Packaging structure and manufacturing method therefor, board-level architecture and communication device

Abstract

Provided in the present application are a packaging structure and a manufacturing method therefor, a board-level architecture and a communication device. The packaging structure comprises: a lead frame, at least one first chip, a plurality of first vertical leads, a plurality of first fan-out pads and a first plastic package. Each first chip is located on the lead frame, each first fan-out pad is located on the side of the first chip facing away from the lead frame, and each first vertical lead is located between the lead frame and the first fan-out pad. A first end of at least one first vertical lead is in contact connection with a surface of the lead frame or the first chip, and a second end of same is electrically connected to the first fan-out pad. The first plastic package wraps the at least one first chip and the plurality of first vertical leads, and the plurality of first fan-out pads are located on the surface of the first plastic package. In the embodiments of the present application, signal fan-out and heat dissipation of the packaging structure are not on the same side, and there is no need for an interposer to transmit signals; thus, the size of a board-level architecture is small, the loss of a signal transmission medium is low, and the cost is also low.

Description

A packaging structure, manufacturing method thereof, board-level architecture and communication equipment

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on August 4, 2023, with application number 202310977573.9 and application name “A packaging structure, its manufacturing method, board-level architecture and communication equipment”, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of chip technology, and in particular to a packaging structure, a manufacturing method thereof, a board-level architecture, and a communication device. Background Art

[0004] With the continuous development of wireless communication technology, the multiple input and multiple output (MM) power amplifier board-level architecture of the current fifth-generation mobile communication technology (5G) is gradually evolving towards a minimalist architecture.

[0005] In related technologies, the power amplifier board-level architecture includes: a power amplifier RF board, an antenna board, and a power amplifier module, with the power amplifier module located between the power amplifier RF board and the antenna board. The signal fan-out and heat dissipation of the power amplifier module are on the same side. The power amplifier module fans out on the side close to the antenna board to achieve signal interconnection with the antenna board, and the heat of the power amplifier module is also dissipated through the antenna board. In order to achieve signal interconnection between the power amplifier RF board and the antenna board, an interposer needs to be set between the power amplifier RF board and the antenna board.

[0006] However, setting an adapter board in the power amplifier board-level architecture will lead to the following problems: First, since the adapter board occupies a large space, it is necessary to reserve installation and positioning positions on the power amplifier RF board and antenna board, resulting in a larger volume of the power amplifier board-level architecture; Second, setting up the adapter board will make the signal link longer, resulting in a larger transmission medium loss in the power amplifier board-level architecture. For example, the RF gain loss of the power amplifier board-level architecture in the related technology exceeds 0.1dB; Third, setting up the adapter board in the power amplifier board-level architecture will increase the material cost of the power amplifier board-level architecture, and the power amplifier RF board, antenna board and adapter board require at least two steps to complete the assembly. The assembly process is more complex, the processing cycle is longer, and the assembly and processing cost is higher, resulting in a higher processing cost of the power amplifier board-level architecture.

[0007] Summary of the Invention

[0008] The embodiments of the present application provide a packaging structure, a manufacturing method thereof, a board-level architecture, and a communication device, which are used to reduce the volume of the board-level architecture, reduce the signal transmission loss of the board-level architecture, and reduce the material cost and processing cost of the board-level architecture.

[0009] In a first aspect, an embodiment of the present application provides a packaging structure, and the packaging structure in the embodiment of the present application may include: a lead frame, at least one first chip, a plurality of first vertical leads, a plurality of first fan-out pads, and a first plastic package. For example, the first chip may be an amplifier chip or a matching chip, etc., and the first chip may be a bare chip or a chip with a certain degree of packaging, and the type and quantity of the first chip may be set according to actual needs. Each first chip is located on the lead frame, each first fan-out pad is located on the side of the first chip away from the lead frame, and each first vertical lead is located between the lead frame and the first fan-out pad. The first end of at least one first vertical lead is in contact with the surface of the lead frame or the first chip, and the second end is electrically connected to the first fan-out pad (directly in contact or electrically connected through other conductive components), so that the first chip can be electrically connected to the first fan-out pad through the first vertical lead, or the first chip can be electrically connected to the first fan-out pad through the lead frame and the first vertical lead, so that the signal of the first chip can be transmitted to the first fan-out pad and fanned out on the top surface of the packaging structure. The first plastic package body encapsulates each first chip and each first vertical lead, and the first plastic package body can protect each first chip and each first vertical lead. Each first fan-out pad is located on a surface of the first plastic package body, and the package structure is electrically connected to the first circuit board through each first fan-out pad.

[0010] In the embodiment of the present application, for the sake of convenience, the surface of the package structure having the first fan-out pad is referred to as the "top surface", and the surface of the package structure having the lead frame is referred to as the "bottom surface".

[0011] In the packaging structure provided in the embodiment of the present application, each first chip is arranged on a lead frame, and during operation, each first chip can dissipate heat through the lead frame, so that the packaging structure can dissipate heat on the bottom or side. In addition, a plurality of first vertical leads are arranged between the lead frame and the first fan-out pad, and the first plastic package wraps each first vertical lead. The first plastic package can play a role in protecting and supporting the first vertical leads, so that the signal of the packaging structure can be fanned out on the top surface. In other words, the signal fan-out and heat dissipation of the packaging structure in the embodiment of the present application are not on the same surface, and the packaging structure has a self-flip structure. Therefore, in the embodiment of the present application, the packaging structure can be directly connected to the first circuit board through the first fan-out pad, without the need to transmit signals with the help of an adapter board, which can make the volume of the board-level architecture smaller and the material cost lower. The packaging structure can be directly connected to the first circuit board, and the signal transmission path is shorter, so that the signal transmission medium loss of the board-level architecture is smaller. In addition, the structure of the packaging structure is simpler, which can simplify the processing complexity of the board-level architecture and reduce the production cost. Thus, the problems in the related art caused by setting up an adapter board in the power amplifier board-level architecture, such as large volume, large signal transmission medium loss, and high cost, are solved.

[0012] In some embodiments of the present application, the first upright lead may include: a fixing portion located at the first end, and a linear upright portion connected to the fixing portion, wherein the width of the fixing portion is greater than the diameter of the upright portion. In an embodiment of the present application, the diameter of the upright portion may be in the range of 1 micron to 100 microns. For example, the diameter of the upright portion may be about 25 microns, 38 microns, or 50 microns. By providing a fixing portion at the first end of the first upright lead, the contact area between the first upright lead and the surface of the lead frame (or the first chip) may be increased. The connection between the fixing portion and the upright portion may play a role in fixing the upright portion and improving the stability of the first upright lead. For example, the fixing portion may be spherical or ellipsoidal. Of course, the fixing portion may also be other shapes, which are not limited here. In some cases, the first upright lead may not include the fixing portion, that is, the first upright lead may only include the upright portion, which is not limited here.

[0013] During the manufacturing process, a wire bonding process can be used to first form a fixed portion on the surface of the lead frame (or the first chip), and then pull it upward to form an upright portion, thereby obtaining a first upright lead upright on the surface of the lead frame (or the first chip). Optionally, the first upright lead can be made of metal wires such as gold wire, aluminum wire, and copper wire, or other metal materials such as silver or tin can be used to make the first upright lead. Of course, other conductive materials can also be used to make the first upright lead, which is not limited here. In addition, a first plastic package can be made first, and a through hole can be formed in the first plastic package, and the first upright lead can be formed by filling the through hole with a conductive material. Other processes can also be used to make the first upright lead, which is not limited here.

[0014] The upright leads in the embodiment of the present application (the first upright lead mentioned above or the second upright lead to be mentioned later) are linear, and the diameter of the upright leads is less than 100 microns. Moreover, since the upright leads are very thin, in order to ensure the strength of the upright leads and avoid damage, a plastic package (a first plastic package or a second plastic package) is used to wrap each upright lead to support and protect the upright leads. During the manufacturing process, a wire bonding process can be used to manufacture linear upright leads, and then a plastic package process can be used to form a plastic package that wraps the upright leads. The upright leads in the embodiment of the present application are different from conductive connection structures such as conductive columns in the related art. In the related art, conductive connection structures such as conductive columns can be manufactured by a stamping process. The sizes of the conductive connection structures obtained by the stamping process are relatively large. Generally, the diameter of the conductive connection structure is in the order of millimeters, and it is impossible to obtain a linear conductive connection structure with a diameter less than a micron.

[0015] In some embodiments of the present application, the lead frame may include: a support pad and a plurality of first signal pads, wherein the support pad plays a role of support and heat dissipation, and the first signal pad plays a role of signal connection. Each first chip is located on the support pad, and the position of at least one first fan-out pad corresponds to that of the first signal pad. The first end of at least one first vertical lead is in contact with the surface of the first signal pad, and the second end is electrically connected to the first fan-out pad at the corresponding position. In this way, the signal of the first chip can be transmitted to the first fan-out pad through the first signal pad and the first vertical lead and fanned out on the top surface of the package structure.

[0016] In a possible implementation, the package structure in the embodiment of the present application may further include: at least one second fan-out pad located on the side of the first chip away from the lead frame, each second fan-out pad being located on the surface of the first plastic package. The position of the at least one second fan-out pad corresponds to the position of the support pad, the first end of the at least one first upright lead is in contact with the surface of the support pad or the first chip, and the second end is electrically connected to the second fan-out pad at the corresponding position, that is, the first upright lead can also be used to connect the support pad (or the first chip) to the second fan-out pad at the corresponding position. The support pad and the second fan-out pad are both used for grounding. The second fan-out pad is located on the top surface of the package structure, and the support pad is located on the bottom surface of the package structure or a position close to the bottom surface of the package structure. The support pad and the second fan-out pad are set to be used for grounding, so that the package structure can realize double-sided fan-out of the ground signal. During the working process of the package structure, the support pad and the second fan-out pad can play a role in shielding external interference, so that the package structure has a double-sided shielding effect of the top and bottom surfaces, realizing the self-shielding function of the package structure.

[0017] In one possible implementation, the first fan-out pad and the second fan-out pad can comprise the same material. For example, the first fan-out pad and the second fan-out pad can both comprise a metal material. Of course, the first fan-out pad and the second fan-out pad can also comprise other conductive materials, which are not limited here. During the manufacturing process, the first fan-out pad and the second fan-out pad can be manufactured using the same patterning process. For example, a sputtering process or an electroplating process can be used to form a conductive film layer on the entire surface, and then the conductive film layer can be patterned using a process such as etching to obtain the patterns of the first fan-out pad and the second fan-out pad. This simple manufacturing process and low manufacturing cost are achieved.

[0018] In the embodiment of the present application, the lead frame has at least two implementation methods, as follows:

[0019] Implementation method 1: The supporting pad has a stepped structure.

[0020] In an embodiment of the present application, the surface of the support pad close to the first fan-out pad is flush with the surface of the first signal pad close to the first fan-out pad, and the maximum thickness of the support pad is greater than the thickness of the first signal pad. That is to say, the support pad and the first signal pad are layered in the vertical direction (perpendicular to the direction of the lead frame surface), and the surface of the support pad facing away from the first fan-out pad is closer to the bottom surface of the package structure. Since the package structure can dissipate heat through the bottom surface when working, the bottom surface of the package structure may be in contact with some heat-conducting media or structural parts. If the first signal pad and the support pad are set to be flush with the surface facing away from the first fan-out pad, that is, the surface of the first signal pad facing away from the first fan-out pad is exposed to the bottom surface of the package structure, leakage or other performance problems are likely to occur, resulting in poor overall performance of the package structure. Therefore, in an embodiment of the present application, the support pad and the first signal pad are layered in the vertical direction, and the support pad is used to be electrically connected to the ground point. The support pad can play a signal shielding role to prevent the first signal pad from having problems such as leakage or signal interference. Furthermore, the thickness of the support pad is greater than that of the first signal pad. The thicker the support pad is, the better the heat dissipation capability of the package structure. Of course, in some cases, the surfaces of the support pad and the first signal pad on the side close to the first fan-out pad may not be flush. In other words, the surface of the first signal pad may be closer to the first fan-out pad than the surface of the support pad, or the surface of the support pad may be closer to the first fan-out pad than the surface of the first signal pad. This is not limited here.

