Laser control method and laser machining apparatus

Abstract

Provided in the embodiments of the present application are a laser control method and a laser machining apparatus. The laser machining apparatus comprises a 3D camera and a laser. The method comprises: controlling the 3D camera to scan a workpiece to be machined according to a preset scanning path so as to obtain a global point cloud of said workpiece; processing the global point cloud and a preset pattern to be machined so as to obtain a three-dimensional machining track, and determining, on the basis of coordinate information and a mapping relation of the three-dimensional machining track, the height of the laser with respect to said workpiece or the focusing distance of the laser; and, according to the three-dimensional machining track and the height of the laser with respect to said workpiece or the focusing distance of the laser, controlling the laser to machine said workpiece. The present application provides a low-cost three-dimensional scanning solution, which can efficiently complete three-dimensional scanning and reconstruction of surface contours of workpieces to be machined, thus greatly improving laser machining efficiency and effect, and achieving simple operation and low cost.

Description

Laser control method and laser processing equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on July 24, 2023, with application number 202310917023.8, and priority to the Chinese patent application entitled “Laser Control Method and Laser Processing Equipment”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of optics, and more specifically, to a laser control method and laser processing equipment. Background Art

[0003] Laser processing equipment is a device that uses laser technology to process and treat workpieces. It uses the high energy and high focusing properties of lasers to heat, melt, evaporate, and burn the surface of the workpiece to achieve operations such as cutting, engraving, welding, punching, and surface modification of materials. It has a wide range of applications in manufacturing, electronics, automotive, medical equipment, aerospace and other fields.

[0004] For example, for a curved object composed of multiple planes, the laser processing equipment can use a layered processing method to perform laser processing on the curved object; for certain cylindrical or spherical curved objects, the laser processing equipment can use a combination of rotation and movement to perform laser processing on the curved object; in some cases, the focus position, worktable position and angle of the laser processing equipment can be adjusted to adapt to the shape of the curved object and to achieve as uniform processing effect as possible on the entire curved surface.

[0005] However, the above methods have great limitations on the surface shape of the workpiece to be processed, low laser processing efficiency, complex manual operation, cannot guarantee the accurate focusing of the laser focus, and require additional rotating equipment to clamp the workpiece to be processed.

[0006] Summary of the Invention

[0007] The embodiments of the present application provide a laser control method and laser processing equipment, which can effectively realize laser processing on curved objects, improve laser processing efficiency and accuracy, and are simple to operate.

[0008] In a first aspect, a laser control method is provided, which is applied to a laser processing device including a 3D camera and a laser, and is used to process a workpiece to be processed, wherein the method includes: controlling the 3D camera to scan the workpiece to be processed according to a preset scanning path to obtain a global point cloud of the workpiece to be processed; processing the global point cloud and a preset pattern to be processed to obtain a three-dimensional processing trajectory; determining the height of the laser relative to the workpiece to be processed or the focusing distance of the laser based on the coordinate information and mapping relationship of the three-dimensional processing trajectory, wherein the mapping relationship is used to represent the mapping relationship between the pre-established three-dimensional processing trajectory and the height of the laser relative to the workpiece to be processed or the focusing distance of the laser; and controlling the laser to emit a laser beam to process the workpiece to be processed based on the three-dimensional processing trajectory, as well as the height of the laser relative to the workpiece to be processed or the focusing distance of the laser.

[0009] Based on the solution provided in this application, a low-cost three-dimensional scanning solution is provided, which can efficiently complete the scanning of the surface contour of the workpiece to be processed and the reconstruction of the three-dimensional model, and obtain the three-dimensional height information of the surface of the workpiece to be processed (for example, the height value or the focusing distance) in advance. Based on the obtained three-dimensional height information, the position and focal length of the laser can be automatically adjusted, so that the laser maintains a suitable focal position and processing depth, ensuring that the laser focus can be accurately focused, and then the laser is located in the optimal position to process the workpiece to be processed with different curved surface heights, greatly improving the efficiency and effect of laser processing, simple operation and low cost.

[0010] In combination with the first aspect, in certain implementations of the first aspect, the workpiece to be processed is scanned according to a preset scanning path, and a global point cloud of the workpiece to be processed is collected, including: obtaining multiple frames of local point clouds of the workpiece to be processed; and fusing the multiple frames of local point clouds to obtain a global point cloud of the workpiece to be processed.

[0011] In combination with the first aspect, in certain implementations of the first aspect, multiple frames of local point clouds are fused to obtain a global point cloud of the workpiece to be processed, including preprocessing each frame of local point cloud data in the multiple frames of local point clouds; aligning each frame of preprocessed local point cloud data with the world coordinate system, and using a fusion algorithm to fuse the aligned local point cloud data of each frame to obtain a global point cloud.

[0012] In combination with the first aspect, in certain implementations of the first aspect, the global point cloud and the preset pattern to be processed are processed to obtain a three-dimensional processing trajectory, including: generating the original processing trajectory of the laser processing equipment based on the pre-imported pattern to be processed of the laser processing equipment and the path information in the graphic file; merging the global point cloud with the original processing trajectory to obtain a three-dimensional processing trajectory.

[0013] In combination with the first aspect, in certain implementations of the first aspect, the method further includes: adjusting the position and focus of the laser based on the height of the laser relative to the workpiece to be processed or the focusing distance of the laser so that the focused spot of the laser beam is always located on the surface of the workpiece to be processed.

[0014] In combination with the first aspect, in certain implementations of the first aspect, the laser is controlled to process the workpiece to be processed according to the three-dimensional processing trajectory, the height of the laser relative to the workpiece to be processed, or the focusing distance of the laser, including: controlling the lateral movement of the laser according to the three-dimensional processing trajectory; controlling the longitudinal distance of the laser according to the height of the laser relative to the workpiece to be processed or the focusing distance of the laser, so as to complete the processing of the workpiece to be processed.

[0015] In a second aspect, a laser control device is provided, including: a control unit unit, used to control a 3D camera to scan a workpiece to be processed according to a preset scanning path to obtain a global point cloud of the workpiece to be processed; a processing unit, used to process the global point cloud and a preset pattern to be processed to obtain a three-dimensional processing trajectory; the processing unit is also used to determine the height of the laser in the laser processing equipment relative to the workpiece to be processed or the focusing distance of the laser according to the coordinate information and mapping relationship of the three-dimensional processing trajectory, and the mapping relationship is used to represent the mapping relationship between the pre-established three-dimensional processing trajectory and the height of the laser relative to the workpiece to be processed or the focusing distance of the laser; the control unit is used to control the laser to emit a laser beam to process the workpiece to be processed according to the three-dimensional processing trajectory, and the height of the laser relative to the workpiece to be processed or the focusing distance of the laser.

