Evaluation device and evaluation method

Abstract

The purpose of the present invention is to provide a technology for estimating a foreign matter failure rate. 　In one embodiment of the present invention, an evaluation device evaluates assembly work of assembling a processing device composed of a plurality of components. The evaluation device comprises a calculation function unit and a failure rate calculation unit. The calculation function unit acquires: gravity information indicating a direction in which gravity acts; assembly order information indicating, for each step (hereinafter referred to as "assembly step") included in the assembly work, an operation to be performed on each of the plurality of components and an assembly order; work operation information indicating a worker's work operation performed in the assembly step; evaluation surface information indicating an evaluation surface of each of the plurality of components; and relative position information indicating the positional relationship between the foreign matter source and the component in the assembly step. The failure rate calculation unit calculates a foreign matter failure rate indicating the risk, for each evaluation surface, of foreign matter generated from the foreign matter source adhering due to the work operation, such calculation made from the gravity information, the assembly order information, the work operation information, and the relative position information.

Description

Evaluation device and evaluation method

[0001] The present invention relates to an evaluation device and an evaluation method.

[0002] Conventionally, methods have been developed for reducing maintenance work time by estimating maintenance work time from facility design and maintenance work procedures at the facility design stage and improving the design and procedures.

[0003] Patent Document 1 aims to provide a program that can improve the accuracy of an estimated assembly time calculated in a simulation, and discloses the following as a program, an assembly time calculation method, and an assembly time calculation device: "A program for calculating a product assembly time through simulation, wherein an input unit 1302 acquires animation data for displaying an animation of a product assembly procedure on a display unit, a change point detection unit 1310 detects a change in the viewpoint of the animation from the acquired animation data, and a standard time calculation unit 1311 calculates an estimated value of the product assembly time based on the detected change in the viewpoint of the animation." Patent Document 2 aims to provide an assemblability evaluation system that not only extracts data to be used for evaluation from 3D CAD data, but also allows for easy input for evaluation by inputting functions to be used in other processes, subsequent processes, or auxiliary processes, and allows the functions to be actually used, and discloses the following assemblability evaluation methods, systems, and programs. "The system imports 3D CAD data, accepts operations from the user to create the animation, records the movement of the parts resulting from the accepted operations, creates evaluation data from this movement, and then substitutes the created evaluation data into a pre-prepared evaluation formula to obtain the evaluation results. Therefore, the only input required from the user is the part that creates the assembly animation; once this animation is created, the evaluation data is automatically created and the evaluation results can be obtained, significantly reducing the amount of input required from the user."

[0004] JP 2014-182557 A JP 2007-200082 A

[0005] The maintenance work time for semiconductor processing equipment can be estimated as the sum of wet work time, leak rework time, and particle rework time. Wet work time mainly refers to the time required for disassembly, cleaning, and reassembly of the chamber where wafers are processed, cleaning particles generated during the reaction process, and reassembling the chamber. Leak rework time refers to the time required to reassemble a device that fails a leak test after wet work and pass the leak test. Particle rework time refers to the time required to re-perform wet work and leak testing and pass the particle test after passing a leak test and failing a particle test. Because maintenance work time is affected by wet work time, leak occurrence rate, and particle defect rate, a method for estimating wet work time, leak occurrence rate, and particle defect rate in advance is needed. Patent Document 1 (Japanese Patent Laid-Open Publication No. 2004-222294) discloses a method for estimating assembly work time from design data, making it possible to estimate wet work time. Furthermore, Patent Document 2 discloses a method for estimating assembly performance (defect rate) from design data, which makes it possible to estimate the leak occurrence rate. However, Patent Documents 1 and 2 do not fully consider the foreign matter defect rate. Therefore, an object of the present invention is to provide a technology for estimating the foreign matter defect rate.

[0006] In order to solve the above-mentioned problems, one representative evaluation device of the present invention is an evaluation device that evaluates an assembly operation of assembling a processing device composed of a plurality of parts, the evaluation device comprising a calculation function unit and a defect rate calculation unit, the calculation function unit acquires gravity information that indicates the direction in which gravity acts, acquires assembly sequence information that indicates the operation and assembly sequence to be performed on each of the plurality of parts for each process included in the assembly operation (hereinafter referred to as an "assembly process"), acquires work action information that indicates the work actions of workers performed in the assembly process, acquires evaluation surface information that indicates an evaluation surface of each of the plurality of parts, and acquires relative position information that indicates the positional relationship between a foreign matter source and the parts in the assembly process, and the defect rate calculation unit calculates a foreign matter defect rate that indicates the risk of foreign matter generated from the foreign matter source adhering to each of the evaluation surfaces due to the work actions, from the gravity information, the assembly sequence information, the work action information, and the relative position information.

[0007] According to the present invention, it is possible to estimate the foreign matter defect rate. Problems, configurations, and effects other than those described above will become apparent from the following description of the preferred embodiment of the invention.

