Display apparatus and method for manufacturing display apparatus

Abstract

The present application relates to the technical field of display, and disclosed thereby are a display apparatus and a method for manufacturing a display apparatus. The display apparatus comprises a display panel and a bridge circuit board located on a back surface of the display panel, and the bridge circuit board is electrically connected to the display panel. The bridge circuit board comprises a circuit structure, a first alignment mark, and a substrate layer and a light-shielding pattern which are stacked. The circuit structure and the first alignment mark are located on the side of the substrate layer away from the display panel, the light-shielding pattern is located on the side of the first alignment mark close to the display panel, and the orthographic projection of the first alignment mark on the back surface of the display panel is located in the orthographic projection of the light-shielding pattern on the back surface of the display panel. In this way, some structures between the first alignment mark and the back surface of the display panel in the display apparatus can be shielded by the light-shielding pattern to prevent the foregoing structures from affecting the identification of the first alignment mark, such that the problem in the prior art of poor alignment precision of display apparatuses is solved, thereby achieving the effect of improving the alignment precision of display apparatuses.

Description

Display device and method for manufacturing the same

[0001] This disclosure claims priority to Chinese patent application No. 202310974929.3 filed on August 3, 2023, entitled “Display device and method for manufacturing display device.” The entire contents of the above case are incorporated by reference into this disclosure. Technical Field

[0002] The present application relates to the field of display technology, and in particular to a display device and a method for manufacturing the display device. Background Art

[0003] A display device is a device that has the function of displaying images.

[0004] A display device includes a display panel and a bridge circuit board. The bridge circuit board is bonded to the back of the display panel via an adhesive layer. The bridge circuit board includes an alignment mark used for alignment operations in subsequent processes.

[0005] However, the adhesive layer is prone to produce twisted lines after lamination, thereby affecting the recognition of the alignment mark and resulting in poor alignment accuracy.

[0006] Summary of the Invention

[0007] The present invention provides a display device and a method for manufacturing the display device, which can solve the problem of poor alignment accuracy of display devices in related technologies. The technical solution is as follows:

[0008] According to a first aspect of the present application, a display device is provided, comprising:

[0009] A display panel and a bridge circuit board located on the back of the display panel, wherein the bridge circuit board is electrically connected to the display panel;

[0010] The bridge circuit board includes a circuit structure, a first alignment mark, and a stacked base layer and a shading pattern. The circuit structure and the first alignment mark are located on a side of the base layer away from the display panel, the shading pattern is located on a side of the first alignment mark close to the display panel, and the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel.

[0011] Optionally, the display device further includes an adhesive layer, wherein the adhesive layer is located between the base layer and the back surface of the display panel, and the adhesive layer is respectively bonded to the base layer and the back surface of the display panel.

[0012] Optionally, the base layer includes a first sub-base layer, a barrier layer, a second sub-base layer, and a buffer layer, which are sequentially stacked in a direction away from the display panel.

[0013] Optionally, the light-shielding pattern is located between the first sub-base layer and the circuit structure.

[0014] Optionally, the light shielding pattern is located between the blocking layer and the second sub-base layer.

[0015] Optionally, the display panel includes a second alignment mark, and an orthographic projection of the second alignment mark on the back surface of the display panel is located outside the orthographic projection of the light-shielding pattern on the back surface of the display panel.

[0016] Optionally, the display device further includes a stress pattern, and the orthographic projection of the stress pattern on the back of the display panel is outside the orthographic projection of the circuit structure on the back of the display panel, and the stress pattern is used to improve the flatness of the bridge circuit board.

[0017] Optionally, the stress pattern and the light shielding pattern are in the same layer structure.

[0018] Optionally, the circuit structure includes a binding area, and an orthographic projection of the binding area on the back surface of the display panel is located in an orthographic projection of the light shielding pattern on the back surface of the display panel.

[0019] Optionally, the bridge circuit board also includes an insulating layer, which is located on the side of the circuit structure away from the display panel, and the insulating layer has an opening, and the orthographic projection of the binding area on the back of the display panel is located in the orthographic projection of the opening on the back of the display panel.

[0020] Optionally, the color of the light-shielding pattern is different from the color of the first alignment mark.

[0021] Optionally, the first alignment mark and the circuit structure are in the same layer structure.

[0022] Optionally, the material of the light-shielding pattern includes at least one of acrylic, silicone film or metal film.

[0023] According to another aspect of the present application, another display device is provided, comprising:

[0024] A display panel and a bridge circuit board located on the back of the display panel, wherein the bridge circuit board is electrically connected to the display panel;

[0025] The bridge circuit board includes a circuit structure on the back of the display panel, a first alignment mark, and a stacked base layer and a shading pattern. The circuit structure and the contrast mark are located on the side of the base layer away from the display panel. The adhesive layer is located between the base layer and the back of the display panel, and the adhesive layer is respectively bonded to the base layer and the back of the display panel. The adhesive layer has an opening, and the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the opening on the back of the display panel.

[0026] According to another aspect of the present application, a method for manufacturing a display device is provided, the method comprising:

[0027] forming a bridge circuit board on a substrate;

[0028] separating the bridge circuit board from the substrate;

[0029] Disposing the bridge circuit board on the back of the display panel and electrically connecting the bridge circuit board to the display panel;

[0030] In which, the bridge circuit board includes a circuit structure, a first alignment mark, and a stacked base layer and a shading pattern. The circuit structure and the contrast mark are located on the side of the base layer away from the display panel, the shading pattern is located on the side of the first alignment mark close to the display panel, and the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel.

