Electronic device comprising speaker

Abstract

An electronic device according to one embodiment of the present disclosure comprises: a vibration unit for generating a sound; and a conduit unit which is formed on the front surface of the vibration unit, and which is the space through which the sound generated by the vibration unit is transmitted, wherein the conduit unit includes: a radiation opening for transmitting the sound to the outside of the electronic device; a first tube, which is connected to the radiation opening at one end thereof and extends a first length; and a second tube, which is connected to the first tube at the other end of the first tube, extends a second length in the direction opposite to that of the radiation opening, and is shaped to have a closed end, and the second length can be determined on the basis of the first length and a third length, which is the length from the center of the vibration unit to the other end of the first tube.

Description

Electronic devices containing speakers

[0001] The present disclosure relates to an electronic device including a speaker.

[0002] An electronic device (e.g., a speaker device) may include a conduit portion arranged in front of a vibrating portion (e.g., a speaker unit). Sound generated by the vibrating portion may be radiated to the side of the electronic device through the conduit portion.

[0003] The sound pressure level (SPL) generated by a vibrating unit can vary depending on changes in the frequency of the vibrating unit. Depending on the changes in the frequency of the vibrating unit, the sound pressure level may include local peaks and valleys.

[0004] To improve the low-frequency acoustic performance of electronic devices (e.g., speaker devices), a relatively large vibrating element (e.g., speaker unit) may be included. As the size of the vibrating element increases, the distance from the center to the edge of the vibrating element may increase. As the distance from the center to the edge of the vibrating element increases, the sound quality of the electronic device may deteriorate due to localized drops in the sound pressure level.

[0005] Therefore, a structure may be required that can reduce the performance degradation of electronic devices (e.g., speaker devices) that include a relatively large-sized vibrating part.

[0006] An electronic device according to one embodiment of the present disclosure includes a vibration unit that generates sound and a conduit formed on a front surface of the vibration unit and being a space through which sound generated from the vibration unit is transmitted, the conduit includes a radiation opening for transmitting sound to the outside of the electronic device, a first tube connected to the radiation opening at one end and extending to a first length, and a second tube connected to the first tube at the other end of the first tube, extending to a second length in a direction opposite to the radiation opening, and having a closed end, wherein the second length can be determined based on the first length and a third length that is a length from the center of the vibration unit to the other end of the first tube.

[0007] An electronic device according to one embodiment of the present disclosure includes a vibrating part that generates sound, a supporting part that surrounds the vibrating part, a cover that is arranged to be spaced apart from the vibrating part, and a conduit part formed by the cover and the supporting part, wherein the conduit part may include a radiating opening for transmitting sound to the outside of the electronic device, a first tube that is connected to the radiating opening at one end and extends to a first length, and a second tube that is connected to the first tube at the other end of the first tube, extends to a second length in a direction opposite to the radiating opening, and has a closed end.

[0008] An electronic device according to one embodiment of the present disclosure may include a separate closed tube to improve the acoustic performance of the electronic device.

[0009] An electronic device according to one embodiment of the present disclosure can eliminate second peaks and dips in sound pressure level according to frequency changes of a vibrating part by including a separate closed tube.

[0010] An electronic device according to one embodiment of the present disclosure can utilize various frequency bands by eliminating second peaks and dips in sound pressure levels, thereby further improving the acoustic performance of the electronic device.

[0011] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0012] FIGS. 2A, 2B, and 2C are diagrams illustrating an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 3 is a drawing showing a vibration unit and a conduit unit in a cross-section perpendicular to the width direction of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 4 is a drawing showing a vibration unit and a conduit unit according to one embodiment of the present disclosure in a cross-section perpendicular to the height direction of the electronic device.

[0015] FIG. 5 is a diagram illustrating an electronic device according to one embodiment of the present disclosure.

[0016] FIGS. 6A, 6B, and 6C are diagrams illustrating an electronic device according to one embodiment of the present disclosure.

[0017] FIG. 7 is a drawing showing a vibration unit and a conduit unit according to one embodiment of the present disclosure.

[0018] FIGS. 8A and 8B are diagrams illustrating an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 9A and FIG. 9B are diagrams showing an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 10 is a drawing showing an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 11 is a drawing showing an electronic device according to one embodiment of the present disclosure.

[0022] FIG. 12 is a graph showing the sound pressure level of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100), according to one embodiment. Referring to FIG. 1 , in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0024] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0025] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0026] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0027] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0028] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0029] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0030] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0031] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0032] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0033] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0034] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0035] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0036] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0037] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0038] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0039] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0040] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0041] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0042] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0043] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0044] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0045] FIG. 2a, FIG. 2b and FIG. 2c are drawings showing an electronic device (200) according to one embodiment of the present disclosure.

[0046] The electronic device (200) of FIGS. 2A, 2B, and 2C may include at least some of the components of the electronic device (101) of FIG. 1.

[0047] An electronic device (200) according to one embodiment of the present disclosure may include a support member (210), a vibrating member (220), a conduit member (230), an adhesive member (240), and / or a cover (250).

[0048] In describing an electronic device (200) according to one embodiment of the present disclosure, the width direction of the electronic device (200) may mean the X-axis direction, and the length direction of the electronic device (200) may mean the Y-axis direction. The height direction of the electronic device (200) may mean the Z-axis direction.

[0049] In one embodiment, the electronic device (200) may refer to a speaker device, a speaker module, and / or a speaker system, or may include a speaker device, a speaker module, and / or a speaker system. For example, the electronic device (200) illustrated in FIGS. 2A, 2B, and 2C may be a speaker device that serves to output an acoustic signal.

[0050] In one embodiment, the vibrating unit (220) may be a configuration that generates sound through vibration. For example, the vibrating unit (220) may refer to a speaker unit that generates sound, or may include a speaker unit.

[0051] Referring to FIG. 2a, the vibrating part (220) may be placed inside the supporting part (210). For example, the vibrating part (220) may be at least partially surrounded by the supporting part (210).

[0052] In one embodiment, the support member (210) may include a mounting member (211). Referring to FIG. 2A, the mounting member (211) may be formed in a shape that surrounds the outer periphery of the vibrating member (220).

[0053] Referring to FIG. 2B, an adhesive member (240) may be placed on the mounting portion (211) of the support member (210). The adhesive member (240) may serve to attach the cover (250) to the support member (210). The adhesive member (240) may include an adhesive material (e.g., bond or double-sided tape).

[0054] Referring to FIG. 2c, a cover (250) can be placed on a support (250). The cover (250) can be coupled to the support (210) by an adhesive member (240).

