Display module and display apparatus

Abstract

A display module (100), comprising a display panel (10), at least one support layer (30), and a driving chip (40). The display panel (10) comprises a main body part (110), a binding part (130), and a bending part (120) located between the main body part (110) and the binding part (130). The main body part (110) has a display side (110A) and a non-display side (110B) which are oppositely arranged, and the bending part (120) is bent towards the non-display side (110B) of the main body part (110), such that the binding part (130) is bent to the non-display side (110B) of the main body part (110). The at least one support layer (30) is located between the main body part (110) and the binding part (130) and is connected to the main body part (110) and the binding part (130), at least one support layer (30) being provided with a first barrier hole (301). The driving chip (40) is located on the binding part (130), and is located on the side of the binding part (130) away from the main body part (110). The orthographic projection of the driving chip (40) on a reference surface at least partially overlaps with the orthographic projection of the first barrier hole (301) on the reference surface. The reference surface is a plane where a display surface of the main body part (110) of the display panel (10) is located.

Description

Display module and display device

[0001] This application claims priority to Chinese patent application No. 202310927587.X filed on July 26, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0003] With the rapid development of display technology, display technologies such as liquid crystal display (LCD), organic light emitting display (OLED), quantum dot light emitting display (QLED) and mini / micro light emitting display (MLED) have been widely used in people's daily lives. For example, smartphones, wearable watches, televisions, laptops and car displays have gradually become prevalent in people's lives.

[0004] Summary of the Invention

[0005] On the one hand, a display module is provided. The display module includes a display panel, a display panel and a driver chip. The display panel includes a main body, a binding part and a bending part located between the main body and the binding part. The main body has a display side and a non-display side that are relatively arranged, and the bending part is bent toward the non-display side of the main body so that the binding part is bent to the non-display side of the main body. The at least one supporting layer is located between the main body and the binding part, and is connected to the main body and the binding part, and at least one supporting layer is provided with a first blocking hole. The driver chip is located on the binding part, and is located on the side of the binding part away from the main body. The orthographic projection of the driver chip on the reference surface at least partially overlaps with the orthographic projection of the first blocking hole on the reference surface. Wherein, the reference surface is the plane where the display surface of the main body of the display panel is located.

[0006] In some embodiments, the display module includes multiple supporting layers. The display module also includes at least one adhesive layer, wherein an adhesive layer exists between two adjacent supporting layers. At least one of the at least one adhesive layer has a second blocking hole, and the orthographic projection of the driver chip on the reference surface at least partially overlaps with the orthographic projection of the second blocking hole on the reference surface.

[0007] In some embodiments, along a direction perpendicular to the main body and directed from the main body toward the binding portion, the multi-layer support layer includes a first support layer and a second support layer, wherein the density of the first support layer is greater than that of the second support layer. The second support layer is provided with the first barrier hole, and the first barrier hole penetrates the second support layer. The at least one adhesive layer includes a first adhesive layer, the first adhesive layer being located between the first and second support layers. The first adhesive layer is provided with a second barrier hole, and the second barrier hole penetrates the first adhesive layer.

[0008] In some embodiments, an orthographic projection of the first barrier hole on the reference surface substantially coincides with an orthographic projection of the second barrier hole on the reference surface.

[0009] In some embodiments, the orthographic projection of the driver chip on the reference surface is located within the range of the orthographic projection of the blocking hole on the reference surface, and the distance between the boundary of the orthographic projection of the driver chip on the reference surface and the boundary of the orthographic projection of the blocking hole on the reference surface is greater than or equal to 0.5 mm.

[0010] In some embodiments, the display module further includes a heat sink, which is located in the blocking hole. The orthographic projection of the heat sink on the reference surface at least partially overlaps with the orthographic projection of the driver chip on the reference surface.

[0011] In some embodiments, the display module further includes an electromagnetic shielding component, which is located in the blocking hole, and the orthographic projection of the electromagnetic shielding component on the reference surface at least partially overlaps with the orthographic projection of the driving chip on the reference surface.

[0012] In some embodiments, the display module further includes a buffer component, the buffer component is located in the blocking hole, and the orthographic projection of the buffer component on the reference surface at least partially overlaps with the orthographic projection of the driver chip on the reference surface.

[0013] In some embodiments, the display module further includes a second adhesive layer, the second adhesive layer including a first adhesive pattern and a second adhesive pattern. The first adhesive pattern is located between the at least one supporting layer and the binding portion. The second adhesive pattern is located between the at least one supporting layer and the binding portion, and between the first adhesive pattern and the bent portion. The second adhesive pattern is thicker than the first adhesive pattern and is spaced apart from the first adhesive pattern. The driver chip is disposed on a side of the first adhesive pattern away from the main body.

[0014] In some embodiments, the display module further includes flexible glass and a first protective layer. The flexible glass is located on the display side of the main body. The orthographic projection of the flexible glass on the reference surface covers the orthographic projection of the display panel on the reference surface, and the boundary of the orthographic projection of the flexible glass on the reference surface is spaced apart from the boundary of the orthographic projection of the display panel on the reference surface. The first protective layer is located on the side of the flexible glass close to the display panel. The first protective layer is at least partially located on the edge of the flexible glass that extends beyond the display panel, and the first protective layer surrounds the display panel.

[0015] In some embodiments, an outer boundary of an orthographic projection of the first protective layer on the reference surface is located outside a boundary of an orthographic projection of the flexible glass on the reference surface.

[0016] In some embodiments, the elastic modulus of the material of the first protective layer is smaller than the elastic modulus of the flexible glass.

[0017] In some embodiments, the display module further includes a second protective layer, which is located on the side of the flexible glass away from the display panel and is arranged along the edge of the flexible glass. The outer boundary of the orthographic projection of the second protective layer on the reference surface is located outside the boundary of the orthographic projection of the flexible glass on the reference surface.

[0018] In some embodiments, a distance between an outer boundary of an orthographic projection of the first protective layer on the reference surface and an edge of an orthographic projection of the flexible glass on the reference surface is greater than or equal to 0.1 mm. And / or a distance between an outer boundary of an orthographic projection of the second protective layer on the reference surface and an edge of an orthographic projection of the flexible glass on the reference surface is greater than or equal to 0.1 mm.

[0019] In some embodiments, an outer edge of the first protective layer is at least partially flush with an outer edge of the second protective layer.

[0020] In some embodiments, the material of the first protective layer includes polyimide or polyethylene terephthalate; in the case where a second protective layer is included, the material of the second protective layer includes polyimide or polyethylene terephthalate.

[0021] In some embodiments, the display module further includes a covering layer and a third adhesive layer. The covering layer is located on a side of the flexible glass away from the display panel, and the orthographic projection of the covering layer on the reference surface covers the orthographic projection of the flexible glass on the reference surface. The third adhesive layer is located between the covering layer and the flexible glass, and the orthographic projection of the third adhesive layer on the reference surface is located within the orthographic projection of the flexible glass on the reference surface, and the boundary of the orthographic projection of the third adhesive layer on the reference surface is spaced apart from the boundary of the orthographic projection of the flexible glass on the reference surface. In the case where the display module includes a second protective layer, the second protective layer is at least partially located on the edge portion of the flexible glass that extends beyond the third adhesive layer and surrounds the third adhesive layer.

[0022] In some embodiments, the display module further includes: a buffer layer located between the flexible glass and the display panel, and / or a light shielding layer located between the flexible glass and the display panel, wherein the light shielding layer is configured to shield ultraviolet light.

[0023] In another aspect, a display device is provided, comprising: a display panel as described in any of the above embodiments and a housing, wherein the display module is located within the housing.

[0024] In some embodiments, the housing includes a bottom plate, a frame, and a top frame. The bottom plate is located on the non-display side of the display module, the frame surrounds the bottom plate and is disposed around the periphery of the display module, the top frame is located on the display side of the display module, and is disposed in an annular shape along the edge of the flexible glass of the display module, with the first protective layer at least partially abutting against the top frame.

[0025] In some embodiments, the inner boundary of the orthographic projection of the top frame on the reference surface is located within the range of the orthographic projection of the flexible glass on the reference surface, and the distance between the inner boundary of the orthographic projection of the top frame on the reference surface and the boundary of the orthographic projection of the flexible glass on the reference surface is greater than or equal to 2 mm.

[0026] In some embodiments, the main body of the display panel in the display module has a display area and a peripheral area surrounding the display area, and the inner boundary of the orthographic projection of the top frame on the reference surface is located within the orthographic projection of the peripheral area on the reference surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and do not limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, etc. involved in the embodiments of the present disclosure.

[0028] FIG1 is a structural diagram of a display device according to some embodiments;

[0029] FIG2 is another structural diagram of a display device according to some embodiments;

[0030] FIG3 is another structural diagram of a display device according to some embodiments;

[0031] FIG4 is another structural diagram of a display device according to some embodiments;

[0032] FIG5A is a structural diagram of a foldable display device according to some embodiments;

[0033] FIG5B is a structural diagram of a foldable display device according to some embodiments;

[0034] FIG6 is a cross-sectional view taken along section line CC in FIG1 ;

[0035] FIG7 is a structural diagram of a display module in a flattened state according to some embodiments;

[0036] FIG8 is a cross-sectional view along section line DD in FIG5A;

[0037] FIG9 is another cross-sectional view along section line DD in FIG5A;

[0038] FIG10 is another cross-sectional view along section line DD in FIG5A;

[0039] FIG11 is another cross-sectional view along section line DD in FIG5A;

[0040] FIG12 is another cross-sectional view along section line DD in FIG5A;

[0041] FIG13 is another cross-sectional view along section line DD in FIG5A;

[0042] FIG14 is another cross-sectional view along section line DD in FIG5A;

[0043] FIG15 is another cross-sectional view along section line DD in FIG5A;

[0044] FIG16 is another cross-sectional view along section line DD in FIG5A;

[0045] FIG17 is a flow chart of a method for preparing a first protective layer according to some embodiments;

[0046] FIG18 is a flow chart of a method for preparing a second protective layer according to some embodiments;

[0047] FIG19 is another cross-sectional view along section line DD in FIG5A;

[0048] FIG20 is another cross-sectional view along section line DD in FIG5A;

[0049] FIG21 is another cross-sectional view along section line DD in FIG5A;

[0050] FIG22 is a structural diagram of a display module in a folded state according to some embodiments;

[0051] FIG23 is another cross-sectional view along section line DD in FIG5A;

[0052] FIG24 is another cross-sectional view along section line DD in FIG5A;

[0053] FIG25 is another cross-sectional view along section line DD in FIG5A;

[0054] FIG. 26 is another cross-sectional view along section line DD in FIG. 5A . DETAILED DESCRIPTION

[0055] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0056] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0057] Terms such as "first" and "second" are used herein to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one component from other components. For example, an element referred to as a first element in one embodiment can be referred to as a second element in another embodiment without departing from the scope of the appended claims. Unless otherwise mentioned, terms in the singular may include plural forms.

