Optical module

Abstract

An optical module (200), comprising a cover shell (910), a base (920), an optical waveguide substrate (900a), a turning prism (502), an optical receiving chip (503), a laser chip (402), a reflector (405), and a displacement prism (407), wherein the base (920) comprises a partition (923), an upper-layer space (924), and a lower-layer space (925); the optical waveguide substrate (900a) is optically coupled to an internal optical fiber, such that a corresponding first input optical port (901a), first output optical port (902a), second input optical port (903a), and second output optical port (904a) are respectively provided on different sides of the optical waveguide substrate (900a), thereby transmitting an optical receiving signal and an optical emitting signal; the laser chip (402) is arranged in the lower-layer space (925) and located in a different layer from that of the optical waveguide substrate (900a), and the laser chip (402) is electrically connected to the other surface of a circuit board (300); in order to guide to the second input optical port (903a) the optical emitting signal generated by the laser chip (402), the reflector (405) is disposed on an output optical path of the laser chip (402), so that the reflector (405) reflects towards a side wall of the partition (923) the optical emitting signal generated by the laser chip (402); and the displacement prism (407) is disposed on the side wall of the partition (923), the displacement prism (407) has an input end facing the layer of the laser chip (402), and an output end facing the second input optical port (903a), thereby guiding into the optical waveguide substrate (900a) the optical emitting signal reflected outwards by the reflector (405).

Description

An optical module

[0001] This application claims the priority of application number 202321990186.0 filed with the China Patent Office on July 26, 2023; the priority of application number 202310927220.8 filed with the China Patent Office on July 26, 2023; the priority of application number 202321985981.0 filed with the China Patent Office on July 26, 2023; the priority of application number 202310926993.4 filed with the China Patent Office on July 26, 2023; the priority of application number 202310929571.2 filed with the China Patent Office on July 26, 2023; and the priority of application number 202310929464.X filed with the China Patent Office on July 26, 2023; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals. They are key components in optical communication equipment and are at the core of optical communication.

[0004] Summary of the Invention

[0005] The optical module provided by the present disclosure includes a circuit board, a cover shell, a base, an optical waveguide substrate, a turning prism, an optical receiving chip, a laser chip, a reflector and a displacement prism. Among them, a fiber optic port is formed at one end of the cover shell to allow the internal optical fiber to extend into the interior of the cover shell. An opening is formed at one end of the base to allow the circuit board to extend into the interior of the base. The base includes a baffle, an upper space located above the baffle and a lower space located below the baffle. The optical waveguide substrate is arranged between the cover shell and the upper space. The internal optical fiber passes through the fiber optic port and enters the interior of the cover shell until it is connected to the optical waveguide substrate. The optical waveguide substrate includes a first input optical port and a first output optical port arranged on opposite sides to transmit optical receiving signals, and also includes a second input optical port and a second output optical port arranged on adjacent sides to transmit optical transmitting signals. The first input optical port and the second output optical port are on the same side, and the first output optical port and the second input optical port are on different sides. The turning prism is arranged in the upper space and on one side of the first output optical port, and is configured to receive and reflect the optical receiving signal. A light receiving chip is disposed on one surface of the circuit board and is configured to receive a light receiving signal reflected by the turning prism. A laser chip is disposed in the lower space and is electrically connected to the other surface of the circuit board. The laser chip and the optical waveguide substrate are located on different layers and are configured to generate a light transmitting signal. A reflector is disposed on the light output path of the laser chip and is configured to reflect the light transmitting chip toward the side wall of the barrier. A displacement prism is disposed on the side wall of the barrier, with its light input and light output ends exposed relative to the barrier. The light input end faces the reflector located in the lower space, and the light output end faces the second input light port located in the upper space. The displacement prism is configured to guide the light transmitting signal output by the reflector into the second input light port, thereby transmitting the light transmitting signal through the optical waveguide substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] To more clearly illustrate the technical solutions of the present disclosure, the following briefly describes the drawings used in some embodiments of the present disclosure. Obviously, the drawings described below are merely illustrations of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0007] FIG1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0008] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0009] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0010] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0011] FIG5 is a schematic diagram of an assembly of an interface claw and an optical fiber plug according to some embodiments of the present disclosure;

[0012] FIG6 is a structural diagram of an interface claw provided according to some embodiments of the present disclosure;

[0013] FIG7 is an exploded view of an interface claw and an optical fiber plug according to some embodiments of the present disclosure;

[0014] FIG8 is a schematic diagram of an assembly of a cover and a base according to some embodiments of the present disclosure;

[0015] FIG9 is an assembly cross-sectional view of an interface claw according to some embodiments of the present disclosure;

[0016] FIG10 is a partially exploded schematic diagram 1 of an optical module provided according to some embodiments of the present disclosure;

[0017] FIG11 is a second partially exploded schematic diagram of an optical module according to some embodiments of the present disclosure;

[0018] FIG12 is a structural diagram 1 of a cover shell provided according to some embodiments of the present disclosure;

[0019] FIG13 is a second structural diagram of a cover shell provided according to some embodiments of the present disclosure;

[0020] FIG14 is a structural diagram 1 of a base provided according to some embodiments of the present disclosure;

[0021] FIG15 is a second structural diagram of a base provided according to some embodiments of the present disclosure;

[0022] FIG16 is a third structural diagram of a base provided according to some embodiments of the present disclosure;

[0023] FIG17 is a first cross-sectional diagram of an assembly of a cover and a base according to some embodiments of the present disclosure;

[0024] FIG18 is a first exploded view of an assembly of a cover and a base according to some embodiments of the present disclosure;

[0025] FIG19 is a second cross-sectional diagram of an assembly of a cover and a base according to some embodiments of the present disclosure;

[0026] FIG20 is a second exploded view of an assembly of a cover and a base according to some embodiments of the present disclosure;

[0027] FIG21 is a schematic structural diagram of an optical waveguide substrate provided according to some embodiments of the present disclosure;

[0028] FIG22 is a schematic diagram of an optical path for transmitting an optical signal through an optical waveguide substrate according to some embodiments of the present disclosure;

[0029] FIG23 is a cross-sectional view of the internal structure of an optical module according to some embodiments of the present disclosure;

[0030] FIG24 is a schematic structural diagram of a protective cover according to some embodiments of the present disclosure;

[0031] FIG25 is a first schematic cross-sectional view of an assembly of a protective cover according to some embodiments of the present disclosure;

[0032] FIG26 is a second schematic cross-sectional view of an assembly of a protective cover according to some embodiments of the present disclosure;

[0033] FIG27 is an exploded view of an assembly of a protective cover according to some embodiments of the present disclosure;

[0034] FIG28 is a schematic diagram of a transmission optical path of a light receiving component according to some embodiments of the present disclosure;

[0035] FIG29 is a first schematic diagram of the relative position relationship among a circuit board, a light emitting component, and a light receiving component according to some embodiments of the present disclosure;

[0036] FIG30 is a second schematic diagram of the relative position relationship among a circuit board, a light emitting component, and a light receiving component according to some embodiments of the present disclosure;

[0037] FIG31 is a structural diagram of an optical receiving chip provided according to some embodiments of the present disclosure;

[0038] FIG32 is an exploded schematic diagram of an optical receiving chip according to some embodiments of the present disclosure;

[0039] FIG33 is an exploded schematic diagram of another optical receiving chip provided according to some embodiments of the present disclosure;

[0040] FIG34 is a cross-sectional view of the internal structure of another optical module according to some embodiments of the present disclosure;

[0041] FIG35 is a cross-sectional view of the internal structure of another optical module according to some embodiments of the present disclosure;

[0042] FIG36 is a structural diagram of a light emitting component provided according to some embodiments of the present disclosure;

[0043] FIG37 is a cross-sectional view of a light emitting component according to some embodiments of the present disclosure;

[0044] FIG38 is a partial structural diagram of a light emitting component according to some embodiments of the present disclosure;

[0045] FIG39 is a light path diagram of a light emitting component according to some embodiments of the present disclosure;

[0046] FIG40 is a side cross-sectional view of a light emitting component according to some embodiments of the present disclosure;

[0047] FIG41 is a second side cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0048] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0049] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0050] Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0051] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0052] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0053] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0054] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0055] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0056] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins that increase the heat dissipation area.

[0057] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0058] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light emitting component, and a light receiving component. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes either the light emitting component or the light receiving component.

[0059] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0060] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0061] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0062] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200. Opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends from opening 204 and is inserted into the electrical connector of the host computer 100; opening 205 is an optical port, which is configured to connect to the external optical fiber 101, so that the optical fiber 101 connects the light emitting component and the light receiving component in the optical module 200.

[0063] The combined assembly of upper and lower housings 201 and 202 facilitates the installation of circuit board 300, light-emitting components, and light-receiving components within the housings, which provide encapsulation and protection for these components. Furthermore, during assembly of circuit board 300, light-emitting components, and light-receiving components, positioning components, heat dissipation components, and electromagnetic shielding components are easily positioned, facilitating automated production.

[0064] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0065] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0066] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0067] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0068] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0069] The circuit board 300 also includes a gold finger 301 formed on its end surface, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0070] At least one of the light emitting component or the light receiving component is located on a side of the circuit board 300 away from the gold finger 301 .

[0071] In some embodiments, the light emitting component and the light receiving component are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0072] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0073] In some embodiments, a DSP chip 302 is also provided on the surface of the circuit board 300. Electrical signals are input from the electrical interface unit. The DSP chip 302 preprocesses and modulates the electrical signals, outputting modulated electrical signals that are then loaded onto the driver chip. The driver chip transmits the modulated electrical signals to the laser chip, which converts the modulated electrical signals into optical signals, thereby generating optical emission signals that carry data. In this disclosure, the side with the DSP chip 302 is referred to as the front side of the circuit board 300, while the opposite side is referred to as the back side of the circuit board 300.

[0074] The circuit board 300 is electrically connected to the optical transceiver cavity. For example, one end of the circuit board 300 extends into the cavity. The cavity is configured to house the optical components of the light receiving end and the optical components of the light transmitting end. By rationally arranging multiple optical transmission paths and light receiving components within the cavity, multi-path transmission is achieved, thereby improving transmission speed.

[0075] To transmit optical signals, the optical port side of the optical transceiver cavity is connected to one end of the optical fiber plug 800b, and the other end of the optical fiber plug 800b is connected to the optical fiber connector 800c. The optical fiber connector 800c is connected to the external optical fiber, and the optical port side of the optical transceiver cavity is connected to the internal optical fiber. The external optical fiber and the internal optical fiber are connected through the optical fiber plug 800b to transmit optical signals. For example, the optical receiving signal to be transmitted to the optical receiving end is transmitted in sequence through the external optical fiber, the optical fiber connector 800c, the optical fiber plug 800b, and the internal optical fiber into the optical transceiver cavity, and then transmitted to the optical receiving component; the optical transmission signal generated by the optical transmitting end is transmitted in sequence through the internal optical fiber, the optical fiber plug 800b, the optical fiber connector 800c, and the external optical fiber, and then transmitted out of the optical transceiver cavity and into the interior of the optical module.

[0076] In some embodiments, the interface claw 800a is configured to couple the fiber optic connector 800c and the fiber optic plug 800b together, the fiber optic connector 800c is connected to the external optical fiber, the end of the fiber optic plug 800b is connected to the internal optical fiber, the fiber optic connector 800c is inserted into one end of the interface claw 800a, and the fiber optic plug 800b is inserted into the other end of the interface claw 800a, and the fiber optic connector 800c and the fiber optic plug 800b are docked inside the interface claw 800a, thereby realizing optical docking between the internal optical fiber and the external optical fiber.

[0077] Figure 5 is a schematic diagram illustrating the assembly of an interface clamp and a fiber optic plug according to some embodiments of the present disclosure; Figure 6 is a structural diagram of an interface clamp according to some embodiments of the present disclosure. As shown in Figures 5 and 6, one end of the interface clamp 800a is vertically provided with a first clamp 801a and a second clamp 802a, respectively. The first clamp 801a and the second clamp 802a are positioned opposite each other. The fiber optic plug 800b is positioned between the first clamp 801a and the second clamp 802a. The first clamp 801a and the second clamp 802a are respectively engaged in the optical transceiver cavity, thereby connecting one end of the interface clamp 800a to the optical transceiver cavity. The other end of the interface clamp 800a is horizontally provided with a third clamp 803a and a fourth clamp 804a, respectively. The third clamp 803a and the fourth clamp 804a are respectively engaged with the optical fiber connector 800c, thereby connecting the other end of the interface clamp 800a to the optical fiber connector 800c.

[0078] In some embodiments, the surface of the first clamping claw 801a is recessed upward to form a first limiting portion 8011a, and the surface of the second clamping claw 802a is recessed downward to form a second limiting portion 8021a.

[0079] To prevent the optical fiber plug 800b from falling out of the interface claw 800a, a retaining plate 800d is provided at the end of the optical fiber plug 800b. The retaining plate 800d is located between the first retaining portion 8011a and the second retaining portion 8021a. The first retaining portion 8011a and the second retaining portion 8021a respectively clamp the retaining plate 800d, thereby securing the retaining plate 800d. The retaining plate 800d holds the optical fiber plug 800b between the interface claw 800a and the retaining plate 800d, thereby preventing the optical fiber plug 800b from falling out of the interface claw 800a and thereby retaining the optical fiber plug 800b in place.

