Touch panel, manufacturing method therefor and display module

Abstract

Disclosed in the present application are a touch panel, a manufacturing method therefor and a display module. The touch panel comprises a touch substrate and a touch layer; the touch layer comprises a touch metal layer and an insulating layer, the touch metal layer being located on a side of the touch substrate, and the insulating layer comprising a body part and an opening part; the body part is in the same layer as the touch metal layer, and / or the body part is located on the side of the touch metal layer facing away from the touch substrate; the opening part exposes at least part of the touch metal layer. The bending performance of the touch panel provided in the present application can be improved.

Description

Touch panel and its preparation method, display module

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese patent application No. 202310966159.8, filed on July 31, 2023, entitled “Touch panel, preparation method thereof, display module, and display device,” and the entire contents of that application are incorporated herein by reference. Technical Field

[0003] The present application belongs to the field of display technology, and in particular relates to a touch panel, a preparation method thereof, and a display module. Background Art

[0004] With the development of display technology, the performance requirements for display devices are getting higher and higher. The display panels in current display devices do not meet the bending performance requirements.

[0005] Summary of the Invention

[0006] The embodiments of the present application provide a touch panel and a manufacturing method thereof, and a display module, which can improve the bending performance of the touch panel.

[0007] An embodiment of a first aspect of the present application provides a touch panel, including:

[0008] touch substrate;

[0009] The touch layer includes a touch metal layer and an insulating layer, wherein the touch metal layer is located on one side of the touch substrate, and the insulating layer includes a main body and an opening. The main body is in the same layer as the touch metal layer, and / or the main body is located on a side of the touch metal layer facing away from the touch substrate. The opening exposes at least a portion of the touch metal layer.

[0010] An embodiment of the second aspect of the present application provides a display module, including any touch panel provided in the first aspect of the present application.

[0011] The third aspect of the present application provides a method for manufacturing a touch panel, including:

[0012] providing a touch substrate;

[0013] A touch layer is formed on one side of the touch substrate. The touch layer includes a touch metal layer and an insulating layer. The touch metal layer is located on one side of the touch substrate. The insulating layer includes a main body and an opening. The main body is layered in the same layer as the touch metal layer, and / or the main body is located on a side of the touch metal layer facing away from the touch substrate, and the opening exposes at least a portion of the touch metal layer.

[0014] The touch panel provided in the present application includes a touch substrate and a touch layer formed on the touch substrate. The touch layer includes a touch metal layer and an insulating layer, and the touch metal layer is used to realize the touch function. The insulating layer includes a main body and an opening portion, and the opening portion exposes at least a portion of the touch metal layer to reduce or eliminate the contact area between the main body and the touch metal layer, thereby reducing the adverse effects on the bending performance of the touch panel caused by the stress difference between the part where the main body and the touch metal layer are in contact when the touch panel is bent under force, for example, the part of the main body that contacts the touch metal layer is prone to cracks, or the main body is easily peeled off from the touch metal layer due to poor contact between the two, thereby helping to improve the bending performance and yield of the touch panel. At the same time, the provision of the insulating layer helps to improve the insulation performance of the touch metal layer in a direction perpendicular to the plane where the touch substrate is located or parallel to the plane where the touch substrate is located. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] FIG1 is a top view of a touch panel provided in an embodiment of the present application;

[0016] FIG2 is a cross-sectional view along line N-N' in FIG1 ;

[0017] FIG3 is another cross-sectional view along line NN' in FIG1 ;

[0018] FIG4 is another cross-sectional view along line NN' in FIG1 ;

[0019] FIG5 is a schematic structural diagram of a touch panel provided in an embodiment of the present application during use;

[0020] FIG6 is another cross-sectional view along NN' in FIG1;

[0021] FIG7 is another cross-sectional view taken along line N-N' in FIG1;

[0022] FIG8 is a partial schematic diagram of a touch panel provided by the present application;

[0023] FIG9 is a partial schematic diagram of another touch panel provided by the present application;

[0024] FIG10 is another cross-sectional view along NN' in FIG1;

[0025] FIG11 is another cross-sectional view along line NN' in FIG1 ;

[0026] FIG12 is a partial schematic diagram of a touch panel provided by the present application;

[0027] FIG13 is another cross-sectional view along line NN' in FIG1;

[0028] FIG14 is a partial schematic diagram of a touch panel provided by the present application;

[0029] FIG15 is a partial schematic diagram of a touch panel provided by the present application;

[0030] FIG16 is another cross-sectional view along line NN' in FIG1;

[0031] FIG17 is another cross-sectional view taken along line N-N' in FIG1;

[0032] FIG18 is another cross-sectional view along line N-N' in FIG1;

[0033] FIG19 is a cross-sectional view taken along line MM' in FIG1;

[0034] FIG20 is a partial enlarged view of area C in FIG1 ;

[0035] FIG21 is a cross-sectional view taken along line MM' in FIG1;

[0036] FIG22 is a schematic diagram of the binding area structure of a touch panel provided in an embodiment of the present application;

[0037] FIG23 is a schematic structural diagram of a display module provided in an embodiment of the present application;

[0038] FIG24 is a partial cross-sectional view of a display module provided in an embodiment of the present application;

[0039] FIG25 is a partial cross-sectional view of a display module provided in an embodiment of the present application;

[0040] FIG26 is a schematic structural diagram of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0041] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it will be apparent to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating the examples of the present application.

[0042] The inventors have discovered that the primary issue with display devices failing to meet bending performance requirements is that during the bending process, the touch layer and the film layer in contact with it may peel off or crack, affecting the display device's bending performance. Based on this research, the inventors have provided a touch panel, a method for manufacturing the same, a display module, and a display device to enhance the touch panel's bending performance.

[0043] In order to better understand the present application, the display panel and its manufacturing method, and the display device according to the embodiments of the present application are described in detail below with reference to Figures 1 to 26.

[0044] Referring to Figures 1 to 4 , an embodiment of the present application provides a touch panel 1 including a touch substrate 11 and a touch layer 12. The touch layer 12 includes a touch metal layer 121 and an insulating layer 122. The touch metal layer 121 is located on one side of the touch substrate 11. The insulating layer 122 includes a body portion 1221 and an opening portion 1222. The body portion 1221 is located on the same layer as the touch metal layer 121 and / or is located on a side of the touch metal layer 121 facing away from the touch substrate 11. The opening portion 1222 exposes at least a portion of the touch metal layer 121.

