Micro-sensor for measuring pressure and temperature in human tissue and packaging process therefor

Abstract

A micro-sensor for measuring pressure and temperature in human tissue, and a packaging process therefor. By means of providing a pressure sensor (11) and a temperature sensor (13) on a carrier board (10), a pressure signal sampling circuit detects a pressure signal according to a change in magnitude of a resistance value of a piezoresistor on the pressure sensor (11), thereby achieving pressure measurement; a temperature signal sampling circuit detects a temperature signal according to a change in magnitude of a resistance value of a thermistor (R5) on the temperature sensor (13). The pressure sensor (11) and the temperature sensor (13) share a grounding wire, thereby realizing micro-assembly of the pressure sensor (11) and the temperature sensor (13) on the carrier board (10), improving the convenience and reducing the packaging volume of the micro-sensor device.

Description

Microsensor for measuring pressure and temperature in human tissue and its packaging process

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This disclosure claims priority to Chinese patent application number 202311036178.7 filed with the State Intellectual Property Office of China on August 16, 2023, entitled “Microsensor for measuring pressure and temperature in human tissue and its packaging process,” the entire contents of which are incorporated by reference into this disclosure. Technical Field

[0003] The present disclosure relates to the technical field of sensors and medical equipment, and in particular to a micro sensor for measuring pressure and temperature in human tissue and a packaging process thereof. Background Art

[0004] Most sensors currently used clinically are used outside the human body. For example, pressure or temperature sensors are used to measure blood pressure or temperature on the body surface or at locations relatively shallow from the surface. With advances in medical technology and the increasing demands placed on these devices, miniaturized packaging of sensors is often necessary when measuring pressure or temperature within human tissue or cavities. Examples include measuring intracranial pressure, intracoronary pressure, pulmonary artery pressure, and renal artery pressure, as well as measuring intracranial temperature, bladder temperature, and rectal temperature. These locations are relatively narrow, and the pressure and temperature sensors required must be miniaturized to reach these locations for measurement.

[0005] However, packaging existing microsensors for use in the human body is difficult and has a low yield rate. After packaging, the sensor devices are often bulky, limiting their use within tissues or blood vessels in the human body.

[0006] Summary of the Invention

[0007] Based on this, the purpose of the present disclosure is to provide a micro sensor for measuring pressure and temperature in human tissue and its packaging process, which has the advantages of easy sensor device manufacturing, high yield rate and small packaging volume.

[0008] According to a first aspect of an embodiment of the present disclosure, a micro sensor for measuring pressure and temperature in human tissue is provided. The micro sensor is connected to a signal detection circuit, the signal detection circuit including a pressure signal sampling circuit and a temperature signal sampling circuit. The micro sensor includes a carrier board, a pressure sensor fixed to the carrier board, and a temperature sensor.

[0009] The pressure sensor consists of a mixture of single-crystal silicon pressure-sensitive film and polycrystalline silicon pressure-sensitive film. The polycrystalline silicon pressure-sensitive film is deposited on the lower surface of the single-crystal silicon layer after bulk silicon processing, and a silicon oxide layer is sandwiched between the single-crystal silicon layer and the polycrystalline silicon pressure-sensitive film. The single-crystal silicon layer is then etched by dry self-stop etching to form a single-crystal silicon stress concentration structure. Finally, the silicon oxide layer is removed to expose the polycrystalline silicon force-sensitive film, thereby preparing a polycrystalline silicon force-sensitive film with a thickness of less than 5μm.