[0055] In one embodiment, at least a portion of the conduit (230) may be formed in the front direction of the vibrating unit (220). The front direction of the vibrating unit (220) may mean a direction facing the positive z-axis direction in the vibrating unit (220). In one embodiment, the conduit (230) may be a space through which sound generated from the vibrating unit (220) is transmitted.

[0056] In one embodiment, the conduit (230) may be formed by the support (210) and the cover (250). For example, the conduit (230) may be a space that is at least partially surrounded by the support (210) and the cover (250).

[0057] In one embodiment, the conduit section (230) may include a radiating opening (235) at one end. Sound generated from the vibrating section (220) may be transmitted to the outside of the electronic device (200) through the radiating opening (235).

[0058] In one embodiment, the radiating aperture (235) may be formed on a side surface of the electronic device (200). The side surface of the electronic device (200) may be a surface facing the width direction (e.g., X-axis direction) or the length direction (Y-axis direction) of the electronic device (200).

[0059] In one embodiment, the electronic device (200) illustrated in FIGS. 2A, 2B, and 2C may be a component of another electronic device (e.g., the electronic device (101) of FIG. 1). For example, the electronic device (200) illustrated in FIGS. 2A, 2B, and 2C may refer to an audio output module (155, see FIG. 1) included in the electronic device (101) of FIG. 1. According to one embodiment, the electronic device (200) may be placed inside another electronic device (101, see FIG. 1).

[0060] When an electronic device (200) according to one embodiment corresponds to a part of another electronic device (101, see FIG. 1), some of the components of the electronic device (200) may include parts of the components of the other electronic device (101, see FIG. 1). For example, the cover (250) of the electronic device (200) illustrated in FIG. 2c may include a part of a display (e.g., a display module (160) of FIG. 1) and / or a support bracket (not illustrated) of the other electronic device (101, see FIG. 1).

[0061] FIG. 3 and FIG. 4 are drawings showing a vibration unit (220) and a conduit unit (230) according to one embodiment of the present disclosure.

[0062] FIG. 3 may be a drawing showing a vibrating unit (220) and a conduit unit (230) as viewed from the A-A' cross-section of FIG. 2c (e.g., a cross-section perpendicular to the width direction of the electronic device (200)). For example, FIG. 3 may be a conceptual diagram corresponding to the vibrating unit (220) and the conduit unit (230) as viewed from the A-A' cross-section of FIG. 2c.

[0063] FIG. 4 may be a drawing showing a vibrating unit (220) and a conduit unit (230) as viewed from the B-B' cross-section of FIG. 2c (e.g., a cross-section perpendicular to the height direction of the electronic device (200)). For example, FIG. 4 may be a conceptual diagram corresponding to the vibrating unit (220) and the conduit unit (230) as viewed from the B-B' cross-section of FIG. 2c.

[0064] In one embodiment, the vibrating portion (220) may be arranged to overlap at least a portion of the conduit portion (230). For example, referring to FIGS. 3 and 4 , the conduit portion (230) may be arranged in one direction of the vibrating portion (220). For example, the conduit portion (230) may be arranged in the positive Z-axis direction with respect to the vibrating portion (220).

[0065] Referring to FIG. 4, the conduit (230) is illustrated as being directly disposed on one side of the vibrating portion (220), but this is exemplary, and other configurations may be disposed between the vibrating portion (220) and the conduit (230). For example, at least a portion of the support portion (210) may be disposed between the vibrating portion (220) and the conduit portion (230), and the vibration of the vibrating portion (220) may be transmitted to the conduit portion (230) through the support portion (210).

[0066] In one embodiment, the conduit section (230) may include a first conduit (231), a second conduit (232), and / or a radiating opening (235).

[0067] In one embodiment, the first tube (231) and the second tube (232) may include a space through which sound generated from the vibrating unit (220) moves.

[0068] In one embodiment, a radiating opening (235) may be formed at one end of the conduit portion (230). For example, referring to FIG. 3, the radiating opening (235) may be formed at the negative Y-axis direction end of the conduit portion (230).

[0069] In one embodiment, one end of the first pipe (231) may mean an end facing in the negative Y-axis direction in the first pipe (231). The other end of the first pipe (231) may mean an end facing in the positive Y-axis direction in the first pipe (231).

[0070] In one embodiment, the first tube (231) may be connected to a radiating opening (235) at one end.

[0071] In one embodiment, the first tube (231) may extend along the longitudinal direction (e.g., the Y-axis direction) of the electronic device (200). The first tube (231) may extend by a first length (L1) in the longitudinal direction of the electronic device (200).

[0072] In one embodiment, the first pipe (231) may be connected to the second pipe (232). For example, the other end of the first pipe (231) may be connected to the second pipe (232).

[0073] In one embodiment, the second tube (232) may extend along the longitudinal direction (e.g., Y-axis direction) of the electronic device (200). The second tube (232) may extend a second length (L2) in a direction opposite to the direction in which the radiating opening (235) is located with respect to the first tube (231).

[0074] In one embodiment, the second tube (232) may be a closed tube having a closed end. For example, the end (232a) of the second tube (232) facing opposite to the first tube (231) may be formed in a closed form.

[0075] In one embodiment, the center line (M) of the vibrating unit (220) may mean an imaginary line that passes through a point located at the center in the longitudinal direction (e.g., Y-axis direction) of the vibrating unit (220) and extends in the height direction (e.g., Z-axis direction). A third length (L3) may be provided from the center line (M) of the vibrating unit (220) to the other end of the first tube (231).

[0076] In one embodiment, the second length (L2) may be determined based on the first length (L1) and the third length (L3). For example, the second length (L2) may be formed as a length within the range of [Mathematical Formula 1].

[0077] [Mathematical Formula 1]

[0078]

[0079] In one embodiment, the first effective length (L1e) may be a length determined based on the shape of the conduit section (230) and / or the end correction effect by the radial opening (235). For example, the first effective length (L1e) may be derived by [Mathematical Formula 2].

[0080] [Equation 2]

[0081]

[0082] In [Mathematical Formula 2], c may represent the sound speed of the medium, and f_peak may represent the second peak frequency measurement value. The sound speed (c) of the medium may represent the speed of sound in the medium (e.g., air) located inside the conduit section (230). In [Mathematical Formula 2], the second peak frequency measurement value (f_peak) may represent the measurement value of the frequency at which the second peak (e.g., 1201b) shown in FIG. 12 appears.

[0083] In an electronic device (200) according to one embodiment, when the second length (L2) is formed to satisfy [Mathematical Expression 1] and [Mathematical Expression 2], the second peak (1201b, see FIG. 12) and / or the drop point (1201c, see FIG. 12) in the graph (1200) illustrated in FIG. 12 are removed, and the acoustic performance of the electronic device (200) can be improved.

