed on a portion of the first main surface 12a and a portion of the second main surface 12b. The third base electrode layer 32c may be disposed only on the surface of the first side surface 12c. The fourth base electrode layer 32d is connected to the second internal electrode layer 16b and is disposed on the surface of the second side surface 12d. The fourth base electrode layer 32d also extends from the second side surface 12d and is disposed on a portion of the first main surface 12a and a portion of the second main surface 12b. The fourth base electrode layer 32d may be disposed only on the surface of the second side surface 12d.

[0058] The base electrode layer 32 includes at least one selected from a baked layer, a conductive resin layer, a thin film layer, etc. In the experimental examples described below, the base electrode layer 32 is a baked layer. Below, each configuration when the base electrode layer 32 is the baked layer, the conductive resin layer, or the thin film layer will be described.

[0059] (When the base electrode layer is a baking layer) The baking layer contains a glass component and a metal component. The glass component of the baking layer contains at least one selected from B, Si, Ba, Mg, Al, Li, etc. The metal component of the baking layer is, for example, Cu as the main component and at least one selected from Ni, Ag, Pd, an Ag-Pd alloy, Au, etc. The baking layer is formed by applying a conductive paste containing a glass component and a metal component to the laminate 12 and baking it. The baking layer may be formed by simultaneously baking a laminated chip having an internal electrode layer 16 and a ceramic layer 14 with a conductive paste applied to the laminated chip, or by baking a laminated chip having an internal electrode layer 16 and a ceramic layer 14 to obtain the laminate 12 and then baking the conductive paste onto the laminate 12. When the baked layer is formed by simultaneously baking the laminated chip having the internal electrode layers 16 and the ceramic layers 14 and the conductive paste applied to the laminated chip, it is preferable that the baked layer be formed by baking a material to which a dielectric material is added instead of a glass component. The baked layer may be a multi-layered layer.

[0060] When the base electrode layer 32 contains a dielectric material instead of a glass component, it is possible to improve the adhesion between the laminate 12 and the base electrode layer 32. The base electrode layer 32 may contain both a glass component and a dielectric component.

[0061] The dielectric material contained in the base electrode layer 32 may be the same as or different from that of the ceramic layer 14. The dielectric component includes at least one selected from the group consisting of BaTiO, CaTiO, (Ba, Ca)TiO, SrTiO, and CaZrO.

[0062] When the first and second base electrode layers 32a, 32b are formed as baked layers, the thickness in the length direction z from the first end face 12e and the second end face 12f is preferably, for example, about 3 μm to 20 μm. When the third and fourth base electrode layers 32c, 32d are formed as baked layers, the thickness in the width direction y from the first side face 12c and the second side face 12d is preferably, for example, about 3 μm to 20 μm.

[0063] (When the base electrode layer is a conductive resin layer) When a conductive resin layer is provided as the base electrode layer 32, the conductive resin layer may be disposed on the baked layer so as to cover the baked layer, or may be disposed directly on the laminate 12 without providing a baked layer. The conductive resin layer contains a metal such as conductive particles and a thermosetting resin. The conductive resin layer may completely cover the base electrode layer, or may cover a portion of the base electrode layer.

[0064] Since the conductive resin layer contains a thermosetting resin, it is more flexible than a conductive layer made of, for example, a plating film or a fired conductive paste. Therefore, even if the three-terminal multilayer ceramic capacitor 10 is subjected to a physical shock or a shock due to a thermal cycle, the conductive resin layer functions as a buffer layer and can prevent cracks in the three-terminal multilayer ceramic capacitor 10.

[0065] The metal contained in the conductive resin layer may be Cu-based, Ag, Ni, Sn, Bi, or an alloy containing these. Metal powders whose surfaces are coated with Ag can also be used. When using metal powders whose surfaces are coated with Ag, it is preferable to use Cu, Ni, Sn, Bi, or an alloy powder thereof as the metal powder. The reason for using Ag conductive metal powder as the conductive metal is that Ag has the lowest resistivity of all metals, making it suitable as an electrode material, and Ag is a noble metal that does not oxidize and has high weather resistance. Furthermore, it is possible to use a cheaper base metal while maintaining the above-mentioned properties of Ag.

[0066] Furthermore, the metal contained in the conductive resin layer may be Cu or Ni that has been subjected to an anti-oxidation treatment. The metal contained in the conductive resin layer may be a metal powder whose surface is coated with Sn, Ni, or Cu. When using a metal powder whose surface is coated with Sn, Ni, or Cu, it is preferable to use Ag, Cu, Ni, Sn, Bi, or an alloy powder thereof as the metal powder.

[0067] The metal contained in the conductive resin layer is mainly responsible for the electrical conductivity of the conductive resin layer. Specifically, when the conductive fillers come into contact with each other, a conductive path is formed inside the conductive resin layer.

[0068] The metal contained in the conductive resin layer may be spherical or flat, but it is preferable to use a mixture of spherical metal powder and flat metal powder.

[0069] The resin for the conductive resin layer may be any of various known thermosetting resins, such as epoxy resin, phenoxy resin, phenol resin, urethane resin, silicone resin, polyimide resin, etc. Among these, epoxy resin is one of the most suitable resins, as it has excellent heat resistance, moisture resistance, adhesion, etc.

[0070] The conductive resin layer preferably contains a curing agent together with the thermosetting resin. When an epoxy resin is used as the base resin, various known compounds such as phenol-based, amine-based, acid anhydride-based, imidazole-based, active ester-based, and amide-imide-based compounds can be used as the curing agent for the epoxy resin.

[0071] The conductive resin layer may be a multi-layered layer.