[0010] The monocrystalline silicon piezoresistors and polycrystalline silicon piezoresistors are connected together inside the chip to form an ultra-micro Wheatstone bridge, forming a complete ultra-micro pressure sensor chip module, specifically including R1, R2, R3, and R4. The pressure sensor chip composed of silicon piezoresistors has different structures, including full-bridge and half-bridge structures: a Wheatstone half-bridge pressure sensor chip consists of two silicon piezoresistors, namely R1 and R2, while R3 and R4 are part of the Wheatstone half-bridge outside the sensor chip connected to R1 and R2 via wires. R3 and R4 are fixed-value resistors. In another embodiment, a Wheatstone full-bridge pressure sensor chip consists of four silicon piezoresistors, namely R1, R2, R3, and R4, all of which are silicon piezoresistors located inside the chip. The temperature sensor includes a thermistor; the first end of the thermistor is connected to the connection ends of R1 and R2 and to ground; the second end of the thermistor is connected to the power supply via a temperature signal sampling circuit.

[0011] According to a second aspect of an embodiment of the present disclosure, a process for manufacturing a microsensor device for measuring pressure and temperature in a human body is provided, comprising the following steps:

[0012] Metal pads a, b, c and metal special-shaped pads d and e are plated on the carrier board through an electroplating process; wherein the pads a, b, c and the pads d and e are connected to the pads on the corresponding sensor chip through wires;

[0013] The pressure sensor is fixed on the carrier board using a die bonding process, and the pads of the pressure sensor are welded to pads a, b, and c of the carrier board using an ultrasonic welding process through wires; the temperature sensor is fixed on the carrier board so that the electrodes of the temperature sensor are connected to pads d and e.

[0014] The disclosed embodiments utilize a pressure sensor and a temperature sensor arranged on a carrier board. A pressure signal sampling circuit detects pressure signals based on changes in the resistance of a piezoresistor on the pressure sensor, thereby achieving pressure measurement. A temperature signal sampling circuit detects temperature signals based on changes in the resistance of a thermistor on the temperature sensor. The pressure and temperature sensors share a common ground line, enabling microassembly of the pressure and temperature sensors on the carrier board. This improves the yield of the microsensor components and reduces the sensor packaging volume.

[0015] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

[0016] For better understanding and implementation, the present disclosure is described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] FIG1 is a schematic diagram of a microsensor for measuring pressure and temperature in human tissue according to an embodiment of the present disclosure;

[0018] FIG2 is a schematic diagram of a specific circuit structure of a microsensor for measuring pressure and temperature in human tissue according to an embodiment of the present disclosure;

[0019] FIG3 is a schematic diagram of a microsensor for measuring pressure and temperature in human tissue provided by another embodiment of the present disclosure;

[0020] FIG4 is a schematic diagram of a specific circuit structure of a microsensor for measuring pressure and temperature in human tissue provided by another embodiment of the present disclosure;

[0021] FIG5 is a flow chart of a packaging process for a microsensor for measuring pressure and temperature in human tissue according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0022] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0023] It should be clear that the embodiments described are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present disclosure.

[0024] The terms used in the embodiments of the present disclosure are for the purpose of describing specific embodiments only and are not intended to limit the embodiments of the present disclosure. The singular forms "a," "the," and "the" used in the embodiments of the present disclosure and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0025] When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims. In the description of the present disclosure, it should be understood that the terms "first", "second", "third", etc. are only used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, nor can they be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances.

[0026] In addition, throughout this disclosure, unless otherwise specified, "plurality" refers to two or more. "And / or" describes the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, or B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0027] The following will describe in detail the microsensor for measuring pressure and temperature in the human body and its packaging process provided by the embodiments of the present disclosure with reference to FIG1 to FIG5.

[0028] Example 1

[0029] In the first embodiment, referring to FIG1 and FIG2 , the present disclosure provides a microsensor device for measuring pressure and temperature in the human body. The microsensor device is connected to a signal detection circuit, which includes a pressure signal sampling circuit and a temperature signal sampling circuit. The microsensor device includes a carrier board 10, a pressure sensor 11 arranged on the carrier board 10, a pressure sensing surface 12, and a temperature sensor 13.