[0016] In a third aspect, a laser processing device is provided for processing a workpiece to be processed, the laser processing device comprising: a work platform, a laser, a 3D camera, and a host computer, wherein the workpiece to be processed is placed on the work platform. The laser is used to emit a laser beam to the workpiece to be processed for processing; the 3D camera is used to scan the workpiece to be processed according to a preset scanning path to obtain a global point cloud of the workpiece to be processed; the host computer is used to process the global point cloud and the preset pattern to be processed to obtain a three-dimensional processing trajectory; based on the coordinate information and mapping relationship of the three-dimensional processing trajectory, the height of the laser relative to the workpiece to be processed or the focusing distance of the laser is determined, and the mapping relationship is used to represent the mapping relationship between the pre-established three-dimensional processing trajectory and the height of the laser relative to the workpiece to be processed or the focusing distance of the laser; based on the three-dimensional processing trajectory and the height of the laser relative to the workpiece to be processed or the focusing distance of the laser, the laser is controlled to process the workpiece to be processed.

[0017] In a fourth aspect, a computer-readable storage medium is provided for storing a computer program, which, when executed on a computer, enables the computer to execute the method in the first aspect and any possible implementation thereof.

[0018] In a fifth aspect, a chip is provided, comprising a processor for calling and running a computer program from a memory, so that a device equipped with the chip executes the laser control method as in the first aspect.

[0019] In a sixth aspect, a computer program is provided, which enables a computer to execute the control method in the first aspect and the first aspect thereof.

[0020] In the seventh aspect, a program product is provided, comprising a computer-readable code, or a non-volatile computer-readable storage medium carrying the computer-readable code. When the computer-readable code runs in an electronic device, the processor in the electronic device executes the laser control method as in the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] 1 and 2 are front views of the laser processing equipment provided in an embodiment of the present application.

[0022] FIG3 is a schematic diagram of the working principle of a 3D camera provided in an embodiment of the present application.

[0023] FIG4 is a flow chart of a laser control method provided in an embodiment of the present application.

[0024] 5 and 6 are schematic diagrams of the area to be scanned of the workpiece to be processed provided in an embodiment of the present application.

[0025] FIG7 is a schematic diagram of a three-dimensional profile of a workpiece surface to be processed provided in an embodiment of the present application.

[0026] FIG8 is a schematic diagram of an original processing trajectory corresponding to a pattern to be processed by a laser processing device provided in an embodiment of the present application.

[0027] FIG9 is a schematic diagram of a three-dimensional machining trajectory of mapping a pattern to be machined onto the surface of a workpiece to be machined, provided in an embodiment of the present application.

[0028] 10 to 12 are schematic diagrams of controlling the longitudinal distance between a laser and the surface of a workpiece to be processed, according to an embodiment of the present application.

[0029] FIG13 is a schematic block diagram of a laser control device provided in an embodiment of the present application.

[0030] FIG14 is a schematic structural diagram of a laser processing device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0031] To facilitate understanding of the technical solution of this application, the following explanations are made.

[0032] In this application, "at least one" means one or more, and "more" means two or more. In the text description of this application, the character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0033] In this application, the terms "first," "second," and various numerical numbers are merely for ease of description and are not intended to limit the scope of the embodiments of this application. The sequence numbers of the processes below do not necessarily indicate the order in which they are executed. The order in which the processes are executed should be determined by their functions and inherent logic, and should not constitute any limitation on the implementation of the embodiments of this application.

[0034] In this application, the terms "comprises" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to the process, method, product or apparatus.

[0035] In this application, the words "exemplary" or "for example" are used to indicate an example, illustration, or description. An embodiment or design described as "exemplary" or "for example" should not be construed as being preferred or advantageous over other embodiments or designs. The use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner to facilitate understanding.

[0036] In this application, the terms "center", "upper" and "lower" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this application.

[0037] In this application, unless otherwise expressly specified or limited, the terms "mounted," "fixed," "disposed," and the like should be understood broadly. When an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intervening element.

[0038] In this application, unless otherwise clearly specified and limited, the term "point cloud" can be replaced by "point cloud data", "point cloud information", "point cloud coordinates", etc.

[0039] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

[0040] Laser processing equipment utilizes laser technology to process and treat workpieces. Leveraging the high energy and focused properties of lasers, it heats, melts, vaporizes, and burns the workpiece surface, enabling operations such as cutting, engraving, welding, drilling, and surface modification. Laser processing equipment can be applied to a wide range of materials, including metals, plastics, ceramics, glass, and textiles. It has widespread application in manufacturing, electronics, automotive, medical devices, aerospace, and other fields, enabling high-precision, high-efficiency, and non-contact processing and treatment.

[0041] The processing effect and processing depth range of laser processing equipment at different surface heights mainly depend on the focusing performance of the laser beam in the vertical direction. Generally speaking, during laser processing and treatment, it is sufficient to ensure that the focus of the laser falls on the surface of the object to be processed. The laser depth of field refers to the focal range of the laser beam in the direction perpendicular to the working surface. However, the laser depth of field of laser processing equipment is limited and short. The specific laser depth of field depends on factors such as the characteristics of the laser, the design of the optical system, and the working distance. If the laser beam is not focused accurately or the laser depth of field is small, it may result in uneven processing or inability to process deep layers of the material. Therefore, when using laser processing equipment for processing, it is necessary to reasonably adjust the laser focus position and processing parameters according to the characteristics and requirements of the material to ensure the desired processing effect.

[0042] Currently, laser processing equipment performs laser processing on curved objects, usually using methods such as layered processing, rotary processing, and manual adjustment.

[0043] (1) Layered processing: For a curved surface object composed of multiple planes, the surface can be decomposed into a series of planes, and then processing can be performed on each plane separately by adjusting the position and angle of the workbench or adjusting the focal length of the laser.

[0044] (2) Rotary processing: For some cylindrical or spherical curved objects, the curved object can be fixed on a rotating device, so that the laser moves along the object's rotation axis to achieve the processing of the curved object. Through the combination of rotation and movement, a uniform processing effect can be achieved on the entire curved surface.

[0045] (3) Manual adjustment: For some special cases, the focus position of the laser processing equipment, the position and angle of the workbench can be manually adjusted to adapt to the shape of the curved object, and then the curved object can be processed. This usually requires adjusting the focus position of the laser processing equipment, the position and angle of the workbench based on experience and practice to obtain the best processing effect.

[0046] As can be seen, the aforementioned processing method has significant limitations on the surface shape of the workpiece being processed, limiting its applicability. Furthermore, the overall laser processing operation is complex and inefficient, and requires additional rotating equipment to clamp the workpiece, making the laser processing equipment complex and costly.

[0047] In view of this, the present application provides a laser control method, device and laser processing equipment, which can efficiently complete the scanning of the surface contour of the workpiece to be processed and the reconstruction of the three-dimensional model, obtain the three-dimensional height information of the surface of the workpiece to be processed in advance, and then automatically adjust the position and focal length of the laser, so that the laser is located in the optimal position to process the workpieces to be processed with different surface heights, greatly improving the efficiency and effect of laser processing, simple operation and low cost.

[0048] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings. The embodiments provided in the present application can be applied to laser processing equipment, such as the laser processing equipment shown in Figures 1 and 2.

