Resin-sealed mold and molded article

Abstract

A resin-sealed mold according to one aspect of an embodiment is for resin-sealing a molded article so as to form an exposed surface in which a part of the molded article is exposed without being covered with a resin, and has a cavity forming part for forming a cavity in which the molded article is disposed and into which the resin flows. The cavity forming part has a contact surface that comes into contact with the exposed surface of the molded article in the cavity. The contact surface has a first region (3121) and a second region (3122) that is surrounded by the first region (3121) and is formed to have a surface roughness different from that of the first region (3121).

Description

Resin sealing mold and molded product

[0001] The disclosed embodiments relate to a resin-sealing mold and a molded article.

[0002] A resin sealing mold for resin-sealing a molded article has been known. For example, a resin sealing mold for producing a molded article by resin-sealing a molded article so as to form an exposed surface in which a portion of the molded article is not covered with resin.

[0003] In this type of resin-sealing mold, during resin sealing, resin may get into the gap between the mold and the surface of the molded product that is intended to be the exposed surface, and this resin may adhere to the surface of the molded product that is intended to be the exposed surface, covering the surface with thin burrs. Such burrs are called flash burrs.

[0004] Patent Document 1 discloses a technique for suppressing flash burrs by forming a recess surrounded by a protruding wall on a molded product and forming a protrusion facing the recess on the molded product on a resin sealing mold. With this technique, resin that has entered between the surface of the molded product and the mold during resin sealing is blocked by the gap formed between the protrusion and the recess, thereby forming the portion of the molded product that faces the protrusion on the mold as an exposed surface.

[0005] JP 2018-56310 A

[0006] However, the technology described in Patent Document 1 requires the formation of a recess in the molded product whose outer periphery is surrounded by a protruding wall, and it is difficult to suppress flash burrs in molded products that do not have protruding walls, for example.

[0007] One aspect of the embodiment has been made in consideration of the above, and aims to provide a resin sealing mold and a molded product that can prevent the surface that is to be the exposed surface from being covered with flash burrs.

[0008] A resin sealing mold according to one aspect of the embodiment is a resin sealing mold that seals a molded product with resin so as to form an exposed surface where a portion of the molded product is exposed and not covered by resin, and has a cavity-forming portion that forms a cavity into which the molded product is placed and the resin flows in. The cavity-forming portion has an abutment surface that abuts against the exposed surface of the molded product within the cavity, and the abutment surface has a first region and a second region that is surrounded by the first region and has a surface roughness different from that of the first region.

[0009] According to one aspect of the embodiment, it is possible to prevent the surface intended to be the exposed surface from being covered with flash burrs.

[0010] FIG. 1 is a perspective view showing an example of the configuration of a resin sealing apparatus according to the first embodiment. FIG. 2 is a plan view showing an example of the configuration of a molded product according to the first embodiment. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. FIG. 4 is a cross-sectional view showing an example of the configuration of a portion of a resin sealing mold of the resin sealing apparatus according to the first embodiment. FIG. 5 is a plan view showing an example of a lower die chess in the resin sealing mold according to the first embodiment. FIG. 6 is a perspective view showing an example of a fitting block of the lower die chess in the resin sealing mold according to the first embodiment. FIG. 7 is a diagram (part 1) showing an example of a resin sealing process using the resin sealing mold according to the first embodiment. FIG. 8 is a diagram (part 2) showing an example of a resin sealing process using the resin sealing mold according to the first embodiment. FIG. 9 is a diagram (part 3) showing an example of a resin sealing process using the resin sealing mold according to the first embodiment. FIG. 10 is a diagram (part 4) showing an example of a resin sealing process using the resin sealing mold according to the first embodiment. FIG. 11 is a diagram (part 5) showing an example of a resin sealing process using the resin sealing mold according to the first embodiment. Fig. 12 is a plan view showing an example of a molded product produced in a resin sealing process using the resin sealing mold according to the first embodiment. Fig. 13 is an enlarged view of region X shown in Fig. 12. Fig. 14 is a plan view showing another example of a fitting block of a lower die chess in the resin sealing mold according to the first embodiment. Fig. 15 is a bottom view showing an example of a molded product according to the second embodiment. Fig. 16 is a cross-sectional view showing an example of a resin sealing mold according to the second embodiment. Fig. 17 is a bottom view showing another example of the bottom surface of a member in the molded product according to the second embodiment.