[0030] The carrier board is plated with pads a, b, c, d, and e. Pad d is a 7-shaped or Q-shaped pad, and pad e is a T-shaped or P-shaped pad. These pads are referred to as carrier pads a, b, c, d, and e, respectively. The pressure sensor has pads Q1, Q2, and Q3. Carrier pads a, b, and c are ultrasonically bonded to sensor pads Q1, Q2, and Q3, respectively. Carrier pads d and e are the connection pads for the temperature sensor electrodes.

[0031] The pads a, b, and c are connected to the wires m1, m2, and m3 respectively through a welding process, and the pads d and e are connected to the wires m4 and m5 respectively through a welding process.

[0032] The pressure sensing surface 12 of the pressure sensor 11 includes a first piezoresistive silicon thin film resistor R1 and a second piezoresistive silicon thin film resistor R2. The temperature sensor 13 includes a thermistor R5. The first ends of the first and second piezoresistors R1 and R2 are connected to the sensor pad Q1. Pad Q1 is connected to pad a via a wire, and to the carrier pad d of thermistor R5 via a wire m1, and to ground GND via a wire m4. The second end of the first piezoresistor R1 is connected to the first end of the pressure signal sampling circuit via pad Q2, and the second end of the second piezoresistor R2 is connected to the second end of the pressure signal sampling circuit via pad Q3. The other end of the thermistor R5 is connected to power supply VCC2 via the temperature signal sampling circuit. Ground GND and power supply VCC2 can be considered the negative and positive poles of the excitation power supply.

[0033] Pads a, b, c, d, and e are connected to the corresponding external sensor sampling circuits via wires, enabling temperature and pressure measurement. The sensor's piezoresistors R1 and R2 form a complete Wheatstone bridge with external resistors R3 and R4 via pads b and c. Pad a and pressure sensor pad Q1 are connected to pad d on the carrier board via wire m1 and are both grounded, meaning the pressure sensor and temperature sensor share a common ground line. Pad e also provides power to the NTC temperature sensor via a wire.

[0034] The length of the carrier board 10 does not exceed 6 mm, and may be 2-6 mm. The maximum width of the carrier board 10 does not exceed 1.5 mm, and may be 0.2-1.5 mm. The thickness of the carrier board 10 does not exceed 0.5 mm, and may be between 0.1 mm and 0.5 mm. This allows the carrier board 10 and the pressure and temperature sensors thereon to be packaged in a small and narrow space. The carrier board 10 may be a flexible circuit board, a rigid circuit board, or a ceramic board.

[0035] The sensor's first and second piezoresistive silicon thin film resistors, R1 and R2, form a Wheatstone half-bridge. The two variable piezoresistive silicon thin film resistors, R1 and R2, are connected to external fixed resistors R3 and R4 via wires to form a Wheatstone bridge capable of measuring pressure. Under pressure within the human body, the resistance values ​​of the first and second piezoresistors R1 and R2 change, causing the voltage at the second end of the first piezoresistor R1, i.e., pad Q2 or pad b, to change, and the voltage at the second end of the second piezoresistor R2, i.e., pad Q3 or pad c, to change. A conductive wire m2 extends from pad b, and a conductive wire m3 extends from pad c. A first voltmeter V1 is connected between these two conductive wires, m1 and m2. The pressure signal sampling circuit uses voltage V1 to measure the pressure within tissue or cavity within the human body.

[0036] The resistance of thermistor R5 varies at different temperatures. Specifically, when the temperature rises, the resistance of thermistor R5 decreases, and when the temperature drops, the resistance of thermistor R5 increases. The thermistor senses temperature changes in the human body, and the resistance of thermistor R5 changes, causing the voltage between pads d and e of thermistor R5 to change. The temperature signal sampling circuit measures the temperature by collecting the voltage between pads d and e of thermistor R5, i.e., the voltage V3 between wires m4 and m5. Thermistor R5 can be an NTC thermistor with columnar electrodes or a sheet-type NTC thermistor with upper and lower electrodes.

[0037] The power source VCC1 and the power source VCC2 may be the positive pole of the same excitation power source, or may be the positive poles of different excitation power sources.

