Semiconductor plastic packaging system and foreign object detection method

Abstract

A semiconductor plastic packaging system and a foreign object detection method. The semiconductor plastic packaging system comprises a plastic packaging device and a foreign object detection apparatus. The foreign object detection apparatus comprises an image collector and a controller. The image collector is used for collecting a target image of a lead frame to be subjected to plastic packaging located in a loading region. The loading region is located in the plastic packaging device. The controller is used for presetting a standard image, comparing the target image with the standard image, and determining whether a foreign object is present in a non-plastic packaging region of the target image. In the present application, the image collector can collect an image of the lead frame to be subjected to plastic packaging before plastic packaging, and the controller compares, with the standard image, the image of the lead frame to be subjected to plastic packaging before plastic packaging and performs analysis to identify whether a foreign object is present in the non-plastic packaging region. The foreign object detection process is automatically completed without manual operation, and thus, labor costs can be saved. Moreover, any contact with the lead frame to be subjected to plastic packaging is avoided during the detection process, thereby avoiding causing other abnormalities, during testing, in the lead frame to be subjected to plastic packaging.

Description

A semiconductor plastic packaging system and foreign matter detection method

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on July 17, 2023, with application number 202310878511.2 and invention name “A semiconductor plastic packaging system and foreign matter detection method”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of packaging, and in particular to a semiconductor plastic packaging system and a foreign matter detection method. Background Art

[0003] Before the semiconductor packaging process begins (for example, after the lead frame undergoes wire bonding), chip shifting and foreign matter may occur. These shifted chips and foreign matter can cause mold failure during the molding process, resulting in mold surface damage, adhesive overflow, and lead damage. These mold damages incur significant costs each year, leading to high mold costs and significant losses.

[0004] Currently, to prevent foreign matter on lead frames from negatively impacting product quality and mold costs, lead frames undergoing plastic encapsulation are manually inspected and those with foreign matter on their surfaces are removed. This manual inspection method increases labor costs and can also cause further damage if performed improperly.

[0005] Therefore, how to solve the above technical problems should be the focus of those skilled in the art.

[0006] Summary of the Invention

[0007] The purpose of this application is to provide a semiconductor plastic packaging system and a foreign matter detection method to reduce labor costs and avoid other abnormalities of the lead frame to be plastic-sealed during detection.

[0008] To solve the above technical problems, the present application provides a semiconductor plastic packaging system, including a plastic packaging device and a foreign matter detection device, wherein the foreign matter detection device includes an image collector and a controller;

[0009] The image collector is used to collect the target image of the lead frame to be plastic-encapsulated in the loading area; the loading area is located in the plastic encapsulation equipment;

[0010] The controller is used to preset a standard image, and compare the target image with the standard image to determine whether there is a foreign object in the non-plastic-sealed area of ​​the target image.

[0011] Optionally, the controller is configured to select a non-plastic-sealed area from the target image and compare the area with the standard image.

[0012] Optionally, the controller is configured to compare the target image with a non-plastic-sealed area in the standard image.

[0013] Optionally, the controller is connected to a switch component of the laminating device. When there is a foreign object in the non-laminated area of ​​the target image, the controller is further configured to send a shutdown instruction to the switch component to control the laminating device to stop.

[0014] Optionally, also include:

[0015] An alarm device connected to the controller is used to receive an alarm instruction from the controller and issue an alarm message when a foreign object exists in the non-plastic-sealed area of ​​the target image.

[0016] Optionally, also include:

[0017] A display device connected to the controller is used to display the target image and the judgment result.

[0018] Optionally, the image collector has a resolution of more than 20 million pixels.

[0019] The present application also provides a method for detecting foreign matter in semiconductors before plastic packaging, comprising:

[0020] Acquire a target image of a lead frame to be plastic-encapsulated located in a loading area of ​​a plastic-encapsulation device;

[0021] The target image is compared with a standard image to determine whether there is foreign matter in the non-plastic-sealed area of ​​the target image.

[0022] Optionally, when there is foreign matter in the non-plastic-sealed area of ​​the target image, the method further includes:

[0023] A shutdown instruction is sent to the switch component of the plastic packaging equipment to control the plastic packaging equipment to stop.

