Compression resin sealing and molding device

Abstract

A compression resin sealing and molding device (101) is for molding a sealing resin layer so as to cover at least a portion of a first surface (1a) of a substrate (1) while sealing a component (7) disposed on the first surface (1a) of the substrate (1) having the first surface (1a) and a second surface (1b) forming front and rear surfaces. The compression resin sealing and molding device comprises a lower mold (51) facing the first surface (1a) and an upper mold (52) abutting the second surface (1b). The lower mold (51) includes an outer frame (12) and an inner frame (11), at least a portion of which can be displaced in the vertical direction relative to the outer frame (12). The outer frame (12) can abut the upper mold (52) on the outside of the substrate (1). The inner frame (11) can take a first state in which a resin material (41), which is the material of the sealing resin layer, is confined in an inner region of the inner frame (11), and a second state in which a portion of the resin material (41) is held in the inner region of the inner frame (11) while another portion of the resin material (41) is leaked to the outside of the inner frame (11). The distance between the portion of the lower mold (51) other than the outer frame (12) and the upper mold (52) when the lower mold (51) and the upper mold (52) are closest to each other is determined by the outer frame (12) abutting the upper mold (52).

Description

Compression resin sealing molding machine

[0001] The present invention relates to a compression resin sealing molding apparatus.

[0002] Japanese Patent Laid-Open Publication No. 2015-162553 (Patent Document 1) describes a resin molding apparatus for semiconductor devices. This resin molding apparatus includes a clamp plate connected to a lower mold by a spring. The clamp plate is disposed so as to surround the outer periphery of the cavity and has an annular protrusion. The annular protrusion contacts the backside of the semiconductor wafer when the mold is closed, thereby clamping the semiconductor wafer.

[0003] Patent Document 1 also describes a configuration in which a stopper is provided. In this case, the clamp plate is stopped by the stopper, so that the wafer is not pressed down more than a set value. This is said to prevent damage to the wafer due to excessive clamping.

[0004] JP 2015-162553 A

[0005] In Patent Document 1, the load applied to the semiconductor device by the clamp plate can be controlled by using a stopper, but the thickness of the semiconductor device cannot be controlled. The thickness of the resin formed on the semiconductor device is controlled by the amount of resin supplied.

[0006] However, there are cases where the thickness of the substrate used in the semiconductor device varies widely, and even if the amount of resin supplied is controlled correctly, if the thickness of the substrate varies widely, the thickness of the entire product, which is the combination of the substrate and the resin layer (hereinafter referred to as "product thickness"), will not necessarily be the desired value.

[0007] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a compression resin sealing molding apparatus that can easily and accurately control the thickness of a product.

[0008] In order to achieve the above object, a compression resin encapsulation molding apparatus according to the present invention is a compression resin encapsulation molding apparatus for encapsulating components arranged on a first surface of a substrate while encapsulating a resin layer so as to cover at least a portion of the first surface of the substrate, the apparatus comprising: a lower mold facing the first surface; and an upper mold abutting the second surface, the lower mold including an outer frame and an inner frame, at least a portion of which is vertically displaceable relative to the outer frame, the outer frame being capable of abutting against the upper mold outside the substrate, the inner frame being capable of assuming a first state in which a resin material for the encapsulation resin layer is confined and pressurized within an inner region of the inner frame; and a second state in which a portion of the resin material is retained within the inner region of the inner frame while another portion of the resin material leaks outward from the inner frame. When the lower mold and the upper mold are closest to each other, the distance between the upper mold and a portion of the lower mold other than the outer frame is determined by the abutment of the outer frame against the upper mold.

[0009] According to the present invention, the thickness of the product can be easily and accurately controlled by allowing a portion of the resin material to leak out of the inner frame while maintaining the desired distance between the lower mold and the upper mold using the outer frame.