[0045] The touch panel 1 provided in the present application includes a touch substrate 11 and a touch layer 12 formed on the touch substrate 11. The touch layer 12 includes a touch metal layer 121 and an insulating layer 122. The touch metal layer 121 is used to implement a touch function. The insulating layer 122 includes a main body 1221 and an opening 1222. The opening 1222 exposes at least a portion of the touch metal layer 121 to reduce or eliminate the contact area between the main body 1221 and the touch metal layer 121. This reduces adverse effects on the bending performance of the touch panel 1 caused by a stress difference between the contacting portions of the main body 1221 and the touch metal layer 121 when the touch panel 1 is bent under force. For example, cracks may easily form in the portion of the main body 1221 that contacts the touch metal layer 121, or the main body 1221 may easily separate from the touch metal layer 121 due to poor contact between the two. This helps improve the bending performance and yield of the touch panel 1. Furthermore, the provision of the insulating layer 122 helps improve the insulation performance of the touch metal layer 121 in a direction perpendicular to or parallel to the plane of the touch substrate 11.

[0046] Specifically, as shown in Figure 2, multiple body portions 1221 can be spaced apart and located on the same layer as the touch metal layer 121. The orthographic projections of the body portions 1221 on the touch substrate 11 do not overlap with the orthographic projections of the touch metal layer 121 on the touch substrate 11, and the openings 1222 are located between adjacent body portions 1221. In this case, the openings 1222 completely expose the touch metal layer 121, and the body portions 1221 do not contact the touch metal layer 121. This prevents stress differences between the contact areas of the body portions 1221 and the touch metal layer 121 from adversely affecting the bending performance of the touch panel 1 when the touch panel 1 is bent under force, thereby improving the bending performance and yield of the touch panel 1. Furthermore, the insulating layer 122 provides insulation parallel to the plane of the touch substrate 11.

[0047] Alternatively, as shown in Figure 3, the body portion 1221 includes a portion co-located with the touch metal layer 121 and a portion located on the side of the touch metal layer 121 facing away from the touch substrate 11. The opening 1222 is formed within the portion of the body portion 1221 located on the side of the touch metal layer 121 facing away from the touch substrate 11. In this case, the opening 1222 exposes a portion of the touch metal layer 121. The provision of the opening 1222 reduces the contact area between the body portion 1221 and the touch metal layer 121, thereby reducing the adverse effects on the bending performance of the touch panel 1 caused by the stress difference between the contact portions of the body portion 1221 and the touch metal layer 121 when the touch panel 1 is bent under force, thereby improving the bending performance and yield of the touch panel 1. Furthermore, the insulating layer 122 provides insulation parallel to the plane of the touch substrate 11.

[0048] Alternatively, as shown in FIG4 , the body portion 1221 includes only the portion located on the side of the touch metal layer 121 facing away from the touch substrate 11. In this case, the body portion 1221 contacts the touch metal layer 121, but because the opening 1222 exposes at least a portion of the touch metal layer 121, the contact area between the body portion 1221 and the touch metal layer 121 is reduced. This reduces the adverse effects on the bending performance of the touch panel 1 caused by the stress difference between the contacting portions of the body portion 1221 and the touch metal layer 121 when the touch panel 1 is bent under force, thereby improving the bending performance and yield of the touch panel 1.

[0049] In a feasible embodiment, as shown in Figures 2 to 4, a protective layer 13 is further included, which is located on the side of the touch layer 12 facing away from the touch substrate 11. The orthographic projection of the protective layer 13 on the touch substrate 11 at least covers the orthographic projection of the touch metal layer 121 on the touch substrate 11.

[0050] Specifically, the protective layer 13 is located on the side of the touch layer 12 away from the touch substrate 11 , including: the protective layer 13 is located on the side of the touch metal layer 121 away from the touch substrate 11 , or the protective layer 13 is located on the side of the insulating layer 122 away from the touch substrate 11 , or both.

[0051] In the above embodiment, the protective layer 13 is provided on the side of the touch layer 12 facing away from the touch substrate 11, and the orthographic projection of the protective layer 13 on the touch substrate 11 at least covers the orthographic projection of the touch metal layer 121 on the touch substrate 11. This helps to cover and protect the portion of the touch metal layer 121 exposed through the opening 1222 in the insulating layer 122, thereby preventing subsequent film layers from adversely affecting the touch metal layer 121, thereby helping to improve the yield and reliability of the touch metal layer 121.

[0052] In a feasible embodiment, the orthographic projection of the protection layer 13 on the touch substrate 11 covers the orthographic projection of the touch layer 12 on the touch substrate 11 , that is, the protection layer 13 covers the entire surface.

[0053] In the above embodiment, the orthographic projection of the protection layer 13 on the touch substrate 11 further covers the orthographic projection of the main body 1221 on the touch substrate 11 , so that the main body 1221 can be protected by the protection layer 13 . In addition, the protection layer 13 can be prepared as a whole layer without patterning, which can save preparation processes.

[0054] As shown in FIG5 , during use, the touch panel 1 is typically mounted on the light-emitting surface of the display panel 21. The display panel 21 includes an array substrate 210 and a light-emitting layer 212. The light-emitting layer 212 is located on the side of the array substrate 210 facing the touch panel 1. The light-emitting layer 212 includes a light-emitting unit 2121. The light-emitting unit 2121 includes a first electrode 2122, a light-emitting functional layer 2123, and a second electrode 2124 stacked and arranged in a direction away from the array substrate 210.

[0055] In a feasible implementation, the material of the protection layer 13 includes an organic material, and can be prepared by using, for example, photoresist (OC).

[0056] In the above embodiment, the protective layer 13 is made of an organic material. Organic materials have better flexibility and ductility, and are less likely to peel off or crack during bending when in contact with the touch layer 12, thereby providing effective protection for the touch layer 12. At the same time, the protective layer 13 can provide a flat surface on the side facing away from the touch substrate 11 to facilitate the preparation of subsequent film layers.

[0057] In a feasible embodiment, as shown in FIG6 , the main body 1221 includes a first cross-section Q perpendicular to the plane of the touch substrate 11 , and the shape of the first cross-section Q is trapezoidal. Alternatively, as shown in FIG7 , the edge of the first cross-section Q on the side away from the touch substrate 11 is arc-shaped.

