Electronic device including segmented antenna

Abstract

Disclosed is an electronic device including a side housing which may be used as an antenna. The side housing may include conductive members separated by a segment part. The conductive members may include protrusions and grooves, which are formed in regions adjacent to the segmented part. A first groove formed on a first end of a first conductive member may have a height different from that of a second groove formed on a second end of a second conductive member.

Description

Electronic device comprising a segmented antenna

[0001] Embodiments disclosed in this document relate to electronic devices including segmented antennas.

[0002] An electronic device may support various wireless communication protocols. Each wireless communication protocol may, for example, utilize different frequency bands. To transmit and receive signals in a specific frequency band, the electronic device may include various antennas. The antennas may be configured to have resonant lengths corresponding to the intended frequency band. To allow the antennas to have different resonant lengths, the antennas may be segmented by segments. For example, the electronic device may include an antenna implemented using a metal portion formed in a housing. To transmit and receive signals in multiple bands, the housing may include a metal member segmented by segments.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device according to an embodiment disclosed in the present document may include a housing, a printed circuit board disposed in an internal space, and at least one wireless communication circuit. The housing may include a front plate, a rear plate, and a side member. The side member may be disposed between the front plate and the rear plate and may form an internal space of the electronic device together with the front plate and the rear plate. The side member may include a segmented portion comprising a non-conductive material, a first conductive member, and a second conductive member. The first conductive member may include a first end adjacent to the segmented portion and a plurality of first protrusions adjacent to the first end and protruding toward the internal space. The second conductive member may include a second end adjacent to the segmented portion and a plurality of second protrusions adjacent to the second end and protruding toward the internal space. The first conductive member may include a first hole penetrating the plurality of first protrusions along a first axis and a first groove positioned between the plurality of first protrusions. The second conductive member may include a second hole penetrating the plurality of second protrusions along the first axis and a second groove positioned between the plurality of second protrusions. At least a portion of the first groove may not overlap the second groove along the first axis. At least one wireless communication circuit may be configured to power the first conductive member and / or the second conductive member.

[0005] According to one embodiment, an electronic device may include a first housing, a second housing, a hinge structure, a printed circuit board disposed in an internal space, and at least one wireless communication circuit. For example, the first housing may include a first area of ​​a front plate, a first back plate, and a first side member disposed between the front plate and the first back plate. The second housing may include a second area of ​​the front plate, a second back plate, and a second side member disposed between the front plate and the second back plate. The first housing and the second housing may be rotatably coupled to the hinge structure. The first side member may include a segmented portion comprising a non-conductive material, a first conductive member, and a second conductive member. The first conductive member may include a first end adjacent to the segmented portion and a plurality of first protrusions adjacent to the first end and protruding toward the internal space. The second conductive member may include a second end adjacent to the segmented portion and a plurality of second protrusions adjacent to the second end and protruding toward the interior space. The first conductive member may include a first hole penetrating the plurality of first protrusions along a first axis and a first groove positioned between the plurality of first protrusions. The second conductive member may include a second hole penetrating the plurality of second protrusions along the first axis and a second groove positioned between the plurality of second protrusions. At least a portion of the first groove may not overlap the second groove along the first axis. At least one wireless communication circuit may be configured to power the first conductive member and / or the second conductive member.

[0006] FIG. 1 illustrates a block diagram of an electronic device according to one embodiment.

[0007] FIG. 2 illustrates an antenna structure of an electronic device according to one embodiment.

[0008] FIG. 3A is a front perspective view of an electronic device according to one embodiment.

[0009] FIG. 3b is a rear perspective view of an electronic device according to one embodiment.

[0010] FIG. 3c is an exploded perspective view of an electronic device according to one embodiment.

[0011] FIG. 4A is a front perspective view of an electronic device in an unfolded state according to one embodiment.

[0012] FIG. 4b is a rear view of an electronic device in an unfolded state according to one embodiment.

[0013] FIG. 4c is a perspective view of an electronic device in a folded state according to one embodiment.

[0014] FIG. 5 illustrates the rear structure of an electronic device in an unfolded state according to one embodiment.

[0015] Figure 6 is an enlarged view of the first area of ​​Figure 5.

[0016] Figure 7 is a perspective view of the second area of ​​Figure 6.

[0017] Figure 8 is a schematic diagram of a section according to one embodiment.

[0018] Figure 9 illustrates a segmentation according to one embodiment.

[0019] FIG. 10 illustrates the rear structure of an electronic device in an unfolded state according to one embodiment.

[0020] Figure 11 is a schematic diagram of a section according to one embodiment.

[0021] FIG. 12 is a block diagram of an electronic device within a network environment according to various embodiments.

[0022] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0023] Hereinafter, various embodiments of the present invention will be described with reference to the attached drawings. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that the present invention encompasses various modifications, equivalents, and / or alternatives of the embodiments.

[0024] FIG. 1 illustrates a block diagram of an electronic device according to one embodiment.

[0025] According to one embodiment, the electronic device (100) may include a processor (120), a memory (130), a communication module (190), and / or an antenna module (197). For example, the electronic device (100) may correspond to the electronic device (1201) of FIG. 12. The structure of the electronic device (100) illustrated in FIG. 1 is exemplary, and the embodiments of the present document are not limited thereto. For example, the electronic device (100) may further include components not illustrated in FIG. 1 (e.g., the components of the electronic device (1201) of FIG. 12). For example, the electronic device (100) may not include at least some of the components illustrated in FIG. 1.

[0026] The processor (120) may include at least one processing circuit. For example, the processor (120) may control various components of the electronic device (100) so that the electronic device (100) performs various operations. For example, the processor (120) may correspond to the processor (1220) of FIG. 12. For example, the operations of the electronic device (100) described below may be referred to as being performed by the processor (120). The processor (120) may perform various operations of the electronic device (100) by executing one or more instructions stored in the memory (130). The processor (120) may control the electronic device (100) so that the electronic device (100) performs various operations by executing the instructions stored in the memory (130). The processor (120) may include one processor or a plurality of processors. In one example, the processor (120) may be implemented as a single chipset.

[0027] The processor (120) may include a baseband processor that processes a baseband signal received from the communication module (190) or transmits a baseband signal to the communication module (190). The processor (120) may be electrically, operatively, or functionally connected to the memory (130), the communication module (190), and / or the antenna module (197). In the present disclosure, when a component is “operatively” connected to another component, it may mean that the component is connected so as to be able to operate the other component. For example, the component may operate the other component by transmitting a control signal to the other component, either directly or via another component. In the present disclosure, when a component is “functionally” connected to another component, it may mean that the component is connected so as to be able to execute a function of the other component. For example, the component may execute a function of the other component by transmitting a control signal to the other component, either directly or via another component.

[0028] For example, the memory (130) may be implemented as a single chip or chipset with the processor (120). For example, the memory (130) may be implemented as a separate chip from the processor (120). In one example, the memory (130) may correspond to the memory (1230) of FIG. 12. As described above, the memory (130) may store instructions executable by the processor (120).

[0029] For example, the antenna module (197) may include a plurality of antennas. The antenna module (170) may include a plurality of radiators that may be used as antennas. For example, at least some of the plurality of antennas may include a portion of the housing of the electronic device (100) (e.g., a portion of a side member), a metallic pattern, a metallic radiator, and / or a conductive member. Examples of antennas may be described below with reference to FIG. 2. The antenna module (197) may include a tuning circuit for tuning the antenna. In one example, the antenna module (197) may correspond to the antenna module (1297) of FIG. 12. In the present disclosure, the term 'antenna' may refer to an antenna circuit or a radiator (e.g., an antenna element). For example, an antenna circuit may include a radiator, a feed point electrically connected to the radiator, a ground point electrically connected to the radiator, a feed line between the feed point and the feed point, and / or a resonant circuit configured to vary the resonant length of the radiator.

[0030] The communication module (190) may include any configurations for transmitting and receiving wireless signals. For example, the communication module (190) may correspond to the wireless communication module (1292) of FIG. 12. The communication module (190) may receive a signal using the antenna module (197). The communication module (190) may convert a signal received using the antenna module (197) into a baseband signal and transmit the converted signal to the processor (120). For example, the communication module (190) may transmit a signal using the antenna module (197). The communication module (190) may convert a baseband signal received from the processor (120) into a radio frequency signal and transmit the converted radio frequency signal through the antenna module (197). The processor (120) may transmit and receive a radio signal by controlling the communication module (190).