[0058] When describing some embodiments, the word "connected" and its derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connected" can mean fixed connection, detachable connection, or integration; it can be directly connected or indirectly connected through an intermediate medium.

[0059] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0060] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0061] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0062] As used herein, "about" or "approximately" is inclusive of the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0063] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0064] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0065] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0066] In this specification, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. It will be further understood that, unless expressly defined herein, terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted as an ideal or overly formal meaning.

[0067] In the present disclosure, terms such as "lower", "below", "above" and similar words are used to explain the relationship between components shown in the drawings. Terms may be relative concepts and described based on the directions shown in the drawings, but are not limited thereto.

[0068] The term "overlap" or "overlapping" means that a first object may be above or below or to the side of a second object, and vice versa. Additionally, the term "overlap" may include stacking, stacking, facing, facing, extending over, covering, or partially covering, or any other suitable term that would be appreciated and understood by one of ordinary skill in the art.

[0069] As shown in FIG. 1 , some embodiments of the present disclosure provide a display device 1000 , which may be any device that displays anything, whether in motion (eg, video) or stationary (eg, still image), and whether text or images.

[0070] For example, as shown in FIG1 , the display device 1000 can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigator, a vehicle display, a flight display, a wearable device, a virtual reality (VR) device, or the like.

[0071] For example, as shown in Figures 2 and 3, the display device 1000 may be a wearable device, which may be a round watch as shown in Figure 2 or a square watch as shown in Figure 3. For another example, the display device 1000 may be a mobile phone, which may be a candy bar phone as shown in Figure 4 or a foldable phone as shown in Figures 5A and 5B.

[0072] The display device 1000 may be any one of a flat display device, a curved display device, a foldable display device, and a rollable display device.

[0073] The following uses the above-mentioned display device 1000 as an example of a foldable display device to schematically illustrate some embodiments of the present disclosure, but the implementation of the present disclosure is not limited to this, and any other display device 1000 can also be considered as long as the same technical concept is applied.

[0074] The foldable display device 1000 includes an inward-folding display device and an outward-folding display device.

[0075] In some embodiments, as shown in FIG1 , a display device 1000 includes a display module 100 . The display module 100 includes a display panel 10 .

[0076] The display panel 10 may be: an organic light emitting diode display panel, a quantum dot light emitting diode display panel, a micro light emitting diode display panel, a liquid crystal display panel, a plasma display panel, a field emission display panel, an electrowetting display panel or an electrophoretic display panel, etc., and the embodiments of the present disclosure do not specifically limit this.

[0077] The following uses the above-mentioned display panel 10 as an organic light-emitting diode display panel as an example to schematically illustrate some embodiments of the present disclosure, but the implementation of the present disclosure is not limited to this, and any other display panel can also be considered as long as the same technical concept is applied.

[0078] As shown in FIG. 1 and FIG. 6 , the display panel 10 includes a substrate 11 , and a plurality of sub-pixels P and an encapsulation layer 12 disposed on the substrate 11 .

[0079] The substrate 11 is a flexible substrate, which may be a polyethylene terephthalate (PET) substrate, a polyethylene naphthalate (PEN) substrate, or a polyimide (PI) substrate.

[0080] In some embodiments, as shown in FIG1 , the plurality of sub-pixels P may be arranged in multiple rows and columns, for example, where a row of sub-pixels P includes a plurality of sub-pixels P arranged along a first direction X, and a column of sub-pixels P includes a plurality of sub-pixels P arranged along a second direction Y. The first direction X is substantially perpendicular to the second direction Y.

[0081] The plurality of sub-pixels P may include a first sub-pixel emitting a first color, a second sub-pixel emitting a second color, and a third sub-pixel emitting a third color. The first, second, and third colors are three primary colors. For example, the first color is red, the second color is blue, and the third color is green. This is not specifically limited in the present embodiment.

[0082] As shown in FIG. 6 , each sub-pixel P includes a pixel circuit 14 and a light-emitting device 15 disposed on a substrate 11 .

[0083] The pixel circuit 14 includes a plurality of thin film transistors 141 and a storage capacitor 142 .

[0084] In some embodiments, the thin film transistor 141 is, for example, an oxide thin film transistor. Oxide thin film transistors have high carrier mobility, which can improve the response speed of the thin film transistor 141 .

[0085] The thin film transistor 141 includes an active layer 1411, a source electrode 1412, a drain electrode 1413, and a gate electrode 1414. The source electrode 1412 and the drain electrode 1413 are respectively in contact with the active layer 1411. The storage capacitor 142 includes a first electrode plate 1421 and a second electrode plate 1422 disposed opposite to each other.

[0086] It should be noted that the source 1412 and the drain 1413 can be interchanged, that is, 1412 in FIG. 6 represents the drain, and 1413 represents the source.

[0087] As shown in FIG6 , the light-emitting device 15 includes a first electrode 151, a light-emitting functional layer 152, and a second electrode 153. The first electrode 151 can be electrically connected to the source 1412 or drain 1413 of a thin-film transistor 141 serving as a driving transistor among the multiple thin-film transistors 141. FIG6 illustrates the electrical connection between the first electrode 151 and the drain 1413 of the thin-film transistor 141. The material of the first electrode 151 includes indium tin oxide (ITO) or silver (Ag). The material of the second electrode includes aluminum (Al), Ag, or magnesium (Mg).

[0088] It should be noted that the first electrode 151 is the anode of the light-emitting device 15, and the second electrode 153 is the cathode of the light-emitting device 15; alternatively, the first electrode 151 is the cathode of the light-emitting device 15, and the second electrode 153 is the anode of the light-emitting device 15. The following examples illustrate the embodiments of the present disclosure using the example of the first electrode 151 being the anode of the light-emitting device 15 and the second electrode 153 being the cathode of the light-emitting device 15. For example, as shown in FIG6 , the second electrode 321 (cathode) is a single-layer structure, meaning that the voltage values ​​on the second electrodes 321 of different light-emitting devices 15 are equal.

[0089] The light-emitting functional layer 152 may include only a light-emitting layer, or, in addition to the light-emitting layer, may also include at least one of an electron transport layer (ETL), an electron injection layer (EIL), a hole transport layer (HTL) and a hole injection layer (HIL).

[0090] The encapsulation layer 12 is located on the side of the second electrode 152 away from the first electrode 151. The encapsulation layer 12 may be an encapsulation film. In some embodiments, the encapsulation layer 12 may include a single layer of encapsulation film, or may include two or more layers of encapsulation films stacked in a stacked manner. For example, the encapsulation layer includes three layers of encapsulation films stacked in sequence.

[0091] When the encapsulation layer 12 includes three layers of encapsulation films stacked in sequence, the encapsulation film in the middle layer is made of an organic material, while the encapsulation films on both sides are made of an inorganic material. The organic material may be, for example, polymethyl methacrylate (PMMA) or PI.

[0092] 1 to 5B , the display panel 10 includes a display area A and a peripheral area B disposed on at least one side of the display area A. In FIG1 to 5B , the peripheral area B is disposed around the display area A as an example.

[0093] As shown in FIG1 , the display area A is an area for displaying images and is configured to set a plurality of pixel units 13 , and the peripheral area B is an area for not displaying images and is configured to set a display driving circuit, for example, a gate driving circuit and a source driving circuit.

[0094] Based on the above embodiment, the display panel 10 includes at least one bending area 101 and at least two non-bending areas 102 .

[0095] In some examples, as shown in FIG. 5A and FIG. 5B , the display panel 10 may include one bending region 101 and two non-bending regions 102 .

[0096] For example, as shown in FIG5A , a bending region 101 extends along a first direction X, and two non-bending regions 102 are disposed on either side of the bending region 101 along a second direction Y. Adjacent non-bending regions 102 are connected via the bending region 101. That is, at least two non-bending regions 102 are spaced apart along the second direction Y, and any two adjacent non-bending regions 102 are connected via a bending region 101.

[0097] Alternatively, as shown in FIG5B , for example, the bending region 101 extends along the second direction Y, and two non-bending regions 102 are respectively provided on either side of the bending region 101 along the first direction X. Adjacent non-bending regions 102 are connected via the bending region 101. That is, at least two non-bending regions 102 are spaced apart along the first direction X, and any two adjacent non-bending regions 102 are connected via a bending region 101.

[0098] As shown in Figures 5A and 5B, some embodiments of the present disclosure are schematically illustrated below by taking the above-mentioned display panel 10 including one bending area 101 and two non-bending areas 102 as an example, but the implementation methods of the present disclosure are not limited to this, and display panels 10 with multiple bending areas 101 and multiple non-bending areas 102 can also be considered, as long as the same technical ideas are applied.

[0099] For example, as shown in FIG. 5A and FIG. 5B , the two non-bending regions 102 may be symmetrically arranged about the bending region 101 , so that after the display panel 10 is bent, the ends of the two non-bending regions 102 away from the bending region 101 are flush.