[0024] Optionally, when there is foreign matter in the non-plastic-sealed area of ​​the target image, the method further includes:

[0025] Send an alarm instruction to the alarm device so that the alarm device issues an alarm message.

[0026] Optionally, also include:

[0027] The target image and the judgment result are sent to a display device.

[0028] Optionally, comparing the target image with a standard image to determine whether there is a foreign object in the non-plastic-sealed area of ​​the target image includes:

[0029] Positioning the frame connecting ribs of the lead frame to be plastic-encapsulated in the target image to determine the non-plastic-encapsulated area;

[0030] The non-plastic-sealed area in the target image is compared with the standard image to determine whether there is foreign matter in the non-plastic-sealed area.

[0031] A semiconductor encapsulation system provided in the present application includes an encapsulation device and a foreign object detection device, wherein the foreign object detection device includes an image collector and a controller; the image collector is used to collect a target image of a lead frame to be encapsulated in a loading area; the loading area is located in the encapsulation device; the controller is used to preset a standard image and compare the target image with the standard image to determine whether there is a foreign object in a non-encapsulation area of ​​the target image.

[0032] It can be seen that the semiconductor encapsulation system in this application includes encapsulation equipment and a foreign object detection device. The image collector in the foreign object detection device can capture the target image of the lead frame to be encapsulated when it is in the loading area, that is, it captures the image of the lead frame to be encapsulated before encapsulation. The controller compares and analyzes the target image of the lead frame to be encapsulated before encapsulation with the standard image to identify whether there are foreign objects in the non-encapsulated area. The foreign object detection process is completed automatically without manual labor, which can save labor costs. At the same time, the detection process will not make any contact with the lead frame to be encapsulated, and will not cause other abnormalities in the lead frame to be encapsulated during detection.

[0033] In addition, the present application also provides a foreign body detection method having the above advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0035] FIG1 is a structural schematic diagram 1 of a semiconductor plastic packaging system provided in an embodiment of the present application;

[0036] FIG2 is a schematic diagram of an image of a lead frame to be encapsulated provided in an embodiment of the present application when the lead frame is an NG product;

[0037] FIG3 is a schematic diagram of an image of a lead frame to be encapsulated provided by an embodiment of the present application when the lead frame is of good quality;

[0038] FIG4 is a second structural diagram of a semiconductor plastic packaging system provided in an embodiment of the present application;

[0039] FIG5 is a flow chart 1 of a foreign body detection method applied to a semiconductor plastic packaging system provided by an embodiment of the present application;

[0040] FIG6 is a second flow chart of a foreign body detection method applied to a semiconductor plastic packaging system provided by an embodiment of the present application;

[0041] FIG7 is a schematic diagram of a target image of a lead frame to be plastic-encapsulated provided in an embodiment of the present application;

[0042] In the figure, 1. Plastic sealing equipment, 2. Foreign matter detection device, 21. Image collector, 22. Controller, 3. Alarm. DETAILED DESCRIPTION

[0043] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments. Obviously, the embodiments described are only a part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making any creative efforts are within the scope of protection of the present application.

[0044] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0045] As mentioned in the background technology section, currently, lead frames that are plastic-encapsulated are inspected manually to remove those with foreign matter on the surface. This manual inspection method increases labor costs and can cause more damage if the inspection is not done properly.

[0046] In view of this, the present application provides a semiconductor plastic packaging system. Please refer to FIG1 . The system includes:

[0047] Plastic packaging equipment 1 and foreign matter detection device 2, the foreign matter detection device 2 includes an image collector 21 and a controller 22;

[0048] The image collector 21 is used to collect the target image of the lead frame to be encapsulated in the loading area; the loading area is located in the encapsulation device 1;

[0049] The controller 22 is used to preset a standard image, and compare the target image with the standard image to determine whether there is a foreign object in the non-plastic-sealed area of ​​the target image.

[0050] The structure of the plastic packaging device 1 in this embodiment can refer to the plastic packaging device 1 for plastic packaging a lead frame in the related art, and will not be described in detail in this embodiment.

