Bonding device, bonding system, and bonding method

Abstract

This bonding device bonds a plurality of dies to a substrate. The substrate includes a plurality of first devices on the surface where the dies are bonded. The dies each include, on the surface where the die is bonded to the substrate, a second device to be electrically connected to the first devices. The bonding device is provided with: a carrier retention unit for retaining a carrier onto which a plurality of the dies have been mounted; a substrate retention unit for retaining the substrate; a first conveyance unit for receiving and conveying the dies from the carrier being retained in the carrier retention unit; a second conveyance unit that is distinct from the first conveyance unit and that receives and conveys the dies from the carrier; and a mounting unit for receiving the dies in a desired order from the first conveyance unit and the second conveyance unit and mounting the received dies onto the substrate being retained in the substrate retention unit.

Description

Bonding device, bonding system, and bonding method

[0001] The present disclosure relates to a bonding device, a bonding system, and a bonding method.

[0002] The chip mounting system described in Patent Document 1 includes a chip supply device, a bonding device, a surface treatment device, a carry-in / out section, and a transport section (paragraph

[0225] of Patent Document 1). The chip supply device supplies multiple chips individually. The chips are attached to tape covering an opening of a frame, and are pushed up one by one and turned upside down (paragraph

[0251] of Patent Document 1). The bonding device attaches the chips supplied from the chip supply device to a substrate.

[0003] Japanese Patent No. 6337400

[0004] One aspect of the present disclosure provides techniques for improving die-to-substrate bonding efficiency.

[0005] A bonding apparatus according to one aspect of the present disclosure bonds multiple dies to a substrate. The substrate has multiple first devices on a bonding surface with the dies, and the dies have second devices on the bonding surface with the substrate that are electrically connected to the first devices. The bonding apparatus includes a carrier holding unit that holds a carrier to which the multiple dies are attached, a substrate holding unit that holds the substrate, a first transport unit that receives the dies from the carrier held by the carrier holding unit and transports them, a second transport unit that receives the dies from the carrier and transports them separately from the first transport unit, and a mount unit that receives the dies from the first transport unit and the second transport unit in a desired order and mounts the received dies on the substrate held by the substrate holding unit.

[0006] According to one aspect of the present disclosure, the efficiency of bonding a die to a substrate can be improved.

[0007] FIG. 1 is a plan view showing a bonding system according to one embodiment. FIG. 2 is a flowchart showing a bonding method according to one embodiment. FIG. 3 is a cross-sectional view showing an example of a carrier with a die attached. FIG. 4 is a cross-sectional view showing an example of a substrate. FIG. 5 is a cross-sectional view showing an example of a die-attached substrate. FIG. 6 is a cross-sectional view showing an example of the operation of the bonding apparatus. FIG. 7 is a cross-sectional view showing an example of the operation subsequent to FIG. 6. FIG. 8 is a plan view showing an example of the movement of the first suction head and the second suction head as viewed from above. FIG. 9 is a plan view showing an example of the movement of the first suction head and the second suction head subsequent to FIG. 8. FIG. 10 is a plan view showing an example of the movement of the first suction head and the second suction head subsequent to FIG. 9. FIG. 11 is a plan view showing an example of the movement of the first suction head and the second suction head subsequent to FIG. 10.

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that the same or corresponding components in each drawing are denoted by the same reference numerals, and descriptions thereof may be omitted. In this specification, the X-axis direction, Y-axis direction, and Z-axis direction are perpendicular to each other. The X-axis direction and Y-axis direction are horizontal directions, and the Z-axis direction is vertical. The X-axis direction includes the positive X-axis direction and the negative X-axis direction that is opposite to the positive X-axis direction. The Y-axis direction includes the positive Y-axis direction and the negative Y-axis direction that is opposite to the positive Y-axis direction. The Z-axis direction includes the positive Z-axis direction and the negative Z-axis direction that is opposite to the positive Z-axis direction.

[0009] A bonding system 1 according to one embodiment will be described below, mainly with reference to Figures 1 to 5. As shown in Figure 5, the bonding system 1 manufactures a die-attached substrate DW by bonding a plurality of dies D to a substrate W. The die-attached substrate DW includes the substrate W and a plurality of dies D bonded to the substrate W.

[0010] The substrate W has a first base substrate W1 and a plurality of first devices W2 formed on the first base substrate W1. The first base substrate W1 is, for example, a silicon wafer, a compound semiconductor wafer, or a glass substrate. The first devices W2 include semiconductor elements, circuits, terminals, or the like. The substrate W has a plurality of first devices W2 on a bonding surface Wa with the die D.

[0011] The die D has a second base substrate D1 and a second device D2 formed on the second base substrate D1. The second base substrate D1 is, for example, a silicon wafer, a compound semiconductor wafer, or a glass substrate. The second device D2 includes a semiconductor element, a circuit, a terminal, or the like. The die D has, on a bonding surface Da with the substrate W, the second device D2 that is electrically connected to a first device W2 of the substrate W. One second device D2 is electrically connected to one first device W2, but multiple second devices D2 may also be electrically connected to one first device W2.

[0012] Although not shown, a second die may be prepared separately from the die D. The second die has a third device on its bonding surface with the substrate W, which is electrically connected to the first device W2 of the substrate W. The third device has a different function, i.e., a different electrical circuit, from the second device D2. The second device D2 and the third device may be electrically connected to one first device W2. Although one third device is electrically connected to one first device W2, multiple third devices may also be electrically connected.

[0013] 1 , the bonding system 1 includes a loading / unloading station 2, a first processing station 3, a second processing station 5, and a control circuit 9. The loading / unloading station 2, the first processing station 3, and the second processing station 5 are arranged in this order from the negative side of the X-axis to the positive side of the X-axis. Although not shown, a plurality of second processing stations 5 may be provided, and a plurality of second processing stations 5 may be arranged from the negative side of the X-axis to the positive side of the X-axis.

