Bendable circuit board, display screen assembly and electronic device

Abstract

Provided in the embodiments of the present application are a bendable circuit board, a display screen assembly and an electronic device. The bendable circuit board comprises: a first insulating layer, a first conductive material layer, a second insulating layer, a second conductive material layer and a third insulating layer. The second insulating layer is arranged between the first conductive material layer and the second conductive material layer, the outer side of the first conductive material layer being covered with the first insulating layer, and the outer side of the second conductive material layer being covered with the second insulating layer. The bendable circuit board can be switched between a bent state and an unbent state. The bendable circuit board successively comprises a first flat area, a bent area and a second flat area, the second conductive material layer located in the first flat area and the second flat area being used for keeping the first flat area and the second flat area flat. The first conductive material layer is provided with a first conductive circuit, and the second conductive material layer is provided with a second conductive circuit, the first conductive circuit and the second conductive circuit both extending from the first flat area to the second flat area.

Description

Flexible circuit boards, display components and electronic devices

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on August 15, 2023, with application number 202311032385.5 and invention name “Bendable circuit board, display assembly and electronic device”. The entire contents of the Chinese patent application are incorporated herein by reference. Technical Field

[0003] The present application relates to the technical field of electronic equipment, and in particular to a bendable circuit board, a display screen assembly, and an electronic device. Background Art

[0004] With breakthroughs and advancements in flexible display technology, foldable electronic devices are gaining popularity. These devices include a first main body and a second main body that can be folded or unfolded relative to each other. In some cases, a first component in the first main body may need to be electrically connected to a second component in the second main body.

[0005] For example, the first body portion includes a main board, and the second body portion includes a secondary board. In related art, the main board and secondary board are typically electrically connected via a flexible transfer circuit board. This flexible transfer circuit board needs to span the folding area of ​​the electronic device, allowing one end of the flexible transfer circuit board to connect to the main board and the other end to connect to the secondary board, thereby connecting the main board and the secondary board via the flexible transfer circuit board.

[0006] Since the flexible transfer circuit board needs to be arranged across the folding area of ​​the electronic device, the flexible transfer circuit board will also bend when the electronic device is bent and opened. Therefore, the flexible transfer circuit board in the related art has the problem of being easily deformed and damaged.

[0007] Summary of the Invention

[0008] The embodiments of the present application provide a bendable circuit board, a display screen assembly, and an electronic device to solve the problems in the background technology.

[0009] In a first aspect, an embodiment of the present application provides a bendable circuit board.

[0010] The bendable circuit board provided in an embodiment of the present application includes: a first insulating layer, a first conductive material layer, a second insulating layer, a second conductive material layer and a third insulating layer; the second insulating layer is arranged between the first conductive material layer and the second conductive material layer, the side of the first conductive material layer away from the second conductive material layer is covered with the first insulating layer, and the side of the second conductive material layer away from the first conductive material layer is covered with the second insulating layer; the bendable circuit board can switch between a bent state and a flattened state, and the bendable circuit board is divided into a first flat area, a bending area and a second flat area in sequence along a direction perpendicular to its own bending axis, and the second conductive material layer located in the first flat area and the second flat area is used to keep the first flat area and the second flat area flat; the first conductive material layer is provided with a first conductive circuit, and the second conductive material layer is provided with a second conductive circuit, and the first conductive circuit and the second conductive circuit both extend from the first flat area to the second flat area.

[0011] Optionally, the thickness of the second conductive material layer located in the first flattened area and the second flattened area is greater than the thickness of the first conductive material layer.

[0012] Optionally, the thickness of the second conductive material layer located in the bending region is smaller than the thickness of the second conductive material layer located in the first flat region, and smaller than the thickness of the second conductive material layer located in the second flat region.

[0013] Optionally, the two ends of the first conductive circuit are respectively electrically connected to the first electrical connector and the second electrical connector exposed on the surface of the first insulating layer; the two ends of the second conductive circuit are respectively electrically connected to the third electrical connector and the fourth electrical connector exposed on the surface of the third insulating layer.

[0014] Optionally, the number of the first conductive circuits is at least two, the number of the second conductive circuits is at least two, the second insulating layer is provided with a through hole, a fifth electrical connector is provided in the through hole, and at least part of the first conductive circuits is electrically connected to the corresponding second conductive circuits through the fifth electrical connector.