[0084] In one embodiment, the second tube (232) may have a predetermined height and extend in the width direction (e.g., in the X-axis direction) of the electronic device (200). For example, the second tube (232) may have a first height (H1) and extend in the width direction (e.g., in the X-axis direction) of the electronic device (200) by a second width (W2).

[0085] FIG. 5 is a drawing showing an electronic device (500) according to one embodiment of the present disclosure.

[0086] FIG. 5 may be a cross-sectional perspective view showing an electronic device (500) according to one embodiment of the present disclosure after cutting in a direction perpendicular to the width direction (e.g., X-axis direction) of the electronic device (500).

[0087] The electronic device (500) of FIG. 5 may be substantially identical to the electronic device (200) illustrated in FIGS. 2A, 2B, and 2C. For example, the electronic device (500) of FIG. 5 may refer to the electronic device (200) of FIG. 2C, or may include at least a portion of the electronic device (200).

[0088] In one embodiment, the electronic device (500) may include a support (510), a vibrating member (520), a conduit member (530), and / or a cover (550). The support (510), the vibrating member (520), the conduit member (530), and the cover (550) of the electronic device (500) of FIG. 5 may have substantially the same functions as the support (210), the vibrating member (220), the conduit member (230), and the cover (250) of FIGS. 2A, 2B, and 2C, respectively.

[0089] In describing an electronic device (500) according to one embodiment of the present disclosure, the width direction of the electronic device (500) may mean the X-axis direction, and the length direction of the electronic device (500) may mean the Y-axis direction. The height direction of the electronic device (500) may mean the Z-axis direction.

[0090] In one embodiment, the conduit (530) may include a first conduit (531), a second conduit (532), and / or a radiating opening (535).

[0091] In one embodiment, a radiating opening (535) may be positioned at one end of the first tube (531), and a second tube (532) may be positioned at the other end of the first tube (531).

[0092] In one embodiment, the second tube (532) may be a closed tube having a closed end. For example, referring to FIG. 5, the end (532a) of the second tube (532) may be formed in a closed form.

[0093] In one embodiment, the first tube (531) and the second tube (532) may be spaces surrounded by a support (510) and a cover (550).

[0094] In one embodiment, the heights of the first tube (531) and the second tube (532) may be formed differently. For example, the first tube (531) may be extended longer than the second tube (532) in the height direction (e.g., Z-axis direction) of the electronic device (500).

[0095] In one embodiment, the cover (550) may include a bend region (552). For example, the bend region (552) may be a region in which the cover (550) bends and extends. In one embodiment, the bend region (552) may be formed at a distal end of the first tube (531). For example, the bend region (552) may be formed at a portion that overlaps a boundary between the first tube (531) and the second tube (532).

[0096] In one embodiment, the bending region (552) of the cover (550) may be configured to secure a reinforcing structure (e.g., a stainless steel plate (not shown)) to one surface of the cover (550). For example, the reinforcing structure (not shown) may be disposed on one surface of the cover (550) (e.g., a surface facing the positive z-axis direction of the cover (550), and at least a portion of the reinforcing structure (not shown) may be secured to the bending region (552) to maintain a fixed position.

[0097] In FIG. 5, the cover (550) is illustrated as being bent and extended at least in a portion including a bending region (552), but this is exemplary, and the shape of the cover (550) may not be limited thereto. For example, the cover (550) may be formed so as to not include a bending region (552), not be bent, and extend in a direction substantially perpendicular to a plane that is substantially perpendicular to the height direction of the electronic device (500). When the cover (550) does not include a bending region (552) and extends parallel to a plane that is substantially perpendicular to the height direction of the electronic device (500), the first tube (531) and the second tube (532) may extend to substantially the same length based on the height direction (e.g., Z-axis direction) of the electronic device (500).

[0098] FIG. 6a, FIG. 6b, and FIG. 6c are drawings showing an electronic device (600) according to one embodiment of the present disclosure.

[0099] The electronic device (600) of FIGS. 6A, 6B, and 6C may include at least a portion of the electronic device (200) of FIG. 2C.

[0100] An electronic device (600) according to one embodiment of the present disclosure may include a support portion (610), a vibrating portion (620), a conduit portion (630), an adhesive member (640), and / or a cover (650). The support portion (610), the vibrating portion (620), the conduit portion (630), the adhesive member (640), and the cover (650) of the electronic device (600) of FIG. 6 may have substantially the same functions as the support portion (210), the vibrating portion (220), the conduit portion (230), the adhesive member (240), and the cover (250) of FIGS. 2A, 2B, and 2C, respectively.

[0101] In describing an electronic device (600) according to one embodiment of the present disclosure, the width direction of the electronic device (600) may mean the X-axis direction, and the length direction of the electronic device (600) may mean the Y-axis direction. The height direction of the electronic device (600) may mean the Z-axis direction.

[0102] Referring to FIG. 6A, the vibrating portion (620) may be positioned inside the supporting portion (610). For example, the vibrating portion (620) may be at least partially surrounded by the supporting portion (610).

[0103] In one embodiment, the support member (610) may include a mounting member (611). The mounting member (611) may be formed in a shape that surrounds the outer periphery of the vibrating member (620).

[0104] In one embodiment, the conduit section (630) may include a first conduit (631), a second conduit (632), and / or a radiating opening (635).

[0105] Referring to FIG. 6A, the mounting portion (611) according to one embodiment may include a partition wall (6115). The partition wall (6115) may be a region of the mounting portion (611) extending in a direction toward the first tube (631).

[0106] In one embodiment, the conduit section (630) may include a plurality of second conduits (632). For example, referring to FIG. 6A, the conduit section (630) may include three second conduits (632). The plurality of second conduits (632) may be formed to be separated from each other by a partition wall (6115).

[0107] Referring to FIG. 6b, an adhesive member (640) may be placed on the mounting portion (611) of the support portion (610). The adhesive member (640) may serve to attach the cover (650) to the support portion (610).

[0108] Referring to FIG. 6c, a cover (650) can be placed on a support (610). The cover (650) can be coupled to the support (610) by an adhesive member (640).

[0109] Referring to FIG. 6B, for example, the adhesive member (640) may also be placed on the partition wall (6115) of the mounting portion (611). When the adhesive member (640) is also placed on the partition wall (6115), the cover (650) and the support portion (610) may be more strongly bonded compared to when the mounting portion (611) does not include the partition wall (6115).

[0110] In one embodiment, the support (610) may further facilitate supporting the cover (650) by including a bulkhead (6115). For example, the bulkhead (6115) may serve to support at least a portion of the cover (650).