[0100] Furthermore, when the display device 1000 is an inward-folding display device 1000, after the display panel 10 is folded, the two non-bending regions 102 of the display panel 10 are stacked face to face. When the display device 1000 is an outward-folding display device 1000, the two non-bending regions 102 of the display panel 10 are stacked back to back.

[0101] It is understood that when the display panel 10 is bent (curled or folded), the bending region 101 bends, while the non-bending region 102 remains flat. It is understood that the bending region 101 and the non-bending region 102 are divided based on whether deformation occurs during the bending process of the display device, and the structures of the two regions can be the same.

[0102] For example, during the manufacturing process of the display panel 10, multiple sub-pixels P are formed on a single substrate 11, such as a polyimide substrate. The display panel 10 is then divided into a first region and second regions disposed on either side of the first region. The substrate 11 and sub-pixels P included in the first region constitute a bending region 101, while the substrate 11 and sub-pixels P included in the second region constitute a non-bending region 102.

[0103] As can be seen from the above, the bending region 101 and the non-bending region 102 can be structurally identical. However, their states differ when the display panel 10 is bent. For example, when the display panel 10 is bent, the bending region 101 bends accordingly, while the non-bending region 102 remains flat.

[0104] In some embodiments, as shown in FIG. 7 , the display module 100 further includes a circuit board 20 . The circuit board 20 may be bound to the display panel 10 at an end portion of the display panel 10 .

[0105] In some embodiments, as shown in Figure 7, the display panel 10 includes a main body 110, a bending portion 120 and a binding portion 130 connected in sequence, the bending portion 120 is located on one side of the main body 110, and the binding portion 130 is located on the side of the bending portion 120 away from the main body 110, that is, the bending portion 120 is located between the main body 110 and the binding portion 130.

[0106] As shown in FIG7 , the main body 110 may be the portion of the display panel 10 for displaying images. That is, the display area A (as shown in FIG2 to FIG5B ) is located in the main body 110 , that is, the main body 110 has the display area A (as shown in FIG2 to FIG5B ).

[0107] As shown in FIG7 , the main body 110 has a display side 110A and a non-display side 110B that are disposed opposite each other. It should be noted that the display side 110A refers to the side of the main body 110 that displays images (the upper side of the main body 110 in FIG7 ), and the non-display side 110B refers to the side opposite the display side 110A (the lower side of the main body 110 in FIG7 ).

[0108] 2 to 5B , the main body 110 may further include a portion of the peripheral area B. For example, as shown in FIG2 to 5B , the orthographic projection of the main body 110 on the reference surface is substantially any one of a circle, an ellipse, and a rectangle, etc., which is not specifically limited in the present embodiment.

[0109] It should be noted that the reference plane is the plane where the display surface of the main body 110 of the display panel 10 is located. The display surface refers to a side surface of the main body 110 used for displaying image information.

[0110] In this article, "substantially circular or elliptical" means that the shape is circular or elliptical as a whole, but is not limited to a standard circular or elliptical shape. That is, the "circular or elliptical" here includes not only a substantially circular or elliptical shape, but also a shape similar to a circular or elliptical shape.

[0111] In this document, "approximately rectangular" means that the shape is generally rectangular, but is not limited to a standard rectangle. That is, "rectangular" here includes not only basic rectangular shapes, but also shapes similar to rectangles. For example, the long and short sides of a rectangle are curved at each intersection (i.e., at the corners), meaning the corners are smooth, resulting in a rounded rectangular shape. The following description uses the example of the orthographic projection of the main body 110 on a reference surface, as shown in Figures 5A and 5B, being approximately a rounded rectangular.

[0112] As shown in FIG7 , the binding portion 130 may be the portion of the display panel 10 used to bind and connect to the circuit board 20. As shown in FIG8 , through a bending process, the bending portion 120 can be bent along a bending axis extending in the first direction X toward the non-display side 110B of the main body 110 of the display panel 10, bending the binding portion 130 to the non-display side 110B of the main body 110, thereby reducing the bezel of the display device 1000 (as shown in FIG5A and FIG5B ). The bending axis is not an actual structure in the display panel 10; it is merely a concept proposed to illustrate the bending process of the display panel 10.

[0113] As shown in FIG8 , after the binding portion 130 is bent, the circuit board 20 can be bent along with the display panel 10 to the non-display side 110B of the main body 110, thereby reducing the bezel of the display device 1000. As shown in FIG8 , a portion of the circuit board 20 is located on the side of the main body 110 close to the binding portion 130 and bonded to the main body 110, while a portion is located on the side of the binding portion 130 away from the main body 110 and bonded to the binding portion 130.

[0114] It should be noted that the bending radius of the bending portion 120 may be 0.1 mm to 0.5 mm; for example, the bending radius of the bending portion 120 may be any one of 0.1 mm, 0.2 mm, 0.3 mm, 0.35 mm, 0.4 mm and 0.5 mm.

[0115] It should be understood that the smaller the bending radius of the bent portion 120, the narrower the frame of the display device 1000 corresponding to the bent portion 120 (such as the lower frame in Figures 5A and 5B) can be designed, which is more conducive to the narrow frame design of the display device 1000. Exemplarily, the bending radius of the bent portion 120 can be 0.1 mm to 0.2 mm. For example, the bending radius of the bent portion 120 can be any one of 0.12 mm, 0.15 mm, and 0.18 mm, so that the frame of the display device 1000 corresponding to the bent portion 120 (such as the lower frame in Figures 5A and 5B) can be made narrower.

[0116] On the basis of the above embodiment, as shown in FIG. 8 , the display module 100 further includes at least one supporting layer 30 and a driving chip 40 .

[0117] As shown in FIG8 , at least one supporting layer 30 is located between the main body 110 and the binding portion 130 , and is connected to the main body 110 and the binding portion 130 . The supporting layer 30 is configured to support the display panel. The material of the supporting layer 30 may include at least one of stainless steel, aluminum, or copper.

[0118] As shown in Figure 8 , the at least one support layer 30 is bonded to the main body via a fourth adhesive layer 4. The fourth adhesive layer 4 can be made of an optically clear adhesive (OCA) or a pressure-sensitive adhesive (PSA). For example, the at least one support layer 30 is bonded to the main body 110 via the pressure-sensitive adhesive.

[0119] As shown in Figure 8, the above-mentioned at least one supporting layer 30 is bonded to the binding part 130 through the second adhesive layer 2. The material of the second adhesive layer 2 includes foam adhesive or mesh adhesive. Exemplarily, the at least one supporting layer 30 is bonded to the binding part 130 through the mesh adhesive.

[0120] Here, the grid glue includes multiple intersecting vertical lines and horizontal lines. The setting of the horizontal lines and vertical lines in the grid glue allows the air between the grid glue and the support layer 30 or the binding part 130 to be better discharged when the grid glue is pasted, thereby reducing the probability of bubble generation, so that the grid glue can be more flat when it is adhered to the support layer 30 or the binding part 130, and the tightness of the bonding between the support layer 30 and the binding part 130 can be improved.

[0121] For example, as shown in FIG9 , the second adhesive layer 2 includes a first adhesive pattern 201 and a second adhesive pattern 202. The first adhesive pattern 201 is located between the at least one supporting layer 30 and the binding portion 130, and is bonded to the at least one supporting layer 30 and the binding portion 130. The second adhesive pattern 202 is located between the at least one supporting layer 30 and the binding portion 130, and is bonded to the at least one supporting layer 30 and the binding portion 130. The second adhesive pattern 202 is also located between the first adhesive pattern 201 and the bending portion 120. The second adhesive pattern 202 is thicker than the first adhesive pattern 201 and is spaced apart from the first adhesive pattern 201.

[0122] In this manner, the portion of the binding portion 130 bonded to the first adhesive pattern 201 has a larger space away from the side of the main body 110, that is, as shown in FIG9 , the portion of the binding portion 130 bonded to the first adhesive pattern 201 has a larger space below, thereby providing installation space for other devices such as a driver chip 40 and a circuit board 20.

[0123] As shown in FIG. 8 , the driving chip 40 is configured to provide the display panel 10 with data signals required for displaying images.

[0124] As shown in FIG8 and FIG9 , the driver chip 40 may be disposed on the binding portion 130 , so that the driver chip 40 may provide the data signal required for displaying the image to the main body 110 through the binding portion 130 and the bending portion 120 to control the display panel 10 to display an image.

[0125] Here, the driver chip 40 includes at least one of microchips such as a source driver chip, a touch control chip, a timing controller, and a gamma circuit, which is not specifically limited in the embodiment of the present disclosure.

[0126] As shown in Figure 9, on the basis of the above embodiment, and when the second adhesive layer 2 includes a first adhesive pattern 201 and a second adhesive pattern 202, the driving chip 40 is arranged on the side of the first adhesive pattern 201 away from the main body 110, that is, the orthographic projection of the driving chip 40 on the reference surface is located within the orthographic projection of the first adhesive pattern 201 on the reference surface.

[0127] By configuring in this manner, the thickness of the display module 100 can be reduced, which is beneficial for making the display device 1000 lighter and thinner.

[0128] Exemplarily, the difference between the thickness of the second adhesive pattern 202 and the thickness of the first adhesive pattern 201 is greater than or equal to the thickness of the driving chip 40 .

[0129] That is, after the driver chip 40 is mounted, the driver chip 40 is further away from the surface of the main body 110 and closer to the main body 110 than the surface of the portion of the binding portion 130 bonded to the second adhesive pattern 202. Alternatively, the driver chip 40 is further away from the surface of the main body 110 and is substantially flush with the surface of the portion of the binding portion 130 bonded to the second adhesive pattern 202.

[0130] In this case, the thickness of the display module 100 can be further reduced.

[0131] In related technologies, when a force is applied to the main body, the force will cause the main body to deform. The deformation can be transmitted to the driver chip through the main body, at least one supporting layer and the binding part, thereby causing the driver chip to deform and thus damage the driver chip.

