Foldable device having digitizer

Abstract

An electronic device according to various embodiments disclosed herein may comprise: a first housing; a second housing rotatably connected to the first housing; a display panel disposed across the first housing and the second housing; and a digitizer plate disposed below the display panel and including wires of a digitizer. The digitizer plate may include: a first plate region disposed in the first housing; a second plate region disposed in the second housing; and a pattern region formed between the first plate region and the second plate region and including a plurality of openings. The first plate region and the second plate region of the digitizer plate are composed of a plurality of layers including a first layer and a second layer, in which the wires of the digitizer are formed, and at least one additional layer. An additional wire electrically connected to the wires of the digitizer formed in the first layer and / or the second layer may be formed in the at least one additional layer of the first plate region and / or the second plate region.

Description

Foldable device containing a digitizer

[0001] This article relates to electronic devices, for example, foldable devices including foldable displays.

[0002] Portable electronic devices (hereinafter, "electronic devices"), such as smartphones, can provide diverse user experiences through various applications. While users demand larger screens when providing applications or multimedia content on electronic devices, portability is also a critical factor, and thus, increasing display size is limited. Therefore, electronic devices with various form factors that allow for variable display areas are being developed. Foldable devices can be fully foldable and unfoldable, including flexible displays.

[0003] An electronic device may include a digitizer for detecting touch input using a user's finger or stylus. The digitizer may include a plurality of wires for detecting and transmitting signals corresponding to the touch input.

[0004] Because foldable devices are designed to fold at the center, digitizer wiring design presents challenges. For example, if digitizer wiring is not placed at the joints of the two folding housings, separate connectors for the digitizer driver ICs may be required, and / or connections may be made via a separate FPCB. This increases the thickness of the electronic device and complicates its structure.

[0005] An electronic device according to this disclosure (or specification, invention) may include a first housing, a second housing rotatably connected to the first housing, a display panel arranged across the first housing and the second housing, and a digitizer plate arranged below the display panel and including wires of a digitizer.

[0006] According to one embodiment, the digitizer plate may include a first plate area disposed in the first housing, a second plate area disposed in the second housing, and a pattern area formed between the first plate area and the second plate area and including a plurality of openings.

[0007] According to one embodiment, the first plate area and the second plate area of ​​the digitizer plate are composed of a plurality of layers including a first layer and a second layer in which wirings of the digitizer are formed, and at least one additional layer, and additional wiring that is electrically connected to the wirings of the digitizer formed in the first layer and / or the second layer can be formed in the at least one additional layer of the first plate area and / or the second plate area.

[0008] An electronic device according to various embodiments of the present document includes a flexible display including a first housing, a second housing, and a hinge housing connected to the first housing and the second housing, and a support plate disposed on the foldable housing and disposed between the display panel and the foldable housing, wherein the support plate includes a first region corresponding to the first housing, a second region corresponding to the second housing, and a folding region corresponding to the hinge housing, and includes a pattern for bending the folding region, and the support plate includes wires for detecting an electronic pen, and at least two wires among the wires disposed in different layers of the folding region of the support plate can extend in parallel in a first direction through the folding region.

[0009] According to various embodiments of this document, the thickness of a foldable device can be reduced by configuring the wiring of a digitizer to pass through openings formed at the connection portion of two housings. Furthermore, the resistance of the digitizer wiring can be reduced by utilizing additional wiring connected to the wiring of the digitizer, thereby improving touch detection performance.

[0010] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0011] FIGS. 2a, 2b, 2c and 2d illustrate electronic devices that can be folded left and right according to various embodiments.

[0012] FIG. 2e illustrates an electronic device having multiple folding regions according to various embodiments.

[0013] FIGS. 3a, 3b, 3c, 3d and 3e illustrate electronic devices that can be folded vertically according to various embodiments.

[0014] FIG. 4 illustrates a laminated structure of a display according to one embodiment.

[0015] FIG. 5 illustrates a stacked structure of a digitizer according to one embodiment.

[0016] FIG. 6 illustrates a laminated structure of a display according to one embodiment.

[0017] FIG. 7 illustrates a connector connected to a digitizer driving IC according to one embodiment.

[0018] FIG. 8 illustrates wires passing through a pattern area according to one embodiment.

[0019] FIG. 9 illustrates a laminated structure of a digitizer plate according to one embodiment.

[0020] FIGS. 10A, 10B, and 10C illustrate examples of Y-channel wiring formed on a digitizer plate according to one embodiment.

[0021] FIG. 11 illustrates wiring formed on a second layer and an additional layer in an upper edge area of ​​an electronic device among pattern areas according to one embodiment.

[0022] FIG. 12 illustrates an example of X-channel wiring formed on a digitizer plate according to one embodiment.

[0023] FIGS. 13a, 13b, 13c and 13d illustrate examples of wirings formed in multiple layers of a digitizer plate according to one embodiment.

[0024] Figures 14a, 14b, 14c, 14d, 14e, and 14f illustrate the arrangement structure of additional wirings according to one embodiment.

[0025] Figures 15a and 15b illustrate the placement locations of additional wires according to one embodiment.

[0026] FIGS. 16A, 16B, 16C, and 16D illustrate an electronic device having a horizontally expandable slider structure according to various embodiments.

[0027] FIGS. 17A and 17B illustrate an electronic device having a vertically expandable slider structure according to various embodiments.

[0028] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0029] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0030] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0031] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0032] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0033] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0034] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0035] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0036] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0037] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0038] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0039] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0040] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0041] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0042] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0043] The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0044] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0045] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0046] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0047] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0048] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0049] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0050] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0051] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0052] FIGS. 2a, 2b, 2c and 2d illustrate an electronic device that can be folded left and right according to one embodiment.

[0053] FIGS. 2A and 2B are front and rear views of the unfolded state of the electronic device, and FIGS. 2C and 2D are front and rear views of the folded state of the electronic device. According to one embodiment, the electronic device (200) may include a foldable structure that folds left and right based on a vertical folding axis (A).

[0054] Referring to FIGS. 2A to 2D, the electronic device (200) may include a pair of housings (210, 220) (or foldable housing structure) that are rotatably coupled about a folding axis (A) via a hinge device so as to be foldable with respect to each other, a first display (230) (or flexible display, foldable display, or main display) disposed through the pair of housings (210, 220), and / or a second display (280) (or sub-display) disposed through the second housing (220). According to one embodiment, at least a portion of the hinge device may be disposed so as not to be visible from the outside through the first housing (210) and the second housing (220), and in an unfolded state, may be disposed so as not to be visible from the outside through a hinge housing (290) that covers the foldable portion.

[0055] According to one embodiment, the hinge device may include a gear assembly including a plurality of gears, a hinge module including a plurality of hinge cams that are coupled to hinge shafts that rotate through the gear assembly and perform a cam-linkage operation, and hinge plates that connect the hinge module to the first housing (210) and the second housing (220). In this document, a surface on which the first display (230) is arranged may be defined as a front surface of the electronic device (200), and a surface opposite to the front surface may be defined as a rear surface of the electronic device (200). In addition, a surface surrounding a space between the front surface and the rear surface may be defined as a side surface of the electronic device (200).

[0056] In one embodiment, the pair of housings (210, 220) may include a first housing (210) and a second housing (220) that are foldably arranged relative to each other via a hinge device. In one embodiment, the pair of housings (210, 220) are not limited to the shapes and combinations illustrated in FIGS. 2A to 2D, and may be implemented by other shapes or combinations and / or combinations of parts. In one embodiment, the first housing (210) and the second housing (220) may be arranged on opposite sides with respect to a folding axis (A), and may have an overall symmetrical shape with respect to the folding axis (A). In some embodiments, the first housing (210) and the second housing (220) may be folded asymmetrically with respect to the folding axis (A). According to one embodiment, the angle or distance between the first housing (210) and the second housing (220) may be different depending on whether the electronic device (200) is in an unfolded state, a folded state, or an intermediate state.

[0057] According to one embodiment, the first housing (210) may include a first side member (213) that is connected to the hinge device in the unfolded state of the electronic device (200) and is arranged to face the front of the electronic device (200), a second side member (212) that faces in the opposite direction of the first side member (211), and / or surrounds at least a portion of a first space (2101) between the first side member (211) and the second side member (212). According to one embodiment, the second housing (220) may include a third side (221) that is connected to the hinge device when the electronic device (200) is in an unfolded state and is arranged to face the front of the electronic device (200), a fourth side (222) that faces in an opposite direction to the third side (221), and / or a second side member (223) that surrounds at least a portion of a second space (2201) between the third side (221) and the fourth side (222). According to one embodiment, the first side (211) may face substantially the same direction as the third side (221) when in an unfolded state, and may at least partially face the third side (221) when in a folded state. According to one embodiment, the electronic device (200) may include a recess (201) formed to accommodate a first display (230) through a structural combination of a first housing (210) and a second housing (220). According to one embodiment, the recess (201) may have substantially the same size as the first display (230). According to one embodiment, the first housing (210) may include a first protective frame (213a) that is combined with a first side member (213) when the first display (230) is viewed from above and overlaps an edge of the first display (230), thereby covering the edge of the first display (230) so that it is not visible from the outside. According to one embodiment, the first protective frame (213a) may be formed integrally with the first side member (213).According to one embodiment, the second housing (220) may include a second protective frame (223a) (or second decorative member) that is coupled to the second side member (223) when the first display (230) is viewed from above and overlaps with the edge of the first display (230), thereby covering the edge of the first display (230) so that it is not visible from the outside. According to one embodiment, the second protective frame (223a) may be formed integrally with the second side member (223). In some embodiments, the first protective frame (213a) and the second protective frame (223a) may be omitted.

[0058] According to one embodiment, the hinge housing (290) (or hinge cover) may be disposed between the first housing (210) and the second housing (220) and may be disposed to cover a portion of the hinge device disposed in the hinge housing (290). According to one embodiment, the hinge housing (290) may be covered by portions of the first housing (210) and the second housing (220) or exposed to the outside, depending on the unfolded state, the folded state, or the intermediate state of the electronic device (200). For example, when the electronic device (200) is in the unfolded state, at least a portion of the hinge housing (290) may be covered by the first housing (210) and the second housing (220) and may not be substantially exposed. According to one embodiment, when the electronic device (200) is in a folded state, at least a portion of the hinge housing (290) may be exposed to the outside between the first housing (210) and the second housing (220). According to one embodiment, when the first housing (210) and the second housing (220) are in an intermediate state where they are folded with a certain angle, the hinge housing (290) may be at least partially exposed to the outside of the electronic device (200) between the first housing (210) and the second housing (220). For example, the area where the hinge housing (290) is exposed to the outside may be less than that in a completely folded state. According to one embodiment, the hinge housing (290) may include a curved surface.

[0059] According to one embodiment, when the electronic device (200) is in an unfolded state (e.g., the state of FIGS. 2a and 2b), the first housing (210) and the second housing (220) form an angle of about 180 degrees, and the first region (230a), the second region (230b), and the folding region (230c) of the first display (230) form substantially the same plane and may be arranged to face substantially the same direction (e.g., the z-axis direction). In another embodiment, when the electronic device (200) is in an unfolded state, the first housing (210) may be rotated at an angle of about 360 degrees with respect to the second housing (220) so that the second side (212) and the fourth side (222) face each other and may be folded in the opposite direction (out folding method).

[0060] According to one embodiment, when the electronic device (200) is in a folded state (e.g., the state of FIGS. 2c and 2d), the first surface (211) of the first housing (210) and the third surface (221) of the second housing (220) may be arranged to face each other. In this case, the first region (230a) and the second region (230b) of the first display (230) may be arranged to face each other while forming a narrow angle (e.g., in the range of 0 to about 10 degrees) with each other through the folding region (230c). According to one embodiment, the folding region (230c) may be deformed into a curved shape having at least a certain curvature. According to one embodiment, when the electronic device (200) is in an intermediate state, the first housing (210) and the second housing (220) may be arranged at a certain angle with each other. In this case, the first region (230a) and the second region (230b) of the first display (230) may form an angle that is larger than the folded state and smaller than the unfolded state, and the curvature of the folding region (230c) may be smaller than the folded state and larger than the unfolded state. In some embodiments, the first housing (210) and the second housing (220) may form an angle that can stop at a designated folding angle between the folded state and the unfolded state through a hinge device (free stop function). In some embodiments, the first housing (210) and the second housing (220) may be continuously operated while being pressed in the unfolding direction or the folding direction based on the designated inflection angle through the hinge device.

[0061] According to one embodiment, the electronic device (200) may include at least one of a display (230, 280), an input device (215), an audio output device (227, 228), a sensor module (217a, 217b, 226), a camera module (216a, 216b, 225), a key input device (219), an indicator (not shown), or a connector port (229) disposed in the first housing (210) and / or the second housing (220). In some embodiments, the electronic device (200) may omit at least one of the components or may additionally include at least one other component.

[0062] According to one embodiment, at least one display (230, 280) may include a first display (230) that is arranged to be supported by a third surface (221) of a second housing (220) via a hinge device from a first surface (211) of a first housing (210), and a second display (280) that is arranged to be at least partially visible from the outside through a fourth surface (222) in an interior space of the second housing (220). In some embodiments, the second display (280) may be arranged to be visible from the outside through the second surface (212) in an interior space of the first housing (210). According to one embodiment, the first display (230) may be primarily used in an unfolded state of the electronic device (200), and the second display (280) may be primarily used in a folded state of the electronic device (200). According to one embodiment, the electronic device (200) can control the first display (230) and / or the second display (280) to be usable based on the folding angles of the first housing (210) and the second housing (220) in an intermediate state.

[0063] According to one embodiment, the first display (230) may be placed in a receiving space formed by a pair of housings (210, 220). For example, the first display (230) may be placed in a recess (201) formed by the pair of housings (210, 220), and may be placed to occupy substantially most of the front surface of the electronic device (200) when unfolded. According to one embodiment, the first display (230) may include a flexible display in which at least a portion of the display may be transformed into a flat or curved surface. According to one embodiment, the first display (230) may include a first region (230a) facing the first housing (210) and a second region (230b) facing the second housing (220). According to one embodiment, the first display (230) may include a folding area (230c) including a part of the first region (230a) and a part of the second region (230b) with respect to the folding axis (A). According to one embodiment, at least a part of the folding area (230c) may include a region corresponding to a hinge device. According to one embodiment, the region division of the first display (230) is merely an exemplary physical division by a pair of housings (210, 220) and a hinge device, and substantially, the first display (230) may be displayed as a seamless, full screen through a pair of housings (210, 220) and a hinge device. According to one embodiment, the first region (230a) and the second region (230b) may have an overall symmetrical shape with respect to the folding area (230c) or a partially asymmetrical shape.

[0064] According to one embodiment, the electronic device (200) may include a first rear cover (240) disposed on a second surface (212) of the first housing (210) and a second rear cover (250) disposed on a fourth surface (222) of the second housing (220). In some embodiments, at least a portion of the first rear cover (240) may be formed integrally with the first side member (213). In some embodiments, at least a portion of the second rear cover (250) may be formed integrally with the second side member (223). According to one embodiment, at least one of the first rear cover (240) and the second rear cover (250) may be formed of a substantially transparent plate (e.g., a glass plate including various coating layers, or a polymer plate) or an opaque plate. In one embodiment, the first rear cover (240) may be formed by an opaque plate, such as, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. In one embodiment, the second rear cover (250) may be formed by a substantially transparent plate, such as, for example, glass or polymer. Accordingly, the second display (280) may be arranged so as to be visible from the outside through the second rear cover (250) in the internal space of the second housing (220).

