Sensor module and sensor package

Abstract

The present disclosure relates to a sensor module and a sensor package with which it is possible to achieve improved detection sensitivity. The sensor module is provided with: a substrate on which an image sensor, a light source, and a seal resin that is formed so as to surround the image sensor are disposed; and a glass member which is provided so as to seal the imaging surface side of the image sensor, and on an upper surface of which a liquid sample can be placed. The glass member serves as a waveguide for light source light from the light source. The present disclosure can be applied to an optical detection device that optically detects a biological sample.

Description

Sensor Modules and Sensor Packages

[0001] The present disclosure relates to a sensor module and a sensor package, and more particularly to a sensor module and a sensor package that enable improved detection sensitivity to be achieved.

[0002] A waveguide mode sensor is known as a sensor for detecting minute substances present in a solution. For example, Patent Document 1 discloses a target substance detection device including a sensor chip having a detection plate capable of forming an enhanced electric field and an optical prism, and an optical detection unit that optically detects a target substance on the surface of the detection plate.

[0003] International Publication No. 2019 / 049817

[0004] However, in the target substance detection device of Patent Document 1, the distance from the detection plate to the light detection unit is large, which may result in a decrease in detection sensitivity for the target substance.

[0005] The present disclosure has been made in view of such circumstances, and aims to realize an improvement in detection sensitivity.

[0006] The sensor module of the first aspect of the present disclosure comprises a substrate on which an image sensor, a light source, and a sealing resin formed to surround the image sensor are arranged, and a glass member arranged to seal the imaging surface side of the image sensor and on whose upper surface a liquid sample can be placed, the glass member serving as a waveguide for light from the light source.

[0007] A sensor package according to a second aspect of the present disclosure comprises an image sensor and a glass member arranged to seal the imaging surface side of the image sensor and on whose upper surface a liquid sample can be placed, the glass member serving as a waveguide for light from an external light source and having an entrance portion and an exit portion for the light from the light source on its outer periphery.

[0008] In a first aspect of the present disclosure, in a sensor module comprising an image sensor, a light source, a substrate on which a sealing resin formed to surround the image sensor is arranged, and a glass member arranged to seal the imaging surface side of the image sensor and on whose upper surface a liquid sample can be placed, the glass member is used as a waveguide for light source light from the light source.

[0009] In a second aspect of the present disclosure, in a sensor package comprising an image sensor and a glass member arranged to seal the imaging surface side of the image sensor and on whose upper surface a liquid sample can be placed, the glass member serves as a waveguide for light from a light source from an external light source, and an entrance portion and an exit portion for the light from the light source are provided on the outer periphery.

[0010] 1 is a cross-sectional view showing an example of the configuration of a sensor module. FIG. 2 is a top view showing an example of the configuration of a sensor module. FIG. 3 is a cross-sectional view showing a first modified example of the sensor module. FIG. 4 is a cross-sectional view showing a second modified example of the sensor module. FIG. 5 is a cross-sectional view showing a third modified example of the sensor module. FIG. 6 is a cross-sectional view showing a fourth modified example of the sensor module. FIG. 7 is a cross-sectional view showing a fifth modified example of the sensor module. FIG. 8 is a bottom view showing the fifth modified example of the sensor module. FIG. 9 is a cross-sectional view showing a sixth modified example of the sensor module. FIG. 10 is a cross-sectional view showing a seventh modified example of the sensor module. FIG. 11 is a cross-sectional view showing an eighth modified example of the sensor module. FIG. 12 is a top view showing the eighth modified example of the sensor module. FIG. 13 is a cross-sectional view showing a ninth modified example of the sensor module. FIG. 14 is a diagram showing an outline of a manufacturing process for the sensor module. FIG. 15 is a diagram showing an outline of a manufacturing process for the sensor module. FIG. 16 is a cross-sectional view showing an example of the configuration of a sensor package. FIG. 17 is a diagram showing an outline of a manufacturing process for the sensor package. FIG. 18 is a cross-sectional view showing a first modified example of the sensor package. FIG. 19 is a cross-sectional view showing a second modified example of the sensor package. FIG. 20 is a diagram showing a modified example of a glass member. FIG. 21 is a diagram explaining tapering of a glass member. FIG. 22 is a diagram explaining another example of tapering. FIG. 23 is a diagram explaining flare occurring at an incident portion. 1 is a diagram showing yet another example of tapering; FIG. 2 is a diagram showing another example of the shape of a glass member; FIG. 3 is a diagram showing another example of the shape of a glass member; FIG. 4 is a diagram showing an example of the configuration of a sample vessel; FIG. 5 is a diagram explaining an example of processing a sample vessel; FIG. 6 is a diagram explaining another example of processing a sample vessel; FIG. 7 is a diagram explaining yet another example of processing a sample vessel; FIG. 8 is a diagram explaining yet another example of processing a sample vessel; FIG. 9 is a diagram showing an example of the configuration of a pixel region of an image sensor; FIG. 10 is a diagram showing an example of the layout of a color filter; FIG. 11 is a cross-sectional view showing an application example of a sensor package; FIG. 12 is a cross-sectional view and a plan view showing another example of the configuration of a sensor package; FIG. 13 is a cross-sectional view and a plan view showing another example of the configuration of a sensor package; FIG. 14 is a cross-sectional view and a plan view showing another example of the configuration of a sensor package; FIG. 15 is a cross-sectional view and a plan view showing another example of the configuration of a sensor package;1A and 1B are cross-sectional views and a plan view showing another configuration example of a sensor package; a cross-sectional view showing another configuration example of a sensor package; a diagram explaining a thinned structure of a glass member; a cross-sectional view and a plan view showing another configuration example of a sensor package; a cross-sectional view showing a first configuration example of an optical detection device; a top view showing the first configuration example of an optical detection device; a side view showing the first configuration example of an optical detection device; a cross-sectional view showing a second configuration example of an optical detection device; a top view showing the second configuration example of an optical detection device; a side view showing the second configuration example of an optical detection device; a diagram explaining a cross section of a liquid sample holder; a diagram showing a first modified example of a liquid sample holder; a diagram showing a second modified example of a liquid sample holder; a diagram showing a third modified example of a liquid sample holder; a diagram showing a modified example of a glass member; a diagram showing a modified example of a glass member; a cross-sectional view showing a third configuration example of an optical detection device; a top view showing the third configuration example of a optical detection device; a cross-sectional view showing a fourth configuration example of an optical detection device; a top view showing the fourth configuration example of an optical detection device; a side view showing the fourth configuration example of an optical detection device. 10A and 10B are diagrams illustrating removal of a glass member.

[0011] Modes for carrying out the present disclosure (hereinafter referred to as embodiments) will be described below in the following order.

[0012] 1. Prior art and its problems 2. First embodiment (sensor module including a light source and a glass waveguide) 3. Second embodiment (sensor package including a glass waveguide) 4. Third embodiment (optical detection device capable of sealing a liquid sample in a glass waveguide)

[0013] 1. Prior Art and Problems Thereof Conventionally, one known method for optically detecting biological samples is to detect minute substances such as bacteria and viruses in water using an enhanced electric field (evanescent light) that seeps out from a waveguide.

[0014] For example, Patent Document 1 discloses a target substance detection device that includes a detection plate capable of forming an enhanced electric field, a sensor chip having an optical prism, and an optical detection unit that optically detects a target substance on the surface of the detection plate.

[0015] However, in the target substance detection device of Patent Document 1, the distance from the detection plate to the light detection unit is large, which may result in a decrease in detection sensitivity and resolution of the target substance. Furthermore, in the target substance detection device of Patent Document 1, the detection plate, the light detection unit, and the light irradiation unit (light source) that irradiates the detection plate with light under total reflection conditions are all individually arranged, which results in a large device. Similar issues exist in other conventional optical detection devices that use waveguides.

[0016] In response to this, the present disclosure proposes an optical detection device that is integrally equipped with a glass member that serves as a waveguide, thereby improving the detection sensitivity and resolution of the target substance and further realizing a more compact device.

[0017] Hereinafter, an embodiment of an optical detection device to which the technology according to the present disclosure is applied will be described.

[0018] 2. First Embodiment (Configuration Example of Sensor Module) A configuration example of a sensor module 100 as an optical detection device according to a first embodiment to which the technology of the present disclosure is applied will be described with reference to Figures 1 and 2. Figure 1 is a cross-sectional view showing the configuration example of the sensor module 100, and Figure 2 is a top view showing the configuration example of the sensor module 100.

[0019] The sensor module 100 is configured by arranging an image sensor 112, a light source 113, and a sealing resin 114 on a substrate 111. In the sensor module 100, a glass member 115 is provided directly above the light source 113 and the sealing resin 114 so as to seal the imaging surface side of the image sensor 112.

[0020] The image sensor 112 may be configured as a complementary metal oxide semiconductor (CMOS) image sensor having a wafer-level chip size package (CSP) structure without a sealing material, etc. The image sensor 112 may be disposed near the center of the substrate 111 in a plan view, as shown in FIG.

[0021] The light source 113 may be configured with a known lamp, LED (Light Emitting Diode), laser, etc. that emits light for detecting a target substance in a liquid sample (hereinafter also referred to as light source light). The light source 113 may be disposed at one end of the substrate 111 in a plan view, as shown in FIG.

[0022] The image sensor 112 and the light source 113 are electrically connected to the substrate 111 by being joined to the substrate 111 by solder bumps 121. In addition, the joints of the image sensor 112 and the light source 113 with the substrate 111 by the solder bumps 121 are protected by underfill 122 applied between the substrate 111 and the image sensor 112 and between the substrate 111 and the light source 113.

