Phase shifter

Abstract

This phase shifter comprises a first row, a second row, a connection part, and a first ground plane. The first row has a plurality of digital phase shift circuits, each of which includes a loop line and which are cascade-connected in the longitudinal direction. The second row has the plurality of digital phase shift circuits that are cascade-connected in the longitudinal direction and extends in parallel with the first row so as to overlap the first row when viewed from an intersecting direction. The connection part electrically connects a first end part of the first row and a first end part of the second row. The first ground plane has a recess and surrounds the first row, the second row, and the connection part in plan view. The first ground plane and the loop lines are not in contact with each other.

Description

phase shifter

[0001] This application claims priority from Japanese Patent Application No. 2023-137589, filed on August 25, 2023, the contents of which are incorporated herein by reference.

[0002] Non-Patent Document 1 below discloses a digitally controlled phase shift circuit (digital phase shift circuit) for microwave, quasi-millimeter wave, or millimeter wave applications. As shown in FIG. 2 of Non-Patent Document 1, this digital phase shift circuit includes a signal line, a pair of inner lines, a pair of outer lines, a first ground bar, a second ground bar, and a pair of NMOS switches (N-type metal-oxide-semiconductor switches). The pair of inner lines are provided on both sides of the signal line. The pair of outer lines are provided outside the pair of inner lines. The first ground bar is connected to first ends of each of the inner lines and each of the outer lines. The second ground bar is connected to second ends of each of the outer lines. Each NMOS switch is provided between the second end of each of the inner lines and the second ground bar.

[0003] In such a digital phase shift circuit, a return current flowing through a pair of inner lines or a pair of outer lines due to transmission of a signal wave through the signal lines is switched depending on whether the pair of NMOS switches are open or closed. This switches the operation mode of the digital phase shift circuit between a low delay mode and a high delay mode. That is, the operation mode of the digital phase shift circuit is the low delay mode when a return current flows through the pair of inner lines, and the high delay mode when a return current flows through the pair of outer lines.

[0004] A Ka-band Digitally-Controlled Phase Shifter with sub-degree Phase Precision (2016,IEEE,RFIC)

[0005] The digital phase shift circuit described above is applied to, for example, base stations using phased array antennas. In this case, multiple cascaded digital phase shift circuits are mounted on a semiconductor substrate. That is, the digital phase shift circuit described above is a unit in the configuration of an actual phase shift device, and multiple cascaded digital phase shift circuits constitute the phase shift device. This phase shift device realizes multiple phase shift amounts as a whole by each of the multiple digital phase shift circuits independently switching between a high delay mode and a low delay mode.

[0006] When such a phase shift device is implemented on a semiconductor substrate, multiple digital phase shift circuits may be arranged in multiple rows. That is, multiple rows (unit rows) each having multiple cascaded digital phase shift circuits may be arranged parallel to one another on the semiconductor substrate. A ground conductor such as a ground plane may be arranged around each unit row. Depending on the arrangement of the ground conductor, the ground conductor may adversely affect the phase shift characteristics of each unit row (phase shift device).

[0007] Furthermore, in the digital phase shift circuit described above, to ensure a sufficient phase shift amount within a limited area, it is desirable to make the inductance value in the high delay mode sufficiently larger than the inductance value in the low delay mode. Inductance is one of the circuit constants. However, in the conventional digital phase shift circuit described above, to increase the inductance value in the high delay mode, it is necessary to separate the outer line from the signal line (or increase the length of the outer line). This increases the size of the digital phase shift circuit. Because the phase shift device described above has a configuration in which multiple digital phase shift circuits are cascaded, there is a problem in that as the size of the digital phase shift circuit increases, the phase shift device also increases in size.

[0008] The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a phase shifting device that is smaller than conventional phase shifting devices and can achieve desired phase shifting characteristics.

[0009] In order to solve the above-described problems, a phase shift device according to a first aspect of the present invention is a first array having a plurality of digital phase shift circuits, each of the plurality of digital phase shift circuits including: a signal line; a first line including a first parallel line extending parallel to the signal line; a second parallel line extending parallel to the signal line; and a second line including a loop line extending from a first end of the second parallel line to near a second end of the second parallel line and having a convex shape in a direction away from the signal line in a cross direction crossing a longitudinal direction of the signal line; a first ground conductor electrically connected to the first end of the first parallel line and the first end of the second parallel line; a second ground conductor connected to the first end of the second line; a first electronic switch provided between the second end of the first parallel line and the second ground conductor; and the second ground conductor; and a control circuit that controls the first electronic switch and the second electronic switch, wherein the signal line is located between the first parallel line and the second parallel line in each of the plurality of digital phase shift circuits, and the plurality of digital phase shift circuits are cascaded in the longitudinal direction; a second line having the plurality of digital phase shift circuits cascaded in the longitudinal direction and extending parallel to the first line so as to overlap with the first line when viewed from the intersecting direction; a connection portion that electrically connects a first end of the first line to a first end of the second line; and a first ground plane that has a recess and surrounds the first line, the second line, and the connection portion in a plan view, wherein the first ground plane and the loop line are not in contact with each other.

[0010] According to aspect 1 of the present invention, the second line of each digital phase shift circuit includes a loop line. Therefore, even if each digital phase shift circuit is miniaturized, the required phase shift amount can be ensured. Furthermore, by miniaturizing each digital phase shift circuit, the required phase shift amount can be ensured with only two columns, thereby enabling the miniaturization of the phase shift device. Furthermore, the first ground plane and the loop line are not in contact with each other. Therefore, the influence of the first ground plane on the phase shift characteristics of the digital phase shift circuit is suppressed, and the desired phase shift characteristics can be achieved.

[0011] Furthermore, in a second aspect of the present invention, the phase shift device of the first aspect further includes a power supply wiring that is U-shaped in a planar view and supplies power to the control circuit, and a decoupling capacitor that is arranged between the first ground plane and the power supply wiring, and at least a portion of the power supply wiring extends along the inner edge of the recess.

[0012] A third aspect of the present invention provides the phase shift device of the first or second aspect, wherein in each of the plurality of digital phase shift circuits, the loop line includes: a first intersecting line extending from the first end of the second parallel line in the intersecting direction away from the signal line; a third parallel line extending from the first end of the first intersecting line parallel to the signal line and having a length shorter than that of the second parallel line; and a bent line connected to the first end of the third parallel line, having a bent portion formed thereon that extends shorter than the length of the first intersecting line so as to approach the signal line in the intersecting direction and then extends parallel to the signal line; and in each of the plurality of digital phase shift circuits, the control circuit is located in a gap formed between the bent line and the first intersecting line of an adjacent digital phase shift circuit in a planar view.

[0013] A fourth aspect of the present invention is the phase shift device according to any one of the first to third aspects, wherein the connection portion has a second ground plane, and the first ground plane and the second ground plane are not in contact with each other.

[0014] A fifth aspect of the present invention is the phase shift device according to any one of the first to fourth aspects, wherein no ground plane is disposed between the first and second rows.

[0015] Furthermore, aspect 6 of the present invention relates to a phase shift device according to any one of aspects 1 to 5, further comprising an input transmission line having a GND and electrically connected to a second end of the first row, and an output transmission line having a GND and electrically connected to a second end of the second row, wherein the GND of the input transmission line and the GND of the output transmission line are electrically connected to the first ground plane.

[0016] A seventh aspect of the present invention is the phase shift device of the sixth aspect, wherein each of the input transmission line and the output transmission line has a signal line electrically connected to the signal line, and a pair of ground lines arranged on both sides of the signal line with a gap therebetween.

[0017] Furthermore, in aspect 8 of the present invention, in the phase shift device of aspect 7, each of the input transmission line and the output transmission line further includes a ground layer arranged above or below the signal line and the pair of ground lines, and a connecting conductor connecting the pair of ground lines and the ground layer.

[0018] Furthermore, in a ninth aspect of the present invention, in the phase shift device of the eighth aspect, when the distance between the signal line and the ground line is S1 and the distance between the signal line and the ground layer is H1, H1≧3×S1 holds.

[0019] Furthermore, aspect 10 of the present invention is a phase shift device according to any one of aspects 6 to 9, further comprising: a first bend connection portion that electrically connects the second end of the first row to the input transmission line and has a bent shape in a planar view; and a second bend connection portion that electrically connects the second end of the second row to the output transmission line and has a bent shape in a planar view, wherein each of the input transmission line and the output transmission line extends in the intersecting direction.

[0020] According to an eleventh aspect of the present invention, in the phase shift device of any one of the seventh to ninth aspects, the phase shift device further includes a first bend connection portion that electrically connects the second end of the first row to the input transmission line and has a bent shape in a planar view, and a second bend connection portion that electrically connects the second end of the second row to the output transmission line and has a bent shape in a planar view, wherein each of the first bend connection portion and the second bend connection portion has a signal line connection path that is electrically connected to the signal line, and a pair of ground line connection paths that are electrically connected to the pair of ground lines.

[0021] Furthermore, in aspect 12 of the present invention, in the phase shift device of aspect 11, each of the first bend connection portion and the second bend connection portion further has a connection ground layer arranged at least either above or below the signal line connection path and the pair of ground line connection paths, and a connection conductor connecting the pair of ground line connection paths and the connection ground layer.

[0022] Furthermore, in aspect 13 of the present invention, in the phase shift device of aspect 12, when the distance between the signal line connection path and the ground line connection path is S2 and the distance between the signal line connection path and the connection ground layer is H2, H2≧3×S2 holds.

[0023] According to the above aspects of the present invention, it is possible to provide a phase shifting device that is smaller than conventional phase shifting devices and that can achieve desired phase shifting characteristics.

[0024] FIG. 1 is a plan view showing a phase shift device according to an embodiment of the present invention. FIG. 2 is a plan view showing a unit array according to an embodiment of the present invention. FIG. 3 is a plan view showing a digital phase shift circuit according to an embodiment of the present invention. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3. FIG. 5 is a cross-sectional view taken along line V-V in FIG. 3. FIG. 6 is a plan view showing the periphery of a connection portion according to an embodiment of the present invention. FIG. 7 is a plan view showing the periphery of an inlet transmission line, a first bend connection portion, and an input circuit according to an embodiment of the present invention. FIG. 8 is a plan view showing the periphery of an outlet transmission line, a second bend connection portion, and an output matching circuit according to an embodiment of the present invention. FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 7. FIG. 9 is a cross-sectional view taken along line X-X in FIG. 7. FIG. 10 is a diagram showing the connection relationship between power supply wiring and a switch control portion according to an embodiment of the present invention.

[0025] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A phase shifting device according to an embodiment of the present invention will be described below with reference to the drawings.

[0026] <Outline of Phase Shift Device> The phase shift device A according to this embodiment is a high-frequency circuit that receives a high-frequency signal such as a microwave, quasi-millimeter wave, or millimeter wave as input and outputs a high-frequency signal that has been phase-shifted by a predetermined phase amount to the outside.

[0027] 1 is a plan view showing a phase shift device A according to this embodiment. As shown in Fig. 1, the phase shift device A according to this embodiment includes a first row R1, a second row R2, a connection portion 90, an input transmission line 100A, an output transmission line 100B, a first bend connection portion 110A, a second bend connection portion 110B, a power supply wiring 120, a plurality of decoupling capacitors 130, an input circuit 140, an output matching circuit 150, and a first ground plane G1.

[0028] In the phase shift device A according to this embodiment, a high-frequency signal is transmitted through the input transmission line 100A, the first bend connection portion 110A, the input circuit 140, the first column R1 (digital phase shift circuit B １ ~B ｎ ), connection section 90, second column R2 (digital phase shift circuit B １ ~B ｎ ), the output matching circuit 150, the second bend connection portion 110B, and the output matching circuit 150. That is, in the phase shift device A according to this embodiment, a high-frequency signal is input from the input transmission line 100A, and a high-frequency signal that has been phase-shifted by a predetermined phase shift amount is output from the output transmission line 100B.

[0029] The first column R1 and the second column R2 extend parallel to each other. In this embodiment, the first column R1 has a shape obtained by rotating the second column R2 by 180° in a plan view. In this specification, when there is no particular distinction between the first column R1 and the second column R2, each column R1 and R2 may be referred to as a "unit column R." Each unit column R (each column R1 and R2) has a plurality of digital phase shift circuits B for shifting the phase of a high-frequency signal by a predetermined phase shift amount. FIG. 2 is a plan view showing the second column R2 according to this embodiment.

[0030] <Digital Phase Shift Circuit> Fig. 3 is a plan view showing a digital phase shift circuit B according to this embodiment. Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 3. Fig. 5 is a cross-sectional view taken along line V-V in Fig. 3. In the following description, unless otherwise specified, the digital phase shift circuit B belonging to the second column R2 will be described. The digital phase shift circuit B belonging to the first column R1 has a shape obtained by rotating the digital phase shift circuit B belonging to the second column R2 by 180° in plan view.

[0031] 3 , the digital phase shift circuit B includes a signal line 10, a first line 21, a second line 22, an upper pad 24, an upper pad 25, a first ground conductor 31, a second ground conductor 32, and a switch control unit 80 (control circuit). The first line 21 according to this embodiment includes a first parallel line 21p1 and a pair of upper pads 21d1 and 21d2. The second line 22 according to this embodiment includes a second parallel line 22p2, a first intersecting line 22c1, a third parallel line 22p3, a bent line 22b, a second intersecting line 22c2, and a pair of upper pads 22d1 and 22d2. The digital phase shift circuit B of this embodiment also includes four electronic switches 41 to 44, a plurality of connecting conductors 50, a capacitor 60, and a plurality of connecting pads P1 to P4 (see also Figures 4 and 5).