[0008] FIG. 1 is a diagram showing an example of a display shown by an evaluation device according to an embodiment. FIG. 2 is a diagram showing an example of the configuration of the evaluation device according to an embodiment. FIG. 3 is a diagram showing a flowchart of a foreign matter defect rate calculation process performed by the evaluation device. FIG. 4 is a diagram showing an example of assembly sequence information, work operation information, and evaluation surface information. FIG. 5 is a diagram showing an example of relative position information. FIG. 6 is a diagram showing an example of a foreign matter defect rate DB. FIG. 7 is a diagram showing an example of a foreign matter defect rate table. FIG. 8 is a diagram showing an extraction method for extracting a countermeasure policy from the foreign matter defect rate table. FIG. 9 is a diagram schematically showing a scene from a process of incorporating a child part into a mother part in wet work.

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Note that the present invention is not limited to this embodiment. In addition, in the description of the drawings, the same parts are designated by the same reference numerals.

[0010] (Cause of Foreign Matter Defects) The cause of foreign matter defects will be described with reference to Fig. 9. Fig. 9 is a diagram schematically showing a scene in a process of incorporating a sub-component into a mother component in a wet process.

[0011] Figure 9 shows the work of incorporating a child component B into a mother component A. Mother component A refers to the component on which the component is attached. Furthermore, child component B refers to the component that is operated by an operator. For example, if mother component A and child component B are components that make up a semiconductor processing device, mother component A would be a chamber or the like, and child component B would be a sample stage or the like that is placed inside the chamber. Child component B is lifted by an operator and placed inside mother component A.

[0012] The arrow indicates a vertical downward direction, which indicates the direction of gravity. During the assembly process, the worker moves in a manner that peers into the inside of the cylindrical mother part A, and therefore the worker's face Of may be located above the mother part A. If a foreign object is generated from the face Of, it is expected that the foreign object Co will move vertically downward and reach a surface of the surface As of the mother part A that is perpendicular to the vertical direction.

[0013] Furthermore, the child part B is held by the worker's hand Oh and transported to the installation position of the mother part A. The worker's hand Oh may come into contact with the inside of the mother part A in addition to the child part B. It is expected that the worker's hand Oh will come into contact with a surface of the surface As that is parallel to the vertical direction, and a foreign object will be transferred from the worker's hand Oh to the surface As.

[0014] In this way, it is conceivable that foreign matter emitted from the body or clothing of a worker may adhere to a part during the assembly process. When estimating the cause of a foreign matter defect, it is necessary to consider not only foreign matter that was originally attached to the part being assembled, but also foreign matter that is attached to parts other than the part being assembled, and the influence of the worker's physical movements during assembly.

[0015] (Display Example of Evaluation Device) Fig. 1 is a diagram showing a display example shown by an evaluation device according to an embodiment. As will be described later, the evaluation device has an input I / F (interface) and an output I / F. The evaluation device has a display function configured by the input I / F and the output I / F.

[0016] The input I / F and output I / F display an assembly sequence input section 201, a work action input section 202, an evaluation surface input section 203, a gravity direction display section 205, a relative position display section 204, a defect rate setting section 206, a gravity input section 207, a result display section 301, and a countermeasure display section 302.

[0017] The assembly sequence input unit 201 displays the set assembly sequence information and accepts user input operations for the assembly sequence information. The assembly sequence information will be described later. An input UI (user interface) can be set appropriately in the assembly sequence input unit 201. For example, by operating a drill-down menu shown in a cell, the user can edit the numerical value or text shown in the cell.

[0018] The work movement input unit 202 displays the set work movement information and accepts input operations by the user for the work movement information. The work movement information will be described later.

[0019] The evaluation surface input section 203 indicates the part (surface) to be evaluated by the evaluation device for the possibility of foreign matter adhering. The relative position display section 204 indicates the relative positional relationship between the foreign matter source and the part during each worker's action. The gravity direction display section 205 indicates the direction of gravity acting on the foreign matter source and the part shown in the relative position display section 204.

[0020] The defect rate setting unit 206 indicates the relationship between the foreign matter source and the defect rate associated with the foreign matter source. The defect rate setting unit 206 indicates a defect rate index previously stored in a foreign matter defect rate DB7, which will be described later. The defect rate setting unit 206 also accepts a user input operation for the defect rate index. The foreign matter defect rate DB7 will be described later.

[0021] The gravity input unit 207 indicates information defining the direction of gravity (hereinafter also referred to as "gravity information" d). The gravity input unit 207 accepts a user's input operation for the gravity information. The direction of gravity in the gravity information set via the gravity input unit 207 is displayed as an arrow in the gravity direction display unit 205.

[0022] The result display section 301 displays the result of the evaluation of the foreign matter defect rate.

