Semiconductor refrigeration chip integrated with tray, and manufacturing method therefor

Abstract

A semiconductor refrigeration chip integrated with a tray, and a manufacturing method therefor, which relate to the technical field of integrated semiconductor refrigeration chips. The semiconductor refrigeration chip comprises a tray member (1) and a semi-finished chip (2), wherein the tray member (1) is used for placing test tubes thereon, and the tray member (1) comprises a bottom tray surface, the bottom tray surface being provided with a hard anode layer (3); and the semi-finished chip (2) comprises a flow guide layer, a die layer and a ceramic wafer (23), the flow guide layer, the die layer and the ceramic wafer (23) being sequentially assembled from top to bottom, and the hard anode layer (3) and the flow guide layer being integrally assembled. The tray member (1) is integrally assembled with the semi-finished chip (2), thereby effectively reducing the contact thermal resistance between a test tube tray and a semiconductor refrigeration element, and improving the test speed of PCR nucleic acid test products; moreover, under the action of the hard anode layer (3), the energy conduction efficiency is enhanced, the effect and efficiency of rapid temperature change are improved, and the test speed of PCR nucleic acid test products is further improved.

Description

Semiconductor refrigeration chip with integrated tray and manufacturing method thereof Technical Field

[0001] The patent of this invention relates to the technical field of integrated semiconductor refrigeration chips, specifically, to a semiconductor refrigeration chip with an integrated tray and a method for manufacturing the same. Background Art

[0002] With the development of the molecular diagnostic market, polymerase chain reaction (PCR) is used as a molecular diagnostic technology to amplify DNA sequencing. The market requires shorter and shorter time for PCR nucleic acid test results, so the detection speed of PCR nucleic acid test products is required to be faster and faster.

[0003] Semiconductor refrigerators are key components used to achieve rapid temperature changes in test samples during PCR nucleic acid testing. PCR instrument manufacturers will assemble semiconductor refrigerators under the test tube tray, and then use thermally conductive interface materials to achieve heat transfer between the semiconductor refrigerator and the test tube tray, reducing the contact thermal resistance between the two components.

[0004] However, due to the low thermal conductivity of the heat-conducting cross-section material, this method still results in a large thermal resistance and a significant performance loss, affecting the rapid temperature change effect.

[0005] Summary of the Invention

[0006] The object of the present invention is to provide a semiconductor refrigeration chip integrated with a tray and a manufacturing method thereof, aiming to solve the problem of high thermal resistance between the test tube tray and the semiconductor refrigeration chip in the prior art.

[0007] The present invention is implemented as follows: a semiconductor refrigeration chip with an integrated tray includes a tray member and a semi-finished chip, the tray member is used to place a test tube, the tray member includes a bottom plate surface, the bottom plate surface is provided with a hard anode layer, the semi-finished chip includes a guide layer, a grain layer and a ceramic sheet, and from top to bottom, the guide layer, the grain layer and the ceramic sheet are assembled in sequence, and the hard anode layer and the guide layer are assembled in an integrated manner.

[0008] Furthermore, the grain layer includes a plurality of grain bodies, each of which is arranged in an array, and the guide layer includes a plurality of guide plates, each of which is arranged in a flat shape. The guide plates are arranged in an overlapping assembly with adjacent grain bodies, and the guide plates and the grain bodies are arranged for energy conduction.

[0009] Furthermore, the semiconductor refrigeration chip of the integrated tray includes a PC glue layer, and the hard anode layer and the guide layer are adhered to each other through the PC glue layer; the PC glue layer includes a plurality of PC films, each of the PC films is arranged in a one-to-one correspondence with the guide plate, and the PC film and the guide plate are arranged in a superimposed and adhered arrangement, and the hard anode layer is synchronously adhered to each of the PC films; or, the semiconductor refrigeration chip of the integrated tray includes a thermal conductive glue layer, the thermal conductive glue layer and the guide plate are arranged in a superimposed and adhered arrangement, and the hard anode layer is synchronously adhered to the thermal conductive glue layer; or, the semiconductor refrigeration chip of the integrated tray includes an adhesive layer, the adhesive layer and the guide plate are arranged in a superimposed and adhered arrangement, and the hard anode layer is synchronously adhered to the adhesive layer, or, the semiconductor refrigeration chip of the integrated tray includes an organic silicone layer, the organic silicone layer and the guide plate are arranged in a superimposed and adhered arrangement, and the hard anode layer is synchronously adhered to the organic silicone layer.

