Method for manufacturing signal transmission module and signal transmission module manufactured thereby

Abstract

The present invention relates to a method for manufacturing a signal transmission module and a signal transmission module manufactured thereby and, more specifically, to a method for manufacturing a signal transmission module and a signal transmission module manufactured thereby, in which forming a circuit pattern, laminating a cover layer, and cutting the outer shape of a signal transmission module are performed in an in-line process by using a roll-to-roll manner, in a signal transmission module manufacturing process, thereby improving productivity of manufacturing the signal transmission module and reducing a defect rate.

Description

Method for manufacturing a signal transmission module and a signal transmission module according to the method

[0001] The present invention relates to a method for manufacturing a signal transmission module and a signal transmission module according to the method, and more specifically, to a method for manufacturing a signal transmission module and a signal transmission module according to the method, which can improve the productivity of manufacturing a signal transmission module and reduce the defect rate by performing the formation of a circuit pattern, laminating a cover layer, and cutting the outer shape of a signal transmission module in an in-line process using a roll-to-roll method.

[0002]

[0003] Generally, a type of printed circuit board (PCB), a flexible printed circuit board (FPCB) with insulation and flexibility, is widely used as a means of signal transmission in various electronic products such as computers, mobile phones, displays, communication networks, and battery modules.

[0004] FPCBs are used in complex product cases that are installed in a curved state or in areas that move repeatedly by taking advantage of the flexibility of the raw material. In particular, FPCBs are used in various products that require miniaturization, slimness, flexibility, and high-density wiring.

[0005] These FPCBs are manufactured by laminating a dry film on a copper-clad laminate formed by forming a copper foil on a polyimide film, and then forming a conductor pattern through exposure, development, and etching processes, and then bonding a cover layer and bonding the cover layer on the outermost copper foil.

[0006] This FPCB manufacturing process requires multiple steps, resulting in high manufacturing costs and low productivity. Furthermore, the etching process generates a large amount of wastewater containing chemicals, requiring additional treatment processes and costs to purify. To address these issues, Korean Patent No. 10-1377273 discloses a laser-based FPCB manufacturing system. However, this system still incurs additional costs for installing expensive laser equipment and fails to improve productivity.

[0007]

[0008] Accordingly, the technical problem of the present invention is conceived from this point, and relates to a method for manufacturing a signal transmission module and a signal transmission module according to the method, which can not only improve the productivity of manufacturing a signal transmission module but also reduce the defect rate by performing the formation of a circuit pattern, laminating a cover layer, and cutting the outer shape of a signal transmission module in an in-line process using a roll-to-roll method in the manufacturing process of a signal transmission module.

[0009]

[0010] According to one embodiment of the present invention, a method for manufacturing a signal transmission module is provided, including: a step of forming a circuit pattern by punching an incoming metal substrate; a step of removing a scrap area of ​​the metal substrate other than the circuit pattern; a step of laminating a first cover layer on an upper surface of the circuit pattern; and a step of laminating a second cover layer on a lower surface of the circuit pattern.

[0011] At this time, the step of removing the scrap area of ​​the metal substrate can be performed by attaching an adhesive film to the upper surface of the punched metal substrate and then removing the adhesive film to which the scrap area is attached.

[0012] Additionally, prior to the step of laminating the first cover layer to the upper surface of the circuit pattern, the method may further include a step of forming an open area in the first cover layer.

[0013] At this time, a step of plating the open area formed in the first cover layer may be further included.

[0014] In addition, the step of laminating the first cover layer and the step of laminating the second cover layer may include a step of bonding the first cover layer and the second cover layer to the circuit pattern; and a step of pressing the bonded first cover layer and the second cover layer to laminate the first cover layer and the second cover layer.

[0015] Additionally, the metal substrate may be a film made of copper.

[0016] Additionally, the metal substrate may be plated with nickel (Ni) on both sides of a copper film.