[0010] FIG. 1 is a cross-sectional view of a state in which a substrate and a powdered resin material have been placed in a compression resin molding apparatus according to a first embodiment of the present invention. FIG. 2 is a plan view of a state in which only an outer frame and an inner frame have been removed from the compression resin molding apparatus according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view of a state in which a lower mold is relatively close to an upper mold in the compression resin molding apparatus according to the first embodiment of the present invention. FIG. 4 is a cross-sectional view of a state in which the inner frame has been lowered in the compression resin molding apparatus according to the first embodiment of the present invention. FIG. 5 is a plan view of a molded product obtained by the compression resin molding apparatus according to the first embodiment of the present invention. FIG. 6 is a cross-sectional view of a molded product obtained by the compression resin molding apparatus according to the first embodiment of the present invention. FIG. 7 is an explanatory view of a state in which an unnecessary portion of a molded product obtained by the compression resin molding apparatus according to the first embodiment of the present invention is removed. FIG. 8 is an explanatory view of a state in which operation is started with a substrate held by the upper mold in the compression resin molding apparatus according to the first embodiment of the present invention. 13A and 13B are cross-sectional views of a compression resin encapsulation molding apparatus according to a second embodiment of the present invention, showing a state in which the lower mold is relatively close to the upper mold; FIG. 14 is an explanatory diagram illustrating the provision of a passage for an air vent in the inner frame of the compression resin encapsulation molding apparatus according to the second embodiment of the present invention; FIG. 15 is a cross-sectional view of a compression resin encapsulation molding apparatus according to the second embodiment of the present invention, showing a state in which the second part of the inner frame has been lowered; FIG. 16 is an explanatory diagram illustrating the state of the inner frame in the state shown in FIG. 13; FIG. 17 is a plan view of a molded product obtained by the compression resin encapsulation molding apparatus according to the second embodiment of the present invention; FIG. 18 is an explanatory diagram illustrating placing an object on a rack after a molding operation; FIG. 19 is a cross-sectional view of a compression resin encapsulation molding apparatus according to the third embodiment of the present invention, showing a state in which a substrate and powdered resin material have been placed; FIG. 19 is a cross-sectional view of a compression resin encapsulation molding apparatus according to the third embodiment of the present invention, showing a state in which the lower mold is relatively close to the upper mold; FIG. 19 is a cross-sectional view of a compression resin encapsulation molding apparatus according to the third embodiment of the present invention, showing a state in which the inner frame has been lowered ...FIG. 1 is a cross-sectional view of a molded product obtained by the compression resin encapsulation molding apparatus in accordance with the third embodiment of the present invention. FIG. 2 is an explanatory view of cutting away a protruding portion from a molded product obtained by the compression resin encapsulation molding apparatus in accordance with the third embodiment of the present invention. FIG. 3 is an explanatory view of cutting out individual modules from a molded product obtained by the compression resin encapsulation molding apparatus in accordance with the third embodiment of the present invention. FIG. 4 is an explanatory view of starting operation with a substrate held by an upper mold in the compression resin encapsulation molding apparatus in accordance with the third embodiment of the present invention. FIG. 5 is a cross-sectional view of a state in which a substrate and powdered resin material have been placed in the compression resin encapsulation molding apparatus in accordance with the fourth embodiment of the present invention. FIG. 6 is a cross-sectional view of a state in which a lower mold is relatively close to an upper mold in the compression resin encapsulation molding apparatus in accordance with the fourth embodiment of the present invention. FIG. 7 is a cross-sectional view of a state in which an inner frame has been lowered in the compression resin encapsulation molding apparatus in accordance with the fourth embodiment of the present invention. FIG. 8 is a plan view of a molded product obtained by the compression resin encapsulation molding apparatus in accordance with the fourth embodiment of the present invention. FIG. 9 is a cross-sectional view of a state in which a substrate and powdered resin material have been placed in the compression resin encapsulation molding apparatus in accordance with the fifth embodiment of the present invention. FIG. 10 is a cross-sectional view of the compression resin sealing molding apparatus in the fifth embodiment according to the present invention, with the second inner frame portion lowered; FIG. 11 is a cross-sectional view of a molded product obtained by the compression resin sealing molding apparatus in the fifth embodiment according to the present invention; FIG. 12 is a cross-sectional view of the compression resin sealing molding apparatus in the sixth embodiment according to the present invention, with a substrate and powdered resin material placed therein; FIG. 13 is a cross-sectional view of the compression resin sealing molding apparatus in the sixth embodiment according to the present invention, with the lower mold relatively close to the upper mold; FIG. 14 is a cross-sectional view of the compression resin sealing molding apparatus in the sixth embodiment according to the present invention, with the second inner frame portion lowered;

[0011] The dimensional ratios shown in the drawings do not necessarily represent the actual ratios, and may be exaggerated for the sake of convenience. In the following description, when the concepts of up and down are mentioned, they do not necessarily mean absolute up and down, but may mean relative up and down in the illustrated position.

[0012] First Embodiment A compression resin sealing molding apparatus according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 7. FIG.

[0013] Hereinafter, when we say that member A and member B are in contact with each other, it does not only include the case where member A and member B are in direct contact with each other without any intervening means, but also the case where member A and member B are in contact with each other via some kind of thin sheet. In other words, even if some kind of thin sheet is interposed between member A and member B, it may be expressed as member A and member B being in contact with each other. Note that the intervening thin sheet is not limited to one sheet, and may be multiple sheets.

[0014] 1 shows a cross-sectional view of a compression resin encapsulation molding apparatus 101 according to this embodiment. Although the substrate 1, component 7, release sheets 2 and 3, and powdered resin material 40 are not part of the compression resin encapsulation molding apparatus 101, for ease of explanation, they are also shown in the cross-sectional view of the compression resin encapsulation molding apparatus 101. This also applies to the following figures.

[0015] The compression resin encapsulation molding apparatus 101 in this embodiment is a compression resin encapsulation molding apparatus for encapsulating components 7 arranged on the first surface 1a of a substrate 1 having a first surface 1a and a second surface 1b opposite each other while molding an encapsulating resin layer to cover at least a portion of the first surface 1a of the substrate 1. The compression resin encapsulation molding apparatus 101 includes a lower mold 51 facing the first surface 1a and an upper mold 52 abutting the second surface 1b. The lower mold 51 is movable relative to the upper mold 52. The lower mold 51 includes an outer frame 12 and an inner frame 11, at least a portion of which is vertically displaceable relative to the outer frame 12. In other words, the entire inner frame 11 may be vertically displaceable relative to the outer frame 12, or only a portion of the inner frame 11 may be vertically displaceable relative to the outer frame 12.

