Electronic device comprising conductive structure

Abstract

This electronic device may comprise: a housing including a front plate, a rear plate, and a side member surrounding at least a portion of an inner space between the front plate and the rear plate; a first electronic component disposed in the housing; a second electronic component spaced apart from the first electronic component and disposed in the housing; a circuit board disposed between the front plate and the rear plate and including at least one neck portion disposed between the first electronic component and the second electronic component; a rear case in which at least one conductive layer is formed on one surface facing the one surface and which is disposed between the circuit board and the rear plate; a metal support plate disposed on one surface of the circuit board and supporting the at least one neck portion; and a conductor disposed on the support plate and electrically connecting the support plate and the conductive layer of the rear case.

Description

Electronic device comprising a conductive structure

[0001] The present disclosure relates to an electronic device including a conductive structure according to one embodiment.

[0002] A typical electronic device may have at least one circuit board positioned within a housing. For example, the circuit boards positioned within the housing may include at least one rigid circuit board or at least one flexible circuit board. For example, rigid circuit boards spaced apart from each other may be electrically connected using a flexible circuit board.

[0003] Additionally, the electronic device may include a main circuit board and at least one sub-circuit board within the housing. Various electronic components for performing the functions of the electronic device may be arranged on one side and / or the other side of the circuit board.

[0004] When arranging a circuit board within a housing, a metal plate may be arranged on one surface of the circuit board to support the arrangement of the circuit board or to reinforce the rigidity of the circuit board. Such a circuit board may use a separate conductive component, such as a clip, for conducting with the conductive layer. The separate conductive component may be arranged at a location spaced apart from the metal plate arranged on the circuit board, or may be arranged on the other surface of the circuit board opposite the one surface on which the support plate is arranged.

[0005] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0006] When a circuit board is adjacent to a metal plate placed on one side and a conductive component (e.g., a conductive clip) is placed at a distance from the metal plate, stress may be generated in the neck portion of the circuit board by the conductive component, which may cause cracks to occur in the circuit board.

[0007] Additionally, if separate conductive components are placed on the other side of the circuit board, the mounting space for other components may be limited, resulting in reduced component installation. For example, insufficient wiring width may make it difficult to place chips such as Hall sensors.

[0008] Additionally, if a circuit board has a conductive component, such as a conductive clip, placed on one side of the metal plate to electrically connect to an adjacent radiator, the antenna performance may be degraded by noise generated from the circuit board.

[0009] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which an embodiment belongs from the description below.

[0010] As a technical means for achieving the above-described technical task, one aspect of the present disclosure is to provide an electronic device including a conductive structure that pursues rigidity of a relatively narrow circuit board, grounding stability, and mountability with other components.

[0011] In addition, another aspect of the present disclosure is to provide an electronic device including a conductive structure that pursues rigidity of a relatively narrow circuit board, ground stability, and improved antenna radiator performance.

[0012] In addition, another aspect of the present disclosure is to provide an electronic device including a conductive structure that pursues rigidity of a relatively narrow circuit board, improved antenna radiator performance, grounding stability, and electromagnetic shielding.

[0013] In addition, another aspect of the present disclosure is to provide an electronic device including a conductive structure for preventing interference between first and second electronic components arranged on both sides of a relatively narrow circuit board.

[0014] An electronic device according to one embodiment may include a housing including a front plate, a rear plate, and a side member surrounding at least a portion of an internal space between the front plate and the rear plate. The housing may include a first electronic component disposed within the housing; a second electronic component spaced apart from the first electronic component and disposed within the housing; at least one neck portion disposed between the first electronic component and the second electronic component, and a circuit board disposed between the front plate and the rear plate. The housing may include a rear case having at least one conductive layer formed on one surface facing the one surface and disposed between the circuit board and the rear plate. The housing may include a support plate made of a metal material disposed on one surface of the circuit board and supporting the at least one neck portion; and a conductor disposed on the support plate and electrically connecting the support plate and the conductive layer of the rear case.

[0015] An electronic device according to one embodiment may include a circuit board including a first electronic component disposed on one surface; a second electronic component spaced apart from the first electronic component; and at least one neck portion disposed between the first electronic component and the second electronic component. The electronic device may include a rear case having at least one conductive layer formed on one surface facing the one surface of the circuit board and disposed to face the circuit board. A conductive structure according to one embodiment may include a support plate disposed on one surface of the circuit board and supporting the at least one neck portion; and a conductor disposed on the support plate to electrically connect the support plate and the conductive layer.

[0016] According to one embodiment, the present invention can enhance the rigidity of the neck portion of a circuit board, ensure grounding stability, prevent interference between electronic components, and improve antenna performance by using a conductive structure.

[0017] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0018] FIG. 1 is a drawing illustrating an example of an appearance of an electronic device in an unfolded state according to one embodiment.

[0019] FIG. 2 is a drawing illustrating an example of an appearance of an electronic device in a folded state according to one embodiment.

[0020] FIG. 3 is an exploded perspective view of an example of an electronic device according to one embodiment.

[0021] FIG. 4 is a plan view showing a neck portion of a circuit board between first and second electronic components according to one embodiment.

[0022] FIGS. 5 to 8 are cross-sectional views each showing a conductive structure disposed in a neck portion of various circuit boards according to one embodiment.

[0023] FIGS. 9 to 12 are cross-sectional views each showing a state in which various conductive structures according to one embodiment are electrically connected to a conductive layer.

[0024] FIG. 13 and FIG. 14 are cross-sectional views each showing a conductive structure having a shielding function according to one embodiment.

[0025] FIG. 15 is a cross-sectional view showing a conductive structure arranged in a veneered portion of various circuit boards according to one embodiment.

[0026] FIG. 16a is a plan view showing a conductive structure according to one embodiment arranged close to an antenna feed section.

[0027] FIG. 16b is a side view showing a state in which a conductive structure according to one embodiment is arranged in a neck portion.

[0028] Figure 16c is a comparative graph showing the radiation efficiency of a conductive structure according to a comparative example and a conductive structure according to an embodiment.

[0029] Figure 17 is a comparative example diagram showing the stress occurring in the neck of a conductive structure according to a comparative example and a conductive structure according to an embodiment.

[0030] Fig. 18 is a plan view showing a circuit board and a grounding portion formed on a neck portion thereof according to one embodiment.

[0031] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0032] Below, embodiments of the present disclosure are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In addition, for the purpose of clearly explaining the present disclosure in the drawings, parts irrelevant to the description are omitted, and similar parts are designated with similar reference numerals throughout the specification.

[0033] The terms used in this disclosure are described as currently common terms, taking into account the functions mentioned herein. However, these terms may mean various other terms depending on the intentions of those skilled in the art, precedents, the emergence of new technologies, etc. Therefore, the terms used in this disclosure should not be interpreted solely based on their names, but rather based on the meanings of the terms and the overall content of this disclosure.

[0034] Additionally, while terms such as first, second, etc. may be used to describe various components, the components should not be limited by these terms. These terms are used to distinguish one component from another.

[0035] Throughout the specification, when a part is said to be "connected" to another part, this includes not only the cases where the parts are "directly connected" but also the cases where the parts are "electrically connected" with other elements intervening. Furthermore, when a part is said to "include" a component, this does not exclude other components, but rather includes other components, unless otherwise stated.

