Electronic device including housing having oxide layer, and manufacturing method therefor

Abstract

An electronic device according to an embodiment may comprise a housing that at least partially forms the appearance of the electronic device. The housing may include: a part made of metal; a first oxide layer that is made of an oxide of the metal and formed on the part; and a second oxide layer that is made of an oxide of the metal and formed on the first oxide layer. The surface of the second oxide layer exposed to the outside of the electronic device may be formed in a first shape. The interface between the part and the first oxide layer may be formed in a second shape different from the first shape. The second shape may include a plurality of concave-convex features.

Description

Electronic device including a housing having an oxide layer formed thereon and a method for manufacturing the same

[0001] The following descriptions relate to an electronic device including a housing having an oxide layer formed thereon and a method for manufacturing the same.

[0002] Electronic devices, such as smartphones, may include a housing that protects the internal components and forms the device's exterior. Typically, the housing material may be plastic, metal, or a combination of these. However, untreated metal surfaces of the housing can wear, corrode, and deteriorate over time. To mitigate these issues, surface treatments such as anodizing, deposition, or electroplating can be applied to the metal material.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device according to one embodiment may include a housing that at least partially forms an exterior of the electronic device. The housing may include a portion formed of metal, a first oxide layer of the metal formed on the portion, and a second oxide layer of the metal formed on the first oxide layer. A surface of the second oxide layer, which is exposed to the exterior of the electronic device, may be formed in a first shape. An interface between the first oxide layer and the portion may be formed in a second shape different from the first shape. The second shape may include a plurality of protruding and recessed features.

[0005] The method for manufacturing the electronic device according to one embodiment may include a step of forming the second oxide layer on the surface of the portion of the housing by anodizing under a first condition, and a step of forming the first oxide layer between the portion and the second oxide layer and forming the interface of the second shape by anodizing under a second condition different from the first condition after the formation of the second oxide layer. The shape of the surface of the portion may be substantially the same as the first shape.

[0006] In one embodiment, the method for manufacturing the electronic device may include the steps of forming the second oxide layer on the surface of the portion of the housing by anodizing under a first condition, forming the third oxide layer between the portion and the second oxide layer by anodizing under a second condition different from the first condition after forming the second oxide layer, and forming the first oxide layer between the portion and the third oxide layer and forming the interface of the second shape by anodizing under a third condition different from the first condition and the second condition after forming the third oxide layer (for example, the step). The shape of the surface of the portion may be substantially the same as the first shape. The first condition, the second condition, and the third condition may include an electrolyte including an organic acid and not including an inorganic acid. Voltages of the first condition, the second condition, and the third condition may be different from each other.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0008] FIG. 2A is a diagram illustrating an exemplary electronic device according to one embodiment.

[0009] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment.

[0010] FIG. 3A is a cross-sectional view showing an exemplary housing according to one embodiment.

[0011] FIG. 3b is a scanning electron microscope image (SEM image) showing a cross-section of an exemplary housing according to one embodiment.

[0012] FIG. 4 is a cross-sectional view showing an exemplary housing according to one embodiment.

[0013] Figure 5 is a graph showing the relative brightness of gray under various conditions.

[0014] Figure 6a is an enlarged image of the surface of the housing of the comparative example.

[0015] Figure 6b is an enlarged image of the surface of a housing according to one embodiment.

[0016] Figure 7 is an exemplary flowchart showing a method for manufacturing a housing according to one embodiment.

[0017] FIG. 8a is an exemplary flowchart of the anodizing step of FIG. 7, according to one embodiment.

[0018] FIG. 8b is an exemplary flowchart of the anodizing step of FIG. 7, according to one embodiment.

[0019] FIG. 1 is a block diagram of an electronic device (1001) within a network environment (1000) according to various embodiments. Referring to FIG. 1, in the network environment (1000), the electronic device (1001) may communicate with the electronic device (1002) via a first network (1098) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (1004) or the server (1008) via a second network (1099) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (1001) may communicate with the electronic device (1004) via the server (1008). According to one embodiment, the electronic device (1001) may include a processor (1020), a memory (1030), an input module (1050), an audio output module (1055), a display module (1060), an audio module (1070), a sensor module (1076), an interface (1077), a connection terminal (1078), a haptic module (1079), a camera module (1080), a power management module (1088), a battery (1089), a communication module (1090), a subscriber identification module (1096), or an antenna module (1097). In some embodiments, the electronic device (1001) may omit at least one of these components (e.g., the connection terminal (1078)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1076), camera module (1080), or antenna module (1097)) may be integrated into one component (e.g., display module (1060)).

[0020] The processor (1020) may control at least one other component (e.g., hardware or software component) of the electronic device (1001) connected to the processor (1020) by executing, for example, software (e.g., program (1040)), and may perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1020) may store commands or data received from other components (e.g., sensor module (1076) or communication module (1090)) in volatile memory (1032), process the commands or data stored in volatile memory (1032), and store result data in non-volatile memory (1034). According to one embodiment, the processor (1020) may include a main processor (1021) (e.g., a central processing unit or an application processor) or an auxiliary processor (1023) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1021). For example, when the electronic device (1001) includes the main processor (1021) and the auxiliary processor (1023), the auxiliary processor (1023) may be configured to use less power than the main processor (1021) or to be specialized for a given function. The auxiliary processor (1023) may be implemented separately from the main processor (1021) or as a part thereof.

[0021] The auxiliary processor (1023) may control at least a portion of functions or states associated with at least one component (e.g., the display module (1060), the sensor module (1076), or the communication module (1090)) of the electronic device (1001), for example, on behalf of the main processor (1021) while the main processor (1021) is in an inactive (e.g., sleep) state, or together with the main processor (1021) while the main processor (1021) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1023) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1080) or a communication module (1090)). In one embodiment, the auxiliary processor (1023) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1001) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1008)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0022] The memory (1030) can store various data used by at least one component (e.g., the processor (1020) or the sensor module (1076)) of the electronic device (1001). The data can include, for example, software (e.g., the program (1040)) and input data or output data for commands related thereto. The memory (1030) can include volatile memory (1032) or non-volatile memory (1034).

[0023] The program (1040) may be stored as software in memory (1030) and may include, for example, an operating system (1042), middleware (1044), or an application (1046).

[0024] The input module (1050) can receive commands or data to be used in a component of the electronic device (1001) (e.g., a processor (1020)) from an external source (e.g., a user) of the electronic device (1001). The input module (1050) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0025] The audio output module (1055) can output audio signals to the outside of the electronic device (1001). The audio output module (1055) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0026] The display module (1060) can visually provide information to an external party (e.g., a user) of the electronic device (1001). The display module (1060) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (1060) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0027] The audio module (1070) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (1070) can acquire sound through the input module (1050), output sound through the sound output module (1055), or an external electronic device (e.g., electronic device (1002)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1001).

[0028] The sensor module (1076) can detect the operating status (e.g., power or temperature) of the electronic device (1001) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1076) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0029] The interface (1077) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1001) to an external electronic device (e.g., the electronic device (1002)). In one embodiment, the interface (1077) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0030] The connection terminal (1078) may include a connector through which the electronic device (1001) may be physically connected to an external electronic device (e.g., the electronic device (1002)). According to one embodiment, the connection terminal (1078) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0031] The haptic module (1079) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1079) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0032] The camera module (1080) can capture still images and videos. According to one embodiment, the camera module (1080) may include one or more lenses, image sensors, image signal processors, or flashes.

