Ultrasonic fingerprint recognition apparatus and electronic device

Abstract

Embodiments of the present application provide an ultrasonic fingerprint recognition apparatus and an electronic device. The recognition apparatus is arranged on a side middle frame of the electronic device to implement ultrasonic fingerprint recognition. The side middle frame is provided with a mechanical press-key or a hidden press-key. The ultrasonic fingerprint recognition apparatus comprises an ultrasonic fingerprint sensor chip, a flexible circuit board, and a bonding wire. The ultrasonic fingerprint sensor chip is attached to the inner surface of a cover plate of the mechanical press-key or the inner surface of the middle frame where the hidden press-key is located. The ultrasonic fingerprint sensor chip is used for sending an ultrasonic signal to a finger, the finger presses the outer surface of the cover plate or the hidden press-key, and the ultrasonic fingerprint sensor chip receives an ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip is electrically connected to the flexible circuit board by means of the bonding wire, and the ultrasonic fingerprint sensor chip is connected to a motherboard of the electronic device by means of a wire of the flexible circuit board.

Description

Ultrasonic fingerprint recognition device and electronic equipment

[0001] This application claims priority to the Chinese invention patent application with application date of August 24, 2023, application number "202310977254.8", and patent name "An Ultrasonic Fingerprint Recognition Device and Electronic Device", and the Chinese invention patent application with application date of October 17, 2023, application number "202311351097.6", and patent name "An Ultrasonic Fingerprint Recognition Device and Electronic Device", all of which are hereby incorporated by reference. Technical Field

[0002] The embodiments of the present application relate to the field of fingerprint recognition technology, and in particular to an ultrasonic fingerprint recognition device and electronic equipment. Background Art

[0003] With the development of the consumer electronics industry, electronic devices with fingerprint recognition functions on the side are becoming increasingly popular. Capacitive fingerprint recognition devices are usually installed in the buttons of the side frame of electronic devices to achieve fingerprint recognition functions. Due to the poor penetration of the capacitive fingerprint recognition chip in the capacitive fingerprint recognition device, the mechanical reliability of the capacitive fingerprint recognition device is lacking, which in turn affects the design of the buttons on the side frame of the electronic device. In addition, the capacitive fingerprint recognition chip also makes it impossible to design the button cover of the side of the electronic device as a curved surface, which also affects the design of the buttons on the side frame of the electronic device.

[0004] Therefore, how to improve the mechanical reliability of the capacitive fingerprint recognition device and prevent the capacitive fingerprint recognition chip from affecting the button design of the side frame of the electronic device has become a technical problem that needs to be solved urgently.

[0005] Summary of the Invention

[0006] In view of this, one of the technical problems solved by the embodiments of the present application is to provide an ultrasonic fingerprint recognition device and an electronic device, which improves the mechanical reliability of the capacitive fingerprint recognition device and avoids the capacitive fingerprint recognition chip affecting the button design of the side middle frame of the electronic device.

[0007] In a first aspect, an ultrasonic fingerprint recognition device is provided, which is arranged on a side middle frame of an electronic device to realize ultrasonic fingerprint recognition. The side middle frame has a mechanical button or a hidden button. The ultrasonic fingerprint recognition device includes: an ultrasonic fingerprint sensor chip, a flexible circuit board and a bonding wire. The ultrasonic fingerprint sensor chip is attached to the inner surface of the cover of the mechanical button or the inner surface of the middle frame where the hidden button is located. The ultrasonic fingerprint sensor chip is used to send an ultrasonic signal to a finger. The finger presses the outer surface of the cover or the hidden button. The ultrasonic fingerprint sensor chip receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip is electrically connected to the flexible circuit board through the bonding wire. The ultrasonic fingerprint sensor chip is connected to the mainboard of the electronic device through the wiring of the flexible circuit board.

[0008] In a second aspect, another ultrasonic fingerprint recognition device is provided. The device is disposed on a side middle frame of an electronic device to implement ultrasonic fingerprint recognition. The side middle frame has a mechanical key. The ultrasonic fingerprint recognition device includes: an ultrasonic fingerprint sensor chip, a flexible circuit board, and bonding wires. The back surface of the ultrasonic fingerprint sensor chip is attached to the inner surface of the cover of the mechanical key. The ultrasonic fingerprint sensor chip is used to emit an ultrasonic signal to a finger. When the finger presses on the outer surface of the cover, the ultrasonic fingerprint sensor chip receives the ultrasonic fingerprint signal returned by the finger. The front surface of the ultrasonic fingerprint sensor chip has a reserved solder pad and is electrically connected to the first surface of the first end of the flexible circuit board via the bonding wire. The ultrasonic fingerprint sensor chip is connected to the mainboard of the electronic device via the traces of the flexible circuit board. The second surface of the first end of the flexible circuit board is opposite to the front surface of the ultrasonic fingerprint sensor chip, with a gap layer between the second surface of the first end of the flexible circuit board and the front surface of the ultrasonic fingerprint sensor chip. The first surface of the second end of the flexible circuit board is fixed to the inner surface of the cover of the mechanical key, and the second surface of the second end of the flexible circuit board is fixed to the mechanical key switch.

[0009] According to a third aspect, another ultrasonic fingerprint recognition device is provided. The ultrasonic fingerprint recognition device is disposed on a side middle frame of an electronic device to implement ultrasonic fingerprint recognition. The side middle frame has a mechanical button. The ultrasonic fingerprint recognition device includes: an ultrasonic fingerprint sensor chip, a flexible circuit board, bonding wires, and a back cover. The back surface of the ultrasonic fingerprint sensor chip is attached to the inner surface of the cover of the mechanical button. The back cover forms a closed environment around the cover of the mechanical button. The ultrasonic fingerprint sensor chip is located in the closed environment. The ultrasonic fingerprint sensor chip is configured to emit an ultrasonic signal to a finger. The finger presses on the outer surface of the cover. The ultrasonic fingerprint sensor chip receives the ultrasonic fingerprint signal returned by the finger. The front surface of the ultrasonic fingerprint sensor chip has a reserved solder pad. The bonding wire passes through a notch in the back cover to electrically connect the solder pad to the first surface of the flexible circuit board. The ultrasonic fingerprint sensor chip is connected to the mainboard of the electronic device via the traces of the flexible circuit board. The second surface of the flexible circuit board is attached to the outer surface of the back cover. A gap layer is provided between the inner surface of the back cover and the front surface of the ultrasonic fingerprint sensor chip.

[0010] In a fourth aspect, an electronic device is provided, comprising: a side middle frame and the ultrasonic fingerprint recognition device described in any one of the first aspect, the first aspect or the third aspect, wherein the ultrasonic fingerprint recognition device is arranged on the side middle frame to realize ultrasonic fingerprint recognition.

[0011] In the embodiment of the present application, an ultrasonic fingerprint recognition device includes an ultrasonic fingerprint sensor chip, a flexible circuit board, and bonding wires. The ultrasonic fingerprint sensor chip is attached to the inner surface of a cover plate for a mechanical key on the electronic device's middle frame, or the inner surface of the middle frame where a hidden key is located. The ultrasonic fingerprint sensor chip is configured to emit an ultrasonic signal to a finger. When the finger presses the outer surface of the cover plate or the hidden key, the ultrasonic fingerprint sensor chip receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip is electrically connected to the flexible circuit board via bonding wires, and the ultrasonic fingerprint sensor chip is connected to the electronic device's mainboard via traces on the flexible circuit board. Therefore, by using an ultrasonic fingerprint sensor chip instead of a capacitive fingerprint sensor chip, the embodiment of the present application avoids the mechanical reliability issues of capacitive fingerprint recognition devices caused by the poor penetration of capacitive fingerprint sensor chips, which in turn affects the design of the keys on the side middle frame of the electronic device. Furthermore, the key cover plate for the side keys of the ultrasonic fingerprint sensor chip used in the embodiment of the present application can be designed as a curved surface, without affecting the key design of the side middle frame of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Hereinafter, some specific embodiments of the present application will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0013] FIG1 is a top view of a capacitive fingerprint recognition device mounted on the side frame of an electronic device;

[0014] FIG2 is a schematic diagram of the packaging of a capacitive fingerprint recognition device mounted on the side middle frame of an electronic device;

[0015] FIG3 is a schematic diagram of the assembly of a capacitive fingerprint recognition device mounted on the side middle frame of an electronic device;

[0016] FIG4 is a top view of an ultrasonic fingerprint recognition device provided in an embodiment of the present application;

[0017] FIG5 is a schematic diagram of the packaging of an ultrasonic fingerprint recognition device provided in an embodiment of the present application;

[0018] FIG6 is a side view of an ultrasonic fingerprint recognition device provided in an embodiment of the present application;

[0019] FIG7 is a top view of an ultrasonic fingerprint recognition device provided by another embodiment of the present application;

[0020] FIG8 is a schematic diagram of the packaging of an ultrasonic fingerprint recognition device provided by another embodiment of the present application;

[0021] FIG9 is a side view of an ultrasonic fingerprint recognition device provided by another embodiment of the present application;

[0022] FIG10 is a top view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0023] FIG11 is a schematic diagram of the packaging of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0024] FIG12 is a side view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0025] FIG13 is a top view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0026] FIG14 is a schematic diagram of the packaging of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0027] FIG15 is a side view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0028] FIG16 is a top view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0029] FIG17 is a schematic diagram of the packaging of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0030] FIG18 is a side view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0031] FIG19 is a top view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0032] FIG20 is a schematic diagram of the packaging of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0033] FIG21 is a side view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0034] FIG22 is a top view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0035] FIG23 is a schematic diagram of the packaging of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0036] FIG24 is a top view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0037] FIG25 is a schematic diagram of the packaging of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0038] FIG26 is a top view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0039] FIG27 is a schematic diagram of the packaging of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0040] FIG28 is a top view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0041] FIG29 is a schematic diagram of the packaging of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application;

[0042] FIG30 is a side view of an ultrasonic fingerprint recognition device provided by yet another embodiment of the present application;

[0043] FIG31 is a schematic diagram of an electronic device provided in accordance with another embodiment of the present application. DETAILED DESCRIPTION

[0044] The specific implementation of the embodiment of the present invention is further described below with reference to the accompanying drawings of the embodiment of the present invention.

[0045] The embodiments of the present application can be applied to any electronic device that can install an indication and identification device on the side frame, such as a mobile phone, pad, computer, wearable device, etc.

[0046] Figure 1 is a top view of a capacitive fingerprint recognition device installed on the side middle frame of an electronic device, Figure 2 is a packaging schematic diagram of a capacitive fingerprint recognition device installed on the side middle frame of an electronic device, and Figure 3 is an assembly schematic diagram of a capacitive fingerprint recognition device installed on the side middle frame of an electronic device.