[0036] The phrases “in one embodiment” and the like appearing in various places throughout this disclosure do not necessarily all refer to the same embodiment.

[0037] An embodiment of the present disclosure may be represented by functional block configurations and various processing steps. Some or all of these functional blocks may be implemented by various hardware and / or software configurations that perform specific functions. For example, the functional blocks of the present disclosure may be implemented by one or more microprocessors or by circuit configurations for a given function. Furthermore, for example, the functional blocks of the present disclosure may be implemented using various programming or scripting languages. The functional blocks may be implemented by algorithms that execute on one or more processors. Furthermore, the present disclosure may employ conventional techniques for electronic configuration, signal processing, and / or data processing. Terms such as "mechanism," "element," "means," and "configuration" may be used broadly and are not limited to mechanical and physical configurations.

[0038] Additionally, the connecting lines or connecting members between components depicted in the drawings are merely exemplary representations of functional connections and / or physical or circuit connections. In an actual device, connections between components may be represented by various functional connections, physical connections, or circuit connections that may be replaced or added.

[0039] The present disclosure will be described in detail with reference to the attached drawings below.

[0040] FIG. 1 is a drawing illustrating an example of the appearance of an electronic device (101) in an unfolded state according to one embodiment. FIG. 2 is a drawing illustrating an example of the appearance of an electronic device (101) in a folded state according to one embodiment.

[0041] Referring to FIGS. 1 and 2 , in one embodiment, an electronic device (101) may include a foldable housing (200), a folding portion (230) (e.g., a hinge and a hinge cover) covering a foldable portion of the foldable housing (200), and a flexible display (260) disposed within a space formed by the foldable housing (200). In this document, a surface on which the flexible display (260) is disposed may be referred to as a front surface of the electronic device (101). A surface opposite to the front surface may be referred to as a rear surface in this document. A surface surrounding a space between the front surface and the rear surface may be referred to as a side surface of the electronic device (101). According to one embodiment, the electronic device (101) may include a front plate that forms a front surface of the electronic device (101) and faces in a first direction (e.g., upward direction), a rear plate (e.g., rear cover) that forms a rear surface of the electronic device (101) and faces in a second direction (e.g., downward direction) opposite to the first direction, and a side member (e.g., bezel structure) that surrounds at least a portion of a space between the front plate and the rear plate and faces in a third direction (e.g., lateral direction) perpendicular to the first and second directions, respectively.

[0042] In one embodiment, the foldable housing (200) may include a first housing structure (210) and a second housing structure (220). The first housing structure (210) may be referred to as a first housing. The second housing structure (220) may be referred to as a second housing. The first housing structure (210) may include a rear cover (290). The foldable housing (200) of the electronic device (101) is not limited to the shape and combination illustrated in FIGS. 1 and 2 and may be implemented by other shapes or combinations and / or combinations of parts. For example, in one embodiment, the first housing structure (210) and the rear cover (290) may be formed integrally.

[0043] In one embodiment, the first housing structure (210) and the second housing structure (220) may be arranged on both sides with respect to the folding axis (A) as the center, and may have a shape in which the side surfaces are symmetrical with respect to the folding axis (A). As described below, depending on the angle or distance between the first housing structure (210) and the second housing structure (220), the state of the electronic device (101) may be referred to as a flat / open state (e.g., FIG. 1), a folded state (e.g., FIG. 2), or an intermediate state. In one embodiment, the first housing structure (210) and the second housing structure (220) may have an overall symmetrical shape, but some portions may have different shapes.

[0044] Referring to FIG. 1, the first housing structure (210) may include a rear cover (290) on which at least one camera (280) is disposed. The second housing structure (220) may include a structure on which a display (205) is disposed on the rear.

[0045] In one embodiment, the first housing structure (210) and the second housing structure (220) may together form a shape that accommodates the flexible display (260). The rear cover (290) may be positioned on one side of the folding axis (A) at the rear of the electronic device (101). The periphery of the rear cover (290) may be wrapped by the housing structure (210).

[0046] In one embodiment, the first housing structure (210) and the second housing structure (220) may form a space in which components of the electronic device (101) (e.g., a printed circuit board, a battery) may be placed. In one embodiment, one or more components or sensors may be placed or visually exposed on the back of the electronic device (101). For example, the lenses of at least one camera (280) may be visually exposed through the back cover (290).

[0047] Referring to FIG. 2, in one embodiment, the folding portion (230) may be configured to be positioned between the first housing structure (210) and the second housing structure (220) and have an internal component (e.g., a hinge structure). In one embodiment, the folding portion (230) may be at least partially covered or exposed to the outside by the first housing structure (210) and the second housing structure (220) depending on the state of the electronic device (101) (e.g., an unfolded state, a folded state, or an intermediate state).

[0048] For example, as illustrated in FIG. 1, when the electronic device (101) is in an unfolded state, the folding portion (230) may be covered by at least one of the first housing structure (210) and the second housing structure (220) and may not be visually exposed. For example, as illustrated in FIG. 2, when the electronic device (101) is in a folded state (e.g., a fully folded state), the folding portion (230) may be at least partially visually exposed to the outside between the first housing structure (210) and the second housing structure (220). For example, when the first housing structure (210) and the second housing structure (220) are in an intermediate state where they are folded at a certain angle, the folding portion (230) may be at least partially exposed to the outside between the first housing structure (210) and the second housing structure (220). For example, the exposed area of ​​the fold (230) may be less than that in a fully folded state. In one embodiment, the exposed area of ​​the fold (230) may include a curved surface.

[0049] In one embodiment, the flexible display (260) may be placed in a space formed by the foldable housing (200). For example, at least a portion of the flexible display (260) may be placed along one side defined along the first housing structure (210) and one side defined along the second housing structure (220). The back of the electronic device (101) may include a back cover (290) and a display (205).

[0050] In one embodiment, the flexible display (260) may include a display in which at least some areas can be transformed into a flat or curved surface. The flexible display (260) may be divided into multiple areas depending on the structural function.

[0051] In one embodiment, when the electronic device (101) is in an unfolded state (e.g., FIG. 1), a first surface on which the flexible display (260) is disposed on the first housing structure (210) side and a second surface on which the flexible display (260) is disposed on the second housing structure (220) side may form an angle of about 180 degrees. The area corresponding to the first housing structure (210) of the flexible display (260) and the area corresponding to the second housing structure (220) may face substantially the same direction. The direction in which the surface on which the flexible display (260) is disposed faces when the electronic device (101) is in an unfolded state may be referred to as the front direction of the electronic device (101).

[0052] In one embodiment, when the electronic device (101) is in a folded state (e.g., FIG. 2), the first housing structure (210) and the second housing structure (220) may be arranged to face each other. The first side of the flexible display (260) arranged on the first housing structure (210) side and the second side arranged on the second housing structure (220) side may form a narrow angle (e.g., an angle of 0 degrees or more and 10 degrees or less) with respect to each other. The first side and the second side may face each other. A portion of the flexible display (260) arranged between the first side and the second side may be deformed into a shape having a predetermined curvature.