[0017] According to another embodiment of the present invention, a method for manufacturing a signal transmission module is provided, characterized in that it further includes: a step of forming a first circuit pattern by punching an incoming first metal substrate; a step of removing a scrap area of ​​the first metal substrate other than the first circuit pattern; a step of forming a second circuit pattern by punching an incoming second metal substrate; a step of removing a scrap area of ​​the second metal substrate other than the second circuit pattern; a step of bonding the first circuit pattern and the second circuit pattern; a step of laminating a first cover layer on an upper surface of the first circuit pattern; a step of laminating a second cover layer on a lower surface of the second circuit pattern; a step of forming a through hole penetrating the first cover layer, the first circuit pattern, the second circuit pattern, and the second cover layer; and a step of plating the through hole.

[0018] According to a modified example of another embodiment of the present invention, a method for manufacturing a signal transmission module is provided, comprising: forming a first circuit pattern by punching an incoming first metal substrate; removing a scrap area of ​​the first metal substrate other than the first circuit pattern; forming a second circuit pattern by punching an incoming second metal substrate; removing a scrap area of ​​the second metal substrate other than the second circuit pattern; bonding the first circuit pattern and the second circuit pattern; forming a through-hole penetrating the first circuit pattern and the second circuit pattern; plating the through-hole; laminating a first cover layer on an upper surface of the first circuit pattern; and laminating a second cover layer on a lower surface of the second circuit pattern.

[0019] At this time, before the step of laminating the first cover layer to the upper surface of the first circuit pattern, a step of forming an open area in the first cover layer may be further included.

[0020] At this time, a step of plating the open area formed in the first cover layer may be further included.

[0021] At this time, the first metal substrate and the second metal substrate may be films made of copper material.

[0022] In addition, the first metal substrate may be a copper material film plated with nickel (Ni) on both sides, and the second metal substrate may be a copper material film.

[0023] According to another embodiment of the present invention, a signal transmission module manufactured by the above-described method for manufacturing a signal transmission module is provided.

[0024]

[0025] According to an embodiment of the present invention, in a signal transmission module manufacturing process, the formation of a circuit pattern, laminating of a cover layer, and cutting of the outer shape of a signal transmission module are performed in-line using a roll-to-roll method, thereby improving the productivity of the signal transmission module manufacturing.

[0026] In addition, the signal transmission module has the effect of preventing environmental pollution by minimizing the generation of wastewater by not using chemicals used in conventional etching processes during its manufacturing.

[0027]

[0028] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0029]

[0030] The above summary, as well as the detailed description of preferred embodiments of the present application described below, will be better understood when read in conjunction with the accompanying drawings. For the purpose of illustrating the present invention, preferred embodiments are depicted in the drawings. However, it should be understood that the present application is not limited to the precise arrangements and means illustrated.

[0031]

[0032] Figures 1 to 3 are reference drawings for explaining a method for manufacturing a signal transmission module according to one embodiment of the present invention.

[0033] FIGS. 4 and 5 are cross-sectional views of a signal transmission module manufactured by a method for manufacturing a signal transmission module according to one embodiment of the present invention.

[0034] FIG. 6 is a reference diagram for explaining a method for manufacturing a signal transmission module according to another embodiment of the present invention.

[0035] FIG. 7 and FIG. 8 are cross-sectional views of a signal transmission module manufactured by a method for manufacturing a signal transmission module according to another embodiment of the present invention.

[0036] FIG. 9 is a reference diagram for explaining a method for manufacturing a signal transmission module according to a modified example of another embodiment of the present invention.

[0037] FIG. 10 and FIG. 11 are cross-sectional views of a signal transmission module manufactured by a method for manufacturing a signal transmission module according to a modified example of another embodiment of the present invention.

[0038]

[0039] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. However, the attached drawings are provided solely to more easily disclose the contents of the present invention, and those skilled in the art will readily understand that the scope of the present invention is not limited to the scope of the attached drawings.

[0040] In addition, in describing the embodiments of the present invention, it is to be noted in advance that although the same names and symbols are used for components having the same functions, they are not substantially the same as the components of the prior art.