[0011] Hereinafter, embodiments of a resin-sealing mold and a molded article disclosed in the present application will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below.

[0012] 1, a resin sealing apparatus 100 according to a first embodiment includes a resin sealing mold 1, a plurality of dies 4, a fixed platen 5, a movable platen 6, and a transfer unit 7. To facilitate understanding of the positional relationships, multiple drawings including FIG. 1 show axes of an XYZ coordinate system including an X-axis, a Y-axis, and a Z-axis that are orthogonal to one another, and the Z-axis is the up-down direction.

[0013] The multiple diving bars 4 are parallel to one another and extend in the vertical direction, and are supported on a base (not shown). A fixed platen 5 is fixed to the upper end of each diving bar 4, and a movable platen 6 is attached to each diving bar 4 so as to be movable in the vertical direction (Z-axis direction).

[0014] The resin sealing mold 1 includes an upper mold 2 and a lower mold 3. The upper mold 2 is attached to a fixed platen 5, and the lower mold 3 is attached to a movable platen 6. The movable platen 6 is driven by a drive mechanism (not shown) to move up and down. The upper mold 2 includes an upper chess piece 10 and an upper die set 20 that supports the upper chess piece 10. The lower mold 3 includes a lower chess piece 30 and a lower die set 40 that supports the lower chess piece 30.

[0015] In the resin sealing apparatus 100, the movable platen 6 moves upward, causing the lower mold 3 to come into contact with the upper mold 2 and clamping the upper mold 2 and the lower mold 3. In the example shown in Fig. 1, the resin sealing apparatus 100 is configured so that the lower mold 3 moves upward (positive direction of the Z axis), but it may also be configured so that the upper mold 2 moves downward (negative direction of the Z axis), or so that the lower mold 3 moves upward and the upper mold 2 moves downward.

[0016] In the resin sealing device 100, the upper mold 2 and the lower mold 3 come into contact with each other and are clamped together, thereby forming a cull, a runner, and a cavity 50 (see Figure 8) in the space between the upper mold 2 and the lower mold 3, and the molded product 60 is resin-sealed within the cavity 50 (see Figure 8).

[0017] 2 and 3, the workpiece 60 includes a plurality of members 61 to 66. The member 61 is, for example, a die pad, the members 62 and 63 are, for example, leads, the members 64 and 65 are, for example, electronic components (such as semiconductor chips), and the member 66 is, for example, a bonding wire.

[0018] The members 61, 62, 63, etc. are formed by a lead frame, but are not limited to this example. Furthermore, the members 61 to 66, etc. in the molded product 60 are not limited to the above-mentioned example, and the configuration of the molded product 60 is also not limited to the above-mentioned example.

[0019] The resin sealing mold 1 of the resin sealing apparatus 100 seals the molded product 60 with resin so as to form an exposed surface where a portion of the molded product 60 is not covered with resin, thereby producing a molded product, which will be described later. In the molded product 60 shown in Fig. 3, an exposed surface, which will be described later, is formed on a bottom surface 611 of the member 61 during resin sealing by the resin sealing mold 1. The bottom surface 611 of the member 61 is a flat surface, but is not limited to such an example.

[0020] 1 is configured to resin-seal one molded article 60, but is not limited to this example and may be configured to simultaneously resin-seal a plurality of molded articles 60. Below, the configuration of the resin sealing mold 1 of the resin sealing apparatus 100 and each of the resin sealing steps for resin-sealing the molded article 60 using the resin sealing mold 1 of the resin sealing apparatus 100 will be described in detail in order.

[0021] 4, in the resin sealing mold 1 of the resin sealing apparatus 100, before clamping, the upper mold 2 including the upper chess piece 10 and the lower mold 3 including the lower chess piece 30 are positioned apart from each other in the clamping direction (Z-axis direction). In the resin sealing process for the molded product 60, the lower mold 3 is moved in a direction toward the upper mold 2 (positive direction of the Z-axis) and comes into contact with the upper mold 2 for clamping.