[0072] (When the base electrode layer is a thin film layer) When a thin film layer is provided as the base electrode layer 32, the thin film layer is formed by a thin film formation method such as sputtering or vapor deposition, and is a layer of 1 μm or less in thickness on which metal particles are deposited.

[0073] The plating layer 34 includes a first plating layer 34a, a second plating layer 34b, a third plating layer 34c, and a fourth plating layer 34d. The first plating layer 34a, the second plating layer 34b, the third plating layer 34c, and the fourth plating layer 34d, which are plating layers 34 that can be disposed on the base electrode layer 32, will be described with reference to Figures 4 and 5. The first plating layer 34a, the second plating layer 34b, the third plating layer 34c, and the fourth plating layer 34d each include, for example, at least one selected from Cu, Ni, Sn, Ag, Pd, an Ag-Pd alloy, Au, and the like.

[0074] The first plating layer 34a is disposed so as to cover the first base electrode layer 32a. The second plating layer 34b is disposed so as to cover the second base electrode layer 32b. The third plating layer 34c is disposed so as to cover the third base electrode layer 32c. The fourth plating layer 34d is disposed so as to cover the fourth base electrode layer 32d.

[0075] The first plating layer 34 a, the second plating layer 34 b, the third plating layer 34 c, and the fourth plating layer 34 d may each be formed of a plurality of layers. In this case, the plating layer 34 preferably has a two-layer structure including a lower plating layer formed on the base electrode layer 32 by Ni plating and an upper plating layer formed on the lower plating layer by Sn plating.

[0076] That is, the first plating layer 34a has a first lower plating layer and a first upper plating layer located on the surface of the first lower plating layer. The second plating layer 34b has a second lower plating layer and a second upper plating layer located on the surface of the second lower plating layer. Similarly, the third plating layer 34c has a third lower plating layer and a third upper plating layer located on the surface of the third lower plating layer. The fourth plating layer 34d has a fourth lower plating layer and a fourth upper plating layer located on the surface of the fourth lower plating layer.

[0077] The lower plating layer made of Ni is used to prevent the base electrode layer 32 from being eroded by solder when mounting the three-terminal multilayer ceramic capacitor 10, and the upper plating layer made of Sn is used to improve the wettability of the solder when mounting the three-terminal multilayer ceramic capacitor 10, thereby facilitating mounting. The thickness of each plating layer is preferably 2.0 μm or more and 15.0 μm or less.

[0078] (3) Dimensions of the Three-Terminal Multilayer Ceramic Capacitor The dimension in the length direction z of the three-terminal multilayer ceramic capacitor 10 including the laminate 12 and the first external electrode 30a to the fourth external electrode 30d is defined as dimension L, the dimension in the height direction x is defined as dimension T, and the dimension in the width direction y is defined as dimension W. The dimensions of the three-terminal multilayer ceramic capacitor 10 are not particularly limited, but are preferably L in the length direction z of 1.05 mm to 1.35 mm, T in the height direction x of 0.45 mm to 0.90 mm, and W in the width direction y of 0.60 mm to 0.95 mm. The dimensions of the three-terminal multilayer ceramic capacitor 10 can be measured using a microscope.

[0079] 2. Method for Manufacturing a Three-Terminal Multilayer Ceramic Capacitor Next, a method for manufacturing a three-terminal multilayer ceramic capacitor will be described.

[0080] First, a dielectric sheet for the ceramic layer and a conductive paste for the internal electrode layer are prepared. The dielectric sheet and the conductive paste for the internal electrode layer contain a binder and a solvent. The binder and the solvent may be known.

[0081] Then, a conductive paste for the internal electrode layers is printed in a predetermined pattern on the dielectric sheet by, for example, gravure printing or screen printing. This prepares a dielectric sheet on which a pattern of the first internal electrode layer is formed and a dielectric sheet on which a pattern of the second internal electrode layer is formed. More specifically, a gravure plate for printing the first internal electrode layer and a gravure plate for printing the second internal electrode layer are separately prepared, and the patterns of the internal electrode layers can be printed using a printer capable of separately printing the two types of gravure. At this time, the depth of the plate is adjusted so that the greater the thickness, the deeper the plate is, so that the thickness of at least one of the third and fourth lead electrode portions in the height direction is greater than the thickness of the first and second lead electrode portions in the height direction ≥ the thickness of the first and second opposing electrode portions in the height direction. Alternatively, multiple screen printing operations may be performed to increase the thickness. The printing of the conductive paste for the internal electrode layers can be performed, for example, while the dielectric sheet is being transported in the longitudinal direction z. In the experimental examples described later, the internal electrode layers were printed by gravure printing.

[0082] Next, a predetermined number of dielectric sheets for outer layers, on which the pattern of the internal electrode layer is not printed, are stacked to form a portion that will become the second main surface side outer layer portion on the second main surface side. Then, a dielectric sheet on which the pattern of the first internal electrode layer is printed and a dielectric sheet on which the pattern of the second internal electrode layer is printed are sequentially stacked on the portion that will become the second main surface side outer layer portion so as to form the structure of the present invention, to form a portion that will become the internal layer portion. A predetermined number of dielectric sheets for outer layers, on which the pattern of the internal electrode layer is not printed, are stacked on this portion that will become the internal layer portion, to form a portion that will become the first main surface side outer layer portion on the first main surface side. In this way, a laminated sheet is produced. The stacking of sheets can be performed, for example, by stacking upper layer sheets while transporting lower layer sheets in the longitudinal direction z.

[0083] Next, the laminated sheets are pressed in the lamination direction by means of a hydrostatic press or the like to produce a laminated block.