[0111] In one embodiment, at least a portion of the conduit (630) may be formed in the front direction of the vibrating unit (620). The front direction of the vibrating unit (620) may mean a direction facing the positive Z-axis direction in the vibrating unit (620). In one embodiment, the conduit (630) may be a space through which sound generated from the vibrating unit (620) is transmitted.

[0112] In one embodiment, the conduit portion (630) may be formed by the support portion (610) and the cover (650). For example, the conduit portion (630) may be a space at least partially surrounded by the vibrating portion (620), the support portion (610), and the cover (650).

[0113] In one embodiment, the conduit (630) may include a radiating opening (635) at one end. Sound generated from the vibrating unit (620) may be transmitted to the outside of the electronic device (600) through the radiating opening (635). In one embodiment, the radiating opening (635) may be formed on a side surface of the electronic device (600). The side surface of the electronic device (600) may be a surface facing the width direction (e.g., X-axis direction) or the length direction (Y-axis direction) of the electronic device (600).

[0114] FIG. 7 is a drawing showing a vibration unit (620) and a conduit unit (630) according to one embodiment of the present disclosure.

[0115] Fig. 7 may be a drawing showing a vibrating part (620) and a conduit part (630) as viewed from the C-C' cross-section of Fig. 6c. For example, Fig. 7 may be a conceptual diagram corresponding to the vibrating part (620) and the conduit part (630) as viewed from the C-C' cross-section of Fig. 6c.

[0116] Referring to FIG. 7, a conduit section (630) according to one embodiment may include a first conduit (631), a second conduit (632), and / or a radiating opening (635).

[0117] In one embodiment, the first tube (631) may extend in the longitudinal direction (e.g., Y-axis direction) of the electronic device (600) by a fourth length (L4). The first tube (631) may extend in the width direction of the electronic device (600) by a third width (W3).

[0118] In one embodiment, the radiating opening (635) may be formed at one end of the first tube (631), and the second tube (632) may be formed at the other end of the first tube (631). In one embodiment, the second tube (632) may be formed at a position spaced apart from the center line (M) of the vibrating portion (620) by an eighth length (L8).

[0119] In one embodiment, the conduit (630) may include a plurality of second conduits (632). For example, the plurality of second conduits (632) may be spaced apart from each other in the width direction of the electronic device (600).

[0120] In one embodiment, the second pipe (632) may include a second-first pipe (632-1), a second-second pipe (632-2), and / or a second-third pipe (632-3).

[0121] In one embodiment, the second-first pipe (632-1) may have a fifth length (L5) and a fourth width (W4). The second-second pipe (632-2) may have a sixth length (L6) and a fifth width (W5). The second-third pipe (632-3) may have a seventh length (L7) and a sixth width (W6).

[0122] In one embodiment, the fifth length (L5) of the 2-1 pipe (632-1), the sixth length (L6) of the 2-2 pipe (632-2), and the seventh length (L7) of the 2-3 pipe (632-3) may be determined based on the fourth length (L4) and the eighth length (L8), respectively.

[0123] In one embodiment, the lengths and widths of the plurality of second pipes (632) may be formed in various ways. For example, the fifth length (L5) of the second-first pipe (632-1), the sixth length (L6) of the second-second pipe (632-2), and the seventh length (L7) of the second-third pipe (632-3) may be formed differently. For example, the fourth width (W4) of the second-first pipe (632-1), the fifth width (W5) of the second-second pipe (632-2), and the sixth width (W6) of the second-third pipe (632-3) may be formed differently.

[0124] In one embodiment, the width of the first pipe (631) may be formed to be greater than the sum of the widths of each of the plurality of second pipes (632). For example, the third width (W3) of the first pipe (631) may be formed to be greater than the sum of the fourth width (W4) of the second-first pipe (632-1), the fifth width (W5) of the second-second pipe (632-2), and the sixth width (W6) of the second-third pipe (632-3).

[0125] In one embodiment, the reflection coefficient of the second tube (L2) may vary based on the relative ratio of the sum of the fourth width (W4), the fifth width (W5), and the sixth width (W6) to the third width (W3). For example, the drop point (e.g., 1201c) of the graph (1200) illustrated in FIG. 12 may vary based on the value obtained by dividing the sum of the fourth width (W4), the fifth width (W5), and the sixth width (W6) by the third width (W3).

[0126] Referring to FIG. 7, on a plane substantially perpendicular to the height direction of the electronic device (600), each of the plurality of second tubes (632) is illustrated as having a rectangular cross-section; however, this is exemplary, and the cross-section of the second tubes (632) may not be limited thereto. For example, on a plane substantially perpendicular to the height direction of the electronic device (600), each of the plurality of second tubes (632) may be formed to have a cross-section that extends in a curved shape at least in a portion.

[0127] FIG. 8A and FIG. 8B are drawings showing an electronic device (800) according to one embodiment of the present disclosure.

[0128] The electronic device (800) of FIGS. 8A and 8B may be substantially identical to or similar to the electronic device (200) illustrated in FIG. 2C. For example, the electronic device (800) of FIGS. 8A and 8B may refer to the electronic device (200) of FIG. 2C or may include at least a portion of the electronic device (200) of FIG. 2C.

[0129] In describing an electronic device (800) according to one embodiment of the present disclosure, the width direction of the electronic device (800) may mean the X-axis direction, and the length direction of the electronic device (800) may mean the Y-axis direction. The height direction of the electronic device (800) may mean the Z-axis direction.

[0130] FIGS. 8A and 8B may be conceptual diagrams illustrating an electronic device (800) according to one embodiment, in a cross-section perpendicular to the width direction (e.g., x-axis direction) of the electronic device (800). For example, FIGS. 8A and 8B may be conceptual diagrams illustrating a cross-section of the electronic device (800) corresponding to the A-A' cross-section of the electronic device (200) of FIG. 2C.

[0131] Referring to FIGS. 8A and 8B , an electronic device (800) according to one embodiment may include a support portion (810), a vibrating portion (820), a conduit portion (830), and / or a cover (850). The support portion (810), the vibrating portion (820), the conduit portion (830), and the cover (850) of the electronic device (800) illustrated in FIGS. 8A and 8B may have substantially the same functions as the support portion (210), the vibrating portion (220), the conduit portion (230), and the cover (250) of FIGS. 2A , 2B, and 2C , respectively.

[0132] In one embodiment, the conduit (830) may be formed by a vibrating portion (820), a supporting portion (810), and a cover (850). For example, the conduit (830) may be a space that is at least partially surrounded by the vibrating portion (820), the supporting portion (810), and the cover (850).

[0133] In one embodiment, a cover (850) may be placed in one direction (e.g., positive Z-axis direction) with respect to the conduit section (830), and a vibrating section (820) and a support section (810) may be placed in the other direction (e.g., negative Z-axis direction).