[0080] In some embodiments, the ends of the optical fiber plug 800b are formed with a first pin 801b and a second pin 802b, respectively. The first pin 801b and the second pin 802b are configured to connect to the aforementioned optical transceiver cavity. An internal optical fiber extends through the end of the optical fiber plug 800b, located between the first claw 801a and the second claw 802a. One end of the internal optical fiber is led out from the end of the optical fiber plug 800b, and the other end extends into the interior of the aforementioned optical transceiver cavity to transmit optical signals with the optical components therein. Given the structure of the optical fiber plug 800b, the structure of the stopper 800d illustratively includes corresponding through holes configured to avoid the first pin 801b and the second pin 802b, and corresponding through holes configured to avoid the internal optical fiber.

[0081] Figure 7 is an exploded view of an interface claw and optical fiber plug assembly according to some embodiments of the present disclosure. As shown in Figure 7, in some embodiments, the optical transceiver cavity includes a cover shell 910 and a base 920 that are connected to each other. The cover shell 910 is embedded between the two side walls of the base 920.

[0082] After the optical fiber plug 800b is connected to the above-mentioned optical transceiver cavity, the limiting piece 800d will be attached to the end face of the cover shell 910. At this time, the limiting piece 800d is located between the optical fiber plug 800b and the end faces of the cover shell 910 and the base 920.

[0083] Figure 8 is a schematic diagram illustrating the assembly of a cover and a base according to some embodiments of the present disclosure. As shown in Figure 8 , a fiber port 913 is formed on the edge of the cover 910. The fiber optic plug 800b is optically docked with the fiber port 913, allowing the internal optical fiber guided from the fiber optic plug 800b to pass through and extend directly into the interior of the cover 910, establishing an optical connection with the optical components within the cover 910.

[0084] A first insertion hole 914a and a second insertion hole 914b are formed on both sides of the optical fiber port 913 to respectively connect the first pin 801b and the second pin 802b, thereby connecting the optical fiber plug 800b and the cover shell 910 together to achieve connection between the two.

[0085] Because the fiber optic plug 800b, to which the internal optical fiber is connected, is positioned between the first and second clamping claws 801a, 802a, which are arranged vertically opposite each other, and the internal optical fiber needs to be optically connected to the optical fiber port 913, the cover 910 includes a first clamping portion 9111 and a second clamping portion 9121, respectively, formed on the upper and lower sides of the optical fiber port 913. The first and second clamping portions 9111, 9121 are arranged vertically opposite each other. In some embodiments, the first clamping claw 801a is inserted into the first clamping portion 9111, and the second clamping claw 802a is inserted into the second clamping portion 9121, thereby securing the interface clamping claw 800a to the cover 910 and achieving a connection between the two. In some embodiments, if the first and second clamping claws 801a, 802a, are relatively thick, the first clamping portion 9111 is excavated deeper to accommodate the first clamping claw 801a. A third clamping portion 9281 is provided at a position relative to the second clamping portion 9121 , and the third clamping portion 9281 avoids the second clamping claw 802a, providing a larger space for the clamping of the second clamping claw 802a. At this time, the second clamping claw 802a is provided between the second clamping portion 9121 and the third clamping portion 9281 .

[0086] In some embodiments, an optical waveguide substrate is provided inside the cover 910. The optical waveguide substrate includes an optical waveguide configured to transmit an optical receive signal and an optical transmit signal. The optical receive signal is an optical signal to be transmitted to the optical receive end, and the optical transmit signal is an optical signal generated by the optical transmit end. An optical fiber port 913 is provided between the optical fiber plug 800b and the optical waveguide substrate. One side of the optical fiber port 913 is optically connected to the optical fiber plug 800b, and the other side is optically connected to the optical waveguide substrate. Exemplarily, the optical fiber port 913 is optically connected to the optical port of the optical waveguide substrate. One end of the internal optical fiber is guided out of the optical fiber plug 800b, and the other end of the internal optical fiber passes through the optical fiber port 913 optically connected to the optical fiber plug 800b until the other end of the internal optical fiber extends to the optical port of the optical waveguide substrate, thereby optically connecting the internal optical fiber to the optical waveguide substrate and achieving transmission of the optical signal.

[0087] In the present disclosure, the optical fiber plug 800b is arranged between the first clamping claw 801a and the second clamping claw 802a, and the optical fiber port is arranged between the first clamping portion 9111 and the second clamping portion 9121. The optical fiber plug 800b is optically connected to the optical fiber port, the first clamping claw 801a is connected to the first clamping portion 9111, and the second clamping claw 802a is connected to the second clamping portion 9121. Then, while realizing the optical connection between the optical fiber plug 800b and the optical fiber port, the interface clamping claw 800a is also fixed on the cover shell 910.

[0088] Figure 9 is a cross-sectional view of an assembly of an interface clamp according to some embodiments of the present disclosure. As shown in Figure 9, in some embodiments of the present disclosure, since an optical waveguide substrate is disposed within cover shell 910, an optical fiber port 913 is formed at the end of cover shell 910. Optical connection between optical waveguide substrate and optical fiber port 913 is established. An internal optical fiber is disposed between vertically opposed first clamping jaw 801a and second clamping jaw 802a. The internal optical fiber then needs to be optically connected to optical fiber port 913, passing the internal optical fiber through optical fiber port 913 until it optically connects to the optical waveguide substrate. Therefore, at the end of the cover shell 910, a first clamping portion 9111 and a second clamping portion 9121 are respectively formed on the upper and lower sides of the optical fiber port 913, and the first clamping claw 801a located above the internal optical fiber is arranged in the first clamping portion 9111 located above the optical fiber port 913, and the second clamping claw 802a located below the internal optical fiber is arranged in the second clamping portion 9121 located below the optical fiber port 913, thereby simultaneously realizing optical docking of the internal optical fiber and the optical fiber port 913, and connection of the interface clamping claw 800a and the cover shell 910.

[0089] Figure 10 is a partially exploded schematic diagram of an optical module according to some embodiments of the present disclosure. As shown in Figure 10 , in some embodiments, the optical transceiver cavity includes a cover 910 and a base 920 that are connected to each other. The two side walls of the base 920 are recessed relative to the surface, so that the cover 910 is disposed between the two side walls of the base 920.

[0090] The optical waveguide substrate 900a is disposed between the cover 910 and the base 920. For example, the cover 910 has a receiving cavity for enclosing the optical waveguide substrate 900a. Therefore, the optical waveguide substrate 900a is disposed on the surface of the base 920 and is covered and enclosed by the cover 910.

[0091] In some embodiments, the cover 910 includes a main body structure 911 configured to cover and encase the optical waveguide substrate 900a. Because the optical fiber plug 800b is optically connected to the optical waveguide substrate 900a and is positioned between the first and second latches 801a, 802a, which are positioned in an opposed relationship, a first engaging portion 9111 and a second engaging portion 9121 are positioned on the upper and lower sides of the optical waveguide substrate 900a, respectively. Because the main body structure 911 is positioned above the optical waveguide substrate 900a, the first engaging portion 9111 is formed on the surface of the main body structure 911. As described above, the surface of the first claw 801a is recessed upward to form the first limiting portion 8011a, and the surface of the second claw 802a is recessed downward to form the second limiting portion 8021a. To achieve the positional fixation of the first and second claws 801a, the upper surface of the main body structure 911 is recessed downward to form a first engaging portion 9111, which is used to mount the first claw 801a. A second engaging portion 9121 is recessed upward at a certain position to mount the second claw 802a. The distance between the first and second claws 801a is less than the thickness of the base 920. Therefore, the upwardly recessed second engaging portion 9121 is not suitable for placement on the base 920. In this case, the second engaging portion 9121 should be positioned on the cover 910. Since the thickness of the main body structure 911 covering the optical waveguide substrate 900a is smaller than the distance between the first clamping claw 801a and the second clamping claw 802a, one end of the main body structure 911 extends downward to form an extension plate 912, and the bottom surface of the extension plate 912 is recessed upward to form a second clamping portion 9121. At the same time, a fiber optic port 913 is provided on the surface of the extension plate 912, so that the fiber optic port 913 is located between the first clamping portion 9111 and the second clamping portion 9121.

[0092] In order to achieve the connection between the cover 910 and the base 920, the present disclosure forms a support groove 928 at the end of the base 920, and the extension plate 912 is embedded in the support groove 928 to connect the cover 910 and the base 920. For example, when the thickness of the second clamping claw 802a is large, the surface of the support groove 928 is recessed downward to form a third clamping portion 9281. The third clamping portion 9281 is arranged opposite to the second clamping portion 9121 to avoid the second clamping claw 802a, providing a larger space for the second clamping claw 802a to be clamped and extended.

[0093] An optical waveguide substrate 900a is disposed between the cover 910 and the base 920. The optical waveguide substrate 900a is optically connected to the optical fiber port 913. The internal optical fiber is led out from the end of the optical fiber plug 800b, passes through the optical fiber port 913, and directly connects to the optical waveguide substrate 900a, thereby achieving optical coupling between the optical fiber plug 800b and the optical waveguide substrate 900a, thereby transmitting optical signals through the internal optical fiber. For example, the optical receiving chip is transmitted to the optical receiving end via the external optical fiber, the optical fiber connector 800c, the optical fiber plug 800b, the internal optical fiber, and the optical channel within the optical waveguide substrate 900a. The optical transmission signal is then transmitted to the outside of the optical module via the optical channel within the optical waveguide substrate 900a, the internal optical fiber, the optical fiber plug 800b, the optical fiber connector 800c, and the external optical fiber.

[0094] An opening 927 is formed at one end of the base 920 to allow the circuit board 300 to extend into the interior of the base 920 , and then the circuit board 300 establishes electrical connections with the light receiving end and the light emitting end respectively, thereby transmitting electrical signals.

[0095] One end of the circuit board 300 is provided with a gold finger 301, and a DSP chip 302 is installed on the surface. The other end of the circuit board 300 extends into the optical transceiver cavity, thereby transmitting electrical signals to the optical transmitter, or transmitting electrical signals generated by the optical receiver to the host computer via the gold finger 301. In this disclosure, the side of the circuit board 300 with the DSP chip 302 is referred to as the front side of the circuit board 300, and the other side is referred to as the back side of the circuit board 300. For example, the front side of the circuit board 300 is provided with some optical components of the optical receiver, and the back side of the circuit board 300 is electrically connected to the electrical components of the optical transmitter.

[0096] In some embodiments, since the DSP chip 302 generates a large amount of heat during operation, the DSP chip 302 is disposed on the front surface of the circuit board 300. In this case, since the front surface of the circuit board 300 is covered with the upper housing 201, the heat generated by the DSP chip 302 can be dissipated through the upper housing 201. Of course, the DSP chip can also be disposed on the back surface of the circuit board 300.

[0097] Figure 11 is a second partially exploded schematic diagram of an optical module provided according to some embodiments of the present disclosure. As shown in Figure 11, in some embodiments, the surface of the extension plate 912 is provided with a fiber port 913 and a second clamping portion 9121. The fiber port 913 is optically connected to the optical waveguide substrate 900a, and the internal optical fiber passes through the fiber port 913 until it extends into the optical waveguide substrate 900a.

[0098] Based on the arrangement of the extension plate 912 , a support groove 928 is formed on one end surface of the base 920 . The extension plate 912 is embedded in the support groove 928 to connect the cover 910 to the base 920 .

[0099] In the present disclosure, because the bottom surface of the extension plate 912 needs to be recessed upward to form the second engaging portion 9121, the support area between the extension plate 912 and the support groove 928 is relatively small. To increase the support surface between the extension plate 912 and the support groove 928 and facilitate position retention, the width of the extension plate 912 is set to be smaller than the width of the main body structure 911, thereby forming overlapping portions 915 between the extension plate 912 and the main body structure 911. Overlapping portions 915 are formed on both sides. Accordingly, the width of the support groove 928 is smaller than the width of the base 920 surface, thereby forming a first supporting portion 9244 and a second supporting portion 9245 on either side of the support groove 928. The overlapping portion 915 on one side is connected to the first supporting portion 9244, and the overlapping portion 915 on the other side is connected to the second supporting portion 9245. This increases the support surface between the extension plate 912 and the support groove 928, thereby achieving a position-limiting connection between the cover 910 and the base 920.

[0100] In the present disclosure, a light receiving chip 503 is provided on one side of the optical output port of the optical waveguide substrate. Exemplarily, the light receiving chips 503 are arranged in an array on the surface of the circuit board 300. Because the circuit board extends into the interior of the base 920, while the light waveguide substrate is located on the surface of the base 920, the height of the light waveguide substrate is greater than that of the light receiving chips 503. Therefore, in some embodiments, a turning prism 502 may be provided before the light receiving chips 503. The turning prism 502 is provided on one side of the light output end of the light waveguide substrate to receive the light receiving signal output by the light waveguide substrate and reflect the light receiving signal toward the light receiving chip 503, thereby transmitting the light receiving signal to the surface of the light receiving chip 503.