[0051] Image collector 21 can be disposed in the loading area of ​​the encapsulation device 1. The loading area of ​​the encapsulation device 1 includes a loading track on which the lead frame to be encapsulated is placed. Image collector 21 can be a camera, video camera, or other device capable of capturing images, and is not specifically limited in this embodiment.

[0052] In order to improve the accuracy of foreign body detection, the resolution of the image collector 21 is above 20 million pixels, and the detection accuracy can reach 0.1×0.1 mm.

[0053] The image collector 21 can transmit the captured target image to the controller 22. The target image can be transmitted wirelessly or via a wired transmission method. When wireless transmission is used, the image collector 21 can be integrated with a wireless transmission component. Alternatively, the foreign object detection device 2 can further include a wireless transmission component, which is connected to the image collector 21 and the controller 22 respectively. The wireless transmission component can be a Bluetooth transmission component, a WiFi transmission component, or the like.

[0054] The controller 22 includes but is not limited to a single chip microcomputer and an MCU (Microcontroller Unit).

[0055] As an implementation method, the controller 22 compares the target image of the lead frame to be encapsulated with the standard image in the following process:

[0056] The frame connecting ribs of the lead frame to be plastic-encapsulated are located in the target image of the lead frame to be plastic-encapsulated to determine the non-plastic-encapsulated area; the non-plastic-encapsulated area in the target image is compared with the standard image to determine whether there is foreign matter in the non-plastic-encapsulated area.

[0057] That is, the controller selects a non-molded area from the target image and compares it with the standard image.

[0058] Before positioning the frame connecting ribs in the target image of the lead frame to be plastic-encapsulated, the method may further include: visual positioning to determine the lead frame to be plastic-encapsulated in the image.

[0059] As another possible implementation, the process in which the controller 22 compares the target image of the lead frame to be plastic-encapsulated with the standard image includes: the controller is configured to compare the target image with the non-plastic-encapsulated area in the standard image.

[0060] The standard image is an image when there is no foreign matter (such as offset, scattered chips, contamination, etc.) on the lead frame.

[0061] As an implementation method, the semiconductor plastic packaging system may further include:

[0062] The display device connected to the controller 22 is used to display the target image and the judgment result.

[0063] There are two judgment results: one is that there is foreign matter on the lead frame to be plastic-sealed, and the other is that there is no foreign matter on the lead frame to be plastic-sealed.

[0064] When there is foreign matter on the lead frame to be plastic-sealed, as shown in FIG2 , there is foreign matter in the box in FIG2 , and the lead frame to be plastic-sealed is a no-good (NG) product. When there is no foreign matter on the lead frame to be plastic-sealed, as shown in FIG3 , the lead frame to be plastic-sealed is a good product.

[0065] The semiconductor encapsulation system in this embodiment includes an encapsulation device 1 and a foreign object detection device 2. An image acquisition device 21 in the foreign object detection device 2 captures a target image of the lead frame to be encapsulated while it is in the loading area, i.e., captures an image of the lead frame before encapsulation. A controller 22 compares and analyzes the target image of the lead frame before encapsulation with a standard image to identify the presence of foreign objects in the non-encapsulated area. The foreign object detection process is automated, requiring no manual effort, thus saving labor costs. Furthermore, the detection process does not involve any contact with the lead frame, preventing any abnormalities in the lead frame during detection.

[0066] Based on the above embodiments, in one embodiment of the present application, the controller 22 is connected to the switch component of the laminating device 1. When there is foreign matter in the non-laminated area of ​​the target image, the controller 22 is also used to send a shutdown command to the switch component to control the laminating device 1 to stop.

[0067] The controller 22 can communicate with the switch components of the molding equipment 1. When there are foreign objects on the lead frame to be molded, the controller 22 can control the molding equipment 1 to automatically shut down so that the staff can handle the lead frame to be molded with foreign objects, remove the foreign objects, and ensure that the mold will not be crushed.

[0068] Referring to FIG. 4 , based on any of the above embodiments, in one embodiment of the present application, the semiconductor plastic packaging system may further include:

[0069] The alarm device 3 connected to the controller 22 is used to receive an alarm instruction from the controller 22 and issue an alarm message when there is a foreign object in the non-plastic-sealed area of ​​the target image.

