Semiconductor package and method for manufacturing semiconductor package

Abstract

The present invention improves optical characteristics in a WLCSP while reducing the height thereof.　This semiconductor package comprises a microlens layer, a color filter layer, a semiconductor substrate, a sealing resin, and a glass substrate. In the semiconductor package, a plurality of refractive index films having different refractive indexes are laminated on the microlens layer. The microlens layer and the color filter layer are laminated on the semiconductor substrate. The sealing resin seals the microlens layer and the semiconductor substrate. The glass substrate is bonded to the sealing resin.

Description

Semiconductor package and method for manufacturing semiconductor package

[0001] The present technology relates to a semiconductor package, and more particularly to a semiconductor package in which sealing or the like is performed at the wafer level, and a manufacturing method thereof.

[0002] Conventionally, WLCSPs (Wafer Level Chip Size Packages), which perform sealing at the wafer level, have been used in solid-state imaging devices, etc. For example, a WLCSP has been proposed in which a single-layer microlens is formed on a substrate and covered with a waterproof protective film (see, for example, Patent Document 1).

[0003] JP 2014-60203 A

[0004] In the above-mentioned conventional technology, a waterproof protective film is used to prevent moisture from entering the semiconductor package. However, in the above-mentioned semiconductor package, if various lens groups are added to a module including the semiconductor package in order to improve optical characteristics, the size of the module in the optical axis direction (i.e., its height) increases. This makes it difficult to achieve both a low profile and improved optical characteristics of the module.

[0005] This technology was developed in light of these circumstances, and aims to improve the optical characteristics of WLCSP while reducing its height.

[0006] The present technology has been made to solve the above-mentioned problems, and a first aspect thereof is a semiconductor package including a microlens layer formed by stacking a plurality of refractive index films having different refractive indices, a color filter layer, a semiconductor substrate on which the microlens layer and the color filter layer are stacked, a sealing resin that seals the microlens layer and the semiconductor substrate, and a glass substrate bonded to the sealing resin, thereby achieving an effect of improving optical characteristics while maintaining a low profile.

[0007] In addition, in this first aspect, the semiconductor substrate may further include a coating film containing a predetermined material having waterproof and gas barrier properties and covering the electrode pad region and the scribe region when viewed from a direction perpendicular to the surface of the semiconductor substrate, wherein any of the plurality of refractive index films contains a hygroscopic material, and an opening is formed in the electrode pad region, penetrating the microlens layer and reaching the electrode pad in the semiconductor substrate, thereby suppressing outgassing and bubble entrapment.

[0008] In this first aspect, the covering film may further cover an area other than the electrode pad area and the scribe area, thereby eliminating the need for a mask.

[0009] In the first aspect, the predetermined material may be any one of silicon nitride, silicon carbonitride, silicon oxynitride, and silicon oxide, thereby providing the effect of suppressing outgassing and bubble entrapment.

[0010] A second aspect of the present technology is a method for manufacturing a semiconductor package, the method including: a sealing step of sealing a semiconductor substrate having a microlens layer and a color filter layer stacked thereon, the microlens layer being formed by stacking a plurality of refractive index films having different refractive indices, with a sealing resin; and a bonding step of bonding a glass substrate to the sealing resin, thereby improving optical characteristics while maintaining a low profile.

[0011] In addition, the second aspect of the present invention further includes an opening step of forming an opening that penetrates the microlens layer and reaches the electrode pad in the semiconductor substrate, and a coating step between the opening step and the sealing step of covering the electrode pad region and the scribe region in which the opening is formed, as viewed from a direction perpendicular to the surface of the semiconductor substrate, with a coating film containing a material that is waterproof and gas-blocking, and any of the plurality of refractive index films may contain a hygroscopic material, thereby suppressing outgassing and bubble entrapment.

[0012] In the second aspect, the coating step may further coat the electrode pad region and the region other than the scribe region with the coating film, thereby eliminating the need for a mask.

[0013] In the second aspect, the predetermined material may be any one of silicon nitride, silicon carbonitride, silicon oxynitride, and silicon oxide, thereby providing the effect of suppressing outgassing and bubble entrapment.

[0014] In addition, in this second aspect, the method may further include a test step of contacting a probe with the electrode pad after the opening step, a coating step of coating a water-soluble protective film on the surface of the microlens layer and the opening after the test step, a processing step of forming a scribe groove in the scribe region after the coating step, a water cleaning step of performing water cleaning after the processing step, and a dehydration bake step of performing dehydration bake after the water cleaning step, and the coating step may be performed between the dehydration bake step and the sealing step. This has the effect of suppressing outgassing and bubble entrapment without affecting the probe test.

[0015] In addition, in the second aspect, the method may further include an annealing step of performing an annealing treatment after the bonding step, and a dicing step of cutting the wafer including the semiconductor substrate along the scribe region after the annealing step, thereby providing an effect of obtaining a plurality of semiconductor packages.

[0016] 1 is a block diagram showing an example of a configuration of a camera module according to a first embodiment of the present technology. FIG. 2 is a block diagram showing an example of a configuration of a solid-state imaging element in a semiconductor package according to the first embodiment of the present technology. FIG. 3 is an example of a plan view of a semiconductor package according to the first embodiment of the present technology. FIG. 4 is a cross-sectional view showing an example of a configuration of a semiconductor package according to the first embodiment of the present technology. FIG. 5 is an example of a plan view of a wafer according to the first embodiment of the present technology. FIG. 6 is an example of a cross-sectional view of a pixel region in a surface of a wafer according to the first embodiment of the present technology. FIG. 7 is an example of a cross-sectional view of a pad region and a scribe region in a surface of a wafer according to the first embodiment of the present technology. FIG. 8 is a diagram for explaining a manufacturing process up to application of a water-soluble protective film in the first embodiment of the present technology. FIG. 9 is a diagram for explaining a manufacturing process up to dehydration bake in the first embodiment of the present technology. FIG. 10 is a diagram for explaining a manufacturing process up to annealing treatment in the first embodiment of the present technology. FIG. 11 is a flowchart showing an example of a method for manufacturing a semiconductor package according to the first embodiment of the present technology. FIG. 12 is an example of a cross-sectional view in a case where bubble entrapment and outgassing occur in the first embodiment of the present technology. FIG. 13 is an example of a cross-sectional view of a peripheral region of a pixel region in a second embodiment of the present technology. FIG. 10 is a diagram for explaining a manufacturing process according to a second embodiment of the present technology. FIG. 11 is a flowchart illustrating an example of a manufacturing method for a semiconductor package according to the second embodiment of the present technology. FIG. 12 is an example of a cross-sectional view of a pixel region according to a third embodiment of the present technology. FIG. 13 is an example of a cross-sectional view of a peripheral region of a pixel region according to the third embodiment of the present technology. FIG. 14 is a diagram illustrating an example of a schematic configuration of an endoscopic surgery system. FIG. 15 is a block diagram illustrating an example of a functional configuration of a camera head and a CCU. FIG. 16 is a block diagram illustrating an example of a schematic configuration of a vehicle control system. FIG. 17 is an explanatory diagram illustrating an example of an installation position of an imaging unit.