[0023] The countermeasure display section 302 shows countermeasures for the work operations of the worker. The countermeasure with the highest priority is displayed as "Improvement for component X to prevent foreign matter from falling onto the mother component during insertion." The countermeasure with the second highest priority is displayed as "Improvement for component X to prevent foreign matter from adhering to the mother component during lateral movement." The countermeasure display section 302 can also display other countermeasures. For example, a scroll bar can be provided on the side of the countermeasure display section 302, and multiple countermeasures can be displayed by the user operating it.

[0024] In FIG. 1 , numerical values ​​or text are displayed in multiple cells. A user can select a cell to edit the numerical values ​​and text displayed in the cell. Such display and editing can be achieved by using a display device such as a monitor, and input devices such as a keyboard and a mouse as the input I / F and output I / F. Furthermore, an input / output device such as a touch panel may be used as the input I / F and output I / F. Furthermore, the I / F is not limited to a display device, and an output device such as audio may also be used.

[0025] (Configuration of Evaluation Apparatus) FIG. 2 is a diagram illustrating an example of the configuration of an evaluation apparatus according to an embodiment. The evaluation apparatus 1 evaluates an assembly operation in which a processing device composed of multiple components is assembled. The evaluation apparatus 1 includes a calculation function unit 4 and a defect rate calculation unit 5. The calculation function unit 4 acquires gravity information indicating the direction of gravity, acquires assembly sequence information indicating the operation and assembly sequence performed on each of the multiple components for each process included in the assembly operation (hereinafter referred to as the "assembly process"), acquires work action information indicating the work actions of workers performed in the assembly process, acquires evaluation surface information indicating the evaluation surface of each of the multiple components, and acquires relative position information indicating the positional relationship between a foreign matter source and the component in the assembly process. Furthermore, the defect rate calculation unit 5 calculates a foreign matter defect rate, which indicates the risk of foreign matter generated from a foreign matter source adhering to each evaluation surface due to the work action, based on the gravity information, assembly sequence information, work action information, and relative position information. A detailed description is provided below.

[0026] The evaluation device 1 has an input I / F 2 , an output I / F 3 , a calculation function unit 4 , a defect rate calculation unit 5 , a storage unit 6 , and a foreign matter defect rate DB 7 .

[0027] As shown in FIG. 1, the input I / F 2 displays various pieces of information to the user of the evaluation device 1 and accepts input operations from the user.

[0028] The input I / F 2 accepts information such as assembly sequence information 101, work operation information 102, evaluation surface information 103, relative position information 104, gravity information 105, etc., or user input operations for setting these pieces of information.

[0029] The assembly sequence information 101 indicates the operations and assembly sequence performed on each of the plurality of parts for each assembly process included in the assembly work. The work action information 102 indicates the user's actions performed in the assembly process. The evaluation aspect information 103 indicates the evaluation aspect of each of the plurality of parts. The assembly sequence information 101, the work action information 102, and the evaluation aspect information 103 are set via the assembly sequence input unit 201, the work action input unit 202, and the evaluation aspect input unit 203 in FIG. 1, respectively.

[0030] The relative position information 104 indicates the positional relationship between the foreign matter source and the component in the assembly process. The relative position information 104 is shown in the relative position display section 204 in FIG.

[0031] The gravity information 105 indicates the direction in which gravity acts. The gravity information 105 is displayed in the gravity direction display section 205 in Fig. 1. The gravity information 105 is set via the gravity input section 207. The gravity input section 207 can set the magnitude of gravity along three axes, x, y, and z, for example.

[0032] Although the above-mentioned information is set via the input I / F 2 in the above description, the present invention is not limited to this. The above-mentioned information can be set in advance in the storage unit 6 (described later) and the previously set information can be displayed to the user. Furthermore, the above-mentioned information can be extracted from an image capture device or a body sensor based on the assembly work actually performed by the worker, and displayed to the user via the input I / F 2.

[0033] The calculation function unit 4 acquires gravity information 105, assembly sequence information 101, work operation information 102, evaluation surface information 103, and relative position information 104. The calculation function unit 4 includes, for example, at least one of a CPU, a ROM, and a RAM.

[0034] The defect rate calculation unit 5 calculates the foreign matter defect rate of the evaluation surface from the gravity information, assembly sequence information, work operation information, and relative position information. The relationship between the evaluation surface and the foreign matter defect rate is calculated for each process included in the assembly sequence and for each evaluation surface. The defect rate calculation unit 5 creates a foreign matter defect rate table 111 that indicates multiple relationships. Note that although the calculation function unit 4 and the defect rate calculation unit 5 are shown as having different configurations, the present disclosure is not limited to this. The defect rate calculation unit 5 can also be included in the configuration of the calculation function unit 4.

[0035] The output I / F 3 displays the foreign matter defect rate table 111 to the user. The result display unit 301 in Fig. 1 displays information contained in the foreign matter defect rate table 111. The output I / F 3 also displays the countermeasure display unit 302 in Fig. 1.