[0015] Optionally, the first insulating layer is a first thermally conductive insulating layer, and the third insulating layer is a second thermally conductive insulating layer.

[0016] In a second aspect, an embodiment of the present application provides a display screen assembly.

[0017] The display screen assembly provided in the embodiment of the present application includes: a flexible display screen and any one of the bendable circuit boards provided in the embodiment of the present application, wherein the bendable circuit board is attached to the side of the flexible display screen away from its own light-emitting side.

[0018] Optionally, the flexible display screen includes a first flat portion, a bendable portion and a second flat portion connected in sequence, and the first flat area, the bending area and the second flat area are correspondingly connected to the first flat portion, the bendable portion and the second flat portion in sequence; the first flat portion is provided with a first electrical connection portion, and the first electrical connection portion is electrically connected to one end of the first conductive circuit and the second conductive circuit close to the first flat portion; the second flat portion is provided with a second electrical connection portion, and the second electrical connection portion is electrically connected to one end of the first conductive circuit and the second conductive circuit close to the second flat portion.

[0019] In a third aspect, an embodiment of the present application provides an electronic device.

[0020] The electronic device provided in the embodiment of the present application includes: any one of the display screen assemblies provided in the embodiment of the present application.

[0021] Optionally, the flexible display screen is electrically connected to the first conductive circuit and the second conductive circuit respectively; the electronic device also includes a first circuit board, a second circuit board, and a first bearing part, a transition part and a second bearing part connected in sequence; the first bearing part and the second bearing part can be opened or folded relative to each other, the first flat area, the bending area and the second flat area are arranged corresponding to the first bearing part, the transition part and the second bearing part in sequence, and the first circuit board is arranged in the first bearing part; the first circuit board is electrically connected to the flexible display screen, the second circuit board is arranged in the second bearing part, and the second circuit board is electrically connected to the flexible display screen.

[0022] At least one of the above technical solutions adopted in the embodiments of the present application can achieve the following beneficial effects:

[0023] In an embodiment of the present application, the first flat area can be set on the first main body of the electronic device, and the second flat area can be set on the second main body of the electronic device. The first device of the first main body can be connected to the ends of the first conductive circuit and the second conductive circuit located in the first flat area, and the second device of the second main body can be connected to the ends of the first conductive circuit and the second conductive circuit located in the second flat area, so that the first device and the second device are connected via the first conductive circuit and the second conductive circuit.

[0024] In addition, the second conductive material layer of the bendable circuit board can be used to prevent the first flat area and the second flat area from deforming, thereby reducing the deformation of the bendable circuit board and improving the anti-deformation damage performance of the bendable circuit board.

[0025] Furthermore, for example, the flexible circuit board can be attached to the back of the flexible display of an electronic device. The first and second flat areas can be used to support the non-bending portion of the flexible display, allowing the bending area to deform along with the bending portion of the flexible display. This eliminates the need for a supporting steel plate attached to the back of the flexible display of the electronic device. In this way, the flexible circuit board not only electrically connects the first and second components provided in the foldable electronic device, but also supports the flexible display of the electronic device, simplifying the assembly process of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only some embodiments recorded in this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0027] FIG1 is a schematic diagram of a bendable circuit board provided in an embodiment of the present application;

[0028] FIG2 is a cross-sectional view of the bendable circuit board shown in FIG1 taken along a cross section passing through line AA;

[0029] FIG3 is a cross-sectional view of the bendable circuit board shown in FIG1 taken along a cross section passing through line BB;

[0030] FIG4 is a schematic diagram of a display screen assembly provided in an embodiment of the present application;

[0031] FIG5 is a schematic diagram of another display screen assembly provided in an embodiment of the present application;

[0032] FIG6 is a schematic diagram of an electronic device provided in an embodiment of the present application.

