Two-dimensional probe arrays comprising vertical probes having spacers make constant contact between adjacent probes and method of forming the same

Abstract

Probe arrays include spacers attached to the probes that were formed along with the probes. Methods of making probe arrays by (1) forming probes on their sides and possibly as linear arrays or combination subarrays (e.g. as a number of side-to-side joined linear arrays) having probes fixed in array positions by a sacrificial material that is temporarily retained after formation of the probes; (2) assembling the probe units into full array configurations using the spacers attached to the probes or using alternative alignment structures to set the spacing and / or alignment of the probe(s) of one unit with another unit; and (3) fixing the probes in their configurations (e.g. bonding to a substrate and / or engaging the probes with one or more guide plates) wherein the spacers are retained or are removed, in whole or in part, prior to putting the array to use.

Description

TWO-DIMENSIONAL PROBE ARRAYS COMPRISING VERTICAL PROBES HAVING SPACERS MAKE CONSTANT CONTACT BETWEEN ADJACENT PROBES AND METHOD OF FORMING THE SAMEField of the Invention:

[0001] The present disclosure relates generally to the field of probes for testing (e.g. wafer level testing or socket level testing) electronic devices (e.g. semiconductor devices) and more particularly to arrays of such probes, wherein the probes may be formed in batch along with permanent or temporary spacers joined to individual probes, alignment structures that are formed with but separated from probes, or separately formed probes and alignment structures, wherein spacer material is different from one or more sacrificial materials that provide joining of at least some probes to one another during batch formation, and wherein for at least some probes, probe- to-probe positioning during formation is different from probe-to-probe positioning within a final array, and wherein one or both of the following conditions are met: (1) final probe-to-probe positioning in an array is set, at least in part, by spacing provided by the spacers or alignment structures, and possibly by probe-to-probe positioning during probe formation, and / or (2) at least some spacers provide for guided movement or at least limited relative movement (e.g. deflection) of probes during usage of the array. In some embodiments, probes are formed from one or more multi-material layers, possibly in combination with non-multi-material layers, with their longitudinal axes laying within the plane of a layer, or planes of multiple layers, wherein the probes are stacked side-by-side, after formation, to form two-dimensional arrays with the tips on one end of the probes located in substantially a common plane and with probes held in array configuration by bonding to a substrate and / or by use of guide plates with through holes that are engaged with the probes.Background of the Invention:

[0002] Probes:

[0003] Probes of various types have been fabricated and used, or have been proposed for use, in semiconductor testing. As the semiconductor industry continues to drive integrated circuit complexity up and size down (more transistors per unit area), a need exists for new and improved probe arrays, methods of making such probe arrays, probe designs for use in such arrays, and / or methods of making such probes where the arrays and probes are used either for testing purposes and associated temporary contact and / or for making permanent contact with such devices. This need drives probes to smaller sizes (e.g., smaller X and Y cross-sectional or lateral dimensions and sometimes to shorter lengths, or longitudinal dimensions, in Z), lower contact force, less scrubbing or more controlled scrubbing, while still maintaining high current carrying capacity so that shorts in failed semiconductor devices do not damage the probes. This need further drives arraysof such probes to finer pitches (i.e., smaller nominal spacing between adjacent probes and probe tips). A need exists for improved probes, probe arrays, and methods of making such probes and arrays to meet the new challenges that that the semiconductor industry is driving.

[0004] Electrochemical Fabrication in General

[0005] Electrochemical fabrication techniques for forming three-dimensional structures from a plurality of adhered layers have been, and are being, commercially pursued by Microfabrica® Inc. (formerly MEMGen Corporation).

[0006] FIGS. 1 A - 11 illustrate side views of various states in an example multi-layer, multimaterial electrochemical fabrication process. FIGS. 1 A - 1 G illustrate various stages in the formation of a single layer of a multi-layer fabrication process where a second metal is deposited on a first metal as well as in openings in the first metal so that the first and second metals form part of the layer. In FIG. 1 A, a side view of a substrate 182 having a surface 188 is shown, onto which patternable photoresist 184 is deposited, spread, or cast as shown in FIG. 1 B. In FIG. 1 C, a pattern of resist is shown that results from the curing, exposing, and developing of the resist. The patterning of the photoresist 184 results in openings or apertures 192(a) - 192(c) extending from a surface 186 of the photoresist through the thickness of the photoresist to surface 188 of the substrate 182. In FIG. 1 D, a metal 194 (e.g., nickel) is shown as having been electroplated into the openings 192(a) - 192(c). In FIG. 1 E, the photoresist has been removed (i.e., chemically stripped) from the substrate to expose regions of the substrate 182 which are not covered with the first metal 194. In FIG. 1 F, a second metal 196 (e.g., silver) is shown as having been blanket electroplated over the entire exposed portions of the substrate 182 (which is conductive) and over the first metal 194 (which is also conductive). FIG. 1 G depicts the completed first layer of the structure which has resulted from the planarization of the first and second metals down to a height that exposes the first metal and sets a thickness for the first layer. In FIG. 1 H, the result of repeating the process steps shown in FIGS. 1 B - 1 G several times to form a multi-layer structure is shown where each layer consists of two materials. For most applications, one of these materials is removed as shown in FIG. 11 to yield a desired 3-D structure 198 (e.g., component or device).

[0007] Electrochemical fabrication provides the ability to form prototypes and commercial quantities of miniature objects, parts, structures, devices, and the like, at reasonable costs and in reasonable times. In fact, electrochemical fabrication is an enabler for the formation of many structures that were hitherto impossible to produce. Electrochemical fabrication opens the spectrum for new designs and products in many industrial fields. Even though electrochemical fabrication offers this new capability, and it is understood that electrochemical fabrication techniques can be combined with designs and structures known within various fields to producenew structures, certain uses for electrochemical fabrication provide designs, structures, capabilities and / or features not known or obvious in view of the state of the art.

[0008] A need exists in various fields for miniature devices having improved characteristics, improved operational capabilities, reduced fabrication times, reduced fabrication costs, simplified fabrication processes, greater versatility in device design, improved selection of materials, improved material properties, more cost effective and less risky production of such devices, and / or more independence between geometric configuration and the selected fabrication process.Summary of the Invention

[0009] It is an object of some embodiments of the invention to provide improved probe arrays. Some such embodiments provide probe arrays that have at least some probes that include permanently adhered spacers or spacer portions that provide for one or more of (1 ) movement of one probe relative to another that is bounded at least in part by the presence of the spacer, (2) positioning of one probe relative to another where spacing or alignment is provided by (a) a spacer attached to one probe interacting with a different probe, (b) a spacer attached to one probe interacting with a spacer attached to another probe, or (c) a spacer attached to one probe interacting with an alignment structure that is not attached to a probe but positioned relative to a plurality of probes, and / or (3) providing a continuous, or condition based electrical relationship, between two or more probes, such as (a) continuous electrical contact, (b) intermittent electrical contact, or (c) electrical separation.

[0010] It is an object of some embodiments of the invention to provide improved methods for making probe arrays. Some such methods provide batch formation of probes followed by assembly of probes or groups of probes into array configurations and then retaining the probes in such array configurations by bonding, lateral engagement and / or longitudinal engagement with substrates, additional alignment structures, and / or guide plates wherein at least some probes are formed with spacers that have dimensions and / or locations that provide for contact spacing or contact alignment between adjacent probes, between spacers on adjacent probes, between adjacent groups of probes, and / or between spacers on adjacent groups of probes, between probes and retention structures. Some such methods may provide release of probes individually or in groups (e.g., by selective retention of a removable sacrificial material, such as one or more conductive sacrificial materials, one or more masking materials that may be differentially removable and that can be used in the capacity of a sacrificial material as well as in a capacity as a patterning material). Groups of probes may have one or more array spacings or alignments set by a removable material with the spacers providing spacing or alignment between individual groups. In some such methods, probes may be formed with or without spacers, probes may be released in groups for assembly, independent spacers may be formed using separate processes relative to theprobes or along with, but separate from the groups of probes, or groups of probes may be aligned by contact spacing or contact alignment with the independent spacers. In some such embodiments, the spacers used in array assembly may be retained in whole, retained in part, or completely removed prior to putting an array to use. It is an object of some embodiments of the invention to form some layers as multi-material layers, with each including at least one structural material and at least one sacrificial material while other layers may be formed with a single material. Some layers formed with a single material may use a sacrificial material that spaces stacked linear probe arrays from one another so that they may be separated from one another upon initial release or such that that may be temporarily held together after an initial release as parts of combination subarrays.

[0011] Other objects and advantages of various embodiments of the invention will be apparent to those of skill in the art upon review of the teachings herein. The various embodiments of the invention, set forth explicitly herein or otherwise ascertained from the teachings herein, may address one or more of the above objects alone or in combination, or alternatively may address some other object ascertained from the teachings herein. It is not necessarily intended that multiple objects of the invention be addressed by any single aspect of the invention even though that may be the case with regard to some aspects.

[0012] In a first aspect of the invention, a two-dimensional probe array comprises: (a) a plurality of probes, comprising: (i) a first end selected from the group consisting of a contact tip and a base; (ii) a second end selected from the group consisting of a contact tip and a base, wherein at least one of the first and second ends comprises a contact tip; (iii) an elongated body portion, longitudinally connecting the first end and the second end, and comprising at least one compliant portion allowing for elastic deformation upon the first end and the second end being compressed toward one another along a longitudinal direction; (b) a plurality of spacers; (c) at least one retention structure for engaging the probes and holding the probes in a two-dimensional array configuration, wherein for at least a portion of the plurality of probes at least one of the plurality of spacers is adhered to a body portion of the probe, and wherein at least some of the spacers make constant contact between the probes to which they adhere and the neighboring probes during relative longitudinal compression of the first end toward the second end of the probes or when there is no relative longitudinal compression of the first end toward the probe end of the probes.

[0013] Numerous variations of the first aspect of the invention are possible and include, for example: (A) the at least one spacer may provide a function selected from the group consisting of: (1 ) setting a minimum contact distance between a portion of the probe to which the at least one spacer is adhered and a portion of a neighboring probe, (2) maintaining a minimum contactdistance between a portion of the probe to which the at least one spacer is adhered and a portion of a neighboring probe, (3) setting a minimum contact distance between a portion of the probe to which the at least one spacer is adhered and at least one spacer attached to a neighboring probe, (4) maintaining a minimum contact distance between a portion of the probe to which the at least one spacer is adhered and at least one spacer attached to a neighboring probe, (5) setting or maintaining a relationship selected from the group consisting of: at least one of a lateral alignment, a longitudinal alignment, a maximum lateral misalignment, and a maximum longitudinal misalignment between a portion of the probe to which the at least one spacer is adhered and a portion of a neighboring probe along a line that is perpendicular to a line extending therebetween; and (6) setting or maintaining a relationship selected from the group consisting of: at least one of a lateral alignment, a longitudinal alignment, a maximum lateral misalignment, and a maximum longitudinal misalignment between a portion of the probe to which the at least one spacer is adhered and at least one spacer attached to the neighboring probe along a line that is perpendicular to a line extending therebetween; (B) at least some spacers may not make contact between the probes to which they adhere and the neighboring probes or one more spacers attached to such neighboring probes under normal operating conditions when there is relative longitudinal compression of the first end toward the second end of the probes; (C) at least a portion of the plurality of spacers may comprise dielectric material that inhibits electric shorting between the probes to which they are attached and one or more neighboring probes; (D) at least a portion of the spacers may provide a function selected from the group consisting of: (1 ) lateral alignment, and (2) a limit on lateral misalignment under a condition selected from the group consisting of: (a) when the probes are undergoing elastic deformation, (b) when the probes are not under an end- to-end compressive force; (E) at least a portion of the spacers may comprise a conductive material that provide an electrically conductive path between selected probes; (F) at least a portion of the spacers adhered to some probes may not directly engage other probes but engages the other probes by contact with spacers adhered to the other probes; (G) at least some of the probes may have non-linear configurations along planes that contain the longitudinal axes of the probes and an axis of layer stacking; (H) at least some of the probes may have non-linear configurations in planes that are perpendicular to an axis of layer stacking; (I) a contact between a spacer adhered to one probe may made contact with another probe or with a spacer of another probe via a surface feature that is selected from the group consisting of: (1) a planar feature, (2) a feature of a single layer, (3) a layer edge and (4) a feature that extends perpendicular to a layer stacking direction; (J) a plurality of linear probe arrays may be provided with each linear probe array including a plurality of probes formed on their sides, with at least some of the plurality of probes having a spacer adhered to a body of the probe and the plurality of probes of a respective linear array connectedtemporarily to one another by retained portions of a first sacrificial material; (K) the first end may comprise at least one first end material, the second end may comprise at least one second end material, and the elongated body portion may be formed of at least one body material, (L) the material being chosen in the group consisting of: nickel, copper, beryllium copper, nickel phosphorous, nickel-cobalt, tungsten, aluminum copper, steel, P7 alloy, palladium, palladiumcobalt, silver, molybdenum, manganese, brass, chrome, chromium copper, gold, tin, silver, zinc, solder, rhodium, rhenium and combinations thereof;

[0014] In a second aspect of the invention a method of forming a two-dimensional probe array, comprises: (a) forming a plurality of linear probe arrays with each linear probe array (300) including a plurality of probes formed on their sides, with at least some of the plurality of probes having a spacer adhered to a body of the probe, and wherein the plurality of probes of a respective linear array are connected temporarily to one another by retained portions of a sacrificial material; (b) stacking multiple linear probe arrays side-to-side using the spacers, to at least partially set spacing of the probes, or alignment of the probes of different linear probe arrays with respect to one another to achieve a two-dimensional array configuration; (c) providing at least one array retention structure and engaging the two-dimensional probe array with the at least one retention structure to engage the probes of the linear probe arrays comprised therein, and thereafter, removing the retained portions of the sacrificial material to release the probes from their respective linear probe arrays, wherein at least some of the spacers makes constant contact between the probes to which they adhere and the neighboring probes during relative longitudinal compression of a first end toward a second end of the probes or when there is no relative longitudinal compression of the first end toward the second end of the probes, the first and second ends of the probes being selected from the group consisting of: a contact tip and a base.

