Inverter, electric drive device having an inverter

Abstract

Disclosed is an inverter (IV), having: - a power module group (LG) of at least one power module (LM), said power module group being arranged in a first component plane (E1) of the inverter; - a driver circuit group (TG) of at least one driver circuit support (TT), said driver circuit group being arranged in a second component plane (E2) of the inverter; - a control circuit group (SG) of at least one control circuit support (ST), said control circuit group being arranged in a third component plane (E3) of the inverter; - wherein the first component plane (E1), the second component plane (E2) and the third component plane (E3) lie one above the other in that order; - wherein the control circuit group (SG) at least partially covers the power module group (LG) and the driver circuit group (TG) in a perpendicular direction (SR), as seen perpendicular to the first component plane (E1). An electric drive device having an aforementioned inverter (IV) is also described.

Description

[0001] Description

[0002] Inverter, electric drive device with an inverter

[0003] Technical area:

[0004] The present invention relates to an inverter, in particular a power inverter for an electric drive device, especially of a motor vehicle, and to an electric drive device, in particular for a motor vehicle.

[0005] State of the art and task of the invention:

[0006] Inverters or power inverters are known and are used, among other things, as part of electrical drive devices, especially for motor vehicles, whereby they convert direct currents into alternating currents or phase currents and / or vice versa.

[0007] As with all technical devices, there is a general requirement for inverters and thus for electrical drive devices to be more compact and efficient.

[0008] The object of the present application is therefore to provide a possibility by which an inverter and thus an electric drive device can be made more compact and efficient.

[0009] Description of the invention:

[0010] This problem is solved by the subject matter of the independent claims. Advantageous embodiments are the subject matter of the dependent claims.

[0011] According to a first aspect of the invention, an inverter, in particular a power inverter for an electric drive device of a motor vehicle, is provided.

[0012] The inverter comprises a power module group comprising at least one power module (or power electronics module), specifically 3 or 3N (where N is a natural number) power modules. The power module group (or the at least one power module or power modules) is arranged in a first component level of the inverter.

[0013] The inverter further comprises a driver circuit group comprising at least one driver circuit carrier (or a driver circuit printed circuit board, i.e., a circuit carrier or printed circuit board on which one or more driver circuits for operating the power module(s) are formed). The driver circuit group (or the at least one driver circuit carrier) is arranged in a second component level of the inverter.

[0014] The driver circuit contains, for example, one or more gate driver circuits or parts thereof, such as one or more gate series resistors, and / or one or more sensors, such as one or more current sensors and / or one or more temperature sensors.

[0015] The inverter further comprises a control circuit group comprising at least one control circuit carrier (or a control circuit printed circuit board, i.e., a circuit carrier or printed circuit board on which one or more control circuits for controlling or regulating the power module(s) are formed). The control circuit group (or the at least one control circuit carrier) is arranged in a third component level of the inverter.

[0016] The first component level, the second component level, and the third component level lie one above the other in this order. Furthermore, the control circuit group, viewed in a vertical direction perpendicular to the first component level, at least partially overlaps or covers the power module group and the driver circuit group. In particular, the control circuit group, viewed in the vertical direction, overlaps or covers the power module group by at least 50%, 75%, or 90%, specifically completely. Similarly, the control circuit group, viewed in the vertical direction, overlaps or covers the driver circuit group by at least 50%, 75%, or 90%, specifically completely.

[0017] The arrangement or assembly of the three key component groups of the inverter, namely the power module group, the driver circuit group and the control circuit group, in a sandwich-like manner in three superimposed component levels enables, on the one hand, a compact design of the inverter and, on the other hand, a simple assembly of the inverter with consecutive assembly steps in one assembly direction.

[0018] Furthermore, the sandwich-like arrangement of the key component groups enables extremely short and thus low-inductance electrical connections between the key components, namely between the at least one power module and the at least one driver circuit carrier or between the at least one driver circuit carrier and the at least one control circuit carrier, wherein the electrical connections between these two key components can be routed directly without having to cross the respective component level of the other key component. Furthermore, the electrical connections between the key components can thus always be routed perpendicular to the component levels with the shortest possible extension. Furthermore, gaps have been created between the component levels that extend laterally parallel to the component levels and are open on the sides.External electrical connections for the individual key components, such as power connections for input DC and output AC currents, can be placed in these spaces to save space and routed out of the inverter at the side. These spaces, which run parallel to the component planes, in turn enable a large-area design for the power connections for the input DC and the output AC currents using wide-area power connection busbars, as well as a parallel, overlapping and thus low-inductance design of the two power connection busbars (H+ and H- connection busbars) for the input DC current.