[0070] It should be noted that the alarm 3 in this embodiment can be an additional alarm 3, or can be an alarm 3 installed on the semiconductor plastic packaging system.

[0071] The alarm 3 can be any one of a sound alarm, a light alarm, and a text alarm, or any combination thereof.

[0072] In this embodiment, when there is foreign matter on the lead frame to be processed, the controller 22 controls the alarm 3 to issue an alarm message to promptly notify the staff that there is foreign matter on the lead frame to be processed, and then the lead frame to be processed with foreign matter in the loading area is processed to remove the foreign matter and ensure that the mold is not crushed.

[0073] Referring to FIG5 , the present application further provides a method for detecting foreign matter before semiconductor plastic packaging, the method comprising:

[0074] Step S101: acquiring a target image of a lead frame to be plastic-encapsulated located in a loading area of ​​a plastic-encapsulation device.

[0075] In this embodiment, the method for obtaining the target image positioning of the lead frame to be encapsulated is not limited and may be determined according to the circumstances. For example, the method may be obtained by wired means or wireless means. The wireless means include but are not limited to Bluetooth transmission and WiFi transmission.

[0076] In this embodiment, the target image of the lead frame to be encapsulated in the loading area is collected and inspected before encapsulation, without the need for separate equipment and processes.

[0077] Step S102: Compare the target image with a standard image to determine whether there is foreign matter in the non-plastic-sealed area of ​​the target image.

[0078] The standard image is an image when there is no foreign matter (such as offset, scattered chips, contamination, etc.) on the lead frame.

[0079] As an implementation method, comparing the target image with a standard image to determine whether there is a foreign object in the non-plastic-sealed area of ​​the image includes:

[0080] Positioning the frame connecting ribs of the lead frame to be plastic-encapsulated in the target image to determine the non-plastic-encapsulated area;

[0081] The non-plastic-sealed area in the target image is compared with the standard image to determine whether there is foreign matter in the non-plastic-sealed area.

[0082] The lead frame to be encapsulated is fixed, and determining the position of the frame connecting ribs also determines the position of the non-encapsulated area, that is, the position of the detection area on the lead frame to be encapsulated.

[0083] As shown in FIG7 , the lead frame 4 includes a chip 41 and frame connecting ribs 42 . The area where the chip 41 is located is a non-detection area, while other areas except the non-detection area are detection areas.

[0084] Before positioning the frame connecting ribs in the target image of the lead frame to be plastic-encapsulated, the method may further include: visual positioning to determine the lead frame to be plastic-encapsulated in the image.

[0085] The Golden Unit model can be used to compare the target image with the standard image to determine whether there are foreign objects in the non-plastic-sealed area of ​​the target image. This model can comprehensively compare foreign objects outside the cavity to prevent missed detection.

[0086] As an implementable embodiment, the foreign body detection method may further include:

[0087] The target image and the judgment result are sent to a display device.

[0088] The foreign object detection method in this embodiment captures a target image of the lead frame to be encapsulated while it is in the loading area. This image is then compared and analyzed with a standard image to identify the presence of foreign objects in the non-encapsulated area. This foreign object detection process is automated, requiring no manual effort, thus saving labor costs. Furthermore, the detection process does not involve any contact with the lead frame to be encapsulated, preventing any abnormalities from being detected.

[0089] Based on the above embodiment, in one embodiment of the present application, when there is a foreign object in the non-plastic-sealed area of ​​the target image, the method may further include:

[0090] A shutdown instruction is sent to the switch component of the plastic packaging equipment to control the plastic packaging equipment to stop.

[0091] After the plastic packaging equipment is shut down, the staff will handle the lead frame to be plastic packaged that contains foreign objects, remove the foreign objects, and ensure that the mold will not be damaged.

[0092] Based on any of the above embodiments, in one embodiment of the present application, referring to FIG6 , a foreign matter detection method includes:

[0093] Step S201: Acquire a target image of a lead frame to be encapsulated located in a loading area of ​​an encapsulation device.

[0094] Step S202: Compare the target image with a standard image to determine whether there is foreign matter in the non-plastic-sealed area of ​​the target image.