[0053] In one embodiment, when the electronic device (101) is in an intermediate state, the first housing structure (210) and the second housing structure (220) may be arranged at a certain angle with respect to each other. The first side of the flexible display (260) arranged on the first housing structure (210) side and the second side arranged on the second housing structure (220) side may form an angle that is larger than the angle formed when the flexible display (260) is in a folded state and smaller than the angle formed when the flexible display (260) is in an unfolded state. A portion of the flexible display (260) arranged between the first side and the second side may be deformed into a shape having a certain curvature. The curvature of the portion of the flexible display (260) in the intermediate state may be smaller than the curvature formed when the flexible display is in a folded state.

[0054] FIG. 3 is an exploded perspective view of an example of an electronic device (101) according to one embodiment.

[0055] In one embodiment, the electronic device (101) may include a flexible display (260), a first housing (210), a second housing (220), a battery (489-1, 489-2), a folding member (230), at least one plate (235), at least one camera (280), a front camera (281), a rear camera (282), a speaker module (455), an antenna module (497), a display (205), and a rear cover (290).

[0056] In one embodiment, at least one plate (235) can be positioned at a position corresponding to an area where the flexible display (260) bends as the first housing (210) and the second housing (220) are folded. The at least one plate (235) can move within the electronic device (101) as the angle between the first housing (210) and the second housing (220) changes. The at least one plate (235) can be positioned to support the flexible display (260) in a state of the electronic device (101) (e.g., an unfolded state). At least a portion of the flexible display (260) can be fixed to the first housing (210), and at least a portion of the remainder can be fixed to the second housing (220).

[0057] In one embodiment, the first housing (210) may include a bracket (or frame) for arranging components of the electronic device (101). The bracket arranged on the side of the first housing (210) may be formed integrally with the first housing (210) or may be fixed to the first housing (210) as a separate component. Referring to FIG. 3, at least one camera (280) (e.g., the camera (280) of FIGS. 1 and 2 ), a front camera (281), a battery (489-1), and an antenna module (497) exposed to the rear of the electronic device (101) may be arranged based on the bracket of the first housing (210). At least a portion of the at least one camera (280) may be optically exposed through the rear cover (290). The front camera (281) may be arranged to receive light through a transparently formed area (e.g., a hole area or a notch area) in the flexible display (260). Alternatively, the front camera (281) may include an under display camera (UDC) that receives light through the flexible display (260) without a separate transparent area in the flexible display (260). The battery (489-1) may store power and supply the stored power to at least one component included in the electronic device (101). The antenna module (497) may include at least one antenna or at least one radio frequency integrated circuit (RFIC) for performing communication. For example, the antenna module (497) may include at least one of a main antenna, a sub antenna, an antenna for performing ultra wide-band (UWB) communication, or an antenna for performing near field communication (NFC).Referring to FIG. 3, at least one camera (280), a front camera (281), a battery (489-1), and an antenna module (497) may be placed within a space at least partially surrounded by the first housing (210), the flexible display (260), and the rear cover (290).

[0058] In one embodiment, the second housing (220) may include a bracket (or frame) (221) for arranging components of the electronic device (101). The bracket arranged on the second housing (220) side may be formed integrally with the first housing (220) or may be fixed to the first housing (220) as a separate component. Referring to FIG. 3, a rear camera (282), a battery (489-2), a speaker module (455), an adhesive member (420), and a first buffer member (430) may be arranged based on the bracket (221) of the second housing (220). The rear camera (282) may be arranged to receive light through a transparently formed area (e.g., a hole area or a notch area) in the display (205). The rear camera (282) may also include a UDC that receives light through the display (205). The battery (489-2) can store power and supply the stored power to at least one component of the electronic device (101). The speaker module (455) can include at least one speaker that outputs sound. For example, the speaker module (455) can include an upper speaker (455-1) that outputs sound through the upper part of the electronic device (101) (e.g., an area adjacent to the rear camera (282) of the second housing (220). The speaker module (455) can include a lower speaker (455-2) that outputs sound through the lower part (opposite of the upper part) of the electronic device (101). The adhesive member (420) can be attached to the flexible display (260) and the bracket (221) to form a waterproof area, which is a space between the flexible display (260) and the bracket (221) into which liquid does not flow in from the outside. The adhesive member (420) can include, for example, a waterproof tape. The first buffer member (430) may include a material that alleviates the impact caused by the flexible display (260) colliding with the bracket (221) made of a rigid material.For example, the first buffer member (430) may include at least one of a porous foam or an elastomer. Referring to FIG. 3, the rear camera (282), the battery (489-2), the speaker module (455), the adhesive member (420), and the first buffer member (430) may be placed within a space at least partially surrounded by the second housing (220), the display (205), and the flexible display (260).

[0059] In one embodiment, the folding member (230) may include a hinge structure that rotatably connects the first housing (210) and the second housing (220), a hinge cover positioned so that the hinge structure is not exposed to the outside, and at least one plate (235) connected to the hinge structure.

[0060] However, the components and arrangement of the components illustrated in FIG. 3 are for the purpose of explaining an example, and some components may be changed or moved in position. For example, although FIG. 3 illustrates that the front camera (281) is arranged on the first housing (210) side and the rear camera (282) is arranged on the second housing (220), the front camera (281) may be arranged on the second housing (220) side and the rear camera (282) may be arranged on the first housing (210) side.

[0061] Hereinafter, with reference to the drawings, a description will be given of a conductive structure according to various embodiments.

[0062] FIG. 4 is a plan view showing a neck portion of a circuit board between first and second electronic components according to one embodiment.

[0063] An orthogonal coordinate system is illustrated in Fig. 4, where the X-axis of the orthogonal coordinate system represents the horizontal direction of the housing, the Y-axis represents the vertical direction of the housing, and the Z-axis represents the height direction of the housing.

[0064] Referring to FIG. 4, an electronic device according to one embodiment may have at least one circuit board (50) disposed inside a housing (e.g., a foldable housing (200) illustrated in FIG. 1). According to one embodiment, the circuit board (50) may be formed of a plurality of layers and may be formed of either a rigid material or a flexible material. According to one embodiment, the circuit board (50) may have a plurality of electronic components disposed on one surface, and a plurality of electronic components disposed on the other surface opposite to the one surface. According to one embodiment, the plurality of electronic components may include a first electronic component (51) disposed on one surface, and a second electronic component (52) disposed on one surface, spaced apart from the first electronic component (51), but adjacent to the first electronic component (51). For example, the first electronic component (51) may include either a camera module or a motor, and the second electronic component (52) may include either a speaker, a microphone, a display DDI, an AP, an LNA, and a filter. According to one embodiment, the first and second electronic components (51, 52) may or may not be disposed on the circuit board (50). For example, the first and second electronic components (51, 52) may be disposed within a housing other than the circuit board.

[0065] According to one embodiment, the circuit board (50) may include at least one neck portion (500). According to one embodiment, the neck portion (500) is a portion disposed between the first and second electronic components (51, 52) disposed on one surface of the circuit board (50), and may be a portion whose width is relatively rapidly reduced and may be a portion that may be more vulnerable to cracks than a portion with a relatively wide width. According to one embodiment, the length of the neck portion (500) of the circuit board disposed within the housing is not limited, and may be formed to be short or long as needed.

[0066] According to one embodiment, the neck portion (500) may be provided with a support plate (e.g., the support plate (610) illustrated in FIG. 5) to reinforce rigidity. According to one embodiment, the support plate may be attached to one surface of the neck portion (500) to support the neck portion (500) and reinforce the rigidity of the neck portion (500).