[0084] The laminated block is then cut to a predetermined size to obtain laminated chips. At this time, corners and ridges of the laminated chips may be rounded by barrel polishing or the like. The cutting of the laminated block can be performed, for example, while the laminated block is being transported in the longitudinal direction z.

[0085] The cut-out laminated chips are then fired to produce a laminate. The firing temperature is preferably 900° C. or higher and 1400° C. or lower, although this depends on the materials of the ceramic layers and internal electrode layers.

[0086] Next, a third base electrode layer 32c of the third external electrode 30c is formed on the first side surface 12c of the laminate 12 obtained by firing, and a fourth base electrode layer 32d of the fourth external electrode 30d is formed on the second side surface 12d of the laminate 12.

[0087] (When the base electrode layer is a baked layer) When a baked layer is formed as the third base electrode layer 32c and the fourth base electrode layer 32d, a conductive paste containing a glass component and a metal component is applied, and then a baking process is performed to form the base electrode layer. The baking process temperature at this time is preferably 700°C or higher and 900°C or lower. In the experimental examples described below, the base electrode layer 32 was formed as a baked layer.

[0088] Various methods can be used to form the baked layer. For example, a method of applying a conductive paste by extruding it through a slit can be used. With this method, by increasing the amount of conductive paste extruded, the base electrode layer 32 can be formed not only on the first side surface 12c and the second side surface 12d but also on portions of the first principal surface 12a and the second principal surface 12b. The baked layer can also be formed using a roller transfer method. With the roller transfer method, when the base electrode layer 32 is formed not only on the first side surface 12c and the second side surface 12d but also on portions of the first principal surface 12a and the second principal surface 12b, the base electrode layer 32 can be formed on portions of the first principal surface 12a and the second principal surface 12b by increasing the pressing pressure during roller transfer.

[0089] (When the Base Electrode Layer is a Conductive Resin Layer) When the third base electrode layer 32c and the fourth base electrode layer 32d are formed of a conductive resin layer, the conductive resin layer can be formed by the following method. The conductive resin layer may be formed on the surface of a baked layer, or the conductive resin layer may be formed alone directly on the laminate 12 without forming a baked layer.

[0090] The conductive resin layer is formed by applying a conductive resin paste containing a thermosetting resin and a metal component onto the baking layer or the laminate 12, and then performing a heat treatment at a temperature of 250°C to 550°C to thermally cure the resin and form the conductive resin layer. The heat treatment is preferably performed in an N2 atmosphere. Furthermore, to prevent the resin from scattering and the various metal components from oxidizing, it is preferable to keep the oxygen concentration below 100 ppm.

[0091] The conductive resin paste can be applied using a method similar to the method of forming the base electrode layer 32 as a baked layer, for example, a method of applying the conductive resin paste by extruding it through a slit or a roller transfer method.

[0092] (When the base electrode layer is a thin film layer) When the third base electrode layer 32c and the fourth base electrode layer 32d are formed as thin film layers, masking or the like is performed, and the base electrode layer can be formed by a thin film formation method such as sputtering or vapor deposition in the area where the external electrode 30 is to be formed. The base electrode layer formed as a thin film layer is a layer of deposited metal particles having a thickness of 1 μm or less.

[0093] Next, the first base electrode layer 32a of the first external electrode 30a is formed on the first end face 12e of the fired laminate, and the second base electrode layer 32b of the second external electrode 30b is formed on the second end face 12f. As with the third and fourth base electrode layers 32c and 32d, when forming baked layers as the first and second base electrode layers 32a and 32b, a conductive paste containing a glass component and a metal component is applied, followed by a baking process to form the base electrode layers. The baking temperature is preferably 700°C or higher and 900°C or lower. The conductive paste can be applied to both end faces of the laminate by, for example, a dipping method or a screen printing method. In the experimental examples described below, the first and second base electrode layers 32a and 32b were formed using a dipping method so as to extend not only to the first end face 12e and the second end face 12f, but also to a portion of the first main surface 12a, a portion of the second main surface 12b, a portion of the first side surface 12c, and a portion of the second side surface 12d.

[0094] In the baking process, the third base electrode layer 32c, the fourth base electrode layer 32d, the first base electrode layer 32a, and the second base electrode layer 32b may be baked simultaneously, or they may be baked separately on both side surfaces 12c and 12d and both end surfaces 12e and 12f.

[0095] When the base electrode layer is formed as a baking layer, the baking layer may contain a dielectric component. In this case, the dielectric component may be contained instead of the glass component, or both may be contained.

[0096] The dielectric component is preferably, for example, the same dielectric material as the laminate. When the baked layer contains the dielectric component, it is preferable to apply a conductive paste to the pre-fired laminated chip, and then simultaneously bake (fire) the pre-fired laminated chip and the conductive paste applied to the pre-fired laminated chip to form a laminate with a baked layer. The baking temperature (baking temperature) at this time is preferably 900°C or higher and 1400°C or lower.

[0097] Next, a plating layer 34 is formed. The plating layer 34 may be formed on the surface of the base electrode layer 32 or directly on the laminate 12. In the experimental examples described below, the plating layer 34 was formed on the surface of the base electrode layer 32. More specifically, a Ni plating layer is formed on the base electrode layer 32 as the lower plating layer, and a Sn plating layer is formed as the upper plating layer. The Ni plating layer and the Sn plating layer are formed sequentially, for example, by barrel plating. Either electrolytic plating or electroless plating may be used for the plating process. However, electroless plating has the disadvantage of requiring pretreatment using a catalyst or the like to improve the plating deposition rate, which complicates the process. Therefore, electrolytic plating is usually preferred.