[0031] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0032] By setting a shading pattern on the side of the first alignment mark close to the display panel, the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel. In this way, some structures between the first alignment mark and the back of the display panel can be blocked by the shading pattern, thereby avoiding that some structures between the first alignment mark and the back of the display panel affect the recognition of the alignment mark, solving the problem of poor alignment accuracy of the display device in the related art, and achieving the effect of improving the alignment accuracy of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0034] FIG1 is a schematic diagram of a top view of a display device;

[0035] FIG2 is a schematic cross-sectional view of the display device provided in FIG1 ;

[0036] FIG3 is a schematic diagram of a top view of a display device provided in an embodiment of the present application;

[0037] FIG4 is a schematic cross-sectional view of the display device provided in FIG3 ;

[0038] FIG5 is a schematic top view of another display device provided in an embodiment of the present application;

[0039] FIG6 is a schematic cross-sectional view of the display device provided in FIG5 ;

[0040] FIG7 is a schematic top view of another display device provided in an embodiment of the present application;

[0041] FIG8 is a schematic top view of the structure of the light shielding pattern and the stress pattern in the display device shown in FIG7 ;

[0042] FIG9 is a schematic top view of another light-shielding pattern provided in an embodiment of the present application;

[0043] FIG10 is a schematic top view of another stress pattern provided in an embodiment of the present application;

[0044] FIG11 is a schematic top view of a bridge circuit board in the display device shown in FIG5 ;

[0045] FIG12 is a schematic cross-sectional view of the bridge circuit board provided in FIG11;

[0046] FIG13 is a schematic diagram of a three-dimensional structure of a display device provided in an embodiment of the present application;

[0047] FIG14 is a schematic top view of another display device provided in an embodiment of the present application;

[0048] FIG15 is a schematic cross-sectional view of the display device provided in FIG14;

[0049] FIG16 is a schematic cross-sectional view of another display device provided in an embodiment of the present application;

[0050] FIG17 is a flow chart of a method for manufacturing a display device provided in an embodiment of the present application;

[0051] FIG18 is a flow chart of another method for manufacturing a display device provided in an embodiment of the present application;

[0052] FIG19 is a cross-sectional structural diagram of a portion of a display device manufacturing method provided in an embodiment of the present application;

[0053] FIG20 is a top view of a partial structure of another method for manufacturing a display device provided in an embodiment of the present application;

[0054] FIG21 is a schematic cross-sectional view of a portion of the structure in the method for manufacturing the display device provided in FIG20 ;

[0055] FIG22 is a top view of another bridge circuit board provided in an embodiment of the present application;

[0056] FIG23 is a schematic cross-sectional view of the bridge circuit board provided in FIG21;

[0057] FIG24 is a schematic diagram of an array pattern in a display panel provided in an embodiment of the present application;

[0058] FIG25 is a schematic diagram of a bridge circuit board combined with a display panel provided in an embodiment of the present application;

[0059] FIG26 is a schematic diagram of an electrical connection between a bridge circuit board and a display panel provided by an embodiment of the present application;

[0060] FIG27 is a schematic structural diagram of a protective layer in a display device provided in an embodiment of the present application.

[0061] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0062] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0063] Please refer to Figures 1 and 2. Figure 2 is a schematic cross-sectional view of the structure taken along line C1-C1 in Figure 1. (To clearly illustrate the circuit structure and first alignment mark, Figure 1 does not show the insulating layer, but this is not intended to be limiting.) The display device 10 includes a display panel 11, a bridge circuit board 12, and an adhesive layer 13. The bridge circuit board 11 is electrically connected to the display panel 12. The adhesive layer 13 is positioned between the display panel 11 and the bridge circuit board 12. The adhesive layer 23 is bonded to the display panel 11 and the bridge circuit board 12, respectively. The bridge circuit board 12 includes a base layer 121, a circuit structure 122, an alignment mark 123, and an insulating layer 124. The circuit structure 122 and the first alignment mark 123 are located on a side of the base layer 121 away from the display panel 11, and the circuit structure 122 and the first alignment mark 123 are co-layered. The base layer 121 includes a first sub-base layer 1211 , a barrier layer 1212 , a second sub-base layer 1213 , and a buffer layer 1214 , which are sequentially stacked in a direction away from the display panel 11 .

[0064] As shown in Figures 1 and 2 , the display panel 11 and the bridge circuit board 12 in the display device 10 are bonded together via an adhesive layer 13 and then pressed together. This lamination process produces distortion lines N in the adhesive layer 13. These distortion lines N can be observed through the various film layers of the bridge circuit board 12 along a top-down direction D1 using a black-and-white lens used to identify alignment marks. These distortion lines N can affect the identification of the boundaries of the alignment marks 123, resulting in poor alignment accuracy. Furthermore, the bridge circuit board 12 comprises multiple film layers, and stress in these layers can lead to poor flatness in the bridge circuit board 12, hindering the bonding of the display panel 11 and the bridge circuit board 12.

[0065] An embodiment of the present application provides a display device. Referring to Figures 3 and 4 , Figure 4 is a schematic cross-sectional view of the structure taken along line C1-C1 in Figure 3 (to clearly illustrate the circuit structure and the first alignment mark, Figure 3 does not show the insulating layer, but this is not intended to be limiting). The display device 20 may include a display panel 21 and a bridge circuit board 22 located on the back side of the display panel 21, the bridge circuit board 22 being electrically connected to the display panel 21.