[0017] Hereinafter, modes for carrying out the present technology (hereinafter referred to as embodiments) will be described. The descriptions will be given in the following order: 1. First embodiment (an example in which a plurality of refractive index films are stacked) 2. Second embodiment (an example in which a plurality of refractive index films are stacked to cover a pad region and a scribe region) 3. Third embodiment (an example in which a plurality of refractive index films are stacked to cover the entire surface) 4. Application example to an endoscopic surgery system 5. Application example to a moving body

[0018] 1. First Embodiment [Configuration Example of Camera Module] Fig. 1 is a block diagram showing a configuration example of a camera module 100 according to a first embodiment of the present technology. The camera module 100 captures image data and includes a lens group 110, a semiconductor package 200, an imaging control unit 120, and a DSP (Digital Signal Processor) circuit 130. The size of the camera module 100 in the optical axis direction is referred to as the "height" of the module. When the camera module 100 is provided in an electronic device such as a smartphone or a digital camera, it is preferable to reduce the height of the camera module 100 (in other words, to reduce its height) as much as possible from the standpoint of miniaturization and thinning.

[0019] The lens group 110 focuses incident light and guides it to the semiconductor package 200. The semiconductor package 200 is a WLCSP having a solid-state image sensor such as a CIS (CMOS Image Sensor) installed therein. The solid-state image sensor in the semiconductor package 200 captures image data and supplies the image data to the DSP circuit 130 via a signal line 209.

[0020] The imaging control unit 120 transmits a control signal to the semiconductor package 200 via a signal line 208 to control its operation.

[0021] The DSP circuit 130 performs various image processing operations on the image data from the solid-state image sensor.

[0022] The camera module 100 may further include a memory for storing image data, an interface for transmitting and receiving data to and from the outside, and the like.

[0023] 2 is a block diagram showing an example of the configuration of a solid-state imaging element 210 in a semiconductor package 200 according to the first embodiment of the present technology. The solid-state imaging element 210 includes a vertical driving unit 211, a system control unit 212, a pixel region 213, a column processing unit 215, a horizontal driving unit 216, a data storage unit 217, and a signal processing unit 218.

[0024] A plurality of pixels 214 are arranged in a two-dimensional lattice pattern in the pixel region 213. The pixels 214 generate pixel signals by photoelectric conversion and supply the pixel signals to a column processing unit 215.

[0025] The vertical driving section 211 sequentially selects and drives rows in the pixel region 213 to output pixel signals.

[0026] The system control unit 212 controls the operation timing of the vertical drive unit 211 , the column processing unit 215 and the horizontal drive unit 216 .

[0027] The column processing unit 215 performs AD (Analog to Digital) conversion processing and CDS (Correlated Double Sampling) processing on pixel signals for each column from the pixel region 213. The column processing unit 215 supplies the processed pixel signals to a signal processing unit 218 under the control of the horizontal driving unit 216.

[0028] The horizontal drive unit 216 selects a column in order and outputs the pixel signal of that column to the signal processing unit 218 .

[0029] The signal processing unit 218 performs various signal processing on the pixel signals. Image data in which the processed pixel signals are arranged is supplied to the DSP circuit 130. Note that the DSP circuit 130 can also perform all or part of the processing performed by the signal processing unit 218 instead.

[0030] The data storage unit 217 temporarily stores data required for processing by the signal processing unit 218 .

[0031] 3 is an example of a plan view of a semiconductor package 200 according to the first embodiment of the present technology. The semiconductor package 200 has a rectangular shape when viewed in the optical axis direction.

[0032] Hereinafter, an axis parallel to the rows or columns of the pixel region 213 will be referred to as the "X axis," the optical axis will be referred to as the "Z axis," and the axis perpendicular to the X axis and Z axis will be referred to as the "Y axis."

[0033] When viewed from the Z-axis direction, the semiconductor package 200 has a pixel region 213 and a predetermined number of electrode pads 220 arranged therein. The electrode pads 220 are arranged around the pixel region 213. For example, the X-coordinates of the left and right ends of the semiconductor package 200 are set to X1 and X4, and the X-coordinates of the left and right ends of the pixel region 213 are set to X2 and X3. In this case, the electrode pads 220 are arranged along the Y-axis direction in the region from coordinate X1 to X2 and the region from coordinate X3 to X4. These electrode pads 220 are used for probe testing performed during wafer-level processing.

[0034] 4 is a cross-sectional view showing an example of a configuration of the semiconductor package 200 according to the first embodiment of the present technology. The drawing shows a cross-sectional view of the pixel region 213 when the semiconductor package 200 is cut along the dashed dotted line in FIG. 3 and viewed from the Y-axis direction.

[0035] 4, the semiconductor package 200 includes a glass substrate 310, a sealing resin 320, a pixel protective film 330, a microlens layer 340, a color filter layer 350, a planarization film 360, and a laminated substrate 370. Hereinafter, the direction from the laminated substrate 370 to the glass substrate 310 will be referred to as the "up" direction. Furthermore, the top surface of a substrate or layer will be referred to as the "front surface," and the bottom surface will be referred to as the "back surface."

[0036] The laminated substrate 370 includes a protective film 371, a silicon substrate 373, a wiring layer 374, and a support substrate 375. The upper surface (i.e., the front surface) of the support substrate 375 is covered with a silicon dioxide (SiO ２ A wiring layer 374 such as silicon dioxide (SiO ) is formed on the surface of the wiring layer 374, and a silicon substrate 373 is formed on the surface of the wiring layer 374. A photodiode 372 is formed for each pixel in the silicon substrate 373. The surface of the silicon substrate 373 is covered with a silicon dioxide (SiO ２) or the like is formed on the laminated substrate 370. The laminated substrate 370 is an example of a semiconductor substrate as defined in the claims.

