Integrated package LED display module and manufacturing method therefor

Abstract

An integrated package LED display module and a manufacturing method therefor. The manufacturing method comprises: placing an LED display module on a heating platform (12), a surface treatment structure thin film covering a surface epoxy layer of the LED display module; pre-heating a heating roller (10); press-fitting at a constant fixed speed the surface treatment structure thin film, so as to heat same to a semi-cured state and bond same to the surface epoxy layer of the LED display module; after the bonding is completed, peeling off a PET thin film on the surface of the surface treatment structure thin film, allowing an adhesive layer (5), a carbon layer (1) and a matte layer (4) of the surface treatment structure thin film to be bonded to the surface of the epoxy layer of the display module; and removing the display module after the PET thin film has been peeled off, and carrying out illumination for adhesive curing to complete packaging.

Description

An integrated packaged LED display module and preparation method Technical Field

[0001] The present invention relates to the field of LED display, and in particular to an integrated packaged LED display module. Background Art

[0002] The current common technology for manufacturing LED display modules uses FR-4 or BT substrates, with electrical circuits etched onto the surface using copper. Metal holes connect the front and back sides, which serve as the light-emitting and driver surfaces. A full flip-chip LED chip is placed on the light-emitting surface using a die bonder, and the driver IC is soldered onto the device side. Because the light-emitting LED chip is relatively fragile, epoxy or silicone resin is used for surface protection. This is the basic technology. To achieve high contrast, the light-emitting surface protection of the display must have a certain degree of blackness and be transparent. How to achieve consistent blackness and light transmittance between display modules is a difficult problem in the current display module manufacturing technology. At present, surface blackening is usually achieved by means of external surface film, bottom filling black glue, epoxy blackening, etc. Among them, when the display module is filmed on the external surface, the back glue used in the film is not firmly adhered to the epoxy layer of the display module, resulting in the film warping on the surface. In the mass production process, the display screen color is inconsistent due to the batch difference of the film; the thickness of the bottom filling black glue and epoxy blackening coating is often difficult to control accurately. Different process operations and material properties may cause changes in thickness, thereby affecting the blackness and light transmittance of the display module. This difference Consistency may lead to differences in blackness and light transmittance between display modules. During the underfill and epoxy blackening process, the viscosity and fluidity of the materials may cause bubbles or other defects to form. These bubbles or defects may reduce the consistency of blackness and light transmittance, and also affect the quality and reliability of the display module. Underfill and epoxy blackening, as blackening technologies, require additional process steps and equipment, which increases the complexity of the manufacturing process, requiring higher technical requirements and operational difficulty, increasing manufacturing costs and risks. The blackening effect of underfill and epoxy blackening often requires a balance between blackness and light transmittance. Increasing blackness may reduce light transmittance, while increasing light transmittance may weaken blackness. Therefore, it is difficult to simultaneously meet the requirements of high consistency of blackness and light transmittance.

[0003] Summary of the Invention

[0004] The present invention addresses the problem that the LED display screen has a strong modular feel in the black screen state due to the differences between display modules during the display module preparation process, and the differences between modules lead to inconsistent display screen colors. An integrated packaged LED display module is proposed. The specific solution is:

[0005] An integrated packaged LED display module, comprising:

[0006] Driver IC, display substrate, LED chip, protective adhesive layer, surface treatment structure film;

[0007] The driver IC is welded on the device surface of the display substrate, and the LED chip is fixed on the light-emitting surface of the display substrate;

[0008] The packaged LED chip is packaged and fixed in sequence by a protective adhesive layer, a surface-treated structural film material, and a hardened structural adhesive layer;

[0009] The surface treatment structural film comprises: a surface treatment structural film material and a hardened structural adhesive layer;

[0010] The surface treated structural film material comprises: an adhesive layer, a carbon layer, a matte layer and a release layer;

[0011] The matte layer is coated on the surface of the discrete layer, the carbon layer is coated on the surface of the matte layer, and the adhesive layer is coated on the surface of the carbon powder and adhered to the protective adhesive layer;

[0012] The hardened structural adhesive layer is light-curing adhesive.

[0013] Furthermore, a preferred embodiment is provided, wherein the release layer is made of PET material and has a thickness of 10-30 μm.