[0038] In FIG2 of the embodiment of the present disclosure, the pressure sensor and temperature sensor in the dashed box 1 are both on the carrier 10, while the fixed resistors R3, R4, and R6, as well as the first and third voltmeters V1 and V3, are not on the carrier 10. The thermistor in the temperature sensor is an NTC thermistor with cylindrical or sheet electrodes.

[0039] Example 2

[0040] In a second embodiment, referring to FIG3 and FIG4 , the present disclosure provides a microsensor device for measuring pressure and temperature in a human body. The microsensor device is connected to a signal detection circuit, which includes a pressure signal sampling circuit and a temperature signal sampling circuit. The microsensor device includes a carrier board 10, a pressure sensor 11 arranged on the carrier board 10, a pressure sensing surface 12, and a temperature sensor 13.

[0041] The carrier board is plated with pads a, b, c, d, and e. Pad d is a 7-shaped or Q-shaped pad, and pad e is a T-shaped or P-shaped pad. These pads are referred to as carrier pads a, b, c, d, and e, respectively. The pressure sensor has pads Q4, Q5, Q6, and Q7. Carrier pads a, b, and c are ultrasonically bonded to sensor pads Q4, Q5, and Q6, respectively. Carrier pads d and e are the connection pads for the temperature sensor electrodes.

[0042] In the disclosed embodiment, the pressure sensor 11 further includes a third piezoresistive silicon thin film resistor R3 and a fourth piezoresistive silicon thin film resistor R4 on the pressure sensing surface 12. The silicon thin film piezoresistors R1, R2, R3, and R4 together form a Wheatstone full-bridge. The first piezoresistor R1 is connected in series with the third piezoresistor R3, while the second piezoresistor R2 is connected in series with the fourth piezoresistor R4. These four piezoresistors can sense the magnitude of pressure within the human body. Their resistance values ​​change under pressure, resulting in higher measurement sensitivity than a Wheatstone half-bridge configuration.

[0043] In this embodiment, the pressure signal sampling circuit includes a second voltmeter V2; one end of the second voltmeter V2 is connected to the second end of the first piezoresistor R1, namely the pad Q4, and the other end of the second voltmeter V2 is connected to the second end of the second piezoresistor R2, namely the pad Q6.

[0044] In the embodiment of the present disclosure, the power supply VCC1 provides voltage, and the voltage difference between the second end of the first varistor R1, i.e., the pad Q4, and the second end of the second varistor R2, i.e., the pad Q6, is measured by the second voltmeter V2. The pressure sensed by the pressure sensor can be obtained based on the voltage difference.

[0045] In the disclosed embodiment, the pressure sensor 11 and the temperature sensor 13 in the dashed box 2 are both on the carrier 10, while the fixed resistor R6, the second voltmeter V2, and the third voltmeter V3 are not on the carrier 10. The thermistor in the temperature sensor 13 is a cylindrical or chip-shaped NTC thermistor.

[0046] Specifically, the carrier board 10 is plated with pads a, b, c, d, and e through an electroplating process. An external lead wire m1 is led out through the pad a, an external lead wire m2 is led out through the pad b and connected to the external power supply VCC1, and an external lead wire m3 is led out through the pad c. A second voltmeter V2 is connected between these two external lead wires m1 and m3.

[0047] In the second embodiment, the temperature signal sampling circuit includes a fixed resistor R6 and a third voltmeter V3; the second end of the thermistor R5, namely the pad e, is connected to the fixed resistor R6 via a wire m5, the other end of the fixed resistor R6 is connected to the power supply VCC2, and the two ends of the third voltmeter V3 are connected to wires m4 and m5 respectively.

[0048] Specifically, pads d and e are plated on carrier board 10. A wire m4 is led from pad d to ground GND, and a wire m5 is led from pad e to connect to external power supply VCC2 via fixed resistor R6. Power supply VCC2 and power supply VCC1 can be the positive pole of the same excitation power supply or the positive poles of different excitation power supplies.