[0015] Numerous variations of the first aspect of the invention are possible and include, for example: (A) forming the plurality of linear probe arrays may comprise (i) forming one or more multi-material layers, with any successively formed multi-material layers adhered to a previously formed multi-material layer or a non-multi-material layer that in turn was adhered directly or indirect to a previously formed multi-material layer, and with each multi-material layer comprising at least two materials, at least one of which is at least one structural material and at least one other of which is at least one further sacrificial material, wherein each multi-material layer defines a successive cross-section of the plurality of linear probe arrays; and (ii) after the forming the one or more multi-material layers which are required to build up each linear probe array, removing at least one further sacrificial material from regions that connect the plurality of linear probe arrays to each other while leaving at least a portion of the sacrificial material in place that connects the probes within each linear probe array to one another to reveal the individual linear probe arrays; and (B)forming of each multi-material layer may comprise a) depositing at least a first of the at least two materials; b) depositing at least a second of the at least two materials; c) planarizing at least two of the at least two deposited materials, including planarizing at least one structural material and at least one sacrificial material.

[0016] Other variations of the first and second aspect of the invention are possible and include, for example: (A) the at least one retention structure including at least two retention structures; (B) the at least one retention structure including a structure selected from the group consisting of (1) at least one substrate to which the one end of the probes of the two-dimensional probe configuration are bonded; (2) at least one guide plate with which at least one end of the probes of the two-dimensional probe array engage; (3) at least two guide plates with which the probes to the two-dimensional probe array engage; and (4) at least three guide plates with which the probes of the two-dimensional probe array engage; (C) at least a portion of some spacers and at least a portion of their respective probes being formed on the same layer; (D) at least a portion of some spacers being formed on layers that do not include any portion of their respective probes; (E) at least some spacers mating with neighboring probes, or spacers attached to those neighboring probes in a line connecting the probes so as to set a distance between the respective probes during array assembly; (F) at least some spacers mating with neighboring probes, or spacers attached to the neighboring probes along a line substantially perpendicular to a line joining the probes so as to provide an alignment of the respective probes selected from the group consisting of (1) a lateral alignment and (2) a longitudinal alignment; (G) at least some spacers being joined to a side of a probe including at least one edge of a layer wherein at least one of the following conditions is met: (1) the spacers meet edges of adjacent linear arrays with widths that are one layer thickness in width; (2) the spacers are proud of the neighboring portions of the temporarily joined linear array to which they are held; (3) the spacers contact edges of adjacent linear arrays along widths associated with single layers; (4) the spacers contact edges of adjacent second linear arrays via second spacers that are held to their temporarily joined second linear array where the second spacers are proud of other portions of the second linear arrays and wherein a contact portion of the second spacers are no more than one layer wide; (H) at least some spacers are adhered to a layer face of their respective probes; (I) at least some spacers are located on at least one layer face of their respective probes and along at least one layer edge of their respective probes; (J) at least some spacers are located on two different portions of a face of their respective probes; (K) at least some spacers are located on two different portions of a single layer of their respective probes; (L) at least some spacers are located on both front and back faces of the layer or layers of their respective probes; (M) at least some of the spacers become permanent parts of the array as the array will be put to use; (N) at least some of spacers aretemporary and are removed prior to putting the array to use; (O) at least some of the spacers are in part permanent and in part temporary wherein the permanent parts form part of the probe array when the probe array is put to use and the temporary parts are removed prior to putting the probe array to use; (P) at least a portion of at least some spacers are not formed on multi-material layers but instead are formed as part of one or more layers that do not include a sacrificial material; and (Q) at least some spacers are used in positioning one or more retention structures.

[0017] Other aspects of the invention will be understood by those of skill in the art upon review of the teachings herein. Other aspects of the invention may involve combinations of the above noted aspects or variations of those aspects. These other aspects of the invention may provide various combinations of the aspects presented above as well as provide other configurations, structures, functional relationships, and processes that have not been specifically set forth above.Brief Description of the Drawings:

[0018] FIGS. 1 A - 1 F schematically depict the formation of a first layer of a structure using adhered mask plating where the blanket deposition of a second material overlays both the openings between deposition locations of a first material and the first material itself.

[0019] FIG. 1 G depicts the completion of formation of the first layer resulting from planarizing the deposited materials to a desired level.

[0020] FIGS. 1 H and 11 respectively depict the state of the process after formation of the multiple layers of the structure and after release of the structure from the sacrificial material.

[0021] FIGS. 2A - 2F show six views of a probe according to an embodiment of the disclosure wherein the probe is a straight pin (e.g., formed from two layers) with the probe body formed on one layer and a spacer located on another layer.

[0022] FIGS. 3A - 3D illustrate four different relationship configurations for a plurality of probes of the type shown in FIGS. 2A - 2F.

[0023] FIGS. 4A-1 , 4A-2, 4B-1 , 4B-2, 4C-1 , 4C-2, 4D-2 and 4D-2 are views of the array of FIG. 3D, along the X-direction and the Y-direction, respectively, in different states of formation.

[0024] FIGS. 5A-1 , 5A-2, 5B-1 , 5B2. 5C1 -, 5C-2, 5D-1 , 5D-2, 5E-1 , 5E-2, 5F-1 , 5F-2, 5G-1 , 5G-2, 5H-1 and 5H-2 are additional views of the array of FIG. 3D with each figure providing a view along the Y-direction (to provide X - Z visible features) and the X-direction (to provide Y - Z visible features) associated with a different state in the assembly of a probe array.

[0025] FIGS. 6A and 6B show an alternative embodiment wherein instead of the probes being provided with an X direction shift, they are instead provided with a Y-direction shift.

[0026] FIGS. 7A and 7B show another alternative embodiment wherein the probes are provided with a curvature induced by a shift in the Y-direction and wherein the spacers are retained without reduction in width.

[0027] FIGS. 8A-1 , 8A-2, 8B-1 , 8B-2, 8C-1 , 8C-2, 8D-1 , 8D-2, 8E-1 , 8E-2, 8F-1 and 8F-2 are illustrations of various configurations of an exemplary 4 x 3 probe array during different steps of its manufacturing method, wherein the probes are held in array configuration by a pair of guide plates.

[0028] FIGS. 9A and 9B show an alternative of the configuration shown in FIGS. 8E-1 and 8E-2 wherein an X-direction shift occurred instead of a Y-direction shift.

[0029] FIGS. 10A and 10B show another alternative embodiment wherein the probes are provided with a curvature induced by a shift along the Y-direction and wherein the spacers are retained without reduction in width.

[0030] FIGS. 11A-11 C, 11 D1 , 11 D-2, 11 E-1 , 22E-2,11 F-1 , 11 F-2, 11 G-1 , 11G-2, 11 H-1 , 11 H-2, 1111 - 111-2, 11 J-1 and 1 1 J-2 illustrate the an exemplary 4 x 3 probe array during different steps of its manufacturing method with spacers that are formed from two materials.

[0031] FIGS. 12A - 12E show another example probe array configuration along with isometric illustrations of various states involved in the process of forming the array wherein the process bonds linear probe arrays at a non-perpendicular angle to a permanent substrate.

[0032] FIGS. 13A - 13B are isometric illustrations of a two-dimensional probe array in two different states of a corresponding process of assembling using non-probe attached spacers or alignment structures that may be formed from a structural material.

[0033] FIGS. 14A - 14B is another illustration involving the use of alternative spacer plates that are not adhered to probes where the plates engage spacer material extending from the sides of the two end probes of each linear array.

[0034] FIG. 14C depicts a linear probe array comprising four three-layer probes, as an example, and having a side facing spacer structure along with an alternative alignment structure.

[0035] FIGS. 15A - 15B show a two-dimensional probe array according to another alternative embodiment using alternative alignment structures not attached to probes with nonlinear subarrays.

[0036] FIGS. 16A - 16D are isometric illustrations of linear probe array according to another embodiment in various states of a corresponding method for creating the linear probe arrays.

[0037] FIGS. 17A - 17D are four views of a probe configuration according to another embodiment of the disclosure where the probe is a straight pin having two spacers located with one on each of two sides of the probe.

[0038] FIGS. 18, 19 and 20 show two views of a probe configuration, one from the frontside or top (left side) and one from the backside or bottom (right side) according to alternative embodiments of probes having two spacers.

[0039] FIGS. 21 A - 21 D show four views of a probe configuration according to a further embodiment where the probe is a straight pin having a spacer located on different sides of the probe.

[0040] FIGS. 22A - 22D show four views of a probe configuration according to a further embodiment where the probe is a straight pin having two spacers located on a side of the probe, e.g., a left side.

[0041] According to some additional embodiments, the probes may be provided with nonlinear configurations in the layer stacking direction, i.e., the direction of the superimposed layers which the probes are formed, due to variations in the cross-sectional configurations forming some layers. In particular, the probes may have non-linear configurations along planes that contain the longitudinal axes of the probes and an axis of layer stacking. Furthermore, the probes may have non-linear configurations in planes that are perpendicular to an axis of layer stacking, i.e., within a plane of the layer or layers of the probes.

[0042] FIGS. 23A - 23D show a final example of an alternative two-dimensional probe array assembly process illustrating the assembly of an example 4 x 3 array of probes by assembling individual probes into 4 x 1 linear arrays, or by forming the probes in such arrays, and then assembling the linear arrays into the 4 x 3 array.

[0043] FIG. 24A provides a generalized flowchart outlining the formation of probes with connected spacers and formation of arrays using temporary or permanent spacers and / or using sacrificial material and / or incorporating spacers as guides, electrical contact elements, or electrical contact inhibitors while arrays are in use.

[0044] FIG. 24B provides a flowchart similar to that of FIG. 24A but with the additional option of providing spacers or guide elements in the form of alternative alignment structures that are not connected to the probes as formed but are added and engaged during assembly, perhaps for the purpose of providing assemblies with enhanced probe positioning for tighter tolerance array formation.Detailed Description of Preferred Embodiments:

[0045] Electrochemical Fabrication in General

[0046] An example of a multi-layer, multi-material electrochemical fabrication process was provided above in conjunction with the illustrations of FIGS. 1 A - 1 1. In some variations, the structure may be separated from the substrate. For example, release of the structure (or multiple structures if formed in a batch process) from the substrate may occur when releasing the structurefrom the sacrificial material particularly when a layer of sacrificial material is positioned between the first layer of the structure and the substrate. Alternative methods may involve, for example, the use of a dissolvable substrate that may be separated before, during or after removal of the sacrificial material, machining off the substrate before or after removal of the sacrificial material, or use of a different intermediate material that can be dissolved, melted or otherwise used to separate the structure(s) from the substrate before, during, or after removal of the sacrificial material that surround the structure(s).

[0047] Various embodiments of various aspects of the invention are directed to formation of three-dimensional structures from materials, some, or all, of which may be electrodeposited or electroless deposited (as illustrated in FIGS. 1 A - 1 1. Some of these structures may be formed from a single build level (e.g., a planarized layer) that is formed from one or more deposited materials while others are formed from a plurality of build levels, each generally including at least two materials (e.g., two or more layers, five or more layers, and even ten or more layers). In some embodiments, layer thicknesses may be as small as one micron or as large as one hundred to two hundred microns. In still other embodiments, layers may be up to five hundred microns, one millimeter, even multiple millimeters, or more. In other embodiments, thinner layers may be used. In still other embodiments, layer thickness may be varied during formation of different levels of the same structure. In some embodiments, microscale structures have lateral features positioned with 0.1 - 10 micron level precision and minimum feature sizes on the order of microns to tens of microns. In other embodiments, structures with less precise feature placement and / or larger minimum features may be formed. In still other embodiments, higher precision and smaller minimum feature sizes may be desirable. In the present application, meso-scale and millimeterscale have the same meaning and refer to devices that may have one or more dimensions that may extend into the 0.1 - 50 millimeter range, or somewhat larger, and features positioned with a precision in the micron to 100 micron range and with minimum feature sizes on the order of several microns to hundreds of microns.

[0048] The various embodiments, alternatives, and techniques disclosed herein may form multi-layer structures using a single patterning technique on all layers or using different patterning techniques on different layers. For example, various embodiments of the invention may perform selective patterning operations using conformable contact masks and masking operations (i.e. operations that use masks which are contacted to but not adhered to a substrate), proximity masks and masking operations (i.e. operations that use masks that at least partially selectively shield a substrate by their proximity to the substrate even if contact is not made), non-conformable masks and masking operations (i.e. masks and operations based on masks whose contact surfaces are not significantly conformable), adhered masks and masking operations (masks and operations thatuse masks that are adhered to a substrate onto which selective deposition or etching is to occur as opposed to only being contacted to it), and / or selective patterned deposition of materials (e.g. via extrusion, jetting, or controlled electrodeposition) as opposed to masked patterned deposition. Conformable contact masks, proximity masks, and non-conformable contact masks share the property that they are preformed and brought to, or in proximity to, a surface which is to be treated (i.e., the exposed portions of the surface are to be treated). These masks can generally be removed without damaging the mask or the surface that received treatment to which they were contacted or located in proximity to. Adhered masks are generally formed on the surface to be treated (i.e., the portion of that surface that is to be masked) and bonded to that surface such that they cannot be separated from that surface without being completely destroyed or damaged beyond any point of reuse. Adhered masks may be formed in a number of ways including (1 ) by application of a photoresist, selective exposure of the photoresist, and then development of the photoresist, (2) selective transfer of pre-patterned masking material, (3) direct formation of masks from computer-controlled depositions of material, and / or (4) laser ablation of a deposited material.