[0023] 2, the sealing resin 114 is formed so as to surround the image sensor 112 in a plan view. Specifically, the sealing resin 114 and the light source 113 are arranged along the outer edge of the substrate 111. The sealing resin 114 is made of a resin material with high light-blocking properties.

[0024] The glass member 115 serves as a waveguide for the source light L from the light source 113. The upper surface of the glass member 115 is adapted to allow a liquid sample to be placed thereon. Specifically, a sample vessel 130 on which the liquid sample is placed is formed on the upper surface of the glass member 115. The sample vessel 130 is formed by a frame portion 130F that is formed by processing the glass member 115. In the example of FIGS. 1 and 2 , the frame portion 130F is provided so that the effective pixel area PA of the image sensor 112 fits inside the sample vessel 130 in a plan view. The frame portion 130F is provided in a position on the glass member 115 that does not overlap with the point at which the source light L is totally reflected.

[0025] A liquid sample containing a target substance is introduced into the sample vessel 130, and the detected light generated by the presence of the target substance in the liquid sample due to the evanescent light generated by total reflection of the light source light L is detected by the image sensor 112.

[0026] According to the above configuration, the image sensor, light source, and sealing resin are arranged on the same substrate, and the glass member arranged directly above the light source and sealing resin is used as a waveguide, allowing the reaction between the target substance and the enhanced electric field to be detected. In this way, the sensor module of this embodiment can significantly reduce the distance between the sample vessel and the image sensor, thereby improving the detection sensitivity of the target substance, i.e., the S / N (signal / noise) ratio for the optical signal, and the resolution. Furthermore, because the sample vessel, image sensor, and light source are integrated, it is possible to achieve a miniaturized optical detection device.

[0027] In the following, a modification of the sensor module 100 described above will be described.

[0028] (Modification 1) FIG. 3 is a cross-sectional view showing a first modification of the sensor module 100. As shown in FIG.

[0029] In the sensor module 100A shown in FIG. 3, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof will be omitted.

[0030] That is, the sensor module 100A differs from the sensor module 100 of FIGS. 1 and 2 in that it further includes a sealing resin 114' formed between the image sensor 112 and the light source 113 so as to block the light source light L.

[0031] With this configuration, the incidence of stray light on the image sensor 112 is suppressed, which further improves the S / N ratio of the optical signal and also makes it possible to improve the strength of the entire sensor module.

[0032] (Modification 2) FIG. 4 is a cross-sectional view showing a second modification of the sensor module 100. As shown in FIG.

[0033] In the sensor module 100B shown in FIG. 4, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof will be omitted.

[0034] That is, sensor module 100B differs from sensor module 100 in Figures 1 and 2 in that it further includes a bandpass filter 140 that transmits only light of a specific wavelength and is formed on the imaging surface side of image sensor 112 of glass member 115 corresponding to sample vessel 130.

[0035] With this configuration, the incidence of light other than the desired wavelength on the image sensor 112 is suppressed, thereby making it possible to further improve the S / N ratio of the optical signal.

[0036] (Modification 3) FIG. 5 is a cross-sectional view showing a third modification of the sensor module 100. As shown in FIG.

[0037] In the sensor module 100C shown in FIG. 5, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof will be omitted.

[0038] That is, sensor module 100C differs from sensor module 100 of FIGS. 1 and 2 in that glass member 115 has tapered portion 115TP where the outer periphery of the upper surface thereof is tapered.

[0039] With this configuration, the optical path of the light source light L in the glass member 115 is limited, which makes it possible to further improve the S / N ratio of the optical signal.

[0040] (Fourth Modification) FIG. 6 is a cross-sectional view showing a fourth modification of the sensor module 100. As shown in FIG.

[0041] In the sensor module 100D shown in FIG. 6, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof will be omitted.

[0042] That is, sensor module 100D differs from sensor module 100 in Figures 1 and 2 in that glass member 115 is provided as glass member 151 made of sapphire glass, and the space (void portion) surrounded by light source 113 and sealing resin 114 is filled with low refractive index resin 152.

[0043] For example, the refractive index of the glass member 151 is set to 1.7, and the refractive index of the low refractive index resin 152 is set to about 1.4 (specifically, 1.45 or less). Here, it is sufficient that the light source light L is totally reflected by the glass member 151 and propagates.

[0044] In this way, the gap surrounded by the light source 113 and the sealing resin 114 is filled with a low refractive index resin, thereby making it possible to improve the strength of the entire sensor module.

[0045] (Fifth Modification) FIG. 7 is a cross-sectional view showing a fifth modification of the sensor module 100, and FIG. 8 is a bottom view showing the fifth modification of the sensor module 100. As shown in FIG.

[0046] In the sensor module 100E shown in FIGS. 7 and 8, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof will be omitted.

[0047] That is, sensor module 100E differs from sensor module 100 of Figures 1 and 2 in that sample vessel 130 is formed on the imaging surface side of image sensor 112 in glass member 115, and sealing resin 114 has opening 114P that allows a sample to be introduced into sample vessel 130.

[0048] That is, in the sensor module 100E, the image sensor 112 can detect the light to be detected in the sample vessel 130 from the upper surface of the glass member 115, rather than detecting the light to be detected in the sample vessel 130 from the lower surface of the glass member 115.

[0049] In the sensor module 100E, since a liquid sample is introduced into the interior thereof, it is desirable that the image sensor 112 adopt a wafer-level CSP structure having a sealing member 160 such as glass.

[0050] With this configuration, it is possible to further improve the S / N ratio of the optical signal by further reducing the distance between the sample vessel 130 and the image sensor 112. In addition, since the liquid sample is introduced into the sensor module 100, it is possible to improve the handling of the liquid sample.

[0051] (Sixth Modification) FIG. 9 is a cross-sectional view showing a sixth modification of the sensor module 100. As shown in FIG.

[0052] In the sensor module 100F shown in FIG. 9, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof will be omitted.

[0053] That is, the sensor module 100F differs from the sensor module 100 of FIGS. 1 and 2 in that, instead of the sample vessel 130 formed by the frame portion 130F, a sample vessel 130R formed as a recess in the upper surface of the glass member 115 is provided.

[0054] In this way, by forming the sample vessel as a recess in the upper surface of the glass member 115, it becomes possible to easily shape the sample vessel itself.

[0055] (Seventh Modification) FIGS. 10 and 11 are cross-sectional views showing a seventh modification of the sensor module 100. FIG.

[0056] In the sensor module 100G shown in FIG. 10 and the sensor module 100G' shown in FIG. 11, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof will be omitted.

[0057] 1 and 2 in that it further includes a light-shielding portion 170 that shields the upper surface of the glass member 115 from light except for the sample vessel 130. Also, the sensor module 100G′ differs from the sensor module 100 in that it further includes a light-shielding portion 170 that shields the entire module (chip) from light except for the sample vessel 130.

[0058] With this configuration, the light shielding portion 170 shields light from areas other than the sample vessel 130 (i.e., areas other than the effective pixel area), thereby making it possible to further improve the S / N ratio for the optical signal.

[0059] (Eighth Modification) FIG. 12 is a cross-sectional view showing an eighth modification of the sensor module 100, and FIG. 13 is a top view showing the eighth modification of the sensor module 100. As shown in FIG.

[0060] In the sensor module 100H shown in FIGS. 12 and 13, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof will be omitted.

[0061] 1 and 2 in that the sample vessel 130 of the sensor module 100H is formed by a frame 180 made of a material different from the glass member 115. The frame 180 may be formed by etching a predetermined resin or the like.

[0062] In this way, by forming the frame of the sample vessel 130 from a material different from that of the glass member 115, it becomes possible to easily shape the sample vessel itself.

[0063] (Modification 9) FIG. 14 is a cross-sectional view showing a ninth modification of the sensor module 100. As shown in FIG.

[0064] In the sensor module 100I shown in FIG. 14, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof will be omitted.

[0065] 1 and 2 in that the sensor module 100I further includes an adhesive resin 190 formed between the light source 113 and the glass member 115. The refractive index of the adhesive resin 190 is preferably close to and smaller than the refractive index of the glass member 115.

[0066] In this way, by providing adhesive resin 190 between light source 113 and glass member 115, it becomes possible to easily process the module (chip) involved in joining glass member 115.

[0067] (Sensor Module Manufacturing Process) An outline of the manufacturing process for the sensor module 100 will be described with reference to FIGS.

[0068] First, as shown in FIG. 15A, a photoresist PR is applied to a wafer-shaped glass member 115W, and is exposed to light with a pattern that forms the frame portion 130F of the sample vessel 130.

[0069] From this state, glass member 115W is etched to form sample vessel 130 (frame portion 130F) on the upper surface of glass member 115W, as shown in FIG. 15B.

[0070] On the other hand, as shown in FIG. 16C, solder 121s is printed on the wafer-shaped substrate 111W at the mounting locations of the image sensor 112 and the light source 113 by the solder printer PM.

[0071] In this state, the image sensor 112 and the light source 113 are mounted on the substrate 111W, and a reflow process is performed, whereby the image sensor 112 and the light source 113 are mounted on the substrate 111W as shown in FIG. 16D.

[0072] 16E, underfill 122 is applied to the joint between image sensor 112 and substrate 111W by solder bumps 121 of light source 113, and sealing resin 114 is also applied. Furthermore, adhesive AD for bonding glass member 115 is applied directly above light source 113 and sealing resin 114.

[0073] Then, as shown in Figure 17F, a glass member 115W on which a sample vessel 130 (frame portion 130F) is formed is adhered to a substrate 111W on which an image sensor 112 and a light source 113 are mounted, and then the sensor module 100 is separated into individual pieces using a dicing blade DB.