[0036] The storage unit 6 stores information input via the input I / F 2 and information calculated by the defect rate calculation unit 5. In the storage unit 6, gravity information storage units 61 and 62 store gravity information 105. The assembly sequence information storage unit 63 stores assembly sequence information 101. The work motion information storage unit 64 stores work motion information 102. The evaluation surface information storage unit 65 stores evaluation surface information 103. The relative position information storage unit 66 stores relative position information 104. The foreign matter defect rate table storage unit 67 stores a foreign matter defect rate table 111.

[0037] Although the case where a storage unit is provided for each piece of information has been described, the present invention is not limited to this. The storage unit may be configured by a single piece of hardware, and multiple pieces of information may be stored in one storage unit.

[0038] The foreign matter defect DB 7 holds data indicating the relationship between the foreign matter source and the defect rate indicated in the defect rate setting unit 206 .

[0039] The evaluation device 1 may be configured by hardware or by information processing resources provided by a cloud service. Furthermore, although the calculation of the foreign matter defect rate for a semiconductor processing device will be described, the present disclosure is not limited to the case of a semiconductor processing device.

[0040] (Calculation Process of Foreign Matter Defect Rate) FIG. 3 is a flowchart showing the calculation process of foreign matter defect rate performed by the evaluation device.

[0041] The foreign matter defect rate is calculated for each unit operation (steps S1 to S7) and for each evaluation surface (steps S2 to S6). A unit operation is an assembly operation subdivided according to a predetermined standard, and refers to an operation that has been divided so as to calculate the foreign matter defect rate. Below, we will explain the case where the operation operations included in the operation operation information 102 are considered to be unit operations, but the present disclosure is not limited to this. The method of analyzing the operations in the assembly operation can be set as appropriate.

[0042] The calculation function unit 4 acquires gravity information 105, work action information 102, evaluation surface information 103, and relative position information 104 required to calculate the foreign matter defect rate for each work action and each evaluation surface.

[0043] Next, the defect rate calculation unit 5 determines whether the positional relationship between the foreign matter source and the component is a predetermined positional relationship or whether it is another positional relationship.

[0044] The predetermined positional relationship is determined by ray tracing, which determines whether a line extending perpendicularly from the evaluation surface of the component collides with the foreign matter source. Specifically, the defect rate calculation unit 5 emits a ray from the evaluation surface in a direction opposite to the direction of gravity indicated in the gravity information 105 (step S3). For example, if the component is represented by a polygon, a half-line is extended from the center of gravity of each facet (triangular surface) constituting the evaluation surface in the direction opposite to the direction of gravity.

[0045] The defect rate calculation unit 5 determines whether the foreign matter source and the ray collide (step S4). Specifically, it determines whether a half-line extending perpendicularly from the evaluation surface collides with the foreign matter source. If a collision occurs, the defect rate calculation unit 5 retrieves a defect rate index from a database (DB) based on the positional relationship between the foreign matter source and the evaluation surface and adds it (step S5). Examples of foreign matter sources include the face and hands of a worker, and tools used by the worker. The positional relationship may include a case where the foreign matter source is in contact with the evaluation surface (when the half-line extending between the foreign matter source and the evaluation surface is equal to or shorter than a predetermined length), or a case where the foreign matter source is located above the evaluation surface (when the foreign matter source and the evaluation surface are not in contact, but the foreign matter source is located in a position opposite the direction of gravity of the evaluation surface and a half-line extending from the evaluation surface reaches the foreign matter source). While the case where the direction of gravity and the direction perpendicular to the evaluation surface are parallel has been described, the present disclosure is not limited to this case. The present disclosure can also be applied to cases where the direction of gravity and the direction perpendicular to the evaluation surface are not parallel.

[0046] (Details of Information) Fig. 4 is a diagram showing an example of the assembly sequence information 101, the work action information 102, and the evaluation aspect information 103. Fig. 4 shows the information in the display format shown in the assembly sequence input unit 201, the work action input unit 202, and the evaluation aspect input unit 203 in Fig. 1.

[0047] In the assembly sequence information 101, the item "ID" indicates an assembly process included in the assembly work. The item "part name" indicates a part that is operated by a worker in each assembly process. The part name mainly indicates a child part. The item "action" indicates an action element defined for analyzing the assembly work. The symbol "↓" means that a child part is moved downward (in the direction of gravity), and the symbol "→" means that a child part is moved laterally. In the assembly process of ID0-0, the cylinder operates to move laterally. In addition, in the assembly process of ID0-1, the cylinder operates to move downward (insertion operation). The assembly process of ID0-1 is performed following the assembly process of ID0-0, and the assembly processes are arranged in chronological order.