[0033] Explanation of reference numerals: 100 - electronic device; 110 - bendable circuit board; 110a - first flat area; 110b - bending area; 110c - second flat area; 111 - first insulating layer; 112 - first conductive material layer; 1121 - first conductive circuit; 113-second insulating layer; 114-second conductive material layer; 1141-second conductive circuit; 115-third insulating layer; 1161-first electrical connector; 1162-second electrical connector; 1163-third electrical connector; 1164-fourth electrical connector; 1165-fifth electrical connector; 120-flexible display screen; 120a-first flat portion; 120b-bendable portion; 120c-second flat portion; 121-colorless polyimide layer; 122-first optical adhesive; 123-polyethylene terephthalate layer; 124-second optical adhesive layer; 125-polarizer layer; 126-panel layer; 127-support film layer; 128-cover layer; 130-first circuit board; 140-second circuit board; 151-first bearing portion; 152-transition portion; 153-second bearing portion. DETAILED DESCRIPTION

[0034] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0035] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0036] In addition, although the terms used in this application are selected from commonly known and commonly used terms, some of the terms mentioned in this specification may be selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant parts of the description of this document. It is required that this application be understood not only by the actual terms used, but also by the meaning implied by each term.

[0037] The following describes in detail the technical solutions provided by various embodiments of the present application in conjunction with the accompanying drawings.

[0038] 1 to 3 , the bendable circuit board 110 provided in the embodiment of the present application includes: a first insulating layer 111 , a first conductive material layer 112 , a second insulating layer 113 , a second conductive material layer 114 , and a third insulating layer 115 .

[0039] The second insulating layer 113 is disposed between the first conductive material layer 112 and the second conductive material layer 114. In this way, the first conductive material layer 112 and the second conductive material layer 114 can be insulated and separated by the second insulating layer 113.

[0040] The side of the first conductive material layer 112 away from the second conductive material layer 114 is covered with a first insulating layer 111, and the side of the second conductive material layer 114 away from the first conductive material layer 112 is covered with a second insulating layer 113. In this way, the first insulating layer 111 and the second insulating layer 113 can be used to insulate the outer surface of the flexible circuit board 110.

[0041] The flexible circuit board 110 is capable of switching between a bent state and a flattened state. The flexible circuit board 110 is divided into a first flat region 110a, a bending region 110b, and a second flat region 110c, in a direction perpendicular to its bending axis. For example, when the flexible circuit board 110 is forced to fold along its bending axis, the bending region 110b can bend and deform, and the first flat region 110a and the second flat region 110c can move toward each other. When the flexible circuit board 110 switches from the bent state to the flattened state, the bending region 110b can flatten, and the first flat region 110a, the bending region 110b, and the second flat region 110c can assume a straight state.

[0042] The first conductive material layer 112 is provided with a first conductive trace 1121, and the second conductive material layer 114 is provided with a second conductive trace 1141. Both the first conductive trace 1121 and the second conductive trace 1141 extend from the first planarized area 110a to the second planarized area 110c. In this way, a first device can be connected to the ends of the first and second conductive traces 1121 and 1141 located in the first planarized area 110a, and a second device can be connected to the ends of the first and second conductive traces 1121 and 1141 located in the second planarized area 110c, thereby connecting the first and second devices via the first and second conductive traces 1121 and 1141.

[0043] The second conductive material layer 114 located in the first and second flattened areas 110a, 110c is used to maintain the flatness of the first and second flattened areas 110a, 110c. For example, the second conductive material layer 114 can be made of a conductive material with a certain degree of hardness and resistance to deformation, so that the first and second flattened areas 110a, 110c remain flat under the support of the second conductive material layer 114. Furthermore, target areas of the second conductive material layer 114 can be hollowed out to form second conductive traces 1141. The third insulating layer 115 covering the second conductive material layer 114 can then be filled into the hollowed-out areas to insulate the spaces between adjacent second conductive traces 1141.

[0044] In an embodiment of the present application, the second conductive material layer 114 located in the first flattened area 110a and the second flattened area 110c has a preset thickness. The second conductive material layer 114 of the preset thickness has good rigidity and can remain flat. The preset thickness of the second conductive material layer 114 allows the first flattened area 110a and the second flattened area 110c to remain flat. For example, when the second conductive material layer 114 is a copper layer, the thickness of the second conductive material layer 114 located in the first flattened area 110a and the second flattened area 110c can be approximately 1 mm. Of course, in other embodiments, the second conductive material layer 114 can be a silver layer, or the second conductive material layer 114 can be made of other materials. Those skilled in the art can reasonably set the thickness of the second conductive material layer 114 by conducting experiments, and this will not be further described here.