[0019] This provides a way to make an inverter and thus an electric drive device more compact and efficient.

[0020] The inverter can further comprise a power connection bar group comprising at least one positive-voltage-side power connection bar, at least one negative-voltage-side power connection bar, and at least three phase power connection bars. The power connection bar group or the power connection bars are arranged in a fourth component level of the inverter. The control circuit group at least partially, in particular completely, overlaps or covers the power connection bar group when viewed vertically.

[0021] The fourth component level can be located between the second component level and the third component level. In this case, the power connection rails can extend from the fourth component level through the second component level or through the driver circuit group to the first component level or the power module group and be electrically contacted with the at least one power module.

[0022] The inverter can further comprise at least one first electrical contact connection that electrically connects the at least one driver circuit carrier to the at least one control circuit carrier. In this case, at least one of the power connection rails can comprise at least one first recess extending through the power connection rail, through which the at least one first contact connection can be routed to establish the aforementioned electrical contact connection from the third component level to the second component level. The at least one first electrical contact connection can be formed as a contact pin.

[0023] The power module group can be arranged in a spatial area which extends from the first component level in the perpendicular direction to the third component level and is at least partially, especially completely, surrounded by the driver circuit group.

[0024] The driver circuit group or the at least one driver circuit carrier can be formed to at least partially, especially completely, surround the power module group or the at least one power module, especially when viewed in the vertical direction. Specifically, the driver circuit group or the at least one driver circuit carrier can be distributed on both opposite sides of the power module group or the at least one power module and extend along an extension direction of the power module group or the at least one power module. The inverter can further comprise at least one second electrical contact connection, which is routed from the first component level to the second component level and electrically connects the at least one power module to the at least one driver circuit carrier.The at least one second contact connection can be formed as a bond connection (a bond wire or a bond ribbon).

[0025] The at least one driver circuit carrier or the driver circuit group can have at least one second recess projecting through the at least one driver circuit carrier or the driver circuit group, through which the at least one second contact connection for establishing the electrical contact connection between the at least one power module and the at least one driver circuit carrier can be guided from the first component level to the second component level.

[0026] The inverter may further comprise a cooler for cooling the inverter, which cooler is arranged in a fifth component level of the inverter, which lies on a side of the first component level facing away from the second component level.

[0027] The inverter may further comprise a capacitor module arranged in a sixth component level of the inverter, which lies on a side of the fifth component level facing away from the first component level.

[0028] The aforementioned positive voltage side and the aforementioned negative voltage side power connection rails can be routed from the fourth component level through the second, first and fifth component levels (in this order) to the sixth component level and can be electrically contacted with the capacitor module.

[0029] The aforementioned first to sixth component levels can be sandwiched together. Thus, the third, fourth, second, first, fifth, and sixth component levels can be sandwiched together in this order.

[0030] For example, the first and second component levels can lie in the same (geometric) plane. In particular, the power module group and the driver circuit group do not cover or overlap each other when viewed perpendicularly to each other. In particular, the driver circuit group, especially if it is formed in one piece, has a recess through which the driver circuit group is electrically or signal-wise connected to the power module group. In particular, the recess is located above the power module group when viewed perpendicularly. In particular, the recess and the power module group largely overlap each other in the perpendicular direction (e.g., over 80% or over 90% of the recess and / or the power module group).

[0031] For example, the at least one driver circuit carrier is adjacent to the at least one power module when viewed in the vertical direction.

[0032] The inverter may further comprise a support frame, for example made of an electrically insulating plastic, to which the aforementioned groups, namely the power module group or the at least one power module and / or the driver circuit group or the at least one driver circuit carrier, and / or the control circuit group or the at least one control circuit carrier, and / or the power connection rail group or at least one of the power connection rails, and / or the cooler and / or the capacitor module are fastened.