[0101] For example, a light receiving chip 503 is provided on the front surface of the circuit board 300, and a turning prism 502 is located on the light outlet side of the optical waveguide substrate 900a. The surface of the base 920 is relatively higher than the surface of the circuit board 300, and the light outlet surface of the turning prism 502 faces the light receiving chip 503. The turning prism 502 can be used to bend the optical signal output by the optical waveguide substrate 900a toward the light receiving chip 503, thereby redirecting the optical receiving signal to the surface of the light receiving chip 503.

[0102] In some embodiments, a first lens 501 is provided between the light outlet of the optical waveguide substrate 900a and the turning prism 502. Exemplarily, the first lens 501 is a converging lens that converges the optical signal outputted by the optical waveguide substrate 900a to reduce the power loss of the received light, and then transmits the converged optical signal to the turning prism 502.

[0103] In some embodiments, a TIA 504 is provided on the surface of the circuit board 300 and on the light output path of the light receiving chip 503 . The photocurrent signal generated by the light receiving chip 503 can be converted into a voltage signal by the TIA 504 and the voltage signal can be amplified.

[0104] Figure 12 is a structural diagram of a cover provided according to some embodiments of the present disclosure; Figure 13 is a structural diagram of a cover provided according to some embodiments of the present disclosure. As shown in Figures 12 and 13, the cover 910 includes a main body structure 911. The surface of the main body structure 911 is recessed downward to form a first clamping portion 9111. One end of the main body structure 911 extends downward to form an extension plate 912. The surface of the extension plate 912 is configured to provide a fiber optic port 913 and a second clamping portion 9121. For example, the bottom surface of the extension plate 912 is recessed upward to form the second clamping portion 9121.

[0105] The end of the optical fiber plug 800b is formed with a fiber port, through which the internal optical fiber exits. When optically mated with the optical port 913, the internal optical fiber extends through the optical port 913 until it reaches the optical port of the optical waveguide substrate 900a. A first pin 801b and a second pin 802b are respectively provided on either side of the optical port of the optical fiber plug 800b. Correspondingly, a first receptacle 914a and a second receptacle 914b are respectively formed on either side of the optical port 913. The first pin 801b is inserted into the first receptacle 914a, and the second pin 802b is inserted into the second receptacle 914b, thereby connecting the optical fiber plug 800b to the cover 910.

[0106] Exemplarily, the main body structure 911 includes a first side wall 9112 and a second side wall 9113 that are arranged opposite to each other. A avoidance groove 9114 is formed through the middle of the first side wall 9112 , and a boss 9115 is formed on one side of the first side wall 9112 .

[0107] For example, a receiving cavity 9116 is formed between the first side wall 9112 and the second side wall 9113 to enclose and accommodate the optical waveguide substrate 900a. To facilitate disassembly and repair of the optical waveguide substrate 900a, a notch 9117 is provided on one side of the second side wall 9113. This notch 9117 facilitates removal of the optical waveguide substrate 900a for disassembly and repair.

[0108] Figure 14 is a structural diagram of a base provided according to some embodiments of the present disclosure; Figure 15 is a structural diagram of a base provided according to some embodiments of the present disclosure. As shown in Figures 14 and 15, in some embodiments, the base 920 includes a third sidewall 921 and a fourth sidewall 922. The surface of the base 920 is relatively recessed relative to the third sidewall 921 and the fourth sidewall 922, and the distance between the third sidewall 921 and the fourth sidewall 922 is greater than the distance between the first sidewall 9112 and the second sidewall 9113, so that the cover 910 is disposed between the third sidewall 921 and the fourth sidewall 922.

[0109] The base 920 has a layered structure, with a barrier 923 formed in the middle. This barrier 923 divides the base 920 into an upper space 924 located above the barrier 923 and a lower space 925 located below the barrier 923. The upper space 924 is separated from the lower space 925 by the barrier 923. The upper space 924 houses the optical waveguide substrate 900a, the first lens 501, and the turning prism 502. The lower space 925 houses the optical elements of the light-emitting end. The turning prism 502 is disposed on a surface of the barrier 923, illustratively within the upper space 924.

[0110] Since the optical waveguide substrate 900a, the first lens 501, and the turning prism 502 are all located in the upper space 924, the transmission of the optical receiving signal is same-layer transmission. The optical signal output by the optical waveguide substrate 900a is transmitted along the same layer to the first lens 501 and the turning prism 502. The transmission optical path of the optical receiving signal does not need to be highly switched and guided between the upper and lower spaces. The optical receiving optical path is simple, thereby reducing optical power loss.

[0111] The upper space 924 includes a first surface 9241, a second surface 9242, and a third surface 9243, respectively. The first surface 9241, the second surface 9242, and the third surface 9243 are located on the top surface of the barrier 923. The optical waveguide substrate 900a is disposed between the cover 910 and the first surface 9241. The second surface 9242 is configured to accommodate the first lens 501, and the third surface 9243 is configured to accommodate the turning prism 502. For example, the second surface 9242 may be located at a higher height than the third surface 9243, so that the optical axes of the first lens 501 and the turning prism 502 are coaxial.

[0112] An opening 927 is formed at one end of the barrier 923 to allow the circuit board 300 to extend into the barrier 923. The front surface of the circuit board 300 can be used to support the light receiving chip 503 and the TIA 504, thereby establishing an electrical connection with the light receiving end. The circuit board 300 extends into the light emitting component, thereby establishing an electrical connection with the light emitting end.

[0113] The first surface 9241 includes a surface configured to support the optical waveguide substrate 900a, and also includes a first support portion 9244, a second support portion 9245 and a third support portion 9246. The first support portion 9244 and the second support portion 9245 are located on the optical port side of the optical transceiver cavity, and the third support portion 9246 is located on the electrical port side of the optical transceiver cavity.

[0114] A support groove 928 is provided between the first support portion 9244 and the second support portion 9245. The support groove 928 is U-shaped and recessed relative to the surface of the base 920. Exemplarily, the support groove 928 is recessed relative to the surface of the first surface 9241 so that the extension plate 912 is disposed within the support groove 928 and the overlapping portions 915 on both sides overlap the first surface 9241. Exemplarily, the overlapping portions 915 on both sides overlap the first support portion 9244 and the second support portion 9245, respectively, thereby inserting the extension plate 912 into the support groove 928. The support groove 928 supports the extension plate 912, and then the overlapping portions 915 match and overlap with the first support portion 9244 and the second support portion 9245, thereby achieving a position-limiting connection between the cover 910 and the base 920.

[0115] In some embodiments, a fourth surface 929 is formed on a side of the first surface 9241 close to the third sidewall 921 . Exemplarily, the fourth surface 929 is recessed relative to the first surface 9241 .

[0116] In some embodiments, the third side wall 921 is hollowed out to form an embedded portion 926, which is a through hole. The embedded portion 926 exposes the upper and lower surfaces of the partition 923. For example, the height of the embedded portion 926 is greater than the height of the partition 923, and the upper and lower surfaces of the partition 923 are exposed relative to the embedded portion 926.

[0117] Figure 16 is a third structural diagram of a base provided according to some embodiments of the present disclosure. As shown in Figure 16, the surface of the lower space 925 is recessed to varying degrees toward the upper space 924, forming a first recessed portion 9251 and a second recessed portion 9252. The first recessed portion 9251 and the second recessed portion 9252 are located on the bottom surface of the barrier 923. For example, the first recessed portion 9251 and the second recessed portion 9252 are configured to house optical elements at the light-emitting end, with the first recessed portion 9251 being more recessed than the second recessed portion 9252. A first vertical surface 9253 and a second vertical surface 9254 are connected to one side of the second recessed portion 9252, respectively.

[0118] The first recessed portion 9251 and the second recessed portion 9252 are respectively configured to be optical elements for disposing light emitting ends.

[0119] Figure 17 is a schematic cross-sectional view of a cover and base assembly according to some embodiments of the present disclosure. As shown in Figure 17, the width between the third sidewall 921 and the fourth sidewall 922 of the base 920 is relatively larger than the first sidewall 9112 and the second sidewall 9113 of the cover 910. Therefore, the cover 910 is positioned between the third sidewall 921 and the fourth sidewall 922, and the surface of the cover 910 can be flush with the surfaces of the third sidewall 921 and the fourth sidewall 922.

[0120] The optical waveguide substrate 900a is disposed between the cover 910 and the base 920. Exemplarily, the optical waveguide substrate 900a is located between the cover 910 and the upper space 924 of the base 920. The second sidewall 9113 of the cover 910 encloses the optical waveguide substrate 900a. The width of the optical waveguide substrate 900a is smaller than the width between the first sidewall 9112 and the second sidewall 9113. This allows for a distance between one side of the optical waveguide substrate 900a and the second sidewall 9113 to facilitate optical path design and adjustment. In some packaging processes, the optical waveguide substrate 900a must be secured. Exemplarily, the cover 910 can be used to enclose the optical waveguide substrate 900a to secure it.

[0121] Because the optical waveguide substrate 900a is located in the upper space 924 and the optical elements at the light emitting end are located in the lower space 925, the transmission of the light emitting signal is cross-layer transmission, and the transmission optical path of the light emitting signal needs to be switched and guided at a certain height. For example, the transmission direction of the light emitting signal is turned toward the upper space 924 so that the output direction of the light emitting signal is toward the optical waveguide substrate 900a, thereby ultimately transmitting the light emitting signal into the light waveguide substrate 900a. In some embodiments, by providing a displacement prism 407, the transmission direction of the light emitting signal is turned toward the upper space 924 so that the output direction of the light emitting signal is transmitted into the light waveguide substrate 900a, thereby guiding the light emitting signal into the light waveguide substrate 900a.

[0122] In some embodiments, the displacement prism 407 is disposed in the embedding portion 926. For example, the displacement prism 407 is disposed in the fixing frame 408, and then the fixing frame 408 is embedded in the embedding portion 926, thereby embedding the displacement prism 407 in the embedding portion 926, thereby fixing the displacement prism 407.

[0123] In some embodiments, the fixing frame 408 is a frame with an opening, such as including a top surface, a bottom surface, and a side surface connecting the top surface and the bottom surface. The displacement prism 407 is arranged between the top surface and the bottom surface, and the displacement prism 407 is clamped up and down by the top surface and the bottom surface, and the displacement prism 407 is fixed by the side surface.

[0124] In some embodiments, the width of the fixing frame 408 is relatively greater than the width of the third side wall 921. Therefore, an escape groove 9114 is formed through the middle of the first side wall 9112 of the cover 910 to avoid the fixing frame 408. Exemplarily, one side of the fixing frame 408 is connected to the escape groove 9114.

[0125] In some embodiments, the second sidewall 9113 of the cover 910 is disposed between the fourth sidewall 922 of the base 920 and the optical waveguide substrate 900 a ; and the first sidewall 9112 is connected to the third sidewall 921 .

[0126] Figure 18 is a schematic diagram of the first exploded assembly of a cover and base according to some embodiments of the present disclosure. As shown in Figure 18 , a clearance groove 9114 is formed through the middle of the first sidewall 9112 to accommodate the fixing bracket 408. For example, one side of the fixing bracket 408 is connected to the clearance groove 9114. An embedded portion 926 is formed in the third sidewall 921 to accommodate the fixing bracket 408.

[0127] Figure 19 is a second schematic cross-sectional view of the assembly of a cover and a base according to some embodiments of the present disclosure; Figure 20 is a second schematic exploded view of the assembly of a cover and a base according to some embodiments of the present disclosure. As shown in Figures 19 and 20, a relief groove 9114 is formed through the middle of the first side wall 9112, and a boss 9115 is formed on one side of the first side wall 9112. The boss 9115 is connected to a portion of the area of ​​the third support portion 9246, and a portion of the surface of the third support portion 9246 is used to support the boss 9115.

[0128] The cover case is formed with a receiving cavity 919 to receive the optical waveguide substrate 900 a .

[0129] Figure 21 is a schematic diagram of the structure of an optical waveguide substrate provided according to some embodiments of the present disclosure. As shown in Figure 21, in some embodiments, a first input optical port 901a and a second output optical port 904a are formed on a side of the optical waveguide substrate 900a adjacent to the optical fiber plug 800b, a first output optical port 902a is formed on a side opposite to the first input optical port 901a, and a second input optical port 903a is formed on a side adjacent to the second output optical port 904a.

[0130] The first input optical port 901a is connected to the first output optical port 902a, and multiple optical channels are provided between the two to realize the transmission of multiple optical signals. The optical channel between the first input optical port 901a and the first output optical port 902a is configured to transmit the external optical signal, that is, the optical receiving signal, to the optical receiving end.

[0131] The second input optical port 903a is connected to the second output optical port 904a, and multiple optical channels are also provided between the two to realize the transmission of multiple optical signals. The optical channel between the second input optical port 903a and the second output optical port 904a is configured to transmit the optical signal generated by the optical transmitting end, that is, the optical transmission signal, to the outside of the optical module.