[0010] Furthermore, it comprises a plurality of the semi-finished chips, and the tray, the hard anode layer, the PC adhesive layer and the plurality of the semi-finished chips are arranged in an integrated assembly in sequence.

[0011] Furthermore, adjacent semi-finished chips are spliced ​​and arranged in a conductive manner, the ceramic sheets are provided with positive convex points and negative concave points, and the positive convex points and negative concave points of adjacent ceramic sheets are arranged in a buckled and conductive manner.

[0012] Furthermore, the tray member includes a plurality of test tube columns and a tray plate, the tray plate forming the bottom plate surface, each of the test tube columns being respectively mounted on the tray plate, and the test tube columns being used to place test tubes, the test tube columns having a cylindrical surface, the cylindrical surface being used to support the test tubes and surround the ends of the test tubes, the cylindrical surface, the tray plate and the hard anode layer being arranged in an energy-conducting manner.

[0013] Furthermore, the tray member includes an upper support seat and a cold absorption layer, and each of the test tube columns is respectively embedded in the upper support seat, and the upper support seat is connected to the tray plate; the cold absorption layer is arranged inside the upper support seat, and the cold absorption layer and each of the test tube columns are flatly and conflictingly arranged, and the lower part of the cold absorption layer and the hard anode layer are arranged for energy conduction, and the cold absorption layer is used to absorb the heat of the test tube; the cold absorption layer is a phase change material.

[0014] The manufacturing method of the semiconductor refrigeration chip with integrated tray is as follows:

[0015] (1) Make semi-finished chips;

[0016] (2) Using hard anode technology to cover the hard anode layer on the pallet;

[0017] (3) Use PC glue layer to bond the hard anode layer and the semi-finished chip for integrated arrangement.

[0018] Furthermore, the semi-finished chip includes a guide layer, a grain layer and a ceramic sheet. In step (1), the guide layer, the grain layer and the ceramic sheet are welded or bonded to form the semi-finished chip.

[0019] Furthermore, a plurality of the semi-finished chips are arranged in a spliced ​​manner along the same horizontal plane, the PC adhesive layer is laid flatly and synchronously on each of the semi-finished chips, and the hard anode layer and the PC adhesive layer are arranged in a flat, overlapping and adhered manner.

[0020] Compared with existing technology ， The semiconductor refrigeration chip with an integrated tray and the manufacturing method thereof provided by the present invention effectively reduce the contact thermal resistance between the test tube tray and the semiconductor refrigeration chip through the integrated assembly of the tray component and the semi-finished chip, thereby improving the detection speed of PCR nucleic acid detection products. At the same time, under the action of the hard anode layer, the energy conduction efficiency is enhanced, the effect and efficiency of rapid temperature change are improved, and the detection speed of PCR nucleic acid detection products is further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] FIG1 is a perspective schematic diagram of a semiconductor refrigeration chip with an integrated tray according to a first embodiment of the present invention;

[0022] FIG2 is an exploded schematic diagram of a semiconductor refrigeration chip with an integrated tray according to a first embodiment of the present invention;

[0023] FIG3 is a perspective schematic diagram of a second embodiment of a semiconductor refrigeration chip with an integrated tray provided by the present invention;

[0024] FIG4 is an exploded schematic diagram of a second embodiment of a semiconductor refrigeration chip with an integrated tray provided by the present invention;

[0025] FIG5 is an enlarged schematic diagram of part A of the semiconductor refrigeration chip of the integrated tray provided by the present invention;

[0026] FIG6 is a perspective schematic diagram of a third embodiment of a semiconductor refrigeration chip with an integrated tray provided by the present invention;

[0027] FIG7 is an exploded schematic diagram of a third embodiment of a semiconductor refrigeration chip with an integrated tray provided by the present invention;

[0028] FIG8 is a flow chart of a method for manufacturing a semiconductor refrigeration chip with an integrated tray provided by the present invention. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0030] The implementation of the present invention is described in detail below with reference to specific embodiments.