[0022] The upper die chess 10 includes a cavity forming portion 11 that forms a cavity 50 (see FIG. 8), a runner forming portion (not shown) that forms a runner (not shown), and a cull forming portion (not shown) that forms a cull (not shown). Each of the cavity 50 (see FIG. 8), the cull (not shown), and the runner (not shown) is a space that is formed when the upper die 2 and the lower die 3 are clamped together.

[0023] The lower die chess 30 includes a cavity forming portion 31 that forms a cavity 50 (see FIG. 8), a runner forming portion (not shown) that forms a runner (not shown), and a cull forming portion (not shown) that forms a cull (not shown).

[0024] 4 and 5, the lower chess piece 30 includes a main body block 32 and a fitting block 33. The main body block 32 includes a cavity forming portion 311, a runner forming portion (not shown) for forming a runner (not shown), a cull forming portion (not shown) for forming a cull (not shown), etc. The fitting block 33 includes a cavity forming portion 312.

[0025] An insertion hole 321 is formed in the main body block 32, and an insertion block 33 is inserted into the insertion hole 321. In Fig. 4, the insertion block 33 is inserted into the insertion hole 321 of the main body block 32, and the cavity forming portion 311 and the cavity forming portion 312 form the cavity forming portion 31.

[0026] 6, the cavity-forming portion 312 of the fitting block 33 has a first region 3121 and a second region 3122 that is surrounded by the first region 3121 and has a surface roughness different from that of the first region 3121. The cavity-forming portion 312 is an example of a contact surface that contacts the bottom surface 611 of the member 61 in the workpiece 60. The cavity-forming portion 312 shown in FIG. 6 is a flat surface, but is not limited to such an example and may be any surface that contacts the bottom surface 611 of the member 61 over its entire surface.

[0027] The second region 3122 is a polygonal or circular region, and the first region 3121 is an annular region surrounding the second region 3122, but is not limited to such an example. The surface roughness of the first region 3121 may be coarser than the surface roughness of the second region 3122, but may also be finer than the surface roughness of the second region 3122.

[0028] 7, a transfer device (not shown) places the molded article 60 between the upper mold 2 and the lower mold 3. In the example shown in Fig. 7, the molded article 60 is placed between the upper mold 2 and the lower mold 3, on the lower mold chest 30 of the lower mold 3.

[0029] Thereafter, the movable platen 6 (see FIG. 1) moves upward (positive direction of the Z axis), causing the lower mold 3 to move upward (positive direction of the Z axis) toward the upper mold 2. When the lower mold 3 moves upward (positive direction of the Z axis), the upper mold 2 and the lower mold 3 are clamped together, and the molded product 60 is sandwiched between the upper mold chess 10 of the upper mold 2 and the lower mold chess 30 of the lower mold 3, as shown in FIG.

[0030] The upper mold 2 and the lower mold 3 are clamped together to form a cavity 50, and the workpiece 60 is placed in the cavity 50. At this time, the bottom surface 611 of the member 61 in the workpiece 60 (FIG. 3) abuts against the cavity forming portion 312 of the fitting block 33.

[0031] Thereafter, the resin tablet placed in the pot 8 (see FIG. 1) melts, and as shown in FIG. 9, the molten resin 9 fills the cavity 50 via the cull and runner (not shown).

[0032] 10, in the resin sealing apparatus 100, the movable platen 6 (see FIG. 1) moves downward (in the negative Z-axis direction), thereby moving the lower mold 3 downward (in the negative Z-axis direction). This releases the clamping between the upper mold 2 and the lower mold 3. Then, as shown in FIG. 11, the molded product 70 is removed from the resin sealing mold 1 by a conveying device (not shown).

[0033] 1.4. Molded Product 70 As shown in FIGS. 12 and 13, the molded product 70 produced by the resin sealing apparatus 100 has an exposed surface 71 that is not covered with the resin 9 and is exposed.

[0034] As described above, in the resin sealing process of the resin sealing apparatus 100, the bottom surface 611 of the member 61 in the workpiece 60 ( FIG. 3 ) comes into contact over the entire surface with the cavity forming portion 312 of the fitting block 33. As described above, the cavity forming portion 312 has a first region 3121 and a second region 3122 that is surrounded by the first region 3121 and has a surface roughness different from that of the first region 3121.