[0132] The first input optical port 901a and the first output optical port 902a provided on the opposite side are configured to transmit optical receive signals; the second input optical port 903a and the second output optical port 904a provided on the adjacent side are configured to transmit optical transmit signals.

[0133] The first input optical port 901a and the first output optical port 902a are located on opposite sides, and the optical receiving chip 503 is located on one side of the first output optical port 902a. The light input direction of the optical receiving chip 503 is consistent with the output direction of the optical signal of the optical waveguide substrate 900a. The output optical path of the optical waveguide substrate 900a is in the same direction as the input optical path of the optical receiving chip 503. For example, both are toward the optical port end of the optical module. Therefore, the optical signal output by the optical waveguide substrate 900a can be directly received by the optical receiving chip 503, reducing optical loss and facilitating the guarantee of optical receiving power.

[0134] The second input optical port 903a and the second output optical port 904a are located on two adjacent sides. The light emitting direction of the laser chip at the light emitting end is inconsistent with the input direction of the optical waveguide substrate 900a. Therefore, the input optical path direction of the optical waveguide substrate 900a is inconsistent with the light emitting path direction of the laser chip. For example, the light emitting path of the laser chip is toward the optical port, and the input optical path of the optical waveguide substrate 900a is toward the side. Therefore, the light emission signal generated by the laser chip at the light emitting end needs to be turned and guided in the transmission direction to transmit the light emission signal into the optical waveguide substrate 900a.

[0135] The first input optical port 901a and the second output optical port 904a are located on the same side. For example, the first input optical port 901a and the second output optical port 904a are both located on the side close to the optical fiber plug 800b, so the received light of the optical receiving end and the emitted light of the optical transmitting end are both concentrated on one side. The received light of the optical receiving end enters the optical waveguide substrate 900a on this side, and the emitted light of the optical transmitting end is output from the optical waveguide substrate 900a on this side.

[0136] The first output optical port 902a and the second input optical port 903a are on different sides. For example, the first output optical port 902a and the second input optical port 903a are located on two adjacent sides. In the optical waveguide substrate 900a, the transmission starting point of the received light and the transmission end point of the emitted light are on the same side, and then the received light is transmitted along the transmission starting point to the side opposite to the transmission starting point, while the transmission starting point of the emitted light is located on a different side from the transmission end point of the emitted light. Based on the reversibility of the optical path, the present disclosure is equivalent to the received light and the emitted light converging on the same side, and then dispersing and transmitting to different sides.

[0137] In the present disclosure, the transmission direction of the optical receiving signal is consistent with the direction of the optical port of the optical module, while the transmission direction of the optical transmitting signal is guided to the side of the optical waveguide substrate via the reflector and the displacement prism.

[0138] In this disclosure, the input of the optical receive signal and the output of the optical transmit signal converge on one side, while the output of the optical receive signal and the input of the optical transmit signal are dispersed along different transmission paths, rationally arranging the transmission routes of the optical receive and transmit signals. In this disclosure, the space on the surface of the cover and base is fully utilized, and the relative relationship between the optical waveguide substrate, the receiving optical path, and the transmitting optical path is rationally arranged to achieve optical signal reception and transmission.

[0139] The second surface 9242 and the third surface 9243 are both located on one side of the first output light port 902a of the optical waveguide substrate 900a, so as to transmit the optical signal output by the first output light port 902a to the first lens 501 set on the surface of the second surface 9242 and the turning prism 502 set on the surface of the third surface 9243 in sequence.

[0140] The fourth surface 929 is located on one side of the second input optical port 903a of the optical waveguide substrate 900a to transmit the optical signal output by the optical element disposed on the fourth surface 929 to the second input optical port 903a and then output it through the second output optical port 904a.

[0141] The embedded portion 926 is also located on one side of the second input optical port 903a of the optical waveguide substrate 900a, so as to transmit the optical signal output by the optical element installed in the embedded portion 926 to the second input optical port 903a and then output it through the second output optical port 904a.

[0142] For example, when the optical module is an 800G optical module, the first input optical port 901a is connected to the first output optical port 902a, with eight optical channels between them. These eight optical channels are eight optical receiving channels. The second input optical port 903a is connected to the second output optical port 904a, with eight optical channels between them. These eight optical channels are eight optical transmitting channels. By properly positioning the optical ports, the eight optical receiving channels and the eight optical transmitting channels can be properly arranged, avoiding mutual interference between the channels.

[0143] In the present disclosure, the optical receiving signal and the optical transmitting signal are transmitted simultaneously through the optical waveguide substrate 900a. Since the optical device at the optical receiving end and the optical device at the optical transmitting end are in different layers of space, if the optical receiving signal and the optical transmitting signal are transmitted through the optical fiber ribbon, fiber winding or fiber coiling will occur. Fiber winding or fiber coiling causes optical power loss, thereby reducing optical power. Therefore, the present disclosure can avoid fiber winding or fiber coiling through the optical waveguide substrate 900a, thereby reducing optical power loss.

[0144] Figure 22 is a schematic diagram of an optical path for transmitting an optical signal through an optical waveguide substrate according to some embodiments of the present disclosure. As shown in Figure 22, in some embodiments, the optical receiving end includes a first lens 501, a turning prism 502, and an optical receiving chip 503. For example, the optical receiving signal enters the optical waveguide substrate 900a from the first input optical port 901a via an internal optical fiber, is then transmitted through the optical channel within the optical waveguide substrate 900a, and is output from the first output optical port 902a. The first lens 501 is disposed on one side of the first output optical port 902a to receive the optical receiving signal output from the first output optical port 902a.

[0145] In some embodiments, the light emitting end includes a laser chip 402, a reflector 405, etc. Compared to the light receiving chip 503 arranged on the surface of the circuit board 300, the laser chip 402 is not arranged on the surface of the circuit board 300. The laser chip 402 is arranged on the other surface of the partition 923. For example, the laser chip 402 is arranged in the lower space 925. The light emission signal emitted by the laser chip 402 is reflected by the reflector 405 into the displacement prism 407. The displacement prism 407 turns and guides the transmission direction of the light emission signal output by the reflector 405 toward the second input optical port 903a of the optical waveguide substrate 900a, so that the light emission signal is transmitted into the optical waveguide substrate 900a. Exemplarily, the light-emitting side of the displacement prism 407 is located on one side of the second input optical port 903a. The optical emission signal output from the displacement prism 407 enters the optical waveguide substrate 900a from the second input optical port 903a, and is then transmitted to the second output optical port 904a through the optical channel in the optical waveguide substrate 900a. The optical emission signal is output from the second output optical port 904a, enters the internal optical fiber, and is then transmitted to the outside of the optical module through the external optical fiber coupled to the internal optical fiber.

[0146] Figure 23 is a cross-sectional view of the internal structure of an optical module provided according to some embodiments of the present disclosure. As shown in Figure 23, an opening 927 is formed at one end of the baffle 923. One end of the circuit board 300 extends into the baffle 923 through the opening 927. The surface length of the upper space 924 is relatively longer than the length of the cover 910. The surface of the upper space 924 is exposed relative to the cover 910. The first lens 501 and the turning prism 502 are respectively disposed on the exposed surface. The light receiving chip 503 and the TIA 504 are disposed on a surface of the circuit board 300. For example, the light receiving chip 503 and the TIA 504 are disposed on the front of the circuit board 300. The first lens 501 and the turning prism 502 are disposed toward the front of the circuit board 300. The light emitting surface of the turning prism 502 faces the front of the circuit board 300. For example, the light emitting surface of the turning prism 502 faces the light receiving chip 503 disposed on the front of the circuit board 300.

[0147] The lower space 925 is configured to house the laser chip 402 and the reflector 405. One end of the circuit board 300 extends into the barrier 923 through the opening 927. When the circuit board 300 extends to one side of the laser chip 402, the laser chip 402 is electrically connected to the other surface of the circuit board 300 by bonding. For example, the laser chip 402 is connected to the back surface of the circuit board 300. To ensure high-frequency signal transmission performance, the other surface of the circuit board 300 is flush with the surface of the laser chip 402. For example, the back surface of the circuit board 300 is flush with the surface of the laser chip 402. This helps shorten the bonding length between the circuit board 300 and the laser chip 402, thereby ensuring high-frequency signal transmission performance.

[0148] The circuit board 300 extends into the baffle 923 from the opening 927. At this time, one surface of the circuit board 300, such as the front side, is configured to set the light receiving chip 503 and TIA504, and the other surface of the circuit board 300, such as the back side, is flush with the surface of the laser chip 402. The back side of the circuit board 300 and the laser chip 402 are connected by wires.

[0149] The first lens 501 is located on the side of the first output optical port 902a of the optical waveguide substrate 900a to receive the optical receiving signal output from the optical waveguide substrate 900a; the light-emitting surface of the first lens 501 faces the turning prism 502; the turning prism 502 is configured to reflect the optical signal toward the optical receiving chip 503, thereby transmitting the optical receiving signal to the optical receiving chip 503. Exemplarily, the light-emitting surface of the turning prism 502 faces the front of the circuit board 300, for example, the light-emitting surface of the turning prism 502 faces the optical receiving chip 503; the optical receiving chip 503 is configured to convert the optical receiving signal into an electrical signal and transmit the electrical signal to the TIA 504. The TIA 504 is configured to convert the electrical signal into a voltage signal and amplify the voltage signal.

[0150] In some embodiments, when packaging the optical waveguide substrate 900a, the optical receiving chip 503, the laser chip 402, etc., it is exemplary necessary to fix the optical waveguide substrate 900a through the cover 910. Therefore, after the optical waveguide substrate 900a is installed, the cover 910 needs to be installed to fix the optical waveguide substrate 900a; then the optical components of the optical emitting end such as the laser chip 402 are packaged to ensure the optical transmission power; and then the optical components of the optical receiving end such as the optical receiving chip 503 are packaged. In order to facilitate the packaging of the optical receiving chip 503, the cover 910 is installed to fix the optical waveguide substrate 900a. The length of the cover shell 910 is relatively smaller than the surface length of the upper space 924, so that a certain space is reserved on the top surface of the base 920 for arranging the optical elements of the light receiving end such as the light receiving chip 503. For example, the optical elements of the light receiving end such as the light receiving chip 503 are encapsulated on the surface of the base 920 exposed relative to the cover shell 910. Therefore, the optical elements of the light receiving end such as the light receiving chip 503 are exposed relative to the cover shell 910 to facilitate the assembly of the optical elements of the light receiving end such as the light receiving chip 503.

[0151] Since the optical components of the light receiving end such as the light receiving chip 503 are exposed relative to the cover 910 , a protective cover 930 is provided to protect the light receiving chip 503 and the like. Exemplarily, the protective cover 930 covers the surface of the light receiving chip 503 .

[0152] In some embodiments, the protective cover 930 covers the surface of the light receiving chip 503; in some embodiments, the protective cover 930 covers the surfaces of the first lens 501, the turning prism 502, the light receiving chip 503 and the TIA504. At this time, one end of the protective cover 930 is connected to the cover shell 910, and the bottom end of the protective cover 930 is set on the front of the circuit board 300. For example, the side wall where the bottom end of the protective cover 930 is located overlaps the front of the circuit board 300, thereby covering the surfaces of the first lens 501, the turning prism 502, the light receiving chip 503 and the TIA504.

[0153] Figure 24 is a schematic diagram of the structure of a protective cover provided according to some embodiments of the present disclosure. As shown in Figure 24, the protective cover 930 includes a cover plate 933, a side plate 934 connected to the cover plate 933, a side plate 935, and a side plate 936. The cover plate 933 is configured to cover the light receiving component, the side plate 934 is configured to connect to the base 920, the side plate 935 is configured to connect to the base 920, and the side plate 936 is configured to connect to the circuit board 300. One side of the protective cover 930 is connected to the cover shell 910.

[0154] The surface of the protective cover 930 is formed with a first notch 931 and a second notch 932. The first notch 931 is configured to connect with the base 920; the second notch 932 is configured to avoid the fourth sidewall 922. The first notch 931 overlaps the surface of the base 920, and the second notch 932 is spliced ​​with the fourth sidewall 922, thereby securing the protective cover 930. In some embodiments, the first notch 931 can overlap the surface of the barrier 923, and the second notch 932 can be spliced ​​with the fourth sidewall 922.

[0155] FIG25 is a schematic diagram of a first cross-sectional assembly of a protective cover according to some embodiments of the present disclosure; FIG26 is a schematic diagram of a second cross-sectional assembly of a protective cover according to some embodiments of the present disclosure; and FIG27 is a schematic diagram of an exploded assembly of a protective cover according to some embodiments of the present disclosure. As shown in FIG25-27 , in some embodiments, in order to facilitate the assembly of the protective cover 930 and to facilitate the removal of the protective cover 930 when the protective cover 930 needs to be disassembled and repaired, a gap is provided between the side wall of the protective cover 930 and the third side wall 921. The presence of the gap leaves an operating space for clamping the protective cover 930, thereby facilitating the removal and placement of the protective cover. For example, the protective cover 930 is clamped between the gap and the outward side of the second notch 932, thereby removing the protective cover 930 and performing disassembly and repair on the protective cover 930.