[0074] 17G, the individual sensor modules 100 are subjected to a light etching process #LE on the surface of the glass member 115. This makes it possible to prevent degradation of the performance of the glass member 115 as a waveguide due to surface roughness or cracks.

[0075] In the sensor module of this embodiment, the above-described modified examples can be combined as appropriate.

[0076] 3. Second Embodiment (Configuration Example of Sensor Package) A configuration example of a sensor package 200 as an optical detection device according to a second embodiment to which the technology of the present disclosure is applied will be described with reference to Fig. 18. Fig. 18 is a cross-sectional view showing the configuration example of the sensor package 200.

[0077] The sensor package 200 has a wafer-level chip size package (CSP) structure and is composed of an image sensor 211 and a glass member 212 provided to seal the imaging surface side of the image sensor 211.

[0078] The image sensor 211 may be configured as, for example, a CMOS image sensor.

[0079] A dam member 213 is provided between the image sensor 211 and the glass member 212 so as to surround the effective pixel area PA of the image sensor 211. A cavity 214 is formed in the space surrounded by the dam member 213. The height of the dam member 213 is, for example, 20 to 50 μm.

[0080] The glass member 212 is provided as a cover glass for the image sensor 211 and also serves as a waveguide for the light source light L from the external light source LS. The height (thickness) of the glass member 212 is, for example, 300 to 500 μm. The glass member 212 has an incident portion and an exit portion for the light source light L on its outer periphery. Specifically, a tapered portion 212TP formed by tapering the outer periphery of the upper surface of the glass member 212 serves as the incident portion and the exit portion for the light source light L. In the example of FIG. 18 , the tapered portion 212TP is tapered into an inverse R-chamfered shape.

[0081] A liquid sample SP can be placed on the upper surface of the glass member 212. Specifically, a sample reservoir 220 in which the liquid sample SP is placed is formed on the upper surface of the glass member 212 opposite the imaging surface of the image sensor 211. The sample reservoir 220 is formed as a recess in the upper surface of the glass member 212, and is formed to have the same size as or approximately the same size as the effective pixel area PA of the image sensor 211.

[0082] The light source light L propagating through the glass member 212 serving as a waveguide is preferably incident perpendicularly to the tapered portion 212TP serving as the incident portion. Inside the glass member 212, the light source light L is totally reflected by propagating at an incident angle of 41 degrees or more. The sample vessel 220 may be provided at a location on the top surface of the glass member 212 that coincides with the point at which the light source light L is totally reflected.

[0083] A liquid sample SP containing a target substance TS is introduced into the sample vessel 220, and the detected light generated due to the presence of the target substance TS in the liquid sample SP is detected by the image sensor 211 using evanescent light generated by total reflection of the light source light L.

[0084] According to the above configuration, the glass member that constitutes the wafer-level CSP integrated with the image sensor is used as a waveguide, making it possible to detect the reaction between the target substance and the enhanced electric field. In this way, in the sensor package of this embodiment, the distance between the sample vessel and the image sensor can be significantly reduced, thereby improving the detection sensitivity of the target substance, i.e., the S / N ratio for the optical signal, and the resolution. Furthermore, since the sample vessel and the image sensor are integrated, it is possible to miniaturize the optical detection device.

[0085] (Sensor Package Manufacturing Process) An overview of the manufacturing process for the sensor package 200 will be described with reference to Fig. 19. Note that in Fig. 19, descriptions of steps that are similar to the manufacturing process for a semiconductor device that employs a general wafer-level CSP structure will be omitted.

[0086] That is, in the step shown in FIG. 19A, a wafer-shaped image sensor 211W is bonded to a wafer-shaped glass member 212W on which a dam material 213 is formed.

[0087] Thereafter, through steps similar to those used in manufacturing semiconductor devices that employ a general wafer-level CSP structure, the sensor packages 200 are separated into individual pieces by a dicing blade DB, as shown in view Z of FIG.

[0088] In this manner, when sensor package 200 is diced, tapered portion 212TP may be formed by tapering the outer periphery of the top surface of glass member 212. Note that tapered portion 212TP may be formed by photolithography and dry etching, in addition to tapering the outer periphery of the top surface of glass member 212 during dicing.

[0089] In the following, a modified example of the sensor package 200 described above will be described.

[0090] (Modification 1) FIG. 20 is a cross-sectional view showing a first modification of the sensor package 200. As shown in FIG.

[0091] In the sensor package 200A shown in FIG. 20, the same components as those in FIG. 18 are denoted by the same reference numerals, and the description thereof will be omitted.

[0092] That is, the sensor package 200A differs from the sensor package 200 in FIG. 18 in that a high-refractive-index glass member 231 made of a high-refractive-index material is provided instead of the glass member 212, and the space (void portion) surrounded by the dam material 213 is filled with a low-refractive-index resin 232.

[0093] For example, if the high-refractive-index glass member 231 is made of SiN, its refractive index will be 2.0 to 2.2. If the high-refractive-index glass member 231 is made of sapphire glass, its refractive index will be 1.7 to 1.8. If the high-refractive-index glass member 231 is made of SiO, its refractive index will be 1.4 to 1.5. In contrast, the refractive index of the low-refractive-index resin 232 only needs to be lower than that of the high-refractive-index glass member 231, and the refractive index of the low-refractive-index resin 232 is, for example, 1.2 to 1.6.

[0094] Note that the high-refractive-index glass member 231 has a tapered portion 231TP on the outer periphery of its upper surface as an entrance portion and an exit portion for light from the light source, similar to the glass member 212 in the sensor package 200 in Fig. 18. In the example in Fig. 20, the height (thickness) of the high-refractive-index glass member 231 is, for example, 50 µm or more.

[0095] Even with this configuration, the distance between the sample vessel and the image sensor can be significantly reduced, which makes it possible to improve the detection sensitivity of the target substance, i.e., the S / N ratio for the optical signal and the resolution. Furthermore, since the sample vessel and the image sensor are provided as an integrated unit, it is possible to miniaturize the optical detection device.

[0096] (Modification 2) FIG. 21 is a cross-sectional view showing a second modification of the sensor package 200. As shown in FIG.

[0097] In the sensor package 200B shown in FIG. 21, the same components as those in FIG. 18 are denoted by the same reference numerals, and the description thereof will be omitted.

[0098] That is, the sensor package 200B differs from the sensor package 200 in FIG. 18 in that, instead of the glass member 212, a high-refractive-index glass member 241 made of a high-refractive-index material such as SiN is provided, and an oxide film 242 is formed on the upper surface of the high-refractive-index glass member 241, and the dam material 213 is not formed between the image sensor 211 and the high-refractive-index glass member 241, but is filled with a low-refractive-index resin 243.

[0099] 21, the high-refractive-index glass member 241 serves as a waveguide for light from an external light source, and its end faces (side faces) serve as the entrance and exit points for the light. Furthermore, the sample vessel 220 is formed as a recess in the upper surface of the oxide film 242, rather than in the high-refractive-index glass member 241.

[0100] Even with this configuration, the distance between the sample vessel and the image sensor can be significantly reduced, which makes it possible to improve the detection sensitivity of the target substance, i.e., the S / N ratio for the optical signal and the resolution. Furthermore, since the sample vessel and the image sensor are provided as an integrated unit, it is possible to miniaturize the optical detection device.

[0101] (Modifications of Glass Member) FIGS. 22A to 22D are diagrams showing modifications of the glass member 212 in the sensor package 200 of FIG.

[0102] 22A, an anti-reflection film 251 may be formed on the lower surface (the imaging surface side of the image sensor 211) of the glass member 212. The anti-reflection film 251 may be formed on the entire lower surface of the glass member 212, or may be patterned and formed only in the area corresponding to the sample vessel 220. This prevents reflection of specific wavelengths using interference due to differences in refractive index, thereby improving the detection sensitivity of the target substance.

[0103] As shown in Figure 1B, tapered portion 212TP of glass member 212 may have a rounded chamfered shape rather than a reversed rounded chamfered shape. In this case, tapered portion 212TP is formed by imprinting. This allows for greater freedom in the optical design of glass member 212.

[0104] As shown in Figure 1C, the surfaces (top and side surfaces) of the glass member 212 may be coated with a low-refractive-index resin 252. Siloxane-based or acrylic-based materials can be used for the low-refractive-index resin 252 without a filler (refractive index 1.4), while porous SiO2 particles with a small amount of resin can be used for the low-refractive-index resin 252 with a filler (refractive index 1.25). This allows more evanescent light to seep out. Furthermore, coating the tapered portions 212TP, which serve as the entrance and exit points for light from the light source, with the low-refractive-index resin 252 can improve sensitivity at the entrance and suppress stray light (noise) at the exit.

[0105] The low refractive index resin 252 may be formed as a film by chemical vapor deposition (CVD) processing after the sensor package 200 is separated into individual pieces. This allows the surface of the glass member 212 to be smoothed.

[0106] As shown in Figure 1D, a moth-eye structure 253 may be formed on the lower surface (the imaging surface side of the image sensor 211) of the glass member 212. This suppresses stray light from entering the image sensor 211, thereby improving the detection sensitivity of the target substance.

[0107] (Tapering of Glass Member) The tapering of the glass member 212 will be described with reference to Fig. 23. Fig. 23 shows a top view and a cross-sectional view of the glass member 212.

[0108] 23, tapered portions 212TP with a reverse R-chamfered shape of the same width are formed on all four sides of the rectangular outer periphery of glass member 212. This structure increases the degree of freedom in arranging the light source.

[0109] However, if the arrangement of the light source is fixed, only the light source light incident side and light output side of the glass member 212 may be tapered.

[0110] For example, as shown in FIG. 24A, tapered portions 212TP may be formed on only two opposing sides of the four sides of the rectangular outer periphery of glass member 212.