[0098] In the manner described above, the three-terminal multilayer ceramic capacitor 10 according to this embodiment is manufactured.

[0099] 3. Effects and Benefits The following describes the effects and benefits of the three-terminal multilayer ceramic capacitor 10. (1) Effects and benefits resulting from the thickness relationship that the thicknesses tb1, tb2 of the third and fourth lead electrode portions 28b1, 28b2 are greater than the thicknesses ta1, ta2 of the first and second lead electrode portions 28a1, 28a2, and that at least one of the thicknesses t1, t2 of the first and second opposing electrode portions 26a, 26b.

[0100] The present inventors have discovered a new finding that, regarding the relationships among the thicknesses ta1, ta2 of the first and second lead electrode portions 28a1, 28a2, the thicknesses tb1, tb2 of the third and fourth lead electrode portions 28b1, 28b2, and the thicknesses t1, t2 of the first and second opposing electrode portions 26a, 26b, the relationships that have adverse effects such as a decrease in moisture resistance reliability, an increase in the dimensions of the three-terminal multilayer ceramic capacitor 10, and structural defects are such that the thicknesses tb1, tb2 of the third and fourth lead electrode portions 28b1, 28b2 < the thicknesses ta1, ta2 of the first and second lead electrode portions 28a1, 28a2 ≦ the thickness t1, t2 of the first or second opposing electrode portion 26a, 26b. Based on this new finding, it was newly discovered that the thickness relationships should be set such that the thicknesses tb1, tb2 of the third and fourth lead electrode portions 28b1, 28b2 are greater than the thicknesses ta1, ta2 of the first and second lead electrode portions 28a1, 28a2 and are greater than or equal to the thicknesses t1, t2 of at least one of the first and second opposing electrode portions 26a, 26b. In this way, by defining the magnitude relationship in consideration of the thicknesses tb1, tb2 of the third and fourth lead electrode portions 28b1, 28b2, the thicknesses ta1, ta2 of the first and second lead electrode portions 28a1, 28a2, and at least one of the thicknesses t1, t2 of the first and second opposing electrode portions 26a, 26b, and forming the internal electrode layers 16, it was discovered that it is possible to suppress a decrease in moisture resistance reliability, an increase in the dimensions of the three-terminal multilayer ceramic capacitor 10, structural defects, etc. This will be described in detail below.

[0101] According to the above configuration, the thicknesses tb1 and tb2 of the third and fourth lead electrode portions 28b1 and 28b2 are greater than at least one of the thicknesses t1 and t2 of the first and second opposing electrode portions 26a and 26b. In other words, the third and fourth lead electrode portions 28b1 and 28b2 are exposed on the first side surface 12c and the second side surface 12d with a thickness greater than at least one of the thicknesses t1 and t2 of the first and second opposing electrode portions 26a and 26b. This improves adhesion between the third and fourth lead electrode portions 28b1 and 28b2 and the third and fourth external electrodes 30c and 30d. Specifically, an alloy layer is formed by interdiffusion of Ni in the third and fourth lead electrode portions 28b1 and 28b2 and Cu in the third and fourth external electrodes 30c and 30d. This alloy layer is formed more densely than the internal electrode layers 16 and the external electrodes 30 themselves, improving the connectivity between the internal electrode layers 16 and the external electrodes 30. Furthermore, by forming the third and fourth lead electrode portions 28b1, 28b2 with large thicknesses tb1, tb2 as described above, the contact areas between the third and fourth lead electrode portions 28b1, 28b2 and the third and fourth external electrodes 30c, 30d are increased, and the alloy layer is formed over a larger area. This improves the adhesion between the third and fourth lead electrode portions 28b1, 28b2 and the third and fourth external electrodes 30c, 30d, thereby suppressing the penetration of moisture into the laminate 12 from between the third and fourth lead electrode portions 28b1, 28b2 and the third and fourth external electrodes 30c, 30d, and improving moisture resistance reliability.

[0102] Furthermore, the thicknesses ta1, ta2 of the first and second lead electrode portions 28a1, 28a2 are greater than at least one of the thicknesses t1, t2 of the first and second opposing electrode portions 26a, 26b. That is, the first and second lead electrode portions 28a1, 28a2 are exposed at the first end face 12e and the second end face 12f with a thickness greater than at least one of the thicknesses t1, t2 of the first and second opposing electrode portions 26a, 26b. This increases the contact area between the first and second lead electrode portions 28a1, 28a2 and the first and second external electrodes 30a, 30b, and forms a large alloy layer, thereby improving the adhesion between the first and second lead electrode portions 28a1, 28a2 and the first and second external electrodes 30a, 30b and improving the moisture resistance reliability.

[0103] Furthermore, at least one of the thicknesses t1, t2 of the first and second opposing electrode portions 26a, 26b is smaller than the thicknesses tb1, tb2 of the third and fourth lead electrode portions 28b1, 28b2, and at least one of the thicknesses t1, t2 of the first and second opposing electrode portions 26a, 26b is equal to or smaller than the thicknesses ta1, ta2 of the first and second lead electrode portions 28a1, 28a2. This prevents the thickness of the effective layer, where the first opposing electrode portion 26a and the second opposing electrode portion 26b are opposed to each other in the height direction x via the ceramic layer 14, from increasing. This prevents the dimension of the three-terminal multilayer ceramic capacitor 10 in the height direction x from increasing.