[0049] FIG1 is a front view of the first type of laser processing equipment provided in an embodiment of the present application. As shown in FIG1 , the laser processing equipment 100 includes a laser 110 and a 3D camera 120. The 3D camera 120 and the laser 110 are fixed together, and the 3D camera 120 can move along the X, Y, and Z axes following the laser 110. In other words, the 3D camera 120 is a mobile 3D camera. It should be understood that this installation method is more suitable for scenarios where a single measurement can only measure a small local area. For example, the 3D camera 120 can be a single-point rangefinder or a single-line 3D camera.

[0050] Figure 2 is a front view of a second type of laser processing equipment provided in an embodiment of the present application. As shown in Figure 2, laser processing equipment 200 includes a laser 210 and a 3D camera 220. The laser 110 can move along the X, Y, and Z axes, while the 3D camera 220 is fixedly mounted on the top or side of the laser processing equipment 200 for downward measurement. This means that the 3D camera 220 is a fixed 3D camera. It should be understood that this mounting method is more suitable for scenarios where a single measurement can cover a larger area.

[0051] In an embodiment of the present application, the laser processing equipment (e.g., 100 or 200) shown in FIG. 1 or FIG. 2 includes a work platform, a laser 110 / 210, a 3D camera 120 / 220, and a host computer, and the workpiece to be processed is placed on the work platform. The laser 110 / 210 is used to emit a laser beam to the workpiece 130 / 230 to be processed. The laser 110 / 210 can be a single-line, multi-line, single-point, or multi-point laser light source, such as a tunable continuous-line laser that can continuously output lasers of different frequencies with stable power, or a tunable pulsed-line laser that can output pulsed lasers of different frequencies with stable power. This application does not specifically limit this. The 3D camera 120 / 220 is used to collect the global point cloud of the workpiece to be processed 130 / 230; the host computer is used to process the global point cloud and the preset pattern to be processed to obtain a three-dimensional processing trajectory, as well as the height of the laser 110 / 210 relative to the workpiece to be processed 130 / 230 or the focusing distance of the laser 110 / 210, so as to control the laser 110 / 210 to process the workpiece to be processed 130 / 230 according to the three-dimensional processing trajectory, as well as the height of the laser 110 / 210 relative to the workpiece to be processed 130 / 230 or the focusing distance of the laser 110 / 210 to obtain the target object.

[0052] It should be noted that Figures 1 and 2 above are merely examples for ease of understanding, and this application does not limit the installation methods of different 3D cameras. In addition, the two 3D camera installation methods shown in Figures 1 and 2 above can be implemented independently or in combination. For example, in some scenarios, a fixed 3D camera (such as the 3D camera 220 shown in Figure 2) can be used first to perform a global low-precision scan, and then a mobile 3D camera (such as the 3D camera 120 shown in Figure 1) can be used to perform a local high-precision scan, etc. This application does not limit this.

[0053] Specifically, taking a 3D camera based on the line structured light calculation principle as an example, the working principle of the 3D camera in the embodiment of the present application (for example, the 3D camera 120 in FIG. 1 and the 3D camera 220 in FIG. 2 ) is specifically described in combination with FIG. 3 .

[0054] Figure 3 is a schematic diagram illustrating the operating principle of a 3D camera provided by an embodiment of the present application. For ease of description, as shown in Figure 3 , the 3D camera 300 includes a line transmitter 310 and a receiver 320 , with the optical axes of the line transmitter 310 and the receiver 320 arranged at a predetermined angle or parallel to each other.

[0055] Optionally, the line emitting end 310 may be a single-line, multi-line, single-point, or multi-point laser light source. This is because laser has the advantages of high collimation and strong directionality, which can improve the accuracy and efficiency of calibration.

[0056] Optionally, the present application does not specifically limit the number of line emitting ends 310 and receiving ends 320, the wavelength of the laser light emitted by the line emitting end 310, the angle between the optical axis of the line emitting end 310 and the optical axis of the receiving end 320, and the orientation of the line emitting end 310 and the receiving end 320. For example, scenarios in which the receiving end 320 irradiates vertically downward and the line emitting end 310 irradiates diagonally downward, or in which the line emitting end 310 irradiates vertically downward and the receiving end 320 irradiates diagonally downward, or in which both the line emitting end 310 and the receiving end 320 irradiate diagonally downward, all fall within the scope of protection of the technical solution of the present application.

[0057] Optionally, the receiving end 320 may be a charge-coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) or other photosensitive element capable of receiving infrared light, ultraviolet light, etc. Furthermore, the processing chip includes independent dedicated circuits, such as a dedicated SOC chip, FPGA chip, ASIC chip, etc., which includes a CPU, memory, bus, etc., and may also include a general-purpose processing circuit. For example, when the laser profiler is integrated into a smart terminal such as a mobile phone, television, computer, scanner, or 3D printer, the processing circuit in the terminal may serve as at least a part of the processor.

[0058] Based on the principle of line laser scanning, a line laser is projected onto the workpiece 330 using a line transmitter 310. The receiver 320 captures an image and extracts the centerline of the line laser in the image. Subsequently, using the light plane equation and the calibrated internal and external parameters of the receiver 320, a point cloud of the workpiece 330 in the world coordinate system is calculated. Changes in the Z-axis height are reflected as pixel movements in the receiver 320.

[0059] In a first implementation, the line transmitter 310 in the 3D camera 300 emits a line laser toward the workpiece 330 to be processed. This line laser forms a light knife plane. Each light knife plane corresponds to a light knife plane equation, which can be obtained through calibration. The receiver 320 in the 3D camera 300 collects the line laser reflected by the workpiece 330 to form a line image on the imaging plane. Any point on the line laser in this line image is extracted, and a ray is formed from the optical center of the receiver 320 and any point on the line laser. The intersection of this ray and the light knife plane determines the three-dimensional coordinates of any point in the camera coordinate system, thereby obtaining a point cloud of the workpiece 330 to be processed in the camera coordinate system.

[0060] Because the line transmitter 310 uses a single-line laser, its single-frame point cloud is single-line. In order to obtain the surface contour of the workpiece 330 to be processed, the surface contour of the workpiece 330 to be processed can be scanned by moving the receiving end 320 or the workpiece 330 to obtain multiple frames of point clouds. The collected multiple frames of point clouds are then spliced ​​based on the internal and external parameters of the receiving end 320 to obtain three-dimensional point cloud information of the surface contour of the workpiece 330 to be processed in the world coordinate system. The origin of the world coordinate system can usually be defined as a corner point on the work platform, and the X-axis and Y-axis are the sides intersecting the corner point. Optionally, the world coordinate system can also be constructed by other methods, which are not limited in this application.

[0061] In the second implementation method, the center line on the line laser in the line image can be extracted through the center line extraction algorithm, and a ray is formed from the optical center of the receiving end 320 and any center point of the line laser. The intersection of the ray and the light knife plane is obtained, and the three-dimensional coordinates of any center point can be determined, thereby obtaining the point cloud of the workpiece 330 to be processed.