[0033] For fastening the above-mentioned components, the inverter may have corresponding fastening means, such as screws or bolts, which extend from one of the component levels through at least one intermediate component level to the other component level and physically connect the components from these component levels to one another.

[0034] The inverter may also comprise at least one sensor for measuring a parameter on one of the aforementioned power connection rails, which sensor is arranged on the at least one control circuit carrier and extends from the control circuit carrier to the power connection rail to be measured and thus from the third component level to the fourth component level.

[0035] In this case, the at least one sensor can be formed as a current sensor for measuring a current flowing through the power connection rail and can have at least one toroidal core which is arranged on the at least one control circuit carrier and (at least partially) surrounds the power connection rail to be measured.

[0036] According to a second aspect of the invention, an electric drive device, in particular for a motor vehicle, is provided.

[0037] The drive device comprises an electric motor with at least three phase current input terminals and a previously described inverter. The inverter further comprises at least three phase current output terminals and is electrically connected via these phase current output terminals to the at least three phase current input terminals of the electric motor. The aforementioned phase current connection rails can form the at least three phase current input terminals or can each be electrically connected to one of these phase current input terminals.

[0038] The component levels described above are not to be equated with mathematical or geometric levels, but rather comparable with assembly levels or functional layers, according to which the respective components are mounted in different assembly steps or are assigned to different functional layers.

[0039] Description of the drawing:

[0040] An exemplary embodiment of the invention is explained in more detail below with reference to the accompanying drawing. Figure 1 shows a schematic side cross-sectional view of a portion of a power inverter IV (or a part thereof) according to an exemplary embodiment of the invention.

[0041] In this embodiment, the power inverter IV is part of an electric drive device of a motor vehicle, which, in addition to the power inverter IV, also has, among other things, an electric motor for driving the motor vehicle. The power inverter IV is designed to convert a direct current provided by a traction battery of the motor vehicle into phase currents and to make them available to the electric motor in order to operate the electric motor. The power inverter IV has a power module group LG, which in turn has three power modules LM. The three power modules LM are arranged in a row in a first component level E1 of the inverter IV along a longitudinal extension direction LR of the inverter IV (which extends perpendicular to the image area of ​​Figure 1). The three power modules LM are largely identical and each have the same number of positive-voltage-side semiconductor switches (e.g.six positive-voltage-side semiconductor switches each) and negative-voltage-side semiconductor switches (e.g., six negative-voltage-side semiconductor switches each). The positive-voltage-side semiconductor switches and the negative-voltage-side semiconductor switches of the respective power modules LM are each distributed across one of the two halves of the respective power modules LM. The positive-voltage-side semiconductor switches of all power modules LM are arranged in a row along the longitudinal direction LR of the inverter IV. Analogously, the negative-voltage-side semiconductor switches of all power modules LM are arranged in a row along the longitudinal direction LR of the inverter IV.Accordingly, the positive voltage side semiconductor switches and the negative voltage side semiconductor switches of the respective power modules LM are arranged distributed on both opposite sides of the respective power modules LM, viewed along the longitudinal extension direction LR of the inverter IV.

[0042] The inverter IV further comprises a driver circuit group TG, which in turn comprises two driver circuit carriers TT, on each of which a driver circuit (or part thereof) is formed for operating the positive-voltage-side semiconductor switches of all three power modules LM or the negative-voltage-side semiconductor switches of all three power modules LM. The two driver circuit carriers TT and thus the driver circuit group TG are arranged in a second component level E2 of the inverter IV and, viewed along the longitudinal direction LR of the inverter IV, are distributed on both opposite sides of the power modules LM. Viewed in a vertical direction SR perpendicular to the first or second component level, the two driver circuit carriers TT each border laterally on the respective power modules LM. Accordingly, the two driver circuit carriers TT partially or completely encircle the power modules LM.on both long sides of the respective power modules LM. The inverter IV also has a control circuit group SG, which in turn has a control circuit carrier ST on which a common control circuit (or part thereof) is implemented for controlling or regulating all three power modules LM and thus all positive- and negative-voltage-side semiconductor switches of the three power modules LM. The control circuit group SG or the control circuit carrier ST is arranged in a third component level E3 of the inverter IV and, viewed in the vertical direction SR, largely completely covers the power module group LG or the three power modules LM and the driver circuit group TG or the two driver circuit carriers TT.