[0031] According to one embodiment, the communication module (190) may include a first communication circuit (190a), a second communication circuit (190b), and / or a transceiver (190c). The configuration of the communication module (190) illustrated in FIG. 1 is an example, and embodiments of the present disclosure are not limited thereto. For example, between the communication circuit (e.g., the first communication circuit (190a) and / or the second communication circuit (190b)) and the transceiver (190c), at least one switch and / or at least one duplexer configured to change the connection between the communication circuit and the transceiver (190c) may be positioned. For example, the first communication circuit (190a) and the second communication circuit (190b) may be formed of a plurality of module-independent modules. Although FIG. 1 illustrates one transceiver (190c), embodiments of the present disclosure are not limited thereto. For example, the transceiver (190c) may include a first transceiver connected to the first communication circuit (190a) and a second transceiver (not shown) connected to the second communication circuit (190b).

[0032] According to one embodiment, the antenna module (197) may include a first antenna circuit (197a) and a second antenna circuit (197b). For example, the first antenna circuit (197a) may include a plurality of antenna radiators. For example, the first antenna circuit (197a) may further include at least one tuning circuit connected to at least one of the plurality of antenna radiators. For example, the second antenna circuit (197b) may include a plurality of antenna radiators. For example, the second antenna circuit (197b) may further include at least one tuning circuit connected to at least one of the plurality of antenna radiators. The configuration of the antenna module (197) in FIG. 1 is an example, and the embodiments of the present document are not limited thereto. For example, at least one switch, at least one coupler, and / or at least one duplexer may be positioned between the communication module (190) and the antenna module (197), which are configured to change the connection between the communication module (190) and the antenna module (197). In one example, the first antenna circuit (197a) and the second antenna circuit (197b) may share at least one antenna.

[0033] For example, a first communication circuit (190a) may be electrically connected to a first antenna circuit (197a). A second communication circuit (190b) may be electrically connected to a second antenna circuit (197b). The first communication circuit (190a) may perform processing (e.g., amplification, filtering, and / or phase shifting) on ​​a signal to be transmitted through the first antenna circuit (197a). The second communication circuit (190b) may perform processing (e.g., amplification, filtering, and / or phase shifting) on ​​a signal to be transmitted through the second antenna circuit (197b). The first communication circuit (190a) may perform processing (e.g., amplification, filtering, and / or phase shifting) on ​​a signal received through the first antenna circuit (197a). The second communication circuit (190b) may perform processing (e.g., amplification, filtering, and / or phase shifting) on ​​a signal received through the second antenna circuit (197b). For example, each of the first communication circuit (190a) and the second communication circuit (190b) may include at least one of an amplifier, a low noise amplifier (LNA), at least one filter, a duplexer, a phase shifter, and / or a switch.

[0034] The transceiver (190c) may, for example, process a baseband signal received from the processor (120). For example, the transceiver (190c) may upconvert, amplify, and / or filter the baseband signal. The transceiver (190c) may transmit a signal by transmitting the processed signal to the first communication circuit (190a) and / or the second communication circuit (190b). The transceiver (190c) may process the signal based on a control signal from the processor (120).

[0035] The transceiver (190c) may perform post-processing on a signal received from, for example, the first communication circuit (190a) and / or the second communication circuit (190b). For example, the transceiver (190c) may perform downconversion, amplification, and / or filtering on the received signal. The transceiver (190c) may convert the received signal into a baseband signal and transmit it to the processor (120). The transceiver (190c) may process the signal based on a control signal from the processor (120).

[0036] In one example, the first communication circuit (190a) and the second communication circuit (190b) may be communication circuits for processing different frequency bands of the same wireless communication protocol. For example, the first communication circuit (190a) may be a communication circuit configured to process signals in the first frequency band of the first wireless communication protocol. For example, the second communication circuit (190a) may be a communication circuit configured to process signals in the second frequency band of the first wireless communication protocol.

[0037] In one example, the first communication circuit (190a) may be a communication circuit for processing signals of a different wireless communication protocol than the second communication circuit (190b). For example, the first communication circuit (190a) may be configured to process signals of the first wireless communication protocol, and the second communication circuit (190b) may be configured to process signals of the second wireless communication protocol.

[0038] The configurations of the wireless communication circuit of the electronic device (100) illustrated in FIG. 1 are merely examples, and embodiments of the present disclosure are not limited thereto. Those skilled in the art will appreciate that any structure including multiple antennas may be utilized in the electronic device (100).

[0039] FIG. 2 illustrates an antenna structure of an electronic device according to one embodiment.

[0040] Referring to FIG. 2, the electronic device (100) may include a plurality of antennas. At least one of the plurality of antennas illustrated in FIG. 2 may correspond to an antenna included in the antenna module (197) illustrated in FIG. 1. For example, at least one of the plurality of antennas illustrated in FIG. 2 may be included in the first antenna circuit (197a) and / or the second antenna circuit (197b) illustrated in FIG. 1.

[0041] For example, the electronic device (100) may include a housing (310). The housing (310) may include a side housing surrounding a space between the front (e.g., display surface) and the back of the electronic device (100). At least a portion of the housing (310) may be used as an antenna radiator. For example, the housing (310) may include a metallic member, and the metallic member may be electrically isolated by a dielectric slit (e.g., segment (220) of FIG. 2). A portion of the electrically isolated metallic member may be used as an antenna. For example, at least one of the portions of the housing (310) separated by the slit (e.g., 211, 212, 213, 214, 215, 216, 217, and 218) may be used as an antenna radiator.

[0042] For example, the electronic device (100) may include a substrate (250) positioned inside a housing (310). For example, a conductive pattern (251) may be positioned inside or on the substrate (250). The conductive pattern (251) may be used as an antenna. The substrate (250) may include, for example, a printed circuit board (PCB), a flexible PCB (FPCB), or any substrate structure within the housing (310).

[0043] The antennas described with reference to FIG. 2 are exemplary, and embodiments of the present disclosure are not limited thereto. For example, a metal plate on the back of a display, a metallic pattern imprinted on the housing (310), or any metal structure may be used as an antenna.

[0044] FIG. 3A is a front perspective view of an electronic device according to one embodiment. FIG. 3B is a rear perspective view of the electronic device according to one embodiment.

[0045] Referring to FIGS. 3A and 3B, an electronic device (100a) (e.g., the electronic device (100) of FIG. 1) according to one embodiment may include a housing (310) including a first side (or front side) (310a), a second side (or back side) (310b), and a third side (or side side) (310c) surrounding a space between the first side (310a) and the second side (310b).

[0046] In one example, the housing (310) may include a front plate (311), a side member (312), and a back plate (313). A first side (310a) may be formed by at least a portion of the front plate (311) that is at least partially transparent (e.g., a glass plate including various coating layers, or a polymer plate). A second side (310b) may be formed by at least a portion of the back plate (313). The back plate (313) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, magnesium, or any alloy), or a combination of at least two of the foregoing materials. A third side (310c) may be formed by a side member (312) (e.g., a side bezel structure) that is coupled to the front plate (311) and the back plate (312) and includes a metal and / or polymer.

[0047] In the present disclosure, a single physical configuration (e.g., a front plate (311), a rear plate (313), and a side member (312)) may not form a single surface (e.g., a first surface (310a), a second surface (310b), and a third surface (310c)). In one example, the first surface (310a) may be formed by a portion of the front plate (311) and the side member (312). In one example, the third surface (310c) may be formed by at least a portion of a peripheral plate (e.g., the front plate (311) and / or the rear plate (313)) coupled with the side member (312) and the side member (312). In one example, the rear plate (313) and the side member (312) may be formed integrally and may include the same material (e.g., a metallic material such as aluminum).