[0062] Optionally, the point cloud obtained in this implementation may be a point cloud in a camera coordinate system.

[0063] Compared with the first implementation method mentioned above, that is, directly calculating the point cloud of the workpiece 330 to be processed through any point on the line laser, in this second implementation method, the corresponding center point with sub-pixel coordinates is obtained by calculating the center line on the line laser, and the point cloud data is obtained through the sub-pixel center point, which can improve the accuracy of the point cloud data.

[0064] Optionally, the point cloud obtained by the above two implementation methods or other implementation methods may be filtered to improve the accuracy of the point cloud.

[0065] Optionally, the receiving end 320 in the 3D camera 300 can be used alone to collect a two-dimensional image of the workpiece 330 to be processed, so as to further obtain information such as line width, graphics, and texture of the workpiece 330 to be processed.

[0066] It should be understood that the above-described method for obtaining a point cloud of the workpiece 330 to be processed is primarily described using a single-line scanning method, and the present application is also applicable to scanning performed by the 3D camera 300 using a surface scanning method. For example, if the light beam emitted by the line transmitting end 310 is a multi-line light beam, then the receiving end 320 can collect the multi-line light beam reflected back from the workpiece 330 to obtain a multi-line image. However, a ray formed from any point on any line in the multi-line image and the optical center of the receiving end 320 intersects with the light knife plane corresponding to the multi-line light beam emitted by the line transmitting end 310 to obtain multiple intersection points, resulting in the inability to uniquely determine the light plane equation corresponding to the current line in the multi-line image.

[0067] In order to determine the light knife plane equation corresponding to the current line beam in the multi-line image, each line beam in the multi-line beam emitted by the line transmitting end 310 can be encoded, such as using a coding pattern to uniquely encode multiple line beams in the multi-line pattern or using the inherent properties of the multi-line beam (such as color or brightness) to encode each line beam, so that the receiving end 320 collects the reflected light beam and generates a coded multi-line image. Subsequently, the coded multi-line image is decoded to identify each line beam, so that the light knife plane equation corresponding to the current line beam can be uniquely determined, and further according to the above-mentioned line laser scanning principle and combined with the internal and external parameters of the 3D camera 300, the point cloud information of the workpiece 330 to be processed in the world coordinate system can be obtained.

[0068] Optionally, when the 3D camera 300 adopts a surface scanning mode, the line transmitting end 310 can also emit a structured light pattern to the workpiece to be processed 330, and the receiving end 320 receives the light beam reflected back by the workpiece to be processed 330 to generate a structured light image. The structured light image is processed based on the structured light principle, and combined with the internal and external parameters of the 3D camera 300, the point cloud information of the workpiece to be processed 330 in the world coordinate system can be obtained.

[0069] Optionally, the 3D camera 300 may further include a processing chip (not shown) configured to process the image captured by the receiving end 320 to obtain a point cloud of the workpiece 330 to be processed in the camera coordinate system. Optionally, the processing chip may be a processor comprising independent dedicated circuits, such as a dedicated SOC chip, FPGA chip, ASIC chip, etc., comprising a CPU, memory, and bus. Alternatively, the processing chip may include general-purpose processing circuits. For example, when the 3D camera 300 is integrated into a laser processing device (e.g., 100 shown in FIG. 1 or 200 shown in FIG. 2 ), the processing circuitry of the host computer in the laser processing device 100 / 200 may serve as part of the processing chip.

[0070] It should be noted that the 3D camera 300 shown in FIG3 is merely an example for ease of understanding and does not constitute a limitation on the technical solutions of this application. It should be understood that the above description uses a laser profiler as an example. In other embodiments, the 3D camera 300 may also be a single-point rangefinder based on triangulation or single-point direct time-of-flight, a multi-line rangefinder, a speckle structured light / binocular camera, an indirect time-of-flight camera based on flood / speckle / line array, etc. As long as the device can obtain 3D information, it falls within the scope of protection of this application.

[0071] The following describes the calibration of the 3D camera 300 in the embodiment of the present application in conjunction with Figures 1 to 3. It should be noted that calibration of the 3D camera is an optional step. For example, the 3D camera 120 / 220 / 300 may be calibrated before each processing operation of the laser processing equipment 100 / 200; or the 3D camera 120 / 220 / 300 may be calibrated periodically, for example, once every 10 operations of the laser processing equipment; or the 3D camera 120 / 220 / 300 may be calibrated based on practical experience, processing results, actual usage, and other factors. In short, by calibrating the 3D camera 120 / 220 / 300, the measurement accuracy of the 3D camera 120 / 220 / 300 can be ensured, thereby improving the acquisition accuracy of the laser processing equipment 100 / 200.

[0072] In one implementation, as shown in FIG1 or FIG2 , a calibration plate 140 / 240 is provided. Based on the operating principle of the 3D camera 300 in FIG3 , the host computer controls the 3D camera 120 / 220 to move above the calibration plate 140 / 240, photographs the calibration plate 140 / 240 in multiple poses, and calculates the intrinsic and extrinsic parameters of the 3D camera 120 / 220 to calibrate the 3D camera 120 / 220. For example, the 3D camera 300 may first capture a calibration image including the calibration plate 140 / 240, and then calibrate the calibration image according to a preset calibration algorithm to obtain the intrinsic and extrinsic parameters of the 3D camera 120 / 220. The preset calibration algorithm may be the Zhang Zhengyou calibration algorithm or another calibration algorithm.

[0073] Based on the above-mentioned Figures 1 to 3, the laser control method provided in the present application is described in detail below in combination with Figures 4 to 12. The method is applicable to the laser processing equipment 100 / 200 shown in Figure 1 or Figure 2.

[0074] FIG4 is a flow chart of a laser control method 400 provided in an embodiment of the present application. As shown in FIG4 , the method includes the following steps.

[0075] S410 , controlling a 3D camera to scan the workpiece to be processed according to a preset scanning path to obtain a global point cloud of the workpiece to be processed.

[0076] For example, by controlling the 3D camera 300 shown in FIG3 to scan the workpiece to be processed according to a preset scanning path, a global point cloud of the workpiece to be processed can be obtained. It should be noted that the point cloud involved in the embodiments of the present application can include three-dimensional coordinate information, color information, light intensity information, etc. For ease of understanding and description, the following specific description uses three-dimensional coordinate information as an example.

[0077] Based on the working principle of the 3D camera shown in FIG3 , the implementation of the above step S410 is specifically described for the mobile 3D camera 120 shown in FIG1 and the fixed 3D camera 220 shown in FIG2 .

[0078] (1) The mobile 3D camera 120 as shown in FIG1 .

[0079] Exemplarily, the 3D camera 120 acquires the global point cloud of the workpiece 130 to be processed, including the following steps.

[0080] S411, obtaining multiple frames of local point clouds.