[0065] In one embodiment, the input device (215) may include a microphone. In some embodiments, the input device (215) may include a plurality of microphones arranged to detect the direction of sound. In one embodiment, the audio output device (227, 228) may include speakers. In one embodiment, the input device (215), the audio output device (227, 228), and the connector (229) may be arranged in spaces of the first housing (210) and / or the second housing (220) and may be exposed to the external environment through at least one hole formed in the first housing (210) and / or the second housing (220). In one embodiment, the audio output device (227, 228) may also include a speaker (e.g., a piezo speaker) that operates without the hole formed in the first housing (210) and / or the second housing (220).

[0066] According to one embodiment, the camera modules (216a, 216b, 225) may include a first camera module (216a) disposed on a first surface (211) of the first housing (210), a second camera module (216b) disposed on a second surface (212) of the first housing (210), and / or a third camera module (225) disposed on a fourth surface (222) of the second housing (220). According to one embodiment, the electronic device (200) may include a flash (218) disposed near the second camera module (216b).

[0067] According to one embodiment, the sensor modules (217a, 217b, 226) may generate electrical signals or data values ​​corresponding to the internal operating state of the electronic device (200) or the external environmental state. According to one embodiment, the sensor modules (217a, 217b, 226) may include a first sensor module (217a) disposed on a first surface (211) of the first housing (210), a second sensor module (217b) disposed on a second surface (212) of the first housing (210), and / or a third sensor module (226) disposed on a fourth surface (222) of the second housing (220). According to one embodiment, the sensor module (217a, 217b, 226) may include at least one of a gesture sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a light sensor, an ultrasonic sensor, an iris recognition sensor, or a distance detection sensor (e.g., a time of flight (TOF) sensor or a light detection and ranging (LiDAR) sensor).

[0068] According to one embodiment, the key input device (219) may be positioned to be exposed to the outside through the first side member (213) of the first housing (210). For example, the key input device (219) may also be positioned to be exposed to the outside through the second side member (223) of the second housing (220).

[0069] According to one embodiment, the connector port (229) may include a connector (e.g., a USB connector or an interface connector port module) for transmitting and receiving power and / or data to and from an external electronic device.

[0070] According to one embodiment, at least one of the camera modules (216a, 216b, 225), at least one of the sensor modules (217a, 217b, 226), and / or an indicator may be arranged to be exposed through at least one display (230, 280). For example, at least one of the camera modules (216a, 225), at least one of the sensor modules (217a, 226), and / or an indicator may be arranged to be exposed through at least one display (230, 280). For example, at least one of the camera modules (216a, 225), at least one of the sensor modules (217a, 226), and / or an indicator may be arranged in an interior space of at least one housing, below an active area of ​​at least one display, and may be arranged to be in contact with an external environment through an opening or transparent area perforated up to a cover member (e.g., a window layer (not shown) of the first display (230) and / or a second rear cover (250)). In one embodiment, an area where at least one display (230, 280) and at least one camera module (216a, 225) face each other may be formed as a transparent area having a certain transmittance as part of an area displaying content. In one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. This transparent area may include an area overlapping with an effective area (e.g., a field of view area) of at least one camera module (216a, 225) through which light passes to be imaged by an image sensor to create an image. For example, the transparent area of ​​the display (230, 280) may include an area having a lower pixel density than the surrounding area. For example, the transparent area may replace an opening. For example, at least one camera module (216a, 225) may include an under-display camera (UDC) or an under-panel camera (UPC). In another embodiment, some camera modules or sensor modules (217a, 226) may be arranged to perform their functions without being visually exposed through the display.For example, an area facing a camera module (216a, 225) and / or a sensor module (217a, 226) disposed under a display (230, 280) (e.g., a display panel) may have an under display camera (UDC) structure, so that a perforated opening may not be necessary. According to one embodiment, the pixel density of an area including a UDC may be the same as the pixel density of a surrounding area, and in this case, a driving circuit for driving pixels in the UDC area may be disposed in a surrounding area rather than the UDC area. Accordingly, the transmittance of light input to the camera in the UDC area can be increased.

[0071] FIG. 2e illustrates an electronic device having multiple folding regions according to various embodiments.

[0072] In the following, descriptions of configurations corresponding to those described through FIGS. 2a to 2d will be omitted.

[0073] Referring to FIG. 2e, a flexible display (260) is included, and the flexible display (260) can be arranged across a first housing (251), a second housing (252), and a third housing (253) that are arranged sequentially.

[0074] According to one embodiment, the first housing (251) and the second housing (252) may be foldable or unfoldable relative to each other via the first hinge member (254). For example, the first housing (251) and the second housing (252) may be rotatably coupled about the folding axis B using the first hinge member (254). The second housing (252) and the third housing (253) may be foldable or unfoldable relative to each other via the second hinge member (255). For example, the second housing (252) and the third housing (253) may be rotatably coupled about the folding axis C using the second hinge member (255).

[0075] According to one embodiment, a first folding area (264) may be formed between the first housing (251) and the second housing (252). The first folding area (264) may be formed as a lattice structure including a plurality of openings. The first folding area (264) may provide elasticity by expanding or contracting the size of the openings when the first housing (251) and the second housing (252) are folded or unfolded.

[0076] According to one embodiment, a second folding area (265) may be formed between the second housing (252) and the third housing (253). The second folding area (265) may be formed as a lattice structure including a plurality of openings. The second folding area (265) may provide elasticity by expanding or contracting the size of the openings when the second housing (252) and the third housing (253) are folded or unfolded.

[0077] According to one embodiment, the electronic device (205) can be completely folded in the following order: the third housing (253) is first folded relative to the second housing (252) via the second hinge member (255) between the second housing (252) and the third housing (253), and the first housing (251) is folded relative to the folded second housing (252) and third housing (253) via the first hinge member (254) between the first housing (251) and the second housing (252). To this end, the area of ​​the first folding area (264) can be wider than the area of ​​the second folding area (265). For example, the third display area (263) and the second display area (262) of the flexible display (260) can be folded to face each other primarily through the second hinge member (255), and the first display area (261) of the flexible display (260) and the rear surface of the third housing (253) can be folded to face each other secondarily.

[0078] FIGS. 3a, 3b, 3c, 3d and 3e illustrate electronic devices that can be folded vertically according to various embodiments.

[0079] FIG. 3A is a perspective view of an electronic device in an unfolding state (or flat state), FIG. 3B is a plan view of a front side of the electronic device in an unfolding state, and FIG. 3C is a plan view of a rear side of the electronic device in an unfolding state. FIG. 3D is a perspective view of an electronic device in a folding state, and FIG. 3E is a perspective view of an electronic device in an intermediate state. According to one embodiment, the electronic device (300) may include a foldable structure that folds up and down with respect to a horizontal folding axis (A).

[0080] Referring to FIGS. 3A to 3E, the electronic device (300) may include a pair of housings (310, 320) (e.g., foldable housings) that are rotatably coupled to face each other and foldable with respect to a hinge device. According to one embodiment, the hinge devices may be arranged in the X-axis direction or the Y-axis direction, and two or more may be arranged so as to fold in the same direction or different directions. According to one embodiment, the electronic device (300) may include a flexible display (390) (or foldable display) that is arranged in an area formed by the pair of housings (310, 320).

[0081] According to one embodiment, the first housing (310) and the second housing (320) may be arranged on both sides with respect to the folding axis (axis A) as the center, and may have a shape that is substantially symmetrical with respect to the folding axis (axis A). According to one embodiment, the angle or distance between the first housing (310) and the second housing (320) may vary depending on whether the state of the electronic device (300) is a flat state (or unfolding state), a folding state, or an intermediate state.

[0082] In one embodiment, a pair of housings (310, 320) may include a first housing (310) (or a first housing structure) coupled with a hinge device and a second housing (320) (or a second housing structure) coupled with the hinge device. In one embodiment, the first housing (310) may include, in an unfolded state, a first surface (311) facing a first direction (e.g., a front direction) (z-axis direction) and a second surface (312) facing a second direction (e.g., a rear direction) (-z-axis direction) opposite to the first surface (311). In one embodiment, the second housing (320) may include, in an unfolded state, a third surface (321) facing a first direction (z-axis direction) and a fourth surface (322) facing a second direction (-z-axis direction). According to one embodiment, the electronic device (300) can be operated in such a way that, in an unfolded state, the first surface (311) of the first housing (310) and the third surface (321) of the second housing (320) face substantially the same first direction (z-axis direction), and in a folded state, the first surface (311) and the third surface (321) face each other. According to one embodiment, the electronic device (300) can be operated in such a way that, in an unfolded state, the second surface (312) of the first housing (310) and the fourth surface (322) of the second housing (320) face substantially the same second direction (-z-axis direction), and in a folded state, the second surface (312) and the fourth surface (322) face opposite directions. For example, in the folded state, the second side (312) can face the first direction (z-axis direction), and the fourth side (322) can face the second direction (-z-axis direction).

[0083] According to one embodiment, the first housing (310) may include a first side member (313) that at least partially forms an exterior of the electronic device (300) and a first rear cover (314) that is coupled to the first side member (313) and forms at least a portion of a second side (312) of the electronic device (300). According to one embodiment, the first side member (313) may include a first side surface (313a), a second side surface (313b) that extends from one end of the first side surface (313a), and a third side surface (313c) that extends from the other end of the first side surface (313a). According to one embodiment, the first side member (313) may be formed into a rectangular (e.g., square or rectangular) shape through the first side surface (313a), the second side surface (313b), and the third side surface (313c).

[0084] According to one embodiment, the second housing (320) may include a second side member (323) that at least partially forms an exterior of the electronic device (300) and a second rear cover (324) that is coupled to the second side member (323) and forms at least a portion of a fourth side (322) of the electronic device (300). According to one embodiment, the second side member (323) may include a fourth side (323a), a fifth side (323b) that extends from one end of the fourth side (323a), and a sixth side (323c) that extends from the other end of the fourth side (323a). According to one embodiment, the second side member (323) may be formed into a rectangular shape through the fourth side (323a), the fifth side (323b), and the sixth side (323c).

[0085] According to one embodiment, the pair of housings (310, 320) are not limited to the illustrated shapes and combinations, and may be implemented by other shapes or combinations and / or combinations of parts. For example, the first side member (313) may be formed integrally with the first rear cover (314), and the second side member (323) may be formed integrally with the second rear cover (324).

[0086] According to one embodiment, the electronic device (300), in an unfolded state, the second side (313b) of the first side member (313) and the fifth side (323b) of the second side member (323) can be connected without any gap. According to one embodiment, the electronic device (300), in an unfolded state, the third side (313c) of the first side member (313) and the sixth side (323c) of the second side member (323) can be connected without any gap. According to one embodiment, the electronic device (300), in an unfolded state, can be configured such that the combined length of the second side (313b) and the fifth side (323b) is longer than the length of the first side (313a) and / or the fourth side (323a). In addition, the combined length of the third side (313c) and the sixth side (323c) may be configured to be longer than the length of the first side (313a) and / or the fourth side (323a). According to one embodiment, the electronic device (300) may be configured such that, in the unfolded state, the combined length of the second side (313b) and the fifth side (323b) is shorter than or equal to the length of the first side (313a) and / or the fourth side (323a). In addition, the combined length of the third side (313c) and the sixth side (323c) may be configured to be shorter than or equal to the length of the first side (313a) and / or the fourth side (323a).

[0087] In one embodiment, the first side member (313) and / or the second side member (323) may further include a polymer formed of metal or injected into metal. In one embodiment, the first side member (313) and / or the second side member (323) may also include at least one conductive portion (316 and / or 126) electrically segmented through at least one segment (3161, 3162 and / or 1261, 1262) formed of polymer. In such a case, the at least one conductive portion may be electrically connected to a wireless communication circuit included in the electronic device (300) so as to be used as an antenna operating in at least one designated band (e.g., a legacy band).

[0088] According to one embodiment, the first rear cover (314) and / or the second rear cover (324) may be formed by, for example, at least one or a combination of two of coated or colored glass, ceramic, polymer, or metal (e.g., aluminum, stainless steel (STS), or magnesium).

[0089] According to one embodiment, the flexible display (390) may be arranged to extend from the first side (311) of the first housing (310) across the hinge device to at least a portion of the third side (321) of the second housing (320). For example, the flexible display (390) may include a first region (330a) substantially corresponding to the first side (311), a second region (330b) substantially corresponding to the third side (321), and a third region (330c) (or a bendable region) connecting the first region (330a) and the second region (330b) and corresponding to the hinge device. According to one embodiment, the electronic device (300) may include a first protective cover (315) (or a first protective frame, a first decorative member) coupled along an edge of the first housing (310). According to one embodiment, the electronic device (300) may include a second protective cover (325) (or a second protective frame, a second decorative member) coupled along an edge of the second housing (320). According to one embodiment, the first protective cover (315) and / or the second protective cover (325) may be formed of a metal or polymer material. According to one embodiment, the first protective cover (315) and / or the second protective cover (325) may be used as a decoration member. According to one embodiment, the flexible display (390) may be positioned such that an edge of the first region (330a) is interposed between the first housing (310) and the first protective cover (315).

[0090] According to one embodiment, the flexible display (390) may be positioned such that the edge of the second region (330b) is interposed between the second housing (320) and the second protective cover (325). According to one embodiment, the flexible display (390) may be positioned such that the edge of the flexible display (390) corresponding to the protective cap is protected by a protective cap (335) disposed in an area corresponding to the hinge device. Accordingly, the edge of the flexible display (390) may be substantially protected from the outside. According to one embodiment, the electronic device (300) may include a hinge housing (341) (e.g., a hinge cover) that supports a hinge device and is exposed to the outside when the electronic device (300) is in a folded state and is positioned so as to be invisible from the outside by being introduced into a first space (e.g., an internal space of the first housing (310)) and a second space (e.g., an internal space of the second housing (320)) when the electronic device (300) is in an unfolded state. According to one embodiment, the flexible display (390) may be positioned so as to extend from at least a portion of the second surface (312) to at least a portion of the fourth surface (322). In this case, the electronic device (300) may be folded so that the flexible display (390) may be exposed to the outside (out-folding method).

[0091] According to one embodiment, the electronic device (300) may include a sub-display (331) that is arranged separately from the flexible display (390). According to one embodiment, the sub-display (331) may be arranged to be at least partially exposed on the second side (312) of the first housing (310), so that when in a folded state, it may display status information of the electronic device (300) that replaces the display function of the flexible display (390). According to one embodiment, the sub-display (331) may be arranged to be visible from the outside through at least a portion of the first rear cover (314). According to one embodiment, the sub-display (331) may also be arranged on the fourth side (322) of the second housing (320). In this case, the sub-display (331) may be arranged to be visible from the outside through at least a portion of the second rear cover (324).

[0092] According to one embodiment, the electronic device (300) may include at least one of an input device (e.g., a microphone (303)), an audio output device (e.g., a call receiver (301), a speaker (302)), a sensor module (304), a camera device (e.g., a first camera device (305), a second camera device (308)), a key input device (306), or a connector port (307). In the illustrated embodiment, the input device (e.g., microphone (303)), audio output device (e.g., call receiver (301), speaker (302)), sensor module (304), camera device (e.g., first camera device (305), second camera device (308)), key input device (306) or connector port (307) refers to a hole or shape formed in the first housing (310) or the second housing (320), but may be defined to include an actual electronic component (e.g., input device, audio output device, sensor module or camera device) disposed inside the electronic device (300) and operating through the hole or shape.

