Electronic device

Abstract

This electronic device comprises: a main body housing; a middle frame positioned inside the main body housing; a circuit board, which is positioned on one surface of the middle frame and includes a heat dissipation component; and heat dissipation fins formed on the other surface of the middle frame, wherein the heat dissipation fins have a stepped shape of which the width gradually decreases as the distance from the middle frame increases, and thus heat dissipation efficiency can be enhanced at low cost while avoiding an increase in size.

Description

electronic devices

[0001] The present invention relates to a small-sized electronic device including a heat generating component.

[0002] A growing number of small, portable electronic devices are emerging, including mobile terminals, wireless routers, portable cameras, and small projectors. To miniaturize these devices, it's crucial to pack components tightly into a confined space.

[0003] Miniaturization can be achieved by incorporating high-performance IC chips. APs, in particular, consume significant energy and generate significant heat. When these heat-generating components are installed in confined spaces, heat dissipation efficiency is reduced and the effects can even affect neighboring components.

[0004] To increase heat dissipation performance, materials with high thermal conductivity can be used, but this increases cost and increases volume when securing a large space. Therefore, there is a need for a heat dissipation structure that maximizes heat dissipation efficiency in a minimal space while being inexpensive.

[0005] The present invention aims to provide an electronic device including a heat dissipation structure capable of improving heat dissipation efficiency at low cost while preventing volume increase.

[0006] An electronic device is provided, comprising: a main body housing; a middle frame positioned on the inside of the main body housing; a circuit board positioned on one surface of the middle frame and including a heat generating component; and heat dissipation fins formed on the other surface of the middle frame, wherein the heat dissipation fins have a stepped shape whose width becomes narrower as they are spaced apart from the middle frame.

[0007] The above heat dissipation fin includes a plurality of stepped portions, and the edges of each stepped portion can form a straight line.

[0008] The above heat dissipation fins may be extended in the first direction and arranged in multiple numbers spaced apart from each other in the second direction.

[0009] The heat dissipation fin includes a first end adjacent to the middle frame; and a second end extending from the first end and having a width smaller than the width of the first end in the second direction, and the height of the second end can be formed to be longer than the height of the first end.

[0010] The above heat dissipation fin includes a third stage extending from the second stage and having a width smaller than the width of the second stage in the second direction, and the height of the third stage can be formed longer than the height of the second stage.

[0011] The above heat dissipation fins may have a height ratio of the first stage, the second stage, and the third stage of 1:2:2.5.

[0012] The above heat dissipation fin may further include a blower fan positioned at one end of the first direction, and the main body housing may include a plurality of heat dissipation holes formed on the side.

[0013] The blower fan is positioned on one side of the middle frame, and the middle frame may include an opening that opens between the blower fan and the heat dissipation fin.

[0014] The main body housing can be formed so that the length in the first direction is longer than the length in the second direction.

[0015] It may include a rotatable camera module located at the second end of the main body housing.

[0016] The above middle frame can be inserted in the one-sided direction to a depth corresponding to the height of the heat dissipation fin in the first region where the heat dissipation fin is formed.

[0017] The above heat dissipation fins are arranged in a plurality of lengths in a first direction and spaced apart from each other in a second direction, and both ends of the first region in the first direction can be opened.

[0018] The electronic device of the present invention can increase heat dissipation efficiency at a low cost while avoiding an increase in size.

[0019] The electronic device of the present invention can improve heat dissipation efficiency by expanding the heat dissipation area of ​​the heat dissipation fin.

[0020] The electronic device of the present invention can simplify the structure of the electronic device and improve the convenience of processing by implementing a heat dissipation fin as an integral part of the middle frame.

[0021] The electronic device of the present invention can secure convenience of assembly by providing a blower fan and a heat dissipation fin on different sides of the middle frame.

[0022] The effects that can be obtained from the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present invention belongs from the description below.