[0134] In one embodiment, the conduit (830) may include a first conduit (831) and / or a second conduit (832). The first conduit (831) and the second conduit (832) may extend along the longitudinal direction (e.g., the Y-axis direction) of the electronic device (800). The first conduit (831) may be connected to a radiating opening (235, see FIG. 3) at one end and connected to the second conduit (832) at the other end. The second conduit (832) may be connected to the first conduit (831) and may be formed in a closed shape at an end (832a).

[0135] In one embodiment, the cover (850) may include a bend region (852, 854). The bend region (852, 854) may be a region in which the cover (850) bends and extends. In one embodiment, the bend region (852, 854) may include a first bend region (852) and / or a second bend region (854).

[0136] In one embodiment, the first bending region (852) may be formed at a position overlapping the distal end of the first tube (831) (e.g., the distal end from the first tube (831) toward the second tube (832). The cover (850) may be bent and extended at the first bending region (852) so that the height (e.g., the length in the Z-axis direction) of the second tube (832) may be formed to be smaller than the height of the first tube (831).

[0137] In one embodiment, the second bending region (832) may be formed at a position overlapping the end (832a) of the second tube (832).

[0138] In one embodiment, one side of the vibrating unit (820) may mean a side of the vibrating unit (820) that faces the conduit unit (830). In one embodiment, the side surface of the vibrating unit (820) may mean a side that is substantially perpendicular to the height direction (e.g., Z-axis direction) of the electronic device (800) in the vibrating unit (820).

[0139] Referring to FIG. 8a, the coupling surface (812) of the support member (810) according to one embodiment may be formed to face the side surface of the vibrating member (820).

[0140] Referring to FIG. 8B, the support member (810) according to one embodiment may include a fixed region (813). For example, the fixed region (813) may be a region in which a portion of the support member (810) extends to face one side of the vibrating member (820). In one embodiment, when the support member (810) includes the fixed region (813), the support member (810) may be more strongly coupled to the vibrating member (820).

[0141] Referring to FIG. 8A, a support member (810) according to one embodiment may not include a fixed region (813) and may be coupled with a vibrating member (820) at a coupling surface (812). When the support member (810) according to one embodiment does not include a separate fixed region (813), the thickness of the support member (810) (e.g., the length by which the support member (810) extends in the Z-axis direction) may be formed relatively thin.

[0142] In one embodiment, a support member (810) may be positioned in a lateral direction (e.g., in the positive Y-axis direction) of the vibrating member (820).

[0143] In one embodiment, the vibrating portion (820) and the supporting portion (810) may be bonded to each other at least in part. For example, referring to FIG. 8A, the coupling surface (812) of the supporting portion (810) may be bonded to a side surface of the vibrating portion (820) using a separate adhesive material (e.g., bond, double-sided tape). Referring to FIG. 8B, the fixing area (813) of the supporting portion (810) may be bonded to one surface of the vibrating portion (820) using a separate adhesive material (e.g., bond, double-sided tape).

[0144] In one embodiment, the vibrating portion (820) and the supporting portion (810) are bonded to each other at least in part, and the space between the vibrating portion (820) and the supporting portion (810) can be sealed. As the space between the vibrating portion (820) and the supporting portion (810) is sealed, sound generated from the vibrating portion (820) can travel along the conduit portion (830) and be transmitted to the outside of the electronic device (800) through the radiating opening (235, see FIG. 3).

[0145] FIG. 9A and FIG. 9B are diagrams illustrating an electronic device (900) according to one embodiment of the present disclosure.

[0146] The electronic device (900) of FIGS. 9A and 9B may be substantially identical to or similar to the electronic device (200) illustrated in FIG. 2C. For example, the electronic device (900) of FIGS. 9A and 9B may refer to the electronic device (200) of FIG. 2C or may include at least a portion of the electronic device (200) of FIG. 2C.

[0147] In describing an electronic device (900) according to one embodiment of the present disclosure, the width direction of the electronic device (900) may mean the X-axis direction, and the length direction of the electronic device (900) may mean the Y-axis direction. The height direction of the electronic device (900) may mean the Z-axis direction.

[0148] FIGS. 9A and 9B may be conceptual diagrams illustrating an electronic device (900) according to one embodiment, in a cross-section perpendicular to the width direction (e.g., x-axis direction) of the electronic device (900). For example, FIGS. 9A and 9B may be conceptual diagrams illustrating a cross-section of the electronic device (900) corresponding to the A-A' cross-section of the electronic device (200) of FIG. 2C.

[0149] Referring to FIG. 9A, an electronic device (900) according to one embodiment may include a first support portion (910), a vibrating portion (920), a conduit portion (930), and / or a second support portion (960).

[0150] Referring to FIG. 9A, a conduit section (930) according to one embodiment may be formed by a vibrating section (920), a first support section (910), and a second support section (920). For example, the conduit section (930) may be a space that is at least partially surrounded by the vibrating section (920), the first support section (910), and the second support section (960).

[0151] Referring to FIG. 9A, the second support portion (960) according to one embodiment may include a cover region (961) and / or a support region (962). The cover region (961) may be a region that covers the conduit portion (930) and extends in a direction substantially perpendicular to the height direction (e.g., Z-axis direction) of the electronic device (900). Referring to FIG. 9B, the support region (962) may be a region that is connected to the cover region (961) and extends in the height direction (e.g., Z-axis direction) of the electronic device (900). The support region (962) may be disposed on one surface of the first support portion (910).

[0152] Referring to FIG. 9A, in one embodiment, a cover area (961) may be arranged in one direction (e.g., positive z-axis direction) based on the second pipe (932) of the pipe section (930), and a vibrating section (920) and / or a first support section (910) may be arranged in another direction (e.g., negative z-axis direction) based on the second pipe (932) of the pipe section (930).

[0153] Referring to FIG. 9b, an electronic device (900) according to one embodiment may include a first support portion (910), a vibrating portion (920), a conduit portion (930), a cover (950), and / or a second support portion (960).

[0154] Referring to FIG. 9B, a conduit section (930) according to one embodiment may be formed by a vibrating section (920), a first support section (910), a cover (950), and a second support section (960). For example, the conduit section (930) may be a space that is at least partially surrounded by the vibrating section (920), the first support section (910), the cover (950), and the second support section (960).

[0155] Referring to FIG. 9B, the second support member (960) according to one embodiment may be formed separately from the cover member (950). For example, the second support member (960) may be formed separately from the cover member (950) and then coupled to the cover member (950). The second support member (960) may be disposed on one surface of the first support member (910).