[0031] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate the orientation or position relationship, they are based on the orientation or position relationship shown in the drawings. This is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0032] 1-8 , which are preferred embodiments of the present invention.

[0033] The semiconductor refrigeration chip of the integrated tray includes a tray part 1 and a semi-finished chip 2. The tray part 1 is used to place the test tube. The tray part 1 includes a chassis surface, and the chassis surface is provided with a hard anode layer 3. The semi-finished chip 2 includes a guide layer, a grain layer and a ceramic sheet 23. From top to bottom, the guide layer, the grain layer and the ceramic sheet 23 are assembled in sequence, and the hard anode layer 3 and the guide layer are assembled in an integrated manner.

[0034] The semiconductor refrigeration chip of the above-mentioned integrated tray effectively reduces the contact thermal resistance between the test tube tray and the semiconductor refrigeration chip through the integrated assembly of the tray part 1 and the semi-finished chip 2, thereby improving the detection speed of the PCR nucleic acid detection product. At the same time, under the action of the hard anode layer 3, the energy conduction efficiency is enhanced, the effect and efficiency of rapid temperature change are improved, and the detection speed of the PCR nucleic acid detection product is further improved.

[0035] That is to say, by using the semi-finished chip 2, there is no need for the shell of the semi-finished chip 2 to conduct energy with the tray part 1. Energy can be conducted directly through the guide layer and the tray part 1, which reduces the contact thermal resistance and facilitates improving the effect and efficiency of the rapid temperature change of each test tube.

[0036] The grain layer includes a plurality of grain bodies 22, each grain body 22 is arranged in an array, the guide layer includes a plurality of guide plates 21, the guide plates 21 are arranged in a flat shape, the guide plates 21 and the adjacent grain bodies 22 are arranged in an overlapping assembly, and the guide plates 21 and the grain bodies 22 are arranged for energy conduction.

[0037] Each grain body 22 conducts the cold source to the tray member 1 through each guide plate 21, realizing rapid temperature change of the tray member 1, thereby improving the detection speed of the PCR nucleic acid detection product; at the same time, adjacent grain bodies 22 and guide plates 21 are arranged in an overlapping assembly, effectively enhancing the conduction efficiency and effect of the cold source, and further contributing to rapid temperature change.

[0038] The semiconductor refrigeration chip of the integrated tray includes a PC adhesive layer 4, and the hard anode layer 3 and the guide layer are adhered and arranged through the PC adhesive layer 4; the integrated assembly of the tray component 1 and the semi-finished chip 2 is achieved through the PC adhesive layer 4.

[0039] The PC adhesive layer 4 includes multiple PC films 41, and each PC film 41 is arranged in a one-to-one correspondence with the guide plate 21, and the PC film 41 and the guide plate 21 are arranged in an overlapping and adhered manner to ensure the adhesion effect of the guide plate 21 and the conduction of the cold source. At the same time, the hard anode layer 3 is synchronously adhered to each PC film 41. Through the hard anode layer 3, it is convenient for the pallet component 1 to fully receive the cold source, making the rapid temperature change of the pallet component 1 more uniform, thereby improving the detection accuracy of PCR nucleic acid detection.

[0040] The PC adhesive layer 4 is made of high-molecular-weight polycarbonate, which is more resistant to low temperatures, ensures adhesion, and at the same time reduces the impact on cold source conduction.

[0041] The PC adhesive layer 4 can also be made of ordinary PC material.

[0042] Alternatively, the PC adhesive layer 4 is a thermally conductive adhesive, which utilizes the energy conduction performance of the thermally conductive adhesive to reduce the performance loss of the cold source being conducted to the tray 1, thereby ensuring the cold source conduction effect; the thermally conductive adhesive is thermally conductive silicone.

[0043] Alternatively, the semiconductor refrigeration chip of the integrated tray includes a thermally conductive adhesive layer, the thermally conductive adhesive layer guide plate is arranged in an overlapping and adhered arrangement, and the hard anode layer is synchronously arranged in an adhered arrangement with the thermally conductive adhesive layer; reducing the performance loss of the cold source conducted to the tray component 1 and ensuring the cold source conduction effect.