[0111] Also, as shown in Figure B of the same document, tapered portions 212TP may be formed only on two opposing sides of the four sides of the rectangular outer periphery of the glass member 212, in the portions that are the same width as the sample vessel 220.

[0112] Such a structure minimizes the dicing process required for tapering, thereby reducing manufacturing costs.

[0113] Furthermore, as shown in Figure C, two opposing sides of the four sides of the rectangular outer periphery of glass member 212 may be formed with tapered portions 212TP that are inclined from the top surface to the bottom surface, the opposite of those shown in Figures A and B. In this case, tapered portions 212TP protrude from sensor package 200, making it easy to distinguish between the vertical and horizontal directions during handling during assembly.

[0114] Incidentally, flare may occur depending on the slope of tapered portion 212TP, which serves as the incident portion of light from the light source at the end of glass member 212. Specifically, as shown in Fig. 25 , when light source light L1 from light source LS1 is incident on tapered portion 212TP, which slopes from the lower surface side to the upper surface side of glass member 212, a portion of light source light L1 may leak directly onto the imaging surface side of image sensor 211, causing flare. On the other hand, when light source light L2 from light source LS2 is incident on tapered portion 212TP, which slopes from the upper surface side to the lower surface side of glass member 212, light source light L2 does not leak directly onto the imaging surface side of image sensor 211, and there is no risk of flare occurring.

[0115] Therefore, as shown in FIG. 26, the inclination of tapered portion 212TP at the end of glass member 212 may be made asymmetric between the incident side and the exit side.

[0116] 26A, tapered portions 212TP with different slopes may be formed on two opposing sides of the four sides of the rectangular outer periphery of glass member 212. Such a structure can be realized with an existing general-purpose dicing blade.

[0117] Furthermore, as shown in Figure 1B, tapered portions 212TP with different slopes may be formed only on portions of two opposing sides of the four sides of the rectangular outer periphery of glass member 212 that are the same width as sample vessel 220. In this case, during handling for assembly, by gripping the two sides of glass member 212 where tapered portions 212TP are not formed, even if glass member 212 is chipped, there is no effect on the entrance portion or exit portion.

[0118] (Shape of Glass Member) The shape of the glass member 212 is not limited to that in the above-described embodiment.

[0119] For example, as shown in Figure 27A, the glass member 212 may not have the sample vessel 220 formed on its upper surface. Even in this configuration, a liquid sample can be placed on the upper surface of the glass member 212. On the other hand, the glass member 212 may have a convex portion 261 formed on the imaging surface side of the image sensor 211. This allows the evanescent light to be focused on the lower surface side of the glass member 212. The corners of the convex portion 261 may be provided with a curvature.

[0120] Furthermore, as shown in FIG. 1B, a sample vessel 220 may be formed on the upper surface of a glass member 212, and then a convex portion 261 may be formed on the imaging surface side of an image sensor 211.

[0121] Furthermore, as shown in Figure C, a recess 262 having the same diameter (size) as the space surrounded by the dam material 213 may be formed in the glass member 212 on the imaging surface side of the image sensor 211. In this case, by thinning the dam material 213, the distance between the sample vessel and the image sensor can be made even closer, improving the detection sensitivity and resolution of the target substance and reducing the height of the optical detection device.

[0122] 28 , a sample vessel 220R having a curvature may be formed on the upper surface of glass member 212, and a recess 262R having a curvature may be formed on the imaging surface side of image sensor 211. In this case, even if the target substance is scattered over a wide area in sample vessel 220R, the detection sensitivity for the target substance can be maintained by increasing the light-collection efficiency of the evanescent light.

[0123] (Examples of the Configuration and Processing of Sample Vessel) In the sample vessel 220 formed in the glass member 212, the corners may be rounded.

[0124] Specifically, as shown in Figure 29, when viewed in a plane, corners R may be provided at the four corners of the sample vessel 220, and when viewed in a cross section (side view), corners R may be provided at the corners formed by the side walls and bottom surface of the sample vessel 220.

[0125] FIG. 30 is a diagram illustrating an example of processing a sample vessel 220 in a glass member 212. In FIG.

[0126] First, as shown in FIG. 30A, a photoresist PR is applied to a wafer-shaped glass member 212W and exposed to light with a pattern that forms the sample vessel 220.

[0127] From this state, the glass member 212W is etched to form the sample vessel 220 on the upper surface of the glass member 212W, as shown in FIG. 30B.

[0128] As explained with reference to Figure 30, in addition to forming the sample vessel 220 by directly processing the glass member 212, the sample vessel 220 may also be formed by recessing a material different from the glass member 212 that is formed on the upper surface of the glass member 212.

[0129] FIG. 31 is a diagram illustrating another example of processing the sample vessel 220 in the glass member 212. In FIG.

[0130] First, as shown in FIG. 31A, a resin material 271 is applied to a wafer-shaped glass member 212W by CVD processing.

[0131] Next, as shown in FIG. 31B, a photoresist PR is applied to the resin material 271 and exposed to light with a pattern that forms the sample vessel 220 .

[0132] From this state, the resin material 271 is etched to form the sample vessel 220 on the upper surface of the glass member 212W, as shown in FIG. 31C.

[0133] FIG. 32 is a diagram illustrating yet another example of processing a sample vessel 220 in a glass member 212. In FIG.

[0134] First, as shown in FIG. 32A, a photosensitive resin material 272 is applied to a wafer-shaped glass member 212W.

[0135] From this state, the photosensitive resin material 272 is exposed and developed with a pattern that forms the sample vessel 220, thereby forming the sample vessel 220 on the upper surface of the glass member 212W, as shown in Figure 32B.

[0136] In addition to the above-described example of processing the sample vessel 220, a material different from the glass member 212 may be printed directly on the upper surface of the glass member 212 in a pattern that forms the sample vessel 220.

[0137] In this way, it is possible to determine the wettability of the sample vessel 220 depending on the processing method of the sample vessel, such as directly processing the glass member 212 or recessing a material different from the glass member 212 on the top surface of the glass member 212.

[0138] (Configuration Example of Pixel Region of Image Sensor) A configuration for preventing color mixing may be provided in the pixel region of the image sensor 211 .

[0139] 33 , for each pixel unit PU, where a plurality of pixels provided in the effective pixel area PA constitute one unit, a light-shielding structure 281 may be provided so as to surround the pixel unit PU. Furthermore, an on-chip lens 282 may be provided for each pixel unit PU.

[0140] Furthermore, although not shown, pixels having color filters that transmit specific wavelengths may be provided to cancel the excitation light in the waveguide mode, thereby enabling more reliable detection of fluorescence emitted from the target substance.

[0141] (Modification for Multiple Light Sources) A ​​modification in which multiple light sources are provided outside the sensor package 200 will be described.

[0142] In plan view, a first light source may be provided that irradiates the glass member 212 with light source light from the vertical direction, and a second light source may be provided that irradiates the glass member 212 with light source light from the horizontal direction. In this case, the wavelengths of the light source light irradiated by the first light source and the second light source may be different.

[0143] This makes it possible to detect two types of specimens as target substances. In addition, since the refractive index changes depending on the wavelength of the light source light, if the wavelengths of the light source light irradiated by the first light source and the second light source are different, the inclination (angle) of the tapered portion serving as the entrance portion for each light source light may be changed according to the wavelength of each light source light.

[0144] Furthermore, the layout of color filters in the pixel region of the image sensor 211 may be changed depending on the wavelength of the light source light emitted from each of the first light source and the second light source.

[0145] For example, if the wavelengths of the light emitted from the first light source and the second light source are 450 nm and 550 nm, respectively, the G (Green) and B (Blue) color filters are arranged in a checkerboard pattern as shown in Figure 34A.

[0146] Similarly, when the wavelengths of the light source light emitted from the first light source and the second light source are 450 nm and 550 nm, respectively, color filters of the same color (G, B) may be arranged in the column direction, and a light-shielding wall 290 may be provided for each row, as shown in B of Fig. 34. This makes it possible to separate the light source light from the row direction by the color filter arrangement, and to separate the light source light from the column direction by the light-shielding wall 290.

[0147] (Example of Signal Processing for Pixel Signals) An example of signal processing for pixel signals output from the image sensor 211 will be described.

[0148] For example, similar to a general image sensor, the black level may be corrected by offsetting pixel signals of optical black pixels provided around the effective pixel area PA.

[0149] Alternatively, optical black pixels may not be provided around the effective pixel area PA, and the pixel signal level may be corrected based on the pixel signal obtained before the introduction of the liquid sample. In this case, the chip size can be reduced by the amount of optical black pixels not provided, which leads to a reduction in the size of the device and a reduction in costs due to an increase in the number of chips per wafer.

[0150] Furthermore, the level may be corrected based on the pixel signal of a pixel region that does not correspond to the position of the sample reservoir 220 where the liquid sample is introduced.

[0151] (Application example of sensor package) The pixel of the sensor package of this embodiment may be a pixel such as that disclosed in Japanese Patent Application Laid-Open No. 2022-91358. The pixel applied to the sensor package of this embodiment is, for example, a pixel (hereinafter referred to as a pinhole pixel) that includes a lens unit, a filter unit that transmits light of a specific wavelength that has passed through the lens unit, and a light-shielding unit having a pinhole that transmits light of the specific wavelength that has passed through the filter unit, and captures an image of the light that has passed through the pinhole.

[0152] 35, a configuration example of a sensor package 300 in which pinhole pixels are applied to the pixels of the image sensor 211 will be described.

[0153] The sensor package 300 has a wafer-level CSP structure and is composed of an image sensor 311 and a glass member 312 provided to seal the imaging surface side of the image sensor 311.