[0048] In the illustrated embodiment, the front plate (311) may include a first region (310d) that is seamlessly extended and curved from a portion of the first face (310a) toward the rear plate (313). In one example, the first regions (310d) may be located at both ends (e.g., relatively long edges) of the front plate (311). In the illustrated embodiment, the rear plate (313) may include second regions (310e) that are seamlessly extended and curved from a portion of the second face (310b) toward the front plate (302). The second regions (310e) may be located at both ends (e.g., relatively long edges) of the rear plate (313). The first region (310d) and the second region (310e) may be referred to as regions having a curvature greater than 0 among regions adjacent to the side member (312). In one example, the electronic device (100a) may not include the first region (310d) and the second region (310e). In one embodiment, the front plate (311) (or the rear plate (313)) may not include at least some of the first regions (310d) (or the second regions (310e)).

[0049] In one embodiment, the side wall portion of the side member (312) (e.g., the frame structure (341) of FIG. 3C) may be formed to have different thicknesses depending on the side when viewed from the side of the electronic device (100a). For example, the side wall portion of the side member (312) may be formed to have different thicknesses depending on the side when viewed from the outside of the electronic device (100a). When looking at a long edge of the electronic device (100a) (e.g., when looking in the +X direction or the -X direction), the thickness of the side wall portion of the side member (312) as viewed from the outside may be a first thickness (e.g., a length along the Z axis). When looking at a short edge of the electronic device (100a) (e.g., when looking in the +Y direction or the -Y direction), the thickness of the side member (312) as viewed from the outside may be a second thickness (e.g., a length along the Z axis) that is longer than the first thickness.

[0050] In one example, the side member (312) can include at least one segment (e.g., segment (220) of FIG. 2). For example, the frame structure (341) of the side member (312) forms an outer side surface of the electronic device (100a) and can include at least one segment. In the example of FIG. 3, a first segment (320a), a second segment (320b), and a third segment (320c) are illustrated, but the electronic device (100a) can further include segments that are not illustrated. In one embodiment, the electronic device (100a) can use at least a portion of the segmented side member (312) as an antenna. A portion of the segmented side member (312) (e.g., frame structure (341)) through the segmented portion can be configured to transmit and receive a signal of a specified frequency band.

[0051] In one embodiment, the electronic device (100a) may include at least one of a display (160) (e.g., a display module (1260) of FIG. 12), a camera module (381, 382) (e.g., a camera module (1280) of FIG. 12), a key input device (317) (e.g., an interface (1277) of FIG. 12), a light-emitting element (not shown), audio holes (303, 307, 371), and a connector hole (308) (e.g., a connection terminal (178) of FIG. 1). In another embodiment, the electronic device (100a) may omit at least one of the above components (e.g., a key input device (317) or a light-emitting element (not shown)), or may additionally include other components.

[0052] In one embodiment, the display (160) may be visible from the outside through at least a portion of the front plate (311). For example, at least a portion of the display (160) may be visually exposed through the front plate (311), which includes the first areas (310d) of the first side (310a) and the third side (310c). The display (160) may be disposed on the back surface (e.g., the side facing the -z direction) of the front plate (311). In one example, the display (160) and the front plate (311) may be bonded to each other to form a single module, which may be referred to as a display module (e.g., the display module (160) of FIG. 12 ). In one example, an edge of the display (160) may be formed to be substantially identical to an adjacent outer shape of the front plate (311). In one embodiment, the surface of the housing (310) may include a screen display area formed as the display (160) is visually exposed. For example, the screen display area may include a first surface (310a) and first areas (310d) of the side surfaces. The screen display area may be referred to as an area on which a visual image may be displayed by the display (160). In one embodiment, at least a portion of the screen display area (e.g., at least a portion of the first surface (310a) and the first area (310d)) may include a sensing area (not shown) configured to acquire a user's biometric information (e.g., a fingerprint) or a touch input. In one example, the display (160) may include a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic stylus pen. In one example, the touch detection circuit, the pressure sensor, and / or the digitizer may be disposed adjacent to the display (160).

[0053] In one embodiment, at least one of an audio module (not shown), a sensor module (not shown), a camera module (e.g., a first camera module (381)), and a light-emitting element (not shown) may be disposed on the back of the display (160). For example, the electronic device (100a) may include a first camera module (381) (e.g., the camera module (1280) of FIG. 12) disposed on the back (e.g., the side facing the -z direction) of the first surface (310a) (e.g., the front). For example, the first camera module (381) may be referred to as an under display camera (UDC). The first camera module (381) may be disposed under the display (160) so as to face the first surface (310a). In one example, the first camera module (381) may be configured to receive light through the transmissive area (306) of the display (160). The transparent region (306) may be an area that is configured to allow at least some light to pass through (e.g., an area with a relatively low pixel density).

[0054] In one embodiment, the second camera module (382) (e.g., the camera module (1280) of FIG. 12) may include multiple cameras (e.g., a dual camera, a triple camera, or a quad camera). However, the second camera module (382) is not necessarily limited to including multiple cameras and may include a single camera. For example, the lenses of the second camera module (382) may be configured to receive external light through the camera area (384).

[0055] The audio holes may include, for example, microphone holes (303, 371) and speaker holes (307). The positions and numbers of the audio holes illustrated in FIGS. 3A and 3C are merely examples, and embodiments of the present disclosure are not limited thereto. In one embodiment, the speaker holes may include a receiver hole (not illustrated) for calls.

[0056] FIG. 3c is an exploded perspective view of an electronic device according to one embodiment.

[0057] Referring to FIGS. 3A to 3C , an electronic device (100a) according to an embodiment may include a front plate (311), a display (160), a side member (312), a printed circuit board (350), a rear substrate (360), a battery (370), a rear plate (313), a first camera module (381), a second camera module (382), and an antenna. The configurations of the electronic device (100a) illustrated in FIG. 3C are merely examples, and embodiments of the present disclosure are not limited thereto. For example, the electronic device (100a) may not include at least some of the illustrated components (e.g., the rear substrate (360)). The electronic device (100a) may additionally include other components not illustrated in FIG. 3C .

[0058] In one embodiment, the front plate (311) and the display (160) may be coupled to the side member (312). For example, the front plate (311) and the display (160) may be positioned in the +z-axis direction from the side member (311). For example, the display (160) may be coupled (or attached) to one side of the side member (312) in the +z-axis direction, and the front plate (311) may be coupled (or attached) to one side of the display (160) in the +z-axis direction. The front plate (311) may form a part of the outer surface (or exterior) of the electronic device (100a). The display (160) may be disposed between the front plate (311) and the side member (312) within the electronic device (100a).

[0059] In one embodiment, a side member (312) may be positioned between the display (160) and the back plate (313). The side member (312) may include a frame structure (341) forming a portion of a side of the electronic device (100a) (e.g., the third side (310c) of FIG. 3a) and a plate structure (342) extending inwardly from the frame structure (341).

[0060] For example, the plate structure (342) may be disposed inside the frame structure (341) so as to be surrounded by the frame structure (341). The plate structure (342) may be physically connected to the frame structure (341) or may be formed integrally with the frame structure (341). The plate structure (342) may be formed of a metallic material and / or a non-metallic (e.g., polymer) material. In one embodiment, the side member (312) may be referred to as a support member or support structure configured to support components of the electronic device (100a). For example, the plate structure (342) may support other components included in the electronic device (100a). The plate structure (342) may be referred to as, for example, a support member. For example, at least one of a display (160), a printed circuit board (350), a rear substrate (360), and a battery (370) may be disposed on the plate structure (342). For example, a display (160) may be coupled to one side of the plate structure (342) (e.g., a side facing the +z-axis direction), and a printed circuit board (350) may be coupled to an opposite side of the one side (e.g., a side facing the -z-axis direction). In one example, at least a portion of the plate structure (342) may be omitted from the electronic device (100a).

[0061] In one embodiment, the side member (312) (e.g., frame structure (341)) may be arranged to surround a space between the front plate (311) and the rear plate (312), thereby forming a housing (e.g., housing (310) of FIGS. 3A and 3B) of the electronic device (100a) together with the front plate (311) and the rear plate (312).

[0062] In one embodiment, the rear substrate (360) may be disposed between the rear plate (312) and the plate structure (342). For example, the rear substrate (360) may be electrically connected to the printed circuit board (350). The rear substrate (360) may include at least one antenna or any electronic component. For example, the rear substrate (360) may include a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna.