[0049] In the disclosed embodiment, thermistor R5 changes its resistance as a function of temperature, causing the current flowing through thermistor R5 and fixed resistor R6 to change. The temperature change sensed by the temperature sensor can be determined by measuring the voltage across thermistor R5, i.e., between wires m4 and m5, using a third voltmeter V3.

[0050] Specific packaging process flow:

[0051] Please refer to Figure 5, which is a schematic diagram of a process flow for packaging a microsensor for measuring pressure and temperature in the human body according to an embodiment of the present disclosure. The packaging process for a microsensor for measuring pressure and temperature in the human body according to an embodiment of the present disclosure includes steps S1 to S5, which are specifically as follows:

[0052] S1: Plating a plurality of pads on the carrier; wherein, the plurality of sensor pads and the plurality of carrier pads are connected through conductive wires according to a preset connection relationship; all the plurality of pads electroplated on the carrier can be plated with copper, gold, tin or silver to achieve a strong welding between the conductive wires and the pads.

[0053] The layout of the substrate pads is based on the principle of being closest to the pads on the two sensors and being most convenient for soldering, so that the sensor pads can be connected to several substrate pads through conductive wires according to a preset connection relationship.

[0054] The pads a, b, and c of the carrier board can be used to connect to the pads of the pressure sensor, and the pads d and e are used to connect to the electrodes of the temperature sensor.

[0055] S2: The pressure sensor is fixed to the carrier board using a die bonding process, and the pressure sensor pads are welded to the corresponding carrier board pads using an ultrasonic welding process through wires;

[0056] S3: Fix the temperature sensor on the carrier board so that the electrodes of the temperature sensor are connected to the corresponding pads of the carrier board. This includes S301 and S302. The specific steps are as follows:

[0057] S301: If the thermistor is an NTC thermistor with cylindrical electrodes at both ends, secure the temperature sensor to the carrier board using an SMT process so that the two electrodes at each end of the thermistor are connected to the two corresponding pads on the carrier board. Specifically, one electrode of the thermistor is connected to pad d, and the other electrode of the thermistor is connected to pad e.

[0058] Refer to Figure 1. The carrier board is plated with pads a, b, c, d, and e, and the pressure sensor has pads Q1, Q2, and Q3. Using ultrasonic welding, pad a is connected to pad Q1 of the pressure sensor via a wire, pad b is connected to pad Q2 of the pressure sensor, and pad c is connected to pad Q3 of the pressure sensor. Pad a is then connected to pad d via wire m1.

[0059] S302: If the thermistor is a sheet-type NTC thermistor with upper and lower electrodes, a silver paste bonding process is used to fix the lower electrode of the temperature sensor to the carrier board so that the lower electrode of the thermistor is connected to the pad d to which it is connected. An ultrasonic welding process is used to connect the upper electrode of the thermistor to the pad e through a wire.

[0060] Refer to Figure 3. The carrier board is plated with pads a, b, c, d, and e, and the pressure sensor has pads Q4, Q5, Q6, and Q7. Using ultrasonic wire welding, pad a is connected to pad Q4 of the pressure sensor, pad b is connected to pad Q5, pad c is connected to pad Q6, and pad d is connected to pad Q7.

[0061] S4: Solder the pressure sensor and temperature sensor pads and wires to achieve a common ground for both.

[0062] Conductive wire M4 is used as a ground wire, so the pressure sensor and temperature sensor share a common ground. Using a common ground connection can make microassembly easier. The electrical connection of the pressure sensor and temperature sensor can reduce the soldering of an external conductor wire, making it easier to layout pads on the narrow carrier board.

[0063] S5: By welding appropriate external wires m1, m2, m3, m4, and m5 on the substrate pads, all wires are insulated and connected together through a bonding process, and all wires are welded to the sensor interface circuit to achieve communication between the sensor signal and the host system.