[0014] Furthermore, a preferred embodiment is provided, wherein the hardened structural adhesive layer is composed of epoxy acrylic resin, propylene glycol diacrylate resin, and dimethylaminoethyl methacrylate.

[0015] Based on the same inventive concept, the present invention also provides a method for preparing an integrated packaged LED display module, the method comprising:

[0016] S1: placing the LED display module on a heating platform, and covering the surface epoxy layer of the LED display module with a surface treatment structure film;

[0017] S2: preheating of the heating roller;

[0018] S3: Pressing the surface treatment film at a constant speed to heat it to a semi-cured state and bond it to the epoxy layer on the surface of the LED display module;

[0019] S4: After the bonding is completed, the PET film on the surface of the surface treatment structure film is peeled off, so that the adhesive layer, carbon layer and matte layer of the surface treatment structure film are bonded to the epoxy layer surface of the display module;

[0020] S5: removing the display module after peeling off the PET film in S4, and performing light-curing to complete the packaging.

[0021] Furthermore, a preferred embodiment is provided, wherein the light curing in S5 includes:

[0022] Placing the display module after peeling off the PET film in S4 on the surface of the customized tooling lifting structure;

[0023] Injecting light-curing glue onto the surface of the display module after the PET film is peeled off through a glue injection system, pressing down the customized tooling hoisting structure, and applying pressure to flatten the light-curing glue and cover the surface of the display module after the PET film is peeled off;

[0024] The light-curing glue is cured on the surface of the surface treatment structure to form a cured glue layer.

[0025] Furthermore, a preferred embodiment is provided, wherein the light irradiation condition is as follows: when the light curing energy reaches 1000 mj / cm 2 ~1300mj / cm 2 , turn off the light.

[0026] Furthermore, a preferred method is provided, in which illumination is performed by an LED UV curing lamp.

[0027] Furthermore, a preferred embodiment is provided, wherein the method further comprises preheating the heating platform, and the preheating temperature is 100°C to 120°C.

[0028] Furthermore, a preferred embodiment is provided, wherein the injected curing glue is 5 g to 20 g.

[0029] Furthermore, a preferred embodiment is provided, wherein the preheating temperature in S2 is 100°C to 130°C.

[0030] The present invention is beneficial in that:

[0031] The present invention solves the problem that the LED display screen has a strong modular feel in a black screen state due to the differences between display modules during the display module preparation process, and the differences between modules lead to inconsistent display screen colors.

[0032] In an integrated packaged LED display module described in the present invention, the film includes a glue layer, a carbon layer, a matte layer and a release layer. The design of these layers helps to eliminate differences between modules and increase the color consistency of the display screen. The selection and arrangement of these layers can reduce the reflection and scattering of light to ensure consistent optical performance between different modules; the matte layer is coated on the surface of the discrete layer, and the carbon layer is coated on the surface of the matte layer. Such a superimposed design can reduce reflection, inhibit light interference and diffraction, thereby reducing color differences. The combination of the matte layer and the carbon layer helps to evenly distribute light and improve the color consistency between modules; the glue layer is coated on the surface of the carbon powder and then covered on the surface of the protective glue layer. This design can increase the protectiveness of the glue layer and reduce the occurrence of color differences. The presence of the glue layer can fill and smooth the surface of the display module, further improving the color uniformity; the hardened structural glue layer is a light-curing glue used to encapsulate and fix the packaged LED chip, so that the components of the display module are tightly connected, reducing internal gaps, thereby reducing light leakage and color differences. The present invention improves the optical consistency between modules through the design of a surface-treated structural film, including a glue layer, a carbon layer, a matte layer and a release layer, as well as the application of a glue layer and a hardened structural glue layer, thereby solving the problem of color inconsistency in the display screen due to module differences.