[0081] The host computer interface of the laser processing device 100 selects the scanning area of ​​the workpiece 130 to be processed. An optimal scanning path is automatically generated based on the scanning area, or a user-defined scanning path is provided. For example, depending on whether the shape of the workpiece 130 to be processed is regular or irregular, a fine scanning method or a sparse scanning method is adaptively selected to obtain a point cloud of the workpiece 130 to be processed.

[0082] In a first implementation, when the workpiece 130 to be processed is regular, the area to be scanned corresponding to the workpiece 130 to be processed can be divided into multiple regions. The 3D camera 120 is controlled to perform a global sparse scan of the center position of each region of the workpiece 130 to be processed, so as to obtain a multi-frame sparse point cloud of the workpiece 130 to be processed. In other words, the spacing between the multiple regions of the workpiece 130 to be processed is set larger, so that the number of regions to be scanned is reduced. For example, the area to be scanned is divided into 5*5 identical regions. For a regular workpiece 130 to be processed, a relatively accurate global point cloud can be fitted using a limited number of sparse point clouds. The small number of region divisions can also shorten the time it takes for the 3D camera 120 to acquire the point cloud. In other words, the sparse scanning of the area to be scanned by the 3D camera 120 can improve scanning efficiency, thereby saving processing time.

[0083] FIG5 is a schematic diagram of the first area to be scanned of a workpiece to be processed provided by an embodiment of the present application. As shown in FIG5 , the scanning direction of the 3D camera 120 is from left to right, dividing the area to be scanned into finer-grained areas. The interval between each area can be set to 1 mm, that is, the 3D camera 120 acquires a point cloud every time it moves 1 mm. It is understandable that because the 3D camera 120 is fixed together with the laser 110, the measurement beam emitted by the laser 110 can cover multiple areas simultaneously, that is, the width of a single measurement is relatively large, typically reaching tens or even hundreds of millimeters. Therefore, the 3D camera 120 will acquire point clouds corresponding to multiple areas every time it moves 1 mm, for example, a "Z"-shaped scan can be used.

[0084] In a second implementation, when the workpiece 130 to be processed is irregular, the area to be scanned corresponding to the workpiece 130 to be processed can be divided into smaller regions. That is, the spacing between the multiple regions into which the workpiece to be scanned is set smaller, so that the number of regions into which the workpiece to be scanned is larger. This allows the 3D camera 120 to achieve fine scanning of the area to be scanned, thereby obtaining a larger number of dense point clouds. By fusing the dense point clouds, a global point cloud of the workpiece 130 to be processed can be obtained, thereby more accurately locating the locations of concave and convex features on the surface of the workpiece 130 to be processed. It should be noted that when the workpiece to be processed is regular, a fine scanning method can also be used to obtain a more accurate point cloud, and this application does not impose any restrictions on this.

[0085] Figure 6 is a schematic diagram of a second scanning area of ​​a workpiece to be processed, according to an embodiment of the present application. As shown in Figure 6 , the 3D camera 120 moves in a bow-shaped pattern to acquire dense point clouds corresponding to various regions of the workpiece 130 to be processed. This bow-shaped pattern eliminates the need for the 3D camera 120 to stop when reaching the edge of the workpiece 130, enabling continuous scanning. Compared to simply moving the 3D camera 120 in a single direction, this bow-shaped pattern reduces the time required to acquire the point cloud of the workpiece 130.

[0086] In a third implementation, when the regular regions on the surface of the workpiece 130 cannot be precisely determined, or when the irregular regions on the surface of the workpiece 130 are relatively scattered, the 3D camera 120 needs to perform a global fine scan of the entire surface of the workpiece 130. However, when it is known that the workpiece 130 has irregular regions in specific local areas, a sparse scan can be performed on the entire surface of the workpiece 130 to obtain multiple frames of sparse point clouds and the irregular regions of the workpiece 130. Subsequently, a fine scan of the irregular regions of the workpiece 130 is performed to obtain a dense point cloud. The sparse point cloud and the dense point cloud are then fused to obtain a global point cloud of the workpiece 130. Compared to a global fine scan, fusing a global sparse scan with a local fine scan reduces the number of acquired point clouds, simplifies the global fine scan process, and thereby improves the processing speed of the 3D camera 120.

[0087] Alternatively, if a line-scan 3D camera is used, the host computer controls 3D camera 120 to move along the scanning path and acquire multiple frames of local point cloud data in real time. The host computer also records the coordinates [Xwi, Ywi, Zwi] of 3D camera 120 (typically the optical center of 3D camera 120) in the world coordinate system (or global coordinate system) when measuring the i-th frame of point cloud data until the scan is complete. The j-th point cloud data in the i-th frame of local point cloud data can be expressed as [xij, yij, zij].

[0088] Optionally, if a 3D camera using surface scanning is used, the scanning path can be converted into multiple local rectangular areas to be scanned. The host computer controls the 3D camera 120 to move to the corresponding centers of the multiple rectangular areas for measurement, obtains multiple frames of local point cloud data corresponding to the multiple areas, and records the coordinates [Xw_i, Yw_i, Zw_i] corresponding to the 3D camera 120 in the world coordinate system when measuring the i-th frame of point cloud data.

[0089] S412: fuse the local point clouds of multiple frames to obtain a global point cloud.

[0090] Exemplarily, the specific implementation of step S412 may include the following steps:

[0091] S4121, preprocessing each frame of the acquired local point cloud.

[0092] Exemplarily, preprocessing includes but is not limited to denoising, filtering, feature extraction, etc. This implementation method helps to reduce noise and unnecessary points and ensure the accuracy of laser processing results.

[0093] S4122 , align each local point cloud with the world coordinate system according to the coordinates [Xw_i, Yw_i, Zw_i] of the 3D camera 120 in the world coordinate system during each measurement.

[0094] For example, an iterative closest point (ICP) or other registration algorithms are usually used to estimate the transformation relationship between each local point cloud and the global point cloud.

[0095] S4123: perform point cloud fusion on the local point cloud of each frame to obtain a global point cloud.

[0096] For example, after aligning the local point clouds to the world coordinate system, different fusion algorithms can be used to fuse multiple frames of local point clouds into a complete global point cloud. It should be understood that point cloud fusion is a key step in fusing multiple local point cloud data into a complete global point cloud. This implementation method can obtain contour information at different locations on the surface of the workpiece 130 to be processed, providing basic data for subsequent processing tasks.

[0097] Exemplarily, commonly used fusion methods include, but are not limited to, voxel grid filtering, Euclidean clustering, and nearest neighbor search based on a KD tree.

[0098] Optionally, the fused global point cloud may have some imperfect or inaccurate parts, and an optimization algorithm, such as nonlinear least squares or ICP iteration, may be applied to further optimize the fit and accuracy of the global point cloud.

[0099] FIG7 illustrates three-dimensional contour information of a workpiece surface to be processed, as provided in an embodiment of the present application. As shown in FIG7 , coordinate information in the X / Y / Z directions of different locations on the surface of the workpiece 130 to be processed is provided. For example, by scanning the workpiece 130 with a 3D camera 120 according to a preset scanning path, three-dimensional contour information of the global point cloud of the workpiece 130 can be obtained, providing basic data for subsequent laser processing.