[0037] A planarization film 360 is formed on the surface of the laminated substrate 370 to planarize the region where the color filters are to be formed. Within this planarization film 360, light-shielding films 361 are arranged at positions between pixels to prevent light from leaking into adjacent pixels. A color filter layer 350 is formed on the surface of the planarization film 360. In the color filter layer 350, color filters that transmit visible light, such as R (Red), G (Green), and B (Blue), are arranged for each pixel. These color filters are arranged, for example, in a Bayer pattern when viewed in the Z-axis direction.

[0038] A microlens layer 340 is formed on the surface of the color filter layer 350. The microlens layer 340 includes a low refractive index film 341, a microlens protection film 342, a high refractive index film 343, and a medium refractive index film 344.

[0039] The medium refractive index film 344 is formed on the surface of the color filter layer 350. The material of this medium refractive index film 344 is, for example, a single layered thermosetting styrene resin (STSR), and the refractive index thereof is, for example, 1.57.

[0040] A high refractive index film 343 is formed on the surface of the medium refractive index film 344. The material of this high refractive index film 343 is, for example, silicon nitride (SiN), and its refractive index is, for example, 1.88.

[0041] A microlens protection film 342 for preventing the intrusion of water and impurities is formed on the surface of the high refractive index film 343. The material of this microlens protection film 342 is, for example, silicon oxynitride (SiON), and its refractive index is, for example, 1.65.

[0042] A low refractive index film 341 is formed on the surface of the microlens protective film 342. The refractive index of this low refractive index film 341 is, for example, 1.41. The low refractive index film 341 is made of, for example, a hygroscopic coating material based on polycyclohexane.

[0043] A pixel protection film 330 is formed on the surface of the low refractive index film 341. For example, a low temperature oxide film (LTO) is used as this pixel protection film 330, and its refractive index is, for example, 1.47.

[0044] A sealing resin 320 is formed on the surface of the pixel protective film 330 to seal the pixel protective film 330, the microlens layer 340, etc. The refractive index of this sealing resin 320 is, for example, 1.51. A glass substrate 310 is bonded to the surface of the sealing resin 320.

[0045] 5 is an example of a cross-sectional view of a peripheral region of a pixel region according to the first embodiment of the present technology. The drawing shows a cross-sectional view of the peripheral region of the pixel region as viewed from the Y-axis direction. A pad region and a scribe region are provided around the pixel region.

[0046] In the pad region, an opening is formed that penetrates the pixel protection film 330, the microlens layer 340, and the laminated substrate 370 and reaches the electrode pad 220 in the wiring layer 374. In the figure, the X coordinates of the left and right ends of the pad region are X31 and X34. Furthermore, in the pad region, the X coordinates of the left and right ends of the opening are X32 and X33.

[0047] The scribe area is an area used to cut the semiconductor package 200 from the wafer. In a wafer-level process, scribe grooves were formed in the scribe area before dicing. After cutting along the scribe grooves, a portion of the left side of the scribe groove remained, as illustrated in the figure. The X coordinates of the left and right ends of the scribe area after dicing are X34 and X4, and the X coordinates of the left and right ends of the remaining scribe grooves are X35 and X4.

[0048] In addition, in the pad region and the scribe region, the openings and the scribe grooves are sealed with a sealing resin 320 .

[0049] In dicing, for example, the wafer is cut along the scribed grooves in one step using a dicing blade, and the shape of the cut surface is linear when viewed in the Y-axis direction, as illustrated in the same figure.

[0050] It should be noted that dicing can be performed in multiple steps rather than in one step. For example, dicing can be performed in two steps as shown in FIG. 32 of JP 2019-213151 A. A dicing blade is used in the first step, and dry etching, laser dicing, or a dicing blade is used in the second step. Alternatively, dicing can be performed in three steps as shown in FIGS. 33 and 34 of JP 2019-213151 A.

[0051] In addition, laser dicing or wet etching can be used as exemplified in Figures 7 to 9 of Japanese Patent Application Laid-Open No. 2020-27837. Plasma etching can also be used.

[0052] 4 and 5 , a plurality of refractive index films (low refractive index film 341 and high refractive index film 343) having different refractive indices are laminated on microlens layer 340. Microlens layer 340 and color filter layer 350 are laminated on laminate substrate 370. Microlens layer 340 and color filter layer 350 are sealed with sealing resin 320, and glass substrate 310 is bonded to sealing resin 320.

[0053] Here, as a comparative example, a structure in which the microlens layer 340 is formed only from a single layer of thermosetting styrene resin (STSR) is considered. In this comparative example, to improve optical characteristics such as resolution, it is necessary to add a lens to the lens group 110 above the microlens layer 340. In this case, the size (height) of the camera module 100 in the optical axis direction increases. This makes it difficult to achieve both improved optical characteristics and a low profile of the module.

[0054] In contrast to this, as illustrated in Figures 4 and 5, by forming a microlens layer 340 in which multiple refractive index films with different refractive indices are stacked, it is possible to improve the optical characteristics without adding lenses (in other words, while reducing the height).

[0055] [Method for Manufacturing Semiconductor Package] Next, a method for manufacturing the semiconductor package 200 will be described with reference to FIGS.

[0056] 6 is an example of a plan view of a wafer 300 according to the first embodiment of the present technology. This figure shows a plan view as seen from the Z-axis direction. Within the circular wafer 300, each of a plurality of rectangular regions surrounded by dotted lines indicates an area for a chip-sized semiconductor package 200 to be cut out by dicing.

[0057] 7 is an example of a cross-sectional view of a pixel region on the surface of a wafer 300 according to the first embodiment of the present technology. The drawing shows a cross-sectional view of the wafer 300 in FIG. 6 cut along a dashed line and viewed from the Y-axis direction.

[0058] As illustrated in FIG. 7, in a wafer-level process before dicing, a planarization film 360, a color filter layer 350, and a microlens layer 340 are laminated on a laminate substrate 370, and a pixel protection film 330 is applied.

[0059] 8 is an example of a cross-sectional view of the pad region and the scribe region on the surface of the wafer 300 according to the first embodiment of the present technology. This figure shows a cross-sectional view as seen from the Y-axis direction.

[0060] The X coordinates of the left and right ends of a pixel area are X2 and X3, and the X coordinate of the left end of a pixel area to the right of that pixel area is X6. The X coordinate midway between X3 and X6 is X5. In this case, a scribe area is placed in a predetermined range centered on X5, and pad areas are placed on both sides of it.