[0058] In the above embodiment, the body portion 1221 may include a block structure corresponding one-to-one to the light-emitting units 2121, so as to facilitate the adjustment of the light-emitting units 2121. Alternatively, the orthographic projections of multiple body portions 1221 on the array substrate 210 are located within the orthographic projection of one light-emitting unit 2121 on the array substrate 210.

[0059] The main body 1221 includes a first cross-section Q perpendicular to the plane of the touch substrate 11. The first cross-section Q is trapezoidal in shape, or the edge of the first cross-section Q facing away from the touch substrate 11 is curved. This allows the main body 1221 to form a convex lens structure, achieving a light-collecting effect. This further improves the light emission rate perpendicular to the plane of the touch substrate 11 and can focus some high-angle light and emit it perpendicular to the plane of the touch substrate 11. This improves the light emission rate of the light-emitting unit 2121, thereby reducing the power consumption of the display panel 21. Furthermore, the trapezoidal or curved shape increases the contact area between the main body 1221 and the protective layer 13, further enhancing the connection strength between the two.

[0060] In a feasible implementation manner, as shown in FIG8 and FIG9 , the shape of the orthographic projection of the body portion 1221 on the touch substrate 11 is circular and / or rectangular.

[0061] In the above embodiment, the orthographic projection of the main body 1221 on the touch substrate 11 is circular or rectangular. On the one hand, adopting a regular shape can facilitate manufacturing. On the other hand, a main body 1221 of a suitable shape can be selected according to the actual shape of the light-emitting unit 2121 to improve the light extraction effect of the display panel 21.

[0062] In a feasible embodiment, as shown in FIG. 10 , the body portion 1221 includes a groove structure 1220 . The groove structure 1220 is formed on a surface of the body portion 1221 facing away from the touch substrate 11 , and the protection layer 13 extends into the groove structure 1220 .

[0063] In the above embodiment, the body portion 1221 includes a groove structure 1220. The groove structure 1220 is formed by a surface of the body portion 1221 facing away from the touch substrate 11, which is recessed toward the side closer to the touch substrate 11. The protective layer 13 extends into the groove structure 1220, thereby increasing the contact area and depth between the protective layer 13 and the body portion 1221. This improves the bonding strength between the protective layer 13 and the body portion 1221, reduces the probability of separation between the protective layer 13 and the body portion 1221 during bending of the touch panel 1, and further enhances structural stability and improves the yield of the touch panel 1.

[0064] In a feasible implementation, as shown in FIG11 , the touch metal layer 121 is a first touch metal layer 1211 , that is, the touch metal layer 121 has only one metal layer.

[0065] In another feasible embodiment, as shown in Figure 12, the touch metal layer 121 includes a first touch metal layer 1211 and a second touch metal layer 1212, the first touch metal layer 1211 includes a first touch trace 1216, the second touch metal layer 1212 includes a first touch electrode 1213, a second touch electrode 1214 and a second touch trace 1215, the first touch electrodes 1213 are arranged in rows and columns, and the first touch electrodes 1213 adjacent to each other along the column direction are electrically connected through the first touch trace 1216, the second touch electrodes 1214 are arranged in rows and columns, and the second touch electrodes 1214 adjacent to each other along the row direction are electrically connected through the second touch trace 1215.

[0066] In the above embodiment, the first touch electrodes 1213 can be arranged in rows and columns, the second touch electrodes 1214 can be arranged in rows and columns, and the first touch electrodes 1213 and the second touch electrodes 1214 can be staggered in the rows and columns to achieve higher density touch detection.

[0067] Specifically, as shown in Figures 2 and 12, the second touch metal layer 1212 is located on the side of the first touch metal layer 1211 away from the touch substrate 11, or, as shown in Figure 13, the first touch metal layer 1211 is located on the side of the second touch metal layer 1212 away from the touch substrate 11, which is not particularly limited in this application.

[0068] In one feasible embodiment, the opening 1222 exposes at least the edge of the touch metal layer 121. When the edge of the touch metal layer 121 contacts a material with poor ductility, a significant stress difference between the two occurs during bending, potentially leading to problems such as peeling and warping. Exposing the edge of the touch metal layer 121 through the opening 1222 prevents contact between the insulating layer 122 and the edge of the touch metal layer 121. This reduces contact between the insulating layer 122 and the touch metal layer 121 due to the significant stress difference during bending, thereby improving the bending performance.

[0069] Specifically, when the second touch metal layer 1212 is located on a side of the first touch metal layer 1211 facing away from the touch substrate 11 , the opening 1222 at least exposes an edge of the second touch metal layer 1212 .

[0070] Among them, the second touch metal layer 1212 is patterned to form a first touch electrode 1213, a second touch electrode 1214 and a second touch trace 1215. The edge position of the patterned structure of the insulating layer 122 in the second touch metal layer 1212 is more likely to produce defects after being subjected to force such as bending or folding. Therefore, the opening portion 1222 at least exposes the edge of the second touch metal layer 1212, thereby reducing the contact area between the second touch metal layer 1212 and the insulating layer 122 while avoiding contact with the area with greater stress generated by bending, thereby reducing the probability of defective problems after bending, and reducing the poor contact between the insulating layer 122 and the second touch metal layer 1212 caused by the large stress difference between the two during the bending process, thereby improving the bending performance of the touch panel 1.

[0071] Specifically, when the first touch metal layer 1211 is located on the side of the second touch metal layer 1212 facing away from the touch substrate 11, the opening 1222 exposes at least the edge of the first touch metal layer 1211, thereby reducing poor contact between the insulating layer 122 and the first touch metal layer 1211 caused by the large stress difference between the two layers during bending, thereby improving the bending performance. Furthermore, because the first touch metal layer 1211 only includes the first touch trace 1216, while the second touch metal layer 1212 includes the first touch electrode, the second touch electrode 1214, and the second touch trace 1215, the second touch metal layer 1212 has a larger area than the first touch metal layer 1211, which has a greater negative impact on the bending performance of the touch panel 1. Disposing the second touch metal layer 1212 between the first touch metal layer 1211 and the touch substrate 11 can make the second touch metal layer 1212 closer to the neutral layer, thereby reducing the impact of the second touch metal layer 1212 on the bending performance of the touch panel 1, thereby helping to improve the bending performance of the touch panel 1.