[0014] The carry-in / out station 2 includes a mounting table 20. Cassettes C1 to C4 are mounted on the mounting table 20. Cassette C1 accommodates a carrier A on which a die D is attached. Cassette C2 accommodates a carrier A from which a die D has been peeled. Cassette C3 accommodates a substrate W before being bonded to a die D. Cassette C4 accommodates a die-attached substrate DW.

[0015] As shown in Fig. 3, the carrier A holds a plurality of dies D. The carrier A is, for example, an electrostatic carrier. The electrostatic carrier electrostatically attracts the plurality of dies D. The electrostatic carrier may also electrostatically attract the plurality of dies D and vacuum attract them. Even after the electrostatic attraction force disappears, the plurality of dies D can continue to be held by vacuum attraction force.

[0016] A carrier A is prepared, for example, for each substrate W. In this embodiment, the carrier A holds only a plurality of dies D having the same function, but may further hold the above-mentioned plurality of second dies in addition to the plurality of dies D. It is preferable that one carrier A holds all the dies to be bonded to one substrate W.

[0017] The carrier A has, for example, a conductive substrate A1 and an insulating film A2, and adsorbs the die D on the side opposite the conductive substrate A1 with respect to the insulating film A2. A charge supply unit (not shown) applies a voltage to the conductive substrate A1 to supply a charge of a first polarity (e.g., positive) to the conductive substrate A1. A charge removal unit (not shown) removes the charge of the first polarity from the die D, leaving a charge of a second polarity (e.g., negative) opposite to the first polarity on the die D.

[0018] Charges of the first polarity accumulate on the conductive substrate A1, while charges of the second polarity accumulate on the die D. As a result, a potential difference occurs between the conductive substrate A1 and the die D across the insulating film A2, generating an electrostatic attraction force. The generated electrostatic attraction force is maintained even after the application of voltage to the conductive substrate A1 and the de-electrification of the die D are released.

[0019] The conductive substrate A1 is made of, for example, silicon, aluminum, an aluminum alloy, stainless steel, or titanium. The conductive substrate A1 may have one or more through holes A3 formed therein for each die D. The die D can be peeled off from the carrier A by supplying gas to the through holes A3 or inserting a pin (not shown) into the through holes A3. The number and arrangement of the through holes A3 are not particularly limited.

[0020] The insulating film A2 maintains the electrostatic chucking force by limiting the movement of charges between the second base substrate D1 and the conductive substrate A1 of the die D. The insulating film A2 preferably has a breakdown voltage of 30 kV or more, and more preferably 40 kV or more.

[0021] The insulating film A2 is preferably made of a flexible material, specifically a material having an elastic modulus of 2 GPa or less, more preferably 0.5 GPa or less. When the die D is pressed against the insulating film A2 by electrostatic attraction, a vacuum attraction force is generated between the die D and the insulating film A2.

[0022] Even if charge leaks from the conductive substrate A1 or the die D and the electrostatic adsorption force disappears, it is possible to continue holding the multiple dies D by the vacuum adsorption force. Causes of charge leakage include, for example, supplying a treatment liquid to the die D when removing the protective film PF or modifying the bonding surface Da.

[0023] The insulating film A2 is made of, for example, polyimide or EVA (ethylene-vinyl acetate copolymer) from the viewpoint of durability when modifying the bonding surface Da. The thickness of the insulating film A2 is, for example, 10 μm.

[0024] The insulating film A2 may have a through hole A4 formed therein, which is connected to the through hole A3 in the conductive substrate A1. The diameter of the through hole A4 in the insulating film A2 is preferably smaller than the diameter of the through hole A3 in the conductive substrate A1. The through hole A4 may be omitted. Even if the through hole A4 is omitted, the insulating film A2 can be locally deformed by supplying gas to the through hole A3 or by inserting a pin into the through hole A3, and the die D can be peeled off from the carrier A.

[0025] Although not shown, the carrier A may have a carrier substrate corresponding to the conductive substrate A1 and a resin film corresponding to the insulating film A2, and may mount a plurality of dies D on the resin film. The carrier A preferably holds the die D with the bonding surface Da of the die D facing upward. The carrier A electrostatically attracts the die D, for example. Note that by pressing the die D against the resin film, the resin film can be deformed so as to remove gas from between the die D and the resin film, and the die D can also be vacuum-attached to the resin film.

[0026] The carrier substrate may be conductive or insulating. Through-holes are formed in the carrier substrate, penetrating the carrier substrate in the thickness direction. The die D can be separated from the carrier A by supplying gas to the through-holes or inserting pins (not shown) into the through-holes. The number and arrangement of the through-holes are not particularly limited. One or more through-holes may be formed for each die D.

[0027] The carrier substrate is preferably made of a rigid material, such as silicon (Si), ceramic, aluminum, an aluminum alloy, stainless steel, zirconia, silicon carbide (SiC), titanium, or glass. The carrier substrate may have a diameter comparable to that of the substrate W. The carrier substrate may also have a thickness comparable to that of the substrate W.

[0028] The resin film is preferably made of a flexible material, specifically a material with an elastic modulus of 2 GPa or less, more preferably 0.5 GPa or less. From the viewpoint of durability during modification of the bonding surface of the die D, the resin film is preferably made of, for example, polyimide or EVA (ethylene-vinyl acetate copolymer). The thickness of the resin film is, for example, 10 μm. The resin film is a single layer, but may be multiple layers. For example, the resin film may have a polyolefin layer and an acrylic adhesive layer.