[0154] The image sensor 311 has a pixel array in which a color filter 311CF and a microlens 311LZ are formed for each pixel.

[0155] A dam material 313 is provided between the image sensor 311 and the glass member 312, and is formed to surround the pixel array of the image sensor 311. In the space surrounded by the dam material 313, a low refractive index resin 314, an SiO lens 315, and a cavity 316 are formed in this order from the image sensor 311 side. The SiO lens 315 is configured as a lens group corresponding to each pixel of the image sensor 311.

[0156] The glass member 312 is basically formed in the same manner as the glass member 212 included in the sensor package 200 of Fig. 18. However, the glass member 312 has a plurality of micro sample vessels 320 formed on its upper surface, and a glass lens 312LZ is provided on the imaging surface side of the image sensor 311.

[0157] The micro sample vessels 320 are formed to correspond to the respective pixels of the image sensor 311. The glass lenses 312LZ are configured as a lens group corresponding to the respective pixels of the image sensor 311.

[0158] With this structure, the pixels of the image sensor 311 can be configured as pinhole pixels PP having the micro sample vessel 320, the glass lens 312LZ, the SiO lens 315, the microlens 311LZ, and the color filter 311CF.

[0159] The pinhole pixel can improve the light utilization efficiency, and therefore, in a sensor package including an image sensor with pinhole pixels, it is possible to further improve the detection sensitivity and resolution of a target substance.

[0160] (Further Improvement of Detection Sensitivity and Resolution of Target Substance) An example in which a configuration for further improving detection sensitivity and resolution of target substances is provided in the sensor package 200 of this embodiment will be described.

[0161] (1) Configuration in which a Metal Reflective Film is Provided on the Underside of a Glass Member FIG. 36 is a cross-sectional view and a plan view showing a configuration example of a sensor package in which a metal reflective film is provided on the underside of a glass member.

[0162] The sensor package 200A shown in FIG. 36 includes a metal reflective film 411 on the lower surface of a glass member 212, the metal reflective film 411 having an opening corresponding to the sample vessel 220 (in other words, the effective pixel area PA of the image sensor 211).

[0163] With this structure, the light source light L is not absorbed by the dam material 213, and the transmission efficiency of the light source light L is increased by reflection from the metal reflective film 411, and the light source light L is prevented from leaking into the imaging surface of the image sensor 211. Furthermore, by providing an opening corresponding to the sample vessel 220, the detection sensitivity and resolution of the target substance can be further improved.

[0164] (2) Configuration Having a Concave-Convex Structure on the Underside of the Glass Member FIG. 37 is a cross-sectional view and a plan view showing an example of the configuration of a sensor package having a concave-convex structure on the underside of the glass member.

[0165] 37 , the glass member 212 has a concave-convex structure 421 formed in a Fresnel lens shape in cross section outside the area on its underside that corresponds to the sample vessel 220 (in other words, the effective pixel area PA of the image sensor 211). That is, the glass member 212 has a sawtooth cross section outside the area on its underside that corresponds to the sample vessel 220.

[0166] The plurality of concave-convex structures 421 formed on the lower surface of the glass member 212 may have the same width (pitch), height, and inclination angle of the inclined surfaces, or may have different pitches, heights, and inclination angles of the inclined surfaces, for example, depending on the distance from the center of the glass member 212. The concave-convex structures 421 can be formed on the lower surface of the glass member 212 by a glass imprint method.

[0167] 37, this structure allows the light to be efficiently irradiated onto the liquid sample (target substance) introduced into the sample vessel 220 by controlling the direction of reflection of the light source lights L and L' on the underside of the glass member 212. As a result, the detection sensitivity and resolution of the target substance can be further improved.

[0168] 37, the concave-convex structure 421 is formed only in one direction, the horizontal direction in the figure (left-right direction in plan view), on the underside of the glass member 212. However, as shown in FIG. 38, in the sensor package 200B′, the concave-convex structure 421 may be formed in two directions, the horizontal direction in the figure (left-right direction in plan view) and the depth direction (up-down direction in plan view), on the underside of the glass member 212.

[0169] Although not shown, the metal reflective film 411 described with reference to FIG. 36 may be provided on the surface of the plurality of concave-convex structures 421 formed on the lower surface of the glass member 212 .

[0170] (3) Configuration Having a Convex Lens Structure on the Lower Surface of the Glass Member FIG. 39 is a cross-sectional view and a plan view showing an example of the configuration of a sensor package having a convex lens structure on the lower surface of the glass member.

[0171] 39, the glass member 212 has a convex lens structure 431 on its underside in an area corresponding to the sample vessel 220 (in other words, the effective pixel area PA of the image sensor 211). The convex lens structure 431 can be formed by a conventional on-chip lens formation process.

[0172] With this structure, the evanescent light can be efficiently collected on the lower surface side of the glass member 212, and the detection sensitivity and resolution of the target substance can be further improved.

[0173] 40, in sensor package 200C′, metal reflective film 411 described with reference to FIG. 36 may be provided on the lower surface of glass member 212. This can further improve the detection sensitivity and resolution of the target substance.

[0174] (4) Configuration Having a High Refractive Index Layer on the Lower Surface of the Glass Member FIG. 41 is a cross-sectional view and a plan view showing a configuration example of a sensor package having a high refractive index layer on the lower surface of the glass member.

[0175] 41 , glass member 212 has a high refractive index layer 441, which has a refractive index higher than that of glass member 212, formed on the lower surface of glass member 212 in an area corresponding to effective pixel area PA of image sensor 211. High refractive index layer 441 may be formed of high refractive index glass, such as sapphire glass, which has a refractive index higher than that of glass member 212.

[0176] This structure prevents light reflected from the liquid sample (target substance) introduced into the sample vessel 220 from being reflected by the underside of the glass member 212, and refracts the reflected light so that it is incident on the effective pixel area PA of the image sensor 211. This makes it possible to further improve the sensitivity and resolution of the evanescent light incident thereon.

[0177] 42, in sensor package 200D′, metal reflective film 411 described with reference to Fig. 36 may be provided on the lower surface of glass member 212. This can further improve the detection sensitivity and resolution of the target substance.

[0178] (5) Thinned Structure Between Sample Vessel and Lower Surface of Glass Member FIG. 43 is a cross-sectional view showing an example of the structure of a sensor package in which the space between the sample vessel and the lower surface of the glass member is thinned.

[0179] In the sensor package 200E shown in FIG. 43, the glass member 212H has a thinned structure between the sample vessel 220 and the lower surface of the glass member 212H so that the light source light L is reflected at least two times.

[0180] As shown in Figure 44, if the width of the sample vessel 220 (the length in the propagation direction of the light source light) is X, the thickness of the sample vessel 220 portion of the glass member 212H is Y, and the angle of reflection of the light source light at the bottom surface of the sample vessel 220 is θ, in order for the light source light L to be reflected two or more times between the sample vessel 220 and the bottom surface of the glass member 212H, the following relationship must be satisfied.

[0181] X>2×Y×tanθ

[0182] This structure allows the number of times the light source light is reflected by the liquid sample (target substance) introduced into the sample chamber 220 to be increased, and the amount of detectable light generated by the evanescent light due to the presence of the target substance in the liquid sample to be increased.

[0183] 45, in sensor package 200E′, metal reflective film 411 described with reference to FIG. 36 may be provided on the lower surface of glass member 212H, thereby further improving detection sensitivity and resolution of the target substance.

[0184] In the sensor package of this embodiment, the above-described modified examples can be combined as appropriate.

[0185] Furthermore, in an optical detection device to which the technology of the present disclosure can be applied, it is also possible to appropriately combine the configuration of the sensor module of the first embodiment and the configuration of the sensor package of the second embodiment.

[0186] For example, although not shown, the sample vessel 130 in which the liquid sample is placed does not necessarily have to be formed on the upper surface of the glass member 115 included in the sensor module 100 of the first embodiment. The tapered portion 212TP of the sensor package 200 of the second embodiment may be formed on the outer periphery of the upper surface of the glass member 115 included in the sensor module 100 of the first embodiment.

[0187] 4. Third Embodiment (Configuration Example of Sensor Module) A configuration example of a sensor module 1100 as a first configuration of an optical detection device according to a third embodiment to which the technology of the present disclosure is applied will be described with reference to Fig. 46 to Fig. 48. Fig. 46 is a cross-sectional view showing the configuration example of the sensor module 1100, and Fig. 47 is a top view showing the configuration example of the sensor module 1100. Fig. 48 is a side view showing the configuration example of the sensor module 1100.

[0188] The sensor module 1100 differs from the sensor module 100 described with reference to FIGS. 1 and 2 in that a glass member 1110 is provided in place of the glass member 115 so as to seal the imaging surface side of the image sensor 112 .

[0189] Like glass member 115, glass member 1110 serves as a waveguide for light source light L from light source 113. Glass member 1110 is capable of holding a liquid sample therein. Specifically, inside glass member 1110, at least a tubular opening is formed that penetrates glass member 1110, forming liquid sample holding section 1120 that is capable of sucking in and holding a liquid sample by capillary force.

[0190] The liquid sample holder 1120 is formed by penetrating from a first side surface of the glass member 1110 to a second side surface opposite the first side surface. As shown in Figures 46 and 47, the liquid sample holder 1120 is formed in the shape of a straight tube with the same diameter from the left side surface to the right side surface of the glass member 1110 in the figures. The liquid sample holder 1120 is formed so that its center overlaps with the effective pixel area of ​​the image sensor 112 in top view.

[0191] For example, assuming that the target substance in the liquid sample to be observed is a cell with a diameter of 20 μm, in order to avoid clogging when the liquid sample is sucked up by capillary action, the liquid sample holding portion 1120 should be formed with a diameter of approximately 50 μm.