[0047] Referring to Figures 1 and 2 , a capacitive fingerprint recognition device includes a plastic layer 11 disposed on the inner surface of a key cover 2, and a capacitive fingerprint recognition chip 12 encapsulated by the plastic layer 11. Due to the poor penetration performance of the capacitive fingerprint recognition chip 12 in the capacitive fingerprint recognition device, the thickness of the plastic layer 11 on the front surface of the capacitive fingerprint recognition chip 12 must be controlled within 150 μm. Consequently, the mechanical reliability of the capacitive fingerprint recognition device is poor. Referring to Figure 2 , to improve the mechanical reliability of the capacitive fingerprint recognition device, a groove is typically cut in the key area corresponding to the capacitive fingerprint recognition device on the side middle frame of the electronic device, reducing the height of the key to a lower level than the plane of the middle frame. This allows the middle frame to protect the capacitive fingerprint recognition device, which has poor mechanical reliability. Due to the limitations of the capacitive fingerprint recognition chip 12, the pressing surface of the capacitive fingerprint recognition button on the side middle frame of the electronic device can generally only be flat. When the middle frame is curved, the capacitive fingerprint recognition button design lacks aesthetic appeal. Furthermore, the surface finish of capacitive fingerprint recognition buttons is generally a matte coating process, which also imposes certain limitations on the button design.

[0048] To overcome the aforementioned technical drawbacks, the present invention utilizes an ultrasonic fingerprint sensor chip in place of a capacitive fingerprint sensor chip. This avoids the mechanical reliability issues inherent in capacitive fingerprint recognition devices due to the poor penetration of the capacitive fingerprint sensor chip, which in turn affects the design of the buttons on the side frame of the electronic device. Furthermore, the button cover for the side buttons of the ultrasonic fingerprint sensor chip employed in the present invention can be designed as a curved surface, without affecting the button design on the side frame of the electronic device.

[0049] The first embodiment of the present application specifically implements an ultrasonic fingerprint recognition device. The ultrasonic fingerprint recognition device of the embodiment of the present application is arranged on the side middle frame of the electronic device to realize ultrasonic fingerprint recognition. The side middle frame of the electronic device has a mechanical button or a hidden button. The mechanical button refers to a component with a button cover and is separated from the side middle frame of the electronic device. The user can press the mechanical case to achieve the corresponding operation; the hidden button refers to a component that is integrated with the side middle frame of the electronic device and can also achieve the corresponding operation by pressing the mechanical case with the user's finger.

[0050] First embodiment

[0051] Figure 4 is a top view of the ultrasonic fingerprint recognition device provided in an embodiment of the present application, Figure 5 is a packaging schematic diagram of the ultrasonic fingerprint recognition device provided in an embodiment of the present application, and Figure 6 is a side view of the ultrasonic fingerprint recognition device provided in an embodiment of the present application.

[0052] 4 and 5 , the ultrasonic fingerprint recognition device 4 provided in an embodiment of the present application is applied to an electronic device having a mechanical button on the side middle frame. The ultrasonic fingerprint recognition device 4 includes: an ultrasonic fingerprint sensor chip 41, a flexible circuit board 42, and a bonding wire 43. The back of the ultrasonic fingerprint sensor chip 41 is attached to the inner surface of the cover plate 2 of the mechanical button. The front of the ultrasonic fingerprint sensor chip 41 has a reserved pad and is electrically connected to the first surface of the flexible circuit board 42 through the bonding wire 43. The ultrasonic fingerprint sensor chip 41 is used to send an ultrasonic signal to the finger. The finger presses on the outer surface of the cover plate, and the ultrasonic fingerprint sensor chip 41 receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip 41 is connected to the mainboard of the electronic device (not shown in the figure) through the wiring of the flexible circuit board 42. The second surface of the flexible circuit board 43 is attached to the inner surface of the cover plate 2 of the mechanical button.

[0053] In the specific implementation of the first embodiment of the present application, in order to ensure the bonding effect between the ultrasonic fingerprint sensor chip 41 and the cover plate 2 of the mechanical key, the ultrasonic fingerprint sensor chip 41 is bonded to the inner surface of the cover plate 2 of the mechanical key through an adhesive 44.

[0054] Specifically, the adhesive 44 is glue or film, which further improves the bonding effect and saves process costs.

[0055] In the specific implementation of the first embodiment of the present application, the ultrasonic fingerprint recognition device 4 also includes a special-shaped reinforcement component 45, one end of the special-shaped reinforcement component 45 is connected to the inner surface of the cover plate 2, and the other end is attached to the first surface of the flexible circuit board 42. The special-shaped reinforcement component 45 surrounds the ultrasonic fingerprint sensor chip 41 to provide reinforcement protection, and a gap layer 46 is set between the special-shaped reinforcement component 45 and the front of the ultrasonic fingerprint sensor chip 41.

[0056] Specifically, the gap layer 46 is made of foam or air, so that the ultrasonic signal emitted by the ultrasonic fingerprint sensor chip 41 is interrupted from penetrating toward the gap layer 46 , and only the ultrasonic signal change caused by the finger pressing the cover is retained, thereby reducing the interference of useless ultrasonic signals and improving the consistency of the signal amount.

[0057] In a specific implementation of the first embodiment of the present application, the bonding wire 43 is covered with a bonding wire protection glue 431 to protect the bonding wire 43 and the pad corresponding to the bonding wire 43 .

[0058] The special-shaped reinforcement component 45 in the embodiment of the present application is used to reinforce and protect the acoustic fingerprint sensor chip 41, thereby improving the mechanical reliability of the ultrasonic fingerprint recognition device 4.

[0059] 6 , the ultrasonic fingerprint sensor chip 41 is sealed around by dispensing glue 47 , thereby improving the waterproofness, mechanical reliability, and environmental reliability of the ultrasonic fingerprint recognition device of the embodiment of the present application.

[0060] Specifically, the gap layer 46 is configured to be foam, which can prevent the glue 47 from contaminating the ultrasonic fingerprint sensor chip 41 .

[0061] In the specific implementation of the first embodiment of the present application, in order to enable the key cover 2 to provide a better pressing feel, the ultrasonic fingerprint recognition device 4 also includes a silicone layer 48. The first surface of the silicone layer 48 is attached to the second surface of the special-shaped reinforcement component 45. The second surface of the silicone layer 48 has a dome protrusion, so that when the outer surface of the cover 2 receives the force of the finger, the silicone layer 48 presses the dome protrusion.

[0062] The key cover 2 of the side key of the ultrasonic fingerprint sensor chip 41 used in the embodiment of the present application can be designed as a curved surface, which has no effect on the key design of the side middle frame of the electronic device and can improve the aesthetic appearance of the key design.

[0063] The cover plate 2 of the present embodiment can be made of glass, metal, or plastic. Specifically, the glass can contain ink, or even sapphire glass containing ink. The metal can be made of aluminum alloy, stainless steel, or other materials. Vacuum plating and other processes are used, and plastic can be vacuum-coated, matte-finished, spray-painted, or polished. The cover plate of the present embodiment supports a variety of materials and processes, enhancing the aesthetic appeal of the keypad design.

[0064] By replacing a capacitive fingerprint sensor chip with an ultrasonic fingerprint sensor chip, this embodiment of the present application avoids the mechanical reliability issues of a capacitive fingerprint recognition device due to the poor penetration of the capacitive fingerprint sensor chip. In this embodiment of the present application, the thickness of the cover plate 2 is greater than or equal to 2 mm, which provides the ultrasonic fingerprint recognition device with strong mechanical reliability and eliminates the need for a button design to protect the ultrasonic fingerprint recognition device.

[0065] Specifically, the thickness of the cover plate is one of 0.8 mm, 1.0 mm, and 1.3 mm, thereby ensuring that the ultrasonic fingerprint recognition device has strong mechanical reliability and facilitating the design and processing of the cover plate.

[0066] Second embodiment

[0067] FIG7 is a top view of an ultrasonic fingerprint recognition device provided in another embodiment of the present application, FIG8 is a packaging schematic diagram of an ultrasonic fingerprint recognition device provided in another embodiment of the present application, and FIG9 is a side view of an ultrasonic fingerprint recognition device provided in another embodiment of the present application.

[0068] Referring to Figures 7 and 8, an ultrasonic fingerprint recognition device 4 provided in another embodiment of the present application is applied to an electronic device having a mechanical button on the side middle frame. The difference from the first embodiment is that the ultrasonic fingerprint recognition device 4 also includes a ring component 49, one end of the ring component 49 is arranged around the cover plate 2, and the other end of the ring component 49 is respectively connected to the special-shaped reinforcement component 45 and the back of the flexible circuit board 42 to form a sealed environment, and the ultrasonic fingerprint sensor chip 41 is in the sealed environment.

[0069] Specifically, in the embodiment of the present application, one end of the annular component 49 is disposed around the cover plate 2, including one end of the annular component 49 being disposed around the inner surface or the outer surface of the cover plate 2 (as shown in FIG. 7 ).

[0070] 9 , a sealed environment is formed around the ultrasonic fingerprint sensor chip 41 by combining the annular component 49 with the special-shaped reinforcement component 45 and the flexible circuit board 42, thereby improving the waterproofness, mechanical reliability and environmental reliability of the ultrasonic fingerprint recognition device of the embodiment of the present application.

[0071] Specifically, in the specific implementation of the first embodiment of the present application, the cover plate 2 is made of plastic material, and the process adopts injection molding or plate CNC (Computer Numerical Control) process.

[0072] The annular component 49 can be made of metal or plastic. When metal is used, it can be bonded to the cover plate 2 by glue, in-mold injection molding, etc. When plastic is used, it can be integrally formed with the cover plate 2 by injection molding.

[0073] In the specific implementation of Example 1 of the present application, in order to further improve the waterproofness, mechanical reliability and environmental reliability of the ultrasonic fingerprint recognition device, the special-shaped reinforcement component 45 and the annular component 49 and the special-shaped reinforcement component 45 and the cover plate 2 are connected by glue 47.

[0074] Specifically, the gap layer 46 is made of foam or air, so that the ultrasonic signal emitted by the ultrasonic fingerprint sensor chip 41 is interrupted from penetrating toward the gap layer 46 , and only the ultrasonic signal change caused by the finger pressing the cover is retained, thereby reducing the interference of useless ultrasonic signals and improving the consistency of the signal amount.

[0075] Specifically, the gap layer 46 is set to be an air gap, which can provide better blocking of useless ultrasonic signals in the direction of the gap layer 46 and further improve the consistency of the signal amount.

[0076] Third embodiment

[0077] FIG10 is a top view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application, FIG11 is a schematic diagram of the packaging of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application, and FIG12 is a side view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application.

[0078] Referring to Figures 10 to 12, another embodiment of the present application provides an ultrasonic fingerprint recognition device 4 that is applied to an electronic device having a mechanical button on the side middle frame. The difference from the second embodiment is that the annular component 49 in the ultrasonic fingerprint recognition device 4 is made of hardware, and one end of the annular component 49 is arranged around the outer surface of the cover 2 so that the finger touches the annular component 49 when pressing the cover. The reserved pads of the flexible circuit board 42 include a ground terminal and a pad for receiving a capacitive sensor. The annular component 49 is connected to the ground terminal of the flexible circuit board 42 or the pad 51 for receiving a capacitive sensor through a conductive adhesive 50, thereby forming a ground terminal or a receiving capacitive sensor. If a receiving capacitive sensor is formed, the receiving capacitive sensor can be used to trigger the electronic device to enter the fingerprint recognition state from the sleep state.