[0045] In addition, the first conductive material layer 112 can be made of conductive material, and the target area of ​​the first conductive material layer 112 can be hollowed out to form a first conductive circuit 1121, and the first insulating layer 111 covering the outside of the first conductive material layer 112 can be filled in the hollowed area to insulate and fill the spacing area between adjacent first conductive material layers 112.

[0046] For example, the first device can be a mainboard of an electronic device, and the second device can be a subboard of the electronic device. The mainboard can be connected to the ends of the first and second conductive traces 1121 and 1141 located in the first flat region 110a, and the subboard can be connected to the ends of the first and second conductive traces 1121 and 1141 located in the second flat region 110c. In this way, the mainboard and subboard can be electrically connected via the flexible circuit board 110, thereby enabling signal transmission between the mainboard and subboard.

[0047] In this way, in an embodiment of the present application, the first flat area 110a can be set in the first body part of the electronic device, and the second flat area 110c can be set in the second body part of the electronic device. The first device of the first body part can be connected to the ends of the first conductive line 1121 and the second conductive line 1141 located in the first flat area 110a, and the second device of the second body part can be connected to the ends of the first conductive line 1121 and the second conductive line 1141 located in the second flat area 110c, so that the first device and the second device are connected via the first conductive line 1121 and the second conductive line 1141.

[0048] In addition, the second conductive material layer 114 of the flexible circuit board 110 can be used to prevent the first flat area 110a and the second flat area 110c from deforming, thereby reducing the deformation of the flexible circuit board 110 and improving the deformation resistance of the flexible circuit board 110.

[0049] Alternatively, for example, the flexible circuit board 110 can be attached to the back of the flexible display of an electronic device. The first flat region 110a and the second flat region 110c can be used to support the non-bending portion of the flexible display, allowing the bending region 110b to deform along with the bending portion of the flexible display. This eliminates the need for a supporting steel plate attached to the back of the flexible display of the electronic device. In this way, the flexible circuit board 110 not only electrically connects the first and second components provided in the foldable electronic device, but also supports the flexible display of the electronic device, simplifying the assembly process of the electronic device.

[0050] In some embodiments, the thickness of the second conductive material layer 114 located in both the first flattened region 110a and the second flattened region 110c is greater than the thickness of the first conductive material layer 112. In other words, the thickness of the second conductive material layer 114 located in the first flattened region 110a is greater than the thickness of the first conductive material layer 112, and the thickness of the second conductive material layer 114 located in the second flattened region 110c is also greater than the thickness of the first conductive material layer 112. This allows the second conductive material layer 114 located in the first flattened region 110a and the second flattened region 110c to be thicker, thereby providing support for the flexible circuit board 110 and maintaining the flatness of the first flattened region 110a and the second flattened region 110c. Furthermore, since the second conductive material layer 114 located in the first flattened region 110a and the second flattened region 110c already provide support, the first conductive material layer 112 can primarily function as a connecting circuit. Consequently, the thickness of the first conductive material layer 112 can be set by referring to conventional thickness setting schemes for circuit layers in related art.

[0051] In some embodiments, the thickness of the second conductive material layer 114 in the bending region 110b is less than the thickness of the second conductive material layer 114 in the first flat region 110a and the second flat region 110c. In other words, the thickness of the second conductive material layer 114 in the bending region 110b is less than the thickness of the second conductive material layer 114 in the first flat region 110a, and the thickness of the second conductive material layer 114 in the bending region 110b is less than the thickness of the second conductive material layer 114 in the second flat region 110c.

[0052] For example, the raw materials used to make the bendable circuit board have a second conductive material layer with a uniform thickness. Furthermore, the second conductive material layer in the bend region 110b can be thinned by cutting, or etched, so that the thickness of the second conductive material layer 114 in the bend region 110b is thinner than the thickness of the second conductive material layer 114 in the first flat region 110a and the second flat region 110c. Thus, by thinning the second conductive material layer in the bend region 110b, the bendability of the bend region 110b can be improved.