[0066] The bridge circuit board 22 includes a circuit structure 223, a first alignment mark 224, and a stacked base layer 221 and a shading pattern 222. The circuit structure 223 and the first alignment mark 224 are located on the side of the base layer 221 away from the display panel 21, and the shading pattern 222 is located on the side of the first alignment mark 224 close to the display panel 21. The positive projection of the first alignment mark 224 on the back of the display panel 21 is located in the positive projection of the shading pattern 222 on the back of the display panel 21, that is, when the bridge circuit board 22 is observed along the top direction D2 through a black and white lens for identifying the alignment mark, some structures between the first alignment mark 224 and the back of the display panel 21 are blocked by the shading pattern 222, so that some structures between the first alignment mark 224 and the back of the display panel 21 can be avoided from affecting the identification of the first alignment mark 224, wherein the display panel 21 includes a front side A and a back side B, the front side A of the display panel 21 can be the side with the display area, and the back side B of the display panel 21 can be the other side opposite to the front side A.

[0067] To sum up, the display device provided by the embodiment of the present application sets a shading pattern on the side of the first alignment mark close to the display panel, and the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel. In this way, some structures between the first alignment mark and the back of the display panel can be blocked by the shading pattern, thereby avoiding that some structures between the first alignment mark and the back of the display panel affect the recognition of the alignment mark, solving the problem of poor alignment accuracy of the display device in the related art, and achieving the effect of improving the alignment accuracy of the display device.

[0068] The present application provides another display device in accordance with an embodiment of the present invention. Please refer to Figures 5 and 6. Figure 6 is a schematic cross-sectional view of the structure of Figure 5 taken at position C1-C1. (To clearly illustrate the circuit structure and the first alignment mark, Figure 5 does not show the insulating layer, but this is not intended to be limiting.) The display device 20 includes a display panel 21, a bridge circuit board 22 located on the back of the display panel 21, an adhesive layer 23, and a stress pattern 24. The bridge circuit board 21 is electrically connected to the display panel 22. The bridge circuit board 22 includes a first surface A' and a second surface B'. The first surface A' can be used to prepare circuits, and the second surface B' can be used to set the adhesive layer 33.

[0069] In the embodiment of the present application, the adhesive layer 23 is positioned between the base layer 221 and the back surface of the display panel 21, and the adhesive layer 23 is adhered to the base layer 221 and the back surface of the display panel 21, respectively, thereby connecting and securing the display panel 21 to the bridge circuit board 22. In the display device 20, the display panel 21 and the bridge circuit board 22 are bonded together by the adhesive layer 23 and then subjected to a lamination process. This lamination process produces distorted lines in the adhesive layer 22. When observing the bridge circuit board 12 from a top-down direction D2 through a black-and-white lens used for identifying alignment marks, the light-shielding pattern 222 coincides with the first alignment mark 224. In other words, the light-shielding pattern 222 obscures the adhesive layer 22 at the location corresponding to the first alignment mark 224. Therefore, the distorted lines in the adhesive layer 22 do not affect the identification of the boundary of the first alignment mark 224. Exemplarily, the adhesive layer 23 may be at least one of a hot melt adhesive, a silicone adhesive, and a light-curing adhesive.

[0070] Optionally, the bridge circuit board 22 may include a circuit structure 223, a first alignment mark 224, and a stacked base layer 221 and a light shielding pattern 222. The base layer 221 includes a first sub-base layer 2211, a barrier layer 2212, a second sub-base layer 2213, and a buffer layer 2214, which are stacked in sequence in a direction away from the display panel 21.

[0071] The first sub-base layer 2211 is located on the side of the adhesive layer 23 away from the display panel 21. The first sub-base layer 2211 can play the role of protection, moisture-proof, radiation-resistant and insulation. Exemplarily, the material of the first sub-base layer 2211 may include polyimide (PI). The first sub-base layer 2211 can be made by a deposition process, and the deposition process includes chemical deposition or physical deposition.

[0072] The barrier layer 2212 is located on the side of the first sub-base layer 2211 away from the display panel 21. The barrier layer 2212 can isolate the heat generated inside the display panel, thereby improving the service life. Exemplarily, the material of the barrier layer 2212 can be silicon nitride or silicon oxide.

[0073] The second sub-base layer 2213 is located on the side of the shading pattern 222 away from the display panel 21. The second sub-base layer 2213 is similar to the first sub-base layer 2211 and can play the role of protection, moisture-proofing, radiation resistance and insulation. Exemplarily, the second sub-base layer 2213 can be a polyimide film. The second sub-base layer 2213 can be made by a deposition process, and the deposition process includes chemical deposition or physical deposition.

[0074] The buffer layer 2214 is located on the side of the second sub-base layer 2213 away from the display panel 21. The buffer layer 2214 can smooth the surface of the bridge circuit board 22, preventing the bridge circuit board 22 from warping, thereby improving the stability of the bridge circuit board 22 and the display panel 21. In addition, the buffer layer 2214 can also isolate water and oxygen. Exemplary materials for the buffer layer 2214 can include silicon oxide (such as SiO), silicon nitride (such as SiN), or silicon oxynitride (such as SiON).

[0075] Optionally, the light shielding pattern 222 is located between the first sub-base layer 2211 and the circuit structure 223 , so that the light shielding pattern 222 can shield the adhesive layer 23 and is not directly bonded to the adhesive layer 23 , thereby avoiding the problem of uneven bonding surface.