[0072] In a feasible embodiment, as shown in FIG. 14 and FIG. 15 , the openings 1222 are arranged at intervals and are independent of each other.

[0073] In the above embodiment, the openings 1222 are spaced apart and independent of each other. Specifically, the openings 1222 can expose the second touch traces 1215 and / or the second touch electrodes 1214. Since adjacent second touch electrodes 1214 along a row are electrically connected via the second touch traces 1215, as shown in FIG14 , one type of opening 1222 can simultaneously expose the second touch electrodes 1214 and the second touch traces 1215 arranged along the row, facilitating manufacturing. As shown in FIG15 , another type of opening 1222 can correspond one-to-one with each first touch electrode 1213 and expose the first touch electrode 1213.

[0074] In another feasible embodiment, as shown in FIG. 8 and FIG. 9 , the opening portion 1222 is continuously provided over the entire surface.

[0075] In the above embodiment, the opening 1222 is continuously provided throughout the entire display area AA.

[0076] Specifically, the opening 1222 can expose the first touch electrode 1213 , the second touch electrode 1214 , and the second touch trace 1215 at the same time, thereby forming the opening 1222 that is continuously arranged on the entire surface.

[0077] Specifically, the material of the first touch metal layer 1211 and the second touch metal layer 1212 includes a metal material. Specifically, the material of the first touch metal layer 1211 and the second touch metal layer 1212 may include a titanium metal layer 211, an aluminum metal layer 211, and a titanium metal layer 211 stacked in a direction away from the touch substrate 11, or may be ITO. This is not particularly limited in this application.

[0078] In a feasible embodiment, as shown in FIG13 , a first insulating layer 14 is further included between the first touch metal layer 1211 and the second touch metal layer 1212. The orthographic projection of the first insulating layer 14 on the touch substrate 11 covers the orthographic projection of the first touch metal layer 1211 on the touch substrate 11. This achieves mutual insulation between the first touch metal layer 1211 and the second touch metal layer 1212.

[0079] Specifically, the material of the first insulating layer 14 can be either organic material or inorganic material, which is not particularly limited in this application.

[0080] In one feasible embodiment, as shown in FIG16 , the touch substrate 11 further includes a first insulating layer 14 and a second insulating layer 15 located between a first touch metal layer 1211 and a second touch metal layer 1212 stacked sequentially on one side of the touch substrate 11. The first insulating layer 14 includes a solid area 141 and an open area 142. The solid area 141 is co-layered with the first touch metal layer 1211, and / or the solid area 141 is located on a side of the first touch metal layer 1211 facing away from the touch substrate 11, while the open area 142 exposes at least a portion of the first touch metal layer 1211. The second insulating layer 15 is located on a side of the first insulating layer 14 facing away from the touch substrate 11. The projection of the second insulating layer 15 on the touch substrate 11 at least covers the projection of the open area 142 on the touch substrate 11, thereby isolating the first touch metal layer 1211 from the second touch metal layer 1212.

[0081] In a feasible embodiment, the first insulating layer 14 includes an inorganic material, and the second insulating layer 15 includes an organic material.

[0082] In the above embodiment, as shown in FIG16 , the first insulating layer 14 is patterned to form solid areas 141 and open areas 142. Specifically, multiple solid areas 141 can be spaced apart and located on the same layer as the first touch metal layer 1211. The orthographic projections of the solid areas 141 on the touch substrate 11 do not overlap with the orthographic projections of the first touch metal layer 1211 on the touch substrate 11. The open areas 142 are located between adjacent solid areas 141. In this manner, the open areas 142 completely expose the first touch metal layer 1211, and the solid areas 141 do not contact the first touch metal layer 1211. This prevents adverse effects on the bending performance of the touch panel 1 caused by stress differences between the contact areas of the solid areas 141 and the first touch metal layer 1211 when the touch panel 1 is bent under force, thereby improving the bending performance and yield of the touch panel 1. Furthermore, the first insulating layer 14 provides insulation parallel to the plane of the touch substrate 11.

[0083] Alternatively, as shown in Figure 17, the solid area 141 includes a portion co-located with the first touch metal layer 1211 and a portion of the first touch metal layer 1211 located on the side facing away from the touch substrate 11. The opening area 142 is formed within the solid area 141 on the side facing away from the touch substrate 11. In this case, the opening area 142 exposes a portion of the first touch metal layer 1211. The provision of the opening area 142 reduces the contact area between the solid area 141 and the first touch metal layer 1211, thereby reducing the adverse effects on the bending performance of the touch panel 1 caused by the stress difference between the contact areas of the solid area 141 and the first touch metal layer 1211 when the touch panel 1 is bent under force, thereby improving the bending performance and yield of the touch panel 1. Furthermore, the first isolation layer 14 provides insulation along a plane parallel to the touch substrate 11.

[0084] Alternatively, as shown in FIG18 , the physical area 141 includes only the portion of the first touch metal layer 1211 located away from the touch substrate 11. In this case, the physical area 141 contacts the first touch metal layer 1211. However, because the opening area 142 exposes at least a portion of the first touch metal layer 1211, the contact area between the physical area 141 and the first touch metal layer 1211 is reduced. This reduces the adverse effects on the bending performance of the touch panel 1 caused by the stress difference between the contact portions of the physical area 141 and the first touch metal layer 1211 when the touch panel 1 is bent under force, thereby improving the bending performance and yield of the touch panel 1.

[0085] In the above embodiment, the first insulating layer 14 includes an inorganic material. The inorganic material has excellent support and insulation properties and can well support the second touch metal layer 1212 .

[0086] In the above embodiment, as shown in FIG18 , the projection of the second insulating layer 15 on the touch substrate 11 covers the projection of the opening area 142 on the touch substrate 11 . Filling the opening area 142 with the second insulating layer 15 can, on the one hand, achieve a planarization effect. On the other hand, when the orthographic projection of the opening area 142 on the touch substrate 11 overlaps with the orthographic projection of the first touch metal layer 1211 on the touch substrate 11 , covering and filling the opening area 142 with the second insulating layer 15 can also provide an auxiliary insulation effect.

[0087] In the above embodiment, the second insulating layer 15 is located on the side of the first insulating layer 14 facing away from the touch substrate 11 , and the second insulating layer 15 contacts the side of the first insulating layer 14 facing away from the touch substrate 11 . In this case, the second insulating layer 15 can mainly play a planarization role, while also playing an insulating and protective role.