[0023] FIG. 1 is a drawing showing an electronic device according to one embodiment of the present invention mounted on a display device.

[0024] FIG. 2 is a perspective view illustrating an electronic device according to one embodiment of the present invention.

[0025] Figures 3 and 4 are exploded views of an electronic device according to one embodiment of the present invention.

[0026] FIG. 5 is a drawing showing a state in which the back surface of the main body housing of an electronic device according to one embodiment of the present invention is opened.

[0027] Figure 6 is a cross-section AA of Figure 5.

[0028] Fig. 7 is a schematic diagram of a heat dissipation fin of an electronic device according to another embodiment.

[0029] Figure 8 is a schematic diagram of a heat dissipation fin of an electronic device according to one embodiment of the present invention.

[0030] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably only for the convenience of writing the specification, and do not in themselves have distinct meanings or roles. In addition, when describing the embodiments disclosed in this specification, if it is determined that a specific description of a related known technology may obscure the gist of the embodiments disclosed in this specification, a detailed description thereof will be omitted. In addition, the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the attached drawings, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and technical scope of the present invention.

[0031] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0032] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0033] Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0034] In this application, terms such as “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0035] FIG. 1 is a drawing showing an electronic device (200) according to one embodiment of the present invention mounted on a display device (100), and FIG. 2 is a drawing showing an electronic device (200) according to the present invention.

[0036] The electronic device of the present invention includes all small electronic devices, and the present embodiment exemplifies a video camera mounted on the upper side of a display device, but is not limited thereto.

[0037] As illustrated in this embodiment, a small electronic device (200) must accommodate components within a limited space and also have a heat dissipation function. The present invention aims to provide an electronic device (200) including a heat-generating component (252) and a heat dissipation fin (215) for dissipating heat generated from the heat-generating component (252).

[0038] As illustrated in FIG. 2, a small electronic device (200) is generally mounted inside a box-shaped body (210) and may include a heat dissipation hole (218) on the side of the body (210). External air is introduced into the body (210) through the heat dissipation hole (218), and hot air inside the body (210) can be discharged to the outside of the body (210) through the heat dissipation hole (218).

[0039] The heat dissipation holes (218) can be arranged in consideration of the air flow within the main body housing (211, 212), and the larger the area where the heat dissipation holes (218) are formed, the smoother the air flow within the interior can be, thereby improving the heat dissipation effect. However, since external foreign substances can enter through the heat dissipation holes (218) and internal components can be exposed, they can be arranged laterally as illustrated in Fig. 2.

[0040] The electronic device (200) of the present invention may include a box-shaped main body (210) and a mount module (220) for fixing the main body (210) to a display device (100). The main body (210) has a camera module (240) positioned on the upper side, and the camera module (240) captures a user's face, etc. and transmits the captured image to a remote location, thereby enabling remote treatment or video conferencing.

[0041] The camera module (240) can be equipped with multiple cameras to collect more specific information. The multiple cameras have different functions, enabling the acquisition of various types of images and information. To achieve a sense of perspective similar to that of the human eye, the camera module (240) can be equipped with a horizontally elongated body (210).

[0042] The main body (210) has a box shape with a thin thickness in the front-back direction, and the front side is in contact with the back surface of the display device (100) so that it can be placed in close contact with the back surface of the display device (100). Fig. 1 illustrates one side of the electronic device (200), and Fig. 2 illustrates the other side of the electronic device (200). The electronic device (200) of the present embodiment has a similar shape on one side and the other side.

[0043] Figures 3 and 4 are exploded perspective views of an electronic device (200) according to one embodiment of the present invention. Figure 3 is a view viewed from one side of the electronic device (200), and Figure 4 is a view viewed from the other side of the electronic device (200).

[0044] The electronic device (200) of the present invention may include a main body housing (211, 212) forming an exterior, a middle frame (213, 214) positioned inside the main body housing (211, 212) to secure rigidity, and a circuit board (251). The circuit board (251) includes various ICs for controlling the electronic device (200), and may include a heat-generating component (252), such as an AP, which generates a lot of heat.