[0076] For example, as shown in FIG6 , in the embodiment of the present application, the light-shielding pattern 222 is located between the second sub-base layer 2213 and the barrier layer 2212. However, this embodiment of the present application is not limited thereto. The light-shielding pattern 222 may also be located between the first sub-base layer 2211 and the barrier layer 2212, or between the second sub-base layer 2213 and the buffer layer 2214, or between the buffer layer 2214 and the circuit structure 223. As shown in FIG7 and FIG8 , the orthographic projection of the first alignment mark 224 on the back surface of the display panel 21 is located within the orthographic projection of the light-shielding pattern 222 on the back surface of the display panel 21. In other words, some structures between the first alignment mark 224 and the back surface of the display panel 21 are obscured by the light-shielding pattern 222. For example, the light-shielding pattern 222 may be formed by magnetron sputtering, chemical vapor deposition, or lamination of existing film materials. The material of the light-shielding pattern 222 may be acrylic, silicone film, metal film, etc. Optionally, the color of the shading pattern is different from the color of the first alignment mark. In this way, when observed along the top-down direction D2 through a black and white lens used to identify the alignment mark, the shading pattern 222 is obviously different from the first alignment mark 224, which is conducive to the identification of the first alignment mark 224. Exemplarily, the first alignment mark can be silver, and the color of the shading pattern 222 can be black. At this time, the shading pattern 222 can be composed of a black matrix, and the material of the black matrix is ​​the same as that of the black matrix in the color film substrate.

[0077] In addition, as shown in FIG9 , the shape of the shading pattern 222 can be a regular shape or an irregular shape such as a rectangle, a fan shape, a circle, a diamond shape, a regular hexagon, etc. The shading pattern 222 can also be a shape corresponding to some other structures in the bridge circuit board, thereby avoiding other structures.

[0078] As shown in Figures 7 and 8 (to clearly illustrate the circuit structure and first alignment mark, the insulating layer is not shown in Figure 7, but this is not intended to be limiting), the display device 20 further includes a stress pattern 24. The orthographic projection of the stress pattern 24 on the back surface of the display panel 21 is located outside the orthographic projection of the circuit structure 223 on the back surface of the display panel 21. In other words, when observing the bridge circuit board 12 along the top view direction D2 through a black and white lens used to identify the alignment mark, the stress pattern 24 and the circuit structure 223 do not overlap. The bridge circuit board 22 comprises multiple film layers. The stress present in these multiple film layers hinders the attachment of the bridge circuit board 22 to the back surface of the display panel 21 via the adhesive layer 23, potentially reducing the flatness of the bridge circuit board 22 and causing warping of the bridge circuit board 22. Therefore, the provision of the stress pattern 24 can improve the flatness of the bridge circuit board 22. For example, as shown in FIG10 , the stress pattern 24 can include a single, integral pattern or a combination of multiple patterns. The shape of the stress pattern 24 can be regular or irregular, such as a rectangle, sector, circle, rhombus, or regular hexagon. The shape, location, and size of the stress pattern can be determined through simulation or experimentation, effectively mitigating the effect of film stress on the flatness of the bridge circuit board 22. Furthermore, the stress pattern 24 and the light-shielding pattern 222 are co-layered, allowing both to be processed simultaneously in a single process, saving a single step and thereby improving production efficiency and reducing costs. FIG7 and FIG8 illustrate the stress pattern 24 and the light-shielding pattern 222 as co-layered, but this embodiment of the present application is not limited thereto. For example, the stress pattern 24 can also be located between the first sub-base layer 2211 and the barrier layer 2212, or between the second sub-base layer 2213 and the buffer layer 2214, or between the buffer layer 2214 and the circuit structure 223.

[0079] The circuit structure is located on a side of the buffer layer away from the display panel, as shown in FIG11 (to clearly illustrate the circuit structure and the first alignment mark, FIG11 does not show the insulating layer, but this is not intended to limit the scope of the present invention). The circuit structure 223 includes a first connecting terminal L1, a second connecting terminal L2, and a fan-out trace L3. The first connecting terminal L1 is connected to one end of the fan-out trace L3 in a one-to-one correspondence, and the second connecting terminal L2 is connected to the other end of the fan-out trace L3 in a one-to-one correspondence. For example, as shown in FIG26, the first connecting terminal L1 can be electrically connected to the display panel 21 via a line 25. For example, as shown in Figures 11 and 13 (it should be noted that L3 in Figure 13 is a fan-out trace covered and blocked by an insulating layer), the binding area 2231 includes a plurality of second connection terminals L2, and the orthographic projection of the binding area 2231 on the back of the display panel 21 is located in the orthographic projection of the shading pattern on the back of the display panel 21, that is, some structures between the binding area 2231 and the back of the display panel 21 are blocked by the shading pattern 222, then these structures will not affect the recognition of the binding area 2231; the binding area 2231 is connected to one end of the flexible circuit board 27, and the other end of the flexible circuit board 27 is connected to other external components, thereby providing power and signals to the display device. For example, the circuit structure 223 can be formed by a patterning process. In the embodiment of the present application, the patterning process involved may include photoresist coating, exposure, development, etching and photoresist stripping. In addition, the first alignment mark 224 and the circuit structure 223 are in the same layer structure, so the first alignment mark 224 and the circuit structure 223 can be processed simultaneously through one composition process, saving one composition process, thereby improving production efficiency and saving costs.