[0044] Alternatively, the semiconductor refrigeration chip of the integrated tray includes an adhesive layer, the adhesive layer guide plate is arranged in an overlapping and adhered arrangement, and the hard anode layer is synchronously arranged in an adhered arrangement with the adhesive layer; the performance loss of the cold source being conducted to the tray component 1 is reduced, and the cold source conduction effect is ensured.

[0045] Alternatively, the semiconductor refrigeration chip of the integrated tray includes an organic silicone layer, the guide plate of the organic silicone layer is arranged in an overlapping and adhered manner, and the hard anode layer is synchronously arranged in an adhered manner with the organic silicone layer; reducing the performance loss of the cold source conducted to the tray component 1 and ensuring the cold source conduction effect.

[0046] It includes multiple semi-finished chips 2, a tray part 1, a hard anode layer 3, a PC glue layer 4 and multiple semi-finished chips 2, which are integrated and assembled in sequence; the multiple semi-finished chips 2 simultaneously release the cold source and conduct it to the tray part 1, so as to achieve comprehensive and rapid temperature change of the tray part 1 and ensure PCR nucleic acid detection.

[0047] Adjacent semi-finished chips 2 are spliced ​​and arranged in a conductive manner, and the ceramic sheet 23 is provided with positive convex points and negative concave points, and the positive convex points and negative concave points of adjacent ceramic sheets 23 are arranged in a buckled and conductive manner; in this way, adjacent semi-finished chips 2 are arranged in series, reducing the arrangement of circuits. At the same time, during maintenance and replacement, the buckled semi-finished chips 2 can be directly disassembled to realize the replacement of the semi-finished chips 2.

[0048] Alternatively, adjacent semi-finished chips 2 are arranged in an interleaved and conductive manner.

[0049] Of course, each semi-finished chip 2 can be arranged independently, and a single semi-finished chip 2 forms a loop to facilitate the replacement of the semi-finished chip 2.

[0050] The tray member 1 includes multiple test tube columns and a tray plate. The tray plate forms a bottom plate. Each test tube column is installed on the tray plate. The test tube column is used to place the test tube. The test tube column has a cylindrical surface, which is used to support the test tube and surround the end of the test tube. The cylindrical surface, the tray plate and the hard anode layer 3 are arranged in an energy conduction manner.

[0051] In this way, the cold source is conducted from the hard anode layer 3 to each cylindrical surface, and then conducted to the test tube through the cylindrical surface, thereby realizing a rapid temperature change of the test tube.

[0052] The tray member 1 includes an upper support seat and a cold absorption layer. Each test tube column is embedded in the upper support seat, and the upper support seat is connected to the tray plate. The cold absorption layer is arranged inside the upper support seat, and the cold absorption layer and each test tube column are arranged in a flat and conflicting manner. The lower part of the cold absorption layer and the hard anode layer 3 are arranged for energy conduction. The cold absorption layer is used to absorb the heat of the test tube. The cold absorption layer is a phase change material.

[0053] In this way, under the action of the cold absorption layer, the effect and efficiency of rapid temperature change are enhanced, thereby improving the detection speed of PCR nucleic acid detection products; at the same time, the cold absorption layer receives the cold source, realizes cooling, and realizes the cycle to accelerate the temperature change of the test tube.

[0054] The phase change material is prepared by mixing 50-65% of acetone, 15-25% of ethanol, 18-23% of pure water, and 1-2% of condensation nuclei to achieve cold source conduction.

[0055] Pallet 1 embodiment 1:

[0056] The tray 1 includes 96 test tube columns arranged in a 12*8 array; the hard anode layer 3 is synchronously laid under the 96 test tube columns, including 6 semi-finished chips 2, which are arranged in a 2*3 array. The 6 semi-finished chips 2 are synchronously arranged corresponding to the hard anode layer 3, and the PC glue layer 4 is synchronously laid on each semi-finished chip 2 and the hard anode layer 3 to realize cold source conduction.

[0057] Pallet 1 embodiment 2:

[0058] The tray 1 includes 16 test tube columns arranged in a 4*4 array; the hard anode layer 3 is laid synchronously under the 16 test tube columns, including a semi-finished chip 2. The independently arranged semi-finished chip 2 is arranged corresponding to the hard anode layer 3, and the PC glue layer 4 is laid synchronously with the semi-finished chip 2 and the hard anode layer 3 to realize cold source conduction.