[0032] As shown in Fig. 3, the signal line 10 is a linear strip-shaped conductor extending in one direction. That is, the signal line 10 is a long, plate-like conductor having a constant width, a constant thickness, and a predetermined length. A signal current flows through the signal line 10 from the right side to the left side of the drawing in Fig. 3, that is, from the end on the right side (input end) to the end on the left side (output end). This signal current is a high-frequency signal having a wavelength in the microwave, quasi-millimeter wave, or millimeter wave range described above.

[0033] (Direction Definition) Here, in this embodiment, the longitudinal direction of the signal line 10 (the direction in which the signal line 10 extends) is simply referred to as the longitudinal direction X. In the digital phase shift circuit B belonging to the second column R2, the direction from the input end to the output end of the signal line 10 along the longitudinal direction X is referred to as the +X direction or left. The direction opposite to the left is referred to as the right or −X direction. The direction intersecting (e.g., perpendicular to) the signal line 10 is referred to as the cross direction Y. One direction along the cross direction Y is referred to as the back side or +Y direction. The direction opposite to the back side is referred to as the front side or −Y direction. The direction intersecting (e.g., perpendicular to) both the longitudinal direction X and the cross direction Y is referred to as the up-down direction Z. One direction along the up-down direction Z is referred to as the up or +Z direction. The direction opposite to the up is referred to as the down or −Z direction. A view from the up-down direction Z is referred to as a planar view. The up-down direction Z does not have to coincide with the vertical direction. Furthermore, "up" and "down" do not have to coincide with the upper and lower sides in the vertical direction. Furthermore, instead of defining the +X direction and the -X direction as the left and right, respectively, the +X direction and the -X direction may be defined as the right and left, respectively.

[0034] The signal line 10 electrically has an inductance L1 as a lumped constant circuit element. This inductance L1 is a parasitic inductance whose magnitude depends on the shape of the signal line 10, such as the length of the signal line 10. The signal line 10 also electrically has a capacitance C1 as a lumped constant circuit element. This capacitance C1 is a parasitic capacitance between the signal line 10 and a first parallel line 21p1 (described in detail below), between the signal line 10 and a second parallel line 22p2 (described in detail below), between the signal line 10 and a third parallel line 22p3 (described in detail below), or between the signal line 10 and a silicon substrate (not shown), for example.

[0035] In the following description, one side in the Y direction (+Y side) of the signal line 10 belonging to the second column R2 will be referred to as the first side of the signal line 10, and the other side in the Y direction (-Y side) of the signal line 10 belonging to the second column R2 will be referred to as the second side of the signal line 10. The first parallel line 21p1 is a linear strip-shaped conductor provided on the second side (-Y side) of the signal line 10. The first parallel line 21p1 is a long, plate-shaped conductor having a constant width, a constant thickness, and a predetermined length. The first parallel line 21p1 extends parallel to the signal line 10 (longitudinal direction X). The first parallel line 21p1 and the signal line 10 are spaced apart in the intersecting direction Y. Of the ends of the first parallel line 21p1, the end located on the -X side will be referred to as the first end (one end), and the end located on the +X side will be referred to as the second end (the other end). Of the first parallel lines 21p1, the edge located on the +Y side is referred to as the first edge (one side edge), and the edge located on the -Y side is referred to as the second edge (the other side edge).

[0036] The upper pad 21d1 is a rectangular flat conductor connected to the first end (-X side) of the first parallel line 21p1. The long sides of the upper pad 21d1 extend in the transverse direction Y, and the short sides of the upper pad 21d1 extend in the longitudinal direction X. Of the short sides of the upper pad 21d1, the short side located on the +Y side is referred to as the first short side (one short side), and the short side located on the -Y side is referred to as the second short side (other short side). The first short side (+Y side) of the upper pad 21d1 is located at approximately the same position in the transverse direction Y as the first side edge (+Y side) of the first parallel line 21p1. The second short side (-Y side) of the upper pad 21d1 is located closer to the front (-Y side) than the second side edge (-Y side) of the first parallel line 21p1. That is, the dimension of the upper pad 21d1 in the cross direction Y is larger than the width (dimension in the cross direction Y) of the first parallel line 21p1.

[0037] The upper pad 21d2 is a rectangular flat conductor connected to the second end (+X side) of the first parallel line 21p1. The long sides of the upper pad 21d2 extend in the transverse direction Y, and the short sides of the upper pad 21d2 extend in the longitudinal direction X. Of the short sides of the upper pad 21d2, the short side located on the +Y side is referred to as the first short side (one short side), and the short side located on the -Y side is referred to as the second short side (other short side). The first short side (+Y side) of the upper pad 21d2 is located at approximately the same position in the transverse direction Y as the first side edge (+Y side) of the first parallel line 21p1. The second short side (-Y side) of the upper pad 21d2 is located closer to the front (-Y side) than the second side edge (-Y side) of the first parallel line 21p1. That is, the dimension of the upper pad 21d2 in the cross direction Y is larger than the width (dimension in the cross direction Y) of the first parallel line 21p1.

[0038] The second parallel line 22p2 is a linear strip-shaped conductor provided on a first side (+Y side) of the signal line 10. The second parallel line 22p2 is a long, plate-shaped conductor having a constant width, a constant thickness, and a predetermined length. The second parallel line 22p2 extends parallel to the signal line 10 (longitudinal direction X). The second parallel line 22p2 and the signal line 10 are spaced apart in the cross direction Y. Of the ends of the second parallel line 22p2, the end located on the −X side is referred to as the first end (one end), and the end located on the +X side is referred to as the second end (the other end). Of the side edges of the second parallel line 22p2, the edge located on the +Y side is referred to as the first side edge (one side edge), and the edge located on the −Y side is referred to as the second side edge (the other side edge).

[0039] The second parallel line 22p2 is provided on the opposite side of the signal line 10 from the first parallel line 21p1. In other words, the second parallel line 22p2 is disposed so that the signal line 10 is located between the first parallel line 21p1 and the second parallel line 22p2 in the cross direction Y.

[0040] The upper pad 22d1 is a rectangular flat conductor connected to the first end (-X side) of the second parallel line 22p2. The long sides of the upper pad 22d1 extend in the transverse direction Y, and the short sides of the upper pad 22d1 extend in the longitudinal direction X. Of the short sides of the upper pad 22d1, the short side located on the +Y side is referred to as the first short side (one short side), and the short side located on the -Y side is referred to as the second short side (other short side). The second short side (-Y side) of the upper pad 22d1 is located at approximately the same position in the transverse direction Y as the second side edge (-Y side) of the second parallel line 22p2. The first short side (+Y side) of the upper pad 22d1 is located further back (+Y side) than the first side edge (+Y side) of the second parallel line 22p2. That is, the dimension of the upper pad 22d1 in the cross direction Y is larger than the width (dimension in the cross direction Y) of the second parallel line 22p2.

[0041] The upper pad 22d2 is a rectangular flat conductor connected to the second end (+X side) of the second parallel line 22p2. The long sides of the upper pad 22d2 extend in the transverse direction Y, and the short sides of the upper pad 22d2 extend in the longitudinal direction X. Of the short sides of the upper pad 22d2, the short side located on the +Y side is referred to as the first short side (one short side), and the short side located on the -Y side is referred to as the second short side (other short side). The second short side (-Y side) of the upper pad 22d2 is located at approximately the same position in the transverse direction Y as the second side edge (-Y side) of the second parallel line 22p2. The first short side (+Y side) of the upper pad 22d2 is located further back (+Y side) than the first side edge (+Y side) of the second parallel line 22p2. That is, the dimension of the upper pad 22d2 in the cross direction Y is larger than the width (dimension in the cross direction Y) of the second parallel line 22p2.

[0042] The first crossing line 22c1 is a strip-shaped conductor electrically connected to a first end (-X side) of the second parallel line 22p2. The first crossing line 22c1 has a bend CR1, and the side closer to the second parallel line 22p2 (e.g., closer to the second parallel line 22p2 than the midpoint of the first crossing line 22c1 in the Y direction) has a crank shape. In a plan view, the first crossing line 22c1 extends from the first end (-X side) of the second parallel line 22p2, away from the signal line 10 in the crossing direction Y, bends to the left (+X side) at the bend CR1, and then extends again away from the signal line 10 in the crossing direction Y. The end of the first crossing line 22c1 located on the +Y side is referred to as the first end (one end), and the end located on the -Y side is referred to as the second end (the other end). The second end of the first intersecting line 22c1 is also the second end of a loop line RP (described later).

[0043] The third parallel line 22p3 is a linear strip-shaped conductor connected to the first end (+Y end) of the first intersecting line 22c1. The third parallel line 22p3 is a long, plate-shaped conductor having a constant width, constant thickness, and predetermined length. The third parallel line 22p3 extends from the first end (+Y side) of the first intersecting line 22c1 in a direction parallel to the signal line 10 (longitudinal direction X). That is, in this embodiment, the third parallel line 22p3 extends from the first end (+Y side) of the first intersecting line 22c1 toward the left side (+X side). The length of the third parallel line 22p3 is shorter than the length of the second parallel line 22p2. Of the ends of the third parallel line 22p3, the end located on the +X side is referred to as the first end (one end), and the end located on the -X side is referred to as the second end (the other end).

[0044] The third parallel line 22p3 is provided on the first side (+Y side) of the signal line 10, at a position farther from the signal line 10 than the second parallel line 22p2. In other words, the third parallel line 22p3 is disposed such that the second parallel line 22p2 is located between the signal line 10 and the third parallel line 22p3 in the cross direction Y.

[0045] As shown in Figure 3, in the cross direction Y, the distance D1 between the center line of the second parallel line 22p2 and the center line of the third parallel line 22p3 is greater than the distance D2 between the center line of the second parallel line 22p2 and the far outer edge (the outer edge on the third parallel line 22p3 side) of the first ground conductor 31 (described later).

[0046] The bent line 22b is a strip-shaped conductor connected to the first end (+X side) of the third parallel line 22p3 and having a bend CR. The bent line 22b is composed of a first partial line 22b1 and a second partial line 22b2. The first partial line 22b1 extends from the first end (+X side) of the third parallel line 22p3 toward the signal line 10 in the cross direction Y. The end of the first partial line 22b1 located on the -Y side is referred to as the first end (one end), and the end located on the +Y side is referred to as the second end (the other end). The second partial line 22b2 extends from the first end (-Y side) of the first partial line 22b1 in the longitudinal direction X (left side (+X side)) parallel to the signal line 10. Of the ends of the second line segment 22b2, the end located on the +X side is referred to as the first end (one end), and the end located on the −X side is referred to as the second end (the other end). The line segments 22b1 and 22b2 constituting the bent line 22b are each a long, plate-like conductor having a constant width, a constant thickness, and a predetermined length. The length of the first line segment 22b1 is shorter than the length of the first cross line 22c1. The bent line 22b may have multiple bends CR. In this embodiment, the first end of the second line segment 22b2 is the first end (one end) of the bent line 22b, and the second end of the first line segment 22b1 is the second end (the other end) of the bent line 22b.

[0047] The second crossing line 22c2 is a strip-shaped conductor connected to a first end (+X side) of the second partial line 22b2 constituting the bent line 22b. The second crossing line 22c2 has a bend CR2, and the side closer to the second parallel line 22p2 (e.g., closer to the second parallel line 22p2 than the midpoint of the second crossing line 22c2 in the Y direction) is crank-shaped. In a plan view, the second crossing line 22c2 extends from the first end (+X side) of the partial line 22b2 constituting the bent line 22b toward the signal line 10 in the crossing direction Y, bends to the left (+X side) at the bend CR2, and then extends again toward the signal line 10 in the crossing direction Y. The end of the second crossing line 22c2 located on the −Y side is referred to as the first end (one end), and the end located on the +Y side is referred to as the second end (the other end). The first end of the second intersecting line 22c2 is also the first end of a loop line RP (described later).

[0048] In this embodiment, the first edge (-Y side) of the second intersecting line 22c2 is located at approximately the same position in the intersecting direction Y as the second short sides (-Y side) of the upper pads 22d1 and 22d2 and the second side edge (-Y side) of the second parallel line 22p2. The upper pad 22d2 and the second intersecting line 22c2 are spaced apart from each other in the longitudinal direction X.

[0049] In addition, in this embodiment, a first end (-Y side) of the second cross line 22c2 is constantly electrically connected to a second ground conductor 32 (described later) via a conductor (not shown). In other words, a first end of the loop line RP (described later) is constantly electrically connected to the second ground conductor 32 via a conductor (not shown).

[0050] The first intersecting line 22c1, the third parallel line 22p3, the bent line 22b, and the second intersecting line 22c2 described above form a loop line RP that is convex toward the rear (+Y side). The loop line RP extends so as to at least partially overlap with the second parallel line 22p2 when viewed from the intersecting direction Y. For example, the third parallel line 22p3 according to this embodiment extends in the longitudinal direction X so as to overlap with the second parallel line 22p2 when viewed from the intersecting direction Y.

