Apparatuses and methods involving high density bioelectronic fibers

Abstract

In certain examples, methods and apparatuses (e.g., semiconductor structures) are directed to use of a ID fiber material characterized as a fibrous structure having one or more transformations from among: a spiral, a roll and wrinkles. Such an apparatus may include one or more wire-contact regions, adjacent and unconnected to the ID fiber material, for contacting the ID fiber material, and may include sensor circuitry (integrated with the ID fiber material) to sense parameters in response to changes in at least one of: pressure, capacitance, and strain. In a more specific example, such an apparatus includes a polymer- based substrate with one or more properties from among; a self-adhesive property', being stretchable; and an elasticity property with the ability to return to its original shape after being stretched.

Description

[0001] STFD.458PCT (S23-326) 1      APPARATUSES AND METHODS INVOLVING HIGH DENSITY BIOELECTRONIC FIBERS   BACKGROUND Aspects of the present disclosure are related generally to the field of sensor- related circuits and materials, and as may be exemplified by uses in applications, among others, including biomedical devices. Using electronic fibers as one example technology relating to the present disclosure, for ease of discussion, it has been appreciated that electronic fibers have been attracting considerable attention owing to their miniaturized structure, remarkable deformability, and their applications to hold multiple functions including sensing, actuation, tissue modulation, energy harvesting, and light emission, among others. Despite their potential benefits, electronic fiber manufacturing is still a challenge due to their incompatibility with conventional microfabrication techniques, which have been originally developed for planar substrates. As a result, currently available fiber devices suffer from low density, limited functionality, and imprecise positioning of components. Therefore, the fusion of microfabrication techniques with fiber production holds huge potential and unlocks new possibilities across various fields, including implantable biomedical device, electronic textile, wearable devices, and others. In the specific context of biological applications, bioelectronic fibers hold promise for applications (e.g., research and / or clinical) due to their compactness, ease of implantation, and ability to incorporate advanced functionalities such as sensing, recording and stimulation. However, previously-known devices of this type have been disadvantageous for one or more reasons due to of associated with their bulkiness, rigidity, low functionality, and low density of active components. These limitations stem from the difficulty to incorporate multiple components on 1D fiber devices due to their incompatibility with conventional microfabrication methods (e.g., photolithography), because of their thin, curved, and extended structures. In specific contexts, biomedical devices with 1D geometry, such as surgical sutures, biopsy needles, endoscopes, guidewires, manometry probes, fiberscopes, and deep brain stimulation electrodes have been extensively used in the clinic for several decades. Compared to 3D systems and 2D thin films, 1D devices are more compact and can accommodate complex deformations. Therefore, 1D devices are favorable for deep penetration into tissues and body channels through minimally invasive implantation STFD.458PCT (S23-326) 2      procedures. Furthermore, they can be readily retrieved and removed after completing sensing or therapeutic functions. Among the various examples of 1D devices, electronic fibers have gained considerable attention. With recent advances in materials, fabrication, optics, and electronics, electronic fibers have acquired new functionalities, including sensing, actuation, tissue modulation, energy harvesting, and light emission, among others. Despite their potential benefits, electronic fiber manufacturing is still a challenge due to their incompatibility with conventional microfabrication techniques, which have been originally developed for planar substrates. As a result, currently-available fiber devices suffer from low density, limited functionality, and imprecise positioning of components. To date, approaches such as fiber spinning, 3D printing, (micro)fluidics, functionalization / coating of commercial fibers, and thermal drawing have been used to fabricate 1D fiber devices. Although electronic fibers prepared by thermal drawing can potentially host tens of channels (e.g., for signaling) and multiple functional components, the active region (e.g., sensing area) is typically located at the tip of the fiber, i.e., no longitudinal distribution. Additionally, it remains difficult to achieve high-density fibers with precise control over device structure, position, and orientation. Examples of on- fiber lithography has been recently introduced to break the fiber’s longitudinal symmetry and to introduce micro-patterned components. However, such procedures are still time- consuming, imprecise, and challenging for high-throughput production. In addition to the limitations mentioned above, the requirement for compatibility with the thermal drawing process considerably reduces the variety of materials that can be utilized.

[0002] STFD.458PCT (S23-326) 3      SUMMARY OF VARIOUS ASPECTS AND EXAMPLES Various examples / embodiments presented by the present disclosure are directed to issues such as those addressed above and / or others which may become apparent from the following disclosure. For example, some of these disclosed aspects are directed to methods and devices that use or leverage from fiber-based devices and methods for using and manufacturing fiber-based devices. In specific examples, the present disclosure is directed to apparatuses (e.g., semiconductor structures) and / or methods (of use and manufacturing), wherein the apparatus or method involves a 1D fiber material characterized as a fibrous structure having one or more transformations from among: a spiral, a roll and wrinkles. For example, a method in accordance with the present disclosure may involve use of an apparatus, or manufacturing such an apparatus, corresponding to or including 1D fiber material characterized as a fibrous structure having one or more of these transformations. In a more specific aspects of the present disclosure, the above-characterized apparatus is integrated with a semiconductor structure and the apparatus may include one or more wire-contact regions, adjacent and unconnected to the 1D fiber material, for contacting the 1D fiber material, and / or may include sensor circuitry (integrated with the 1D fiber material) to sense parameters in response to changes in at least one of: pressure, capacitance, and strain. In yet further specific examples, such an apparatus includes a polymer-based substrate with one or more properties from among: a self-adhesive property, being stretchable; and an elasticity property with the ability to return to its original shape after being stretched. In other exemplary contexts, methods for manufacturing such electronic fibers involve customizing (or optimizing for specific applications) one or more parameters involving electronic fibers according to the present disclosure in terms of achieving precise control on their developed structure, size and / or composition, and / or one or more manufacturing aspects for automating the fiber preparation process. In more specific examples related to the above methodology and / or devices, exemplary aspects include a method of fabrication which is based on a spiral transformation to convert a 2D film, containing pertinent microfabricated devices, into 1D fibers. This method allows for the creation of multifunctional bioelectronic fibers with high density, while enabling precise control over their longitudinal, angular, and radial positioning (e.g., as successfully demonstrated and disclosed herein with the utility of these fibers for motility mapping, serotonin sensing and tissue stimulation within the dynamic and soft STFD.458PCT (S23-326) 4      gastrointestinal (GI) system, and for single neural recording in the brain). In related examples, the post-fabricated bioelectronic fibers showcase significant promise for next- generation clinical monitoring and modulation applications, particularly in minimally invasive deployments within the GI tract and other curved and confined regions of the body. In the context of biologic and other application-specific fibers, another specific example aspect of the present disclosure is a method to prepare high-density soft electronic fibers that can host a variety of functional components. In a more specific method of this type, fabrication processing may be carried out on a 2D substrate, which is subsequently rolled into a 1D structure. According one exemplary embodiment, the present disclosure is directed to a method including steps of providing 1D fiber material as a fibrous structure having one or more transformations from among a spiral, a roll or wrinkles, and with the 1D fiber material configured to convey signals indicative of one or more biomedical functions. In more specific embodiments, the 1D fiber material is integrated with circuitry including at least one microfabricated component and / or device, to convey the signals indicative of the biomedical function(s). The biomedical function(s) may be from among: monitoring physiological parameters or responses of a live being; and introducing or causing bio-modulation within a curved or confined region of a live being. Further, in such more specific embodiments, the 1D fiber material may be used to simultaneously effect: real-time mapping of biomedical signals obtained via the 1D fiber material and from within a live being, and stimulating tissue within the live being, wherein the circuitry is used to facilitate said real-time mapping and said stimulating tissue. According to various other exemplary embodiments, the present disclosure is implemented via such transformation processing methodology (e.g., involving transformation by rolling, spiraling and the like) and used to create and / or modify a variety of 1D devices, some examples of which include 1D devices as part of: biomedical applications (e.g., implantable probes, electrodes, leads, catheters, guidewires, fiberscopes, endoscopes, biopsy needles, and / or sutures); fibers for e-textiles and wearables, fiber electrical connectors, fiber actuators (e.g., artificial muscles for robotics), and various general sensing applications. In addition to providing electronic functions, the disclosed examples of such transformation processing methodology can be used to create fibers with optical and optoelectronic functions. STFD.458PCT (S23-326) 5      The above discussion is not intended to describe each aspect, embodiment or every implementation of the present disclosure. The figures and detailed description that follow also exemplify various embodiments.