[0100] (2) A fixed 3D camera 220 as shown in FIG2 .

[0101] Exemplarily, the 3D camera 220 acquires the global point cloud of the workpiece 230 to be processed, including: the 3D camera 220 collects a frame of point cloud data, and the frame of point cloud is the global point cloud.

[0102] It should be understood that the above methods 1 and 2 are examples provided for ease of understanding and should not constitute any limitation on the technical solution of this application. Optionally, the point cloud acquisition and processing method of the workpiece 130 / 230 to be processed can be selected and adjusted according to actual conditions, and this application does not make specific limitations on this.

[0103] S420 , processing the global point cloud and the preset pattern to be processed to obtain a three-dimensional processing trajectory.

[0104] For example, the host computer merges the global point cloud with the preset pattern to be processed to obtain a three-dimensional processing trajectory.

[0105] S430: Determine the height of the laser 110 / 210 relative to the workpiece 130 / 230 to be processed or the focusing distance of the laser 110 / 210 based on the coordinate information and the mapping relationship of the 3D machining trajectory. The mapping relationship represents the mapping relationship between the pre-established coordinate information of the 3D machining trajectory and the height of the laser relative to the workpiece to be processed or the focusing distance of the laser.

[0106] Optionally, the mapping relationship may be expressed in the form of a table, function, text, or string, and this application does not limit this. For example, the host computer searches a preset table for the height of the laser 110 / 210 relative to the workpiece 130 / 230 to be processed or the focusing distance of the laser 110 / 210 based on the coordinate information of the three-dimensional processing trajectory.

[0107] First, by pre-importing the pattern to be processed by the laser processing equipment 100 / 200 into the host computer, the host computer software will generate the corresponding original processing trajectory based on the path information in the graphic file. As shown in Figure 8, the coordinates of each point on the two-dimensional trajectory can be expressed as [X_i, Y_i]. The path defines the path and sequence of movement of the laser processing equipment 100 / 200 during the processing process, and can also include laser power, working speed, scanning mode, etc. These point coordinates do not contain Z-axis information, or the Z-axis values ​​of different point coordinates are the same. Among them, the pattern to be processed is usually in vector graphics format, and common formats include but are not limited to: Scalable Vector Graphics (SVG), Drawing Exchange Format (DXF), and (Adobe Illustrator, AI).

[0108] Secondly, the global point cloud is merged into the original processing trajectory shown in Figure 8, so that the processing trajectory adds a Z-axis height information to obtain a three-dimensional processing trajectory, as shown in Figure 9. At this time, the coordinates of each point on the three-dimensional processing trajectory can be expressed as three-dimensional coordinates [X_i, Y_i, Z_i], which means that the pattern to be processed is mapped to the three-dimensional coordinates on the surface of the workpiece 130 / 230 to be processed.

[0109] Then, the height of the laser 110 / 210 relative to the workpiece 130 / 230 to be processed, or the focusing distance of the laser 110 / 210, is determined using a pre-established lookup table that maps Zi and the height of the laser 110 / 210 relative to the workpiece 130 / 230 to be processed, or the focusing distance of the laser 110 / 210. The lookup table indicates that when the distance value of a certain area of ​​the workpiece 130 / 230 to be processed relative to the work platform is Zi, the height value of the laser 110 / 210 relative to the workpiece 130 / 230 to be processed is Δh_i, or the focusing distance of the laser 110 / 210 at this time is Δf_i, so that the laser 110 / 210 can achieve the best processing effect on the workpiece 130 / 230 to be processed in that area. In other words, based on the known height Zi in the three-dimensional processing trajectory, the height value Δh_i of the laser 110 / 210 relative to the workpiece 130 / 230 to be processed or the focusing distance Δf_i of the laser 110 / 210 can be found in the lookup table.

[0110] Furthermore, the position and / or focus of the laser 110 / 210 is adjusted based on the obtained height value Δh_i or focusing distance Δf_i, so that the laser 110 / 210 can be located at the optimal position to process the workpiece 130 / 230 to obtain the target object with the best processing effect. For example, when the laser 110 / 210 moves to the coordinates [X_i, Y_i], the height value or focusing distance that needs to be adjusted for the laser 110 / 210 can be found based on the Zi_i value in [X_i, Y_i, Z_i] in the three-dimensional processing trajectory. The host computer then controls the laser 110 / 210 to move the height Δh_i, or adjusts the focal length of the laser 110 / 210 by Δf_i, thereby ensuring that the focused spot of the laser 110 / 210 is always located on the surface of the workpiece 130 / 230 to be processed.

[0111] S440 , controlling the laser 110 / 210 to emit a laser beam to process the workpiece 130 / 230 according to the three-dimensional processing trajectory, the height of the laser 110 / 210 relative to the workpiece 130 / 230 to be processed, or the focusing distance of the laser 110 / 210 .

[0112] It should be understood that once a three-dimensional machining trajectory of the workpiece 130 / 230 to be machined is generated (as shown in FIG9 ), it can be sent to the laser machining apparatus 100 / 200 for actual machining operations. The laser machining apparatus 100 / 200 can move the laser 110 / 210 laterally according to the three-dimensional machining trajectory and control the longitudinal distance of the laser 110 / 210 based on the height of the laser 110 / 210 relative to the workpiece 130 / 230 to be machined or the focusing distance of the laser 110 / 210 corresponding to the three-dimensional machining trajectory to complete the machining of the workpiece 130 / 230 to be machined.

[0113] There are many ways for the laser processing equipment 100 / 200 to control the longitudinal distance between the laser 110 / 210 and the surface of the workpiece 130 / 230 to be processed, including the following implementations.

[0114] Method 1:

[0115] In one example, as shown in FIG10 , a laser 110 / 210 includes a laser light source and a focusing lens. The focusing lens is used to focus the laser beam emitted by the laser light source. The focal point of the laser beam can be changed by adjusting the focusing lens of the laser 110 / 210. Generally, moving the focusing lens closer to the laser light source can move the laser beam focal point farther away, while moving the focusing lens away from the laser light source can move the laser beam focal point closer, thereby controlling the longitudinal distance between the laser 110 / 210 and the surface of the workpiece 130 / 230 to be processed.

[0116] In another example, the laser 110 / 210 includes a laser light source and a zoom lens, which includes a liquid lens, a metalens, etc. The zoom lens has a variable focal length and is used to focus the laser beam emitted by the laser light source. By changing the focal length of the zoom lens, the laser beam emitted by the laser light source can be focused on the surface of the workpiece 130 / 230 to be processed, thereby controlling the longitudinal distance between the laser 110 / 210 and the surface of the workpiece 130 / 230 to be processed.