[0095] Step S203: sending the target image and the judgment result to a display device.

[0096] Step S204: When there is a foreign object in the non-molding area of ​​the target image, a shutdown instruction is sent to the switch component of the molding device to control the molding device to stop.

[0097] Step S205: When there is a foreign object in the non-plastic-sealed area of ​​the target image, an alarm instruction is sent to the alarm device, so that the alarm device issues an alarm message.

[0098] In this embodiment, the type of alarm information is not limited and depends on the situation. For example, the alarm information can be any one of sound alarm information, light alarm information, and text alarm information, or any combination thereof.

[0099] It should be noted that the order of step S204 and step S205 can be interchanged.

[0100] In this embodiment, when there is foreign matter on the lead frame to be processed, the alarm is controlled to send out an alarm message to promptly notify the staff that there is foreign matter on the lead frame to be processed, and then the lead frame to be processed with foreign matter in the loading area is processed to remove the foreign matter and ensure that the mold is not crushed.

[0101] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0102] The semiconductor plastic packaging system and foreign body detection method provided by this application are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of this application. The description of the above embodiments is only intended to help understand the method and core concept of this application. It should be noted that for those skilled in the art, without departing from the principles of this application, various improvements and modifications can be made to this application, and such improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. A semiconductor plastic packaging system, characterized in that: It includes a plastic sealing device and a foreign matter detection device, wherein the foreign matter detection device includes an image collector and a controller; The image collector is used to collect the target image of the lead frame to be encapsulated in the loading area; the loading area is located in the encapsulation equipment; The controller is used to preset a standard image, and compare the target image with the standard image to determine whether there is a foreign object in the non-plastic sealing area of ​​the target image.

2. The semiconductor plastic packaging system according to claim 1, characterized in that: The controller is used for selecting a non-plastic-sealed area from the target image and comparing it with the standard image.

3. The semiconductor plastic packaging system according to claim 1, characterized in that: The controller is used for comparing the target image with the non-plastic-sealed area in the standard image.

4. The semiconductor plastic packaging system according to claim 1, characterized in that: The controller is connected to the switch component of the plastic packaging device. When there is a foreign object in the non-plastic packaging area of ​​the target image, the controller is also used to send a shutdown instruction to the switch component to control the plastic packaging device to stop.

5. The semiconductor plastic packaging system according to claim 1, characterized in that: Also includes: An alarm connected to the controller is used to receive an alarm instruction from the controller and send out an alarm message when there is a foreign object in the non-plastic-sealed area of ​​the target image.

6. The semiconductor plastic packaging system according to claim 1, characterized in that: Also includes: A display device connected to the controller is used to display the target image and the judgment result.

7. The semiconductor plastic packaging system according to any one of claims 1 to 6, characterized in that: The resolution of the image collector is above 20 million pixels.

8. A method for detecting foreign matter before semiconductor plastic packaging, characterized in that: include: Acquire a target image of a lead frame to be encapsulated located in a feeding area of ​​an encapsulation device; The target image is compared with a standard image to determine whether there is a foreign object in the non-plastic sealing area of ​​the target image.

9. The foreign body detection method according to claim 8, characterized in that: When there is a foreign object in the non-plastic sealing area of ​​the target image, the method further includes: A shutdown command is sent to the switch component of the plastic packaging device to control the plastic packaging device to shut down.

10. The foreign matter detection method according to claim 8, characterized in that: When there is a foreign object in the non-plastic sealing area of ​​the target image, the method further includes: Send an alarm instruction to the alarm so that the alarm sends out an alarm message.

11. The foreign body detection method according to claim 8, characterized in that: Also includes: The target image and the judgment result are sent to a display device.

12. The foreign matter detection method according to any one of claims 8 to 11, characterized in that: Comparing the target image with the standard image and determining whether there is a foreign object in the non-plastic-sealed area of ​​the target image includes: Positioning the frame connecting ribs of the lead frame to be plastic-encapsulated in the target image to determine the non-plastic-encapsulated area; The non-plastic-sealed area in the target image is compared with the standard image to determine whether there is a foreign object in the non-plastic-sealed area.

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