[0061] In the pad region and the scribe region, a pixel protection film 330 and a microlens layer 340 are laminated on the upper surface of the laminate substrate 370. The openings and scribe grooves are formed in the process described below.

[0062] Next, focusing on the pad region and the scribe region, the process subsequent to that of FIG. 8 will be described with reference to FIGS.

[0063] FIG. 9 is a diagram for explaining the manufacturing process up to the application of the water-soluble protective film 402 according to the first embodiment of the present technology.

[0064] As shown in FIG. 10A, an opening 401 is formed by dry etching or the like, penetrating the microlens layer 340 and reaching the electrode pad 220 in the laminated substrate 370 .

[0065] Then, as illustrated in b in the figure, a probe test is performed in which a probe is brought into contact with the surface of the exposed electrode pad 220. After this step, the electrode pad 220 is no longer needed, and it becomes possible to cover it with a covering film, which will be described later, or to embed it in a sealing resin 320.

[0066] Next, as shown in c in the figure, a water-soluble protective film 402 is applied to the entire surface in order to prevent the adhesion of dust generated by laser processing, which will be described later. For example, a water-soluble protective film from the HogoMax (registered trademark) series by DISCO (registered trademark) is used as this water-soluble protective film 402.

[0067] FIG. 10 is a diagram for explaining the manufacturing process up to the dehydration bake in the first embodiment of the present technology.

[0068] After the application of the water-soluble protective film 402, as shown in FIG. 3A, scribe grooves 403 are formed by laser processing, reaching the wiring layer 374. Laser processing is also called laser dicing or LA (Laser Ablation).

[0069] Then, as shown in FIG. 1B, water washing is performed.

[0070] Subsequently, as shown in FIG. 1C, dehydration baking is performed at 200° C. for 10 minutes, for example.

[0071] FIG. 11 is a diagram for explaining the manufacturing process up to the annealing treatment according to the first embodiment of the present technology.

[0072] After the dehydration bake, as shown in FIG. 10A, a sealing resin 320 is applied to seal the pixel protective film 330, the microlens layer 340, and the laminated substrate 370.

[0073] Then, as shown in FIG. 1B, the glass substrate 310 is bonded to the surface of the sealing resin 320 .

[0074] Subsequently, as shown in FIG. 1C, an annealing process is performed at 200° C. for 4 hours, for example.

[0075] Furthermore, in a later step, the wafer 300 including the laminated substrate 370 and the like is cut along the scribe regions, and the wafer 300 is separated into a plurality of semiconductor packages 200 .

[0076] FIG. 12 is a flowchart showing an example of a method for manufacturing the semiconductor package 200 according to the first embodiment of the present technology.

[0077] First, in the wafer 300, the planarization film 360, the color filter layer 350, and the microlens layer 340 are formed on the laminated substrate 370 (step S901), and the electrode pads 220 are exposed through openings (step S902).

[0078] Then, a probe test is carried out and a water-soluble protective film 402 is formed (step S903). Subsequently, scribed grooves are formed by laser processing and the substrate is washed with water (step S904).

[0079] Then, a dehydration bake is performed (step S905), and the microlens layer 340 and the laminated substrate 370 are sealed by applying a sealing resin 320 (step S906). Then, the glass substrate 310 is bonded to the sealing resin 320 (step S907), and an annealing process is performed (step S908).

[0080] Next, dicing is performed along the scribe region (step S909), and various processes are performed as necessary, completing the manufacturing process of the semiconductor package 200.

[0081] As described above, according to the first embodiment of the present technology, the microlens layer 340 is formed by stacking a plurality of refractive index films having different refractive indices, so that the optical characteristics of the camera module 100 can be improved while reducing its height.

[0082] 2. Second Embodiment In the first embodiment described above, the microlens layer 340 has a laminated structure, but the low-refractive-index film 341 in this microlens layer 340 contains a hygroscopic material as described above. For this reason, during the annealing process after bonding the glass substrates, outgassing may occur from the low-refractive-index film 341, and this outgassing may cause appearance abnormalities at the edges of the openings, etc. The semiconductor package 200 in this second embodiment differs from the first embodiment in that outgassing is suppressed by a coating film containing a waterproof and gas-barrier material.

[0083] FIG. 13 is an example of a cross-sectional view of a case where bubble entrapment and outgassing occur in the first embodiment of the present technology.

[0084] As shown in the diagram a, when the sealing resin 320 is applied, air may get mixed into the pad area or the scribe area, causing bubbles 404 in the opening 401 or the scribe groove 403. This phenomenon is called "bubble entrapment."

[0085] Furthermore, during water washing after the formation of the scribed grooves 403, the low refractive index film 341 containing a hygroscopic material may absorb moisture, and moisture may remain even after dehydration baking. Then, when an annealing process is performed as illustrated in c in the figure after bonding the glass substrate 310 in b in the figure, outgassing 405 may occur due to the moisture remaining in the low refractive index film 341. This outgassing 405 may cause abnormal appearance at the edges of the openings 401, etc.

[0086] Furthermore, the outgassing 405 and bubble entrapment may deteriorate the electrical characteristics of the devices in the semiconductor package 200 .

[0087] 14 is an example of a cross-sectional view of a peripheral region of a pixel region in a second embodiment of the present technology. The semiconductor package 200 in the second embodiment differs from the first embodiment in that it further includes a covering film 380. Note that the cross-sectional view of the pixel region in the second embodiment is similar to that in the first embodiment.

[0088] The coating film 380 is applied to the pad region and scribe region of the surface of the semiconductor package 200 when viewed from the Z-axis direction. This coating film 380 contains a waterproof and gas-blocking material. Examples of this material include silicon nitride (SiN), silicon carbide nitride (SiCN), silicon carbide oxide (SiCO), and silicon oxide (SiO). This structure can be called a CPAS (Coated Pads And Scribes) structure.

[0089] 15 is a diagram for explaining a manufacturing process according to a second embodiment of the present technology. In order to suppress the occurrence of the aforementioned outgassing and bubble entrapment, in the second embodiment, a step indicated by b in the figure is added between the dehydration bake step indicated by a in the figure and the application step of the seal resin 320 indicated by c in the figure.

[0090] In FIG. 1B, a coating film 380 is applied to the pad and scribe areas to obtain a CPAS structure.

[0091] By covering the pad region and the scribe region with the coating film 380 that is waterproof and gas-blocking, it is possible to suppress outgassing from the low refractive index film 341. This makes it possible to prevent appearance abnormalities caused by outgassing.