[0035] In the resin sealing process of the resin sealing apparatus 100, the resin 9 penetrates between the bottom surface 611 of the member 61 and the cavity forming portion 312. If the surface roughness of the cavity forming portion 312 is constant, the resin 9 penetrates deeply between the bottom surface 611 of the member 61 and the cavity forming portion 312, and there is a risk that the resin 9 will adhere to the bottom surface 611 of the member 61 over a wide area as flash burrs.

[0036] On the other hand, as described above, the cavity forming portion 312 in the resin sealing mold 1 according to the first embodiment has the first region 3121 and the second region 3122, which have different surface roughnesses. Due to the difference in surface roughness between the first region 3121 and the second region 3122, the movement of the resin 9 that has entered between the bottom surface 611 of the member 61 and the cavity forming portion 312 from above the first region 3121 to above the second region 3122 is suppressed, as shown in FIG. 13 , compared to when the surface roughness of the first region 3121 and the second region 3122 is the same.

[0037] 12 and 13 , the bottom surface 611 of the member 61 of the workpiece 60 is divided into a first region 6111 abutting the first region 3121 and a second region 6112 abutting the second region 3122. Due to the difference in surface roughness between the first region 3121 and the second region 3122, the movement of the resin 9 that has entered between the bottom surface 611 of the member 61 and the cavity forming portion 312 from above the first region 6111 to above the second region 6112 is suppressed compared to when the surface roughness of the first region 3121 and the second region 3122 are the same.

[0038] Therefore, although some resin 9 may penetrate into the second region 6112 and form flash burrs 91 from above the first region 6111 to a portion of the second region 6112, most of the second region 6112 is formed as an exposed surface 71 without being covered with flash burrs 91.

[0039] Furthermore, because the first region 3121 is formed in an annular shape, it is possible to appropriately suppress the intrusion of the resin 9 onto the second region 3122. Furthermore, even if the surface roughness of the first region 3121 is coarser than the surface roughness of the second region 3122, but is finer than the surface roughness of the second region 3122, the resin 9 that has infiltrated between the bottom surface 611 of the member 61 and the cavity forming portion 312 is suppressed from moving from above the first region 3121 to above the second region 3122.

[0040] In the above example, the cavity forming portion 312 of the fitting block 33 has two types of regions with different surface roughnesses, but it may have three or more types of regions with different surface roughnesses. For example, as shown in Fig. 14, the cavity forming portion 312 may have a third region 3123 surrounded by a first region 3121 in the region facing the bottom surface 611 of the member 61 and formed with a surface roughness different from that of the first region 3121.

[0041] This further suppresses the movement of the resin 9 that has entered between the bottom surface 611 of the member 61 and the cavity forming portion 312 from above the third region 3123 to above the first region 3121. The third region 3123 has a surface roughness different from that of the first region 3121, and for example, has the same surface roughness as that of the second region 3122, but is not limited to this example.

[0042] Furthermore, in the above-described example, by dividing the lower die chess 30 into the main body block 32 and the fitting block 33, it is possible to easily replace the fitting block 33. Therefore, in the resin sealing mold 1 according to the first embodiment, even if, for example, the workpiece 60, the material of the resin 9, or the pressure at which the resin 9 is filled is different, simply by replacing each of the multiple regions including the first region 3121 and the second region 3122 with fitting blocks 33 having appropriate surface roughness, it is possible to prevent the surface intended to be the exposed surface 71 from being covered with flash burrs 91.

[0043] The lower die chess 30 of the resin-sealed mold 1 according to the first embodiment has a main body block 32 and an insert block 33, but the main body block 32 and the insert block 33 may be integrally formed without being separated.

[0044] In the above example, the bottom surface 611 of the member 61 of the workpiece 60 does not face the cavity forming portion 311 of the main body block 32, but this is not limiting. For example, the area of ​​the cavity forming portion 312 of the fitting block 33 may be reduced, and the lower die chess 30 may be formed so that the outer peripheral region (e.g., first region 3121) of the bottom surface 611 of the member 61 faces the cavity forming portion 311 of the main body block 32.

[0045] By making the surface roughness of at least a portion of the cavity-forming portion 311 (for example, the region facing the bottom surface 611 of the member 61) different from that of the cavity-forming portion 312, it is possible to prevent the surface intended to be the exposed surface 71 from being covered by the flash burrs 91. In this case, the cavity-forming portions 311, 312 are an example of abutting surfaces that abut against the bottom surface 611 of the member 61 of the workpiece 60. Note that at least one of the cavity-forming portions 311 and 312 may have a region with a different surface roughness.