[0088] Alternatively, the second insulating layer 15 is located on the side of the first touch metal layer 1211 facing away from the touch substrate 11 , and contacts the side of the first touch metal layer 1211 facing away from the touch substrate 11 . In this case, the second insulating layer 15 can mainly serve as insulation.

[0089] Alternatively, part of the second insulating layer 15 is located on the side of the first insulating layer 14 away from the touch substrate 11 , and the other part is located on the side of the first touch metal layer 1211 away from the touch substrate 11 . In this case, the second insulating layer 15 can perform planarization and insulation functions.

[0090] In the above embodiment, the second insulating layer 15 comprises an organic material. Organic materials have excellent flexibility and ductility. Using organic materials to fill the opening area 142 for direct contact with the first touch metal layer 1211 can reduce the adverse effects of stress differences between the two during bending on bending performance. Furthermore, the use of organic materials provides a good planarization effect, facilitating the fabrication of subsequent film layers.

[0091] In one feasible embodiment, as shown in Figures 1 and 19, the touch panel 1 includes a bonding area, which includes bonding pads 16. The bonding pads 16 are electrically connected to the touch metal layer 121. The bonding pads 16 are used to bond with the chip to achieve an electrical connection between the touch metal layer 121 and the chip, thereby realizing the touch function.

[0092] In one feasible embodiment, as shown in Figures 19 and 20, an isolation layer 17 is provided on the side of the bonding pad 16 facing away from the touch substrate 11. The isolation layer 17 includes an isolation body 171 and an opening 172. The opening 172 is formed by enclosing the isolation body 171. The orthographic projection of the opening 172 on the touch substrate 11 is located within the orthographic projection of the bonding pad 16 on the touch substrate 11.

[0093] In the above embodiment, the binding area further includes an isolation layer 17, which is located on the side of the binding pad 16 facing away from the touch substrate 11 and includes an isolation body 171 and an opening 172. The orthographic projection of the opening 172 on the touch substrate 11 is located within the orthographic projection of the binding pad 16 on the touch substrate 11, and the edges of the two orthographic projections do not overlap, that is, the orthographic projection area of ​​the opening 172 on the touch substrate 11 is smaller than the orthographic projection area of ​​the binding pad 16 on the touch substrate 11. Specifically, the opening 172 exposes a portion of the binding pad 16, such as the central area, to facilitate binding of the binding pad 16 to other components. The orthographic projection of the isolation body 171 on the touch substrate 11 can cover the edge area of ​​the orthographic projection of the binding pad 16 on the touch substrate 11, thereby reducing the adverse effects of subsequent process steps on the binding pad 16, thereby protecting the binding pad 16. Specifically, the bonding pad 16 may include a stacked titanium metal layer 211, an aluminum metal layer 211, and a titanium metal layer 211. During the etching process of the film layer on the side of the bonding pad 16 facing away from the touch substrate 11, over-etching may occur, and the titanium metal layer 211 may be partially etched away, thereby exposing the aluminum metal layer 211. This makes the bonding pad 16 susceptible to oxidation, causing the bonding impedance of the bonding pad 16 after bonding with other components to be too high, thereby causing product defects. By covering the edge of the bonding pad 16 with the isolation body 171, it is protected, thereby reducing the risk of edge exposure, oxidation, and other defects on the bonding pad 16, and improving the problem of excessive impedance. At the same time, since the opening 172 exposes the bonding pad 16, the adverse effects on the alignment accuracy of the bonding pad 16 during electrical connection can be reduced to a certain extent. That is, while protecting the bonding pad 16, the alignment accuracy of its electrical connection is maintained.

[0094] In a feasible embodiment, as shown in Figure 19, the bonding pad 16 is provided in the same layer as the second touch metal layer 1212. Furthermore, the two can be made of the same metal layer and prepared at the same time.

[0095] In the above embodiment, the bonding pad 16 is provided on the same layer as the second touch metal layer 1212, eliminating the need for a new film layer for forming the bonding pad 16 and simplifying the manufacturing process. Furthermore, when the bonding pad 16 is provided on the same layer as the second touch metal layer 1212, the step difference between the bonding area and other areas is smaller, which reduces the thickness of the sidewalls on both sides of the opening 172 above the bonding pad 16. This makes it easier to bond other components to the bonding pad 16, helping to improve the stability and reliability of the bonding. Furthermore, the bonding pad 16 has fewer film layers on the side facing away from the touch substrate 11, which reduces the impact of etching the film layer on the side facing away from the touch substrate 11 to expose the bonding pad 16 on the yield of the bonding pad 16.

[0096] In another feasible implementation, as shown in FIG. 21 , the bonding pad 16 is disposed on the same layer as the first touch metal layer 1211 .

[0097] In the above embodiment, the binding pad 16 is arranged on the same layer as the first touch metal layer 1211, and there is no need to add a new film layer for preparing the binding pad 16, which can simplify the preparation process. At the same time, the thickness of the side walls on both sides of the opening 172 can be made thinner, thereby making it easier to bind other components to the binding pad 16, which helps to improve the stability and reliability of the binding.

[0098] In one feasible embodiment, the isolation layer 17 and the insulating layer 122 are provided in the same layer. After forming a material layer, different patterns can be formed in the bonding area and other areas through patterning, so that the isolation layer 17 is formed in the bonding area and the insulating layer 122 is formed in other areas. This can reduce the number of film layers prepared and thus reduce the preparation cost.

[0099] In one feasible embodiment, as shown in FIG. 20 , FIG. 21 , and FIG. 22 , a protective layer 18 is further included. The protective layer 18 is located on the side of the isolation layer 17 facing away from the touch substrate 11 . The protective layer 13 is also located on the side of the touch layer 12 facing away from the touch substrate 11 . The protective layer 18 and the protective layer 13 are disposed on the same layer. The orthographic projection of the protective layer 18 on the touch substrate 11 does not overlap with the orthographic projection of the opening 172 on the touch substrate 11 .

[0100] After forming a material layer, different patterns can be formed in the binding area and other areas through patterning to form a protective layer 18 in the binding area and a protective layer 13 in other areas, thereby saving the number of film layers prepared and saving preparation costs.