[0132] To address the above issues, as shown in FIG9 , in an embodiment of the present disclosure, at least one supporting layer 30 is provided with a first blocking hole 301. The orthographic projection of the driver chip 40 on the reference surface at least partially overlaps with the orthographic projection of the first blocking hole 301 on the reference surface. The first blocking hole 301 may be a blind hole or a through hole.

[0133] In this manner, the first blocking hole 301 can prevent the deformation of the main body 110 from being transmitted to the driver chip 40 , thereby reducing the risk of deformation of the driver chip 40 and the risk of damage to the driver chip 40 .

[0134] In some embodiments, as shown in FIG10 , the display module 100 includes a support layer 30 , specifically, a first support layer 31 . The first support layer 31 is positioned between the main body 110 and the binding portion 130 . The orthographic projection of the first support layer 31 on a reference surface at least covers the orthographic projection of the display area A on the reference surface. The first support layer 31 and the main body 110 are bonded together via a fourth adhesive layer 4 , and the first support layer 31 and the binding portion 130 are bonded together via a second adhesive layer 2 . The first support layer 31 is provided with a first blocking hole 301 .

[0135] Exemplarily, as shown in Figure 10, the first barrier hole 301 is a blind hole, and the opening direction of the blind hole is toward the binding part 130, that is, the surface of the first supporting layer 31 close to the binding part 130 has an opening, and the surface of the first supporting layer 31 away from the binding part 130 has no opening.

[0136] In this case, each area within the outer boundary of the first supporting layer 31 has the first supporting layer 31. When the main body 110 is subjected to a force, each part of the main body 110 located in the display area A can be supported by the first supporting layer 31, which can make the surface of the main body 110 located in the display area A close to the first supporting layer 31 relatively flat, that is, there is no height difference between the surface of the main body 110 in the display area A and the first supporting layer 31, thereby reducing the risk of film printing on the display panel 10.

[0137] Alternatively, for example, as shown in Figure 11, the first blocking hole 301 is a through hole. In this way, the first blocking hole 301 has a larger size along the direction perpendicular to the main body 110, which can further block the deformation generated by the main body 110 from being transmitted to the driver chip 40, thereby reducing the risk of deformation of the driver chip 40 and reducing the risk of damage to the driver chip 40.

[0138] In other embodiments, as shown in FIG. 12 , the display module 100 includes multiple support layers 30 and at least one adhesive layer.

[0139] The multi-layer support layer 30 is located between the main body 110 and the binding portion 130 and is connected to the main body 110 and the binding portion 130. An adhesive layer is present between two adjacent layers of the multi-layer support layer 30, bonding the two adjacent layers together. At least one of the adhesive layers (and all the adhesive layers between the multi-layer support layers 30) has a second blocking hole 302 defined therein. The orthographic projection of the driver chip 40 on the reference surface at least partially overlaps with the orthographic projection of the second blocking hole 302 on the reference surface.

[0140] In this manner, the second blocking hole 302 can prevent the deformation of the main body 110 from being transmitted to the driver chip 40 , thereby reducing the risk of deformation of the driver chip 40 and the risk of damage to the driver chip 40 .

[0141] In some examples, as shown in FIG12 , along a direction perpendicular to the main body 110 and pointing from the main body 110 to the binding portion 130 , the multilayer support layer 30 includes a first support layer 31 and a second support layer 32 , and the density of the first support layer 31 is greater than the density of the second support layer 32 . For example, the material of the first support layer 31 includes stainless steel, and the material of the second support layer 32 includes titanium or aluminum.

[0142] In this case, the weight of the multi-layer supporting layer 30 can be reduced, thereby reducing the weight of the display module 100, which is conducive to the thinness and lightness of the display device 1000. The first supporting layer 31 and the main body 110 are bonded by the fourth adhesive layer 4, and the second supporting layer 32 and the binding part 130 are bonded by the second adhesive layer 2.

[0143] On this basis, in order to reduce the weight of the multi-layer support layer 30 and ensure the support strength of the multi-layer support layer 30, the thickness of the first support layer 31 is 30 μm to 100 μm, and the thickness of the second support layer 32 is 150 μm to 200 μm.

[0144] For example, the thickness of the first supporting layer 31 is any one of 30 μm, 36 μm, 40 μm, 60 μm, 65 μm, 75 μm, 83 μm, 90 μm, and 100 μm, and the thickness of the second supporting layer 32 is any one of 150 μm, 155 μm, 161 μm, 168 μm, 172 μm, 180 μm, 185 μm, 194 μm, and 200 μm.

[0145] Exemplarily, as shown in FIG. 12 , only the second supporting layer 32 is provided with the first blocking hole 301 , and the first blocking hole 301 passes through the second supporting layer 32 .

[0146] In this manner, on the one hand, each area within the outer boundary of the first supporting layer 31 has the first supporting layer 31. When the main body 110 is subjected to a force, each part of the main body 110 located in the display area A can be supported by the first supporting layer 31, which can make the surface of the main body 110 located in the display area A close to the first supporting layer 31 relatively flat, thereby reducing the risk of film printing in the display area A.

[0147] On the other hand, since the thickness of the second supporting layer 32 is greater than that of the first supporting layer 31, the second supporting layer 32 is provided with a first blocking hole 301, and the first blocking hole 301 passes through the second supporting layer, so that the size of the first blocking hole 301 in the direction perpendicular to the main body 110 can be larger, which can further prevent the deformation generated by the main body 110 from being transmitted to the driving chip 40, thereby reducing the risk of deformation of the driving chip 40 and reducing the risk of damage to the driving chip 40.

[0148] Alternatively, illustratively, as shown in FIG13 , only the first support layer 31 is provided with the first barrier hole 301 .

[0149] In this manner, since the density of the first supporting layer 31 is relatively high, arranging the first blocking hole 301 on the first supporting layer 31 can significantly reduce the weight of the multi-layer supporting layer 30, thereby reducing the weight of the display module 100, which is conducive to making the display device 1000 lighter and thinner.

[0150] Alternatively, illustratively, as shown in FIG14 , the first supporting layer 31 is provided with a first blocking hole 301 , and the second supporting layer 32 is provided with a first blocking hole 301 .

[0151] Arranged in this way, the first blocking hole 301 has a larger size in the direction perpendicular to the main body 110, which can further prevent the deformation generated by the main body 110 from being transmitted to the driver chip 40, thereby reducing the risk of deformation of the driver chip 40 and reducing the risk of damage to the driver chip 40.

[0152] Furthermore, as shown in Figures 12 to 14 , the at least one adhesive layer includes a single adhesive layer, namely, the display module 100 includes a first adhesive layer 1. The first adhesive layer 1 is positioned between and bonded to the first supporting layer 31 and the second supporting layer 32. The first adhesive layer 1 is provided with a second barrier hole 302 that passes through the first adhesive layer 1. The material of the first adhesive layer 1 includes a fluorinated ethylene propylene copolymer layer (FEP).

[0153] On the basis of the above embodiment, as shown in FIG. 12 to FIG. 14 , the orthographic projection of the first blocking hole 301 on the reference surface substantially coincides with the orthographic projection of the second blocking hole 302 on the reference surface.

[0154] In this manner, the first barrier hole 301 and the second barrier hole 302 can be formed in a one-step etching process, which can reduce the number of process steps for the display module 100 and lower the manufacturing cost of the display module 100 .

[0155] In some embodiments, as shown in Figures 12 to 14, the orthographic projection of the driver chip 40 on the reference surface is located within the range of the orthographic projection of the blocking hole on the reference surface, and the distance between the boundary of the orthographic projection of the driver chip 40 on the reference surface and the boundary of the orthographic projection of the blocking hole on the reference surface is greater than or equal to 0.5 mm.

[0156] It should be noted that the barrier hole includes the first barrier hole 301 and / or the second barrier hole 302. In addition, the barrier holes mentioned below all include the first barrier hole 301 and / or the second barrier hole 302, which will not be described in detail in the embodiment of the present disclosure.

[0157] For example, the distance between the boundary of the orthographic projection of the driving chip 40 on the reference surface and the boundary of the orthographic projection of the blocking hole on the reference surface is one of 0.5 mm, 0.55 mm, 0.61 mm, 0.7 mm and 0.85 mm.

[0158] In this manner, the blocking hole can block the deformation of the main body 110 from being transferred to the driver chip 40 to the greatest extent, thereby reducing the risk of deformation of the driver chip 40 and the risk of damage to the driver chip 40.

[0159] Exemplarily, the orthographic projection of the driver chip 40 on the reference surface is located within the range of the orthographic projection of the first blocking hole 301 on the reference surface, and the distance between the boundary of the orthographic projection of the driver chip 40 on the reference surface and the boundary of the orthographic projection of the first blocking hole 301 on the reference surface is greater than or equal to 0.5 mm.

[0160] For example, the distance between the boundary of the orthographic projection of the driving chip 40 on the reference surface and the boundary of the orthographic projection of the first blocking hole 301 on the reference surface is one of 0.5 mm, 0.55 mm, 0.61 mm, 0.7 mm and 0.85 mm.

[0161] Or, for example, the orthographic projection of the driver chip 40 on the reference surface is located within the range of the orthographic projection of the second blocking hole 302 on the reference surface, and the distance between the boundary of the orthographic projection of the driver chip 40 on the reference surface and the boundary of the orthographic projection of the second blocking hole 302 on the reference surface is greater than or equal to 0.5 mm.

[0162] For example, the distance between the boundary of the orthographic projection of the driving chip 40 on the reference surface and the boundary of the orthographic projection of the second blocking hole 302 on the reference surface is one of 0.5 mm, 0.55 mm, 0.61 mm, 0.7 mm and 0.85 mm.

[0163] Alternatively, for example, the orthographic projection of the driver chip on the reference surface is located within the range of the orthographic projection of the first blocking hole 301 on the reference surface, and the distance between the boundary of the orthographic projection of the driver chip 40 on the reference surface and the boundary of the orthographic projection of the first blocking hole 301 on the reference surface is greater than or equal to 0.5 mm.