[0003] STFD.458PCT (S23-326) 6      BRIEF DESCRIPTION OF FIGURES Various example embodiments, including experimental examples, may be more completely understood in consideration of the following detailed description in connection with the accompanying drawings, each in accordance with the present disclosure, in which: FIGs.1A-1H are a set of diagrams illustrating certain exemplary aspects of the present disclosure, wherein: FIG.1A is schematic illustration of an example approach for transforming a 2D film, FIG.1B and FIG.1C are photographs of such films (including a film with some sensing components in part i and part ii), FIG.1D is a microscope image of a high- density transformed bioelectronic fibers (t-BEFs), FIGs.1E, 1F, 1G and 1H, respectively, are depictions showing aspects of the bioelectronic fibers (1E), a schematic illustration describing film dimensions and transformation process (1F), and diagrams in the forms of graphs showing parameters (1G) and attributes (1H) of example fibers; FIGs.2A-2F are a set of diagrams illustrating certain exemplary aspects of the present disclosure, wherein: FIGs.2A and 2B are schematic illustrations showing first and second parts of an exemplary transformation process including forces involved in the process, FIG.2C is a set of microscope images showing a rolling process under varying conditions, FIG.2D is a set of 2D exemplary layout designs and the corresponding fibers, FIG.2E are images showing advanced functions integratable into such a fiber, and FIG.2F is a diagram showing another example aspect of the exemplary transformation process according to the present disclosure; FIGs.3A-3L are a set of diagrams illustrating certain exemplary aspects with: FIGs.3A-3B showing the deployment of t-BEF into the small intestine of a pig, FIG.3C is a recording of natural motility in the small intestine, FIG.3D is a schematic showing the 2D design of bifunctional t-BEF, FIG.3E is a photograph showing the t-BEF obtained from the 2D design shown in FIG.3D, FIG.3F shows pressure sensor output in response to different stimulation, FIG.3G is a summary of the maximum response obtained under stimulation at different voltages, FIG.3H is a schematic illustration showing the use of distributed stimulation electrodes, FIG.3I is a demonstration of the closed loop feedback system for programmable stimulation, FIG.3J is a schematic illustration showing the use of SSRI injection, FIG.3K charts drug-induced luminal serotonin concentration change, and FIG.3L charts electrochemical sensing of SSRI-induced serotonin; FIGs.4A-4L are a set of diagrams illustrating exemplary aspects of the present disclosure, with: FIG.4A is a schematic of a related design of the 2D film used for preparing neural t-BEFs, FIG.4B is an image showing the tip of the neural t-BEF with the recording STFD.458PCT (S23-326) 7      PEDOT microelectrodes. FIG.4C shows a distribution of impedance measurements collected from 60 on-fiber micro electrodes, FIG.4D is a schematic showing a setup for recording neural signals in awake mice, FIG.4E is raw data obtained from four recording electrodes, FIG.4F is an overlay of hundreds of spikes collected via neural t-BEF, FIG.4G are four correlograms, FIG.4H are ISI violations, FIGs.4I-4J are sharp wave ripples (SWR) detected in the hippocampus, and FIGs.4K-L are spectrograms showing stereotypical increase in power; FIGs.5A-5F are a set of diagrams illustrating certain exemplary aspects of the present disclosure, wherein FIGs.5A and 5B are schematic illustrations showing two parts of the transformation process, FIG.5C shows optimization of the rolling process by tuning different parameters, FIG.5D depicts interlayer intimate bonding following the thin film transformation using thermal annealing, FIG.5E is an image of off-center rolled fiber showing the densely packed layers, and FIG.5F is a fiber cross-section showing the well- bonded layers; and FIGs.6A-6H are a set of images and a graph illustrating certain exemplary aspects of the present disclosure directed to a high-density electrical-recording fiber, with: FIG.6A is photograph of 2D film, FIG.6B is an image of an exposed site of the film of FIG. 6A, FIGs.6C-6D are related microscopic images (showing the 230-µm fiber obtained after rolling), FIG.6E is a cross-sectional image of the fiber showing the different rolled layers, FIGs.6F-6G are SEM images of a 320-channel fiber, and FIG.6H is a graph with plots showing an impedance analysis. While various embodiments discussed herein are amenable to modifications and alternative forms, aspects thereof have been shown by way of example in the drawings and will be described in detail. It should be understood, however, that the intention is not to limit the disclosure to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the scope of the disclosure including aspects defined in the claims. In addition, the term “example” as used throughout this application is only by way of illustration, and not limitation. STFD.458PCT (S23-326) 8      DETAILED DESCRIPTION Aspects of the present disclosure are believed to be applicable to a variety of different types of apparatuses, systems and methods involving fiber-based devices and methods for using and manufacturing fiber-based devices (e.g., including but not limited to structural aspects of such devices which are partially manufactured and / or assembled) and involving devices characterized at least in part by specific materials and integrated circuitry for specific applications. While the present disclosure is not necessarily limited to such aspects and examples, an understanding of specific examples in the following description may be understood from discussion in such specific contexts or applications. In certain exemplary embodiments and specific aspects, the present disclosure is directed to apparatuses and / or methods of providing (i.e., in use, testing and / or manufacturing) 1D fiber material, wherein the apparatus or method involves the 1D fiber material characterized as a fibrous structure having one or more transformations from among: a spiral, a roll and wrinkles. For example, such a method may involve testing of an apparatus manufactured according to apparatuses and / or methods of the present disclosure, with the apparatus corresponding to or including 1D fiber material characterized as a fibrous structure having one or more of these transformations. In the context of biologic and other application-specific fibers, another specific example aspect of the present disclosure is a method to prepare high-density soft electronic fibers that can host different functional components. In a specific method of this type, fabrication processing for such fibers is carried out on a 2D substrate, and the 2D substrate is subsequently rolled into a 1D structure. The 1D fiber material is therein provided as a fibrous structure having one or more transformations from among a spiral, a roll or wrinkles, and with the 1D fiber material configured to convey signals indicative of one or more biomedical functions. In more specific embodiments, the 1D fiber material is integrated with circuitry including at least one microfabricated component and / or device, to convey the signals indicative of the biomedical function(s). The biomedical function(s) may be from among: monitoring physiological parameters or responses of a live being; and introducing or causing bio-modulation within a curved or confined region of a live being. Further, in such more specific embodiments, the 1D fiber material may be used to simultaneously effect: real-time mapping of biomedical signals obtained via the 1D fiber material and from within a live being, and stimulating tissue within the live being, wherein the circuitry is used to facilitate said real-time mapping and said stimulating tissue. STFD.458PCT (S23-326) 9      In the present disclosure, various specific details are set forth to describe specific examples presented herein. It should be apparent to one skilled in the art, however, that one or more other examples and / or variations of these examples may be practiced without all the specific details given below. In other instances, well known features have not been described in detail so as not to obscure the description of the examples herein. For ease of illustration, the same connotation and / or reference numerals may be used in different diagrams to refer to the same elements or additional instances of the same element. Also, although aspects and features may in some cases be described in individual figures, it will be appreciated that features from one figure or embodiment can be combined with features of another figure or embodiment even though the combination is not explicitly shown or explicitly described as a combination. Consistent with the above aspects, such a manufactured device or method of such manufacture may involve aspects presented and claimed in U.S. Provisional Application Serial No.63 / 528,846 filed on July 25, 2023 (STFD.458P1 S23-326) with Appendices A-D, to which priority is claimed. To the extent permitted, such subject matter is incorporated by reference in its entirety generally and to the extent that further aspects and examples (such as experimental and / or more-detailed embodiments) may be useful to supplement and / or clarify. Through such experimental work, multiple significant advancements are achieved, such as the following, First, a method is performed to create high density electronic fibers while still being able to use conventional microfabrication techniques. This approach allows the translation of materials, devices, circuits, and fabrication process well-established with conventional planar systems, to thin, curved, and extended 1D fibers. Second, the capability of real-time mapping of GI signals and simultaneous tissue stimulation is demonstrated by such experimental work, while minimizing disruptions to the natural movements of the body and organ. Further, high density single neuron recording using elastomer-based fibers is realized by this experimental work, thereby providing a new level of softness that has not been realized before with single neuron recording microelectrode arrays. As noted above, certain exemplary aspects of the present disclosure involve methodology and structures directed to 1D fiber transformed from a 2D structure. Depending on the specifics of the process used and / or the materials selected, in various examples the core of the fiber may be implemented as an optical fiber, a hollow fiber, or a solid material that can be removed by solvent or vapor etching to create a hollow structure (see, e.g., FIG. 1E). Further, the 1D fiber can be used to be woven into fabric to create sensing fabric (e.g., FIG.1E) or knitted into other shapes (e.g., FIG.1E) or wrapped around 3D structures such as a robotic hand, body or organ. The 1D fiber can also be integrated with other materials and STFD.458PCT (S23-326) 10      even sutured into fabric or tissue. In examples involving use of such fiber with electronics (particular those delivering signals for control or stimulus and / or those detecting phenomena (e.g., sensors), it is beneficial for the related circuitry to be integrated with wireless communication systems. In certain exemplifying experimental implementations, the core used to roll the 1D structure is implemented as one of the following: a 1D fiber, a 1D hollow fiber, and a micro patterned structure placed at the edge or above the edge of the 2D structure (or sheet) that is subsequently rolled into the final 1D structure. As in some instances indicated in the various figures, according to various example structures, a post-processed (e.g., post-rolled or post-spiraled) form of the 1D structure may have a few to several (e.g., 3-7 or 3-9) layers due to the processed overlapping portions. In other example embodiments the post-processed form of the 1D structure may have more than several (e.g., 8-40) overlapping portions, may have only 1-2 overlapping portions, and while less ideal for many applications other examples may have the opposing sides of post-processed portions meeting up at edges or almost meeting at edges without any overlapping portions. Consistent with certain of these examples according to the present disclosure, another specific example aspect of the present