[0063] In one embodiment, the printed circuit board (350) may be equipped with a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0064] In one embodiment, a battery (370) (e.g., battery (1289) of FIG. 12) may power at least one component of the electronic device (100a). For example, the battery (370) may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (370) may be disposed substantially flush with the printed circuit board (350). The battery (370) may be disposed integrally within the electronic device (300), or may be disposed detachably from the electronic device (300).

[0065] FIG. 4A is a front perspective view of an electronic device in an unfolded state according to one embodiment. FIG. 4B is a rear perspective view of an electronic device in an unfolded state according to one embodiment. FIG. 4C is a perspective view of an electronic device in a folded state according to one embodiment.

[0066] Referring to FIGS. 4a, 4b, and 4c, according to one embodiment, the electronic device (100b) (e.g., the electronic device (100) of FIG. 1) may be a foldable device in which at least a portion of the housing (310) may be foldable. The electronic device (100b) may be folded about a folding axis A. In the examples of FIGS. 4a, 4b, and 4c, the electronic device (100b) is illustrated as an infold device in which the first display (161) (e.g., the display module (1260) of FIG. 12) is folded to face each other in a folded state. However, embodiments of the present disclosure are not limited thereto. For example, the electronic device (100b) may be an outfold device in which the first display (161) is folded to face the outside in a folded state. For convenience of explanation, with respect to FIGS. 4A to 4C, descriptions of components having the same reference numerals as FIGS. 3A to 3C may be referred to by the relevant descriptions of FIGS. 3A to 3C, unless otherwise described.

[0067] For example, the housing (310) of the electronic device (100b) may include a front plate (311), a side member (312), and a rear plate (313). The side member (312) may include a first side member (312a) and a second side member (312b) that are distinguished based on the folding axis A. The rear plate (313) may include a first rear plate (313a) and a second rear plate (313b) that are distinguished based on the folding axis A. For example, the housing (310) may include a first housing and a second housing that are distinguished based on the folding axis A. For example, the first housing may include a part of the front plate (311) (e.g., a front plate (311) positioned in the +Y direction with respect to the folding axis A), a first side member (312a), and a first rear plate (313a). For example, the second housing may include a portion of a front plate (311) (e.g., a front plate (311) positioned in the -Y direction with respect to the folding axis A), a second side member (312b), and a second rear plate (313b). A hinge structure (411, 412, 420) may be arranged between the first housing and the second housing. The hinge structure (411, 412, 420) may include any structure that allows the housing (310) to be folded or unfolded about the folding axis A.

[0068] In the unfolded state of FIGS. 4a and 4b, the electronic device (100b) may include a first display (161) arranged to face the front side (e.g., the side facing the +Z direction) of the electronic device (100b). In the unfolded state, the electronic device (100b) may include a second display (162) arranged on the rear side (e.g., the display module (1260) of FIG. 12). The unfolded state may be referred to as an open state or a flat state. For example, the unfolded state may include a case where the angle between the first side member (312a) and the second side member (312b) is greater than or equal to a specified angle (e.g., about 120 degrees).

[0069] In the folded state of FIG. 4c, the electronic device (100b) may include a second display (162) positioned to face the front side (e.g., the side facing the +Z direction) of the electronic device (100b). The folded state may be referred to as a closed state. For example, the folded state may include a case where the angle between the first side member (312a) and the second side member (312b) is less than a specified angle (e.g., about 60 degrees).

[0070] Although not illustrated in FIGS. 4A to 4C , the electronic device (100b) may be configured to have an intermediate state between the folded state and the unfolded state. For example, the intermediate state may be referred to as a flex state or a table mode. In the intermediate state, the angle between the first side member (312a) and the second side member (312b) may have a specified range (e.g., from about 60 degrees to about 120 degrees).

[0071] The intermediate state (or flex state) is a state in which the first housing (210) and the second housing (220) are arranged at a certain angle as illustrated in FIG. 2D, and the electronic device (101) may not be in the unfolded state or the folded state. The intermediate state may refer to a state in which the first housing (210) and the second housing (220) form a certain angle (e.g., 6 degrees or more and 80 degrees or less). The definition of the intermediate state is an example and may be applied differently depending on various implementation examples.

[0072] As illustrated in FIG. 4c, the side member (312) may include a plurality of segments (320a, 320b, 320c, and 320d). As described above with respect to FIG. 2, the metal members of each side member separated by the segments may be utilized as an antenna. As described above with respect to FIGS. 3a to 3c, the side member (312) may include a frame structure forming an exterior of the electronic device (100b) and a plate structure coupled to the frame structure. The side member (312) may be referred to as a support member or support structure configured to support components of the electronic device (100b).

[0073] With reference to FIGS. 3A to 4C , various examples of the electronic device (100) of FIG. 1 have been described. Hereinafter, embodiments of the present disclosure will be described with a focus on the structure of the electronic device (100b) of FIGS. 4A to 4C . However, those skilled in the art will appreciate that the structures of the embodiments described below can be applied to any electronic device. For example, the embodiments described below can be applied to any electronic device that includes a segmented portion in a housing and uses the segmented metal members as an antenna. For example, the structure of the segmented portion described below can be applied to any of the segmented portions (312a, 312b, or 312c) illustrated in FIG. 3A . In the following disclosure, the term “side member” can refer to the side member (312) or a portion of the side member (312) (e.g., a frame structure).

[0074] FIG. 5 illustrates the rear structure of an electronic device in an unfolded state according to one embodiment.

[0075] Referring to FIG. 5, according to one embodiment, the electronic device (100b) may include a plurality of antennas (e.g., the antenna module (197) of FIG. 1). For example, the rear structure of the electronic device (100b) illustrated in FIG. 5 may correspond to a state in which the rear plate (312) of FIG. 4b is removed.

[0076] According to one embodiment, the electronic device (100b) may include a side housing (e.g., side member (311) of FIG. 3). The side housing may be, for example, coupled to or physically supported by a hinge structure (570). The side housing may include, for example, a first side member (312a) and a second side member (312b). In one example, the side housing may be physically and / or electrically coupled to a support member (e.g., plate structure (342) of FIG. 3c) within the electronic device (100b).

[0077] The first side member (312a) and the second side member (312b) may include a plurality of segments (520a to 520l) (e.g., segment (220) of FIG. 2). The first side member (312a) and the second side member (312b) may form a frame of the electronic device (100b). The frame may include a plurality of metal members (e.g., conductive members 501 to 510) coupled to the segments (520a to 520l). The plurality of segments (520a to 520l) may include, for example, a dielectric (e.g., a non-conductive member).

[0078] For example, a plurality of segments (520a to 520l) can be created by creating segments through cutting processing on a metal frame. For example, a plurality of segments (520a to 520l) can be created by casting a metal frame so that the metal frame has segments. In one example, a non-conductive member can be filled in the plurality of segments (520a to 520l) through a process such as an injection molding process. The non-conductive member positioned in the plurality of segments (520a to 520l) can be physically coupled to adjacent metal members. The physical rigidity between adjacent metal members can be increased through the non-conductive member.

[0079] A non-conductive member can electrically isolate adjacent metal members. By electrically isolating the metal members, each of the metal members can be used as a radiator of an antenna. At least one feeding point can be formed on the metal member used for the antenna. The wireless communication circuit of the electronic device (100b) (e.g., the communication module (190) of FIG. 1 ) can transmit and receive a signal corresponding to the electrical length or resonant frequency of the metal member by feeding power to the metal member through the feeding point. To improve the radiation performance of the metal member, at least one feeding point can be formed on the metal member, or at least one tuning circuit can be connected to the metal member. The feeding point and grounding point illustrated in FIG. 5 are examples, and embodiments of the present disclosure are not limited thereto.