[0164] For example, the distance between the boundary of the orthographic projection of the driving chip 40 on the reference surface and the boundary of the orthographic projection of the first blocking hole 301 on the reference surface is one of 0.5 mm, 0.55 mm, 0.61 mm, 0.7 mm and 0.85 mm.

[0165] Moreover, the orthographic projection of the driver chip 40 on the reference surface is located within the range of the orthographic projection of the second blocking hole 302 on the reference surface, and the distance between the boundary of the orthographic projection of the driver chip 40 on the reference surface and the boundary of the orthographic projection of the second blocking hole 302 on the reference surface is greater than or equal to 0.5 mm.

[0166] For example, the distance between the boundary of the orthographic projection of the driving chip 40 on the reference surface and the boundary of the orthographic projection of the second blocking hole 302 on the reference surface is one of 0.5 mm, 0.55 mm, 0.61 mm, 0.7 mm and 0.85 mm.

[0167] In some embodiments, as shown in FIG15 , the display module 100 further includes a heat sink 50 , which is located in the blocking hole. The orthographic projection of the heat sink 50 on the reference surface at least partially overlaps with the orthographic projection of the driver chip 40 on the reference surface.

[0168] In this case, the heat generated by the driver chip 40 can be transferred to the heat sink 50 , and the heat sink 50 transfers the heat to the atmosphere, thereby improving the heat dissipation efficiency of the driver chip 40 and increasing the service life of the driver chip 40 .

[0169] The heat sink 50 may be made of at least one of copper, silver, gold, graphite, and boron nitride. For example, the heat sink 50 may be made of graphite. Graphite has a high heat dissipation coefficient, which helps improve the heat dissipation efficiency of the driver chip 40.

[0170] In some examples, as shown in FIG15 , the size of the heat sink 50 along a direction perpendicular to the main body 110 is smaller than or equal to the size of the blocking hole. In other words, the end of the heat sink 50 near the binding portion is farther from the binding portion 130 than the end of the blocking hole near the binding portion 130; alternatively, the end of the heat sink 50 near the binding portion 130 is substantially flush with the end of the blocking hole near the binding portion 130.

[0171] In this case, the problem of deformation of the binding portion 130 caused by the heat sink 50 protruding from the blocking hole can be improved, the risk of deformation of the binding portion 130 causing deformation of the driver chip 40 can be reduced, and the risk of damage to the driver chip 40 can be reduced.

[0172] In other embodiments, as shown in FIG15 , the display module 100 further includes an electromagnetic shielding member 60 , which is located in the blocking hole. The orthographic projection of the electromagnetic shielding member 60 on the reference surface at least partially overlaps with the orthographic projection of the driving chip 40 on the reference surface.

[0173] In this case, the electromagnetic shielding member 60 can reduce the impact of electromagnetic waves outside the driving chip 40 on the driving chip 40. The electromagnetic shielding member 60 is made of a wave-absorbing material, for example, the electromagnetic shielding member 60 includes at least one of copper, aluminum and nickel.

[0174] In some examples, as shown in the figure, the size of the electromagnetic shielding member 60 along a direction perpendicular to the main body 110 is smaller than or equal to the size of the blocking hole. In other words, the end of the electromagnetic shielding member 60 proximate to the binding portion 130 is further away from the binding portion 130 than the end of the blocking hole proximate to the binding portion 130; alternatively, the end of the electromagnetic shielding member 60 proximate to the binding portion 130 is substantially flush with the end of the blocking hole proximate to the binding portion 130.

[0175] In this case, the problem of deformation of the binding portion 130 caused by the electromagnetic shielding component 60 protruding from the blocking hole can be improved, the risk of deformation of the binding portion 130 causing deformation of the driver chip 40 can be reduced, and the risk of damage to the driver chip 40 can be reduced.

[0176] In some other embodiments, as shown in FIG. 15 , the display module 100 further includes a buffer 70 . The buffer 70 is located in the blocking hole, and the orthographic projection of the buffer 70 on the reference surface at least partially overlaps with the orthographic projection of the driver chip 40 on the reference surface.

[0177] In this case, the buffer 70 can produce a certain deformation after being subjected to stress (tensile stress or compressive stress), and the deformation of the buffer 70 itself can release the stress generated within it, thereby preventing the deformation generated by the main body 110 from being transmitted to the driver chip 40, thereby reducing the risk of deformation of the driver chip 40 and the risk of damage to the driver chip 40. The buffer 70 is made of foam or rubber.

[0178] In some examples, as shown in FIG15 , the size of the buffer member 70 along a direction perpendicular to the main body 110 is smaller than or equal to the size of the blocking hole. In other words, the end of the buffer member 70 proximate to the binding portion 130 is further away from the binding portion 130 than the end of the blocking hole proximate to the binding portion 130; alternatively, the end of the buffer member 70 proximate to the binding portion 130 is substantially flush with the end of the blocking hole proximate to the binding portion 130.

[0179] In this case, the problem of deformation of the binding portion 130 caused by the protrusion of the buffer member 70 through the blocking hole can be improved, the risk of deformation of the binding portion 130 causing deformation of the driver chip 40 can be reduced, and the risk of damage to the driver chip 40 can be reduced.

[0180] In some embodiments, as shown in FIG. 7 , the display module 100 further includes a back film 80 , which is located on the non-display side of the display panel 10 .

[0181] In some examples, as shown in FIG. 8 to FIG. 15 , the back film 80 may include a first sub-back film 801 and a second sub-back film 802 , and the first sub-back film 801 and the second sub-back film 802 are disconnected at the bending portion 120 .

[0182] The first sub-back film 801 at least partially overlaps the main body 110 in a direction perpendicular to the main body 110. The second sub-back film 802 at least partially overlaps the binding portion 130 and can be bent along the binding portion 130 to the non-display side 110B of the main body 110 of the display panel 10.

[0183] In this case, the back film 80 exposes the bending portion 120 of the display panel 10, which can reduce the bending resistance of the bending portion 120 of the display panel 10 and change the position of the force-neutral layer of the bending portion 120 of the display panel 10 during the bending process, thereby reducing the risk of damage to the display panel 10.

[0184] In some examples, as shown in Figures 8 to 15 , the orthographic projection of the boundary of the main body portion 110 on the reference surface lies within the range of the orthographic projection of the boundary of the first sub-back film 801 on the reference surface. That is, the first sub-back film 801 covers the main body portion 110, and the side of the first sub-back film 801 proximal to the second sub-back film 802 extends to the bend 120. The orthographic projection of the boundary of the binding portion 130 on the reference surface lies within the range of the orthographic projection of the boundary of the second sub-back film 802 on the reference surface. That is, the second sub-back film 802 covers the binding portion 130, and the side of the second sub-back film 802 proximal to the first sub-back film 801 extends to the bend 120.

[0185] In this case, during the bending process of the display panel 10, stress concentration at the junction of the main body 110, the bending portion 120 and the binding portion 130 can be avoided, thereby reducing the risk of cracks or breakage of the display panel 10 at the junction of the main body 110, the bending portion 120 and the binding portion 130.

[0186] In some embodiments, as shown in FIG. 6 , the display panel 10 further includes a black matrix 17 . The black matrix 17 is disposed on a side of the light emitting device 15 away from the substrate 11 .

[0187] It should be noted that the black matrix 17 is configured to separate the light emitted from different sub-pixels P, and has the function of reducing the reflected light generated after the external ambient light enters the interior of the display panel 10.

[0188] 6 , the display panel 10 further includes a color filter 18, which is disposed on a side of the light emitting device 15 away from the substrate 11. When the display panel 10 includes a black matrix 17, the color filter 18 is disposed on a side of the black matrix 17 away from the substrate 11.

[0189] It should be noted that the color filter 18 can filter out light of most wavelength bands in the external ambient light, thereby reducing the reflection intensity of the external ambient light on the display panel 10 .

[0190] As shown in FIG. 6 , the color filter 18 includes a plurality of filter patterns 181 , and the orthographic projection of one pixel opening 16 on the substrate 11 is located within the range of the orthographic projection of one filter pattern 181 on the substrate 11 .

[0191] 6 , the shape of the filter pattern 181 may be substantially the same as or different from the shape of the pixel opening 16 . FIG6 takes the shape of the filter pattern 181 being substantially the same as the shape of the pixel opening 16 as an example.

[0192] It should be noted that the material of the above-mentioned filter pattern 181 includes an organic material. For example, the material of the filter pattern 181 includes at least one of polymethyl methacrylate, a general polymer of polystyrene, a polymer derivative having a phenolic group, an acryl polymer, an imide polymer, an aromatic ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, and a vinyl alcohol polymer.

[0193] In some other embodiments, the display panel 10 may further include a polarizer. The polarizer may be disposed on a side of the light emitting device 15 away from the substrate 11 . The polarizer may be a flexible member.

[0194] In this way, by selectively passing light of a certain polarization direction through the polarizer, the reflection intensity of the external ambient light on the display panel 10 can be reduced.

[0195] In some embodiments, as shown in FIG16 , the display module 100 further includes flexible glass 90 (ultra-thin glass). Flexible glass 90 refers to glass having a thickness less than or equal to a first threshold, for example, the first threshold is 0.1 mm.

[0196] As shown in FIG16 , the flexible glass 90 is located on the display side of the main body 110. The orthographic projection of the flexible glass 90 on the reference surface overlaps the orthographic projection of the display panel 10 on the reference surface, and the boundary of the orthographic projection of the flexible glass 90 on the reference surface is spaced apart from the boundary of the orthographic projection of the display panel on the reference surface. In other words, the boundary of the flexible glass 90 extends beyond the boundary of the display panel 10. The orthographic projection of the flexible glass 90 on the reference surface overlapping the orthographic projection of the display panel 10 on the reference surface means that the orthographic projection of the flexible glass 90 on the reference surface overlaps with the orthographic projection of the display panel 10 on the reference surface. Alternatively, the orthographic projection of the flexible glass 90 on the reference surface and the orthographic projection of the display panel 10 on the reference surface are within the range of the orthographic projection of the flexible glass 90 on the reference surface.