[0021] In one possible implementation, the support pad may include: a first support portion and a second support portion stacked and in contact with each other, the first support portion being located on a side of the second support portion proximal to the first fan-out pad. The first signal pads are distributed around the first support portion, and the second support portion covers the first support portion and the first signal pads in a direction from the second support portion toward the first support portion. Furthermore, a first plastic encapsulation fills a first gap in the lead frame, and the first plastic encapsulation covers the surface of each first signal pad facing away from the first fan-out pad. The first gap may be the gap between the support pad and each first signal pad, as well as the gap between adjacent first signal pads. In this way, the upper surface, lower surface, and at least a portion of the side surface of each first signal pad are encapsulated by the first plastic encapsulation, thereby burying each first signal pad within the package structure. The second support portion effectively shields the signals of each first signal pad, preventing problems such as leakage or signal interference. Furthermore, the lead frame structure is relatively compact, making rational use of the lead frame space and minimizing the volume occupied by the lead frame, which facilitates the miniaturization of the package structure.

[0022] In a specific implementation, the support pad may further include: a plurality of connecting portions connected to the first support portion, and each first signal pad and each connecting portion are distributed around the first support portion. In the direction in which the second support portion points to the first support portion, the second support portion covers each connecting portion, and each connecting portion is in contact and connected with the second support portion. For example, a connecting portion may be provided at the top corner of the first support portion, or at the side of the first support portion (for example, a side near the middle). The position and number of the connecting portions can be set according to actual needs and are not limited here.

[0023] The connecting portion is located at the edge of the first supporting portion. During the process of manufacturing the packaging structure, the connecting portion can serve to connect the connecting portions in other lead frames. Specifically, in order to improve manufacturing efficiency, a whole-surface frame structure including multiple lead frames can be manufactured first, and two adjacent lead frames are connected by the connecting portion. After the lead frames are manufactured, the whole-surface frame structure is divided into multiple independent lead frames. Similarly, during the manufacturing process, the first signal pad can be connected to the first signal pads in other lead frames. After the first plastic package is manufactured, the two connected first signal pads are divided.

[0024] In practical applications, the first supporting portion, the second supporting portion, and the connecting portions of the support pad can be connected as a whole. Since the first supporting portion, the second supporting portion, and the connecting portions are interconnected, the first supporting portion, the second supporting portion, and the connecting portions are all used for grounding. In addition, the first supporting portion, the second supporting portion, and the connecting portions of the support pad can be made of the same material, for example, a metal material such as copper or aluminum. Of course, other conductive materials can also be used, which is not limited here.

[0025] In an embodiment of the present application, the number of the first fan-out pads may be equal to the number of the first signal pads, and the position of each first fan-out pad may correspond one-to-one to the position of each first signal pad. In order to facilitate connection with the first circuit board, the size of the first fan-out pad may be set to be greater than or equal to the size of the first signal pad at the corresponding position. Of course, the number of the first fan-out pads and the first signal pads may also be different, and the size of the first fan-out pad may also be set to be smaller than the size of the first signal pad at the corresponding position. The position, quantity and size of the first fan-out pad and the first signal pad may be set according to actual needs, and are not limited here. The shape of the second fan-out pad may be consistent with the shape of the support pad, and the packaging structure may include one, two, three or more second fan-out pads, and the number and shape of the second fan-out pads are not limited here.

[0026] The lead frame in the embodiment of the present application may further include: a surface treatment layer, the surface treatment layer being located on the surface of the support pad and each first signal pad on the side close to the first fan-out pad, the surface treatment layer being able to provide protection and prevent oxidation. In a specific implementation, the surface of the support pad and each first signal pad may be surface treated to form an oxidation-resistant and wear-resistant surface treatment layer, thereby preventing the surface of the support pad and each first signal pad from being oxidized in the air, thereby avoiding quality problems such as poor contact between the lead frame and the first chip (or components such as the first vertical lead).

[0027] Implementation method 2: The thickness of the support pad is uniform.

[0028] In the second implementation, in the thickness direction of the lead frame, the support pad and each first signal pad do not overlap each other. Moreover, the support pad is flush with the surface of each first signal pad on the side close to the first fan-out pad, and the thickness of the support pad is greater than the thickness of the first signal pad. The first plastic encapsulation fills the first gap in the lead frame, and the first plastic encapsulation covers the surface of each first signal pad on the side away from the first fan-out pad. In this way, the upper surface, lower surface and at least part of the side of each first signal pad can be wrapped by the first plastic encapsulation, so that each first signal pad is buried inside the packaging structure. The first plastic encapsulation and the support pad can effectively shield the signal of each first signal pad and prevent the first signal pad from having problems such as leakage or signal interference. Of course, in some cases, the surface of the support pad and the first signal pad on the side close to the first fan-out pad may not be flush, that is, the surface of the first signal pad can be set to be closer to the first fan-out pad than the surface of the support pad, or the surface of the support pad can be set to be closer to the first fan-out pad than the surface of the first signal pad, which is not limited here.

[0029] In one possible implementation, the support pad may include: a support portion and a plurality of connecting portions, and each first signal pad and each connecting portion are distributed around the support portion. The thickness of each position in the support pad is consistent, and the support portion may be in the shape of a cuboid, a cube, a cylinder, etc. The support portion plays a role in supporting and dissipating heat, and the connecting portion is located at the edge of the support portion. In the process of manufacturing the packaging structure, the connecting portion can play a role in connecting the connecting portions in other lead frames. Specifically, in order to improve the manufacturing efficiency, a whole-surface frame structure including a plurality of lead frames can be manufactured first, and two adjacent lead frames are connected by a connecting portion. After the lead frame is manufactured, the whole-surface frame structure is divided into a plurality of independent lead frames. For example, a connecting portion can be provided at the top corner of the support portion, or a connecting portion can be provided on the side of the first support portion (for example, a position near the middle of the side). The position and number of the connecting portion can be set according to actual needs, and are not limited here.

[0030] In a specific implementation, the support portion and each connecting portion can be connected as a whole, and both the support portion and each connecting portion can be used for grounding. Furthermore, the support portion and each connecting portion can be made of the same material, for example, a metal material such as copper or aluminum. Of course, other conductive materials can also be used, which is not limited here.

[0031] In summary, the difference between Implementation Method 1 and Implementation Method 2 lies in the different shapes of the support pads. Specifically, in Implementation Method 1, the support pads have a stepped structure, and each first signal pad can be obscured by the edge of the second support portion. In Implementation Method 2, the thickness of the support pads is consistent at all locations. For example, the support portion of the support pads can be in the shape of a cuboid, a cube, a cylinder, etc. In addition, the structure of the lead frame in Implementation Method 2 is consistent with that in Implementation Method 1. Implementation Method 2 can be implemented with reference to the description of the lead frame in Implementation Method 1, and any repetitions will not be repeated.

[0032] In an embodiment of the present application, for the lead frame in the above-mentioned implementation method one and implementation method two, the multiple first upright leads in the packaging structure can have multiple connection relationships. The first upright lead can connect the first signal pad and the first fan-out pad at the corresponding position, specifically, the first end of the first upright lead is in contact with the surface of the first signal pad, and the second end is electrically connected to the first fan-out pad at the corresponding position (direct contact connection or electrical connection through other conductive components). And / or, the first upright lead can connect the support pad and the second fan-out pad at the corresponding position, specifically, the first end of the first upright lead is in contact with the surface of the support pad, and the second end is electrically connected to the second fan-out pad at the corresponding position (direct contact connection or electrical connection through other conductive components). And / or, the first upright lead can connect the first chip and the first fan-out pad or the second fan-out pad at the corresponding position, specifically, the first end of the first upright lead is in contact with the surface of the first chip, and the second end is electrically connected to the first fan-out pad or the second fan-out pad at the corresponding position (direct contact connection or electrical connection through other conductive components). Of course, the first vertical lead may also be used to connect other components between the lead frame and the first fan-out pad (or the second fan-out pad), and examples thereof will not be given here one by one.

[0033] The packaging structure in the embodiment of the present application may further include: a plurality of interconnecting wires located in the first plastic package. The plurality of interconnecting wires in the packaging structure may have a variety of connection relationships. The interconnecting wire may connect the support pad and the first signal pad; and / or, the interconnecting wire may connect the two first chips; and / or, the interconnecting wire may connect the first chip and the first signal pad; and / or, the interconnecting wire may connect the first chip and the support pad. Of course, the interconnecting wire may also be used to connect other components on the lead frame, which will not be listed one by one here. During the manufacturing process, a metal bonding process may be used to manufacture the interconnecting wire. Optionally, the interconnecting wire may be manufactured using metal wires such as gold wire, aluminum wire, and copper wire. Of course, other conductive materials may also be used to manufacture the interconnecting wire, which is not limited here.

[0034] In an embodiment of the present application, the interconnection line can be linear, and the diameter of the interconnection line can be less than 100 microns. For example, the diameter of the interconnection line can be about 25 microns, 38 microns, or 50 microns. Unlike the upright lead, the interconnection line connects two components in the horizontal direction (parallel or approximately parallel to the surface of the lead frame), and the interconnection line can be arc-shaped. Of course, the interconnection line can also be other shapes and can be set according to the positions of the two components to be connected, which is not limited here. The upright lead connects two components in the vertical direction (perpendicular to the surface of the lead frame), and the upright lead is a straight line extending in the vertical direction.

[0035] In one possible implementation, the plurality of first upright leads in the packaging structure may include: at least one upright lead group. Each upright lead group may include: a plurality of first upright leads arranged in at least one row, the first end of each first upright lead in the upright lead group being in contact and connected with the surface of the support pad, and the second end being electrically connected with the second fan-out pad at the corresponding position. That is to say, the plurality of first upright leads in contact with the surface of the support pad are divided into a plurality of upright lead groups, and the first upright leads in each upright lead group are arranged in at least one row. Since the support pad is used for grounding, the first upright leads in contact with the surface of the support pad are also used for grounding, and the plurality of first upright leads arranged in at least one row in the upright lead group can play a role in signal shielding.

[0036] The multiple first chips in the package structure may include: a first chipset and a second chipset, the first chipset may include at least one first chip, and the second chipset may include at least one first chip. The vertical lead group may be located between the first chipset and the second chipset, and the arrangement direction of each first vertical lead in the vertical lead group intersects with the direction from the first chipset to the second chipset. Exemplarily, the arrangement direction of each first vertical lead in the vertical lead group may be consistent with the arrangement direction of each first chip in the first chipset (or the second chipset). In this way, by providing the vertical lead group between the first chipset and the second chipset, signal interference between the first chips in the first chipset and the second chipset can be shielded.

[0037] For example, during operation of the package structure, the first chipset can be used as a normal service channel, and the second chipset as a backup service channel. When the normal service channel and the backup service channel operate simultaneously, the signals generated by the two channels are prone to mutual interference. By providing a vertical lead group between the two channels, the mutual interference between the two channels can be effectively shielded.

[0038] Alternatively, the vertical lead group may be located at the edge of the support pad, with the arrangement direction of each first vertical lead in the vertical lead group aligned with the extension direction of the edge of the support pad. Thus, by arranging the vertical lead group at the edge of the support pad, external signals can be prevented from interfering with the first chip on the surface of the support pad, and the first chip on the surface of the support pad can also be prevented from interfering with external signals.

[0039] In one possible implementation, the side of the package structure can be wrapped with a first shielding layer, which is used to electrically connect to the ground point and is insulated from each first signal pad. In this way, the signal in the package structure can be effectively shielded, the signal of the package structure can be confined internally, and the signal of the package structure can be prevented from affecting peripheral circuits or devices, so that the package structure can achieve signal self-shielding. In addition, the first shielding layer is insulated from each first signal pad to prevent the first signal pad from shorting to the ground point. Optionally, each first signal pad can be configured to be completely enclosed by the first plastic package.

[0040] Furthermore, the entire surface of the package structure with the lead frame can be provided with a second shielding layer, which is electrically connected to a ground point. Providing this second shielding layer on the bottom surface of the package structure effectively shields signals within the package structure, confining them internally and preventing them from affecting peripheral circuits or devices, thus achieving self-shielding signal functionality.

[0041] In one possible implementation, when the lead frame has a stepped support pad, the surface of the support pad facing away from the first fan-out pad has a better shielding effect and can replace the function of the second shielding layer. Therefore, when the lead frame has a stepped support pad, the second shielding layer on the bottom surface of the packaging structure can be omitted.