[0104] Furthermore, the thicknesses tb1 and tb2 of the third and fourth lead electrode portions 28b1 and 28b2 are greater than the thicknesses ta1 and ta2 of the first and second lead electrode portions 28a1 and 28a2. In other words, the thicknesses ta1 and ta2 of the first and second lead electrode portions 28a1 and 28a2 are smaller than the thicknesses tb1 and tb2 of the third and fourth lead electrode portions 28b1 and 28b2. Here, it is difficult to keep the dimension of the three-terminal multilayer ceramic capacitor 10 in the height direction x constant in the length direction z, that is, distortion may occur in the length direction z. For example, when the laminate 12 in which the first internal electrode layers 16a, the second internal electrode layers 16b, and the ceramic layers 14 are stacked is cut while being conveyed in the length direction z, cutting deviation may occur in the length direction z, resulting in distortion in the length direction z. Furthermore, the first internal electrode layer 16a and the second internal electrode layer 16b cannot be overlapped with high precision, and lamination misalignment may occur in the longitudinal direction z. In particular, when lamination is performed while transporting in the longitudinal direction z, lamination misalignment in the longitudinal direction z may become significant. Furthermore, printing misalignment may occur in the first internal electrode layer 16a in the longitudinal direction z. In particular, when printing is performed while transporting in the longitudinal direction z, printing misalignment in the longitudinal direction z may become significant. When cutting misalignment, lamination misalignment, printing misalignment, etc. occur in the laminate 12 in the longitudinal direction z as described above, it may be impossible to position the portions of the first and second lead electrode portions 28a1, 28a2 with large thicknesses ta1, ta2 on the first and second end faces 12e, 12f, and it may not be possible to ensure a large exposed area of ​​the first internal electrode layer 16a relative to the external electrodes. To address this, it is conceivable to increase the lengths of the thicknesses ta, ta of the first and second lead electrode portions 28a, 28a in the longitudinal direction z, thereby positioning the portions of the first and second lead electrode portions 28a, 28a with larger thicknesses ta, ta on the first and second end faces 12e, 12f even if cutting misalignment, stacking misalignment, printing misalignment, etc. In this case, however, because the thicknesses ta, ta of the first and second lead electrode portions 28a, 28a are large in the longitudinal direction z, they may be stacked so as to overlap with the second opposing electrode portion 26b.As a result, at least the thickness of the portions where the thicknesses ta1, ta2 of the first and second lead electrode portions 28a1, 28a2 overlap with the second opposing electrode portion 26b becomes large. This type of lamination may potentially result in disadvantages such as structural defects and an increase in the dimension of the three-terminal multilayer ceramic capacitor 10 in the height direction x. Therefore, by making the thicknesses ta1, ta2 of the first and second lead electrode portions 28a1, 28a2 smaller than the thicknesses tb1, tb2 of the third and fourth lead electrode portions 28b1, 28b2 as described above, even if the first and second lead electrode portions 28a1, 28a2 overlap with the second opposing electrode portion 26b due to cutting misalignment, lamination misalignment, printing misalignment, or the like, it is possible to prevent the dimension of the three-terminal multilayer ceramic capacitor 10 in the height direction x from becoming large and to prevent structural defects, etc. Furthermore, by making the thicknesses tb1, tb2 of the third and fourth lead electrode portions 28b1, 28b2, which are less affected by cutting misalignment, lamination misalignment, printing misalignment, etc. in the longitudinal direction z, larger than the thicknesses ta1, ta2 of the first and second lead electrode portions 28a1, 28a2, the connectivity between the third and fourth lead electrode portions 28b1, 28b2 and the third and fourth external electrodes 30c, 30d is improved.

[0105] (2) Effects of the thicknesses ta1, ta2 of the first and second lead electrode portions 28a1, 28a2 being 1.0 to 1.3 times the thickness t1 of the first opposing electrode portion 26a By setting the thicknesses ta1, ta2 of the first and second lead electrode portions 28a1, 28a2 as described above, it is possible to improve the adhesion between the first internal electrode layer 16a and the first and second external electrodes 30a, 30b and to achieve miniaturization. Here, if the thicknesses ta1, ta2 of the first and second lead electrode portions 28a1, 28a2 are less than 1.0 times the thickness t1 of the first opposing electrode portion 26a, the contact area between the first internal electrode layer 16a and the first and second external electrodes 30a, 30b becomes small, making it impossible to improve the adhesion. On the other hand, if the thicknesses ta1 and ta2 of the first and second lead electrode portions 28a1 and 28a2 are made larger than 1.3 times the thickness t1 of the first opposing electrode portion 26a, the thickness of the three-terminal multilayer ceramic capacitor 10 becomes large, making it impossible to reduce the size.

[0106] (3) Effects of the thicknesses tb1, tb2 of the third and fourth lead electrode portions 28b1, 28b2 being 1.3 to 1.7 times the thickness t2 of the second opposing electrode portion 26b By setting the thicknesses tb1, tb2 of the third and fourth lead electrode portions 28b1, 28b2 as described above, it is possible to improve the adhesion between the second internal electrode layer 16b and the third and fourth external electrodes 30c, 30d and to achieve miniaturization. Here, if the thicknesses tb1, tb2 of the third and fourth lead electrode portions 28b1, 28b2 are less than 1.3 times the thickness t2 of the second opposing electrode portion 26b, the contact area between the second internal electrode layer 16b and the third and fourth external electrodes 30c, 30d becomes small, making it impossible to improve the adhesion. On the other hand, if the thicknesses tb1, tb2 of the third and fourth extraction electrode portions 28b1, 28b2 are made larger than 1.7 times the thickness t2 of the second opposing electrode portion 26b, the thickness of the three-terminal multilayer ceramic capacitor 10 becomes large, making it impossible to reduce the size.