[0059] The semiconductor cooling chips of the integrated tray formed in the second embodiment can be spliced, and the circuits can be arranged independently; or the semiconductor cooling chips of the integrated tray can be arranged in series to achieve circuit connectivity, reducing the layout of the circuits.

[0060] Furthermore, the spliced ​​hard anode layers 3 are arranged in a coplanar and conflicting manner to achieve energy conduction.

[0061] Pallet 1 embodiment 3:

[0062] The tray 1 includes 8 test tube columns, which are arranged in sequence and at intervals; it includes 2 semi-finished chips 2, which are arranged in conflict with each other along the length direction, and the hard anode layer 3 is laid synchronously under the 8 test tube columns. The PC glue layer 4 is laid synchronously with the semi-finished chips 2 and the hard anode layer 3 to realize cold source conduction.

[0063] The semiconductor cooling chips of the integrated tray formed in the third embodiment can be spliced, and the circuits can be arranged independently; or the semiconductor cooling chips of the integrated tray can be arranged in series to achieve circuit connectivity, reducing the layout of the circuits.

[0064] The hard anode layer 3 corresponds to two semi-finished chips 2, ensuring sufficient refrigerant transportation and ensuring rapid temperature change of the test tube column.

[0065] The manufacturing method of the semiconductor refrigeration chip with integrated tray is as follows:

[0066] (1) Making a semi-finished chip 2;

[0067] (2) Using a hard anode process to cover the hard anode layer 3 on the pallet 1;

[0068] (3) Use PC glue layer 4 to bond the hard anode layer 3 and the semi-finished chip 2 together for integrated arrangement.

[0069] In the above-mentioned method for manufacturing the semiconductor refrigeration chip of the integrated tray, the semi-finished chip 2 is prefabricated and arranged, and then a single semi-finished chip 2 or multiple semi-finished chips 2 are selected according to the size of the tray part 1, and then the hard anode layer 3 is bonded to the semi-finished chip 2 through the PC adhesive layer 4 for integrated arrangement; the integrated assembly is adopted to effectively reduce the contact thermal resistance between the test tube tray and the semiconductor refrigeration chip, thereby improving the detection speed of the PCR nucleic acid detection product. At the same time, under the action of the hard anode layer 3, the energy conduction efficiency is enhanced, the effect and efficiency of rapid temperature change are improved, and the detection speed of the PCR nucleic acid detection product is further improved.

[0070] At the same time, a single semi-finished chip 2 or multiple semi-finished chips 2 are selected for integration with the hard anode layer 3 to realize the production of the semiconductor refrigeration chip of the integrated tray of the first to third embodiments.

[0071] The semi-finished chip 2 includes a guide layer, a grain layer and a ceramic sheet 23. In step (1), the guide layer, the grain layer and the ceramic sheet 23 are welded to form the semi-finished chip 2; thus, the semi-finished chip 2 is manufactured.

[0072] Alternatively, the guide layer, the grain layer and the ceramic sheet 23 are bonded together to form a semi-finished chip 2 , thereby achieving the production of the semi-finished chip 2 .

[0073] Multiple semi-finished chips 2 are spliced ​​and arranged along the same horizontal plane, and matched with PC glue layer 4 and hard anode layer 3 to produce semiconductor refrigeration chips with integrated trays of different specifications.

[0074] The PC adhesive layer 4 is laid flat on each semi-finished chip 2 simultaneously, and the hard anode layer 3 and the PC adhesive layer 4 are laid flat, overlapped and adhered to each other, thereby realizing the assembly of the semiconductor refrigeration chip of the integrated tray.

[0075] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. Semiconductor refrigeration chip with integrated tray, characterized in that: It includes a tray and a semi-finished chip, the tray is used to place a test tube, the tray includes a bottom plate, the bottom plate is provided with a hard anode layer, the semi-finished chip includes a guide layer, a grain layer and a ceramic sheet, from top to bottom, the guide layer, the grain layer and the ceramic sheet are assembled in sequence, and the hard anode layer and the guide layer are assembled in an integrated manner.