[0043] The inverter IV also has a power connection busbar group AG, which in turn has a positive voltage side power connection busbar HS, a negative voltage side power connection busbar LS, and three phase power connection busbars PS. The power connection busbar group AG or the power connection busbars HS, NS, PS are arranged in a fourth component level E4 (a group of fourth component levels E4) of the inverter IV, which is located between the second and third component levels E2 and E3. Starting from the power module group LG, viewed in the perpendicular direction SR to the control circuit group SG, the first, second, fourth, and third component levels E1, E2, E4, and E3 are located one above the other in this order and at different heights relative to the power module group LG.wherein the control circuit group SG, viewed in the vertical direction SR, at least partially overlaps the power connection rail group AG and thus the three power connection rails HS, LS, PS.

[0044] Depending on their design, the power connection bars HS, NS, and PS are each formed as a single piece from a stamped and bent metal or copper sheet, or from several metal or copper stamped and bent parts that are bonded together or force-fit. Furthermore, the power connection bars HS, NS, and PS each have several connecting legs that extend from the respective power connection bars HS, NS, and PS, and thus from the fourth component level E4 (or from the group of fourth component levels E4), through the second component level E2 to the first component level E1, and are physically and electrically connected to the respective power modules LM in the first component level E1.Because the two driver circuit carriers TT are arranged distributed on both opposite sides of the respective power modules LM, an opening is formed between the two driver circuit carriers TT, which extends through the second component level E2 and through which the connecting legs of the respective power connection rails HS, NS, PS can be easily guided from the fourth component level E4 to the first component level E1.

[0045] The inverter IV also has a plurality of first electrical contact connections V1 in the form of contact pins, which are distributed across the two driver circuit carriers TT and run from the respective driver circuit carriers TT (and thus from the second component level E2) to the control circuit carrier ST (and thus to the third component level E3) and electrically connect the respective driver circuits on the respective driver circuit carriers TT to the control circuit on the control circuit carrier ST. To enable the first contact connections V1 to pass through the fourth component level E4, the power connection rails HS, NS, PS have cutouts at corresponding locations, for example in the form of through-holes, through which the first contact connections V1 run from the respective driver circuit carriers TT to the control circuit carrier ST.

[0046] The inverter IV also has a plurality of second electrical contact connections V2 in the form of bond wires or bond ribbons, which electrically connect the respective power modules LM or the control Z-signal terminals of the respective semiconductor switches to the respective corresponding driver circuits on the respective driver circuit carriers TT. The second contact connections V2 from the respective power modules LM are routed through the aforementioned opening in the second component level E2 between the two driver circuit carriers TT to the respective driver circuit carriers TT, with the second contact connections V2 or the bond wires or bond ribbons bridging the height difference between the first and second component levels E1, E2 through their loops (arc shape).

[0047] Because the two driver circuit carriers TT are arranged distributed adjacent to the respective power modules LM on both opposite sides thereof and the positive voltage side semiconductor switches and the negative voltage side semiconductor switches of the respective power modules LM are arranged distributed along the longitudinal direction LR of the inverter IV on both opposite sides of the respective power modules LM, which are thus facing the respective corresponding driver circuit carriers TT, the second contact connections V2 can be designed to be short in the form of bonding wires or bonding ribbons.

[0048] The inverter IV also has a cooler KL for cooling the inverter IV or the power modules LM. This cooler is arranged in a fifth component level E5 of the inverter IV, which lies on a side of the first component level E1 facing away from the second component level E2. The three power modules LM rest on the cooler KL directly or (in the case where the cooler is predominantly made of a metal such as aluminum) via an electrically insulating layer, and are thermally contacted with it. Alternatively, the power modules LM can be arranged on a ceramic substrate, which in turn rests on the cooler KL and is thermally contacted with it.

[0049] In addition, inverter IV includes a capacitor module KD (a DC link capacitor) arranged in a sixth component level E6 of inverter IV, which is located on a side of the fifth component level E5 facing away from the first component level E1. The capacitor module KD is physically and thermally connected to the cooler.