[0041] In addition, the terminology used in this application is only used to describe specific embodiments and is not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, it should be understood that the terms "comprise" or "have" are intended to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0042]

[0043] Hereinafter, a method for manufacturing a signal transmission module according to the present invention and a signal transmission module according to the same will be described in detail with reference to the attached drawings. In describing with reference to the attached drawings, identical or corresponding components are assigned the same drawing numbers, and redundant descriptions thereof will be omitted.

[0044]

[0045] FIGS. 1 to 3 are reference diagrams for explaining a method for manufacturing a signal transmission module according to an embodiment of the present invention. Referring to FIGS. 1 to 3, the method for manufacturing a signal transmission module according to the present embodiment may include a step of forming a circuit pattern (S100), a step of removing a scrap area (S200), a first cover layer lamination step (S300), a second cover layer lamination step (S400), and an outer shape cutting step.

[0046] The step of forming a circuit pattern (S100) refers to a step of forming a circuit pattern by punching an incoming metal substrate. The metal substrate may be a metal film (thin film), and the metal substrate is introduced into a rotating punching mold and punched by the punching mold to form a preset circuit pattern on the metal substrate. At this time, the punching mold can form a circuit pattern on the metal substrate by pressing and punching the metal substrate introduced into the punching mold as the mold is protruded and rotated on the outer periphery of the roller.

[0047] At this time, the metal substrate may be introduced into the punching mold while adhered to the carrier film. The carrier film is a thin film that helps the circuit pattern formed by punching the metal substrate maintain its pattern shape during the signal transmission module manufacturing process, and may be formed of polyimide (PI) or PET material.

[0048] At this time, the metal substrate may be a copper (Cu) film or a film in which nickel (Ni) is plated on both sides of a copper (Cu) film. However, the metal substrate is not limited to copper (Cu) and may be formed of various materials having electrical conductivity.

[0049] If the metal substrate is a film in which nickel (Ni) is plated on both sides of a copper (Cu) film, a separate oxidation prevention process for the circuit pattern to protect the circuit pattern from oxidation by surface treatment of the circuit pattern is not required, which has the effect of improving productivity.

[0050] Next, the metal substrate is punched to form a circuit pattern, and then the scrap area is removed from the metal substrate.

[0051] The step of removing the scrap area (S200) means a step of removing the scrap area of ​​the metal substrate other than the circuit pattern formed by the punch.

[0052] When an incoming metal substrate passes through a die, a circuit pattern is formed on the metal substrate, and a scrap area is formed as an unnecessary portion outside of the circuit pattern. The step of removing the scrap area (S200) refers to the process of separating this scrap area from the circuit pattern.

[0053] The step (S200) of removing the scrap area of ​​the metal substrate can be performed by attaching an adhesive film to the upper surface of the punched metal substrate and then removing the adhesive film to which the scrap area is attached. At this time, it is also possible to remove the scrap area of ​​the metal substrate by attaching an adhesive film having the same area as the area of ​​the punched metal substrate to the upper surface of the metal substrate and then removing the adhesive film to which the scrap area is attached.

[0054] Specifically, when a metal substrate passes through a rotating punching mold, the metal substrate is divided into a circuit pattern and a scrap area, and an adhesive film having an area equal to that of the metal substrate is attached to the upper surface of the metal substrate, and then the adhesive film is separated from the metal substrate, thereby removing the scrap area from the circuit pattern.

[0055] Next, a first cover layer is laminated to the upper surface of the circuit pattern.

[0056] The step of laminating the first cover layer (S300) refers to the step of attaching the first cover layer having the same area as the carrier film to the upper surface of the circuit pattern. At this time, the first cover layer may be a PI film having excellent heat resistance and warpage resistance, little dimensional change, and being suitable as an insulating film. An adhesive (or adhesive film) is applied to the lower surface of the PI film, and the PI film is adhered to the upper surface of the circuit pattern, thereby attaching the PI film, which is the first cover layer, to the upper surface of the circuit pattern.