[0192] In the sensor module 1100, the light source light L from the light source 113 propagates as a waveguide between the liquid sample holder 1120 and the lower surface of the glass member 1110. A liquid sample containing a target substance is held in the liquid sample holder 1120, and the image sensor 112 detects the light to be detected that is generated by the total reflection of the light source light L and is due to the presence of the target substance in the liquid sample as evanescent light.

[0193] 1 and 2, the liquid sample is dropped into the sample reservoir 130 formed on the upper surface of the glass member 115. In this case, there is a risk that the target substance cannot be properly observed due to external factors such as the surface tension of the liquid sample, dust, or vibration, or that the target substance may be located in a region that cannot be reached by the evanescent light.

[0194] In contrast, according to the sensor module 1100 of this embodiment, the liquid sample is held in the liquid sample holder 1120 formed inside the glass member 1110, so that the target substance can be properly observed without being affected by the surface tension of the liquid sample or external factors. Furthermore, in the sensor module 1100, the distance between the liquid sample holder and the image sensor can be made even closer, so that it is possible to realize further improvements in the detection sensitivity and resolution of the target substance.

[0195] 49 to 51 , a configuration example of a sensor package 1200 as a second configuration of an optical detection device according to a third embodiment to which the technology of the present disclosure is applied will be described. Fig. 49 is a cross-sectional view showing the configuration example of the sensor package 1200, and Fig. 50 is a top view showing the configuration example of the sensor package 1200. Fig. 51 is a side view showing the configuration example of the sensor package 1200.

[0196] The sensor package 1200 differs from the sensor package 200 described with reference to FIG. 18 in that a glass member 1210 is provided in place of the glass member 212 so as to seal the imaging surface side of the image sensor 211 .

[0197] Like glass member 212, glass member 1210 serves as a waveguide for light source light L from an external light source LS. Glass member 1210 has an incident portion and an exit portion for light source light L on its outer periphery. Specifically, tapered portion 1210TP, formed by tapering the outer periphery of the upper surface of glass member 1210, serves as the incident portion and exit portion for light source light L. In the example of Fig. 49, tapered portion 1210TP is tapered into an inverse R-chamfered shape.

[0198] Glass member 1210 is also capable of holding a liquid sample inside. Specifically, inside glass member 1210, at least a tubular opening is formed that penetrates glass member 1210, forming liquid sample holding section 1220 that is capable of sucking in and holding a liquid sample by capillary force.

[0199] The liquid sample holder 1220 is formed by penetrating from a first side surface of the glass member 1210 to a second side surface opposite the first side surface. As shown in Figures 49 and 50 , the liquid sample holder 1220 is formed in the shape of a straight tube with the same diameter from the left side surface to the right side surface of the glass member 1210 in the figures. The liquid sample holder 1220 is formed so that its center overlaps with the effective pixel area PA of the image sensor 211 in a top view.

[0200] For example, assuming that the target substance in the liquid sample to be observed is a cell with a diameter of 20 μm, in order to avoid clogging when the liquid sample is sucked up by capillary action, the liquid sample holding portion 1220 should be formed with a diameter of approximately 50 μm.

[0201] In the sensor package 1200, the light source light L from the light source LS propagates as a waveguide between the liquid sample holder 1220 and the upper surface of the glass member 1210. A liquid sample containing a target substance is held in the liquid sample holder 1220, and the light to be detected, which is generated by the total reflection of the light source light L and is due to the presence of the target substance in the liquid sample, is detected by the image sensor 211 as evanescent light.

[0202] 18, the liquid sample is dropped into a sample reservoir 220 formed on the upper surface of a glass member 212. In this case, there is a risk that the target substance cannot be properly observed due to external factors such as the surface tension of the liquid sample, dust, or vibration, or that the target substance may be located in a region that cannot be reached by evanescent light.

[0203] In contrast, with sensor package 1200 of this embodiment, the liquid sample is held in liquid sample holder 1220 formed inside glass member 1210, allowing the target substance to be properly observed without being affected by the surface tension of the liquid sample or external factors. Furthermore, with sensor package 1200, the distance between the liquid sample holder and the image sensor can be made even closer, making it possible to further improve the detection sensitivity and resolution of the target substance.

[0204] (Cross Section of Liquid Sample Holder) FIG. 52 is a diagram illustrating a cross section of the liquid sample holder 1120 in the sensor module 1100. As shown in FIG.

[0205] The cross-sectional shape of the liquid sample holder 1120 may be rectangular (horizontally elongated rectangle) as shown in Figure 52A, semicircular as shown in Figure 52B, or triangular as shown in Figure 52C. Regardless of the cross-sectional shape, the reflection surface of the liquid sample holder 1120 for the light source light L is formed parallel to the surface of the opposing glass member. In other words, the irradiation surface of the liquid sample holder 1120 for the light source light L is formed flat. This allows the light source light L to be appropriately totally reflected and propagated through the glass member 1110 as a waveguide.

[0206] Furthermore, by adopting an appropriate cross-sectional shape for the liquid sample holder 1120, particularly the cross-sectional shape of the open end, it is possible to make it difficult for dust and foreign matter to be sucked into the liquid sample holder 1120.

[0207] Although not shown, the cross section of the liquid sample holder 1220 in the sensor package 1200 can also have the same configuration as the liquid sample holder 1120 .

[0208] (Modifications of Liquid Sample Holder) FIGS. 53 to 55 are diagrams showing modifications of the liquid sample holder 1220 in the sensor package 1200. FIG.

[0209] 53A, 53B, and 53C are a cross-sectional view, a top view, and a side view showing a first modified example of the liquid sample holder 1220. FIG.

[0210] As shown in Fig. 53, a plurality of liquid sample holders 1220 may be formed in a glass member 1210. In the example of Fig. 53, three straight tubular liquid sample holders 1220 are formed in the glass member 1210, but any other number of straight tubular liquid sample holders 1220 may be formed.

[0211] In this way, by forming a plurality of liquid sample holders 1220 in glass member 1210, it becomes possible to observe a plurality of target substances at once.

[0212] 54A, 54B, and 54C are a cross-sectional view, a top view, and a side view showing a second modified example of the liquid sample holder 1220.

[0213] 54, the liquid sample holder 1220 may have a planar space 1220S in a portion corresponding to the effective pixel area PA of the image sensor 211. The area of ​​the planar space 1220S may be equal to or smaller than the effective pixel area PA.

[0214] In this way, by providing the planar space 1220S in the liquid sample holder 1220 at a portion corresponding to the effective pixel area PA of the image sensor 211, it is possible to increase the amount of liquid sample that can be observed.

[0215] 55A, 55B, and 55C are a cross-sectional view, a top view, and a side view showing a third modified example of the liquid sample holder 1220.

[0216] 55 , liquid sample holder 1220 may have a curved convex portion 1220V on the image sensor side in a portion corresponding to effective pixel area PA of the image sensor, and glass member 1210 may have a curved concave portion 1210C on the surface on the image sensor side corresponding to effective pixel area PA. Curved convex portion 1220V and curved concave portion 1210C form a concave lens structure in the portion corresponding to effective pixel area PA.

[0217] In this way, by forming a concave lens structure in the liquid sample holding portion 1220 in the portion corresponding to the effective pixel area PA of the image sensor 211, it is possible to increase the focusing efficiency of the evanescent light and maintain the detection sensitivity of the target substance.

[0218] The above-described modified examples of the liquid sample holder 1220 may be combined as appropriate within the scope of possibility. Although not shown, the cross section of the liquid sample holder 1120 in the sensor module 1100 may also have the same configuration as the liquid sample holder 1220.

[0219] (Modifications of Glass Member) FIG. 56 is a diagram showing modifications of the glass member 1210 in the sensor package 1200. In FIG.

[0220] 56, the glass member 1210 may be composed of a first member 1210-1 having a groove 1220G that forms the liquid sample holder 1220, and a second member 1210-2 that is removably joined to the surface of the first member 1210-1 on which the groove 1220G is formed. The first member 1210-1 and the second member 1210-2 are joined at a joining surface J1 by, for example, electrostatic adhesion. Of the first member 1210-1 and the second member 1210-2, for example, the member that does not serve as a waveguide for the light source light L may be formed from a transparent resin such as acrylic, rather than glass.

[0221] In this way, since the glass member 1210 is composed of a first member 1210-1 and a second member 1210-2 that are joined in a separable manner, it can be easily cleaned even if dust or foreign matter remains inside the liquid sample holding portion 1220.

[0222] Furthermore, in the liquid sample holder 1220 of the glass member 1210, which is made up of two separably joined members, a monolayer may be formed on the inner surface on the side of the reflecting surface of the light source light L.

[0223] For example, as shown in Fig. 57, the self-assembled monolayer ML is formed on the bonding surface J1 side of the second member 1210-2. In the example of Fig. 57, the bonding surface J1 side of the liquid sample holder 1220 becomes the reflecting surface side of the light source light L.

[0224] Furthermore, as shown in Figure 58, when the side opposite the bonding surface J2 of the liquid sample holding part 1220 is the reflection surface side of the light source light L, a self-assembled monolayer ML may be formed on the inner surface of the liquid sample holding part 1220 opposite the bonding surface J2.

[0225] An Si-O-R bond is formed between the glass and the self-assembled monolayer ML. By making the side chain "-R" hydrophobic, the glass surface is modified to prevent protein adsorption, making it possible to guide the protein to the area to be observed. Furthermore, by making the side chain "-S", a disulfide bond with the protein is formed, making it possible to bond the target substance to be observed to the self-assembled monolayer ML.