[0053] In some embodiments, the two ends of the first conductive trace 1121 are electrically connected to the first electrical connector 1161 and the second electrical connector 1162 exposed on the surface of the first insulating layer 111, respectively. The two ends of the second conductive trace 1141 are electrically connected to the third electrical connector 1163 and the fourth electrical connector 1164 exposed on the surface of the third insulating layer 115, respectively. For example, the first electrical connector 1161, the second electrical connector 1162, the third electrical connector 1163, and the fourth electrical connector 1164 can all be solder pads. In some embodiments, solder pads can be first disposed outside the first conductive material layer 112 and the second conductive material layer 114, and electrically connected to each of the first conductive trace 1121 and the second conductive trace 1141. Furthermore, an insulating layer can be disposed outside the first conductive material layer 112 and the second conductive material layer 114 to form the first insulating layer 111 and the third insulating layer 115, respectively.

[0054] In some embodiments, there are at least two first conductive traces 1121 and at least two second conductive traces 1141. The second insulating layer 113 is provided with a through-hole, and a fifth electrical connector 1165 is provided in the through-hole. At least some of the first conductive traces 1121 are electrically connected to corresponding second conductive traces 1141 via the fifth electrical connector 1165. Thus, when it is necessary to electrically connect the first conductive traces 1121 and the second conductive traces 1141, the fifth electrical connector 1165, which passes through the second insulating layer 113, can be used to electrically connect the first conductive traces 1121 and the second conductive traces 1141, so that the circuits of the flexible circuit board 110 meet the requirements.

[0055] It should be noted that in some embodiments, solder pads may be provided on only one side of the flexible circuit board 110. For example, solder pads may be provided only on the side of the flexible circuit board 110 near the first conductive trace 1121. Alternatively, solder pads may be provided only on the side of the flexible circuit board 110 near the second conductive trace 1141. This allows electrical connection between the flexible circuit board 110 and the flexible display to be made on only one side of the flexible circuit board 110, simplifying the connection process.

[0056] When a solder pad is provided only on one side of the flexible circuit board 110 , the corresponding first conductive trace 1121 and the second conductive trace 1141 can be electrically connected through the fifth electrical connector 1165 , so that the second conductive trace 1141 can be electrically connected to the solder pad through the fifth electrical connector 1165 and the first conductive trace 1121 .

[0057] It should also be noted that in other embodiments, solder pads may be provided on both sides of the flexible circuit board 110. Thus, the first conductive trace 1121 can be electrically connected via the solder pad on the side proximal to the first conductive trace 1121, and the second conductive trace 1141 can be electrically connected via the solder pad on the side proximal to the second conductive trace 1141. Furthermore, by way of example, if one of the first conductive traces 1121 is grounded and one of the second conductive traces 1141 is grounded, this allows the first conductive trace 1121 to be grounded and the second conductive trace 1141 to be grounded to be electrically connected via the fifth electrical connector 1165. Of course, those skilled in the art can also flexibly adjust the electrical connection relationship between the first conductive trace 1121 and the second conductive trace 1141 based on actual wiring requirements. This will not be further explained here.

[0058] Referring to FIG1 , for example, the portion of the first conductive trace 1121 located in the bending region 110b can be a first serpentine bending segment. Furthermore, the portion of the second conductive trace 1141 located in the bending region 110b can be a second serpentine bending segment. This facilitates bending of the first conductive trace 1121 and the second conductive trace 1141.

[0059] In some embodiments, the first insulating layer 111 is a first thermally conductive insulating layer, and the third insulating layer 115 is a second thermally conductive insulating layer. Thus, when the flexible circuit board 110 is attached to the surface of the flexible display 120 or other device that generates a certain temperature, the first thermally conductive insulating layer and the second thermally conductive insulating layer can be used to assist in dissipating heat from the flexible display 120 or other device that generates a certain temperature.

[0060] It should be noted that, illustratively, the second insulating layer 113 may be a third thermally conductive insulating layer. Alternatively, in other embodiments, the first insulating layer 111, the second insulating layer 113, and the third insulating layer 115 may be conventional insulating layers. It should also be noted that the specific material of each insulating layer can be determined by reference to related art, or the specific material of each insulating layer may be a material that will be developed in the future and will not be further described here.