[0042] In one possible implementation, if the first plastic package does not completely wrap the first signal pad, leaving part of the side of the first signal pad exposed, in order to avoid a short circuit between the first signal pad and the shielding layer, the first shielding layer may not be provided on the side of the packaging structure, and the second shielding layer may be provided only on the bottom surface of the packaging structure.

[0043] The above introduces several ways of setting a shielding layer on the outer surface of the packaging structure. In specific implementation, the shielding layer can be set according to the specific structure of the packaging structure. The specific setting method of the shielding layer is not limited here.

[0044] In some other embodiments of the present application, the first signal pad may not be provided in the lead frame, that is, the lead frame may only include a support pad, and the first chip may be electrically connected to the first fan-out pad or the second fan-out pad through a first vertical lead. Specifically, the first end of the first vertical lead may be in contact with the surface of the first chip, and the second end may be electrically connected to the first fan-out pad or the second fan-out pad (directly in contact or electrically connected through other conductive components). In this way, the interconnection lines between the first chip and the lead frame can be reduced, and even no interconnection lines may be provided between the first chip and the lead frame. Thus, the interconnection relationship between the components in the packaging structure can be simplified, making the structure of the packaging structure more compact, saving the internal space of the packaging structure, and making the volume of the packaging structure smaller. In addition, the packaging structure can be implemented with reference to the description of the above embodiments. For example, the implementation of the support pad in the packaging structure can be implemented with reference to the support pad in the above implementation method one or implementation method two, and the structure of the first vertical lead in the packaging structure can refer to the structure of the first vertical lead in the above embodiment. Furthermore, referring to the description in the above embodiment, a vertical lead group can be provided in the package structure, with the first vertical lead in the vertical lead group being used to connect the support pad and the second fan-out pad, thereby providing signal shielding. Furthermore, a shielding layer can also be provided on the side and / or bottom surfaces of the package structure.

[0045] In some embodiments of the present application, the packaging structure can be electrically connected to the first circuit board in the form of a quad flat no-leads package (QFN). Specifically, the packaging structure can be directly soldered to the first circuit board through each first fan-out pad. In other embodiments of the present application, the packaging structure can be electrically connected to the first circuit board in the form of a ball grid array (BGA). Specifically, the packaging structure can also include: solder balls located on the surface of the first fan-out pad. When the packaging structure includes a second fan-out pad, solder balls can also be provided on the surface of the second fan-out pad. The packaging structure can be soldered to the first circuit board through each solder ball, thereby improving the reliability of the solder joints between the packaging structure and the first circuit board.

[0046] In a possible implementation, the packaging structure in the embodiment of the present application may have a multi-layer stacking structure. Specifically, the packaging structure may include: at least two device layers arranged in a stacked manner, and each device layer may include: at least one of: a first chip, a capacitor, and a resistor. In the specific implementation, the number of device layers in the packaging structure, as well as the type and quantity of devices in each device layer, can be set according to actual needs, and are not limited here. The devices in two adjacent device layers are electrically connected through a first vertical lead. In addition, a connecting layer can be provided between two adjacent device layers, and the connecting layer can play a role of support and connection. In the embodiment of the present application, by providing a plurality of device layers arranged in a stacked manner, the packaging structure has a multi-layer stacking structure, and more chips, capacitors, resistors and other devices can be integrated in the vertical direction (the direction perpendicular to the surface of the lead frame), which is conducive to the miniaturized design of the packaging structure.

[0047] In an embodiment of the present application, the lead frame may have a double-sided structure. Specifically, the package structure may further include: at least one second chip, a plurality of second upright leads, a plurality of third fan-out pads, and a second plastic package. Each second chip is located on the side of the lead frame facing away from the first chip, each third fan-out pad is located on the side of the second chip facing away from the lead frame, and each second upright lead is located between the lead frame and the third fan-out pad. The first end of at least one second upright lead is in contact with the surface of the lead frame or the second chip, and the second end is electrically connected to the third fan-out pad (directly in contact or electrically connected through other conductive components), so that the second chip can be electrically connected to the third fan-out pad through the second upright lead, or the second chip can be electrically connected to the third fan-out pad through the lead frame and the second upright lead, so that the signal of the second chip can be transmitted to the third fan-out pad and fanned out on the bottom surface of the package structure. The second plastic package wraps each second chip and each second upright lead, and each third fan-out pad is located on the surface of the second plastic package.

[0048] In an embodiment of the present application, by setting the lead frame to a double-sided structure, chips, capacitors, resistors and other devices can be set on the upper and lower surfaces of the lead frame, so that the packaging structure can encapsulate more devices, improve the integration of the packaging structure, and facilitate the miniaturization design of the packaging structure. In addition, the packaging structure is provided with fan-out pads on the top and bottom surfaces, so that the packaging structure can fan out signals on the top and bottom surfaces to achieve double-sided fan-out of signals. In a specific implementation, a circuit board can be connected to the top and bottom surfaces of the packaging structure respectively, so that the board-level architecture can achieve more functions. The packaging structure can dissipate heat through the side, and heat dissipation components such as radiators can be set on the side of the packaging structure to improve heat dissipation efficiency.

[0049] The implementation of the lead frame can refer to the above description. In one possible implementation, the lead frame may include only a support pad, each second chip is located on the surface of the support pad facing away from the first chip, the first end of at least one second upright lead is in contact with the second chip, and the second end is electrically connected to the third fan-out pad (directly in contact or electrically connected through other conductive components). In this way, the second chip can be electrically connected to the third fan-out pad through the second upright lead, so that the signal of the second chip can be fanned out on the bottom surface of the package structure. In another possible implementation, the lead frame may include: a support pad, a plurality of first signal pads, and a plurality of second signal pads. Each second chip is located on the surface of the support pad facing away from the first chip, each second signal pad is located on the side of the first signal pad facing away from the first fan-out pad, the position of at least one third fan-out pad corresponds to that of the second signal pad, the first end of at least one second upright lead is in contact with the second signal pad or the surface of the second chip, and the second end is electrically connected to the third fan-out pad at the corresponding position (directly in contact or electrically connected through other conductive components). In this way, the second chip can be electrically connected to the third fan-out pad through the second upright lead and the second signal pad, so that the signal of the second chip can be fanned out on the bottom surface of the package structure.

[0050] In specific implementation, the implementation of each component on the lower surface of the lead frame (the surface with the second chip side) can refer to the implementation of each component on the upper surface (the surface with the first chip side). For example, the implementation of the second chip can refer to the implementation of the first chip, the implementation of the second signal pad can refer to the implementation of the first signal pad, the implementation of the second upright lead can refer to the implementation of the first upright lead, the implementation of the second plastic package can refer to the implementation of the first plastic package, the implementation of the third fan-out pad can refer to the implementation of the first fan-out pad, the fourth fan-out pad can refer to the implementation of the second fan-out pad, and the implementation of the lower surface of the support pad can refer to the implementation of the upper surface. Repetitive parts will be omitted.

[0051] In addition, at least one fourth fan-out pad can be set on the side of the second chip away from the lead frame, and each fourth fan-out pad is located on the surface of the second plastic package body. The position of at least one fourth fan-out pad corresponds to that of the support pad. The first end of at least one second upright lead is in contact with the support pad or the surface of the second chip, and the second end is electrically connected to the fourth fan-out pad at the corresponding position. The support pad and the fourth fan-out pad are both used to be electrically connected to the ground point. In this way, during the operation of the packaging structure, the second fan-out pad and the fourth fan-out pad can play a role in shielding external interference, so that the packaging structure has a double-sided shielding effect on the top and bottom surfaces, thereby realizing the self-shielding function of the packaging structure. In order to further improve the self-shielding effect of the packaging structure, a first shielding layer can be set on the side of the packaging structure.

[0052] In the second aspect, an embodiment of the present application further provides a board-level architecture, which may include: the packaging structure and the first circuit board in the above-mentioned first aspect, the packaging structure being electrically connected to the first circuit board through each first fan-out pad. For example, the first circuit board may be a power amplifier RF board. Since the signal fan-out and heat dissipation of the above-mentioned packaging structure are not on the same side, the packaging structure can be directly connected to the first circuit board through the first fan-out pad, without the aid of an adapter board to transmit the signal, which can make the board-level architecture smaller in size, lower in material and production costs, and lower in signal transmission medium loss.

[0053] The board-level architecture in the embodiment of the present application may further include: a heat sink, which is connected to the lead frame in the packaging structure. In one possible implementation, the heat sink may be located on the side of the packaging structure away from the first circuit board, and the packaging structure may transfer heat to the heat sink on the bottom surface, thereby dissipating the heat generated when the packaging structure is working. In another possible implementation, the packaging structure may dissipate heat through the side, and the heat sink may be set on the side of the packaging structure. Of course, the heat sink may also be set in other positions, and the position of the heat sink may be reasonably set according to the heat dissipation path of the packaging structure, which is not limited here.

[0054] In a specific implementation, the function of the antenna board can be integrated into the first circuit board, so that the first circuit board has the functions of both the power amplifier RF board and the antenna board, thereby eliminating the antenna board and further reducing the volume of the board-level architecture. In addition, the packaging structure can be in direct contact with the radiator, thereby improving the heat dissipation efficiency of the board-level architecture.

[0055] In a third aspect, an embodiment of the present application further provides a communication device, which may include: the board-level architecture and a housing in the second aspect above, wherein the board-level architecture is located inside the housing. The communication device may be a base station, a computer, a laptop, a tablet computer, a mobile phone, and the like. Since the signal fan-out and the heat dissipation of the packaging structure in the above-mentioned board-level architecture are not on the same side, the board-level architecture has the advantages of being smaller in size, having lower material and production costs, and having lower signal transmission medium loss. Therefore, the communication device including the above-mentioned board-level architecture also has the advantages of being smaller in size, having lower costs, and having lower signal transmission loss, so that the communication device has better performance.

[0056] In a fourth aspect, an embodiment of the present application further provides a method for manufacturing a packaging structure. The method for manufacturing a packaging structure in an embodiment of the present application may include:

[0057] Step 1. Provide a lead frame. The lead frame may include a support pad and a plurality of first signal pads. Optionally, the lead frame may be made of metal materials such as copper and aluminum. Of course, it may also be made of other conductive materials, which is not limited here. In one possible implementation, the lead frame may have the stepped structure described in the above implementation method one. In another possible implementation, the lead frame may have the structure with uniform thickness described in the above implementation method two. Of course, the lead frame may also have other structures. For example, the lead frame may only have a support pad, and the structure of the lead frame is not limited here.

[0058] Step 2: Mount at least one first chip on the surface of the lead frame. In specific implementation, a die attach process may be used to mount each first chip on the surface of the supporting pad.

[0059] Step 3: Form a plurality of first upright leads on the lead frame; wherein the first end of at least one first upright lead is in contact with and connected to the surface of the lead frame or the first chip. In a specific implementation, each first upright lead can be formed at a corresponding location based on the connection relationship of each first upright lead. For example, the first upright lead can be formed on a support pad, a first signal pad, or the surface of the first chip.

[0060] In the actual process, a wire bonding process can be used to form each first upright lead on the lead frame. Specifically, a fixed portion can be formed on the surface of the lead frame (or the first chip), and then pulled upward to form an upright portion, thereby obtaining a first upright lead upright on the surface of the lead frame (or the first chip). Optionally, the first upright lead can be made of metal wires such as gold wire, aluminum wire, and copper wire, or other metal materials such as silver or tin can be used to make the first upright lead. Of course, other conductive materials can also be used to make the first upright lead, which is not limited here. In addition, a first plastic package can be made first, and a through hole can be formed in the first plastic package. The first upright lead can be formed by filling the through hole with a conductive material. Other processes can also be used to make the first upright lead, which is not limited here. In addition, a wire bonding process can be used to form multiple interconnects, and the interconnects can be made at corresponding positions according to the connection relationship of each interconnect.

[0061] Step 4: Form a first plastic package body that encapsulates each first chip and each first upright lead, leaving the second end of at least one first upright lead exposed on the surface of the first plastic package body. In a specific implementation, the first plastic package body can be manufactured using a molding process. After the first plastic package body is cured, the surface of the first plastic package body can be ground using a grinding process to expose the end surface of the second end of the first upright lead.