[0080] In one embodiment, the electronic device (100b) may transmit and receive wireless signals corresponding to various bands and / or various wireless protocols using the side housing. For example, the first conductive member (501) may be configured to transmit and receive signals of a mid-band and a high-band (e.g., n77 band and n79 band) of a cellular network. The second conductive member (502) may be configured to transmit and receive signals according to a global positioning system (GPS) and / or Wi-Fi (e.g., 2.4 GHz band and / or 5 GHz band). The third conductive member (503) may be configured to transmit and receive signals of a mid-band and / or a low-band of a cellular network. The fourth conductive member (504) may be configured to transmit and receive signals of a high-band (e.g., n77 band) of a cellular network and / or signals according to Wi-Fi (e.g., 2.4 GHz band and / or 5 GHz band). The fifth conductive element (505) may be configured to transmit and receive signals in the low band, mid band, and / or high band of a cellular network. The sixth conductive element (506) may be configured to transmit and receive signals in the mid band and / or high band (e.g., n77 band and n79 band) of a cellular network. The seventh conductive element (507) may be configured to transmit and receive signals in the low band and / or high band of a cellular network. The eighth conductive element (508) may be configured to transmit and receive signals in the low band and / or mid band of a cellular network.

[0081] Hereinafter, a segmented structure according to an embodiment of the present disclosure is described with reference to FIGS. 6 to 8. In FIGS. 6 to 8, the segmented structure is described with a focus on the first region (the dotted line region in FIG. 5), but the segmented structure described below may be applied to any segment of the electronic device (100b).

[0082] Figure 6 is an enlarged view of the first area of ​​Figure 5.

[0083] Referring to FIG. 6, according to one embodiment, the first conductive member (501) and the second conductive member (502) may be physically separated by a segment (520a). The second conductive member (502) and the third conductive member (503) may be physically separated by a segment (520b). In the example of FIG. 6, the non-conductive members positioned at the segments (520a, 520b) may be assumed to be omitted. For example, each of the first conductive member (501), the second conductive member (502), and the third conductive member (503) may be physically coupled to the plate structure (342) at least at one point. For example, each of the first conductive member (501), the second conductive member (502), and the third conductive member (503) may be electrically connected to the plate structure (342) at least at one point. In one example, at least a portion of the plate structure (342) may be composed of a conductive material to form a grounding area together with a substrate (not shown).

[0084] When two conductive elements are separated by a segment, capacitive coupling may occur at adjacent surfaces of the two conductive elements. For example, this capacitive coupling may manifest as a capacitive load on the conductive elements. The capacitive load may increase as the size of the facing surfaces of adjacent conductive elements increases and the distance between the conductive elements decreases. As the capacitive load increases, the antenna performance (e.g., gain and / or bandwidth) of the conductive element may deteriorate. Furthermore, as the capacitive load increases, the noise signal induced in the conductive element may increase. Since a non-conductive element is positioned in the slit between the conductive elements, the slit between the conductive elements may be visually exposed to the outside. Due to the visual exposure of the conductive elements and / or the reduction in the size of the electronic device (100b), the size of the slit may be limited. According to an embodiment of the present disclosure, the electronic device (100b) may reduce the size of the capacitive coupling between adjacent conductive elements. The electronic device (100b) can improve the performance of the antenna of the electronic device (100b) by reducing the size of the capacitive coupling.

[0085] At least one hole (e.g., holes 611 to 617) may be formed at one end of the conductive member. For example, the hole may be referred to as a through hole or a link hole. The first conductive member (501) may include a protrusion having holes (611, 612) formed therein. The second conductive member (502) may include a hole (613) formed at one end of the protrusion adjacent to the first conductive member (501). The second conductive member (502) may include holes (614, 615) formed at one end of the protrusion adjacent to the third conductive member (503). The third conductive member (503) may include holes (616, 617) formed at one end of the protrusion adjacent to the second conductive member (502).

[0086] A non-conductive member (not shown) can be coupled to the slits (520a, 520b) and holes (e.g., holes 611 to 617). For example, the non-conductive member can be coupled to the slits (520a) and the holes (611, 612, 613). In this case, the first conductive member (501) and the second conductive member (502) can be physically coupled through the non-conductive member. By coupling the non-conductive member to the holes (611, 612, 613) at adjacent ends of both conductive members, the rigidity of the side member including the first conductive member (501) and the second conductive member (502) can be increased. For example, the holes (611, 612, 613) can be filled with the non-conductive member. The non-conductive member can be filled into the holes (611, 612, 613), for example, through an injection molding process. To form the holes (611, 612, 613), the first conductive member (501) and the second conductive member (502) can include protrusions (e.g., portions formed by protruding in the +x direction). According to one embodiment, the electronic device (100b) can include protrusions that are set so that the surfaces facing each other are reduced. Hereinafter, the structure of the protrusions can be described with reference to FIG. 7, focusing on the second region (690).

[0087] Figure 7 is a perspective view of the second area of ​​Figure 6.

[0088] Referring to FIGS. 6 and 7, according to one embodiment, the electronic device (100b) may include a plurality of grooves formed in a first end of a first conductive member (501) and a plurality of grooves formed in a second end of a second conductive member (502). For example, the plurality of grooves formed in the first end and the plurality of grooves formed in the second end may be configured to reduce an area of ​​a surface where the first end and the second end face each other (e.g., an area of ​​the ends overlapping in the xz plane). In various embodiments of the present disclosure, the grooves may be referred to as recesses or cavities. The rigidity of the side members including the first conductive member (501) and the second conductive member (502) may be increased by coupling a non-conductive member to the grooves at adjacent ends of both conductive members. For example, the grooves may be filled with a non-conductive member. The non-conductive material can be filled into the grooves and / or holes (611, 612, 613), for example, through an injection molding process.

[0089] For example, by reducing the area of ​​the surface where the first and second ends face each other, where the distance between the first and second ends is limited to d, the size of the capacitive coupling between the first conductive member (501) and the second conductive member (502) can be reduced. Hereinafter, the shape of the grooves can be described in more detail with reference to FIG. 8.

[0090] Figure 8 is a schematic diagram of a section according to one embodiment.

[0091] Referring to FIGS. 6, 7, and 8, according to one embodiment, the first conductive member (501) and the second conductive member (502) may include protrusions of different heights. For example, reference numeral 891 illustrates a first end (810) of the first conductive member (501) as viewed in a second direction about axis B of FIG. 7. Reference numeral 892 illustrates a second end (820) of the second conductive member (502) as viewed in the first direction about axis B of FIG. 7. In the example of FIG. 8, holes (e.g., holes 611, 612, and 614 of FIG. 7) are omitted for convenience of explanation, but one of ordinary skill in the art will understand that holes for coupling to the protrusions may be positioned.

[0092] In one example, the first conductive member (501) may include a plurality of grooves formed in the first end (810). The plurality of grooves formed in the first end (810) of the first conductive member (501) may be formed in a direction from the inside to the outside of the electronic device (100b) (e.g., -x direction). The plurality of grooves may be formed, for example, through cutting processing of the first end (810) of the first conductive member (501). In one example, the first conductive member (501) may include a first groove (811), a second groove (813), and a third groove (815) formed in the first end (810).

[0093] In one example, the second conductive member (502) may include a plurality of grooves formed in the second end (820). The plurality of grooves formed in the second end (820) of the second conductive member (502) may be formed in a direction from the inside to the outside of the electronic device (100b) (e.g., -x direction). The plurality of grooves may be formed, for example, through cutting processing of the second end (820) of the second conductive member (502). In one example, the second conductive member (502) may include a fourth groove (821), a fifth groove (823), and a sixth groove (825) formed in the second end (820).

[0094] According to one embodiment, at least some of the grooves of the first end (810) and the grooves of the second end (820) can be formed at different heights (e.g., heights along the z-axis). For example, by varying the cutting heights (e.g., heights along the z-axis) of the second end (820) and the first end (810), the heights between the grooves can be formed to be different. The heights can be referred to, for example, as the center heights of the grooves along the z-axis. By varying the heights of the grooves, the size of the surface where the first end (810) and the second end (820) face each other (e.g., the surface overlapping in the xz plane) can be reduced.

[0095] In one example, the first conductive member (501) may include a plurality of protrusions formed at the first end (810). The plurality of protrusions formed at the first end (810) of the first conductive member (501) may be formed in a direction from the outside to the inside of the electronic device (100b) (e.g., +x direction). The plurality of protrusions may be formed, for example, by cutting the first end (810) of the first conductive member (501). In one example, the first conductive member (501) may include a first protrusion (812) and a second protrusion (814) formed at the first end (810). As described above with reference to FIGS. 6 and 7 , holes (611, 612) may be formed in the first protrusion (812) and the second protrusion (814).