[0033] The method for preparing an integrated packaged LED display module described in the present invention can effectively reduce interference and diffraction between modules and reduce light reflection and scattering by treating the adhesive layer, carbon layer and matte layer of the structural film on the surface. This structural design can reduce the difference in light sources from different LED modules, thereby making the color of the display more consistent and unified. The surface treated structural film in the present invention can reduce the reflectivity of the display module and increase the transmittance, thereby enhancing the display effect. By reducing the scattering and interference of light, the purity and saturation of the color are improved, making the color of the display more vivid and delicate, and avoiding the problem of unevenness caused by module differences. The problems of color distortion and inconsistency caused by this; the heating and pressing technology and solid glue process adopted can ensure the close bonding of the surface treatment structure film and the LED display module. This adhesive layer has good structural stability, reducing the slight displacement and deformation between the modules, thereby further ensuring the consistency of color; the glue layer, carbon layer and matte layer of the surface treatment structure film can provide an additional protective layer, reducing the problems of scratches, pollution and oxidation on the surface of the module. This protective layer has certain wear resistance and chemical corrosion resistance, which can increase the service life of the display and reduce the risk of color inconsistency caused by changes in the external environment.

[0034] The present invention is applied to the field of large-size splicing of display screens. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] FIG1 is a schematic diagram of an integrated packaged LED display module according to Embodiment 1, wherein 1 is a carbon layer, 2 is an LED chip, 3 is a hardened structural adhesive layer, 4 is a matte layer, 5 is an adhesive layer, 6 is a protective adhesive layer, 7 is a display substrate, and 8 is a driver IC;

[0036] FIG2 is a schematic diagram of a surface treatment structure film material according to the first embodiment, wherein 9 is a release layer;

[0037] FIG3 is a schematic diagram of the protective adhesive layer according to the first embodiment;

[0038] FIG4 is a schematic diagram of the preparation method according to the fourth embodiment, wherein 10 is a heated rubber roller, 11 is a customized tooling, and 12 is a heating platform;

[0039] FIG5 is a release layer according to the eleventh embodiment;

[0040] FIG6 is a schematic diagram of light curing glue according to the eleventh embodiment, wherein 13 is a customized tooling hoisting structure, 14 is a polypropylene film, 15 is a high-transmittance glass, and 16 is an LED UV curing lamp. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in combination with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments.

[0042] Embodiment 1: This embodiment is described with reference to FIG1, FIG2 and FIG3. This embodiment describes an integrated packaged LED display module, the display module comprising:

[0043] Driver IC 8, display substrate 7, LED chip 2, protective adhesive layer 6, surface treatment structure film;

[0044] The driver IC 8 is welded to the device surface of the display substrate 7, and the LED chip 2 is fixed to the light-emitting surface of the display substrate 7;

[0045] The packaged LED chip 2 is packaged and fixed in sequence by the protective adhesive layer 6, the surface treatment structural film material and the hardened structural adhesive layer;

[0046] The surface treatment structural film comprises: a surface treatment structural film material and a hardened structural adhesive layer;

[0047] The surface treated structural film material comprises: an adhesive layer 5, a carbon layer 1, a matte layer 4 and a release layer 9;

[0048] The matte layer 4 is coated on the surface of the discrete layer 9, the carbon layer 1 is coated on the surface of the matte layer 4, and the adhesive layer 5 is coated on the surface of the carbon powder and adhered to the protective adhesive layer 6;

[0049] The hardened structural adhesive layer is light-curing adhesive 3.

[0050] In an integrated packaged LED display module described in this embodiment, the film includes a glue layer, a carbon layer, a matte layer and a release layer. The design of these layers helps to eliminate differences between modules and increase the color consistency of the display screen. The selection and arrangement of these layers can reduce light reflection and scattering to ensure consistent optical performance between different modules; the matte layer is coated on the surface of the discrete layer, and the carbon layer is coated on the surface of the matte layer. Such a superimposed design can reduce reflection, inhibit light interference and diffraction, thereby reducing color differences. The combination of the matte layer and the carbon layer helps to evenly distribute light and improve color consistency between modules; the glue layer is coated on the surface of the carbon powder and then covered on the surface of the protective glue layer 6. This design can increase the protectiveness of the glue layer and reduce the occurrence of color differences. The presence of the glue layer can fill and smooth the surface of the display module, further improving color uniformity; the hardened structural glue layer is a light-curing glue used to encapsulate and fix the packaged LED chip 2, so that the components of the display module are tightly connected, reducing internal gaps, thereby reducing light leakage and color differences.

[0051] This embodiment improves the optical consistency between modules through the design of a surface treatment structural film, including a glue layer, a carbon layer, a matte layer and a release layer, as well as the application of a glue layer and a hardened structural glue layer, thereby solving the problem of color inconsistency in the display due to module differences.