[0197] In this case, on the one hand, when an object collides with the display module 100 or the display module 100 collides with the ground, the object will first collide with the flexible glass 90 instead of hitting the display panel 10. In this way, the flexible glass 90 can reduce the risk of objects outside the display module 100 directly colliding with the display panel 10 and causing damage to the display panel 10.

[0198] On the other hand, when an object moves in a direction parallel to the main body 110, the object will first hit the edge of the flexible glass 90 and will not hit the edge of the display panel 10. In this way, the flexible glass 90 can also reduce the risk of objects outside the display module 100 directly colliding with the edge of the display panel 10, thereby causing damage to the display panel 10.

[0199] Furthermore, to bond the flexible glass 90 to the display panel 10, the display module 100 further includes a top optically clear adhesive (TOCA) 9. This TOCA is located between the flexible glass 90 and the display panel 10 and is configured to bond the two together.

[0200] As shown in FIG16 , the display module 100 further includes a first protective layer 210 . The first protective layer 210 is located on a side of the flexible glass 90 that is close to the display panel 10 . The first protective layer 210 is at least partially located on the edge of the flexible glass 90 that extends beyond the display panel 10 . The first protective layer 210 surrounds the display panel 10 .

[0201] That is to say, at least part of the area of ​​the edge portion of the flexible glass 90 that extends beyond the display panel 10 is supported, that is, at least part of the area of ​​the edge portion of the flexible glass 90 that extends beyond the display panel 10 will not be in a suspended state. When the flexible glass 90 is subjected to an action force, the action force will be transmitted to the first protective layer 210 through the edge portion of the flexible glass 90 that extends beyond the display panel 10, and then the action force will be dispersed to the first protective layer 210. In this way, the risk of stress concentration at the edge portion of the flexible glass 90 that extends beyond the display panel 10, resulting in the breakage of the flexible glass 90, can be reduced.

[0202] In some embodiments, as shown in FIG. 16 , the outer boundary of the orthographic projection of the first protection layer 210 on the reference surface is located outside the boundary of the orthographic projection of the flexible glass 90 on the reference surface.

[0203] In this way, when an object moves in a direction parallel to the main body 110, the object will first hit the edge of the first protective layer 210 and will not hit the edge of the flexible glass 90. The first protective layer 210 can reduce the risk of objects outside the display module 100 directly colliding with the edge of the flexible glass 90 and causing damage to the display panel 10.

[0204] Exemplarily, a distance between an outer boundary of an orthographic projection of the first protective layer 210 on the reference surface and a boundary of an orthographic projection of the flexible glass 90 on the reference surface is greater than or equal to 0.1 mm.

[0205] For example, the distance between the outer boundary of the orthographic projection of the first protective layer 210 on the reference surface and the boundary of the orthographic projection of the flexible glass 90 on the reference surface is one of 0.1 mm, 0.15 mm, 0.22 mm, 0.30 mm, 0.42 mm, 0.48 mm and 0.5 mm.

[0206] In some embodiments, the elastic modulus of the first protective layer 210 is smaller than the elastic modulus of the flexible glass 90 .

[0207] In this case, the first protective layer 210 may be formed by laser cutting.

[0208] In some examples, the elastic modulus of the first protective layer 210 is greater than or equal to 3 GPa.

[0209] For example, the elastic modulus of the first protective layer 210 is one of 3 GPa, 3.6 GPa, 4 GPa, 5.3 GPa, 5.8 GPa, and 6 GPa.

[0210] The elastic modulus of the flexible glass 90 is greater than or equal to 7 GPa.

[0211] For example, the elastic modulus of the flexible glass 90 is one of 7 GPa, 7.5 GPa, 8.1 GPa, 8.9 GPa, 9.5 GPa, and 10 GPa.

[0212] Exemplarily, the outer boundary of the orthographic projection of the first protection layer 210 on the reference surface coincides with the outer boundary of the orthographic projection of the flexible glass 90 on the reference surface.

[0213] The first protective layer 210 may be formed by the following preparation method. As shown in FIG. 17 , the preparation method of the display device 1000 includes steps S100 to S200 .

[0214] S100 , attaching a first initial protective layer 211 to a side of the flexible glass 90 close to the display panel 10 .

[0215] The first initial protective layer 211 is at least partially located on the edge portion of the flexible glass 90 that extends beyond the display panel 10. The inner boundary of the orthographic projection of the first initial protective layer 211 on the reference surface is located within the boundary of the orthographic projection of the flexible glass 90 on the reference surface. The outer boundary of the orthographic projection of the first initial protective layer 211 on the reference surface is located within the boundary of the orthographic projection of the flexible glass 90 on the reference surface, and the first initial protective layer 211 surrounds the display panel 10.

[0216] S200 , using a laser to cut the first initial protection layer 211 along a first cutting line to form a first protection layer 210 .

[0217] The second cutting line is the boundary of the flexible glass 90 .

[0218] In some embodiments, the material of the first protective layer 210 includes polyimide or polyethylene terephthalate, and the thickness of the first protective layer 210 is 20 μm to 300 μm.

[0219] For example, the thickness of the first protection layer 210 is one of 20 μm, 30 μm, 34 μm, 38 μm, 42 μm, 45 μm, 51 μm, 55 μm, 60 μm, 100 μm, 150 μm, 210 μm, 260 μm, and 300 μm.

[0220] Based on the above embodiment, to bond the first protective layer 210 to the flexible glass 90, the display module 100 further includes a sixth adhesive layer 6. The sixth adhesive layer 6 is located between the first protective layer 210 and the flexible glass 90 and is configured to bond the ultra-thin glass to the first protective layer 210. Exemplarily, the sixth adhesive layer 6 is made of a pressure-sensitive adhesive and has an elastic modulus of 10 kPa to 50 kPa.

[0221] For example, the elastic modulus of the sixth adhesive layer 6 is one of 10 KPa, 11 KPa, 15 KPa, 19 KPa, 20 KPa, 25 KPa, 33 KPa, 39 KPa, 40 KPa, 45 KPa and 50 KPa.

[0222] In some embodiments, as shown in FIG16 , the display module 100 further includes a second protective layer 220. The second protective layer 220 is located on a side of the flexible glass 90 away from the display panel 10 and is disposed along an edge of the flexible glass 90. The outer boundary of the orthographic projection of the second protective layer 220 on the reference surface is located outside the boundary of the orthographic projection of the flexible glass 90 on the reference surface.

[0223] In this case, when an object moves in a direction parallel to the main body 110, the object will first hit the edge of the second protective layer 220 and will not hit the edge of the flexible glass 90. In this way, the second protective layer 220 can also reduce the risk of objects outside the display module 100 directly colliding with the edge of the flexible glass 90 and causing damage to the flexible glass 90.

[0224] Exemplarily, the outer boundary of the orthographic projection of the second protection layer 220 on the reference surface and the boundary of the orthographic projection of the flexible glass 90 on the reference surface are greater than or equal to 0.1 mm.

[0225] For example, the distance between the outer boundary of the orthographic projection of the second protection layer 220 on the reference surface and the boundary of the orthographic projection of the flexible glass 90 on the reference surface is one of 0.1 mm, 0.15 mm, 0.22 mm, 0.30 mm, 0.42 mm, 0.48 mm and 0.5 mm.

[0226] In some embodiments, the elastic modulus of the second protective layer 220 is smaller than the elastic modulus of the flexible glass 90 .

[0227] In this case, the second protective layer 220 may be formed by laser cutting.

[0228] In some examples, the elastic modulus of the second protective layer 220 is greater than or equal to 3 GPa.

[0229] For example, the elastic modulus of the second protective layer 220 is one of 3 GPa, 3.6 GPa, 4 GPa, 5.3 GPa, 5.8 GPa, and 6 GPa.

[0230] The elastic modulus of the flexible glass 90 is greater than or equal to 7GP.

[0231] For example, the elastic modulus of the flexible glass 90 is one of 7 GPa, 7.5 GPa, 8.1 GPa, 8.9 GPa, 9.5 GPa, and 10 GPa.

[0232] Exemplarily, the outer boundary of the orthographic projection of the second protective layer 220 on the reference surface is located outside the boundary of the orthographic projection of the flexible glass 90 on the reference surface. The second protective layer 220 can be formed by the following preparation method, as shown in FIG18 . The preparation method of the display device 1000 includes S210 to S220.

[0233] S210 , laminating a second initial protective layer 221 on a side of the flexible glass 90 away from the display panel 10 .

[0234] The second initial protective layer 221 is at least partially located on the edge portion of the flexible glass 90 that extends beyond the display panel 10. The inner boundary of the orthographic projection of the second initial protective layer 221 on the reference surface is located within the boundary of the orthographic projection of the flexible glass 90 on the reference surface. The outer boundary of the orthographic projection of the second initial protective layer 221 on the reference surface is located within the boundary of the orthographic projection of the flexible glass 90 on the reference surface, and the second initial protective layer 221 surrounds the display panel 10.

[0235] S220 , using a laser to cut the second initial protective layer 221 along a second cutting line to form a second protective layer 220 .

[0236] The boundary of the second cutting line is the boundary of the second protective layer 220 , and the outer boundary of the orthographic projection of the boundary of the second protective layer 220 on the reference surface is located outside the boundary of the orthographic projection of the flexible glass 90 on the reference surface.

[0237] It should be noted that the above-mentioned S220 and S200 can be performed in the same process step. In this way, the process steps of the display device 1000 can be reduced, and the manufacturing cost of the display device 1000 can be reduced.

[0238] 16, the outer edge of the first protective layer 210 is at least partially flush with the outer edge of the second protective layer 220. During the process of forming the protective layers by laser cutting materials, the first protective layer 210 and the second protective layer 220 can be formed simultaneously.