[0016] In order to show the positional relationship between the outer frame 12 and the inner frame 11, a plan view of only the outer frame 12 and the inner frame 11 is shown in FIG. 2 . The outer frame 12 and the inner frame 11 are each annular. The outer frame 12 is arranged to surround the inner frame 11. Here, an example is shown in which the outer frame 12 is annular in shape and continuous around the entire circumference, but the outer frame 12 is not limited to being a complete annular shape like this. For example, the outer frame 12 may be divided into multiple sections and arranged in an intermittent annular shape. Alternatively, the outer frame 12 may be arranged so that multiple blocks are scattered throughout.

[0017] The outer frame 12 can abut against the upper mold 52 outside the substrate 1. The inner frame 11 can be in a first state in which the resin material that is the material for the sealing resin layer is confined and pressurized within the inner region of the inner frame 11, and a second state in which a portion of the resin material is held within the inner region of the inner frame 11 while another portion of the resin material leaks out from the inner frame 11. The "resin material" referred to here is a powdered resin material 40 in FIG. 1. The resin material later melts and becomes a resin material 41 in FIGS. 3 and 4.

[0018] 1 shows a state in which a powdered resin material 40 is placed in a compression resin sealing molding apparatus 101. A release sheet 2 is placed on a lower mold 51, and the powdered resin material 40 is placed in the central cavity. A substrate 1 is placed on the release sheet 2. The substrate 1 is placed with a first surface 1a facing downward. A component 7 is mounted on the first surface 1a of the substrate 1.

[0019] Before placing the substrate 1 in this position, it is preferable to subject it to treatments such as Ar plasma cleaning, O2 radical plasma cleaning, and UV light cleaning. These treatments are performed on the substrate 1 to clean and modify its surface. These treatments are performed on the substrate 1 on which components have already been mounted. Any method for cleaning and surface modification may be used as long as it improves adhesion between the encapsulating resin and the substrate, and between the encapsulating resin and the components. For example, plasma cleaning may be performed using either the DP method or the RIE method. The gas used during processing may be any of Ar, N2, O2, CF4, etc., or a mixture of two or more of these. When optical cleaning is used, the light source used may be any type of light source, such as a low-pressure mercury lamp or an excimer lamp.

[0020] The outer edge of the substrate 1 rests on the inner frame 11 via a release sheet 2. However, the substrate 1 does not completely cover the top surface of the inner frame 11, but rather covers a portion of the top surface of the inner frame 11. A release sheet 3 is placed on the substrate 1.

[0021] The lower mold 51 includes a member 26, a member 27, an inner frame drive shaft 16, and a base drive shaft 17. The outer frame 12 is supported by the member 27. The inner frame 11 is supported by the member 26 via a spring 13. The inner frame drive shaft 16 extends from the member 26. The base drive shaft 17 extends from the member 27. The member 26 can move up and down relative to the member 27. By moving the inner frame drive shaft 16 up and down, the vertical position of the inner frame 11 can be determined. By moving the base drive shaft 17 up and down, the vertical position of the outer frame 12 can be determined.

[0022] FIG. 3 shows a state in which the lower mold 51 approaches the upper mold 52 relatively from the state shown in FIG. 1 . In this state, the substrate 1 sandwiched between the release sheets 2 and 3 is sandwiched and fixed between the inner frame 11 of the lower mold 51 and the upper mold 52. The resin material melts in the cavity and becomes the resin material 41. The resin material 41 is confined inside the inner frame 11. The resin material 41 covers a portion of the first surface 1a of the substrate 1. The state shown in FIG. 3 is the first state. In this first state, pressure can be applied to the resin material 41 at any desired value. This allows the resin material 41 to sufficiently fill the gap between the component 7 and the substrate 1 (hereinafter referred to as the "sub-component space"). Furthermore, applying sufficient pressure to the entire resin material 41 can prevent the generation of voids. In the first state, pressure can be applied to the resin material 41 without leaking any of the resin material 41, or air or resin material 41 can be leaked to the extent that the desired internal pressure is maintained.

[0023] In the first state shown in Fig. 3, compared to the state shown in Fig. 1, the spring 13 is elastically deformed, causing the inner frame 11 to sink downward relative to the member 27. At this time, the downward movement of the inner frame 11 reduces the volume of the resin material 41 that can be accommodated inside the inner frame 11, and thus the resin material 41 is pressurized. In other words, the inner frame 11 is supported via the spring 13 as an elastic body, and in the first state, the elastic body of the inner frame 11 elastically deforms, thereby pressurizing the resin material 41 confined in the inner region of the inner frame 11. In the example shown here, the spring 13 is installed below the inner frame 11 to lower the inner frame 11, but some other elastic body other than the spring 13, or an air cylinder, for example, may be installed below the inner frame 11.

[0024] In other words, any structure is acceptable as long as the lower mold 51 approaches the upper mold 52 relatively, the inner frame 11 comes into contact with the upper mold 52, and then the inner frame 11 descends relatively to the member 27, causing the resin material 41 to be pressed against the member 27 and applying pressure.