[0096] In one example, the second conductive member (502) may include a plurality of protrusions formed at the second end (820). The plurality of protrusions formed at the second end (820) of the second conductive member (502) may be formed in a direction from the outside to the inside of the electronic device (100b) (e.g., +x direction). The plurality of protrusions may be formed, for example, by cutting the second end (820) of the second conductive member (502). In one example, the second conductive member (502) may include a third protrusion (822) and a fourth protrusion (823) formed at the second end (820). As described above with reference to FIGS. 6 and 7 , holes (613) may be formed in the third protrusion (822) and the fourth protrusion (824).

[0097] In one embodiment, at least some of the protrusions of the first end (810) and the protrusions of the second end (820) can be formed at different heights (e.g., heights along the z-axis). The heights can be referred to, for example, as center heights of the protrusions along the z-axis. By varying the heights of the protrusions, the size of the surface where the first end (810) and the second end (820) face each other (e.g., surfaces overlapping on the xz plane) can be reduced.

[0098] In the above disclosure, the height of the protrusions or grooves has been described as the focus, but in one example, the thickness (e.g., length along the z-axis) of the protrusions and / or grooves may be different. By setting the thickness of the protrusions and / or grooves differently, the heights of the protrusions or grooves may be formed differently.

[0099] In the example of FIG. 8, the thickness d11 (e.g., length along the z-axis) of the first groove (811) may be about 0.5 mm. The thickness d12 of the first protrusion (812) may be about 0.4 mm. The thickness d13 of the second groove (813) may be about 0.5 mm. The thickness d14 of the second protrusion (814) may be about 0.4 mm. The thickness d15 of the third groove (815) may be about 0.5 mm. The thickness d21 of the fourth groove (821) may be about 0.5 mm. The thickness d22 of the third protrusion (812) may be about 0.9 mm. The thickness d23 of the fifth groove (823) may be about 0.5 mm. The thickness d24 of the fourth protrusion (824) may be approximately 0.5 mm. The thickness d25 of the sixth groove (825) may be approximately 0.5 mm. The above-described figures are merely examples, and the embodiments of the present disclosure are not limited thereto.

[0100] In the example of Fig. 8, since the grooves of the first stage (810) and the second stage (820) are formed with different heights, the size of the surface facing the first stage (810) and the second stage (820) can be reduced. For example, in the example of Fig. 8, the capacitive load can be reduced by about 7% compared to the example in which the grooves are formed with the same height.

[0101] The shapes of the first end (810) and the second end (820) described above with reference to FIG. 8 are merely examples, and embodiments of the present disclosure are not limited thereto. For example, the number of formed protrusions and / or grooves may differ from the example of FIG. 8. The height and / or thickness of the formed protrusions and / or grooves may differ from the example of FIG. 8. Those skilled in the art will appreciate that any shape of grooves that can reduce the size of the facing surfaces of the first end (810) and the second end (820) may be included in the embodiments of the present disclosure.

[0102] Figure 9 illustrates a segmentation according to one embodiment.

[0103] Referring to FIGS. 5 to 9, according to one embodiment, the electronic device (100b) may include a non-conductive member positioned in a segment. For example, the non-conductive member may be filled in the segment to be joined to adjacent conductive members. The non-conductive member may be filled in the segment, for example, through an injection molding process.

[0104] A non-conductive member (910) may be positioned at a segment (520a) between a first conductive member (501) and a second conductive member (502). For example, the non-conductive member (910) may be physically coupled to the first conductive member (501) and the second conductive member (502). The non-conductive member (910) may be coupled to the segment (520a) and the holes (611, 612, 613). As described above with respect to FIG. 8, since the non-conductive member (910) is physically coupled to the holes (611, 612, 613) formed in the protrusion, the physical coupling strength of the first conductive member (501) and the second conductive member (502) may be increased. Additionally, the grooves and protrusions formed in the first conductive member (501) and the second conductive member (502) and the non-conductive member (910) can be physically coupled. As described above with respect to segment (220) of FIG. 2, the non-conductive member (910) can electrically isolate the first conductive member (501) and the second conductive member (502). In the present disclosure, the non-conductive member (910) can include any dielectric (e.g., a polymer).

[0105] FIG. 10 illustrates the rear structure of an electronic device in an unfolded state according to one embodiment.

[0106] Referring to FIG. 10, according to one embodiment, the electronic device (100b) may further include a tuning circuit (1010). The printed circuit board (350) may be coupled to, for example, a plate structure (342). The plate structure (342) may be referred to as a structure within the electronic device (100b) that is physically coupled to or integrally formed with a side member (e.g., the side member (312) of FIG. 5).

[0107] For example, the tuning circuit (1010) may be electrically connected to a point of the first conductive member (501). The tuning circuit (1010) may be electrically connected to a printed circuit board (350). The tuning circuit (1010) may be controlled according to the control of a wireless communication module (e.g., the wireless communication module (190) of FIG. 1) disposed on the printed circuit board (350). For example, the tuning circuit (1010) may include at least one switch and / or at least one lumped element. The tuning circuit (1010) may be configured to change the resonant frequency characteristic of the first conductive member (501) using the at least one switch and / or the at least one lumped element. In one example, the tuning circuit (1010) may be physically coupled to the plate structure (342) or the printed circuit board (350).

[0108] According to one embodiment, the electronic device (100b) can change the frequency characteristics of the first conductive member (501) using the tuning circuit (1010). For example, by changing the frequency characteristics, the electronic device (100b) can receive a low-band signal through the first conductive member (501). In this case, the mid-band reception sensitivity of the first conductive member (501) can be increased. In addition, in the folded state of the electronic device (100b), low-band coverage for three sides of the electronic device (100b) can be achieved by the first conductive member (501), the third conductive member (503), and the sixth conductive member (506).

[0109] According to one embodiment, the electronic device (100b) may include a fifth conductive member (505) of a reduced length compared to FIG. 5. For example, the electronic device (100b) may be configured to receive high-band, mid-band, or low-band signals using the conductive member (501), and to receive high-band and mid-band signals using the fifth conductive member (505). When not receiving low-band signals, the length (e.g., length along the y-axis) of the fifth conductive member (505) may be reduced. Referring to the enlarged drawing of the third region (1020), as the length of the fifth conductive member (505) is reduced, the position of the segment (520e) may move in the +y direction. In this case, the plate structure (342) coupled with the hinge structure (570) may extend in the +y direction according to the change in the position of the segment (520e). By increasing the area of ​​the plate structure (342), the heat dissipation efficiency of the electronic device (100b) can be increased, for example. Heat generated inside the electronic device (100b) can be dissipated to the outside of the electronic device (100b) through the hinge structure (570) and the plate structure (342) (e.g., a plate formed of a metallic material).

[0110] Figure 11 is a schematic diagram of a section according to one embodiment.

[0111] Referring to FIGS. 5 and 11 , according to one embodiment, the electronic device (100b) may include grooves formed with different thicknesses in the segmented portion. In the example of FIG. 8 , the grooves are illustrated as having the same thickness, but embodiments of the present disclosure are not limited thereto. In the example of FIG. 11 , reference numeral 1191 may indicate a shape corresponding to a first end portion (1101) (e.g., the first end portion (810) of FIG. 8 ), and reference numeral 1192 may indicate a shape corresponding to a second end portion (1102) (e.g., the second end portion (820) of FIG. 8 ).

[0112] The first groove (1121) between the first protrusion (1111) and the second protrusion (1112) may have a thickness d1. The second groove (1122) between the third protrusion (1113) and the fourth protrusion (1114) may have a thickness d4. As illustrated in FIG. 11, the thicknesses of the first groove (1121) and the second groove (1122) may be set to be different. For example, by setting the thicknesses of the grooves to be different, the size of the surface where the first end (1101) and the second end (1102) face each other may be reduced. For example, the thickness of the second protrusion (1112) having a thickness d3 and the fourth protrusion (1114) having a thickness d5 overlapping on the z-axis may be reduced by d2.

[0113] With reference to FIGS. 8 and 11, one of ordinary skill in the art will appreciate that the size of the surface facing the first end and the second end can be reduced by varying the height of the groove and / or the protrusion, or by varying the thickness of the groove and / or the protrusion.