[0052] Embodiment 2: This embodiment further limits the integrated packaged LED display module described in embodiment 1. The release layer 9 is made of PET and has a thickness of 10 μm to 30 μm.

[0053] In this embodiment, the release layer is made of PET, with a thickness of 10 to 30 μm and a release force of 10 to 15 g. The PET substrate is coated with a matte layer. This matte layer is a polyurethane-based matte coating with a coating thickness of 1.5 to 10 μm and is cured at 100 to 150°C. A black ink containing carbon powder is applied to the fully cured carbon layer. The black ink is diluted with a transparent diluent to a fixed transmittance of 30% to 60%. The black ink is evenly applied to the matte layer using a coating machine to a thickness of 1.5 to 10 μm and cured at 100 to 150°C. A modified polyolefin resin is applied to the carbon powder surface. A mixture of glue and curing agent is heated to 120 to 140°C and evenly applied to the carbon layer to a thickness of 1 to 10 μm. After coating, the film is cut to the substrate size, with a width of 140 to 180 mm, adding 20 to 40 mm to the substrate size.

[0054] The release layer in this embodiment effectively isolates the discrete layer from the surface treatment structure film, preventing unnecessary adhesion or contact between them. This helps to protect the integrity and performance of the surface treatment structure film and ensures that it can achieve the expected optical effect. During the manufacturing and assembly process, the release layer serves to simplify the separation process. It makes it easier to separate the surface treatment structure film from other components, reducing the risk of damage or stretching. At the same time, the presence of the release layer also reduces friction and adhesion during the separation process, thereby ensuring a good separation effect. And the release layer acts as a protective layer to prevent the surface treatment structure film from being scratched, worn or contaminated during manufacturing and use. It can provide additional protection, keep the film clean and good in appearance, and extend its service life.

[0055] Implementation method 3: This implementation method further limits the integrated packaged LED display module described in implementation method 1, wherein the hardened structural adhesive layer is composed of epoxy acrylic resin, propylene glycol diacrylate resin, and dimethylaminoethyl methacrylate.

[0056] The hardened structural adhesive layer of this embodiment is specifically composed of: epoxy (meth) acrylic resin, accounting for 60% to 80% of the adhesive, propylene glycol diacrylate resin or glycol diacrylate, accounting for 10% to 20%, and dimethylaminoethyl methacrylate, accounting for 5% to 10%. The adhesive is cured under ultraviolet light with a wavelength of 365nm and a light curing energy of 1000mj / cm 2 ~1300mj / cm 2 It can also be the same type of light-curing glue.

[0057] In some examples, heat-curing glue may be used, such as epoxy or silicone glue, with a curing temperature of 90°C to 100°C, a hardness of 75D or above after curing, and a TG temperature of 60°C or above.

[0058] In this embodiment, the epoxy acrylic resin can effectively adhere to the film surface treatment structure, forming a strong connection. Propylene glycol diacrylate resin and dimethylaminoethyl methacrylate also have good adhesion properties, which can enhance the bonding strength between the adhesive layer and other components. The epoxy acrylic resin enables the hardened structural adhesive layer to effectively protect the surface treatment structure film from external impact, vibration, and deformation. Epoxy acrylic resin, propylene glycol diacrylate resin, and dimethylaminoethyl methacrylate all have good heat and chemical resistance. They can remain stable at higher temperatures and resist chemical corrosion, thereby increasing the service life of the adhesive layer. Epoxy acrylic resin, propylene glycol diacrylate resin, and dimethylaminoethyl methacrylate have low viscosity and appropriate fluidity, which facilitates coating, filling, and forming a uniform adhesive layer. This helps ensure uniform contact between the adhesive layer and the surface treatment structure film and provides good adhesion.

[0059] In this embodiment, the hardened structural adhesive layer composed of epoxy acrylic resin, propylene glycol diacrylate resin, and dimethylaminoethyl methacrylate provides excellent adhesion, high strength and rigidity, heat and chemical resistance, and good fluidity and filling properties. This combination helps solidify the adhesive layer and ensures reliable adhesion to the surface-treated structural film, further protecting the film and enhancing its functionality.