[0093] According to one embodiment, the input device may include at least one microphone (303) arranged in the second housing (320). According to one embodiment, the audio output device may include call receivers (301) and speakers (302). According to one embodiment, the audio output device may include a call receiver (301) arranged in the first housing (310) and a speaker (302) arranged in the second housing (320). According to one embodiment, the input device (e.g., microphone (303)), the audio output device (e.g., call receiver (301), speaker (302)), and the connector port (307) may be arranged in a space provided in the first housing (310) and / or the second housing (320) of the electronic device (300) and may be exposed to the external environment through at least one hole formed in the first housing (310) and / or the second housing (320). According to one embodiment, at least one connector port (307) may be used to transmit and receive power and / or data to and from an external electronic device.

[0094] According to one embodiment, the sensor module (304) can generate an electrical signal or data value corresponding to the internal operating state of the electronic device (300) or the external environmental state. The sensor module (304) can detect the external environment, for example, through the first surface (311) of the first housing (310).

[0095] According to one embodiment, the camera devices may include a first camera device (305) (e.g., a front camera device) disposed on a first side (311) of a first housing (310) and a second camera device (308) disposed on a second side (312) of the first housing (310). The electronic device (300) may further include a flash (309) disposed near the second camera device (308).

[0096] According to one embodiment, a key input device (e.g., a key button (306)) may be disposed on a third side (313c) of a first side member (313) of a first housing (310). According to one embodiment, a key input device (e.g., a key button (306)) may also be disposed on at least one of the other side members (313a, 113b) of the first housing (310) and / or the side members (323a, 123b, 123c) of the second housing (320).

[0097] Referring to FIG. 3E, the electronic device (300) may be operated to maintain an intermediate state through a hinge device. In this case, the electronic device (300) may control the flexible display (390) to display different contents on the display area corresponding to the first side (311) and the display area corresponding to the third side (321). According to one embodiment, the electronic device (300) may be operated in a substantially unfolded state (e.g., the unfolded state of FIG. 3A) and / or a substantially folded state (e.g., the folded state of FIG. 3D) based on a certain inflection angle (e.g., the angle between the first housing (310) and the second housing (320) when in the intermediate state) through the hinge device. For example, the electronic device (300) may be operated to transition to an unfolded state (e.g., the unfolded state of FIG. 3a) when a pressure is applied in the unfolding direction (direction B) from a state in which it is unfolded at a certain inflection angle through a hinge device. For example, the electronic device (300) may be operated to transition to a closed state (e.g., the folded state of FIG. 3d) when a pressure is applied in the folding direction (direction C) from a state in which it is unfolded at a certain inflection angle through a hinge device. In one embodiment, the electronic device (300) may be operated to maintain an unfolded state (not shown) at various angles through the hinge device.

[0098] FIG. 4 illustrates a laminated structure of a display according to one embodiment.

[0099] According to one embodiment, the electronic device may be configured with a foldable structure that can be folded left and right based on a vertical folding axis (e.g., the electronic device (200) of FIGS. 2A to 2D) or a foldable structure that can be folded up and down based on a horizontal folding axis (e.g., the electronic device (300) of FIGS. 3A to 3E). The electronic device may include a housing structure including two housings that are rotatably coupled to each other to implement a foldable structure (e.g., the first housing (210) and the second housing (220) of FIGS. 2A to 2D, the first housing (310) and the second housing (320) of FIGS. 3A to 3E) and a flexible display (e.g., the first display (230) of FIGS. 2A to 2D, the flexible display (390) of FIGS. 3A to 3E).

[0100] Referring to FIG. 4, the display (400) (or foldable display, flexible display) may include a window layer (430), a polarizing layer (440), a display panel (450), a first polymer layer (460), a support plate (410), a digitizer (420), and a reinforcing plate (480) that are sequentially stacked in a vertical direction (or z-axis direction). According to one embodiment, some of the illustrated configurations (e.g., the window layer (430), the polarizing layer (440), the display panel (450), the first polymer layer (460)) may be made of a flexible material and may be arranged across the first housing and the second housing of the electronic device, and other configurations (e.g., the support plate (410), the digitizer (420), the reinforcing plate (480)) may be separately arranged to be accommodated in the first housing and the second housing, respectively.

[0101] According to one embodiment, the window layer (430) is exposed to the outside from the front of the electronic device and can protect the display (400) from external impact. The window layer (430) may be made of a glass material (e.g., ultra thin glass (UTG)) or a polymer such as polyethylene terephthalate (PET) or polyimide (PI). According to one embodiment, a protection layer and / or a functional coating layer including a hard coating formed of a transparent polymer (e.g., polyethylene terephthalate (PET)) for protecting the window layer (430) may be formed on the upper portion (e.g., in the +z direction) of the window layer (430).

[0102] According to one embodiment, the display panel (450) may include a plurality of pixels and a wiring structure (e.g., an electrode pattern). The display panel (450) may include, but is not limited to, organic light emitting diodes (OLEDs) that include organic materials.

[0103] According to one embodiment, the polarization layer (440) can selectively transmit light output from a light source of the display panel (450) and vibrating in a certain direction. According to one embodiment, the polarization layer (440) can be disposed between the window layer (430) and the display panel (450), or the polarization layer (440) and the display panel (450) can be formed integrally. According to one embodiment, the electronic device may not include the polarization layer (440), but may include a color filter for outputting light of a predetermined wavelength band on top of the display panel (450) and a BM (black matrix) layer for preventing light leakage.

[0104] According to one embodiment, the first polymer layer (460) is disposed below the display panel (450) and may provide a dark background to ensure visibility of the display panel (450). The first polymer layer (460) may be formed of a buffering material to buffer impact transmitted from the outside to the display panel (450). The first polymer layer (460) may include barrier PI.

[0105] According to one embodiment, the support plate (410) may perform a function of supporting each component (e.g., polarizing layer (440), display panel (450), first polymer layer (460)) disposed on the top. For example, the support plate (410) may be formed of a non-metallic thin-plate material, such as fiber reinforced plastics (FRP) (e.g., carbon fiber reinforced plastics (CFRP) or glass fiber reinforced plastics (GFRP)) having rigid (or inflexible) properties for supporting the display panel (450).

[0106] According to one embodiment, the support plate (410) includes a first support plate area (412) accommodated within a first housing of the electronic device and a second support plate area (414) accommodated within a second housing, wherein the first support plate area (412) and the second support plate area (414) can be maintained in a flat state when the electronic device is folded or unfolded.

[0107] According to one embodiment, a pattern region (415) including a plurality of openings (or recesses, holes) may be formed between the first support plate region (412) and the second support plate region (414). The pattern region (415) may include a lattice structure in which support axes (or ribs, lips) and openings intersect.

[0108] In one embodiment, the first support plate region (412), the second support plate region (424), and the pattern region (415) may refer to respective regions of a support plate (410) that is a single structure. In another embodiment, the first support plate region (412), the second support plate region (424), and the pattern region (415) may be separate structures that are at least partially spaced apart from each other.

[0109] According to one embodiment, the pattern area (415) is positioned corresponding to a bending area (or hinge structure) between the first housing and the second housing, and can provide elasticity by expanding or contracting the size of the opening when the electronic device is folded or unfolded.

[0110] According to one embodiment, the digitizer (420) may include wires for detecting a touch input (or hovering input). For example, the digitizer (420) may include loop-shaped wires formed in a horizontal and vertical direction across the entire area of ​​the display (400). According to one embodiment, the digitizer (420) may include a first digitizer area (422) accommodated within a first housing and a second digitizer area (424) accommodated within a second housing, and the wires arranged in the first digitizer area (422) and the second digitizer area (424) may not be electrically connected to each other. When configured in this manner, the wires of the first digitizer area (422) (or the second digitizer area (424)) can be directly connected to the main PBA (printed circuit board assembly) on which the digitizer driving IC is mounted via a connector, and the wires of the second digitizer area (424) (or the first digitizer area (422)) can be connected to the sub PBA connected to the main PBA via a connector.

[0111] According to one embodiment, a first polymer layer (470) including a pressure sensitive adhesive (PSA) and a thermoplastic polyurethane (TPU) may be disposed between the digitizer (420) and the support plate (410). The second polymer layer (470) may include a first PSA region (472) disposed under at least a portion of a first support plate region (412) of the support plate (410), a second PSA region (474) disposed under at least a portion of a second support plate region (414), and a TPU region (475) disposed under a pattern region (415). In one embodiment, the upper end of the TPU region (475) is attached to the lower end of the pattern region (415) and the lower end of a portion of the first support plate region (412) and the second support plate region (414), and the lower end of the TPU region (475) may be spaced apart from the digitizer (420) located below by a predetermined gap. In one embodiment, the height of the TPU region (475) may be substantially the same as the height of the first PSA region (472) and / or the second PSA region (474), in which case the TPU region (475) may be attached to the upper end of the digitizer (420) without a gap.

[0112] According to one embodiment, a reinforcing plate (480) for supporting the display (400) may be disposed below the digitizer (420). The reinforcing plate (480) includes a first reinforcing plate (482) accommodated within the first housing and a second reinforcing plate (484) accommodated within the second housing, and the first reinforcing plate (482) and the second reinforcing plate (484) are not formed at a bending portion of the electronic device (e.g., below the pattern area (415)), and thus may be separated from each other.

[0113] Each of the layers illustrated in FIG. 4 is not an essential configuration for implementing various embodiments of this document, and some of them may be omitted or replaced with other configurations.

[0114] In the embodiment of FIG. 4, the wiring of the digitizer (420) is not arranged in the folding area of ​​the electronic device, but the digitizer areas (412, 414) are arranged separately within the first housing and the second housing. In this configuration, the touch detection performance in the folding area may be reduced, and since the connector to which the wiring of the digitizer (420) is connected has two lead-out portions, there may be problems with material costs and mounting space.

[0115] FIG. 5 illustrates a stacked structure of a digitizer according to one embodiment.

[0116] FIG. 5 illustrates the laminated structure of the digitizer (420) of the display (400) illustrated in FIG. 4.

[0117] According to one embodiment, the digitizer (420) can detect a touch position based on a change in an electrical signal when a touch input (or hovering input) occurs on the display (400). The digitizer (420) may include wires that cover a substantial entire area of ​​the display (400) to detect the touch position. For example, the digitizer (420) may include X-channel wires that form a loop in a horizontal direction and are sequentially arranged in a vertical direction, and Y-channel wires that form a loop in a vertical direction and are sequentially arranged in a horizontal direction.

[0118] Referring to FIG. 5, the digitizer (420) may include a plurality of layers. According to one embodiment, the digitizer (420) may include a first layer (510) in which X-channel wires are arranged and a second layer (520) in which Y-channel wires are arranged. Since the X-channel wires and the Y-channel wires are arranged in different layers, the X-channel wires and the Y-channel wires may intersect each other in a plane. According to one embodiment, the X-channel wires are not arranged only in the first layer (510) and the Y-channel wires are not arranged only in the second layer (520), and in some areas, the Y-channel wires may be further arranged in the first layer (510) and the X-channel wires may be further arranged in the second layer (520). For example, at the edge portions of the electronic device (e.g., top edge, bottom edge, left edge, right edge), X-channel wires and Y-channel wires may be arranged in a mixed manner in the first layer (510), and / or X-channel wires and Y-channel wires may be arranged in a mixed manner in the second layer (520).

[0119] According to one embodiment, an insulating layer (or polymer layer) (530) may be disposed between the first layer (510) and the second layer (520) to shield noise between the wires of the first layer (510) and the second layer (520). In addition, an insulating layer (540, 550) may be disposed on the top and bottom of the first layer (510) to electrically shield the digitizer (420) and the adjacent components.

[0120] According to the embodiment of FIG. 5, the wirings of the digitizer (420) may be arranged on two layers (510, 520). In this case, the X-channel wiring and the Y-channel wiring may be arranged to cross each other, but if additional wiring is required, there may not be enough space for arrangement. For example, if the wirings of the digitizer (420) are configured to pass through the openings of a pattern area (e.g., the pattern area (415) of FIG. 4), the number of wirings that can pass through is inevitably limited because the size of the opening is limited, and in this case, the two layers (510, 520) alone may not be enough to arrange the wiring in some areas (e.g., near the upper and lower edges of the folding area).

[0121] FIG. 6 illustrates a laminated structure of a display according to one embodiment.

[0122] According to one embodiment, the electronic device may be configured with a foldable structure that can be folded left and right based on a vertical folding axis (e.g., the electronic device (200) of FIGS. 2A to 2D) or a foldable structure that can be folded up and down based on a horizontal folding axis (e.g., the electronic device (300) of FIGS. 3A to 3E). The electronic device may include a housing structure including two housings that are rotatably coupled to each other to implement a foldable structure (e.g., the first housing (210) and the second housing (220) of FIGS. 2A to 2D, the first housing (310) and the second housing (320) of FIGS. 3A to 3E) and a flexible display (e.g., the first display (230) of FIGS. 2A to 2D, the flexible display (390) of FIGS. 3A to 3E).

[0123] Referring to FIG. 6, the display (600) (or foldable display, flexible display) may include a window layer (630), a polarizing layer (640), a display panel (650), a first polymer layer (660), a digitizer plate (610), a second polymer layer (670), and a reinforcing plate (680) that are sequentially stacked in a vertical direction (or z-axis direction). According to one embodiment, some of the illustrated configurations (e.g., the window layer (630), the polarizing layer (640), the display panel (650), the first polymer layer (660), the digitizer plate (610)) may be formed of at least a portion of a flexible material and may be arranged across the first housing and the second housing of the electronic device, and other configurations (e.g., the reinforcing plate (680)) may be arranged separately so as to be accommodated in the first housing and the second housing, respectively.

[0124] Each of the layers illustrated in FIG. 6 is not an essential configuration for implementing various embodiments of this document, and some of them may be omitted or replaced with other configurations.

[0125] According to one embodiment, the window layer (630) is exposed to the outside from the front of the electronic device and can protect the display (600) from external impact. The window layer (630) may be made of a glass material (e.g., ultra thin glass (UTG)) or a polymer such as polyethylene terephthalate (PET) or polyimide (PI). According to one embodiment, a protection layer and / or a functional coating layer including a hard coating formed of a transparent polymer (e.g., polyethylene terephthalate (PET)) for protecting the window layer (630) may be formed on the upper portion (e.g., in the +z direction) of the window layer (630).

[0126] According to one embodiment, the display panel (650) may include a plurality of pixels and a wiring structure (e.g., an electrode pattern). The display panel (650) may include, but is not limited to, organic light emitting diodes (OLEDs) that include organic materials.

[0127] According to one embodiment, the polarization layer (640) can selectively transmit light that is output from a light source of the display panel (650) and vibrates in a certain direction. According to one embodiment, the polarization layer (640) can be disposed between the window layer (630) and the display panel (650), or the polarization layer (640) and the display panel (650) can be formed integrally. According to one embodiment, the electronic device may not include the polarization layer (640), but may include a color filter for outputting light of a predetermined wavelength band on top of the display panel (650) and a BM (black matrix) layer for preventing light leakage.

[0128] According to one embodiment, the first polymer layer (660) is disposed below the display panel (650) and may provide a dark background to ensure visibility of the display panel (650). The first polymer layer (660) may be formed of a buffering material to buffer impact transmitted from the outside to the display panel (650). The first polymer layer (660) may include barrier PI.