[0092] Furthermore, by applying the coating film 380 before applying the sealing resin 320, the embedding property of the sealing resin 320 can be improved and bubbles that occur when the sealing resin 320 is applied can be suppressed.

[0093] In addition, titanium oxide (TiO) is used as a water-soluble protective film to suppress initial debris and scattering during laser processing. ２ ) has become mainstream, but there is a concern that this material may act as a catalyst that induces resin deterioration. Therefore, if the sealing resin 320 is applied while the electrode pads 220 and scribe grooves are left exposed, as in the first embodiment, there is a risk that the quality of the resin may deteriorate. In contrast, in the second embodiment, the pad area and scribe area are covered before the sealing resin 320 is applied, so that deterioration of the resin quality can also be suppressed.

[0094] Furthermore, by covering the scribe area with the coating film 380 that is waterproof and gas-blocking, it is possible to prevent the microlens material (such as the low refractive index film 341) from absorbing moisture when forming the scribe grooves. This moisture absorption suppression can prevent deterioration of the film properties of the refractive index film inside the microlens.

[0095] In summary, the addition of step b in the figure produces the following effects: (1) Suppression of outgassing from the low refractive index film 341. Prevention of appearance abnormalities due to the suppression of outgassing. (2) Improvement of the embeddability of the sealing resin 320 in the scribe region, etc. Suppression of bubble entrapment due to the improved embeddability. (3) Suppression of deterioration of the resin quality of the sealing resin 320. (4) Suppression of moisture absorption by the microlens material when forming the scribe groove. Suppression of deterioration of film characteristics due to the suppression of moisture absorption.

[0096] 4 of Patent Document 1, the waterproof and gas-blocking coating film 380 is not present on the side walls of the electrode pad 220 and the scribe groove, and therefore the effect of suppressing bubble entrapment and abnormal appearance cannot be obtained. Also, in Patent Document 1, the problem of insufficient film formation, which results in the protective film on the side walls becoming thin, and the problem of the protective film disappearing when forming openings by dry etching or when laser processing the scribe grooves may occur.

[0097] In contrast, in the second embodiment, in which the coating film 380 is formed before the application of the sealing resin 320, there is no subsequent processing step to thin the coating film 380. Therefore, the coating film 380 does not disappear, and the coating performance (in other words, coverage) is maintained. This makes it possible to maximize the above-mentioned effects. Furthermore, because the coating film 380 is formed after the probe test, even if the electrode pads 220 are covered, there is no problem with the probe test before the coating.

[0098] 16 is a flowchart illustrating an example of a method for manufacturing a semiconductor package 200 according to the second embodiment of the present technology. The manufacturing method according to the second embodiment differs from the first embodiment in that step S910 is further executed.

[0099] After dehydration baking (step S905), a coating film 380 is applied to the pad region and the scribe region (step S910). Then, a sealing resin 320 is applied to seal the microlens layer 340 and the laminated substrate 370 (step S906), and steps S907 and onward are executed.

[0100] As described above, according to the second embodiment of the present technology, the pad region and the scribe region are covered with the coating film 380 that is waterproof and gas-blocking, so that outgassing and bubble entrapment can be suppressed.

[0101] 3. Third Embodiment In the second embodiment described above, only the pad region and the scribe region are covered with the covering film 380, but regions other than these regions can also be covered. The semiconductor package 200 in this third embodiment differs from the second embodiment in that the entire surface is covered with the covering film 380.

[0102] FIG. 17 is an example of a cross-sectional view of a pixel region according to the third embodiment of the present technology.

[0103] FIG. 18 is an example of a cross-sectional view of a peripheral region of a pixel region according to the third embodiment of the present technology.

[0104] 17 and 18 , in the third embodiment, the entire surface of the semiconductor package 200, including areas other than the pad area and the scribe area (such as the pixel area), is covered with a waterproof and gas-blocking coating film 381. As this coating film 381, an LTO film or a film with a refractive index equivalent to that of the low refractive index film 341 is used.

[0105] The step of forming the coating film 381 is added between the dehydration bake step and the step of applying the sealing resin 320, as in the second embodiment.

[0106] In the CPAS structure, it was necessary to mask the pixel region so that the coating film 380 would not be applied thereto, but in the third embodiment, the coating film 381 is applied to the entire surface, so there is no need to mask.

[0107] As described above, according to the third embodiment of the present technology, the entire surface of the semiconductor package 200 is covered with the covering film 381 having waterproof and gas barrier properties, so there is no need to mask the pixel region.

[0108] 4. Application Example to Endoscopic Surgery System The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be applied to an endoscopic surgery system.

[0109] FIG. 19 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technology according to the present disclosure (the present technology) can be applied.

[0110] 19 shows an operator (doctor) 11131 performing surgery on a patient 11132 on a patient bed 11133 using an endoscopic surgery system 11000. As shown in the figure, the endoscopic surgery system 11000 is composed of an endoscope 11100, other surgical tools 11110 such as an insufflation tube 11111 and an energy treatment tool 11112, a support arm device 11120 that supports the endoscope 11100, and a cart 11200 on which various devices for endoscopic surgery are mounted.

[0111] The endoscope 11100 is composed of a lens barrel 11101, a region of a predetermined length from the tip of which is inserted into a body cavity of a patient 11132, and a camera head 11102 connected to the base end of the lens barrel 11101. In the example shown, the endoscope 11100 is configured as a so-called rigid scope having a rigid lens barrel 11101, but the endoscope 11100 may also be configured as a so-called flexible scope having a flexible lens barrel.

[0112] An opening into which an objective lens is fitted is provided at the tip of the lens barrel 11101. A light source device 11203 is connected to the endoscope 11100, and light generated by the light source device 11203 is guided to the tip of the lens barrel by a light guide extending inside the lens barrel 11101, and is irradiated via the objective lens toward an object to be observed inside the body cavity of the patient 11132. The endoscope 11100 may be a direct-viewing endoscope, an oblique-viewing endoscope, or a side-viewing endoscope.

[0113] An optical system and an image sensor are provided inside the camera head 11102, and light reflected from the object of observation (observation light) is collected onto the image sensor by the optical system. The observation light is photoelectrically converted by the image sensor to generate an electrical signal corresponding to the observation light, i.e., an image signal corresponding to the observed image. The image signal is sent to a camera control unit (CCU) 11201 as RAW data.