[0029] It is preferable that the carrier A has the same diameter as the substrate W. In this case, the transport arm that transports the carrier A and the transport arm that transports the substrate W can be of the same model number (i.e., the same dimensions and the same shape), thereby reducing costs. Similarly, the first activation device 37 and the second activation device 39, or the first hydrophilization device 38 and the second hydrophilization device 40, can also be of the same model number, thereby reducing costs. This also prevents the device from becoming too large.

[0030] 1 , the loading / unloading station 2 includes a third transport region 21, a third carrier transport arm 22, and a third substrate transport arm 23. The third transport region 21 is adjacent to the mounting table 20. The third transport region 21 extends in the Y-axis direction. The third carrier transport arm 22 holds and transports a carrier A in the third transport region 21. The third substrate transport arm 23 holds and transports a substrate W in the third transport region 21.

[0031] The loading / unloading station 2 has a drive unit (not shown) that moves or rotates the third carrier transport arm 22 and the third substrate transport arm 23. The third carrier transport arm 22 and the third substrate transport arm 23 can move horizontally (in both the X-axis and Y-axis directions) and vertically, and can rotate about a vertical axis.

[0032] 1, the third carrier transport arm 22 and the third substrate transport arm 23 may be mounted on the same Y-axis slider and moved simultaneously in the Y-axis direction, or may be mounted on different Y-axis sliders and moved independently in the Y-axis direction. The third carrier transport arm 22 and the third substrate transport arm 23 are disposed at different heights.

[0033] The first processing station 3 includes a first transfer region 31, a first carrier transfer arm 32, and a first substrate transfer arm 33. The first transfer region 31 extends in the X-axis direction. The first carrier transfer arm 32 holds and transfers a carrier A in the first transfer region 31. The first substrate transfer arm 33 holds and transfers a substrate W in the first transfer region 31.

[0034] The first processing station 3 has a drive unit (not shown) that moves or rotates the first carrier transport arm 32 and the first substrate transport arm 33. The first carrier transport arm 32 and the first substrate transport arm 33 can move horizontally (in both the X-axis and Y-axis directions) and vertically, and can rotate about a vertical axis.

[0035] 1, the first carrier transport arm 32 and the first substrate transport arm 33 may be mounted on the same X-axis slider and moved simultaneously in the X-axis direction, or may be mounted on different X-axis sliders and moved independently in the X-axis direction. The first carrier transport arm 32 and the first substrate transport arm 33 are disposed at different heights.

[0036] The first processing station 3 includes a third transition device 34, a fourth transition device 35, a cleaning device 36, a first activation device 37, a first hydrophilization device 38, a second activation device 39, a second hydrophilization device 40, an inspection device 41, a peeling device 42, and an annealing device 43. The third transition device 34, the fourth transition device 35, the cleaning device 36, the first activation device 37, the first hydrophilization device 38, the second activation device 39, the second hydrophilization device 40, the inspection device 41, the peeling device 42, and the annealing device 43 are adjacent to the first transport region 31.

[0037] The third transition device 34 is provided between the third transfer region 21 and the first transfer region 31 and temporarily stores the carrier A. The third transition device 34 relays the carrier A between the third carrier transfer arm 22 and the first carrier transfer arm 32. The relayed carrier A may be one from which the die D has been attached or one from which the die D has been removed.

[0038] The fourth transition device 35 is provided between the third transfer region 21 and the first transfer region 31, and temporarily stores the substrate W. The fourth transition device 35 relays the substrate W between the third substrate transport arm 23 and the first substrate transport arm 33. The relayed substrate W may be one to which the die D has not yet been bonded, or one to which the die D has been bonded (i.e., a die-attached substrate DW).

[0039] The cleaning device 36 removes the protective film PF from the die D while the die D is held by the carrier A. The protective film PF protects the bonding surface Da of the die D, for example, during dicing. If the protective film PF is water-soluble, the cleaning device 36 supplies pure water to the protective film PF. After removing the protective film PF from the die D, the cleaning device 36 may further clean the bonding surface Da of the die D. This can improve the quality of the subsequent processing of the bonding surface Da of the die D.

[0040] The first activation device 37 activates the bonding surface Da of the die D while the die D is held by the carrier A. The first activation device 37 is, for example, a plasma processing device. In the first activation device 37, oxygen gas, which is a processing gas, is excited under reduced pressure, for example, to form plasma and is ionized. The bonding surface Da of the die D is activated by irradiating the oxygen ions onto the bonding surface Da of the die D. The processing gas is not limited to oxygen gas, and may be, for example, nitrogen gas.

[0041] The first hydrophilization device 38 hydrophilizes the bonding surface Da of the die D while the die D is held by the carrier A. For example, the first hydrophilization device 38 supplies pure water (e.g., deionized water) onto the die D while rotating the carrier A held by the spin chuck. The pure water imparts OH groups to the bonding surface Da of the die D, which has been activated in advance. The die D and the substrate W can be bonded together by utilizing hydrogen bonding between the OH groups.

[0042] The second activation device 39 activates the bonding surface Wa of the substrate W. The second activation device 39 is, for example, a plasma processing device. In the second activation device 39, oxygen gas, which is a processing gas, is excited under reduced pressure, for example, to form plasma and is ionized. The bonding surface Wa of the substrate W is activated by irradiating the oxygen ions onto the bonding surface Wa of the substrate W. The processing gas is not limited to oxygen gas, and may be, for example, nitrogen gas.

[0043] The second hydrophilization device 40 hydrophilizes the bonding surface Wa of the substrate W. For example, the second hydrophilization device 40 supplies pure water (e.g., deionized water) onto the substrate W while rotating the substrate W held by the spin chuck. The pure water provides OH groups to the bonding surface Wa of the substrate W, which has been activated in advance. The die D and the substrate W can be bonded by utilizing hydrogen bonds between the OH groups.