[0156] Referring to FIG. 9B, a cover (950) according to one embodiment may include a connection region (955) at a distal end. The connection region (955) may be a region extending in an inclined direction from a surface of the cover (950) (e.g., a surface perpendicular to the Z-axis direction of the cover (950)) at the distal end of the cover (950). For example, the second support (960) and the cover (950) may be more strongly coupled through the connection region (955).

[0157] Referring to FIG. 9b, in one embodiment, a cover (950) may be placed in one direction (e.g., positive Z-axis direction) with respect to the conduit section (930), and a vibrating section (920) and a first support section (910) may be placed in another direction (e.g., negative Z-axis direction).

[0158] Referring to FIGS. 9A and 9B , in one embodiment, the conduit portion (930) may include a first conduit (931) and / or a second conduit (932). The first conduit (931) and the second conduit (932) may extend along the longitudinal direction (e.g., the y-axis direction) of the electronic device (900). The first conduit (931) may be connected to a radial opening (235, see FIG. 3 ) at one end and connected to the second conduit (932) at the other end. The second conduit (932) may be connected to the first conduit (931) and may be formed in a closed shape at an end (932a).

[0159] Referring to FIGS. 9A and 9B, the end (932a) of the second pipe (932) may be formed by the second support (960). For example, the second pipe (932) may be formed in a closed form at the end (932a) by the second support (960).

[0160] In one embodiment, the first support (910) of FIGS. 9A and 9B may include stainless steel (STS). For example, the first support (910) may be formed by processing stainless steel (STS).

[0161] In one embodiment, the second support (960) of FIGS. 9A and 9B may include a resin material. For example, the resin material may be processed through injection molding to form the second support (960).

[0162] In one embodiment, the cover (950) of FIG. 9B may include stainless steel (STS). For example, stainless steel (STS) may be processed to form the cover (950). In one embodiment, when the cover (950) of the electronic device (900) includes stainless steel, the thickness of the cover (950) may be formed relatively thin.

[0163] FIG. 10 is a drawing showing an electronic device (1000) according to one embodiment of the present disclosure.

[0164] The electronic device (1000) of FIG. 10 may be substantially identical to or similar to the electronic device (200) illustrated in FIG. 2C. For example, the electronic device (1000) of FIG. 10 may refer to the electronic device (200) of FIG. 2C or may include at least a portion of the electronic device (200) of FIG. 2C.

[0165] In describing an electronic device (1000) according to one embodiment of the present disclosure, the width direction of the electronic device (1000) may mean the X-axis direction, and the length direction of the electronic device (1000) may mean the Y-axis direction. The height direction of the electronic device (1000) may mean the Z-axis direction.

[0166] FIG. 10 may be a conceptual diagram illustrating an electronic device (1000) according to one embodiment of the present invention in a cross-section perpendicular to the width direction (e.g., x-axis direction) of the electronic device (1000). For example, FIG. 10 may be a conceptual diagram illustrating a cross-section of the electronic device (1000) corresponding to the A-A' cross-section of the electronic device (200) of FIG. 2C.

[0167] Referring to FIG. 10, an electronic device (1000) according to one embodiment may include a support portion (1010), a vibrating portion (1020), a conduit portion (1030), an adhesive member (1040), and / or a cover (1050). The support portion (1010), the vibrating portion (1020), the conduit portion (1030), the adhesive member (1040), and the cover (1050) of the electronic device (1000) illustrated in FIG. 10 may have substantially the same functions as the support portion (210), the vibrating portion (220), the conduit portion (230), the adhesive member (240), and the cover (250) of FIGS. 2A, 2B, and 2C, respectively.

[0168] Referring to FIG. 10, a conduit section (1030) according to one embodiment may be formed by a vibrating section (1020), a supporting section (1010), and a cover (1050). For example, the conduit section (1030) may be a space that is at least partially surrounded by the vibrating section (1020), the supporting section (1010), and the cover (1050).

[0169] Referring to FIG. 10, in one embodiment, a cover (1050) may be placed in one direction (e.g., positive Z-axis direction) based on the conduit section (1030), and a vibrating section (1020) may be placed in another direction (e.g., negative Z-axis direction).

[0170] Referring to FIG. 10, the cover (1050) can be coupled to at least a portion of the support (1010) via an adhesive member (1040). The support (1010) can include a mounting portion (1011) on which the adhesive member (1040) is disposed. The adhesive member (1040) is disposed on the mounting portion (1011) of the support (1010) and can couple the cover (1050) and the support (1010) to each other.

[0171] In one embodiment, the cover (1050) may have a configuration having a function other than forming the conduit portion (1030). For example, the cover (1050) may include a display (e.g., a display module (160), see FIG. 1) included in the electronic device (1000). When the cover (1050) includes a display, the cover (1050) may serve to visually display information to the outside of the electronic device (1000).

[0172] FIG. 11 is a drawing showing an electronic device (1100) according to one embodiment of the present disclosure.

[0173] The electronic device (1100) of FIG. 11 may be substantially the same as or similar to the electronic device (200) illustrated in FIG. 4. For example, the electronic device (1100) of FIG. 11 may refer to the electronic device (200) of FIG. 4 or may include at least a portion of the electronic device (200) of FIG. 4.

[0174] In describing an electronic device (1100) according to one embodiment of the present disclosure, the width direction of the electronic device (1100) may mean the X-axis direction, and the length direction of the electronic device (1100) may mean the Y-axis direction. The height direction of the electronic device (1100) may mean the Z-axis direction.

[0175] FIG. 11 may be a conceptual diagram illustrating an electronic device (1100) according to one embodiment of the present invention in a cross-section perpendicular to the height direction (e.g., Z-axis direction) of the electronic device (1100). For example, FIG. 11 may be a conceptual diagram illustrating a cross-section of the electronic device (1100) corresponding to the B-B' cross-section of the electronic device (200) of FIG. 2C.

[0176] In one embodiment, the electronic device (1100) may include a vibrating portion (1120) and / or a conduit portion (1130).

[0177] In one embodiment, the conduit section (1130) may include a first conduit (1131), a second conduit (1132), a third conduit (1133), and / or a radiating opening (1135).

[0178] In one embodiment, the vibrating member (1120) may be positioned to overlap the first tube (1131).

[0179] In one embodiment, the first center line (C1) may mean a line passing through the center of the vibrating unit (1120) (e.g., the center of the X-axis direction of the vibrating unit (1120)) along a direction parallel to the longitudinal direction (e.g., the Y-axis direction) of the electronic device (1100).

[0180] In one embodiment, the second center line (C2) may mean a line passing through the center of the radiating opening (1135) (e.g., the center of the radiating opening (1135) in the X-axis direction) along a direction parallel to the longitudinal direction (e.g., the Y-axis direction) of the electronic device (1100).