[0114] FIG. 12 is a block diagram of an electronic device (1201) within a network environment (1200), according to various embodiments.

[0115] Referring to FIG. 12, in a network environment (1200), an electronic device (1201) may communicate with an electronic device (1202) via a first network (1298) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (1204) or a server (1208) via a second network (1299) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (1201) may communicate with the electronic device (1204) via the server (1208). According to one embodiment, the electronic device (1201) may include a processor (1220), a memory (1230), an input module (1250), an audio output module (1255), a display module (1260), an audio module (1270), a sensor module (1276), an interface (1277), a connection terminal (1278), a haptic module (1279), a camera module (1280), a power management module (1288), a battery (1289), a communication module (1290), a subscriber identification module (1296), or an antenna module (1297). In some embodiments, the electronic device (1201) may omit at least one of these components (e.g., the connection terminal (1278)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1276), camera module (1280), or antenna module (1297)) may be integrated into a single component (e.g., display module (1260)).

[0116] The processor (1220) may control at least one other component (e.g., hardware or software component) of the electronic device (1201) connected to the processor (1220) by executing, for example, software (e.g., program (1240)), and may perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1220) may store commands or data received from other components (e.g., sensor module (1276) or communication module (1290)) in volatile memory (1232), process the commands or data stored in volatile memory (1232), and store result data in non-volatile memory (1234). According to one embodiment, the processor (1220) may include a main processor (1221) (e.g., a central processing unit or an application processor) or an auxiliary processor (1223) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1221). For example, when the electronic device (1201) includes the main processor (1221) and the auxiliary processor (1223), the auxiliary processor (1223) may be configured to use less power than the main processor (1221) or to be specialized for a given function. The auxiliary processor (1223) may be implemented separately from the main processor (1221) or as a part thereof.

[0117] The auxiliary processor (1223) may control at least a portion of functions or states associated with at least one component (e.g., the display module (1260), the sensor module (1276), or the communication module (1290)) of the electronic device (1201), for example, on behalf of the main processor (1221) while the main processor (1221) is in an inactive (e.g., sleep) state, or together with the main processor (1221) while the main processor (1221) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1223) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1280) or a communication module (1290)). In one embodiment, the auxiliary processor (1223) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1201) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1208)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0118] The memory (1230) can store various data used by at least one component (e.g., the processor (1220) or the sensor module (1276)) of the electronic device (1201). The data can include, for example, software (e.g., the program (1240)) and input data or output data for commands related thereto. The memory (1230) can include a volatile memory (1232) or a non-volatile memory (1234).

[0119] The program (1240) may be stored as software in memory (1230) and may include, for example, an operating system (1242), middleware (1244), or an application (1246).

[0120] The input module (1250) can receive commands or data to be used in a component of the electronic device (1201) (e.g., a processor (1220)) from an external source (e.g., a user) of the electronic device (1201). The input module (1250) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0121] The audio output module (1255) can output audio signals to the outside of the electronic device (1201). The audio output module (1255) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0122] The display module (1260) can visually provide information to an external party (e.g., a user) of the electronic device (1201). The display module (1260) may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling the device. In one embodiment, the display module (1260) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0123] The audio module (1270) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (1270) can acquire sound through the input module (1250), output sound through the sound output module (1255), or an external electronic device (e.g., electronic device (1202)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1201).

[0124] The sensor module (1276) can detect the operating status (e.g., power or temperature) of the electronic device (1201) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1276) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0125] The interface (1277) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1201) with an external electronic device (e.g., the electronic device (1202)). In one embodiment, the interface (1277) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0126] The connection terminal (1278) may include a connector through which the electronic device (1201) may be physically connected to an external electronic device (e.g., the electronic device (1202)). In one embodiment, the connection terminal (1278) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0127] The haptic module (1279) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1279) may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0128] The camera module (1280) can capture still images and videos. According to one embodiment, the camera module (1280) may include one or more lenses, image sensors, image signal processors, or flashes.

[0129] The power management module (1288) can manage the power supplied to the electronic device (1201). According to one embodiment, the power management module (1288) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0130] A battery (1289) may power at least one component of the electronic device (1201). In one embodiment, the battery (1289) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0131] The communication module (1290) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1201) and an external electronic device (e.g., electronic device (1202), electronic device (1204), or server (1208)), and the performance of communication through the established communication channel. The communication module (1290) may operate independently from the processor (1220) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1290) may include a wireless communication module (1292) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1294) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (1204) via a first network (1298) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1299) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1292) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1296) to verify or authenticate the electronic device (1201) within a communication network such as the first network (1298) or the second network (1299).

[0132] The wireless communication module (1292) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1292) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1292) may support various technologies for securing performance in high-frequency bands, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1292) may support various requirements specified in the electronic device (1201), an external electronic device (e.g., the electronic device (1204)), or a network system (e.g., the second network (1299)). According to one embodiment, the wireless communication module (1292) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0133] The antenna module (1297) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (1297) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1297) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1298) or the second network (1299), may be selected from the plurality of antennas, for example, by the communication module (1290). A signal or power may be transmitted or received between the communication module (1290) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1297).

[0134] According to various embodiments, the antenna module (1297) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0135] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0136] According to one embodiment, commands or data may be transmitted or received between the electronic device (1201) and an external electronic device (1204) via a server (1208) connected to a second network (1299). Each of the external electronic devices (1202 or 1204) may be the same or a different type of device as the electronic device (1201). According to one embodiment, all or part of the operations executed in the electronic device (1201) may be executed in one or more of the external electronic devices (1202, 1204, or 1208). For example, when the electronic device (1201) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1201) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1201). The electronic device (1201) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1201) may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (1204) may include an Internet of Things (IoT) device. The server (1208) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (1204) or server (1208) may be included within the second network (1299). The electronic device (1201) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0137] According to one embodiment, an electronic device (1200) (e.g., the electronic device (100) of FIG. 1, the electronic device (100a) of FIGS. 3A to 3C, or the electronic device (100b) of FIGS. 4A to 4C) may include a housing (e.g., the housing (310) of FIGS. 3A to 4C), a printed circuit board (e.g., the printed circuit board (350) of FIG. 4C or FIG. 10) disposed in an internal space, and at least one wireless communication circuit (e.g., the communication module (1290), the communication circuit (190) of FIG. 1). For example, the housing may include a front plate (e.g., a front plate (311) of FIGS. 3A to 4C), a rear plate (e.g., a rear plate (313) of FIGS. 3A to 3C or first and second rear plates (313a, 313b) of FIGS. 4A to 4C), and a side member (e.g., a side member (312) of FIGS. 3A to 3C or first and second side members (312a, 312b) of FIGS. 4A to 4C). The side member may be disposed between the front plate and the rear plate and may form an internal space of the electronic device together with the front plate and the rear plate.

[0138] According to one embodiment, an electronic device (1200) (e.g., the electronic device (100b) of FIGS. 4A to 4C) may include a first housing, a second housing, a hinge structure (e.g., the hinge structure (570) of FIG. 5 or FIG. 10), a printed circuit board (e.g., the printed circuit board (350) of FIG. 4C or FIG. 10) disposed in an internal space, and at least one wireless communication circuit (e.g., the communication module (1290) or the communication circuit (190) of FIG. 1). For example, the first housing may include a first region (e.g., a region positioned in the +Y direction with respect to axis A of FIG. 4A) of a front plate (e.g., a front plate (311) of FIG. 4A), a first rear plate (e.g., a first rear plate (313a) of FIGS. 4A to 4C), and a first side member (e.g., a first side member (312a) of FIGS. 4A to 4C) disposed between the front plate and the first rear plate. For example, the second housing may include a second region (e.g., a region positioned in the -Y direction with respect to axis A of FIG. 4A), a second rear plate (e.g., a second rear plate (313b) of FIGS. 4A to 4C), and a second side member (e.g., a second side member (312b) of FIGS. 4A to 4C) disposed between the front plate and the second rear plate. The first housing and the second housing can be rotatably coupled to the hinge structure.

[0139] In one example, a side member (e.g., side member (312) of FIGS. 3A-3C or first side member (312a) of FIGS. 4A-4C) of an electronic device (e.g., electronic device (100, 100a, 100b, 1201)) can include a segment (e.g., segment (520a) of FIGS. 5, 6, 7, 9, or 10) comprising a non-conductive material (e.g., non-conductive material (910) of FIG. 9), a first conductive member (e.g., first conductive member (501) of FIGS. 5-10), and a second conductive member (e.g., second conductive member (502) of FIGS. 5-10).