[0114] The CCU 11201 is configured with a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), etc., and comprehensively controls the operations of the endoscope 11100 and the display device 11202. Furthermore, the CCU 11201 receives an image signal from the camera head 11102 and performs various types of image processing on the image signal, such as development processing (demosaic processing), to display an image based on the image signal.

[0115] Under the control of the CCU 11201, the display device 11202 displays an image based on an image signal that has been subjected to image processing by the CCU 11201.

[0116] The light source device 11203 is composed of a light source such as an LED (light emitting diode), and supplies irradiation light to the endoscope 11100 when photographing the surgical site, etc.

[0117] The input device 11204 is an input interface for the endoscopic surgery system 11000. A user can input various information and instructions to the endoscopic surgery system 11000 via the input device 11204. For example, the user inputs an instruction to change the imaging conditions (type of irradiation light, magnification, focal length, etc.) of the endoscope 11100.

[0118] The treatment tool control device 11205 controls the driving of the energy treatment tool 11112 for cauterizing tissue, incising, sealing blood vessels, etc. The insufflation device 11206 inflates the body cavity of the patient 11132 through the insufflation tube 11111 in order to ensure a clear field of view for the endoscope 11100 and a working space for the surgeon. The recorder 11207 is a device capable of recording various types of information related to the surgery. The printer 11208 is a device capable of printing various types of information related to the surgery in various formats such as text, images, or graphs.

[0119] The light source device 11203, which supplies illumination light to the endoscope 11100 when photographing the surgical site, can be configured from a white light source, such as an LED, a laser light source, or a combination of these. When the white light source is configured from a combination of RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high precision, allowing the light source device 11203 to adjust the white balance of the captured image. In this case, it is also possible to time-share images corresponding to each RGB by irradiating the object of observation with laser light from each RGB laser light source and controlling the drive of the image sensor of the camera head 11102 in synchronization with the irradiation timing. According to this method, color images can be obtained without providing a color filter to the image sensor.

[0120] Furthermore, the light source device 11203 may be controlled to change the intensity of light it outputs at predetermined time intervals. By controlling the driving of the image sensor of the camera head 11102 in synchronization with the timing of the change in light intensity to acquire images in a time-division manner and combining the images, it is possible to generate an image with a high dynamic range that is free from so-called blocked-up shadows and blown-out highlights.

[0121] The light source device 11203 may also be configured to supply light in a predetermined wavelength band corresponding to special light observation. Special light observation, for example, utilizes the wavelength dependence of light absorption in body tissues to irradiate light with a narrower band than the light irradiated during normal observation (i.e., white light), thereby capturing high-contrast images of specific tissues, such as blood vessels on the surface of mucous membranes, known as narrow-band imaging. Alternatively, special light observation may be performed using fluorescence observation, in which images are obtained using fluorescence generated by irradiating excitation light. Fluorescence observation may involve irradiating excitation light onto body tissues and observing the fluorescence from the tissue (autofluorescence observation), or by locally injecting a reagent such as indocyanine green (ICG) into the body tissue and irradiating the tissue with excitation light corresponding to the fluorescent wavelength of the reagent to obtain a fluorescent image. The light source device 11203 may be configured to supply narrow-band light and / or excitation light corresponding to such special light observation.

[0122] FIG. 20 is a block diagram showing an example of the functional configuration of the camera head 11102 and the CCU 11201 shown in FIG.

[0123] The camera head 11102 has a lens unit 11401, an imaging unit 11402, a drive unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 has a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are connected to each other via a transmission cable 11400 so that they can communicate with each other.

[0124] The lens unit 11401 is an optical system provided at the connection portion with the lens barrel 11101. Observation light taken in from the tip of the lens barrel 11101 is guided to the camera head 11102 and enters the lens unit 11401. The lens unit 11401 is composed of a combination of multiple lenses including a zoom lens and a focus lens.

[0125] The imaging unit 11402 may include one imaging element (a so-called single-chip type) or multiple imaging elements (a so-called multi-chip type). When the imaging unit 11402 is configured as a multi-chip type, for example, each imaging element may generate an image signal corresponding to each of RGB, and a color image may be obtained by combining these signals. Alternatively, the imaging unit 11402 may be configured to have a pair of imaging elements for acquiring image signals for the right eye and the left eye corresponding to a 3D (dimensional) display. The 3D display allows the surgeon 11131 to more accurately grasp the depth of the biological tissue at the surgical site. When the imaging unit 11402 is configured as a multi-chip type, multiple lens units 11401 may be provided corresponding to each imaging element.

[0126] Furthermore, the imaging unit 11402 does not necessarily have to be provided in the camera head 11102. For example, the imaging unit 11402 may be provided inside the lens barrel 11101, immediately after the objective lens.

[0127] The driving unit 11403 is configured by an actuator, and moves the zoom lens and focus lens of the lens unit 11401 by a predetermined distance along the optical axis under the control of the camera head control unit 11405. This allows the magnification and focus of the image captured by the imaging unit 11402 to be adjusted appropriately.

[0128] The communication unit 11404 is configured by a communication device for transmitting and receiving various types of information to and from the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 to the CCU 11201 via the transmission cable 11400 as RAW data.

[0129] Furthermore, the communication unit 11404 receives a control signal for controlling the driving of the camera head 11102 from the CCU 11201 and supplies the control signal to the camera head control unit 11405. The control signal includes information on the imaging conditions, such as information specifying the frame rate of the captured image, information specifying the exposure value at the time of imaging, and / or information specifying the magnification and focus of the captured image.

[0130] The image capturing conditions such as the frame rate, exposure value, magnification, and focus may be appropriately specified by the user, or may be automatically set by the control unit 11413 of the CCU 11201 based on the acquired image signal. In the latter case, the endoscope 11100 is equipped with a so-called AE (Auto Exposure) function, AF (Auto Focus) function, and AWB (Auto White Balance) function.

[0131] The camera head control unit 11405 controls the driving of the camera head 11102 based on a control signal received from the CCU 11201 via the communication unit 11404 .

[0132] The communication unit 11411 is configured by a communication device for transmitting and receiving various information to and from the camera head 11102. The communication unit 11411 receives an image signal transmitted from the camera head 11102 via the transmission cable 11400.

[0133] Furthermore, the communication unit 11411 transmits to the camera head 11102 a control signal for controlling the driving of the camera head 11102. The image signal and the control signal can be transmitted by electrical communication, optical communication, or the like.

[0134] The image processing unit 11412 performs various image processing operations on the image signal, which is RAW data transmitted from the camera head 11102 .