[0181] In one embodiment, the third tube (1133) may be formed to extend in a direction substantially perpendicular to the direction in which the second tube (1132) extends. For example, referring to FIG. 11, the second tube (1132) may extend in the Y-axis direction, and the third tube (1133) may extend in the X-axis direction.

[0182] In one embodiment, when the first center line (C1) and the second center line (C2) do not coincide, the shape of the conduit section (1130) may not be formed symmetrically with respect to the widthwise center line (e.g., the first center line (C1)) of the vibrating section (1120).

[0183] In one embodiment, when the first center line (C1) and the second center line (C2) do not coincide, the third pipe (1133) may extend from the first pipe (1131) in an opposite direction to the direction in which the second center line (C2) is located with respect to the first center line (C1). For example, referring to FIG. 11, since the second center line (C2) is located in the positive X-axis direction with respect to the first center line (C1), the third pipe (1133) may extend from the first pipe (1131) in the negative X-axis direction.

[0184] In one embodiment, the third tube (1133) may extend from the first tube (1131) by a ninth length (L9). In one embodiment, the distance from the center of the vibrating member (1120) to an end of the first tube (1131) (e.g., an end facing the negative X-axis direction of the first tube (1131)) may have a tenth length (L10).

[0185] When the first center line (C1) and the second center line (C2) do not coincide, it may be difficult for sound waves reflected from one side of the conduit (1130) (e.g., the side located in the positive X-axis direction of the conduit (1130)) and the other side (e.g., the side located in the negative X-axis direction of the conduit (1130)) to cancel each other out. According to one embodiment, the electronic device (1100) may include a third conduit (1133) so that sound waves reflected from one side and the other side of the conduit (1130) cancel each other out when the first center line (C1) and the second center line (C2) do not coincide.

[0186] FIG. 12 is a graph (1200) showing the sound pressure level of an electronic device (200) according to one embodiment of the present disclosure.

[0187] The horizontal axis of the graph (1200) illustrated in FIG. 12 may represent the frequency (e.g., hertz (Hz)) of the vibration unit (220) of the electronic device (200). The vertical axis of the graph illustrated in FIG. 12 may represent the sound pressure level (SPL) (e.g., decibel (dB)) generated from the vibration unit (220).

[0188] The graph (1200) of FIG. 12 may include a first measurement line (1201), a second measurement line (1202), and a third measurement line (1203). The first measurement line (1201) may refer to a sound pressure level measurement value when the second length (L2) of the second tube (232) in the electronic device (200) is formed relatively small. The third measurement line (1203) may refer to a sound pressure level measurement value when the second length (L2) of the second tube (232) in the electronic device (200) is formed relatively long. For example, the third measurement line (1203) may represent a sound pressure level value measured in an electronic device (200) in which the second length (L2) is formed longer than in an electronic device (200) corresponding to the second measurement line (1202). The second measuring line (1202) may represent a sound pressure level value measured in an electronic device (200) having a second length (L2) formed longer than that of the electronic device (200) corresponding to the first measuring line (1201).

[0189] In one embodiment, based on the second length (L2) of the second tube (232) of the electronic device (200), the measured value of the sound pressure level corresponding to the frequency (e.g., hertz (Hz)) of the vibrating unit (220) may vary.

[0190] In one embodiment, the high points (1201a, 1201b) of the first measurement line (1201) may refer to measurement values ​​of local high point portions of the first measurement line (1201). The first measurement line (1201) may include the first high point (1201a) and / or the second high point (1201b). For example, referring to FIG. 12 , the first high point (1201a) and the second high point (1201b) may have relatively high values ​​compared to other regions of the first measurement line (1201).

[0191] In one embodiment, the drop point (1201c) of the first measurement line (1201) may refer to a measurement value of a local low point portion of the first measurement line (1201). Referring to FIG. 12, the drop point (1201c) may have a relatively low value compared to other areas of the first measurement line (1201).

[0192] In one embodiment, the first high point (1201a) and the second high point (1202b) may vary based on the sum of the first length (L1, see FIG. 3) and the second length (L2, see FIG. 3) of the electronic device (200).

[0193] In one embodiment, the drop point (1201c) may vary based on the sum of the second length (L2, see FIG. 3) and the third length (L3, see FIG. 3) of the electronic device (200).

[0194] In one embodiment, the second peak point (1201b) and the drop point (1201c) of the first measurement line (1201) may change according to a change in the second length (L2) of the electronic device (200). In one embodiment, as the second length (L2) of the electronic device (200) increases, the measurement lines (1201, 1202, 1203) corresponding to the electronic device (200) may change in the order of the first measurement line (1201), the second measurement line (1202), and the third measurement line (1203). For example, the third measurement line (1203) corresponding to the electronic device (200) in which the second length (L2) of the electronic device (200) is formed relatively long may be formed in a shape in which the second peak point (1201b) and the drop point (1201c) are removed from the first measurement line (1201).

[0195] Referring to FIG. 12, the sound pressure level of the third measuring line (1203) can change with a relatively more uniform value according to the change in frequency compared to the second measuring line (1202) and the first measuring line (1201). For example, since the third measuring line (1203) is formed in a shape in which the second peak (1201b) and the drop point (1201c) are removed from the first measuring line (1201), the sound pressure level can change with a relatively more uniform value according to the change in frequency.

[0196] An electronic device (200) according to one embodiment of the present disclosure includes a vibration unit (220) that generates sound and a conduit unit (230) that is formed on the front of the vibration unit (220) and is a space through which sound generated from the vibration unit (220) is transmitted. The conduit unit (230) may include a radiation opening (235) for transmitting sound to the outside of the electronic device, a first tube (231) that is connected to the radiation opening (235) at one end and extends to a first length (L1), and a second tube (232) that is connected to the first tube (231) at the other end of the first tube (231), extends to a second length (L2) in a direction opposite to the radiation opening (235), and has a closed end.

[0197] In one embodiment, the second length (L2) may be determined based on the first length (L1) and the third length (L3), which is the length from the center of the vibrating portion (220) to the other end of the first tube (231).

[0198] In one embodiment, the second length (L2) is determined based on the first length (L1), the third length (L3) and the first effective length (L1e), and the first effective length (L1e) may be determined based on the shape of the conduit section (230).

[0199] In one embodiment, the width of the second tube (232) may be formed smaller than the width of the first tube (231).

[0200] In one embodiment, the electronic device (600) includes a plurality of second tubes (632), and the plurality of second tubes (632) can be spaced apart from each other in the width direction of the electronic device (600).

[0201] In one embodiment, the plurality of second tubes (632) may be formed with different widths.