[0107] (4) Effects of the second Ni diffusion distance being greater than the first Ni diffusion distance Since the second Ni diffusion distance is greater than the first Ni diffusion distance, the alloy layers formed between the second internal electrode layers 16 b and the third and fourth external electrodes 30 c, 30 d are larger than the alloy layers formed between the first internal electrode layers 16 a and the first and second external electrodes 30 a, 30 b. This further improves the adhesion between the second internal electrode layers 16 b and the third and fourth external electrodes 30 c, 30 d, thereby further suppressing the penetration of moisture into the laminate 12 from between the second internal electrode layers 16 b and the third and fourth external electrodes 30 c, 30 d, and further improving the moisture resistance reliability.

[0108] 4. Experimental Example Next, in order to confirm the effects of the three-terminal multilayer ceramic capacitor according to the present invention described above, three-terminal multilayer ceramic capacitors were manufactured as experimental samples by the above manufacturing method, and a humidity resistance reliability test and measurement of the Ni diffusion distance were carried out.

[0109] A. Sample Preparation (a) Specifications of Samples in Examples First, three-terminal multilayer ceramic capacitors according to Examples 1 to 10 were fabricated according to the multilayer ceramic capacitor manufacturing method described above. Examples 1 to 10 share the same configuration except for the thicknesses (ta1, ta2) of the first and second lead electrode portions in the height direction x, the thickness (t1) of the first opposing electrode portion in the height direction x, the thicknesses (tb1, tb2) of the third and fourth lead electrode portions in the height direction x, and the dimension (t2) of the second opposing electrode portion in the height direction x. Examples 1 to 10 represent 10 of 72 samples fabricated in the same lot.

[0110] Examples 1 to 10 In Examples 1 to 10, the thicknesses (ta1, ta2) of the first and second extracted electrode portions in the height direction x, the thickness (t1) of the first opposing electrode portion in the height direction x, the thicknesses (tb1, tb2) of the third and fourth extracted electrode portions in the height direction x, and the dimension (t2) of the second opposing electrode portion in the height direction x are different for each of Examples 1 to 10. Other design values ​​are common to Examples 1 to 10.

[0111] ◎Structure of three-terminal multilayer ceramic capacitor: three terminals (see Figure 1) ◎Dimensions of three-terminal multilayer ceramic capacitor L x W x T (including design values): 1.23 mm x 0.93 mm x 0.48 mm ◎Material of ceramic layer: BaTiO3 ◎Capacitance: 22 μF ◎Rated voltage: 4 V

[0112] First internal electrode layer Material: Ni Shape: See Figures 4, 6, and 8 Number of layers: 220 Thickness of the first and second lead electrode portions in the height direction x (ta1, ta2): See Table 1 Thickness of the first opposing electrode portion in the height direction x (t1): See Table 1

[0113] Second internal electrode layer Material: Ni Shape: See Figures 5, 7, and 9 Number of layers: 220 Thickness of the third and fourth lead electrode portions in the height direction x (tb1, tb2): See Table 1 Dimension of the second opposing electrode portion in the height direction x (t2): See Table 1

[0114] ◎ Structure of external electrodes First external electrode and second external electrode Base electrode layer: Baked layer containing conductive metal (Cu) and glass component Thickness at center of end face: 16 μm Plating layer: Two-layer structure of Ni plating layer and Sn plating layer Thickness of Ni plating layer: 5 μm Thickness of Sn plating layer: 5 μm

[0115] Third external electrode and fourth external electrode Base electrode layer: Baked layer containing conductive metal (Cu) and glass component Thickness at center of side surface: 12 μm Plating layer: Two-layer structure of Ni plating layer and Sn plating layer Thickness of Ni plating layer: 4 μm Thickness of Sn plating layer: 5 μm

[0116] (b) Specifications of Sample of Comparative Example 1 Next, a three-terminal multilayer ceramic capacitor according to Comparative Example 1 was fabricated, in which the configurations of the first internal electrode layer and the second internal electrode layer were different from those of Examples 1 to 10. (Comparative Example 1) A three-terminal multilayer ceramic capacitor according to Comparative Example 1 was fabricated with the following design. Other configurations of Comparative Example 1 were the same as those of Examples 1 to 10. ◎ First internal electrode layer - Thickness in the height direction x of the first and second lead electrode portions (ta1, ta2): See Table 1 - Thickness in the height direction x of the first opposing electrode portion (t1): See Table 1 ◎ Second internal electrode layer - Thickness in the height direction x of the third and fourth lead electrode portions (tb1, tb2): See Table 1 - Thickness in the height direction x of the second opposing electrode portion (t2): See Table 1

[0117] B. Evaluation of Samples A moisture resistance reliability test and Ni diffusion length measurement were performed on 72 samples manufactured in the same lot, including Examples 1 to 10, and 72 samples of Comparative Example 1. Examples 1 to 10 include, among the 72 samples manufactured in the same lot, samples with the maximum and minimum thicknesses (ta1, ta2) in the height direction x of the first and second extraction electrode portions, samples with the maximum and minimum thicknesses (t1) in the height direction x of the first opposing electrode portion, samples with the maximum and minimum thicknesses (tb1, tb2) in the height direction x of the third and fourth extraction electrode portions, and samples with the maximum and minimum dimension (t2) in the height direction x of the second opposing electrode portion.