[0048] The work motion information 102 indicates the positional relationship between the foreign matter source and the part in the assembly process, and is time-series data separated by a predetermined time interval. The work motion information 102 is, for example, 3D simulation data that expresses the assembly process from start to finish, or data obtained by separating this 3D simulation data by a certain time interval. Here, the assembly process with ID0-0 is represented by data in a predetermined format separated by 0-0-0. pose, 0-0-1. pose, ... The assembly process with ID0-1 is represented by data 0-1-0. pose.

[0049] The evaluation surface information 103 indicates a surface to be evaluated for foreign matter adhesion. The evaluation surface is specified by the user. Alternatively, the evaluation surface may be a surface selected by the evaluation device 1. The evaluation surface may be a cleaned surface, which is a surface that requires a predetermined cleanliness level, and the calculation function unit 4 may extract the cleaned surface based on the shape data of the semiconductor processing apparatus in the mid-assembly state and the cleaned surface determination conditions, which are conditions for determining the cleaned surface. The cleaned surface determination conditions may, for example, determine whether a surface is assigned a flag or the like in advance in the shape data of the part. Here, CB01 is extracted as the evaluation surface. CB01 indicates a surface of a mother part in an assembly operation. Note that the evaluation surface is not limited to a surface of a mother part and may be a surface of a child part. Furthermore, multiple surfaces may be extracted as evaluation surfaces.

[0050] FIG. 5 is a diagram showing an example of the relative position information 104. FIG. 5( a) shows the relative position information in the display format shown in the relative position display unit 204. A name field 1021 indicates the name of the displayed data among the work motion information 102. The relative position display unit 204 also displays gravity information 105 set in the gravity input unit 207, and the direction of gravity is indicated by an arrow. FIG. 5( a) schematically shows the relative positional relationships among the worker's hands 1041, the worker's face 1045, the child part 1043, the mother part 1044, and the evaluation surface 1042. The hands 1041 and the face 1045 are particularly likely to act as sources of foreign matter, and are therefore shown as extracted from the elements constituting the worker.

[0051] 5A is a schematic representation, in which the calculation function unit 4 calculates the relative positional relationships between a child part 1043, a mother part 1044, and a foreign matter source based on assembly sequence information 101, work motion information 102, and evaluation surface information 103. FIG. 5B is a diagram showing an example of work motion information 102. The work motion information 102 is 3D simulation data and includes a worker's hands 1041 and face 1045, a child part 1043, and a mother part 1044 (placed on a workbench 1046). The calculation function unit 4 calculates relative position information 104 based on positional information of the worker's body, the part to be assembled, the evaluation surface, and the like in the assembly process of the assembly work.

[0052] The evaluation device 1 further includes a database in which a defect index is defined for each positional relationship. The defect calculation unit 5 calculates the foreign matter defect rate for each evaluation surface based on the defect index. FIG. 6 shows an example of the foreign matter defect rate DB 7. The foreign matter defect rate DB 7 defines a defect index indicating the risk of foreign matter adhesion due to each foreign matter source for each relative positional relationship between the component and the foreign matter source. The "Foreign Matter Source" item indicates the cause of foreign matter generation. The "Defective Rate Index" item is a numerical value used to calculate the foreign matter defect rate when conducting foreign matter testing of semiconductor processing equipment. The defect rate index is defined when there is a predetermined positional relationship between the foreign matter source and the component. The "Contact" and "Above" items indicate the relative positional relationship between the foreign matter source and the component. "Contact" refers to when the foreign matter source and the component are in contact. "Above" refers to when the foreign matter source is located above the component. Note that "above" refers to the direction opposite to the direction of gravity when the component is used as the reference point. A method for calculating the foreign matter defect rate for the entire assembly work will be described later.

[0053] The foreign matter source "face" refers to the worker's face. When the face comes into contact with the part, the defect rate index is 1.000%, and when the face is above the part, the defect rate index is 0.002%. The foreign matter source "hand" refers to the worker's hand. When the hand comes into contact with the part, the defect rate index is 0.050%, and when the hand is above the part, the defect rate index is 0.005%. The foreign matter source "arm (clothing)" refers to the worker's arm. When the arm comes into contact with the part, the defect rate index is 0.020%, and when the arm is above the part, the defect rate index is 0.002%. The foreign matter source "part Z" refers to a part with a foreign matter attached. For example, if a sub-part is fastened to a mother part with an insufficiently treated screw, the screw corresponds to part Z. Although it is not expected that such a screw will come into contact with the part, it is expected that the screw will pass above the mother part during transport. The defect rate index is set to 0.0002%. Furthermore, the foreign matter source "Tool Y" refers to the tool to which the foreign matter is attached. For example, if a sub-part is fixed to a mother part with a wrench that has not been adequately treated, the wrench corresponds to Tool Y. Although it is not expected that such a wrench will come into contact with the part, it is expected that the wrench will pass over the mother part during transportation. The defect rate index is set to 0.0005%.