[0033] The power management module (1088) can manage power supplied to the electronic device (1001). According to one embodiment, the power management module (1088) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0034] A battery (1089) may power at least one component of the electronic device (1001). In one embodiment, the battery (1089) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0035] The communication module (1090) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1001) and an external electronic device (e.g., electronic device (1002), electronic device (1004), or server (1008)), and the performance of communication through the established communication channel. The communication module (1090) may operate independently from the processor (1020) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1090) may include a wireless communication module (1092) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1094) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, a corresponding communication module may communicate with an external electronic device (1004) via a first network (1098) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (1099) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1092) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1096) to verify or authenticate the electronic device (1001) within a communication network such as the first network (1098) or the second network (1099).

[0036] The wireless communication module (1092) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1092) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1092) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1092) may support various requirements specified in the electronic device (1001), an external electronic device (e.g., the electronic device (1004)), or a network system (e.g., the second network (1099)). According to one embodiment, the wireless communication module (1092) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0037] The antenna module (1097) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (1097) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1097) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1098) or the second network (1099), may be selected from the plurality of antennas by, for example, the communication module (1090). A signal or power may be transmitted or received between the communication module (1090) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1097).

[0038] According to various embodiments, the antenna module (1097) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0039] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0040] According to one embodiment, commands or data may be transmitted or received between the electronic device (1001) and an external electronic device (1004) via a server (1008) connected to a second network (1099). Each of the external electronic devices (1002 or 1004) may be the same or a different type of device as the electronic device (1001). According to one embodiment, all or part of the operations executed in the electronic device (1001) may be executed in one or more of the external electronic devices (1002, 1004, or 1008). For example, when the electronic device (1001) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1001) may, instead of or in addition to executing the function or service on its own, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1001). The electronic device (1001) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1001) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (1004) may include an Internet of Things (IoT) device. The server (1008) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (1004) or server (1008) may be included in the second network (1099). The electronic device (1001) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0041] FIG. 2A is a diagram illustrating an exemplary electronic device according to an embodiment. Referring to FIG. 2A, an electronic device (100) according to an embodiment may include a housing (110) forming an exterior of the electronic device (100). For example, the housing (110) may include a first side (or front side) (100A), a second side (or back side) (100B), and a third side (or side surface) (100C) surrounding a space between the first side (100A) and the second side (100B). In an embodiment, the housing (110) may also refer to a structure forming at least a portion of the first side (100A), the second side (100B), and / or the third side (100C).

[0042] An electronic device (100) according to one embodiment may include a substantially transparent front plate (102). In one embodiment, the front plate (102) may form at least a portion of the first surface (100A). In one embodiment, the front plate (102) may include, but is not limited to, a glass plate or a polymer plate including various coating layers, for example.

[0043] An electronic device (100) according to one embodiment may include a substantially opaque back plate (111). In one embodiment, the back plate (111) may form at least a portion of the second surface (100B). In one embodiment, the back plate (111) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0044] An electronic device (100) according to one embodiment may include a side bezel structure (e.g., a side member or bracket) (118). In one embodiment, the side bezel structure (118) may be combined with a front plate (102) and / or a rear plate (111) to form at least a portion of a third side (100C) of the electronic device (100). For example, the side bezel structure (118) may form the entire third side (100C) of the electronic device (100), or, for another example, the side bezel structure (118) may form the third side (100C) of the electronic device (100) together with the front plate (102) and / or the rear plate (111).

[0045] Unlike the illustrated embodiment, when the third side (100C) of the electronic device (100) is partially formed by the front plate (102) and / or the rear plate (111), the front plate (102) and / or the rear plate (111) may include a portion extending from its edge and curved toward the rear plate (111) and / or the front plate (102). The extending portion of the front plate (102) and / or the rear plate (111) may be positioned at both ends of a long edge of the electronic device (100), for example, but is not limited to the above-described example.

[0046] In one embodiment, the side bezel structure (118) may include a metal and / or a polymer. In one embodiment, the back plate (111) and the side bezel structure (118) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (111) and the side bezel structure (118) may be formed as separate components and / or may include different materials.

[0047] In one embodiment, the electronic device (100) may include a display (101), an audio module (103, 104, 107), a sensor module (not shown), a camera module (105, 112, 113), a key input device (117), a light emitting element (not shown), and a connector hole (108). In one embodiment, the electronic device (100) may omit at least one of the above components (e.g., the key input device (117) or the light emitting element (not shown)), or may additionally include other components.

[0048] In one embodiment, the display (101) (e.g., the display module (1060) of FIG. 1) may be visually exposed through a substantial portion of the front plate (102). For example, at least a portion of the display (101) may be visible through the front plate (102) forming the first surface (100A). The display (101) may be disposed on the back surface of the front plate (102).

[0049] In one embodiment, in order to expand the area to which the display (101) is visually exposed, the outer shape of the display (101) may be formed to be substantially the same as the outer shape of the front plate (102) adjacent to the display (101). In one embodiment, the gap between the outer shape of the display (101) and the outer shape of the front plate (102) may be formed to be substantially the same.

[0050] In one embodiment, the display (101) (or the first surface (100A) of the electronic device (100)) may include a screen display area (101A). In one embodiment, the display (101) may provide visual information to a user through the screen display area (101A). In the illustrated embodiment, when the first surface (100A) is viewed from the front, the screen display area (101A) is depicted as being positioned on the inside of the first surface (100A) and spaced apart from the outer edge of the first surface (100A), but is not limited thereto. For example, when the first surface (100A) is viewed from the front, at least a portion of an edge of the screen display area (101A) may substantially coincide with an edge of the first surface (100A) (or the front plate (102)).

[0051] In one embodiment, the screen display area (101A) may include a sensing area (101B) configured to acquire a user's biometric information. Here, the meaning of "the screen display area (101A) includes the sensing area (101B)" may be understood to mean that at least a portion of the sensing area (101B) may overlap the screen display area (101A). For example, the sensing area (101B) may refer to an area that, like other areas of the screen display area (101A), can display visual information by the display (101) and additionally acquire the user's biometric information (e.g., a fingerprint). Although the sensing area (101B) is illustrated as being formed within the screen display area (101A), it is not limited thereto. For example, the sensing area (101B) may also be formed in the key input device (117).

[0052] In one embodiment, the display (101) may include an area where a first camera module (105) (e.g., camera module (1080) of FIG. 1) is positioned. For example, an opening may be formed in the area of ​​the display (101), and the first camera module (105) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (100A). In this case, the screen display area (101A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (105) (e.g., an under display camera (UDC)) may be positioned under the display (101) so as to overlap the area of ​​the display (101). In this case, the display (101) can provide visual information to the user through the above area, and additionally, the first camera module (105) can obtain an image corresponding to the direction toward the first surface (100A) through the above area of ​​the display (101).

[0053] In one embodiment, the display (101) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0054] In one embodiment, the audio module (103, 104, 107) (e.g., audio module (1070) of FIG. 1) may include a microphone hole (103, 104) and a speaker hole (107).

[0055] In one embodiment, the microphone holes (103, 104) may include a first microphone hole (103) formed in a portion of the third surface (100C) and a second microphone hole (104) formed in a portion of the second surface (100B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (103, 104). The microphone may include a plurality of microphones to detect the direction of the sound, but is not limited thereto.