[0118] (Moisture Resistance Reliability Test) Based on the PCBT test method, a moisture resistance reliability test was performed on each sample. More specifically, each sample was first mounted on a mounting board using solder. Subsequently, the insulation resistance value IR of each sample was measured (insulation resistance value 1 hour after the start of the moisture resistance reliability test). Next, the mounting board was placed in a high-temperature, high-humidity chamber, and a DC current of 4 V was applied between the first and second external electrodes of each sample and between the third and fourth external electrodes of each sample under an environment of 125°C and 95% RH for 72 hours (moisture resistance reliability test time). After the moisture resistance reliability test, the insulation resistance value IR of each sample was measured (insulation resistance value after moisture resistance reliability test). For each sample, a decrease in log IR after the moisture resistance reliability test of 0.5 or more compared to the log IR before the moisture resistance reliability test was determined and counted as IR degradation.

[0119] (Measurement of Ni Diffusion Distance) The Ni diffusion distance of Ni constituting the internal electrode layer into the external electrode at the joints between the first to fourth external electrodes and the internal electrode layers was measured using the following device for each of the cases where the firing temperatures were 680°C, 700°C, 720°C, and 740°C. The Ni diffusion region was defined as a region from the interface between the external electrode and the internal electrode layer where the Ni content relative to the total Ni content and Cu content (Ni content / (Ni content + Cu content)) was 10% or more. Within 256 x 256 pixels, for each of 72 samples including Examples 1 to 10 and 72 samples of Comparative Example 1, the 30th value among the longest Ni diffusion distances from the interface was obtained as the Ni diffusion distance for each sample. Furthermore, as experimental results, the average value of the Ni diffusion distances for the 72 samples including Examples 1 to 10 and the average value for the 72 samples of Comparative Example 1 was obtained for each of the firing temperatures of 680°C, 700°C, 720°C, and 740°C.

[0120] FE-WDX (device name: JEOL JXA-8500F) Acceleration voltage: 15.0 kV Probe current: 5 × 10 -8A Field of view: 25 μm x 25 μm Number of pixels (number of pixels): 256 x 256 Pixel size: 0.0978 (4000x) Dwell time (capture time for one pixel): 40 ms Scan method: Beam Analysis depth: 1 to 2 μm Measurable elements: Ni, Cu

[0121] Table 1 shows the design values ​​of each sample of Examples 1 to 10 and Comparative Example 1.

[0122]

[0123] Table 2 shows the experimental results of the humidity resistance reliability test.

[0124]

[0125] Table 3 shows the experimental results of the Ni diffusion distance.

[0126]

[0127] C. Experimental Results As shown in the results in Table 2, of the 72 samples including Examples 1 to 10, none showed IR degradation. On the other hand, in Comparative Example 1, three samples showed IR degradation, indicating a decrease in moisture resistance reliability. Therefore, it was found that no IR degradation occurred in the samples of Examples 1 to 10, and the decrease in moisture resistance reliability was suppressed, ensuring moisture resistance reliability.

[0128] In Examples 1 to 10 in which moisture resistance reliability was ensured, the thickness relationship was: thickness in the height direction x of the third and fourth extracted electrode portions > thickness in the height direction x of the first and second extracted electrode portions ≥ thickness in the height direction x of the first and second opposing electrode portions. On the other hand, in Comparative Example 1 in which moisture resistance reliability was reduced, the thickness in the height direction x of the third and fourth extracted electrode portions > thickness in the height direction x of the first and second opposing electrode portions > thickness in the height direction x of the first and second extracted electrode portions.

[0129] Therefore, it was found that the moisture resistance reliability of a three-terminal multilayer ceramic capacitor can be ensured if the thickness relationship derived from Examples 1 to 10 is met. Furthermore, from the calculation results related to Examples 1 to 10 in Table 1, it was found that the thicknesses ta1 and ta2 in the height direction x of the first and second extraction electrode portions are preferably 1.0 to 1.3 times the thickness t1 in the height direction x of the first opposing electrode portion (or the thickness t2 in the height direction x of the second opposing electrode portion). In other words, in Examples 1 to 10, the minimum value of ta1(ta2) / t1(t2) was 1.00 in Example 9 and the maximum value was 1.34 in Example 3. Rounded off, the minimum value was 1.0 and the maximum value was 1.3.

[0130] Furthermore, from the calculation results related to Examples 1 to 10 in Table 1, it was found that the thicknesses tb1 and tb2 of the third and fourth extraction electrode portions in the height direction x are preferably 1.3 to 1.7 times the thickness t1 of the second opposing electrode portion in the height direction x (or the thickness t2 of the second opposing electrode portion in the height direction x). That is, in Examples 1 to 10, the minimum value of tb1(tb2) / t1(t2) is 1.28 in Example 8 and the maximum value is 1.71 in Example 10, and when rounded up or down, the minimum value is 1.3 and the maximum value is 1.7.

[0131] Furthermore, from the calculation results related to Examples 1 to 10 in Table 3, it was found that the second Ni diffusion distance / first Ni diffusion distance is preferably 1.04 or more and 1.45 or less, and more preferably 1.05 or more and 1.40 or less.

[0132] As described above, although the embodiments of the present invention have been disclosed in the above description, the present invention is not limited thereto. In other words, the present invention allows various modifications to be made to the above-described embodiments in terms of the configuration, shape, material, quantity, position, arrangement, etc., without departing from the scope of the technical idea and purpose of the present invention, and such modifications are included in the present invention.