[0117] Method 2:

[0118] In one example, as shown in FIG. 11 , the height of the laser 110 / 210 on the Z axis can be adjusted by a Z axis transmission shaft, thereby controlling the longitudinal distance between the laser 110 / 210 and the surface of the workpiece 130 / 230 to be processed.

[0119] Method 3:

[0120] In one example, as shown in FIG12 , the distance of the laser focal point relative to the work platform along the Z axis can be varied by adjusting the height of the elevating work platform on which the workpiece 130 / 230 to be processed is placed. For example, moving the work platform upward (from position 2 to position 1) moves the focal point closer to the work platform, while moving the work platform downward (from position 1 to position 2) moves the focal point away from the work platform, thereby controlling the longitudinal distance between the laser 110 / 210 and the surface of the workpiece 130 / 230 to be processed.

[0121] It should be understood that the implementation methods provided above are merely examples given for ease of understanding and should not constitute any limitation on the technical solutions of the present application.

[0122] In summary, in order to ensure that the laser focus can be accurately focused when the laser processing equipment processes objects with different curved surface heights, a low-cost three-dimensional scanning solution is provided. The 3D camera can efficiently complete the three-dimensional scanning and reconstruction of the surface contour of the workpiece to be processed, and obtain the three-dimensional contour information of the surface of the workpiece to be processed in advance. Based on this three-dimensional contour information, the position and focal length of the laser can be assisted in the real-time adjustment during the processing process to maintain the appropriate focal position and processing depth, thereby greatly improving the efficiency and effect of laser processing.

[0123] The laser control method according to the embodiment of the present application is described in detail above with reference to Figures 1 to 12 . The laser control device and laser processing equipment according to the embodiment of the present application will be described below with reference to Figures 13 and 14 . It should be understood that the description of the device embodiment corresponds to the description of the method embodiment, and therefore, for portions not described in detail, reference can be made to the aforementioned method embodiment.

[0124] Figure 13 is a schematic block diagram of a laser control device provided in an embodiment of the present application. As shown in Figure 13, the device 1000 may include a processing unit 1020 and a control unit 1010, and the processing unit 1020 is used to perform data processing.

[0125] In one possible design, the device 1000 can implement steps or processes corresponding to those performed by the laser processing equipment 100 / 200 in the above method embodiment, wherein the processing unit 1020 is used to perform processing-related operations of the laser processing equipment 100 / 200 in the above method embodiment, and the control unit 1010 is used to perform sending and receiving-related operations of the laser processing equipment 100 / 200 in the above method embodiment.

[0126] Exemplarily, the control unit 1010 is configured to control the 3D camera to scan the workpiece to be processed according to a preset scanning path to obtain a global point cloud of the workpiece to be processed;

[0127] The processing unit 1020 is configured to process the global point cloud and the preset pattern to be processed to obtain a three-dimensional processing trajectory; determine the height of the laser relative to the workpiece to be processed or the focusing distance of the laser based on the coordinate information and mapping relationship of the three-dimensional processing trajectory, where the mapping relationship represents the mapping relationship between the pre-established three-dimensional processing trajectory and the height of the laser relative to the workpiece to be processed or the focusing distance of the laser;

[0128] The control unit 1010 is further configured to control the laser to emit a laser beam to process the workpiece according to the three-dimensional processing trajectory, the height of the laser relative to the workpiece or the focusing distance of the laser.

[0129] It should be understood that the apparatus 1000 herein is embodied in the form of a functional unit. The term "unit" herein may refer to an application specific integrated circuit (ASIC), an electronic circuit, a processor (e.g., a shared processor, a dedicated processor, or a group processor, etc.) and memory for executing one or more software or firmware programs, combined logic circuits, and / or other suitable components that support the described functionality.

[0130] The functions may be implemented by hardware or by hardware executing corresponding software. The hardware or software may include one or more modules corresponding to the above functions; for example, the processing unit may be replaced by a processor to perform the processing operations in the above method embodiments.

[0131] In addition, the processing unit may be a processing circuit. In an embodiment of the present application, the device in FIG9 may be the laser processing equipment in the aforementioned embodiment, or may be a chip or chip system, such as a system on chip (SoC). The processing unit is a processor, microprocessor, or integrated circuit integrated on the chip. This is not limited here.

[0132] FIG14 is a schematic block diagram of a laser processing device 2000 provided in an embodiment of the present application. As shown in FIG14 , the laser processing device 2000 includes a 3D camera 2010, a work platform 2020, a laser 2030, and a host computer 2040. A workpiece to be processed is placed on the work platform 2020. The laser 2030 can be a single-line, multi-line, single-point, or multi-point laser light source, such as a tunable continuous-line laser capable of continuously outputting laser light of varying frequencies with stable power, or a tunable pulsed-line laser capable of outputting pulsed laser light of varying frequencies with stable power, although this application does not impose specific limitations on this.

[0133] Exemplarily, a laser is used to emit a laser beam to a workpiece to be processed so as to process the workpiece to be processed; a 3D camera is used to scan the workpiece to be processed according to a preset scanning path, and to acquire a global point cloud of the workpiece to be processed; a host computer is used to process the global point cloud and a preset pattern to be processed to obtain a three-dimensional processing trajectory; based on the coordinate information and mapping relationship of the three-dimensional processing trajectory, the height of the laser relative to the workpiece to be processed or the focusing distance of the laser is determined, and the mapping relationship is used to represent the mapping relationship between the pre-established three-dimensional processing trajectory and the height of the laser relative to the workpiece to be processed or the focusing distance of the laser; based on the three-dimensional processing trajectory, as well as the height of the laser relative to the workpiece to be processed or the focusing distance of the laser, the laser is controlled to emit a laser beam to process the workpiece to be processed.

[0134] In one embodiment, the host computer 2040 includes a processor for sending control signals to control the various components and for executing the laser control method provided in the embodiments of the present application. Optionally, as shown in FIG14 , the host computer 2040 may also include a memory. The host computer 2040 may call and run the laser control program from the memory to implement the method in the embodiments of the present application. The memory may be a separate device independent of the host computer or integrated into the host computer.

[0135] Optionally, the memory may include read-only memory and random access memory, and provide instructions and data to the processor. A portion of the memory may also include non-volatile random access memory. For example, the memory may also store device type information. The host computer 2040 may be configured to execute instructions stored in the memory. When the host computer 2040 executes the instructions stored in the memory, the host computer 2040 is configured to execute the various steps and / or processes of the aforementioned laser control method.

[0136] During implementation, each step of the above method can be completed by an integrated logic circuit of the hardware in the processor or by instructions in the form of software. The steps of the method disclosed in conjunction with the embodiments of the present application can be directly embodied as being executed by a hardware processor, or can be executed by a combination of hardware and software modules in the processor. The software module can be located in a storage medium mature in the art such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory or an electrically erasable programmable memory, a register, etc. The storage medium is located in the memory, and the processor reads the information in the memory and completes the steps of the above method in conjunction with its hardware. To avoid repetition, it will not be described in detail here.