[0129] According to one embodiment, the display (600) of the electronic device may include a digitizer plate (610) that integrates a support plate (e.g., the support plate (410) of FIG. 4) and a digitizer (e.g., the digitizer (420) of FIG. 4) into a single layer. That is, the display (600) may place the wiring of the digitizer on a plate for supporting each component (e.g., the polarizing layer (640), the display panel (650), the first polymer layer (660)) that is disposed on the top. Accordingly, compared to the embodiment of FIG. 4, the adhesive layer (e.g., the second polymer layer (470) of FIG. 4) between the support plate and the digitizer is removed, the thickness of the display (600) can be made thinner, and there is a weight saving effect because it is implemented as a single component.

[0130] According to one embodiment, the digitizer plate (610) may be referred to as a support plate, as digitizer wires are formed on a support plate (e.g., the support plate (610) of FIG. 4).

[0131] According to one embodiment, the digitizer plate (610) may be disposed below (e.g., in the -z direction) the display panel (650) and may include a first plate area (612) disposed in a first housing and a second plate area (614) disposed in a second housing. The first plate area (612) and the second plate area (614) may be planar and may be formed of a non-metallic thin-plate material, such as fiber reinforced plastics (FRP) (e.g., carbon fiber reinforced plastics (CFRP) or glass fiber reinforced plastics (GFRP)) having rigid (or inflexible) properties for supporting the display panel (650).

[0132] According to one embodiment, a pattern region (615) corresponding to a folding region of the electronic device may be arranged between the first plate region (612) and the second plate region (614) of the digitizer plate (610). The pattern region (615) may include a lattice structure in which support axes and openings intersect. For example, the pattern region (615) may include support axes (or ribs) that are elongated in the y-axis direction, and openings may be formed between the support axes. When the electronic device is folded, the distance between adjacent support axes in the x-axis direction may increase, thereby increasing the size of the openings, and when the electronic device is unfolded, the distance between adjacent support axes in the x-axis direction may decrease, thereby decreasing the size of the openings.

[0133] In one embodiment, the first plate region (612), the second plate region (624), and the pattern region (615) may refer to respective regions of a single structure, the digitizer plate (610). In another embodiment, the first plate region (612), the second plate region (624), and the pattern region (615) may be separate structures that are at least partially spaced apart from each other.

[0134] According to one embodiment, digitizer wires may be formed on a digitizer plate (or support plate) (610). For example, the digitizer may include loop-shaped wires formed in a horizontal and vertical direction over the entire area of ​​the display (600) to detect the position of a touch input (or hovering input) using a stylus (or electronic pen). The digitizer wires may be formed as a conductive pattern of a metal material (e.g., Cu) on the digitizer plate (610). For example, X-channel wires that form a horizontally long loop and are sequentially arranged in a vertical direction, and Y-channel wires that form a vertically long loop and are sequentially arranged in a horizontal direction, may be formed on the digitizer plate (610).

[0135] According to one embodiment, the wirings of the X channel or Y channel formed on the digitizer plate (610) may have two or more loops to form one channel. For example, one X channel may include two loops having a long rectangular shape in a horizontal direction (or x-axis direction) that are electrically connected, and one Y channel may include two loops having a long rectangular shape in a vertical direction (or y-axis direction) that are electrically connected. The structure of each channel formed on the digitizer plate (610) and the number of loops are not limited thereto.

[0136] According to one embodiment, the digitizer plate (610) may be composed of a plurality of layers. For example, the digitizer plate (610) may include a first layer in which X-channel wirings are formed, a second layer in which Y-channel wirings are formed, and at least one additional layer disposed between the first layer and the second layer. The digitizer plate (610) may include four layers, including the first layer, the second layer, and two additional layers, but the number is not limited thereto. The stacked structure of the layers constituting the digitizer plate (610) will be described in more detail with reference to FIG. 9.

[0137] According to one embodiment, the display (600) may include at least one connector connected to the digitizer driving IC. For example, one connector connected to the digitizer driving IC may be disposed within the first housing, such that at least some of the wiring of the digitizer may be electrically connected across the first plate area (612) and the second plate area (614). Alternatively, the display (600) may include two connectors connected to the digitizer driving IC, in which case the two connectors may be disposed at positions corresponding to the first plate area (612) and the second plate area (614), respectively.

[0138] According to one embodiment, among the wires formed on the digitizer plate (or support plate) (610), the wires formed across the first plate region (612) and the second plate region (614) may pass through the pattern region (615) and extend from the first plate region (612) to the second plate region (614). For example, since the X channel wires form one loop across the first plate region (612) and the second plate region (614), the wires need to be arranged on the pattern region (615) as well. In addition, since one channel may include two or more loops, and some Y channels include a loop formed on the first plate region (612) and a loop formed on the second plate region (614), the wires for connecting each loop may pass through the pattern region (615). Additionally, when the display (600) includes only one connector connected to the digitizer driving IC, a wiring for electrically connecting the Y channel formed in the first plate area (612) or the second plate area (614) where the connector is not arranged to the connector may pass through the pattern area (615).

[0139] In one embodiment, due to space constraints, the number of wires passing through the opening in the pattern area (615) may be limited. Accordingly, in the case of X-channel wires formed in the first layer, some wires may pass through the first layer in order to pass through the pattern area (615), and other wires may pass through at least one additional layer between the first layer and the second layer. In addition, in the case of Y-channel wires formed in the second layer, some wires may pass through the second layer in order to pass through the pattern area (615), and other wires may pass through at least one additional layer between the first layer and the second layer. The structure in which wires are formed on the pattern area (615) will be described in more detail with reference to FIG. 8.

[0140] In one embodiment, a second polymer layer (670) including a pressure sensitive adhesive (PSA) and a thermoplastic polyurethane (TPU) may be disposed under the digitizer plate (610). The second polymer layer (670) may include a first PSA region (672) disposed under at least a portion of the first plate region (612) of the digitizer plate (610), a second PSA region (674) disposed under at least a portion of the second plate region (614), and a TPU region (675) disposed under the pattern region (615). In one embodiment, an upper portion of the TPU region (675) may be attached to a lower portion of the pattern region (615) and a lower portion of the first plate region (612) and a lower portion of a portion of the second plate region (614), and a lower portion of the TPU region (675) may be disposed to be spaced apart from a reinforcing plate (680) positioned under it by a predetermined gap. In one embodiment, the height of the TPU region (675) may be substantially equal to the height of the first PSA region (672) and / or the second PSA region (674), in which case the TPU region (675) may be attached to the top of the reinforcement plate (680) without a gap.

[0141] FIG. 7 illustrates a connector connected to a digitizer driving IC according to one embodiment.

[0142] According to one embodiment, an electronic device may include a digitizer for detecting a touch input or hovering input using a stylus or a user's finger. The digitizer may include a plurality of wires forming a loop at predetermined intervals, and may detect the location of the touch input based on an electrical signal detected from each wire.

[0143] In one embodiment, a digitizer driver IC can output a drive signal to wires of a drive channel and receive an electrical signal detected from wires of a receive channel. The digitizer driver IC can be placed on a main printed circuit board assembly (PBA) and electrically connected to the wires of the digitizer through a connector.

[0144] FIG. 7 (a) illustrates an embodiment in which a foldable type electronic device includes two connectors (751, 752) connected to a display driving IC. For example, as described with reference to FIG. 4, the digitizer may include a first digitizer area (710) accommodated in a first housing and a second digitizer area (720) accommodated in a second housing, and wires arranged in the first digitizer area (710) and the second digitizer area (720) may not be electrically connected to each other. In this configuration, the wires of the first digitizer area (710) may be directly connected to the main PBA on which the digitizer driving IC is mounted via the first connector (751), and the wires of the second digitizer area (720) may be connected to the sub PBA connected to the main PBA via the second connector (752).

[0145] FIG. 7 (b) illustrates an embodiment in which a foldable type electronic device includes one connector (755) connected to a display driving IC. Referring to FIG. 7 (b), the connector (755) connected to the digitizer driving IC may be positioned within the first housing and may not be positioned within the second housing.

[0146] According to one embodiment, a display of an electronic device may include a digitizer plate (e.g., a digitizer plate (610) of FIG. 6) that integrates a support plate (e.g., a support plate (410) of FIG. 4) and a digitizer (e.g., a digitizer (420) of FIG. 4) into a single layer. The wiring of the digitizer may be formed on the digitizer plate. In this way, when the wiring is formed on the digitizer plate and only one connector connected to the digitizer driving IC is arranged, some of the wiring of the digitizer may be arranged across the first plate (710) and the second plate (720). For example, X-channel wires forming a long loop in the horizontal direction can form one loop across the first plate (710) and the second plate (720), and Y-channel wires formed on the second plate (720) need to extend to the first plate (710) for connection with a connector.

[0147] According to one embodiment, among the wires formed on the digitizer plate, the wires formed across the first plate (710) and the second plate (720) may pass through the pattern area (730) and extend from the first plate (710) to the second plate (720).

[0148] FIG. 8 illustrates wires passing through a pattern area (or lattice structure) according to one embodiment.

[0149] According to one embodiment, the electronic device may be a foldable electronic device that can be completely folded (e.g., the electronic device (200) of FIGS. 2A to 2D, the electronic device (300) of FIGS. 3A to 3E). The display of the electronic device may include a digitizer plate (e.g., the digitizer plate (610) of FIG. 6) that integrates a support plate (e.g., the support plate (410) of FIG. 4) and a digitizer (e.g., the digitizer (420) of FIG. 4) into a single layer.

[0150] According to one embodiment, among the wires formed on the digitizer plate, the wires formed across the first plate area (e.g., the first plate area (612) of FIG. 6) and the second plate area (e.g., the second plate area (614) of FIG. 6) may pass through the pattern area (615) (e.g., the pattern area (615) of FIG. 6) and extend from the first plate area to the second plate area. For example, since the X channel wires form one loop across the first plate area and the second plate area, the wires need to be arranged on the pattern area (615), and some of the Y channel wires may also pass through the pattern area (615) in a narrow section of the upper edge and the lower edge. In addition, one channel may include two loops, and some Y channels may include at least one loop formed on the pattern area (615), or some Y channels may include a loop formed on the first plate area and a loop formed on the second plate area. Accordingly, wiring for connecting each loop may pass through the pattern area (615). Additionally, the display may include only one connector connected to the digitizer driving IC, in which case wiring for electrically connecting the Y channel formed in the first plate area or the second plate area where the connector is not arranged to the connector may pass through the pattern area (615).

[0151] Referring to FIG. 8, the pattern region (615) includes elongated support axes (820) (or ribs) in the y-axis direction, and openings (810) (or recesses) may be formed between the support axes (820). Each of the support axes (820) may be spaced apart from each other by a predetermined distance in the x-axis direction, and the distance between adjacent support axes (820) may vary when the electronic device is folded or unfolded. Each of the support axes (820) may be arranged to be offset from each other, so that a spatial path formed by the openings (810) may be a winding path. Accordingly, the wires (831, 832, 841, 842) passing through the pattern region (615) may be in the form of a serpentine pattern that follows the spatial path formed by the support axes (820).

[0152] According to one embodiment, only a predetermined number or less of wires can pass through the winding spatial path formed on the support axis (820) due to the openings (810) of the pattern area (615). For example, as the support axis (820) of the pattern area (615) becomes thicker, the repulsive force increases, and the folding characteristics of the electronic device may deteriorate, so the width of the support axis (820) (e.g., width in the x-axis direction or y-axis direction) cannot be greatly adjusted. In addition, it is not easy to secure the width of the support axis by reducing the size of the opening within a predetermined space in the manufacturing process, and there may be limitations in making the thickness of the wire thin. Although FIG. 8 illustrates that two wires can pass through one spatial path formed by the openings (820) of the pattern area (615), the number is not limited thereto.

[0153] According to one embodiment, the electronic device may configure the digitizer plate (or support plate) with a plurality of layers (e.g., four) to resolve the above-described spatial constraints. For example, the digitizer plate may include a first layer, a second layer, and at least one additional layer, which are sequentially stacked in the z-axis direction. In the case of X-channel wirings formed in the first layer, some of the wirings may pass through the first layer in order to pass through the pattern area (615), and other wirings may pass through at least one additional layer between the first layer and the second layer. In addition, in the case of Y-channel wirings formed in the second layer, some of the wirings may pass through the second layer in order to pass through the pattern area (615), and other wirings may pass through at least one additional layer between the first layer and the second layer.

[0154] According to one embodiment, the wires (831, 832, 841, 842) of the digitizer may be formed as wires in a meandering shape so as to be formed along a meandering spatial path formed on the support axes (820) by the openings (810) of the pattern area (615). Accordingly, the resistance of the digitizer wires (831, 832, 841, 842) may increase, and there is a concern that the touch recognition performance may deteriorate because the driving current must be lowered when the wire resistance increases.

[0155] According to one embodiment, the electronic device may include additional wiring electrically connected to at least some of the wirings (831, 832, 841, 842) of the digitizer. According to one embodiment, the additional wiring may be disposed on at least one additional layer of the digitizer plate (or the support plate), and may be disposed in an area in which no X-channel or Y-channel wiring is formed in the additional layer of the first plate area or the second plate area. According to another embodiment, the additional wiring may be disposed on at least one additional layer of the pattern area of ​​the digitizer plate (or the support plate), and may be disposed in an area in which no X-channel or Y-channel wiring is formed in the additional layer of the pattern area. The additional wiring may be connected in parallel with the wirings of the digitizer, and thus the resistance of the digitizer wiring may be reduced.

[0156] FIG. 9 illustrates a laminated structure of a digitizer plate according to one embodiment.

[0157] Fig. 9 illustrates the laminated structure of the digitizer of the display illustrated in Fig. 6.

[0158] According to one embodiment, the wiring of the digitizer may be formed on a digitizer plate (e.g., the digitizer plate (610) of FIG. 6). For example, the digitizer may include X-channel wirings that form a loop in a horizontal direction and are arranged sequentially in a vertical direction, and Y-channel wirings that form a loop in a vertical direction and are arranged sequentially in a horizontal direction. The digitizer plate may also be referred to as a support plate.

[0159] In one embodiment, the digitizer plate may include a plurality of layers. For example, the plurality of layers may include a first layer (910) and a second layer (920) on which digitizer wiring is formed, and at least one additional layer (931, 932). Each layer may include digitizer wiring and / or additional wiring.

[0160] According to one embodiment, the plurality of layers can be formed substantially parallel (e.g., in the XY plane) within a first plate region (e.g., the first plate region (612) of FIG. 6) disposed within a first housing, a second plate region (e.g., the second plate region (614) of FIG. 6) disposed within a second housing, and a pattern region (e.g., the pattern region (615) of FIG. 6) disposed within a pattern region.

[0161] According to one embodiment, an insulating layer (942, 943, 944) may be disposed between each layer. For example, the insulating layer may be composed of an insulating material such as GFRP (glass fiber reinforced plastics). The insulating layer may also be referred to as a GFRP layer. As the insulating layer is disposed, noise (e.g., cross talk) caused by wirings of adjacent layers may be reduced. In addition, an insulating layer (941, 945) may also be disposed on the top of the first layer (910) and the bottom of the second layer (920).

[0162] According to one embodiment, the first layer (910) may be arranged in the +z direction from the second layer (920), and X channel wirings may be formed on the first layer (910). The second layer (920) may be arranged in the -z direction from the first layer (910), and Y channel wirings may be formed on the second layer (920). As the X channel wirings and the Y channel wirings are arranged in different layers, the X channel wirings forming a long loop in the x-axis direction and the Y channel wirings forming a long loop in the y-axis direction may intersect each other.