[0133] <1> A laminate having a plurality of laminated ceramic layers, the laminate having first and second main surfaces opposing each other in a height direction, first end faces and second end faces opposing each other in a length direction perpendicular to the height direction, and first and second side faces opposing each other in a width direction perpendicular to the height direction and the length direction; a plurality of first internal electrode layers arranged on the plurality of ceramic layers and extended to the first end faces and the second end faces; a plurality of second internal electrode layers arranged on the plurality of ceramic layers and extended to the first side faces and the second side faces; a first external electrode arranged on the first end faces and connected to the first internal electrode layers; a second external electrode arranged on the second end faces and connected to the first internal electrode layers; a third external electrode arranged on the first side faces and connected to the second internal electrode layers; and a fourth external electrode arranged on the second side faces and connected to the second internal electrode layers, the first internal electrode layer has a first opposing electrode portion opposing the second internal electrode layer, a first lead electrode portion extending from the first opposing electrode portion to the first end face, and a second lead electrode portion extending from the first opposing electrode portion to the second end face; the second internal electrode layer has a second opposing electrode portion opposing the first opposing electrode portion, a third lead electrode portion extending from the second opposing electrode portion to the first side face, and a fourth lead electrode portion extending from the second opposing electrode portion to the second side face; and a three-terminal multilayer ceramic capacitor in which the thickness in the height direction of the third lead electrode portion and the fourth lead electrode portion is greater than the thickness in the height direction of the first lead electrode portion and the second lead electrode portion≧at least one of the thicknesses in the height direction of the first opposing electrode portion and the second opposing electrode portion.

[0134] <2> The three-terminal multilayer ceramic capacitor according to <1>, wherein the thickness of the first and second lead electrode portions in the height direction is 1.0 to 1.3 times the thickness of the first opposing electrode portion in the height direction.

[0135] <3> The three-terminal multilayer ceramic capacitor according to <1> or <2>, wherein the thickness of the third and fourth extraction electrode portions in the height direction is 1.3 to 1.7 times the thickness of the second opposing electrode portion in the height direction.

[0136] <4> The three-terminal multilayer ceramic capacitor according to any one of <1> to <3>, wherein, when a region where the Ni content relative to the total of the Ni content and the Cu content is 10% or more is defined as a Ni diffusion region, a second Ni diffusion distance of Ni in the width direction from the third and fourth extraction electrode portions to the third and fourth external electrodes, based on the first side surface and the second side surface of the laminate, is 1.05 to 1.4 times a first Ni diffusion distance of Ni in the length direction from the first and second extraction electrode portions to the first and second external electrodes, based on the first end surface and the second end surface of the laminate.

[0137] 10: Three-terminal multilayer ceramic capacitor 12: Laminate 12a: First main surface 12b: Second main surface 12c: First side surface 12d: Second side surface 12e: First end surface 12f: Second end surface 14: Ceramic layer 16: Internal electrode layer 16a: First internal electrode layer 16b: Second internal electrode layer 18: Internal layer portion 20a: First main surface side outer layer portion 20b: Second main surface side outer layer portion 22a: First side surface side outer layer portion 22b: Second side surface side outer layer portion 24a: First end surface side outer layer portion 24b: Second end surface side outer layer portion 26a, 26b: First and second opposing electrode portions 27: Counter electrode portion region 28a1, 28a2: First and second lead electrode portions 28b1, 28b2: Third and fourth lead electrode portions 30: External electrode 30a to 30d: First to fourth external electrodes 32: Base electrode layer 32a to 32d: First to fourth base electrode layers 34: Plating layer 34a to 34d: First to fourth plating layers x: Height direction y: Width direction z: Length direction

Claims

1. A laminate having a plurality of laminated ceramic layers, the laminate having a first main surface and a second main surface opposing each other in a height direction, a first end surface and a second end surface opposing each other in a length direction perpendicular to the height direction, and a first side surface and a second side surface opposing each other in a width direction perpendicular to the height direction and the length direction; a plurality of first internal electrode layers arranged on the plurality of ceramic layers and extended to the first end surface and the second end surface; a plurality of second internal electrode layers arranged on the plurality of ceramic layers and extended to the first side surface and the second side surface; a first external electrode arranged on the first end surface and connected to the first internal electrode layer, a second external electrode arranged on the second end surface and connected to the first internal electrode layer, a third external electrode arranged on the first side surface and connected to the second internal electrode layer, and a fourth external electrode arranged on the second side surface and connected to the second internal electrode layer, a third extraction electrode portion extending from the second opposing electrode portion to the first side surface, and a fourth extraction electrode portion extending from the second opposing electrode portion to the second side surface; and a three-terminal multilayer ceramic capacitor, wherein the first internal electrode layer has a first opposing electrode portion opposing the second internal electrode layer, a first extraction electrode portion extending from the first opposing electrode portion to the first end surface, and a second extraction electrode portion extending from the first opposing electrode portion to the second end surface; and the second internal electrode layer has a second opposing electrode portion opposing the first opposing electrode portion, a third extraction electrode portion extending from the second opposing electrode portion to the first side surface, and a fourth extraction electrode portion extending from the second opposing electrode portion to the second side surface; and 2. A three-terminal multilayer ceramic capacitor as described in claim 1, wherein the thickness of said first and second extraction electrode portions in the height direction is between 1.0 and 1.3 times the thickness of said first opposing electrode portion in the height direction.

3. A three-terminal multilayer ceramic capacitor as described in claim 1 or 2, wherein the thickness in the height direction of the third and fourth extraction electrode portions is 1.3 to 1.7 times the thickness in the height direction of the second opposing electrode portion.

4. A three-terminal multilayer ceramic capacitor as claimed in any one of claims 1 to 3, wherein, when a region in which the Ni content relative to the total of the Ni content and the Cu content is 10% or more is defined as a Ni diffusion region, a second Ni diffusion distance in the width direction of Ni from the third and fourth extraction electrode portions to the third and fourth external electrodes, based on the first and second side faces of the laminate, is 1.05 to 1.4 times greater than a first Ni diffusion distance in the length direction from the first and second extraction electrode portions to the first and second external electrodes, based on the first and second end faces of the laminate.

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