[0062] Step 5: Form a plurality of first fan-out pads on the surface of the first plastic package, wherein at least one first fan-out pad is electrically connected to the second end of the first vertical lead. In addition, at least one second fan-out pad may be formed on the surface of the first plastic package. In order to reduce the number of process steps, the first fan-out pads and the second fan-out pads may be manufactured using the same patterning process. For example, a sputtering process or an electroplating process may be used to manufacture a conductive film layer on the entire surface, and then the conductive film layer may be patterned using a process such as etching to obtain patterns of the first fan-out pads and the second fan-out pads. This method has a simple manufacturing process and a low manufacturing cost.

[0063] In the actual process, for a lead frame including a support pad and multiple first signal pads, before at least one first core is installed on the surface of the lead frame, the lead frame can also be pre-molded so that the molding material fills the first gap of the lead frame and covers the surface of each first signal pad facing away from the first fan-out pad, wherein the first gap is the gap between the support pad and each first signal pad, as well as the gap between adjacent first signal pads.

[0064] In addition, after the above step five, it can also include: forming a first shielding layer on the side of the packaging structure that is insulated from each first signal pad, and / or forming a second shielding layer on the bottom surface of the packaging structure to improve the self-shielding effect of the packaging structure.

[0065] In the manufacturing method of the packaging structure provided in the embodiment of the present application, at least one first chip and at least one first vertical lead are installed on the lead frame, and a first plastic packaging body that wraps each first chip and each first vertical lead is formed by a plastic packaging process. Then, a plurality of first fan-out pads are formed on the surface of the first plastic packaging body, thereby obtaining a packaging structure in which the signal fan-out and the heat dissipation are not on the same side. The packaging structure can be directly contacted and connected with the first circuit board through the first fan-out pads, and there is no need to manufacture an adapter board during the manufacturing process, thereby reducing the difficulty of the manufacturing process of the packaging structure and reducing the processing cost.

[0066] The above describes the manufacturing process of the packaging structure in the embodiment of the present application. Other extended structures of the packaging structure can be implemented with reference to the above description, and the repeated parts will not be repeated. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] FIG1 is a schematic diagram of the structure of a board-level architecture provided in an embodiment of the present application;

[0068] FIG2 is a schematic structural diagram of the packaging structure in FIG1 ;

[0069] FIG3 is a schematic diagram of the three-dimensional structure of the lead frame in FIG2 ;

[0070] FIG4 is another schematic structural diagram of the packaging structure according to an embodiment of the present application;

[0071] FIG5 is another schematic diagram of the structure of the board-level architecture according to an embodiment of the present application;

[0072] FIG6 is a schematic structural diagram of the packaging structure in FIG5 ;

[0073] FIG7 is a schematic structural diagram of the lead frame in FIG6 ;

[0074] FIG8 is a schematic diagram of the interconnection relationship of the packaging structure in an embodiment of the present application;

[0075] FIG9 is a partial schematic diagram of the surface of the support pad in an embodiment of the present application;

[0076] FIG10 is a schematic structural diagram of a packaging structure according to an embodiment of the present application;

[0077] FIG11 is another schematic structural diagram of the packaging structure according to an embodiment of the present application;

[0078] FIG12 is another schematic structural diagram of the packaging structure according to an embodiment of the present application;

[0079] FIG13 is another schematic structural diagram of the packaging structure according to an embodiment of the present application;

[0080] FIG14 is another schematic structural diagram of the packaging structure according to an embodiment of the present application;

[0081] FIG15 is another structural diagram of the board-level architecture according to an embodiment of the present application;

[0082] FIG16 is another structural diagram of the board-level architecture according to an embodiment of the present application;

[0083] FIG17 is a schematic structural diagram of the packaging structure in FIG16;

[0084] FIG18 is another schematic structural diagram of the packaging structure according to an embodiment of the present application;

[0085] FIG19 is a flow chart of a method for manufacturing a packaging structure according to an embodiment of the present application;

[0086] FIG20 is a schematic structural diagram corresponding to each step in the manufacturing method of an embodiment of the present application;

[0087] FIG21 is another structural schematic diagram corresponding to each step in the manufacturing method of an embodiment of the present application;

[0088] FIG22 is a schematic diagram of the manufacturing process of the lead frame in an embodiment of the present application;

[0089] FIG23 is a schematic diagram of the production process of the lead frame in an embodiment of the present application.

[0090] Figure 100: Package structure; 11: Lead frame; 111: Support pad; 111a: First support portion; 111b: Second support portion; 111c: Connecting portion; 111d: Support portion; 112: First signal pad; 113: Surface treatment layer; 114: Second signal pad; 12: First chip; 12': Second chip; 12M: First chipset; 12N: Second chipset; 13, 13a, 13b, 13c: First vertical lead; 13': Second vertical lead; 13M: Vertical lead group; 131: Fixed portion; 132: Vertical portion; 14: First fan-out pad; 14': Third Fan-out pad; 15-first plastic package; 15'-second plastic package; 151, 152-plastic packaging material; 16-second fan-out pad; 16'-fourth fan-out pad; 17, 17a, 17b, 17c, 17d-interconnection line; 181-first shielding layer; 182-second shielding layer; 19-solder ball; 200-first circuit board; 300-heat sink; Q1, Q2, Q3-device layer; W-connection layer; C-capacitor; R-resistor. DETAILED DESCRIPTION

[0091] In the related art, since the signal fan-out and heat dissipation of the power amplifier module are on the same side, in order to realize the signal interconnection between the power amplifier RF board and the antenna board, it is necessary to set an adapter board between the power amplifier RF board and the antenna board. In order to solve the problems of large volume, large signal transmission medium loss, high cost, etc. caused by setting an adapter board in the power amplifier board-level architecture in the related art. The embodiment of the present application provides a packaging structure, a manufacturing method thereof, a board-level architecture and a communication device. The packaging structure can be a power amplifier module (PA Module). In some cases, the packaging structure can also be other modules such as a RF module and a storage module. The board-level architecture can be a 5G multiple input and multiple output (MM) power amplifier board-level architecture. The board-level architecture can be applied to communication equipment such as base stations. In some cases, the board-level architecture can also be applied to terminals with communication functions such as desktop computers, laptops, tablet computers, and mobile phones.

[0092] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0093] It should be noted that the same reference numerals in the drawings of this application represent the same or similar structures, and thus their repeated description will be omitted. The words expressing positions and directions described in this application are all explained using the drawings as examples, but they can be modified as needed, and such modifications are included in the scope of protection of this application. The drawings of this application are only for illustrating relative positional relationships and do not represent true proportions.

[0094] FIG1 is a schematic diagram of a board-level architecture according to an embodiment of the present application. As shown in FIG1 , the board-level architecture according to an embodiment of the present application may include: a packaging structure 100 and a first circuit board 200. For example, the first circuit board 200 may be a power amplifier radio frequency board.

[0095] FIG2 is a schematic diagram of the structure of the package structure in FIG1 , wherein (1) in FIG2 is a schematic diagram of the cross-sectional structure of the package structure in the embodiment of the present application, (2) in FIG2 is a schematic diagram of the top surface structure of the package structure in the embodiment of the present application, and (3) in FIG2 is a schematic diagram of the bottom surface structure of the package structure in the embodiment of the present application. In the embodiment of the present application, for ease of explanation, the side of the package structure close to the first circuit board is referred to as the "top surface", and the side of the package structure facing away from the first circuit board is referred to as the "bottom surface".

[0096] 1 and 2 , the package structure 100 may include: a lead frame 11, at least one first chip 12, a plurality of first upright leads 13, a plurality of first fan-out pads 14, and a first plastic package 15. For example, the first chip 12 may be a power amplifier chip or a matching chip, etc. The first chip 12 may be a bare chip or a chip with a certain degree of packaging. The type and quantity of the first chips 12 can be set according to actual needs. Each first chip 12 is located on the lead frame 11, each first fan-out pad 14 is located on the side of the first chip 12 facing away from the lead frame 11, and each first upright lead 13 is located between the lead frame 11 and the first fan-out pad 14. The first end of at least one first upright lead 13 is in contact with and connected to the surface of the lead frame 11 or the first chip 12, and the second end is electrically connected to the first fan-out pad 14 (directly or through other conductive components), so that the first chip 12 can be electrically connected to the first fan-out pad 14 through the first upright lead 13, or the first chip 12 can be electrically connected to the first fan-out pad 14 through the lead frame 11 and the first upright lead 13, so that the signal of the first chip 12 can be transmitted to the first fan-out pad 14 and fanned out on the top surface of the package structure 100. The first plastic package 15 wraps around each first chip 12 and each first upright lead 13, and the first plastic package 15 can protect each first chip 12 and each first upright lead 13. Each first fan-out pad 14 is located on the surface of the first plastic package 15, and the package structure 100 is electrically connected to the first circuit board 200 through each first fan-out pad 14.

[0097] In the package structure provided in the embodiment of the present application, each first chip 12 is arranged on the lead frame 11, and during operation, each first chip 12 can dissipate heat through the lead frame 11, so that the package structure 100 can dissipate heat on the bottom or side. In addition, a plurality of first vertical leads 13 are arranged between the lead frame 11 and the first fan-out pad 14, and the first plastic package 15 wraps each first vertical lead 13. The first plastic package 15 can protect and support the first vertical lead 13, so that the signal of the package structure 100 can be fanned out on the top surface. In other words, the signal fan-out and heat dissipation of the package structure 100 in the embodiment of the present application are not on the same surface, and the package structure 100 has a self-flip structure. Therefore, in the embodiment of the present application, the package structure 100 can be directly connected to the first circuit board 200 via the first fan-out pad 14, eliminating the need for an adapter board to transmit signals. This can reduce the size of the board-level architecture and lower material costs. The package structure 100 can be directly connected to the first circuit board 200, shortening the signal transmission path and reducing the signal transmission medium loss of the board-level architecture. Furthermore, the package structure 100 has a simpler structure, which can simplify the processing complexity of the board-level architecture and reduce manufacturing costs. This solves the problems of larger size, greater signal transmission medium loss, and higher costs caused by the provision of an adapter board in the power amplifier board-level architecture in the related art.

[0098] As shown in (1) of FIG2 , in some embodiments of the present application, the first upright lead 13 may include: a fixing portion 131 located at the first end, and a linear upright portion 132 connected to the fixing portion 131, wherein the width of the fixing portion 131 is greater than the diameter of the upright portion 132. In the embodiment of the present application, the diameter of the upright portion 132 may be in the range of 1 micron to 100 microns, for example, the diameter of the upright portion 132 may be about 25 microns, 38 microns, or 50 microns. By providing the fixing portion 131 at the first end of the first upright lead 13, the contact area between the first upright lead 13 and the surface of the lead frame 11 (or the first chip 12) may be increased. The fixing portion 131 is connected to the upright portion 132, which may play a role in fixing the upright portion 132 and improving the stability of the first upright lead 13. For example, the fixing portion 131 may be spherical or ellipsoidal. Of course, the fixing portion 131 may also be other shapes, which are not limited here. In some cases, the first upright lead 13 may not include the fixing portion 131 , that is, the first upright lead 13 may only include the upright portion 132 , which is not limited here.

[0099] During the manufacturing process, a wire bonding process can be used to first form a fixed portion 131 on the surface of the lead frame 11 (or the first chip 12), and then pull it upward to form an upright portion 132, thereby obtaining a first upright lead 13 upright on the surface of the lead frame 11 (or the first chip 12). Optionally, the first upright lead 13 can be made of a metal wire such as gold wire, aluminum wire, copper wire, or other metal materials such as silver or tin. Of course, the first upright lead 13 can also be made of other conductive materials, which are not limited here. In addition, the first plastic package 15 can also be made first, and a through hole can be formed in the first plastic package 15. The first upright lead 13 is formed by filling the through hole with a conductive material. Other processes can also be used to make the first upright lead 13, which are not limited here.

[0100] The upright leads in the embodiment of the present application (the first upright lead mentioned above or the second upright lead to be mentioned later) are linear, and the diameter of the upright leads is less than 100 microns. Moreover, since the upright leads are very thin, in order to ensure the strength of the upright leads and avoid damage, a plastic package (a first plastic package or a second plastic package) is used to wrap each upright lead to support and protect the upright leads. During the manufacturing process, a wire bonding process can be used to manufacture linear upright leads, and then a plastic package process can be used to form a plastic package that wraps the upright leads. The upright leads in the embodiment of the present application are different from conductive connection structures such as conductive columns in related technologies. In related technologies, conductive connection structures can be manufactured by a stamping process. The sizes of the conductive connection structures obtained by the stamping process are relatively large. Generally, the diameter of the conductive connection structure is in the millimeter range, and it is impossible to obtain a linear conductive connection structure with a diameter of less than 100 microns.