[0049] Patterning operations may be used in selectively depositing material and / or may be used in the selective etching of material. Selectively etched regions may be selectively filled in or filled in via blanket deposition, or the like, with a different desired material. In some embodiments, the layer-by-layer build up may involve the simultaneous formation of portions of multiple layers. In some embodiments, depositions made in association with some layer levels may result in depositions to regions associated with other layer levels (i.e., regions that lie within the top and bottom boundary levels that define a different layer’s geometric configuration).

[0050] Temporary substrates on which structures may be formed may be of the sacrificial- type (i.e., destroyed or damaged during separation of deposited materials to the extent they cannot be reused), non-sacrificial-type (i.e. not destroyed or excessively damaged, i.e. not damaged to the extent they may not be reused, e.g. with a sacrificial or release layer located between the substrate and the initial layers of a structure that is formed). Non-sacrificial substrates may be considered reusable, with little or no rework (e.g., planarizing one or more selected surfaces or applying a release layer, and the like) though they may or may not be reused for a variety of reasons.

[0051] Definitions of various terms and concepts that may be used in understanding the embodiments of the invention (either for the devices themselves, certain methods for making the devices, or certain methods for using the devices) will be understood by those of skill in the art.

[0052] Definitions

[0053] This section of the specification is intended to set forth definitions for a number of specific terms that may be useful in describing the subject matter of the various embodiments of the invention. It is believed that the meanings of most if not all these terms are clear from theirgeneral use in the specification, but they are set forth hereinafter to remove any ambiguity that may exist. It is intended that these definitions be used in understanding the scope and limits of any claims that use these specific terms.

[0054] “Longitudinal” as used herein refers to a long dimension of a probe, an end-to-end dimension of the probe, or a tip-to-tip dimension.

[0055] “Lateral” as used herein is related to the term longitudinal. In terms of the stacking of layers, lateral typically refers to a direction within each layer, or two perpendicular directions within each layer. When referring to probe arrays, lateral generally refers to a direction or pair of perpendicular directions that are parallel to or generally co-planar with the planes formed by one set of probe ends or both sets of probe ends and thus is, or are, perpendicular to a longitudinal axis of the probe array. When referring to probes themselves, the lateral dimensions may be those that are perpendicular to an overall longitudinal axis of the probe, a local longitudinal axis of the probe (that is local lateral dimensions), or simply the dimensions similar to those noted for arrays or layers.

[0056] “Build” as used herein refers, as a verb, to the process of building a desired structure (or part) or plurality of structures (or parts) from a plurality of applied or deposited materials which are stacked and adhered upon application or deposition or, as a noun, to the physical structure (or part) or structures (or parts) formed from such a process. Depending on the context in which the term is used, such physical structures may include a desired structure embedded within a sacrificial material or may include only desired physical structures which may be separated from one another or may require dicing and / or slicing to cause separation.

[0057] “Planarization” is a process that tends to remove materials, above a desired plane, in a substantially non-selective manner such that all deposited materials are brought to a substantially common height or desired level (e.g., within 20%, 10%, 5%, or even 1% of a desired layer boundary level). For example, lapping removes material in a substantially non-selective manner though some amount of recession of one material or another may occur (e.g., copper may recess relative to nickel). Planarization may occur primarily via mechanical means, e.g., lapping, grinding, fly cutting, milling, sanding, abrasive polishing, frictionally induced melting, other machining operations, or the like (i.e. , mechanical planarization). Mechanical planarization may be followed or preceded by thermally induced planarization (e.g., melting) or chemically induced planarization (e.g., etching). Planarization may occur primarily via a chemical and / or electrical means (e.g., chemical etching, electrochemical etching, or the like). Planarization may occur via a simultaneous combination of mechanical and chemical etching (e.g., chemical mechanical polishing (CMP)).

[0058] “Structural material” as used herein refers to a material that remains part of the structure when put into use.

[0059] “Sacrificial material” is material that forms part of a build layer but is not a structural material. Sacrificial material on a given build layer is separated from structural material on that build layer after formation of that build layer is completed and more generally is removed from a plurality of layers after completion of the formation of the plurality of layers during a “release” process that removes the bulk of the sacrificial material or materials. Sacrificial material is typically removed via a chemical etching operation but in some embodiments may be removed via a melting operation or electrochemical etching operation. In typical structures, the removal of the sacrificial material (i.e. , release of the structural material from the sacrificial material) does not result in planarized surfaces but instead results in surfaces that are dictated by the boundaries of structural materials located on each build layer. “Masking material” is a material that may be used as a tool in the process of forming a build layer but generally does not form part of that build layer. Masking material is typically a photopolymer or photoresist material or other material that may be readily patterned. Masking material is typically a dielectric. Masking material, though typically sacrificial in nature, is not generally a sacrificial material as used herein unless if forms part of a completed layer and generally has one or more subsequent layer formed thereon. Masking material is typically applied to a surface during the formation of a build layer for the purpose of allowing selective deposition, etching, or other treatment and is removed either during the process of forming that build layer or immediately after the formation of that build layer.

[0060] “Proud”, is used herein to describe a first feature or surface in relationship to a second feature, or surface wherein the first feature or surface is protruding, raised, or projecting from, or relative to, the second surface or feature.

[0061] Probes, Probe Arrays, and Methods of Making:

[0062] Some embodiments of the invention are directed to probe arrays that include at least some probes and possibly other alignment structures that permanently include, or temporarily included, affixed contact spacers (affixed to a single probe, integrated into a temporary linear array or combination subarray or affixed to another alignment structure and directly or indirectly contactable with one or more other probes, temporary array units, or other alignment structures) that allow (or allowed for) precise contact positioning of probes or alignment structures during probe array formation or movement of probes relative to neighboring probes during probe array usage. In some embodiments, spacing between some probes (e.g. probes formed on their sides as a linear subarray with probe tips spaced by a desired array spacing or possibly as a number of linear subarrays temporarily combined to form two-dimensional subarrays with a desired face-to- face spacing from small number of layers (e.g. 2 - 15 layers) with individual linear subarraysseparated from others by gaps in position or by one or more layers containing sacrificial material and possibly selected regions of one or more spacer materials. In such linear arrays or combined subarrays, probe spacing may be set by sacrificial material used in the formation process which is retained after formation for assembly (e.g., stacking) of separate linear arrays or combined subarrays. One or more outer surfaces of the subarrays or combined subarrays may include spacer material for directly or indirectly engaging probes or alignment structures associated with other subarrays or combined subarrays during assembly of the plurality of subarrays or combined subarrays into final arrays. In these embodiments, spacer material may serve one or more of a number of purposes:(1 ) Temporary spacing between two adjacent probes, between other alignment structures, or between a probe and non-probe alignment structure that sets a distance between the adjacent probes or other alignment structures via direct or indirect contact (e.g. a dielectric spacer, a spacer formed from multiple dielectrics, a conductive spacer, a spacer formed from multiple conductive materials, or a combination of these may be used) where the spacer may be retained, partially removed, or fully removed prior to putting the array to use depending on the relationship between the geometries of the probes, the material the spacer is formed from, the location of the spacer, and the interference in movement that it may cause during array usage;(2) Temporary alignment of two probes or other alignment structures in a lateral direction that is perpendicular to a line connecting the two probes or other alignment structures with or without also providing distance spacing;(3) Temporary alignment of two probes along longitudinal axes of the probes (e.g., alignment of tip or base heights) with or without also providing lateral perpendicular alignment or distance spacing as set forth in (1 ) and (2);(4) The function of any of (1 ) - (3) or one or more of (1 ) - (3) applied multiple times between one probe and another probe, one probe and one alignment structure, and / or one alignment structure and another alignment structure (e.g., applied longitudinally near both the top and bottom of a pair of probe structures);(5) Multiple functions of (1 ) - (3) applied between one probe and another probe, one probe and one alignment structure, and / or one alignment structure and another alignment structure;(6) One or more of the functions of (1 ) - (3) as applied between one probe or other alignment structure and one or more other probes or alignment structures;(7) Different ones of the functions of (1 ) - (3) as applied between one probe and a plurality of other probes or alignment structures or as applied between one alignment structure and a plurality of probes and other alignment structures;(8) A dielectric barrier function to inhibit electrical contact between two adjacent probes prior to and / or during elastic deflection (e.g., the barrier may take the form of a dielectric spacer, a spacer formed from multiple dielectrics, a spacer formed from one dielectric and a conductive material, or the dielectric residual portion of a multi-material spacer that also provided positioning during array assembly prior to removal of a sacrificial portion of the spacer);(9) A permanent conductive contact located between two adjacent probes and providing electrical contact between the probes prior to and / or during elastic deflection (e.g., the contact may take the form of a conductive spacer or a conductive residual portion of a multi-material spacer that also provided positioning during array assembly prior to removal of a sacrificial portion of the spacer); and / or(10) A combination of the functions of (1 ) - (9).

[0063] In some variations, the contact spacers may be used to provide for one or more of:(1) precise spacing of one probe or alignment structure relative to an adjacent probe or alignment structure (e.g., within + / - 5 microns of a target position, more preferably within + / - 2 microns, and most preferably within + / - 1 micron, or less) during array formation,(2) precise alignment of one probe or alignment structure relative to an adjacent probe or alignment structure in a direction with a perpendicular component to a line of contact between the first probe or alignment structure and the second probe or alignment structure (e.g., within + / - 5 microns of a target position, more preferably within + / - 2 microns, and most preferably within + / - 1 micron, or less) during array formation,(3) precise height positioning of one probe tip relative to the height of an adjacent probe tip (e.g., within + / - 5 microns of a target position, more preferably within + / - 2 microns, and most preferably within + / - 1 micron, or less) during array formation.

[0064] In some embodiments, relatively small errors in spacing can accumulate to unacceptable levels as the number of spacing engagements increase. Generally, lateral positioning of parts across a build substrate (e.g., of several inches or more), or the buildup of thickness in a layer stacking direction (e.g., tens to hundreds of microns or even a number of millimeters) results in little significant positioning or thickness errors. However, since builds typically have thickness that are 10 - 1000 times smaller than lateral dimensions, if spacers are used to provide positioning relative to the stacking direction of layers, due to potentially much larger number of spacer interfaces, accumulated errors can become significant and thus additional methods for maintaining reasonable error tolerances are needed particularly when stacking in the direction of layer build up. In different alternative embodiments, error tolerance may be managed in different ways, for example:(1 ) By precisely knowing the thickness of individual layer groups prior to assembly, and / or measuring stacking height or thickness after assembly, an accumulated error can be determined, thus enabling selection of a next layer group to aid in minimizing or even reversing the accumulated error. A next group to add to the stack could be selected to compensate at least in part for the accumulated error based on its own thickness relative to its intended target thickness. In other words, stacking could occur with build groups that are slightly above or below nominal so that any net accumulated error remains near zero or at least within an acceptable tolerance (e.g., + / - 2 microns or less, + / - 5 microns, + / - 10 microns, or perhaps as high as + / - 20 microns or more);(2) By ensuring that each layer group that is to be added to a stack is formed slightly undersized, such that the periodic insertion of one or more thin shims (e.g., 1 - 10 microns in thickness) may occur to ensure that probe locations are always within a reasonable tolerance of their target positions and to ensure that accumulated errors between successive layer groups remain within a required tolerance; and / or(3) By providing linear arrays or combined subarrays with probes having their longitudinal extents lying within the plane or planes of the layers (e.g. in the Z-direction) and with their tips providing array extension along one lateral axis of the plane or planes of build layers (e.g. the Y axis) and extended alignment structures with configurations intended to engage the ends or other portions of the linear arrays or combined subarrays when stacked face-to-face during assembly of full arrays such that local alignment and positioning is provided by contact between linear arrays or combined subarrays but with periodic adjustments due to engagement of groups of such linear arrays or combined arrays to high precision engagement features on extended alignment structures that are positioned at an angle (e.g. perpendicular) to orientation of the linear axes of the linear arrays as well as the longitudinal extends of the probes. Such extended alignment structures may be formed from a permanent structural material that remains in place or is removed from the arrays once formed or they may be formed from a sacrificial material that is removed after array assembly (e.g., after bonding to an array substrate and / or securing of probes by guide plates). In some embodiments, such alignment structures may be formed with their longitudinal dimensions within the plane of one or more formation layers as may be the probes themselves but where the orientation of the alignment structures and probes are relatively rotated (e.g. to perpendicular orientations when array assembly occurs thus allowing the fabrication spacing to control spacing of alignment structure features as well as to control probe-to-probe spacing when alignment using the alignment structure occurs. In some embodiments, alignment structures may be made from multiple slidable elements such that gaps or alignment structures are wide enough or narrow enough to allow easy probe loading into gaps or around protrusions withsome tolerance but where after loading, multiple (e.g. at least two but possibly three or more elements) undergo relative movement (e.g. along planes of alignment structure formation) that provides for narrowing of gaps (e.g. narrowing of spacing between two or more protruding features on two or more alignment elements) or effective expansion of protruding features relatively narrow protruding features on two or more elements by relative sliding causing increased misalignment of originally aligned features) such that tighter position tolerance or even gripping or holding of probes or other alignment structures regions occurs thus providing, at least temporarily, one or more of enhanced probe positioning or enhanced retention of probes.