[0045] The middle frame (213, 214) is located inside the main body housing (211, 212) to secure the rigidity of the electronic device (200), and may be provided in pairs as shown in FIGS. 3 and 4, or may be provided on only one side.

[0046] The electronic device (200) of the present embodiment is a device including a camera module (240) and can be operated continuously for a long time, so it is necessary to dissipate heat generated from a heat-generating component (252). To dissipate heat from the heat-generating component (252), the electronic device (200) of the present invention may include a heat-radiating fin (215). The heat-radiating fin (215) may be configured separately from the middle frame (214), but the present invention is characterized in that the heat-radiating fin (215) is implemented using a part of the middle frame (214).

[0047] The middle frame (214) illustrated in FIGS. 3 and 4 is illustrated as a pair, but hereinafter, the middle frame (214) means a middle frame (214) on which a heat dissipation fin (215) is formed, and the heat dissipation fin (215) may be formed on the middle frame (214) facing the surface on which the heat generating component (252) of the circuit board (251) is mounted.

[0048] A circuit board (251) may be positioned on one side of the middle frame (214), and a heat dissipation fin (215) may be formed on the other side of the middle frame (214). The heat dissipation fin (215) may be formed on the other side of the first region (2141) of the middle frame (214), and the heat generating component (252) may be positioned on one side of the first region (2141). That is, the heat dissipation fin (215) may be arranged to overlap the heat generating component (252) in the thickness direction.

[0049] The heat dissipation fins (215) protrude from the middle frame (214) in the direction of the other side, and may be formed in multiple numbers by extending in a first direction and spaced apart in a second direction. In the drawing, the first direction is shown as a horizontal direction and the second direction as a vertical direction, but the present invention is not necessarily limited thereto. However, in order to arrange the blower fan (216) described later, it is advantageous to arrange it in a long horizontal direction. If the vertical direction is longer, the first direction may be a vertical direction.

[0050] FIG. 5 is a drawing illustrating a state in which the back surface of the main body housing (211, 212) of the electronic device (200) according to one embodiment of the present invention is opened. It is preferable that the first direction ends of the extended heat dissipation fins (215) be opened so that air passing through the heat dissipation fins (215) can flow in the first direction. Accordingly, the camera module (240) can be positioned on one side in the second direction, i.e., on the upper side of the electronic device (200).

[0051] In order to promote the flow of air passing through the heat dissipation fins (215), a blower fan (216) positioned at an end in the first direction of the heat dissipation fins (215) may be further included. The blower fan (216) serves to lower the temperature of the heat dissipation fins (215) by sucking in external air and supplying it to the heat dissipation fins (215). The blower fan (216) may be positioned at an end in the first direction, which is the direction in which the heat dissipation fins (215) extend, so that air can flow throughout the heat dissipation fins (215).

[0052] The blower fan (216) may be mounted on a circuit board (251) so that it can be supplied with power and driven under the control of a control unit. Accordingly, it may be positioned along one side of the middle frame (214) together with the circuit board (251), and an opening (2142) may be formed at one end of the heat dissipation fin (215) so that air supplied from the blower fan (216) is supplied to the heat dissipation fin (215) (see FIG. 4).

[0053] That is, the middle frame (214) may be provided with a mounting portion (2145) on which a blower fan (216) is mounted on one side of the heat dissipation fin (215), and an opening (2142) may be formed between the heat dissipation fin (215) and the mounting portion.

[0054] Heat absorbed from a heat generating component (252) located on one side of a first region (2141) where a heat dissipation fin (215) is located is transferred to the heat dissipation fin (215) and the temperature of the electronic device (200) can be lowered as the heat is taken away by air passing through the heat dissipation fin (215). The other side of the heat dissipation fin (215) can include a plurality of heat dissipation holes (218) to allow air that has absorbed the heat of the heat dissipation fin (215) to escape.