[0067] FIGS. 5 to 8 are cross-sectional views each showing a conductive structure disposed in a neck portion of various circuit boards according to one embodiment.

[0068] Referring to FIG. 5, according to one embodiment, an electronic device (e.g., the electronic device (101) illustrated in FIG. 1) may have a conductive structure (61) disposed thereon to reinforce the rigidity of a neck portion (500) of a circuit board and to electrically connect with a conductive layer (e.g., an antenna radiator or a ground portion).

[0069] According to one embodiment, the conductive structure (61) may be a metal structure that supports the neck portion (500) of the circuit board, shields interference between the first and second electronic components (51, 52), is connected to the ground portion of the circuit board and can act as a ground portion, and is electrically connected to another conductive layer (e.g., an antenna radiator) or can act as an antenna radiator. According to one embodiment, the conductive structure (61) may include a supporting plate (610) and a conductive body (612). According to one embodiment, the conductive structure (61) may be placed on a circuit board (e.g., the circuit board (50) of FIG. 4) as a surface mounting device (SMD).

[0070] According to one embodiment, the conductive structure (61) serves as a reinforcing material to prevent damage to the circuit board (50), and from an electrical perspective, can be utilized as a critical contact point (CCP), general antenna feeding, or a coaxial connector.

[0071] According to one embodiment, the support plate (610) is a thin plate made of metal and can be bonded to one surface of the neck portion (500) of a circuit board (e.g., the circuit board (50) illustrated in FIG. 4). For example, the support plate (610) can be made of SUS (stainless steel). According to one embodiment, the support plate (610) can be bonded to a ground portion formed on a circuit board (e.g., the circuit board (50) illustrated in FIG. 4). For example, the ground portion can be formed in a pattern shape on one surface of the circuit board (50).

[0072] According to one embodiment, the conductor (612) may be formed integrally with the support plate (610), but is not limited thereto, and may be manufactured separately and then combined. According to one embodiment, the conductor (612) may be a conductive portion for electrically connecting the support plate (610) to a conductive layer. For example, the conductive layer may be any one of an antenna radiator formed in a rear case (e.g., the rear case (r) of FIG. 9) or a portion of a metal housing. According to one embodiment, when the conductive structure (61) is electrically connected to the metal housing, such a connection structure may be used to strengthen the grounding function between the circuit board (50) and the housing.

[0073] In one embodiment, the conductor (612) may be a clip-shaped connecting terminal, one end (612a) of which may be a fixed portion, and the other end (612b) of which may be an elastic portion. In one embodiment, the conductor (612) may be a portion in which one end (612a) is electrically connected to the support plate (610), and the other end (612b) is elastically electrically connected to another conductive layer. For example, the conductor may be either a C-clip or a finger clip.

[0074] According to one embodiment, when viewed from above the supporting plate (610) (e.g., in the Z-axis direction), the conductor (612) and the supporting plate (610) may be arranged so as to overlap at least a portion thereof. Furthermore, according to one embodiment, when viewed from above the supporting plate (610), the neck portion (500), the supporting plate (610), and the conductor (612) may be arranged so as to overlap at least a portion thereof. For example, the overlapped state may be in a vertical direction (e.g., in the Z-axis direction).

[0075] Referring to FIG. 6, according to one embodiment, an electronic device (e.g., the electronic device (101) illustrated in FIG. 1) may have a conductive structure (62) disposed thereon to reinforce the rigidity of a neck portion (500) of a circuit board (e.g., the circuit board (50) illustrated in FIG. 4) and to electrically connect with a conductive layer. According to one embodiment, the conductive structure (62) may include a support plate (620) and a conductor (622).

[0076] According to one embodiment, the support plate (620) is a thin metal plate that can be placed or bonded to one surface of the neck portion (500). According to one embodiment, the support plate (620) can be bonded to a grounding portion formed on a circuit board (e.g., a circuit board (50) illustrated in FIG. 4). For example, the grounding portion can be formed in a pattern shape on one surface of the circuit board (e.g., a circuit board (50) illustrated in FIG. 4).

[0077] In one embodiment, the conductor (622) may be electrically connected to the neck portion (500) of the circuit board by being inserted at least partially into the support plate (620). In one embodiment, the conductor (622) may be a conductive portion for electrically connecting the neck portion (500) of the circuit board to another conductive layer. For example, the conductive layer may be an antenna radiator or a ground portion formed in a rear case (e.g., the rear case (r) of FIG. 9).

[0078] In one embodiment, the conductor (622) may be a flat fastener shape, with one end (622a) electrically connected to another conductive layer and the other end (622b) electrically connected to the neck portion (500) of the circuit board. In one embodiment, the other end (622b) may be formed in a protrusion shape that is upright from the one end (622a). In one embodiment, the conductor (622) may be electrically connected to the support plate (620) or may be insulated from the support plate (620).

[0079] According to one embodiment, when viewed from above the support plate (620) (e.g., in the Z-axis direction), the conductor (622) and the support plate (620) may be arranged so as to overlap at least a portion thereof. Furthermore, according to one embodiment, the neck portion (500), the support plate (620), and the conductor (622) may be arranged so as to overlap at least a portion thereof. For example, they may overlap along a vertical direction (e.g., in the Z-axis direction).

[0080] According to one embodiment, the conductive structure (62) can be placed on a circuit board (50) as a surface mounting device (SMD).

[0081] Referring to FIG. 7, according to one embodiment, an electronic device (e.g., the electronic device (101) illustrated in FIG. 1) may have a conductive structure (63) disposed thereon to reinforce the rigidity of a neck portion (500) of a circuit board (e.g., the circuit board (50) illustrated in FIG. 4) and to electrically connect with a conductive layer. According to one embodiment, the conductive structure (63) may include a support plate (630) and a conductor (632).

[0082] According to one embodiment, the support plate (630) is a thin metal plate, at least a portion of which may be placed or bonded to one surface of the neck portion (500). According to one embodiment, the support plate (630) may be bonded to a grounding portion formed on a circuit board (e.g., the circuit board (50) illustrated in FIG. 4). For example, the grounding portion may be formed in a pattern shape, at least a portion of which may be formed on one surface of the circuit board.

[0083] In one embodiment, the conductor (632) may be fastened to the support plate (630). In one embodiment, the conductor (632) may be a conductive portion for electrically connecting the support plate (630) to another conductive layer. For example, the other conductive layer may be an antenna radiator formed on the rear case.

[0084] In one embodiment, the conductor (632) may be in the shape of a metal fastener, such as a screw. In one embodiment, the conductor (632) may include a head (632a) and a threaded portion (632b). In one embodiment, the conductor (632) may have a threaded portion (632b) that penetrates the conductive layer and may be fastened to the support plate (630). The conductive layer (e.g., antenna radiator) and the support plate (630) are electrically connected by the conductor (632), so that the support plate (630) may be utilized as a part of the antenna radiator. In one embodiment, the support plate (630) may be relatively thick for fastening the threaded portion (632b) of the conductor.

[0085] According to one embodiment, when viewed from above the supporting plate (e.g., in the Z-axis direction), the conductor (632) and the supporting plate (630) may be arranged so as to overlap at least a portion thereof. Furthermore, according to one embodiment, the neck portion (500), the supporting plate (630), and the conductor (632) may be arranged so as to overlap at least a portion thereof. For example, the overlapping structure may overlap at least a portion thereof along a vertical direction (e.g., up-down direction) (e.g., in the Z-axis direction).