[0065] In some embodiments, the probes are formed, along with their affixed spacers (whether of the permanent type, sacrificial type, or a combined type) using, at least in part, multilayer, multi-material electrochemical fabrication methods as described herein. In some formation embodiments, the probes are formed on their sides with overall thickness of the layers formed in making probes being relatively small such that probe length (longitudinal dimension) to cross- sectional dimension (lateral dimension) has a ratio of 10, or less, to 200, or more. In some embodiments, a spacer or spacers may be formed as part of a same layer or layers that form the body of the probe while in other embodiments, the spacer or spacers may be formed as part of one or more layers that are different from the layer or layers used to form the body of the probe. In some embodiments, some layers may be limited to single material layers (e.g., sacrificial material) or two materials with neither being a permanent structural material (e.g., a first sacrificial material and a second sacrificial material).

[0066] In some embodiments, in addition to the use of spacers to provide permanent or temporary spacing of probe elements during array assembly or usage, a primary sacrificial material or other structures may be used in providing some spacing or connection between probes. In this regard, a primary sacrificial material may be a material that is used during the formation of structures using a multi-material, multi-layer electrochemical fabrication process to provide a fill material between regions of structural material on each layer being formed. The sacrificial material, in many circumstances, may also provide a conductive plating base on which a next layer may be formed, though in some cases, seed layers, barrier layers, or other relatively thin layers (e.g., 5 - 10, or even 100 times thinner) may be formed over dielectric material to form plating bases for subsequent electrodeposition.

[0067] In some embodiments, spacer contact may be made with other spacers, spacer contact may be made with a body of an adjacent probe, and in still other embodiments, a spacer may make contact with a spacer of another probe and the body of that other probe. In some embodiments, spacer contact involving two probes may provide for spacing of one or more probes that are in line with, adjacent to, or otherwise connected (e.g., via intact sacrificial material) to theprobes directly involved in making spacer-based contact. In other embodiments, other alternative alignment structures (e.g., spacers not adhered to probes) may exist that make spacer-based contact in place of, or in addition to, probes making such contact.

[0068] Spacer material is generally different from the conductive structural materials of the probes and the sacrificial material as may be used during a probe fabrication process. However, in some embodiments, spacer material may include a sacrificial material that is a second type of sacrificial material used in forming probes particularly when selected groups of probes (e.g. linear arrays or combination subarrays) are to be held together by a second type of sacrificial material while individual groups are to be separated one from another by removal of a first sacrificial material. In such cases, removal of the second sacrificial material would remove that portion of the spacers formed from the second sacrificial material while removing it from other portions of the build. Similarly, spacers may include one of the conductive structural materials or materials of the probe when, for example, the spacer is intended to make electrical contact with neighboring probes, or the conductive material is simply acting as a supplemental part of the spacer that will be separated upon removal of an intermediate sacrificial spacer material. Spacers will often only connect to one of the probes being formed and will remain in place after the removal of at least a first sacrificial material and may be retained or removed subsequent to the removal of the first sacrificial material and after performance of one or more spacing operations that make use of that spacer material. Often the spacer material is a dielectric material but, in some cases, may be, or may include a conductive material especially when that conductive material does not extend between the adjacent probes or when the spacer is removed prior to putting a probe array to use. In some embodiments, the spacers will provide a dielectric barrier between two probes, during array usage. When used as a dielectric barrier, the spacer may normally not contact an adjacent probe except possibly during elastic deflection of the probes and particularly when the deflection risks shorting of two adjacent probes together. In other embodiments, where physical configuration of the probes still allows some amount of independent movement of the probe tips, contact between the spacer and the adjacent probe may regularly exist (e.g. when regions of the probes in contact via the spacer move up and down vertically such that the probes can slide relative to one another).

[0069] During formation of probes and / or assembly of probes, probe groups will generally have probe tips located in a plane for contacting pads or bumps on an electronic device or substrate; however, in some implementations, deviations from this general practice may occur (e.g. when probes are intended to contact different semiconductor devices that have their surfaces held in different contact planes). In some arrays, individual probes may extend perpendicular to a contact surface, a mounting surface, guide plate planes, or they may have curved, bent, or angledconfigurations running from a mounting surface to a guide plate or to a contact surface or running between two or more guide plates. In some embodiments, probes may take on different shapes for various reasons including, for example: (1 ) the shapes they are formed with, (2) an orientation set upon initial mounting to a substrate, (3) relative lateral movement of a substrate and one or more guide plates, (4) relative lateral movement between two or more guide plates that hold the probes, and (5) loading contact with a first electronic device or a first set of electronic devices and / or a second electronic device or set of electronic devices. In some testing setups, contact surfaces or sets of electronic devices may require probe arrays that include probes that have not only different but parallel planes of contact but also planes of different contact orientations which may be accommodated by different assembly methods and / or spacer / alignment structure configurations. It is intended that all such variations fall within the scope of the teachings set forth herein unless specifically excluded by specific teachings.

[0070] FIGS. 2A - 2F provide six views of a probe 100, or probe preform (hereafter simply referred to as a “probe” unless the context requires distinguishing between a preliminary probe structure, i.e. probe preform, that is used in array formation, and a finalized probe that forms part of an array as the array is to be put to use) according to an embodiment of the invention wherein the probe is a straight pin (e.g. formed from two layers) with the probe body formed on a first layer 111 and a spacer 120 formed on a second layer 112. The probe 100 comprises a first end 100A and a second end 100B, selected from the group consisting of a contact tip and a base. The first end100A and second end 100B respectively comprise at least one first end material and at least one second end material. An elongated body portion 100C is formed of at least one body material, and longitudinally connects the first end 100A and the second end 100B. Suitably, the elongated body portion 100C comprises at least one compliant portion 130 allowing for elastic deformation upon the first end and the second end being compressed toward one another along a longitudinal direction.

[0071] FIG. 2A provides an isometric view of the probe 100. FIG. 2B provides a view looking down on the probe 100 from above the layer planes. FIG. 2C provides a view of the probe looking up from the bottom. FIGS. 2D and 2E provide side views from opposite sides. FIG. 2F provides an end view of the probe. In other embodiments, a similar probe may be formed from a single layer with both the probe body material and the spacer material forming part of a single layer. In such alternative embodiments, the spacers 120 would be formed in the plane of the probes 100 which in turn would provide a different relationship between the spacer 120 of a probe 100 and the other adjacent probes that might be formed along with the single probe that is shown especially when the probes that are formed together might be part of a linear array which may be used in assembling a full two-dimensional array. Such alternatives might have the spacers that do renot contact adjacent probes but instead use retained sacrificial material as a spacing element while the spacers could function as motion limiters in a finalized probe array.

[0072] In other alternative embodiments, the probe body may be formed from multiple layers and the spacer may also be formed from multiple layers, e.g. from the same layers or a subset of those layers, one or more of those layers in combination with one or more different layers, or just from one or more different layers, but at least in part from a different material. In some embodiments, (e.g. embodiments where the spacer will remain in place while the probe is in use) the spacer may be formed, in whole or in part, from a dielectric material that provides for electric isolation of adjacent probes when required while in other embodiments (e.g. embodiments where the spacer will be removed in whole or in part prior to probe usage), the spacer may be formed from any material or combination of materials including a conductive metal with the primary requirement being the separability of the spacer, or part of the spacer, from the probe.

[0073] In still other embodiments, the spacer and probe features may not sit flush against one another, but the spacer material might include some portion of probe material embedded or even interlocked therein or the probe material may include some embedded or even interlocked spacer material to probe enhanced stability or durability of the connection between the features.

[0074] FIGS. 3A - 3D illustrate four different relationship configurations for a plurality of probes 100 of the type shown in FIGS. 2A - 2F. FIG. 3A provides an example isometric view of three linear arrays 300 (exemplified with four probes 100 each) as formed together on a substrate 311 with a release layer 312 between the substrate and the probes 100 and with the spacers 120 formed above the probe bodies. FIG. 3B provides an isometric illustration of one of the linear arrays 300 that has been released from the substrate 311 and separated from surrounding sacrificial material 313 but wherein at least a retained portion 313a of the sacrificial material 313 between the probes 100 is retained to hold them in registration with one another (along the Y- direction). FIG. 3C provides an isometric view of three such arrays 300 aligned face-to-face but separated from one another (along the X-direction). FIG. 3D provides an isometric view of the three linear arrays 300 after being brought into a desired array configuration (along the X-direction) by a distance Dx set by spacer contact and by the spacing Dy along the Y-direction set by the retained portion 313a of the sacrificial material 313 located between the probes 100.

[0075] Numerous other variations of this example are possible and include for example: (1) each linear array being formed with fewer or with more probes; (2) each linear array having probes that may or may not align with probes in adjacent arrays during assembly; (3) some probes from otherwise uniform linear arrays may be missing; (4) different probe configurations may be used within a single linear array or within an assembled two-dimensional array; (5) instead of a single group of linear arrays forming an entire two-dimensional array, groups of multiple linear arrays maybe stacked on one another (along the X-direction or Y-direction) to form combined subarrays where such combined subarrays may be assembled with one another to form wider and / or longer two-dimensional arrays; (6) probes may be formed with tip structures on one or both ends; (7) probes may be formed with a bonding material (e.g. solder), a bonding promoter on or near one end, or even a masking material to inhibit the spread of a bonding material (e.g. solder) to avoid bridging of the bonding material between two adjacent probes when the probes are to be bonded to a permanent substrate (e.g. a space transformer or interposer substrate); (8) probes, linear arrays, or combination subarrays may be formed with additional or alternative spacer configurations, e.g., (a) a spacer or spacers near the middle of the probe, (b) spacers on multiple sides of a probe, linear array, or combination subarray, to provide not only X-direction spacing but Y-direction and / or even Z-direction spacing or alignment of the probes, stacked linear arrays, or stacked combination subarrays, (c) spacers or alignment structures engaging any other mixture of stacking arrangements of probes, linear arrays, combination subarrays of interest, or (d) spacers and / or other alignment structures with special configurations to lock with other spacers, alignment structures, or probes in multiple directions; and (9) spacers or alignment structures configured to provide for engagement of probes, linear arrays, or combination arrays with other than a fixed and uniform X & Y grid pattern but of a different pattern, e.g. a checkerboard array pattern with only half the cells having probes centered therein, a hexagonal array pattern with probes located at center points or at vertices, a triangular array pattern with probes located at center points or at vertices, or any other uniform or non-uniform pattern appropriate for probes to engage pads of a single DUT or of a plurality of DUTS when performing simultaneous multi-DUT tests or at least simultaneous landings on multiple DUTS.

[0076] According to the embodiment shown in the figures, the spacers 120 are formed so as to make constant contact between the probes 100 to which they adhere and the neighboring probes during relative longitudinal compression of the first end 100A toward the second end 100B of the probes 100, e.g. during a working condition when the probes 100 are undergoing elastic deformation, or when there is no relative longitudinal compression of the first end 100A toward the probe end 100B of the probes 100, e.g. during a rest condition when the probes 100 are not under an end-to-end compressive force.

[0077] FIGS. 4A-1 , 4A-2, 4B-1 , 4B-1 , 4C-1 , 4C-2, 4D-1 , 4D-2 each provide views of a two- dimensional probe array 400 according to an embodiment of the disclosure comprising a plurality of linear arrays 300 of FIG. 3D, along the Y-direction and the X-direction in different states of formation of the array 400, being a 3 x 4 array of probes 100, for sake of example, the two- dimensional probe array 400 being obtained by attaching the linear probe arrays 300 to a substrate 440 that is provided with an array bonding material 445 (e.g., solder).

[0078] FIGS. 4A-1 and 4A-2 show the exemplary two-dimensional probe array 400 according to an embodiment of the disclosure along the Y-axis (to provide X - Z visible features) and along the X-axis (to provide Y - Z visible features), respectively while aligned with, spaced from, and not yet bonded to substrate 440, in particular an array substrate. Each linear probe array 300 includes a plurality of probes 100 formed on their sides, i.e., side-by-side along the Y axis.

[0079] FIGS. 4B-1 and 4B-2 show the exemplary two-dimensional probe array 400 according to an embodiment of the disclosure along the Y-axis and along the -X-axis, respectively, after bonding to the substrate 440 wherein spacing between the probes 100 in the two-dimensional probe array 400 is still set by the spacers 120 of each probe 100 and by the retained portions 310a of the sacrificial material 310 being disposed between the probes 100 along the X axis and the Y axis, respectively. Moreover, an array bonding material 445 or bonding structure is provided on the substrate 440 to ensure a correct positioning of the exemplary array 400, along the X axis and the Y axis, when bonded to the substrate 440. In particular, the bonding structure comprises the array bonding material 445 (e.g., solder) being able to attach the linear arrays 300 as well as the two-dimensional probe array 400 to the substrate 440.

[0080] FIGS. 4C-1 and 4C-2 show the exemplary two-dimensional probe array 400 according to an embodiment of the disclosure along the Y-axis and along the -X-axis, respectively, after removal of the retained portions 313a of the sacrificial material 313 previously provided between the probes 100 of each linear array 300.

[0081] FIGS. 4D-1 and 4D-2 show an optional state of the two-dimensional probe array 400 according to an embodiment of the disclosure along the X-axis and along the Y-axis after the material forming the spacers 120 is removed which may or may not be required to allow the individual probes 100 to elastically compress (e.g., via bending and / or buckling) independently of one another.