[0135] The control unit 11413 performs various controls related to the imaging of the surgical site, etc. by the endoscope 11100 and the display of the captured image obtained by imaging the surgical site, etc. For example, the control unit 11413 generates a control signal for controlling the driving of the camera head 11102.

[0136] Furthermore, the control unit 11413 displays the captured image showing the surgical site, etc., on the display device 11202 based on the image signal subjected to image processing by the image processing unit 11412. At this time, the control unit 11413 may recognize various objects in the captured image using various image recognition technologies. For example, the control unit 11413 can recognize surgical tools such as forceps, specific biological parts, bleeding, mist generated when using the energy treatment tool 11112, etc., by detecting the shape and color of the edges of objects included in the captured image. When displaying the captured image on the display device 11202, the control unit 11413 may use the recognition results to superimpose various surgical support information on the image of the surgical site. By superimposing the surgical support information and presenting it to the surgeon 11131, the burden on the surgeon 11131 can be reduced and the surgeon 11131 can proceed with the surgery reliably.

[0137] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 is an electrical signal cable for electrical signal communication, an optical fiber for optical communication, or a composite cable of these.

[0138] In the illustrated example, communication is performed wired using a transmission cable 11400, but communication between the camera head 11102 and the CCU 11201 may also be performed wirelessly.

[0139] The foregoing describes an example of an endoscopic surgery system to which the technology disclosed herein can be applied. The technology disclosed herein can be applied to, for example, the camera head 11102 among the above-described configurations. Specifically, the camera module 100 shown in FIG. 1 can be applied to the camera head 11102. By applying the technology disclosed herein to the camera head 11102, the height can be reduced while improving optical characteristics, thereby enabling clearer images of the surgical site to be obtained, enabling the surgeon to reliably confirm the surgical site.

[0140] Although an endoscopic surgery system has been described as an example here, the technology according to the present disclosure may also be applied to other systems, such as a microsurgery system.

[0141] 4. Application Examples to Mobile Bodies The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of mobile body, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, or a robot.

[0142] FIG. 21 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile object control system to which the technology according to the present disclosure can be applied.

[0143] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 21 , the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also shown as functional components of the integrated control unit 12050 are a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (interface) 12053.

[0144] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a braking force of the vehicle.

[0145] The body system control unit 12020 controls the operation of various devices equipped in the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as headlamps, backup lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves transmitted from a portable device that serves as a key or signals from various switches can be input to the body system control unit 12020. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0146] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture images outside the vehicle and receives the captured images. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for people, cars, obstacles, signs, characters on the road surface, etc. based on the received images.

[0147] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0148] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing off.

[0149] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, steering mechanism, or braking device based on the information inside and outside the vehicle acquired by the outside-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including vehicle collision avoidance or impact mitigation, following driving based on the distance between vehicles, maintaining vehicle speed, vehicle collision warning, vehicle lane departure warning, etc.

[0150] In addition, the microcomputer 12051 can perform cooperative control for the purpose of automatic driving, which allows the vehicle to travel autonomously without relying on driver operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle obtained by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0151] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information outside the vehicle acquired by the outside information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside information detection unit 12030, and perform cooperative control aimed at preventing glare, such as switching from high beams to low beams.

[0152] The audio / video output unit 12052 transmits at least one of audio and video output signals to an output device capable of visually or audibly notifying information to vehicle occupants or the outside of the vehicle. In the example of Fig. 21, the output devices are exemplified by an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an on-board display and a head-up display.

[0153] FIG. 22 is a diagram showing an example of the installation position of the imaging unit 12031.

[0154] In FIG. 22, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0155] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as the front nose, side mirrors, rear bumper, back door, and the top of the windshield inside the vehicle cabin of the vehicle 12100. The imaging unit 12101 provided on the front nose and the imaging unit 12105 provided on the top of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 provided on the top of the windshield inside the vehicle cabin is mainly used to detect preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc.

[0156] 22 shows an example of the imaging ranges of the imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, by overlaying the image data captured by the imaging units 12101 to 12104, an overhead image of the vehicle 12100 viewed from above can be obtained.

[0157] At least one of the image capturing units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the image capturing units 12101 to 12104 may be a stereo camera made up of multiple image capturing elements, or may be an image capturing element having pixels for phase difference detection.

[0158] For example, based on the distance information obtained from the imaging units 12101 to 12104, the microcomputer 12051 can calculate the distance to each three-dimensional object within the imaging ranges 12111 to 12114 and the change in this distance over time (relative speed with respect to the vehicle 12100), thereby extracting as a preceding vehicle, in particular, the closest three-dimensional object on the path of the vehicle 12100 that is traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or higher). Furthermore, the microcomputer 12051 can set the inter-vehicle distance to be maintained in advance in front of the preceding vehicle, and perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), etc. In this way, cooperative control can be performed for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation.

[0159] For example, the microcomputer 12051 classifies and extracts three-dimensional object data regarding three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines the collision risk, which indicates the risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drive system control unit 12010.

[0160] At least one of the image capturing units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether or not a pedestrian is present in the images captured by the image capturing units 12101 to 12104. Such pedestrian recognition is performed, for example, by extracting feature points from the images captured by the image capturing units 12101 to 12104 as infrared cameras and performing pattern matching processing on a series of feature points that indicate the outline of an object to determine whether or not the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the image capturing units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular outline on the recognized pedestrian for emphasis. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating the pedestrian at a desired position.

[0161] The foregoing has described an example of a vehicle control system to which the technology according to the present disclosure can be applied. The technology according to the present disclosure can be applied to, for example, the image capture unit 12031 of the above-described configuration. Specifically, the camera module 100 of FIG. 1 can be applied to the image capture unit 12031. By applying the technology according to the present disclosure to the image capture unit 12031, the height can be reduced while improving optical characteristics, and a captured image that is easier to see can be obtained, thereby reducing driver fatigue.

[0162] Note that the above-described embodiment shows an example for realizing the present technology, and the matters in the embodiment and the matters specifying the invention in the claims correspond to each other. Similarly, the matters specifying the invention in the claims and the matters in the embodiment of the present technology having the same name correspond to each other. However, the present technology is not limited to the embodiment, and can be realized by applying various modifications to the embodiment within the scope of the gist thereof.

[0163] The effects described in this specification are merely examples and are not limiting, and other effects may also be obtained.