[0086] According to one embodiment, the conductive structure (63) can be placed on a circuit board (50) as a surface mounting device (SMD).

[0087] Referring to FIG. 8, according to one embodiment, an electronic device (e.g., the electronic device (101) illustrated in FIG. 1) may have a conductive structure (64) disposed thereon to reinforce the rigidity of a neck portion (500) of a circuit board (e.g., the circuit board (50) illustrated in FIG. 4) and to electrically connect with a conductive layer. According to one embodiment, the conductive structure (64) may include a support plate (640) and a conductor (642).

[0088] According to one embodiment, the support plate (640) is a thin metal plate, and at least a portion thereof may be placed or bonded to one surface of the neck portion (500) of a circuit board (e.g., a circuit board (50) illustrated in FIG. 4). According to one embodiment, at least a portion of the support plate (640) may be bonded to a ground portion formed on the circuit board (e.g., a circuit board (50) illustrated in FIG. 4). For example, at least a portion of the ground portion may be formed in a pattern shape on one surface of the circuit board.

[0089] In one embodiment, the conductor (642) may be physically connected to the support plate (640). In one embodiment, the conductor (642) may be a conductive portion for electrically connecting the support plate (640) to another conductive layer. For example, the other conductive layer may be an antenna radiator formed on a rear case (e.g., the rear case (r) of FIG. 9). In one embodiment, the conductor (642) may include metal fasteners (642a, 642b) and a fastening portion (6401). In one embodiment, the metal fasteners (642a, 642b) may have a screw-like shape.

[0090] In one embodiment, the metal fastener may include a head (642a) and a threaded portion (642b). In one embodiment, the conductor (642) may have the threaded portion (642b) penetrate another conductive layer and be fastened to the fastening portion (6401). The other conductive layer and the support plate (640) may be electrically connected by the conductor (642).

[0091] According to one embodiment, the fastening portion (6401) may be formed integrally with the support plate (640) and made of the same material. For example, the fastening portion (6401) may be cylindrical and have a threaded portion (642b) fastened to the internal space.

[0092] In one embodiment, the conductor (642) and the support plate (640) may be arranged so as to overlap at least a portion thereof. Furthermore, in one embodiment, the neck portion (500), the support plate (640), and the conductor (642) may be arranged so as to overlap at least a portion thereof. For example, the overlapping structure may overlap at least a portion thereof along a vertical direction (e.g., up-down direction) (e.g., Z-axis direction).

[0093] According to one embodiment, the conductive structure (64) can be placed on a circuit board (50) as a surface mounting device (SMD).

[0094] FIGS. 9 to 12 are cross-sectional views each showing a state in which various conductive structures according to one embodiment are electrically connected to a conductive layer.

[0095] Referring to FIG. 9, according to one embodiment, the conductive structure (61) illustrated in FIG. 5 may be electrically connected to a conductive layer (71) formed on a rear case (r). According to one embodiment, the conductor (612) may electrically connect the conductive layer (71) and the support plate (610). According to one embodiment, one end (612a) of the conductor (612) may elastically maintain contact with the conductive layer (71). For example, the conductive layer (71) may include an antenna radiator. Hereinafter, the conductive layer (71) will be referred to as an antenna radiator (71). According to one embodiment, the conductive structure (61) may electrically connect the circuit board (50) and the conductive layer (71) and may be used as a power supply unit of the conductive layer (71).

[0096] According to one embodiment, the support plate (610) may be grounded to one side of the neck portion (500) of a circuit board (e.g., the circuit board (50) illustrated in FIG. 4), thereby supporting the neck portion (500) of the circuit board and simultaneously grounding the circuit board. According to one embodiment, the conductor (612) of the conductive structure (61) may be utilized as a part of the antenna radiator (71) by electrically connecting the antenna radiator (71) and the support plate (610).

[0097] For example, the antenna radiator (71) may include any one of the following types: a radiator formed in a pattern shape, an antenna arranged in a patch type, or an LDS (laser direct structuring) antenna. This connection structure between the conductive structure (61) and the antenna radiator (71) may be advantageous in saving component mounting space and may enable the implementation of a stable electrical connection.

[0098] According to one embodiment, the conductive structure (61) can be used as a power supply part of the conductive layer (71) by electrically connecting a circuit board (e.g., a circuit board (50) as shown in FIG. 4) and the conductive layer (71). According to one embodiment, when the conductive structure (61) is used as a power supply part of the conductive layer (71), the copper layer (e.g., a ground part) of the circuit board (50) can be removed so that the conductive structure (61) can operate as an antenna radiator.

[0099] In one embodiment, the conductive structure (61) can be used as an antenna tuning point (e.g., changing the antenna resonance point) for optimal antenna performance by changing some of its shape and material.

[0100] Referring to FIG. 10, according to one embodiment, the conductive structure (62) illustrated in FIG. 6 may be electrically connected to an antenna radiator (71) formed in a rear case (r). According to one embodiment, the conductor (622) may electrically connect the antenna radiator (71) and a circuit board. According to one embodiment, one end (622a) of the conductor (622) may be connected to the antenna radiator (71), and the other end (622b) may be connected to a connection pad (not illustrated) of a circuit board (e.g., a circuit board (50) illustrated in FIG. 4).

[0101] According to one embodiment, the support plate (620) of the conductive structure (62) may be grounded to one side of the neck portion (500) of the circuit board, thereby supporting the neck portion (500) and being grounded to the circuit board at the same time. According to one embodiment, the conductor (622) of the conductive structure (62) may be utilized as a part of the antenna radiator (71) by electrically connecting the antenna radiator (71) and the support plate (620).

[0102] For example, the antenna radiator (71) may include any one of the following types: a radiator formed in a pattern shape, an antenna arranged in a patch type, or an LDS (laser direct structuring) antenna.

[0103] According to one embodiment, the conductive structure (62) electrically connects a circuit board (e.g., circuit board (50) illustrated in FIG. 4) and a conductive layer (71), so that the conductive structure (62) can be used as a power supply portion of the conductive layer (71). According to one embodiment, when the conductive structure (62) is used as a power supply portion of the conductive layer (71), the copper layer (e.g., ground portion) of the circuit board (e.g., circuit board (50) illustrated in FIG. 4) can be removed, so that the conductive structure (62) can operate as an antenna radiator.

[0104] In one embodiment, the conductive structure (62) can be used as an antenna tuning point (e.g., changing the antenna resonance point) for optimal antenna performance by changing some of its shape and material.

[0105] Referring to FIG. 11, according to one embodiment, the conductive structure (63) illustrated in FIG. 7 may be electrically connected to an antenna radiator (71) formed in a rear case (r). According to one embodiment, the conductor (632) may penetrate the antenna radiator (71) and then be fastened to the support plate (630). According to one embodiment, the antenna radiator (71) may be physically fastened to the support plate (630) by the conductor (632) and electrically connected, so that it may be utilized as a part of the antenna radiator (71).

[0106] According to one embodiment, the support plate (630) of the conductive structure (63) is grounded to one side of the neck portion (500) of the circuit board (e.g., the circuit board shown in FIG. 4), so as to support the circuit board (e.g., the circuit board (50) shown in FIG. 4) and at the same time be grounded to the circuit board (e.g., the circuit board shown in FIG. 4). According to one embodiment, the conductor (632) of the conductive structure (63) can be utilized as a part of the antenna radiator (71) by electrically connecting the antenna radiator (71) and the support plate (630).