[0082] FIGS. 5A-1 , 5A-2, 5B-1 , 5B-2, 5C-1 , 5C-2, 5D-1 , 5D-2, 5E-1 , 5E-2, 5F-1 , 5F-2, 5G- 1 , 5G2, 5H-1 and 5H-2 provide additional views of the array 400 of FIG. 3D with each figure providing a view along the Y-direction (to provide X - Z visible features) and the X-direction (to provide Y - Z visible features), respectively associated with a different state in the assembly of an exemplary two-dimensional probe array 400 according to an embodiment of the disclosure including bonding to a substrate 440 and installing a guide plate 410. FIGS. 5A-1 , 5A-2, 5B-1 and 5B-2 show a two-dimensional probe array 400 in the same process phases shown in FIGS. 4A-1 . 4A-2, 4B-1 and 4B-2. In particular, suitably according to the invention, the exemplary two- dimensional probe array 400 comprises a plurality of linear arrays 300, in turn including the probes 100 which are attached to the substrate 440 while in an array configuration by means of an arraybonding material 445. Suitably, the substrate 440 may be chosen between a spacer transformer, an interposer, or the like.

[0083] FIGS. 5C-1 and 5C-2 shows the two-dimensional probe array 400 according to an embodiment of the disclosure after the retained portions 313a of the sacrificial material 310 are partially removed at an upper portion 100a of the probes 100 to provide gaps 140 around the probe ends 130A at the upper portion 100a thereof. In this way, an engagement with a guide plate 410 is allowed, while still providing precise relative positioning of the probes 100, in particular of the upper probe ends 130A. The plurality of retained portions 313a of the sacrificial material 310 act as a retention structure of the two-dimensional probe array 400, which engages the probes 100 and holds the same in a desired two-dimensional configuration.

[0084] In the present example, removal of the retained portions 313a of the sacrificial material at the upper portion 100a of the probes 100 may have been achieved at least in part by use of a masking material that blocked access of a chemical etchant or selective bombardment radiation (e.g., in the form of electromagnetic radiation or particle bombardment) to the sacrificial material 313 in regions where the sacrificial material 313 was to be retained. In some variations, the sacrificial material 313 may have been a different type than the sacrificial material of the retained portions 313a which could have allowed selective removal of one without the other. In still other variations, removal of the retained portions 313a of the sacrificial material 313 at the upper portion 100a, also indicated as upper portion of the sacrificial material 313 without removal of a lower portion of the sacrificial material 313, i.e. the retained portion 313a outside the upper portion100a of the probes 100, may have been achieved by a timed etching and / or by a series of timed etchings and inspections.

[0085] FIGS. 5D-1 and 5D-2 show two-dimensional probe array 400 according to an embodiment of the disclosure after a guide plate 410 is laterally aligned (in X and Y) relative to the upper end of the probes 100 without the guide plate holes 410A yet engaging the probes 100. FIGS. 5E-1 and 5E-2 show the two-dimensional probe array 400 according to an embodiment of the disclosure after the guide plate 410 engages the upper ends of the probes 100. In some variations, the spacers 120 attached to some or all of the probes 100, or perhaps other probe structural components may provide for longitudinal guide plate 410 positioning. FIGS. 5F-1 and 5F-2 show an optional state of the two-dimensional probe array 400 according to an embodiment of the disclosure corresponding to a method wherein after removal of all spacers 120 the probes100 are left with positioning dictated by the substrate 440 and the engaged guide plate 410. In some alternative embodiments, some spacers 120 or portions of some or all spacers may remain. FIGS. 5G-1 and 5G-2 show another optional state of the two-dimensional probe array 400 according to an embodiment of the disclosure corresponding to a method where the guide plate410 is laterally shifted in the X- direction relative to the substrate 440 to provide a curvature to the probes 100, e.g., to set a preferential bending or buckling direction. In this example, a preferential bending or buckling direction occurs an axis that is parallel to a line existing in the planes of the layer or layers from which the probes are formed FIGS. 5H-1 and 5H-2 show another optional state of two-dimensional probe array 400 according to an embodiment of the disclosure corresponding to a method where the guide plate 410 has been laterally shifted in the Y-direction so that, in effect, the combination of the steps of FIGS. 5G-1 , 5G-2, 5H-1 and 5H-2 provide a net diagonal shift which could have been performed in a single step in some alternatives.

[0086] In some variations of this embodiment, one or more additional steps may be performed that cause back filling of a compressible, or deformable, material around all, or a portion, of each probe, or of selected probes, to provide more structural support for the probes. In still other variations, additional guide plates may be engaged with the probes. In some such alternatives an additional set of plates (e.g. two or more) may be shifted longitudinally toward the bases of the probes and then the plates may be laterally shifted relative to one another near the substrate to provide for a gripping of the probe bases by the shifted plates for improved probe durability and / or retention in the array configuration.

[0087] FIGS. 6A and 6B provides a further alternative of the two-dimensional probe array 400 according to an embodiment of the disclosure corresponding to a method wherein instead of the probes 100 being provided with an X direction shift, they are provided with a Y-direction shift. In this example, a preferential bending or buckling direction occurs about an axis that is perpendicular to the plane of the formation layers. It is noted, as used herein, the direction(s) of shearing force(s) is / are perpendicular to bending or buckling direction of curvature as the direction of bending is the axis around which bending occurs.

[0088] FIGS. 7A and 7B provide another alternative of the two-dimensional probe array 400 according to an embodiment of the disclosure corresponding to a method wherein the probes 100 are provided with a curvature induced by a shift in the Y-direction and wherein the spacers 120 are retained without reduction in width (i.e., amount of protrusion from the probe body). In this example, it is assumed that since the probes 100are not provided with curvature in the Y-direction, i.e. the direction of spacing provided by the spacers 120, the probes 100 while making contact with the spacers 120 will still be able to independently and elastically compress and decompress as contact is made with a contact pad of an electronic circuit element and as separation from the pad occurs, i.e. during the normal working of the probes during a testing of an electronic circuit elements.

[0089] FIGS. 8A-1 , 8A-2, 8B-1 , 8B-2, 8C-1 , 8C-2, 8D-1 , 8D-2, 8E-1 , 8E-2, 8F-1 and 8F-2 provide illustrations of various configurations of an exemplary 4 x 3 probe array according to anembodiment of the disclosure during different steps of a corresponding manufacturing method, the probes 100 being held in array configuration by a pair of guide plates, in particular an upper guide plate 410 and a lower guide plate 420.

[0090] More particularly, FIG. 8A-1 and 8A-2 show the two-dimensional probe array 400 according to an embodiment of the disclosure along the Y-axis and along the -X-axis, respectively wherein the sacrificial material 313 has been removed from the probe ends 100A and 100B, retained portions 313a of the sacrificial material 313being left in the intermediate regions of the probes 100, substantially along their probe body, to provide probe positioning integrity along with guide plates 410, 420 that are laterally aligned and located above and below the two-dimensional probe array 400 for eventual engagement.

[0091] FIGS. 8B-1 and 8B-2 show the two-dimensional probe array 400 according to an embodiment of the disclosure along the Y-axis and along the -X-axis, respectively after engagement of both an upper guide plate 410 and a lower guide plate 420, still comprising retained portions 313a of the sacrificial material 313 between the probes 100.

[0092] Similarly, FIGS. 8C-1 and 8C-2 show the two-dimensional probe array 400 according to an embodiment of the disclosure along the Y-axis and along the -X-axis, respectively after removal of the sacrificial material 313, the probes 100 having respective spacers 120. FIGS. 8D-1 and 8D-2, instead, shown an optional state of the two-dimensional probe array 400 according to an embodiment of the disclosure along the Y-axis and along the -X-axis, respectively corresponding to a method wherein the spacers 120 have been removed.

[0093] FIGS. 8E-1 and 8E-2 show another optional state of the two-dimensional probe array 400 according to an embodiment of the disclosure corresponding to a method wherein a lateral shifting of the two guide plates 410, 420 has occurred in the Y-direction to provide the probes 100 with a desired curvature. Similarly, FIGS. 8F-1 and 8F-2 show another optional state of the two-dimensional probe array 400 according to an embodiment of the disclosure corresponding to a method wherein another lateral shift of the two guide plates 410, 420 has occurred but this time in the X-direction.

[0094] In some alternative embodiments, a third guide plate or even two or more additional guide plates may be added to provide desired probe shaping and retention characteristics. In still other embodiments, probes may comprise spacers, spacer portions, or contain other configurational elements, and / or non-probe guide plate connection elements may be provided that help establish guide plate placement and / or probe retention. In still other embodiments, instead of using a Y-direction shift followed by an X-direction shift, or vice-a-versa, a single diagonal shift of the guide plates relative to one another may occur or a plurality of smaller X, Y, and / or X-Y shiftsmay occur, and in still other embodiments, depending on exact probe positions, lateral rotational shifting may also occur with or without lateral translations.

[0095] FIGS. 9A and 9B show an alternative configuration of the 400 according to an embodiment of the disclosure, starting from the embodiment shown in FIGS. 8E-1 and 8E-2 corresponding to a method wherein an X-direction shift of the two guide plates 410, 420 occurred instead of a Y-direction shift.

[0096] Similarly, FIGS. 10A and 10B show another alternative of the two-dimensional probe array 400 according to an embodiment of the disclosure corresponding to a method wherein the probes 100 are provided with a curvature induced by a shift along the Y-direction of the two guide plates 410, 420 and wherein the spacers 120 are retained without reduction in width. According to this alternative embodiment, since the probes 100 are not provided with curvature in the Y- direction, i.e., the same direction of spacing provided by the spacers 120, the probes 100 will be able to independently and elastically deform when the probe array 400 is driven against contact pads of an electronic component (e.g., in preparation for testing) and is thereafter separated from those pads (e.g., after testing is completed).

[0097] FIGS. 11A-11 C, 11 D1 , 11 D-2, 11 E-1 , 22E-2,1 1 F-1 , 11 F-2, 11 G-1 , 11 G-2, 11 H-1 , 11 H-2, 1111 - 111-2, 11 J-1 and 1 1 J-2 illustrate various states of the two-dimensional probe array 400 according to an embodiment of the disclosure corresponding to a method wherein the spacers 120 are formed from two materials with a first material M1 being attached to a respective probe 100 and the other material being attached to the first material M1 wherein the second material M2 is a temporary material (e.g. a dielectric or conductive material) and the first material M1 is a permanent material (e.g. a dielectric material) that will remain as part of the probes 100 and probe array 400 and wherein the first material M1 may be used as a shorting barrier or guide material while the first and second material 1 and M2 in combination are used as a spacing or alignment feature during array assembly. In particular, the first dielectric material M1 forming the spacers 120 inhibits electric shorting between the probes 100 to which they are attached and one or more neighboring probes in the two-dimensional probe array 400. Moreover, the second conductive material M2 can be used to provide an electrically conductive path between selected probes 100.

[0098] More particularly, FIG. 11 A is an isometric view of and exemplary 3 x 4 two- dimensional probe array 400 comprising three spaced apart linear arrays 300 with four probes 300 each, where each probe 100 holds a spacer 120 formed from a first material M1 and a second material M2. FIG. 11 B is an isometric view of the exemplary 4 x 3 array 400 corresponding to a method when the three linear arrays 300 are positioned against one another with the spacers 120 setting a desired array spacing in the X-direction, a sacrificial material 313 being left between the probes 100 of each linear probe array 300 setting intra-linear array spacing in the Y-direction (otherfeatures not shown may be used to set linear-array-to-linear-array positioning (i.e. inter-linear-array spacing) in the Y-direction). FIG. 11 C is an isometric view of the exemplary 4 x 3 probe array 400 corresponding to a method wherein the second material M2 of the spacers is removed along with the sacrificial material 131 (array retention elements are not shown but are assumed to exist, e.g., in the form of guide plates, bonding to a substrate, and the like).

[0099] Moreover, FIGS. 11 D-1 and 1 1 D-2 show s side view of the exemplary 4 x 3 array 400 along the Y- and X-directions, respectively, corresponding to a method where the spacers 120 and sacrificial material 131 can be seen. FIGS. 11 E-1 and 1 1 E-2 show the exemplary 4 x 3 array 400 corresponding to a method wherein the sacrificial material 313 has been removed from the tops and bottoms of the probes 100 while leaving retained portions 313a of the sacrificial material 313 in place, being sufficient to ensure position integrity of the probes 100 to one another within the exemplary 4 x 3 array 400.

[0100] FIGS. 11 F-1 and 1 1 F-2 show the exemplary 4 x 3 array 400 along the Y-axis and along the X-axis, respectively corresponding to a method wherein an upper guide plate 410 and a lower guide plate 420 are ready for longitudinal engagement with the probes 100. FIGS. 11 G-a and 11 G-2 show the exemplary 4 x 3 array 400 along the Y-axis and along the X-axis, respectively corresponding to a method wherein the guide plates 410 and 420 are longitudinally engaged with the probes 100 within the exemplary 4 x 3 array 400.

[0101] Furthermore, FIGS. 11 H-1 and 11 H-2 show the exemplary 4 x 3 array 400 along the Y-axis and along the X-axis, respectively corresponding to a method the retained portions 313a of the sacrificial material 313 have been removed. FIGS. 111-1 and 1 11-2 show the exemplary 4 x 3 array 400 along the Y-axis and along the X-axis, respectively corresponding to a method wherein optional, opposite, lateral shifting of the guide plates 410, 420 in the Y-direction causes a curvature in the probes 100 that gives them a desired pre-use configuration.