[0079] This embodiment of the present application utilizes a ring-shaped component made of a metal material. The surface of the ring-shaped component is conductive, allowing it to further form a ground terminal or receive a capacitive sensor through electrical connection to a pad on a flexible printed circuit board. This embodiment of the present application utilizes the ring-shaped component to achieve further circuit functions. The ring-shaped component also reduces the width of the key cover, enhancing the aesthetic appearance of the key.

[0080] Fourth embodiment

[0081] FIG13 is a top view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application, FIG14 is a schematic diagram of the packaging of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application, and FIG15 is a side view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application.

[0082] Referring to Figures 13 and 14, another embodiment of the present application provides an ultrasonic fingerprint recognition device 4 for use in an electronic device having a mechanical button on its side middle frame. The difference from the first embodiment is that the ultrasonic fingerprint recognition device 4 further includes a reinforcement plate 52, the flexible circuit board 42 includes a first portion 421, and the ultrasonic fingerprint sensor chip 41 includes a first portion 411 and a second portion 412. The front surface of the first portion 411 of the ultrasonic fingerprint sensor chip 41 is bonded to the inner surface of the cover plate 2 of the mechanical button. The front surface of the second portion 412 of the ultrasonic fingerprint sensor chip 41 has a reserved solder pad and is electrically connected to the first surface of the first portion 421 of the flexible circuit board 42 via a bonding wire 43. The second surface of the first portion 421 of the flexible circuit board 42 and the back surface of the ultrasonic fingerprint sensor chip 41 are both bonded to the first surface of the reinforcement plate 52.

[0083] In the specific implementation of the first embodiment of the present application, in order to ensure the bonding effect between the ultrasonic fingerprint sensor chip 41 and the cover plate 2 of the mechanical key, the ultrasonic fingerprint sensor chip 41 is bonded to the inner surface of the cover plate 2 of the mechanical key through an adhesive 44.

[0084] Specifically, the adhesive 44 is glue or film, which further improves the bonding effect and saves process costs.

[0085] In a specific implementation of the first embodiment of the present application, the ultrasonic fingerprint recognition device 4 further includes a special-shaped reinforcement component 45, one end of the first surface of the special-shaped reinforcement component 45 is connected to the inner surface of the cover plate 2, and the other end is connected to an edge end of the second surface of the reinforcement plate 52. The special-shaped reinforcement component 45 surrounds the ultrasonic fingerprint sensor chip 41 to provide reinforcement protection, and a gap layer 46 is provided between the first surface of the special-shaped reinforcement component 45 and the second surface of the reinforcement plate 52.

[0086] Specifically, one end of the first surface of the special-shaped reinforcing component 45 is connected to the inner surface of the cover plate 2 via adhesive, and the other end is connected to an edge end of the second surface of the reinforcing plate 52 via adhesive.

[0087] Specifically, the gap layer 46 is made of foam or air, so that the ultrasonic signal emitted by the ultrasonic fingerprint sensor chip 41 is interrupted from penetrating toward the gap layer 46 , and only the ultrasonic signal change caused by the finger pressing the cover is retained, thereby reducing the interference of useless ultrasonic signals and improving the consistency of the signal amount.

[0088] In a specific implementation of the first embodiment of the present application, the bonding wire 43 is covered with a bonding wire protection glue 431 to protect the bonding wire 43 and the pad corresponding to the bonding wire 43 .

[0089] The special-shaped reinforcement component 45 in the embodiment of the present application is used to reinforce and protect the acoustic fingerprint sensor chip 41, thereby improving the mechanical reliability of the ultrasonic fingerprint recognition device 4.

[0090] 15 , the ultrasonic fingerprint sensor chip 41 is sealed around by dispensing glue 47 , thereby improving the waterproofness, mechanical reliability, and environmental reliability of the ultrasonic fingerprint recognition device of the embodiment of the present application.

[0091] Specifically, the gap layer 46 is configured to be foam, which can prevent the glue 47 from contaminating the ultrasonic fingerprint sensor chip 41 .

[0092] In the specific implementation of the first embodiment of the present application, in order to enable the key cover 2 to provide a better pressing feel, the ultrasonic fingerprint recognition device 4 also includes a silicone layer 48. The first surface of the silicone layer 48 is attached to the second surface of the special-shaped reinforcement component 45. The second surface of the silicone layer 48 has a dome protrusion, so that when the outer surface of the cover 2 receives the force of the finger, the silicone layer 48 presses the dome protrusion.

[0093] The key cover 2 of the side key of the ultrasonic fingerprint sensor chip 41 used in the embodiment of the present application can be designed as a curved surface, which has no effect on the key design of the side middle frame of the electronic device and can improve the aesthetic appearance of the key design.

[0094] The cover plate 2 of the present embodiment can be made of glass, metal, or plastic. Specifically, the glass can contain ink, or even sapphire glass containing ink. The metal can be made of aluminum alloy, stainless steel, or other materials. Vacuum plating and other processes are used, and plastic can be vacuum-coated, matte-finished, spray-painted, or polished. The cover plate of the present embodiment supports a variety of materials and processes, enhancing the aesthetic appeal of the keypad design.

[0095] By replacing a capacitive fingerprint sensor chip with an ultrasonic fingerprint sensor chip, this embodiment of the present application avoids the mechanical reliability issues of a capacitive fingerprint recognition device due to the poor penetration of the capacitive fingerprint sensor chip. In this embodiment of the present application, the thickness of the cover plate 2 is greater than or equal to 2 mm, which provides the ultrasonic fingerprint recognition device with strong mechanical reliability and eliminates the need for a button design to protect the ultrasonic fingerprint recognition device.

[0096] Specifically, the thickness of the cover plate is one of 0.8 mm, 1.0 mm, and 1.3 mm, thereby ensuring that the ultrasonic fingerprint recognition device has strong mechanical reliability and facilitating the design and processing of the cover plate.

[0097] Fifth embodiment

[0098] FIG16 is a top view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application, FIG17 is a schematic diagram of the packaging of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application, and FIG18 is a side view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application.

[0099] 16 and 17 , an ultrasonic fingerprint recognition device 4 provided in another embodiment of the present application is applied to an electronic device having a mechanical button on the side middle frame. The difference from the fourth embodiment is that the ultrasonic fingerprint recognition device 4 further includes an annular component 49, one end of which is arranged around the cover plate 2, and the other end of the annular component 49 is respectively connected to the special-shaped reinforcement component 45 and the back of the flexible circuit board 42 to form a sealed environment, and the ultrasonic fingerprint sensor chip 41 is in the sealed environment.

[0100] 18 , a sealed environment is formed around the ultrasonic fingerprint sensor chip 41 by combining the annular component 49 with the special-shaped reinforcement component 45 and the flexible circuit board 42, thereby improving the waterproofness, mechanical reliability and environmental reliability of the ultrasonic fingerprint recognition device of the embodiment of the present application.

[0101] Specifically, in the specific implementation of the first embodiment of the present application, the cover plate 2 is made of plastic material, and the process adopts injection molding or plate CNC (Computer Numerical Control) process.

[0102] The annular component 49 can be made of metal or plastic. When metal is used, it can be bonded to the cover plate 2 by glue, in-mold injection molding, etc. When plastic is used, it can be integrally formed with the cover plate 2 by injection molding.

[0103] In the specific implementation of Example 1 of the present application, in order to further improve the waterproofness, mechanical reliability and environmental reliability of the ultrasonic fingerprint recognition device, the special-shaped reinforcement component 45 and the annular component 49 and the special-shaped reinforcement component 45 and the cover plate 2 are connected by glue 47.

[0104] Specifically, the gap layer 46 is made of foam or air, so that the ultrasonic signal emitted by the ultrasonic fingerprint sensor chip 41 is interrupted from penetrating toward the gap layer 46 , and only the ultrasonic signal change caused by the finger pressing the cover is retained, thereby reducing the interference of useless ultrasonic signals and improving the consistency of the signal amount.

[0105] Specifically, the gap layer 46 is set to be an air gap, which can provide better blocking of useless ultrasonic signals in the direction of the gap layer 46 and further improve the consistency of the signal amount.

[0106] Sixth embodiment

[0107] FIG19 is a top view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application, FIG20 is a schematic diagram of the packaging of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application, and FIG21 is a side view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application.

[0108] Referring to Figures 19 to 21, an ultrasonic fingerprint recognition device 4 provided in another embodiment of the present application is applied to an electronic device with a side middle frame having mechanical buttons. The difference from the second embodiment is that the ultrasonic fingerprint recognition device 4 has a circular raised edge 53 on all sides of the cover plate 2 facing the inner surface of the cover plate 2, the back of the ultrasonic fingerprint sensor chip 41 is attached to the inner surface of the cover plate 2 of the mechanical button, the ultrasonic fingerprint sensor chip 41 is accommodated in the circular raised edge 53, and the front of the ultrasonic fingerprint sensor chip 41 has a reserved pad and is electrically connected to the first surface of the flexible circuit board 42 through a bonding wire 43.

[0109] In the embodiment of the present application, the annular component 49 in the second embodiment is replaced by an annular raised edge 53 having an inner surface of the cover plate 2 and arranged around the cover plate 2. The annular raised edge 53 on the inner surface of the cover plate 2 improves the waterproofness, mechanical reliability and environmental reliability of the ultrasonic fingerprint recognition device in the embodiment of the present application.

[0110] Specifically, the cover plate 2 of the embodiment of the present application is made of plastic material and injection molding process, which makes the manufacturing process of the cover plate simpler and saves manufacturing and assembly costs.

[0111] In a specific implementation of the first embodiment of the present application, the ultrasonic fingerprint recognition device 4 further includes a reinforcement plate 52, the second surface of the flexible circuit board 42 is adhered to the first surface of the reinforcement plate 52, and a gap layer 46 is provided between the second surface of the reinforcement plate 52 and the front surface of the ultrasonic fingerprint sensor chip 41. The reinforcement plate of the embodiment of the present application improves the strength of the ultrasonic fingerprint recognition device 4.

[0112] In a specific implementation of the first embodiment of the present application, the ultrasonic fingerprint recognition device 4 further includes a special-shaped reinforcement component 45 , one end of which is in contact with the first surface of the flexible circuit board 42 , and the other end is connected to the annular raised edge 53 .

[0113] The special-shaped reinforcement component 45 in the embodiment of the present application is used to reinforce and protect the acoustic fingerprint sensor chip 41, thereby improving the mechanical reliability of the ultrasonic fingerprint recognition device 4.

[0114] In the embodiment of the present application, the annular raised edge 53 is combined with the special-shaped reinforcement component 45 and the reinforcement plate 52 to form a sealed environment, thereby further improving the waterproofness, mechanical reliability and environmental reliability of the ultrasonic fingerprint recognition device in the embodiment of the present application.

[0115] The annular raised edge 53 in the embodiment of the present application is sealed with the special-shaped reinforcement component 45 and the reinforcement plate 52 by glue 47, thereby further improving the waterproofness, mechanical reliability and environmental reliability of the ultrasonic fingerprint recognition device in the embodiment of the present application.