[0140] For example, the first conductive member may include a first end adjacent to the segment (e.g., the first end (810) of FIG. 8) and a plurality of first protrusions adjacent to the first end and protruding toward the interior space (e.g., the first protrusions (812) and the second protrusions (814) of FIG. 8). The first conductive member may include a first hole (e.g., the hole (612) of FIG. 7) penetrating the plurality of first protrusions along the first axis and a first groove (e.g., the second groove (813) of FIG. 8) positioned between the plurality of first protrusions.

[0141] For example, the second conductive member may include a second end adjacent to the segment (e.g., the second end (820) of FIG. 8) and a plurality of second protrusions adjacent to the second end and protruding toward the internal space (e.g., the third protrusion (822) and the fourth protrusion (824) of FIG. 8). The second conductive member may include a second hole penetrating the plurality of second protrusions along the first axis (e.g., the hole (613) of FIG. 7) and a second groove positioned between the plurality of second protrusions (e.g., the fifth groove (823) of FIG. 8).

[0142] For example, the first axis may be perpendicular to the front plate and the rear plate (e.g., the first rear plate). At least a portion of the first groove may not overlap the second groove along the first axis. The first groove and the second groove may be formed in a direction facing outward from the interior space of the electronic device.

[0143] For example, the first conductive member may further include a third groove (e.g., the first groove (811) of FIG. 8) positioned between the plurality of first protrusions, and the second conductive member may further include a fourth groove (e.g., the fourth groove (821) of FIG. 8) positioned between the plurality of second protrusions. The third groove and the fourth groove may overlap on the first axis.

[0144] For example, the segment may be interposed between the first end and the second end. The segment, the first groove, the second groove, the first hole, and the second hole may be filled with a non-conductive material (e.g., the non-conductive material (910) of FIG. 9). The non-conductive material may be configured to provide physical coupling between the first conductive member and the second conductive member and electrical isolation between the first conductive member and the second conductive member. The first conductive member, the second conductive member, and the non-conductive material may form a continuous outer surface of the electronic device.

[0145] At least one wireless communication circuit may be configured to power the first conductive member and / or the second conductive member. In one example, the electronic device may further include a tuning circuit (e.g., tuning circuit 1010 of FIG. 10) electrically connected to the first conductive member. The at least one wireless communication circuit may be configured to change a frequency characteristic of the first conductive member using the tuning circuit. For example, the at least one wireless communication circuit may be configured to transmit and / or receive signals of a cellular network using the first conductive member. The at least one wireless communication circuit may be configured to transmit and / or receive signals of a global positioning system (GPS) and / or signals of a Wi-Fi network using the second conductive member.

[0146] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0147] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0148] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0149] Various embodiments of the present document may be implemented as software (e.g., a program (1240)) including one or more instructions stored in a storage medium (e.g., an internal memory (1236) or an external memory (1238)) readable by a machine (e.g., an electronic device (1201)). For example, a processor (e.g., a processor (1220)) of the machine (e.g., an electronic device (1201)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0150] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0151] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices (100, 100a, 100b, 1201), A housing (310) including a front plate (311), a rear plate (313, 313a, 313b), and side members (312, 312a, 312b), wherein the side members are disposed between the front plate and the rear plate and form an internal space of the electronic device together with the front plate and the rear plate; A printed circuit board (350) disposed in the above internal space; and At least one wireless communication circuit (190, 1290) disposed on the printed circuit board, The above side members are: A segment (220, 520a) comprising a non-conductive material (910), A first conductive member (501) including a first end (810) adjacent to the segmented portion and a plurality of first protrusions (812, 814) adjacent to the first end, and A second conductive member (502) comprising a second end (820) adjacent to the segmented portion and a plurality of second protrusions (822, 824) adjacent to the second end, wherein said at least one wireless communication circuit is configured to supply power to said first conductive member and / or said second conductive member; The first conductive member includes a first hole (612) penetrating the plurality of first protrusions and a first groove (813) positioned between the plurality of first protrusions, The second conductive member includes a second hole (613) penetrating the plurality of second protrusions and a second groove (823) positioned between the plurality of second protrusions, At least a portion of the first conductive member extends along the first axis from the first end, At least a portion of said second conductive member extends from said second end along said first axis, An electronic device, wherein at least a portion of the first groove does not overlap the second groove along a second axis perpendicular to the first axis.

2. In paragraph 1, The above segment (220, 520a) is an electronic device interposed between the first stage (810) and the second stage (820).

3. In paragraph 1, The second axis is an electronic device that is perpendicular to the front plate (311) and the rear plate (313).

4. In paragraph 1, An electronic device, wherein the first groove (813) and the second groove (823) are formed in a direction from the internal space toward the exterior of the electronic device.

5. In paragraph 1, An electronic device in which the non-conductive material (910) is filled in the segmented portion (520a), the first groove (813), the second groove (823), the first hole (611, 612), and the second hole (613).

6. In any one of paragraphs 1 to 5, An electronic device wherein the non-conductive material (910) is configured to provide physical coupling between the first conductive member (501) and the second conductive member (502) and electrical isolation between the first conductive member and the second conductive member.

7. In any one of paragraphs 1 to 5, An electronic device, wherein the first conductive member, the second conductive member, and the non-conductive material form a continuous outer surface of the electronic device.

8. In any one of paragraphs 1 to 5, The above first conductive member further includes a third groove (811) positioned between the plurality of first protrusions, The second conductive member further includes a fourth groove (821) positioned between the plurality of second protrusions, An electronic device, wherein the third groove and the fourth groove overlap on the second axis.

9. In any one of paragraphs 1 to 5, Further comprising a tuning circuit (1010) electrically connected to the first conductive member and set to change the frequency characteristic of the first conductive member; An electronic device wherein said at least one wireless communication circuit is configured to change a frequency characteristic of said first conductive member using said tuning circuit.

10. In any one of paragraphs 1 to 5, At least one of the wireless communication circuits, Transmitting and / or receiving signals of a cellular network using the above first conductive element, An electronic device configured to transmit and / or receive signals of a global positioning system (GPS) and / or signals of Wi-Fi using the second conductive member.

11. In electronic devices (100b, 1201), A first housing including a first region of a front plate (311), a first rear plate (313a), and a first side member (312a) disposed between the front plate and the first rear plate; A second housing including a second area of ​​the front plate, a second rear plate (313b), and a second side member (312b) disposed between the front plate and the second rear plate; As a hinge structure (570), the first housing and the second housing are rotatably coupled to the hinge structure; A printed circuit board (350) disposed in the internal space of the first housing; and At least one wireless communication circuit (190, 1290) disposed on the printed circuit board, The above first side member: A segment (220, 520a) containing a non-conductive material; A first conductive member (501) comprising a first end (810) adjacent to the segmented portion and a plurality of first protrusions (812, 814) adjacent to the first end and protruding toward the inner space, and A second conductive member (502) comprising a second end (820) adjacent to the segmented portion and including a plurality of second protrusions (822, 824) adjacent to the second end and protruding toward the inner space, wherein said at least one wireless communication circuit is configured to supply power to said first conductive member and / or said second conductive member; The first conductive member comprises a first hole (612) penetrating the plurality of first protrusions along the first axis and a first groove (813) positioned between the plurality of first protrusions, The second conductive member comprises a second hole (613) penetrating the plurality of second protrusions along the first axis and a second groove (823) positioned between the plurality of second protrusions, An electronic device, wherein at least a portion of the first groove does not overlap the second groove along the first axis.

12. In paragraph 11, An electronic device, wherein the segment is interposed between the first end and the second end.

13. In paragraph 11, An electronic device wherein the first axis is perpendicular to the front plate and the first rear plate.

14. In paragraph 11, An electronic device, wherein the first groove and the second groove are formed in a direction from the internal space toward the exterior of the electronic device.

15. In paragraph 11, An electronic device wherein the non-conductive material is filled in the segmented portion, the first groove, the second groove, the first hole, and the second hole.

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