[0051] The loop line RP is formed on a layer different from the layer on which the signal line 10, the first line 21, the second parallel line 22p2, and the upper pads 22d1, 22d2, 24, and 25 are formed, and the layer on which the first ground conductor 31 and the second ground conductor 32 are formed. For example, the loop line RP is formed on the layer on which the second intermediate pads 71b, 72b, 73b, and 74b (details will be described later) shown in Figures 4 and 5 are formed. The loop line RP may also be formed on the layer on which the third intermediate pads 71c, 72c, 73c, and 74c (details will be described later) shown in Figures 4 and 5 are formed.

[0052] The loop line RP is formed in such a layer in order to make the thickness (cross-sectional area) of the loop line RP smaller than the thickness (cross-sectional area) of the signal line 10, the first line 21, the second parallel line 22p2, and the upper pads 22d1 and 22d2. Generally, in a semiconductor with a multilayer structure, the thickness of the wiring decreases from the surface to the inner layer. Therefore, in this embodiment, the loop line RP is formed in a layer (inner layer) below the layer in which the signal line 10, the first line 21, the second parallel line 22p2, and the upper pads 22d1, 22d2, 24, and 25 are formed, thereby making the thickness (cross-sectional area) of the loop line RP smaller than the thickness (cross-sectional area) of the signal line 10, the first line 21, the second parallel line 22p2, and the upper pads 22d1 and 22d2.

[0053] As will be described in detail later, the thickness of the loop line RP is made smaller than the thicknesses of the signal line 10, the first line 21, the second parallel line 22p2, and the upper pads 22d1 and 22d2 in order to increase the strength of the magnetic field generated by the current (third return current) flowing through the loop line RP and to increase the resistance of the loop line RP. The thickness of the loop line RP is desirably set so that the cross-sectional area of ​​the loop line RP is less than one-fifth the cross-sectional areas of the signal line 10, the first line 21, the second parallel line 22p2, and the upper pads 22d1 and 22d2.

[0054] The upper pad 24 is a rectangular flat conductor similar to the upper pads 21d1 and 21d2 that form part of the first line 21. The long sides of the upper pad 24 extend in the transverse direction Y, and the short sides of the upper pad 24 extend in the longitudinal direction X. Of the short sides of the upper pad 24, the short side located on the +Y side is referred to as the first short side (one short side), and the short side located on the -Y side is referred to as the second short side (other short side). The first short side (+Y side) of the upper pad 24 is located at approximately the same position in the transverse direction Y as the first side edge (+Y side) of the first parallel line 21p1. The second short side (-Y side) of the upper pad 24 is located closer to the front (-Y side) than the second side edge (-Y side) of the first parallel line 21p1. That is, the dimension of the upper pad 24 in the cross direction Y is larger than the width (dimension in the cross direction Y) of the first parallel line 21p1, similar to the upper pads 21d1 and 21d2 that form part of the first line 21. Furthermore, the upper pad 24 is constantly electrically connected to the second ground conductor 32 by a conductor (not shown), similar to the first end (-Y side) of the second intersecting line 22c2.

[0055] The upper pad 25 is a rectangular flat conductor similar to the upper pads 22d1 and 22d2 that form part of the second line 22. The long sides of the upper pad 25 extend in the transverse direction Y, and the short sides of the upper pad 25 extend in the longitudinal direction X. Of the short sides of the upper pad 25, the short side located on the +Y side is referred to as the first short side (one short side), and the short side located on the -Y side is referred to as the second short side (other short side). The second short side (-Y side) of the upper pad 25 is located at approximately the same position in the transverse direction Y as the second side edge (-Y side) of the second parallel line 22p2. The first short side (+Y side) of the upper pad 25 is located further back (+Y side) than the first side edge (+Y side) of the second parallel line 22p2. That is, the dimension of the upper pad 25 in the cross direction Y is larger than the width (dimension in the cross direction Y) of the second parallel line 22p2, similar to the upper pads 22d1 and 22d2 that form part of the second line 22. Furthermore, the upper pad 25 is constantly electrically connected to the second ground conductor 32 by a conductor (not shown), similar to the first end (-Y side) of the second intersecting line 22c2.

[0056] The first ground conductor 31 is a plate-shaped conductor provided on the input end side (−X side) of the signal line 10. The first ground conductor 31 is electrically grounded. The first ground conductor 31 has a rectangular shape with long sides extending in the cross direction Y and short sides extending in the longitudinal direction X. The first ground conductor 31 overlaps the front (−Y side) ends of the upper pads 21d1 and 22d1 and the first cross line 22c1 in the vertical direction Z. As shown in FIG. 4 , the first ground conductor 31 is located below (on the −Z side) the signal line 10, the first line 21 (upper pad 21d1), and the second line 22 (upper pad 22d1). Of the ends of the first ground conductor 31, the end located on the +Y side is referred to as the first end (one end), and the end located on the −Y side is referred to as the second end (the other end).

[0057] The second ground conductor 32 is a plate-shaped conductor provided on the output end side (+X side) of the signal line 10. The second ground conductor 32 is electrically grounded. Although not shown in detail, the second ground conductor 32 is located below (on the −Z side) the signal line 10, the first line 21, the second line 22, and the upper pads 24 and 25.

[0058] 4 , the first connection pad P1 includes the above-described upper pad 21d1, first intermediate pad 71a, second intermediate pad 71b, third intermediate pad 71c, and first ground conductor 31. The upper pad 21d1, first intermediate pad 71a, second intermediate pad 71b, third intermediate pad 71c, and first ground conductor 31 overlap one another in a plan view. The upper pad 21d1, first intermediate pad 71a, second intermediate pad 71b, third intermediate pad 71c, and first ground conductor 31 are aligned in this order from the upper side (+Z side) to the lower side (−Z side), and are spaced apart in the vertical direction Z.

[0059] 4, the upper pad 21d1 and the first intermediate pad 71a are electrically and mechanically connected by a plurality of connecting conductors 50. The first intermediate pad 71a and the second intermediate pad 71b are electrically and mechanically connected by a plurality of connecting conductors 50. The second intermediate pad 71b and the third intermediate pad 71c are electrically and mechanically connected by a plurality of connecting conductors 50. The third intermediate pad 71c and the first ground conductor 31 are electrically and mechanically connected by a plurality of connecting conductors 50. As a result, the first connection pad P1 constantly electrically connects the first end (−X side) of the first parallel line 21p1 and the first ground conductor 31.

[0060] In this specification, the "connection conductor 50" is a conductor that extends in the vertical direction Z and electrically and mechanically connects a member connected to the upper end of the connection conductor 50 with a member connected to the lower end of the connection conductor 50. The connection conductor 50 is, for example, a via that penetrates an insulating layer (not shown) in the vertical direction Z.

[0061] 4 , the second connection pad P2 includes an upper pad 22d1, a first intermediate pad 72a, a second intermediate pad 72b, a third intermediate pad 72c, and a first ground conductor 31. The upper pad 22d1, the first intermediate pad 72a, the second intermediate pad 72b, the third intermediate pad 72c, and the first ground conductor 31 overlap one another in a plan view. The upper pad 22d1, the first intermediate pad 72a, the second intermediate pad 72b, the third intermediate pad 72c, and the first ground conductor 31 are aligned in this order from the upper side (+Z side) to the lower side (−Z side), and are spaced apart in the vertical direction Z.

[0062] 4, the upper pad 22d1 and the first intermediate pad 72a are electrically and mechanically connected by a plurality of connecting conductors 50. The first intermediate pad 72a and the second intermediate pad 72b are electrically and mechanically connected by a plurality of connecting conductors 50. The second intermediate pad 72b and the third intermediate pad 72c are electrically and mechanically connected by a plurality of connecting conductors 50. The third intermediate pad 72c and the first ground conductor 31 are electrically and mechanically connected by a plurality of connecting conductors 50. As a result, the second connection pad P2 constantly electrically connects the first end (−X side) of the second parallel line 22p2 and the first ground conductor 31.

[0063] 4, the near side (-Y side) end of the first intersecting line 22c1 is connected to the second intermediate pad 72b included in the second connection pad P2. As a result, the second connection pad P2 constantly electrically connects the loop line RP and the first ground conductor 31. The near side (-Y side) end of the first intersecting line 22c1 may be connected to the third intermediate pad 72c included in the second connection pad P2.

[0064] 5, the third connection pad P3 includes the upper pad 21d2, the first intermediate pad 73a, the second intermediate pad 73b, the third intermediate pad 73c, and the lower pad 33a. The upper pad 21d2, the first intermediate pad 73a, the second intermediate pad 73b, the third intermediate pad 73c, and the lower pad 33a overlap one another in a plan view. The upper pad 21d2, the first intermediate pad 73a, the second intermediate pad 73b, the third intermediate pad 73c, and the lower pad 33a are aligned in this order from the upper side (+Z side) to the lower side (-Z side) and are spaced apart in the vertical direction Z.

[0065] 3 , the lower pad 33a is a rectangular flat conductor whose long sides extend in the transverse direction Y and whose short sides extend in the longitudinal direction X. The lower pad 33a is provided separately from the second ground conductor 32. The lower pad 33a and the second ground conductor 32 are electrically connected or disconnected depending on the state of a first electronic switch 41 (described later). Therefore, the lower pad 33a is electrically grounded or disconnected depending on the state of the first electronic switch 41.

[0066] 5 , the upper pad 21d2 and the first intermediate pad 73a are electrically and mechanically connected by a plurality of connecting conductors 50. The first intermediate pad 73a and the second intermediate pad 73b are electrically and mechanically connected by a plurality of connecting conductors 50. The second intermediate pad 73b and the third intermediate pad 73c are electrically and mechanically connected by a plurality of connecting conductors 50. The third intermediate pad 73c and the lower pad 33a are electrically and mechanically connected by a plurality of connecting conductors 50. As a result, the third connection pad P3 constantly electrically connects the second end (+X side) of the first parallel line 21p1 and the first electronic switch 41.

[0067] 5, the fourth connection pad P4 includes the upper pad 22d2, the first intermediate pad 74a, the second intermediate pad 74b, the third intermediate pad 74c, and the lower pad 33b. The upper pad 22d2, the first intermediate pad 74a, the second intermediate pad 74b, the third intermediate pad 74c, and the lower pad 33b overlap one another in a plan view. The upper pad 22d2, the first intermediate pad 74a, the second intermediate pad 74b, the third intermediate pad 74c, and the lower pad 33b are aligned in this order from the upper side (+Z side) to the lower side (-Z side) and are spaced apart in the vertical direction Z.

[0068] 3, the lower pad 33b is a rectangular flat conductor whose long sides extend in the transverse direction Y and whose short sides extend in the longitudinal direction X. The lower pad 33b is provided separately from the second ground conductor 32 and the lower pad 33a. The lower pad 33b and the second ground conductor 32 are electrically connected or disconnected depending on the state of a second electronic switch 42 (described below). Therefore, the lower pad 33b is electrically grounded or disconnected depending on the state of the second electronic switch 42.

[0069] 5 , the upper pad 22d2 and the first intermediate pad 74a are electrically and mechanically connected by a plurality of connecting conductors 50. The first intermediate pad 74a and the second intermediate pad 74b are electrically and mechanically connected by a plurality of connecting conductors 50. The second intermediate pad 74b and the third intermediate pad 74c are electrically and mechanically connected by a plurality of connecting conductors 50. The third intermediate pad 74c and the lower pad 33b are electrically and mechanically connected by a plurality of connecting conductors 50. As a result, the fourth connection pad P4 constantly electrically connects the second end (+X side) of the second parallel line 22p2 and the second electronic switch 42.

[0070] 4 , the capacitor 60 is a parallel plate whose upper electrode is connected to the signal line 10 and whose lower electrode is connected to the first ground conductor 31 via the third electronic switch 43. The capacitor 60 has a capacitance Ca corresponding to the opposing area of ​​the parallel plates. In other words, the capacitance Ca is a circuit constant provided between the signal line 10 and the first ground conductor 31. However, the capacitor 60 may also be an interdigital capacitor.

[0071] 3, the first electronic switch 41 is a transistor that opens and closes the lower pad 33a of the third connection pad P3 and the second ground conductor 32. As shown in FIG. 1, the first electronic switch 41 in this embodiment is, for example, a MOS type FET (field effect transistor) with a drain terminal connected to the lower pad 33a of the third connection pad P3, a source terminal connected to the second ground conductor 32, and a gate terminal connected to the switch control unit 80.

[0072] The first electronic switch 41 switches the conduction state between the drain terminal and the source terminal between an open state and a closed state based on a gate signal input to the gate terminal from the switch control unit 80. That is, the first electronic switch 41, by the switch control unit 80, brings the second end (+X side) of the first parallel line 21p1 and the second ground conductor 32 into a conductive state or a cut-off state.

[0073] 3, the second electronic switch 42 is a transistor that opens and closes the lower pad 33b of the fourth connection pad P4 and the second ground conductor 32. As shown in FIG. 1, the second electronic switch 42 in this embodiment is, for example, a MOS type FET, and has a drain terminal connected to the lower pad 33b of the fourth connection pad P4, a source terminal connected to the second ground conductor 32, and a gate terminal connected to the switch control unit 80.

[0074] The second electronic switch 42 switches the conduction state between the drain terminal and the source terminal between an open state and a closed state based on a gate signal input to the gate terminal from the switch control unit 80. That is, the second electronic switch 42 switches the conduction state between the second end (+X side) of the second parallel line 22p2 and the second ground conductor 32 between an open state and a closed state by the switch control unit 80.

[0075] 4, the third electronic switch 43 is a transistor that opens and closes the connection between the lower electrode of the capacitor 60 and the first ground conductor 31. The third electronic switch 43 is, for example, a MOS type FET, and has a drain terminal connected to the lower electrode of the capacitor 60, a source terminal connected to the first ground conductor 31, and a gate terminal connected to the switch control unit 80.