[0060] Embodiment 4: This embodiment is described with reference to FIG4 . This embodiment describes a method for preparing an integrated packaged LED display module, the method comprising:

[0061] S1: placing the LED display module on the heating platform 12, and covering the surface epoxy layer of the LED display module with a surface treatment structure film;

[0062] S2: preheating the heating roller 10;

[0063] S3: Press the surface treatment film at a constant speed to heat it to a semi-cured state and bond it to the epoxy layer on the surface of the LED display module.

[0064] S4: After the bonding is completed, the PET film on the surface of the surface treatment structure film is peeled off, so that the adhesive layer 5, the carbon layer 1 and the matte layer 4 of the surface treatment structure film are bonded to the epoxy layer surface of the display module;

[0065] S5: removing the display module after peeling off the PET film in S4, and performing light-curing to complete the packaging.

[0066] The preparation method of an integrated packaged LED display module described in this embodiment can effectively reduce interference and diffraction between modules and reduce light reflection and scattering by using the adhesive layer, carbon layer and matte layer of the surface treatment structure film. This structural design can reduce the difference in light sources from different LED modules, thereby making the color of the display more consistent and unified; the surface treatment structure film in this embodiment can reduce the reflectivity of the display module and increase the transmittance, thereby enhancing the display effect. By reducing the scattering and interference of light, the purity and saturation of the color are improved, making the color of the display more vivid and delicate, avoiding the problem of unevenness caused by the module. The color distortion and inconsistency caused by differences; the heating and pressing technology and solid glue process adopted can ensure the close combination of the surface treatment structure film and the LED display module. This adhesive layer has good structural stability, reducing the slight displacement and deformation between the modules, thereby further ensuring the color consistency; the glue layer, carbon layer and matte layer of the surface treatment structure film can provide an additional protective layer, reducing the problems of scratches, pollution and oxidation on the surface of the module. This protective layer has certain wear resistance and chemical corrosion resistance, which can increase the service life of the display and reduce the risk of color inconsistency caused by changes in the external environment.

[0067] Embodiment 5: This embodiment further limits the method for preparing an integrated packaged LED display module described in embodiment 4. The light-curing process in S5 includes:

[0068] Place the display module after peeling off the PET film in S4 on the surface of the customized tooling lifting structure 13;

[0069] Inject light-curing glue onto the surface of the display module after the PET film is peeled off through the glue injection system, press down the customized tooling lifting structure 13, and apply pressure to flatten the light-curing glue and cover the surface of the display module after the PET film is peeled off;

[0070] The light-curing glue is cured on the surface of the surface treatment structure to form a cured glue layer.

[0071] In this embodiment, the light-curing glue used in the light-curing glue can be quickly cured and hardened by irradiating ultraviolet light of a specific wavelength. This light-curing characteristic can completely cure the glue in a short time, improve production efficiency, and ensure the firmness and stability of the glue layer; by pressing down the customized tooling hoisting structure and applying pressure, the light-curing glue can be evenly flattened on the surface of the LED display module and covered on the entire surface treatment structure film after the film is applied, so as to ensure that a uniform cured glue layer is formed in the entire display area, thereby improving the reliability and life of the display device; the cured glue layer formed during the curing process of the light-curing glue can provide protection and encapsulation, which can prevent dust, moisture and other environmental factors from invading the interior of the LED display module, protect the circuits and components therein from damage, and improve the overall waterproof performance and durability.

[0072] The light curing step of this embodiment uses light-curing glue to achieve rapid curing and hardening, so that a uniform cured glue layer is formed on the surface of the entire LED display module after the film is applied. This can provide protection and packaging, enhance the reliability and life of the display device, and improve production efficiency, making it suitable for large-scale production environments.

[0073] Implementation 6: This implementation is a further limitation of the preparation method of an integrated packaged LED display module described in Implementation 5. The illumination condition is: when the light curing energy reaches 1000mj / cm 2 ~1300mj / cm 2 , turn off the light.

[0074] By setting the light curing energy range, the light curing time can be effectively controlled. Once the energy reaches the set range, it means that the light curing is complete and the light can be turned off immediately to avoid unnecessary energy waste caused by over-curing or the heat generated during the curing process having an adverse effect on the display module. Light curing is a time and energy sensitive process. The appropriate energy range during the curing process can ensure that the light curing glue reaches the ideal curing quality within the appropriate time. Set 1000mj / cm 2 ~1300mj / cm 2 The light curing energy range ensures that the glue is fully cured and hardened, providing a strong and reliable cured adhesive layer to protect and encapsulate the LED display module after film application. The setting of lighting conditions allows operators to accurately control the time and energy of the curing process to ensure that each LED display module can achieve the same curing effect. By precisely controlling the light curing energy range and using it as a curing standard, the consistency and stability of the product can be improved, and the risk of under-curing or over-curing can be reduced.