[0080] As shown in Figures 7 and 8, the display panel 21 also includes a second alignment mark 211. The second alignment mark 211 is an alignment mark in the display panel 21. The second alignment mark 211 can not only play a positioning role in the manufacturing process of the display panel 21, but also achieve alignment in the manufacturing process of structures such as bridge circuit boards.

[0081] In the display device provided in the embodiment of the present application, the orthographic projection of the second alignment mark 211 on the back of the display panel 21 is located outside the orthographic projection of the shading pattern 222 on the back of the display panel, that is, when the bridge circuit board 22 is observed along the top-down direction D2 through a black and white lens for identifying the alignment mark, the second alignment mark 211 will not be blocked by the shading pattern 222, so the second alignment mark 211 can be used for alignment in some subsequent processes.

[0082] The display device provided in the embodiment of the present application may further include an insulating layer 225, as shown in Figures 11 and 12 (Figure 12 is a schematic diagram of the cross-sectional structure of Figure 11 at C2-C2), the insulating layer 225 is located on the side of the circuit structure 223 away from the base layer 221, and the insulating layer 225 has an opening E, and the orthographic projections of the first connection terminal L1 and the second connection terminal L2 on the back of the display panel 21 are located in the orthographic projections of the opening E on the back of the display panel 21, so the first connection terminal L1 and the second connection terminal L2 are not covered with the insulating layer, that is, the insulating layer 225 is used to cover and protect other positions except the first connection terminal L1 and the second connection terminal L2 that are subsequently connected to some other structures, wherein the insulating layer 225 can be formed by a composition process.

[0083] An embodiment of the present application provides another display device. Please refer to Figures 14 and 15 (to clearly illustrate the circuit structure and the first alignment mark, Figure 14 does not show the insulating layer, but this is not limiting). Figure 15 is a schematic cross-sectional structure diagram of Figure 14 taken at C3-C3. The display device 30 includes: a display panel 31 and a bridge circuit board 32 located on the back of the display panel 31, the bridge circuit board 31 being electrically connected to the display panel 32; the bridge circuit board 32 includes a circuit structure 322 on the back of the display panel 31, a first alignment mark 323, and a laminated adhesive layer 33 and a base layer 321, as well as, The circuit structure 322 and the first alignment mark 323 are located on the side of the base layer 321 away from the display panel. The adhesive layer 33 is located between the base layer 321 and the back surface of the display panel 31, and is adhered to the base layer 321 and the back surface of the display panel 31, respectively. The adhesive layer 33 has an opening k. The orthographic projection of the first alignment mark 323 on the back surface of the display panel 31 is located within the orthographic projection of the opening k on the back surface of the display panel 31. In other words, when observing the bridge circuit board 32 along the top-down direction D3 through a black and white lens used for identifying alignment marks, the position corresponding to the first alignment mark 323 is the opening k. Due to the presence of the opening k, the position corresponding to the first alignment mark 323 is free of adhesive. Therefore, even if the adhesive layer 33 is distorted after lamination, the recognition of the first alignment mark 323 is not affected, thereby improving alignment accuracy.

[0084] To sum up, the embodiment of the present application provides another display device, which provides an opening on the adhesive layer and sets the orthographic projection of the first alignment mark on the back of the display panel to be located in the orthographic projection of the opening on the back of the display panel. In this way, there is no adhesive material at the position corresponding to the alignment mark of the bridge circuit board in the display device, that is, under the black and white lens used to identify the alignment mark, there is no distortion texture effect beside the boundary of the alignment mark, which avoids the adhesive layer affecting the identification of the alignment mark, solves the problem of poor alignment accuracy of the display device in the related art, and achieves the effect of improving the alignment accuracy of the display device.

[0085] Alternatively, in another display device shown in FIG. 14 and FIG. 15 , the base layer 321 may include a first sub-base layer 3211 , a barrier layer 3212 , a second sub-base layer 3213 and a buffer layer 3214 stacked in sequence in a direction away from the display panel 31 .

[0086] The first sub-base layer 3211 is located on the side of the adhesive layer 33 away from the display panel 31. The first sub-base layer 3211 can play the role of protection, moisture-proof, radiation-resistant and insulation. Exemplarily, the material of the first sub-base layer 3211 may include PI. The first sub-base layer 3211 can be made by a deposition process, and the deposition process includes chemical deposition or physical deposition.

[0087] The barrier layer 3212 is located on the side of the first sub-base layer 3211 away from the display panel 31. The barrier layer 3212 can isolate the heat generated inside the display panel, thereby improving the service life. Exemplarily, the material of the barrier layer 3212 can be silicon nitride or silicon oxide.

[0088] The second sub-base layer 3213 is located on the side of the shading pattern 222 away from the display panel 31. The second sub-base layer 3213 is similar to the first sub-base layer 3211 and can play the role of protection, moisture-proof, radiation-resistant and insulation. Exemplarily, the second sub-base layer 3213 can be a PI film. The second sub-base layer 3213 can be made by a deposition process, and the deposition process includes chemical deposition or physical deposition.

[0089] The buffer layer 3214 is located on the side of the second sub-base layer 3213 away from the display panel 31. The buffer layer 3214 can smooth the surface of the bridge circuit board 32, preventing the bridge circuit board 22 from warping, thereby improving the stability of the bridge circuit board 32 and the display panel 31. In addition, the buffer layer 2214 can also isolate water and oxygen. Exemplary materials for the buffer layer 3214 can include silicon oxide (such as SiO), silicon nitride (such as SiN), or silicon oxynitride (such as SiON).