[0076] 4, the third electronic switch 43 is disposed at a position away from the signal line 10 on the rear side (+Y side). The first end (+Y side) of the first ground conductor 31 extends away from the signal line 10 in the cross direction Y and is connected to the third electronic switch 43. The reason for this arrangement is that there are design rule restrictions on the connection of the lower electrode of the capacitor 60 in certain semiconductor manufacturing processes.

[0077] Specifically, this constraint requires that the lower electrode of the capacitor 60 must first be connected to an upper wiring layer (e.g., the layer on which the signal line 10 is formed) via a connecting wire and a via, and then be connected from that wiring layer to a lower wiring layer via a via. Note that FIG. 4 shows a simplified connection path between the lower electrode of the capacitor 60 and the third electronic switch 43. Due to this constraint, the third electronic switch 43 cannot be placed near the position where the capacitor 60 is formed (e.g., the input end (−X side) of the signal line 10 shown in FIG. 3 ), but must be placed at a location farther away from the signal line 10 (+Y side). The first ground conductor 31 extends away from the signal line 10 in the cross direction Y in order to be connected to the source terminal of the third electronic switch 43 placed in this position.

[0078] The third electronic switch 43 switches the conduction state between the drain terminal and the source terminal between an open state and a closed state based on a gate signal input to the gate terminal from the switch control unit 80. In other words, the third electronic switch 43 brings the lower electrode of the capacitor 60 and the first ground conductor 31 into a conductive state or a cut-off state by the switch control unit 80.

[0079] 4 , the fourth electronic switch 44 is a transistor that can freely open and close between the input end (−X side) of the signal line 10 and the first ground conductor 31. Like the above-described first electronic switch 41, second electronic switch 42, and third electronic switch 43, this fourth electronic switch 44 is a MOS-type FET, with a drain terminal connected to the input end (−X side) of the signal line 10, a source terminal connected to the first ground conductor 31, and a gate terminal connected to the switch control unit 80. Note that the fourth electronic switch 44 may be provided between the output end (+X side) of the signal line 10 and the second ground conductor 32, instead of between the input end (−X side) of the signal line 10 and the first ground conductor 31.

[0080] The fourth electronic switch 44 switches the conduction state between the drain terminal and the source terminal between an open state and a closed state based on a gate signal input to the gate terminal from the switch control unit 80. That is, the fourth electronic switch 44 brings the input end side (−X side) of the signal line 10 and the first ground conductor 31 into a conductive state or a cut-off state by the switch control unit 80.

[0081] The switch control unit 80 is a control circuit that controls the above-mentioned first electronic switch 41, second electronic switch 42, third electronic switch 43, and fourth electronic switch 44. The switch control unit 80 has four output ports, and outputs gate signals from each output port to the gate terminals of the first electronic switch 41, second electronic switch 42, third electronic switch 43, and fourth electronic switch 44 individually. That is, the switch control unit 80 opens or closes the first electronic switch 41, second electronic switch 42, third electronic switch 43, and fourth electronic switch 44 according to the gate signals.

[0082] Next, the operation of the digital phase shift circuit B configured as above will be described.

[0083] In the digital phase shift circuit B of this embodiment, the operation mode is switched depending on the conduction states of the first to third electronic switches 41 to 43. That is, the operation modes of the digital phase shift circuit B include a low delay mode in which the first electronic switch 41 and the second electronic switch 42 are set to a closed state and the third electronic switch 43 is set to an open state by the switch control unit 80, and a high delay mode in which the first electronic switch 41 and the second electronic switch 42 are set to an open state and the third electronic switch 43 is set to a closed state by the switch control unit 80.

[0084] In the low delay mode, the switch control unit 80 sets the first electronic switch 41 and the second electronic switch 42 to a closed state and sets the third electronic switch 43 to an open state. That is, in the low delay mode, the first propagation delay time T Ｌ The phase at the output end (left end) is the second phase θ ＨA first phase θ smaller than Ｌ The low latency mode will be explained in more detail below.

[0085] When the first electronic switch 41 is set to a closed state, the second end (+X side) of the first parallel line 21p1 is connected to the second ground conductor 32 via the third connection pad P3 (see FIG. 3). Meanwhile, the first end (-X side) of the first parallel line 21p1 is constantly connected to the first ground conductor 31 via the first connection pad P1 (see FIGS. 3 and 4). Therefore, when the second end (+X side) of the first parallel line 21p1 is connected to the second ground conductor 32 via the first electronic switch 41, a first current path is formed through which a current can flow between the first end (-X side) and the second end (+X side).

[0086] Furthermore, by setting the second electronic switch 42 to a closed state, the second end (+X side) of the second parallel line 22p2 is connected to the second ground conductor 32 via the fourth connection pad P4 (see FIG. 3). Meanwhile, the first end (-X side) of the second parallel line 22p2 is constantly connected to the first ground conductor 31 via the second connection pad P2 (see FIGS. 3 and 4). Therefore, by connecting the second end (+X side) of the second parallel line 22p2 to the second ground conductor 32 via the second electronic switch 42, a second current path is formed through which a current can flow between the first end (-X side) and the second end (+X side).

[0087] When both ends of the first parallel line 21p1 and the second parallel line 22p2 are connected, if a signal current flows from the input end to the output end of the signal line 10, a return current is generated in the first parallel line 21p1 and the second parallel line 22p2 due to the propagation of the signal current. The return current flows through the first parallel line 21p1 and the second parallel line 22p2 from the second end (+X side) to the first end (−X side).

[0088] That is, a first return current flows in the first parallel line 21p1 forming the first current path in the opposite direction to the direction of the signal current due to the flow of the signal current in the signal line 10. Furthermore, a second return current flows in the second parallel line 22p2 forming the second current path in the opposite direction to the direction of the signal current, i.e., in the same direction as the first return current, due to the flow of the signal current in the signal line 10.

[0089] Here, the first return current flowing through the first parallel line 21p1 and the second return current flowing through the second parallel line 22p2 are both opposite to the direction of the signal current. Therefore, the first return current and the second return current act to reduce the overall inductance of the digital phase shift circuit B due to the electromagnetic coupling (mutual induction) between the signal line 10 and the first parallel line 21p1 and the electromagnetic coupling (mutual induction) between the signal line 10 and the second parallel line 22p2. When the inductance of the signal line 10 is reduced to Ls ｌｏｗ , the inductance of the return path (the first parallel line 21p1 and the second parallel line 22p2) is Lg ｌｏｗ , the mutual inductance between the signal line 10 and the return path is M ｌｏｗ The total inductance L of the digital phase shift circuit B in the low delay mode is ｌｏｗ is Ls ｌｏｗ + Lg ｌｏｗ -M ｌｏｗ This becomes:

[0090] As described above, the signal line 10 has a capacitance C1 as a parasitic capacitance. In the low delay mode, the third electronic switch 43 is set to an open state, and therefore the capacitor 60 is not connected between the signal line 10 and the first ground conductor 31. In other words, the capacitance Ca of the capacitor 60 does not affect the high-frequency signal propagating through the signal line 10. Therefore, the high-frequency signal propagating through the signal line 10 has a capacitance C1 (L ｌｏｗ ×C1) １／２ The first propagation delay time T Ｌ is effective.

[0091] The high-frequency signal at the output end of the signal line 10 has a first propagation delay time T Ｌ, the phase of the high frequency signal at the input end of the signal line 10 becomes a first phase θ Ｌ That is, in the low delay mode, the total inductance of the digital phase shift circuit B is delayed by the inductance L ｌｏｗ This reduces the propagation delay time.

[0092] On the other hand, in the high delay mode, the switch control unit 80 sets the first electronic switch 41 and the second electronic switch 42 to an open state, and sets the third electronic switch 43 to a closed state. The fourth electronic switch 44 is set to a closed state. That is, in the high delay mode, the second propagation delay time T Ｈ The phase at the output terminal (left terminal) is the first phase θ Ｌ A second phase θ greater than Ｈ The high latency mode will be explained in more detail below.

[0093] As described above, in the high delay mode, the first electronic switch 41 and the second electronic switch 42 are set to the open state. Therefore, the first conductive path described above is not formed in the first parallel line 21p1, and the second conductive path described above is not formed in the second parallel line 22p2. Therefore, the first return current flowing in the first parallel line 21p1 is extremely small, and the second return current flowing in the second parallel line 22p2 is extremely small.

[0094] In contrast, the near side (-Y side) end of the first intersecting line 22c1, which is part of the loop line RP, is constantly connected to the first ground conductor 31 via the second connection pad P2 (see FIG. 4 ). Furthermore, the first end (-Y side) of the second intersecting line 22c2, which is part of the loop line RP, is constantly connected to the second ground conductor 32, as described above. Therefore, a third current path is formed in advance in the loop line RP, through which a current can flow between the first end (-Y side) of the second intersecting line 22c2 and the near side (-Y side) end of the first intersecting line 22c1. Therefore, in the high delay mode, a third return current flows from the first end (-Y side) of the second intersecting line 22c2 to the near side (-Y side) end of the first intersecting line 22c1 via the bent line 22b and the third parallel line 22p3, due to the signal current in the signal line 10.

[0095] Here, the third return current flows in the third parallel line 22p3 parallel to the signal line 10 and in the partial line 22b2 of the bent line 22b, in a direction opposite to the direction of the signal current flowing in the signal line 10. Furthermore, the first partial line 22b1, the third parallel line 22p3, and the first intersecting line 22c1 of the bent line 22b form a loop line RP that is convex on the opposite side (+Y side) from the signal line 10. Therefore, the inductance of the return path (path through which the third return current flows) can be increased compared to a conventional configuration in which the loop line RP is not formed. Moreover, in this embodiment, the thickness of the loop line RP (the thickness of the first intersecting line 22c1, the third parallel line 22p3, the bent line 22b, and the second intersecting line 22c2) is smaller than the thickness of the signal line 10, the first line 21, the second parallel line 22p2, and the upper pads 22d1 and 22d2.

[0096] This allows the overall inductance of the digital phase shift circuit B to be significantly increased, and a desired phase shift amount can be ensured even at low frequencies where the phase shift amount is small. ｈｉｇｈ , the inductance of the return path (the second intersecting line 22c2, the bent line 22b, the third parallel line 22p3, and the first intersecting line 22c1) is Lg ｈｉｇｈ , the mutual inductance between the signal line 10 and the return path is M ｈｉｇｈIn addition, Ls ｈｉｇｈ = Ls ｌｏｗ The total inductance L of the digital phase shift circuit B in the high delay mode ｈｉｇｈ is Ls ｈｉｇｈ + Lg ｈｉｇｈ -M ｈｉｇｈ Here, it is clear that Lg ｌｏｗ <Lg ｈｉｇｈ and M ｌｏｗ >M ｈｉｇｈ Since this holds, L ｈｉｇｈ >L ｌｏｗ holds true.

[0097] The principle by which the third return current acts to increase the inductance of the return path can be explained as follows. Specifically, the magnetic field generated when the third return current flows through the partial line 22b1 of the bent line 22b, the magnetic field generated when the third return current flows through the third parallel line 22p3, and the magnetic field generated when the third return current flows through the first intersecting line 22c1 all have the same direction (the -Z direction) within the loop line. Therefore, these magnetic fields reinforce each other. Therefore, compared to a conventional configuration in which the line through which the third return current flows does not form a loop line, the magnetic field generated by the third return current can be made larger, thereby increasing the inductance of the return path. Furthermore, the inductance of the return path can be significantly changed by adjusting the height of the loop (i.e., the position of the third parallel line 22p3 in the intersecting direction Y and the lengths of the first intersecting line 22c1 and the first partial line 22b1 of the bent line 22b).

[0098] On the other hand, the signal line 10 has a capacitance C1 as a parasitic capacitance. In addition, in the high delay mode, the third electronic switch 43 is set to a closed state, and therefore the capacitor 60 is connected between the signal line 10 and the first ground conductor 31. That is, the signal line 10 has a capacitance Cb which is the sum of the capacitance Ca of the capacitor 60 and the capacitance C1 (parasitic capacitance). Therefore, the high-frequency signal propagating through the signal line 10 experiences a second propagation delay time T Ｈ is effective.

[0099] The high-frequency signal at the output end of the signal line 10 has a second propagation delay time T Ｈ , the phase of the high frequency signal at the input end of the signal line 10 becomes a second phase θ Ｈ That is, in the high delay mode, the inductance of the transmission system is increased due to the third return current, thereby increasing the propagation delay time.

[0100] In the high delay mode, the fourth electronic switch 44 may be set to a closed state to intentionally increase the loss in the signal line 10. This loss is intended to make the loss of the high frequency signal in the high delay mode the same as the loss of the high frequency signal in the low delay mode.

[0101] <First and Second Columns> As shown in FIGS. 1 and 2, the unit column R (each of columns R1 and R2) according to this embodiment includes a plurality of digital phase shift circuits B (B １ , B ２ , B ３ , ..., B ｎ－１ , B ｎ In the unit array R (each of the arrays R1 and R2) according to this embodiment, a plurality of digital phase shift circuits B (B １ , B ２ , B ３ , ..., B ｎ－１ , B ｎ ) are cascaded in the longitudinal direction X. As shown in FIG. 1, the first row R1 and the second row R2 extend parallel to each other and overlap each other when viewed from the cross direction Y. Of the ends of the unit row R (each row R1, R2), the end located on the −X side is referred to as the first end (one end), and the end located on the +X side is referred to as the second end (the other end).