[0057] Specifically, the first cover layer is wound in a roll type, and as the wound first cover layer is unwound to correspond to the inflow speed of the circuit pattern, the scrap area is removed so that the first cover layer is positioned on the upper surface of the inflowing circuit pattern, and the rotating roller presses the first cover layer and the circuit pattern so that the first cover layer is attached to the upper surface of the circuit pattern.

[0058] At this time, the carrier film can be removed while the first cover layer is bonded to the circuit pattern. Specifically, the carrier film can be removed by bonding the first cover layer to the upper surface of the circuit pattern and then scraping off the carrier film attached to the lower surface of the circuit pattern using a scraper or the like, or by bonding an adhesive tape to the carrier film and then recovering the adhesive tape so that the carrier film is recovered together with the adhesive tape, thereby separating the carrier film from the first cover layer.

[0059] Next, a second cover layer is laminated to the underside of the circuit pattern.

[0060] The step of laminating the second cover layer (S400) refers to the step of attaching a second cover layer having the same area as the carrier film to the lower surface of the circuit pattern. At this time, the second cover layer may be a PI film having excellent heat resistance and warpage resistance, little dimensional change, and being suitable as an insulating film. An adhesive (or adhesive film) is applied to the upper surface of the PI film, and the PI film is adhered to the lower surface of the circuit pattern, thereby attaching the PI film, which is the second cover layer, to the upper surface of the circuit pattern.

[0061] Specifically, the second cover layer is wound in a roll type, and as the wound second cover layer is unwound to correspond to the inflow speed of the circuit pattern, the second cover layer is positioned on the lower surface of the circuit pattern to which the first cover layer is attached, and a rotating roller presses the second cover layer and the circuit pattern, so that the second cover layer is attached to the upper surface of the circuit pattern.

[0062] Finally, the outer shape of the signal transmission module is formed by cutting the outer shape. Specifically, the circuit pattern, which is formed by laminating the first cover layer and the second cover layer, is passed through a rotating punching mold and punched, thereby cutting the circuit pattern, to which the cover layer is laminated, into a predetermined shape to form the signal transmission module.

[0063] According to this embodiment, the formation of a circuit pattern, lamination of a cover layer, and cutting of the outer shape of a signal transmission module are performed in an in-line process using a roll-to-roll method, thereby improving the productivity of manufacturing a signal transmission module and reducing the defect rate.

[0064] In addition, by not using chemicals used in the etching process during the conventional FPCB manufacturing process, the generation of wastewater can be minimized, thereby preventing environmental pollution.

[0065] Meanwhile, referring to FIG. 2, a step (S250) of forming an open area in the first cover layer may be further included before the step (S300) of bonding the first cover layer to the upper surface of the circuit pattern. The open area of ​​the first cover layer is an area corresponding to a terminal of the circuit pattern, and an open area is formed in the first cover layer covering the upper surface of the circuit pattern to form a terminal portion for electrically connecting with the terminal of the circuit pattern. The open area formed in the first cover layer is plated with a conductive material to form a terminal portion, and the terminal portion is electrically connected to the terminal of the circuit pattern, and an electrical component outside the signal transmission module and the circuit pattern of the signal transmission module are electrically connected through the terminal portion.

[0066] Meanwhile, referring to FIG. 3, the step of laminating the first cover layer (S300) may include the step of bonding the first cover layer to the circuit pattern (S330) and the step of pressing the first cover layer to laminate the first cover layer (S350), and the step of bonding the second cover layer (S400) may include the step of bonding the second cover layer to the circuit pattern (S430) and the step of pressing the second cover layer to laminate the second cover layer (S450).

[0067] Typically, in FPCB manufacturing, the process of laminating a cover layer over a circuit pattern is accomplished through a hot stamping process, which involves bonding the cover layer to the circuit pattern, cutting and processing the outer shape of the signal transmission module, and then applying high temperature and high pressure. However, this manufacturing process can compromise the continuity of signal transmission module production, as the lamination of the cover layer is performed in a separate process after the outer shape processing process.