[0156] The first notch 931 is connected to the surface of the barrier 923. For example, the first notch 931 is connected to the surface of the third support portion 9246, and the first notch 931 overlaps the surface of the third support portion 9246; the second notch 932 is connected to the fourth side wall 922. For example, the second notch 932 is connected to the fourth side wall 922 by splicing; one side of the protective cover 930 is connected to the side wall of the cover shell 910, and the bottom surface of the protective cover 930 is provided on the surface of the circuit board 300. The protective cover 930 is supported by the circuit board 300, and the protective cover 930 is respectively connected to the cover shell 910, the base 920, and the circuit board 300, thereby fixing the protective cover 930 to protect the first lens 501, the turning prism 502, the light receiving chip 503 and the TIA504 through the protective cover 930.

[0157] Figure 28 is a schematic diagram of the transmission optical path of an optical receiving component provided according to some embodiments of the present disclosure; Figure 29 is a schematic diagram of the relative position relationship of a circuit board, an optical emitting component and an optical receiving component provided according to some embodiments of the present disclosure; Figure 30 is a schematic diagram of the relative position relationship of a circuit board, an optical emitting component and an optical receiving component provided according to some embodiments of the present disclosure. As shown in Figures 28 to 30, the optical waveguide substrate 900a is arranged between the cover shell 910 and the base 920. For example, the optical waveguide substrate 900a is arranged between the cover shell 910 and the upper space 924. The upper space 924 is also configured to set a first lens 501 and a turning prism 502, and the lower space 925 is configured to set optical elements such as the laser chip 402. It can be seen that the optical waveguide substrate 900a, the first lens 501, and the turning prism 502 are on the same layer, and the optical waveguide substrate 900a and the laser chip 402 are on different layers. The light receiving signal output by the optical waveguide substrate 900a is transmitted to the light receiving chip 503 after one reflection, and the light transmitting signal generated by the laser chip 402 needs to be guided by the guiding light path to guide the generated light transmitting signal into the optical waveguide substrate 900a.

[0158] The optical receiving signal output by the optical waveguide substrate 900a is transmitted to the first lens 501. The turning prism 502 is configured to reflect the optical receiving signal downward to redirect the transmission direction of the optical receiving signal to the surface of the optical receiving chip 503. Exemplarily, the first lens 501 and the turning prism 502 are located on one side of the first optical output port 902a to receive the optical receiving signal output by the first optical output port 902a.

[0159] In some embodiments, the optical port of the optical waveguide substrate 900a optically interfaces with an internal optical fiber to transmit optical receive and transmit signals. The extension plate 912 of the cover 910 is inserted into the support groove 928 of the base 920, thereby connecting the cover 910 and the base 920. The cover 910 has a receiving cavity to accommodate and secure the optical waveguide substrate 900a.

[0160] In some embodiments, the top surface of the base 920 is formed with a first surface 9241, a second surface 9242, and a third surface 9243. The first surface 9241 is configured to accommodate the optical waveguide substrate 900a. The second surface 9242 and the third surface 9243 are configured to accommodate the first lens 501 and the turning prism 502, respectively. If the top surface of the base 920 is longer than the cover 910, the first lens 501 and the turning prism 502 are disposed on the excess surface. In this case, the first lens 501 and the turning prism 502 are exposed relative to the cover 910, facilitating mounting of the first lens 501 and the turning prism 502.

[0161] The optical axes of the first lens 501 and the turning prism 502 are on the same axis. The turning prism 502 is arranged on the output optical path of the first lens 501. The light receiving chip 503 is located below the turning prism 502, and the TIA 504 is located on one side of the light receiving chip 503. For example, the first lens 501 is a converging lens. The turning prism 502 is configured to reflect the light receiving signal transmitted by the first lens 501 and reflect it to the surface of the light receiving chip 503. The light receiving chip 503 is configured to convert the received light receiving signal into a photocurrent signal and transmit the electrical signal to the TIA 504. The TIA 504 is configured to convert the photocurrent signal into a voltage signal and amplify the voltage signal. When the optical module is multi-channel, the first lens 501 is arranged in the form of an array. Accordingly, the turning prism 502, the light receiving chip 503, and the TIA 504 are all arranged in the form of an array.

[0162] The first lens 501 is located on the surface of the second surface 9242, and the light incident surface of the first lens 501 faces the optical waveguide substrate 900a. Exemplarily, the light incident surface of the first lens 501 faces the first output light port 902a of the optical waveguide substrate 900a to receive the optical receiving signal output from the first output light port 902a; the light exit surface of the first lens 501 faces the turning prism 502 to transmit the optical receiving signal transmitted from the first lens 501 to the interior of the turning prism 502.

[0163] The turning prism 502 is located on the third surface 9243. The light incident surface of the turning prism 502 faces the first lens 501, and the light emitting surface faces the light receiving chip 503 disposed on the front surface of the circuit board 300. The turning prism 502 is configured to reflect the received light receiving signal toward the surface of the light receiving chip 503 disposed on the front surface of the circuit board 300. For example, the turning prism 502 has an inclined surface, through which the light receiving signal incident on its surface is reflected. The inclined surface can be inclined at a predetermined angle, thereby achieving a total internal reflection effect, and completely reflecting the light signal incident on its surface. Exemplarily, the light incident surface of the turning prism 502 faces the first lens 501 to receive the light signal transmitted through the first lens 501 and reflect the light signal, thereby turning its light path. Exemplarily, the transmission light path of the light signal is turned downward to reflect the light signal into the light receiving chip 503 located below the turning prism 502; the light emitting surface of the turning prism 502 faces the light receiving chip 503 to transmit the reflected light signal into the light receiving chip 503.

[0164] The optical receiving chip 503 is located on a surface of the circuit board 300. For example, the optical receiving chip 503 is located on the front of the circuit board 300. The optical receiving chip 503 is wired connected to the TIA504. The light incident surface of the optical receiving chip 503 faces the light emitting surface of the turning prism 502 to receive the optical receiving signal reflected by the turning prism 502.

[0165] The TIA 504 is located on a surface of the circuit board 300 . Exemplarily, the TIA 504 is located on the front side of the circuit board 300 and on one side of the optical receiving chip 503 . The TIA 504 is connected to the circuit board 300 by wire bonding.

[0166] In some embodiments, after entering the optical module, the optical receiving signal enters the optical waveguide substrate 900a along the internal optical fiber from the first input optical port 901a of the optical waveguide substrate 900a, is output from the first output optical port 902a along the internal optical channel, and is transmitted to the first lens 501. After being converged by the first lens 501, it continues to be transmitted to the turning prism 502. After being reflected by the oblique surface of the turning prism 502, the light path turns downward and turns to the surface of the optical receiving chip 503 on the circuit board 300. The optical receiving chip 503 converts the received optical receiving signal into a photocurrent signal, and then the TIA504 converts the photocurrent signal into a voltage signal and amplifies the voltage signal.

[0167] The first lens 501 is located on the surface of the second surface 9242, and the light receiving chip 503 is located on the surface of the circuit board 300. The height of the second surface 9242 is higher than the height of the circuit board 300, and there is a certain positional misalignment between the first lens 501 and the light receiving chip 503. Therefore, a turning prism 502 is provided on the output light path of the first lens 501, and the light path of the light signal transmitted through the first lens 501 is turned downward by the turning prism 502 to the surface of the light receiving chip 503.

[0168] The first lens 501 and the turning prism 502 are arranged opposite to each other so that the optical signal transmitted from the first lens 501 is incident on the turning prism 502. The focal length of the first lens 501 should be sufficient to ensure that the optical signal transmitted from the first lens 501 is reflected by the turning prism 502 and then focused on the surface of the optical receiving chip 503, thereby reducing the size of the light spot and making the optical receiving signal fall within the light receiving range of the optical receiving chip 503.

[0169] In some embodiments, the first surface 9241 where the optical waveguide substrate 900a is located, the second surface 9242 where the first lens 501 is located, and the third surface 9243 where the turning prism 502 is located are arranged in a stepped manner. The purpose of this arrangement is to ensure that the optical axes of the optical waveguide substrate 900a, the first lens 501, and the turning prism 502 are all on the same axis.

[0170] In some embodiments, one end of the circuit board 300 extends into the opening 927. The exposed surface of the circuit board 300, which is opposite to the cover 910, is provided with a light receiving chip 503 and a TIA 504. The optical signal output from the turning prism 502 is transmitted to the surface of the light receiving chip 503, where it is then converted and processed.

[0171] Exemplarily, a portion of the turning prism 502 is disposed on the third surface 9243; a portion is not disposed on the third surface 9243, and this portion is suspended relative to the third surface 9243, and a light receiving chip 503 is provided under the suspended portion, so that the light signal reflected by the turning prism 502 passes through the light emitting surface of the suspended portion and is transmitted to the light receiving chip 503.

[0172] Exemplarily, since the thickness of the optical waveguide substrate 900 a is smaller than the height of the first lens 501 , the height of the first surface 9241 where the optical waveguide substrate 900 a is located is higher than the height of the second surface 9242 where the first lens 501 is located.

[0173] In the present disclosure, the optical receiving chip 503 and the optical waveguide substrate 900a are on the same layer, and the transmission of the optical receiving signal is on the same layer, without the need for optical path switching and guidance at upper and lower heights. The optical receiving signal transmission path is relatively simple, and there are fewer optical devices on the transmission path, thereby reducing the loss of optical power and allowing more optical receiving signals to be transmitted to the surface of the optical receiving chip 503.

[0174] In some embodiments of the present disclosure, as the rate of the optical module increases, the photosensitive surface of the optical receiving chip 503 becomes smaller and smaller. For example, the photosensitive surface is reduced from 30um to 16um, or even 12um. However, the smaller photosensitive surface affects the optical coupling efficiency. The first lens 501 focuses the received optical receiving signal once. In order to improve the optical coupling efficiency, a second focusing may be performed before the optical receiving signal is transmitted to the surface of the optical receiving chip 503 to improve the optical coupling efficiency and increase the coupling tolerance.

[0175] In some embodiments, a spherical lens is provided between the turning prism 502 and the light receiving chip 503. The first lens 501 focuses the received light signal once, and the spherical lens focuses the light signal output by the turning prism 502 a second time, thereby improving the light coupling efficiency. The light spot output by the spherical lens is mostly a light spot with uneven energy distribution. When the light spot with uneven energy distribution is coupled to the photosensitive surface, the energy in a certain range of the photosensitive surface is too concentrated, resulting in a photocurrent overshoot phenomenon. At the same time, the focal length of the spherical lens is difficult to control, thereby affecting the light coupling efficiency. In addition, for spherical lenses, due to their manufacturing process, the poor consistency of the lens center leads to poor consistency of the optical path, which also reduces the coupling efficiency.

[0176] In some embodiments, an aspheric lens is provided between the turning prism 502 and the light receiving chip 503. For example, such as a super lens, the first lens 501 focuses the received light signal once, and the aspheric lens focuses the light signal output by the turning prism 502 for a second time, thereby improving the light coupling efficiency. The aspheric lens has strong flexibility and freedom, and can output a uniform light spot, thereby avoiding the photocurrent overshoot phenomenon. For example, the aspheric lens includes a substrate and a plurality of dielectric units provided on the surface of the substrate. By changing the size or arrangement of the dielectric units, a light spot with uniform energy distribution can be output, thereby avoiding the photocurrent overshoot phenomenon. At the same time, the focal length of the aspheric lens is easier to control. For example, the focal length is adjusted by changing the size or arrangement of the dielectric units, thereby improving the light coupling efficiency. In addition, in the present disclosure, the aspheric lens is integrated with the light receiving chip monolithically or wafer-integrated, thereby reducing the tolerance introduced in the patch process, thereby improving the coupling efficiency.

[0177] FIG31 is a structural diagram of an optical receiver chip provided according to some embodiments of the present disclosure; FIG32 is an exploded schematic diagram of an optical receiver chip provided according to some embodiments of the present disclosure. As shown in FIG31 and FIG32, in some embodiments, an aspheric lens 505 is provided on the surface of the optical receiver chip 503. Relative to the aspheric lens 505, the first lens 501, the second lens 403, and the third lens 409 are spherical lenses. The aspheric lens 505 is concentric with the photosensitive surface of the optical receiver chip 503. The first lens 501 focuses the optical reception signal once and enters the turning prism 502. The aspheric lens 505 focuses the optical signal reflected from the turning prism 502 twice, thereby reducing the spot size, allowing the spot to focus on a smaller photosensitive surface, and improving the optical coupling efficiency.

[0178] The aspheric lens 505 outputs a light spot with uniform energy distribution to avoid photocurrent overshoot. At the same time, the focal length of the aspheric lens 505 is easily adjustable, so that the light spot is focused on the photosensitive surface of the light receiving chip 503, thereby improving the light coupling efficiency.

[0179] In some embodiments, the optical receiver chip 503 includes a top surface 5033 having a photosensitive surface 5031. A GSG pad 5032 is provided on the surface surrounding the photosensitive surface 5031. The GSG pad 5032 is a ground-signal-ground pad. As the channel transmission rate increases, the area of ​​the photosensitive surface 5031 decreases. Therefore, the light spot of the optical receiving signal coupled to the optical receiver chip 503 should be reduced in size so that the light spot falls within the photosensitive surface 5031.