[0090] An embodiment of the present application provides another display device, as shown in Figure 16, the display device 40 includes: a stacked display panel 41 and a bridge circuit board 42, and an adhesive layer 43 arranged between the display panel 41 and the bridge circuit board 42, at least one side trace 44, a shading pattern 45, a protective layer 46 and a first alignment mark 47.

[0091] The display panel 41 includes a first substrate 411 and a first circuit layer 412 disposed on the first substrate 411. The first circuit layer 412 includes a driving element 4121 and at least one first connection pad 4122. A bridge circuit board 42 is disposed on a side of the first substrate 411 away from the first circuit layer 412. The bridge circuit board 42 includes an insulating layer 421, a second circuit layer 422 disposed on the insulating layer 421, and a base layer 423. The second circuit layer 422 includes at least one second connection pad 4221 and at least one fan-out trace 4222. The base layer 423 includes an inorganic insulating layer 4231 and an organic insulating layer 4232.

[0092] The first alignment mark 47 can be a co-layer structure with the fan-out trace 4222 in the second circuit layer 422. The shading pattern 45 is arranged on the side of the base layer 423 away from the display panel 41, and the orthographic projection of the first alignment mark 47 on the back of the display panel 21 is located in the orthographic projection of the shading pattern 45 on the back of the display panel 21. That is, the adhesive layer 43 at the corresponding position of the first alignment mark 47 is blocked by the shading pattern 45. Therefore, the distorted pattern that may be generated by the adhesive layer 43 will not affect the first alignment mark 47.

[0093] In summary, an embodiment of the present application provides another display device, in which a shading pattern is set on a side of a first alignment mark close to a display panel, and the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel. In this way, some structures between the first alignment mark and the back of the display panel are blocked by the shading pattern, thereby avoiding that some structures between the first alignment mark and the back of the display panel affect the recognition of the alignment mark, solving the problem of poor alignment accuracy of the display device in the related art, and achieving the effect of improving the alignment accuracy of the display device.

[0094] An embodiment of the present application provides a method for manufacturing a display device, as shown in FIG17 , which may include:

[0095] Step 1701: forming a bridge circuit board on a substrate.

[0096] Step 1702: Separate the bridge circuit board from the substrate.

[0097] Step 1703: Dispose a bridge circuit board on the back of the display panel, and electrically connect the bridge circuit board to the display panel.

[0098] Among them, the bridge circuit board includes a circuit structure, a first alignment mark, and a stacked base layer and a shading pattern. The circuit structure and the first alignment mark are located on the side of the base layer away from the display panel, and the shading pattern is located on the side of the first alignment mark close to the display panel. The orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel, that is, the structure between the first alignment mark and the back of the display panel is blocked by the shading pattern, which can avoid some structures between the first alignment mark and the back of the display panel affecting the recognition of the first alignment mark.

[0099] In summary, an embodiment of the present application provides a method for manufacturing a display device, by setting a shading pattern on the side of a first alignment mark close to the display panel, and the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel. In this way, some structures between the first alignment mark and the back of the display panel can be blocked by the shading pattern, thereby avoiding that some structures between the first alignment mark and the back of the display panel affect the recognition of the alignment mark, solving the problem of poor alignment accuracy of the display device in the related art, and achieving the effect of improving the alignment accuracy of the display device.

[0100] An embodiment of the present application provides another method for manufacturing a display device, as shown in FIG18 , which may include:

[0101] Step 1801: Form a first sub-base layer on a substrate.

[0102] The first sub-base layer can be formed on a substrate, a flat surface component that provides support for the fabrication of various film layers within the bridge circuit board and ensures the flatness of the bridge circuit board 22. Exemplarily, the substrate can be made of glass. Referring to FIG. 19 , the first sub-base layer 2211 is positioned on the substrate 226. The first sub-base layer 2211 can provide protection, moisture resistance, radiation resistance, and insulation. Exemplarily, the material of the first sub-base layer 2211 can include PI. The first sub-base layer 2211 can be fabricated using a deposition process, such as chemical deposition or physical deposition.

[0103] Step 1802: forming a barrier layer on the first sub-base layer.

[0104] A blocking layer can be formed on the first sub-base layer. Please refer to Figure 19. The blocking layer 2212 is located on the side of the first sub-base layer 2211 away from the substrate 226. The blocking layer 2212 can isolate the heat emitted from the inside of the display panel, thereby improving the service life. Exemplarily, the material of the blocking layer 2212 can be silicon nitride or silicon oxide.

[0105] Step 1803: forming a light-shielding pattern on the blocking layer.