[0061] In order to enable those skilled in the art to better implement the solutions provided in the embodiments of the present application, a relatively detailed method for manufacturing the bendable circuit board 110 is provided below for reference by those skilled in the art.

[0062] In some embodiments, a flexible copper clad laminate (FCCL) substrate with inconsistent copper layer thickness on both sides can be selected as the raw material for making a circuit board. Alternatively, a material with consistent copper layer thickness on both sides can be used as the raw material for making a circuit board, and further, the copper layer on one side can be thickened by single-sided electroplating. Alternatively, an insulating material layer can be prepared first, and then the two opposite sides of the insulating material layer are electroplated respectively to obtain a substrate with consistent copper layer thickness on both sides. Exemplarily, the thickness of the thicker copper layer can be about 1 mm. The thickness of the thinner copper layer can be set with reference to the thickness of the copper layer of a conventional circuit board in the relevant technology, which will not be listed here one by one.

[0063] Furthermore, for areas where guide holes are required for upper and lower circuits, drilling can be performed first, followed by hole metallization (electroplating) to create signal vias for the upper and lower circuit layers, so that the plating on the via hole walls forms the fifth electrical connector 1165. The first conductive trace 1121 and the second conductive trace 1141 can be processed into the two copper layers through an etching process. Thus, the unetched areas of the thicker copper layer can be used to support the circuit board, thereby maintaining the flatness of the first and second flat areas 110a, 110c.

[0064] Furthermore, electrical connectors can be disposed outside the first conductive material layer 112 and the second conductive material layer 114, respectively, and electrically connected to the first conductive traces 1121 and the second conductive traces 1141, respectively, to form first electrical connectors 1161, second electrical connectors 1162, third electrical connectors 1163, and fourth electrical connectors 1164. Furthermore, insulating layers can be disposed outside the first conductive material layer 112 and the second conductive material layer 114, respectively, to form first insulating layer 111 and third insulating layer 115. Using this approach, a flexible circuit board 110 can be fabricated.

[0065] For example, an embodiment of the present application provides a display screen assembly. Referring to Figures 4 and 5 , the display screen assembly provided in this embodiment of the present application includes a flexible display screen 120 and any of the flexible circuit boards 110 provided in this embodiment of the present application. Flexible circuit board 110 is attached to the side of flexible display screen 120 facing away from its own light-emitting side.

[0066] It should be noted that when the flexible circuit board 110 is attached to the side of the flexible display 120 that is away from the light-emitting side thereof, the first conductive material layer 112 can be positioned closer to the flexible display 120 than the second conductive material layer 114, or the second conductive material layer 114 can be positioned closer to the flexible display 120 than the first conductive material layer 112. In other words, when attaching the flexible circuit board 110, the front and back sides do not need to be considered; the flexible circuit board 110 only needs to be attached to the flexible display 120.

[0067] In some embodiments, the flexible display 120 is electrically connected to the first conductive circuit 1121 and the second conductive circuit 1141. Furthermore, the electrical connection between the first device and the second device can be achieved by electrically connecting the first device and the second device to the flexible display 120, and the flexible display 120 to the first conductive circuit 1121 and the second conductive circuit 1141.

[0068] 4 , in some embodiments, the flexible display 120 may include a colorless polyimide (CPI) layer 121, a first optically clear adhesive (OCA) layer 122, a polyethylene terephthalate (PET) layer 123, a second optical adhesive layer 124, a polarizer (POL) layer 125, a panel layer 126, a bottom PET film (BP) layer 127, and a cover panel (C-panel) layer 128, which are stacked in sequence. The cover panel layer 128 may be made of double-sided polyethylene terephthalate (PET). One side of the cover panel layer 128 may be bonded to the support film layer 127, and the other side may be bonded to the flexible circuit board 110.

[0069] Referring to FIG5 , in other embodiments, a material similar to the cover layer can be used as a substrate, copper can be plated on opposite sides of the substrate, and then, according to a specific process, a flexible circuit board 110 can be manufactured. The flexible circuit board 110 is then bonded to a support film layer 127. In this way, compared to the solution shown in FIG4 , the cover layer 128 can be omitted, thereby reducing the overall thickness of the display assembly.