[0044] The inspection device 41 inspects whether the bonding state between the substrate W and the die D in the die-attached substrate DW is good or bad. The inspection is performed for each die D. The inspection items include at least one of the presence or absence of foreign matter such as air bubbles and the presence or absence of misalignment.

[0045] The delamination device 42 delaminates the die D, which has been found to have a poor bonding state in the inspection by the inspection device 41, from the substrate W. The delamination device 42 delaminates the die D before the annealing device 43 heats the die-attached substrate DW.

[0046] The annealing device 43 heats the die-attached substrate DW. Before the heat treatment, the die D and the substrate W are bonded by hydrogen bonding between OH groups. The heat treatment causes a dehydration condensation reaction, which creates covalent bonds and improves the bonding strength between the die D and the substrate W.

[0047] The second processing station 5 includes a second transfer region 51, a second carrier transfer arm 52, and a second substrate transfer arm 53. The second transfer region 51 extends in the X-axis direction. The second carrier transfer arm 52 holds and transfers a carrier A in the second transfer region 51. The second substrate transfer arm 53 holds and transfers a substrate W in the second transfer region 51.

[0048] The second processing station 5 has a drive unit (not shown) that moves or rotates the second carrier transport arm 52 and the second substrate transport arm 53. The second carrier transport arm 52 and the second substrate transport arm 53 can move horizontally (in both the X-axis and Y-axis directions) and vertically, and can rotate about a vertical axis.

[0049] 1, the second carrier transport arm 52 and the second substrate transport arm 53 may be mounted on the same X-axis slider and moved simultaneously in the X-axis direction, or may be mounted on different X-axis sliders and moved independently in the X-axis direction. The second carrier transport arm 52 and the second substrate transport arm 53 are disposed at different heights.

[0050] The second processing station 5 includes a first transition device 54, a second transition device 55, and a joining device 56. The first transition device 54, the second transition device 55, and the joining device 56 are adjacent to the second transfer region 51.

[0051] The first transition device 54 is provided between the first transfer region 31 and the second transfer region 51 and temporarily stores the carrier A. The first transition device 54 relays the carrier A between the first carrier transfer arm 32 and the second carrier transfer arm 52. The relayed carrier A may be one from which the die D has been attached or one from which the die D has been removed.

[0052] The second transition device 55 is provided between the first transfer region 31 and the second transfer region 51 and temporarily stores the substrate W. The second transition device 55 relays the substrate W between the first substrate transport arm 33 and the second substrate transport arm 53. The relayed substrate W may be one to which the die D has not yet been bonded or one to which the die D has been bonded (i.e., a die-attached substrate DW).

[0053] 6 and 7, the bonding device 56 removes the die D from the carrier A and bonds the die D to the substrate W with the bonding surface Da of the removed die D facing the bonding surface Wa of the substrate W. A die-attached substrate DW is obtained. The second device D2 of the die D and the first device W2 of the substrate W are electrically connected. Details of the bonding device 56 will be described later.

[0054] The control circuit 9 is, for example, a computer, and includes an arithmetic unit 91 such as a CPU (Central Processing Unit) and a storage unit 92 such as a memory. The storage unit 92 stores programs that control various processes executed in the bonding system 1. The control circuit 9 controls the operation of the bonding system 1 by causing the arithmetic unit 91 to execute the programs stored in the storage unit 92. A lower-level control circuit that controls the operation of each device that constitutes the bonding system 1 may be provided, and a higher-level control circuit that controls multiple lower-level control circuits may be provided. The control circuit 9 may be configured with the lower-level control circuit and the higher-level control circuit.

[0055] The control circuit 9 includes electronic circuits such as a CPU, a field programmable gate array (FPGA), or an application specific integrated circuit (ASIC), and performs the various control operations described in this specification by executing instruction codes stored in a memory or by being a circuit designed for a specific application.

[0056] Next, a bonding method according to one embodiment will be described with reference to Fig. 2. The process of Fig. 2 is performed under the control of a control circuit 9.

[0057] First, the third carrier transport arm 22 takes out the plurality of dies D together with the carrier A from the cassette C1 and transports them to the third transition device 34. Next, the first carrier transport arm 32 takes out the plurality of dies D together with the carrier A from the third transition device 34 and transports them to the cleaning device 36.

[0058] Next, the cleaning device 36 removes the protective film PF from the die D while the die D is held by the carrier A (step S101). After that, the first carrier transport arm 32 takes out the multiple dies D together with the carrier A from the cleaning device 36 and transports them to the first activation device 37.

[0059] Next, the first activation device 37 activates the bonding surface Da of the die D while the die D is held by the carrier A (step S102). After that, the first carrier transport arm 32 takes out the plurality of dies D together with the carrier A from the first activation device 37 and transports them to the first hydrophilization device 38.

[0060] Next, the first hydrophilization device 38 hydrophilizes the bonding surface Da of the die D while the die D is held by the carrier A (step S103). Thereafter, the first carrier transport arm 32 takes out the multiple dies D together with the carrier A from the first hydrophilization device 38 and transports them to the first transition device 54. Subsequently, the second carrier transport arm 52 takes out the multiple dies D together with the carrier A from the first transition device 54 and transports them to the bonding device 56.

[0061] In parallel with the above steps S101 to S103, the following steps S104 to S105 are performed. First, the third substrate transport arm 23 takes out the substrate W from the cassette C3 and transports it to the fourth transition device 35. Thereafter, the first substrate transport arm 33 takes out the substrate W from the fourth transition device 35 and transports it to the second activation device 39.

[0062] Next, the second activation device 39 activates the bonding surface Wa of the substrate W (step S104). Thereafter, the first substrate transport arm 33 takes the substrate W out of the second activation device 39 and transports it to the second hydrophilization device 40.