[0056] In one embodiment, the second microphone hole (104) formed in a portion of the second surface (100B) may be positioned adjacent to the camera module (105, 112, 113). For example, the second microphone hole (104) may acquire sound according to the operation of the camera module (105, 112, 113). However, the present invention is not limited thereto.

[0057] In one embodiment, the speaker hole (107) may include an external speaker hole (107) and a call receiver hole (not shown). The external speaker hole (107) may be formed in a part of the third surface (100C) of the electronic device (100). In one embodiment, the external speaker hole (107) may be integrated into the microphone hole (103), and the speaker hole (107) and the microphone hole (103) may be implemented as a single hole. Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (100C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (107) on the third surface (100C). For example, based on the city of FIG. 2A, the external speaker hole (107) may be formed on the third surface (100C) corresponding to the lower portion of the electronic device (100), and the call receiver hole may be formed on the third surface (100C) corresponding to the upper portion of the electronic device (100). However, this is not limited thereto, and in other embodiments, the call receiver hole may be formed at a location other than the third surface (100C). For example, the call receiver hole may be formed by a spaced space between the front plate (102) (or, display (101)) and the side bezel structure (118).

[0058] In one embodiment, the electronic device (100) may include at least one speaker (not shown) (e.g., an audio output module (1055) of FIG. 1) configured to output sound to the outside of the housing (110) through an external speaker hole (107) and / or a call receiver hole (not shown).

[0059] In one embodiment, a sensor module (not shown) (e.g., sensor module (1076) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0060] In one embodiment, a camera module (105, 112, 113) (e.g., camera module (1080) of FIG. 1) may include a first camera module (105) arranged to face a first side (100A) of the electronic device (100), a second camera module (112) arranged to face a second side (100B), and a flash (113).

[0061] In one embodiment, the second camera module (112) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (112) is not necessarily limited to including multiple cameras and may include one camera.

[0062] In one embodiment, the first camera module (105) and the second camera module (112) may include one or more lenses, image sensors, and / or image signal processors.

[0063] In one embodiment, the flash (113) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (100).

[0064] In one embodiment, a key input device (117) (e.g., input module (1050) of FIG. 1) may be disposed on a third side (100C) of the electronic device (100). In one embodiment, the electronic device (100) may not include some or all of the key input devices (117), and the key input devices (117) that are not included may be implemented in another form, such as a soft key, on the display (101).

[0065] In one embodiment, a connector hole (108) may be formed on the third side (100C) of the electronic device (100) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (1078) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (108). The electronic device (100) according to one embodiment may include an interface module (e.g., an interface (1077) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0066] In one embodiment, the electronic device (100) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (100A) of the housing (110). The light-emitting element (not shown) may provide status information of the electronic device (100) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (105). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0067] FIG. 2B is an exploded perspective view of an exemplary electronic device according to an embodiment. In the following, duplicate descriptions of components having the same reference numerals as those described above may be omitted. Referring to FIG. 2B , an electronic device (100) according to an embodiment may include a frame structure (140), a first printed circuit board (150), a second printed circuit board (152), a cover plate (160), and a battery (170).

[0068] In one embodiment, a frame structure (140) (e.g., a side bezel structure (118) of FIG. 2A) may be positioned between a display (101) and a rear plate (111). In one embodiment, the frame structure (140) may support or accommodate components included in the electronic device (100). For example, a display (101) may be disposed on one side of the frame structure (140) facing one direction (e.g., a +Z direction). A first printed circuit board (150), a second printed circuit board (152), a battery (170), and a second camera module (112) may be disposed on the other side of the frame structure (140) facing the opposite direction (e.g., a -Z direction). The first printed circuit board (150), the second printed circuit board (152), the battery (170), and the second camera module (112) can be placed within a recess formed in the frame structure (140).

[0069] In one embodiment, the frame structure (140) may include a first part (141) and a second part (142) surrounding the first part (141). The first part (141) may be positioned below the display (101) (e.g., in the -Z direction) to support the display (101). Alternatively, the first part (141) may support the display (101) together with the second part (142). The second part (142) may surround a space between the back plate (111) and the front plate (102) (and / or the display (101)). The second part (142) surrounding the space may form a side surface of the electronic device (100) (e.g., the third surface (100C) of FIG. 2A), and the first part (141) positioned within the space may extend inwardly from the second part (142). The above side may extend from the front surface of the electronic device (100) (e.g., the first surface (100A) of FIG. 2A) or the perimeter of the front plate (102). In one embodiment, the first part (141) and the second part (142) may be formed of metal and / or polymer.

[0070] In one embodiment, the first printed circuit board (150), the second printed circuit board (152), and the battery (170) may be respectively coupled to the frame structure (140). For example, the first printed circuit board (150) and the second printed circuit board (152) may be fixedly disposed to the frame structure (140) through a coupling member such as a screw. For example, the battery (170) may be fixedly disposed to the frame structure (140) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0071] In one embodiment, the cover plate (160) may be disposed between the first printed circuit board (150) and the back plate (111). In one embodiment, the cover plate (160) may be disposed on the first printed circuit board (150). For example, the cover plate (160) may be disposed on a surface of the first printed circuit board (150) facing the -Z direction.

[0072] In one embodiment, the cover plate (160) may at least partially overlap the first printed circuit board (150) with respect to the Z-axis. In one embodiment, the cover plate (160) may cover at least a portion of the first printed circuit board (150). In this way, the cover plate (160) may protect the first printed circuit board (150) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (150).

[0073] In one embodiment, the cover plate (160) may be fixedly positioned on the first printed circuit board (150) via a joining member (e.g., a screw), or may be joined to the frame structure (140) together with the first printed circuit board (150) via the joining member.

[0074] In one embodiment, the display (101) may be disposed between a frame structure (140) and a front plate (102). For example, the front plate (102) may be disposed on one side (e.g., in the +Z direction) of the display (101), and the frame structure (140) may be disposed on the other side (e.g., in the -Z direction).

[0075] In one embodiment, the front plate (102) may be coupled with the display (101). For example, the display (101) may be attached to the back surface of the front plate (102) via an optically clear adhesive (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)).

[0076] In one embodiment, the front plate (102) may be coupled with a frame structure (140). For example, the front plate (102) may include an outer portion extending outside the display (101) when viewed in the Z-axis direction. The frame structure (140) (e.g., the second part (142)) may be attached to the outer portion, but is not limited thereto.

[0077] In one embodiment, the first printed circuit board (150) and / or the second printed circuit board (152) may be equipped with a processor (e.g., the processor (1020) of FIG. 1), a memory (e.g., the memory (1030) of FIG. 1), and / or an interface (e.g., the interface (1077) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (100) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (150) and the second printed circuit board (152) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0078] In one embodiment, a battery (170) (e.g., battery (1089) of FIG. 1) may power at least one component of the electronic device (100). For example, the battery (170) may include a rechargeable secondary battery or a fuel cell.

[0079] An electronic device (100) according to one embodiment may include an antenna module (not shown) (e.g., antenna module (1097) of FIG. 1). In one embodiment, the antenna module may be disposed between the rear plate (111) and the battery (170). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0080] In one embodiment, a first camera module (105) (e.g., a front camera) may be disposed in at least a portion of a frame structure (140) (e.g., a first part (141)) such that the lens can receive external light through a portion of the front plate (102) (e.g., the camera area (137)) (e.g., the front (100A) of FIG. 2A).