[0102] The unit string R is the digital phase shift circuit B １ The high frequency signal input from the digital phase shift circuit B ｎ1 and 2, the first electronic switch 41, the second electronic switch 42, and the switch control unit 80 are omitted for clarity. As described above, the first column R1 has a shape obtained by rotating the second column R2 by 180 degrees in a plan view. Therefore, in the following description, unless otherwise specified, only the second column R2 will be described, and the description of the second column R2 will replace the description of the first column R1.

[0103] 2 , the second row R2 is cascaded in the longitudinal direction X so that the first lines 21 are located only on the second side (−Y side) of the signal line 10 and the second lines 22 are located only on the first side (+Y side) of the signal line 10. In other words, the second row R2 is configured such that the loop lines RP are arranged only on the first side (+Y side) of the signal line 10. This configuration is used in order to reduce the size of the unit row R and the phase shift device A.

[0104] In the second column R2 according to this embodiment, the digital phase shift circuit B ｋ (k is an arbitrary natural number satisfying 1≦k≦n−1. The same applies below.) is the digital phase shift circuit B ｋ＋１ In the second column R2 according to this embodiment, the digital phase shift circuit B ｋ＋１ is the digital phase shift circuit B adjacent to the right (-X side). ｋ It can also be said that the connection is such that a part of it penetrates into the other.

[0105] More specifically, in the portion where the digital phase shift circuits are adjacent to each other, the first ground conductor 31 and the second ground conductor 32 are common to each other, a portion of the first intersecting line 22c1 and a portion of the second intersecting line 22c2 are common to each other, the upper pad 21d1 and the upper pad 24 are common to each other, and the upper pad 22d1 and the upper pad 25 are common to each other. ｋ The second ground conductor 32 and the digital phase shift circuit B ｋ＋１ The first ground conductor 31 of the digital phase shift circuit B ｋ a part of the second crossing line 22c2 and the digital phase shift circuit B ｋ＋１A part of the first crossing line 22c1 of the digital phase shift circuit B is shared. ｋ and the upper pad 24 of the digital phase shift circuit B. ｋ＋１ The upper pad 21d1 of the digital phase shift circuit Bk is shared with the upper pad 25 of the digital phase shift circuit B ｋ＋１ The upper pad 22d1 is shared with the upper pad 22d2.

[0106] Therefore, the digital phase shift circuit B ｋ＋１ The first ground conductor 31 of the digital phase shift circuit B ｋ It also functions as the second ground conductor 32 of the digital phase shift circuit B. ｋ＋１ A part of the first crossing line 22c1 is connected to the digital phase shift circuit B ｋ The digital phase shift circuit B also functions as a part of the second crossing line 22c2. ｋ＋１ The upper pad 21d1 of the digital phase shift circuit B ｋ It also functions as the upper pad 24 of the digital phase shift circuit B ｋ＋１ The upper pad 22d1 of the digital phase shift circuit B ｋ It also functions as the upper pad 25 of the

[0107] Here, the first intersecting line 22c1 forming the loop line RP has a bend CR1, with the side closer to the second parallel line 22p2 being crank-shaped. The second intersecting line 22c2 forming the loop line RP has a bend CR2, with the side closer to the second parallel line 22p2 being crank-shaped. Therefore, in a portion where the digital phase-shift circuits B are adjacent to each other, the shared first intersecting line 22c1 and second intersecting line 22c2 extend from the first end (-X side) of the second parallel line 22p2 in the intersecting direction Y, away from the signal line 10, in a plan view, and bend to the left (+X side) at the bend CR1 and to the right (-X side) at the bend CR2, forming a T-shape.

[0108] Such a connection can reduce the reduction in magnetic field caused by mutual interference between adjacent digital phase shift circuits B. As a result, the mutual inductance between adjacent digital phase shift circuits B can be reduced.

[0109] In this way, in the unit string R of this embodiment, as described above, the digital phase shift circuit B １ ~B ｎ In each of the unit arrays R of this embodiment, the line through which the third return current flows forms a loop line RP that is convex on the side opposite to the signal line 10 (the +Y side in the second row R2 and the −Y side in the first row R1), and the thickness (cross-sectional area) of the line through which the third return current flows is smaller than the thickness (cross-sectional area) of the signal line 10, the first line 21, the second parallel line 22p2, and the upper pads 22d1 and 22d2. This significantly improves the efficiency of generating a magnetic field compared to conventional units. Furthermore, as described above, the unit array R of this embodiment can reduce the mutual inductance between adjacent digital phase shift circuits B. This ensures the required amount of phase shift even when the loop line RP is arranged only on the first side of the signal line 10 (the +Y side in the second row R2 and the −Y side in the first row R1).

[0110] In addition, in the unit string R of this embodiment, for example, the digital phase shift circuit B １ When the adjacent digital phase shift circuit is set to the high delay mode, the third return current flows through a path (path PT in the figure) that does not pass through the second connection pad P2. That is, when the adjacent digital phase shift circuit is set to the high delay mode, the third return current flows through a path (path PT in the figure) that does not pass through the second connection pad P2. １ , the third return current flows through a path PT that does not pass through obstacles with high loss, such as the second connection pad P2 and the first ground conductor 31 (second ground conductor 32). Therefore, the unit string R of this embodiment can significantly reduce the loss of high-frequency signals in the high delay mode.

[0111] <Connection Portion> FIG. 6 is a plan view showing the periphery of the connection portion 90 according to this embodiment.

[0112] As shown in FIG. 6, the connection part 90 is connected to the first end of the first column R1 (the digital phase shift circuit B ｎ the end where the digital phase shift circuit B １ The connection part 90 electrically connects the first end of the first column R1 (the end where the digital phase shift circuit B ｎ ) is input to the first end of the second column R2 (digital phase shift circuit B１ The connection portion 90 according to this embodiment has a U-shape that is convex in the longitudinal direction X in a direction away from the rows R1 and R2.

[0113] Specifically, the connection portion 90 according to this embodiment forms a so-called grounded coplanar line, and includes a signal line connection line 91, a pair of ground line connection lines 92a and 92b, a lower ground layer (second ground plane G2), and a plurality of connection conductors 50. The pair of ground line connection lines 92a and 92b are arranged on both sides of the signal line connection line 91 with a gap therebetween. However, the connection portion 90 may also form a so-called coplanar line or a microstrip line.

[0114] The signal line connection path 91 is a long, plate-like conductor having a constant width, a constant thickness, and a predetermined length. The signal line connection path 91 connects the signal line 10 in the first row R1 with the signal line 10 in the second row R2. In the example shown in FIG. 6 , the signal line connection path 91 has a shape consisting of five straight line portions, but the shape of the signal line connection path 91 is not limited to this. For example, the signal line connection path 91 may include four or fewer straight line portions or six or more straight line portions, or may include a curved portion.

[0115] Of the pair of ground line connecting paths 92a, 92b, the first ground line connecting path 92a is a long, plate-shaped conductor having a constant width, a constant thickness, and a predetermined length. The first ground line connecting path 92a extends parallel to the signal line connecting path 91 and is located inside the signal line connecting path 91. The first ground line connecting path 92a is connected to the digital phase shift circuit B of the first column R1. ｎ and the upper pad 24 of the digital phase shift circuit B of the second column R2. １ and the upper pad 21d1 of the

[0116] Of the pair of ground line connecting paths 92a, 92b, the second ground line connecting path 92b is a long, plate-like conductor having a constant width, a constant thickness, and a predetermined length. The second ground line connecting path 92b extends parallel to the signal line connecting path 91 and is positioned outside the signal line connecting path 91. The second ground line connecting path 92b is connected to the digital phase shift circuit B of the first column R1. ｎ and the digital phase shift circuit B of the second column R2.１ and an upper pad 22d1 of the same.

[0117] The second ground plane G2 is a rectangular plate-shaped conductor extending in the longitudinal direction X and the transverse direction Y. The second ground plane G2 is disposed below and spaced a predetermined distance from the signal line connection path 91 and the pair of ground line connection paths 92a, 92b. The second ground plane G2 is connected to the pair of ground line connection paths 92a, 92b via a plurality of connection conductors 50. The plurality of connection conductors 50 are arranged along the first ground line connection path 92a and the second ground line connection path 92b.

[0118] In addition to the above-described lower ground layer (second ground plane G2), the connection portion 90 may also have an upper ground layer disposed above the signal line connection path 91 and the pair of ground line connection paths 92a, 92b at a predetermined distance. That is, the connection portion 90 may have a triplate line structure in which the signal line connection path 91 is sandwiched between two ground layers. Alternatively, the connection portion 90 may have only one of the upper and lower ground layers. That is, it is sufficient that a ground layer is disposed above or below at least one of the signal line connection path 91 and the pair of ground line connection paths 92a, 92b.

[0119] <Input Circuit> FIG. 7 is an enlarged view showing the input transmission line 100A, the first bend connection portion 110A, the input circuit 140, and the surrounding area according to this embodiment.

[0120] As shown in FIG. 7, the input circuit 140 is connected to the second end of the first column R1 (the digital phase shift circuit B １ The input circuit 140 is electrically connected to the second end of the first series R1 (the end where the digital phase shift circuit B is located) and receives the high-frequency signal from the input transmission line 100A via the first bend connection portion 110A. １ )

[0121] Specifically, the input circuit 140 according to this embodiment configures a so-called grounded coplanar line, and includes a signal line 141, a pair of parallel lines 142a and 142b, a ground layer 143 (lower ground layer), and a plurality of connecting conductors 50. The pair of parallel lines 142a and 142b are arranged on both sides of the signal line 141 with a gap therebetween. However, the input circuit 140 may also configure a so-called coplanar line or a microstrip line.

[0122] The signal line 141 is a linear strip-shaped conductor extending in the longitudinal direction X. That is, the signal line 141 is a strip-shaped conductor having a constant width, a constant thickness, and a predetermined length. The signal line 141 is connected to the signal line 10 in the first row R1.

[0123] Of the pair of parallel lines 142a and 142b, the first parallel line 142a is a strip-shaped conductor having a constant width, a constant thickness, and a predetermined length. The parallel line 142a extends parallel to the signal line 141. The parallel line 142a is connected to the digital phase shift circuit B of the first column R1. １ 21d1 has.

[0124] Of the pair of parallel lines 142a and 142b, the second parallel line 142b is a strip-shaped conductor having a constant width, a constant thickness, and a predetermined length. The parallel line 142b extends parallel to the signal line 141. The parallel line 142b is connected to the digital phase shift circuit B in the first column R1. １ 22d1 has.

[0125] The ground layer 143 is a plate-shaped conductor extending in the longitudinal direction X and the transverse direction Y. The ground layer 143 is disposed below the signal line 141 and the pair of parallel lines 142 a, 142 b at a predetermined distance. The ground layer 143 is connected to the pair of parallel lines 142 a, 142 b via a plurality of connecting conductors 50. The plurality of connecting conductors 50 are arranged along the parallel line 142 a and also along the parallel line 142 b.

[0126] In addition to the above-described ground layer 143 (lower ground layer), the input circuit 140 may also have an upper ground layer disposed above the signal line 141 and the pair of parallel lines 142a, 142b at a predetermined distance. That is, the input circuit 140 may have a triplate line structure in which the signal line 141 is sandwiched between two ground layers. Alternatively, the input circuit 140 may have only one of the upper and lower ground layers. That is, it is sufficient that a ground layer is disposed above or below at least one of the signal line 141 and the pair of parallel lines 142a, 142b.

[0127] <Output Matching Circuit> FIG. 8 is an enlarged view showing the periphery of the output transmission line 100B, the second bend connection portion 110B, and the output matching circuit 150 according to this embodiment.

[0128] As shown in FIG. 8, the output matching circuit 150 is connected to the second end of the second column R2 (the digital phase shift circuit B ｎ The output matching circuit 150 is electrically connected to the second end of the second column R2 (the end where the digital phase shift circuit B ｎ ) to the output transmission line 100B via the second bend connection portion 110B.

[0129] The output matching circuit 150 according to this embodiment also serves to match the input / output impedance to a real load. A commonly known method for matching the input / output impedance to a real load is to connect an inductor in series to the output unit. However, in this embodiment, the output unit (the digital phase shift circuit B in the second column R2) ｎ ), and the output transmission line 100B and the first bend connection portion 110A, which are their output destinations, are each composed of multiple conductors. Therefore, it is difficult to connect an inductor, which is a lumped element, in series between them. The output matching circuit 150 according to this embodiment can match the input / output impedance to a real load even in the phase shift device A, in which it is difficult to connect an inductor, which is a lumped element, in series between them.

[0130] Specifically, the output matching circuit 150 according to this embodiment includes a signal line 151 and a return line 152. The return line 152 according to this embodiment includes a cross line 152c1, a parallel line 152p1, a bent line 152b, and a cross line 152c2.

[0131] The signal line 151 is formed, for example, in the same layer as the signal line 10. The return line 152 is formed in a layer different from the layer in which the signal line 151 is formed. For example, the return line 152 is formed in a layer below the layer in which the signal line 151 is formed. However, the signal line 151 and the return line 152 may be formed in the same layer.