disclosure is a method in which fabrication processing occurs on a 2D substrate, which is subsequently rolled into a 1D structure as depicted in FIG.1A. Such a layout design is suitable for a variety of types of fibers including multifunctional transformed bioelectronic fibers (t-BEFs) which permit for precise control over the longitudinal, angular, and radial device positions. The application of soft fibers, as disclosed herein, is demonstrated by the description herein of experimental example embodiments in the highly dynamic and loopy GI environment and in the brain (of a live being). An example approach for this type of fabrication may be appreciated with a discussion of FIG.1A with its related illustrations (FIGs.1A-1H) showing a 1D structure transformed from processing via a 2D substrate, according to certain exemplary aspects of the present disclosure, with micropatterned components into a fiber. In certain examples, such a 1D structure is developed for bioelectronic fiber devices with realization of increased compactness and deformability, higher density of electronic components, and better compatibility with biological systems. In one such experiment according to the present disclosure, to prepare such devices, microfabrication of desired electronic components is performed on a 2D film using conventional photolithography. Consistent therewith, FIG.1B is a photograph of a 1.5-μm STFD.458PCT (S23-326) 11      2D film with microfabricated devices used for preparing a high-density t-BEF. Next, the 2D film is converted into a 1D fiber using a spiral transformation approach according to the present disclosure, as in FIGs.1C and 1D. FIG.1C is a photograph of a high-density t-BEFs (250 μm) which contains 150 sensors as 81 pressure and 69 electrochemical sensors, indicating a dramatic increase in density of devices per unit width follows the transformation from 2D to 1D (by way of a density of 150 components per 3 cm width to 150 components per 250 μm diameter), and with zoom in to show the sensing components in part i and part ii. FIG.1D is a microscope image of the t-BEF presented in FIG.1C and showing parts of the interconnects and some surface sensors. The obtained fibers are soft and they can be stitched into fabric, knotted, bent, and stretched as shown in the photograph of the fiber of FIG.1E (showing the softness and flexibility of such bioelectronic fibers which allow them to be stitched in fabric, knotted, bent against an gelatin gel, and stretched). In certain processing such as discussed herein, the fiber diameter depends on the length and thickness of the 2D film, and its stiffness can be controlled by tuning the diameter or selecting different backbone materials. More specifically, FIG.1F is a schematic illustration that describes the 2D film dimensions and transformation process, which can be used to control the dimension of the final fiber, and FIG.1G is a diagram showing measured (emphasized (or red) circles near the dotted graph lines ) and calculated fiber diameters as a function of 2D film thickness and length as in FIG.1F, with the measured diameters being slightly higher than the calculated diameters, likely due to non-ideal packing in the beginning of the transformation process, which results in a larger internal diameter (n=3). FIG.1H is a diagram showing bending stiffness of fibers prepared from different types of SEBS (with different Young’s modulus: 1.2, 7.7, and 50.0 MPa) or varying 2D film thicknesses (which resulted in different fiber diameters: 0.18, 0.27, and 0.36 mm; n = 4). Notably, besides the high density that can be readily achieved by standard microfabrication on 2D films, the spiral transformation further boosts the density of components (per unit width) by up to 2 and 3 order of magnitude. For example, the 250 μm fiber shown in FIG.1D is obtained from a 3-cm-wide 2D film with 150 micropatterned sensing components as in FIG.1B. The component density per unit width changed from 150 / 30 = 5 mm -1 to 150 / 0.25 = 600 mm -1, giving a gain in density / width of 120. With reference to FIGs.2A-2F, one example of the transformation process can be understood by dividing the approach into two main parts: (i) forming the core of the fiber (FIG.2A) and (ii) rolling the fiber (FIG.2B). In the first part or step, the core is created by scraping against the edge of the 2D film, which collapses and / or wrinkles on itself and forms STFD.458PCT (S23-326) 12      a ‘fibrous’ structure that can be used to initiate the rolling process. Such collapsing and / or wrinkling is readily apparent in the fabricated 1D structure (e.g., as indicated in various ones of FIGs.1A-1F and FIGs.2A-2F). This process depends on the thickness of the 2D film and its mechanical properties. Thin, soft, and highly self-adhesive films allow for easier core formation. In the second part or step, the transformation involves rolling the film to achieve the final fiber. The rolling process may be stopped before approaching the wire contact area to allow for easy connection with an external flat cable. Where appropriate in certain examples, the rolling of the fiber can be performed with a blade to ensure tight contact between layers. FIG.2B also schematically illustrates (along with the rolling process) the forces involved in the process, wherein Fadh-msis the adhesion between the film and the moving substrate, Fadh-ssis the adhesion between the film and the stationary substrate, Fadh-self. is the self-adhesion of SEBS (or the other used elastomers), Frollingis the force applied on the fiber to maintain the rolling procedure, Fres represents forces that resist the rolling process (e.g., friction with the stationary substrate, rolling resistance due to fiber deformation, etc.), and Fcompis the compressive force generated by the moving stage to help maintain good adhesion between the layers and prevent sliding. In certain of the experimental example embodiments, optimization of this process was used to achieve densely packed fibers with intact shape and structure as in the microscope images of FIG.2C showing the rolling process under varying conditions. Styreneethylene butylene styrene copolymer (SEBS) was employed as the main stretchable substrate due to its self-adhesive properties, which were used for both steps. While the adhesion between SEBS layers is sufficient to preserve and bond the rolled structure, an azide cross-linker, bis(6-((4- azido-2,3,5,6-tetrafluorobenzoyl)oxy)hexyl) decanedioate, was also incorporated for further stabilization by thermal or UV cross-linking. Other elastic materials such as styrene butadiene styrene copolymer (SBS) may be used successfully to prepare fibers according to the present disclosure (in certain examples, the post-processed (e.g., rolled) fiber can be made from a variety of elastic materials not limited to styrene copolymers such as styrene-ethylene-butylene-styrene copolymer, poly(styrene-butadiene-styrene), styrene-isoprene-rubber), silicones, polyurethanes, acrylic block copolymers). In certain examples, the rolled structure can be made of flexible materials such as polyimide, polyethylene terephthalate, polycarbonate, and PMMA, combined with an adhesive layer. STFD.458PCT (S23-326) 13      The versatility of the transformation method could be used to prepare fibers with different dimensions and device layouts. For example, FIG.2D is a set of 2D layout designs and the corresponding fibers showing the versatility and control offered by such a transformation method according to the present disclosure. Outperforming previous methods, the exemplary methods disclosed herein offer precise control over the longitudinal, angular, and radial component position. Some components can be positioned on the surface while others can be embedded inside the fiber based on their intended functions. It also provides control over the shape of fibers, and can readily allow the incorporation of additional functions, such as fluid delivery using hollow fibers or light transmission by integrating an optical fiber into the core. For example, FIG.2E depicts a pair of images showing advanced functions that can be integrated into the fiber and these may include light guiding using a fiber with an optical waveguide core (left) and fluid delivery using hollow fibers (right). Additionally, this method can be extended to flexible substrates such as polyimide. However, unlike self-adhesive elastic materials, flexible substrates require an additional adhesive layer to help preserve the rolled structure. The experimental efforts created electronic polyimide fibers containing multiple electrical resistors. The change in resistance after transformation was negligible, confirming the compatibility of the transformation process with non-stretchable substrates. As an example, FIG.2F shows an example extension of the exemplary transformation method to flexible substrates, with preparation of polyimide fibers with multiple micropatterned resistor components and measured resistance before and after the rolling process (no damage is caused to the thin flexible film during the transformation process). As more-specific examples also according to the present disclosure, certain specific methods in this regard are directed to apparatus and methods pertinent to the biomedical fields, including: development of different types of endoscopes based on aspects of the present disclosure; less-expensive and more-advanced gastrointestinal manometry devices (for indicating how well the esophagus can perform peristalsis) with realization of more accurate and additional sensing functions and / or stimulation functions; development of electronic sutures for wound healing monitoring and acceleration; and integration of electronics on existing 1D devices (guidewires and biopsy needles). In addition, other specific examples also according to the present disclosure are directed to apparatus and methods pertinent to the biomedically-related fields involving wearables and / or electronic- textile technologies, for example, with fiber-related aspects according to the present disclosure being used as building block of (e.g., advanced) electronic textiles and / or STFD.458PCT (S23-326) 14      wearables technologies. As a specific example, according to certain other examples of the present disclosure, by using and / or integrated aspects as such, high-density electronic components are developed for body monitoring, on-body signal processing and signal (and related function) manipulation, and subsequent computer-based data processing. As a specific example of such subsequent computer-based data processing, biomedically-related data collected using such fiber-based aspects are assessed and correlated with previously-known information regarding the subject being (e.g., wearer of the related apparatus or technology) or regarding other subjects (e.g., category of subjects fitting a certain set of demographics) or related to the subject from which the data is collected. One more-specific example in this already-specific context according to the present disclosure is in continuous monitoring of human and animal performance in sports and other motoric activities; e.g., with the technology used in connection with an implant or a wearable sensing device such as a cardio / pulmonary electronic sensor which uses small changes in strain, pressure and / or in capacitance to indicate a change in cardio / pulmonary function of the subject, and using such fiber-related aspects of the present disclosure in connection with interconnects to (and / or in combination with) such strain-related, capacitance-related and / or pressure-related sensors as disclosed in Appendix A, Appendix B, Appendix C and / or Appendix D of the underlying U.S. provisional application. In certain experimentally-based example embodiments according to the present disclosure, specific fabrication methods have been used to create soft bioelectronic fibers for monitoring physiological signals and electrical stimulation in the gut, as well as recording single neural signals in the brain. While the focus of certain of these experimentally-based example embodiments, and related demonstrations, has been on in-body implantation, the efforts (and related findings) are applicable to use and implementation with apparatuses (e.g., devices, systems, etc.) and methodologies