[0081] In one embodiment, a second camera module (112) (e.g., a rear camera) may be disposed between the frame structure (140) and the rear plate (111). In one embodiment, the second camera module (112) may be electrically connected to the first printed circuit board (150) via a connecting member (e.g., a connector). In one embodiment, the second camera module (112) may be disposed such that the lens can receive external light through the camera area (184) of the rear plate (111) of the electronic device (100).

[0082] In one embodiment, the camera area (184) may be formed on a surface of the rear plate (111) (e.g., the rear surface (100B) of FIG. 2A). In one embodiment, the camera area (184) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (112). In one embodiment, at least a portion of the camera area (184) may protrude from the surface of the rear plate (111) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (184) may form a plane substantially coextensive with the surface of the rear plate (111).

[0083] In one embodiment, the housing (110) of the electronic device (100) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (100). In this respect, at least a portion of the front plate (102), the frame structure (140), and / or the rear plate (111) that form the exterior of the electronic device (100) may be referred to as the housing (110) of the electronic device (100).

[0084] In FIGS. 2A and 2B , a portable communication device (e.g., a smart phone) is illustrated as an example of an electronic device, but is not limited thereto. For example, the electronic device may include various forms of electronic devices. For example, the electronic device may include a smart ring, a smart watch, a head-mounted display device (HMD), other wearable devices, a notebook PC, a tablet, a camera, or home appliances. The housing (110) may form the exterior of various forms of such electronic devices.

[0085] FIG. 3A is a cross-sectional view illustrating an exemplary housing according to one embodiment. FIG. 3B is a scanning electron microscope (SEM) image illustrating a cross-section of an exemplary housing according to one embodiment.

[0086] Referring to FIGS. 3A and 3B, a housing (110) according to one embodiment may include a portion (1), a first layer (10), and a second layer (20). In one embodiment, the portion (1) may be formed of metal. The portion (1) of the housing (110) may be, for example, a portion formed of metal of a frame structure (140, FIG. 2B). For example, the portion (1) may be a portion formed of metal of a first part (141, FIG. 2B) or a second part (142, FIG. 2B). As another example, the portion (1) may be a portion formed of metal of a rear plate (111, FIG. 2B).

[0087] In one embodiment, the portion (1) may be formed of a metal capable of anodizing. As a non-limiting example, the portion (1) may include aluminum, magnesium, titanium, alloys thereof, and / or combinations thereof. In one embodiment, the portion (1) may be referred to as a parent material or a metal part of the housing (110).

[0088] In one embodiment, the first layer (10) may be formed on the portion (1), and the second layer (20) may be formed on the first layer (10). In one embodiment, the first layer (10) and the second layer (20) may be formed of an oxide of the metal forming the portion (1). For example, when the portion (1) is formed of aluminum, the first layer (10) and the second layer (20) may be formed of aluminum oxide. The first layer (10) and the second layer (20) may each be referred to as an oxide layer, an anodic oxide layer, an oxide film, an anodic film, an oxide coating, or a passivation layer.

[0089] In one embodiment, the first layer (10) and the second layer (20) are formed on the portion (1), thereby protecting the portion (1) from the external environment. For example, the first layer (10) and the second layer (20) can improve the corrosion resistance and wear resistance of the housing (110) by preventing the portion (1) formed of metal from being exposed to the outside.

[0090] In one embodiment, the surface (25) of the second layer (20) may be exposed to the exterior of the housing (110). For example, the surface (25) of the second layer (20) may be exposed to the exterior of the electronic device (100, FIG. 2A). The surface (25) of the second layer (20) may form a portion of an exterior of the electronic device (e.g., a front side (100A, FIG. 2A), a side side (100C, FIG. 2A), or a back side (100B, FIG. 2A)).

[0091] In one embodiment, the surface properties of the surface (25) of the second layer (20) may be different from the surface properties of the interface (5) between the portion (1) and the first layer (10). For example, the morphological properties or topographical properties of the surface (25) and the interface (5) may be different from each other. For example, the roughness of the interface (5) may be greater than the roughness of the surface (25). For example, the arithmetic mean roughness of the interface (5) may be greater than the arithmetic mean roughness of the surface (25). For example, the waviness of the interface (5) may be greater than the waviness of the surface (25). For example, the shape of the interface (5) may be different from the shape of the surface (25). For example, based on the illustrated cross-sectional shape, the interface (5) may include an uneven surface. For example, the interface (5) may include a plurality of concavo-convex features. For example, the interface (5) may include bumps (or ridges) and pits between the bumps. The bumps and the pits may be formed irregularly. For example, the height and width of each of the bumps and pits of the interface (5) may be formed arbitrarily. In contrast, the surface (25) may include an even surface based on the cross-sectional shape illustrated. For example, the surface (25) may be formed to be flat. Here, being flat may mean that the surface (25) is flat from a microscopic perspective. That is, the surface (25) may be curved from a macroscopic perspective (but is not limited to a curved surface), but the microstructure of the surface (25) may be a flat surface. For example, the surface (25) may include a smooth surface.For example, the surface (25) may be substantially free of irregular features such as flaws or uneven features. The smoothness of the surface (25) may be greater than that of the interface (5). The irregular features of the interface (5) may increase the amount of diffuse reflection of light, thereby causing the housing (110) to have a color in the gray spectrum. In addition, the smooth surface (25) may increase the amount of specular reflection of light, thereby improving the glossiness of the housing (110).

[0092] In one embodiment, the surface properties of the interface (15) of the first layer (10) and the second layer (20) may be different from the surface properties of the interface (5). For example, the morphological or topographical properties of the interface (15) and the interface (5) may be different from each other. For example, the roughness of the interface (5) may be greater than the roughness of the interface (15). For example, the arithmetic mean roughness of the interface (5) may be greater than the arithmetic mean roughness of the interface (15). For example, the waviness of the interface (5) may be greater than the waviness of the interface (15). For example, the shape of the interface (5) may be different from the shape of the interface (15). For example, unlike the interface (5) which includes a rough shape, the interface (15) may include a smooth surface, which is substantially the same as or similar to the surface (25). The smoothness of the interface (15) may be higher than that of the interface (5).

[0093] In one embodiment, the thickness of the second layer (20) may be greater than the thickness of the first layer (10), but is not limited thereto. For example, unlike the city, the thickness of the second layer (20) may be substantially the same as the thickness of the first layer (10), or may be less than the thickness of the first layer (10).

[0094] Although not shown, each of the first layer (10) and the second layer (20) may include pores. In one embodiment, the diameter of the pores of the first layer (10) may be smaller than the diameter of the pores of the second layer (20). For example, the average diameter of the pores of the first layer (10) may be smaller than the average diameter of the pores of the second layer (20). As shown in FIG. 3b, the first layer (10) and the second layer (20) may have different colors in the SEM image. This may be because the sizes of the pores of the first layer (10) and the pores of the second layer (20) are different from each other.

[0095] A method for manufacturing a housing (110) including a first layer (10) and a second layer (20) formed on a portion (1) will be described later with reference to FIGS. 7 and 8a.

[0096] FIG. 4 is a cross-sectional view illustrating an exemplary housing according to one embodiment. Referring to FIG. 4, the housing (110) according to one embodiment may include a first layer (12) formed on a portion (1), a second layer (22) formed on the first layer (12), and a third layer (32) formed on the second layer (22).