[0025] 4 shows a state in which the lower mold 51 has been moved even closer relative to the upper mold 52 and the inner frame 11 has been lowered from the state shown in Fig. 3. The movement to lower the inner frame 11 can be achieved, for example, by lowering the inner frame drive shaft 16. In addition to being achieved by lowering the inner frame drive shaft 16, the movement to lower the inner frame 11 can also be achieved by, for example, installing an air cylinder or the like below the inner frame 11 and using the air cylinder.

[0026] The structure of the parts related to the inner frame 11 is not limited to the above example. Any mechanism or method may be employed for the structure of the parts related to the inner frame 11, as long as it is possible for the inner frame 11 to descend from the state shown in Fig. 1 to follow the lower mold 51 as it approaches the upper mold 52 relatively to the state shown in Fig. 3, and the inner frame 11 can further descend relative to the member 27 to reach the state shown in Fig. 4.

[0027] In Fig. 4, a gap has formed between the lower surface of the substrate 1 and the upper surface of the inner frame 11, causing the resin material 41 to leak out. However, the resin material 41 that has leaked out of the inner frame 11 in this way remains in an area inside the outer frame 12. The state shown in Fig. 4 is the second state.

[0028] When the lower mold 51 and the upper mold 52 are closest to each other, the distance between the upper mold 52 and the portion of the lower mold 51 other than the outer frame 12 is determined by the outer frame 12 abutting against the upper mold 52. That is, in the state shown in Fig. 4, the outer frame 12 acts as a stopper to set the distance between the portion of the lower mold 51 other than the outer frame 12 and the upper mold 52 to a desired distance. The distance between the upper surface of the member 27 of the lower mold 51 and the lower surface of the upper mold 52 is accurately determined by the height of the outer frame 12.

[0029] Although the outer frame 12 is illustrated as a frame-shaped member here, it is not necessarily frame-shaped and may be a plurality of divided blocks. The portion corresponding to the outer frame 12 may have any structure as long as it acts as a stopper for setting the distance between the portion of the lower mold 51 other than the outer frame 12 and the upper mold 52 to a desired distance.

[0030] When the lower mold 51 and the upper mold 52 are clamped together, that is, when the lower mold 51 is pressed further upward from the state shown in Fig. 3, the inner frame 11 sinks slightly due to the elastic deformation of the spring 13. Because the inner frame 11 is biased upward by the force of the spring 13, downward displacement of the inner frame 11 does not cause the resin material 41 to immediately leak out. However, in the state shown in Fig. 4 that is subsequently achieved, the inner frame drive shaft 16 is lowered to intentionally cause the resin material 41 to leak out. At this time, the downward displacement of the inner frame 11 is sufficiently large, allowing the resin material 41 to leak out from the gap.

[0031] The resin material 41 hardens with some of it leaking outside the inner frame 11, and the resulting molded product is shown in a plan view in Figure 5. The top surface of the substrate 1 is exposed, and the leaked resin material 41 hardens and adheres to the outer periphery in an amorphous form. A cross-sectional view of this state is shown in Figure 6. The protruding portion 41e of the resin material 41 is connected to both ends. As shown in Figure 7, the portion 41e is cut off. The portion 41e may also be removed by breaking it. An encapsulating resin layer 42 is formed to encapsulate the component 7. Furthermore, if this state corresponds to an assembly of multiple products, it is cut into the size of each individual product.

[0032] 4, the resin material 41 may be cured with the inner frame 11 in a lowered state, or the inner frame 11 may be raised before the resin material 41 is cured and then the resin material 41 may be cured. By curing the resin material 41 after raising the inner frame 11, the resin material 41 in the region overlapping the upper surface of the inner frame 11 becomes even thinner than that shown in FIG. 6, which makes it easier to divide and remove the protruding portion 41e.

[0033] In this embodiment, the thickness of the product including the substrate 1 and the encapsulating resin layer 42 can be easily and precisely controlled by using the outer frame to set the desired distance between the lower mold 51 and the upper mold 52 while allowing a portion of the resin material 41 to leak out. Even if there is variation in the thickness of the substrate 1 or if there are areas in the product where no components are mounted, this can be accommodated by naturally changing the amount of leaked resin material 41, and as a result, the product thickness can be set to the desired value with high precision. As described above, this embodiment makes it possible to realize a compression resin encapsulating molding device that can easily control the resin thickness formed in the target product.

[0034] In this embodiment, the operation is started with the substrate 1 placed on the lower mold 51, but as shown in FIG. 8, the operation may also be started with the substrate 1 held by the upper mold 52. In FIG. 8, the release sheet 3 is held on the lower surface of the upper mold 52, and the substrate 1 is held on the lower surface of the release sheet 3. In order to hold the release sheet 3 on the lower surface of the upper mold 52, the upper surface of the release sheet 3 may be made adhesive, and the release sheet 3 may be attached to the lower surface of the upper mold 52. Even when the operation is started from the state shown in FIG. 8, when the lower mold 51 and the upper mold 52 are brought closer to each other, the state shown in FIG. 3 is reached. Thereafter, the operation proceeds to the state shown in FIG. 4.