[0101] Figure 3 is a schematic diagram of the three-dimensional structure of the lead frame in Figure 2. As shown in Figures 2 and 3, in some embodiments of the present application, the lead frame 11 may include: a support pad 111 and a plurality of first signal pads 112, wherein the support pad 111 plays a role of support and heat dissipation, and the first signal pad 112 plays a role of signal connection. Each first chip 12 is located on the support pad 111, and the position of at least one first fan-out pad 14 corresponds to that of the first signal pad 112. The first end of at least one first vertical lead 13 is in contact with the surface of the first signal pad 112, and the second end is electrically connected to the first fan-out pad 14 at the corresponding position. In this way, the signal of the first chip 12 can be transmitted to the first fan-out pad 14 through the first signal pad 112 and the first vertical lead 13, and fanned out on the top surface of the package structure 100.

[0102] Continuing with reference to Figures 2 and 3, the package structure in the embodiment of the present application may further include: at least one second fan-out pad 16 located on the side of the first chip 12 facing away from the lead frame 11, each second fan-out pad 16 being located on the surface of the first plastic package 15. The positions of at least one second fan-out pad 16 and the support pad 111 correspond to each other, the first end of at least one first upright lead 13 is in contact with the support pad 111 or the surface of the first chip 12, and the second end is electrically connected to the second fan-out pad 16 at the corresponding position, that is, the first upright lead 13 can also be used to connect the support pad 111 (or the first chip 12) to the second fan-out pad 16 at the corresponding position. The support pad 111 and the second fan-out pad 16 are both used for grounding. The second fan-out pad 16 is located on the top surface of the package structure 100, and the support pad 111 is located on the bottom surface of the package structure 100 or near the bottom surface of the package structure 100. By setting the support pad 111 and the second fan-out pad 16 for grounding, the package structure 100 can achieve double-sided fan-out of the ground signal. During the operation of the package structure 100 , the support pad 111 and the second fan-out pad 16 can shield external interference, so that the package structure 100 has double-sided shielding effects on the top and bottom surfaces, thereby realizing the self-shielding function of the package structure 100 .

[0103] In one possible implementation, the first fan-out pad 14 and the second fan-out pad 16 can comprise the same material. For example, the first fan-out pad 14 and the second fan-out pad 16 can both comprise a metal material. Of course, the first fan-out pad 14 and the second fan-out pad 16 can also comprise other conductive materials, which are not limited here. During the manufacturing process, the first fan-out pad 14 and the second fan-out pad 16 can be manufactured using the same patterning process. For example, a sputtering process or an electroplating process can be used to form a conductive film layer on the entire surface, and then the conductive film layer can be patterned using a process such as etching to obtain the patterns of the first fan-out pad 14 and the second fan-out pad 16. This simple manufacturing process and low manufacturing cost.

[0104] In the embodiment of the present application, the lead frame has at least two implementation methods, as follows:

[0105] Implementation method 1: the supporting pad 111 has a stepped structure.

[0106] In conjunction with Figures 2 and 3, in an embodiment of the present application, the surface of the support pad 111 close to the first fan-out pad 14 is flush with the surface of the first signal pad 112 close to the first fan-out pad 14, and the maximum thickness of the support pad 111 is greater than the thickness of the first signal pad 112. That is, the support pad 111 and the first signal pad 112 are layered in the vertical direction (perpendicular to the surface of the lead frame 11), and the surface of the support pad 111 facing away from the first fan-out pad 14 is closer to the bottom surface of the package structure. Since the package structure can dissipate heat through the bottom surface during operation, the bottom surface of the package structure may contact some heat-conducting media or structural parts. If the first signal pad 112 and the support pad 111 are set to be flush with the surface facing away from the first fan-out pad 14, that is, the surface of the first signal pad 112 facing away from the first fan-out pad 14 is exposed to the bottom surface of the package structure, leakage or other performance problems are likely to occur, resulting in poor overall performance of the package structure. Therefore, in the embodiment of the present application, the support pad 111 and the first signal pad 112 are arranged in layers in the vertical direction, and the support pad 111 is used to electrically connect to the ground point. The support pad 111 can play a signal shielding role to prevent the first signal pad 112 from having problems such as leakage or signal interference. In addition, the thickness of the support pad 111 is greater than the thickness of the first signal pad 112. The thicker the support pad 111 is, the better the heat dissipation capacity of the package structure 100. Of course, in some cases, the surfaces of the support pad 111 and the first signal pad 112 on the side close to the first fan-out pad 14 may not be flush, that is, the surface of the first signal pad 112 may be set closer to the first fan-out pad 14 than the surface of the support pad 111, or the surface of the support pad 111 may be set closer to the first fan-out pad 14 than the surface of the first signal pad 112. This is not limited here.

[0107] 2 and 3 , in one possible implementation, the support pad 111 may include a first support portion 111a and a second support portion 111b that are stacked and in contact with each other, with the first support portion 111a located on a side of the second support portion 111b that is close to the first fan-out pad 14. The first signal pads 112 are distributed around the first support portion 111a, and in a direction where the second support portion 111b points toward the first support portion 111a, the second support portion 111b covers the first support portion 111a and the first signal pads 112. Furthermore, the first plastic encapsulation body 15 fills a first gap in the lead frame 11 and covers the surface of each first signal pad 112 on a side facing away from the first fan-out pad 14. The first gap can be the gap between the support pad 111 and each first signal pad 112, as well as the gap between adjacent first signal pads 112. In this way, the upper surface, lower surface, and at least a portion of the side surfaces of each first signal pad 112 can be encapsulated by the first plastic encapsulation body 15, thereby burying each first signal pad 112 within the package structure 100. The second support portion 111b can effectively shield the signals of each first signal pad 112, preventing problems such as leakage or signal interference at each first signal pad 112. Furthermore, the structure of the lead frame 11 is relatively compact, which can rationally utilize the space within the lead frame 11, resulting in a smaller volume occupied by the lead frame 11, which is conducive to the miniaturization design of the package structure 100.

[0108] In a specific implementation, the support pad 111 may also include: a plurality of connecting portions 111c connected to the first support portion 111a, and each first signal pad 112 and each connecting portion 111c are distributed around the first support portion 111a. In the direction in which the second support portion 111b points to the first support portion 111a, the second support portion 111b covers each connecting portion 111c, and each connecting portion 111c is in contact and connected with the second support portion 111b. For example, the connecting portion 111c can be set at the top corner of the first support portion 111a, or can be set on the side of the first support portion 111a (for example, near the middle of the side). The position and number of the connecting portions 111c can be set according to actual needs and are not limited here.

[0109] The connecting portion 111c is located at the edge of the first supporting portion 111a. During the process of manufacturing the packaging structure 100, the connecting portion 111c can serve to connect the connecting portions 111c in other lead frames 11. Specifically, in order to improve the manufacturing efficiency, a whole-surface frame structure including multiple lead frames 11 can be manufactured first, and two adjacent lead frames 11 are connected by the connecting portion 111c. After the lead frame is manufactured, the whole-surface frame structure is divided into multiple independent lead frames 11. Similarly, during the manufacturing process, the first signal pad 112 can be connected to the first signal pad 112 in other lead frames 11. After the first plastic package 15 is manufactured, the two connected first signal pads 112 are divided.

[0110] In practical applications, the first support portion 111a, the second support portion 111b, and the connecting portions 111c in the support pad 111 can be connected as a whole. Since the first support portion 111a, the second support portion 111b, and the connecting portions 111c are connected to each other, the first support portion 111a, the second support portion 111b, and the connecting portions 111c are all used for grounding. In addition, the first support portion 111a, the second support portion 111b, and the connecting portions 111c in the support pad 111 can be made of the same material, for example, they can all be made of metal materials such as copper and aluminum. Of course, they can also be made of other conductive materials, which are not limited here.

[0111] In conjunction with Figures 2 and 3, in an embodiment of the present application, the number of first fan-out pads 14 can be equal to the number of first signal pads 112, and the position of each first fan-out pad 14 can correspond one-to-one to the position of each first signal pad 112. In order to facilitate connection with the first circuit board 200, the size of the first fan-out pad 14 can be set to be greater than or equal to the size of the first signal pad 112 at the corresponding position. Of course, the number of first fan-out pads 14 and first signal pads 112 can also be different, and the size of the first fan-out pad 14 can also be set to be smaller than the size of the first signal pad 112 at the corresponding position. The position, number and size of the first fan-out pad 14 and the first signal pad 112 can be set according to actual needs, and are not limited here. The shape of the second fan-out pad 16 can be consistent with the shape of the support pad 111. Figures 2 and 3 illustrate the example of the package structure 100 including one second fan-out pad 16. In a specific implementation, two, three or more second fan-out pads 16 can also be set, and the number and shape of the second fan-out pad 16 are not limited here.

[0112] FIG4 is another structural diagram of the packaging structure in the embodiment of the present application. As shown in FIG4 , the lead frame 11 in the embodiment of the present application may further include: a surface treatment layer 113. The surface treatment layer 113 is located on the surface of the support pad 111 and each first signal pad 112 close to the first fan-out pad 14. The surface treatment layer 113 may play a protective and anti-oxidation role. In a specific implementation, the surface of the support pad 111 and each first signal pad 112 may be surface treated to form an oxidation-resistant and wear-resistant surface treatment layer 113 to prevent the surface of the support pad 111 and each first signal pad 112 from being oxidized in the air, thereby avoiding quality problems such as poor contact between the lead frame 11 and the first chip 12 (or components such as the first vertical lead 13).

[0113] Implementation method 2: The thickness of the supporting pad 111 is uniform.

[0114] Figure 5 is another structural schematic diagram of the board-level architecture in an embodiment of the present application, and Figure 6 is a structural schematic diagram of the packaging structure in Figure 5, wherein (1) in Figure 6 is a cross-sectional structural schematic diagram of the packaging structure in an embodiment of the present application, (2) in Figure 6 is a top surface structural schematic diagram of the packaging structure in an embodiment of the present application, (3) in Figure 6 is a bottom surface structural schematic diagram of the packaging structure in an embodiment of the present application, and Figure 7 is a structural schematic diagram of the lead frame in Figure 6.

[0115] 5 to 7 , in the second implementation, in the thickness direction of the lead frame 11, the support pad 111 and each first signal pad 112 do not overlap each other. Moreover, the support pad 111 is flush with the surface of each first signal pad 112 on the side close to the first fan-out pad 14, and the thickness of the support pad 111 is greater than the thickness of the first signal pad 112. The first plastic package 15 fills the first gap in the lead frame 11, and the first plastic package 15 covers the surface of each first signal pad 112 on the side away from the first fan-out pad 14. In this way, the upper surface, lower surface and at least part of the side surface of each first signal pad 112 can be wrapped by the first plastic package 15, so that each first signal pad 112 is buried inside the packaging structure 100. The first plastic package 15 and the support pad 111 can effectively shield the signal of each first signal pad 112, and prevent the first signal pad 112 from having problems such as leakage or signal interference. Of course, in some cases, the surfaces of the support pad 111 and the first signal pad 112 on the side close to the first fan-out pad 14 may not be flush. That is, the surface of the first signal pad 112 may be set to be closer to the first fan-out pad 14 than the surface of the support pad 111, or the surface of the support pad 111 may be set to be closer to the first fan-out pad 14 than the surface of the first signal pad 112. This is not limited here.

[0116] In one possible implementation, the support pad 111 may include: a support portion 111d and a plurality of connecting portions 111c, and each first signal pad 112 and each connecting portion 111c are distributed around the support portion 111d. The thickness of each position in the support pad 111 is consistent, and the support portion 111d may be in the shape of a cuboid, a cube, a cylinder, etc. The support portion 111d plays a role in supporting and dissipating heat, and the connecting portion 111c is located at the edge of the support portion 111d. In the process of manufacturing the packaging structure 100, the connecting portion 111c may play a role in connecting the connecting portions 111c in other lead frames 11. Specifically, in order to improve manufacturing efficiency, a whole-surface frame structure including multiple lead frames 11 may be manufactured first, and two adjacent lead frames 11 may be connected by the connecting portion 111c. After the lead frame is manufactured, the whole-surface frame structure may be divided into multiple independent lead frames 11. For example, the connecting portion 111c can be set at the top corner of the supporting portion 111d, or at the side of the supporting portion 111d (for example, near the middle of the side). The position and number of the connecting portion 111c can be set according to actual needs and are not limited here.