[0064] Medical microsensors require medical personnel to implant them into the human body for short-term or long-term measurements. Specifically, the microsensor is encapsulated within a medical device component, such as a thin cannula, or embedded in a thin guidewire or catheter wall, enabling it to reach measurement locations within the human body's organs or cavities that are accessible to the cannula, guidewire, or catheter wall. The pressure sensor on the microsensor senses pressure changes in the organ, and the temperature sensor on the microsensor senses temperature changes in the organ. Effective monitoring of the pressure and temperature of the organ or cavity can reflect the progression of a disease, such as edema, infection, or infarction within a blood vessel or tissue.

[0065] The disclosed embodiment of the present invention can provide a physical fixation for the ultrasonic welding equipment and die-bonding equipment used in semiconductor packaging by using the carrier as a transfer carrier between the pressure sensor, the temperature sensor and the external wires, and also provide a processable object between the transfer wires, thereby providing an assembly platform for micro-assembling the pressure sensor and the temperature sensor on the same carrier. The carrier board with the pressure sensor and the temperature sensor fixed thereon is further encapsulated in the sleeve component, providing a fixable platform and increasing the reliability of the processing. If a carrier board is not used, the tiny pressure sensor and temperature sensor are not suitable for direct welding of the conductive wires, and direct welding results in a low yield rate. At the same time, it is difficult to assemble the independent pressure sensor and the independent temperature sensor together, the yield rate is low, and it is not easy to assemble in a small and narrow space.

[0066] The ultrasonic welding process, SMT patch process, silver paste bonding process and resistance welding process involved in the manufacturing process of the micro sensor device in the embodiment of the present disclosure have the characteristics of saving materials and less pollution, and are suitable for the subsequent processing of medical ultra-micro sensor devices.

[0067] The above description is merely a preferred embodiment of the present disclosure and does not constitute any form of limitation to the present disclosure. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present disclosure without departing from the content of the technical solution of the present disclosure shall still fall within the scope of protection of the technical solution of the present disclosure. Industrial Applicability

[0068] The present disclosure relates to a microsensor for measuring pressure and temperature within human tissue and its packaging process. By placing a pressure sensor and a temperature sensor on a carrier board, a pressure signal sampling module detects pressure signals based on changes in the resistance of single-crystal silicon and polycrystalline silicon piezoresistors on the pressure sensor, achieving pressure measurement. A temperature signal sampling module detects temperature signals based on changes in the resistance of a thermistor on the temperature sensor. The pressure and temperature sensors share a ground line, enabling microassembly of the pressure and temperature sensors on the carrier board, improving the convenience of the microsensor device and reducing the packaging volume.

[0069] Furthermore, it is understood that the disclosed microsensor for measuring pressure and temperature within human tissue and its packaging process are reproducible and can be used in a variety of industrial applications. For example, the disclosed microsensor for measuring pressure and temperature within human tissue and its packaging process can be used in the fields of sensor and medical device technology.

Claims

1. A micro sensor for measuring pressure and temperature in human tissue, characterized in that: The sensor device includes a carrier board, a pressure sensor welded on the carrier board, and a temperature sensor. The sensor device detects the sensor signal by connecting to a signal detection circuit. The signal detection circuit includes a pressure signal sampling circuit and a temperature signal sampling circuit. The pressure signal sampling circuit is connected to the pressure sensor, and the temperature signal sampling circuit is connected to the temperature sensor.

2. The micro sensor for measuring pressure and temperature in human tissue according to claim 1, characterized in that: The Wheatstone bridge structure includes a half-bridge structure or a full-bridge structure. If the pressure sensor is a Wheatstone full-bridge structure, the pressure sensor includes a first piezoresistive silicon thin film resistor (hereinafter referred to as the first resistor), a second piezoresistive silicon thin film resistor (hereinafter referred to as the second resistor), a third piezoresistive silicon thin film resistor (hereinafter referred to as the third resistor) and a fourth piezoresistive silicon thin film resistor (hereinafter referred to as the fourth resistor). The first resistor, the second resistor, the third resistor and the fourth resistor constitute a Wheatstone bridge, which are all located inside the sensor; the temperature sensor includes a thermistor and a fixed resistor, the first end of the thermistor and the Wheatstone bridge are commonly grounded, the second end of the thermistor is connected to the fixed resistor and an external power supply in sequence, and the temperature signal sampling circuit is connected to both ends of the thermistor.