[0116] Specifically, the gap layer 46 is made of foam or air, so that the ultrasonic signal emitted by the ultrasonic fingerprint sensor chip 41 is interrupted from penetrating toward the gap layer 46 , and only the ultrasonic signal change caused by the finger pressing the cover is retained, thereby reducing the interference of useless ultrasonic signals and improving the consistency of the signal amount.

[0117] In a specific implementation of the first embodiment of the present application, the bonding wire 43 is covered with a bonding wire protection glue 431 to protect the bonding wire 43 and the pad corresponding to the bonding wire 43 .

[0118] Specifically, foam is provided at the position of the gap layer 46 corresponding to the bonding wire protection glue 431 of the bonding wire 43 to prevent the bonding wire protection glue 431 from overflowing to the area where the ultrasonic fingerprint sensor chip 41 is connected to the bonding wire 43 .

[0119] Seventh embodiment

[0120] FIG22 is a top view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application, and FIG23 is a schematic diagram of the packaging of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application.

[0121] Referring to Figures 22 and 23, an ultrasonic fingerprint recognition device 4 provided in another embodiment of the present application is applied to an electronic device having a hidden button on the side middle frame. The ultrasonic fingerprint recognition device 4 provided in another embodiment of the present application includes: an ultrasonic fingerprint sensor chip 41, a flexible circuit board 42, bonding wires 43, a reinforcement plate 52, and a reinforcement support component 54. The ultrasonic fingerprint sensor chip 41 includes a first part 411 and a second part 422. The flexible circuit board 42 includes a first part 421 and a second part 433. The first part 421 and the second part 422 of the flexible circuit board 42 are folded into a U shape. The reinforcement support component 54 includes two elastic arms 541 and a reinforcement part 542 with two ends respectively connected to the two elastic arms 541. The front surface of the first portion 411 of the ultrasonic fingerprint sensor chip 41 is bonded to the inner surface of the middle frame 3 corresponding to the hidden button. The front surface of the second portion 412 of the ultrasonic fingerprint sensor chip 41 has a reserved solder pad and is electrically connected to the first surface of the first portion 421 of the flexible circuit board 42 via bonding wires 43. The second surface of the first portion 421 of the flexible circuit board 42 and the back surface of the ultrasonic fingerprint sensor chip 41 are both bonded to the first surface of the reinforcing plate 52. A gap layer 46 is provided between the reinforcing plate 52 and the second surface of the second portion 422 of the flexible circuit board 42. Multiple sensors are provided on the second surface of the second portion 422 of the flexible circuit board 42 for detecting the position of a finger pressing the hidden button 3. The first surface of the second portion 422 of the flexible circuit board 42 is bonded to the reinforcing portion 542. Two elastic arms 541 are connected to the middle frame reinforcement rib 3, ensuring that the reinforcing portion 542 is parallel to the middle frame reinforcement rib 6 with an air gap between them.

[0122] In the embodiment of the present application, when a finger presses a hidden button, the ultrasonic fingerprint sensor chip 41 is used to send an ultrasonic signal to the finger. The finger presses on the outer surface of the hidden button, and the ultrasonic fingerprint sensor chip 41 receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip 41 is connected to the mainboard of the electronic device (not shown in the figure) through the wiring of the flexible circuit board 42. In the embodiment of the present application, when a finger presses a hidden button, multiple sensors provided on the flexible circuit board 42 sense the position where the finger presses the invisible button. For example, if multiple sensors are pressure sensors, when the finger presses the invisible button, when the pressing position is different, the pressure values ​​of each pressure sensor are different. For example, when pressing position A, the pressure sensor close to position A is deformed or displaced to generate a signal that is greater than the signal at position B, and vice versa. In addition, the position coordinates of the fingerprint when the finger presses can be used to assist in positioning to determine the pressing position, thereby realizing the function corresponding to the button.

[0123] Specifically, the hidden button is one of: a volume button, a brightness button, a navigation button, and a slide button.

[0124] For example, when the hidden button is a volume button, position A is volume +, and position B is volume -, in the embodiment of the present application, the user can realize fingerprint recognition and volume adjustment by pressing the hidden button.

[0125] Specifically, the sensor is a capacitive sensor or a resistive sensor. If it is a capacitive sensor, the pressure value at each location is obtained by the change in capacitance caused by pressing. If it is a resistive sensor, the pressure value at each location is obtained by the change in resistance caused by stretching. This is the existing technology of capacitive sensors and resistive sensors, so it will not be detailed here.

[0126] In a specific implementation of the first embodiment of the present application, when the sensor is a capacitive sensor, the reinforcing plate 52 is a steel plate, forming a capacitive transmitting sensor. The second surface of the first portion 421 of the flexible circuit board 42 is adhered to the first surface of the reinforcing plate 52 using conductive adhesive, thereby establishing electrical connection between the reinforcing plate 52 and the capacitive transmitting sensor pads reserved on the flexible circuit board 42. Multiple sensors are provided on the second surface of the second portion 422 of the flexible circuit board 42 as capacitive receiving sensors corresponding to the capacitive transmitting sensors.

[0127] Specifically, a gap layer 46 is provided between the reinforcing plate 52 and the second surface of the second portion 422 of the flexible circuit board 42, creating an air gap with foam between the reinforcing plate 52 and the ends of the second portion 422 of the flexible circuit board 42. The foam provided at both ends of the reinforcing plate 52 and the second portion 422 of the flexible circuit board 42 is used to absorb the tolerance between the capacitive transmitting sensor and the capacitive receiving sensor, while the air gap serves as a reserved air gap between the capacitive transmitting sensor and the capacitive receiving sensor.

[0128] The reinforcing support component 54 secures the capacitive receiving sensor on the second portion of the flexible printed circuit board 42. Its two elastic arms 541 connect to the middle frame reinforcement rib 6, aligning the reinforcing portion 542 with the middle frame reinforcement rib 3 with an air gap between them. The rebound force of the reinforcing portion 542 and the middle frame reinforcement rib 6 pre-compresses the foam between the reinforcing plate 52 and the second portion 422 of the flexible printed circuit board 42. The middle frame reinforcement rib 6 further reinforces the reinforcing support component 54.

[0129] In the specific implementation of the first embodiment of the present application, in order to ensure the fitting effect between the ultrasonic fingerprint sensor chip 41 and the inner surface of the middle frame corresponding to the hidden button 3, the ultrasonic fingerprint sensor chip 41 is adhered to the inner surface of the middle frame corresponding to the hidden button 3 through an adhesive 44.

[0130] Specifically, the adhesive 44 is glue or film, which further improves the bonding effect and saves process costs.

[0131] In a specific implementation of the first embodiment of the present application, the bonding wire 43 is covered with a bonding wire protection glue 431 to protect the bonding wire 43 and the pad corresponding to the bonding wire 43 .

[0132] In the embodiment of the present application, the frame is made of plastic or metal.

[0133] The middle frame corresponding to the hidden button 3 of the ultrasonic fingerprint sensor chip 41 used in the embodiment of the present application can be designed as a curved surface, which has no effect on the design of the side middle frame of the electronic device and can improve the aesthetic appearance of the middle frame design.

[0134] By replacing a capacitive fingerprint sensor chip with an ultrasonic fingerprint sensor chip, this embodiment of the present application avoids the mechanical reliability issues of capacitive fingerprint recognition devices caused by the poor penetration of capacitive fingerprint sensor chips. In this embodiment of the present application, the frame thickness is greater than or equal to 2mm, which provides strong mechanical reliability for the ultrasonic fingerprint recognition device and eliminates the need for design protection for the ultrasonic fingerprint recognition device.

[0135] Specifically, the thickness of the middle frame is one of 0.8 mm, 1.0 mm, and 1.3 mm, thereby ensuring that the ultrasonic fingerprint recognition device has strong mechanical reliability and facilitating the design and processing of the cover.

[0136] Eighth embodiment

[0137] FIG24 is a top view of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application, and FIG25 is a schematic diagram of the packaging of an ultrasonic fingerprint recognition device provided in yet another embodiment of the present application.

[0138] Referring to Figures 24 and 25, an ultrasonic fingerprint recognition device 4 provided in another embodiment of the present application is applied to an electronic device having a hidden button on the side middle frame. The ultrasonic fingerprint recognition device 4 provided in another embodiment of the present application includes: an ultrasonic fingerprint sensor chip 41, a flexible circuit board 42, bonding wires 43, a reinforcement plate 52, and a reinforcement support component 54. The ultrasonic fingerprint sensor chip 41 includes a first part 411 and a second part 422. The flexible circuit board 42 includes a first part 421 and a second part 433. The first part 421 and the second part 422 of the flexible circuit board 42 are folded into a U shape. The reinforcement support component 54 includes two elastic arms 541 and a reinforcement part 542 with two ends respectively connected to the two elastic arms 541. The front surface of the first portion 411 of the ultrasonic fingerprint sensor chip 41 is bonded to the inner surface of the middle frame corresponding to the hidden button 3. The front surface of the second portion 412 of the ultrasonic fingerprint sensor chip 41 has reserved solder pads and is electrically connected to the first surface of the first portion 421 of the flexible circuit board 42 via bonding wires 43. The second surface of the first portion 421 of the flexible circuit board 42 and the back surface of the ultrasonic fingerprint sensor chip 41 are both bonded to the first surface of the reinforcing plate 52. A gap layer 46 is provided between the reinforcing plate 52 and the second surface of the second portion 422 of the flexible circuit board 42. Multiple sensors are provided on the second surface of the second portion 422 of the flexible circuit board 42 to detect the position of a finger pressing on the hidden button 3. The first surface of the second portion 422 of the flexible circuit board 42 is bonded to the reinforcing portion 542. Two elastic arms 541 connect to the inner surface of the middle frame where the hidden button 3 is located, aligning the reinforcing portion 542 with the middle frame. The second surface of the reinforcing portion 542 is bonded to the middle frame reinforcement rib 6.

[0139] In the embodiment of the present application, when a finger presses a hidden button, the ultrasonic fingerprint sensor chip 41 is used to send an ultrasonic signal to the finger. The finger presses on the outer surface of the cover plate, and the ultrasonic fingerprint sensor chip 41 receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip 41 is connected to the mainboard of the electronic device (not shown in the figure) through the wiring of the flexible circuit board 42. In the embodiment of the present application, when a finger presses a hidden button, multiple sensors provided on the flexible circuit board 42 sense the position where the finger presses the invisible button 3. For example, if the multiple sensors are pressure sensors, when the finger presses the invisible button 3, when the pressing position is different, the pressure values ​​of each pressure sensor are different. For example, when pressing position A, the pressure sensor close to position A is deformed or displaced to generate a signal that is greater than the signal at position B, and vice versa. In addition, the position coordinates of the fingerprint when the finger presses can be used to assist in positioning to determine the pressing position, thereby realizing the function corresponding to the button.

[0140] Specifically, the hidden button 3 is one of: a volume button, a brightness button, a navigation button, and a slide button.

[0141] For example, when the hidden button 3 is a volume button, position A is volume +, and position B is volume -, in the embodiment of the present application, the user can realize fingerprint recognition and volume adjustment by pressing the hidden button 3.