[0239] Based on the above embodiment, to bond the second protective layer 220 to the flexible glass 90, the display module 100 further includes a seventh adhesive layer 7. The seventh adhesive layer 7 is located between the second protective layer 220 and the flexible glass 90 and is configured to bond the flexible glass 90 to the second protective layer 220. Exemplarily, the seventh adhesive layer 7 is made of a pressure-sensitive adhesive and has an elastic modulus of 10 kPa to 50 kPa.

[0240] For example, the elastic modulus of the seventh adhesive layer 7 is one of 10 KPa, 11 KPa, 15 KPa, 19 KPa, 20 KPa, 25 KPa, 33 KPa, 39 KPa, 40 KPa, 45 KPa and 50 KPa.

[0241] In some embodiments, the material of the second protective layer 220 can be the same as that of the first protective layer 210. For example, the material of the first protective layer 210 and the material of the second protective layer 220 are both polyimide; for another example, the material of the first protective layer 210 and the material of the second protective layer 220 are both polyethylene terephthalate.

[0242] Alternatively, the material of the second protective layer 220 may be different from the material of the first protective layer 210. For example, the material of the first protective layer 210 is polyimide, and the material of the second protective layer 220 is polyethylene terephthalate; for another example, the material of the first protective layer 210 includes polyethylene terephthalate, and the material of the second protective layer 220 is polyimide.

[0243] In some embodiments, as shown in Figure 19, the display module 100 further includes a cover layer 230 and a third adhesive layer 3. The cover layer is located on a side of the flexible glass 90 away from the display panel 10, and the orthographic projection of the cover layer 230 on the reference surface covers the orthographic projection of the flexible glass 90 on the reference surface.

[0244] In this case, when an object collides with the display module 100 or the display module 100 collides with the ground, the object or the ground will first hit the covering layer 230 and will not hit the flexible glass 90. In this way, the covering layer 230 can reduce the risk of objects outside the display module 100 directly colliding with the flexible glass 90 and causing damage to the flexible glass 90.

[0245] The material of the cover layer 230 includes a transparent polyimide film (English: Colorless Polyimide, abbreviated as: CPI) or polyethylene terephthalate.

[0246] As shown in Figure 19, the third adhesive layer 3 is located between the cover layer 230 and the flexible glass 90, and is configured to bond the cover layer 230 and the flexible glass 90. The material of the third adhesive layer 3 can be optical adhesive.

[0247] Exemplarily, the orthographic projection of the third adhesive layer 3 on the reference surface coincides with the orthographic projection of the flexible glass 90 on the reference surface, that is, the size of the third adhesive layer 3 is the same as that of the flexible glass 90 .

[0248] By configuring in this manner, the bonding area of ​​the flexible glass 90 can be made larger, so that the flexible glass 90 and the cover layer 230 are bonded more firmly.

[0249] Alternatively, for example, as shown in FIG19 , the orthographic projection of the third adhesive layer 3 on the reference surface is within the range of the orthographic projection of the flexible glass 90 on the reference surface, and the boundary of the orthographic projection of the third adhesive layer 3 on the reference surface is spaced from the boundary of the orthographic projection of the flexible glass 90 on the reference surface. For example, the distance between the boundary of the orthographic projection of the third adhesive layer 3 on the reference surface and the boundary of the orthographic projection of the flexible glass 90 on the reference surface is greater than 0.3 mm.

[0250] For example, the distance between the boundary of the orthographic projection of the third adhesive layer 3 on the reference surface and the boundary of the orthographic projection of the flexible glass 90 on the reference surface is one of 0.3 mm, 0.4 mm, 0.45 mm, 0.5 mm, 0.58 mm, 0.62 mm, 0.66 mm, 0.71 mm, 0.79 mm, 0.8 mm, 0.94 mm and 1 mm.

[0251] In this case, the edge portion of the flexible glass 90 extending beyond the third adhesive layer 3 provides accommodation space for the second protective layer 220, that is, when the display module 100 includes the second protective layer 220, the second protective layer 220 is at least partially located on the edge portion of the flexible glass 90 extending beyond the third adhesive layer 3 and surrounds the third adhesive layer 3.

[0252] In some embodiments, as shown in FIG. 20 , the display module 100 further includes a buffer layer 240 and an eighth adhesive layer 8 .

[0253] The buffer layer 240 is located between the flexible glass 90 and the display panel 10. The buffer layer 240 primarily provides shock absorption and improves the impact resistance of the display module 100. The buffer layer 240 may be made of thermoplastic polyurethane (TPU).

[0254] As shown in FIG. 20 , the orthographic projection of the buffer layer 240 on the reference surface may be located within the range of the orthographic projection of the display panel 10 on the reference surface, for example.

[0255] As shown in Figure 20, the eighth adhesive layer 8 is located between the buffer layer 240 and the flexible glass 90, and is configured to bond the buffer layer 240 and the flexible glass 90. The material of the eighth adhesive layer 8 can be the same as that of the third adhesive layer 3, for example, the materials of the third adhesive layer 3 and the eighth adhesive layer 8 are both optical adhesive.

[0256] On the basis of the above embodiment, the top optical adhesive layer 9 is located between the buffer layer 240 and the display panel 10 , and is configured to bond the buffer layer 240 and the display panel 10 .

[0257] In other embodiments, as shown in FIG. 21 and FIG. 22 , the display module 100 further includes a light shielding layer 250 and a fifth adhesive layer 5 .

[0258] The light shielding layer 250 is located between the flexible glass 90 and the display panel 10. The light shielding layer 250 is configured to shield ultraviolet light. In other words, the light shielding layer 250 mainly serves to reduce the risk of aging of organic materials in the display panel 10. The material of the light shielding layer 250 may include ultraviolet-blocking optical adhesive or polyethylene terephthalate.

[0259] As shown in FIG. 21 , the orthographic projection of the light shielding layer 250 on the reference surface may be located within the range of the orthographic projection of the display panel 10 on the reference surface.

[0260] 21 , the fifth adhesive layer 5 is located between the light shielding layer 250 and the flexible glass 90, and is configured to bond the light shielding layer 250 and the flexible glass 90. The material of the fifth adhesive layer 5 can be the same as that of the third adhesive layer 3, for example, the materials of the third adhesive layer 3 and the fifth adhesive layer 5 are both optical adhesive.

[0261] On the basis of the above embodiment, the top optical adhesive layer 9 is located between the light shielding layer 250 and the display panel 10 , and is configured as the light shielding layer 250 and the display panel 10 .

[0262] In some other embodiments, as shown in FIG. 23 , the display module 100 further includes a buffer layer 240 , an eighth adhesive layer 8 , a light shielding layer 250 and a fifth adhesive layer 5 .

[0263] The buffer layer 240 is located between the flexible glass 90 and the display panel 10. The eighth adhesive layer 8 is located between the buffer layer 240 and the flexible glass 90 and is configured to bond the buffer layer 240 and the flexible glass 90. The light shielding layer 250 is located between the buffer layer 240 and the display panel 10. The fifth adhesive layer 5 is located between the buffer layer 240 and the light shielding layer 250 and is configured to bond the buffer layer 240 and the light shielding layer 250.

[0264] On the basis of the above embodiment, the top optical adhesive layer 9 is located between the light shielding layer 250 and the display panel 10 , and is configured as the light shielding layer 250 and the display panel 10 .

[0265] In some other embodiments, as shown in FIG. 24 , the display module 100 further includes a light shielding layer 250 , a fifth adhesive layer 5 , a buffer layer 240 , and an eighth adhesive layer 8 .

[0266] The light shielding layer 250 is located between the flexible glass 90 and the display panel 10. The fifth adhesive layer 5 is located between the light shielding layer 250 and the flexible glass 90 and is configured to bond the light shielding layer 250 and the flexible glass 90. The buffer layer 240 is located between the light shielding layer 250 and the display panel 10. The eighth adhesive layer 8 is located between the buffer layer 240 and the light shielding layer 250 and is configured to bond the buffer layer 240 and the light shielding layer 250.

[0267] On the basis of the above embodiment, the top optical adhesive layer 9 is located between the buffer layer 240 and the display panel 10 , and is configured to bond the buffer layer 240 and the display panel 10 .

[0268] In some embodiments, as shown in FIG. 25 , the display device 1000 further includes a housing 300 , and the display module 100 may be disposed within the housing 300 .

[0269] The housing 300 includes a bottom plate 310, a frame 320, and a top frame 330. The bottom plate 310 is located on the non-display side of the display module 100. The frame 320 surrounds the bottom plate 310 and surrounds the periphery of the display module 100. The top frame 330 is located on the display side of the display module 100 and is arranged in a ring shape along the edge of the flexible glass 90 of the display module 100.

[0270] It should be understood that, as shown in FIG25 , the display module 100 has a display side and a non-display side that are disposed opposite each other. It should be noted that the display side 110A refers to the side of the display module 100 that displays an image (the upper side of the display module in FIG25 ), and the non-display side refers to the side opposite the display side (the lower side of the display module in FIG25 ).

[0271] In some examples, as shown in FIG. 25 , the outer boundary of the orthographic projection of the top frame 330 on the reference surface roughly coincides with the inner boundary of the orthographic projection of the border 320 on the reference surface, and the top frame 330 is connected to the inner side surface of the border 320 .

[0272] Arranged in this manner, the frame 320 can protect the edges of the frame 320 , which are at risk of being broken by accidental collisions.

[0273] In other examples, as shown in FIG26 , the orthographic projection of the frame 320 on the reference surface is within the range of the orthographic projection of the top frame 330 on the reference surface, and the top frame 330 is connected to the end surface of the frame 320 away from the bottom plate 310. In this manner, the frame 320 can provide support for the top frame 330.

[0274] In addition, the first protective layer 210 is at least partially in contact with the top frame 330. In this case, when a user applies force to the top frame 330, the force can be transferred to the flexible glass 90, and then to the first protective layer 210, thereby reducing the risk of the force on the top frame 330 being transferred to the flexible glass 90 and causing damage to the flexible glass 90.