[0063] Next, the second hydrophilization device 40 hydrophilizes the bonding surface Wa of the substrate W (step S105). Thereafter, the first substrate transport arm 33 takes out the substrate W from the second hydrophilization device 40 and transports it to the second transition device 55. Subsequently, the second substrate transport arm 53 takes out the substrate W from the second transition device 55 and transports it to the bonding device 56.

[0064] Next, the bonding device 56 removes the die D from the carrier A and bonds the die D to the substrate W with the bonding surface Da of the removed die D facing the bonding surface Wa of the substrate W (step S106). This results in a die-attached substrate DW. Thereafter, the second substrate transport arm 53 takes out the die-attached substrate DW from the bonding device 56 and transports it to the second transition device 55. Subsequently, the first substrate transport arm 33 takes out the die-attached substrate DW from the second transition device 55 and transports it to the inspection device 41.

[0065] Next, the inspection device 41 inspects whether the bonding state between the substrate W and the die D is good or bad (step S107). The inspection device 41 transmits the inspection results to the control circuit 9. The control circuit 9 checks whether there is a defect (step S108). The control circuit 9 controls the transport destination of the die-attached substrate DW to either the annealing device 43 or the peeling device 42 according to the inspection results by the inspection device 41. The inspection does not have to be performed every time. For example, the inspection may be performed for each lot, for each predetermined number of substrates, or at predetermined intervals. A lot is made up of multiple substrates W (e.g., 25 substrates W) stored in one cassette C3. It is sufficient to inspect the first substrate W in the lot.

[0066] If the bonding state of the die D is defective (step S108, NO), the destination of the die-attached substrate DW is the peeling device 42. The first substrate transport arm 33 removes the die-attached substrate DW from the inspection device 41 and transports it to the peeling device 42. Next, the peeling device 42 peels the die D that is defectively bonded from the substrate W (step S109). Thereafter, the first substrate transport arm 33 removes the die-attached substrate DW from the peeling device 42 and transports it to the annealing device 43. Then, the processing from step S110 onwards is performed.

[0067] Note that another operation may be performed after step S109. First, the first substrate transport arm 33 takes out the substrate W from the delamination device 42 and transports it to the second transition device 55. Next, the second substrate transport arm 53 takes out the substrate W from the second transition device 55 and transports it to the bonding device 56. The bonding device 56 re-bonds the die D at the position where the die D was debonded. Thereafter, the processing from step S107 onwards may be performed again.

[0068] On the other hand, if there are no defects in the bonding state of any of the dies D (YES in step S108), the destination of the die-attached substrate DW is the annealing device 43. The first substrate transport arm 33 removes the die-attached substrate DW from the inspection device 41 and transports it to the annealing device 43. Next, the annealing device 43 heat-treats the die-attached substrate DW (step S110). The heat treatment improves the bonding strength between the die D and the substrate W.

[0069] Thereafter, the first substrate transport arm 33 takes out the die-attached substrate DW from the annealing device 43 and transports it to the fourth transition device 35. Finally, the third substrate transport arm 23 takes out the die-attached substrate DW from the fourth transition device 35 and stores it in the cassette C4. The die-attached substrate DW stored in the cassette C4 is transported out of the bonding system 1.

[0070] After step S106, the second carrier transport arm 52 removes carrier A from the bonding device 56 and transports it to the first transition device 54. Then, the first carrier transport arm 32 removes carrier A from the first transition device 54 and transports it to the third transition device 34. Finally, the third carrier transport arm 22 removes carrier A from the third transition device 34 and stores it in cassette C2.

[0071] Next, the bonding device 56 will be described in detail, mainly with reference to Figures 6 and 7. The bonding device 56 removes the die D from the carrier A and bonds the die D to the substrate W by orienting the bonding surface Da of the removed die D toward the bonding surface Wa of the substrate W. A die-attached substrate DW is obtained. The second device D2 of the die D and the first device W2 of the substrate W are electrically connected.

[0072] The bonding device 56 includes, for example, a carrier holding unit 61, a substrate holding unit 62, a first transport unit 63, and a mount unit 65. The carrier holding unit 61 holds a carrier A. The substrate holding unit 62 holds a substrate W. The first transport unit 63 receives and transports a die D from the carrier A held by the carrier holding unit 61. The mount unit 65 receives the die D from the first transport unit 63 and mounts the received die D on the substrate W held by the substrate holding unit 62.

[0073] The carrier holding unit 61 holds the carrier A horizontally from below with the bonding surface Da of the die D facing upward. The substrate holding unit 62 holds the substrate W horizontally from below with the bonding surface Wa of the substrate W facing upward. The first transport unit 63 turns the die D upside down while transporting the die D, so that the bonding surface Da of the die D faces downward. The mount unit 65 receives the die D from the first transport unit 63 and mounts the received die D on the substrate W held by the substrate holding unit 62.

[0074] Although the carrier holding unit 61 of the present embodiment holds the carrier A horizontally from below with the joining surface Da of the die D facing upward, the technology according to the present disclosure is not limited to this. For example, the carrier holding unit 61 may hold the carrier A horizontally from above with the joining surface Da of the die D facing downward. In this case, the first conveying unit 63 does not need to turn the die D upside down while conveying the die D. This eliminates the need for a mechanism for individually turning the die D upside down, and reduces dust generation from that mechanism.

[0075] The first transport unit 63 has, for example, a first suction head 63a and a first moving mechanism 63b. The first suction head 63a sucks the die D. The first suction head 63a sucks the die D while facing the joining surface Da of the die D. It is preferable that the first suction head 63a sucks the die D in a non-contact manner to prevent contamination of the joining surface Da of the die D. The first moving mechanism 63b moves the first suction head 63a.