[0117] In a specific implementation, the support portion 111d and the connecting portions 111c can be connected as a whole, and both the support portion 111d and the connecting portions 111c can be used for grounding. Furthermore, the support portion 111d and the connecting portions 111c can be made of the same material, for example, copper, aluminum, or other metal materials. Other conductive materials are also possible, and this is not limited here.

[0118] In summary, the difference between Implementation Method 1 and Implementation Method 2 lies in the different shapes of the support pads 111. Specifically, in Implementation Method 1, the support pads 111 have a stepped structure, and each first signal pad 112 can be blocked by the edge of the second support portion 111b. In Implementation Method 2, the thickness of each position in the support pad 111 is consistent. For example, the support portion 111d in the support pad 111 can be in the shape of a cuboid, a cube, a cylinder, etc. In addition, the structure of the lead frame in Implementation Method 2 is consistent with that in Implementation Method 1. Implementation Method 2 can be implemented with reference to the description of the lead frame in Implementation Method 1, and the repeated parts will not be repeated.

[0119] FIG8 is a schematic diagram of the interconnection relationship of the packaging structure in an embodiment of the present application. As shown in FIG8 , for the lead frame in the above-mentioned implementation method one and implementation method two, the multiple first upright leads 13 in the packaging structure 100 can have multiple connection relationships. As shown in FIG8 13a, the first upright lead 13a can connect the first signal pad 112 with the first fan-out pad at the corresponding position. Specifically, the first end of the first upright lead 13a is in contact with the surface of the first signal pad 112, and the second end is electrically connected to the first fan-out pad at the corresponding position (direct contact connection or electrical connection through other conductive components). As shown in FIG8 13b, the first upright lead 13b can connect the support pad 111 with the second fan-out pad at the corresponding position. Specifically, the first end of the first upright lead 13b is in contact with the surface of the support pad 111, and the second end is electrically connected to the second fan-out pad at the corresponding position (direct contact connection or electrical connection through other conductive components). As shown in 13c in FIG8 , the first vertical lead 13c can connect the first chip 12 to the first fan-out pad or the second fan-out pad at the corresponding position. Specifically, the first end of the first vertical lead 13c is in contact with the surface of the first chip 12, and the second end is electrically connected to the first fan-out pad or the second fan-out pad at the corresponding position (directly or through other conductive components). Of course, the first vertical lead 13 can also be used to connect other components located between the lead frame 11 and the first fan-out pad (or the second fan-out pad), and these examples are not given here.

[0120] Continuing with FIG8 , the package structure in the embodiment of the present application may further include: a plurality of interconnects (such as 17a to 17d in FIG8 ) located within the first plastic package. The plurality of interconnects in the package structure may have various connection relationships. As shown in 17a in FIG8 , interconnect 17a may connect the support pad 111 and the first signal pad 112; and / or, as shown in 17b in FIG8 , interconnect 17b may connect two first chips 12; and / or, as shown in 17c in FIG8 , interconnect 17c may connect the first chip 12 and the first signal pad 112; and / or, as shown in 17d in FIG8 , interconnect 17d may connect the first chip 12 and the support pad 111. Of course, the interconnects may also be used to connect other components on the lead frame 11 , and examples thereof are not given here. During the manufacturing process, the interconnects may be made using a metal bonding process. Optionally, the interconnects may be made using metal wires such as gold wire, aluminum wire, and copper wire. Of course, the interconnects may also be made using other conductive materials, and this is not limited here.

[0121] In the embodiment of the present application, the interconnection line can be linear, and the diameter of the interconnection line can be less than 100 microns. For example, the diameter of the interconnection line can be about 25 microns, 38 microns, or 50 microns. Unlike the upright lead, the interconnection line connects two components in the horizontal direction (parallel or approximately parallel to the surface of the lead frame 11). The interconnection line can be arc-shaped. Of course, the interconnection line can also be other shapes and can be set according to the positions of the two components to be connected. This is not limited here. The upright lead connects two components in the vertical direction (perpendicular to the surface of the lead frame 11). The upright lead is a straight line extending in the vertical direction.

[0122] FIG9 is a partial schematic diagram of the surface of a support pad in an embodiment of the present application. As shown in FIG9 , the plurality of first upright leads in the package structure may include at least one upright lead group 13M. Each upright lead group 13M may include a plurality of first upright leads 13b arranged in at least one row. Each first upright lead 13b in the upright lead group 13M has a first end in contact with and connected to the surface of the support pad 111, and a second end electrically connected to a corresponding second fan-out pad. In other words, the plurality of first upright leads 13b in contact with and connected to the surface of the support pad 111 are divided into a plurality of upright lead groups 13M, with each first upright lead 13b in each upright lead group 13M arranged in at least one row. Since the support pad 111 is used for grounding, each first upright lead 13 in contact with and connected to the surface of the support pad 111 is also used for grounding. The plurality of first upright leads 13b arranged in at least one row in the upright lead group 13M can serve as signal shielding.

[0123] The multiple first chips 12 in the package structure may include: a first chipset 12M and a second chipset 12N. The first chipset 12M may include at least one first chip 12, and the second chipset 12N may include at least one first chip 12. A vertical lead group 13M may be located between the first chipset 12M and the second chipset 12N. The arrangement direction of each first vertical lead 13b in the vertical lead group 13M intersects with the direction from the first chipset 12M to the second chipset 12N. For example, the arrangement direction of each first vertical lead 13b in the vertical lead group 13M may be consistent with the arrangement direction of each first chip 12 in the first chipset 12M (or the second chipset 12N). Thus, by providing the vertical lead group 13M between the first chipset 12M and the second chipset 12N, signal interference between the first chips 12 in the first chipset 12M and the second chipset 12N can be shielded.

[0124] For example, during operation of the package structure, the first chipset 12M can be used as a normal service channel, and the second chipset 12N can be used as a backup service channel. When the normal service channel and the backup service channel operate simultaneously, the signals generated by the two channels are likely to interfere with each other. By providing a vertical lead group 13M between the two channels, the mutual interference between the two channels can be effectively shielded.

[0125] And / or, the upright lead group 13M can be located at the edge of the support pad 111, and the arrangement direction of each first upright lead 13b in the upright lead group 13M is consistent with the extension direction of the edge of the support pad 111. In this way, by arranging the upright lead group 13M at the edge of the support pad 111, it is possible to prevent external signals from interfering with the first chip 12 on the surface of the support pad 111, and it is also possible to prevent the first chip 12 on the surface of the support pad 111 from interfering with external signals.

[0126] Figures 10 and 11 are schematic structural diagrams of the packaging structure in the embodiments of the present application, respectively. The packaging structure in Figure 10 has the lead frame in the above-mentioned implementation method one, and the packaging structure in Figure 11 has the lead frame in the above-mentioned implementation method two. As shown in Figures 10 and 11, the side of the packaging structure 100 is wrapped with a first shielding layer 181. The first shielding layer 181 is used to electrically connect to the ground point. The first shielding layer 181 is insulated from each first signal pad 112. In this way, the signal in the packaging structure 100 can be effectively shielded, the signal of the packaging structure 100 can be confined inside, and the signal of the packaging structure 100 can be prevented from affecting the peripheral circuits or devices, so that the packaging structure 100 can achieve signal self-shielding. In addition, the first shielding layer 181 is insulated from each first signal pad 112 to prevent the first signal pad 112 from short-circuiting with the ground point. Optionally, each first signal pad 112 can be set to be completely wrapped by the first plastic package 15.

[0127] Continuing with Figures 10 and 11 , package structure 100 includes a second shielding layer 182 disposed throughout one surface of one side of lead frame 11. Second shielding layer 182 is electrically connected to a ground point. Providing second shielding layer 182 on the bottom surface of package structure 100 effectively shields signals within package structure 100, confining them to the interior and preventing them from affecting peripheral circuits or devices, thereby achieving self-shielding signal functionality.

[0128] Figure 12 is another structural schematic diagram of the packaging structure in an embodiment of the present application. The packaging structure in Figure 12 has the lead frame in the above-mentioned implementation method one. As shown in Figure 12, when the lead frame 11 has a stepped support pad 111, the surface of the support pad 111 facing away from the first fan-out pad 14 has a better shielding effect and can replace the role of the second shielding layer. Therefore, when the lead frame 11 has a stepped support pad 111, the second shielding layer on the bottom surface of the packaging structure can be omitted.

[0129] Figure 13 is another structural schematic diagram of the packaging structure in an embodiment of the present application. The packaging structure in Figure 13 has the lead frame in the above-mentioned implementation method 2. As shown in Figure 13, if the first plastic package 15 does not completely wrap the first signal pad 112, so that part of the side of the first signal pad 112 is exposed, in order to avoid short-circuiting the first signal pad 112 and the shielding layer, the first shielding layer may not be set on the side of the packaging structure 100, and only the second shielding layer 182 is set on the bottom surface of the packaging structure 100.

[0130] Figures 10 to 13 introduce several ways of setting a shielding layer on the outer surface of the packaging structure. In specific implementation, the shielding layer can be set according to the specific structure of the packaging structure. The specific setting method of the shielding layer is not limited here.

[0131] FIG14 is another schematic diagram of the structure of the package structure in an embodiment of the present application. As shown in FIG14 , in some other embodiments of the present application, the first signal pad may not be provided in the lead frame 11, that is, the lead frame 11 may only include the support pad 111, and the first chip 12 may be electrically connected to the first fan-out pad 14 or the second fan-out pad 16 via the first vertical lead 13. Specifically, the first end of the first vertical lead 13 may be in contact with the surface of the first chip 12, and the second end may be electrically connected to the first fan-out pad 14 or the second fan-out pad 16 (directly in contact or through other conductive components). In this way, the number of interconnection lines between the first chip 12 and the lead frame 11 can be reduced, and even no interconnection lines may be provided between the first chip 12 and the lead frame 11. Thus, the interconnection relationship between the various components in the package structure 100 can be simplified, making the structure of the package structure 100 more compact, saving the internal space of the package structure 100, and making the package structure 100 smaller. In addition, the package structure shown in FIG14 can be implemented with reference to the description of the above embodiments. For example, the implementation of the support pad 111 in FIG14 can be implemented with reference to the support pad 111 in the above-mentioned implementation method 1 or implementation method 2, and the structure of the first vertical lead 13 in FIG14 can be implemented with reference to the structure of the first vertical lead 13 in FIG2 or FIG6. In addition, a vertical lead group can be provided in the package structure 100 shown in FIG14 with reference to the structure shown in FIG9. The first vertical lead 13 in the vertical lead group is used to connect the support pad 111 with the second fan-out pad 16, thereby providing signal shielding. A shielding layer can also be provided on the side and / or bottom surface of the package structure 100 shown in FIG14 with reference to the structure shown in FIG10.

[0132] In some embodiments of the present application, as shown in Figures 1 and 2, the package structure 100 can be electrically connected to the first circuit board 200 using a quad flat no-leads package (QFN). Specifically, the package structure 100 can be directly soldered to the first circuit board 200 via each first fan-out pad 14. Figure 15 is another schematic diagram of the board-level architecture in an embodiment of the present application. As shown in Figure 15, in other embodiments of the present application, the package structure 100 can be electrically connected to the first circuit board 200 using a ball grid array (BGA). Specifically, the package structure 100 can further include solder balls 19 located on the surface of the first fan-out pad 14. When the package structure 100 includes a second fan-out pad 16, solder balls 19 can also be provided on the surface of the second fan-out pad 16. The package structure 100 can be soldered to the first circuit board 200 via each solder ball 19, thereby improving the reliability of the solder joints between the package structure 100 and the first circuit board 200.