[0068] In the present embodiment, the productivity of the signal transmission module can be improved by performing the cover layer lamination process immediately after the cover layer lamination process using a roll-to-roll process by laminating the first cover layer and the second cover layer on the circuit pattern through a press process using a rotating roller after the first cover layer and the second cover layer are laminated on the circuit pattern before cutting the outer shape of the signal transmission module.

[0069] In the present embodiment, the first cover layer is laminated on the circuit pattern by pressing the first cover layer using a rotating roller after the first cover layer is bonded to the circuit pattern, and the second cover layer is laminated on the circuit pattern by pressing the second cover layer using a rotating roller after the second cover layer is bonded to the circuit pattern. Although the lamination process of the first cover layer and the second cover layer has been described separately, it is not limited thereto, and it is also possible to laminate the first cover layer and the second cover layer on the circuit pattern by simultaneously pressing the first cover layer and the second cover layer after bonding the first cover layer and the second cover layer to the circuit pattern.

[0070] FIG. 4 and FIG. 5 are cross-sectional views of a signal transmission module manufactured by a method for manufacturing a signal transmission module according to an embodiment of the present invention. FIG. 4 is a view schematically showing a cross-section of a signal transmission module manufactured by a method for manufacturing a signal transmission module according to an embodiment of the present invention when the metal substrate is a film made of copper (Cu), and FIG. 5 is a view schematically showing a cross-section of a signal transmission module manufactured by a method for manufacturing a signal transmission module according to an embodiment of the present invention when the metal substrate is a film made of copper (Cu) with nickel (Ni) plated on both sides.

[0071] Referring to Fig. 5, when the metal substrate is a film made of copper (Cu) material and nickel (Ni) is plated on both sides, nickel (Ni) has electrical conductivity and is applied to the surface of the copper (Cu) film, so there is an advantage of not needing to go through a process of forming a separate terminal portion corresponding to the terminal of the circuit pattern by plating an open area as shown in Fig. 4.

[0072] FIG. 6 is a reference diagram for explaining a method for manufacturing a signal transmission module according to another embodiment of the present invention. Referring to FIG. 6, the method for manufacturing a signal transmission module according to the present embodiment may include a step of forming a first circuit pattern (S500), a step of removing a scrap area (S600), a step of forming a second circuit pattern (S700), a step of removing a scrap area (S800), a step of bonding the first circuit pattern and the second circuit pattern (S900), a first cover layer laminating step (S1000), a second cover layer laminating step (S1100), a through-hole forming step (S1200), a through-hole plating step (S1300), and an outer shape cutting step.

[0073] First, the first metal substrate that is introduced is punched to form a first circuit pattern, and a scrap area of ​​the first metal substrate other than the first circuit pattern is removed, and the second metal substrate that is introduced is punched to form a second circuit pattern, and a scrap area of ​​the second metal substrate other than the second circuit pattern is removed.

[0074] The step (S500) of forming a first circuit pattern by punching an incoming first metal substrate and the step (S700) of forming a second circuit pattern by punching an incoming second metal substrate are the same as the circuit pattern forming step (S100) of the previous embodiment except that a plurality of circuit patterns are formed using a plurality of metal substrates, and therefore, the detailed description will be replaced with the description of the previous embodiment.

[0075] At this time, the first metal substrate and the second metal substrate may be films made of copper (Cu).

[0076] However, the first metal substrate and the second metal substrate are not limited to copper (Cu) material and may be formed of various materials having electrical conductivity.

[0077] Additionally, the first metal substrate may be a copper material film plated with nickel (Ni) on both sides, and the second metal substrate may be a copper (Cu) material film.