[0076] 8 to 11, the first moving mechanism 63b moves the first suction head 63a between a first receiving position P1 and a first delivery position P2, as will be described in detail later. The first receiving position P1 is a position where the first suction head 63a receives the die D from the carrier A. The first delivery position P2 is a position where the first suction head 63a delivers the die D to the mount unit 65. The first moving mechanism 63b may turn the first suction head 63a upside down while the die D is being transported, thereby turning the die D upside down.

[0077] The bonding device 56 may include a pressing unit 66. The pressing unit 66 presses the die D upward to separate the die D from the carrier A held by the carrier holding unit 61. The pressing unit 66 presses the die D upward, for example, by supplying gas to the through-hole A3 of the conductive substrate A1 or by inserting a pin (not shown) into the through-hole A3. Note that when the carrier A is turned upside down, the pressing unit 66 presses the die D downward. The pressing unit 66 only needs to press the die D in a direction to separate the die D from the carrier A. The first conveying unit 63 receives the die D pressed by the pressing unit 66 from the carrier A at the first receiving position P1.

[0078] When the pressing portion 66 is provided, the carrier holding portion 61 may suction only a portion of the underside of the carrier A. The pressing portion 66 can press the die D upward on the remaining portion of the underside of the carrier A. The carrier holding portion 61 is formed, for example, in a ring shape, and suctions the outer periphery of the underside of the carrier A. The pressing portion 66 can press the die D upward on the central portion of the underside of the carrier A. Note that if the die D can be separated from the carrier A simply by lifting the die D together with the first suction head 63a, the pressing portion 66 may not be required.

[0079] The bonding device 56 may include a carrier moving unit 67. The carrier moving unit 67 moves the carrier A together with the carrier holding unit 61. The carrier moving unit 67 moves the carrier A, for example, in the X-axis direction and the Y-axis direction. This allows the pressing unit 66 to press multiple dies D in a desired order without the need for the pressing unit 66 to move in the X-axis direction and the Y-axis direction. The first conveying unit 63 can receive the dies D at the same first receiving position P1 every time. This simplifies the operation of the first conveying unit 63. The carrier moving unit 67 may rotate the carrier A around a vertical axis instead of moving it in the X-axis direction. Alternatively, the carrier moving unit 67 may move the carrier A in the Z-axis direction.

[0080] The bonding device 56 may include a substrate moving unit 68. The substrate moving unit 68 moves the substrate W together with the substrate holder 62. The substrate moving unit 68 moves the substrate W, for example, in the X-axis direction and the Y-axis direction. This makes it possible to change the bonding position of the die D relative to the substrate W. As a result, the first transport unit 63 can transfer the die D to the mount unit 65 at the same first transfer position P2 every time. This simplifies the operation of the first transport unit 63. The substrate moving unit 68 may rotate the substrate W about a vertical axis instead of moving it in the X-axis direction. Alternatively, the substrate moving unit 68 may move the substrate W in the Z-axis direction.

[0081] The mount unit 65 has, for example, a third suction head 65a and a third moving mechanism 65b. The third suction head 65a suctions the die D from the side opposite to the first suction head 63a and the second suction head 64a (described later). The die D has a joining surface Da and a back surface Db facing opposite to the joining surface Da. Since it does not matter if the back surface Db becomes dirty, the third suction head 65a may come into contact with the back surface Db of the die D.

[0082] The third moving mechanism 65b moves the third suction head 65a in the Z-axis direction to bond the die D to the substrate W. The third moving mechanism 65b may move the third suction head 65a in the X-axis direction and the Y-axis direction, or may rotate the third suction head 65a about a vertical axis, in order to improve the accuracy of the bonding position of the die D relative to the substrate W. The amount of movement or rotation required to improve the accuracy of the bonding position is small, and the third suction head 65a does not need to move much when viewed from above.

[0083] The bonding device 56 may include at least one of a first imaging unit 71, a second imaging unit 72, and a third imaging unit 73 in order to improve the accuracy of the bonding position of the die D relative to the substrate W. Note that the first imaging unit 71, the second imaging unit 72, and the third imaging unit 73 do not have to capture an image every time the die D and the substrate W are bonded, and may capture images periodically.

[0084] 6, the first imaging unit 71 captures an image of the alignment marks on the bonding surface Da of the die D held by the third suction head 65a. The number of alignment marks to be captured is, for example, two, but is not particularly limited. The alignment marks may be dedicated marks or may be part of the electrical circuit that constitutes the second device D2.

[0085] The first imaging unit 71 is disposed, for example, below the third suction head 65 a. The first imaging unit 71 transmits the captured image to the control circuit 9. The control circuit 9 processes the image captured by the first imaging unit 71 to detect the position of the die D in the first coordinate system set for the third suction head 65 a.

[0086] 7, the second imaging unit 72 captures an image of the alignment marks on the bonding surface Wa of the substrate W held by the substrate holding unit 62. The number of alignment marks to be captured is, for example, two, but is not particularly limited. The alignment marks may be dedicated marks or may be part of the electrical circuit that constitutes the first device W2.

[0087] The second imaging unit 72 is disposed, for example, above the board holding unit 62, and is provided, for example, on the third suction head 65a. The second imaging unit 72 transmits the captured image to the control circuit 9. The control circuit 9 processes the image captured by the second imaging unit 72, thereby detecting the position of the first device W2 in the second coordinate system set in the board holding unit 62.

[0088] The control circuit 9 aligns the die D held by the third suction head 65a with the substrate W held by the substrate holder 62, using an image captured by at least one of the first imaging unit 71 and the second imaging unit 72. The alignment is performed by controlling at least one of the third moving mechanism 65b and the substrate moving unit 68. Before bonding the die D and the substrate W, the position of the die D or the substrate W can be corrected, thereby improving the accuracy of the bonding position.