[0054] Although the definitions of the foreign matter source and the defect rate index have been described, the present disclosure is not limited thereto. Other foreign matter sources and defect rate indexes may be adopted. Although the cases of "contact" and "above" have been described as the predetermined positional relationship, the defect rate index may be defined based on other positional relationships. Furthermore, in addition to screws and wrenches, parts and tools used in assembly work may also be adopted.

[0055] 7 is a diagram showing an example of the foreign matter defect rate table 111. The foreign matter defect rate table 111 is information displayed on the result display unit 301.

[0056] The foreign matter defect rate table 111 shows the results of calculating the relationship between the evaluation surface and the defect rate for each assembly process. The evaluation surface indicates the surface of a component that is determined to be in contact with or above a foreign matter in the positional relationship between the foreign matter and the component. In the assembly process of ID0-0, a foreign matter defect rate of 0.050 is calculated for the evaluation surface CA01, and a foreign matter defect rate of 0.005 is calculated for the evaluation surface CB01. Furthermore, in the assembly process of ID0-1, a foreign matter defect rate of 0.052 is calculated for the evaluation surface CB01.

[0057] The defect rate calculation unit 5 adds up or multiplies the foreign matter defect rates for each evaluation surface for the same assembly process. In the process ID0-1, there is only one evaluation surface, CB01, so the foreign matter defect rate of evaluation surface CB01, 0.052%, is entered directly in the "Total" item as the foreign matter defect rate for the assembly process ID0-1. By calculating the foreign matter defect rate with a focus on the assembly process in this way, it becomes possible to analyze the assembly work for each assembly process and evaluate the occurrence of foreign matter.

[0058] Furthermore, the defect rate calculation unit 5 adds or multiplies the foreign matter defect rates for each evaluation surface in the assembly work for the same evaluation surface. The total column for evaluation surface CA01 shows a defect rate of 0.130%, and the total column for evaluation surface CB01 shows a defect rate of 0.22%. By calculating the foreign matter defect rate focusing on the evaluation surface in this way, it is possible to identify parts in the assembly work that are at the highest risk of foreign matter adhesion, and this information can be used to improve work operations.

[0059] A specific example of calculating the foreign matter defect rate will now be described with reference to the relative position information 104 shown in FIG. 5A and the foreign matter defect rate DB 7 shown in FIG. 6. As shown in FIG. 5A, a face 1045 and a hand 1041 are present as foreign matter sources. The hand 1041 is in contact with the upper surface (the surface perpendicular to the direction of gravity) of the child part 1043. The face 1045 is located in the air. Therefore, the foreign matter defect rate for the upper surface of the child part 1043 is calculated as 0.050% (the defect rate index when the hand is in contact) + 0.002% (the defect rate index when the face is in the air) = 0.052%. The hand 1041 and the face 1045 are located on the bottom surface (the surface perpendicular to the direction of gravity) of the mother part 1044. Therefore, the foreign matter defect rate for the bottom surface of the mother part 1044 is calculated as 0.002% (defect rate index when face is in the air) + 0.005% (defect rate when hand is in the air) = 0.007%.

[0060] The sum of the defect rate indexes and the multiplication of the defect rate indexes can be set as appropriate. For example, when there is a correlation between work operations, such as when a sub-component is placed on a mother part by a downward movement (insertion movement) and then the sub-component is fixed by rolling into a fitting groove, it is possible to evaluate the risk of foreign matter adhesion by multiplying the defect rate indexes between the work operations. Furthermore, when there is a work operation that has a large impact on the occurrence of foreign matter, it is also possible to multiply the defect rate index by a weight and then add them up.

[0061] (Priority of Countermeasures) The countermeasure display unit 302 displays countermeasures for workers with priorities assigned to them. How to set the priorities will be described with reference to FIG.

[0062] 8 is a diagram showing a method for extracting countermeasure policies from the foreign matter defect rate table 111. The defect rate calculation unit 5 prioritizes and extracts assembly processes to be improved from the assembly processes included in the assembly sequence information based on the foreign matter defect rate.

[0063] FIG. 8A is a diagram illustrating a first extraction method. The first extraction method focuses on work operations that affect the defect rate. The defect rate calculation unit 5 extracts an ID associated with the cell with the highest defect rate from the table of evaluation surfaces and IDs (hatched) in the foreign matter defect rate table 111. The defect rate calculation unit 5 acquires the part name and operation corresponding to the extracted ID by referring to the assembly sequence information 101, and also acquires the evaluation surface corresponding to the extracted ID by referring to the evaluation surface information 103. The defect rate calculation unit 5 displays the acquired part name, operation, and evaluation surface on the countermeasure display unit 302.