[0102] Finally, FIGS. 11 J-1 and 11 J-2 show the exemplary 4 x 3 array 400 along the Y-axis and along the X-axis, respectively, after removal of the second material M2 forming the spacers 120 but with retention of the first material M1 wherein the gaps between the neighboring probes and spacers ensure free movement of the probes 100 during electronic device contact while the retained first material M1 of the spacer 120 provides a desired function, such as, for example, a dielectric barrier against probe-to-probe electric contact, guide plate or probe retention, alignment or guiding of probes upon deflection, and the like.

[0103] Numerous alternatives are possible and will be apparent to those of skill in the art upon review of the teachings herein (e.g., the spacers may exist at different heights long the longitudinal length of the probes, or at multiple heights along the longitudinal length of the probes, or such multiple spacers may have different thicknesses). In another alternative, the first spacermaterial, at least associated with some probes, may be being a conductive material (e.g. a metal which may be the same or different from the material of the probe body) which may provide shorting or intentional electrical contact between some probes and other probes when some of the probes are deflected or underload. In still another example, the first spacer material may have included temporary or sacrificial material while the second spacer material did not such that upon removal of the first spacer material, the entire spacer is removed. Such a configuration might be useful in a situation where a certain non-removable material was desired as contact surface but where it was still desirable to remove the material after it served its purpose. Such a configuration may also be useful in ensuring that the spacers are retained until all other sacrificial material is removed where upon additional etching, the spacers will also be removed.

[0104] FIGS. 12A - 12E show another example probe array configuration along with isometric illustrations of various states corresponding to a method of forming the array wherein the linear probe arrays 300 are bonded at a non-perpendicular angle a to a permanent substrate 440.

[0105] More particularly, FIG. 12A is an isometric view of individual linear probe arrays 300 in upright, spaced apart positions comprising a plurality of probes 100 linked one another by a sacrificial material 313. FIG. 12B is an isometric illustration of the linear arrays 300 having been rotated to an assembly angle a. FIG. 12C is an isometric view of the linear arrays 300 after having been brought into contact with one another via the spacers 120 of the probes 100 comprised therein. FIG. 12D is an isometric view of an exemplary 4 x 3 array 400 formed by the linear arrays 300 bonded to a substrate 440 via an array bonding material 445 (e.g., via solder bonding). Finally, FIG. 12E is an isometric view of the exemplary 4 x 3 array 400 corresponding to a method wherein the spaces 120 and the retained portion 313a of the sacrificial material 313 have been removed. FIGS. 12A - 12D also provide single coordinate axis diagrams showing the relative directions of the X, Y, and Z axes associated with the probes during their formation while FIG. 12E provides two such coordinate axis diagrams with the left most showing X, Y, and Z directions corresponding to the axes for probe formation while the right most shows X’, Y’, Z’ axes associated with the probe array itself where the Z’-axis or longitudinal axis of the probe array extends perpendicular to the plane formed by the probe tips, the plane formed by the probe bases, as well as the plane of the permanent substrate. The X’ and Y’ axes, or lateral axes, of the probe array have also been rotated relative to their X and Y counterparts so that they remain perpendicular to the Z’ axis.

[0106] Numerous alternatives to the embodiment of FIGS. 12A - 12E are possible and include, for example, providing spacers that can function as alignment guides in the lateral direction parallel to the face of the linear array or even as longitudinal guides. Examples of suchalternative spacers / guides include the bar and slot guides of FIG. 18, the notch and bar guides of FIG. 19, and the bar and U-shaped guides of FIG. 20, as explained below.

[0107] FIGS. 13A - 13B are isometric views of a two-dimensional probe array 400 in two different states of a method of assembling a two-dimensional probe array 400 using non-probe attached spacers 120A, 120B that may be formed from a structural material that may or may not be eventually removed or which may be formed from a sacrificial material 313 that may be removed along with the retained portion 313a of the sacrificial material 313 located between probes 100 within individual linear probe arrays 300.

[0108] More particular, FIG. 13A is a view of twelve 4 x 1 linear probe arrays 300 that are to be positioned with respect to one another (in the configuration shown in the figure) via engagement of two spacer plates 120A, 120B, or alignment structures, having guide slots 125S formed by guide bars 125 that can engage the sides 300S or edges of each linear probe array 300. FIG. 13A depicts a single axis diagram for the probes and a separate axis diagram for the guide plates that each show the build axes (X, Y, and Z) including the layer stacking axis X of each. No separate array (or assembly) axes are shown as they have the same orientation as the axes that are shown. As such in this example, the guide plates are formed on their backs while the probes or linear probe arrays are formed on their sides. FIG. 13B shows the two-dimensional probe array 400 after engagement of the spacer plates 120A, 120B. In later steps (not shown), after engagement of permanent array retention elements (e.g., a bonded substrate, tiled substrates and / or guide plates), the spacer plates 120A, 120B may be removed along with any retained portion 313a of sacrificial material within the individual linear probe arrays 300. In some other alternative embodiments, the spacer plates may be retained, or portions of the spacer plates may be retained (e.g., if the spacer plates are formed from multiple materials) while other portions are removed (e.g., if one of the materials is a structural and the other is a sacrificial material). In still other variations, the spacer plates may take on different configurations such as configurations with tapered edges to ease assembly, multiple elements that may slide relative to one another to provide large gaps for loading that can be transitioned to small gaps for alignment, additional features that provide other alignment or stop functions, and / or independent guide features of each linear probe array so that selective removal of selected features for each linear array could occur.

[0109] FIGS. 14A - 14B show another embodiment involving the use of alternative spacer plates (i.e. spacer plates or alignment structures that are not adhered to probes) similar to those of FIGS. 13A - 13B but where the guide slots 125S of the spacer plates 120A, 120B engage array lateral spacers 150 extending from the sides of the two end probes 100 of each linear probe array 300 (as opposed to the probes themselves) and wherein, as shown in the figures, gaps or variations in spacing of the probes 100, in particular spacing between linear arrays 300 includedinto the two-dimensional probe array 400, may be made to occur. The array lateral spacers 150 with the spacer plates 120A, 120B form an alignment structure 350 of the linear arrays 300.

[0110] In some variations of this embodiment, the probes 100 may be formed from multiple layers and the array lateral spacers 150 may be formed along the edges of the corresponding linear array 300 from multiple layers or from a single layer. Spacers or guides formed as part of alternative alignment structures (i.e., alignment structures not adhered to probes) may also be formed from single or multiple layers. Due to the possibility of layer-to-layer offsets occurring when forming stacked layers (e.g. relatively small offsets on the order of 0.5 - 3 microns or less, due for example to unintended layer-to-layer misalignment), it may be beneficial for one of the layers forming the body of the probes in the spacer regions to protrude beyond the other layers of the probe (i.e. extend or protrude beyond the other edge surfaces of the probe so as to be proud of the other surfaces). It may also be beneficial to ensure that regions of neighboring probes or alternative alignment structures that are to mate with the spacers and that are made from multiple layers also have features that protrude from, or are proud of, the other portions of the probes or alignment structures to ensure that the spacer only contact one layer of the neighboring probe, spacer, or alternative alignment structure and that such contact regions are associated with the same layer so that layer-to-layer positioning offsets do not cause positioning errors when using face-to-face spacer contact during array assembly (e.g. by causing unintended larger or smaller gaps to be formed between spaced probes). Alternatively, spacers may be formed from single layers in the contact regions of the probes and neighboring probes so that regardless of offsets associated with different layers of a body of the probe, the spacers themselves have sufficient extension to ensure single-layer-to-single-layer, face-to-face contact between neighboring probes such that proper probe-to-probe spacing or proper probe-tip-to-probe-tip pitch is provided. In still other alternatives, a combination of probe edge protrusions on a single layer of the probes may be combined with single layer or multiple layer formations of spacers such that a single flat spacer surface is provided that can contact a neighboring probe or alternative alignment structure along a proud, single layer region wherein a single layer of spacer material may be proud of recessed adjacent regions such that the proud surface provides face-to-face contact while the recessed adjacent regions provide enhanced mounting stability for the proud portion of the spacer while potentially also providing side-to-side alignment.

[0111] FIG. 14C shows a linear probe array 300 (exemplified by four three-layer probes) having a side facing portion of the spacer plate 120B along with an alternative alignment structure for which mating is to occur wherein the spacer structure has a single protruding portion extending laterally from the end probes 100 of the linear array 300. In particular, a protruding, single layer extends from a probe 100’ the end probes 100 of the linear array 300 more than correspondingarray lateral spacers 150 protruding from adjacent end probes 100, so to form a proud spacer 150A that is held in place by such recessed array lateral spacers 150 and by a backside attachment 150B protruding from the probe body in correspondence of the protruding, single layer forming the proud spacer 150A, which is then able to be inserted in a corresponding guide slot 125S formed by guide bars 125 of the spacer plate 120B. Suitably, also the guide bars 125 of the spacer plate 120B are made from a single layer. The proud spacer 150A with the backside attachment 150B and the array lateral spacers 150 protruding from adjacent end probes as well as the spacer plates 120A, 120B form the alternative alignment structure 350 of the linear arrays 300.

[0112] As shown, the linear probe array 300 is formed with an orientation that is different from that used to form the alternative alignment structure 350. Both the probe array 300 and the alternative alignment structure 350 are formed from layers with a layer stacking direction being along the X-axis. In the illustrated example, array X-direction positioning is set by guide surfaces of the alignment structure slots that are spaced apart along the Z-direction of the structure while Y- direction positioning of the linear array 300 is set by the spacer contacting an X-direction surface of the alignment structure.

[0113] Various alternatives to the depicted configuration are possible and will be apparent to those of the skill in the art. One such alternative, may provide the alignment structure with a stop at the lower ends of structure or alternatively the spacer with a cap at its upper end such that the vertical loading of the spacer into the alignment guide slot is limited to a set position which sets the Z-height of the linear array relative to the alignment structure. In another example variation, the lower and / or upper ends of the Y-direction edge of the spacer may be formed with tapers to ease engagement of the spacer with the alignment structure. In still another example variation, the upper or lower inward facing edges of the alignment slots may be defined by guide elements that may be formed with tapers to ease the engagement the spacer into the alignment guide slot. In some other example variations, the alignment structures may remain in the final array, may be removed after removal of internal sacrificial material, or may be removed along with removal of internal sacrificial material. In still other variations, slots in the alignment structures may be replaced by other alignment features while the bar-like spacers at the end of linear arrays may be replaced by spacers with other configurations or perhaps even removed in their entirety in favor of having the alignment guide elements and slots engage the probes at the end of the arrays directly.

[0114] FIGS. 15A - 15B show another embodiment of the two-dimensional probe array 400 comprising alternative alignment structures 350 (e.g., spacer plates not attached to probes) with non-linear subarrays 450 (e.g., 4 x 3 combination arrays in this example) where array lateral spacers 150 on the edges of the combination arrays may engage slots 125S in the spacer plates 120A, 120B included in an alternative alignment structure. In this example, sacrificial material,masking material, or spacers 120 may be used for internal spacing between probes 100 within the non-linear subarrays 450. Also, in these figures it is shown that the linear probe arrays in the two- dimensional probe array 400 are formed with an orientation that is different from that used to form the spacer plates 120A, 120B of the alternative alignment structure, as indicated by the XYZ directions in the figures.

[0115] In the example of FIGS. 15A and 15B, slots 125A in spacer plates 120A, 120B part of an alignment structure are shown with vertical side walls which may make high tolerance engagement difficult. Slots, spacers, and potentially even probe bodies can be however formed with angled or sloped regions that will close or expand to tighter tolerance regions while still allowing ease of loading. The slots 125S in the spacer plates 120A, 120B may be somewhat larger than the width of corresponding array lateral spacers 150 attached to the end probes 100 of the linear arrays 300 forming the non-linear subarrays 450.

[0116] Guides in the form of slots in the alignment structures may have tapered ends for easing registration of slots and spacers. Such sloped or angled regions can be most easily formed as lateral regions within individual layers though minimization of stair stepping when transitioning between successive layers may also provide for sloped loading interface regions. In still other variations, the length of spacers may be extended by not only inclusion of probe engagement features but also by inclusion of other features that will allow end-to-end joining or extension of alignment structures. In some variations, the alignment structures may include slidable element that allow large gaps to exist at the time of loading which can be transitioned to smaller gaps when setting alignment.

[0117] Numerous additional variations of the example of FIGS. 15A - 15B are possible and include those noted with regard to FIGS. 14A - 14C as well as the other variations for other probe arrays set forth herein, mutatis mutandis.

[0118] FIGS. 16A - 16D are isometric views of linear arrays 300 in various states of a method for creating a probe array assembly wherein the probes 100 are formed on their sides but with a tilted configuration so that the linear arrays 300 themselves are angled and can be combined with other angled linear arrays to build up two-dimensional angled probe arrays.

[0119] FIG. 16A shows two linear arrays 300 of probes 100 formed on a substrate 311 where the probes 100 are formed with longitudinal extends that are not perpendicular to a base line for the array, where probes 100 are formed with a first material on their upper ends 100B, that is different from a material forming a body of the probes 100, and where probes 100 are formed with a second material, in particular a bonding material at their lower ends 100A and wherein a single spacer 120 is formed along the side of each probe 100 but does not extend to the adjacent probe, as sacrificial material 313 will set the probe-to-probe spacing and the spacers themselveswill not be used in the assembly process but will be used after array formation, for example, for probe-to-probe alignment during deflection or for inhibiting electrical contact between probes. FIG. 16A also set forth two different axis diagrams with the left diagram setting for the longitudinal (Z- axis) and lateral (X and Y axes) of the individual probes 100 or linear probe arrays 300 while the right diagram sets forth the axes associated with layer formation with layer stacking occurring along the X’-axis and with the planes of the layers defined by the Y’- and Z’-axes.