[0089] After the die D and the substrate W are bonded, the third imaging unit 73 simultaneously captures images of both the alignment mark on the bonding surface Da of the die D and the alignment mark on the bonding surface Wa of the substrate W. The third imaging unit 73 captures images of the alignment marks of the die D and the substrate W, for example, by transmitting light through the die D. The third imaging unit 73 is configured by, for example, an infrared camera.

[0090] When the third imaging unit 73 captures an image of the alignment marks of the die D and the substrate W through the die D, the third imaging unit 73 is disposed, for example, above the substrate holding unit 62 and is provided, for example, on the third suction head 65 a. The third imaging unit 73 transmits the captured image to the control circuit 9. The control circuit 9 processes the image captured by the third imaging unit 73 to detect a deviation between the actual bonding position and the target bonding position.

[0091] The control circuit 9 uses the image captured by the third imaging unit 73 to align the die D held by the third suction head 65a with the substrate W held by the substrate holder 62 in the next and subsequent bonding of the die D and the substrate W. The position of the die D or the substrate W can be corrected taking into account the behavior of the bonding device 56, and the accuracy of the bonding position can be improved.

[0092] Next, the second transport unit 64 will be described with reference to FIGS. 8 to 11 . The bonding device 56 includes the second transport unit 64. The second transport unit 64 receives and transports the die D from the carrier A separately from the first transport unit 63. The mount unit 65 receives the die D from the first transport unit 63 and the second transport unit 64 in a desired order and mounts the received die D on the substrate W held by the substrate holder 62. After the mount unit 65 mounts the nth die D on the substrate W, the second transport unit 64 delivers the (n+1)th die D to the mount unit 65 before the first transport unit 63 delivers the (n+2)th die D to the mount unit 65, and the mount unit 65 mounts the (n+1)th die D on the substrate W. This shortens the standby time of the mount unit 65, improves the availability of the mount unit 65, and improves the efficiency of bonding the die D to the substrate W. Even when the die D is thin and it takes a long time to transfer the die D, the die D can be efficiently bonded to the substrate W. Note that the nth die D refers to the die D that is bonded to one substrate W for the nth time.

[0093] The second transport unit 64 has, for example, a second suction head 64a and a second moving mechanism 64b. The second suction head 64a suctions the die D. The second suction head 64a suctions the die D while facing the joining surface Da of the die D. It is preferable that the second suction head 64a suctions the die D in a non-contact manner to prevent contamination of the joining surface Da of the die D. The second moving mechanism 64b moves the second suction head 64a.

[0094] The second moving mechanism 64b moves the second suction head 64a between the second receiving position P3 and the second delivery position P4. The second receiving position P3 is a position where the second suction head 64a receives the die D from the carrier A. The second delivery position P4 is a position where the second suction head 64a delivers the die D to the mount unit 65. The second moving mechanism 64b may turn the second suction head 64a upside down while the die D is being transported, thereby turning the die D upside down.

[0095] When viewed from above, the outgoing path B1 of the first suction head 63a from the first receiving position P1 to the first delivery position P2 may overlap with the outgoing path B3 of the second suction head 64a from the second receiving position P3 to the second delivery position P4. In this embodiment, the outgoing path B1 of the first suction head 63a and the outgoing path B3 of the second suction head 64a completely overlap, but they may only overlap at least partially. This reduces the installation area of ​​the joining device 56.

[0096] When viewed from above, the first receiving position P1 and the second receiving position P3 overlap, and the first delivery position P2 and the second delivery position P4 overlap. In this case, the outgoing path B1 of the first suction head 63a and the outgoing path B3 of the second suction head 64a completely overlap. This not only reduces the installation area of ​​the bonding device 56, but also allows multiple (preferably all) dies D to be transported along the same path from the carrier A to the mount unit 65. Therefore, multiple dies D can be bonded to the substrate W with the same quality.

[0097] When viewed from above, the return path B2 (excluding the outgoing path B1) of the movement path of the first suction head 63a and the return path B4 (excluding the outgoing path B3) of the movement path of the second suction head 64a do not overlap. While one of the first suction head 63a and the second suction head 64a moves on the outgoing path, the other can move on the return path. This provides better movement efficiency than when one head is stopped and the other moves.

[0098] When viewed from above, the return path B2 of the first suction head 63a and the return path B4 of the second suction head 64a may be arranged symmetrically with respect to the outgoing paths B1 and B3. When viewed from above, the return path B2 of the first suction head 63a is formed, for example, in a U-shape, and the return path B4 of the second suction head 64a is formed, for example, in an inverted U-shape.

[0099] As shown in Fig. 8, while the first suction head 63a receives the die D from the carrier A at the first receiving position P1, the second suction head 64a delivers the die D to the mount unit 65 at the second delivery position P4. Then, as shown in Fig. 9, while the first suction head 63a moves from the first receiving position P1 to the first delivery position P2, the second suction head 64a moves from the second delivery position P4 to the second receiving position P3.

[0100] 10, while the first suction head 63a delivers the die D to the mount unit 65 at the first delivery position P2, the second suction head 64a receives the die D from the carrier A at the second receiving position P3. Then, as shown in FIG. 11, while the first suction head 63a moves from the first delivery position P2 to the first receiving position P1, the second suction head 64a moves from the second receiving position P3 to the second delivery position P4.

[0101] 8 to 11 are repeatedly performed. When viewed from above, the first receiving position P1 and the second receiving position P3 are in the same positions every time. Also, when viewed from above, the first delivery position P2 and the second delivery position P4 are in the same positions every time.