[0163] According to one embodiment, at least one additional layer (931, 932) may be disposed between the first layer (910) and the second layer (920). Although FIG. 9 illustrates that the first additional layer (931) and the second additional layer (932) are disposed, the number of additional layers is not limited thereto. According to one embodiment, an insulating layer (943) made of an insulating material such as glass fiber reinforced plastics (GFRP) may be disposed between the first additional layer (931) and the second additional layer (932).

[0164] According to one embodiment, at least some of the X-channel wirings and the Y-channel wirings may pass through at least one additional layer (931, 932) of the pattern area. For example, the X-channel wirings formed in the first layer (910) may form a loop across the first plate area and the second plate area, thereby allowing the wirings to pass through the pattern area. Additionally, some of the Y-channels may have at least one loop formed on the pattern area, or may include a loop formed on the first plate area and a loop formed on the second plate area, such that wiring for connecting each loop may pass through the pattern area. Additionally, the electronic device may include only one connector connected to the digitizer driving IC, in which case, wiring for electrically connecting a Y-channel formed in a plate area where a connector connected to the digitizer driving IC is not arranged to the connector may pass through the pattern area.

[0165] As described above, when digitizer wires are arranged to pass through the pattern area, there may be a large number of wires to pass through some areas of the pattern area. For example, many wires need to pass through the edge areas of the pattern area (e.g., near the top edge and bottom edge in the y-axis direction) and areas parallel to the connector. However, as described with reference to FIG. 8, the number of wires passing through the openings of the pattern area may be limited.

[0166] According to one embodiment, some of the X-channel wires of the first layer (910) may be formed on the first layer (910), and the remaining portions may be formed on at least one additional layer (931, 932). For example, if four X-channel wires need to pass through a specific area of ​​the pattern area (e.g., an edge area or an area parallel to a connector), two of the wires may be formed on the first layer (910) in the pattern area, and the remaining two may be formed on the first additional layer (931) below the first layer (910). According to one embodiment, some of the Y-channel wires of the second layer (920) may be formed on the second layer (920) in the pattern area, and the remaining portions may be formed on at least one additional layer (931, 932). For example, if four Y channel wires need to pass through a specific area of ​​the pattern area (e.g., an edge area or an area parallel to a connector), two of the wires can be formed on the second layer (920), and the remaining two can be formed on a second additional layer (932) above the second layer (920).

[0167] According to one embodiment, the wiring of the digitizer may be formed only in a portion of at least one additional layer (931, 932). As described above, the wiring of the digitizer may be formed in a pattern area, a connector, or an area adjacent thereto in the first additional layer (931) and the second additional layer (932), and the wiring of the digitizer may not be formed in many areas on the first plate area and the second plate area.

[0168] According to one embodiment, at least one additional wire may be arranged in at least a portion of an area where the wires of the digitizer are not formed in at least one additional layer (931, 932), and is electrically connected to the wires of the digitizer. Here, the additional wire may be arranged to reduce the resistance of the wires of the digitizer. For example, some of the wires of the digitizer may be formed in a meandering shape to pass through the pattern area, thereby increasing the wire length and designing the wire thickness to be narrow, which may increase the resistance. The electronic device may arrange the additional wires connected in parallel with the wires of the digitizer, thereby reducing the resistance of the wires of the digitizer.

[0169] In one embodiment, at least some of the wirings formed on each layer may be interconnected via vias. For example, additional wirings formed on additional layers (931, 932) may be connected to digitizer wirings of the first layer (910) or the second layer (920) via vias.

[0170] The arrangement order of each layer and the type of wiring arranged in each layer are not limited to those illustrated in FIG. 9. For example, Y-channel wirings may be arranged in the first layer (910) arranged in the +z direction, and X-channel wirings may be arranged in the second layer (920) arranged in the -z direction, and / or at least one of the additional layers (931, 932) may be arranged on the outside of the first layer (910) and the second layer (920) (e.g., in the +z direction of the first layer or in the -z direction of the second layer).

[0171] FIGS. 10A, 10B, and 10C illustrate examples of Y-channel wirings formed on a digitizer plate according to one embodiment.

[0172] According to one embodiment, the display of the electronic device (101) may include a digitizer plate that integrates a polarizing layer, a support plate for supporting a configuration disposed on the top, such as a display panel, and a digitizer including wires for detecting a touch input into a single layer. The digitizer plate may be referred to as a support plate, as the wires of the digitizer are formed on the support plate. The digitizer plate may include a first plate area (1010) disposed in a first housing (e.g., the first plate area (610) of FIG. 6), a second plate area (1020) disposed in a second housing (e.g., the second plate area (620) of FIG. 6), and a pattern area (1030) formed between the first plate area (1010) and the second plate area (1020) (e.g., the pattern area (630) of FIG. 6).

[0173] FIG. 10a, FIG. 10b and FIG. 10c illustrate wires formed on a digitizer plate (e.g., the digitizer plate (610) of FIG. 6) with the front of the electronic device (101) as the standard.

[0174] According to one embodiment, the digitizer plate may be formed with Y-channel wirings that include vertically elongated loops. Each Y-channel may include at least one loop, and for example, as illustrated in FIG. 10A, one Y-channel may comprise a first loop (1051) that is a relatively large rectangular wiring and a second loop (1052) that is a relatively small rectangular wiring within the first loop (1051).

[0175] According to one embodiment, a particular Y channel may include two loops (1051, 1052) arranged across a first plate region (1010) and a second plate region (1020). Referring to FIG. 10A, wires (1061, 1062) may be arranged to connect wires arranged in the first plate region (1010) in the first loop (1051) and the second loop (1052) to wires arranged in the second plate region (1020) in the first loop (1051) and the second loop (1052) through the upper edge region and the lower edge region of the pattern region (1030).

[0176] According to one embodiment, the Y-channel wiring may be formed on a second layer of the digitizer plate (e.g., the second layer (920) of FIG. 9). According to one embodiment, among the Y-channel wirings, wirings passing through the pattern area (1030) may be formed on at least one additional layer (or second additional layer (932)) between the first layer and the second layer. For example, due to spatial constraints of the support axis (or rib) of the pattern area (1030), the number of wirings passing through the pattern area (1030) may be limited, and in the edge area, there may not be enough space to form all the Y-channel wirings on the second layer. Accordingly, in the area, the Y-channel wirings may be formed on at least one additional layer and connected to the Y-channel wirings formed on the first layer through via throughs (or via holes).

[0177] According to one embodiment, the wiring (1070) connecting the loop (1052) of the Y channel and the connector (1090) may also be formed on an additional layer to avoid X channel wiring and Y channel wiring.

[0178] According to one embodiment, the electronic device (101) may include at least one connector connecting the wires of the digitizer plate (or support plate) and the main PBA on which the digitizer driving IC is mounted. FIG. 10b illustrates the arrangement structure of Y-channel wires formed on the first plate area (1010) when one connector (1090) is arranged on the second housing.

[0179] Referring to FIG. 10b, a connector (1090) for connection with the main PBA may be placed at the location of the second plate area (1020). Each channel formed in the digitizer plate may be electrically connected to the connector (1090).

[0180] Referring to FIG. 10b, the Y02 channel and the Y03 channel may be formed on the first plate (1010). For example, the Y02 channel and the Y03 channel each include two loops, and the second loop (1054) of the Y02 channel is formed within the first loop (1053) of the Y02 channel, and the second loop (1056) of the Y03 channel is formed within the first loop (1055) of the Y03 channel, and each of the loops (1053, 1054, 1055, 1056) may overlap at least partially.

[0181] According to one embodiment, wires for connecting wires of the Y02 channel to the connector (1090) and wires for connecting wires of the Y03 channel to the connector (1090) may be formed on the digitizer plate. For example, wires extending from the Y02 channel may be connected to the wire (1043) formed in the first plate area (1010), the wire (1063) passing through the pattern area (1030), and the wire (1044) formed in the second plate area (1020) to be connected to the connector (1090). In addition, wires extending from the Y03 channel may be connected to the wire (1045) formed in the first plate area (1010), the wire (1065) passing through the pattern area (1030), and the wire (1046) formed in the second plate area (1020) to be connected to the connector (1090).

[0182] According to one embodiment, the wires (1043, 1063, 1044, 1045, 1065, 1046) for connecting the wires of the Y02 channel and the Y03 channel to the connector (1090) may be arranged on at least one additional layer between the first layer and the second layer. For example, the wires (1043, 1063, 1044) extending from the Y02 channel and the wires (1045, 1065, 1046) extending from the Y03 channel may each be formed on the second additional layer and arranged adjacent to each other in the y-axis direction.

[0183] According to one embodiment, at least one wire constituting the Y channel may be formed on the pattern area (1030).

[0184] Referring to FIG. 10c, the Y08 channel includes two loops (1057, 1058), and some of the wiring of each loop may be arranged on the pattern area (1030). According to one embodiment, the wirings (1067, 1068) of each loop are formed as meandering wiring at the top and bottom of the pattern area (1030), and in order to connect the wiring of the second loop (1058) of the first plate area (1010) and the connector (1090), the wiring 1047 formed on the first plate area (1010), the wiring 1069 formed on the pattern area, and the wiring 1048 formed on the second plate area (1020) may be formed.

[0185] FIG. 11 illustrates wirings formed on a second layer and an additional layer in an upper edge area of ​​an electronic device among pattern areas according to one embodiment. In FIG. 11, wirings indicated in bold are wirings formed on the second layer, and wirings indicated in transparent color may be wirings formed on an additional layer (e.g., a second additional layer).

[0186] Referring to FIG. 11, in the first plate region (1010), wires (1151, 1152) of a specific Y channel may be formed on the second layer, and in the second plate region (1020), wires (1153, 1154) of a specific Y channel may be formed. For example, each Y channel may include two loops, and may be composed of a first loop which is a relatively large rectangular wire, and a second loop which is a relatively small rectangular wire within the first loop. The number and shape of the loops constituting the Y channel are not limited thereto.

[0187] According to one embodiment, wirings of a specific Y channel may also be formed in the pattern area (1030) (or lattice structure). Referring to FIG. 11, wirings of four loops (1141, 1142, 1143, 1144) may be formed on the pattern area (1030).

[0188] According to one embodiment, at least some of the wirings of the Y channel of the first plate region (1010) may be formed on an additional layer in the edge region. For example, in FIG. 11, at least one of the first wiring (1151) and the second wiring (1152) may be formed on an additional layer in the upper edge region. The wirings formed on the second layer and the additional layer in the edge region may extend through the wiring (1065) formed in a meandering path in the pattern region (1030). According to one embodiment, at least some of the wirings of the Y channel of the second plate region (1020) may be formed on an additional layer in the edge region. For example, in FIG. 11, at least one of the third wiring (1153) and the fourth wiring (1154) may be formed on an additional layer in the upper edge region. The wirings formed on the second layer and the additional layer in the edge region may extend through wirings (1165, 1166) formed in a winding path in the pattern region (1030). Additionally, the additional layer may form Y channel wirings (1161) formed across the first plate region (1010) and the second plate region (1020) in the upper edge region, and wirings (1162, 1163) extending from other wirings formed in the x-axis direction (e.g., wiring for connecting to a connector) may be formed.

[0189] FIG. 12 illustrates an example of X-channel wiring formed on a digitizer plate according to one embodiment.

[0190] Figure 12 illustrates some of the X-channel wiring formed on the digitizer plate (or support plate) with the front of the electronic device as the standard.

[0191] According to one embodiment, the digitizer plate may be formed with X-channel wirings comprising horizontally elongated loops. Each X-channel may comprise at least one loop, for example, one X-channel may comprise two loops, as illustrated in FIG. 12.

[0192] According to one embodiment, the electronic device (101) may include at least one connector (1090) that connects the wires of the digitizer plate and the main PBA on which the digitizer driving IC is mounted. Referring to FIG. 12, one connector (1090) for connection to the main PBA may be placed at a location in the second plate area (1020).

[0193] Referring to FIG. 12, the X19 channel and the X20 channel can be formed across the first plate area (1010) and the second plate area (1020). For example, the X19 channel and the X20 channel each include two loops, the second loop (1252) is formed within the first loop (1251) of the X19 channel, the second loop (1242) is formed within the first loop (1241) of the X20 channel, and the respective loops (1251, 1252, 1241, 1242) can overlap at least partially. Since the X19 channel and the X20 channel are arranged throughout the first plate area (1010) and the second plate area (1020), the wiring (1261) extending from the upper wiring of the first loop (1251) of the X19 channel, the wiring (1262) extending from the upper wiring of the second loop (1252) of the X19 channel, the wiring (1263) extending from the upper wiring of the first loop (1241) of the X20 channel, and the X20 A wiring (1264) extending from the upper wiring of the second loop (1242) of the channel, a wiring (1265) extending from the lower wiring of the second loop (1252) of the X19 channel, a wiring (1266) extending from the lower wiring of the first loop (1251) of the X19 channel, a wiring (1267) extending from the lower wiring of the second loop (1242) of the X20 channel, and a wiring (1268) extending from the lower wiring of the first loop (1241) of the X20 channel may each be formed on a winding path of the pattern area (1030).

[0194] According to one embodiment, the wiring for connecting at least one X channel and the connector (1090) may be formed on at least one additional layer. For example, the wiring for connecting the second loop (1252) of the X19 channel and the connector (1090) and the wiring for connecting the second loop (1242) of the X20 channel and the connector (1090) may each be formed on a first additional layer and may be arranged adjacent to each other in the x-axis direction.

[0195] FIGS. 13a, 13b, 13c and 13d illustrate examples of wirings formed in multiple layers of a digitizer plate according to one embodiment.

[0196] According to one embodiment, a digitizer plate (e.g., digitizer plate (610) of FIG. 6) (or support plate) of the electronic device (101) may be composed of a plurality of layers. For example, the digitizer plate may include a first layer (e.g., first layer (910) of FIG. 9) in which X-channel wirings are formed, a second layer (e.g., second layer (920) of FIG. 9) in which Y-channel wirings are formed, and at least one additional layer disposed between the first layer and the second layer, wherein the at least one additional layer may include a first additional layer (e.g., first additional layer (931) of FIG. 9) and a second additional layer (e.g., second additional layer (932) of FIG. 9). Figure 13a shows the locations of the wirings of the digitizer placed in the first layer, Figure 13b shows the locations of the wirings of the digitizer placed in the second layer, Figure 13c shows the locations of the wirings of the digitizer placed in the first additional layer, and Figure 13d shows the locations of the wirings placed in the second additional layer.

[0197] Referring to FIG. 13A, X-channel wirings including horizontally long loops may be arranged on a first layer of a digitizer plate. The loops of the X-channel wirings are formed across a first plate region (1010) and a second plate region (1020), and may be formed on a support axis of a pattern region (1030) and pass through the pattern region (1030). Each X-channel may include two loops long in the x-axis direction, for example, a first loop which is a relatively large rectangular wiring, and a second loop which is a relatively small rectangular wiring within the first loop. The number and shape of the loops formed by the X-channel wirings are not limited thereto.

[0198] Referring to FIG. 13B, the second layer of the digitizer plate may be arranged with Y-channel wirings including vertically elongated loops. In one embodiment, each Y-channel may include two loops elongated in the y-axis direction, for example, a first loop that is a relatively large rectangular wiring and a second loop that is a relatively small rectangular wiring within the first loop. The number and shape of the loops formed by the Y-channel wirings are not limited thereto.