[0120] FIGS. 16B shows the linear arrays 300 after dicing is used to set a top plane 300T and a bottom planes 300B of the linear probe arrays 300. FIG. 16C shows a linear array 300 in a state of the corresponding manufacturing process after separation of a linear array 300 from the substrate 31 1 and from surrounding sacrificial material 313 but while retaining sacrificial material 313 located between most of the length of the probes 100. FIG. 16D shows the linear array 300 after removal of the retained sacrificial material 313 which would generally not occur until after the linear arrays 300 are assembled in a two-dimensional array configuration 400, and substrate mounting and / or guide plate engagement occurs. FIG. 16D also shows the axis diagrams of FIG. 16A indicating that the layer formation diagram provides axes for the probe array itself with the longitudinal axis of the linear probe array 300 extending along Z’ and the lateral directions corresponding to X’ and Y’. Linear probe arrays 300 like those of FIGS. 16A - 16D may be assembled in much the same way the previously discussed arrays are assembled, for example using additional array lateral spacers 150 attached to the front or back of the linear arrays for spacing purposes or use of non-probe spacers or alignment structures as discussed above.

[0121] FIGS. 17A - 17D provide four views of a probe configuration according to a second embodiment of the disclosure where the probe 100 is a straight pin having two spacers 120, 120’ located with one on each of two sides of the probe 100wherein, in this example, the sides are the top and bottom of the probe in the layer stacking direction of probe formation. FIG. 17A provides a view looking down on the probe 100 from above the layer planes showing a first or front spacer 120. FIG. 17B provides a view of the probe 100 looking up from the bottom showing a second or back spacer 120’. FIG. 17C provides a side view showing both spacers 120, 120’. FIG. 17D provides an end view of the probe 100. A linear array 300 of probes may be formed with probes 100 side-by-side with a sacrificial material functioning to provide temporary side-by-side spacing with spacers 120, 120’ extending from the front and the back of the linear array 300. During assembly of two-dimensional arrays 400, the individual linear arrays 300 may be aligned with their tips in a plane and their bodies extending substantially perpendicular to that plane.

[0122] Alternatively, they may be aligned so that the bodies of the probes 100 form a nonperpendicular angle to the plane of the tips wherein the front spacers 120 of the probes 100 on one linear array 300 may engage the faces of the spacers 120’ on the back of the probes 100 of theadjacent linear array 300 or where both sets of spacers 120, 120’ may engage the body of the probes 100 and even set the angle of engagement based on the bottom of the higher spacer engaging or abutting the top of the lower spacer whereby the angle of engagement could be changed by changing the relative heights of the spacers while the separation of the probes could be set by the thickness of the spacers (in the layer stacking direction). In some alternative embodiments, the front spacer and / or the back spacer could be removed after array formation and position setting (e.g., by bonding to a substrate and / or engaged with one or more guide plates) and before usage to allow enhanced independent movement of the probes.

[0013] In some variations, the frontside and backside spacers 120, 120’ may have different thicknesses so that they both participate in lateral or longitudinal alignment while only one participates in face-to-face spacing. In such alternative embodiments, removal of the thicker of the two spacers may allow the thinner spacer to permanently remain to still provide a limitation against probe-body-to-probe-body contact without potentially inhibiting independent movement of the probes over an anticipated working range. In still other variations, such probes 100 and linear probe arrays 300 may have multiple spacers 120, 120’ located on the front and back of the probe 100 at different heights to provide more spacer contact points for more stable mating.

[0124] FIG. 18 provides two views of a probe 100, one from the frontside or top (left side) and one from the backside or bottom (right side) according to another embodiment where the probe is a straight pin having two spacers 120, 120” located on the frontside of the probe 100 (in the layer stacking direction of probe formation) with an intermediate gap 120G and one spacer 120’ located on the center line of the probe 100 on the backside of the probe 100 (in the layer stacking direction of probe formation) such that the backside spacer 120” on one probe 100 can slide between the frontside spacers 120, 120” of an adjacent probe to not only provide appropriate spacing but also to provide side-to-side alignment of stacked probes. In the example shown, it is assumed the probe will be engaged with other probes at an angle such that the frontside of the probe will have an angled downward facing orientation so that the backside spacer 120’ (with an upward facing orientation) on the neighboring probe will engage the frontside spacers 120, 120” with the proper longitudinal positioning when probes are rotated to an appropriate angle.

[0125] In some variations, the probes 100 shown in FIG. 18 may be formed side-by-side in linear array configurations 300 or even be stacked on one another in combined array configurations where sacrificial material might be used as a spacing material in one or both directions. In some variations, the spacers 120, 120’, 120” may exist at similar longitudinal positions on a probe 100 so that engagement occurs when the probes are arrayed in side-by-side configurations with a plane of tips being substantially perpendicular to the longitudinal axes of the probes.

[0126] Of course in other embodiments, probe bodies and spacers may take on other configurations, for example: (1 ) bodies may be formed from multiple materials, (2) a tip may be formed on one or both ends and have any desired configuration and / or be formed of a different material than the rest of the body, and (3) a base may be formed on one end and be formed with the same or different material as the body of the probe where the base or side walls of the body near the base may be formed with a bonding material, an improved material for bonding material adhesion, a barrier material, or other material that will provide a functional advantage. In some other variations of the probe of FIG. 18, the probe may be formed with its longitudinal axis laying within the plane or planes of the build layer or layers, but it may be rotated laterally by 90 degrees such that the spacers face left and right toward and potentially even touching other probes that are part of a linear array. In still other variations, the thickness of the front and back side spacers may be different such that only one of the spacers makes face-to-face contact with the other probe so as to ensure accurate spacing in a manner analogous to that discussed with regard to FIG. 14C.In some such variations, the thicker of the two spacers may be made of a removable material such that after assembly of the array, the removable spacers are removed while the other spacers remain so as to continue to provide for minimum spacing between probes upon excess deformation while providing a desired gap between the probes during normal operation so as not to inhibit independent movement of the probes.

[0127] FIG. 19 shows two views of a probe configuration one from the frontside or top (left side) and one from the backside or bottom (right side) according to another embodiment where the probe 100 is a straight pin having a spacer 120 located on the front and back of the probe (in a direction of layer stacking during probe formation or linear array formation) where the spacers 120 have different shapes that can provide for one or more of (1 ) face-to-face spacing based on the thicker of the mated spacers, (2) engagement upon angled or tilted placement and spacing, and / or (3) some side-to-side alignment as tangential sliding of probe occurs or vertical alignment as longitudinal sliding of adjacent probes occur (e.g. during tilting or straightening) as the notch on the edge of one spacer 120 engages an edge of a protruding complementary spacer on an adjacent probe. The spacer may be used for initial spacing and / or alignment.

[0128] In some variations, the spacers may be removed prior to putting the array into use. In other embodiments, the spacers may be located in different regions than that shown in order to provide different angular engagements. In some embodiments, the different spacers may be formed of the same material (e.g., both sacrificial, both structural, both conductive, or both dielectric) or different materials (e.g., structural, sacrificial, dielectric, or conductive).

[0129] FIG. 20 provides two views of a probe configuration one from the frontside or top (left side) and one from the backside or bottom (right side) according to another embodimentwhere the probe 100 is a straight pin having a spacer 120, 120’ located on each side of the probe where one of the spacers 120 comprises a U-shaped structure while the other spacer 120’ provides a bar-structure that can be slid into the opening in the U-shaped structure during array formation or to maintain side-to-side alignment during usage with the top or bottom of the U-slot providing a relative movement cap. The engaged spacers 120, 120’ may provide probe-to-probe spacing, side-to-side alignment perpendicular to a line joining the two probes, and / or even longitudinal alignment or tip position setting.

[0130] In some embodiments, spacer locations may vary to allow partial or complete longitudinal engagement at different angular configurations. In some implementations, one or both spacers may be sacrificial and thus removable after array configuration and before array usage. In some implementations, the spacers may face front to back relative to the face of a linear array and thus provide an interface when assembling one linear array with another or they may face side-to- side and thus be embedded in sacrificial material that retains probes within their respective linear arrays. In such configurations, the end probes may have spacers extending therefrom that can engage (1 ) probe bodies of different arrays, (2) spacers attached to probes of different arrays, and / or (3) other alignment structures that might be located between different linear arrays during assembly. In some embodiments, the spacers may only provide guide structures to help guide probes during usage of probe arrays and not to provide direct probe-to-probe spacing which may in turn be provided by sacrificial material or other alignment structures that are to be engaged with probes, linear arrays, or combined subarrays during assembly operations.

[0131] FIGS. 21A - 21 D provide four views of a probe configuration according to a further embodiment where the probe 100 is a straight pin having a spacer 120 located on a side of the probe, in particular a left side in the figure, (when longitudinally aligned with and looking down on the probe) and extending on a front face of the probe 100 (i.e. when looking down on the probe from above the layer planes) such that during array assembly relative probe positioning may be set from side-to-side as well as front-to-back by contact between probe bodies and the spacers 120 on adjacent probes which may be used to set a probe-to-probe pitch in two directions (e.g. in two perpendicular directions). FIG. 21 A provides a view looking down on the probe 100 from above the layer planes, showing the spacer 120 frontally. FIG. 21 B provides a view of the probe 100 looking up from the bottom, showing the spacer 120 laterally. FIG. 21 C provides a view from the left side of the probe 100, showing the spacer 120 frontally and laterally. FIG. 21 D provides an end view of the probe 100.

[0132] Numerous alternative embodiments are possible and include spacer patterns that extend completely around the lateral extends of the probes which could provide improved adhesion of the spacers to the probe body and spacers located at multiple longitudinal locations along theprobe. In still other variations, as with the other embodiments set forth herein, features of this embodiment may be replaced with features from other embodiments or with features in variations of other embodiments, and / or some features from other embodiments and their variations may be added to supplement the features set forth specifically in the present embodiment.

[0133] FIGS. 22A - 22D provide four views of a probe configuration according to yet a further embodiment where the probe 100 is a straight pin having two spacers 120, 120’ located on a side of the probe 100, in particular a left side in the figure, such that enhanced side-to-side alignment of the probes 100 can occur when assembling or configuring an array of probes where such spacers may be used to not only precisely set spacing of adjacent probes via a spacer near the top of the probe but also via a spacer located near the bottom of the probe which may aid in improving overall probe spacing within an array or within a portion of an array. FIG. 22A provides a view looking down on the probe 100 from above the layer planes, showing both spacers 120, 120”. FIG. 22B provides a view of the probe 100 looking up from the bottom, wherein the spacers are not visible. FIG. 22C provides a view from the left side of the probe 100 showing both spacers 120, 120’. FIG. 22D provides an end view of the probe.

[0134] In some embodiment variations, the spacers may be placed on the front or back of the probes as opposed to being on a side of the probes. With spacers located on the sides, need for retention of sacrificial material during probe array assembly from linear arrays may be lessened. In other embodiments where sacrificial material will be generally used to set side-to-side spacing of probes in a linear array, the spacers may be limited to locations on the ends of the linear array as contact spacers to be used when placing linear arrays beside one another. In some, or all, of the above noted embodiments, the spacers may be used only during assembly and then removed, used during both assembly and operation and thus be retained, or not used during assembly as spacers but instead used only during usage operations to provide some limited guidance of probe movement or to inhibit unintended electric contact between probes. In some variations, when spacers are formed on the sides of multi-layer probes, it may be desirable to limit the spacer, or at least the contact portion of the spacer, to a width corresponding to the thickness of a single layer and to ensure that the surface that the spacer contacts is also limited to a single layer to ensure that layer-to-layer alignment does not cause unintended contact with protruding portions of one or more adjacent layers which could cause local misalignment of probes but also a growing misalignment as the number of stackings increase. One method of ensuring proper alignment is by ensuring that spacers and contact surfaces for spacers are proud of the edges of adjacent layers as discussed above with respect to FIG. 14C. In still other variations, as with the other embodiments set forth herein, features of this embodiment may be replaced with features from other embodiments or with features in variations of other embodiments, and / or some features fromother embodiments and their variations may be added in to supplement the features set forth specifically in the present embodiment.

[0135] FIGS. 23A - 3723D provide a final example of an alternative two-dimensional probe array assembly process illustrating the assembly of an example 4 x 3 array of probes by assembling individual probes into 4 x 1 linear arrays 300, or by forming the probes in such arrays, and then assembling the linear arrays 300 into the 4 x 3 array 400. In this process, subarrays (i.e., small groups of probes) or individual probes are formed with front and side and upper and lower spacers 120 to provide two-dimensional spacing guides along one axis that provides for planar arrays 300 and then along a perpendicular axis for stacking the planar arrays 300.

[0136] More particularly, FIG. 23A is an isometric view of a single probe. FIG. 23B is a view of three example subarrays 300 with probes spaced from one another by an upper spacer 120 and a lower spacer 120’ and with each linear array separated from the others. FIG. 23C shows an example of the subarrays 300 being positioned relative to one another using the spacers 120, 120’ to form a two-dimensional probe array 400. FIG. 37D shows the two-dimensional probe array 400 after removal of the spacers 120, 120’ (without showing supporting structure which holds the probes in position, e.g., a substrate to which the probes are bonded and / or one or more guide plates).