3. The micro sensor for measuring pressure and temperature in human tissue according to claim 1, characterized in that: If the pressure sensor is a Wheatstone half-bridge structure, the first resistor and the second resistor are both silicon thin film varistors located inside the microsensor, the third resistor and the fourth resistor are both fixed resistors located outside the microsensor, the first resistor is connected in series with the third resistor through a wire, and the second resistor is connected in series with the fourth resistor through a wire.

4. The microsensor device for measuring pressure and temperature in human tissue according to claims 3 and 4, characterized in that: The silicon thin film varistor is composed of a mixture of a single crystal silicon varistor and a polycrystalline silicon varistor. The polycrystalline silicon varistor is deposited on the lower surface of a single crystal silicon layer after bulk silicon processing. A silicon oxide layer is sandwiched between the single crystal silicon layer and the polycrystalline silicon varistor.

5. The micro sensor for measuring pressure and temperature in human tissue according to any one of claims 2 to 4, characterized in that: The pressure signal sampling circuit includes a first voltmeter, one end of the first voltmeter is connected to a connection end of the first resistor and the third resistor, and the other end of the first voltmeter is connected to a connection end of the second resistor and the fourth resistor.

6. The micro sensor for measuring pressure and temperature in human tissue according to any one of claims 2 to 4, characterized in that: The temperature signal sampling circuit includes a third voltmeter, and two ends of the third voltmeter are respectively connected to two ends of the thermistor.

7. The micro sensor for measuring pressure and temperature in human tissue according to any one of claims 2 to 4, characterized in that: The carrier plate has a width of 0.2 mm to 1.5 mm, a length of 2 mm to 6 mm, and a thickness of 0.1 mm to 0.5 mm.

8. The micro sensor for measuring pressure and temperature in human tissue according to any one of claims 2 to 4, characterized in that: The thermistor includes a columnar NTC thermistor with two end electrodes and a sheet NTC thermistor.

9. A packaging process for a micro sensor device for measuring pressure and temperature in human tissue, characterized in that: The steps include: A plurality of solder pads are plated on the carrier; wherein the plurality of solder pads are connected by conductive wires according to a preset connection relationship; a pressure sensor is fixed on the carrier by a die bonding process, and the solder pads of the pressure sensor are welded to corresponding solder pads of the carrier by a wire by an ultrasonic welding process; a temperature sensor is also fixed on the carrier by a die bonding process, so that the electrodes of the temperature sensor are connected to corresponding solder pads of the carrier.

10. The packaging process of the micro sensor device for measuring pressure and temperature in human tissue according to claim 9, characterized in that: The step of fixing the temperature sensor on the carrier so that the electrodes of the temperature sensor are connected to the corresponding pads of the carrier comprises: If the thermistor is an NTC thermistor with columnar electrodes at both ends, the temperature sensor is fixed on the carrier board by using an SMT patch process, so that the electrodes at both ends of the thermistor are respectively connected to the two pads of the carrier board corresponding to the electrodes at both ends; If the thermistor is a sheet NTC thermistor, a silver paste bonding process is used to fix the lower electrode of the temperature sensor on the carrier so that the lower electrode of the thermistor is connected to the pad of the carrier, and an ultrasonic welding process is used to connect the upper electrode of the thermistor to the other carrier pad corresponding to the upper electrode using a wire; wherein the wire used in the above process can be a gold wire, a copper wire, an aluminum wire or a copper / aluminum enameled wire.

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