[0132] The signal line 151 is a linear strip-shaped conductor extending in the longitudinal direction X. That is, the signal line 151 is a long plate-shaped conductor having a constant width, a constant thickness, and a predetermined length. The signal line 151 is connected to the digital phase shift circuit B in the second row R2. ｎ The signal line 151 is electrically connected to the signal line 10. The width (cross-sectional area) of the signal line 151 is smaller than the width (cross-sectional area) of the signal line 10.

[0133] The crossing line 152c1 is connected to the digital phase shift circuit B of the second column R2. ｎ The crossing line 152c1 is a strip-shaped conductor electrically connected to the upper pad 25 of the digital phase shift circuit B in the second column R2. The crossing line 152c1 has a bent portion CR, and the side closer to the signal line 151 (for example, closer to the signal line 151 than the midpoint of the crossing line 152c1 in the Y direction) has a crank shape. ｎ The crossing line 152c1 extends from the upper pad 25 of the return line 152 in the cross direction Y away from the signal line 151, bends at a bending portion CR in the longitudinal direction X away from the second row R2, and then extends again in the cross direction Y away from the signal line 151. Of the ends of the crossing line 152c1, the end located on the +Y side is referred to as the first end (one end), and the end located on the -Y side is referred to as the second end (the other end). The second end of the crossing line 152c1 is also the second end of the return line 152.

[0134] The parallel line 152p1 is a linear strip-shaped conductor connected to a first end of the intersecting line 152c1 (the end opposite the upper pad 25 in the intersecting direction Y). The parallel line 152p1 is a long, plate-shaped conductor having a constant width, a constant thickness, and a predetermined length. The parallel line 152p1 extends from the first end of the intersecting line 152c1 in a direction parallel to the signal line 151 (longitudinal direction X). That is, in this embodiment, the parallel line 152p1 extends from the first end of the intersecting line 152c1 in the longitudinal direction X so as to move away from the second row R2. The length of the parallel line 152p1 is shorter than the length of the signal line 151. Of the ends of the parallel line 152p1, the end located on the +X side is referred to as the first end (one end), and the end located on the -X side is referred to as the second end (the other end).

[0135] The bent line 152b is a strip-shaped conductor connected to a first end of the parallel line 152p1 (the end opposite the cross line 152c1 in the longitudinal direction X) and having a bent portion CR. The bent line 152b is composed of a first line portion 152b1 and a second line portion 152b2. The first line portion 152b1 extends from the first end of the parallel line 152p1 toward the signal line 151 in the cross direction Y. Of the ends of the first line portion 152b1, the end located on the -Y side is referred to as the first end (one end), and the end located on the +Y side is referred to as the second end (the other end). The second partial line 152b2 extends from a first end of the first partial line 152b1 (the end opposite the parallel line 152p1 in the crossing direction Y) in parallel with the signal line 151, away from the second row R2 in the longitudinal direction X. Of the ends of the second partial line 152b2, the end located on the +X side is referred to as the first end (one end), and the end located on the -X side is referred to as the second end (the other end). The partial lines 152b1 and 152b2 constituting the bent line 152b are each a long, plate-shaped conductor having a constant width, a constant thickness, and a predetermined length. The length of the partial line 152b1 is shorter than the length of the crossing line 152c1. Note that the bent line 152b may have multiple bends CR. In this embodiment, the first end of the second line portion 152b2 is the first end (one end) of the curved line 152b, and the second end of the first line portion 152b1 is the second end (the other end) of the curved line 152b.

[0136] The crossing line 152c2 is a strip-shaped conductor connected to a first end (the end opposite the partial line 152b1 in the longitudinal direction X) of the second partial line 152b2 constituting the bent line 152b. The crossing line 152c2 has a bend CR, and the side closer to the signal line 151 (for example, closer to the signal line 151 than the midpoint of the crossing line 152c2 in the Y direction) is crank-shaped. In a plan view, the crossing line 152c2 extends from the first end of the partial line 152b2 constituting the bent line 152b toward the signal line 151 in the crossing direction Y, bends at the bend CR so as to move away from the second row R2 in the longitudinal direction X, and then extends again toward the signal line 151 in the crossing direction Y. Of the ends of the intersecting line 152c2, the end located on the -Y side is referred to as the first end (one end), and the end located on the +Y side is referred to as the second end (the other end). The first end of the intersecting line 152c2 is also the first end of the return line 152.

[0137] The return line 152 described above forms a loop line that is convex in the crossing direction Y, away from the signal line 151. The shape of the return line 152 corresponds to the shape of the loop line RP of the digital phase shift circuit B. Specifically, the crossing line 152c1 has a shape in which the width (cross-sectional area) of the loop line RP is reduced.

[0138] The shape of the return line 152 can be changed as appropriate. For example, the shape of the return line 152 does not have to correspond to the shape of the loop line RP. Alternatively, the return line 152 does not have to constitute a loop line. In this case, the return line 152 may extend linearly in parallel with the signal line 151.

[0139] <Input Transmission Line and Output Transmission Line> As shown in FIGS. 1 and 7, the input transmission line 100A according to this embodiment is connected to the second end of the first column R1 (the digital phase shift circuit B １The input transmission line 100A extends in the transverse direction Y. The input transmission line 100A serves to transmit a high-frequency signal input from outside the phase shift device A to the interior of the phase shift device A (for example, rows R1 and R2). However, the phase shift device A may not include the first bend connection portion 110A and the input circuit 140, and the input transmission line 100A may be directly connected to the first row R1. In this case, the input transmission line 100A may extend in the longitudinal direction X.

[0140] As shown in FIGS. 1 and 8, the output transmission line 100B according to this embodiment is connected to the second end of the second column R2 (the digital phase shift circuit B ｎ The output transmission line 100B extends in the transverse direction Y. The output transmission line 100B serves to transmit a high-frequency signal that has been phase-shifted inside the phase shift device A (for example, in the rows R1 and R2) to the outside of the phase shift device A. However, the phase shift device A may not include the second bend connection portion 110B and the output matching circuit 150, and the output transmission line 100B may be directly connected to the second row R2. In this case, the output transmission line 100B may extend in the longitudinal direction X.

[0141] As shown in Figures 7 and 8, each of the input transmission line 100A and the output transmission line 100B according to this embodiment constitutes a so-called grounded coplanar line and includes a signal line 101, a pair of ground lines 102a and 102b, a ground layer 103 (lower ground layer), and a plurality of connecting conductors 50. The pair of ground lines 102a and 102b are arranged on both sides of the signal line 101 with a gap therebetween. However, the transmission lines 100A and 100B may also constitute so-called coplanar lines. In this case, the transmission lines 100A and 100B do not necessarily have the ground layer 103 and the connecting conductors 50. Alternatively, the transmission lines 100A and 100B may constitute so-called microstrip lines.

[0142] Fig. 9 is a cross-sectional view taken along line IX-IX shown in Fig. 7. As shown in Fig. 9, the input transmission line 100A according to this embodiment further includes a pair of intermediate conductor layers 104a and 104b. Although not shown in detail, the output transmission line 100B also includes a pair of intermediate conductor layers 104a and 104b, similar to the input transmission line 100A.

[0143] 7 and 8, the signal line 101 is a long, plate-like conductor having a constant width, a constant thickness, and a predetermined length. As shown in Fig. 7, the signal line 101 of the input transmission line 100A is electrically connected to the signal line 10 in the first row R1 via the signal line connecting path 111 (details will be described later) of the first bend connection portion 110A and the signal line 141 of the input circuit 140. As shown in Fig. 8, the signal line 101 of the output transmission line 100B is electrically connected to the signal line 10 in the second row R2 via the signal line connecting path 111 (details will be described later) of the second bend connection portion 110B and the signal line 151 of the output matching circuit 150.

[0144] 7 and 8, the first ground line 102a is a long, plate-like conductor having a constant width, a constant thickness, and a predetermined length. The first ground line 102a extends parallel to the signal line 101 and is located outside the signal line 101 in the longitudinal direction X (farther from the rows R1 and R2).

[0145] 7 and 8, the second ground line 102b is a long, plate-like conductor having a constant width, a constant thickness, and a predetermined length. The second ground line 102b extends parallel to the signal line 101 and is located more inward (closer to rows R1 and R2) than the signal line 101 in the longitudinal direction X.

[0146] 9, the ground layer 103 is disposed below and spaced a predetermined distance from the signal line 101 and the pair of ground lines 102a and 102b. The ground layer 103 functions as the GND for the transmission lines 100A and 100B.

[0147] 9, the first intermediate conductor layer 104a of the pair of intermediate conductor layers 104a, 104b is located between the first ground line 102a and the ground layer 103 in the vertical direction Z. The first intermediate conductor layer 104a is also located at a position spaced a predetermined distance from both the first ground line 102a and the ground layer 103.

[0148] The first ground line 102a and the first intermediate conductor layer 104a are connected by a connecting conductor 50. The first intermediate conductor layer 104a and the ground layer 103 are also connected by the connecting conductor 50. As a result, the ground layer 103 is connected to the first ground line 102a via the connecting conductor 50 and the first intermediate conductor layer 104a. As shown in Figures 7 and 8, the multiple connecting conductors 50 are arranged along the first ground line 102a. Although detailed illustration is omitted, the first intermediate conductor layer 104a extends along the first ground line 102a.

[0149] 9, the second intermediate conductor layer 104b is located between the second ground line 102b and the ground layer 103 in the vertical direction Z. The second intermediate conductor layer 104b is also located at a predetermined distance from both the second ground line 102b and the ground layer 103.

[0150] The second ground line 102b and the second intermediate conductor layer 104b are connected by a connecting conductor 50. The second intermediate conductor layer 104b and the ground layer 103 are also connected by the connecting conductor 50. As a result, the ground layer 103 is connected to the second ground line 102b via the connecting conductor 50 and the second intermediate conductor layer 104b. As shown in Figures 7 and 8, the multiple connecting conductors 50 are arranged along the second ground line 102b. Although detailed illustration is omitted, the second intermediate conductor layer 104b extends along the second ground line 102b.

[0151] Here, in order to achieve good transmission of high-frequency signals in the transmission lines 100A and 100B, it is desirable that a high-frequency current flows between the signal line 101 and the ground lines 102a and 102b, but that a high-frequency current does not flow between the signal line 101 and the ground layer 103. In other words, it is desirable that the distance S1 between the signal line 101 and the ground lines 102a and 102b is sufficiently larger than the distance H1 between the signal line 101 and the ground layer 103. For example, it is desirable that the distances S1 and H1 satisfy the relationship H1≧3×S1.

[0152] In addition to the above-described lower ground layer (ground layer 103), the transmission lines 100A and 100B may also have an upper ground layer located above the signal line 101 and the pair of ground lines 102a and 102b at a predetermined distance. That is, the transmission lines 100A and 100B may have a triplate line structure in which the signal line 101 is sandwiched between two ground layers. Alternatively, the signal line 101 may have only one of the upper and lower ground layers. That is, it is sufficient that a ground layer is located above or below at least one of the signal line 101 and the pair of ground lines 102a and 102b.

[0153] <First Bend Connection Portion and Second Bend Connection Portion> As shown in FIGS. 1 and 7, the first bend connection portion 110A according to this embodiment is connected to the second end of the first column R1 (digital phase shift circuit B １ The first bend connection portion 110A electrically connects the high-frequency signal input from the input transmission line 100A to the second end of the first column R1 (the end where the digital phase shift circuit B １ However, the phase shift device A may not include the input circuit 140, and the first bend connection portion 110A may be directly connected to both the first row R1 and the input transmission line 100A.

[0154] The first bend connection portion 110A according to this embodiment has a bent shape in a plan view. More specifically, the first bend connection portion 110A according to this embodiment extends in the longitudinal direction X away from the first row R1 and the input circuit 140, and then bends in the transverse direction Y away from the center line M (see FIG. 1 ) of the phase shift device A. Note that the "center line M of (the phase shift device A)" is an imaginary line extending in the longitudinal direction X and positioned equidistant from the center line of the signal line 10 in the first row R1 and the center line of the signal line 10 in the second row R2.

[0155] As shown in FIGS. 1 and 8, the second bend connection portion 110B according to this embodiment is connected to the second end of the second column R2 (the digital phase shift circuit B ｎ The second bend connection portion 110B electrically connects the second end of the second column R2 (the end where the digital phase shift circuit B ｎ ) to the output transmission line 100B. However, the phase shift device A may not include the output matching circuit 150, and the second bend connection portion 110B may be directly connected to both the second row R2 and the output transmission line 100B.

[0156] The second bend connection portion 110B according to this embodiment has a bent shape in a plan view. More specifically, the second bend connection portion 110B according to this embodiment extends in a direction away from the second row R2 and the output matching circuit 150 in the longitudinal direction X, and then bends in a direction away from the center line M (see FIG. 1 ) of the phase shift device A in the transverse direction Y.

[0157] 7 and 8 , each of the first bend connection portion 110A and the second bend connection portion 110B according to this embodiment configures a so-called grounded coplanar line and includes a signal line connection line 111, a pair of ground line connection lines 112a and 112b, a connection ground layer 113 (lower ground layer), and a plurality of connection conductors 50. The pair of ground line connection lines 112a and 112b are arranged on both sides of the signal line connection line 111 with a gap therebetween. However, the bend connection portions 110A and 110B may also configure a so-called coplanar line. In this case, the bend connection portions 110A and 110B do not necessarily have the connection ground layer 113 and the connection conductors 50. Alternatively, the bend connection portions 110A and 110B may configure a so-called microstrip line.