[0137] Numerous alternatives are possible, and as an example, some such alternatives might provide individual spacers that provide both spacing in one direction as well as alignment in one or more perpendicular directions. As another alternative, spacers might exist on neighboring probes such that the spacers engage one another to provide for more than one direction of mating and alignment.

[0138] FIG. 24A provides a generalized flowchart outlining the formation of probes with connected spacers and formation of arrays using temporary or permanent spacers and / or using sacrificial material and / or incorporating spacers as guides, electrical contact elements, or electrical contact inhibitors while arrays are in use. Numerous variations of the embodiment set forth in this flowchart are possible and include, for example, (1 ) replacement of decision blocks with operations or steps based on preset parameters or premade decisions, (2) skipping of steps that are unnecessary based on the present parameters or premade decisions, and (3) adding in or removing optional operations or steps.

[0139] The method of forming a two-dimensional probe array 400 generally comprises:(a) forming a plurality of linear probe arrays 300, each including a plurality of probes 100, formed on their sides, some of the probes 100 having a spacer 120 adhered thereto, and retained portions 313a of a first sacrificial material 313 temporarily connecting the probes 100 to one another;(b) stacking multiple linear probe arrays 300 side-to-side using the spacers 120, to at least partially set spacing of the probes 100, or alignment of the probes 100 of different linear probe arrays 300 with respect to one another to achieve a two-dimensional array configuration; and(c) providing at least one array retention structure 350 and engaging the probes 100 pf the linear arrays 300 in the two-dimensional probe array 400, and thereafter, removing the retained portions 313a of the sacrificial material 313 to release the probes 100.

[0140] According to another embodiment, the step of forming the linear arrays 300 comprises:(i) forming one or more multi-material layers, with any successively formed multi-material layers adhered to a previously formed multi-material layer or a non-multi-material layer that in turn was adhered directly or indirect to a previously formed multi-material layer, and with each multi-material layer comprising at least two materials, at least one of which is at least one structural material and at least one other of which is at least one further sacrificial material, wherein each multi-material layer defines a successive cross-section of the plurality of linear probe arrays 300, wherein the forming of each multi-material layer comprises: a) depositing at least a first of the at least two materials; b) depositing at least a second of the at least two materials; c) planarizing at least two of the at least two deposited materials, including planarizing at least one structural material and at least one further sacrificial material; and(ii) after the forming the one or more multi-material layers which are required to build up each linear probe array 300, removing the further sacrificial material from regions that connect the plurality of linear probe arrays 300 to each other while leaving at least a portion 313a of the first sacrificial material 313 in place that connects the probes 100 within each linear probe array 300.

[0141] FIG. 24B provide a flowchart that provides for the option of providing spacers or guide elements in the form of alternative alignment structures that are not connected to the probes as formed but are added and engaged during assembly, for example, for the purpose of providing assemblies with enhanced probe positioning for tighter tolerance array formation. From block J or L of FIG. 24B the flowchart moves to block N which calls on the block of the flowchart of FIG. 24A to complete formation of an array. Numerous variations of the embodiment set forth in this flowchart are possible and include, for example, (1 ) replacement of decision blocks with operations or steps based on preset parameters or premade decisions, (2) skipping of steps that are unnecessary based on the present parameters or premade decisions, and (3) adding in or removing optional operations or steps.

[0142] Further Comments and Conclusions

[0143] Various other embodiments of the present invention exist. For example, some fabrication embodiments may not use any blanket deposition process. Some embodiments may use selective deposition processes or blanket deposition processes on some layers that are not electrodeposition processes. Some embodiments may use nickel or nickel-cobalt as a structural material while other embodiments may use different materials. For example, preferred spring materials include nickel (Ni), copper (Cu), beryllium copper (BeCu), nickel phosphorous (Ni-P), tungsten (W), aluminum copper (Al-Cu), steel, P7 alloy, palladium, palladium-cobalt, silver, molybdenum, manganese, brass, chrome, chromium copper (Cr-Cu), and combinations of these while still other materials functional and useable. Some embodiments may use copper as the structural material with or without a sacrificial material. Some embodiments, for example, may use nickel, nickel-phosphorous, nickel-cobalt, palladium, palladium-cobalt, gold, copper, tin, silver, zinc, solder, rhodium, rhenium as structural materials while other embodiments may use different materials. Some embodiments, for example, may use copper, tin, zinc, solder, or other materials as sacrificial materials. Some embodiments may use different structural materials on different layers or on different portions of single layers. Some embodiments may remove a sacrificial material while other embodiments may not. Some embodiments may use photoresist, polyimide, glass, ceramics, other polymers, and the like as dielectric structural materials or as sacrificial materials.

[0144] It will also be understood that the probe elements, spacers, and / or other alignment and / or guide structures may be formed with processes which are very different from the processes set forth herein and it is not intended that structural aspects of the invention need to be formed by only the processes taught herein or by processes made obvious by those taught herein.

[0145] Though various portions of this specification have been provided with headers, it is not intended that the headers be used to limit the application of teachings found in one portion of the specification from applying to other portions of the specification. For example, alternatives acknowledged in association with one embodiment, are intended to apply to all embodiments to the extent that the features of the different embodiments make such applications functional and do not otherwise contradict or remove all benefits of the adopted embodiment. Various other embodiments of the present invention exist.

[0146] It is intended that any aspects of the invention set forth herein represent independent invention descriptions which Applicant contemplates as full and complete invention descriptions that Applicant believes may be set forth as independent claims without need of importing additional limitations or elements from other embodiments or aspects set forth herein forinterpretation or clarification other than when explicitly set forth in such independent claims once written. It is also understood that any variations of the aspects set forth herein represent individual and separate features that may form separate independent claims, be individually added to independent claims, or added as dependent claims to further define an invention being claimed by those respective independent or dependent claims should they be written.

[0147] In view of the teachings herein, many further embodiments, alternatives in design and uses of the embodiments of the instant invention will be apparent to those of skill in the art. As such, it is not intended that the invention be limited to the illustrative embodiments, alternatives, and uses described above but instead that it be solely limited by the claims presented hereafter.

Claims

CLAIMSWhat is claimed is:1 . A two-dimensional probe array (400) comprising:(a) a plurality of probes (100), comprising:(i) a first end (100A) selected from the group consisting of a contact tip and a base;(ii) a second end (100B) selected from the group consisting of a contact tip and a base, wherein at least one of the first and second ends comprises a contact tip;(iii) an elongated body portion (100C), longitudinally connecting the first end (100A) and the second end (100), and comprising at least one compliant portion (130) allowing for elastic deformation upon the first end (100A) and the second end (100B) being compressed toward one another along a longitudinal direction;(b) a plurality of spacers (120);(c) at least one retention structure (350) for engaging the probes (100) and holding the probes in a two-dimensional array configuration, wherein for at least a portion of the plurality of probes (100) at least one of the plurality of spacers (120) is adhered to a body portion (100C) of the probe (100), and wherein at least some of the spacers (120) make constant contact between the probes (100) to which they adhere and the neighboring probes during relative longitudinal compression of the first end (100A) toward the second end (100B) of the probes (100) or when there is no relative longitudinal compression of the first end (100A) toward the probe end (100B) of the probes (100).

2. The two-dimensional array of claim 1 wherein the at least one spacer (120) provides a function selected from the group consisting of: (1 ) setting a minimum contact distance between a portion of the probe (100) to which the at least one spacer (120) is adhered and a portion of a neighboring probe, (2) maintaining a minimum contact distance between a portion of the probe (100) to which the at least one spacer (120) is adhered and a portion of a neighboring probe, (3) setting a minimum contact distance between a portion of the probe (100) to which the at least one spacer (120) is adhered and at least one spacer attached to a neighboring probe, (4) maintaining a minimum contact distance between a portion of the probe (100) to which the at least one spacer (120) is adhered and at least one spacer attached to a neighboring probe, (5) setting or maintaining a relationship selected from the group consisting of: at least one of a lateral alignment, a longitudinal alignment, a maximum lateral misalignment, and a maximum longitudinalmisalignment between a portion of the probe (100) to which the at least one spacer (120) is adhered and a portion of a neighboring probe along a line that is perpendicular to a line extending therebetween; and (6) setting or maintaining a relationship selected from the group consisting of: at least one of a lateral alignment, a longitudinal alignment, a maximum lateral misalignment, and a maximum longitudinal misalignment between a portion of the probe (100) to which the at least one spacer (120) is adhered and at least one spacer attached to the neighboring probe along a line that is perpendicular to a line extending therebetween.

3. The two-dimensional array of claim 1 wherein at least some spacers (120) do not make contact between the probes (100) to which they adhere and the neighboring probes or one more spacers (120) attached to such neighboring probes under normal operating conditions when there is relative longitudinal compression of the first end (100A) toward the second end (100B) of the probes (100).

4. The two-dimensional array of claim 1 wherein at least a portion of the plurality of spacers (120) comprises dielectric material that inhibits electric shorting between the probes (100) to which they are attached and one or more neighboring probes.

5. The two-dimensional array of claim 1 wherein at least a portion of the spacers (120) provides a function selected from the group consisting of: (1) lateral alignment, and (2) a limit on lateral misalignment under a condition selected from the group consisting of: (a) when the probes (100) are undergoing elastic deformation, (b) when the probes (100) are not under an end-to-end compressive force.

6. The two-dimensional array of claim 1 , wherein at least a portion of the spacers (120) comprises a conductive material that provide an electrically conductive path between selected probes (100).

7. The two-dimensional array of claim 1 , wherein at least a portion of the spacers (120) adhered to some probes (100) does not directly engage other probes but engages the other probes by contact with spacers adhered to the other probes.

8. The two-dimensional array of claim 1 wherein at least some of the probes (100) have non-linear configurations along planes that contain the longitudinal axes of the probes (100) and an axis of layer stacking.

9. The two-dimensional array of claim 1 , wherein at least some of the probes (100) have non-linear configurations in planes that are perpendicular to an axis of layer stacking.

10. The two-dimensional array of claim 1 , wherein a contact between a spacer (120) adhered to one probe (100) makes contact with another probe or with a spacer of another probe via a surface feature that is selected from the group consisting of: (1 ) a planar feature, (2) a feature of a single layer, (3) a layer edge and (4) a feature that extends perpendicular to a layer stacking direction.11 . The two-dimensional array of claim 1 , further comprising a plurality of linear probe arrays (300) with each linear probe array (300) including a plurality of probes (100) formed on their sides, with at least some of the plurality of probes (100) having a spacer (120) adhered to a body of the probe (100), and wherein the plurality of probes (100) of a respective linear array (300) are connected temporarily to one another by retained portions (313a) of a first sacrificial material (313).

12. The two-dimensional array of claim 1 , wherein the first end (100A) comprises at least one first end material, the second end (100B) comprises at least one second end material, and the elongated body portion is formed of at least one body material.

13. The two-dimensional array of claim 1 , wherein the at least one first end material, the at least one second end material, and the of at least one body material are chosen in the group consisting of: nickel, copper, beryllium copper, nickel phosphorous, nickel-cobalt, tungsten, aluminum copper, steel, P7 alloy, palladium, palladium-cobalt, silver, molybdenum, manganese, brass, chrome, chromium copper, gold, tin, silver, zinc, solder, rhodium, rhenium and combinations thereof.

14. A method of forming a two-dimensional probe array (400), comprising:(a) forming a plurality of linear probe arrays (300) with each linear probe array (300) including a plurality of probes (100) formed on their sides, with at least some of the plurality of probes (100) having a spacer (120) adhered to a body of the probe (100), and wherein the plurality of probes (100) of a respective linear array (300) are connected temporarily to one another by retained portions (313a) of a sacrificial material (313)(b) stacking multiple linear probe arrays (300) side-to-side using the spacers (120), to at least partially set spacing of the probes (100), or alignment of the probes (100) ofdifferent linear probe arrays (300) with respect to one another to achieve a two-dimensional array configuration;(c) providing at least one array retention structure (350) and engaging the two- dimensional probe array (400) with the at least one retention structure (350) to engage the probes (100) of the linear probe arrays (300) comprised therein, and thereafter, removing the retained portions (313a) of the sacrificial material (313) to release the probes (100) from their respective linear probe arrays (300), wherein at least some of the spacers (120) makes constant contact between the probes (100) to which they adhere and the neighboring probes during relative longitudinal compression of a first end (100A) toward a second end (100B) of the probes (100) or when there is no relative longitudinal compression of the first end (100A) toward the second end (100B) of the probes (100), the first and second ends (100A, 100B) of the probes (100) being selected from the group consisting of: a contact tip and a base.

15. The method of claim 14, wherein forming the plurality of linear probe arrays (300) comprises:(i) forming one or more multi-material layers, with any successively formed multi-material layers adhered to a previously formed multi-material layer or a non-multi-material layer that in turn was adhered directly or indirect to a previously formed multi-material layer, and with each multi-material layer comprising at least two materials, at least one of which is at least one structural material and at least one other of which is at least one further sacrificial material, wherein each multi-material layer defines a successive cross-section of the plurality of linear probe arrays (300), wherein the forming of each multi-material layer comprises: a) depositing at least a first of the at least two materials; b) depositing at least a second of the at least two materials; c) planarizing at least two of the at least two deposited materials, including planarizing at least one structural material and at least one sacrificial material; and(ii) after the forming the one or more multi-material layers which are required to build up each linear probe array (300), removing at least one further sacrificial material from regions that connect the plurality of linear probe arrays (300) to each other while leaving at least a portion (313a) of the sacrificial material (313) in place that connects the probes (100) within each linear probe array (300) to one another to reveal the individual linear probe arrays (300).

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