[0142] Specifically, the sensor is a capacitive sensor or a resistive sensor. If it is a capacitive sensor, the pressure value at each location is obtained by the change in capacitance caused by pressing. If it is a resistive sensor, the pressure value at each location is obtained by the change in resistance caused by stretching. This is the existing technology of capacitive sensors and resistive sensors, so it will not be detailed here.

[0143] In a specific implementation of the first embodiment of the present application, when the sensor is a capacitive sensor, the reinforcing plate 52 is a steel plate, forming a capacitive transmitting sensor. The second surface of the first portion 421 of the flexible circuit board 42 is adhered to the first surface of the reinforcing plate 52 using conductive adhesive, thereby establishing electrical connection between the reinforcing plate 52 and the capacitive transmitting sensor pads reserved on the flexible circuit board 42. Multiple sensors are provided on the second surface of the second portion 422 of the flexible circuit board 42 as capacitive receiving sensors corresponding to the capacitive transmitting sensors.

[0144] Specifically, a gap layer 46 is provided between the reinforcing plate 52 and the second surface of the second portion 422 of the flexible circuit board 42, creating an air gap with foam between the reinforcing plate 52 and the ends of the second portion 422 of the flexible circuit board 42. The foam provided at both ends of the reinforcing plate 52 and the second portion 422 of the flexible circuit board 42 is used to absorb the tolerance between the capacitive transmitting sensor and the capacitive receiving sensor, while the air gap serves as a reserved air gap between the capacitive transmitting sensor and the capacitive receiving sensor.

[0145] The reinforcing support component 54 secures the capacitive receiving sensor on the second portion of the flexible circuit board 42. Its two elastic arms 541 connect to the middle frame reinforcement rib 3, aligning the reinforcing portion 542 with the middle frame reinforcement rib 3 with an air gap between them. This allows the rebound force of the reinforcing portion 542 and the middle frame reinforcement rib 3 to pre-compress the foam between the reinforcing plate 52 and the second portion 422 of the flexible circuit board 42. The middle frame reinforcement rib 3 further reinforces the reinforcing support component 54.

[0146] In the specific implementation of the first embodiment of the present application, in order to ensure the fitting effect between the ultrasonic fingerprint sensor chip 41 and the inner surface of the middle frame corresponding to the hidden button 3, the ultrasonic fingerprint sensor chip 41 is adhered to the inner surface of the middle frame corresponding to the hidden button 3 through an adhesive 44.

[0147] Specifically, the adhesive 44 is glue or film, which further improves the bonding effect and saves process costs.

[0148] In a specific implementation of the first embodiment of the present application, the bonding wire 43 is covered with a bonding wire protection glue 431 to protect the bonding wire 43 and the pad corresponding to the bonding wire 43 .

[0149] In the embodiment of the present application, the frame is made of plastic or metal.

[0150] The middle frame corresponding to the hidden button 3 of the ultrasonic fingerprint sensor chip 41 used in the embodiment of the present application can be designed as a curved surface, which has no effect on the design of the side middle frame of the electronic device and can improve the aesthetic appearance of the middle frame design.

[0151] By replacing a capacitive fingerprint sensor chip with an ultrasonic fingerprint sensor chip, this embodiment of the present application avoids the mechanical reliability issues of capacitive fingerprint recognition devices caused by the poor penetration of capacitive fingerprint sensor chips. In this embodiment of the present application, the frame thickness is greater than or equal to 2mm, which provides strong mechanical reliability for the ultrasonic fingerprint recognition device and eliminates the need for design protection for the ultrasonic fingerprint recognition device.

[0152] Specifically, the thickness of the middle frame is one of 0.8 mm, 1.0 mm, and 1.3 mm, thereby ensuring that the ultrasonic fingerprint recognition device has strong mechanical reliability and facilitating the design and processing of the cover.

[0153] In a specific implementation of the first embodiment of the present application, the middle frame reinforcement rib 6 has a plurality of support protrusions, and the second surface of the reinforcement portion 542 is attached to the support protrusions of the middle frame reinforcement rib 6, which facilitates deformation or displacement.

[0154] The first embodiment of the present application specifically implements an ultrasonic fingerprint recognition device. The ultrasonic fingerprint recognition device of the embodiment of the present application is disposed on the side middle frame of an electronic device to implement ultrasonic fingerprint recognition. The side middle frame of the electronic device has a mechanical button. A mechanical button refers to a component having a button cover and being disposed separately from the side middle frame of the electronic device, and a corresponding operation can be performed by a user's finger pressing the mechanical button.

[0155] FIG26 is a top view of the ultrasonic fingerprint recognition device provided in an embodiment of the present application, and FIG27 is a schematic diagram of the packaging of the ultrasonic fingerprint recognition device provided in an embodiment of the present application.

[0156] Referring to Figures 26 and 27 , an ultrasonic fingerprint recognition device 4 provided in an embodiment of the present application is applied to an electronic device with a side middle frame having mechanical buttons. The ultrasonic fingerprint recognition device 4 includes an ultrasonic fingerprint sensor chip 41, a flexible circuit board 42, and bonding wires 43. The back surface of the ultrasonic fingerprint sensor chip 41 is attached to the inner surface of the cover plate 2 where the mechanical buttons are located. The front surface of the ultrasonic fingerprint sensor chip 41 has a reserved solder pad 411 and is electrically connected to the first surface of the first end 421 of the flexible circuit board 42 via bonding wires 43. The ultrasonic fingerprint sensor chip 41 is configured to emit an ultrasonic signal to a finger. When a finger presses on the outer surface of the cover plate 2, the ultrasonic fingerprint sensor chip 41 receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip 41 is connected to the electronic device's mainboard (not shown) via traces on the flexible circuit board 42. The second surface of the first end 421 of the flexible circuit board 42 faces the front surface of the ultrasonic fingerprint sensor chip 41, with a gap layer 46 between the second surface of the first end 421 of the flexible circuit board 42 and the front surface of the ultrasonic fingerprint sensor chip 41. A first surface of the second end 422 of the flexible circuit board 42 is fixed to the inner surface of the cover plate 2 of the mechanical key, and a second surface of the second end 422 of the flexible circuit board 42 is fixed to the mechanical key switch 3 .

[0157] Therefore, by using an ultrasonic fingerprint sensor chip instead of a capacitive fingerprint sensor chip, the present embodiment avoids the mechanical reliability issues of capacitive fingerprint recognition devices caused by the poor penetration of the capacitive fingerprint sensor chip, which in turn affects the button design of the side frame of the electronic device. Furthermore, the button cover of the side button of the ultrasonic fingerprint sensor chip used in the present embodiment can be designed as a curved surface, without affecting the button design of the side frame of the electronic device.

[0158] In a specific implementation of the first embodiment of the present application, the flexible circuit board 42 is bent into a U-shape, one side of the U-shape is the first end 421 of the flexible circuit board 42, and the other side of the U-shape is the second end 422 of the flexible circuit board 42. The first surface of the first end 421 of the flexible circuit board 42 is opposite to the first surface of the second end 422 of the flexible circuit board 42.

[0159] The embodiment of the present application utilizes the characteristics of a flexible circuit board. By bending the flexible circuit board into a U-shape, the first end 421 of the flexible circuit board 42 is electrically connected to the reserved solder pad on the front of the ultrasonic fingerprint sensor chip 41, and the second end 422 of the flexible circuit board 42 is connected to the inner surface of the cover plate 2 of the mechanical button and the mechanical button switch 3.

[0160] In a specific implementation of the first embodiment of the present application, the cover 2 of the mechanical button also includes: a cover reinforcement component 21, the cover reinforcement component 21 includes a separated first end 211 and a second end 212, the first end 211 of the cover reinforcement component 21 is arranged between one end of the cover 2 and the second surface of the first end 421 of the flexible circuit board 42, the second end 212 of the cover reinforcement component 21 is arranged between the other end of the cover 2 and the first surface of the second end 422 of the flexible circuit board 42, the cover reinforcement component 21 and the flexible circuit board 42 form a closed environment, and the ultrasonic fingerprint sensor chip 41 is in the closed environment.

[0161] The embodiments of the present application further improve the waterproofness, mechanical reliability, and environmental reliability of the ultrasonic fingerprint recognition device.

[0162] In a specific implementation of the first embodiment of the present application, in order to further increase the strength of the cover plate 2 , the cover plate reinforcement component 21 and the cover plate 2 are formed by in-mold injection molding.

[0163] In a specific implementation of the first embodiment of the present application, in order to reinforce the flexible circuit board 42, the ultrasonic fingerprint recognition device 4 also includes: a first flexible circuit board reinforcement plate 44, which is attached to between the second surface of the first end 421 of the flexible circuit board 42 and the first end 211 of the cover reinforcement component 21.

[0164] In the specific implementation of the first embodiment of the present application, in order to reinforce the ultrasonic fingerprint sensor chip 41 and maintain the flatness of the flexible circuit board 42, the ultrasonic fingerprint recognition device 4 also includes: a first reinforcing bonding portion 45, which is bonded between the second surface of the first end 421 of the flexible circuit board 42 and the front surface of the ultrasonic fingerprint sensor chip 41.

[0165] In a specific implementation of the first embodiment of the present application, in order to reinforce the flexible circuit board 42 and maintain the flatness of the flexible circuit board 42, the ultrasonic fingerprint recognition device 4 further includes: a second reinforcing bonding portion 46, and a second reinforcing bonding portion 47 is bonded to the first surface of the first end 421 of the flexible circuit board 42.

[0166] Specifically, in order to provide better reinforcement and improve the flatness of the flexible circuit board 42, at least one of the first reinforcing bonding portion and the second reinforcing bonding portion is a substrate (FR4, a code for flame retardant material grade).

[0167] In a specific implementation of the first embodiment of the present application, in order to reinforce the flexible circuit board 42, the ultrasonic fingerprint recognition device further includes: a second flexible circuit board reinforcement plate 48, which is adhered between the second reinforcement bonding portion 47 and the second surface of the second end 422 of the flexible circuit board 42.

[0168] Specifically, the second flexible circuit board reinforcement plate 48 can be a gasket.

[0169] In a specific implementation of the first embodiment of the present application, the ultrasonic fingerprint recognition device 4 further includes: a pressure reinforcement component 49, the first surface of the pressure reinforcement component 49 is adhered to the second surface of the second end 422 of the flexible circuit board 42, the first end of the second surface of the pressure reinforcement component 49 is adhered or welded to the second flexible circuit board reinforcement plate 48, and the second end of the second surface of the pressure reinforcement component 49 is adhered or welded to the second end 212 of the cover reinforcement component 21.

[0170] The pressure reinforcement component 49 provided in the embodiment of the present application can absorb kinetic energy and reduce the mechanical reliability pressure of the cover plate 2 when the mechanical button is pressed or the electronic device falls.

[0171] Specifically, in order to provide a better kinetic energy absorption effect, the pressure reinforcement member 49 is a steel plate. The pressure reinforcement member 49 is set to be 0.3 mm thick, which can provide a kinetic energy absorption effect while avoiding affecting the thickness of the ultrasonic fingerprint recognition device.

[0172] Specifically, at least one of the cover plate reinforcement component, the first flexible circuit board reinforcement plate, and the second flexible circuit board reinforcement is made of hardware material.