applicable to a wide range of technologies and applications, including without limitation, smart fabrics, textiles, wearables, and soft robotics. In more specific examples, such aspects involve electronic devices and material- based sutures, long-term neural recording, suturable fibers for gut stimulation, and electronic device to alleviate irregular bodily functionality including as examples irregular heart rhythm (e.g., among other cardio- and / or pulmonary-related functions), constipation and / or incontinence bio-functions, as one or more of these specific examples may be achieved by sensing the biomedically-specific functionality of the subject (e.g., electronic device implanted near or on a membrane of the subject to sense indication of constipation or STFD.458PCT (S23-326) 15      incontinence, and in response to actuate (e.g., via another implanted device) or stimulate muscle / membrane tissue. Discussion now turns to experimental examples involving multifunctional t-BEFs for deployment in the gut.1D structures are ideal for insertion into orifices and tubular structures in the human body. In accordance with certain of the experimental efforts, the GI tract is chosen as an example because of its tortuous structure and continuous contractions, something that benefits from use of soft and highly deformable devices. The experimental efforts started with the development of multifunctional t-BEFs with several GI-relevant functional components including strain / pressure and serotonin sensors as well as electrical stimulation electrodes. Eutectic gallium indium (EGaIn) was used as the conductive interconnects due to its high conductivity and stretchability. The sensing components were all prepared from laser-induced graphene (LIG). A double network of poly(3,4- ethylenedioxythiophene) polystyrene sulfonate (PEDOT-PSS) and poly(ethylene glycol)- block-poly(propylene glycol)-block-poly(ethylene glycol) (PEG-PPG-PEG) was used for preparing the electrical stimulation electrodes due to its high conductivity, low surface impedance, and good stretchability. All electrical components were tested and characterized in-vitro. Pressure and / or strain sensors according to the present disclosure were based on LIG-based piezoresistors that change their resistance as a function of applied tensile and / or compressive forces. The experimental efforts recorded good and reversible responses for forces between 0.1 – 2 N. Pressure sensing t-BEFs provided excellent longitudinal mapping of forces, detection of progressive forces, as well as information of curvature at various locations along the fiber. All could potentially be relevant to studying the biomechanics of the GI tissue. For serotonin sensing, LIG-based electrodes were used with chronoamperometry or cyclic voltammetry. Good sensitivity (0.332 nA nM -1 ) and an estimated detection limit of ~24 nM were obtained. For stimulation, the low impedance of the PEDOT-PSS-based electrodes enabled the achieving of high stimulation currents (< 5 mA) under low voltages (< 4V). Finally, the experimental efforts also demonstrated the possibility and capability of adding more components to the fiber such as pH sensors. As indicated in the results of these experiments, t-BEFs are superior candidates for insertion in the GI system due to their high softness and isotropic deformability. This is supported, for example, by the observation of negligible motility disruption after inserting a fiber (250 μm in diameter and 1.7 MPa modulus) into isolated mouse colon (ex-vivo). Moreover, the presence of fiber into the colon of awake mice (in-vivo) has not shown any STFD.458PCT (S23-326) 16      adverse effects on its behavior. In contrast, insertion of polyimide rectangular films polyimide (a common plastic material used for implantable devices, 38 which has a modulus of > 1GPa) led to significantly less or retarded movements and clear hematochezia (i.e., blood appearance in stool pellets). These findings were further supported by histological images. To highlight the multifunctionality and the longitudinal capabilities of the t-BEF, the experimental efforts demonstrated simultaneous ex-vivo colonic motility sensing and stimulation in mice. GI t-BEF with distributed pressure sensors could detect temporal and spatial motility signals with high precision. Notably, natural spatially-progressing contraction events were observed and detected during the experimentation. Surface electrodes on the t- BEF were used to electrically stimulate the GI tissue, using a previously reported biphasic stimulation method. Under stimulation, an increase in motility events was observed from the responses of distributed piezoresistive sensors. This led to a significant increase in motility index (defined as the average area under recorded motility peaks per one minute) calculated from the sensory output of the t-BEF according to the present disclosure. Video analysis during the experimentation, according to the present disclosure, also confirmed larger changes in colonic diameter as well as higher frequency of events detected under stimulation, including both slow waves and colonic migrating motor complexes (CMMCs). Additional colonic motility tests were performed using the GI t-BEF in-vivo in mice both under anesthesia and in freely moving awake animals. To validate the potential application of t-BEFs, according to the present disclosure, in larger animal models, sensing and modulation functions were performed in the small intestine of the pig species. First, for natural motility sensing, a t-BEF with a 10 cm sensing length was inserted in the small intestine via laparotomy. FIGs.3A-3L is a set of diagrams illustrating certain exemplary aspects of this functionality (demonstration of the bioelectronic fibers in pigs), wherein FIGs.3A-3B show the deployment of t-BEF into the small intestine of pig, which was used for monitoring and modulating GI signals. In this experimentation, natural motility patterns were observed and recorded. FIG.3C is a recording of natural motility in the small intestine using a t-BEF with 8 pressure sensors. Progressive motility signals (marked in yellow, see e.g., S6 plot line) were observed showing an estimated speed of ~ 0.5 mm / sec. Noteworthy, the t-BEF (300 um) was ~50-fold smaller than the diameter of the intestine but it still was able to provide reliable sensing of motility signals. Next, the experimental efforts involved designing bifunctional t-BEFs for motility sensing and stimulation. FIG.3D is a schema showing the 2D design of bifunctional STFD.458PCT (S23-326) 17      t-BEF used for simultaneous motility sensing and stimulation. FIG.3E is a photograph showing the t-BEF obtained from the 2D design shown in FIG.3D. The response of pressure sensors to contractions induced by stimulation is shown in FIGs.3Fand 3G. More specifically, FIG.3F shows pressure sensor output in response to different stimulation voltages (n=7), with the pressure sensor located at the center of the stimulation electrode, and FIG.3G is a summary of the maximum response obtained under stimulation at different voltages. A threshold of 2V was required to induce noticeable contraction signals. This bifunctionality allowed the experimentation to demonstrate successfully a closed-loop feedback programmable stimulation. FIG.3H is a schematic illustration showing the use of distributed stimulation electrodes to induce programmable contraction events over long intestinal segments. Distributed stimulation electrodes were used to stimulate specific parts of the tissue and to program the progression of contraction - similar to the naturally generated contraction. At the same time, distributed pressure sensors provided feedback about the location and progress of contractions, as in FIG.3I showing the closed loop feedback system for programmable stimulation, wherein stimulation of the pig intestine at different locations generates progressive contractions similar to the natural motility patterns, and distributed pressure sensors provide feedback about the location and progress of contractions.. This system can be used for real-time optimization of electrical stimulation. The use of laparoscopically delivered t-BEFs was then demonstrated for electrochemical sensing of serotonin in the small intestine of pig, with FIG.3J schematically illustrating the use of SSRI injection to induce serotonin release inside the intestine. Using amperometry, changes in serotonin concentrations could be detected following the injection of selective serotonin reuptake inhibitor (from SSRI). Cyclic voltammetry was used to verify the existence of serotonin peaks. FIG.3K charts drug-induced luminal serotonin concentration change using an SSRI solution and PBS as control (n = 7). FIG.3L charts electrochemical sensing of SSRI-induced serotonin using cycling voltammetry. Certain embodiments and experimentation successfully realized recorded high density t-BEFs for single neuron recording. Single-unit neuronal recordings requires exceptional electrical characteristics, including low interfacial impedance, small diameter, and high-density recording pads, high shunt impedance from the dielectric, and low cross- coupling from the electrode traces. The experimental efforts satisfied all these requirements using high-density t-BEFs according to the present disclosure. The fibers were prepared from STFD.458PCT (S23-326) 18      styrene butadiene styrene copolymer (SBS) as a substrate and encapsulation and the double network of PEDOT-PSS and PEG-PPG-PEG for the recording microelectrodes. The microelectrodes according to the present disclosure showed very low impedance and high stability for at least for 1 month. The SBS encapsulation provides great insulation properties and was also stable under PBS solution for at least 1 month. With the experimental efforts, a 32-channel 2D film was designed and fabricated with 20 μm x 20 μm PEDOT-based recording sites that was then transformed into the final neural t-BEF. See FIGs.4A and 4B, respectively as a schematic Illustration image showing the design of the 2D film used for preparing neural t-BEFs. Zoom-in inset shows a microscope image of the recording area. FIG.4B is a microscope image showing the tip of the neural t-BEF with the recording PEDOT microelectrodes. The t-BEF has a 1.6 mm long recording area which contained groups of tetrodes with 40 μm pitch. Since the size may be important to minimize insertion trauma, the experimental efforts involved designing the neural t-BEF with a sharp tip (150 μm in diameter). The microelectrodes were helically distributed at the surface of the fiber to enable recording from all directions. After the transformation, microelectrodes according to the present disclosure showed good impedance range and very high yield and consistency. FIG.4C shows a distribution of impedance measurements collected from 60 on-fiber micro electrodes, showing a great yield after fabrication and transformation. To assess the t-BEF’s ability to record neuronal activity, the experimental efforts implanted the t-BEFs in various locations in the brain of mice (e.g., hippocampus and prefrontal cortex). After a week of recovery, mice were mounted onto a cylindrical treadmill for awake and head-fixed recordings. FIG.4D is a schematic illustration showing the setup used for recording neural signals in awake mice. Spontaneous spiking activity was observed, as in FIG.4E which shows plots of raw data obtained from four recording electrodes showing some spontaneous neural spike (with the data being spike sorted using Kilosort2.43). Eight well-isolated single units were identified as indicated by the low fraction of interspike interval (ISI) violations (<0.3) and a high signal- to-noise ratio (SNR) of 5.01. Single units appeared across multiple channels due to the high density as shown from the spike triggered averages, and the waveform shapes were well separated in UMAP space. Additionally, sharp wave ripples (SWR) were detected, with short oscillatory bursts between 125– 200 Hz in the hippocampus, which are associated with memory consolidation and memory retrieval. FIG.4F is an overlay of hundreds of spikes collected by the neural t-BEF (four different units shown as detected by 3 different tetrodes), FIG.4G are four correlograms showing the probability of a second