[0137] It should be noted that the processor in the embodiments of the present application can be an integrated circuit chip with signal processing capabilities. During implementation, each step of the above-described method embodiment can be completed by hardware integrated logic circuits in the processor or by software instructions. The above-described processor can be a general-purpose processor, a digital signal processor, an application-specific integrated circuit, a field-programmable gate array or other programmable logic device, a discrete gate or transistor logic device, or a discrete hardware component. The processor in the embodiments of the present application can implement or execute the various methods, steps, and logic block diagrams disclosed in the embodiments of the present application. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in the embodiments of the present application can be directly implemented and executed by a hardware decoding processor, or by a combination of hardware and software modules in the decoding processor. The software module can be located in a storage medium well-known in the art, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, etc. The storage medium is located in the memory, and the processor reads the information in the memory and, in conjunction with its hardware, completes the steps of the above-described method.

[0138] It is understood that the memory in the embodiments of the present application may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example and not limitation, many forms of RAM are available, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), and direct RAM bus RAM (DR RAM). It should be noted that the memory of the systems and methods described herein is intended to include, but is not limited to, these and any other suitable types of memory.

[0139] Optionally, an embodiment of the present application further provides a chip, including a processor, which can call and run a computer program from a memory to implement the method in the embodiment of the present application.

[0140] Optionally, an embodiment of the present application further provides a computer-readable storage medium for storing a computer program, which enables a computer to execute the method in the embodiment of the present application.

[0141] Optionally, an embodiment of the present application further provides a computer program product, including computer program instructions, which enable a computer to execute the method in the embodiment of the present application.

[0142] Optionally, the embodiments of the present application further provide a computer program that enables a computer to execute the method in the embodiments of the present application.

[0143] It is understood that the memory in the embodiments of the present application may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example and not limitation, many forms of RAM are available, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), and direct RAM bus random access memory (DR RAM). It should be noted that the memory of the systems and methods described herein is intended to include, but is not limited to, these and any other suitable types of memory.

[0144] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and components may be substituted with equivalents without departing from the scope of the present application. In particular, the various technical features described in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions within the scope of the claims.

Claims

1. A laser control method, characterized in that: A laser processing device including a 3D camera and a laser is used to process a workpiece to be processed, wherein the method includes: Controlling the 3D camera to scan the workpiece to be processed according to a preset scanning path to obtain a global point cloud of the workpiece to be processed; Processing the global point cloud and the preset pattern to be processed to obtain a three-dimensional processing trajectory; Determine the height of the laser relative to the workpiece to be processed or the focusing distance of the laser according to the coordinate information and mapping relationship of the three-dimensional processing trajectory, wherein the mapping relationship is used to represent the mapping relationship between the pre-established three-dimensional processing trajectory and the height of the laser relative to the workpiece to be processed or the focusing distance of the laser; According to the three-dimensional processing trajectory, and the height of the laser relative to the workpiece to be processed or the focusing distance of the laser, the laser is controlled to emit a laser beam to process the workpiece to be processed.

2. The method according to claim 1, characterized in that Scanning the workpiece to be processed according to a preset scanning path to obtain a global point cloud of the workpiece to be processed, including: Acquire multiple frames of local point clouds of the workpiece to be processed; The multiple frames of local point clouds are fused to obtain a global point cloud of the workpiece to be processed.

3. The method according to claim 2, characterized in that The step of fusing the multiple frames of local point clouds to obtain a global point cloud of the workpiece to be processed includes: Preprocessing each frame of local point cloud data in the multiple frames of local point clouds; The preprocessed local point cloud data of each frame is aligned with the world coordinate system, and the aligned local point cloud data of each frame is fused using a fusion algorithm to obtain the global point cloud.

4. The method according to any one of claims 1 to 3, characterized in that The step of processing the global point cloud and the preset pattern to be processed to obtain a three-dimensional processing trajectory includes: Generate an original processing trajectory of the laser processing equipment according to the pattern to be processed of the laser processing equipment and the path information in the graphic file imported in advance; The global point cloud is combined with the original processing trajectory to obtain the three-dimensional processing trajectory.

5. The method according to any one of claims 1 to 4, characterized in that The method further comprises: Based on the height of the laser relative to the workpiece to be processed or the focusing distance of the laser, the position and focus of the laser are adjusted so that the focusing spot of the laser beam is always located on the surface of the workpiece to be processed.

6. The method according to claim 1 or 2, characterized in that: The step of controlling the laser to process the workpiece to be processed according to the three-dimensional processing trajectory, the height of the laser relative to the workpiece to be processed, or the focusing distance of the laser comprises: Controlling the lateral movement of the laser according to the three-dimensional processing trajectory; According to the height of the laser relative to the workpiece to be processed or the focusing distance of the laser, the longitudinal distance of the laser is controlled to complete the processing of the workpiece to be processed.

7. A laser processing device, characterized in that: Used to process a workpiece to be processed, the laser processing equipment includes a working platform, a laser, a 3D camera and a host computer, and the workpiece to be processed is placed on the working platform, wherein: The laser is used to emit a laser beam to a workpiece to be processed so as to process the workpiece; The 3D camera is used to scan the workpiece to be processed according to a preset scanning path to obtain a global point cloud of the workpiece to be processed; The host computer is used to process the global point cloud and the preset pattern to be processed to obtain a three-dimensional processing trajectory; determine the height of the laser relative to the workpiece to be processed or the focusing distance of the laser according to the coordinate information and mapping relationship of the three-dimensional processing trajectory, and the mapping relationship is used to represent the mapping relationship between the pre-established three-dimensional processing trajectory and the height of the laser relative to the workpiece to be processed or the focusing distance of the laser; according to the three-dimensional processing trajectory, and the height of the laser relative to the workpiece to be processed or the focusing distance of the laser, control the laser to emit a laser beam to process the workpiece to be processed.

8. The laser processing equipment according to claim 7, characterized in that: The 3D camera is fixed together with the laser and moves along the X\Y\Z axis of the coordinate system following the laser; or, The 3D camera is fixedly installed on the top or side of the laser processing equipment.

9. The laser processing equipment according to claim 7 or 8, characterized in that: The laser comprises a laser light source and a focusing lens; the focusing lens is used to focus the laser light beam emitted by the laser light source to change the focal point position of the laser light beam; or, The laser comprises a laser light source and a zoom lens, wherein the focal length of the zoom lens is variable; the zoom lens is used to focus the laser light beam emitted by the laser light source so that the laser light beam is focused on the surface of the workpiece to be processed.

10. The laser processing equipment according to claim 7 or 8, characterized in that: The host computer is further used to adjust the height of the laser on the Z axis through the Z axis transmission shaft to change the distance between the laser beam and the surface of the workpiece to be processed; or, The host computer is also used to change the distance of the focus of the laser beam relative to the working platform on the Z axis by adjusting the height of the working platform.

11. A computer-readable storage medium, characterized in that: The computer-readable storage medium is used to store a computer program, and when the computer program is executed on a computer, the computer is caused to execute the method according to any one of claims 1 to 6.

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