[0180] In some embodiments, the aspheric lens 505 can be mounted on the surface of the light receiving chip 503. When mounting the aspheric lens 505, it is necessary to identify the relative position of the aspheric lens 505 and the center of the photosensitive surface of the light receiving chip 503. The accuracy requirement is very high, and the compatibility between the channels must also be considered when coupling the array.

[0181] In some embodiments, the aspheric lens 505 is combined with the light receiving chip 503 through a MEMS process to achieve optical expansion of the photosensitive surface of the front-illuminated light receiving chip 503, thereby improving the light coupling efficiency. Exemplarily, the MEMS process includes steps such as photolithography, epitaxy, thin film deposition, oxidation, diffusion, implantation, sputtering, evaporation, etching, scribing, and packaging.

[0182] In the present disclosure, on the one hand, the spherical lens cannot output a uniform light spot to the light receiving chip, and on the other hand, the surface of the substrate 5051 faces the turning prism 502. At this time, if a spherical lens is set on the surface of the substrate 5051, then since the spherical lens achieves the focusing effect through refraction, and the curved surface is relatively far away from the photosensitive surface of the light receiving chip 503, it is easy for the light spot output by the spherical lens to be focused above the photosensitive surface. Therefore, the lens structure set between the turning prism 502 and the light receiving chip 503 in the present disclosure is an aspherical lens.

[0183] In some embodiments, when a non-spherical dielectric unit is etched on the surface of the substrate 5051, an aspheric lens 505 is obtained. For example, when the aspheric lens 505 is a metalens, the focal length can be adjusted by adjusting parameters such as the size or arrangement of the dielectric unit so that the output light spot falls on the photosensitive surface. A metalens, also known as a metasurface lens, is a two-dimensional aspheric lens structure. A metalens focuses light through a metasurface, such as a planar two-dimensional metamaterial with a sub-wavelength thickness. Compared to traditional lenses, metalens have the advantages of being thinner, lighter, lower cost, better imaging, and easier to integrate. They provide a potential solution for compact integrated optical systems, and can control properties such as polarization, phase, and amplitude of light by adjusting parameters such as the shape, rotation direction, and height of the structure.

[0184] In some embodiments, an aspheric lens 505 is disposed on the surface of the light receiving chip 503 using a CMOS process. For example, a substrate 5051 is grown along the GSG pad 5032 on the top surface 5033 of the aspheric lens 505. Then, a plurality of dielectric units 5052 are etched on the exposed surface of the substrate 5051, i.e., the top surface. Because the GSG pad 5032 has a certain thickness, grooves are formed on the bottom surface 5054 of the substrate 5051. Each groove is precisely embedded in the surface of the GSG pad 5032. Since the bottom surface of the substrate 5051 needs to be embedded in the surface of the GSG pad 5032, the grooves are formed on the bottom surface of the substrate 5051. The top surface of the substrate 5051 must be flat to facilitate etching to form the dielectric units 5052. For example, the center of the dielectric unit 5052 is concentric with the center of the photosensitive surface 5031 to improve optical coupling efficiency.

[0185] The material of the substrate 5051 and the dielectric unit 5052 is a light-transmitting material, such as SiO2. The specific material of the substrate 5051 and the dielectric unit 5052 can be flexibly selected according to the wavelength, transmittance, and CTE matching of the light receiving signal.

[0186] In some embodiments, the dielectric units are in the form of dielectric columns, and the dielectric columns are arranged in the form of an array. The array can be a rectangular array, or the center of the substrate 5051 can be used as the center of a circle and etching is performed outward in sequence to arrange the dielectric units, such as winding a certain number of dielectric columns into a circle to obtain dielectric column array circles of different diameters.

[0187] Exemplarily, the dielectric pillars are silicon pillars or silicon oxide pillars. By adjusting the size of the dielectric pillars or the arrangement of the dielectric unit arrays, such as the spacing, continuous phase adjustment is achieved. This modulates the initial phase of incident light at different locations, causing interference between the different incident light beams. This gradually concentrates the energy of the incident light in the same direction, thereby achieving a focusing effect.

[0188] In the present disclosure, by adjusting the size of the dielectric column or the arrangement of each dielectric unit array, such as the arrangement spacing, the properties of the light spot, such as the light spot energy distribution, can be adjusted to output a light spot with uniform energy distribution, thereby avoiding the photocurrent overshoot phenomenon.

[0189] In the present disclosure, since the substrate is grown by thin film growth, in order to avoid stress, the substrate cannot be grown too thick, that is, the size of the substrate 5051 is relatively thin. At this time, the focal length of the lens on the substrate surface is required to be relatively small, so that the light spot is focused on the photosensitive surface; in some embodiments, if a spherical lens is set on the substrate surface, the focusing effect of the spherical lens is affected by the curvature radius and the refractive index, and it is difficult to adjust the curvature radius or the refractive index so that the spherical lens has a very small focal length. At this time, the focal length of the spherical lens causes the light spot to focus below the photosensitive surface, thereby reducing the light coupling efficiency.

[0190] Because the substrate is very thin, the corresponding focal length is very small. Even if the radius of curvature and refractive index of a spherical lens are adjusted to their limits, it still cannot achieve such a small focal length. However, the focal length of an aspherical lens can be adjusted by adjusting the size of the dielectric columns or the arrangement of the dielectric unit arrays, such as the spacing, so that the aspherical lens has a smaller focal length, thereby adapting to thinner substrates and focusing the light spot on the photosensitive surface. For example, the preset focal length of the aspherical lens 505 can be determined based on the thickness of the substrate. That is, there is a preset relationship between the preset focal length of the aspherical lens 505 and the thickness of the substrate. When the substrate is thinner, the preset focal length of the lens is smaller. The preset focal length of the aspherical lens 505 can be matched to the thickness of the substrate, ultimately focusing the light spot on the surface of the light receiving chip 503.

[0191] In some embodiments, when mounting the light receiving chip 503, the mounting alignment is performed through the center of the photosensitive surface. Since the surface of the photosensitive surface is covered by the aspheric lens 505 in the present disclosure, an identification position 5053 is formed on the surface of the aspheric lens 505. The light receiving chip 503 is mounted through the relative position relationship between the identification position 5053 and the center of the photosensitive surface 5031 to ensure the mounting accuracy.

[0192] In some embodiments, an aspheric lens 506 is mounted on the surface of the light receiving chip 503. There is a certain distance between the substrate of the aspheric lens 506 and the surface of the light receiving chip 503. The aspheric lens 506 and the photosensitive surface of the light receiving chip 503 are concentrically arranged. The first lens 501 focuses the light signal once and enters the turning prism 502. The aspheric lens 506 focuses the light signal reflected from the turning prism 502 for a second time, thereby reducing the size of the light spot, so that the light spot is focused on a smaller photosensitive surface, and improving the light coupling efficiency.

[0193] The aspheric lens 506 outputs a light spot with uniform energy distribution to avoid photocurrent overshoot. At the same time, the focal length of the aspheric lens 506 is easily adjustable, so that the light spot is focused on the photosensitive surface of the light receiving chip 503, thereby improving the light coupling efficiency.

[0194] In some embodiments, the aspheric lens 506 may be bonded to the surface of the light receiving chip 503 by optical adhesive; in some embodiments, the aspheric lens 506 may also be combined with the light receiving chip 503 by MEMS technology.

[0195] FIG33 is an exploded schematic diagram of another light receiving chip provided according to some embodiments of the present disclosure. As shown in FIG33 , in some embodiments, the aspheric lens 505 is a metalens. When the aspheric lens 506 is a metalens, and the metalens is combined with the light receiving chip 503 via a CMOS process, in addition to the photosensitive surface 5031 and the GSG pad 5032, the surface of the light receiving chip 503 also includes a connection pad 5034. Exemplarily, the connection pad 5034 is configured to connect the light receiving chip 503 to the metalens.

[0196] In some embodiments, when the aspheric lens 506 is a metalens, the aspheric lens 5056 includes a substrate 5061, a dielectric unit 5062 formed by etching the top surface of the substrate 5061, and a protrusion 5063 formed by electroplating on the bottom surface of the substrate 5061. Exemplarily, the substrate 5061 is a silicon-based wafer, and the dielectric unit 5062 is formed by etching the surface of the silicon-based wafer. Exemplarily, the protrusion 5063 is in the form of a protrusion, which can be a metal column, such as a copper column. The protrusion 5063 is connected to the connection pad 5034 via metal solder, thereby connecting the light receiving chip 503 to the metalens.

[0197] Similarly, the dielectric units are in the form of dielectric columns, and the dielectric columns are arranged in the form of an array. The array can be a rectangular array, or the center of the substrate 5051 can be used as the center of a circle and etching is performed outward in sequence to arrange the dielectric units, such as winding a certain number of dielectric columns into a circle, and then obtaining dielectric column array circles of different diameters.

[0198] Exemplarily, the dielectric pillars are silicon pillars or silicon oxide pillars. By adjusting the size of the dielectric pillars or the arrangement of the dielectric unit arrays, such as the spacing, the properties of the light spot, such as the light spot energy distribution, can be adjusted to output a light spot with uniform energy distribution, thereby avoiding photocurrent overshoot.

[0199] In some embodiments, an aspheric lens, such as a metalens, is provided on the surface of the substrate. The focal length can be adjusted by adjusting the size of the dielectric column or the arrangement of the dielectric unit arrays, such as the arrangement spacing, so that the aspheric lens has a smaller focal length, thereby adapting to the thinner substrate, thereby focusing the light spot on the photosensitive surface.

[0200] Since there is a protrusion 5063 between the substrate 5061 and the photosensitive surface of the light receiving chip 503, both the upper and lower surfaces of the substrate 5061 can be etched to form a dielectric unit.

[0201] The protrusion 5063 has a preset height to match the focal length of the aspheric lens 506 , so that the output light spot is focused on the photosensitive surface of the light receiving chip 503 .

[0202] In some embodiments, an identification position 5064 is formed on the surface of the aspheric lens 506 , and the light receiving chip 503 is mounted based on the relative position relationship between the identification position 5064 and the center of the photosensitive surface 5031 to ensure mounting accuracy.

[0203] Figure 34 is a cross-sectional view of the internal structure of another optical module provided according to some embodiments of the present disclosure. As shown in Figure 34, in some embodiments, an aspheric lens 507 is provided on the light-emitting surface of the turning prism 502. The aspheric lens 507 is adhered to the light-emitting surface of the turning prism 502 using optical adhesive.

[0204] The optical signal output by the turning prism 502 is converged by the aspheric lens 507 and then incident on the surface of the light receiving chip 503, thereby further reducing the size of the optical signal spot through secondary focusing, so that the spot falls on the photosensitive surface of the light receiving chip 503, thereby improving the optical coupling efficiency.

[0205] In some embodiments, the aspheric lens 507 also includes a substrate, and a dielectric unit is etched on the surface of the substrate. By changing the size or arrangement of the dielectric unit, its focal length is adjusted so that the light spot is focused on the photosensitive surface, and the output light spot is a light spot with uniform energy distribution.

[0206] In some embodiments, the substrate of the aspheric lens 507 is connected to the light-emitting surface of the turning prism 502 , and a dielectric unit is formed by etching the surface of the substrate facing the light-receiving chip.

[0207] In some embodiments of the present disclosure, the light-emitting surface of the turning prism 502 is used as a substrate, and a dielectric unit is formed thereon. Since the light-emitting surface of the turning prism 502 is made of glass, it is difficult to form the dielectric unit through an etching process. For example, the dielectric unit can be formed by melt injection molding.

[0208] Figure 35 is a cross-sectional view of the internal structure of another optical module provided according to some embodiments of the present disclosure. As shown in Figure 35, a support portion 508a is provided on the surface of the circuit board 300. An aspheric lens 508 is provided on the surface of the support portion 508a. The aspheric lens 508 is disposed between the turning prism 502 and the light receiving chip 503. The aspheric lens 508 performs secondary focusing on the light signal reflected from the turning prism 502 to reduce the size of the light signal spot, so that the spot falls on the photosensitive surface of the light receiving chip 503, thereby improving the optical coupling efficiency.

[0209] In some embodiments, aspheric lens 508 also includes a substrate, with dielectric units etched onto the surface of the substrate. The substrate in aspheric lens 508 is manufactured using the same process as the substrate in aspheric lens 506, and the dielectric units in aspheric lens 508 are manufactured using the same process as the dielectric units in aspheric lens 506. The substrate of aspheric lens 508 is a silicon-based wafer, with dielectric units etched onto the surface of the silicon-based wafer. The dielectric units in aspheric lens 508 are also metalenses. By controlling the initial phase of incident light at different locations, interference occurs between the different incident light beams, thereby gradually concentrating the energy of the incident light in the same direction, thereby achieving a focusing effect.