firing after an initial spike, and FIG. STFD.458PCT (S23-326) 19      4H are ISI violations. FIGs.4I-4J are sharp wave ripples (SWR) detected in the hippocampus. The spectrogram exhibits the stereotypical increase in power, and observed was ripple propagation longitudinally across the fiber with stronger engagement in the CA1 and CA3 regions. FIGs.4K-L are spectrograms showing the stereotypical increase in power, including observed ripple propagation longitudinally across the fiber with stronger engagement in the CA1 and CA3 regions. In connection with other specific example of a rolling process for transformation of a 2D structure according to the present disclosure, the following steps are carried out. A 2D film (ranging from 10 nm to 10 millimeters in thickness) is rolled into a 1D structure ranging from a few microns to tens of millimeters in diameter. The core could be designed by rolling around a pre-formed fiber, wire, optic fiber, or tube (e.g., a dissolvable core could be used to create one or more such tubes or internal structure). The core may be a structure that is micropatterned on the 2D film, and the rolling process could be performed using a flat or non-flat structure (e.g., a flat 2D slide (moving stage, see FIGs.5A-5F) such as using glass, metal, plastic and / or a cylindrical roll. Surface modification of the moving and stationary stages (as in FIGs.5A-5F) may be used to facilitate smooth rolling and essentially perfect layer packing. Off center rolling could be used to create sharp tips. FIGs.5A-5F are a set of diagrams illustrating certain exemplary aspects of the present disclosure, wherein FIG.5A is a schematic illustration showing the first part of the transformation process where a 2D film is scraped to form a core which can be later used for rolling. FIG.5B is a schematic illustration showing the rolling process and the forces involved in the process, the adhesion between the film and the moving substrate, the adhesion between the film and the stationary substrate, and the self-adhesion of SEBS (or the other used elastomers). Frollingis the force applied on the fiber to maintain the rolling procedure, Fresrepresents forces that resist the rolling process (e.g. friction with the stationary substrate, rolling resistance due to fiber deformation, etc.), and Fcompis the compressive force generated by the moving stage to help maintain good adhesion between the layers and prevent sliding. FIG.5C shows optimization of the rolling process by tuning different parameters (as may be indicated throughout the present disclosure), and Fcomp. FIG.5D depicts interlayer intimate bonding following the thin film transformation using thermal annealing. FIG.5E is an image of off-center rolled fiber showing the densely packed layers. FIG.5F is a fiber cross-section showing the well-bonded layers due to the self-healing property of the elastic substrate. STFD.458PCT (S23-326) 20      In related experiments according to the present disclosure, ultra-high-density fibers were also successfully implemented with fibers having a 230 micron diameter and having 1280 channels thereupon. FIGs.6A-6H are a set of diagrams illustrating certain exemplary aspects of the present disclosure directed to a high-density electrical-recording fiber, wherein FIG.6A is photograph of 2D film with the 1280 channels before rolling (part i showing a zoom-on image with the 10-µm interconnects, and part ii as a zoom-on image showing the exposed recording area), FIG.6B is a microscope image of an exposed site of the film of FIG.6A and showing 10 recording electrodes, FIGs.6C and 6D are microscope images showing the 230- µm fiber obtained after rolling, FIG.6E is a cross-sectional image of the fiber showing the different rolled layers and the Au / PEDOT interconnects, with an inset showing gold-based (e.g., Au / PEDOT) traces and highlighted (red) lines in the inset mark showing some of the traces, FIGs.6F and 6G are SEM images of the 320-channel fiber, and FIG.6H is a graph with plots showing an impedance analysis of 32 channels showing a good yield after the transformation process. Accordingly, certain of the above-discussed experimental examples provide a straightforward strategy to manufacture high density and versatile bioelectronic fibers. The approach involves transforming 2D films with microfabricated devices into 1D fibers using a spiral transformation. This allows for direct utilization of conventional fabrication methods and takes advantage of various procedures already developed for devices, sensors, and circuits. The developed t-BEFs offered a substantial improvement in density of functional components compared to planar flat devices. This work demonstrates for the first time thin electronic fibers with precise control over the devices’ angular, radial, and longitudinal positions. The platform described in this work not only demonstrates exceptional softness but also surpasses existing electronic fibers in terms of size, density, and functionality. Moreover, GI t-BEFs according to the present disclosure exhibit numerous advantages over other motility sensing probes currently available for the GI tract. In the context of neural recording, t-BEFs according to the present disclosure exhibit unprecedented softness when compared to existing microelectrode arrays. While the focus of various demonstrations according to the present disclosure have primarily been on in-body implantation, these findings hold significant potential for a wide range of applications, including smart fabrics, textiles, wearables, and soft robotics. Discussion now turns to some of the materials used in connection with the above- disclosed, experimental example embodiments and aspects. Four types of Tuftec™ SEBS STFD.458PCT (S23-326) 21      (H1062, H10521, H1052, H1221) were obtained from Asahi Kasei. Poly(3,4- ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT PSS, product # 739332), SBS (product # 182877), poly(ethylene glycol)-block-poly(propylene glycol)-block-poly(ethylene glycol) diacrylate (PEG-PPG-PEG DA, product # 915858), lithium phenyl-2,4,6- trimethylbenzoylphosphinate (product # 900889), phenylbis(2,4,6- trimethylbenzoyl)phosphine oxide (BAPO, product # 511447), pentaerythritol tetrakis(3- mercaptopropionate), (PETMP, product # 381462), dimethyl sulfoxide (DMSO, product # 276855), nitric acid 25% (product # 1.60317), EGaIn (product # 495425), AgNO3 (product #209139), KNO3 (product # 221295), FeCl3 (product # 157740), PVB (product # P110010), dextran (product # 31417), Nafion™ 117 containing solution (product # 70160), and aniline (product # 242284) were obtained from Sigma-Aldrich, USA. Photoresist (AZ®1512) was obtained from MicroChemcials, and UK. Microposit™ Developer MF-CD-26 was obtained from Micro Resist Technology GmbH, Germany. Polyimide solution (PI2611) was obtained from HD MicroSystem. Polyimide film (Kapton® Polyimide Film, Electrical- Grade, 12" Wide, 0.0050" Thick, 12" Long) was obtained from McMASTER-CARR. With regards to fabrication and characterization, the above-disclosed, experimental example embodiments and aspects involved preparation and transformation of 2D films into fibers. A water solution of dextran was spin-coated (50 mg / ml, 1000 rpm, 1 min) on a plasma treated Si wafer and baked at 150 °C for 5 min. Then, a toluene solution of SEBS was spin coated and followed by baking at 130 °C for 10 min. Different SEBS concentration (150 mg / ml, 100 mg / ml, and 50 mg / ml) were used to prepare 2D films of different thicknesses. Different types of SEBS (H1062, H10521, H1052, H1221) were used to create films of varying moduli. The 2D film was then released from the Si wafer by immersion in water for 1 hr and then transferred to an octadecyltrichlorosilane (OTS)-treated Si. The sample was then dried under 70 °C for 1 hr. The edges were cut using a laser cutter. The transformation process then started by forming the core of the fiber using a glass slide to scrap against the edge of the film. Once a 30-50 micron core was achieved, the rolling process is started using a glass slide as a moving stage to obtain the final fiber. The fiber was annealed under vacuum at 100 °C. To control the adhesion between the 2D film and the stationary substrate, OTS or plasma treated Si wafers were used. The rolling process could not properly proceed on the plasma treated Si as it led to 2D film tearing. To control the adhesion between the moving stage and the forming fiber, plasma treatment was used. In addition, manual normal pressure was controllably applied during the rolling process to tighten the packing of the different STFD.458PCT (S23-326) 22      layer of the fiber. High adhesion (between moving stage and the fiber core) and lower pressure led to fiber sliding and improper fiber rolling. The above-disclosed, experimental example embodiments and aspects also involved preparation of light guiding and fluid delivery fibers. For light guiding fibers, a 2D film of SEBS was prepared as previously described. A 250 μm PMMA optical fiber (AZIMOM PMMA Plastic End Glow Fiber Optic Cable) was used as a core for starting the rolling process, skipping the scraping part of the transformation process. For fluid delivery fibers, a 2D film of SEBS was prepared and cut. Then, a film of polypropylene glycol (PPG)- based polyurethane (PPG-PU) was sprayed next to the SEBS, with a very small overlap area. The rolling process started from the PPG-PU side, which ended up in the core of the fiber. The fiber was annealed under vacuum at 100 °C, and then developed in acetone to dissolve the PPG- PU core and obtain a hollow SEBS fiber. The above-disclosed, experimental example embodiments and aspects also involved preparation of polyimide fibers. For polyimide fiber preparation, diluted polyimide solution (1:1.5 diluted in NMP) was directly spin coated (5000 rpm, 1 min) on an OTS treated Si wafer. PPG-PU (50 mg / ml in IPA) was then spin coated (2000 rpm, 1 min) as an adhesive layer. SEBS or PPG-PU were sprayed at the edge of the 2D film to be used for forming the fibrous core for rolling. This step was necessary since polyimide films could not be scraped into a fibrous core, as previously described with the elastic films. The above-disclosed, experimental example embodiments and aspects also involved LIG preparation and characterization. Direct laser carbonization of a polyimide substrate was used to generate LIG, which constitutes the main sensing component. Kapton films were laser engraved by an Epilog Fusion M2 CO2 Laser following a reported method on laser-induced graphene. A laser power of 7.5 W was used with a raster speed of 30 %. For morphological and compositional characterization of LIG, SEM images were taken by a FEI XL30 Sirion SEM (5 kV). The LabRAM HR Evolution microscope (HORIBA Scientific) was used for Raman spectroscopy with 532 or 633 nm excitation and a 1,800 grooves mm–1 grating. The above-disclosed, experimental example embodiments and aspects also involved mechanical property characterization. Mechanical properties of the bioelectronic SEBS fibers were studied using Instron 5565 with a 100-N loading cell. Samples with different diameters (e.g., from 150 μm to several hundred μm such as 180 μm, 350 μm, and 550 μm) or made of different types of SEBS (H1062, H1052, H1051, H1221) were tested. The samples were glued between compression plates. The length of the fiber was measured STFD.458PCT (S23-326) 23      by a caliper. The thickness was measured by an optical microscope. A strain rate of 10 mm / min was used for mechanical testing. The above-disclosed, experimental example embodiments and aspects also involved electrical and mechanical property characterization of EGaIn. To measure the conductivity of the EGaIn electrodes during stretching, samples were attached to a homemade stretching station attached to an LCR meter (Keysight Technologies E4980). Silver epoxy was used to make contacts. The contact area was sealed with Torr Seal® epoxy to avoid strains on that area. EGaIn traces with a size of 0.5×20 mm2were used to measure the resistance under stretching from 0 – 50 % in 5% steps. The above-disclosed, experimental example embodiments and aspects also involved preparation of the GI t-BEFs. Dextran (50 mg / ml) in water was spin-coated (1000 rpm, 1 min) on a Si wafer and baked under 150 °C for 5 min. Then, SEBS (80 mg / ml) with 4% (w / w) azide-based cross-linker, bis(6- ((4-azido-2,3,5,6-tetrafluorobenzoyl)oxy)hexyl) decanedioate, in toluene was spin-coated (1000 rpm, 1 min). This was followed by 10 min baking under 150 °C. The desirable functional components (LIG and PEDOT-PSS sensing / stimulation interfaces and EGaIn interconnects) were then patterned on the SEBS film (described in detail in the next section). Finally, the patterning of the SEBS encapsulation layer was done using spray coating (1 ml of 25 mg / ml SEBS solution) through a shadow mask. The film was annealed at 135 °C under vacuum for 5 hr. The 2D sheet containing functional components was released from the Si wafer by immersion in water for 1 hr and then transferred to an OTS-treated Si. The sample was then dried under 70 °C for 1 hr. The edges were cut using a laser cutter and then the film was manually rolled using a glass slide. The connection area was kept unrolled for subsequent connection with a flexible flat cable. After connection and sealing, the fiber was subjected to further modifications such as silver and PANI electrodeposition, immersion in FeCl3, and coating with PVB and Nafion (fully described in the next section) for obtaining the desirable sensing components. The fibers were annealed under vacuum at 100 °C before use. The above-disclosed, experimental example embodiments and aspects also involved EGaIn interconnects patterning. Photoresist was spin-coated (2500 rpm for 45 sec) on a spin-coated SEBS substrate and followed by light exposure (385 nm) using Durham Magneto Optics ML3 MicroWriter. After light exposure^ the photoresist was developed for 1 min. Then, Gold (30 nm) was thermally evaporated on the surface to provide an adhesion layer between EGaIn and SEBS. EGaIn was screen-printed onto the surface using PDMS. This process is repeated multiple times until smooth EGaIn film is obtained. The sample was STFD.458PCT (S23-326) 24      immersed in acetone for 30 min and followed by 30 sec of sonication. This was repeated until the photoresist layer was completely removed. The above-disclosed, experimental example embodiments and aspects also involved preparation and characterization of pressure / stain sensors. LIG was transferred from the polyimide substrate to the 2D SEBS film by applying pressure and shear forces with a metal spatula. Then, EGaIn interconnects were patterned to form resistors for use as piezoresistive pressure / strain sensors and followed by spray coated SEBS encapsulation. After film release and rolling, the sensors ended up in the desired position on the fiber. With such devices, the LIG network deforms under applied forces leading to changes in resistance. The performance of these sensors was examined using different tests: i) normal force (0.1 N – 20 N) was applied directly on the sensor using a force gauge. ii). A metal cylinder was manually rolled on the fiber at different speeds to create progressing forces. iii) In-tube force sensing demonstration: the fiber was inserted into a Tygon tube (Tygon® E-3603; wall thickness: 0.062 in; external diameter: 0.5 in, modulus: 12.1 MPa). External force was applied on the wall of the tube to cause structural deformation that mimics those that happen in the intestine. The resistance was measured and correlated with the magnitude of applied forces. In each of the tests, the current (at 0.5 V) was recorded using PalmSens4 (PalmSens BV, Netherlands). The experimental example embodiments and aspects also involved preparation and characterization of serotonin sensors. A two-electrode electrochemical device was used for serotonin sensing. The working electrode was based on LIG embedded on the surface of SEBS (prepared by transferring from polyimide). Nafion was electrodeposited onto the serotonin sensing electrodes to minimize the effect of interfering molecules (e.g. ascorbic acid) according to previously-reported methods. Briefly, the electrodes were immersed in Nafion solution under a constant voltage (1V) against a commercial reference electrode for 30 seconds. The electrodes were washed with water and dried at 100oC for 10 min. For the reference electrode (located at the tip after fiber rolling), Ag / AgCl based electrode was prepared by silver electrodeposition on LIG from an aqueous solution of 5 mM AgNO3 and 1 M KNO3. The LIG surface electrode was dipped into the electrodeposition solution. The potential was then swept from −0.9 to 0.9 V versus an Ag electrode for 20 segments at a scan rate of 0.1 V s -1.47. After washing with water, the surface of silver was immersed in FeCl3solution (3M) to form AgCl. Finally, the electrode was covered with a PVB layer for stabilization by dipping in a methanol solution of PVB (50 mg / ml). After transforming the 2D film into fiber, on-fiber serotonin sensors were characterized in vitro using STFD.458PCT (S23-326) 25      chronoamperometry (at 0.5 V) or cyclic voltammetry (-0.4 to 1.3 V, 10 V / sec, 0.001 V step) under different concentration: 100, 200, 400, and 800 nM. To test the effect of bending on serotonin sensing, the response to serotonin at different concentrations (0, 1 μM and 2 μM) was monitored in the flat state and after bending the fiber around a plastic tube with 2 mm radius. The experimental example embodiments and aspects also involved preparation of and characterization pH sensors. For pH sensing, a potentiometric setup was used with a two- electrode cell. The working electrode was based on polyaniline (PANI)-modified LIG. PANI was electrodeposited using a previously reported method. The previously-described reference electrode was used also here. The pH dependence was measured as PANI known to be sensitive to pH due to different degree of doping. This intrinsic sensitivity was used to translate pH values to changes in open-circuit potential (OCP). The pH sensor was characterized in buffer solutions with varying pH values ranging from 3-10. The OCP was measured for 30 sec in each solution. The measurement was paused while transferring the electrodes from one solution to another. The above experimental example embodiments and aspects also involved preparation and characterization of PEDOT-PSS-based stimulation electrodes. A solution of PEDOT-PSS, PEDOT-PSS (1.1% in H2O), PEG-PPG-PEG DA, and lithium phenyl-2,4,6- trimethylbenzoylphosphinate (100 : 1 : 0.05 wt%, respectively) was prepared and stored in the fridge.10 μl of fluorosurfactant (Capstone™ FS-30) and 50 μl of DMSO were added to each 1gr of solution before use. The final mixture was sprayed (0.5 ml) on the surface through a laser-cut shadow mask to obtain the stimulation interface. The film was cured under UV (American Ultraviolet, Inc.) for 20 min and then baked for another 10 min under 135 °C. The film was immersed in methanol for 1 min and then baked at 135 °C for 2 min. The film was then immersed in nitric acid (25%) for 30 sec, washed with water, and dried on a hot plate (135 °C) for 1 min. EGaIn was then patterned to form the interconnects and followed by encapsulation with an SEBS layer by spray coating. For characterization, two PEDOT-PSS based stimulation electrodes were immersed in PBS. Impedance was measured from 1MHz to 1Hz. Stimulation currents were also measured under biphasic stimulation conditions: 5 ms pulse duration at different 0.5, 1, 2, and 4 Volts (V). The above experimental example embodiments and aspects also involved preparation of the neural t-BEFs. Dextran (50 mg / ml) in water was spin-coated (1000 rpm, 1 min) on a Si wafer and baked under 150 °C for 5 min. Then, SBS (80 mg / ml) with 4 wt% PETMP, and 4 wt% BAPO, 34 in toluene was spin-coated (1000 rpm, 1 min). The film was STFD.458PCT (S23-326) 26      cured under UV for 1 min. This was followed by 10 min baking under 135 °C. The film was cooled down and immersed in toluene for 3 min to remove any unreacted residues. This was followed by 2 min baking at 135 °C and plasma treatment. PEDOT-PSS based electrodes were then patterned. The previously described PEDOT-PSS solution was spin coated (1000 rpm, 90 sec) on the plasma-treated SBS film. The film was cured under UV for 20 min and then baked for another 10 min under 135 °C. The film was immersed in methanol for 1 min and then baked at 135 °C for 2 min. A very thin layer of SEBS was spin coated (10 mg / ml in toluene, 2500 rpm, and 1 min) to achieve a better adhesion between the PEDOT and the subsequent photoresist layer. After baking (135 °C, 1 min), a photoresist layer was spin coated (2500 rpm, 45 sec), followed by light exposure (385 nm, 90 mJ / cm2) using Durham Magneto Optics ML3 MicroWriter, and then development for 45 sec. The exposed PEDOT layer was etched using plasma etching (March Instruments PX-250 Plasma Asher, 150 W , 250 sec). The film was immersed in acetone for 30 seconds under sonication to remove the photoresist layer and followed by development with cyclohexane for removing the remaining SEBS. The PEDOT-PSS electrodes were then immersed in nitric acid (25%) for 30 sec, washed with water, and dried on a hot plate (135 °C) for 1 min. SBS was then directly photopatterned for encapsulation. Briefly, SBS solution (80 mg / ml in toluene) was spin coated and exposed using ML3 MicroWriter (385 nm, 350 mJ / cm 2). The film was baked for 2 min at 90 °C and then developed using cyclohexane under spinning (2500 rpm, 45 sec). This step was repeated to achieve a double layer of SBS encapsulation with a total thickness of 3.2 micron. The film was baked at 135 °C for 10 min. The 2D sheet containing all recording electrodes was released from the Si wafer by immersion in water for 1 hr and transferred to an OTS-treated Si. The sample was then dried under 70 °C for 1 hr. The edges were cut using a laser cutter. After cutting, the film was manually rolled using a glass slide. The film has a varying width (with the smallest width at the recording area), which led to a fiber with a thinner tip. The connection area was kept unrolled for subsequent connection with a flexible flat cable. After connection and sealing, the fibers were annealed under vacuum at 100 °C for overnight before use. Impedance tests were also used for the above experimental example embodiments and aspects. For long term size-dependent impedance test, four sizes of PEDOT electrodes were prepared (25 μm x 25 μm, 50 μm x 50 μm, 100 μm x 100 μm, and 200 μm x 200 μm). Impedance was measured versus a commercial platinum wire from 1MHz to 1Hz. This test was done at different time points after immersion (immediately, 1 week, 2 weeks, and 1 month). For the encapsulation test, fully encapsulated (a double layer 3.2-micron-thick STFD.458PCT (S23-326) 27      SBS) PEDOT-PSS based electrodes were used. Impedance was measured versus a commercial platinum wire from 1MHz to 1Hz to show the robustness of the encapsulation. This test was also done at different time points (immediately, 1 week, 2 weeks, and 1 month). For the fiber microelectrodes impedance test, the impedance of the 32 on-fiber microelectrodes was measured in PBS solution versus a platinum wire electrode from 1MHz to 1Hz. Such experimental example embodiments and aspects also involved gastrointestinal studies and in-vivo motility sensing and stimulation in anesthetized pigs. All surgical procedures for mice and pigs were performed in accordance with protocols (32497, 32778, and 31893) approved by the Institutional Animal Care and Use Committee (IACUC) at Stanford University. Female juvenile Yucatan miniature pigs (Sus scrofa) aged 6–9 weeks and weighing 10 kg from breeder S&S Farms (Ramona, CA) were used in this study. All pigs were fasted overnight, placed under general anesthesia using vaporized isoflurane and connected to vital-sign monitors during this terminal procedure. A midline laparotomy incision was made to expose the viscera. Krebs / PBS buffer was infused into the porcine intestine to flush the contents before sensing. The ligament of Treitz was identified to locate the duodenum and jejunum and the ileocecal valve was found to designate the ileum. For recording natural motility, a soft 10-cm long fibers holding 8 pressure sensors was inserted within the lumen of the small intestine through an ostomy, for continuous live recordings. Natural motility was very infrequent and unpredictable due to the effect of anesthesia. For studying electrical stimulation, bifunctional