[0158] Fig. 10 is a cross-sectional view taken along line X-X in Fig. 7. As shown in Fig. 10, the first bend connection portion 110A according to this embodiment further includes a pair of intermediate conductor layers 114a, 114b. Although not shown in detail, the second bend connection portion 110B also includes a pair of intermediate conductor layers 114a, 114b, similar to the first bend connection portion 110A.

[0159] As shown in FIGS. 7 and 8 , the signal line connection line 111 is a long, plate-like conductor having a constant width, a constant thickness, and a predetermined length. As shown in FIG. 7 , the signal line connection line 111 of the first bend connection portion 110A electrically connects the signal line 10 of the first row R1 to the signal line 101 of the input transmission line 100A via the signal line 141 of the input circuit 140. As shown in FIG. 8 , the signal line connection line 111 of the second bend connection portion 110B electrically connects the signal line 10 of the second row R2 to the signal line 101 of the output transmission line 100B via the signal line 151 of the output matching circuit 150. Note that, although the signal line connection line 111 has a shape consisting of three straight portions in the examples shown in FIGS. 7 and 8 , the shape of the signal line connection line 111 is not limited thereto. For example, the signal line connection line 111 may include two or fewer straight portions or four or more straight portions, or may include a curved portion.

[0160] Of the pair of ground line connecting paths 112a, 112b, the first ground line connecting path 112a is a plate-shaped conductor that extends parallel to the signal line connecting path 111 and is located outside the signal line connecting path 111, as shown in Figures 7 and 8. The first ground line connecting path 112a of the first bend connection portion 110A connects a parallel line 142a of the input circuit 140 to the first ground line 102a of the input transmission line 100A, as shown in Figure 7. The first ground line connecting path 112a of the second bend connection portion 110B is electrically connected to the first ground line 102a of the output transmission line 100B, as shown in Figure 8. Of the ends of the first ground line connection path 112a of the second bend connection portion 110B, the end located opposite the first ground line 102a is called the first end (one end), and the end connected to the first ground line 102a (i.e., located opposite the first end) is called the second end (other end).

[0161] Of the pair of ground line connecting paths 112a, 112b, the second ground line connecting path 112b is a plate-shaped conductor that extends parallel to the signal line connecting path 111 and is located more inward than the signal line connecting path 111, as shown in Figures 7 and 8. The second ground line connecting path 112b of the first bend connection portion 110A connects the parallel line 142b of the input circuit 140 to the second ground line 102b of the input transmission line 100A, as shown in Figure 7. The second ground line connecting path 112b of the second bend connection portion 110B is electrically connected to the second ground line 102b of the output transmission line 100B, as shown in Figure 8. Of the ends of the second ground line connection path 112b of the second bend connection portion 110B, the end located opposite the second ground line 102b is called the first end (one end), and the end connected to the second ground line 102b (i.e., located opposite the first end) is called the second end (other end).

[0162] A pad 115 is provided at a first end (the end opposite to the first ground line 102a) of the first ground line connecting path 112a of the second bend connecting portion 110B. A pad 116 is provided at a first end (the end opposite to the second ground line 102b) of the second ground line connecting path 112b of the second bend connecting portion 110B. The pad 116 electrically connects the return line 152 of the output matching circuit 150 and the second ground line connecting path 112b of the second bend connecting portion 110B.

[0163] 10, the connection ground layer 113 is disposed below and spaced a predetermined distance from the signal line connection path 111 and the pair of ground line connection paths 112a, 112b. The connection ground layer 113 functions as the GND for the bend connection portions 110A, 110B.

[0164] 10 , of the pair of intermediate conductor layers 114a, 114b, the first intermediate conductor layer 114a is located between the first ground line connecting path 112a and the connection ground layer 113 in the vertical direction Z. The first intermediate conductor layer 114a is also located at a predetermined distance from both the first ground line connecting path 112a and the connection ground layer 113.

[0165] The first ground line connecting path 112a and the first intermediate conductor layer 114a are connected by a connecting conductor 50. The first intermediate conductor layer 114a and the connection ground layer 113 are also connected by the connecting conductor 50. As a result, the connection ground layer 113 is connected to the first ground line connecting path 112a via the connecting conductor 50 and the first intermediate conductor layer 114a. As shown in Figures 7 and 8, the multiple connecting conductors 50 are arranged along the first ground line connecting path 112a. Although detailed illustration is omitted, the first intermediate conductor layer 114a extends along the first ground line connecting path 112a.

[0166] 10 , the second intermediate conductor layer 114b is located between the second ground line connecting path 112b and the connection ground layer 113 in the vertical direction Z. The second intermediate conductor layer 114b is also located at a predetermined distance from both the second ground line connecting path 112b and the connection ground layer 113.

[0167] The second ground line connecting path 112b and the second intermediate conductor layer 114b are connected by a connecting conductor 50. The second intermediate conductor layer 114b and the connection ground layer 113 are also connected by the connecting conductor 50. As a result, the connection ground layer 113 is connected to the second ground line connecting path 112b via the connecting conductor 50 and the second intermediate conductor layer 114b. As shown in Figures 7 and 8, the multiple connecting conductors 50 are arranged along the second ground line connecting path 112b. Although detailed illustration is omitted, the second intermediate conductor layer 114b extends along the second ground line connecting path 112b.

[0168] Here, in order to ensure good transmission of high-frequency signals at the bend connection portions 110A and 110B, it is desirable that high-frequency current flows between the signal line connection path 111 and the ground line connection paths 112a and 112b, but that high-frequency current does not flow between the signal line connection path 111 and the connection ground layer 113. In other words, it is desirable that the distance S2 between the signal line connection path 111 and the ground line connection paths 112a and 112b is sufficiently larger than the distance H2 between the signal line connection path 111 and the connection ground layer 113. For example, it is desirable that the relationship H2 ≥ 3 × S2 holds for the distances S2 and H2.

[0169] In addition to the above-described lower ground layer (connection ground layer 113), the bend connection portions 110A and 110B may also have an upper ground layer disposed above the signal line connection path 111 and the pair of ground line connection paths 112a and 112b at a predetermined distance. That is, the bend connection portions 110A and 110B may have a triplate line structure in which the signal line connection path 111 is sandwiched between two ground layers. Alternatively, the signal line connection path 111 may have only one of the upper and lower ground layers. That is, it is sufficient that a ground layer is disposed above or below at least one of the signal line connection path 111 and the pair of ground line connection paths 112a and 112b.

[0170] In this embodiment, the ground layer 103 of the transmission lines 100A and 100B, the connection ground layer 113 of the bend connection portions 110A and 110B, and the ground layer 143 of the input circuit 140 are electrically connected to one another. For example, the ground layer 103, the connection ground layer 113, and the ground layer 143 may be a common layer. In other words, the ground layer 103, the connection ground layer 113, and the ground layer 143 may be the same conductor. Alternatively, the ground layer 103, the connection ground layer 113, and the ground layer 143 may be provided separately from one another and may be electrically connected to one another via conductors such as vias or pads.

[0171] 1 , the first ground plane G1 is a plate-shaped conductor having a recess RC, extending in the longitudinal direction X and the transverse direction Y. In this embodiment, the first ground plane G1 having the recess RC surrounds the first row R1, the second row R2, the connection portion 90, the input circuit 140, and the output matching circuit 150 in a planar view. That is, in this embodiment, the first row R1, the second row R2, the connection portion 90, the input circuit 140, and the output matching circuit 150 are arranged in the recess RC (the region of the recess RC) in a planar view.

[0172] Hereinafter, the portion of the first ground plane G1 that corresponds to the inner edge of the recess RC will be referred to as the "inner edge EA (of the first ground plane G1)," and the portion other than the inner edge EA will be referred to as the "outer edge EB (of the first ground plane G1)." In this embodiment, the inner edge EA includes a pair of first edges E1a, E1b, a pair of second edges E2a, E2b, a pair of third edges E3a, E3b, and a fourth edge E4. In this embodiment, the outer edge EB includes a pair of fifth edges E5a, E5b.

[0173] Each of the pair of first edges E1a, E1b extends in the longitudinal direction X. The pair of first edges E1a, E1b are located outside the first column R1, the second column R2, the input circuit 140, and the output matching circuit 150 in the transverse direction Y. Of the pair of first edges E1a, E1b, one edge E1a faces the input circuit 140 and the first column R1 in the transverse direction Y. Of the pair of first edges E1a, E1b, the other edge E1b faces the output matching circuit 150 and the second column R2 in the transverse direction Y. Of the ends of each edge E1a, E1b, the end located on the −X side is referred to as a first end (one end), and the end located on the +X side is referred to as a second end (the other end).

[0174] Each of the pair of second edges E2a, E2b extends in the transverse direction Y. Of the pair of second edges E2a, E2b, one edge E2a extends from a first end of edge E1a (the end farther from the input transmission line 100A in the longitudinal direction X) toward the center line M in the transverse direction Y. Of the pair of second edges E2a, E2b, the other edge E2b extends from a first end of edge E1b (the end farther from the output transmission line 100B in the longitudinal direction X) toward the center line M in the transverse direction Y. Of the ends of each edge E2a, E2b, the end closer to the center line M is referred to as a first end (one end), and the end farther from the center line M is referred to as a second end (the other end).

[0175] Each of the pair of third edges E3a, E3b extends in the longitudinal direction X. The pair of third edges E3a, E3b are located outside the connection portion 90 in the transverse direction Y. Of the pair of third edges E3a, E3b, one edge E3a extends from a first end of edge E2a (the end closer to the center line M in the transverse direction Y) so as to move away from the input transmission line 100A in the longitudinal direction X. The other edge E3b of the pair of third edges E3a, E3b extends from a first end of edge E2b (the end closer to the center line M in the transverse direction Y) so as to move away from the output transmission line 100B in the longitudinal direction X. Of the ends of each edge E3a, E3b, the end located on the −X side is referred to as a first end (one end), and the end located on the +X side is referred to as a second end (the other end).

[0176] The fourth edge E4 extends in the transverse direction Y. The fourth edge E4 connects first ends of the pair of third edges E3a, E3b (ends farther from the transmission lines 100A, 100B in the longitudinal direction X). The fourth edge E4 and the pair of third edges E3a, E3b extend along the outer edge of the second ground plane G2 (see also FIG. 6 ).

[0177] Each of the pair of fifth edges E5a, E5b extends in the transverse direction Y. Of the pair of fifth edges E5a, E5b, one edge E5a extends from the second end of edge E1a (the end closer to the input transmission line 100A in the longitudinal direction X) so as to move away from the center line M in the transverse direction Y. Of the pair of fifth edges E5a, E5b, the other edge E5b extends from the second end of edge E1b (the end closer to the output transmission line 100B in the longitudinal direction X) so as to move away from the center line M in the transverse direction Y.

[0178] As shown in FIG. 1 , the pair of first edges E1a and E1b are arranged at a predetermined distance in the transverse direction Y from the first column R1, the second column R2, the input circuit 140, and the output matching circuit 150. This prevents the first ground plane G1 from contacting the loop lines RP of the digital phase shift circuits B in the columns R1 and R2. This ensures a wide and stable GND while suppressing the influence of the first ground plane G1 on the phase shift characteristics of each digital phase shift circuit B, thereby achieving the desired phase shift characteristics. Furthermore, because the first ground plane G1 does not contact the return line 152 of the output matching circuit 150, the influence of the first ground plane G1 on the characteristics of the output matching circuit 150 is suppressed.

[0179] Furthermore, no ground plane (plate-shaped ground conductor) is disposed between the first column R1 and the second column R2 in the intersecting direction Y. If a ground plane were disposed between columns R1 and R2, this ground plane could affect the phase shift characteristics of each digital phase shift circuit B. By not disposing a ground plane between columns R1 and R2, such an effect on the phase shift characteristics can be eliminated, and desired phase shift characteristics can be achieved.

[0180] 1 and 6, the pair of third edges E3a, E3b are arranged at a predetermined distance from the second ground plane G2 in the transverse direction Y. The fourth edge E4 is arranged at a predetermined distance from the second ground plane G2 in the longitudinal direction X. As a result, the first ground plane G1 and the second ground plane G2 are not in contact with each other.

[0181] In other words, a slit SL is formed between the first ground plane G1 and the second ground plane G2 (see FIG. 6). The slit SL has a U-shape that is convex in the longitudinal direction X, away from the rows R1 and R2. By providing such a slit SL, high-frequency signals can be transmitted well through the connection portion 90.

[0182] 1 and 7, the edge E5a is in contact with the ground layer 103 of the input transmission line 100A. Similarly, as shown in Figures 1 and 8, the edge E5b is in contact with the ground layer 103 of the output transmission line 100B. Note that, for ease of viewing, the power supply wiring 120 and the decoupling capacitor 130 are not shown in Figures 7 and 8.

[0183] That is, at least a portion of the outer edge EB of the first ground plane G1 is in contact with the ground layer 103 of the transmission lines 100A and 100B. This electrically connects the GND of the input transmission line 100A and the GND of the output transmission line 100B to the first ground plane G1. By electrically connecting the GND of the transmission lines 100A and 100B to the first ground plane G1, the GND of the transmission lines 100A and 100B can be stabilized.

[0184] The GND of the transmission lines 100A and 100B and the first ground plane G1 do not have to be in direct contact with each other, that is, the GND of the transmission lines 100A and 100B and the first ground plane G1 may be connected to each other through a conductor such as a via or a pad.