[0107] For example, the antenna radiator (71) may include one of the following types: a radiator formed in a pattern shape, an antenna arranged in a patch type, or an LDS (laser direct structuring) antenna.

[0108] According to one embodiment, the conductive structure (63) electrically connects a circuit board (e.g., circuit board (50) illustrated in FIG. 4) and a conductive layer (71), so that the conductive structure (63) can be used as a power supply portion of the conductive layer (71). According to one embodiment, when the conductive structure (63) is used as a power supply portion of the conductive layer (71), the copper layer (e.g., ground portion) of the circuit board (e.g., circuit board (50) illustrated in FIG. 4) can be removed, so that the conductive structure (63) can operate as an antenna radiator.

[0109] In one embodiment, the conductive structure (63) can be used as an antenna tuning point (e.g., changing the antenna resonance point) for optimal antenna performance by changing some of its shape and material.

[0110] Referring to FIG. 12, according to one embodiment, the conductive structure (64) illustrated in FIG. 8 may be electrically connected to the antenna radiator (71) formed in the rear case (r). According to one embodiment, the conductor (642) may penetrate the antenna radiator (71) and then be fastened to the support plate (640). According to one embodiment, the antenna radiator (71) may be physically fastened to the support plate (610) by the conductor (642) and the fastening portion (6401) and may be electrically connected, so that it may be utilized as a part of the antenna radiator (71).

[0111] According to one embodiment, the support plate (640) of the conductive structure (64) is grounded to one surface of the neck portion (500), so as to support the neck portion (500) and at the same time be grounded to a circuit board (e.g., a circuit board (50) illustrated in FIG. 4). According to one embodiment, the conductor (642) and the fastening portion (6401) of the conductive structure (64) can be utilized as a part of the antenna radiator (71) by electrically connecting the antenna radiator (71) and the support plate (610).

[0112] For example, the antenna radiator (71) may include any one of the following types: a radiator formed in a pattern shape, an antenna arranged in a patch type, or an LDS (laser direct structuring) antenna.

[0113] According to one embodiment, the conductive structure (64) electrically connects a circuit board (e.g., circuit board (50) illustrated in FIG. 4) and a conductive layer (71), so that the conductive structure (64) can be used as a power supply portion of the conductive layer (71). According to one embodiment, when the conductive structure (64) is used as a power supply portion of the conductive layer (71), the copper layer (e.g., ground portion) of the circuit board (e.g., circuit board (50) illustrated in FIG. 4) can be removed, so that the conductive structure (64) can operate as an antenna radiator.

[0114] In one embodiment, the conductive structure (64) may be used as an antenna tuning point (e.g., changing the antenna resonance point) for optimal antenna performance by changing some of its shape and material.

[0115] FIG. 13 and FIG. 14 are cross-sectional views each showing a conductive structure having a shielding function according to one embodiment.

[0116] Referring to FIG. 13, according to one embodiment, the conductive structure (63) illustrated in FIG. 7 can be connected to a shielding plate (634) to perform a shielding function of the first and second electronic components (51, 52).

[0117] According to one embodiment, the shielding plate (634) may be fastened to the support plate (630) by the conductor (632). According to one embodiment, the shielding plate (634) may have a shape that surrounds at least a portion of the support plate (630) and the first and second electronic components (51, 52). For example, at least a portion that is surrounded may be the upper surfaces of the first and second electronic components (51, 52) and the shielding plate (634). According to one embodiment, the internal space between the support plate (630) and the first and second electronic components (51, 52) may be surrounded by the shielding plate (634). Since noise generated in the circuit board is absorbed by the shielding plate (634), the shielding plate (634) may contribute to improving antenna performance. For example, the shielding plate (634) may be formed of the same material as or a different material from the support plate (630), and may have the same thickness or a different thickness.

[0118] Referring to FIG. 14, according to one embodiment, the conductive structure (63) illustrated in FIG. 7 can be connected to a shielding plate (636) to perform a shielding function of the first and second electronic components (51, 52).

[0119] According to one embodiment, the shielding plate (636) can perform a shielding function to prevent noise generated from an electronic component from affecting another component, for example, the first component (51) or the second component (52), or to prevent another component from affecting the first component (51) or the second component (52) inside the shielding plate (636). For example, when the first component (51) is a camera module, the transmission power of an antenna radiator applied to the camera module can be blocked by the shielding plate (636).

[0120] According to one embodiment, the shielding plate (636) may be fastened to the support plate (630) by the conductor (632). According to one embodiment, the shielding plate (636) may have a shape that surrounds at least a portion of the first and second electronic components (51, 52). For example, at least a portion surrounded by the shielding plate (636) may be the upper and side surfaces of the first and second electronic components (51, 52) and the support plate (630). According to one embodiment, the internal space between the support plate (630) and the first and second electronic components (51, 52) may be surrounded by the shielding plate (634). According to one embodiment, noise generated from the circuit board is absorbed by the shielding plate (636), and thus the shielding plate (636) may contribute to improving antenna performance.

[0121] In one embodiment, the conductive structure (63) is disposed between a circuit board (e.g., the circuit board (50) illustrated in FIG. 4) and at least a portion of the housing, so as to electrically connect at least a portion of the circuit board and the housing. In one embodiment, when a portion of the housing, for example, a portion of the housing, is made of a metal material, the conductive structure (63) can be used to enhance grounding performance between the circuit board and the housing.

[0122] According to one embodiment, the conductive structure (63) may be arranged to be electrically connectable to at least a portion of the housing and a circuit board (e.g., the circuit board (50) illustrated in FIG. 4). According to one embodiment, when a portion of the housing, for example, a portion of the housing is made of a metal material and is an antenna radiator, the conductive structure (63) may be used to enhance the radiation function of the antenna radiator.

[0123] FIG. 15 is a cross-sectional view showing a conductive structure arranged in a veneered portion of various circuit boards according to one embodiment.

[0124] Referring to FIG. 15, according to one embodiment, the conductive structure (65) may include a support plate (650) disposed on or grounded on one surface of the neck portion (502) of the circuit board, and a conductor (652) penetrating the rear case (r) and fastened to the support plate (650). According to one embodiment, the conductive structure (65) may be equally applied not only to the neck portion (500) of the circuit board, but also to the neck portion (502) other than the neck portion (500).

[0125] According to one embodiment, the conductive structures (61-64) illustrated in FIGS. 5 to 8 may be applied to the veneered portion (502) of the circuit board in the same manner.

[0126] FIG. 16a is a plan view showing a conductive structure according to one embodiment arranged close to an antenna feed section.

[0127] FIG. 16b is a side view showing a state in which a conductive structure according to one embodiment is arranged in a neck portion.

[0128] Figure 16c is a comparative graph showing the radiation efficiency of a conductive structure according to a comparative example and a conductive structure according to an embodiment.

[0129] Referring to FIGS. 16a and 16b, according to one embodiment, when a conductive structure (61) is placed on the neck portion (500) of a circuit board (50) in a position close to the antenna feed portion (53) (radiation current supply point), the conductive structure (61) is grounded to the circuit board (50), thereby maximizing the radiation efficiency of the antenna radiator.