fibers, with 5 stimulation electrodes and 5 pressure sensors, were used. Baseline motility was recorded for 30 second followed by biphasic stimulation at 2V and 4V (stimulation pulse 5 msec, stimulation period: 10 sec). This experiment was performed on three pigs and on multiple intestinal location (n=7). For the programmable stimulation, pressure sensing was done using the distributed sensors. At the same time, selective stimulation was performed at three different locations. The above-disclosed, experimental example embodiments and aspects also involved electrochemical sensing of serotonin in anesthetized pigs. Female juvenile Yucatan miniature pigs (Susscrofa) aged 6–9 weeks and weighing 10 kg from breeder S&S Farms (Ramona, CA) were used in this study. Briefly, all pigs were fasted overnight, placed under general anesthesia using vaporized isoflurane and connected to vital-sign monitors during this terminal procedure. A midline laparotomy incision was made to expose the viscera. PBS solution was infused into the porcine intestine to flush the contents. The ligament of Treitz STFD.458PCT (S23-326) 28      was identified to locate the duodenum and jejunum and the ileocecal valve was found to designate the ileum. A soft 10-cm long t-BEF with 5 serotonin sensors was inserted within the lumen of the small intestine through ostomies, for continuous recordings. Stabilization of the baseline was then performed for 10 min after the injection of PBS (0.5 ml). After 10 min, a new baseline was recorded for 1 min. SSRI solution (10 μM, 0.5 ml) was then administered upstream to the sensing area by direct injection into the lumen. Measurements were performed 10 min after the injection. This experiment was done on three pigs and on multiple intestinal segments (n = 5). Anaesthetized animals were euthanized by trained researchers at the end of the recordings. The data was collected from all 5 sensors simultaneously. However, only a few sensors were responsive; i.e., some sensors have shown no change after SSRI injection while others responded strongly. It is assumed that this may be related to the distance of the fiber from the wall of the intestine or its orientation, which was not well- controlled in this experiment and is known to affect the sensitivity to serotonin. A single sensor may not capture all changes in concentrations accurately due to its localized measurement. However, by using multiple sensors, they have the benefit of being distributed and obtain a more reliable average concentration based on multiple readings. To verify that the signal is coming from serotonin, cyclic voltammetry was used. The fiber was inserted into the intestine as described earlier. Stabilization of the baseline was then performed by continuous cyclic voltammetry (V: -0.4 to 1.3V, scan rate: 10 V / sec) for 10 min after the injection of PBS (0.5 ml). After 10 min, a new baseline was recorded which defined the background current in the intestine. SSRI solution (10 μM, 0.5 ml) was then administered upstream to the sensing area by direct injection into the lumen. Measurements were performed immediately and 10 min after injection, showing the appearance of serotonin peaks. To further prove that the peaks originate from serotonin, a solution of serotonin hydrochloride (10 μM, 0.5 ml) was injected and this resulted in the observation of the peaks (obtained after SSRI injection) which became larger. Statistical analysis was also used. For data analysis, Origin, MATLAB, and Excel were used. All replicate numbers, error bars, P values and statistical tests were indicated in the figure legends. Discussion now turns to the brain studies in connection with the above experimentation, and initially brain surgery (all experiments performed on mice were approved by Stanford University’s Administrative Panel on Laboratory Animal Care). The animal care and use programs at Stanford University meet the requirements of the relevant federal and state regulations governing the humane care and use of laboratory animals STFD.458PCT (S23-326) 29      including the United States Department of Agriculture Animal Welfare Act and the Public Health Service Policy on Humane Care and Use of Laboratory Animals. The laboratory animal care program at Stanford is accredited by the Association for the Assessment and Accreditation of Laboratory Animal Care. All mice were maintained on a reverse 12-hour dark / 12-hour light cycle (temperature: 20° to 25°C; humidity: 50 to 65%) in the Stanford University’s Veterinary Service Center and fed with food and water ad libitum as appropriate. All experiments occurred during their active cycle. Anesthesia was induced with isoflurane (4%; maintained at 1.5%). Once anesthetized, the mouse was head-fixed on a stereotactic frame (RWD) and body temperature was maintained with a heating pad (Keenovo). The eyes were protected with Ophthalmic ointment (Puralube). The skull was exposed, and a 0.5-mm- diameter craniotomy was made at the following coordinates from bregma: anteroposterior, 1.7 mm; mediolateral, 1.6 mm for the hippocampus, and anteroposterior, 2 mm; mediolateral, 0.5 mm for the prefrontal cortex. Durotomy was then performed. The fiber device was then inserted at a velocity of 0.1 mm / s to the target depth of 3 mm for both the hippocampus and prefrontal cortex, and the cranial window was subsequently filled with Kwik-Sil (WPI). A self-tapping bone screw was secured over the cerebellum as the ground electrode, and a stainless steel headbar was cemented onto the skull using dental cement (C&B Metabond). After implantation, mice were habituated to run on a treadmill for 7 days. As for electrophysiological recordings, the mice were placed on the treadmill and fixed to a headbar clamp. The probe was then connected to the data acquisition system (Intan RHS Stim / Recording System) through a custom adapter board. Electrophysiological data was collected at 30 kHz for 10 minutes. Data analysis was performed using custom software written in MATLAB 2019b (MathWorks). Spike sorting was performed using Kilosort 2.0 (https: / / github.com / MouseLand / Kilosort) with default parameters. Subsequently, quality metrics were computed and double counted spikes (within ±0.16 ms) removed using the ecephys spike sorting pipeline (https: / / github.com / AllenInstitute / ecephys_spike_sorting). Clusters were then manually curated in Phy (https: / / github.com / cortex-lab / phy). Single units were only classified as good if the ISI violations were less than 0.3, the number of spikes were greater than 200, and the presence ratio was greater than 0.9. The skilled artisan would also recognize various terminology as used in the present disclosure by way of their plain meaning. As examples, the Specification may describe and / or illustrates aspects useful for implementing the examples by way of various semiconductor materials / circuits which may be illustrated as or using terms such as layers, STFD.458PCT (S23-326) 30      blocks, modules, device, system, unit, controller, and / or other circuit-type depictions. Such semiconductor and / or semiconductive materials (including portions of semiconductor structure) and circuit elements and / or related circuitry may be used together with other elements to exemplify how certain examples may be carried out in the form or structures, steps, functions, operations, activities, etc. It would also be appreciated that terms to exemplify orientation, such as upper / lower, left / right, top / bottom and above / below, may be used herein to refer to relative positions of elements as shown in the figures. It should be understood that the terminology is used for notational convenience only and that in actual use the disclosed structures may be oriented different from the orientation shown in the figures. Thus, the terms should not be construed in a limiting manner. Based upon the above discussion and illustrations, those skilled in the art will readily recognize that various modifications and changes may be made to the various embodiments without strictly following the exemplary embodiments and applications illustrated and described herein. For example, methods as exemplified in the Figures may involve steps carried out in various orders, with one or more aspects of the embodiments herein retained, or may involve fewer or more steps. Such modifications do not depart from the true spirit and scope of various aspects of the disclosure, including aspects set forth in the claims. Accordingly, in the following description various specific details are set forth to describe specific examples presented herein. It should be apparent to one skilled in the art, however, that one or more other examples and / or variations of these examples may be practiced without all the specific details given below. In other instances, well-known features have not been described in detail so as not to obscure the description of the examples herein. For ease of illustration, the same reference numerals may be used in different diagrams to refer to the same elements or additional instances of the same element. Also, although aspects and features may in some cases be described in individual figures, it will be appreciated that features from one figure or embodiment can be combined with features of another figure or embodiment even though the combination is not explicitly shown or explicitly described as a combination. Also, unless otherwise indicated, ranges (of any, and all metrics) are merely exemplary of “approximate ranges” wherein this term may be understood to vary the bound(s) of the range (e.g., using improved and / or degraded component-, material- or circuit-based design parameters) by a degree of anywhere from 10- to-20 percent (or in some instances) from 5-35 percent, and, in the context of comparison to STFD.458PCT (S23-326) 31      an improvement over a previously-reported effort, by a degree of improvement of 20 percent or greater. As examples, the Specification describes and / or illustrates aspects useful for implementing the claimed disclosure by way of various components, circuits or circuitry which may be illustrated as or using terms such as blocks, modules, device, system, unit, controller, and / or other component-related, circuit- related and / or material-based depictions (e.g., layers of materials including doped semiconductor materials). As a specific example, “microfabricated device(s)” is exemplified by and / or refers to one or more circuit-related components such as very-small integrated components and / or circuits (e.g., “microchips”) which are fabricated based on microcomponent unit operations (as a more specific example, “microfabricated device(s)” is exemplified by and / or refers to the process of fabricating small structures on a micrometre or smaller scale). Such components may include or refer to those as discussed hereinabove and may also include (without limitation): capacitors, resistors, electrodes, insulative materials between electrodes, circuits or micropatterned sensing components, and circuit-based structures which include one or more such components such as one or more sensors for sensing / detecting pressure, capacitance, and / or strain. Also, “high- density”, relating to aspects of fabrication according to the present disclosure, refers to or includes densities of materials, components and the like which may cover a range that is at least five time more dense, an order of magnitude more dense, and / or two-to-three orders of magnitude more dense than densities achieved by known (standard) microfabrication techniques, as such known techniques are exemplified in the disclosure of the above- referenced U.S. Provisional Application. For instance, Appendix A discusses such high density using spiral transformation according to aspects of the present disclosure as boosting the density of components (per unit width) by up to 2 and 3 order of magnitude and in one such example with the 250 µm fiber obtained from a 3-cm-wide 2D film with 150 micropatterned sensing components and with the component density per unit width changing in various degrees). Such components, circuitry and / or materials are used together with other elements to exemplify how certain embodiments may be carried out in the form or structures, steps, functions, operations, activities, etc.