[0199] According to one embodiment, Y channel wiring may be concentrated and arranged in some areas of the digitizer plate. Referring to FIG. 13B, a plurality of wirings for passing through the pattern area (1030) may be arranged in the upper edge area (1321) and the lower edge area (1322) of the pattern area (1030). In addition, a plurality of Y channel wirings may also be arranged in an area (1323) adjacent to a connector (1090) arranged in the second plate area (1020).

[0200] In one embodiment, the first additional layer may be disposed between the first layer and the second additional layer, and the second additional layer may be disposed between the first additional layer and the second layer. X-channel wiring and / or Y-channel wiring may be disposed in some areas of the first additional layer and the second additional layer.

[0201] Referring to FIG. 13c, X-channel wiring and / or Y-channel wiring may be arranged in the upper edge area (1331) and the lower edge area (1332) of the pattern area (1030) in the first additional layer. A plurality of wirings may be concentratedly arranged in the upper edge area (1331) and the lower edge area (1332) of the pattern area (1030) to extend from the first plate area (1010) to the second plate area (1020). As described above with reference to FIG. 8, due to space constraints, the number of wirings that can be formed on the support axis (or rib) of the pattern area (1030) in one layer and pass through the pattern area (1030) is inevitably limited. Accordingly, at least some of the X channel wires of the first layer and / or the Y channel wires of the second layer in the edge region (1331, 1332) may be placed on the first additional layer and / or the second additional layer when passing through the pattern region (1030).

[0202] Also, referring to FIG. 13c, X-channel wiring and / or Y-channel wiring may be arranged in an area (1335) adjacent to a connector (1090) among the first plate areas (1010) in the first additional layer, a portion (1334) of the pattern areas (1030), and a portion (1336) of the second plate areas (1020). According to one embodiment, the electronic device (101) may include one connector (1090) that connects the wiring of the digitizer plate and the main PBA on which the digitizer driving IC is mounted, and referring to FIG. 13c, the connector (1090) may be arranged on the second plate area (1020). Wires may be required to connect some of the wires of the X channel and / or some of the wires of the Y channel to the connector (1090), and the wires may be placed in some areas of the first plate area (1010), some areas of the pattern area (1030), and some areas of the second plate area (1020) adjacent to the connector (1090) in the first additional layer.

[0203] Referring to FIG. 13D, X-channel wiring and / or Y-channel wiring may be arranged in the upper edge area and lower edge area of ​​the pattern area (1030) in the second additional layer. In addition, wirings for connecting some of the X-channel wirings and / or Y-channel wirings to the connector (1090) may be arranged in some area (1334) of the first plate area (1010) adjacent to the connector (1090), some area (1333) of the pattern area (1030), and some area (1336) of the second plate area (1020) in the second additional layer.

[0204] Figures 14a, 14b, 14c, 14d, 14e, and 14f illustrate the arrangement structure of additional wirings according to one embodiment.

[0205] FIGS. 14a, 14b and 14c illustrate embodiments in which additional wirings are arranged in additional layers of the first plate area and the second plate area, and FIGS. 14d, 14e and 14f illustrate embodiments in which additional wirings are arranged along a winding path in an additional layer of the pattern area between the first plate area and the second plate area.

[0206] According to one embodiment, a digitizer plate (e.g., digitizer plate (610) of FIG. 6) may include a first layer (e.g., first layer (910) of FIG. 9) on which X-channel wirings are formed, a second layer (e.g., second layer (920) of FIG. 9) on which Y-channel wirings are formed, and at least one additional layer disposed between the first layer and the second layer, wherein the at least one additional layer may include a first additional layer (e.g., first additional layer (931) of FIG. 9) and a second additional layer (e.g., second additional layer (932) of FIG. 9).

[0207] According to one embodiment, additional wiring may be formed in at least one additional layer of a first plate area and a second plate area of ​​a digitizer plate, the additional wiring being electrically connected to the wirings of the digitizer. The additional wiring may be connected in parallel with at least some of the wirings of the X channel formed in the first layer and / or the wirings of the Y channel formed in the second layer, whereby resistance of the wirings of the X channel and / or the wirings of the Y channel may be reduced. According to one embodiment, the additional wirings formed in the first additional layer or the second additional layer may be connected to the wirings formed in the first layer or the second layer through a via through (or via hole).

[0208] According to one embodiment, the additional wiring may be arranged in an area where no X-channel wiring and / or Y-channel wiring is arranged in at least one additional layer. For example, as described with reference to FIGS. 13C and 13D , at least some of the X-channel wiring and / or Y-channel wiring may be arranged on the first additional layer and / or the second additional layer in the edge top area and the edge bottom area in the first plate area and the second plate area, and in an area adjacent to a connector connected to the digitizer driver IC. The additional wiring may be arranged in an area where no X-channel wiring and / or Y-channel wiring is arranged in this manner, and may be connected to wirings of the first layer and / or the second layer.

[0209] According to one embodiment, the additional wiring may be connected to at least one of the X channel or the Y channel used as a driving channel of the digitizer. The digitizer is configured with a driving channel that outputs a driving signal according to a signal of a digitizer driving IC and a signal receiving channel that receives an electrical signal according to a touch input using a touch pen (or stylus). At least one of the X channel or the Y channel may be used as a driving channel, and the X channel and the Y channel may be used as receiving channels. For example, when the X channel is used as a driving channel of the digitizer, the additional wiring arranged in the additional layer may be connected to the X channel wirings of the first layer. Alternatively, when the Y channel is used as a driving channel of the digitizer, the additional wiring arranged in the additional layer may be connected to the Y channel wirings of the second layer. Alternatively, when the X channel and the Y channel are used as driving channels of the digitizer, the additional wiring placed in the first additional layer may be connected to the X channel wiring of the first layer, and the additional wiring placed in the second additional layer may be connected to the Y channel wiring of the second layer.

[0210] Referring to FIG. 14A, additional wirings (1431, 1441) may be formed parallel to at least some of the Y channel wirings (1421) on the first additional layer and the second additional layer. For example, the Y channel wirings may be arranged in a straight line in the second layer of the first plate area and the second plate area, and the additional wiring (1431) of the first additional layer and the additional wiring (1441) of the second additional layer may be arranged in the +z direction of the second layer as straight wiring. The additional wirings (1431, 1441) may be connected in parallel with the Y channel wirings of the second layer through a via through. For example, an electronic device may use a Y channel as a driving channel of a digitizer, and the additional wirings (1431, 1441) may be arranged in an area on the first additional layer and the second additional layer where X channel wirings and / or Y channel wirings are not arranged. Accordingly, the thickness of the Y channel wiring (1421) used as the driving channel may increase, which may have the effect of reducing resistance.

[0211] Referring to FIG. 14B, additional wirings (1433, 1443) may be formed in parallel with at least some of the X-channel wirings (1413) on the first additional layer and the second additional layer. For example, the X-channel wirings (1413) may be arranged in a straight line in the first layer of the first plate area and the second plate area, and the additional wiring (1433) of the first additional layer and the additional wiring (1443) of the second additional layer may be arranged in the -z direction of the first layer as straight wiring. The additional wirings (1433, 1443) may be connected in parallel with the X-channel wirings (1413) of the first layer through a via through. For example, an electronic device may utilize an X-channel as a driving channel of a digitizer, and additional wires (1433, 1443) may be arranged in an area (1413a) where X-channel wires and / or Y-channel wires are not arranged on the first additional layer and the second additional layer. For example, wires may be formed in a first layer of a pattern area between a first plate area and a second plate area through a winding path on a support axis (or rib), and X-channel wires may also be formed in the first additional layer and the second additional layer due to a lack of arrangement space. Accordingly, additional wires may not be formed in the pattern area (1453) of the first additional layer and the second additional layer where X-channel wires are formed. As described above, by connecting the additional wires (1433, 1443) in parallel with the X-channel wire (1413), the thickness of the X-channel wire (1412) used as the driving channel increases, which may have the effect of reducing resistance.

[0212] Referring to FIG. 14c, the additional wirings (1455) may include a first additional wiring (1435) formed parallel to the X-channel wirings (1415) of the first layer on the first additional layer, and a second additional wiring (1445) formed parallel to the Y-channel wirings (1425) of the second layer on the second additional layer. For example, an electronic device may use an X-channel and a Y-channel as driving channels of a digitizer, and the first additional wiring (1435) may be disposed in an area on the first additional layer where X-channel wirings and / or Y-channel wirings are not disposed, and the second additional wiring (1445) may be disposed in an area on the second additional layer where X-channel wirings and / or Y-channel wirings are not disposed. According to one embodiment, wirings may be formed in a first layer (1415a) of a pattern area between a first plate area and a second plate area through a winding path on a support axis (or rib), and X-channel wirings may also be formed in the first additional layer due to a lack of arrangement space. Accordingly, additional wirings may not be formed in the pattern area (1456) of the first additional layer where X-channel wirings are formed.

[0213] According to one embodiment, the digitizer plate (or support plate) includes wires for detecting an electronic pen (or stylus), and at least two wires among the wires arranged on different layers of a folding area of ​​the digitizer plate may extend in parallel in the x-axis direction through the folding area. For example, the additional wires may be arranged on a first additional layer and a second additional layer between a first layer and a second layer in the folding area, and the additional wires may be formed on a winding path formed on a support axis (or rib) of the pattern area.

[0214] According to one embodiment, additional wirings formed on different layers can be connected to each other through vias and can extend to the first plate area and the second plate area as a single wiring.

[0215] Figure 14d illustrates wiring formed in the second layer, the first additional layer, and the second additional layer of the pattern area between the first plate area and the second plate area. In the pattern area, digitizer wiring and additional wiring can be formed in a winding path formed on a support axis (or rib) in the second layer, the first additional layer, and the second additional layer.

[0216] Referring to FIG. 14d, Y channel wiring may be formed in the second layer of the pattern area. Additional wirings (1442, 1432) may be arranged on the first additional layer and the second additional layer, and may be arranged in areas where X channel wirings and / or Y channel wirings are not arranged in the first additional layer and the second additional layer. Additional wirings (1442, 1432) may be formed along a winding path on a support axis (or rib) in the first additional layer and the second additional layer. According to one embodiment, the electronic device may utilize the Y channel as a driving channel of the digitizer, and in this case, as illustrated in FIG. 14d, additional wirings (1442, 1432) formed on the first additional layer and the second additional layer of the pattern area may be connected to the Y channel wiring of the second layer through a via through. FIG. 14e illustrates wirings formed on the first layer of the first plate area and the second plate area and the first layer, the first additional layer, and the second additional layer of the pattern area.

[0217] Referring to FIG. 14E, X-channel wirings (1414) forming long loops in the x-axis direction may be formed in the first layer. The X-channel wirings may be formed along a winding path in the first layer of the pattern area and may extend to the first plate area and the second plate area. According to one embodiment, additional wirings (1434, 1444) may be formed on the first additional layer and the second additional layer of the pattern area. The additional wirings may be formed along a winding path in the first additional layer and the second additional layer, corresponding to the X-channel wirings formed along a winding path in the first layer.

[0218] According to one embodiment, the electronic device may utilize the X channel as a driving channel of the digitizer, in which case, as illustrated in FIG. 14e, additional wirings (1444, 1434) formed on the first additional layer and the second additional layer of the pattern area may be connected to the X channel wiring of the first layer through a via through.

[0219] According to one embodiment, additional wires (1434, 1444) may be formed in areas in the pattern area where X-channel wires and / or Y-channel wires are not formed in the first additional layer and the second additional layer.

[0220] According to one embodiment, additional wirings (1434) arranged in the first additional layer in the pattern area and additional wirings (1444) arranged in the second additional layer may be connected to each other through vias. The additional wirings may be electrically connected to each other through the vias to extend to the first plate area and the second plate area as a single wiring.

[0221] According to one embodiment, at least one of the X-channel wirings extending to the first and second regions of the digitizer plate can be connected to wirings arranged in the first additional layer and the second additional layer of the pattern area through a via.

[0222] Figure 14f illustrates an example in which additional wiring is formed in the first additional layer in the pattern area to be connected to the X channel wiring, and additional wiring is formed in the second additional layer to be connected to the Y channel wiring.

[0223] Referring to FIG. 14F, the additional wirings (1436, 1446) may include a first additional wiring (1436) formed on a first additional layer and connected to the X channel wirings (1416) of the first layer, and a second additional wiring (1446) formed on a second additional layer and connected to the Y channel wirings (1426) of the second layer. For example, in the first layer of the pattern area, the X channel wirings (1416a) may be formed along a meandering path, and the additional wirings (1436) formed on the first additional layer may be connected to the X channel wirings (1416a) through via throughs. In the second layer of the pattern area, the Y channel wirings (1426) may be formed along a meandering path, and the additional wirings (1446) formed on the second additional layer may be connected to the Y channel wirings (1426) through via throughs.

[0224] Figures 15a and 15b illustrate the placement locations of additional wires according to one embodiment.

[0225] According to one embodiment, additional wiring connected to the X-channel wiring of the first layer or the Y-channel wiring of the second layer may be placed in an area in which the X-channel wiring and / or the Y-channel wiring is not placed in at least one additional layer.

[0226] Fig. 15a illustrates a wiring location of a Y08 channel formed in a second layer. Referring to Fig. 15a, the Y08 channel may include a first loop (1521) having a large rectangular shape formed across a first plate area and a pattern area on the second layer, and a second loop (1522) formed across the first plate area and the pattern area and formed within the first loop (1521). Each loop (1521, 1522) is electrically connected to each other, and in some sections, the wiring of the Y08 channel may be arranged in a second additional layer.

[0227] Figure 15b illustrates additional wiring locations formed in the second additional layer.

[0228] According to one embodiment, additional wiring that connects to the wiring of the digitizer may be placed in an area on the first additional layer and the second additional layer where X-channel wiring and / or Y-channel wiring are not placed.

[0229] Referring to FIG. 15b, additional wires (1531, 1532) connected to the Y08 channel may be arranged in an area where Y channel wires are not arranged in the second additional layer. For example, Y channel wires may be formed in an upper edge area, a lower edge area, and an area adjacent to a connector in the pattern area in the second additional layer. Additional wires (1531, 1532) connected to the Y08 channel may be formed parallel to two loops on the second additional layer forming Y08, and may not be formed in an area where Y channel wires are arranged in the second additional layer.

[0230] In another embodiment, additional wires may be formed at locations in the first additional layer and / or the second additional layer corresponding to the locations of the Y-channel wires in the pattern area. For example, additional wires may be positioned corresponding to the locations where the Y-channel wires are formed in the first loop (1521) and the second loop (1522).

[0231] According to various embodiments, additional wires connected in parallel to extend the thickness of the pattern area (or lattice structure) and wires passing through the pattern area, and digitizer wires, may also be included in the slider type electronic device.

[0232] Hereinafter, the structure of an electronic device including a display and a housing structure that are expandable in the horizontal direction, i.e., expandable to the left or right based on the vertical direction (or portrait type) of the electronic device, will be described through FIGS. 16a, 16b, 16c, and 16d.

[0233] FIGS. 16A and 16B are drawings showing the front and back of a horizontally expandable electronic device in a slide-in state according to various embodiments, and FIGS. 16C and 16D are drawings showing the front and back of the electronic device in a slide-out state.