[0055] Figure 6 is a cross-section taken along line AA of Figure 5. The first region (2141) can be inserted in one direction so that the end of the heat dissipation fin (215) has the same height as other parts of the middle frame (214). The part of the middle frame (214) other than the first region (2141) can be configured to have the same plane as the end of the heat dissipation fin (215), as illustrated in Figure 4.

[0056] Referring to FIG. 3, one side of the middle frame (214) may include a protrusion to secure a space for mounting a component mounted on the circuit board (251).

[0057] The heat dissipation fin (215) of the present invention may have a stepped shape whose width becomes narrower as it moves away from the middle frame (214). More specifically, in the cross-section in the second direction illustrated in Fig. 6, the width of the first section at the position in contact with the middle frame (214) is the widest and becomes narrower by forming a step.

[0058] Fig. 7 is a schematic diagram of a heat dissipation fin (215) of an electronic device (200) according to another embodiment. When the heat dissipation fin (215) has many irregularities, the heat dissipation area increases, which has the advantage of high heat dissipation effect. However, etching methods such as casting and laser processing are complex or impossible to manufacture, so they can be formed in a rectangular shape or an inclined surface as shown in Fig. 7.

[0059] The cross-section of the heat dissipation fins (215a, 251b) is illustrated as being rectangular or having an inclined surface. When the cross-section of the heat dissipation fins (215a) is rectangular, the space (B2) between the heat dissipation fins (215b) is wider than the space (B1) between the heat dissipation fins (215a), so there is an advantage that the space (B2>B1) through which the air supplied from the blower fan (216) can flow is wider. In addition, the heat dissipation area (A2) of the heat dissipation fins (215b) having an inclined surface is wider than the heat dissipation area (A1) of the heat dissipation fins (215a) having a rectangular cross-section (A2>A1).

[0060] Fig. 8 is a schematic diagram of a heat dissipation fin (215) of an electronic device (200) according to one embodiment of the present invention. As illustrated in Fig. 8, in the case of a stepped heat dissipation fin (215) forming a step, the flow space (B3) and the heat dissipation area (A3) can be wider than in the embodiments described above.

[0061] The stepped heat dissipation fins (215) of this embodiment have a width that gradually narrows in the second direction (d>e>f). This embodiment is configured in three stages, but is not necessarily limited thereto, and may be configured in two or four stages.

[0062] The lines connecting the edges due to the step difference between the first stage (2151) and the second stage (2152), and between the second stage (2152) and the third stage (2153) can be configured to form straight lines. In this case, as in the case where the heat dissipation fin (215) is inclined as in (b) of Fig. 7, the air flow space can be widened by the space etched by the step difference.

[0063] At this time, the height (a, b, c) of each stage (2151, 2152, 2153) can become longer as it goes toward the top in the drawing (c>b>a). This means that if the length of the narrow third stage (2153) is longer, more fluid space can be secured, and the length of the third stage (2153) can be formed longer than the length of the second stage (2152), and the length of the second stage (2152) can be formed longer than the length of the first stage.

[0064] However, since the length of the third stage (2153) may be too long, the rigidity may be weakened, so the ratio of the lengths (a: b: c) of the first stage (2151), second stage (2152), and third stage (2153) may be configured to have a ratio of 1: 2: 2.5 in consideration of heat dissipation performance and rigidity.

[0065] Table 1 below shows the heat dissipation performance according to the shape of the heat dissipation fin (215). It shows the temperature of AP, which is a representative heat-generating component (252), and the surface temperature of the electronic device (200), and shows the heat dissipation efficiency through the temperature reduction ratio.