[0102] The first conveying unit 63 and the second conveying unit 64 may alternately convey the dies D. For example, the first conveying unit 63 conveys odd-numbered dies D, and the second conveying unit 64 conveys even-numbered dies D. Alternatively, the first conveying unit 63 may convey even-numbered dies D, and the second conveying unit 64 may convey odd-numbered dies D.

[0103] 9 , the carrier moving unit 67 may move the carrier A in the Y-axis direction after the first suction head 63a receives the die D from the carrier A and before the second suction head 64a receives the die D from the carrier A so that the first receiving position P1 and the second receiving position P3 overlap when viewed from above. Note that the carrier moving unit 67 may move the carrier A in at least one of the X-axis direction and the Y-axis direction. Furthermore, the carrier moving unit 67 may rotate the carrier A around the vertical axis instead of moving it in the X-axis direction.

[0104] 11 , the carrier moving unit 67 may move the carrier A in the Y-axis direction after the second suction head 64a receives the die D from the carrier A and before the first suction head 63a receives the die D from the carrier A so that the first receiving position P1 and the second receiving position P3 overlap when viewed from above. Note that the carrier moving unit 67 may move the carrier A in at least one of the X-axis direction and the Y-axis direction. Furthermore, the carrier moving unit 67 may rotate the carrier A around the vertical axis instead of moving it in the X-axis direction.

[0105] By having the carrier moving unit 67 move the carrier A in the X-axis direction and the Y-axis direction, the pressing unit 66 can press the multiple dies D in a desired order without having to move the pressing unit 66 in the X-axis direction and the Y-axis direction. The pressing unit 66 presses the die D upward to separate the die D from the carrier A at a position where the first receiving position and the second receiving position overlap when viewed from above. Note that when the carrier A is turned upside down, the pressing unit 66 presses the die D downward. The pressing unit 66 simply presses the die D in a direction to separate the die D from the carrier A.

[0106] Although the embodiments of the joining device, joining system, and joining method according to the present disclosure have been described above, the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure.

[0107] This application claims priority based on Japanese Patent Application No. 2023-123344 filed with the Japan Patent Office on July 28, 2023, the entire contents of which are incorporated herein by reference.

[0108] 1 Bonding system 56 Bonding device D Die Da Bonding surface D2 Second device W Substrate Wa Bonding surface W2 First device

Claims

1. A bonding apparatus for bonding a plurality of dies to a substrate, wherein the substrate has a plurality of first devices on a bonding surface with the dies, and the dies have a second device electrically connected to the first devices on a bonding surface with the substrate, the bonding apparatus comprising: a carrier holding section for holding a carrier to which the plurality of dies are attached; a substrate holding section for holding the substrate; a first transport section for receiving and transporting the dies from the carrier held by the carrier holding section; a second transport section for receiving and transporting the dies from the carrier separately from the first transport section; and a mounting section for receiving the dies from the first transport section and the second transport section in a desired order and mounting the received dies on the substrate held by the substrate holding section.

2. The bonding device described in claim 1, wherein the first transport unit has a first suction head that adsorbs the die and a first moving mechanism that moves the first suction head, and the first moving mechanism moves the first suction head between a first receiving position where the first suction head receives the die from the carrier and a first delivery position where the first suction head delivers the die to the mounting unit, and the second transport unit has a second suction head that adsorbs the die and a second moving mechanism that moves the second suction head, and the second moving mechanism moves the second suction head between the second receiving position where the second suction head receives the die from the carrier and the second delivery position where the second suction head delivers the die to the mounting unit.

3. A joining device as described in claim 2, wherein, when viewed from above, the outward path of the first suction head from the first receiving position to the first delivery position overlaps with the outward path of the second suction head from the second receiving position to the second delivery position.

4. The joining device according to claim 3, wherein, when viewed from above, the first receiving position and the second receiving position overlap, and the first delivery position and the second delivery position overlap.

5. A joining device as described in claim 4, wherein, when viewed from above, the return path excluding the outward path of the movement path of the first suction head does not overlap with the return path excluding the outward path of the second suction head.

6. A bonding apparatus as set forth in claim 4 or 5, further comprising a carrier moving section which moves the carrier holding section when viewed from above.

7. The bonding apparatus according to claim 6, wherein the carrier moving section moves the carrier holding section after the first suction head receives the die from the carrier and before the second suction head receives the die from the carrier.

8. A joining device as described in claim 4 or 5, further comprising a pressing section which presses the die upward or downward at a position where the first receiving position and the second receiving position overlap when viewed from above, to separate the die from the carrier held by the carrier holding section.

9. A bonding system comprising: the bonding apparatus according to any one of claims 1 to 5; a first activation device which activates a bonding surface of the die in a state where the die is attached to the carrier; a first hydrophilization device which hydrophilizes the bonding surface of the die in a state where the die is attached to the carrier; a first transition device which temporarily stores the carrier; a first transport area adjacent to the first activation device, the first hydrophilization device and the first transition device; a first carrier transport arm which transports the carrier in the first transport area; a second transport area which is disposed on the opposite side of the first transport area with respect to the first transition device and which is adjacent to the first transition device and the bonding apparatus; and a second carrier transport arm which transports the carrier in the second transport area.

10. A bonding system comprising: the bonding apparatus according to any one of claims 1 to 5; a second activation device which activates the bonding surfaces of the substrates; a second hydrophilization device which hydrophilizes the bonding surfaces of the substrates; a second transition device which temporarily stores the substrates; a first transport region adjacent to the second activation device, the second hydrophilization device and the second transition device; a first substrate transport arm which transports the substrate in the first transport region; a second transport region which is disposed on the opposite side of the first transport region with respect to the second transition device and which is adjacent to the second transition device and the bonding apparatus; and a second substrate transport arm which transports the substrate in the second transport region.

11. A bonding method comprising bonding the die to the substrate using a bonding apparatus according to any one of claims 1 to 5.

Images