[0234] Referring to FIGS. 16A to 16D , an electronic device (1600) may include a first housing part (1610) (or, a fixed part, a base housing), a second housing part (1620) (e.g., a movable part, a slide housing) movably coupled to the first housing part (1610) in a specified direction (e.g., an x-axis direction) and within a specified distance, and a flexible display (1630) arranged to be supported by at least a portion of the first housing part (1610) and the second housing part (1620). The flexible display (1630) may include an expandable display or a stretchable display. The flexible display (1630) can change the size of the area visible from the front (e.g., expand or contract) as the second housing part (1620) moves from the first housing part (1610). The flexible display (1630) can include at least some of the configurations and / or functions of the display module (160) disclosed in FIG. 1.

[0235] According to one embodiment, at least a portion of the second housing part (1620) may be accommodated in the first space (15101) of the first housing part (1610), thereby allowing the electronic device (1600) to be changed into a slide-in state. The electronic device (1600) may include a bendable member (or bendable support member) (e.g., a multi-joint hinge module or a multi-bar assembly) that forms at least a partially coplanar plane with at least a portion of the first housing part (1610) in the slide-out state and is accommodated at least partially into the second space (15201) of the second housing part (1620) in the slide-in state.

[0236] According to one embodiment, at least a portion of the flexible display (1630) can be arranged so as to be invisible from the outside by being accommodated in the internal space (15201) of the second housing part (1620) while being supported by the bendable member in a slide-in state. At least a portion of the flexible display (1630) can be arranged so as to be visible from the outside by being supported by the bendable member that forms at least partially the same plane as the first housing part (1610) in a slide-out state.

[0237] According to various embodiments, the electronic device (1600) may include a front surface (1600a) (e.g., a first surface), a back surface (1600b) (e.g., a second surface) facing in an opposite direction from the front surface (1600a), and a side surface (not shown) surrounding a space between the front surface (1600a) and the back surface (1600b). For example, the electronic device (1600) may include a first housing part (1610) including a first side surface member (1611), and a second housing part (1620) including a second side surface member (1621).

[0238] According to one embodiment, the first side member (1611) can include a first side (15111) having a first length along a first direction (e.g., an x-axis direction), a second side (15112) extending from the first side (15111) to have a second length along a direction substantially perpendicular to the first side (15111) that is longer than the first length, and a third side (15113) extending from the second side (15112) substantially parallel to the first side (15111) and having the first length. The first side member (1611) can be formed at least partially of a conductive material (e.g., a metal). At least a portion of the first side member (1611) can include a first support member (1612) extending to at least a portion of the first space (15101) of the first housing part (1610). According to one embodiment, the first side member (1611) and / or the second side member (1621) may include at least one conductive member that is electrically separated from each other by at least one partition.

[0239] In one embodiment, the second side member (1621) can include a fourth side member (15211) that corresponds at least partially to the first side member (15111) and has a third length, a fifth side member (15212) that extends from the fourth side member (15211) in a direction substantially parallel to the second side member (15112) and has a fourth length that is longer than the third length, and a sixth side member (15213) that extends from the fifth side member (15212) to correspond to the third side member (15113) and has a third length. The second side member (1621) can be formed at least partially of a conductive material (e.g., metal). At least a portion of the second side member (1621) can include a second support member (1622) that extends to at least a portion of the second space (15201) of the second housing part (1620).

[0240] According to one embodiment, the first side (15111), the fourth side (15211), and the third side (15113) and the sixth side (15213) can be slidably coupled to each other. The electronic device (1600) can be arranged so that the fourth side (15211) overlaps the first side (15211) in the slide-in state, so that it is substantially invisible from the outside. The electronic device (1600) can be arranged so that the sixth side (15213) overlaps the third side (15213) in the slide-in state, so that it is substantially invisible from the outside. In some embodiments, the electronic device (1600) can be arranged so that, in the slide-in state, at least a portion of the fourth side (15211) and the sixth side (15213) are at least partially visible from the outside.

[0241] According to one embodiment, the electronic device (1600) may be arranged so that the second support member (1622) overlaps the first support member (1612) in the slide-in state, thereby being substantially invisible from the outside. In some embodiments, a portion of the second support member (1622) may be arranged so that it overlaps the first support member (1612) in the slide-in state, thereby being invisible from the outside, and the remaining portion of the second support member (1622) may be arranged so that it is visible from the outside.

[0242] According to one embodiment, the electronic device (1600) may include a rear cover (1613) disposed on at least a portion of the first housing part (1610). The rear cover (1613) may be disposed on the rear surface (1600b) of the electronic device (1600) via at least a portion of the first support member (1612). In some embodiments, the rear cover (1613) may be formed integrally with the first side member (1611). The rear cover (1613) may be formed of a polymer, a coated or colored glass, a ceramic, a metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. In some embodiments, the rear cover (1613) may extend to at least a portion of the first side member (1611). At least a portion of the first support member (1612) may be replaced by the rear cover (1613). The electronic device (1600) may also include another rear cover (e.g., a second rear cover) disposed on at least a portion of the second support member (1622) in the second housing part (1620), or replacing at least a portion of the second support member (1622).

[0243] According to one embodiment, the electronic device (1600) may include a flexible display (1630) (e.g., an expandable display) arranged to be supported by at least a portion of a first housing part (1610) and a second housing part (1620). The flexible display (1630) may include a first portion (1630a) (e.g., a first display) that is always visible from the outside in a slide-in state or a slide-out state, and a second portion (1630b) (e.g., a second display) that extends from the first portion (1630a) and extends in a specified direction (e.g., an x-axis direction) together with the second housing part (1620) in the slide-out state. The first portion (1630a) of the flexible display (1630) may form a first display area, and the second portion (1630b) may form a second display area. A first part (1630a) of a flexible display (1630) can form a plane, and a second part (1630b) can form a bendable part that is at least partially accommodated in a second space (15201) of a second housing part (1620) so that at least a portion thereof is not visible from the outside when in a slide-in state. The first part (1630a) can be arranged to be supported by the first housing part (1610), and the second part (1630b) can be arranged to be at least partially supported by a bendable member. The second part (1630b) of the flexible display (1630) may be arranged to extend from the first part (1630a) and form substantially the same plane as the first part (1630a) while receiving support from the bendable member as the second housing part (1620) is pulled out along a designated direction (e.g., the x-axis direction) and to be visible from the outside. The second part (1630b) of the flexible display (1630) may be arranged to be accommodated in the second space (16201) of the second housing part (1620) and not visible from the outside as the second housing part (1620) is introduced into the first housing part (1610) along a designated direction (e.g., the -x-axis direction).The electronic device (1600) can expand the display area of ​​the flexible display (1630) as the second housing part (1620) is moved (e.g., withdrawn) in a sliding manner along a specified direction (e.g., x-axis direction) from the first housing part (1610).

[0244] In one embodiment, the electronic device (1600) can display at least one application using the first part (1630a) (e.g., the first display area) of the flexible display (1630) in a slide-in state. In another embodiment, the electronic device (1600) can display at least one application using the first part (1630a) (e.g., the first display area) and the second part (1630b) (e.g., the second display area) in a state where the second housing part (1620) is pulled out from the first housing part (1610). In various embodiments, the flexible display (1630) can display the first application (A) using the first part (1630a) and the second application (B) using the second part (1630b) in a slide-out state.

[0245] In one embodiment, referring to FIG. 16C, although the size of the first portion (1630a) (e.g., the first display area) of the flexible display (1630) is illustrated as being formed larger than the size of the second portion (1630b) (e.g., the second display area), the sizes of the first portion (1630a) and the second portion (1630b) may be formed to be substantially the same, or the size of the second portion (1630b) may be formed to be larger than the size of the first portion (1630a). The sizes of the first portion (1630a) and the second portion (1630b) of the flexible display (1630) may be formed to be the same or in various different sizes.

[0246] According to one embodiment, the first housing part (1610) and the second housing part (1620) can be operated in a sliding manner so that the overall width is variable with respect to each other. Referring to FIG. 16C, the electronic device (1600) can be configured to have a first width (W1) from the second side (15112) to the fifth side (15212) in a slide-in state. In a slide-out state, the electronic device (1600) can be configured to have a third width (W3) that is larger than the first width (W1) by moving at least a portion of the bendable member accommodated in the second space (15201) of the second housing part (1620) to have an additional second width (W2). For example, the flexible display (1630) may have a display area substantially corresponding to the first width (W1) in a slide-in state, and may have an expanded display area substantially corresponding to the third width (W3) in a slide-out state. In one embodiment, although the second width (W2) is illustrated as having a smaller width than the first width (W1) in FIG. 16C , the first width (W1) and the second width (W2) may be configured to have substantially the same width. In one embodiment, the first portion (1630a) and the second portion (1630b) of the flexible display (1630) may be configured to have display screens of substantially the same size.

[0247] According to one embodiment, the electronic device (1600) may include a driving unit (or actuator) (not shown) for moving the second housing part (1620) from the first housing part (1610). For example, the driving unit may include a rotary motor structure, and when a user presses a specific button and / or moves a portion of the second housing part (1620), the motor may be activated to provide a driving force for sliding movement of the second housing part (1620).

[0248] According to one embodiment, the electronic device (1600) may include at least one of an input module (e.g., a microphone (1603)), an audio output module (e.g., a call receiver (1606) or a speaker (1607)), a sensor module (1604, 1617), a camera module (e.g., a first camera module (1605) or a second camera module (1616)), a connector port (1608), a key input device (not shown), or an indicator (not shown) disposed in a first space (15101) of a first housing part (1610). The electronic device (1600) may be configured such that at least one of the above-described components is omitted, or other components are additionally included. In another embodiment, at least one of the above-described components may be disposed in a second space (15201) of a second housing part (1620).

[0249] According to various embodiments, the input module may include an embodiment related to the input module (150) of FIG. 1. The audio output module may include an embodiment related to the audio output module (155) of FIG. 1. The sensor modules (1604, 1617) may include an embodiment related to the sensor module (176) of FIG. 1. The camera module may include an embodiment related to the camera module (180) of FIG. 1.

[0250] In one embodiment, the input module (e.g., the input module (150) of FIG. 1) may include a microphone (1603). In some embodiments, the input module (e.g., the microphone (1603)) may include a plurality of microphones arranged to detect the direction of sound. The audio output module may include, for example, a call receiver (1606) and a speaker (1607). The speaker (1607) may be exposed to the outside through at least one speaker hole formed in the first housing part (1610) in a slide-out state. The connector port (1608) may be exposed to the outside through a connector port hole formed in the first housing part (1610) in a slide-out state. The call receiver (1606) may also include a speaker (e.g., a piezo speaker) that operates without a separate speaker hole.

[0251] According to various embodiments, the sensor modules (1604, 1617) (e.g., the sensor module (176) of FIG. 1) may generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (1600) or an external environmental state. The sensor modules (1604, 1617) may include, for example, a first sensor module (1604) (e.g., a proximity sensor or an illuminance sensor) disposed on the front (1600a) of the electronic device (1600) and / or a second sensor module (1617) (e.g., a heart rate monitoring (HRM) sensor) disposed on the back (1600b) of the electronic device (1600). The first sensor module (1604) may be disposed on the back (e.g., in the -z-axis direction) of the flexible display (1630) on the front (1600a) of the electronic device (1600). The first sensor module (1604) and / or the second sensor module (1617) may include at least one of a proximity sensor, an illuminance sensor, a time of flight (TOF) sensor, an ultrasonic sensor, a fingerprint recognition sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, or a humidity sensor.

[0252] According to one embodiment, a camera module (e.g., camera module (180) of FIG. 1) may include a first camera module (1605) disposed on a front side (1600a) of an electronic device (1600) and a second camera module (1616) disposed on a rear side (1600b). The electronic device (1600) may include a flash (1618) positioned near the second camera module (1616). The camera modules (1605, 1616) may include one or more lenses, image sensors, and / or image signal processors. The first camera module (1605) may be disposed on a rear side (e.g., in the -z-axis direction) of a flexible display (1630) and may be configured to capture an object through a portion of an active area of ​​the flexible display (1630). The flash (1618) may include, for example, a light emitting diode or a xenon lamp.

[0253] According to one embodiment, among the camera modules, the first camera module (1605) and among the sensor modules (1604, 1617), some sensor modules (1604) may be arranged to detect the external environment through the flexible display (1630).

[0254] According to one embodiment, the electronic device (1600) may include at least one antenna (A1, A2) electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed in a first space (15101) of a first housing part (1610). The at least one antenna (A1, A2) may include a first antenna (A1) disposed in an upper region of the electronic device (1600) and a second antenna (A2) disposed in a lower region.

[0255] Hereinafter, the structure of an electronic device including a display that is vertically expandable, i.e., expandable up or down based on the vertical direction (or portrait type) of the electronic device, will be described through FIGS. 17a and 17b.

[0256] FIG. 17A is a diagram illustrating a vertically expandable electronic device in a slide-in state according to one embodiment. FIG. 17B is a diagram illustrating a front view of a vertically expandable electronic device in a slide-out state according to one embodiment.

[0257] Referring to FIGS. 17A and 17B , the electronic device (1700) may include a first housing part (1710), a second housing part (1720) slidably coupled to the first housing part (1710) in a designated direction (e.g., direction ① or direction ②) (e.g., direction of the y-axis), and a flexible display (1730) arranged to be supported by at least a portion of the first housing part (1710) and the second housing part (1720). The flexible display (1730) may include an expandable display or a stretchable display. The flexible display (1730) may include at least a portion of the configuration and / or function of the display module (160) disclosed in FIG. 1.

[0258] According to one embodiment, the electronic device (1700) may be arranged such that the first housing part (1710) is pulled out (slide-out) in a first direction (direction ①) or is inserted (slide-in) in a second direction (direction ②) opposite to the first direction (direction ①) based on the second housing part (1720) held by the user. According to one embodiment, at least a portion of the first housing part (1710) including the first space (17101) may be accommodated in the second space (17201) of the second housing part (1720), thereby changing to a slide-in state.

[0259] According to one embodiment, the electronic device (1700) may include a bendable member (or bendable support member) that, in a slide-out state, forms at least partially the same plane as at least a portion of the first housing part (1710), and is at least partially accommodated into a second space (17201) of the second housing part (1720) in a slide-in state.

[0260] According to one embodiment, at least a portion of the flexible display (1730) may be arranged so as to be invisible from the outside by being accommodated in the internal space (17201) of the second housing part (1720) while being supported by the bendable member in a slide-in state. According to one embodiment, at least a portion of the flexible display (1730) may be arranged so as to be visible from the outside by being supported by the bendable member that forms at least partially the same plane as the first housing part (1710) in a slide-out state.

[0261] According to one embodiment, the electronic device (1700) may include a first housing part (1710) including a first side member (1711) and a second housing part (1720) including a second side member (1721). According to one embodiment, the first side member (1711) may include a first side (17111) having a first length along a first direction (e.g., a y-axis direction), a second side (17112) extending from the first side (17111) to have a second length shorter than the first length along a direction substantially perpendicular to the first side (17111) and a third side (17113) extending from the second side (17112) to be substantially parallel to the first side (17111) and having the first length. In one embodiment, the first side member (1711) may be formed at least partially of a conductive material (e.g., metal). In some embodiments, the first side member (1711) may be formed by a combination of a conductive material and a non-conductive material (e.g., a polymer).

[0262] In one embodiment, the first housing part (1710) may include a first support member (1712) extending from at least a portion of the first side member (1711) to at least a portion of the first space (17101). In one embodiment, the first support member (1712) may be formed integrally with the first side member (1711). In some embodiments, the first support member (1712) may be configured separately from the first side member (1711) and may be structurally coupled to the first side member (1711).