[0226] (Another Configuration Example of Sensor Module) A configuration example of a sensor module 1100′ as a third configuration of an optical detection device according to the third embodiment to which the technology of the present disclosure is applied will be described with reference to Fig. 59 and Fig. 60. Fig. 59 is a cross-sectional view showing the configuration example of the sensor module 1100′, and Fig. 60 is a top view showing the configuration example of the sensor module 1100′.

[0227] The sensor module 1100' differs from the sensor module 1100 described with reference to Figures 46 to 48 in that a glass member 1110' is provided instead of the glass member 1110, and two light sources 113-1 and 113-2 are provided instead of the light source 113.

[0228] Glass member 1110' serves as a waveguide for source light L1 from light source 113-1 and source light L2 from light source 113-2. Inside glass member 1110', at least a tubular opening is formed that penetrates glass member 1110', forming liquid sample holding section 1120' that can suck in and hold a liquid sample by capillary force.

[0229] The liquid sample holder 1120' is formed so as to penetrate from a first side surface of the glass member 1110' to the top surface opposite the imaging surface of the image sensor 112 near a second side surface opposite the first side surface. As shown in Figures 59 and 60, the liquid sample holder 1120' is formed in the shape of a tube with the same diameter from the left side surface in the figure to the top surface of the glass member 1110'. The liquid sample holder 1120' is formed so that its center overlaps with the effective pixel area of ​​the image sensor 112 in a top view.

[0230] Of light sources 113-1 and 113-2 provided adjacent to the right side of glass member 1110' in the figure, light source 113-1 emits source light L1 onto the glass member 1110' below liquid sample holding section 1120', and light source 113-2 emits source light L2 onto the glass member 1110' above liquid sample holding section 1120'.

[0231] In this way, the light source light L1 and L2 from the two light sources 113-1 and 113-2 are reflected above and below the liquid sample holding portion 1120', thereby increasing the amount of detectable light generated by the presence of the target substance in the liquid sample due to the evanescent light, thereby improving the detection sensitivity of the target substance.

[0232] (Another example of a sensor package configuration) Conventionally, image sensors with a glass-less CSP structure have been developed that suppress the occurrence of ring-shaped flare by connecting terminals from the back surface without bonding a glass substrate to the front surface of the image sensor, and that improve connectivity with the mounting board by connecting terminals from the back surface. In the image sensor with a glass-less CSP structure, the terminal connection structure from the back surface of the image sensor with a glass CSP structure remains the same, but the glass substrate on the light-receiving surface is eliminated.

[0233] However, in an image sensor with a glass-less CSP structure, the chip strength is reduced compared to an image sensor with a glass CSP structure due to the absence of a glass substrate. In particular, the chip may be damaged by external impacts at the edge of the image sensor.

[0234] In response to this, image sensors with a glass-less CSP structure have been proposed in recent years, in which a glass substrate is not provided in the pixel region, but a reinforcing member is provided in a peripheral region located on the periphery of the pixel region. This structure allows for increased chip strength without providing a glass substrate. The technology disclosed herein can also be applied to image sensors with such a glass-less CSP structure.

[0235] 61 to 63 , a configuration example of a sensor package 1300 as a fourth configuration of an optical detection device according to a third embodiment to which the technology of the present disclosure is applied will be described. Fig. 61 is a cross-sectional view showing the configuration example of the sensor package 1300, and Fig. 62 is a top view showing the configuration example of the sensor package 1300. Fig. 63 is a side view showing the configuration example of the sensor package 1300.

[0236] The sensor package 1300 is configured as an image sensor with a wafer-level CSP structure that does not have a sealing member such as a glass substrate. The sensor package 1300 is configured with a semiconductor substrate 1301, a wiring layer 1302, a reinforcing member 1303, a light source 1304, a power supply wiring 1305, and a glass member 1310.

[0237] The semiconductor substrate 1301 has an effective pixel area PA. A plurality of pixels are arranged in the effective pixel area PA. A lens layer is stacked on the semiconductor substrate 1301, on which on-chip lenses corresponding to the respective pixels in the effective pixel area PA are formed.

[0238] A wiring layer 1302 laminated on the lower side of the semiconductor substrate 1301 in the drawing is provided with a plurality of wirings, solder bumps, and the like.

[0239] In the upper layer of the semiconductor substrate 1301 (lens layer), a reinforcing member 1303 and a light source 1304 are provided in the peripheral area of ​​the effective pixel area PA.

[0240] The reinforcing member 1303 is a member for reinforcing the sensor package 1300. As shown in FIG. 62 , the reinforcing member 1303 is formed in a rectangular frame shape in a plan view (top view) so as to include the light source 1304. For example, glass or the like can be used as the reinforcing member 1303. This structure can increase the chip strength of the sensor package 1300. Power is supplied to the light source 1304 from the wiring layer 1302 via a power supply wiring 1305.

[0241] The glass member 1310 is provided surrounded by the reinforcing member 1303 and the light source 1304 .

[0242] Glass member 1310 serves as a waveguide for source light L from light source 1304. Glass member 1310 is capable of holding a liquid sample therein. Specifically, inside glass member 1310, at least a tubular opening is formed that penetrates glass member 1110, forming liquid sample holding section 1320 that is capable of sucking in and holding a liquid sample by capillary force.

[0243] The liquid sample holder 1320 is formed by penetrating from a first side surface of the glass member 1310 to a second side surface opposite the first side surface. As shown in Figures 61 and 62 , the liquid sample holder 1320 is formed in the shape of a straight tube with the same diameter from the left side surface to the right side surface of the glass member 1310 in the figures. The liquid sample holder 1320 is formed so that its center portion overlaps with the effective pixel area PA in top view.

[0244] In the sensor package 1300 of this embodiment, the liquid sample is held in the liquid sample holding portion 1320 formed inside the glass member 1310, so that the target substance can be properly observed without being affected by the surface tension of the liquid sample or external factors.

[0245] As shown in Fig. 63, glass member 1310 is provided so as to penetrate the left side surface of reinforcing member 1303 in Fig. 61 and Fig. 62, exposing the side surface. In other words, the side surface of reinforcing member 1303 is provided with an opening through which glass member 1310 can be slid and removed, as shown in Fig. 64.

[0246] In this way, by making the glass member 1310 removable by sliding it, the entire glass member 1310 can be replaced, making it possible to prevent a decrease in the detection sensitivity of the target substance due to contamination inside the liquid sample holding portion 1320.

[0247] The optical detection device of this embodiment described above can suck up a liquid sample using the liquid sample holder by capillary force, so the device itself can be immersed in the liquid sample for use. Furthermore, since the viscosity of the liquid that can be sucked up by capillary force is limited, it is also possible to selectively observe a specific solution from a liquid mixture containing solutions of multiple viscosities.

[0248] In the optical detection device of this embodiment, it is also possible to appropriately combine the configuration of the sensor module of the first embodiment and the configuration of the sensor package of the second embodiment.

[0249] The effects described in this specification are merely examples and are not limiting, and other effects may also be present.

[0250] Furthermore, the embodiments to which the technology of the present disclosure is applied are not limited to the above-described embodiments, and various modifications are possible within the scope that does not deviate from the gist of the technology of the present disclosure.