[0046] Furthermore, by making the surface roughness of the second region 3122 finer than that of the first region 3121, it is possible to prevent scratches and the like from occurring on the exposed surface 71, and sintering of the exposed surface 71 of the molded product 70 can be performed more appropriately.

[0047] 2. Second Embodiment While the surface roughness of the bottom surface 611 of the member 61 in the molded product 60 shown in Fig. 3 is uniform, the bottom surface 611A of the member 61A in the molded product 60A according to the second embodiment has a first region 6111A and a second region 6112A having different surface roughnesses, as shown in Fig. 15. The second region 6112A is surrounded by the first region 6111A and is formed with a surface roughness different from that of the first region 6111A.

[0048] The second region 6112A is a polygonal or circular region, and the first region 6111A is an annular region surrounding the second region 6112A, but is not limited to such an example. The surface roughness of the first region 6111A may be coarser than the surface roughness of the second region 6112A, but may also be finer than the surface roughness of the second region 6112A.

[0049] 16, the resin sealing mold 1A of the resin sealing apparatus 100A according to the second embodiment differs from the resin sealing mold 1 of the resin sealing apparatus 100 in that it has a lower die chess 30A instead of the lower die chess 30. The lower die chess 30A differs from the lower die chess 30 in that it has a cavity forming portion 31A that abuts against the bottom surface 611A of the member 61A and has an abutment surface with a uniform surface roughness.

[0050] When the molded product 60A is resin-sealed using the resin sealing process using the resin sealing apparatus 100A, the difference in surface roughness between the first region 6111A and the second region 6112A prevents the resin 9 that has penetrated between the bottom surface 611A of the member 61A and the cavity forming portion 31A from moving from the first region 6111A to the second region 6112A.

[0051] Therefore, although some resin 9 may penetrate onto the second region 6112A, causing flash burrs from above the first region 6111A to a portion of above the second region 6112A, most of the second region 6112A is formed as an exposed surface 71A without being covered with flash burrs.

[0052] Furthermore, because the first region 6111A is formed in an annular shape, it is possible to appropriately suppress the intrusion of the resin 9 onto the second region 6112A. Furthermore, even if the surface roughness of the first region 6111A is coarser than that of the second region 6112A but is finer than the surface roughness of the second region 6112A, the resin 9 that has infiltrated between the bottom surface 611A of the member 61A and the cavity forming portion 31A is suppressed from moving from above the first region 6111A to above the second region 6112A.

[0053] In the example described above, the bottom surface 611A of the member 61A has two regions with different surface roughnesses, but it may have three or more regions with different surface roughnesses. For example, as shown in FIG. 17 , the bottom surface 611A of the member 61A may have a third region 6113A surrounding the first region 6111A in the region facing the cavity forming portion 31A.

[0054] This further suppresses the movement of the resin 9 that has entered between the bottom surface 611A of the member 61A and the cavity forming portion 31A from the third region 6113A to the first region 6111A. The third region 6113A has a surface roughness different from that of the first region 6111A, and may have the same surface roughness as that of the second region 6112A, for example, but is not limited to, this example.

[0055] Furthermore, by making the surface roughness of the first region 6111A and the surface roughness of the second region 6112A different, most of the bottom surface 611A of the member 61A is formed as the exposed surface 71A without being covered with flash burrs, so that the contact surface of the cavity forming portion 31A can be made to have a uniform and fine surface roughness, which prevents scratches and the like from occurring on the exposed surface 71A and allows for more appropriate sintering of the exposed surface 71A of the molded product 70.

[0056] In the second embodiment, the lower chess piece 30 may be used instead of the lower chess piece 30A. In this case, the first region 6111A abuts against the first region 3121 (see FIG. 6), and the second region 6112A abuts against the second region 3122 (see FIG. 6), but this is not limited to this example.