[0075] In this embodiment, the light curing energy range is set and the curing time reaches 1000 mj / cm 2~1300mj / cm 2 Turning off the light at this time can ensure the controllability of the curing time, curing quality and curing process. This can improve the efficiency and consistency of curing, ensuring that each LED display module can obtain a high-quality cured adhesive layer, thereby enhancing the reliability and performance of the product.

[0076] Embodiment 7: This embodiment further limits the method for preparing an integrated packaged LED display module described in Embodiment 5, and uses an LED UV curing lamp 16 for illumination.

[0077] This embodiment uses LED UV curing lamps to generate high-intensity ultraviolet light, rapidly curing the light-curing adhesive. Compared to traditional deuterium lamps, LED curing lamps use less energy, offer greater durability, and have a longer lifespan, thus achieving energy savings. They also generate less heat than traditional deuterium lamps. This is crucial for temperature-sensitive materials or components, such as heat-sensitive films and electronic components. By using LED UV curing lamps, deformation, burning, and other adverse effects caused by excessive temperatures can be avoided.

[0078] Embodiment 8: This embodiment further limits the method for preparing an integrated packaged LED display module described in embodiment 4, wherein the method further includes preheating the heating platform at a temperature of 100° C. to 120° C.

[0079] In this embodiment, preheating the heating platform can increase the temperature of the material, making it easier to cure. The preheated material molecules are more active and react faster, thus promoting the light-curing reaction. This can shorten the curing time and improve production efficiency.

[0080] The preheating platform heats the material to a certain temperature range, allowing it to reach the optimal curing temperature. During the light-curing process, high temperatures provide better curing results, increasing the material's hardness and durability. Furthermore, the preheating platform eliminates trapped or dissolved gases within the material, reducing the risk of bubbles and shrinkage during the light-curing process. Preheating the material facilitates the release of trapped gases, reducing defects during the curing process.

[0081] Implementation method 9: This implementation method further limits the preparation method of the integrated packaged LED display module described in implementation method 5, wherein the amount of injected curing glue is 5 g to 20 g.

[0082] This embodiment ensures coverage of the entire surface of the LED display module after film application by injecting an appropriate amount of light-curing glue. The glue is evenly distributed under applied pressure, forming a continuous cured adhesive layer. This cured adhesive layer protects and encapsulates the LED display module, providing excellent resistance to heat, moisture, and vibration.

[0083] The amount of glue injected ranges from 5g to 20g, which can be precisely controlled based on the size and design requirements of the LED display module. Using the right amount of glue can avoid waste and reduce costs. Choosing the right amount of glue can prevent problems such as excessive glue overflow or incomplete curing, ensuring a high-quality fit and cure.

[0084] Embodiment 10: This embodiment further limits the method for preparing an integrated packaged LED display module described in embodiment 4, wherein the heating temperature in S2 is 100° C. to 130° C.

[0085] In this embodiment, the temperature to which the heating platform is heated can increase the temperature of the adhesive layer (including the epoxy layer and the adhesive layer 5) and accelerate the semi-curing process of the adhesive layer. The adhesive layer in the semi-cured state has a certain viscosity, which can better bond with the epoxy layer of the surface treatment structure film and the LED display module; high temperature can improve the contact between the adhesive layer and the epoxy layer of the LED display module and increase the bonding strength. At a temperature of 100°C to 130°C, the viscosity of the adhesive layer increases, which can better penetrate and combine with the epoxy layer to form a strong and firm bond; after the adhesive layer is semi-cured and bonded to the epoxy layer, the adhesive layer can fully wet and adhere to the epoxy layer of the surface treatment structure film and the LED display module. This makes the bonded joint have better heat resistance, can maintain stable bonding performance under high temperature conditions, and prevent bonding failure or separation.