[0070] Referring to Figure 6, the flexible display 120 includes a first flat portion 120a, a bendable portion 120b, and a second flat portion 120c, which are connected in sequence. The first flat region 110a, the bendable region 110b, and the second flat region 110c are connected to the first flat portion 120a, the bendable portion 120b, and the second flat portion 120c, respectively. The first flat portion 120a is provided with a first electrical connection portion, which is electrically connected to the ends of the first and second conductive traces 1121, 1141, which are proximal to the first flat portion 120a. The second flat portion 120c is provided with a second electrical connection portion, which is electrically connected to the ends of the first and second conductive traces 1121, 1141, which are proximal to the second flat portion 120c. This allows the flexible display 120 to be electrically connected to the first and second conductive traces 1121, 1141 of the flexible circuit board 110.

[0071] An embodiment of the present application provides an electronic device. Referring to FIG6 , the electronic device 100 provided in the embodiment of the present application includes any one of the display screen assemblies provided in the embodiment of the present application.

[0072] In some embodiments, the flexible display screen 120 is electrically connected to the first conductive circuit 1121 and the second conductive circuit 1141, respectively. Furthermore, the electronic device 100 may also include a first circuit board 130, a second circuit board 140, and a first carrier portion 151, a transition portion 152, and a second carrier portion 153 connected in sequence. The first carrier portion 151 and the second carrier portion 153 can be opened or folded relative to each other. Generally speaking, those skilled in the art refer to electronic devices in which the first carrier portion 151 and the second carrier portion 153 can be opened or folded relative to each other as foldable electronic devices. In the case where the electronic device is a mobile phone, those skilled in the art generally refer to the mobile phone as a folding screen mobile phone.

[0073] The first flat region 110a, the bending region 110b, and the second flat region 110c are sequentially arranged corresponding to the first supporting portion 151, the transition portion 152, and the second supporting portion 153. In other words, the first flat region 110a is arranged on the first supporting portion 151, the bending region 110b is arranged on the transition portion 152, and the second flat region 110c is arranged on the second supporting portion 153. Furthermore, correspondingly, the first flat region 120a of the flexible display 120 is arranged on the first supporting portion 151, the bendable region 120b of the flexible display 120 is arranged on the transition portion 152, and the second flat region 120c of the flexible display 120 is arranged on the second supporting portion 153. Thus, when a user folds or unfolds the electronic device 100, the display assembly can fold or unfold accordingly.

[0074] Furthermore, the first circuit board 130 is disposed on the first carrier portion 151. The first circuit board 130 is electrically connected to the flexible display 120. The second circuit board 140 is disposed on the second carrier portion 153 and is electrically connected to the flexible display 120. In this way, the electrical connection between the first circuit board 130 and the second circuit board 140 can be achieved by electrically connecting the first circuit board 130 and the second circuit board 140 to the flexible display 120, and by electrically connecting the flexible display 120 to the first conductive trace 1121 and the second conductive trace 1141, respectively. For example, the first circuit board 130 can be the main board of the electronic device 100, and the second circuit board 140 can be a sub-board of the electronic device 100.

[0075] It should be noted that in other embodiments, the first circuit board 130 and the second circuit board 140 can be electrically connected via other means. For example, the first circuit board 130 can be electrically connected to the pads located in the first flat region 110a of the flexible circuit board 110, and the second circuit board 140 can be electrically connected to the pads located in the second flat region 110c of the flexible circuit board 110. In this way, the first circuit board 130 and the second circuit board 140 can be electrically connected via the flexible circuit board 110. Furthermore, if the first circuit board 130 is the mainboard of the electronic device 100, the mainboard can be electrically connected to the flexible display 120 to control the flexible display 120.

[0076] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0077] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the embodiments of the present application, and the scope of the embodiments of the present application is defined by the appended claims and their equivalents.