[0251] Furthermore, the present disclosure can have the following configurations. (1) A sensor module comprising: a substrate on which an image sensor, a light source, and a sealing resin formed to surround the image sensor are arranged; and a glass member provided to seal the imaging surface side of the image sensor and on whose upper surface a liquid sample can be placed, the glass member serving as a waveguide for light source light from the light source. (2) The sensor module described in (1), in which a sample reservoir in which the liquid sample is placed is formed on the upper surface of the glass member. (3) The sensor module described in (1) or (2), in which the sealing resin is formed so as to shield the light source light between the image sensor and the light source. (4) The sensor module described in any of (1) to (3), in which the image sensor has a wafer-level CSP (chip size package) structure without a sealing member. (5) The sensor module described in any of (1) to (4), in which the sample reservoir is formed as a recess in the upper surface of the glass member. (6) The sensor module according to any one of (1) to (5), further comprising an adhesive resin formed between the light source and the glass member and having a refractive index smaller than that of the glass member. (7) The sensor module according to any one of (1) to (6), further comprising a bandpass filter formed on the glass member on the imaging surface side of the image sensor in correspondence with the sample vessel, and transmitting only light of a specific wavelength. (8) The sensor module according to any one of (1) to (7), wherein the sample vessel is formed by a frame portion formed by processing the glass member. (9) The sensor module according to any one of (1) to (8), wherein the sample vessel is formed by a frame portion formed by processing a material different from the glass member. (10) The sensor module according to (2), wherein the sample vessel is formed on the glass member on the imaging surface side of the image sensor, and wherein the sealing resin has an opening that allows a sample to be introduced into the sample vessel. (11) The sensor module according to (10), wherein the image sensor has a wafer-level CSP (Chip Size Package) structure having a sealing member.(12) The sensor module according to any one of (1) to (9), further comprising a light-shielding portion that shields the upper surface of the glass member excluding the sample vessels or the entire module excluding the sample vessels from light. (13) The sensor module according to any one of (1) to (9), wherein the glass member has a tapered portion formed by tapering the outer periphery of the upper surface. (14) The sensor module according to any one of (1) to (9), wherein the glass member is formed of sapphire glass, and wherein the space surrounded by the sealing resin is filled with a low-refractive-index resin having a refractive index of 1.45 or less. (15) A sensor package comprising: an image sensor; and a glass member that is arranged to seal the imaging surface side of the image sensor and on whose upper surface a liquid sample can be placed, the glass member serving as a waveguide for light from an external light source and having an input portion and an output portion for the light source light on its outer periphery. (16) The sensor package according to (15), wherein a sample vessel on which the liquid sample is placed is formed on the upper surface of the glass member. (17) The sensor package according to (16), further comprising a dam material formed to surround the effective pixel area of ​​the image sensor. (18) The sensor package according to (17), further comprising a cavity in the space surrounded by the dam material. (19) The sensor package according to (17), wherein the glass member is formed of a high refractive index material, and the space surrounded by the dam material is filled with a low refractive index resin. (20) The sensor package according to any one of (16) to (19), wherein the incident portion and the exit portion are formed by tapering the outer periphery of the upper surface of the glass member. (21) The sensor package according to any one of (16) to (20), wherein the sample vessel is formed as a recess in the upper surface of the glass member. (22) The sensor package according to (21), wherein the sample vessel is formed to have the same or approximately the same size as the effective pixel area of ​​the image sensor. (23) The sensor package according to (21) or (22), wherein the corners of the sample vessel are rounded. (24) The sensor package according to any one of (21) to (23), wherein the sample vessel is formed by recessing a film of a material different from the glass member that is formed on the upper surface of the glass member.(25) The sensor package according to (16), comprising, for each pixel of the image sensor, the sample vessel formed on the upper surface of the glass member, a lens section, a filter section that transmits light of a specific wavelength that has passed through the lens section, and a light-shielding section having a pinhole that transmits light of the specific wavelength that has passed through the filter section. (26) The sensor package according to (16), further comprising a metal reflective film on the lower surface of the glass member that has an opening corresponding to the sample vessel. (27) The sensor package according to (16) or (26), wherein the glass member has an uneven structure formed in a Fresnel lens shape in cross section outside an area on the lower surface of the glass member that corresponds to the sample vessel. (28) The sensor package according to (27), wherein the glass member has a plurality of uneven structures with inclination angles of inclined surfaces that differ. (29) The sensor package according to (16) or (26), wherein the glass member has a convex lens structure in an area on the lower surface of the glass member that corresponds to the sample vessel. (30) The sensor package according to (16) or (26), further comprising a high-refractive index layer having a refractive index higher than that of the glass member, formed in a region on the lower surface of the glass member corresponding to the effective pixel region of the image sensor. (31) The sensor package according to (16) or (26), wherein the glass member has a thinned structure between the sample vessel and the lower surface of the glass member so that the light source light is reflected at least two times. (32) An optical detection device comprising: an image sensor; a glass member provided to seal the imaging surface side of the image sensor; and a liquid sample holder that penetrates the glass member, has at least a tubular opening, and is capable of sucking in and holding a liquid sample by capillary force, wherein the glass member serves as a waveguide for light source light from a light source. (33) The optical detection device according to (32), wherein the liquid sample holder is formed by penetrating from a first side surface of the glass member to a second side surface opposite the first side surface. (34) The optical detection device according to (33), wherein a reflection surface of the light source light in the liquid sample holder is formed parallel to a surface of the glass member facing the reflection surface.(35) The optical detection device according to (33) or (34), wherein the liquid sample holder is formed in a linear tubular shape from the first side surface to the second side surface. (36) The optical detection device according to (35), wherein a plurality of the liquid sample holders are formed in the glass member. (37) The optical detection device according to (33) or (34), wherein the liquid sample holder has a planar space in a portion corresponding to the effective pixel area of ​​the image sensor. (38) The optical detection device according to (33) or (34), wherein the liquid sample holder has a curved convex portion on the image sensor side in a portion corresponding to the effective pixel area of ​​the image sensor, and the glass member has a curved concave portion on the surface on the image sensor side that corresponds to the effective pixel area. (39) The optical detection device according to (33) or (34), wherein the glass member is composed of a first member having a groove that forms the liquid sample holder, and a second member that is releasably joined to the surface of the first member on which the groove is formed. (40) The optical detection device according to (39), wherein the liquid sample holding portion has a monolayer on the inner surface on the side of the reflection surface of the light source light. (41) The optical detection device according to (40), wherein the monolayer includes a self-assembled monolayer. (42) The optical detection device according to (32), wherein the liquid sample holding portion is formed so as to penetrate from a first side surface of the glass member to an upper surface opposite to the imaging surface of the image sensor in the vicinity of a second side surface facing the first side surface, and further comprises the light source provided adjacent to the second side surface. (43) The optical detection device according to (42), wherein the light source comprises a first light source that directs the light source light onto the glass member above the liquid sample holding portion, and a second light source that directs the light source light onto the glass member below the liquid sample holding portion. (44) The optical detection device described in (32), configured as the image sensor of a wafer-level CSP (Chip Size Package) structure without a sealing member, further comprising a reinforcing member and the light source provided in the peripheral region of the effective pixel region of the image sensor, and the glass member being surrounded by the reinforcing member and the light source.(45) The optical detection device according to (44), wherein a removal opening through which the glass member can be slid and removed is provided on a side surface of the reinforcing member.

[0252] 100 Sensor module, 111 Substrate, 112 Image sensor, 113 Light source, 114 Sealing resin, 115 Glass member, 130 Sample tank, 130F Frame, 200, 200A to 200E Sensor package, 211 Image sensor, 212, 212H Glass member, 212TP Tapered portion, 213 Dam material, 220 Sample tank, 411 Metal reflective film, 421 Concave-convex structure, 431 Lens structure, 441 High refractive index layer, 1100, 1100' Sensor module, 1110, 1110' Glass member, 1120, 1120' Liquid sample holder, 1200 Sensor package, 1210 Glass member, 1220 Liquid sample holder, 1300 Sensor package 1303 Reinforcing member, 1304 Light source, 1310 Glass member, 1320 Liquid sample holder

Claims

1. A sensor module comprising: a substrate on which an image sensor, a light source, and a sealing resin formed to surround the image sensor are disposed; and a glass member arranged to seal the imaging surface side of the image sensor and on which a liquid sample can be placed, the glass member serving as a waveguide for light from the light source.

2. The sensor module according to claim 1, wherein a sample vessel in which the liquid sample is placed is formed on the upper surface of the glass member.

3. The sensor module according to claim 2, wherein the sealing resin is formed between the image sensor and the light source so as to block the light from the light source.

4. The sensor module according to claim 2, wherein the image sensor has a wafer-level CSP (Chip Size Package) structure that does not include a sealing material.

5. The sensor module according to claim 2, wherein the sample vessel is formed as a recess in the upper surface of the glass member.

6. The sensor module according to claim 2, further comprising an adhesive resin formed between the light source and the glass member and having a refractive index smaller than that of the glass member.

7. The sensor module according to claim 2, further comprising a bandpass filter that transmits only light of a specific wavelength and is formed on the imaging surface side of the image sensor of the glass member in correspondence with the sample vessel.

8. The sensor module according to claim 2, wherein the sample vessel is formed by a frame portion formed by processing the glass member.

9. The sensor module according to claim 2, wherein the sample vessel is formed by a frame portion that is processed from a material different from the glass member.

10. The sensor module according to claim 2, wherein the sample vessel is formed on the glass member on the imaging surface side of the image sensor, and the sealing resin has an opening that allows a sample to be introduced into the sample vessel.

11. The sensor module according to claim 10, wherein the image sensor has a wafer-level CSP (Chip Size Package) structure having a sealing member.

12. The sensor module according to claim 2, further comprising a light-shielding portion that shields the upper surface of the glass member excluding the sample vessel, or the entire module excluding the sample vessel, from light.

13. The sensor module according to claim 2, wherein the glass member has a tapered portion formed by tapering the outer periphery of the upper surface.

14. The sensor module according to claim 2, wherein the glass member is formed of sapphire glass, and the space surrounded by the sealing resin is filled with a low refractive index resin having a refractive index of 1.45 or less.

15. A sensor package comprising: an image sensor; and a glass member arranged to seal the imaging surface side of the image sensor and on whose upper surface a liquid sample can be placed, the glass member serving as a waveguide for light from an external light source and having an entrance portion and an exit portion for the light from the light source on its outer periphery.

16. The sensor package according to claim 15, wherein a sample vessel in which the liquid sample is placed is formed on the upper surface of the glass member.

17. The sensor package according to claim 16, further comprising a dam material formed to surround an effective pixel area of ​​the image sensor.

18. The sensor package according to claim 17, further comprising a cavity in a space surrounded by the dam material.

19. The sensor package according to claim 17, wherein the glass member is formed of a high refractive index material, and the space surrounded by the dam material is filled with a low refractive index resin.

20. The sensor package according to claim 16, wherein the entrance portion and the exit portion are formed by tapering the outer periphery of the upper surface of the glass member.

21. The sensor package of claim 16, wherein the sample vessel is formed as a recess in the top surface of the glass member.

22. The sensor package according to claim 21, wherein the sample vessel is formed to have the same or approximately the same size as an effective pixel area of ​​the image sensor.

23. The sensor package according to claim 21, wherein the corners of the sample vessel are rounded.

24. The sensor package according to claim 21, wherein the sample vessel is formed by recessing a film of a material different from the glass member that is formed on the upper surface of the glass member.

25. The sensor package of claim 16, comprising, for each pixel of the image sensor, a sample vessel formed on the upper surface of the glass member, a lens portion, a filter portion that transmits light of a specific wavelength that has passed through the lens portion, and a light-shielding portion having a pinhole that transmits light of the specific wavelength that has passed through the filter portion.

26. The sensor package according to claim 16, further comprising a metal reflective film on the lower surface of the glass member, the metal reflective film having an opening corresponding to the sample vessel.

27. The sensor package according to claim 16, wherein the glass member has an uneven structure formed in a Fresnel lens shape in cross section outside the area corresponding to the sample vessel on the underside of the glass member.

Images