[0078] In addition, the second metal substrate may be nickel (Ni) plated on both sides of a copper (Cu) film, similar to the first metal substrate. However, in the case of the first metal substrate, nickel (Ni) plating is required to protect the copper (Cu) film due to an open area formed in the first cover layer, which will be described later. However, in the case of the second metal substrate, nickel (Ni) plating is not necessarily required because no open area is formed in the second cover layer and the film is not exposed to the outside by the second cover layer attached to the lower surface of the second metal substrate. In addition, in terms of the increase in the production cost of the signal transmission module due to nickel (Ni) plating, it is preferable not to nickel (Ni) plate the surface of the second metal substrate.

[0079] The step of removing a scrap area of ​​the first metal substrate other than the first circuit pattern (S600) and the step of removing a scrap area of ​​the second metal substrate other than the second circuit pattern (S800) are also the same as the step of removing a scrap area of ​​the previous embodiment (S200), so the detailed description will be replaced with the description of the previous embodiment.

[0080] Next, the first circuit pattern and the second circuit pattern are bonded (S900). Specifically, the bonding of the first circuit pattern and the second circuit pattern is achieved by interposing a PI film with an adhesive (or adhesive film) applied to both sides between the first circuit pattern and the second circuit pattern, and pressing the first circuit pattern and the second circuit pattern through a rotating roller to bond the first circuit pattern and the second circuit pattern to each other.

[0081] Next, a first cover layer is laminated to the upper surface of the first circuit pattern (S1000), a second cover layer is laminated to the lower surface of the second circuit pattern (S1100), and the outer shape is cut.

[0082] The first cover layer lamination step (S1000) and the second cover layer lamination step (S1100) are the same except that the first cover layer is attached to the upper surface of the first circuit pattern and the second cover layer is attached to the lower surface of the second circuit pattern, and the step of cutting the outer shape of this embodiment is also the same as the step of cutting the outer shape of the previous embodiment, so the detailed description will be replaced with the description of the previous embodiment.

[0083] Meanwhile, a step of forming an open area in the first cover layer prior to the step (S1000) of laminating the first cover layer on the upper surface of the first circuit pattern may further include a step of forming an open area in the first cover layer. The open area of ​​the first cover layer corresponds to a terminal of the first circuit pattern, and the open area is formed in the first cover layer covering the upper surface of the first circuit pattern to form a terminal portion for electrically connecting with the terminal of the first circuit pattern. The open area formed in the first cover layer is plated with a conductive material to form a terminal portion, and the terminal portion is electrically connected to the terminal of the first circuit pattern, and an electrical component outside the signal transmission module and the first circuit pattern of the signal transmission module are electrically connected through the terminal portion.

[0084] Next, a through hole penetrating the first cover layer, the first circuit pattern, the second circuit pattern, and the second cover layer is formed (S1200), and the formed through hole is plated (S1300). The through hole is for electrically connecting the first circuit pattern and the second circuit pattern, and the through hole is formed on one side of the first circuit pattern and the second circuit pattern, and the through hole can be plated with copper (Cu).

[0085] FIG. 7 and FIG. 8 are cross-sectional views of a signal transmission module manufactured by a method for manufacturing a signal transmission module according to another embodiment of the present invention, wherein FIG. 7 is a diagram schematically showing a cross-section of a signal transmission module manufactured by a method for manufacturing a signal transmission module according to another embodiment of the present invention when the first metal substrate and the second metal substrate are films made of copper (Cu), and FIG. 8 is a diagram schematically showing a cross-section of a signal transmission module manufactured by a method for manufacturing a signal transmission module according to another embodiment of the present invention when the first metal substrate is a film made of copper (Cu) with nickel (Ni) plated on both sides, and the second metal substrate is a film made of copper (Cu).

[0086] FIG. 9 is a reference diagram for explaining a method for manufacturing a signal transmission module according to a modified example of another embodiment of the present invention. Referring to FIG. 9, the method for manufacturing a signal transmission module according to the present embodiment may include a step of forming a first circuit pattern (S500), a step of removing a scrap area (S600), a step of forming a second circuit pattern (S700), a step of removing a scrap area (S800), a step of bonding the first circuit pattern and the second circuit pattern (S900), a step of forming a through-hole (S1200), a step of plating a through-hole (S1300), a step of laminating a first cover layer (S1000), a step of laminating a second cover layer (S1100), and a step of cutting an outer shape.