[0202] In one embodiment, the sum of the widths of each of the plurality of second pipes (632) may be formed to be smaller than the width of the first pipe (631).

[0203] In one embodiment, the second pipe (232) has a length determined in the height direction of the second pipe (232) and can extend in the width direction of the second pipe (232).

[0204] In one embodiment, the electronic device (200) includes a cover (250) spaced apart from the vibrating unit (220) with a first tube (231) therebetween and a support (210) surrounding the vibrating unit (220), and the second tube (232) may be a space formed by the cover (250) and the support (210).

[0205] In one embodiment, the electronic device (200) includes an adhesive member (240) disposed on a support member (210), and the cover (250) can be coupled to the support member (210) using the adhesive member (240).

[0206] In one embodiment, the cover (1050) may be a display that visually displays information to the outside of the electronic device (1000).

[0207] In one embodiment, the support (810) includes a fixed area (813), which may be an area where a portion of the support (810) extends to face one side of the vibrating part (820).

[0208] In one embodiment, the electronic device (900) includes a second support (960) including a cover area (961) positioned in an opposite direction of the first support (910) with respect to the first support (910) and the second pipe (932), wherein the first support (910) includes stainless steel, and the pipe section (930) may be a space at least partially surrounded by the vibrating section (920), the first support (910), and the second support (960).

[0209] In one embodiment, the electronic device (900) includes a first support (910), a cover (950) positioned opposite the first support (910) with respect to a second tube (932), and a second support (960) coupled to the cover (950) and disposed on one surface of the first support (910), wherein the first support (910) and the cover (950) include stainless steel, and the tube (930) may be a space at least partially surrounded by the vibrating portion (920), the first support (910), the cover (950), and the second support (960).

[0210] In one embodiment, the electronic device (1100) may include a third tube (1133) connected to the first tube (1131) and extending in an opposite direction to the direction in which the widthwise center of the radiation opening (1135) is located relative to the widthwise center of the vibrating unit (1120) and spaced apart from the widthwise center of the electronic device (1100).

[0211] An electronic device (200) according to one embodiment of the present disclosure includes a vibration unit (220) that generates sound, a support unit (210) that surrounds the vibration unit (220), a cover (250) that is spaced apart from the vibration unit (220), and a conduit unit (230) formed by the cover (250) and the support unit (210). The conduit unit (230) may include a radiating opening (235) for transmitting sound to the outside of the electronic device (200), a first tube (231) that is connected to the radiating opening (235) at one end and extends to a first length (L1), and a second tube (232) that is connected to the first tube (231) at the other end of the first tube (231), extends to a second length (L2) in a direction opposite to the radiating opening (235), and has a closed end.

[0212] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0213] It should be understood that the embodiments of the present disclosure and the terminology used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0214] The term "module" used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0215] An embodiment of the present disclosure may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0216] According to one embodiment, the method according to various embodiments of the present disclosure may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0217] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the above-described components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in a manner identical to or similar to that performed by the corresponding component among the plurality of components prior to the integration.

[0218] According to one embodiment, the operations performed by a module, program or other component may be performed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be performed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (200), A vibrating part (220) that generates sound; and It is formed on the front of the above vibrating part and includes a conduit part (230) which is a space through which sound generated from the above vibrating part is transmitted. The above pipe section, A radiating opening (235) for transmitting the above sound to the outside of the electronic device; A first tube (231) connected to the above-mentioned radiating opening at one end and extending to a first length (L1); and A second tube (232) is connected to the first tube at the other end of the first tube, extends in a direction opposite to the radiating opening to a second length (L2), and has a closed end formed therein. The above second length is, An electronic device determined based on the first length and the third length (L3), which is the length from the center of the vibrating portion to the other end of the first tube.

2. In paragraph 1, The above second length is, It is determined based on the first length, the third length and the first effective length (L1e). The above first effective length is An electronic device determined based on the shape of the above conduit section.

3. In paragraph 1, The width of the above second pipe is: An electronic device formed to be smaller than the width of the first tube.

4. In paragraph 1, Contains a plurality of the above second pipes, An electronic device in which the plurality of second tubes are arranged spaced apart from each other in the width direction of the electronic device.

5. In paragraph 4, The above plurality of second pipes, An electronic device formed with different widths.

6. In paragraph 4, The sum of the widths of each of the above plurality of second pipes is An electronic device formed to be smaller than the width of the first tube.

7. In paragraph 1, The above second pipe, An electronic device having a length determined in the height direction of the second pipe and extending in the width direction of the second pipe.

8. In paragraph 1, A cover (250) placed spaced apart from the vibrating part, with the first pipe interposed between them; and It further includes a support member (210) surrounding the above vibrating member, The above second pipe, An electronic device characterized by a space formed by the cover and the support.

9. In paragraph 8, It further includes an adhesive member (240) placed on the above support member, The above cover, An electronic device coupled to the support using the adhesive material.

10. In paragraph 8, The above cover, An electronic device which is a display that visually displays information on the outside of the electronic device.

11. In paragraph 8, The above support part, Includes a fixed area (813), The above fixed area is, An electronic device in which a portion of the support portion extends to face one side of the vibrating portion.

12. In paragraph 1, First support (910); and It further includes a second support (960) including a cover area (961) located in the opposite direction of the first support based on the second pipe, The above first support member, Contains stainless steel, The above pipe section, An electronic device, wherein the space is at least partially surrounded by the vibrating portion, the first support portion, and the second support portion.

13. In paragraph 1, First support (910); A cover (950) positioned in the opposite direction of the first support part based on the second pipe; and It is combined with the above cover and further includes a second support member (960) arranged on one side of the first support member, The above first support member and the above cover, Contains stainless steel, The above pipe section, An electronic device, wherein the space is at least partially surrounded by the vibrating portion, the first support portion, the cover, and the second support portion.

14. In paragraph 1, When the width direction center of the above radiation opening is located apart from the width direction center of the above vibrating part and the width direction of the above electronic device, An electronic device further comprising a third tube (1133) connected to the first tube and extending in a direction opposite to the direction in which the widthwise center of the radiation opening is located with respect to the widthwise center of the vibrating portion.

15. In an electronic device (200), A vibrating part (220) that generates sound; A support member (210) surrounding the above vibrating member; A cover (250) arranged apart from the above vibrating part; and It includes a conduit section (230) formed by the above cover and the above support section, The above pipe section, A radiating opening (235) for transmitting the above sound to the outside of the electronic device; A first tube (231) connected to the above-mentioned radiating opening at one end and extending to a first length (L1); and An electronic device including a second tube (232) connected to the first tube at the other end of the first tube, extending in a direction opposite to the radiating opening to a second length (L2), and having a closed end.

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