[0086] Implementation 11: This implementation is described with reference to FIG5 and FIG6. This implementation provides a specific example of the method for preparing an integrated packaged LED display module described in Implementation 4, and is also used to explain Implementation 5 to Implementation 10. Specifically:

[0087] The display module includes:

[0088] Driver IC 8, display substrate 7, light-emitting LED chip 2, protective adhesive layer 6, surface treatment structure film;

[0089] The driver IC 8 is welded to the device surface of the display substrate 7, and the light-emitting LED chip 2 is fixed to the light-emitting surface of the display substrate 7; the packaged LED chip 2 is packaged and fixed in sequence by a protective adhesive layer 6, a surface treatment structural film material, and a hardened structural adhesive layer;

[0090] The surface treatment structural film comprises: a surface treatment structural film material and a hardened structural adhesive layer;

[0091] The surface treated structural film material comprises: an adhesive layer, a carbon layer, a matte layer and a release layer;

[0092] The matte layer is coated on the surface of the discrete layer, the carbon layer is coated on the surface of the matte layer, and the adhesive layer is coated on the surface of the carbon powder; the adhesive layer covers the surface of the protective adhesive layer 6;

[0093] The hardened structural adhesive layer is light-curing adhesive.

[0094] The flip chip is mounted on the pad layer of the light-emitting surface of the display substrate 7, and the driver IC 8 is mounted on the pad layer of the substrate driving surface. Epoxy resin is encapsulated on the surface of the display substrate 7 by molding, so that the epoxy resin is higher than the flip chip surface and solidified.

[0095] The light-curing glue adopts light curing, epoxy (meth) acrylic resin accounts for 60% to 80% of the adhesive, propylene glycol diacrylate resin or glycol diacrylate accounts for 10% to 20%, and ultraviolet light initiator, dimethylaminoethyl methacrylate, accounts for 5% to 10%.

[0096] As shown in Figure 6, this embodiment also provides a surface treatment application structure. The application structure includes a heating platform, a customized tooling 11, and a heating roller 10. The customized tooling is pre-processed. According to the position of the display module drive surface driver IC8, the avoidance groove is deducted from the inside of the customized tooling 11. The display module can place the substrate on the surface of the customized tooling 11, and the avoidance groove can avoid the drive surface driver IC8. A heating device is set under the tooling and a fixed temperature can be set. A heating rubber roller 10 is hoisted above the tooling. The rubber roller is made of silicone and has an embedded heating tube to achieve heating and temperature control. The LED display module is prepared according to the surface treatment application structure, specifically:

[0097] Place the display device with epoxy resin cured in advance in the customized tooling 11. The customized tooling 11 has hollow points so that the substrate with the driver IC 8 can be placed on its surface.

[0098] Preheat the tooling to 100°C to 120°C via the heating platform 12;

[0099] The coated film is spread flat on the epoxy substrate surface and passed through a heated roller 10 at a temperature of 120°C to adhere the film to the epoxy surface. Alternatively, an air bag can be used, heated to 120°C, and vacuumed to adhere the film to the epoxy surface. After application, the release PET film is removed, leaving the film with the adhesive layer 5, carbon layer 1, and matte layer 4 on the epoxy substrate surface.

[0100] The display module with the film applied is removed from the surface of the customized tooling 11 and placed on the surface of the customized tooling hoisting structure 13 with surface treatment and hardening structure. A high-transmittance glass plate 15 is placed directly below the tooling, and a UV LED light source is placed below the high-transmittance glass plate 15.

[0101] Place the polypropylene film 14 on the surface of the glass plate 15 and inject 5g to 20g of glue on it;

[0102] The tooling hoisting structure with the substrate is slowly placed on the surface of the glue-injected polypropylene film 14 at a certain speed, and the light-curing glue is flattened by gravity. The LED UV curing lamp 16 is turned on to reach 1000mj / cm 2 ~1300mj / cm 2 Energy, to cure the fast-curing glue, turn off the light;

[0103] Remove the cured display module and remove any excess adhesive residue;

[0104] The display unit is cut according to the set size to complete the integrated packaged display module.