[0087] The method for manufacturing a signal transmission module according to the present embodiment is the same as the method for manufacturing a signal transmission module according to the previous embodiment, except that the through-hole forming step (S1200) and the through-hole plating step (S1300) are performed before the first cover layer laminating step (S1000) and the second cover layer laminating step (S1100). Therefore, the description of the same will be replaced with the description of the previous embodiment.

[0088] A method for manufacturing a signal transmission module according to the present embodiment forms a through-hole after bonding a first circuit pattern and a second circuit pattern. Specifically, the bonding of the first circuit pattern and the second circuit pattern is performed by interposing a PI film having an adhesive (or adhesive film) applied to both surfaces between the first circuit pattern and the second circuit pattern, and pressing the first circuit pattern and the second circuit pattern through a rotating roller, thereby bonding the first circuit pattern and the second circuit pattern to each other.

[0089] Next, a through hole penetrating the first circuit pattern and the second circuit pattern is formed (S1200), and the formed through hole is plated (S1300). The through hole is for electrically connecting the first circuit pattern and the second circuit pattern, and the through hole is formed on one side of the first circuit pattern and the second circuit pattern, and the through hole can be plated with copper (Cu).

[0090] During through-hole plating, a metal layer made of copper (Cu) may be formed on the upper surface of the first circuit pattern and the lower surface of the second circuit pattern. The metal layer is a metal layer laminated on the upper surface of the first circuit pattern and the lower surface of the second circuit pattern during the through-hole plating process. As the metal layer is laminated, the total volume of the metal, which is a conductive material, increases, thereby lowering the resistance value of the circuit and increasing the electrical conductivity, thereby having the effect of improving signal transmission efficiency.

[0091] FIG. 10 and FIG. 11 are cross-sectional views of a signal transmission module manufactured by a method for manufacturing a signal transmission module according to a modified example of another embodiment of the present invention, wherein FIG. 10 is a diagram schematically showing a cross-section of a signal transmission module manufactured by a method for manufacturing a signal transmission module according to a modified example of another embodiment of the present invention when the first metal substrate and the second metal substrate are films made of copper (Cu), and FIG. 11 is a diagram schematically showing a cross-section of a signal transmission module manufactured by a method for manufacturing a signal transmission module according to a modified example of another embodiment of the present invention when the first metal substrate is a film made of copper (Cu) with nickel (Ni) plated on both sides, and the second metal substrate is a film made of copper (Cu).

[0092] The present embodiment relates to a method for manufacturing a signal transmission module in which circuit patterns are formed on the upper and lower portions of the signal transmission module, and to a signal transmission module according to the method. According to the present embodiment, electrical signal transmission according to a plurality of circuit patterns is possible using one signal transmission module, thereby enabling high-density wiring and miniaturization of the signal transmission module.

[0093] In addition, unlike the previous embodiment, in the case of this embodiment, a metal layer made of copper (Cu) is formed on the upper surface of the first circuit pattern and the lower surface of the second circuit pattern during through-hole plating, and the total volume of the metal, which is a conductive material, increases by laminating the metal layers, thereby lowering the resistance value of the circuit and increasing the electrical conductivity, thereby having the effect of improving signal transmission efficiency.

[0094] Thus, according to the present invention, in the signal transmission module manufacturing process, the formation of a circuit pattern, laminating of a cover layer, and cutting of the signal transmission module exterior are performed in an in-line process using a roll-to-roll method, thereby improving the productivity of the signal transmission module manufacturing.