[0275] It should be noted that the term "abutment" should be understood in a broad sense and can refer to fixed connections, detachable connections, or abutment or contact. Furthermore, "abutment" can be direct, meaning there is no other component (or region, layer, or portion) between the two components (or regions, layers, or portions), or indirect, meaning there is another component (or region, layer, or portion) between the two components (or regions, layers, or portions).

[0276] In some embodiments, as shown in Figures 25 and 26, the inner boundary of the orthographic projection of the top frame 330 on the reference surface is located within the range of the orthographic projection of the flexible glass 90 on the reference surface, and the distance between the inner boundary of the orthographic projection of the top frame 330 on the reference surface and the boundary of the orthographic projection of the flexible glass 90 on the reference surface is greater than or equal to 2 mm.

[0277] For example, a distance between an inner boundary of an orthographic projection of the top frame 330 on the reference surface and a boundary of an orthographic projection of the flexible glass 90 on the reference surface is one of 2 mm, 2.5 mm, 3.1 mm, 4.5 mm, and 5 mm.

[0278] In this case, the bonding area between the flexible glass 90 and the top frame 330 is larger, which can improve the supporting strength of the top frame 330 on the flexible glass 90 .

[0279] In some embodiments, as shown in FIG. 25 , the inner boundary of the orthographic projection of the top frame 330 on the reference surface is located within the orthographic projection of the peripheral area B on the reference surface.

[0280] By setting it in this way, the distance between the orthographic projection boundary of the peripheral area B on the reference surface and the outer boundary of the orthographic projection of the top frame 330 on the reference surface can be shortened, that is, the size of the border of the display device 1000 can be shortened, so that the screen-to-body ratio of the display device 1000 can be improved.

[0281] For example, the inner boundary of the orthographic projection of the top frame 330 on the reference surface coincides with the orthographic projection boundary of the peripheral area B on the reference surface. In this case, the size of the frame of the display device 1000 can be shortened to the greatest extent.

[0282] When the bending radius of the display device 1000 is 3mm, the performance indicators of the above-mentioned display device 1000 can meet the following requirements: at a temperature of -20°C, the display device 1000 can be bent more than or equal to 20,000 times. At a temperature of 25°C, the display device 1000 can be bent more than or equal to 300,000 times. At a temperature of 85°C, the display device 1000 can be bent more than or equal to 20,000 times. The surface hardness of the display device 1000 is greater than or equal to 3H. During the drop ball test, the mass of the falling ball is 32.65g, and the height of the falling ball is greater than or equal to 15mm.

[0283] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0284] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A display module, comprising: The display panel comprises a main body, a binding portion and a bending portion between the main body and the binding portion; The main body has a display side and a non-display side that are opposite to each other, and the bending portion is bent toward the non-display side of the main body so that the binding portion is bent to the non-display side of the main body; At least one supporting layer is located between the main body and the binding part and connected to the main body and the binding part; at least one supporting layer is provided with a first blocking hole; A driving chip is located on the binding portion and on a side of the binding portion away from the main body; the orthographic projection of the driving chip on the reference surface at least partially overlaps with the orthographic projection of the first blocking hole on the reference surface; wherein the reference surface is the plane where the display surface of the main body of the display panel is located.

2. The display module according to claim 1, wherein: The display module includes a plurality of supporting layers, and the display module also includes: At least one adhesive layer, wherein an adhesive layer exists between two adjacent supporting layers in the multiple supporting layers; among the at least one adhesive layer, at least one adhesive layer is provided with a second blocking hole; the orthographic projection of the driving chip on the reference surface at least partially overlaps with the orthographic projection of the second blocking hole on the reference surface.

3. The display module according to claim 2, wherein: Along a direction perpendicular to the main body and pointing from the main body to the binding part, the multi-layer support layer includes a first support layer and a second support layer, the density of the first support layer is greater than the density of the second support layer; the second support layer is provided with the first barrier hole, and the first barrier hole penetrates the second support layer; The at least one adhesive layer includes a first adhesive layer, and the first adhesive layer is located between the first supporting layer and the second supporting layer; the first adhesive layer is provided with a second barrier hole, and the second barrier hole penetrates the first adhesive layer.

4. The display module according to claim 3, wherein: The orthographic projection of the first blocking hole on the reference surface substantially coincides with the orthographic projection of the second blocking hole on the reference surface.

5. The display module according to any one of claims 1 to 4, wherein: The orthographic projection of the driving chip on the reference surface is located within the range of the orthographic projection of the blocking hole on the reference surface; Furthermore, a distance between a boundary of an orthographic projection of the driving chip on the reference surface and a boundary of an orthographic projection of the blocking hole on the reference surface is greater than or equal to 0.5 mm.

6. The display module according to any one of claims 1 to 5, further comprising A heat sink is located in the blocking hole; an orthographic projection of the heat sink on the reference surface at least partially overlaps with an orthographic projection of the driver chip on the reference surface.

7. The display module according to any one of claims 1 to 5, further comprising: The electromagnetic shielding component is located in the blocking hole; the orthographic projection of the electromagnetic shielding component on the reference plane at least partially overlaps with the orthographic projection of the driving chip on the reference plane.

8. The display module according to any one of claims 1 to 5, further comprising: A buffer is located in the blocking hole; an orthographic projection of the buffer on the reference surface at least partially overlaps with an orthographic projection of the driver chip on the reference surface.

9. The display module according to any one of claims 1 to 8, further comprising: A second adhesive layer, comprising a first adhesive pattern and a second adhesive pattern; The first adhesive pattern is located between the at least one supporting layer and the binding portion; The second adhesive pattern is located between the at least one supporting layer and the binding portion, and between the first adhesive pattern and the bending portion. The thickness of the second adhesive pattern is greater than that of the first adhesive pattern, and there is a gap between the second adhesive pattern and the first adhesive pattern. Wherein, the driving chip is arranged on a side of the first adhesive pattern away from the main body.

10. The display module according to any one of claims 1 to 9, further comprising: Flexible glass, located on the display side of the main body; The orthographic projection of the flexible glass on the reference surface covers the orthographic projection of the display panel on the reference surface, and a boundary of the orthographic projection of the flexible glass on the reference surface is spaced from a boundary of the orthographic projection of the display panel on the reference surface; The first protective layer is located on a side of the flexible glass close to the display panel; the first protective layer is at least partially located on an edge portion of the flexible glass that exceeds the display panel, and the first protective layer surrounds the display panel.

11. The display module according to claim 10, wherein: An outer boundary of the orthographic projection of the first protection layer on the reference surface is located outside a boundary of the orthographic projection of the flexible glass on the reference surface.

12. The display module according to claim 10 or 11, wherein: The elastic modulus of the material of the first protective layer is smaller than the elastic modulus of the flexible glass.

13. The display module according to any one of claims 10 to 12, further comprising: The second protective layer is located on a side of the flexible glass away from the display panel and is arranged along the edge of the flexible glass. The outer boundary of the orthographic projection of the second protective layer on the reference plane is located outside the boundary of the orthographic projection of the flexible glass on the reference plane.

14. The display module according to claim 13, wherein: The distance between the outer boundary of the orthographic projection of the first protective layer on the reference surface and the boundary of the orthographic projection of the flexible glass on the reference surface is greater than or equal to 0.1 mm; and / or, The outer boundary of the orthographic projection of the second protective layer on the reference surface and the boundary of the orthographic projection of the flexible glass on the reference surface are greater than or equal to 0.1 mm.

15. The display module according to claim 13 or 14, wherein: The outer edge of the first protective layer is at least partially flush with the outer edge of the second protective layer.

16. The display module according to any one of claims 10 to 15, wherein: The material of the first protective layer includes polyimide or polyethylene terephthalate; in the case where the second protective layer is included, the material of the second protective layer includes polyimide or polyethylene terephthalate.

17. The display module according to any one of claims 10 to 16, further comprising: A covering layer is located on a side of the flexible glass away from the display panel; and the orthographic projection of the covering layer on the reference surface covers the orthographic projection of the flexible glass on the reference surface; a third adhesive layer, located between the cover layer and the flexible glass; The orthographic projection of the third adhesive layer on the reference surface is located within the orthographic projection of the flexible glass on the reference surface, and a boundary of the orthographic projection of the third adhesive layer on the reference surface is spaced from a boundary of the orthographic projection of the flexible glass on the reference surface; In the case where the display module includes a second protective layer, the second protective layer is at least partially located on an edge portion of the flexible glass that exceeds the third adhesive layer and surrounds the third adhesive layer.

18. The display module according to any one of claims 10 to 17, further comprising: A buffer layer, located between the flexible glass and the display panel; and / or, A light shielding layer is located between the flexible glass and the display panel, and the light shielding layer is configured to shield ultraviolet light.

19. A display device comprising: The display module according to any one of claims 1 to 18; A housing, wherein the display module is located inside the housing.

20. The display device according to claim 19, wherein: The shell includes a bottom plate, a frame and a top frame. The bottom plate is located on the non-display side of the display module. The frame surrounds the bottom plate and is arranged around the peripheral side of the display module. The top frame is located on the display side of the display module. The top frame is arranged in a ring shape along the edge of the flexible glass of the display module. The first protective layer is at least partially in contact with the top frame.

21. The display device according to claim 20, wherein: The inner boundary of the orthographic projection of the top frame on the reference plane is located within the range of the orthographic projection of the flexible glass on the reference plane, and the distance between the inner boundary of the orthographic projection of the top frame on the reference plane and the boundary of the orthographic projection of the flexible glass on the reference plane is greater than or equal to 2 mm.

22. The display device according to claim 20 or 21, wherein: The main body of the display panel in the display module has a display area and a peripheral area surrounding the display area, and the inner boundary of the orthographic projection of the top frame on the reference surface is located within the orthographic projection of the peripheral area on the reference surface.

Images