[0097] In one embodiment, the first layer (12), the second layer (22), and the third layer (32) may be formed of an oxide of a metal forming the portion (1). In one embodiment, the first layer (12), the second layer (22), and the third layer (32) may protect the portion (1) from the external environment by preventing the portion (1) from being exposed to the outside. The first layer (12), the second layer (22), and the third layer (32) may each be referred to as an oxide layer, an anodic oxide layer, an oxide film, an anodic film, an oxide coating, or a passivation layer.

[0098] In one embodiment, the description of the surface (25) of the second layer (20) of FIG. 3A and the interface (5) between the first layer (10) and the portion (1) may be substantially identical to the description of the surface (37) of the third layer (32) and the interface (7) between the first layer (12) and the portion (1). For example, the surface (37) of the third layer (32) may be exposed to the outside of the housing (110) and may form a part of the exterior of the electronic device. For example, the surface characteristics of the surface (37) of the third layer (32) may be different from the surface characteristics of the interface (7). For example, the roughness and waviness of the interface (7) may be greater than the roughness of the surface (37). For example, the surface shape of the interface (7) may be different from the surface shape of the surface (37). For example, the interface (7) may be an uneven surface formed with irregular bumps and pits, and the surface (37) may be a substantially smooth surface without steps or uneven features. The irregular shape of the interface (7) may increase the amount of diffuse reflection of light, thereby causing the housing (110) to appear gray. In addition, the smooth surface (37) may increase the amount of specular reflection of light, thereby improving the glossiness of the housing (110).

[0099] In one embodiment, the surface shape of the interface (17) between the first layer (12) and the second layer (22) may be substantially the same as or similar to the surface shape of the interface (7). For example, the interface (17) may include a rough surface formed by bumps and pits between the bumps. The bumps and pits of the interface (17) may be formed irregularly. The degree of irregularity in the shape of the interface (17) may be less than that of the interface (7), but is not limited thereto.

[0100] In one embodiment, the surface shape of the interface (27) between the second layer (22) and the third layer (32) may be substantially the same as the surface (37) of the third layer (32). For example, the description of the interface (15) of FIG. 3A may be applied to the interface (27) in a substantially identical or corresponding manner. For example, the interface (27) may be formed as a substantially smooth surface. However, the present invention is not limited to the above-described example, and the interface (27) may have a surface shape that is substantially the same as or similar to the interface (17). For example, the interface (27) may include a plurality of uneven features.

[0101] Although not shown, each of the first layer (12), the second layer (22), and the third layer (32) may include pores. In one embodiment, the diameter of the pores of the first layer (12) may be smaller than the diameter of the pores of the second layer (22), and the diameter of the pores of the second layer (22) may be smaller than the diameter of the pores of the third layer (32). For example, the average diameter of the pores of the first layer (12) may be smaller than the average diameter of the pores of the second layer (22), and the average diameter of the pores of the second layer (22) may be smaller than the average diameter of the pores of the third layer (32).

[0102] In one embodiment, the thickness of the second layer (22) may be greater than the thickness of the first layer (12), but is not limited thereto. For example, unlike the illustration, the thickness of the second layer (22) may be substantially the same as the thickness of the first layer (12), or may be less than the thickness of the first layer (12).

[0103] In one embodiment, the thickness of the third layer (32) may be greater than, but is not limited to, the thickness of the second layer (22). For example, unlike the city, the thickness of the third layer (32) may be substantially the same as, or less than, the thickness of the second layer (22).

[0104] In one embodiment, the thickness of the third layer (32) may be greater than the thickness of the first layer (12), but is not limited thereto. For example, unlike the city, the thickness of the third layer (32) may be substantially the same as the thickness of the first layer (12), or may be less than the thickness of the first layer (12).

[0105] A method for manufacturing a housing (110) including a first layer (12), a second layer (22), and a third layer (32) formed on a portion (1) will be described later with reference to FIGS. 7 and 8b.

[0106] Figure 5 is a graph showing the relative brightness of gray under various conditions. The brightness (L*) in Figure 5 is a relative brightness value from 0 to 100 according to the CIE color space, where 0 is black and 100 is white (or reference white). For example, black with L*=0 can be the color of an object that absorbs and does not reflect all incident light. For example, white with L*=100 can be the color of an object that uniformly reflects all incident light from a specific light source (e.g., incandescent lamp or daylight) in all directions.

[0107] Fig. 6a is an enlarged image of the surface of the housing of the comparative example. Fig. 6b is an enlarged image of the surface of the housing according to one embodiment. Fig. 6b may be an image representing the surface (25) of Fig. 3a or the surface (37) of Fig. 4.

[0108] In one embodiment, the layers (10, 20) of FIG. 3A and the layers (12, 22, 32) of FIG. 4 may be formed by an anodizing process. By forming an oxide film on the metal surface through the anodizing process, not only can the metal be protected, but also various colors can be realized. Methods for realizing such colors include, for example, a dye coloring method and an electrolytic coloring method. The electrolytic coloring method is a method of adsorbing a metal into the pores of the oxide film, and since the applicable metals are limited, the range of colors that can be realized is limited. The dye coloring method injects a dye into the pores of the oxide film, and therefore, the colors that can be realized may be limited depending on the size of the dye particles. For example, white dye particles are difficult to adsorb into the pores because they are larger than the size of the pores, and it may also be difficult to expand the pores to the size of the particles. Accordingly, it may be difficult to realize a white anodizing film, and it may also be difficult to realize a high-brightness gray mixed with white. Alternatively, a method of changing the composition of the metal alloy or performing a heat treatment on the metal may be applied to implement an opaque color or a color similar to white. However, since the metal (e.g., part (1)) used in the housing (110) of the electronic device must satisfy not only the appearance of the device but also other physical properties such as strength, corrosion resistance, and wear resistance of the device, it may be difficult to easily change the composition of the material of the housing (110). Alternatively, a method of adsorbing a salt or oxide into the pores of an oxide film to implement such a color exists, but the salt or oxide thus adsorbed is adsorbed in an unstable state at the top of the pores, making it difficult to implement a uniform color and difficult to satisfy the characteristics of wear resistance and corrosion resistance.

[0109] According to one embodiment, the housing (110) may have a high brightness color (e.g., gray). For example, even if a separate coloring process is not performed on the housing (110), a high brightness color may be implemented. For example, referring to FIG. 5, which shows the relative brightness of gray according to various conditions, the brightness (L*) of the anodized material colored using the first dye (A), the second dye (B), and the third dye (C) may be less than 45. In other words, it may be difficult to implement a gray color with a brightness (L*) of 45 or more by the dye coloring method. In contrast, the housing (D) of the electronic device according to one embodiment may implement a gray color only by the oxidation layers, even without using a separate coloring dye, and may also implement a color with a brightness (L*) of about 45 or more.

[0110] Gloss is a significant factor affecting the quality of a device's appearance, in addition to color. Typically, to achieve a glossy surface, the surface of a base material (e.g., part (1)) is polished and then anodized. This is because polishing increases the amount of light reflected, thereby increasing the gloss of the base material surface, and the oxide film is formed along the surface shape of the base material. However, pores and defects within the oxide film can increase the amount of diffuse reflection, which can reduce the gloss. In other words, even if the gloss is increased through surface treatment of the base material, the gloss may be reduced by the anodizing process. For example, the gloss of a polished base material surface is approximately 1690 GU (gloss units), but after the anodizing process, the gloss may decrease to approximately 790 GU. This phenomenon is more likely to occur under sulfuric acid bath conditions. Sulfuric acid is widely used as an electrolyte in anodizing processes because it is inexpensive, has superior solubility compared to other electrolytes, and is easy to manage. However, the oxide film formed using a sulfuric acid bath has a porous structure containing a relatively large number of micropores, making it difficult to maintain the gloss of the base material. As an alternative method to maintain the gloss of the base material, a metal layer can be directly coated on the base material, rather than an oxide film. The metal layer can be formed, for example, through vapor deposition or plating. However, galvanic corrosion can occur due to the potential difference between the base material (metal) and the metal layer.