[0035] As shown in this embodiment, it is preferable that the inner frame 11 abuts against the first surface 1 a in the first state. By adopting this configuration, the inner frame 11 can be used to clamp the substrate 1.

[0036] (Embodiment 2) A compression resin encapsulation molding apparatus according to Embodiment 2 of the present invention will be described with reference to Figures 9 to 15. Figure 9 shows a plan view of only the inner frame 11 and outer frame 12 included in this compression resin encapsulation molding apparatus. The inner frame 11 includes an inner frame first portion 11a and an inner frame second portion 11b. The inner frame 11 is annular, with the inner frame second portion 11b positioned to occupy a portion of the inner frame. The inner frame 11 is annular due to the combination of the inner frame first portion 11a and the inner frame second portion 11b. Figure 10 shows a cross-sectional view taken along line X-X in Figure 9. However, Figure 10 does not limit the cross-sectional view to the inner frame first portion 11a and the inner frame second portion 11b, but rather shows a wider area of ​​the compression resin encapsulation molding apparatus 102.

[0037] The compression resin sealing molding device 102 is equipped with springs 13a and 13b. The inner frame first portion 11a of the inner frame 11 is supported by the spring 13a. The inner frame second portion 11b of the inner frame 11 is supported by the spring 13b. The inner frame second portion 11b is vertically displaceable separately from the inner frame first portion 11a. The vertical position of the inner frame second portion 11b can be determined by moving the inner frame drive shaft 16 vertically.

[0038] 10, the outer edge of the substrate 1 rests on the inner frame 11 via the release sheet 2. That is, one part of the outer edge of the substrate 1 rests on the inner frame first part 11a, and the other part rests on the inner frame second part 11b.

[0039] FIG. 11 shows a state in which the lower mold 51 has moved relatively closer to the upper mold 52 than the state shown in FIG. 10. In this state, the substrate 1 sandwiched between the release sheets 2 and 3 is sandwiched and fixed between the inner frame 11 of the lower mold 51 and the upper mold 52. The resin material melts in the cavity and becomes the resin material 41. The resin material 41 is confined inside the inner frame 11. The resin material 41 covers a portion of the first surface 1a of the substrate 1. The state shown in FIG. 11 is the first state.

[0040] Although the top surfaces of the first and second inner frame portions 11a and 11b are shown in FIG. 11 as being at the same height, the top surface of the second inner frame portion 11b may actually be set slightly lower. That is, as shown in FIG. 12, the top surface of the second inner frame portion 11b may be positioned lower by a depth D than the top surface of the first inner frame portion 11a. In this case, the recess of depth D is formed as a gap that does not allow leakage of the resin material 41 but allows air to pass through. This recess is used as a passage for an air vent when the resin material 41 is confined between the lower mold 51 and the upper mold 52. As long as the desired internal pressure is ensured, the resin material 41 may leak through this passage in addition to air.

[0041] The structure of the parts related to the inner frame 11 is not limited to the above-mentioned example. Any mechanism or method may be employed for the structure of the parts related to the inner frame 11, as long as it is possible for the inner frame first part 11a and the inner frame second part 11b to descend from the state shown in Fig. 10 when the lower mold 51 approaches the upper mold 52 relatively to reach the state shown in Fig. 11, and the inner frame second part 11b can further descend relative to the member 27 to reach the state shown in Fig. 13.

[0042] Figure 13 shows a state in which the lower mold 51 is further moved relatively closer to the upper mold 52 from the state shown in Figure 11, and the inner frame second portion 11b is lowered. In this state, the outer frame 12 abuts against the underside of the upper mold 52, thereby defining the distance between the upper mold 52 and the portion of the lower mold 51 other than the outer frame 12. The movement to lower the inner frame second portion 11b can be achieved by lowering the inner frame drive shaft 16. In this state, the inner frame second portion 11b is lowered by a greater distance than the depth D shown in Figure 12. In Figure 13, a gap has formed between the underside of the substrate 1 and the upper surface of the inner frame second portion 11b, causing the resin material 41 to leak outward. However, the resin material 41 that has leaked outward from the inner frame 11 in this manner remains in an area inside the outer frame 12. The state shown in Figure 13 is the second state. The appearance of the inner frame 11 in this state is shown in Figure 14. The second inner frame portion 11b is lower than the first inner frame portion 11a. That is, in the second state, the second inner frame portion 11b as part of the inner frame 11 is displaced in a direction away from the upper mold 52, causing the resin material 41 to leak out of the inner frame 11.

[0043] The resin material 41 hardens with a portion of it leaking outside the inner frame 11, and the resulting molded product is shown in a plan view in Figure 15. The top surface of the substrate 1 is exposed, and the leaked resin material 41 hardens and adheres to the outer periphery in an amorphous form. The leakage of the resin material 41 occurs only in the section where the inner frame second portion 11b is arranged, and as shown in Figure 15, the protruding portion 41e is formed so as to protrude only in the section where the inner frame second portion 11b is arranged. Since portion 41e is unnecessary, it is cut off.

[0044] This embodiment can also achieve the effects described in the first embodiment. In this embodiment, the portion 41e is formed only in a limited area rather than around the entire circumference, which makes it easier to cut out the portion 41e. In other words, the portion 41e is formed so as to protrude only from a limited area, which makes it easier to break off the portion 41e.