[0173] The process of hardware materials adopts injection molding or plate CNC (Computer Numerical Control) process.

[0174] If the second flexible circuit board reinforcement plate 48 and the pressure reinforcement component 49 are both made of metal, the first end of the first surface of the pressure reinforcement component 49 is welded to the second flexible circuit board reinforcement plate 48, otherwise, the two are connected by bonding (ie, adhesion).

[0175] If the second end 212 of the cover reinforcement component 21 and the pressure reinforcement component 49 are both made of metal materials, the second end 212 of the cover reinforcement component 21 is welded to the second flexible circuit board reinforcement plate 48, otherwise, the two are connected by bonding (ie, adhesion).

[0176] In the specific implementation of the first embodiment of the present application, in order to ensure the bonding effect between the ultrasonic fingerprint sensor chip 41 and the cover plate 2 of the mechanical key, the ultrasonic fingerprint sensor chip 41 is bonded to the inner surface of the cover plate 2 of the mechanical key through an adhesive.

[0177] Specifically, the adhesive is glue or adhesive film, which further improves the bonding effect and saves process costs.

[0178] Specifically, the gap layer 46 is made of foam or air, so that the ultrasonic signal emitted by the ultrasonic fingerprint sensor chip 41 is interrupted from penetrating toward the gap layer 46 , and only the ultrasonic signal change caused by the finger pressing the cover is retained, thereby reducing the interference of useless ultrasonic signals and improving the consistency of the signal amount.

[0179] In a specific implementation of the first embodiment of the present application, the bonding wire 43 is covered with a bonding wire protection glue 431 to protect the bonding wire 43 and the pad corresponding to the bonding wire 43 .

[0180] The cover plate 2 of the present embodiment can be made of glass, metal, or plastic. Specifically, the glass can contain ink, or even sapphire glass containing ink. The metal can be made of aluminum alloy, stainless steel, or other materials. Vacuum plating and other processes are used, and plastic can be vacuum-coated, matte-finished, spray-painted, or polished. The cover plate of the present embodiment supports a variety of materials and processes, enhancing the aesthetic appeal of the keypad design.

[0181] By replacing a capacitive fingerprint sensor chip with an ultrasonic fingerprint sensor chip, this embodiment of the present application avoids the mechanical reliability issues of a capacitive fingerprint recognition device due to the poor penetration of the capacitive fingerprint sensor chip. In this embodiment of the present application, the thickness of the cover plate 2 is less than or equal to 2 mm, which provides the ultrasonic fingerprint recognition device with strong mechanical reliability and eliminates the need for a button design to protect the ultrasonic fingerprint recognition device.

[0182] Specifically, the thickness of the cover plate is one of 0.8 mm, 1.0 mm, and 1.3 mm, thereby ensuring that the ultrasonic fingerprint recognition device has strong mechanical reliability and facilitating the design and processing of the cover plate.

[0183] Figure 28 is a top view of the ultrasonic fingerprint recognition device provided in an embodiment of the present application, Figure 29 is a packaging schematic diagram of the ultrasonic fingerprint recognition device provided in an embodiment of the present application, and Figure 30 is a side view of the ultrasonic fingerprint recognition device provided in another embodiment of the present application.

[0184] Referring to Figures 28 to 30 , another embodiment of the present application provides an ultrasonic fingerprint recognition device 4 for use in an electronic device with a side middle frame having mechanical buttons. The ultrasonic fingerprint recognition device 4 includes an ultrasonic fingerprint sensor chip 41, a flexible circuit board 42, bonding wires 43, and a back cover 50. The back of the ultrasonic fingerprint sensor chip 41 is attached to the inner surface of the mechanical button cover 2. The back cover 50 surrounds the mechanical button cover 2 to form a closed environment, within which the ultrasonic fingerprint sensor chip 41 resides. The front of the ultrasonic fingerprint sensor chip 41 has a reserved solder pad 411. The bonding wire 43 passes through a notch 501 in the back cover 50 to electrically connect the solder pad 411 to the first surface of the flexible circuit board 42. The ultrasonic fingerprint sensor chip 41 is configured to emit an ultrasonic signal to a finger. When a finger presses on the outer surface of the cover 2, the ultrasonic fingerprint sensor chip 41 receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip 41 is connected to the electronic device's mainboard (not shown) via traces on the flexible circuit board 42. The second surface of the flexible circuit board 42 is attached to the outer surface of the back cover 50 , and a gap layer 46 is provided between the inner surface of the back cover 50 and the front surface of the ultrasonic fingerprint sensor chip 41 .

[0185] Therefore, by using an ultrasonic fingerprint sensor chip instead of a capacitive fingerprint sensor chip, the present embodiment avoids the mechanical reliability issues of capacitive fingerprint recognition devices caused by the poor penetration of the capacitive fingerprint sensor chip, which in turn affects the button design of the side frame of the electronic device. Furthermore, the button cover of the side button of the ultrasonic fingerprint sensor chip used in the present embodiment can be designed as a curved surface, without affecting the button design of the side frame of the electronic device.

[0186] In the specific implementation of the first embodiment of the present application, in order to improve the stability of the bonding wire 43, a gasket 51 is provided between the inner surface of the back cover 50 and the front surface of the ultrasonic fingerprint sensor chip 41. The position of the gasket 51 corresponds to the position where the bonding wire 43 is connected to the flexible circuit board 42.

[0187] Specifically, in order to further improve the mechanical reliability of the capacitive fingerprint recognition device, the back cover 50 is made of metal.

[0188] In the specific implementation of the first embodiment of the present application, in order to ensure the bonding effect between the ultrasonic fingerprint sensor chip 41 and the cover plate 2 of the mechanical key, the ultrasonic fingerprint sensor chip 41 is bonded to the inner surface of the cover plate 2 of the mechanical key through an adhesive.

[0189] Specifically, the adhesive is glue or adhesive film, which further improves the bonding effect and saves process costs.

[0190] Specifically, the gap layer 46 is made of foam or air, so that the ultrasonic signal emitted by the ultrasonic fingerprint sensor chip 41 is interrupted from penetrating toward the gap layer 46 , and only the ultrasonic signal change caused by the finger pressing the cover is retained, thereby reducing the interference of useless ultrasonic signals and improving the consistency of the signal amount.

[0191] In a specific implementation of the first embodiment of the present application, the bonding wire 43 is covered with a bonding wire protection glue 431 to protect the bonding wire 43 and the pad corresponding to the bonding wire 43 .

[0192] The cover plate 2 of the present embodiment can be made of glass, metal, or plastic. Specifically, the glass can contain ink, or even sapphire glass containing ink. The metal can be made of aluminum alloy, stainless steel, or other materials. Vacuum plating and other processes are used, and plastic can be vacuum-coated, matte-finished, spray-painted, or polished. The cover plate of the present embodiment supports a variety of materials and processes, enhancing the aesthetic appeal of the keypad design.

[0193] By replacing a capacitive fingerprint sensor chip with an ultrasonic fingerprint sensor chip, this embodiment of the present application avoids the mechanical reliability issues of a capacitive fingerprint recognition device due to the poor penetration of the capacitive fingerprint sensor chip. In this embodiment of the present application, the thickness of the cover plate 2 is less than or equal to 2 mm, which provides the ultrasonic fingerprint recognition device with strong mechanical reliability and eliminates the need for a button design to protect the ultrasonic fingerprint recognition device.

[0194] Specifically, the thickness of the cover plate is one of 0.8 mm, 1.0 mm, and 1.3 mm, thereby ensuring that the ultrasonic fingerprint recognition device has strong mechanical reliability and facilitating the design and processing of the cover plate.

[0195] 31 , another embodiment of the present application further provides an electronic device, comprising: a side middle frame and the above-mentioned ultrasonic fingerprint recognition device 4 , wherein the ultrasonic fingerprint recognition device is arranged on the side middle frame to realize ultrasonic fingerprint recognition.

[0196] The electronic devices of the embodiments of the present application include, but are not limited to:

[0197] (1) Mobile communication devices: These devices are characterized by their mobile communication capabilities and are primarily designed to provide voice and data communications. These terminals include smartphones (e.g., iPhones), multimedia phones, feature phones, and low-end phones.

[0198] (2) Ultra-mobile personal computer devices: These devices fall under the category of personal computers, have computing and processing capabilities, and generally also have mobile Internet access. These terminals include PDAs, MIDs, and UMPCs, such as the iPad.

[0199] (3) Portable entertainment devices: These devices can display and play multimedia content. These devices include audio and video players (such as iPods), handheld game consoles, e-books, smart toys, and portable car navigation devices.

[0200] (4) Other electronic devices with data interaction functions.

[0201] Thus far, specific embodiments of the present subject matter have been described. Other embodiments are within the scope of the appended claims. In some cases, the actions recited in the claims can be performed in a different order and still achieve the desired results. Furthermore, the processes depicted in the accompanying drawings do not necessarily require the specific order shown or sequential order to achieve the desired results. In certain embodiments, multitasking and parallel processing may be advantageous.

[0202] In the 1990s, technological improvements could be clearly distinguished as either hardware improvements (for example, improvements to circuit structures like diodes, transistors, and switches) or software improvements (improvements to process flows). However, with the advancement of technology, many process flow improvements today can now be considered direct improvements to hardware circuit structures. Designers almost always create the corresponding hardware circuit structure by programming the improved process flow into the hardware circuit. Therefore, it cannot be said that a process flow improvement cannot be implemented using hardware modules. For example, a programmable logic device (PLD), such as a field programmable gate array (FPGA), is an integrated circuit whose logical function is determined by user programming. Designers can "integrate" a digital system on a PLD by programming it themselves, without having to hire a chip manufacturer to design and manufacture a dedicated integrated circuit chip. Moreover, nowadays, instead of manually fabricating integrated circuit chips, this programming is mostly done using "logic compiler" software. This is similar to the software compiler used when developing programs. Before compilation, the original code must also be written in a specific programming language, called a hardware description language (HDL). There is not just one HDL, but many, such as ABEL (Advanced Boolean Expression Language), AHDL (Altera Hardware Description Language), Confluence, CUPL (Cornell University Programming Language), HDCal, JHDL (Java Hardware Description Language), Lava, Lola, MyHDL, PALASM, RHDL (Ruby Hardware Description Language), etc. The most commonly used are VHDL (Very-High-Speed ​​Integrated Circuit Hardware Description Language) and Verilog. Those skilled in the art will also understand that by simply programming the method flow in one of these hardware description languages ​​and then programming it into an integrated circuit, a hardware circuit that implements the logic method flow can be easily obtained.

[0203] The controller can be implemented in any suitable manner. For example, the controller can take the form of a microprocessor or processor and a computer-readable medium storing computer-readable program code (e.g., software or firmware) executable by the (micro)processor, logic gates, switches, application-specific integrated circuits (ASICs), programmable logic controllers, and embedded microcontrollers. Examples of controllers include, but are not limited to, the following microcontrollers: ARC 625D, Atmel AT91SAM, Microchip PIC18F26K20, and Silicone Labs C8051F320. The memory controller can also be implemented as part of the control logic of the memory. Those skilled in the art will also know that in addition to implementing the controller in a purely computer-readable program code format, the controller can be implemented in the form of logic gates, switches, application-specific integrated circuits, programmable logic controllers, and embedded microcontrollers by logically programming the method steps. Therefore, such a controller can be considered a hardware component, and the devices included therein for implementing various functions can also be considered as structures within the hardware component. Or even, the devices for implementing various functions can be considered as both software modules that implement the method and structures within the hardware component.