[0105] In some embodiments, the surface treatment hardening structure is a heat curing process:

[0106] The thermosetting surface hardening structure mainly includes a customized tooling hoisting structure, a heating plate, and a ceramic plate. The ceramic plate is placed on the surface of the heating plate, and the customized tooling hoisting structure is located directly above the ceramic plate. The LED display module is prepared according to the thermosetting surface hardening structure. Specifically:

[0107] Remove the film-applied display module from the surface of the customized tooling and place it on the surface of the customized tooling hoisting structure with surface treatment and hardening structure;

[0108] Turn on the heating plate and ceramic plate together to heat at a temperature of 90°C to 130°C;

[0109] Place a PET film with release force on the surface of the ceramic plate;

[0110] Inject 5g~20g of epoxy resin or silicone on the surface of PET film.

[0111] Place the tooling hoisting structure with the base plate slowly on the surface of the glue-injected polypropylene film at a certain speed, and flatten the epoxy resin glue by gravity. Keep it warm for 5 minutes to 10 minutes to allow the epoxy resin to solidify.

[0112] Remove the cured display module and remove any excess adhesive residue;

[0113] The display unit is cut according to the set size to complete the integrated packaged display module.

[0114] The above further describes the technical solution provided by the present invention in detail in conjunction with the accompanying drawings in order to highlight the advantages and benefits, and is not intended to limit the present invention. Any modification, combination of implementation methods, improvement and equivalent replacement of the present invention based on the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An integrated packaged LED display module, characterized in that: The display module comprises: Driver IC, display substrate, LED chip, protective adhesive layer, surface treatment structure film; The device surface of the display substrate is welded with a driver IC, and the LED chip is fixed on the light-emitting surface of the display substrate; The packaged LED chip is packaged and fixed in sequence by a protective adhesive layer, a surface treatment structural film material and a hardened structural adhesive layer; The surface treatment structural film comprises: a surface treatment structural film material and a hardened structural adhesive layer; The surface treated structural film material comprises: a glue layer, a carbon layer, a matte layer and a release layer; The matte layer is coated on the surface of the discrete layer, the carbon layer is coated on the surface of the matte layer, and the adhesive layer is coated on the surface of the carbon powder and adhered to the protective adhesive layer; The hardened structural adhesive layer is light-curing adhesive.

2. The integrated packaged LED display module according to claim 1, characterized in that: The release layer is made of PET material, and has a thickness of 10um to 30um.

3. The integrated packaged LED display module according to claim 1, characterized in that: The hardened structural adhesive layer is composed of epoxy acrylic resin, propylene glycol diacrylic resin and dimethylaminoethyl methacrylate.

4. A method for preparing an integrated packaged LED display module, characterized in that: The method comprises: S1: placing the LED display module on a heating platform, and covering the surface epoxy layer of the LED display module with a surface treatment structure film; S2: preheating the heating roller; S3: Pressing the surface treatment film at a constant speed to heat it to a semi-cured state and bond it to the surface epoxy layer of the LED display module; S4: After the bonding is completed, the PET film on the surface of the surface treatment structure film is peeled off, so that the glue layer, the carbon layer and the matte layer of the surface treatment structure film are bonded to the epoxy layer surface of the display module; S5: removing the display module after the PET film is peeled off in S4, and performing light irradiation to solidify the glue to complete the packaging.

5. The method for preparing an integrated packaged LED display module according to claim 4, characterized in that: The light curing in S5 includes: Placing the display module after the PET film is peeled off in S4 on the surface of the customized tooling lifting structure; Injecting light-curing glue onto the surface of the display module after the PET film is peeled off through a glue injection system, pressing down the customized tooling hoisting structure, and applying pressure to flatten the light-curing glue and cover the surface of the display module after the PET film is peeled off; The light-curing glue is cured by light, and the light-curing glue is cured on the surface of the surface treatment structure to form a cured glue layer.

6. The method for preparing an integrated packaged LED display module according to claim 5, characterized in that: The illumination conditions are: when the light curing energy reaches 1000mj / cm 2 ~1300mj / cm 2 , turn off the light.

7. The method for preparing an integrated packaged LED display module according to claim 5, characterized in that: Illumination is done by LED UV curing lamps.

8. The method for preparing an integrated packaged LED display module according to claim 4, characterized in that: The method further comprises preheating the heating platform, wherein the preheating temperature is 100° C. to 120° C.

9. The method for preparing an integrated packaged LED display module according to claim 5, characterized in that: The injected curing glue is 5g to 20g.

10. The method for preparing an integrated packaged LED display module according to claim 4, characterized in that: The preheating temperature in S2 is 100°C to 130°C.

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