[0045] Furthermore, as shown in Fig. 16, objects after molding can be easily handled when they are placed on the rack 60. Convex portions 61 and concave portions 62 are formed on the left and right inner walls of the rack 60 so as to extend in a front-to-rear direction. The object is placed by sliding it along the concave portions 62 to the rear so that the left and right ends of the object rest on the convex portions 61. When the object is to be removed from the rack 60, it is removed by sliding it forward along the concave portions 62.

[0046] In this embodiment, the portions 41e are not formed on the four sides where the inner frame second portions 11b are not arranged. Therefore, by adopting a configuration in which the inner frame second portions 11b are not arranged on the two parallel sides of the substrate 1, it is possible to realize a linear state in which the two parallel sides are not formed with any protruding portions 41e after molding. This allows the substrate to be smoothly inserted into and removed from the rack 60 without getting caught.

[0047] As shown in this embodiment, if a slight difference in the height of the top surfaces of the first inner frame portion 11a and the second inner frame portion 11b is provided to ensure a passage for the air vent, air escapes more easily when the resin material is pressed, ensuring that the resin material 41 is filled around the component 7. Improved air escape reduces the likelihood of voids occurring.

[0048] 17 to 19, a compression resin sealing molding apparatus according to a third embodiment of the present invention will be described. An initial state of a compression resin sealing molding apparatus 103 according to this embodiment is shown in FIG.

[0049] In the compression resin sealing molding device 103, the inner frame 11 is not in contact with the first surface 1a of the substrate 1. The substrate 1 is placed on top of the powdered resin material 40. The substrate 1 is contained inside the inner frame 11. The substrate 1 and the powdered resin material 40 are contained in the recesses of the release sheet 2. Figure 18 shows a state in which the lower mold 51 moves relatively close to the upper mold 52 from this state. The resin material melts in the cavity and becomes the resin material 41. The resin material 41 is confined inside the inner frame 11. The resin material 41 covers the entire first surface 1a of the substrate 1. The state shown in Figure 18 is the first state.

[0050] In the first state, the inner frame 11 abuts against the upper mold 52 at a position surrounding the substrate 1 .

[0051] Figure 19 shows a state in which the lower mold 51 has been moved even closer to the upper mold 52 relative to the state shown in Figure 18, and the inner frame 11 has been lowered slightly. The movement of lowering the inner frame 11 can be achieved by lowering the inner frame drive shaft 16. In Figure 19, a gap has been created between the lower surface of the substrate 1 and the upper surface of the inner frame 11, so the resin material 41 has leaked out. However, the resin material 41 that has leaked out of the inner frame 11 in this way remains in an area inside the outer frame 12. The state shown in Figure 19 is the second state.

[0052] The present embodiment can also achieve the effects described in the first embodiment. In this embodiment, the substrate 1 is not constrained in the thickness direction, so the degree of damage to the substrate 1 can be reduced. By reducing the difference between the inner size of the inner frame 11 and the size of the substrate 1, the resin material can be molded in a state in which the substrate 1 is constrained in the horizontal direction but not in the thickness direction. In the compression resin sealing molding device 103 of this embodiment, as shown in FIG. 20, the resin material is molded in a state in which it is expanded to a size larger than the size of the substrate 1. In this case, the state shown in FIG. 21 is obtained. The protruding portion 41e can be cut off as shown in FIG. 22.

[0053] 23, the substrate is cut into individual modules 201. At this time, the outer periphery is cut out as an unnecessary portion 251.

[0054] In this embodiment, good positional accuracy between the substrate 1 and the sealing resin layer 42 can reduce the amount of wasted resin molding on the outer periphery. When the inner frame 11 is lowered to allow the resin material 41 to leak as shown in Figure 19, the thickness of the passage through which the resin material 41 leaks needs to be smaller than the thickness of the substrate 1 so that the substrate 1 does not move horizontally and overlap the inner frame 11.

[0055] In this embodiment, the operation is started with the substrate 1 placed on the powder resin material 40 on the lower mold 51 side, but as shown in FIG. 24, the operation may also be started with the substrate 1 held by the upper mold 52. In FIG. 24, the release sheet 3 is held on the lower surface of the upper mold 52, and the substrate 1 is held on the lower surface of the release sheet 3. Even when the operation is started in the state shown in FIG. 24, when the lower mold 51 and the upper mold 52 are brought closer to each other, the state shown in FIG. 18 is reached. Thereafter, the operation proceeds to the state shown in FIG. 19.

[0056] 25 to 28, a compression resin sealing molding apparatus according to a fourth embodiment of the present invention will be described. An initial state of a compression resin sealing molding apparatus 104 according to this embodiment is shown in FIG.

[0057] In the compression resin sealing molding device 104, as in the third embodiment, the substrate 1 is housed inside the inner frame 11. Furthermore, as in the second embodiment, the inner frame 11 includes a first inner frame portion 11a and a second inner frame portion 11b. The second inner frame portion 11b is capable of vertical displacement separately from the first inner frame portion 11a.