[0204] The systems, devices, modules, or units described in the above embodiments may be implemented by computer chips or entities, or by products having certain functions. A typical implementation device is a computer. Specifically, the computer may be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smartphone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.

[0205] For the convenience of description, the above devices are described as being divided into various units according to their functions. Of course, when implementing this application, the functions of each unit can be implemented in the same or multiple software and / or hardware.

[0206] Those skilled in the art will appreciate that the embodiments of the present application can be provided as methods, systems, or computer program products. Therefore, the present application can adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application can adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program code.

[0207] The present application is described with reference to the flow chart and / or block diagram of the method, device (system), and computer program product according to the embodiment of the present application. It should be understood that each flow process and / or box in the flow chart and / or block diagram and the combination of the flow process and / or box in the flow chart and / or block diagram can be realized by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processing machine or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device produce a device for realizing the function specified in one flow chart flow or multiple flows and / or one box or multiple boxes of the block diagram.

[0208] These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce a product including an instruction device that implements the functions specified in one or more processes in the flowchart and / or one or more boxes in the block diagram.

[0209] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, so that the instructions executed on the computer or other programmable device provide steps for implementing the functions specified in one or more processes in the flowchart and / or one or more boxes in the block diagram.

[0210] In a typical configuration, a computing device includes one or more processors (CPUs), input / output interfaces, network interfaces, and memory.

[0211] Memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. Memory is an example of a computer-readable medium.

[0212] Computer-readable media includes permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. The information can be computer-readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer-readable media does not include transitory computer-readable media (transitory media), such as modulated data signals and carrier waves.

[0213] It should also be noted that the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a series of elements includes not only those elements but also other elements not explicitly listed, or includes elements inherent to such process, method, commodity, or apparatus. In the absence of further limitations, an element defined by the phrase "comprises a ..." does not exclude the presence of other identical elements in the process, method, commodity, or apparatus that includes the element.

[0214] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Furthermore, the present application may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0215] The present application may be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, and the like that perform specific tasks or implement specific abstract data types. The present application may also be practiced in distributed computing environments where tasks are performed by remote processing devices connected via a communications network. In a distributed computing environment, program modules may be located in local and remote computer storage media, including storage devices.

[0216] The various embodiments in this specification are described in a progressive manner. Similar parts between the various embodiments can be referred to in conjunction with each other. Each embodiment focuses on the differences between the other embodiments. In particular, the system embodiments are generally similar to the method embodiments, so the description is relatively simple. For relevant parts, refer to the description of the method embodiments.

[0217] The foregoing is merely an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included within the scope of the claims of the present application.

Claims

1. An ultrasonic fingerprint recognition device, characterized in that: It is arranged on the side middle frame of the electronic device to realize ultrasonic fingerprint recognition. The side middle frame has a mechanical button or a hidden button. The ultrasonic fingerprint recognition device includes: an ultrasonic fingerprint sensor chip, a flexible circuit board and bonding wires. The ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical button or the inner surface of the middle frame where the hidden button is located. The ultrasonic fingerprint sensor chip is used to send an ultrasonic signal to the finger. The finger presses on the outer surface of the cover plate or the hidden button. The ultrasonic fingerprint sensor chip receives the ultrasonic fingerprint signal returned by the finger. The ultrasonic fingerprint sensor chip is electrically connected to the flexible circuit board through the bonding wire, and the ultrasonic fingerprint sensor chip is connected to the mainboard of the electronic device through the wiring of the flexible circuit board.

2. The ultrasonic fingerprint recognition device according to claim 1, characterized in that: The outer surface of the cover plate or the outer surface of the middle frame where the hidden button is located is a curved surface.

3. The ultrasonic fingerprint recognition device according to claim 1, characterized in that: The cover plate is made of one of glass, metal and plastic; the side middle frame is made of plastic or metal.

4. The ultrasonic fingerprint recognition device according to claim 1, characterized in that: The ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical key or the inner surface of the middle frame where the hidden key is located through an adhesive.

5. The ultrasonic fingerprint recognition device according to claim 4, characterized in that: The bonding material is glue or adhesive film.

6. The ultrasonic fingerprint recognition device according to claim 1, characterized in that: The back side of the ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical key, the front side of the ultrasonic fingerprint sensor chip has a reserved pad and is electrically connected to the first surface of the flexible circuit board through the bonding wire, and the second surface of the flexible circuit board is attached to the inner surface of the cover plate of the mechanical key.

7. The ultrasonic fingerprint recognition device according to claim 6, characterized in that: The ultrasonic fingerprint recognition device also includes a special-shaped reinforcement component, one end of which is connected to the inner surface of the cover plate, and the other end is attached to the first surface of the flexible circuit board. The special-shaped reinforcement component surrounds the ultrasonic fingerprint sensor chip to provide reinforcement protection, and a gap layer is arranged between the special-shaped reinforcement component and the front side of the ultrasonic fingerprint sensor chip.

8. The ultrasonic fingerprint recognition device according to claim 1, characterized in that: The ultrasonic fingerprint recognition device also includes a reinforcement plate, the flexible circuit board includes a first part, the ultrasonic fingerprint sensor chip includes a first part and a second part, the front side of the first part of the ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical key or the inner surface of the middle frame where the hidden key is located, the front side of the second part of the ultrasonic fingerprint sensor chip reserves a solder pad and is electrically connected to the first surface of the first part of the flexible circuit board through the bonding wire, and the second surface of the first part of the flexible circuit board and the back side of the ultrasonic fingerprint sensor chip are both attached to the first surface of the reinforcement plate.

9. The ultrasonic fingerprint recognition device according to claim 8, characterized in that: The ultrasonic fingerprint recognition device also includes a special-shaped reinforcement component, one end of the first surface of the special-shaped reinforcement component is connected to the inner surface of the cover plate, and the other end is connected to an edge end of the second surface of the reinforcement plate. The special-shaped reinforcement component surrounds the ultrasonic fingerprint sensor chip to provide reinforcement protection, and a gap layer is arranged between the first surface of the special-shaped reinforcement component and the second surface of the reinforcement plate.

10. The ultrasonic fingerprint recognition device according to claim 7 or 9, characterized in that: The four sides of the ultrasonic fingerprint sensor chip are sealed by dispensing glue.

11. The ultrasonic fingerprint recognition device according to claim 10, characterized in that: The gap layer is foam.

12. The ultrasonic fingerprint recognition device according to claim 7 or 9, characterized in that: The ultrasonic fingerprint recognition device also includes an annular component, one end of which is arranged around the cover plate, and the other end of the annular component is respectively connected to the special-shaped reinforcement component and the back side of the flexible circuit board to form a sealed environment, and the ultrasonic fingerprint sensor chip is in the sealed environment.

13. The ultrasonic fingerprint recognition device according to claim 12, characterized in that: The gap layer is an air gap.

14. The ultrasonic fingerprint recognition device according to claim 12, characterized in that: If the annular component is made of hardware material, the cover plate and the annular component are connected by glue or in-mold injection molding; if the annular component is made of plastic material, the cover plate and the annular component are integrally injection molded.

15. The ultrasonic fingerprint recognition device according to claim 12, characterized in that: The special-shaped reinforcement component and the annular component as well as the special-shaped reinforcement component and the cover plate are connected by dispensing.

16. The ultrasonic fingerprint recognition device according to claim 1, characterized in that: The cover plate has an annular raised edge around it facing the inner surface of the cover plate, the back side of the ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical button, the ultrasonic fingerprint sensor chip is accommodated in the annular raised edge, and the front side of the ultrasonic fingerprint sensor chip has a reserved solder pad and is electrically connected to the first surface of the flexible circuit board through the bonding wire.

17. The ultrasonic fingerprint recognition device according to claim 16, characterized in that: The ultrasonic fingerprint recognition device also includes a reinforcement plate, the second surface of the flexible circuit board is attached to the first surface of the reinforcement plate, the second surface of the reinforcement plate is connected to one end of the annular raised edge, and a gap layer is arranged between the second surface of the reinforcement plate and the front side of the ultrasonic fingerprint sensor chip.

18. The ultrasonic fingerprint recognition device according to claim 17, characterized in that: The gap layer is foam or air gap.

19. The ultrasonic fingerprint recognition device according to claim 16, characterized in that: The ultrasonic fingerprint recognition device further comprises a special-shaped reinforcement component, one end of which is attached to the first surface of the flexible circuit board, and the other end of which is connected to the other end of the annular raised edge.

20. The ultrasonic fingerprint recognition device according to claim 19, characterized in that: One end of the annular raised edge is connected to the reinforcing plate by glue spotting, and the other end of the annular raised edge is connected to the special-shaped reinforcing plate by glue spotting.

21. The ultrasonic fingerprint recognition device according to claim 16, characterized in that: The cover plate is made of plastic material by injection molding.

22. The ultrasonic fingerprint recognition device according to claim 12, characterized in that: If the annular component is made of hardware material, one end of the annular component is arranged around the outer surface of the cover plate, so that the finger touches the annular component when pressing the cover plate. The annular component is connected to the pad of the flexible circuit board through conductive glue to form a ground terminal or a receiving capacitance sensor. The receiving capacitance sensor triggers the electronic device to enter the fingerprint recognition state from the sleep state.

23. The ultrasonic fingerprint recognition device according to claim 7 or 9, characterized in that: The ultrasonic fingerprint recognition device also includes a silicone layer, a first surface of the silicone layer is attached to the second surface of the special-shaped reinforcement component, and the second surface of the silicone layer has a dome protrusion, so that when the outer surface of the cover plate receives the force of the finger, the silicone layer presses the dome protrusion.

24. The ultrasonic fingerprint recognition device according to claim 8, characterized in that: The front of the first part of the ultrasonic fingerprint sensor chip is attached to the inner surface of the middle frame where the hidden button is located. The ultrasonic fingerprint recognition device also includes a reinforcing support component, which includes two elastic arms and reinforcing parts with two ends respectively connected to the two elastic arms. The flexible circuit board also includes a second part. The first and second parts of the flexible circuit board are U-shaped folded in half. A plurality of sensors are arranged on the second surface of the second part of the flexible circuit board. The first surface of the second part of the flexible circuit board is attached to the reinforcing part. A gap layer is arranged between the first surface of the second part of the flexible circuit board and the second surface of the reinforcing plate. The two elastic arms are connected to the middle frame reinforcement rib, so that the reinforcement part is parallel to the middle frame reinforcement rib and there is an air gap in between.

25. The ultrasonic fingerprint recognition device according to claim 8, characterized in that: The gap layer includes two foams at two ends of the first surface of the second part of the flexible circuit board and the second surface of the reinforcement plate and an air gap in between.