[0130] Referring to FIG. 16c, when the radiation efficiency of a conductive structure (dotted line) according to a comparative example and a conductive structure (e.g., conductive structure (61) illustrated in FIG. 5) (solid line) according to an embodiment were measured, it was confirmed that the radiation characteristics of the conductive structure according to an embodiment were improved by approximately 0.5 decibels (dB) compared to the conductive structure of the comparative example, and the BW (bandwidth) was improved. The horizontal axis of the graph illustrated in FIG. 16c represents frequency, and the vertical axis represents the overall radiation efficiency.

[0131] The conductive structure of the comparative example means a structure in which a support plate is arranged on one surface of a circuit board and a conductor (e.g., a clip) is arranged on the other surface of the circuit board, and the conductive structure according to one embodiment may be the conductive structure (61) illustrated in FIG. 5.

[0132] Figure 17 is a comparative example diagram showing the stress occurring in the neck of a conductive structure according to a comparative example and a conductive structure according to an embodiment.

[0133] Referring to FIG. 17, when measuring the stress applied to the neck portion of the circuit board in the conductive structure of the comparative example and the conductive structure according to one embodiment (e.g., the conductive structure (61) illustrated in FIG. 5), the neck portion of the circuit board according to the conductive structure of the comparative example shows a bending (strain 654 uε) approximately near the back surface of the conductor (e.g., clip) and at the sensor boundary, whereas the neck portion of the circuit board according to the conductive structure according to one embodiment may hardly experience stress due to the conductor (e.g., clip) (strain e-7 level).

[0134] The conductive structure of the comparative example means a structure in which a support plate (610) is arranged on one side of the neck portion of the circuit board, and a conductor (e.g., a clip) is arranged at a location spaced from the support plate (610) on one side of the neck portion of the circuit board, and the conductive structure according to the embodiment may be the conductive structure (61) illustrated in FIG. 5.

[0135] In the shaded representation of the circuit board (50) shown in Fig. 17, the brighter the part (A, B), the more stress may be generated in the neck portion (500) of the circuit board (50), and the darker the part, the less stress may be generated in the neck portion (500) of the circuit board (50). The vertical axis of Fig. 17 represents the effective strain.

[0136] Referring to FIG. 18, according to one embodiment, the positioned area of ​​the support plate can be set wide enough to sufficiently ensure the rigidity of the circuit board (50). According to one embodiment, by removing (fill cut) the ground layer (g) of the circuit board (50) corresponding to the entire area of ​​the support plate, the support plate can be used as an antenna radiator. For example, when the ground layer (g) (e.g., ground line) formed on the circuit board (50) is removed, the support plate according to one embodiment (e.g., the support plate (610) illustrated in FIG. 5) can be utilized as an antenna radiator, rather than a grounding function.

[0137] According to one embodiment, if the ground layer (g) formed on the circuit board (50) is not removed, according to one embodiment, a support plate (e.g., support plate (610) illustrated in FIG. 5) is soldered to the ground layer (g), and thus can be utilized as a grounding body that performs a grounding function, rather than an antenna radiator function.

[0138] According to one embodiment, for antenna tuning, an inductor and / or a capacitor may be placed adjacent to a support plate (e.g., support plate (610) illustrated in FIG. 5). According to one embodiment, in order to secure a radiation volume, the ground layer (g) of the circuit board (50) may be formed by removing not only the top layer of the circuit board (50) but also about 4 to 6 layers, and using the remaining layers, the lines of components placed in the neck portion (500) of the circuit board, which is formed narrow and long, may be routed using the layers below it. Since many lines, such as sensors and antenna switches, are not usually required in the corresponding area, wiring may be possible in some layers.

[0139] According to one embodiment, when a support plate (e.g., support plate (610) illustrated in FIG. 5) is utilized as an antenna radiator, the support plate (e.g., support plate (610) illustrated in FIG. 5) electrically connected to the antenna radiator operates as a part of the antenna radiator, and thus can be used as a tuning part by changing the shape and material for further improved antenna performance.

[0140] According to one embodiment, when the degree of reinforcement of the neck portion (500) of the circuit board is reduced due to the fill cut, a pad (503) may be formed in the inner layer in the same manner as the pad (503) arranged as an SMD formed on the upper surface of the circuit board, and then a via (504) may be applied to some layers. Reference numeral 505 denotes a matching portion for tuning an antenna arranged on the circuit board.

[0141] According to one embodiment, an electronic device (e.g., an electronic device (101) illustrated in FIG. 1) comprises a housing (e.g., a first housing (210) illustrated in FIG. 1) including a front plate, a rear plate, and a side member surrounding at least a portion of an internal space between the front plate and the rear plate; a first electronic component (e.g., a first electronic component (51) illustrated in FIG. 4) disposed within the housing; a second electronic component (e.g., a second electronic component (52) illustrated in FIG. 4) spaced apart from the first electronic component and disposed within the housing; a circuit board (e.g., a circuit board (50) illustrated in FIG. 4) comprising at least one neck portion (e.g., a neck portion (500) illustrated in FIG. 4) disposed between the first electronic component and the second electronic component, the circuit board being disposed between the front plate and the rear plate; It may include a rear case (e.g., a rear case (r) shown in FIG. 9) formed on one side facing the one side and disposed between the circuit board and the rear plate; a support plate made of a metal material (e.g., a support plate (610) shown in FIG. 5) disposed on one side of the circuit board and supporting the at least one neck portion; and a conductor (e.g., a conductor (612) shown in FIG. 5) disposed on the support plate and electrically connecting the support plate and the conductive layer of the rear case.

[0142] According to one embodiment, a support plate (e.g., support plate (610) illustrated in FIG. 5) may be grounded to the circuit board (e.g., circuit board (50) illustrated in FIG. 4).

[0143] According to one embodiment, the conductive layer (e.g., the conductive layer (71) illustrated in FIG. 9) may include at least one antenna radiator.

[0144] According to one embodiment, the first electronic component (e.g., the first electronic component (51) illustrated in FIG. 4) may include one of a camera module and a motor, and the second electronic component (e.g., the second electronic component (52) illustrated in FIG. 4) may include one of a speaker, a display DDI, an AP, an LNA, and a filter.

[0145] According to one embodiment, when the support plate (e.g., the support plate (610) illustrated in FIG. 5)) is viewed from above, the conductive layer (e.g., the conductive layer (71) illustrated in FIG. 9) may be arranged to overlap at least a portion of the support plate and the neck portion (e.g., the neck portion (500) illustrated in FIG. 4).

[0146] According to one embodiment, a conductor (e.g., conductor (622) illustrated in FIG. 6) may be fastened to the support plate as a metal fastener, penetrating the conductive layer.

[0147] According to one embodiment, a support plate (e.g., support plate (610) illustrated in FIG. 5) and the conductive layer (e.g., conductive layer (71) illustrated in FIG. 9) are electrically connected by the conductor, so that the support plate can operate as a part of the antenna radiator.

[0148] According to one embodiment, a conductor (e.g., conductor (632) illustrated in FIG. 11) may be fastened to a support plate (e.g., support plate (630) illustrated in FIG. 11) by penetrating the rear case (e.g., rear case (r) illustrated in FIG. 11) and the conductive layer (e.g., conductive layer (71) illustrated in FIG. 11) as a metal fastener.