Claims

1. A bendable circuit board (110), comprising: A first insulating layer (111), a first conductive material layer (112), a second insulating layer (113), a second conductive material layer (114) and a third insulating layer (115); The second insulating layer (113) is provided between the first conductive material layer (112) and the second conductive material layer (114); a side of the first conductive material layer (112) away from the second conductive material layer (114) is covered with the first insulating layer (111), and a side of the second conductive material layer (114) away from the first conductive material layer (112) is covered with the second insulating layer (113); The bendable circuit board (110) is capable of switching between a bent state and a flattened state; the bendable circuit board (110) is sequentially divided into a first flat area (110a), a bending area (110b) and a second flat area (110c) along a direction perpendicular to its own bending axis; the second conductive material layer (114) located in the first flat area (110a) and the second flat area (110c) is used to keep the first flat area (110a) and the second flat area (110c) flat; The first conductive material layer (112) is provided with a first conductive circuit (1121), and the second conductive material layer (114) is provided with a second conductive circuit (1141), and both the first conductive circuit (1121) and the second conductive circuit (1141) extend from the first flattened area (110a) to the second flattened area (110c).

2. The bendable circuit board (110) according to claim 1, wherein: The thickness of the second conductive material layer (114) located in the first flattened area (110a) and the second flattened area (110c) is greater than the thickness of the first conductive material layer (112).

3. The bendable circuit board (110) according to claim 1, wherein: The thickness of the second conductive material layer (114) located in the bending area (110b) is smaller than the thickness of the second conductive material layer (114) located in the first flat area (110a), and is smaller than the thickness of the second conductive material layer (114) located in the second flat area (110c).

4. The bendable circuit board (110) according to claim 1, wherein: The two ends of the first conductive circuit (1121) are respectively electrically connected to a first electrical connector (1161) and a second electrical connector (1162) exposed on the surface of the first insulating layer (111); the two ends of the second conductive circuit (1141) are respectively electrically connected to a third electrical connector (1163) and a fourth electrical connector (1164) exposed on the surface of the third insulating layer (115).

5. The bendable circuit board (110) according to claim 1, wherein: The number of the first conductive lines (1121) is at least two, the number of the second conductive lines (1141) is at least two, the second insulating layer (113) is provided with a through hole, a fifth electrical connector (1165) is provided in the through hole, and at least part of the first conductive lines (1121) is electrically connected to the corresponding second conductive lines (1141) through the fifth electrical connector (1165).

6. The bendable circuit board (110) according to claim 1, wherein: The first insulating layer (111) is a first heat-conducting insulating layer, and the third insulating layer (115) is a second heat-conducting insulating layer.

7. A display screen assembly, comprising: A flexible display screen (120) and the bendable circuit board (110) as claimed in any one of claims 1 to 6, wherein the bendable circuit board (110) is attached to the side of the flexible display screen (120) that is away from its own light-emitting side.

8. The display screen assembly according to claim 7, wherein: The flexible display screen (120) comprises a first flat portion (120a), a bendable portion (120b) and a second flat portion (120c) which are connected in sequence, and the first flat area (110a), the bendable area (110b) and the second flat area (110c) are connected in sequence to the first flat portion (120a), the bendable portion (120b) and the second flat portion (120c); The first flat portion (120a) is provided with a first electrical connection portion, which is electrically connected to one end of the first conductive circuit (1121) and the second conductive circuit (1141) close to the first flat portion (120a); the second flat portion (120c) is provided with a second electrical connection portion, which is electrically connected to one end of the first conductive circuit (1121) and the second conductive circuit (1141) close to the second flat portion (120c).

9. An electronic device comprising the display screen assembly according to claim 7.

10. The electronic device according to claim 9, wherein: The flexible display screen (120) is electrically connected to the first conductive circuit (1121) and the second conductive circuit (1141) respectively; The electronic device further comprises a first circuit board (130), a second circuit board (140), and A first bearing portion (151), a transition portion (152), and a second bearing portion (153) connected; The first bearing portion (151) and the second bearing portion (153) can be relatively opened or folded, and the first flat area (110a), the bending area (110b) and the second flat area (110c) are sequentially arranged corresponding to the first bearing portion (151), the transition portion (152) and the second bearing portion (153); The first circuit board (130) is arranged on the first bearing portion (151), and the first circuit board (130) is electrically connected to the flexible display screen (120); the second circuit board (140) is arranged on the second bearing portion (153), and the second circuit board (140) is electrically connected to the flexible display screen (120).

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