[0164] The present technology can also be configured as follows: (1) A semiconductor package comprising: a microlens layer formed by stacking a plurality of refractive index films having different refractive indices; a color filter layer; a semiconductor substrate on which the microlens layer and the color filter layer are stacked; a sealing resin that seals the microlens layer and the semiconductor substrate; and a glass substrate bonded to the sealing resin. (2) The semiconductor package according to (1), further comprising: a coating film containing a predetermined material having waterproof and gas barrier properties, the coating film covering an electrode pad region and a scribe region when viewed from a direction perpendicular to the surface of the semiconductor substrate, wherein any of the plurality of refractive index films contains a hygroscopic material, and the electrode pad region has an opening that penetrates the microlens layer and reaches the electrode pad in the semiconductor substrate. (3) The semiconductor package according to (2), wherein the coating film further covers a region other than the electrode pad region and the scribe region. (4) The semiconductor package according to (2) or (3), wherein the predetermined material is any of silicon nitride, silicon carbonitride, silicon oxynitride, and silicon oxide. (5) A method for manufacturing a semiconductor package, comprising: a sealing step of sealing a semiconductor substrate having a microlens layer and a color filter layer stacked thereon, the microlens layer being made of a plurality of refractive index films having different refractive indices, with a sealing resin; and a bonding step of bonding a glass substrate to the sealing resin. (6) A method for manufacturing a semiconductor package according to (5), further comprising: an opening step of forming an opening that penetrates the microlens layer and reaches an electrode pad in the semiconductor substrate; and a covering step, between the opening step and the sealing step, of covering the electrode pad region and the scribe region in which the opening is formed, as viewed from a direction perpendicular to the surface of the semiconductor substrate, with a covering film containing a material having waterproof and gas barrier properties, wherein any of the plurality of refractive index films contains a hygroscopic material. (7) A method for manufacturing a semiconductor package according to (6), further comprising: in the covering step, further covering the electrode pad region and the region other than the scribe region with the covering film.(8) The method for manufacturing a semiconductor package according to (6) or (7), wherein the predetermined material is any one of silicon nitride, silicon carbonitride, silicon oxynitride, and silicon oxide. (9) The method for manufacturing a semiconductor package according to any one of (6) to (8), further comprising: a testing step of bringing a probe into contact with the electrode pad after the opening step; a coating step of applying a water-soluble protective film to the surface of the microlens layer and the opening after the testing step; a processing step of forming a scribe groove in the scribe area after the coating step; a water cleaning step of performing water cleaning after the processing step; and a dehydration bake step of performing dehydration bake after the water cleaning step, wherein the covering step is performed between the dehydration bake step and the sealing step. (10) The method for manufacturing a semiconductor package according to any one of (6) to (9), further comprising: an annealing step of performing an annealing treatment after the bonding step; and a dicing step of cutting a wafer including the semiconductor substrate along the scribe area after the annealing step.

[0165] 100 Camera module 110 Lens group 120 Imaging control unit 130 DSP circuit 200 Semiconductor package 210 Solid-state imaging element 211 Vertical drive unit 212 System control unit 213 Pixel area 214 Pixel 215 Column processing unit 216 Horizontal drive unit 217 Data storage unit 218 Signal processing unit 220 Electrode pad 300 Wafer 310 Glass substrate 320 Sealing resin 330 Pixel protective film 340 Microlens layer 341 Low refractive index film 342 Microlens protective film 343 High refractive index film 344 Medium refractive index film 350 Color filter layer 360 Planarization film 361 Light-shielding film 370 Laminated substrate 371 Protective film 372 Photodiode 373 Silicon substrate 374 Wiring layer 375 Support substrate 380, 381 Coating film 401 Opening 402 Water-soluble protective film 403 Scribe groove 404 Air bubble 405 Outgas 11102 Camera head 12031 Imaging unit

Claims

1. A semiconductor package comprising: a microlens layer formed by stacking a plurality of refractive index films having different refractive indices; a color filter layer; a semiconductor substrate on which the microlens layer and the color filter layer are stacked; a sealing resin that seals the microlens layer and the semiconductor substrate; and a glass substrate bonded to the sealing resin.

2. The semiconductor package according to claim 1, further comprising a coating film containing a specified material having waterproof and gas barrier properties, covering the electrode pad area and the scribe area when viewed from a direction perpendicular to the surface of the semiconductor substrate, wherein any one of the plurality of refractive index films contains a hygroscopic material, and an opening is formed in the electrode pad area, penetrating the microlens layer and reaching the electrode pad in the semiconductor substrate.

3. The semiconductor package according to claim 2, wherein the covering film further covers an area other than the electrode pad area and the scribe area.

4. The semiconductor package according to claim 2, wherein the predetermined material is any one of silicon nitride, silicon carbonitride, silicon oxynitride, and silicon oxide.

5. A method for manufacturing a semiconductor package, comprising: a sealing step of sealing a semiconductor substrate having a microlens layer and a color filter layer stacked thereon, the microlens layer being formed by stacking a plurality of refractive index films having different refractive indices, with a sealing resin; and a bonding step of bonding a glass substrate to the sealing resin.

6. A method for manufacturing a semiconductor package as described in claim 5, further comprising: an opening step for forming an opening penetrating the microlens layer and reaching an electrode pad in the semiconductor substrate; and a covering step between the opening step and the sealing step for covering the electrode pad area and the scribe area in which the opening is formed, when viewed from a direction perpendicular to the surface of the semiconductor substrate, with a covering film containing a material having waterproof and gas barrier properties, wherein any one of the plurality of refractive index films contains a hygroscopic material.

7. The method for manufacturing a semiconductor package according to claim 6, wherein in said covering step, said covering film is further used to cover areas other than said electrode pad area and said scribe area.

8. The method for manufacturing a semiconductor package according to claim 6, wherein the predetermined material is any one of silicon nitride, silicon carbonitride, silicon oxynitride, and silicon oxide.

9. A method for manufacturing a semiconductor package as described in claim 6, further comprising: a test step of contacting a probe with the electrode pad after the opening step; a coating step of applying a water-soluble protective film to the surface of the microlens layer and the opening after the test step; a processing step of forming a scribe groove in the scribe area after the coating step; a water cleaning step of performing water cleaning after the processing step; and a dehydration bake step of performing a dehydration bake after the water cleaning step, wherein the covering step is performed between the dehydration bake step and the sealing step.

10. The method of claim 6, further comprising: an annealing step of performing an annealing treatment after said bonding step; and a dicing step of cutting a wafer including said semiconductor substrate along said scribe areas after said annealing step.

Images