[0111] The housing (110) according to one embodiment may have high gloss. For example, high gloss may be achieved even without performing a separate polishing process on the housing (110). This may be because the number of grain boundaries and black spots on the surface of the housing (110) is relatively small. For example, comparing FIG. 6A, which shows a surface image of a comparative embodiment, with FIG. 6B, which shows a surface image according to one embodiment, the area of ​​grain boundaries and the number and area of ​​black spots formed on the surface of the housing (110) according to one embodiment may be relatively small. Specifically, the number of black spots according to one embodiment is 1,485, and the number of black spots in the comparative embodiment is 2,177, so the number of black spots according to one embodiment may be reduced by about 1.4 times compared to the comparative embodiment. In addition, the area ratio of black spots to the reference area of ​​the surface according to one embodiment (black spot area / reference area) may be 1% or less (e.g., about 0.63%), and the area ratio of black spots to the reference area of ​​the surface of the comparative embodiment may be about 3.36%, so that the black spot area of ​​the surface according to one embodiment may be significantly reduced compared to the comparative embodiment. Since grain boundaries have a more fragile structure than other parts, and black spots are parts where impurities of the base material are etched, the grain boundaries and black spots may reduce gloss. The housing (110) according to one embodiment may improve gloss by minimizing grain boundaries and black spots. For example, based on a product having the same color, the gloss of the housing (110) according to one embodiment in which grain boundaries and black spots are reduced may be about 1300 GU, and the gloss of the comparative embodiment may be about 790 GU. The gloss of the housing (110) according to one embodiment may be a gloss level similar to that of a polished base material (e.g., about 1690 GU).

[0112] As described above, the housing (110) according to one embodiment can not only realize a high-brightness gray color and high gloss without performing a separate surface treatment (e.g., coloring or polishing), but also satisfy general characteristics required for an oxide layer (e.g., vibration test, salt spray test).

[0113] However, the above description does not limit the housing (110) to not undergoing a coloring process and a polishing process. For example, the housing (110) may have a high-brightness gray color even without a coloring process. However, if a coloring process is additionally performed, the brightness of the color resulting from the coloring process may be further improved. Furthermore, if a polishing process is additionally performed on the housing (110), the gloss of the housing (110) may be further improved.

[0114] Fig. 7 is an exemplary flowchart illustrating a method for manufacturing a housing according to one embodiment. Figs. 8a and 8b are exemplary flowcharts of an anodizing step (705) of Fig. 7 according to one embodiment. Fig. 8a may illustrate steps for forming a first layer (10) and a second layer (20) on a portion (1) of Fig. 3a. Fig. 8b may illustrate steps for forming a first layer (12), a second layer (22), and a third layer (32) on a portion (1) of Fig. 4.

[0115] Referring to FIG. 7, along with FIG. 3a and FIG. 4, a method for manufacturing a housing may include performing a pretreatment step (700), an anodizing step (705), and a post-treatment step (710) in sequence.

[0116] In the preprocessing step (700), a polishing process may be performed to remove bumps on the surface of the portion (1) of the housing (110) and improve the flatness of the surface. The polishing process may include mechanical polishing, chemical polishing, or electrolytic polishing. Afterwards, a washing process may be performed to remove contaminants on the portion (1). Optionally, the polishing process may be omitted.

[0117] In the anodizing step (705), the housing (110) may be immersed in an electrolyte and then a voltage may be applied to form an oxide layer. The applied voltage may electrolyze ions in the electrolyte, and the portion (1) of the housing (110) may react with oxygen ions in the electrolyte. Accordingly, a metal oxide layer of the portion (1) may be formed. In one embodiment, the electrolyte may include an organic acid. The organic acid in the electrolyte may include only one type of organic acid, or may include different types of organic acids. For example, the organic acid may include oxalic acid, but is not limited thereto. The concentration of the organic acid may be about 1 wt% (weight%) to about 15 wt%. The applied voltage may be about 5 V to about 50 V. The processing time may be about 30 minutes to about 150 minutes. In one embodiment, the electrolyte of the anodizing step (705) may not include sulfuric acid. In one embodiment, the electrolyte of the anodizing step (705) may not include an inorganic acid.

[0118] In the post-processing step (710), the pores of the oxide layer formed in the anodizing step (705) can be sealed. The sealing process may use, but is not limited to, a metal salt, an organic substance, or water.

[0119] Additionally or optionally, after the anodizing step (705) and before the post-treatment step (710), a process of coloring the porous structure of the oxide layer with a dye or metal may be performed to implement a specific color.

[0120] Referring to FIG. 3a and FIG. 8a below, detailed steps of the anodizing step (705) are described.

[0121] Referring to FIGS. 3A and 8A, a second layer may be formed under a first condition in step (800a). For example, by anodizing under the first condition, a second layer (20) may be formed on the surface of the portion (1). The first condition may include a voltage of a first specified duration and a first specified magnitude. For example, in step (800a), a voltage of the first specified magnitude may be applied for the first specified duration. The shape of the surface of the portion (1) on which the second layer (20) is formed may be substantially the same as the shape of the surface (25) of the second layer (20). The second layer (20) may be formed to have the same shape as the surface of the portion (1) before step (800a) is performed. The second layer (20) may grow in a direction from the surface (25) toward the interface (15). Since the first layer (10) has not yet been formed, the interface (15) in step (800a) may be an interface between the second layer (20) and the portion (1). The shape of the interface (15) may be substantially the same as the shape of the surface of the portion (1). For example, the interface (15) may be formed to be the same as the flat shape of the surface of the portion (1).

[0122] Thereafter, in step (805a), the first layer and the interface shape between the first layer and the base material can be formed under a second condition. For example, by anodizing under a second condition, the first layer (10) can be formed and the interface (5) shape between the first layer (10) and the portion (1) can be formed. The second condition can include a second specified period and a voltage of a second specified magnitude. For example, in step (805a), the voltage of the second specified magnitude can be applied during the second specified period. The second condition can be different from the first condition. For example, the voltage of the second specified magnitude can be different from the voltage of the first specified magnitude. For example, the voltage of the second specified magnitude can be smaller than the voltage of the first specified magnitude. For example, the second specified period can be different from the first specified period. For example, the second specified period may be shorter than the first specified period, but is not limited thereto. For example, the second specified period may be longer than or equal to the first specified period. The time conditions may vary depending on the required thickness of each of the first layer (10) and the second layer (20).

[0123] The first layer (10) can grow in a direction from the interface (15) toward the interface (5). In one embodiment, by anodizing under a second condition different from the first condition, a shape of the interface (5) including an uneven feature can be formed. As the anodizing process conditions change, the sizes of pores formed in the first layer (10) and the second layer (20) can change. Accordingly, an irregular shape of the interface (5) can be formed. Since the irregular interface (5) increases the amount of diffuse reflection of light, a high-brightness gray color can be implemented. The brightness of the implemented color can change depending on the difference between the first voltage of the specified size and the second voltage of the specified size.