[0057] As described above, the resin-sealing mold 1 according to the first embodiment is a resin-sealing mold that seals the molded workpiece 60 with resin so as to form an exposed surface 71 in which a portion of the molded workpiece 60 is exposed and not covered by the resin 9. The resin-sealing mold 1 includes a cavity-forming portion 31 that forms a cavity 50 in which the molded workpiece 60 is placed and into which the resin flows. The cavity-forming portion 31 has an abutment surface that abuts the exposed surface 71 of the molded workpiece 60 within the cavity 50. The cavity-forming portion 312 is an example of an abutment surface. The abutment surface includes a first region 3121 and a second region 3122 that is surrounded by the first region 3121 and has a different surface roughness from that of the first region 3121. This prevents the surface intended to be the exposed surface 71 from being covered by flash burrs 91.

[0058] Furthermore, the surface roughness of the first region 3121 is coarser than the surface roughness of the second region 3122. This makes it possible for the resin sealing mold 1 to prevent the surface intended to be the exposed surface from being covered with flash burrs 91. Furthermore, by making the surface roughness of the second region 3122 finer than the surface roughness of the first region 3121, it is possible to prevent scratches and the like from occurring on the exposed surface 71, and sintering of the exposed surface 71 of the molded product 70 can be more appropriately performed.

[0059] The second region 3122 is a polygonal or circular region, and the first region 3121 is an annular region surrounding the second region 3122. This allows the resin sealing mold 1 to appropriately suppress the intrusion of the resin 9 onto the second region 3122.

[0060] The contact surface also has a third region 3123 that surrounds the first region 3121 and is formed with a surface roughness different from that of the first region 3121. This allows the resin-sealing mold 1 to further suppress the intrusion of the resin 9 onto the second region 3122.

[0061] Furthermore, the molded product 60A according to the second embodiment is a molded product that is resin-sealed by the resin-sealing mold 1A so as to form an exposed surface 71A that is partially exposed and not covered by the resin 9, and has a second region 6112A that is surrounded by a first region 6111A that will become the exposed surface 71A and that has a surface roughness different from that of the first region 6111A. This makes it possible to prevent the surface of the molded product 60A that is to become the exposed surface 71A from being covered with flash burrs.

[0062] The second region 6112A is a polygonal or circular region, and the first region 6111A is an annular region surrounding the second region 6112A. This allows the workpiece 60A to appropriately suppress the intrusion of the resin 9 onto the second region 6112A.

[0063] Furthermore, the workpiece 60A has a third region 6113A that surrounds the first region 6111A and has a surface roughness different from that of the first region 6111A, thereby enabling the workpiece 60A to further suppress the intrusion of the resin 9 onto the second region 6112A.

[0064] Further advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

[0065] REFERENCE SIGNS LIST 1, 1A Resin sealing mold 2 Upper mold 3 Lower mold 9 Resin 11, 31, 31A, 311, 312 Cavity forming portion 50 Cavity 60, 60A Molded product 70 Molded product 71, 71A Exposed surface 100, 100A Resin sealing device 611, 611A Bottom surface 3121, 6111, 6111A First region 3122, 6112, 6112A Second region 3123, 6113A Third region

Claims

1. A resin sealing mold that resin seals a molded product so as to form an exposed surface where a portion of the molded product is exposed and not covered by resin, the resin sealing mold having a cavity forming portion in which the molded product is placed and into which the resin flows, the cavity forming portion having an abutment surface that abuts against the exposed surface of the molded product within the cavity, the abutment surface having a first region and a second region that is surrounded by the first region and is formed with a surface roughness different from that of the first region.

2. The resin sealing mold according to claim 1, characterized in that the surface roughness of the first region is rougher than the surface roughness of the second region.

3. The resin sealing mold according to claim 2, characterized in that the second region is a polygonal or circular region, and the first region is an annular region surrounding the second region.

4. A resin sealing mold as described in any one of claims 1 to 3, characterized in that the abutment surface has a third region surrounding the first region and formed with a surface roughness different from that of the first region.

5. A molded product that is resin-sealed using a resin-sealing mold so as to form an exposed surface that is partially exposed and not covered by resin, the molded product having a second region surrounded by a first region that is the exposed surface and formed with a surface roughness different from that of the first region.

6. The molded product according to claim 5, characterized in that the second region is a polygonal or circular region, and the first region is an annular region surrounding the second region.

7. The molded product according to claim 5 or 6, characterized in that it has a third region surrounding the first region and formed with a surface roughness different from that of the first region.

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