[0106] The light-shielding pattern can be formed on the barrier layer. Please refer to Figures 20 and 21. Figure 21 is a schematic diagram of the cross-sectional structure of Figure 20 at C4-C4. The light-shielding pattern 222 is located on the side of the barrier layer 2212 away from the substrate 226, and the orthographic projection of the first alignment mark formed in the subsequent process on the substrate 226 is located in the orthographic projection of the light-shielding pattern 222 on the substrate 226, that is, some structures between the first alignment mark and the substrate 226 are blocked by the light-shielding pattern 222. Exemplarily, the light-shielding pattern 222 can be formed by magnetron sputtering, chemical vapor deposition, or lamination of existing film materials; the material of the light-shielding pattern 222 can be acrylic, silicone film, metal film, etc. As shown in Figure 9, Figure 9 is a top view schematic diagram of another light-shielding pattern provided in an embodiment of the present application. The shape of the light-shielding pattern 222 can be regular or irregular shapes such as rectangle, fan, circle, diamond, regular hexagon, etc. In addition, the display device may also include a stress pattern 24. Figures 20 and 21 show that the stress pattern 24 and the shading pattern 222 are in the same layer structure, but the embodiments of the present application are not limited to this. For example, the stress pattern 24 may also be located between the first sub-base layer 2211 and the barrier layer 2212, or between the second sub-base layer 2213 and the buffer layer 2214, or between the buffer layer 2214 and the circuit structure 223.

[0107] Step 1804 : forming a second sub-base layer on the light-shielding pattern.

[0108] The second sub-base layer can be formed on the light-shielding pattern, please refer to Figures 6, 22 and 23 (it should be noted that, in order to clearly show the circuit structure and the first alignment mark, Figure 22 does not show the insulating layer, but this is not limited to this). Figure 23 is a schematic diagram of the cross-sectional structure of Figure 22 at C4-C4. The second sub-base layer 2213 is located on the side of the light-shielding pattern 222 away from the display panel 21. The second sub-base layer 2213 is similar to the first sub-base layer 2211 and can play a role in protection, moisture-proofing, radiation resistance and insulation. For example, the second sub-base layer 2213 can be a PI film. The second sub-base layer 2213 can be made by a deposition process, and the deposition process includes chemical deposition or physical deposition.

[0109] Step 1805 : forming a buffer layer on the second sub-base layer.

[0110] A buffer layer can be formed on the second sub-base layer. Referring to Figures 6, 22, and 23, the buffer layer 2214 is located on the side of the second sub-base layer 2213 away from the display panel 21. The buffer layer 2214 can smooth the surface of the bridge circuit board 22, preventing the bridge circuit board 22 from warping, thereby improving adhesion between the bridge circuit board 22 and the display panel 21. Furthermore, the buffer layer 2214 can also isolate water and oxygen. Exemplary materials for the buffer layer 2214 include silicon oxide (e.g., SiO), silicon nitride (e.g., SiN), or silicon oxynitride (e.g., SiON).

[0111] Step 1806: forming a circuit structure on the buffer layer.

[0112] The circuit structure can be formed on the buffer layer. Please refer to Figures 22 and 23. The circuit structure 223 includes a binding area 2231. The binding area 2231 is connected to other external components through a flexible circuit board 27, thereby providing power and signals for the display device. Exemplarily, the circuit structure 223 can be formed by a composition process. In the embodiment of the present application, the composition process involved may include photoresist coating, exposure, development, etching and photoresist stripping. In addition, the first alignment mark 224 and the circuit structure 223 are in the same layer structure. Therefore, the first alignment mark 224 and the circuit structure 223 can be processed simultaneously through a single composition process, saving a single composition process, thereby improving production efficiency and saving costs.

[0113] Step 1807: forming an insulating layer on the circuit structure.

[0114] An insulating layer can be formed on the circuit structure. Please refer to Figures 12 and 23. The insulating layer 225 is located on the side of the circuit structure 223 away from the base layer 221, and the insulating layer 225 has an opening for connection with the flexible circuit board, that is, the insulating layer 225 is used to protect other locations except for the areas that need to be used later. Exemplarily, the insulating layer 225 can be formed by a patterning process.

[0115] Step 1808: Separate the bridge circuit board from the substrate.

[0116] The bridge circuit board can be separated from the substrate through processes such as laser peeling, chemical peeling, mechanical peeling and ion beam, and laser cut into individual samples in preparation for bonding to the display panel.

[0117] Step 1809: forming an array pattern on the display panel.

[0118] The display panel can form an array pattern through a pattern process. As shown in Figure 24, the display panel 21 includes a front side A and a back side B. The front side A of the display panel 21 can be a side having a display area, and the back side B of the display panel 21 can be a side opposite to the front side A. The array pattern 24 is formed on the front side of the display panel 21. The array pattern 24 is used to form a circuit and is connected to the bridge circuit board 22.

[0119] Step 1810: Place the bridge circuit board on the back of the display panel.

[0120] The bridge circuit board can be set on the back of the display panel. As shown in Figure 25, the back side B of the display panel 21 is combined with the second side B' of the bridge circuit board 22. The combination method can include setting an adhesive layer 23 on the back of the bridge circuit board 22 and then bonding them together using a bonding device.

[0121] Step 1811: electrically connect the bridge circuit board to the display panel.

[0122] The bridge circuit board can be electrically connected to the display panel. As shown in FIG26 , the bridge circuit board 22 is electrically connected to the display panel 21 via a circuit 25. The circuit 25 can be prepared by coating and then laser etching to achieve electrical connection. Alternatively, the circuit 25 can be formed by printing a metal material, or by printing a conductive composite material, or by attaching a patterned film layer having a patterned opening (the shape of the opening can be consistent with the circuit 25), forming a conductive material layer (such as a metal layer) on the film layer, and then removing the patterned film layer to form the circuit 25. The embodiments of the present application are not limited to this.

[0123] Step 1812: Set a protective layer on the electrically connected lines.