[0050] Starting from the capacitor module KD, viewed in the vertical direction SR, the sixth, fifth, first, second, fourth and third component levels E6, E5, E1, E2, E4 and E3 are sandwiched one above the other in this order and at different heights with respect to the capacitor module KD.

[0051] The positive voltage side and the negative voltage side power connection bars HS, LS or their respective exposed end sections are bent from the fourth component level E4 in the vertical direction SR and are led through the second, first and fifth component levels E2, E1, E5 in this order to the sixth component level E6 and are electrically contacted with the capacitor module KD or with a positive voltage side or a negative voltage side power connection of the capacitor module KD. The inverter IV also has a support frame TR made of an electrically non-conductive plastic, on which the capacitor module KD, the cooler KL, the three power modules LM, the two driver circuit carriers TT, the positive voltage side power connection bar HS, the negative voltage side power connection bar LS and the three phase power connection bars PS, as well as the control circuit carrier ST are arranged or fixed directly or indirectly.are attached. The support frame TR thus holds all of the aforementioned components KD, KL, LM, TT, HS, LS, PS, ST together to form an inverter structure. For this purpose, the inverter IV has corresponding connecting elements for establishing corresponding force-fitting, form-fitting, or material-locking connections, such as screw connections, rivet connections, soldered connections, and / or sintered connections, between the support frame TR on the one hand and the aforementioned components KD, KL, LM, TT, HS, LS, PS, ST on the other hand, and / or between the aforementioned components KD, KL, LM, TT, HS, LS, PS, ST among themselves.

[0052] The inverter IV also has three current sensors SS for measuring phase currents flowing through the respective phase current connection rails PS. These current sensors are arranged on the control circuit carrier ST and are electrically connected to the control circuit on the measurement signal output side. The current sensors SS are designed as Hall sensors and each have a toroidal core RK. These are arranged or surface-mounted on the control circuit carrier ST and each surround the corresponding phase current connection rails PS. The current sensors SS thus extend from the control circuit carrier ST to the respective phase current connection rails PS and thus from the third component level E3 to the fourth component level E4.

[0053] The phase current connection rails PS are led from the inverter IV or from its fourth component level E4 to the electric motor not shown in the figure and are electrically contacted to its respective phase current input terminals.

[0054] The arrangement of the key components of the inverter IV, namely the power modules LM, the two driver circuit carriers TT and the control circuit carrier ST, the power connection rails HS, LS, PS, the cooler KS, the capacitor module KD and the support frame TR, sandwiched in several superimposed component levels E1 to E6, enables a compact design of the inverter IV on the one hand and simple assembly of the inverter IV with successive assembly steps in the same assembly direction on the other.

[0055] In addition, the sandwich-like arrangement of the key components of the inverter IV, namely the power modules LM, the two driver circuit carriers TT and the control circuit carrier ST, enables the shortest and thus low-inductive power and signal connections HS, LS, PS and V1, V2 between these key components without them having to cross each other.

[0056] In addition, the power and signal connections HS, LS, PS, and V1, V2 between the key components can be routed largely perpendicular to the component planes E1, E2, E3, and E4, thus always keeping the shortest possible distance. This provides a compact and efficient Inverter IV.

Claims

Patent claims 1 . Inverter (IV), comprising, - a power module group (LG) of at least one power module (LM) arranged in a first component level (E1) of the inverter; - a driver circuit group (TG) of at least one driver circuit carrier (TT) arranged in a second component level (E2) of the inverter; - a control circuit group (SG) of at least one control circuit carrier (ST) arranged in a third component level (E3) of the inverter; - wherein the first component level (E1), the second component level (E2) and the third component level (E3) are located one above the other in this order; - wherein the control circuit group (SG) at least partially covers the power module group (LG) and the driver circuit group (TG) when viewed in a vertical direction (SR) perpendicular to the first component plane (E1).

2. Inverter (IV) according to claim 1, further comprising - a current connection bar group (AG) of at least one positive voltage side current connection bar (HS), at least one negative voltage side current connection bar (LS), and at least three phase current connection bars (PS), which is arranged in a fourth component level (E4) of the inverter; - wherein the control circuit group (SG) at least partially overlaps the power connection rail group (AG) when viewed in the vertical direction (SR).