[0101] The orthographic projection of the protective layer 18 on the touch substrate 11 does not overlap with the orthographic projection of the opening 172 on the touch substrate 11 , so as to avoid blocking the central area of ​​the binding pad 16 and thus avoid interference with the binding.

[0102] In a feasible embodiment, as shown in FIG22 , there are multiple binding pads 16 , the protective layer 18 includes a through hole 181 , and the orthographic projections of the multiple binding pads 16 on the touch substrate 11 are located within the orthographic projection of the through hole 181 on the touch substrate 11 , that is, the orthographic projections of all the binding pads 16 on the touch substrate 11 are located within the orthographic projection of the through hole 181 on the touch substrate 11 .

[0103] In the above embodiment, the protective layer 18 includes a large through-hole 181 located in the bonding area. This through-hole 181 exposes all openings 172, meaning that the orthographic projections of all openings 172 on the touch substrate 11 are located within the orthographic projections of the through-holes 181 on the touch substrate 11. This prevents the protective layer 18 from obstructing the openings 172 and thus interfering with bonding. Furthermore, it reduces the thickness of the sidewalls of the openings 172 and the openings 142, thus simplifying bonding. Furthermore, since the enlarged through-holes 181 in the protective layer 18 create an area within the openings 172 that is unaffected by the protective layer 18 material, this prevents the protective layer 18 from including portions located between adjacent openings 172, which could be adversely affected by subsequent fabrication processes and melt, forming residue, and otherwise fall into the openings 172 and the openings 142, potentially adversely affecting bonding. This is primarily due to the heat pressing required during the bonding process for the bonding pads 16.

[0104] Of course, in other embodiments, the protective layer 18 is provided with a plurality of through holes 181 , and each through hole corresponds to a plurality of binding pads 16 .

[0105] The present application also provides a display module 2, as shown in FIG23, comprising any one of the touch panels 1 provided in the present application.

[0106] Since the display module 2 provided in the present application includes any one of the touch panels 1 provided in the above embodiments, the display module 2 provided in the present application has the beneficial effects of any one of the touch panels 1 provided in the above embodiments, which will not be described in detail here.

[0107] The display module 2 provided in this application also includes a display panel 21, as shown in FIG24 , which is located on one side of the touch panel 1. The display panel 21 includes an array substrate 210, which includes a metal layer 211. The touch panel 1 includes bonding pads 16. The bonding pads 16 are provided on the same layer as the metal layer 211. Therefore, the bonding pads 16 can be prepared simultaneously with the metal layer 211. This eliminates the need for additional film layers, simplifying the manufacturing process.

[0108] Specifically, the array substrate 210 includes a substrate and a first metal layer 211, a second metal layer 211, a third metal layer 211, and a fourth metal layer 211, which are sequentially arranged away from the substrate. The first metal layer 211 is used to form the gate of the transistor and the lower plate of the capacitor, the second metal layer 211 is used to form the upper plate of the capacitor, the third metal layer 211 is used to form the source and drain of the transistor, and the fourth metal layer 211 is used to form signal lines, etc. The array substrate 210 may also include a structure including more layers of metal layers 211, which is not particularly limited in this application. The bonding pad 16 may be provided on the same layer as any of the first metal layer 211, the second metal layer 211, the third metal layer 211, and the fourth metal layer 211.

[0109] When the bonding pad 16 is provided on the same layer as the fourth metal layer 211 , the thickness of the sidewall surrounding the opening 172 is relatively thin, making it easier to achieve electrical connection between the bonding pad 16 and other components.

[0110] In the above embodiment, the bonding pads 16 include bonding pads 16 for electrically connecting the touch layer 12 to the chip, and also include bonding pads 16 for connecting the display panel 21 to the chip. The bonding pads 16 may include some or all of the driver chip bonding pads 16, the flexible circuit board bonding pads 16, and the CT bonding pads 16.

[0111] In a feasible embodiment, as shown in Figure 24, the display panel 21 also includes a light-emitting layer 212, the light-emitting layer 212 is located between the array substrate 210 and the touch panel 1, the light-emitting layer 212 includes a plurality of light-emitting units 2121, the touch panel 1 includes a touch layer 12, the touch layer 12 includes a touch metal layer 121 and an insulating layer 122, the insulating layer 122 includes a main body 1221 and an opening 1222, and the orthographic projection of the main body 1221 on the array substrate 210 at least partially overlaps with the orthographic projection of the light-emitting unit 2121 on the array substrate 210.

[0112] The main body 1221 regulates the light emitted by the light-emitting unit 2121. Specifically, the orthographic projection of the main body 1221 on the array substrate 210 at least partially overlaps with the orthographic projection of the light-emitting unit 2121 on the array substrate 210. The main body 1221 includes a first cross-section Q perpendicular to the plane of the touch substrate 11. The first cross-section Q is trapezoidal in shape, or the edge of the first cross-section Q facing away from the touch substrate 11 is arc-shaped. This allows the main body 1221 to form a convex lens structure, achieving a light-collecting effect. This further improves the light emission rate perpendicular to the plane of the touch substrate 11. It can also focus some high-angle light and emit it perpendicular to the plane of the touch substrate 11, thereby improving the light emission rate of the light-emitting unit 2121 and reducing the power consumption of the display panel 21.

[0113] Furthermore, a protective layer 13 is disposed on the body portion 1221 facing away from the display panel 21. The refractive index of the body portion 1221 is greater than that of the protective layer 13, ensuring a light-gathering effect. This improves the normal-angle light emission rate of the display panel 21 and reduces the high-angle light emission rate, thereby enhancing the anti-peeping function. For example, in some embodiments, the body portion 1221 is made of silicon nitride (SiNx), and its refractive index can be 1.8 or greater than 1.5; the protective layer 13 is made of photoresist (OC), and its refractive index can be 1.5 or less than 1.5.

[0114] In a feasible embodiment, as shown in Figure 25, it also includes a shading layer 22 and a color filter portion 23 formed on the side of the touch panel 1 facing away from the display panel 21. A plurality of through holes 221 are provided on the shading layer 22. The orthographic projection of the through holes 221 on the array substrate 210 at least partially overlaps with the orthographic projection of the light-emitting unit 2121 on the array substrate 210. The color filter portion 23 is located in the through holes 221 and can correspond one to one, such as the orthographic projection of the color filter portion 23 on the array substrate 210 covers the orthographic projection of the through holes 221 on the array substrate 210.