2. The semiconductor refrigeration chip of the integrated tray according to claim 1, characterized in that: The grain layer includes a plurality of grain bodies, each of which is arranged in an array. The guide layer includes a plurality of guide plates, each of which is arranged in a flat shape. The guide plates are arranged to be assembled in a superimposed manner with adjacent grain bodies, and the guide plates and the grain bodies are arranged to conduct energy.

3. The semiconductor refrigeration chip of the integrated tray as claimed in claim 2, characterized in that: The semiconductor refrigeration chip of the integrated tray includes a PC glue layer, and the hard anode layer and the guide layer are adhered to each other through the PC glue layer; the PC glue layer includes a plurality of PC films, each of the PC films is arranged in a one-to-one correspondence with the guide plate, and the PC film and the guide plate are arranged in a superimposed adhesion, and the hard anode layer is synchronously arranged in an adhesion with each of the PC films; or, the semiconductor refrigeration chip of the integrated tray includes a thermal conductive glue layer, the thermal conductive glue layer and the guide plate are arranged in a superimposed adhesion, and the hard anode layer is synchronously arranged in an adhesion with the thermal conductive glue layer; or, the semiconductor refrigeration chip of the integrated tray includes an adhesive layer, the adhesive layer and the guide plate are arranged in a superimposed adhesion, and the hard anode layer is synchronously arranged in an adhesion with the adhesive layer, or, the semiconductor refrigeration chip of the integrated tray includes an organic silicone layer, the organic silicone layer and the guide plate are arranged in a superimposed adhesion, and the hard anode layer is synchronously arranged in an adhesion with the organic silicone layer.

4. The semiconductor refrigeration chip of the integrated tray as claimed in claim 3, characterized in that: It comprises a plurality of the semi-finished chips, wherein the tray, the hard anode layer, the PC glue layer and the plurality of the semi-finished chips are arranged in an integrated assembly in sequence.

5. The semiconductor refrigeration chip of the integrated tray as claimed in claim 4, characterized in that: The adjacent semi-finished chips are spliced ​​and arranged in conduction, the ceramic sheets are provided with positive convex points and negative concave points, and the positive convex points and negative concave points of the adjacent ceramic sheets are arranged in a buckled and conductive manner.

6. The semiconductor refrigeration chip of the integrated tray as claimed in claim 4, characterized in that: The tray member includes a plurality of test tube columns and a tray plate, wherein the tray plate forms the bottom surface, and each of the test tube columns is respectively mounted on the tray plate, and the test tube columns are used to place test tubes, and the test tube columns have a cylindrical surface, and the cylindrical surface is used to support the test tube and surround the end of the test tube, and the cylindrical surface, the tray plate and the hard anode layer are arranged in an energy conduction manner.

7. The semiconductor refrigeration chip of the integrated tray according to claim 6, characterized in that: The tray member includes an upper supporting seat and a cold absorbing layer, each of the test tube columns is respectively embedded in the upper supporting seat, and the upper supporting seat is connected to the tray plate; the cold absorbing layer is arranged inside the upper supporting seat, and the cold absorbing layer and each of the test tube columns are arranged in a flat and abutting manner, the lower part of the cold absorbing layer and the hard anode layer are arranged for energy conduction, and the cold absorbing layer is used to absorb the heat of the test tube; the cold absorbing layer is a phase change material.

8. A method for manufacturing a semiconductor refrigeration chip with an integrated tray, characterized in that: The production steps are as follows: (1) Produce semi-finished chips; (2) Using hard anode technology to cover the hard anode layer on the pallet; (3) Use PC glue layer to bond the hard anode layer and the semi-finished chip for integrated layout.

9. The method for manufacturing a semiconductor refrigeration chip of an integrated tray according to claim 8, characterized in that: The semi-finished chip comprises a guide layer, a grain layer and a ceramic sheet. In step (1), the guide layer, the grain layer and the ceramic sheet are welded or bonded to form the semi-finished chip.

10. The method for manufacturing a semiconductor refrigeration chip of an integrated tray according to claim 8, characterized in that: The plurality of semi-finished chips are arranged in a spliced ​​manner along the same horizontal plane, the PC adhesive layer is laid flatly and synchronously on each of the semi-finished chips, and the hard anode layer and the PC adhesive layer are arranged in a flatly overlapped and adhered manner.

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