[0124] A protective layer can be provided on the electrically connected circuit. As shown in FIG26 and FIG27 , providing a protective layer 46 on the electrically connected circuit 25 can protect the circuit 25 from external influences in subsequent harsh environments. Exemplarily, the protective layer 46 can be provided in various ways such as pad printing and printing, and the material of the protective layer 46 can be at least one material that is anti-collision and anti-water and oxygen-resistant.

[0125] Step 1813: Bind the flexible circuit board to the bridge circuit board.

[0126] In the embodiment of the present application, the flexible circuit board can be bound in the binding area on the bridge circuit board through a binding process. Please refer to Figure 13. The binding area 2231 is bound to one end of the flexible circuit board 27, and the other end of the flexible circuit board 27 can be connected to the power supply and control components, thereby providing power and signals for the display device.

[0127] In summary, an embodiment of the present application provides a method for manufacturing a display device, by setting a shading pattern on the side of a first alignment mark close to the display panel, and the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel. In this way, some structures between the first alignment mark and the back of the display panel can be blocked by the shading pattern, thereby avoiding that some structures between the first alignment mark and the back of the display panel affect the recognition of the alignment mark, solving the problem of poor alignment accuracy of the display device in the related art, and achieving the effect of improving the alignment accuracy of the display device.

[0128] In this application, the term "at least one of A and B" simply describes an association relationship between associated objects, indicating that three possible relationships exist. For example, "at least one of A and B" can mean: A exists alone, A and B exist simultaneously, and B exists alone. Similarly, "at least one of A, B, and C" means that seven possible relationships exist, indicating: A exists alone, B exists alone, C exists alone, A and B exist simultaneously, A and C exist simultaneously, C and B exist simultaneously, and A, B, and C exist simultaneously.

[0129] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0130] In this application, the terms "first", "second" and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0131] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display device, characterized in that: The display device comprises: A display panel and a bridge circuit board located on the back of the display panel, wherein the bridge circuit board is electrically connected to the display panel; The bridge circuit board includes a circuit structure, a first alignment mark, and a stacked base layer and a shading pattern, wherein the circuit structure and the first alignment mark are located on a side of the base layer away from the display panel, the shading pattern is located on a side of the first alignment mark close to the display panel, and an orthographic projection of the first alignment mark on the back of the display panel is located in an orthographic projection of the shading pattern on the back of the display panel.

2. The display device according to claim 1, characterized in that The display device further includes an adhesive layer, which is located between the base layer and the back surface of the display panel, and the adhesive layer is respectively bonded to the base layer and the back surface of the display panel.

3. The display device according to claim 1, characterized in that The base layer includes a first sub-base layer, a barrier layer, a second sub-base layer, and a buffer layer which are sequentially stacked in a direction away from the display panel.

4. The display device according to claim 3, characterized in that The light shielding pattern is located between the first sub-base layer and the circuit structure.

5. The display device according to claim 4, characterized in that: The light shielding pattern is located between the barrier layer and the second sub-base layer.

6. The display device according to claim 1, characterized in that: The display panel includes a second alignment mark, and an orthographic projection of the second alignment mark on the back side of the display panel is located outside the orthographic projection of the light shielding pattern on the back side of the display panel.

7. The display device according to claim 1, characterized in that: The display device further comprises a stress pattern, and an orthographic projection of the stress pattern on the back of the display panel is outside an orthographic projection of the circuit structure on the back of the display panel, and the stress pattern is used to improve the flatness of the bridge circuit board.

8. The display device according to claim 7, characterized in that: The stress pattern and the light shielding pattern are in the same layer structure.

9. The display device according to claim 1, characterized in that: The circuit structure includes a binding area, and an orthographic projection of the binding area on the back surface of the display panel is located in an orthographic projection of the light shielding pattern on the back surface of the display panel.

10. The display device according to claim 9, characterized in that: The bridge circuit board also includes an insulating layer, which is located on a side of the circuit structure away from the display panel, and the insulating layer has an opening, and the orthographic projection of the binding area on the back of the display panel is located in the orthographic projection of the opening on the back of the display panel.

11. The display device according to any one of claims 1 to 10, characterized in that: The color of the light shielding pattern is different from the color of the first alignment mark.

12. The display device according to any one of claims 1 to 10, characterized in that: The first alignment mark and the circuit structure are in the same layer structure.

13. The display device according to any one of claims 1 to 10, characterized in that: The material of the light shielding pattern includes at least one of acrylic, silicone film or metal film.

14. A display device, characterized in that: The display device comprises: A display panel and a bridge circuit board located on the back of the display panel, wherein the bridge circuit board is electrically connected to the display panel; The bridge circuit board includes a circuit structure, a first alignment mark, and a stacked base layer and a light shielding pattern. The circuit structure and the contrast mark are located on a side of the base layer away from the display panel. The adhesive layer is located between the base layer and the back of the display panel, and the adhesive layer is respectively bonded to the base layer and the back of the display panel. The adhesive layer has an opening. An orthographic projection of an alignment mark on the back surface of the display panel is located in an orthographic projection of the opening on the back surface of the display panel.

15. A method for manufacturing a display device, characterized in that: The method comprises: forming a bridge circuit board on a substrate; separating the bridge circuit board from the substrate; Disposing the bridge circuit board on the back of the display panel, and electrically connecting the bridge circuit board to the display panel; Among them, the bridge circuit board includes a circuit structure, a first alignment mark, and a stacked base layer and a shading pattern, the circuit structure and the contrast mark are located on the side of the base layer away from the display panel, the shading pattern is located on the side of the first alignment mark close to the substrate, and the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel.

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