[0124] Before the first layer (10) is formed, the surface of the portion (1) may be flat, like the shape of the surface (25) of the second layer (20). As the first layer (10) is formed, a bumpy feature may be formed on the surface of the portion (1). In a comparative example, the bumpy shape of the interface (5) may be formed through a physical or chemical treatment before the anodizing process. However, since the oxide layer grows along the surface shape of the parent material, the surface (25) of the second layer (20) may also have a bumpy shape like the interface (5). An uneven surface (25) of the second layer (20) may deteriorate the surface texture and gloss. The degree of irregularity of the bumps and pits of the interface (5) formed in step (805a) according to one embodiment may be higher than in the comparative example in which a rough surface is formed before the anodizing process. The bumps and pits of the interface (5) formed in step (805a) according to one embodiment may be formed more finely than in the comparative embodiment in which a rough surface is formed before the anodizing process. In one embodiment, without a separate surface treatment, the interface (5) between the portion (1) and the first layer (10) may be formed as an uneven surface including irregularities, and the surface (25) of the second layer (20) may be formed as an even surface.

[0125] The electrolytes of the first condition and the second condition may be the same. For example, the first condition and the second condition may include an electrolyte containing an organic acid. The electrolytes of the first condition and the second condition may not include sulfuric acid. The electrolytes of the first condition and the second condition may not include an inorganic acid. A sulfuric acid electrolyte can form an oxide layer quickly and easily because it has better solubility than other acid solutions. However, a sulfuric acid electrolyte can accelerate defects in the material and significantly reduce the gloss. In one embodiment, defects in the material can be minimized by using an electrolyte containing an organic acid and not sulfuric acid. When an organic acid is used as the electrolyte, the applied voltage can be increased to increase the growth rate of the oxide layer. However, a high voltage can damage a joint between a portion (1) of the housing (110) formed of metal and a non-metallic portion (e.g., an injection-molded plastic) or a thin metal portion. The steps according to one embodiment can be performed under different conditions to minimize damage to the joint of the metal-formed housing (110) portion (1) and the non-metallic portion or the thin metal portion while using an organic acid as an electrolyte.

[0126] Referring to FIG. 4 and FIG. 8b below, detailed steps of the anodizing step (705) are described.

[0127] Referring to FIGS. 4 and 8b, a third layer may be formed under a first condition in step (800b). For example, by anodizing under the first condition, a third layer (32) may be formed on the surface of the portion (1). The first condition may include a first designated period and a voltage of a first designated magnitude. For example, in step (800b), a voltage of the first designated magnitude may be applied for the first designated period. The shape of the surface of the portion (1) on which the third layer (32) is formed may be substantially the same as the shape of the surface (37) of the third layer (32). The third layer (32) may be formed to have the same shape as the surface of the portion (1) before step (800b) is performed. The third layer (32) may grow in a direction from the surface (37) toward the interface (27). Since the second layer (22) has not yet been formed, the interface (27) in step (800b) may be an interface between the third layer (32) and the portion (1). The interface (27) may have a shape substantially identical to the shape of the surface of the portion (1). For example, the interface (27) may be formed to have a flat shape identical to the shape of the surface of the portion (1).

[0128] Thereafter, in step (805b), a second layer may be formed under a second condition. For example, by anodizing under the second condition, a second layer (22) may be formed between the third layer (32) and the portion (1). The second condition may include a second specified period and a voltage of a second specified magnitude. For example, in step (805b), the voltage of the second specified magnitude may be applied for the second specified period. The second condition may be different from the first condition. For example, the voltage of the second specified magnitude may be different from the voltage of the first specified magnitude. For example, the voltage of the second specified magnitude may be less than the voltage of the first specified magnitude. For example, the second specified period may be different from the first specified period. For example, the second specified period may be shorter than the first specified period, but is not limited thereto. For example, the second specified period may be longer than or equal to the first specified period. Depending on the thickness of each of the required third layer (32) and second layer (22), the time conditions may vary.

[0129] The second layer (22) can grow in the direction from the interface (27) toward the interface (17). Since the first layer (12) has not yet been formed, the interface (17) may be the interface between the second layer (22) and the portion (1). In one embodiment, by anodizing under a second condition different from the first condition, a shape of the interface (17) including a rough feature can be formed. As the anodizing process conditions change, the sizes of pores formed in the third layer (32) and the second layer (22) may change. Accordingly, an irregular shape of the interface (17) may be formed. Before the second layer (22) is formed, the surface of the portion (1) may be flat, like the shape of the surface (37) of the third layer (32). As the second layer (22) is formed, irregularities may be formed on the surface of the portion (1).

[0130] Thereafter, in step (810b), the first layer and the interface shape between the first layer and the base material can be formed under the third condition. For example, by anodizing under the third condition, the first layer (12) can be formed and the interface (7) shape between the first layer (12) and the portion (1) can be formed. In one embodiment, the third condition can include a third specified period and a voltage of a third specified magnitude. For example, in step (810b), the voltage of the third specified magnitude can be applied during the third specified period.

[0131] In one embodiment, the third condition may be different from the first condition. For example, the voltage of the third specified magnitude may be different from the voltage of the first specified magnitude. For example, the voltage of the third specified magnitude may be less than the voltage of the first specified magnitude. For example, the third specified period may be different from the first specified period. For example, the third specified period may be shorter than the first specified period, but is not limited thereto. For example, the third specified period may be longer than or equal to the first specified period. The time conditions may vary depending on the required thicknesses of each of the first layer (12) and the third layer (32).

[0132] In one embodiment, the third condition may be different from the second condition. For example, the voltage of the third specified magnitude may be different from the voltage of the second specified magnitude. For example, the voltage of the third specified magnitude may be less than the voltage of the second specified magnitude. For example, the third specified period may be different from the second specified period. For example, the third specified period may be shorter than the second specified period, but is not limited thereto. For example, the third specified period may be longer than or equal to the second specified period. The time conditions may vary depending on the required thickness of each of the first layer (12) and the second layer (22).

[0133] The first layer (12) can grow in a direction from the interface (17) toward the interface (7). In one embodiment, by anodizing under third conditions different from the second conditions, a shape of the interface (7) including uneven features can be formed. As the anodizing process conditions change, the sizes of pores formed in the second layer (22) and the first layer (12) can change. Accordingly, an irregular shape of the interface (7) can be formed. The degree of irregularity of the shape of the interface (7) can be greater than that of the interface (17), but is not limited thereto.

[0134] In one embodiment, the electrolytes of the first condition, the second condition, and the third condition may be the same. For example, the first condition, the second condition, and the third condition may include an electrolyte containing an organic acid. The electrolytes of the first condition, the second condition, and the third condition may not include sulfuric acid. The electrolytes of the first condition, the second condition, and the third condition may not include an inorganic acid.

[0135] An electronic device according to one embodiment (e.g., electronic device (100, FIG. 2A)) may include a housing (e.g., housing (110, FIG. 2A)) that at least partially forms an exterior of the electronic device. The housing may include a portion formed of metal (e.g., portion (1, FIG. 3a) or portion (1, FIG. 4), a first oxide layer of the metal formed on the portion (e.g., first layer (10, FIG. 3a) or first layer (12, FIG. 4)), and a second oxide layer of the metal formed on the first oxide layer (e.g., second layer (20, FIG. 3a) or third layer (32, FIG. 4)). A surface of the second oxide layer (e.g., surface (25, FIG. 3a) or surface (37, FIG. 4)) exposed to the outside of the electronic device may be formed in a first shape. An interface between the first oxide layer and the portion (e.g., interface (5, FIG. 3a) or interface (7, FIG. 4)) may be formed in a second shape different from the first shape. The second shape may include a plurality of uneven features. Through this, the color implemented in the housing Brightness and gloss can be improved.