[0066] Straight-linear, step-type AP temperature 78.6℃ 78.1℃ 77.5℃ Surface temperature 70℃ 67.7℃ 64.6℃ Heat dissipation efficiency 10.9% 13.3% 16.6%

[0067] The straight heat dissipation fin (215) has a heat dissipation efficiency of only 10.9%, but the diagonal heat dissipation fin (215) shows a heat dissipation efficiency of 13.3%, which is an increase of about 20% in heat dissipation efficiency compared to the straight heat dissipation fin (215). The stepped heat dissipation fin (215) shows a heat dissipation efficiency of 16.6%, which can be improved by more than 50% in heat dissipation efficiency compared to the straight heat dissipation fin (215).

[0068] The stepped heat dissipation fin (215) is easy to manufacture using a casting method using a mold, or a method of laser etching the surface, in which the upper open portion is wide and the portion becomes narrower as it approaches the middle frame (214). In addition, performance can be improved at a lower cost than the method of improving heat dissipation performance by plating the outer surface with an expensive metal such as copper.

[0069] As described above, the electronic device (200) of the present invention can increase heat dissipation efficiency at a low cost while avoiding an increase in size.

[0070] The electronic device (200) of the present invention can improve heat dissipation efficiency by expanding the heat dissipation area of ​​the heat dissipation fin (215).

[0071] The electronic device (200) of the present invention can simplify the structure of the electronic device (200) and improve the convenience of processing by implementing a heat dissipation fin (215) integrally in the middle frame (214).

[0072] The electronic device (200) of the present invention can secure convenience of assembly by providing the blower fan (216) and the heat dissipation fins (215) on different sides of the middle frame (214). The above detailed description should not be construed as limiting in all respects but should be considered as illustrative. The scope of the present invention should be determined by a reasonable interpretation of the appended claims, and all changes within the equivalent scope of the present invention are included in the scope of the present invention.

Claims

1. Main body housing; A middle frame located inside the main body housing; A circuit board located on one side of the above middle frame and including a heat generating component; and Includes a heat dissipation fin formed on the other side of the middle frame, An electronic device characterized in that the heat dissipation fin has a stepped shape whose width becomes narrower as it moves away from the middle frame.

2. In paragraph 1, The above heat dissipation fins Contains multiple step portions, An electronic device characterized in that the edges of each step are straight.

3. In paragraph 1, The above heat dissipation fins are characterized in that they extend long in the first direction and are arranged in multiple numbers spaced apart in the second direction. Electronic devices.

4. In paragraph 3, The above heat dissipation fins A first stage adjacent to the above middle frame; and A second end extending from the first end and having a width smaller than the width of the second direction of the first end, The height of the second stage is characterized by being longer than the height of the first stage. Electronic devices.

5. In paragraph 4, The above heat dissipation fins A third stage extending from the second stage and having a width smaller than the width of the second direction of the second stage, The height of the third stage is characterized by being longer than the height of the second stage. Electronic devices.

6. In paragraph 5, The above heat dissipation fins The height ratio of the first stage, the second stage and the third stage is characterized by having 1:2:2.

5. Electronic devices.

7. In paragraph 3, Further comprising a blower fan located at one end of the first direction of the above heat dissipation fin, An electronic device characterized in that the main body housing includes a plurality of heat dissipation holes formed on the side.

8. In paragraph 7, The above blower fan is located on one side of the middle frame. The above middle frame is characterized by including an opening that opens between the blower fan and the heat dissipation fin. Electronic devices.

9. In paragraph 3, An electronic device, wherein the body housing has a length in the first direction that is longer than a length in the second direction.

10. In paragraph 3, An electronic device characterized in that it comprises a rotatable camera module located at the second end of the main body housing.

11. In paragraph 1, The above middle frame is, An electronic device characterized in that the first region in which the heat dissipation fins are formed is recessed in the one-sided direction to a depth corresponding to the height of the heat dissipation fins.

12. In paragraph 11, The above heat dissipation fins are extended in the first direction and arranged in multiple numbers spaced apart in the second direction, An electronic device characterized in that the first region has both ends in the first direction open.

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