Claims

STFD.458PCT (S23-326) 32      What is Claimed:

1. An apparatus comprising: 1D fiber material characterized as a fibrous structure having one or more transformations from among: a spiral, a roll and wrinkles.

2. The apparatus of claim 1, further including and being embedded within the 1D fiber material, one or more from among: microfabricated electronic components; and electronic devices.

3. The apparatus of claim 1, further including and being secured on the 1D fiber material, one or more from among: microfabricated electronic components; and electronic devices.

4. The apparatus of claim 1, further including one or more wire-contact regions, adjacent and unconnected to the 1D fiber material, configured and arranged for contacting the 1D fiber material.

5. The apparatus of claim 1, further including one or more wire-contact regions adjacent and connected to the 1D fiber material.

6. The apparatus of claim 1, further including and being integrated with the 1D fiber material, a set of one or more circuits including at least one sensor to sense parameters in response to changes in at least one of: pressure, capacitance, and strain.

7. The apparatus of claim 1, further including a polymer-based substrate (co-polymer such as SEBS) with self-adhesive properties and at least one property in terms of: stretchability; and elasticity with a post-stretching ability to return to an original shape.

8. The apparatus of claim 1, wherein the 1D fiber material is further characterized by having a plurality of micropatterned circuit components arranged between overlapping portions of the 1D fiber material, wherein the 1D fiber material has a thickness or diameter in a range from 150 μm to several hundred μm.STFD.458PCT (S23-326) 33      9. A method comprising: providing 1D fiber material characterized as a fibrous structure having one or more transformations from among a spiral, a roll or wrinkles.

10. The method of claim 9, wherein the 1D fiber material is integrated with at least one microfabricated component or device, and the method further includes using a dissolvable rigid structure to form the 1D fiber materials and then causing the rigid structure to dissolve, and controlling positioning of the 1D fiber material in terms of at least one of: longitudinal, angular, and radial-based positioning.

11. The method of claim 9, wherein the 1D fiber material is integrated with at least one microfabricated component or device, and the method further includes controlling positioning of the 1D fiber material in terms of at least two of: longitudinal, angular, and radial-based positioning.

12. The method of claim 9, wherein the 1D fiber material is integrated with one or more interconnects and said providing 1D fiber material least one of: causing the one or more transformations; using the 1D fiber material to sense a change in at least one of: pressure, capacitance, and strain; and testing one or more conductivity attributes of the 1D fiber material.

13. The method of claim 9, wherein providing 1D fiber material includes least one of: real-time mapping of biomedical signals obtained via the 1D fiber material and from within a live being; and tissue stimulation within a live being.

14. The method of claim 9, wherein: the 1D fiber material is integrated with circuitry including at least one microfabricated component and / or device; and providing 1D fiber material includes simultaneously: real-time mapping of biomedical signals obtained via the 1D fiber material and from within a live being, and stimulating tissue within the live being, wherein the circuitry is used to facilitate said real-time mapping and said stimulating tissue.STFD.458PCT (S23-326) 34      15. A method comprising: transforming 1D fiber material into a fibrous structure having one or more characteristics from among: a spiral, a roll and wrinkles 16. The method of claim 15, further including: forming a core material from a 2D fiber material; and causing the core material to have the one or more characteristics by at least one of: spinning the core material; rolling the core material; and causing the core material to collapse on itself to provide the wrinkles.

17. The method of claim 15, wherein the 1D fiber material is integrated with one or more from among microfabricated electronic components and electronic devices, and the method further includes using the 1D fiber material for one or more biomedical functions from among: motility mapping, serotonin sensing; single neural recording from brain activity; tissue stimulation within a gastrointestinal (GI) system; and recording responses of microelectrode arrays.

18. The method of claim 15, wherein the 1D fiber material is integrated with one or more from among microfabricated electronic components and electronic devices, and the method further includes using the 1D fiber material for one or more biomedical functions from among: monitoring physiological parameters or responses of a live being; and introducing or causing bio-modulation within a curved or confined region of a live being.

19. The method of claim 15, further including using a core material-based structure to transform or roll the 1D structure wherein the core includes one or more of the following: a 1D fiber, a 1D hollow fiber, and a micro patterned structure placed at the edge or above the edge of a 2D structure or sheet that is subsequently formed or into a structure that corresponds to the 1D fiber material.

20. The method of claim 15, wherein the 1D fiber material is integrated with one or more circuit elements from among microfabricated electronic components and electronic devices, and the method further includes using a microfabrication technique, to form the one or more circuit elements, that involves at least one of patterning, deposition and lithography.STFD.458PCT (S23-326) 35      21. A method comprising: providing 1D fiber material characterized as a fibrous structure having one or more transformations from among a spiral, a roll or wrinkles, wherein: the 1D fiber material is integrated with circuitry including at least one microfabricated component and / or device, and configured to convey signals indicative of one or more biomedical functions from among: monitoring physiological parameters or responses of a live being; and introducing or causing bio-modulation within a curved or confined region of a live being; and using the 1D fiber material includes simultaneously: real-time mapping of biomedical signals obtained via the 1D fiber material and from within a live being, and stimulating tissue within the live being, wherein the circuitry is used to facilitate said real-time mapping and said stimulating tissue.

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