[0136] In one embodiment, the first shape may be formed flat. This may improve the glossiness of the housing.

[0137] In one embodiment, the interface (e.g., interface (15, FIG. 3a)) between the first oxide layer and the second oxide layer can be formed flat.

[0138] In one embodiment, the housing may include a third oxide layer of the metal (e.g., second layer (22, FIG. 4)) formed between the first oxide layer and the second oxide layer.

[0139] In one embodiment, the interface (e.g., interface (27, FIG. 4)) between the second oxide layer and the third oxide layer can be formed flat.

[0140] In one embodiment, the interface between the first oxide layer and the third oxide layer (e.g., interface (17, FIG. 4)) may include a plurality of concavo-convex features.

[0141] In one embodiment, the ratio of the area of ​​the black spots on the surface of the second oxide layer to the area of ​​the surface of the second oxide layer may be 1% or less.

[0142] In one embodiment, the surface of the second oxide layer may have a color in a gray spectrum. The color may have a relative brightness value of 45 or greater on a scale from 0 (black) to 100 (white).

[0143] In one embodiment, the average diameter of the pores formed in the first oxide layer may be smaller than the average diameter of the pores formed in the second oxide layer.

[0144] In one embodiment, the electronic device may include a front plate (e.g., front plate (102, FIG. 2B)) that at least partially forms a front surface (e.g., front surface (100A, FIG. 2A)) of the electronic device, and a display (e.g., display (101, FIG. 2B)) attached to a back surface of the front plate. The housing may include a first part (e.g., first part (141, FIG. 2B)) that supports the display, and a second part (e.g., second part (142, FIG. 2B)) that surrounds the first part and forms a side surface (e.g., side surface (100C, FIG. 2A)) of the electronic device that extends from a perimeter of the front plate. The second part may include the portion formed of the metal.

[0145] In one embodiment, the thickness of the second oxide layer may be thicker than the thickness of the first oxide layer.

[0146] The method for manufacturing the electronic device according to one embodiment may include a step of forming the second oxide layer on the surface of the portion of the housing by anodizing under a first condition (e.g., step (800a, FIG. 8a)), and a step of forming the first oxide layer between the portion and the second oxide layer and forming the interface of the second shape by anodizing under a second condition different from the first condition after the formation of the second oxide layer (e.g., step (805a, FIG. 8a)). The shape of the surface of the portion may be substantially the same as the first shape.

[0147] In one embodiment, the first condition and the second condition may include an electrolyte comprising an organic acid.

[0148] In one embodiment, the concentration of the organic acid in the electrolyte may be 1 wt% to 15 wt%.

[0149] In one embodiment, the electrolyte may not contain sulfuric acid.

[0150] In one embodiment, the electrolyte may not contain an inorganic acid.

[0151] In one embodiment, the first condition may include a first designated duration, and the second condition may include a second designated duration that is shorter than the first designated duration.

[0152] In one embodiment, the first condition may include a voltage of a first specified magnitude, and the second condition may include a voltage of a second specified magnitude that is different from the first specified magnitude.

[0153] In one embodiment, the second specified size may be smaller than the first specified size.

[0154] In one embodiment, the method for manufacturing the electronic device may include a step of forming the second oxide layer on the surface of the portion of the housing by anodizing under a first condition (e.g., step (800b, FIG. 8b)), a step of forming the third oxide layer between the portion and the second oxide layer by anodizing under a second condition different from the first condition after forming the second oxide layer (e.g., step (805b, FIG. 8b)), and a step of forming the first oxide layer between the portion and the third oxide layer and forming the interface of the second shape by anodizing under a third condition different from the first condition and the second condition after forming the third oxide layer (e.g., step (810b, FIG. 8b)). The shape of the surface of the portion may be substantially the same as the first shape. The first condition, the second condition, and the third condition may include an electrolyte containing an organic acid and not containing an inorganic acid. The voltages of the first condition, the second condition, and the third condition may be different from each other.

[0155] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0156] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0157] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0158] Various embodiments of the present document may be implemented as software (e.g., a program (1040)) including one or more instructions stored in a storage medium (e.g., an internal memory (1036) or an external memory (1038)) readable by a machine (e.g., an electronic device (1001)). For example, a processor (e.g., a processor (1020)) of the machine (e.g., an electronic device (1001)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0159] According to one embodiment, the method according to the various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0160] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, comprising a housing at least partially forming the exterior of said electronic device; The above housing: A part formed of metal; a first oxide layer of the metal formed on the above portion; and comprising a second oxide layer of the metal formed on the first oxide layer; The surface of the second oxide layer, which is exposed to the outside of the electronic device, is formed in a first shape, The interface between the first oxide layer and the part is formed in a second shape different from the first shape, The second shape includes a plurality of uneven features. Electronic devices.

2. In claim 1, The above first shape is formed flat, Electronic devices.

3. In claim 1 or claim 2, The interface between the first oxide layer and the second oxide layer is formed flat. Electronic devices.

4. In claim 1 or claim 2, The housing comprises a third oxide layer of the metal formed between the first oxide layer and the second oxide layer. Electronic devices.

5. In claim 4, The interface between the second oxide layer and the third oxide layer is formed flat. Electronic devices.

6. In claim 4 or claim 5, The interface between the first oxide layer and the third oxide layer includes a plurality of rough features. Electronic devices.

7. In any one of claims 1 to 6, The ratio of the area of ​​the black spot on the surface of the second oxide layer to the area of ​​the surface of the second oxide layer is 1% or less, Electronic devices.

8. In any one of claims 1 to 7, The surface of the second oxide layer has a color in the gray spectrum, The above color has a relative brightness value of 45 or greater on a scale from 0 (black) to 100 (white). Electronic devices.

9. In any one of claims 1 to 8, The average diameter of the pores formed in the first oxide layer is smaller than the average diameter of the pores formed in the second oxide layer. Electronic devices.

10. In any one of claims 1 to 9, A front plate at least partially forming the front surface of said electronic device; Including a display attached to the back surface of the above front plate, The above housing, A first part supporting the above display; and A second part surrounding the first part and forming a side surface of the electronic device extending from the perimeter of the front plate, The second part comprises the part formed of the metal. Electronic devices.

11. In any one of claims 1 to 10, The thickness of the second oxide layer is thicker than the thickness of the first oxide layer. Electronic devices.

12. In a method for manufacturing the electronic device according to any one of claims 1 to 11, a step of forming the second oxide layer on the surface of the part of the housing by anodizing under the first condition; and After the formation of the second oxide layer, a step of forming the first oxide layer between the part and the second oxide layer and forming the interface of the second shape is included by anodizing under a second condition different from the first condition. The shape of the surface of the above part is substantially the same as the first shape. Manufacturing method.

13. In claim 12, The electrolyte of the above first condition and the above second condition does not contain an inorganic acid, Manufacturing method.

14. In claim 12 or claim 13, The above first condition includes the first specified period, The second condition includes a second specified period that is shorter than the first specified period. Manufacturing method.

15. In any one of claims 12 to 14, The first condition above includes a voltage of a first specified size, The second condition includes a voltage of a second specified size different from the first specified size. Manufacturing method.

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