[0210] In the present disclosure, the optical receiver chip 503 and the optical waveguide substrate 900a are located on the same layer, and the optical receive signal is transmitted on the same layer, with a simple optical path. The laser chip 402 and the optical waveguide substrate 900a are located on different layers, and the optical transmit signal is transmitted across layers, with a more complex optical path. During active coupling, since the optical transmitter has its own light source, the optical power loss experienced by the optical transmitter is higher than that of the optical receiver. Therefore, the optical receiver requires a simpler optical path than the optical transmitter. In other words, the optical transmitter is more suitable for a complex optical path than the optical receiver. To this end, in the present disclosure, the transmission of the optical receive signal is configured as on-layer transmission between the optical waveguide substrate 900a and the optical transmit signal is configured as cross-layer transmission between the optical waveguide substrate 900a.

[0211] In some embodiments, the reverse side of the circuit board 300 and the bottom surface of the base 920 are in the same direction. As can be seen from the above, the reverse side of the circuit board 300 refers to the opposite side where the DSP chip 302 is provided.

[0212] The bottom surface of the base 920 is further provided with a cover 940 , which is buckled onto the bottom surface of the base 920 to protect the light emitting component.

[0213] Figure 36 is a structural diagram of a light emitting component provided according to some embodiments of the present disclosure, and Figure 37 is a cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure. As shown in Figures 36 and 37, after removing the cover 940 from the bottom surface of the base 920, it can be seen that the bottom surface of the base 920 is recessed toward the upper space 924 to form a lower space 925. The lower space 925 includes a first recessed portion 9251 and a second recessed portion 9252 of varying degrees of recess. Optical components at the light emitting end, such as the TEC 401, laser chip 402, second lens 403, and reflector, are located within the lower space 925. The light emitted by the laser chip 402 is divergent light; the second lens 403 is a collimating lens, configured to collimate the divergent light emitted by the laser chip 402 into parallel light; and the third lens 409 is a converging lens. When the optical module is multi-channel, the laser chip 402, second lens 403, and third lens 409 are arranged in an array. The laser chip 402 and the second lens 403 are both arranged on the surface of TEC401. The second lens 403 is arranged on the light output path of the laser chip 402. The TEC401 is configured to ensure that the laser chip 402 is within a certain working range, thereby ensuring the stability of the output light power of the laser chip 402.

[0214] TEC401, laser chip 402, and second lens 403 constitute a light-emitting component, which is arranged in the first recessed portion 9251. Since the laser chip 402 is located in the lower space 925 and the optical waveguide substrate 900a is located in the upper space 924, it is necessary to guide the optical path to guide the light emission signal generated by the laser chip 402 into the optical waveguide substrate 900a, thereby transmitting the light emission signal through the optical waveguide substrate 900a. To this end, a reflector is provided on the light output path of the laser chip 402, and the reflector is configured to guide the light emission signal toward the side wall of the base 920, illustratively, to guide the light emission signal toward the side wall of the baffle 923; then, a displacement prism is provided on the side wall of the base 920, illustratively, on the side wall of the baffle 923, and the reflector reflects the light emission signal toward the displacement prism, and guides the light emission signal into the optical waveguide substrate 900a through the displacement prism, illustratively, to the second input optical port 903a, thereby transmitting the light emission signal to the optical waveguide substrate 900a through the second input optical port 903a, and transmitting the light emission signal through the optical waveguide substrate 900a.

[0215] In some embodiments, the side of the second recessed portion 9252 is connected to a vertical surface, and the reflector is placed on the vertical surface to achieve the fixation of the reflector. Because the TEC 401 in the light-emitting assembly has a certain height, in order to ensure that the collimated light emitted from the second lens 403 is incident on the reflector, the first recessed portion 9251 is more recessed than the second recessed portion 9252.

[0216] In some embodiments, the light input end and the light output end of the displacement prism are exposed relative to the barrier 923, the light input end of the displacement prism faces the lower space 925, and the light output end of the displacement prism faces the upper space 924. The displacement prism is used to guide the light emission signal generated by the laser chip 402 to the second input light port 903a located in the upper space 924, thereby transmitting the light emission signal to the optical waveguide substrate 900a.

[0217] In some embodiments, when the optical module is an 800G optical module, it includes 8 laser chips 402. These 8 laser chips 402 are divided into two groups, namely a first laser chip array 402a and a second laser chip array 402b. The first laser chip array 402a and the second laser chip array 402b each include 4 laser chips 402. To monitor the operating temperature of the laser chips 402, a thermistor is provided between the first laser chip array 402a and the second laser chip array 402b. That is, a thermistor is provided between two adjacent laser chips in the first laser chip array 402a and the second laser chip array 402b. The four laser chips 402 in the first laser chip array 402a are equally spaced, and the four laser chips 402 in the second laser chip array 402b are equally spaced. However, the presence of the thermistor increases the distance between the last laser chip 402 in the first laser chip array 402a and the first laser chip 402 in the second laser chip array 402b. That is, the distance between two adjacent laser chips in the first laser chip array 402a and the second laser chip array 402b is increased. To this end, illustratively, the reflector includes a first reflector 404 and a second reflector 405. The first reflector 404 and the second reflector 405 are offset to compensate for the difference in optical channel spacing caused by the presence of the thermistor.

[0218] Correspondingly, when there are eight laser chips 402, there are eight second lenses 403. These eight second lenses 403 are divided into two groups: a first lens array 403a and a second lens array 403b. The first lens array 403a is positioned on the output optical path of the first laser chip array 402a, with the first lens array 403a corresponding to the second lens array 403b. The second lens array 403b is positioned on the output optical path of the second laser chip array 402b, with the second lens array 403b corresponding to the first lens array 403a.

[0219] The light incident surface of the first lens array 403a is arranged opposite to the light emitting surface of the first laser chip array 402a, and the light emitting surface is arranged opposite to the first reflector 404, so that the light emission signal emitted by the first laser chip array 402a passes through the first lens array 403a and is incident on the surface of the first reflector 404. The first reflector 404 reflects and transmits the received light emission signal.

[0220] The light incident surface of the second lens array 403b is arranged opposite to the light emitting surface of the second laser chip array 402b, and the light emitting surface is arranged opposite to the second reflector 405, so that the light emission signal emitted by the second laser chip array 402b passes through the second lens array 403b and is incident on the surface of the second reflector 405. The second reflector 405 reflects and transmits the received light emission signal.

[0221] In order to set the first reflector 404 and the second reflector 405, a first vertical surface 9253 and a second vertical surface 9254 are respectively connected to one side of the second recessed portion 9252. The first vertical surface 9253 and the second vertical surface 9254 are perpendicular to the surface of the second recessed portion 9252. The first vertical surface 9253 is configured to set the first reflector 404, and the second vertical surface 9254 is configured to set the second reflector 405. For example, the first reflector 404 is attached to the surface of the first vertical surface 9253, and the second reflector 405 is attached to the surface of the second vertical surface 9254, thereby achieving the fixation of the first reflector 404 and the second reflector 405.

[0222] Figure 38 is a partial structural diagram of a light emitting component provided according to some embodiments of the present disclosure. As shown in Figure 38, the divergent light output by the laser chip 402 is converted from divergent light to collimated light after being collimated by the second lens 403. The collimated light beam transmitted by the second lens 403 is incident on the surface of the corresponding first reflector 404 or second reflector 405.

[0223] In some embodiments, the first reflector 404 is in the form of a long reflector, which receives the light signal transmitted from the first lens array 403a with a larger light-collecting area; the second reflector 405 is also in the form of a long reflector, which receives the light signal transmitted from the second lens array 403b with a larger light-collecting area.

[0224] In order to compensate for the optical channel spacing difference caused by the position of the thermistor, the first reflector 404 and the second reflector 405 are staggered. For example, the first reflector 404 is farther away from the position of the second lens 403 than the second reflector 405 .

[0225] Figure 39 is an optical path diagram of a light emitting component provided according to some embodiments of the present disclosure; Figure 40 is a side view cross-section 1 of a light emitting component provided according to some embodiments of the present disclosure; and Figure 41 is a side view cross-section 2 of a light emitting component provided according to some embodiments of the present disclosure. As shown in Figures 39-41, a displacement prism is disposed on a side wall of the base 920. For example, the displacement prism is disposed on a side wall of the barrier 923. The light input end of the displacement prism faces the layer where the laser chip 402 is located, and the light output end faces the light input end of the optical waveguide substrate 900a, for example, toward the second input optical port 903a, so as to guide the light emission signal output by the reflector toward the second input optical port 903a.

[0226] To correspond to the first reflector 404 and the second reflector 405, the displacement prism includes a first displacement prism 406 and a second displacement prism 407. The first reflector 404 corresponds to the first displacement prism 406, and the second reflector 405 corresponds to the second displacement prism 407. The light-emitting surface of the first reflector 404 faces the light-incident surface of the first displacement prism 406, so that the optical signal output by the first reflector 404 is transmitted to the surface of the first displacement prism 406; the light-emitting surface of the second reflector 405 faces the light-incident surface of the second displacement prism 407, so that the optical signal output by the second reflector 405 is transmitted to the surface of the second displacement prism 407.

[0227] In some embodiments, the first displacement prism 406 and the second displacement prism 407 are both fixed in a fixing frame 408, which wraps the first displacement prism 406 and the second displacement prism 407. The fixing frame 408 is then fixed in the embedded portion 926 on the side wall of the base 920, thereby fixing the first displacement prism 406 and the second displacement prism 407.

[0228] In order to facilitate the transmission of the optical path, the hollow size of the embedded portion 926 exposes the upper and lower surfaces of the partition 923. The light input end of the displacement prism faces the lower surface of the partition 923, and the light output end faces the upper surface of the partition 923. Then, the light input end and the light output end of the displacement prism are both exposed relative to the partition 923, which is beneficial to the transmission of light emission signals on the upper and lower surfaces of the partition. For example, the light emission signals transmitted to the first displacement prism 406 and the second displacement prism 407 are transmitted on the lower surface of the partition, and the light emission signals output from the first displacement prism 406 and the second displacement prism 407 are transmitted on the upper surface of the partition.

[0229] The first displacement prism 406 and the second displacement prism 407 are respectively configured to turn the transmission direction of the optical emission signals generated by the first laser chip array 402a and the second laser chip array 402b toward the optical waveguide substrate 900a, so as to transmit the optical emission signals emitted by the optical emission components to the outside of the optical module through the optical waveguide substrate 900a.

[0230] One end of the first displacement prism 406 is directed toward the first reflector 404, and the other end is directed toward the optical waveguide substrate 900a. One end of the second displacement prism 407 is directed toward the second reflector 405, and the other end is directed toward the optical waveguide substrate 900a, so as to reflect the optical signals reflected by the corresponding reflectors respectively, so that the optical transmission signal is transmitted into the optical waveguide substrate 900a.

[0231] In some embodiments, the first displacement prism 406 is configured to receive optical signals output sequentially from the first laser chip array 402a, the first lens array 403a, and the first reflector 404, and change the transmission direction of the optical signal. For example, the optical signal is reflected twice on the bottom surface of the base 920 and then transferred to the top surface of the base 920. Similarly, the second displacement prism 407 also has this function.

[0232] The first displacement prism 406 includes a straight surface, a first inclined surface, and a second inclined surface. One end of the straight surface is connected to the first inclined surface, and the other end of the straight surface is connected to the second inclined surface. The straight surface serves as both the light incident surface and the light emitting surface, and faces both the first reflector 404 and the optical waveguide substrate 900a. The portion of the straight surface serving as the light incident surface faces the first reflector 404, while the portion of the straight surface serving as the light emitting surface faces the optical waveguide substrate 900a. The first inclined surface and the second inclined surface are disposed opposite each other, with the inclination of the first inclined surface being opposite to the inclination of the second inclined surface. The first inclined surface faces the bottom surface of the base 920, illustratively, toward the first reflector 404; the second inclined surface faces the top surface of the base 920, illustratively, toward the direction of the third lens 409 and the optical waveguide substrate 900a. The second inclined surface faces the third lens 409, which in turn faces the second input optical port 903a of the optical waveguide substrate 900a. This redirects the optical transmit signal output by the laser chip 402 to the second input optical port 903a of the optical waveguide substrate 900a. The signal is then transmitted along the optical channel within the optical waveguide substrate 900a to the second output optical port 904a. The signal is then output along the second output optical port 904a, output to the internal optical fiber, and then transmitted along the external optical fiber to the outside of the optical module, thereby transmitting the optical transmit signal. Similarly, the operating principle of the second displacement prism 407 is similar.

[0233] The first inclined surface of the first displacement prism 406 faces the first reflector 404, and is configured to receive the light emission signal reflected by the first reflector 404 and reflect the light emission signal reflected by the first reflector 404 toward the second inclined surface; the second inclined surface faces the direction of the third lens 409 and the optical waveguide substrate 900a, and is configured to receive the light emission signal reflected from the first inclined surface and reflect the light signal reflected by the first inclined surface so that the transmission direction of the light emission signal is toward the third lens 409 and then toward the optical waveguide substrate 900a.

[0234] The first displacement prism 406 and the second displacement prism 407 are both vertically arranged across the side wall of the bottom surface to the side wall of the top surface of the base 920, so that the light path, after transmitting through the first displacement prism 406, turns to the top surface of the base 920, illustratively, enters the optical waveguide substrate 900a on the top surface of the base 920.