[0115] In the above embodiment, the light shielding layer 22 and the color filter 23 are used instead of the polarizer, so that the display module 2 can be thinner and have stronger bending performance. At the same time, the excellent transmittance of the color filter 23 makes the power consumption required by the display panel 21 lower when it is working.

[0116] Specifically, in the above embodiment, the light emitting unit 2121 covered by the orthographic projection of the color filter 23 on the light emitting layer 212 emits light of the same color as the color of the color filter 23 , thereby improving the purity of the emitted light.

[0117] The present application also provides a method for preparing a touch panel 1, comprising:

[0118] S100 , providing a touch control substrate 11 .

[0119] S200: A touch layer 12 is formed on one side of the touch substrate 11. The touch layer 12 includes a touch metal layer 121 and an insulating layer 122. The touch metal layer 121 is located on one side of the touch substrate 11. The insulating layer 122 includes a body portion 1221 and an opening portion 1222. The body portion 1221 is located on the same layer as the touch metal layer 121, and / or the body portion 1221 is located on a side of the touch metal layer 121 facing away from the touch substrate 11, and the opening portion 1222 exposes at least a portion of the touch metal layer 121.

[0120] Since the preparation method of the touch panel 1 provided in the present application is used to prepare any one of the touch panels 1 in the above embodiments, the touch panel 1 prepared using the preparation method of the touch panel 1 provided in the present application has the beneficial effects of any one of the touch panels 1 provided in the above embodiments, which will not be repeated here.

[0121] In a feasible implementation, step S200 includes:

[0122] S201 , forming a touch metal layer 121 on one side of the touch substrate 11 .

[0123] S201 , forming an insulating layer 122 on one side of the touch control substrate 11 . The insulating layer 122 is provided on the same layer as the touch metal layer 121 . The insulating layer 122 includes a main body portion 1221 and an opening portion 1222 . The main body portions 1221 are arranged at intervals, and the opening portions 1222 are located between adjacent main body portions 1221 . The orthographic projection of the touch metal layer 121 on the touch control substrate 11 is located within the opening portion 1222 .

[0124] In the above embodiment, by setting the main body 1221 of the insulating layer 122 on the same layer as the touch metal layer 121, the insulating layer 122 and the touch metal layer 121 are prevented from contacting each other, thereby greatly reducing the defects caused by the large stress difference between the insulating layer 122 and the touch metal layer 121 during the bending process due to the contact between the two, thereby improving the bending performance of the display module 2.

[0125] In a feasible embodiment, the touch panel 1 includes a binding area and a binding pad 16 formed on one side of the touch substrate 11 . The binding pad 16 is located in the binding area and is disposed in the same layer as the touch metal layer 121 .

[0126] In the above embodiment, the bonding pads 16 are provided on the same layer as the second touch metal layer 1212, or the bonding pads 16 are provided on the same layer as the first touch metal layer 1211. This eliminates the need for a new film layer for forming the bonding pads 16, simplifying the fabrication process. Furthermore, the sidewalls of the openings 172 and 142 can be made thinner, making it easier to bond other components to the bonding pads 16, thereby improving bonding stability and reliability.

[0127] In a feasible implementation manner, forming the insulating layer 122 on one side of the touch control substrate 11 includes:

[0128] An inorganic material layer is formed on a side of the touch layer 12 facing away from the touch substrate 11 and patterned to form a main body portion 1221 spaced apart from and co-layered with the touch metal layer 121, and an opening portion 1222 exposing the touch metal layer 121. Furthermore, an isolation layer 17 is formed in the bonding area. The isolation layer 17 includes an isolation body 171 and an opening 172. The orthographic projection of the opening 172 on the touch substrate 11 is located within the orthographic projection of the bonding pad 16 on the touch substrate 11.

[0129] In the above embodiment, the insulating layer 122 and the isolation layer 17 are located on the same layer and can be formed using the same set of manufacturing processes. Specifically, the inorganic material layer is formed on the side of the touch layer 12 facing away from the touch substrate 11 and patterned. This can omit the process of forming the inorganic material layer. This can save manufacturing steps and reduce manufacturing costs.

[0130] The present application also provides a display device 3, as shown in Figure 26, including any one of the touch panels 1 provided in the above embodiments of the present application; or, including any one of the display modules 2 provided in the above embodiments of the present application; or including the touch panel 1 prepared by the above method.

[0131] Since the display device 3 provided in the present application includes any one of the touch panels 1 provided in the above embodiments, or includes any one of the display modules 2 provided in the above embodiments, or includes a touch panel 1 prepared by the above method, the display device 3 provided in the present application has the beneficial effects of any one of the touch panels 1 provided in the above embodiments or any one of the display modules 2 provided in the above embodiments, which will not be repeated here.

[0132] The display device 3 in the embodiment of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles and other devices with display functions.

[0133] While the embodiments described above are not exhaustive, they do not limit the present application to specific embodiments. Clearly, numerous modifications and variations are possible based on the above description. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the present application, thereby enabling those skilled in the art to better utilize the present application and its modifications. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A touch panel, comprising: Touch substrate; A touch layer, comprising a touch metal layer and an insulating layer, wherein the touch metal layer is located on one side of the touch substrate, and the insulating layer comprises a main body portion and an opening portion; The body portion is in the same layer as the touch metal layer, and / or the body portion is located on a side of the touch metal layer away from the touch substrate; and the opening portion exposes at least a portion of the touch metal layer.

2. The touch panel according to claim 1, wherein: It also includes a protection layer, which is located on a side of the touch layer away from the touch substrate, and the orthographic projection of the protection layer on the touch substrate at least covers the orthographic projection of the touch metal layer on the touch substrate; The insulating layer includes an inorganic material, and the protective layer includes an organic material.

3. The touch panel according to claim 2, wherein: The main body portion is in the same layer as the touch metal layer, and the orthographic projection of the protection layer on the touch substrate covers the orthographic projection of the touch layer on the touch substrate; The orthographic projection of the touch metal layer on the touch substrate is located within the orthographic projection of the opening on the touch substrate.

4. The touch panel according to claim 2, wherein: The main body includes a first section perpendicular to the plane of the touch substrate, the first section is trapezoidal, or the edge of the first section away from the touch substrate is arc-shaped, and the refractive index of the main body is greater than that of the protective layer.