26. The ultrasonic fingerprint recognition device according to claim 8, characterized in that: The front of the first part of the ultrasonic fingerprint sensor chip is attached to the inner surface of the middle frame where the hidden button is located. The ultrasonic fingerprint recognition device also includes a reinforcing support component, which includes two elastic arms and reinforcing parts with two ends respectively connected to the two elastic arms. The flexible circuit board also includes a second part. The first and second parts of the flexible circuit board are U-shaped by folding in half. A plurality of sensors are arranged on the second surface of the second part of the flexible circuit board, and the plurality of sensors are used to obtain the position of the finger pressing the hidden button. A gap layer is arranged between the second surface of the second part of the flexible circuit board and the second surface of the reinforcing plate. The first surface of the second part of the flexible circuit board is attached to the first surface of the reinforcing part. The two elastic arms are connected to the inner surface of the middle frame where the hidden button is located, so that the reinforcing part is parallel to the middle frame where the hidden button is located, and the second surface of the reinforcing part is attached to the reinforcing rib of the middle frame.

27. The ultrasonic fingerprint recognition device according to claim 24 or 26, characterized in that: The hidden button is one of a volume button, a brightness button, a navigation button, and a slide button.

28. The ultrasonic fingerprint recognition device according to claim 24 or 26, characterized in that: The sensor is a capacitive sensor or a resistive sensor.

29. The ultrasonic fingerprint recognition device according to claim 24 or 26, characterized in that: The sensor is a capacitive sensor, the reinforcement plate is a steel sheet reinforcement plate, and serves as a capacitive transmitting sensor. The second surface of the first part of the flexible circuit board is adhered to the first surface of the reinforcement plate through conductive adhesive, and a plurality of sensors are arranged on the second surface of the second part of the flexible circuit board as capacitive receiving sensors.

30. The ultrasonic fingerprint recognition device according to claim 26, characterized in that: The middle frame reinforcement rib has a plurality of support protrusions, and the second surface of the reinforcement portion is attached to the support protrusions of the middle frame reinforcement rib.

31. The ultrasonic fingerprint recognition device according to claim 1, characterized in that: The bonding wires are coated with bonding wire protection glue.

32. The ultrasonic fingerprint recognition device according to claim 1, characterized in that: The thickness of the cover plate is greater than or equal to 2 mm.

33. The ultrasonic fingerprint recognition device according to claim 1, characterized in that: The thickness of the cover plate is one of 0.8 mm, 1.0 mm, and 1.3 mm.

34. An ultrasonic fingerprint recognition device, characterized in that: The ultrasonic fingerprint sensor chip is arranged on the side middle frame of the electronic device to realize ultrasonic fingerprint recognition. The side middle frame has a mechanical button. The ultrasonic fingerprint recognition device includes: an ultrasonic fingerprint sensor chip, a flexible circuit board and a bonding wire. The back of the ultrasonic fingerprint sensor chip is attached to the inner surface of the cover of the mechanical button. The ultrasonic fingerprint sensor chip is used to send an ultrasonic signal to a finger. The finger presses on the outer surface of the cover. The ultrasonic fingerprint sensor chip receives the ultrasonic fingerprint signal returned by the finger. The front of the ultrasonic fingerprint sensor chip reserves a solder pad and is electrically connected to the first surface of the first end of the flexible circuit board through the bonding wire. The ultrasonic fingerprint sensor chip is connected to the main board of the electronic device through the routing of the flexible circuit board. The second surface of the first end of the flexible circuit board is opposite to the front of the ultrasonic fingerprint sensor chip, and a gap layer is provided between the second surface of the first end of the flexible circuit board and the front of the ultrasonic fingerprint sensor chip. The first surface of the second end of the flexible circuit board is fixed to the inner surface of the cover of the mechanical button, and the second surface of the second end of the flexible circuit board is fixed to the mechanical button switch.

35. The ultrasonic fingerprint recognition device according to claim 34, characterized in that: The flexible circuit board is bent into a U-shape, one side of the U-shape is the first end of the flexible circuit board, the other side of the U-shape is the second end of the flexible circuit board, and the first surface of the first end of the flexible circuit board is opposite to the first surface of the second end of the flexible circuit board.

36. The ultrasonic fingerprint recognition device according to claim 34, characterized in that: The cover of the mechanical button also includes: a cover reinforcement component, the cover reinforcement component includes a separated first end and a second end, the first end of the cover reinforcement component is arranged between one end of the cover and the second surface of the first end of the flexible circuit board, the second end of the cover reinforcement component is arranged between the other end of the cover and the first surface of the second end of the flexible circuit board, the cover reinforcement component and the flexible circuit board form a closed environment, and the ultrasonic fingerprint sensor chip is in the closed environment.

37. The ultrasonic fingerprint recognition device according to claim 36, characterized in that: The cover plate reinforcing component and the cover plate are formed by in-mold injection molding.

38. The ultrasonic fingerprint recognition device according to claim 36, characterized in that: The ultrasonic fingerprint recognition device further includes: a first flexible circuit board reinforcement plate, wherein the first flexible circuit board reinforcement plate is attached between the second surface of the first end of the flexible circuit board and the first end of the cover plate reinforcement component.

39. The ultrasonic fingerprint recognition device according to claim 38, characterized in that: The ultrasonic fingerprint recognition device further includes: a first reinforcing bonding portion, wherein the first reinforcing bonding portion is bonded between the second surface of the first end of the flexible circuit board and the front surface of the ultrasonic fingerprint sensor chip.

40. The ultrasonic fingerprint recognition device according to claim 39, characterized in that: The ultrasonic fingerprint recognition device further includes: a second reinforcing bonding portion, wherein the second reinforcing bonding portion is bonded to the first surface of the first end of the flexible circuit board.

41. The ultrasonic fingerprint recognition device according to claim 39 or 40, characterized in that: At least one of the first reinforcing and pasting part and the second reinforcing and pasting part is a substrate.

42. The ultrasonic fingerprint recognition device according to claim 40, characterized in that: The ultrasonic fingerprint recognition device further includes: a second flexible circuit board reinforcement plate, wherein the second flexible circuit board reinforcement plate is attached between the second reinforcement attachment portion and the second surface of the second end of the flexible circuit board.

43. The ultrasonic fingerprint recognition device according to claim 42, characterized in that: The ultrasonic fingerprint recognition device also includes: a pressure reinforcement component, the first surface of the pressure reinforcement component is adhered to the second surface of the second end of the flexible circuit board, a second flexible circuit board reinforcement plate is arranged on the first end of the second surface of the pressure reinforcement component, and the second end of the cover plate reinforcement component is arranged on the second end of the second surface of the pressure reinforcement component.

44. The ultrasonic fingerprint recognition device according to claim 43, characterized in that: The pressure reinforcement component is a steel plate.

45. The ultrasonic fingerprint recognition device according to claim 44, characterized in that: At least one of the cover plate reinforcement component, the first flexible circuit board reinforcement plate, and the second flexible circuit board reinforcement is made of hardware material.

46. ​​The ultrasonic fingerprint recognition device according to claim 45, characterized in that: According to the materials of the second flexible circuit board reinforcement plate and the cover plate reinforcement component, the second flexible circuit board reinforcement plate is welded or adhered to the first end of the first surface of the pressure reinforcement component, and the second end of the cover plate reinforcement component is welded or adhered to the second end of the first surface of the pressure reinforcement component.

47. The ultrasonic fingerprint recognition device according to claim 34, characterized in that: The gap layer is foam or air.

48. The ultrasonic fingerprint recognition device according to claim 34, characterized in that: The outer surface of the middle frame where the outer surface of the cover plate is located is a curved surface.

49. The ultrasonic fingerprint recognition device according to claim 34, characterized in that: The material of the cover plate is one of glass, metal and plastic.

50. The ultrasonic fingerprint recognition device according to claim 34, characterized in that: The ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical button through an adhesive.

51. The ultrasonic fingerprint recognition device according to claim 50, characterized in that: The bonding material is glue or adhesive film.

52. The ultrasonic fingerprint recognition device according to claim 34, characterized in that: The bonding wires are coated with bonding wire protection glue.

53. The ultrasonic fingerprint recognition device according to claim 34, characterized in that: The thickness of the cover plate is less than or equal to 2 mm.

54. The ultrasonic fingerprint recognition device according to claim 53, characterized in that: The thickness of the cover plate is one of 0.8 mm, 1.0 mm, and 1.3 mm. 55.An ultrasonic fingerprint recognition device, characterized in that: The ultrasonic fingerprint sensor chip is arranged on the side middle frame of the electronic device to realize ultrasonic fingerprint recognition. The side middle frame has a mechanical button. The ultrasonic fingerprint recognition device includes: an ultrasonic fingerprint sensor chip, a flexible circuit board, a bonding wire and a back cover. The back of the ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical button. The back cover forms a closed environment around the cover plate of the mechanical button. The ultrasonic fingerprint sensor chip is in the closed environment. The ultrasonic fingerprint sensor chip is used to send an ultrasonic signal to a finger. The finger is pressed on the outer surface of the cover plate. The ultrasonic fingerprint sensor chip receives the ultrasonic fingerprint signal returned by the finger. A pad is reserved on the front of the ultrasonic fingerprint sensor chip. The bonding wire passes through the notch of the back cover to electrically connect the pad and the first surface of the flexible circuit board. The ultrasonic fingerprint sensor chip is connected to the main board of the electronic device through the routing of the flexible circuit board. The second surface of the flexible circuit board is attached to the outer surface of the back cover. There is a gap layer between the inner surface of the back cover and the front of the ultrasonic fingerprint sensor chip.

56. The ultrasonic fingerprint recognition device according to claim 55, characterized in that: A gasket is arranged between the inner surface of the back cover and the front surface of the ultrasonic fingerprint sensor chip, and the position of the gasket corresponds to the position where the bonding wire is connected to the flexible circuit board.

57. The ultrasonic fingerprint recognition device according to claim 55, characterized in that: The back cover is made of metal.

58. The ultrasonic fingerprint recognition device according to claim 55, characterized in that: The gap layer is foam or air.

59. The ultrasonic fingerprint recognition device according to claim 55, characterized in that: The outer surface of the middle frame where the outer surface of the cover plate is located is a curved surface.

60. The ultrasonic fingerprint recognition device according to claim 55, characterized in that: The material of the cover plate is one of glass, metal and plastic.

61. The ultrasonic fingerprint recognition device according to claim 55, characterized in that: The ultrasonic fingerprint sensor chip is attached to the inner surface of the cover plate of the mechanical button through an adhesive.

62. The ultrasonic fingerprint recognition device according to claim 61, characterized in that: The bonding material is glue or adhesive film.

63. The ultrasonic fingerprint recognition device according to claim 55, characterized in that: The bonding wires are coated with bonding wire protection glue.

64. The ultrasonic fingerprint recognition device according to claim 55, characterized in that: The thickness of the cover plate is less than or equal to 2 mm.

65. The ultrasonic fingerprint recognition device according to claim 64, characterized in that: The thickness of the cover plate is one of 0.8 mm, 1.0 mm, and 1.3 mm.

66. An electronic device, characterized in that: include: The side middle frame and the ultrasonic fingerprint recognition device as described in any one of claims 1-65, wherein the ultrasonic fingerprint recognition device is arranged on the side middle frame to realize ultrasonic fingerprint recognition.

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