[0058] Figure 26 shows a state in which the lower mold 51 has moved relatively closer to the upper mold 52 from the state shown in Figure 25. The resin material melts in the cavity and becomes the resin material 41. The resin material 41 is confined inside the inner frame 11. Figure 27 shows a state in which the lower mold 51 has moved relatively closer to the upper mold 52 from the state shown in Figure 26 and the inner frame second portion 11b has been slightly lowered. In Figure 27, a gap has appeared between the lower surface of the substrate 1 and the upper surface of the inner frame second portion 11b, causing the resin material 41 to leak out.

[0059] Since resin material 41 hardens with a portion of it leaking outside inner frame 11, the resulting product is shown in a plan view in Fig. 28. Since the leakage of resin material 41 occurs only in the section where inner frame second portion 11b is arranged, as shown in Fig. 28, the protruding portion 41e is formed so as to protrude only in the section where inner frame second portion 11b is arranged.

[0060] This embodiment also provides the effects described in embodiment 1. Furthermore, this embodiment also provides the effects of both embodiments 2 and 3.

[0061] 29 to 31, a compression resin sealing molding apparatus in accordance with a fifth embodiment of the present invention will be described. An initial state of a compression resin sealing molding apparatus 105 in this embodiment is shown in FIG.

[0062] In the compression resin sealing molding device 105, steps are provided in the inner frame 11. That is, a step portion 11u is provided in the first inner frame portion 11a, and a step portion 11v is provided in the second inner frame portion 11b. The substrate 1 is placed so as to be hooked on the step portions 11u and 11v. The other configurations are the same as those described in the second embodiment.

[0063] Figure 30 shows a state in which the lower mold 51 has moved relatively closer to the upper mold 52 from the state shown in Figure 29. The resin material melts in the cavity and becomes the resin material 41. The resin material 41 is confined inside the inner frame 11. Figure 31 shows a state in which the lower mold 51 has moved relatively closer to the upper mold 52 from the state shown in Figure 30 and the inner frame second portion 11b has been slightly lowered. In Figure 31, a gap has appeared between the lower surface of the substrate 1 and the upper surface of the inner frame second portion 11b, causing the resin material 41 to leak out.

[0064] In this embodiment, the inner frame 11 includes a first height portion that can come into contact with the upper mold 52, and a second height portion that is located inside the first height portion and can overlap the substrate 1. Step portions 11u and 11v are formed by the difference in height between the first height portion and the second height portion.

[0065] The present embodiment can also achieve the effects described in the first embodiment. A molded product obtained by the compression resin sealing molding apparatus 105 in this embodiment is shown in Figure 32. Figure 32 is a cross-sectional view taken along a cross section passing only through the portion that abutted against the inner frame first portion 11a, not the portion that abutted against the inner frame second portion 11b. As shown in Figure 32, a sealing resin layer 42 is formed. However, a notch 43 is formed near the outer periphery of the molded product. At the notch 43, the thickness of the sealing resin layer 42 is thinner.

[0066] Near the periphery of the substrate 1, there are areas where no components are mounted, even though they are on the substrate 1. In this embodiment, cutouts 43 can be formed in the sealing resin layer 42 in these areas, which allows the amount of resin used to be reduced.

[0067] As shown in this embodiment, it is preferable that the first height portion and the second height portion are integrally formed. By adopting this configuration, the number of parts can be reduced.

[0068] Sixth Embodiment A compression resin sealing molding apparatus in a sixth embodiment according to the present invention will be described with reference to Figures 33 to 35. An initial state of a compression resin sealing molding apparatus 106 in this embodiment is shown in Figure 33.

[0069] In the compression resin sealing molding device 106, a bottom-raising portion 18 is arranged further inside the inner frame 11. The bottom-raising portion 18 is fixed to the upper surface of the member 27. The bottom-raising portion 18 is not limited to being a separate member, but may be a protruding portion of the member 27. No step portion is provided in the inner frame first portion 11a and the inner frame second portion 11b. The other configurations are the same as those described in the third embodiment.

[0070] Figure 34 shows a state in which the lower mold 51 has moved relatively closer to the upper mold 52 from the state shown in Figure 33. The resin material melts in the cavity and becomes the resin material 41. The resin material 41 is confined inside the inner frame 11. Figure 35 shows a state in which the lower mold 51 has moved relatively closer to the upper mold 52 from the state shown in Figure 34 and the inner frame second portion 11b has been slightly lowered. In Figure 35, a gap has appeared between the lower surface of the substrate 1 and the upper surface of the inner frame second portion 11b, causing the resin material 41 to leak out.

[0071] The inner frame 11 has a first height portion that can come into contact with the upper mold 52. The lower mold 51 has a second height portion that is located inside the inner frame 11 and can overlap the substrate 1 without contacting the substrate 1. In this embodiment, the bottom-raised portion 18 is the second height portion.

[0072] In this embodiment, the same effects as those described in the fifth embodiment can be obtained.

[0073] It should be noted that a plurality of the above-described embodiments may be appropriately combined and employed. The above-described embodiments disclosed herein are illustrative in all respects and are not limiting. The scope of the present invention is defined by the claims, and includes all modifications within the meaning and scope of the claims.