3. Inverter (IV) according to claim 2, wherein, - the fourth component level (E4) lies between the second component level (E2) and the third component level (E3), - wherein the power connection rails (HS, LS, PS) are guided from the fourth component level (E4) through the second component level (E2) to the first component level (E1) and are electrically contacted with the at least one power module (LM).

4. Inverter (IV) according to claim 2 or 3, further comprising - at least one first electrical contact connection (V1) which electrically connects the at least one driver circuit carrier (TT) to the at least one control circuit carrier (ST); - wherein at least one of the power connection rails (HS, LS, PS) has at least one first recess (AS) projecting through the power connection rail (HS, LS, PS), wherein the at least one first contact connection (V1) is guided from the third component level (E3) through the at least one first recess (AS) to the second component level (E2).

5. Inverter (IV) according to one of the preceding claims, wherein the power module group (LG) is arranged in a spatial region which extends from the first component level (E1) in the perpendicular direction (SR) to the third component level (E3) and is at least partially surrounded by the driver circuit group (TG).

6. Inverter (IV) according to one of the preceding claims, further comprising - at least one second electrical contact connection (V2) which electrically connects the at least one power module (LM) to the at least one driver circuit carrier (TT); - wherein the at least one second contact connection (V2) is led from the first component level (E1) to the second component level (E2).

7. Inverter (IV) according to claim 6, wherein - the at least one driver circuit carrier (TT) has at least one second recess projecting through the at least one driver circuit carrier (TT); - wherein the at least one second contact connection (V2) is guided from the first component level (E1) through the at least one second recess to the second component level (E2).

8. Inverter (IV) according to one of the preceding claims, further comprising - a cooler (KL) for cooling the inverter, which is arranged in a fifth component level (E5) of the inverter; wherein the fifth component level (E5) lies on a side of the first component level (E1) facing away from the second component level (E2).

9. Inverter (IV) according to one of the preceding claims, further comprising - a capacitor module (KD) arranged in a sixth component level (E6) of the inverter; - wherein the sixth component level (E6) lies on a side of the fifth component level (E5) facing away from the first component level (E1).

10. Inverter (IV) according to claim 9 and one of claims 2 to 4, wherein the positive voltage side (HS) and the negative voltage side (LS) current connection rails are guided from the fourth component level (E4) through the second (E2), the first (E1) and the fifth (E5) component level to the sixth component level (E6) and are electrically contacted with the capacitor module (KD).

11. Inverter (IV) according to one of the preceding claims, wherein the aforementioned component levels (E1, E2, E3, E4, E5, E6) are sandwiched between each other.

12. Inverter (IV) according to one of the preceding claims, wherein the power module group (LG) and the driver circuit group (TG) do not overlap each other when viewed in the perpendicular direction (SR).

13. Inverter (IV) according to one of the preceding claims, wherein the at least one driver circuit carrier (TT) is adjacent to the at least one power module (LM).

14. Inverter (IV) according to one of the preceding claims, which further comprises a support frame (TR) to which the aforementioned groups (LG, TG, SG, AG) and / or the cooler (KL) and / or the capacitor module (KD) are fastened.

15. Inverter (IV) according to one of the preceding claims, which further comprises at least one sensor (SS) for measuring a parameter on one of the power connection rails (HS, NS, PS), which sensor is arranged on the at least a control circuit carrier (ST) is arranged and extends from the at least one control circuit carrier (ST) to the power connection rail (HS, NS, PS).

16. Inverter (IV) according to claim 15, wherein, - the at least one sensor (SS) is designed as a current sensor for measuring a current flowing through the current connection rail (HS, NS, PS) and has at least one toroidal core (RK), - wherein the at least one toroidal core (RK) is arranged on the at least one control circuit carrier (ST) and surrounds the at least one phase current connection rail (PS).

17. Electric drive device, comprising: - an electric motor with at least three phase current input connections, - an inverter (IV) according to one of the preceding claims, which further has at least three phase current output terminals and is electrically connected to the at least three phase current input terminals of the electric motor via the at least three phase current output terminals.

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