[0263] In one embodiment, the second side member (1721) can include a fourth side member (17211) that corresponds at least partially with the first side member (17111) and has a third length, a fifth side member (17212) that extends from the fourth side member (17211) in a direction substantially parallel to the second side member (17112) and has a fourth length that is shorter than the third length, and a sixth side member (17213) that extends from the fifth side member (17212) to correspond with the third side member (17113) and has a third length. In one embodiment, the second side member (1721) can be formed at least partially of a conductive material (e.g., a metal). In some embodiments, the second side member (1721) can be formed by a combination of a conductive material and a non-conductive material (e.g., a polymer). In one embodiment, at least a portion of the second side member (1721) may include a second support member (1722) extending to at least a portion of the second space (17201) of the second housing part (1720). In one embodiment, the second support member (1722) may be formed integrally with the second side member (1721). In some embodiments, the second support member (1722) may be formed separately from the second side member (1721) and structurally coupled to the second side member (1721).

[0264] In one embodiment, the first side (17111) and the fourth side (17211) can be slidably coupled to each other. In one embodiment, the third side (17113) and the sixth side (17213) can be slidably coupled to each other. In one embodiment, in the slide-in state, the first side (17111) can be arranged to overlap with the fourth side (17211) so as to be substantially invisible from the outside. In one embodiment, in the slide-in state, the third side (17113) can be arranged to overlap with the sixth side (17213) so as to be substantially invisible from the outside. In some embodiments, at least a portion of the first side (17111) and the third side (17113) can be arranged to be at least partially visible from the outside in the slide-in state. According to one embodiment, in the slide-in state, the first support member (1712) can be arranged to overlap the second support member (1722) so as to be substantially invisible from the outside.

[0265] In one embodiment, the electronic device (1700) may include a first rear cover (1713) coupled with a first housing part (1710) on the rear side. In one embodiment, the first rear cover (1713) may be disposed through at least a portion of the first support member (1712). In some embodiments, the first rear cover (1713) may be formed integrally with the first side member (1711). In one embodiment, the first rear cover (1713) may be formed of a polymer, a coated or colored glass, a ceramic, a metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. In some embodiments, the first rear cover (1713) may extend to at least a portion of the first side member (1711). In some embodiments, at least a portion of the first support member (1712) may be replaced by the first rear cover (1713).

[0266] In one embodiment, the electronic device (1700) may include a second rear cover (1723) coupled with a second housing part (1720) on the rear side. In one embodiment, the second rear cover (1723) may be disposed through at least a portion of the second support member (1722). In some embodiments, the second rear cover (1723) may be formed integrally with the second side member (1721). In one embodiment, the second rear cover (1723) may be formed of a polymer, a coated or colored glass, a ceramic, a metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. In some embodiments, the second rear cover (1723) may extend to at least a portion of the second side member (1721). In some embodiments, at least a portion of the second support member (1722) may be replaced by the second rear cover (1723).

[0267] According to one embodiment, the electronic device (1700) may include a flexible display (1730) arranged to be supported by at least a portion of a first housing part (1710) and a second housing part (1720). According to one embodiment, the flexible display (1730) may include a first portion (1730a) (e.g., a flat portion) that is always visible from the outside and a second portion (1730b) (e.g., a bendable portion) that extends from the first portion (1730a) and is at least partially accommodated into a second space (17201) of the second housing part (1720) such that at least a portion thereof is not visible from the outside in a slide-in state.

[0268] In one embodiment, the first portion (1730a) may be positioned to be supported by the first housing part (1710), and the second portion (1730b) may be positioned to be at least partially supported by the bendable member.

[0269] According to one embodiment, the second part (1730b) of the flexible display (1730) may be arranged to extend from the first part (1730a) while receiving support from the bendable member in a state where the first housing part (1710) is pulled out along the first direction (direction ①), form substantially the same plane as the first part (1730a), and be visible from the outside. According to one embodiment, the second part (1730b) of the flexible display (1730) may be accommodated in the second space (17201) of the second housing part (1720) in a state where the second housing part (1720) is pulled in along the second direction (direction ②), and may be arranged so as not to be visible from the outside. Accordingly, the electronic device (1700) can induce the display area of ​​the flexible display (1730) to vary as the first housing part (1710) slides along a specified direction (e.g., y-axis direction) from the second housing part (1720).

[0270] According to one embodiment, the flexible display (1730) may have a length that varies in the first direction (direction ①) according to the sliding movement of the first housing part (1710) relative to the second housing part (1720). For example, the flexible display (1730), in a slide-in state, may have a first display area (e.g., an area corresponding to the first part (1730a)) corresponding to the first length (L1). According to one embodiment, the flexible display (1730) may be expanded to have a third display area (e.g., an area including the first part (1730a) and the second part (1730b)) that corresponds to a third length (L3) that is longer than the first length (L1) and is larger than the first display area, according to the sliding movement of the first housing part (1710) that is additionally moved by a second length (L2) based on the second housing part (1720) in the slide-out state.

[0271] According to one embodiment, the electronic device (1700) may include at least one of an input module (e.g., a microphone (1703-1)), an audio output device (e.g., a call receiver (1706) or a speaker (1707)), a sensor module (1704, 217), a camera module (e.g., a first camera module (1705) or a second camera module on the rear), a connector port (1708), a key input device (1719), or an indicator (not shown) disposed in a first space (17101) of a first housing part (1710). According to one embodiment, the electronic device (1700) may include another input device (e.g., a microphone (1703)) disposed in a second housing part.

[0272] According to one embodiment, the slide-in and slide-out operations of the electronic device (1700) may be performed automatically. For example, the slide-in and slide-out operations of the electronic device (1700) may be performed through a gearing operation of a drive motor including a pinion gear (1761) disposed in a first space (17101) of a first housing part (1710) and a rack gear disposed in a second space (17201) of a second housing part (1720) and meshed with the pinion gear (1761). For example, when a processor of the electronic device (1700) (e.g., the processor (120) of FIG. 1) detects a triggering operation to change from a slide-in state to a slide-out state or from a slide-out state to a slide-in state, the processor may operate a drive unit (e.g., a drive motor) disposed inside the electronic device (1700). In one embodiment, the triggering action may include selecting (e.g., touching) an object displayed on the flexible display (1730) or operating a physical button (e.g., a key button) included in the electronic device (1700).

[0273] According to various embodiments, additional wires connected in parallel to extend the thickness of the pattern area (or lattice structure) and wires passing through the pattern area, and digitizer wires, may also be included in the slider-type electronic device disclosed in FIGS. 16A to 16D or FIGS. 17A and 17B.

[0274] For example, a portion of a housing of a slidable type electronic device may have a bending region, and a pattern region (or recess structure) including openings may be formed in the bending region. At least some of the digitizer wires may be arranged on a support axis (or rib) of the pattern region and may pass through the pattern region. According to one embodiment, additional wires may be formed in a region of the pattern region or another region where digitizer wires are not formed, and may be connected in parallel with the digitizer wires. The additional wires may be arranged in a different layer from the digitizer wires and may be connected through a via through.

[0275] An electronic device according to various embodiments of the present document may include a first housing, a second housing rotatably connected to the first housing, a display panel arranged across the first housing and the second housing, and a digitizer plate arranged below the display panel and including wires of a digitizer.

[0276] According to one embodiment, the digitizer plate may include a first plate area disposed in the first housing, a second plate area disposed in the second housing, and a pattern area formed between the first plate area and the second plate area and including a plurality of openings.

[0277] According to one embodiment, the first plate area and the second plate area of ​​the digitizer plate are composed of a plurality of layers including a first layer and a second layer in which wirings of the digitizer are formed, and at least one additional layer, and additional wiring that is electrically connected to the wirings of the digitizer formed in the first layer and / or the second layer can be formed in the at least one additional layer of the first plate area and / or the second plate area.

[0278] According to one embodiment, the patterns formed in the pattern area are formed by the openings formed in the folding area of ​​the support plate, and the wirings formed across the first plate area and the second plate area among the wirings of the digitizer can extend from the first plate area to the second plate area along a winding path around the openings of the pattern area.

[0279] In one embodiment, some of the wires formed in the first layer may bypass the pattern area openings, and some may pass through at least one additional layer of the pattern area.

[0280] According to one embodiment, the at least one additional layer can be formed between the first layer and the second layer.

[0281] According to one embodiment, the at least one additional layer may include a first additional layer adjacent to the first layer and a second additional layer adjacent to the second layer.

[0282] In one embodiment, the first layer may include wirings of the X channel of the digitizer, and the second layer may include wirings of the Y channel of the digitizer.

[0283] According to one embodiment, the wires of the X channel may form a long electrical loop in the horizontal direction of the electronic device, and the wires of the Y channel may form a long electrical loop in the vertical direction of the electronic device.

[0284] According to one embodiment, the additional wiring may be connected to at least one of the X channel or Y channel wiring used as a driving channel of the digitizer.

[0285] According to one embodiment, when the X channel is used as a driving channel of the digitizer, the additional wiring arranged in the at least one additional layer can be connected to the digitizer wiring of the first layer.

[0286] According to one embodiment, when the Y channel is used as a driving channel of the digitizer, the additional wiring arranged in the at least one additional layer can be connected to the digitizer wiring of the second layer.

[0287] According to one embodiment, when the X channel and the Y channel are used as driving channels of the digitizer, the additional wiring arranged in the first additional layer may be connected to the digitizer wirings of the first layer, and the additional wiring arranged in the second additional layer may be connected to the digitizer wirings of the second layer.

[0288] In one embodiment, the additional wiring may not be arranged in an area where the wiring of the digitizer is arranged in the at least one additional layer.

[0289] According to one embodiment, the additional wiring disposed in the at least one additional layer can be connected to the wiring of the digitizer of the first layer and / or the second layer through a via hole.

[0290] In one embodiment, the additional wiring may be connected in parallel with the wiring of the digitizer.

[0291] According to one embodiment, the electronic device further includes a digitizer driving IC that processes a signal of the digitizer, and a connector that connects wires of the digitizer and the digitizer driving IC can be placed within the first housing or the second housing.

[0292] An electronic device according to various embodiments of the present document includes a flexible display including a first housing, a second housing, and a hinge housing connected to the first housing and the second housing, and a support plate disposed on the foldable housing and disposed between the display panel and the foldable housing, wherein the support plate includes a first region corresponding to the first housing, a second region corresponding to the second housing, and a folding region corresponding to the hinge housing, and includes a pattern for bending the folding region, and the support plate includes wires for detecting an electronic pen, and at least two wires among the wires disposed in different layers of the folding region of the support plate can extend in parallel in a first direction through the folding region.

[0293] According to one embodiment, the at least two wires are connected to each other through at least one via, so that one wire can extend to the first region and / or the second region.

[0294] According to one embodiment, one of the wires extending into the first region and the second region of the support plate among the wires can be connected to at least two wires arranged on different layers of the folding region of the support plate through at least one via.

[0295] According to one embodiment, the folding area of ​​the support plate includes a first layer and a second layer in which at least two conductive layers are formed, and a GFRP (glass fiber reinforced polymer) layer may be disposed between the first layer and the second layer.

[0296] According to one embodiment, the pattern for bending of the folding area is formed by openings formed within the folding area of ​​the support plate, and the at least two wires can be formed along a winding path corresponding to different layers of patterns included within the folding area of ​​the support plate.

[0297] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0298] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0299] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0300] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0301] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0302] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, 1st housing; A second housing rotatably connected from the first housing; A display panel arranged across the first housing and the second housing; and A digitizer plate is disposed below the display panel and includes wiring of the digitizer, The digitizer plate includes a first plate area disposed in the first housing, a second plate area disposed in the second housing, and a pattern area formed between the first plate area and the second plate area and including a plurality of openings. The first plate area and the second plate area of ​​the digitizer plate are composed of a plurality of layers including a first layer and a second layer in which the wirings of the digitizer are formed, and at least one additional layer, and An electronic device in which additional wiring is formed in the at least one additional layer of the first plate area and / or the second plate area, the additional wiring being electrically connected to the wirings of the digitizer formed in the first layer and / or the second layer.

2. In paragraph 1, The patterns formed in the above pattern area are formed by the openings formed within the folding area of ​​the support plate, An electronic device in which the wirings of the digitizer, which are formed across the first plate area and the second plate area, extend from the first plate area to the second plate area along a winding path around the openings of the pattern area.

3. In paragraph 2, An electronic device wherein some of the wirings formed in the first layer avoid the pattern area openings, and the remaining some pass through at least one additional layer of the pattern area.

4. In any one of paragraphs 1 to 3, An electronic device wherein said at least one additional layer is formed between said first layer and said second layer.

5. In any one of paragraphs 1 to 4, An electronic device wherein said at least one additional layer comprises a first additional layer adjacent to said first layer and a second additional layer adjacent to said second layer.

6. In any one of paragraphs 1 to 5, An electronic device wherein the first layer includes wirings of the X channel of the digitizer, and the second layer includes wirings of the Y channel of the digitizer.

7. In paragraph 1, An electronic device wherein the wires of the X channel form a long electrical loop in the horizontal direction of the electronic device, and the wires of the Y channel form a long electrical loop in the vertical direction of the electronic device.

8. In paragraph 7, An electronic device in which the above additional wiring is connected to at least one of the X channel or Y channel used as a driving channel of the digitizer.

9. In paragraph 7, When the above X channel is used as a driving channel of the digitizer, the additional wiring arranged in the at least one additional layer is connected to the digitizer wiring of the first layer, When the above Y channel is used as a driving channel of the digitizer, the additional wiring arranged in the at least one additional layer is connected to the digitizer wiring of the second layer, and An electronic device wherein, when the above X channel and the above Y channel are used as driving channels of the digitizer, the additional wiring arranged in the first additional layer is connected to the digitizer wirings of the first layer, and the additional wiring arranged in the second additional layer is connected to the digitizer wirings of the second layer.

10. In any one of paragraphs 1 to 9, An electronic device wherein said additional wiring is not arranged in an area where wiring of said digitizer is arranged in said at least one additional layer.

11. In any one of paragraphs 1 to 10, An electronic device wherein additional wiring arranged in at least one additional layer is connected to wirings of a digitizer of the first layer and / or the second layer through via holes.

12. In any one of paragraphs 1 to 11, It further includes a digitizer driving IC that processes signals from the digitizer, An electronic device in which a connector connecting the wires of the digitizer and the digitizer driving IC is placed within the first housing or the second housing.

13. In electronic devices, A first housing, a second housing, and a hinge housing connected to the first housing and the second housing; and A flexible display is disposed on the foldable housing, and includes a display panel, and a support plate disposed between the display panel and the foldable housing, The support plate includes a first region corresponding to the first housing, a second region corresponding to the second housing, and a folding region corresponding to the hinge housing, and includes a pattern for bending the folding region. The above support plate includes wires for detecting the electronic pen, An electronic device in which at least two wires, among the above wires, are arranged in different layers of the folding area of ​​the support plate and extend in parallel in the first direction through the folding area.

14. In paragraph 13, An electronic device in which the at least two wires are connected to each other through at least one via, and extend to the first region and / or the second region as a single wire.

15. In paragraph 13 or 14, An electronic device in which one of the above wirings extending into the first region and the second region of the support plate is connected to at least two wirings arranged on different layers of the folding region of the support plate through at least one via.

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