5. The touch panel according to claim 2, wherein: The orthographic projection of the main body on the touch substrate is circular and / or rectangular; the main body includes a groove structure formed on a surface of the main body facing away from the touch substrate, and the protection layer extends into the groove structure.

6. The touch panel according to claim 1, wherein: The opening at least exposes an edge of the touch metal layer.

7. The touch panel according to claim 6, wherein: The touch metal layer is a first touch metal layer; or, The touch metal layer includes a first touch metal layer and a second touch metal layer. The touch metal layer includes a first touch wiring, and the second touch metal layer includes a first touch electrode, a second touch electrode and a second touch wiring, the first touch electrodes are arranged in rows and columns, and the first touch electrodes adjacent to each other in the column direction are electrically connected through the first touch wiring, and the second touch electrodes are arranged in rows and columns, and the second touch electrodes adjacent to each other in the row direction are electrically connected through the second touch wiring; wherein, the second touch metal layer is located on a side of the first touch metal layer away from the touch substrate, and the opening at least exposes an edge of the second touch metal layer, or the first touch metal layer is located on a side of the second touch metal layer away from the touch substrate, and the opening at least exposes an edge of the first touch metal layer.

8. The touch panel according to claim 6, wherein: The openings are arranged at intervals and are independent of each other, or the openings are arranged continuously over the entire surface.

9. The touch panel according to claim 6, wherein: The touch metal layer includes a first touch metal layer and a second touch metal layer stacked in sequence on one side of the touch substrate, and a first insulating layer between the first touch metal layer and the second touch metal layer, wherein the orthographic projection of the first insulating layer on the touch substrate covers the orthographic projection of the first touch metal layer on the touch substrate; Alternatively, the touch metal layer includes a first touch metal layer and a second touch metal layer stacked in sequence on one side of the touch substrate, and a first insulating layer and a second insulating layer located between the first touch metal layer and the second touch metal layer, the first insulating layer includes a solid area and an opening area, the solid area is in the same layer as the first touch metal layer, and / or the solid area is located on a side of the first touch metal layer away from the touch substrate, the opening area exposes at least part of the first touch metal layer, the second insulating layer is located on a side of the first insulating layer away from the touch substrate, and a projection of the second insulating layer on the touch substrate at least covers a projection of the opening area on the touch substrate; Wherein, the first insulating layer comprises an inorganic material, and the second insulating layer comprises an organic material.

10. The touch panel according to claim 9, wherein: The physical area at least exposes an edge of the first touch metal layer.

11. The touch panel according to claim 1, wherein: The touch panel comprises a binding area, the binding area comprises a binding pad, and the binding pad is electrically connected to the touch metal layer; An isolation layer is provided on the side of the bonding pad facing away from the touch substrate, and the isolation layer includes The touch control substrate includes an isolation body and an opening, wherein the opening is formed by enclosing the isolation body, and an orthographic projection of the opening on the touch control substrate is located within an orthographic projection of the binding pad on the touch control substrate.

12. The touch panel according to claim 11, wherein: The binding pad is disposed in the same layer as the touch metal layer; the isolation layer is disposed in the same layer as the insulating layer; and the isolation layer includes an inorganic material.

13. The touch panel according to claim 11, wherein: The touch panel further comprises a protective layer, which is located on a side of the isolation layer away from the touch substrate, and the orthographic projection of the protective layer on the touch substrate does not overlap with the orthographic projection of the opening on the touch substrate; the touch panel further comprises a protective layer located on a side of the touch layer away from the touch substrate, and the protective layer is arranged on the same layer as the protective layer.

14. The touch panel according to claim 13, wherein: There are multiple binding pads, the protective layer includes a through hole, and the orthographic projections of the multiple binding pads on the touch substrate are located within the orthographic projection of the through hole on the touch substrate.

15. A display module, comprising the touch panel according to any one of claims 1 to 14.

16. The display module according to claim 15, wherein: It also includes a display panel located on one side of the touch panel, the display panel includes an array substrate, the array substrate includes a metal layer, the touch panel includes a binding pad, and the binding pad is arranged in the same layer as the metal layer.

17. The display module according to claim 16, wherein: The display panel also includes a light-emitting layer, which is located between the array substrate and the touch panel. The light-emitting layer includes a plurality of light-emitting units. The touch panel includes a touch layer, which includes a touch metal layer and an insulating layer. The insulating layer includes a main body and an opening. The orthographic projection of the main body on the array substrate at least partially overlaps with the orthographic projection of the light-emitting unit on the array substrate.

18. The display module according to claim 16, wherein: It also includes a shading layer and a color filter portion formed on the side of the touch panel away from the display panel, the shading layer is provided with a plurality of through holes, the orthographic projections of the through holes on the array substrate at least partially overlap with the orthographic projections of the light-emitting units on the array substrate, and the color filter portion is arranged in the through holes.

19. A method for preparing a touch panel, comprising: Providing a touch substrate; A touch layer is formed on one side of the touch substrate, wherein the touch layer includes a touch metal layer and an insulating The touch metal layer is located on one side of the touch substrate, the insulating layer includes a main body and an opening, the main body and the touch metal layer are in the same layer, and / or the main body is located on a side of the touch metal layer away from the touch substrate, and the opening exposes at least a portion of the touch metal layer.

20. The preparation method according to claim 19, wherein: The forming of the touch layer on one side of the touch substrate comprises: forming a touch metal layer on one side of the touch substrate; An insulating layer is formed on one side of the touch substrate. The insulating layer is disposed on the same layer as the touch metal layer. The insulating layer includes a body portion and an opening portion. The orthographic projection of the touch metal layer on the touch substrate is located within the orthographic projection of the opening portion on the touch substrate.

21. The preparation method according to claim 20, wherein: The touch panel comprises a binding area, and a binding pad is formed on one side of the touch substrate. The binding pad is located in the binding area, and the binding pad is electrically connected to the touch metal layer, and the two are formed synchronously.

22. The preparation method according to claim 21, wherein The step of forming an insulating layer on one side of the touch control substrate comprises: An inorganic material layer is formed on a side of the touch layer away from the touch substrate and patterned to form a main body portion provided on the same layer as the touch metal layer and an opening portion exposing the touch metal layer, and an isolation layer is formed in the binding area, the isolation layer comprising an isolation body and an opening, the orthographic projection of the opening on the touch substrate being located within the orthographic projection of the binding pad on the touch substrate.

Images