[0133] FIG16 is another structural schematic diagram of the board-level architecture in an embodiment of the present application, and FIG17 is a structural schematic diagram of the package structure in FIG16. As shown in FIG16 and FIG17, in a possible implementation, the package structure 100 in the embodiment of the present application can have a multi-layer stacked structure. Specifically, the package structure 100 can include: at least two device layers arranged in a stacked manner. In FIG17, the package structure 100 includes three device layers Q1, Q2, and Q3 as an example. Each device layer can include: at least one of a first chip 12, a capacitor C, and a resistor R. For example, in FIG17, the device layer Q1 includes two first chips 12, the device layer Q2 includes two first chips 12, and the device layer Q3 includes two resistors R and one capacitor C. In specific implementation, the number of device layers in the package structure 100, as well as the type and number of devices in each device layer, can be set according to actual needs, and are not limited here. The devices in two adjacent device layers are electrically connected by a first vertical lead 13. In addition, a connecting layer W can be provided between two adjacent device layers, and the connecting layer W can play a supporting and connecting role. In an embodiment of the present application, by setting up multiple stacked device layers, the packaging structure has a multi-layer stacking structure, and more chips, capacitors, resistors and other devices can be integrated in the vertical direction (perpendicular to the surface of the lead frame), which is conducive to the miniaturized design of the packaging structure.

[0134] As shown in Figures 1, 5, 15 and 16, the board-level architecture in the embodiment of the present application may further include: a heat sink 300, which is connected to the lead frame in the packaging structure 100. In one possible implementation, the heat sink 300 may be located on the side of the packaging structure 100 away from the first circuit board 200, and the packaging structure 100 may transfer heat to the heat sink 300 on the bottom surface, thereby dissipating the heat generated when the packaging structure 100 is working. In another possible implementation, the packaging structure 100 may dissipate heat through the side, and the heat sink 300 may be set on the side of the packaging structure 100. Of course, the heat sink 300 may also be set at other positions, and the position of the heat sink 300 may be reasonably set according to the heat dissipation path of the packaging structure 100, which is not limited here.

[0135] Continuing to refer to Figures 1, 5, 15 and 16, in a specific implementation, the function of the antenna board can be integrated into the first circuit board 200, so that the first circuit board 200 has the functions of both the power amplifier RF board and the antenna board, thereby eliminating the antenna board and further reducing the volume of the board-level architecture. In addition, the packaging structure 100 can be in direct contact with the heat sink 300, thereby improving the heat dissipation efficiency of the board-level architecture.

[0136] FIG18 is another structural schematic diagram of the packaging structure in the embodiment of the present application. As shown in FIG18 , in the embodiment of the present application, the lead frame 11 may have a double-sided structure. Specifically, the packaging structure 100 may further include: at least one second chip 12′, a plurality of second upright leads 13′, a plurality of third fan-out pads 14′, and a second plastic package 15′. Each second chip 12′ is located on the side of the lead frame 11 away from the first chip 12, each third fan-out pad 14′ is located on the side of the second chip 12′ away from the lead frame 11, each second upright lead 13′ is located between the lead frame 11 and the third fan-out pad 14′, a first end of at least one second upright lead 13′ is in contact with and connected to the surface of the lead frame 11 or the second chip 12′, and a second end is electrically connected to the third fan-out pad 14′. The second chip 12' is electrically connected to the third fan-out pad 14' via the second upright lead 13' (direct contact connection or electrical connection through other conductive components), or the second chip 12' is electrically connected to the third fan-out pad 14' via the lead frame 11 and the second upright lead 13', so that the signal of the second chip 12' can be transmitted to the third fan-out pad 14' and fanned out on the bottom surface of the package structure 100. The second plastic package 15' encapsulates each second chip 12' and each second upright lead 13', and each third fan-out pad 14' is located on the surface of the second plastic package 15'.

[0137] In an embodiment of the present application, by setting the lead frame 11 to a double-sided structure, chips, capacitors, resistors and other devices can be set on the upper surface and the lower surface of the lead frame 11, so that the packaging structure 100 can be packaged with more devices, the integration of the packaging structure 100 is improved, and it is beneficial to the miniaturization design of the packaging structure 100. In addition, the packaging structure 100 is provided with fan-out pads on the top and bottom surfaces, so that the packaging structure can fan out signals on the top and bottom surfaces to achieve double-sided fan-out of signals. In a specific implementation, a circuit board can be connected to the top and bottom surfaces of the packaging structure 100 respectively, so that the board-level architecture can achieve more functions. The packaging structure 100 can dissipate heat through the side, and heat dissipation components such as radiators can be set on the sides of the packaging structure 100 to improve heat dissipation efficiency.

[0138] The implementation of the lead frame 11 can refer to the above description. In one possible implementation, the lead frame 11 can include only a support pad 111, and each second chip 12' is located on the surface of the support pad 111 facing away from the first chip 12. The first end of at least one second upright lead 13' is in contact with the second chip 12', and the second end is electrically connected to the third fan-out pad 14' (directly in contact or through other conductive components). In this way, the second chip 12' can be electrically connected to the third fan-out pad 14' through the second upright lead 13', so that the signal of the second chip 12' can be fanned out on the bottom surface of the package structure 100. In another possible implementation, the lead frame 11 may include: a support pad 111, a plurality of first signal pads 112, and a plurality of second signal pads 114. Each second chip 12' is located on the surface of the support pad 111 facing away from the first chip 12. Each second signal pad 114 is located on the side of the first signal pad 112 facing away from the first fan-out pad 14. At least one third fan-out pad 14' corresponds to the position of the second signal pad 114. The first end of at least one second upright lead 13' is in contact with the second signal pad 114 or the surface of the second chip 12', and the second end is electrically connected to the corresponding third fan-out pad 14' (directly or through other conductive components). In this way, the second chip 12' can be electrically connected to the third fan-out pad 14' via the second upright lead 13' and the second signal pad 114, so that the signal of the second chip 12' can be fanned out from the bottom surface of the package structure 100.

[0139] In a specific implementation, the implementation of each component on the lower surface of the lead frame 11 (the surface with the second chip 12' side) can refer to the implementation of each component on the upper surface (the surface with the first chip 12 side). For example, the implementation of the second chip 12' can refer to the implementation of the first chip 12, the implementation of the second signal pad 114 can refer to the implementation of the first signal pad 112, the implementation of the second vertical lead 13' can refer to the implementation of the first vertical lead 13, the implementation of the second plastic package 15' can refer to the implementation of the first plastic package 15, the implementation of the third fan-out pad 14' can refer to the implementation of the first fan-out pad 14, the implementation of the fourth fan-out pad 16' can refer to the implementation of the second fan-out pad 16, and the implementation of the lower surface of the support pad 111 can refer to the implementation of the upper surface. The repeated parts will not be repeated.

[0140] In addition, at least one fourth fan-out pad 16' can be provided on the side of the second chip 12' facing away from the lead frame 11. Each fourth fan-out pad 16' is located on the surface of the second plastic package 15'. At least one fourth fan-out pad 16' corresponds to the position of the support pad 111. The first end of at least one second upright lead 13' is in contact with the support pad 111 or the surface of the second chip 12', and the second end is electrically connected to the fourth fan-out pad 16' at the corresponding position. The support pad 111 and the fourth fan-out pad 16' are both used to electrically connect to the ground point. In this way, during the operation of the package structure 100, the second fan-out pad 16' and the fourth fan-out pad 16' can shield external interference, so that the package structure 100 has a double-sided shielding effect on the top and bottom surfaces, realizing the self-shielding function of the package structure 100. In order to further improve the self-shielding effect of the package structure 100 , a first shielding layer 181 may be provided on the side surface of the package structure 100 .

[0141] Based on the same technical concept, an embodiment of the present application also provides a communication device, which may include: any of the above-mentioned board-level architectures and a shell, wherein the board-level architecture is located inside the shell. The communication device may be a base station, a computer, a laptop, a tablet computer, a mobile phone, etc. Since the signal fan-out and the heat dissipation of the packaging structure in the above-mentioned board-level architecture are not on the same side, the board-level architecture has the advantages of small size, low material and production costs, and small signal transmission medium loss. Therefore, the communication device including the above-mentioned board-level architecture also has the advantages of small size, low cost, and small signal transmission loss, so that the communication device has better performance.

[0142] Based on the same technical concept, the embodiment of the present application further provides a method for manufacturing a packaging structure. FIG19 is a flow chart of the method for manufacturing a packaging structure in the embodiment of the present application. FIG20 is a schematic structural diagram corresponding to each step in the manufacturing method in the embodiment of the present application. FIG21 is another schematic structural diagram corresponding to each step in the manufacturing method in the embodiment of the present application. As shown in FIG19 to FIG21, the method for manufacturing a packaging structure in the embodiment of the present application may include:

[0143] S401. Provide a lead frame. (1) in Figure 20 is a schematic diagram of the three-dimensional structure of the lead frame 11, and (2) in Figure 20 is a schematic diagram of the cross-sectional structure of the lead frame 11. Referring to (1) and (2) in Figure 20, the lead frame 11 may include a support pad 111 and a plurality of first signal pads 112. Optionally, the lead frame 11 may be made of metal materials such as copper and aluminum. Of course, it may also be made of other conductive materials, which are not limited here. In one possible implementation, the lead frame 11 may have the stepped structure described in the above-mentioned implementation method one. (1) in Figure 21 is a schematic diagram of the three-dimensional structure of the lead frame 11, and (2) in Figure 21 is a schematic diagram of the cross-sectional structure of the lead frame 11. Referring to (1) and (2) in Figure 21, in another possible implementation, the lead frame 11 may have the structure with uniform thickness described in the above-mentioned implementation method two. Of course, the lead frame 11 may also have other structures. For example, referring to FIG. 14 , the lead frame 11 may only have the support pad 111 , and the structure of the lead frame 11 is not limited here.

[0144] Referring to (3) in Figure 20 and (3) in Figure 21, when the lead frame 11 includes a support pad 111 and multiple first signal pads 112, the lead frame 11 can also be pre-molded so that the molding material 151 fills the first gap of the lead frame 11 and covers the surface of each first signal pad 112 facing away from the first fan-out pad, wherein the first gap is the gap between the support pad 111 and each first signal pad 112, as well as the gap between adjacent first signal pads 112.

[0145] S402, referring to (4) in FIG20 and (4) in FIG21, at least one first chip 12 is mounted on the surface of the lead frame 11. In specific implementation, each first chip 12 can be mounted on the surface of the support pad 111 by using a die attach process.

[0146] S403. Continuing with (4) in FIG. 20 and (4) in FIG. 21 , a plurality of first upright leads 13 are formed on the lead frame 11; wherein a first end of at least one first upright lead 13 is in contact with and connected to the surface of the lead frame 11 or the first chip 12. In a specific implementation, each first upright lead 13 can be fabricated at a corresponding position based on the connection relationship of each first upright lead 13. For example, the first upright lead 13 can be fabricated on the support pad 111, the first signal pad 112, or the surface of the first chip 12.

[0147] In the actual process, a wire bonding process can be used to form each first upright lead 13 on the lead frame 11. Specifically, a fixed portion can be formed on the surface of the lead frame 11 (or the first chip 12), and then pulled upward to form an upright portion, thereby obtaining the first upright lead 13 upright on the surface of the lead frame 11 (or the first chip 12). Optionally, the first upright lead 13 can be made of a metal wire such as gold wire, aluminum wire, copper wire, or other metal materials such as silver or tin. Of course, the first upright lead 13 can also be made of other conductive materials, which are not limited here. In addition, the first plastic package 15 can also be made first, and a through hole can be formed in the first plastic package 15. The first upright lead 13 is formed by filling the through hole with a conductive material. Other processes can also be used to make the first upright lead 13, which are not limited here. In addition, a wire bonding process may be used to form a plurality of interconnecting lines 17 , and the interconnecting lines 17 may be fabricated at corresponding positions according to the connection relationship between the interconnecting lines 17 .

[0148] S404, referring to (5) in FIG. 20 and (5) in FIG. 21 , a first plastic package 15 is formed to encapsulate each first chip 12 and each first upright lead 13, and the second end of at least one first upright lead 13 is exposed on the surface of the first plastic package 15. In a specific implementation, the first plastic package 15 can be manufactured by a plastic packaging process. After the first plastic package 15 is cured, the surface of the first plastic package 15 can be ground by a grinding process to expose the end surface of the second end of the first upright lead 13.

[0149] S405. Referring to (6) in FIG. 20 and (6) in FIG. 21 , a plurality of first fan-out pads 14 are formed on the surface of the first plastic package 15, wherein at least one first fan-out pad 14 is electrically connected to the second end of the first vertical lead 13. In addition, at least one second fan-out pad 16 can be formed on the surface of the first plastic package 15. In order to reduce the number of process steps, the same patterning process can be used to produce each first fan-out pad 14 and each second fan-out pad 16. For example, a sputtering process or an electroplating process can be used to produce a conductive film layer on the entire surface, and then the conductive film layer can be patterned using a process such as etching to obtain patterns of each first fan-out pad 14 and each second fan-out pad 16. The manufacturing process is simple and the manufacturing cost is low.