[0074] (Addendum) (Addendum 1) A compression resin sealing molding apparatus for molding an encapsulating resin layer to cover at least a portion of a first surface of a substrate, the first surface and second surface being opposite each other, while encapsulating a component arranged on the first surface of the substrate, the compression resin sealing molding apparatus comprising: a lower mold facing the first surface; and an upper mold abutting the second surface, the lower mold including an outer frame and an inner frame, at least a portion of which is displaceable in an up-and-down direction relative to the outer frame, the outer frame being capable of abutting against the upper mold outside the substrate, the inner frame being capable of taking two states: a first state in which a resin material that is a material for the encapsulating resin layer is confined and pressurized within an inner region of the inner frame, and a second state in which a portion of the resin material is held within the inner region of the inner frame while another portion of the resin material leaks out beyond the inner frame, and when the lower mold and the upper mold are closest to each other, the distance between the upper mold and a portion of the lower mold other than the outer frame is determined by the outer frame abutting against the upper mold.

[0075] (Supplementary Note 2) The compression resin sealing molding apparatus according to Supplementary Note 1, wherein the inner frame abuts against the first surface in the first state.

[0076] (Supplementary Note 3) The compression resin sealing molding apparatus according to Supplementary Note 1, wherein in the first state, the inner frame abuts against the upper mold at a position surrounding the substrate.

[0077] (Appendix 4) The compression resin sealing molding device described in Appendix 3, wherein the inner frame includes a first height portion that can abut against the upper mold and a second height portion that is located inside the first height portion and can overlap the substrate.

[0078] (Supplementary Note 5) The compression resin sealing molding device according to Supplementary Note 4, wherein the first height portion and the second height portion are integrally formed.

[0079] (Appendix 6) A compression resin sealing molding device as described in Appendix 3, wherein the inner frame has a first height portion that can abut against the upper mold, and the lower mold has a second height portion inside the inner frame that can overlap the substrate without contacting the substrate.

[0080] (Appendix 7) A compression resin sealing molding device described in any one of Appendices 1 to 6, wherein in the second state, a portion of the inner frame is displaced in a direction away from the upper mold, thereby causing the resin material to leak out from the inner frame.

[0081] (Appendix 8) A compression resin sealing molding device described in any one of Appendices 1 to 7, wherein the inner frame is supported via an elastic body, and in the first state, the elastic body elastically deforms, thereby pressurizing the resin material confined in the inner region of the inner frame.

[0082] 1 Substrate, 1a First surface, 1b Second surface, 2, 3 Release sheet, 7 Parts, 11 Inner frame, 11a Inner frame first part, 11b Inner frame second part, 11u, 11v Step portion, 12 Outer frame, 13, 13a, 13b Spring, 15 Base, 16 Inner frame drive shaft, 17 Base drive shaft, 18 Bottom raised portion, 26, 27 Member, 40 Powdered resin material, 41 Resin material, 41e (protruding) portion, 42 Sealing resin layer, 43 Cutout portion, 51 Lower mold, 52 Upper mold, 60 Rack, 61 Convex portion, 62 Concave portion, 101, 102, 103, 104, 105, 106 Compression resin sealing molding device, 201 Module, 251 Unnecessary portion.

Claims

1. A compression resin sealing molding apparatus for molding an encapsulating resin layer to cover at least a portion of a first surface of a substrate, the first surface and the second surface being opposite each other, while encapsulating a component placed on the first surface of the substrate, the compression resin sealing molding apparatus comprising: a lower mold opposing the first surface; and an upper mold abutting the second surface, the lower mold including an outer frame and an inner frame, at least a portion of which is vertically displaceable relative to the outer frame, the outer frame being capable of abutting against the upper mold outside the substrate, the inner frame being capable of assuming a first state in which a resin material that is a material for the encapsulating resin layer is confined within an inner region of the inner frame and pressurized, and a second state in which a portion of the resin material is retained within the inner region of the inner frame while another portion of the resin material leaks out beyond the inner frame, the compression resin sealing molding apparatus comprising: a lower mold opposed to the first surface; 2. The compression resin sealing molding apparatus according to claim 1, wherein said inner frame is in contact with said first surface in said first state.

3. The compression resin sealing molding apparatus according to claim 1, wherein in the first state, said inner frame abuts against said upper die at a position surrounding said substrate.

4. A compression resin sealing molding apparatus as described in claim 3, wherein the inner frame includes a first height portion that can abut against the upper mold, and a second height portion that is located inside the first height portion and can overlap the substrate.

5. The compression resin sealing molding apparatus according to claim 4, wherein the first height portion and the second height portion are integrally formed.

6. A compression resin sealing molding apparatus as described in claim 3, wherein the inner frame has a first height portion that can abut against the upper mold, and the lower mold has a second height portion inside the inner frame that can overlap the substrate without contacting the substrate.

7. A compression resin sealing molding device described in any one of claims 1 to 6, wherein in the second state, a portion of the inner frame is displaced away from the upper mold, thereby causing the resin material to leak out from the inner frame to the outside.

8. A compression resin sealing molding device described in any one of claims 1 to 7, wherein the inner frame is supported via an elastic body, and in the first state, the elastic body elastically deforms, thereby pressurizing the resin material confined in the inner region of the inner frame.

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