[0235] In some embodiments, the optical emission signal reflected from the first reflector 404 first reaches the first inclined surface of the first displacement prism 406. After being reflected by the first inclined surface, the optical signal reaches the second inclined surface. Then, after being reflected by the second inclined surface, the optical emission signal is output through a straight surface and reaches the third lens 409. The third lens 409 is oriented toward the second input optical port 903a of the optical waveguide substrate 900a, thereby transferring the optical emission signal generated by the laser chip 402 to the second input optical port 903a of the optical waveguide substrate 900a, transmitting the optical signal along the optical channel within the optical waveguide substrate 900a to the second output optical port 904a, and outputting the signal along the second output optical port 904a. Therefore, the first displacement prism 406 can perform two reflections, redirecting the optical signal's transmission direction twice: the first reflection is performed by the first inclined surface, reflecting the optical signal reflected from the first reflector 404 onto the second inclined surface. This redirects the optical transmission signal's transmission direction from the output optical path of the first reflector 404 to a vertical direction, i.e., toward the second inclined surface. The second reflection is performed by the second inclined surface, redirecting the optical signal reflected from the second inclined surface from a vertical direction to a direction toward the optical waveguide substrate 900a. The "vertical direction" refers to the direction from the upper space 924 toward the lower space 925.

[0236] In some embodiments, the third lens 409 is arranged in an array on the surface of the fourth surface 929, and the fourth surface 929 is located on the side of the second input optical port 903a of the optical waveguide substrate 900a, so that the optical signal transmitted by the third lens 409 enters the optical waveguide substrate 900a from the second input optical port 903a.

[0237] In some embodiments, the fourth surface 929 on which the third lens 409 is disposed is more recessed relative to the first surface 9241 on which the optical waveguide substrate 900a is disposed, so that the light exit axis of the third lens 409 and the light input axis of the optical waveguide substrate 900a are aligned.

[0238] In the embodiment of the present disclosure, by setting the displacement prism in the vertical direction, the first inclined surface in the displacement prism faces the bottom surface of the base 920, and the second inclined surface faces the top surface of the base 920, the displacement prism is vertically arranged across the side wall of the base 920, so that the light path originally on the bottom surface of the base 920 can be turned twice, thereby turning the light path to the bottom surface of the base 920, illustratively, to the optical waveguide substrate 900a set on the bottom surface of the base 920, wherein "vertical direction" refers to the direction from the upper space 924 to the lower space 925.

[0239] In the embodiment of the present disclosure, the optical waveguide substrate 900a and the optical receiving chip 503 are both located in the upper space, i.e., the top surface of the barrier 923, so that the optical receiving signal can be directly transmitted along the optical channel inside the optical waveguide substrate 900a to the optical receiving chip 503, thereby realizing the reception of the optical signal; since the laser chip 402 is located in the lower space, i.e., the bottom surface of the barrier 923, the optical emission signal generated by the laser chip 402 is guided by the reflector and the displacement prism to guide the optical emission signal to the second input optical port 903a of the optical waveguide substrate 900a, thereby realizing the emission of the optical signal.

[0240] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. An optical module, comprising: Circuit boards; A cover shell, one end of which is formed with an optical fiber port so that the internal optical fiber can extend into the interior of the cover shell; A base, one end of which is formed with an opening so that the circuit board can extend into the base, the base comprising a baffle, an upper space above the baffle, and a lower space below the baffle; An optical waveguide substrate is arranged between the cover shell and the upper space, and the internal optical fiber passes through the optical fiber port and enters the interior of the cover shell until it is connected with the optical waveguide substrate; the optical waveguide substrate includes a first input optical port and a first output optical port arranged on opposite sides to transmit a light receiving signal, and also includes a second input optical port and a second output optical port arranged on an adjacent side to transmit a light transmitting signal; the first input optical port and the second output optical port are on the same side, and the first output optical port and the second input optical port are on different sides; a turning prism, disposed in the upper space and on one side of the first light output port, configured to receive and reflect the light receiving signal; A light receiving chip, disposed on a surface of the circuit board, configured to receive a light receiving signal reflected by the turning prism; a laser chip, disposed in the lower space and electrically connected to the other surface of the circuit board, the laser chip and the optical waveguide substrate being located at different layers and configured to generate a light emission signal; A reflector, disposed on the light-emitting optical path of the laser chip, and configured to reflect the light-emitting chip toward the side wall of the barrier; A displacement prism is arranged on the side wall of the partition, and a light input end and a light output end are exposed relative to the partition, the light input end faces the reflector located in the lower space, and the light output end faces the second input light port located in the upper space. The displacement prism is configured to guide the light emission signal output by the reflector to the second input light port so as to transmit the light emission signal through the optical waveguide substrate.

2. The optical module according to claim 1, further comprising an interface claw, wherein one end of the interface claw is respectively formed with a first claw and a second claw which are arranged opposite to each other up and down, an optical fiber plug is arranged between the first claw and the second claw, and an internal optical fiber is arranged at the end of the optical fiber plug; The cover shell includes a main body structure and an extension plate extending relative to the main body structure; a first clamping portion is formed on the surface of the main body structure, and a fiber port and a second clamping portion are respectively formed on the surface of the extension plate, wherein the first clamping portion and the second clamping portion are respectively located at the upper and lower sides of the fiber port; The first clamping claw is connected to the first clamping portion, and the second clamping claw is connected to the second clamping portion; The optical fiber plug is optically connected to the optical fiber port so that the internal optical fiber passes through the optical fiber port until it is connected to the optical waveguide substrate.

3. The optical module according to claim 2, wherein: A supporting groove is formed at one end of the base, the extension plate is embedded in the supporting groove, and the surface of the supporting groove is recessed downward to form a third clamping portion, and the third clamping portion is arranged opposite to the second clamping portion.

4. The optical module according to claim 1, wherein: The base includes a third side wall and a fourth side wall; The surface of the light receiving chip is covered with a protective cover; A first notch and a second notch are respectively formed on the surface of the protective cover, the first notch is configured to be connected to the base, and the second notch is configured to avoid the fourth side wall; wherein, the first notch is overlapped with the surface of the base, there is a gap between the side wall of the first notch and the third side wall, and the second notch is spliced ​​with the fourth side wall.

5. The optical module according to claim 1, wherein: The cover shell includes a first side wall and a second side wall that are oppositely disposed, and the base includes a third side wall and a fourth side wall, and the width between the third side wall and the fourth side wall is greater than the width between the first side wall and the second side wall, so that the cover shell is disposed between the third side wall and the fourth side wall; The optical waveguide substrate is located between the cover shell and the upper space, and the turning prism is located in the upper space; The laser chip and the reflector are both located in the lower space; The displacement prism is located on the side wall of the barrier, the light-incoming end of the displacement prism faces the lower space, and the light-outgoing end of the displacement prism faces the upper space.

6. The optical module according to claim 5, wherein: An embedding portion is formed on the third side wall, the embedding portion exposes the upper and lower surfaces of the barrier, and the embedding portion is configured to embed the displacement prism.

7. The optical module according to claim 5, characterized in that: A third lens is provided between the displacement prism and the second input light port. The third lens is provided in the upper space. The third lens is configured to converge the light emission signal output by the displacement prism into the optical waveguide substrate through the second input light port.

8. The optical module according to claim 1, wherein: The base includes a baffle, an upper space located above the baffle, and a lower space located below the baffle; The lower space is recessed toward the upper space to form a first recessed portion and a second recessed portion, respectively. The first recessed portion is configured to be used to place the laser chip, and a vertical surface of the second recessed portion is configured to be used to place the reflector.

9. The optical module according to claim 1, wherein: The laser chips respectively form a first laser chip array and a second laser chip array, and a thermistor is provided between the first laser chip array and the second laser chip array; A reflector is provided on the light output path of the laser chip, the reflector includes a first reflector and a second reflector, the first reflector and the second reflector are arranged in a staggered manner; the first reflector is arranged opposite to the first laser chip array, and the second reflector is arranged opposite to the second laser chip array; The displacement prism includes a first displacement prism and a second displacement prism, the first displacement prism is arranged opposite to the first reflector, and the second displacement prism is arranged opposite to the second reflector.

10. The optical module according to claim 3, wherein: The width of the extension plate is smaller than the width of the main body structure, so as to form an overlap portion between the extension plate and the main body structure; The width of the support groove is smaller than the width of the surface of the base, so that a support portion is formed between the support groove and the base, and the overlap portion is overlapped and connected with the support portion to connect the cover shell and the base.

11. An optical module, comprising: Circuit boards; A cover shell, one end of which is formed with an optical fiber port so that the internal optical fiber can extend into the interior of the cover shell; A base, one end of which is formed with an opening so that the circuit board can be inserted into the base, the base comprising a third side wall, a fourth side wall and a baffle, the third side wall is formed with an embedded portion, the embedded portion exposes the upper and lower surfaces of the baffle; an optical waveguide substrate, disposed between the cover shell and a surface of the baffle, the internal optical fiber being connected to the optical waveguide substrate; the optical waveguide substrate comprising a first input optical port and a first output optical port disposed on opposite sides to transmit a light receiving signal, and further comprising a second input optical port and a second output optical port disposed on adjacent sides to transmit a light transmitting signal; the first input optical port and the second output optical port are located on the same side, and the first output optical port and the second input optical port are located on different sides; A turning prism, disposed on a surface of the barrier and on one side of the first light output port, configured to receive and reflect the light receiving signal; A light receiving chip, disposed on a surface of the circuit board, configured to receive a light receiving signal reflected by the turning prism; A laser chip is disposed on the other surface of the barrier and is electrically connected to the other surface of the circuit board. The laser chip and the optical waveguide are located in different layers and are configured to generate a light emission signal. A reflector, disposed on the light-emitting optical path of the laser chip, and configured to reflect the light-emitting chip toward the side wall of the base; a displacement prism, disposed in the embedded portion, with a light input end facing the reflector and a light output end facing the second input light port, and configured to guide the light emission signal output by the reflector toward the second input light port; The third lens is disposed on a surface of the barrier, between the light-emitting end of the displacement prism and the second input light port, and is configured to transmit the light emission signal output by the displacement prism to the optical waveguide substrate through the second input light port.

12. The optical module according to claim 11, further comprising an interface claw, wherein one end of the interface claw is respectively formed with a first claw and a second claw disposed opposite to each other, an optical fiber plug is disposed between the first claw and the second claw, and an internal optical fiber is disposed at the end of the optical fiber plug; The cover shell includes a main body structure and an extension plate extending relative to the main body structure; a first clamping portion is formed on the surface of the main body structure, and a fiber port and a second clamping portion are respectively formed on the surface of the extension plate, wherein the first clamping portion and the second clamping portion are respectively located at the upper and lower sides of the fiber port; The first clamping claw is connected to the first clamping portion, and the second clamping claw is connected to the second clamping portion; The optical fiber plug is optically connected to the optical fiber port so that the internal optical fiber passes through the optical fiber port until it is connected to the optical waveguide substrate.

13. According to the optical module of claim 12, the cover shell includes a main body structure and an extension plate extending relative to the main body structure, a support groove is formed at one end of the base, the extension plate is embedded in the support groove, and the surface of the support groove is recessed downward to form a third clamping portion, and the third clamping portion is arranged opposite to the second clamping portion.

14. The optical module according to claim 11, wherein: The cover shell includes a first side wall and a second side wall that are oppositely disposed, and the base includes a third side wall and a fourth side wall, and the width between the third side wall and the fourth side wall is greater than the width between the first side wall and the second side wall, so that the cover shell is disposed between the third side wall and the fourth side wall; The base includes a baffle, an upper space located above the baffle, and a lower space located below the baffle; The optical waveguide substrate is located between the cover shell and the upper space, the turning prism is located in the upper space, and the third lens is located in the upper space; The laser chip and the reflector are both located in the lower space; The displacement prism is located on the side wall of the barrier, the light-incoming end of the displacement prism faces the lower space, and the light-outgoing end of the displacement prism faces the upper space.

15. The optical module according to claim 14, wherein: An embedding portion is formed on the third side wall, the embedding portion exposes the upper and lower surfaces of the barrier, and the embedding portion is configured to embed the displacement prism.

16. The optical module according to claim 11, wherein: The base includes a baffle, an upper space located above the baffle, and a lower space located below the baffle; The lower space is recessed toward the upper space to form a first recessed portion and a second recessed portion, respectively. The first recessed portion is configured to be used to place the laser chip, and a vertical surface of the second recessed portion is configured to be used to place the reflector.

17. The optical module according to claim 11, wherein: The base includes a third side wall and a fourth side wall; The surface of the light receiving chip is covered with a protective cover; A first notch and a second notch are respectively formed on the surface of the protective cover, the first notch is configured to be connected to the base, and the second notch is configured to avoid the fourth side wall; wherein, the first notch is overlapped with the surface of the base, there is a gap between the side wall of the first notch and the third side wall, and the second notch is spliced ​​with the fourth side wall.

Images