[0095]

[0096] As described above, preferred embodiments of the present invention have been described. It will be apparent to those skilled in the art that the present invention may be embodied in other specific forms, in addition to the embodiments described above, without departing from the spirit or scope thereof. Therefore, the above-described embodiments should be considered illustrative rather than restrictive, and accordingly, the present invention is not limited to the above description, but may be modified within the scope of the appended claims and their equivalents.

Claims

1. A step of forming a circuit pattern by punching an incoming metal substrate; A step of removing a scrap area of ​​the metal substrate other than the circuit pattern; A step of laminating a first cover layer on the upper surface of the circuit pattern; and A method for manufacturing a signal transmission module, characterized in that it includes a step of laminating a second cover layer on the lower surface of the circuit pattern.

2. In paragraph 1, The step of removing the scrap area of ​​the above metal substrate is: A method for manufacturing a signal transmission module, characterized in that it is performed by attaching an adhesive film to the upper surface of the metal substrate that has been punched out and then removing the adhesive film to which the scrap area is attached.

3. In paragraph 1, Before the step of laminating the first cover layer on the upper surface of the circuit pattern, A method for manufacturing a signal transmission module, characterized in that it further comprises a step of forming an open area in the first cover layer.

4. In paragraph 3, A method for manufacturing a signal transmission module, characterized in that it further comprises a step of plating the open area formed in the first cover layer.

5. In paragraph 1, The step of combining the first cover layer and the step of combining the second cover layer are as follows: A step of bonding the first cover layer and the second cover layer to the circuit pattern; and A method for manufacturing a signal transmission module, characterized in that it comprises a step of pressing the first cover layer and the second cover layer to laminate the first cover layer and the second cover layer.

6. In paragraph 1, A method for manufacturing a signal transmission module, characterized in that the metal substrate is a copper film.

7. In paragraph 1, A method for manufacturing a signal transmission module, characterized in that the metal substrate is nickel-plated on both sides of a copper film.

8. A step of forming a first circuit pattern by punching the incoming first metal substrate; A step of removing a scrap area of ​​the first metal substrate other than the first circuit pattern; A step of forming a second circuit pattern by punching an incoming second metal substrate; A step of removing a scrap area of ​​the second metal substrate other than the second circuit pattern; A step of bonding the first circuit pattern and the second circuit pattern; A step of laminating a first cover layer on the upper surface of the first circuit pattern; A step of laminating a second cover layer on the lower surface of the second circuit pattern; A step of forming a through hole penetrating the first cover layer, the first circuit pattern, the second circuit pattern, and the second cover layer; and A method for manufacturing a signal transmission module, characterized in that it comprises a step of plating the above through-hole.

9. A step of forming a first circuit pattern by punching the incoming first metal substrate; A step of removing a scrap area of ​​the first metal substrate other than the first circuit pattern; A step of forming a second circuit pattern by punching an incoming second metal substrate; A step of removing a scrap area of ​​the second metal substrate other than the second circuit pattern; A step of bonding the first circuit pattern and the second circuit pattern; A step of forming a through hole penetrating the first circuit pattern and the second circuit pattern; A step of plating the above through-hole; A step of laminating a first cover layer on the upper surface of the first circuit pattern; and A method for manufacturing a signal transmission module, characterized in that it comprises a step of laminating a second cover layer on the lower surface of the second circuit pattern.

10. In paragraph 8 or 9, Before the step of laminating the first cover layer on the upper surface of the first circuit pattern, A method for manufacturing a signal transmission module, characterized in that it further comprises a step of forming an open area in the first cover layer.

11. In paragraph 10, A method for manufacturing a signal transmission module, characterized in that it further comprises a step of plating the open area formed in the first cover layer.

12. In paragraph 8 or 9, A method for manufacturing a signal transmission module, characterized in that the first metal substrate and the second metal substrate are films made of copper material.

13. In paragraph 8 or 9, The above first metal substrate is nickel-plated on both sides of a copper film, A method for manufacturing a signal transmission module, characterized in that the second metal substrate is a copper film.

14. A signal transmission module manufactured according to paragraph 1 or paragraph 8.

Images