[0149] According to one embodiment, the conductor (e.g., conductor (612) illustrated in FIG. 9) is a metal clip, one end of which is in contact with the support plate (e.g., support plate (610) illustrated in FIG. 9) and the other end of which is elastically in contact with the conductive layer (e.g., conductive layer (71) illustrated in FIG. 9).

[0150] According to one embodiment, a conductor (e.g., conductor (642) illustrated in FIG. 8) may include a fastening portion (e.g., fastening portion (6401) illustrated in FIG. 8) formed upright on one surface of the support plate and made of the same material; and a metal fastener (e.g., metal fasteners (642a, 642b) illustrated in FIG. 8) penetrating the conductive layer and fastened to the fastening portion.

[0151] According to one embodiment, a shielding plate (e.g., a shielding plate (634) illustrated in FIG. 13) may be further included, which is arranged to surround a space between the first electronic component (e.g., the first electronic component (51) illustrated in FIG. 13) and the second electronic component (e.g., the second electronic component (52) illustrated in FIG. 13).

[0152] According to one embodiment, a shielding plate (e.g., a shielding plate (634) illustrated in FIG. 13) may be fastened to a support plate (e.g., a support plate (630) illustrated in FIG. 13) using a metal fastener (e.g., a conductor (632) illustrated in FIG. 13).

[0153] According to one embodiment, when the shielding plate (e.g., the shielding plate (634) illustrated in FIG. 13) is viewed from above (in top view), the metal fastener (e.g., the conductor (632) illustrated in FIG. 13), the shielding plate (e.g., the shielding plate (634) illustrated in FIG. 13) and the support plate (e.g., the support plate (630) illustrated in FIG. 13) may be arranged to overlap each other vertically.

[0154] According to one embodiment, in an electronic device (e.g., an electronic device (101) illustrated in FIG. 1), a circuit board (e.g., a circuit board (50) illustrated in FIG. 4) having a first electronic component (e.g., a first electronic component (51) illustrated in FIG. 4) disposed on one surface and a second electronic component (e.g., a second electronic component (52) illustrated in FIG. 4) spaced apart from the first electronic component) and including at least one neck portion (e.g., a neck portion (500) illustrated in FIG. 4) disposed between the first electronic component and the second electronic component; a rear case (e.g., a rear case (r) illustrated in FIG. 9) having at least one conductive layer (e.g., a conductive layer (71) illustrated in FIG. 9) formed on one surface facing one surface of the circuit board (e.g., a circuit board (5) illustrated in FIG. 4)) and disposed to face the circuit board; It may include a support plate (e.g., support plate (610) shown in FIG. 9) disposed on one side of the circuit board and supporting at least one neck portion; and a conductor (e.g., conductor (61) shown in FIG. 9) disposed on the support plate and electrically connecting the support plate and the conductive pattern.

[0155] According to one embodiment, a support plate (e.g., support plate (610) illustrated in FIG. 9) may be grounded to the circuit board (e.g., circuit board (50) illustrated in FIG. 4).

[0156] According to one embodiment, the conductive layer (e.g., the conductive layer (71) illustrated in FIG. 9) may include at least one antenna radiator.

[0157] According to one embodiment, the first electronic component (e.g., the first electronic component (51) illustrated in FIG. 9) may include a camera module, and the second electronic component (e.g., the second electronic component (52) illustrated in FIG. 9) may include a speaker.

[0158] According to one embodiment, when the support plate (e.g., the support plate (610) illustrated in FIG. 9) is viewed from above, the conductive layer (e.g., the conductive layer (71) illustrated in FIG. 9) may be arranged to overlap at least a portion of the support plate and the neck portion (e.g., the neck portion (500) illustrated in FIG. 9).

[0159] According to one embodiment, a support plate (e.g., support plate (610) illustrated in FIG. 9) and the conductive layer (e.g., conductive layer (71) illustrated in FIG. 9) are electrically connected by the conductor (e.g., conductor (612) illustrated in FIG. 9), so that the support plate can operate as a part of the antenna radiator.

[0160] According to one embodiment, the present invention further includes a shielding plate (e.g., a shielding plate (634) illustrated in FIG. 13) arranged to surround at least a portion of a space between a first electronic component (e.g., a first electronic component (51) illustrated in FIG. 13) and a second electronic component (e.g., a second electronic component (52) illustrated in FIG. 13), wherein the shielding plate can be fastened to the support plate (e.g., a support plate (630) illustrated in FIG. 13) using a metal fastener (e.g., a conductor (632) illustrated in FIG. 13).

Claims

1. In electronic devices, A housing comprising a front plate, a rear plate, and side members surrounding at least a portion of an interior space between the front plate and the rear plate; A first electronic component disposed within the housing; A second electronic component spaced apart from the first electronic component and positioned within the housing; A circuit board comprising at least one neck portion positioned between the first electronic component and the second electronic component, and positioned between the front plate and the rear plate; A rear case having at least one conductive layer formed on one side facing the one side and disposed between the circuit board and the rear plate; A support plate made of a metal material, which is arranged on one side of the circuit board and supports at least one neck portion; and An electronic device comprising a conductor disposed on the support plate and electrically connecting the support plate and the conductive layer of the rear case.

2. An electronic device in accordance with claim 1, wherein the support plate can operate as a grounding element when grounded to the circuit board, or can operate as an antenna radiator when electrically connected to the conductive layer.

3. An electronic device according to claim 1, wherein the conductive layer includes at least one antenna radiator.

4. In the first paragraph, the support plate is a component that prevents interference between the first and second electronic components. An electronic device wherein the first electronic component includes one of a camera module and a motor, and the second electronic component includes one of a speaker, a microphone, a display DDI, an AP, an LNA, and a filter.

5. An electronic device in accordance with claim 1, wherein when the support plate is viewed from above, the conductive layer is arranged to overlap at least a portion of the support plate and the neck portion.

6. In the third paragraph, the conductor is an electronic device that is fastened to the support plate by penetrating the conductive layer as a metal fastener.

7. An electronic device in accordance with claim 6, wherein the support plate and the conductive layer are electrically connected by the conductor, so that the support plate operates as a part of the antenna radiator.

8. An electronic device in the first paragraph, wherein the conductor is a metal fastener that penetrates the rear case and the conductive pattern and is fastened to the support plate.

9. An electronic device in the first paragraph, wherein the conductor is a metal clip, one end of which is in contact with the support plate and the other end is in elastic contact with the conductive layer.

10. In paragraph 1, the conductor is A fastening member formed upright on one side of the above support plate and made of the same material; and An electronic device comprising a metal fastener penetrating the above challenging pattern and fastened to the fastening portion.

11. An electronic device according to claim 1, further comprising a shielding plate arranged to surround at least a portion of the first electronic component and the second electronic component.

12. An electronic device in accordance with claim 11, wherein the shielding plate is fastened to the support plate using a metal fastener.

13. An electronic device in accordance with claim 12, wherein, when the shielding plate is viewed from above (in top view), the metal fastener, the shielding plate, and the support plate are arranged to overlap each other vertically.

14. In paragraph 12, An electronic device, wherein the shielding plate is formed to surround at least a portion of an internal space formed by the first electronic component, the second electronic component, and the support plate.

15. In paragraph 14, An electronic device in which the above shielding plate is formed of a material that absorbs noise generated from the circuit board.

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