[0064] FIG. 8B is a diagram illustrating a second extraction method. The second extraction method focuses on evaluation aspects that affect the defect rate. The defect rate calculation unit 5 extracts an evaluation aspect associated with the cell with the largest defect rate from the column (hatched) of total values ​​of the foreign matter defect rate calculated for each evaluation aspect in the foreign matter defect rate table 111. The defect rate calculation unit 5 extracts the ID with the largest foreign matter defect rate from the column of the extracted evaluation aspects and IDs. The defect rate calculation unit 5 acquires the component name and operation corresponding to the extracted ID by referring to the assembly sequence information 101, and also acquires the evaluation aspect corresponding to the extracted ID by referring to the evaluation aspect information 103. The defect rate calculation unit 5 displays the acquired component name, operation, and evaluation aspect on the countermeasure display unit 302.

[0065] FIG. 8C is a diagram illustrating a third extraction method. The third extraction method focuses on the assembly process that affects the defect rate. The defect rate calculation unit 5 extracts the ID associated with the cell with the largest defect rate from the column (hatched) of the total value of the defect rate of the foreign matter calculated for each ID in the foreign matter defect rate table 111. The defect rate calculation unit 5 extracts the evaluation surface with the largest defect rate of the foreign matter from the row of the extracted ID and evaluation surface. The defect rate calculation unit 5 acquires the part name and operation corresponding to the extracted ID by referring to the assembly sequence information 101. The defect rate calculation unit 5 displays the extracted evaluation surface, the acquired part name, and operation on the countermeasure display unit 302.

[0066] In this way, the factors that have a significant impact on the foreign matter defect rate can be extracted from three perspectives: work operations, evaluation aspects, and assembly processes. This makes it possible to provide work guidelines, such as work manuals, that reduce the risk of foreign matter adhesion when designing assembly work.

[0067] As described above, according to the present disclosure, it is possible to estimate the defect rate due to foreign matter by setting information on the work operations and the source of foreign matter, etc. This makes it possible to design assembly operations that reduce the risk of foreign matter adhesion and minimize the maintenance work time for semiconductor processing equipment.

[0068] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the gist of the present invention.

[0069] The present invention is not limited to the following embodiments. (Aspect 1) An evaluation device for evaluating an assembly operation for assembling a processing device composed of multiple parts, the evaluation device comprising a calculation function unit and a defect rate calculation unit, wherein the calculation function unit acquires gravity information indicating the direction in which gravity acts, acquires assembly sequence information indicating the operation and assembly sequence to be performed on each of the multiple parts for each process included in the assembly operation (hereinafter referred to as an "assembly process"), acquires work action information indicating the work actions of workers performed in the assembly process, acquires evaluation surface information indicating an evaluation surface of each of the multiple parts, and acquires relative position information indicating the positional relationship between a foreign matter source and the parts in the assembly process, and the defect rate calculation unit calculates a foreign matter defect rate indicating the risk of foreign matter generated from the foreign matter source adhering to each of the evaluation surfaces due to the work action, from the gravity information, the assembly sequence information, the work action information, and the relative position information. (Aspect 2) The evaluation device according to Aspect 1, wherein the work action information is time-series data indicating the positional relationship in the assembly process and separated by a predetermined time interval. (Aspect 3) The evaluation device according to Aspect 1 or 2, wherein the evaluation surface is a cleaning surface that is a surface that requires a predetermined degree of cleanliness. (Aspect 4) The evaluation device according to any one of Aspects 1 to 3, wherein the calculation function unit extracts the cleaning surface based on shape data of the processing device in an intermediate assembly state and cleaning surface determination conditions that are conditions for determining the cleaning surface. (Aspect 5) The evaluation device according to any one of Aspects 1 to 4, further comprising a database in which a defect rate index is defined for each of the positional relationships, and the defect rate calculation unit calculates the foreign matter defect rate based on the defect rate index. (Aspect 6) The evaluation device according to any one of Aspects 1 to 5, wherein the defect rate calculation unit determines whether the positional relationship is a predetermined positional relationship or another positional relationship.(Aspect 7) The evaluation device according to any one of Aspects 1 to 6, wherein ray tracing is used to determine whether a straight line extending perpendicularly from the evaluation surface of the component collides with the foreign matter source. (Aspect 8) The evaluation device according to any one of Aspects 1 to 7, wherein the defect rate calculation unit adds up or multiplies up the foreign matter defect rates for the evaluation surfaces in the same assembly process. (Aspect 9) The evaluation device according to any one of Aspects 1 to 8, wherein the defect rate calculation unit adds up or multiplies up the foreign matter defect rates for the evaluation surfaces in the assembly work in the same evaluation process. (Aspect 10) The evaluation device according to any one of Aspects 1 to 9, wherein the defect rate calculation unit prioritizes and extracts assembly processes to be improved from the assembly processes included in the assembly sequence information based on the foreign matter defect rates. (Aspect 11) An evaluation method for evaluating assembly work in which a processing device made up of a plurality of parts is assembled, the evaluation method comprising the steps of: acquiring gravity information indicating the direction in which gravity acts; acquiring assembly sequence information indicating the operations and assembly sequence performed on each of the plurality of parts for each process included in the assembly work (hereinafter referred to as an "assembly process"); acquiring work action information indicating the work actions of workers performed in the assembly process; acquiring evaluation surface information indicating the evaluation surface of each of the plurality of parts; acquiring relative position information indicating the positional relationship between a foreign matter source and the part in the assembly process; and calculating a foreign matter defect rate indicating the risk of foreign matter generated from the foreign matter source adhering to each of the evaluation surfaces due to the work action from the gravity information, the assembly sequence information, the work action information, and the relative position information.