[0150] In the manufacturing method of the packaging structure provided in the embodiment of the present application, at least one first chip and at least one first vertical lead are installed on the lead frame, and a first plastic packaging body that wraps each first chip and each first vertical lead is formed by a plastic packaging process. Then, a plurality of first fan-out pads are formed on the surface of the first plastic packaging body, thereby obtaining a packaging structure in which the signal fan-out and the heat dissipation are not on the same side. The packaging structure can be directly contacted and connected with the first circuit board through the first fan-out pads, and there is no need to manufacture an adapter board during the manufacturing process, thereby reducing the difficulty of the manufacturing process of the packaging structure and reducing the processing cost.

[0151] In some embodiments of the present application, the support pads in the lead frame may have a stepped structure, that is, the lead frame may have the structure described in the above implementation method 1. The lead frame in the above implementation method 1 can be manufactured in a variety of ways, as follows:

[0152] Manufacturing method 1: As shown in (1) and (2) in Figure 20, a device processing process such as a stamping process can be used to directly manufacture a complete lead frame 11. Then, as shown in (3) in Figure 20, a pre-packaging process is used to fill the gaps in the lead frame 11 with plastic packaging material 151 so that each first signal pad 112 is embedded.

[0153] Manufacturing method 2: FIG22 is a schematic diagram of the manufacturing process of the lead frame in the embodiment of the present application, (1) in FIG22 is a schematic diagram of the three-dimensional structure of the lead frame, and (2) in FIG22 is a schematic diagram of the cross-sectional structure of the lead frame. As shown in (1) and (2) in FIG22, a lead frame 11 with a support pad 111 and a first signal pad 112 of equal thickness is first manufactured. As shown in (3) in FIG22, a pre-molding process is adopted to fill the area other than the support pad 111 with a molding material 152. As shown in (4) in FIG22, the support pad 111 is thickened to obtain a stepped support pad 111. In the embodiment of the present application, a support pad 111 and a first signal pad 112 of equal thickness are first manufactured, and then the support pad 111 is thickened after subsequent pre-molding. The process difficulty is relatively low and the manufacturing accuracy can be improved.

[0154] Manufacturing method three: FIG23 is a schematic diagram of the manufacturing process of the lead frame in the embodiment of the present application, (1) in FIG23 is a schematic diagram of the three-dimensional structure of the lead frame, and (2) in FIG23 is a schematic diagram of the cross-sectional structure of the lead frame. As shown in (1) and (2) in FIG23, a support pad 111 and a first signal pad 112 with uniform thickness are first manufactured, and the thickness of the support pad 111 is greater than the thickness of the first signal pad 112. During the manufacturing process, a support pad 111 and a first signal pad 112 with uniform thickness can be manufactured first, and then the first signal pad 112 is thinned. As shown in (3) in FIG23, a pre-molding process is adopted to fill the gap between the support pad 111 and each first signal pad 112, the gap between each first signal pad 112, and the lower surface of each first signal pad 112 with a molding material 151, so that each first signal pad 112 is buried. As shown in (4) of FIG. 23 , the support pad 111 is thickened to obtain a stepped support pad 111 .

[0155] In addition, after the above step S405, it can also include: forming a first shielding layer on the side of the packaging structure that is insulated from each first signal pad, and / or forming a second shielding layer on the bottom surface of the packaging structure to improve the self-shielding effect of the packaging structure.

[0156] The above describes the manufacturing process of the packaging structure in the embodiment of the present application. Other extended structures of the packaging structure can be implemented with reference to the above description, and the repeated parts will not be repeated.

[0157] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present application.

[0158] Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the embodiments of the present application. Thus, if these modifications and variations of the embodiments of the present application fall within the scope of the claims of the present application and their equivalents, the present application also intends to include such modifications and variations.

Claims

1. A packaging structure, characterized in that: include: A lead frame, at least one first chip, a plurality of first vertical leads, a plurality of first fan-out pads, and a first plastic package; The at least one first chip is located on the lead frame, the plurality of first fan-out pads are located on a side of the first chip away from the lead frame, and the plurality of first vertical leads are located between the lead frame and the first fan-out pads; At least one of the plurality of first vertical leads has a first end in contact with and connected to the surface of the lead frame or the first chip, and a second end electrically connected to the first fan-out pad; The first plastic package body encapsulates the at least one first chip and the plurality of first vertical leads, and the plurality of first fan-out pads are located on a surface of the first plastic package body.

2. The packaging structure according to claim 1, characterized in that: The lead frame includes: a support pad and a plurality of first signal pads; The at least one first chip is located on the supporting pad, and the positions of at least one first fan-out pad and the first signal pad correspond to each other; At least one of the plurality of first vertical leads has a first end in contact with and connected to a surface of the first signal pad, and a second end electrically connected to a first fan-out pad at a corresponding position.

3. The packaging structure according to claim 2, characterized in that: It also includes: at least one second fan-out pad located on a side of the first chip away from the lead frame; The at least one second fan-out pad is located on the surface of the first plastic package body; The positions of at least one of the second fan-out pads and the support pad correspond to each other; the first end of at least one of the multiple first vertical leads is contacted and connected to the support pad or the surface of the first chip, and the second end is electrically connected to the second fan-out pad at the corresponding position, and the support pad and the second fan-out pad are both used to be electrically connected to the ground point.

4. The packaging structure according to claim 3, characterized in that: The plurality of first upright leads include: at least one upright lead group; Each of the vertical lead groups comprises: a plurality of the first vertical leads arranged in at least one row, a first end of each of the first vertical leads in the vertical lead group being in contact and connected with a surface of the support pad, and a second end being electrically connected to the second fan-out pad at a corresponding position; The at least one first chip comprises: a first chip group and a second chip group, the first chip group comprises at least one first chip, and the second chip group comprises at least one first chip; the vertical lead group is located between the first chip group and the second chip group, and the arrangement direction of each of the first vertical leads in the vertical lead group intersects with the direction from the first chip group to the second chip group; And / or, the upright lead group is located at an edge of the supporting pad, and an arrangement direction of each of the first upright leads in the upright lead group is consistent with an extension direction of the edge of the supporting pad.

5. The packaging structure according to claim 3, characterized in that: At least one of the plurality of first vertical leads has a first end in contact with and connected to the surface of the first chip, and a second end electrically connected to the second fan-out pad at a corresponding position.

6. The packaging structure according to any one of claims 1 to 5, characterized in that: The first upright lead includes: a fixing portion located at the first end, and a linear upright portion connected to the fixing portion; The width of the fixing portion is greater than the diameter of the upright portion.

7. The packaging structure according to claim 6, characterized in that: The diameter of the upright portion is in the range of 1 micrometer to 100 micrometers.

8. The packaging structure according to any one of claims 2 to 7, characterized in that: Also included: a plurality of interconnecting wires located within the first plastic package; At least one interconnection line among the plurality of interconnections connects the support pad and the first signal pad; and / or, at least one interconnection line among the plurality of interconnections connects two of the first chips; and / or, at least one interconnection line among the plurality of interconnections connects the first chip and the first signal pad; And / or, at least one interconnection line among the plurality of interconnection lines connects the first chip and the supporting pad.

9. The packaging structure according to any one of claims 2 to 8, characterized in that: The surface of the supporting pad close to the first fan-out pad is flush with the surface of the first signal pad close to the first fan-out pad; The maximum thickness of the support pad is greater than the thickness of the first signal pad, and the support pad is used to be electrically connected to a ground point.

10. The packaging structure according to claim 9, characterized in that: The supporting pad comprises: a first supporting portion and a second supporting portion which are stacked and contact-connected, wherein the first supporting portion is located at a side of the second supporting portion close to the first fan-out pad; The plurality of first signal pads are distributed around the first supporting portion; In a direction in which the second supporting portion points to the first supporting portion, the second supporting portion covers the first supporting portion and the plurality of first signal pads.

11. The packaging structure according to claim 10, characterized in that: The supporting pad further includes: a plurality of connecting portions connected to the first supporting portion; The plurality of first signal pads and the plurality of connecting portions are distributed around the first supporting portion; In a direction in which the second supporting portion points to the first supporting portion, the second supporting portion covers the plurality of connecting portions, and the plurality of connecting portions are in contact and connected with the second supporting portion.

12. The packaging structure according to claim 9, characterized in that: In a thickness direction of the lead frame, the support pad and the plurality of first signal pads do not overlap each other.

13. The packaging structure according to claim 12, characterized in that: The support pad includes: a support portion and a plurality of connection portions; The plurality of first signal pads and the plurality of connection portions are distributed around the support portion.

14. The packaging structure according to any one of claims 2 to 13, characterized in that: The first plastic package fills the first gap in the lead frame; wherein the first gap is the gap between the support pad and the plurality of first signal pads, and the gap between adjacent first signal pads; The first plastic package covers a surface of each of the first signal pads that is away from the first fan-out pad.

15. The packaging structure according to any one of claims 2 to 14, characterized in that: The side surface of the packaging structure is wrapped with a first shielding layer; The first shielding layer is used to be electrically connected to a ground point, and the first shielding layer is insulated from the plurality of first signal pads.

16. The packaging structure according to any one of claims 1 to 15, characterized in that: The packaging structure has a second shielding layer on the surface of one side of the lead frame; The second shielding layer is used to be electrically connected to a grounding point.

17. The packaging structure according to any one of claims 1 to 16, characterized in that: The packaging structure comprises: at least two device layers stacked in layers, each of the device layers comprising: at least one of the first chip, a capacitor, and a resistor; The devices in two adjacent device layers are electrically connected via the first vertical leads.

18. The packaging structure according to any one of claims 1 to 15, characterized in that: Also includes: At least one second chip, a plurality of second upright leads, a plurality of third fan-out pads and a second plastic package; The at least one second chip is located on a side of the lead frame away from the first chip, the plurality of third fan-out pads are located on a side of the second chip away from the lead frame, and the plurality of second upright leads are located between the lead frame and the third fan-out pads; At least one of the plurality of second upright leads has a first end in contact with and connected to the surface of the lead frame or the second chip, and a second end electrically connected to the third fan-out pad; The second plastic package body encapsulates the at least one second chip and the plurality of second upright leads, and the plurality of third fan-out pads are located on a surface of the second plastic package body.

19. The packaging structure according to claim 18, characterized in that: The lead frame includes: a support pad, a plurality of first signal pads and a plurality of second signal pads; The at least one second chip is located on a side of the supporting pad away from the first chip, and the plurality of second signal pads are located on a side of the first signal pad away from the first fan-out pad; The positions of at least one of the third fan-out pads and the second signal pad correspond to each other, and the first end of at least one of the multiple second vertical leads is in contact with and connected to the second signal pad or the surface of the second chip, and the second end is electrically connected to the third fan-out pad at the corresponding position.

20. A method for manufacturing a packaging structure, characterized in that: include: providing a lead frame; Mounting at least one first chip on the surface of the lead frame; A plurality of first vertical leads are formed on the lead frame; a first end of at least one of the plurality of first vertical leads is in contact and connected with a surface of the lead frame or the first chip; Forming a first plastic package body that encapsulates the at least one first chip and the plurality of first vertical leads, and leaving the second end of at least one first vertical lead among the plurality of first vertical leads exposed on the surface of the first plastic package body; A plurality of first fan-out pads are formed on the surface of the first plastic package body; at least one first fan-out pad among the plurality of first fan-out pads A pad is electrically connected to the second end of the first upstanding lead.

21. The method of claim 20, wherein: The lead frame includes: a support pad and a plurality of first signal pads; Before mounting at least one first chip on the surface of the lead frame, the method further comprises: The lead frame is pre-molded so that the molding material fills the first gap of the lead frame and covers the surface of each first signal pad facing away from the first fan-out pad; the first gap is the gap between the supporting pad and the multiple first signal pads, and the gap between adjacent first signal pads.

22. A board-level architecture, characterized in that: include: The packaging structure according to any one of claims 1 to 19, and a first circuit board; The packaging structure is electrically connected to the first circuit board through a plurality of first fan-out pads.

23. A communication device, characterized in that: include: The board-level architecture as claimed in claim 22, and a housing; The board-level architecture is located inside the housing.

Images