[0070] 1 Evaluation device, 2 Input I / F, 3 Output I / F, 4 Calculation function unit, 5 Defect rate calculation unit, 6 Memory unit, 61 Gravity information memory unit, 62 Gravity information memory unit, 63 Assembly sequence information memory unit, 64 Work operation information memory unit, 65 Evaluation surface information memory unit, 66 Relative position information memory unit, 67 Foreign matter defect rate table memory unit, 101 Assembly sequence information, 102 Work operation information, 103 Evaluation surface information, 104 Relative position information, 105 Gravity information, 111 Foreign matter defect rate table, 201 Assembly sequence input unit, 202 Work operation input unit, 203 Evaluation surface input unit, 204 Relative position display unit, 205 Gravity direction display unit, 206 Defect rate setting unit, 207 Gravity input unit, 301 Result display unit, 302 Countermeasure display unit, 1021 Name field, 1041 Hand part, 1042 evaluation surface, 1043 child part, 1044 mother part, 1045 face part, 1046 work table

Claims

1. An evaluation device for evaluating an assembly operation of assembling a processing device constituted by a plurality of parts, said evaluation device comprising a calculation function unit and a defect rate calculation unit, said calculation function unit: acquires gravity information indicating the direction in which gravity acts, acquires assembly sequence information indicating the operation and assembly sequence performed on each of the plurality of parts for each process included in the assembly operation (hereinafter referred to as an "assembly process"), acquires work action information indicating the work actions of workers performed in the assembly process, acquires evaluation surface information indicating an evaluation surface of each of the plurality of parts, and acquires relative position information indicating the positional relationship between a foreign matter source and the parts in the assembly process, and said defect rate calculation unit calculates a foreign matter defect rate indicating the risk of foreign matter generated from the foreign matter source adhering to each of the evaluation surfaces due to the work actions from the gravity information, the assembly sequence information, the work action information and the relative position information.

2. The evaluation device according to claim 1, wherein the work movement information indicates the positional relationship in the assembly process and is time-series data divided into predetermined time intervals.

3. The evaluation device according to claim 1, wherein the evaluation surface is a cleaning surface that is required to have a predetermined degree of cleanliness.

4. The evaluation device according to claim 3, characterized in that the calculation function unit extracts the cleaning surface based on shape data of the processing device in an intermediate assembly state and cleaning surface determination conditions which are conditions for determining the cleaning surface.

5. The evaluation device according to claim 1, further comprising a database in which a defect rate index is defined for each of the positional relationships, and the defect rate calculation unit calculates the foreign matter defect rate for each of the evaluation surfaces based on the defect rate index.

6. The evaluation device according to claim 5, wherein the defect rate calculation section judges whether the positional relationship is a predetermined positional relationship or another positional relationship.

7. The evaluation device according to claim 6, characterized in that the determination of the specified positional relationship uses ray tracing to determine whether or not a straight line extending perpendicularly from the evaluation surface of the component collides with the foreign matter source.

8. The evaluation device according to claim 1, characterized in that the defect rate calculation unit adds up or multiplies the foreign matter defect rates for each evaluation surface for the same assembly process.

9. The evaluation device according to claim 1, characterized in that the defect rate calculation unit adds up or multiplies the foreign matter defect rates for each evaluation surface in the assembly work for the same evaluation surface.

10. The evaluation device according to claim 1, characterized in that the defect rate calculation unit extracts, from the assembly processes included in the assembly sequence information, assembly processes to be improved by prioritizing them based on the foreign matter defect rate.

11. An evaluation method for evaluating an assembly operation for assembling a processing device composed of a plurality of parts, comprising the steps of: acquiring gravity information indicating the direction in which gravity acts; acquiring assembly sequence information indicating the operation and assembly sequence performed on each of the plurality of parts for each process included in the assembly operation (hereinafter referred to as an "assembly process"); acquiring work action information indicating the work actions of workers performed in the assembly process; acquiring evaluation surface information indicating an evaluation surface of each of the plurality of parts; acquiring relative position information indicating the positional relationship between a foreign matter source and the parts in the assembly process; and calculating a foreign matter defect rate indicating the risk of foreign matter generated from the foreign matter source adhering to each of the evaluation surfaces due to the work actions from the gravity information, the assembly sequence information, the work action information, and the relative position information.

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