[0185] <Power Supply Wiring and Decoupling Capacitor> As shown in FIG. 1 , the power supply wiring 120 has a U-shape that is convex in the longitudinal direction X, away from the transmission lines 100A and 100B. The power supply wiring 120 is for supplying power to the switch control units 80 (see FIG. 3 , etc.) of each digital phase shift circuit B. The power supply wiring 120 may be formed on any layer. For example, the power supply wiring 120 may be formed on the layer on which the signal line 10 is formed, or on a layer other than the layer on which the signal line 10 is formed. The power supply wiring 120 according to this embodiment has a pair of parallel portions 121 a and 121 b and a detour portion 122.

[0186] Of the pair of parallel portions 121a, 121b, the first parallel portion 121a is a long, plate-like conductor having a constant width, a constant thickness, and a predetermined length. The first parallel portion 121a extends in the longitudinal direction X along the edge E1a (inner edge EA) of the first ground plane G1. In the illustrated example, the first parallel portion 121a overlaps with the first ground plane G1 (edge ​​E1a) in a planar view. More specifically, the side edge of the first parallel portion 121a on the inner side in the transverse direction Y (the side closer to the center line M) coincides with the edge E1a in a planar view. In the illustrated example, the length (dimension in the longitudinal direction X) of the first parallel portion 121a is equal to the length (dimension in the longitudinal direction X) of the edge E1a. Of the ends of the first parallel portion 121a, the end located on the -X side is referred to as the first end (one end), and the end located on the +X side is referred to as the second end (the other end).

[0187] Of the pair of parallel portions 121a, 121b, the second parallel portion 121b is a long, plate-like conductor having a constant width, constant thickness, and a predetermined length. The second parallel portion 121b extends in the longitudinal direction X along the edge E1b (inner edge EA) of the first ground plane G1. In the illustrated example, the second parallel portion 121b overlaps with the first ground plane G1 (edge ​​E1b) in a planar view. More specifically, the side edge of the second parallel portion 121b on the inner side in the transverse direction Y (the side closer to the center line M) coincides with the edge E1b in a planar view. In the illustrated example, the length (dimension in the longitudinal direction X) of the second parallel portion 121b is equal to the length (dimension in the longitudinal direction X) of the edge E1b. Of the ends of the second parallel portion 121b, the end located on the -X side is referred to as the first end (one end), and the end located on the +X side is referred to as the second end (the other end).

[0188] The detour portion 122 is a long, plate-like conductor having a constant width, a constant thickness, and a predetermined length. The detour portion 122 connects first ends (ends farther from the transmission lines 100A and 100B in the longitudinal direction X) of the pair of parallel portions 121a and 121b. The detour portion 122 has a U-shape that is convex in the longitudinal direction X in a direction away from the transmission lines 100A and 100B. The detour portion 122 does not overlap the connection portion 90 in a plan view and is located outside the connection portion 90. In other words, the detour portion 122 extends so as to detour around the connection portion 90 in a plan view.

[0189] A plurality of decoupling capacitors 130 are provided along each of the parallel portions 121 a and 121 b. Each decoupling capacitor 130 is disposed between the power supply wiring 120 and the first ground plane G1. That is, when the power supply wiring 120 is located above the first ground plane G1, the upper electrode of each decoupling capacitor 130 is connected to the power supply wiring 120, and the lower electrode of each decoupling capacitor 130 is connected to the first ground plane G1.

[0190] In the phase shift device A according to this embodiment, the multiple decoupling capacitors 130 correspond one-to-one to the multiple digital phase shift circuits B. Each decoupling capacitor 130 is provided in a position aligned with the corresponding digital phase shift circuit B in the intersecting direction Y. However, the number and arrangement of the decoupling capacitors 130 can be changed as appropriate.

[0191] In this way, at least a portion (parallel portions 121a, 121b) of the power supply wiring 120 extends along the inner edge EA (first edges E1a, E1b) of the first ground plane G1, which makes it easy to provide a large number of decoupling capacitors 130 between the power supply wiring 120 and the first ground plane G1, thereby realizing a stable power supply wiring 120.

[0192] Furthermore, at least a portion (parallel portions 121a, 121b) of the power supply wiring 120 extends along the inner edge EA (first edges E1a, E1b) of the first ground plane G1, so that the power supply wiring 120 and the first ground plane G1 are close to each other. This shortens the connection path of the decoupling capacitor 130, thereby realizing a stable power supply wiring 120.

[0193] Note that, if it is possible to place the decoupling capacitor 130 between the power supply wiring 120 and the first ground plane G1, the parallel portions 121a, 121b and the first edges E1a, E1b may be misaligned in the cross direction Y. In other words, it is sufficient that the parallel portions 121a, 121b extend parallel to the first edges E1a, E1b in the vicinity of the first edges E1a, E1b.

[0194] Fig. 11 is a diagram showing the connection relationship between the power supply wiring 120 and the switch control unit 80 according to this embodiment. As shown in Fig. 11, the power supply wiring 120 supplies power to the switch control unit 80 via a power supply path 123. Note that as long as the power supply wiring 120 can supply power to the switch control unit 80, the specific form of the power supply path 123 is not particularly limited and can be designed as appropriate.

[0195] 11, a gap GP is formed between two adjacent digital phase shift circuits B in plan view. This is because the digital phase shift circuit B has the bent line 22b described above. Specifically, the gap GP ｋ is the digital phase shift circuit B ｋ and the adjacent digital phase shift circuit B ｋ＋１ and the first intersecting line 22c1 of the ｋ is the digital phase shift circuit B ｋ The bent line 22b and the digital phase shift circuit B ｋ＋１ The first intersecting line 22c1 is the area surrounded by the first intersecting line 22c2.

[0196] And, digital phase shift circuit B ｋ The switch control unit 80 of this gap GP ｋ By disposing the switch control section 80 in the gap GP, the space on the semiconductor substrate can be effectively utilized, and the phase shifting device A can be further miniaturized.

[0197] <Summary> As described above, the phase shift device A according to this embodiment is a first row R1 having a plurality of digital phase shift circuits B, and each of the plurality of digital phase shift circuits B includes a signal line 10, a first line 21 including a first parallel line 21p1 extending parallel to the signal line 10, a second parallel line 22p2 extending parallel to the signal line 10, and a second parallel line 22p2 extending from a first end of the second parallel line 22p2 to near a second end of the second parallel line 22p2 and extending along the longitudinal direction of the signal line 10. a second line 22 including a loop line RP having a convex shape in a direction away from the signal line 10 in a cross direction Y crossing the direction X; a first ground conductor 31 electrically connected to a first end of the first parallel line 21p1 and a first end of the second parallel line 22p2; a second ground conductor 32 connected to a first end of the second line 22; a first electronic switch 41 provided between the second end of the first parallel line 21p1 and the second ground conductor 32; a first column R1 in which the digital phase shift circuits B are cascaded in the longitudinal direction X, the first column R1 having a second electronic switch 42 provided between a second end of the row line 22p2 and the second ground conductor 32, and a control circuit (switch control unit 80) that controls the first electronic switch 41 and the second electronic switch 42, the first column R1 having a first end of the row line 22p2 and a second end of the row line 22p2 and a second end of the row line 22p2 and a control circuit (switch control unit 80) that controls the first electronic switch 41 and the second electronic switch 42, the first column R1 having a first ... second end of the row line 22p2 and a control circuit (switch control unit 80) that controls the first electronic switch 41 and the second electronic switch 42, the signal line 10 being located between the first parallel line 21p1 and the second parallel line 22p2 in each of the digital phase shift circuits B, the digital phase shift circuits B being cascaded in the longitudinal direction X, The digital phase shift circuit has a plurality of cascaded digital phase shift circuits, a second row extending parallel to the first row so as to overlap the first row when viewed from the cross direction, a connection portion electrically connecting a first end of the first row to a first end of the second row, and a first ground plane having a recess and surrounding the first row, the second row, and the connection portion in a plan view, wherein the first ground plane and the loop line are not in contact with each other.

[0198] According to this configuration, the second line 22 of each digital phase shift circuit B includes the loop line RP. Therefore, even if each digital phase shift circuit B is miniaturized, the required phase shift amount can be ensured. Furthermore, by miniaturizing each digital phase shift circuit B, the required phase shift amount can be ensured with only two rows R1 and R2 (i.e., without providing three or more unit rows R), thereby enabling the miniaturization of the phase shift device A. Furthermore, the first ground plane G1 and the loop line RP are not in contact with each other. Therefore, the influence of the first ground plane G1 on the phase shift characteristics of each digital phase shift circuit B is suppressed, and the desired phase shift characteristics can be achieved.

[0199] The phase shift device A according to this embodiment further includes a power supply wiring 120 that is U-shaped in plan view and supplies power to the switch control unit 80, and a decoupling capacitor 130 that is arranged between the first ground plane G1 and the power supply wiring 120, and at least a portion (parallel portions 121 a, 121 b) of the power supply wiring 120 extends along the inner edge EA (first edges E1 a, E1 b) of the recess RC. This configuration enables the realization of a stable power supply wiring 120.

[0200] Furthermore, in each of the plurality of digital phase shift circuits B, the loop line RP includes a first intersecting line 22c1 extending from a first end of the second parallel line 22p2 in the intersecting direction Y away from the signal line 10, a third parallel line 22p3 extending from the first end of the first intersecting line 22c1 parallel to the signal line 10 and having a length shorter than that of the second parallel line 22p2, and a bent line 22b connected to the first end of the third parallel line 22p3 and having a bent portion CR formed thereon, the bent line 22b extending a length shorter than that of the first intersecting line 22c1 so as to approach the signal line 10 in the intersecting direction Y, and then extending parallel to the signal line 10, and in each of the plurality of digital phase shift circuits B, the switch control unit 80 is located in a gap GP formed between the bent line 22b and the first intersecting line 22c1 of an adjacent digital phase shift circuit B in a planar view. This configuration allows for effective use of the space on the semiconductor substrate, and further miniaturization of the phase shifting device A can be achieved.

[0201] The connection portion 90 also has a second ground plane G2, and the first ground plane G1 and the second ground plane G2 are not in contact with each other. This configuration allows for good transmission of high-frequency signals at the connection portion 90.

[0202] Furthermore, no ground plane is disposed between the first column R1 and the second column R2. This configuration eliminates the adverse effect that the ground plane disposed between the columns R1 and R2 has on the phase shift characteristics of each digital phase shift circuit B, thereby achieving the desired phase shift characteristics.

[0203] The phase shift device A according to this embodiment further includes an input transmission line 100A having a GND and electrically connected to the second end of the first row R1, and an output transmission line 100B having a GND and electrically connected to the second end of the second row R2, and the GND of the input transmission line 100A and the GND of the output transmission line 100B are electrically connected to the first ground plane G1. This configuration stabilizes the GND of the transmission lines 100A and 100B.

[0204] Each of the input transmission line 100A and the output transmission line 100B includes a signal line 101 electrically connected to the signal line 10, a pair of ground lines 102a and 102b spaced apart on both sides of the signal line 101, a ground layer 103 disposed above or below the signal line 101 and the pair of ground lines 102a and 102b, and a connecting conductor 50 connecting the pair of ground lines 102a and 102b to the ground layer 103, where S1 is the distance between the signal line 101 and the ground lines 102a and 102b and H1 is the distance between the signal line 101 and the ground layer 103, and H1 ≥ 3 × S1 holds. This configuration allows high-frequency current to flow easily between the signal line 101 and the ground lines 102a and 102b and makes it difficult for high-frequency current to flow between the signal line 101 and the ground layer 103. This allows for good transmission of high-frequency signals through the transmission lines 100A and 100B. Furthermore, by suppressing the outflow of high-frequency current from the signal line 101 to the ground layer 103, it is possible to suppress the outflow of high-frequency current to the first ground plane G1 connected to the ground layer 103. This makes it possible to suppress adverse effects on the phase shift characteristics caused by the outflow of high-frequency current to the first ground plane G1.

[0205] The phase shift device A according to this embodiment further includes a first bend connection portion 110A electrically connecting the second end of the first column R1 to the input transmission line 100A and having a bent shape in a plan view, and a second bend connection portion 110B electrically connecting the second end of the second column R2 to the output transmission line 100B and having a bent shape in a plan view, wherein the input transmission line 100A and the output transmission line 100B each extend in the transverse direction Y. By introducing such bend connection portions 110A and 110B, the transmission lines 100A and 100B can be extended outward in the transverse direction Y from the second ends of the columns R1 and R2, respectively. This makes it possible to suitably apply the phase shift device A according to this embodiment to a semiconductor package in which other circuits connected to the transmission lines 100A and 100B are located on both sides of the columns R1 and R2 in the transverse direction Y.

[0206] Furthermore, each of the first bend connection portion 110A and the second bend connection portion 110B has a signal line connection path 111 electrically connected to the signal line 10, a pair of ground line connection paths 112a, 112b electrically connected to the pair of ground lines 102a, 102b, a connection ground layer 113 arranged at least either above or below the signal line connection path 111 and the pair of ground line connection paths 112a, 112b, and a plurality of connection conductors 50 connecting the pair of ground line connection paths 112a, 112b and the connection ground layer 113, and when the distance between the signal line connection path 111 and the ground line connection paths 112a, 112b is S2 and the distance between the signal line connection path 111 and the connection ground layer 113 is H2, then H2≧3×S2 holds. This configuration allows high-frequency current to flow easily between the signal line connection path 111 and the ground line connection paths 112a, 112b, and makes it difficult for high-frequency current to flow between the signal line connection path 111 and the connection ground layer 113. This allows for good transmission of high-frequency signals at the bend connections 110A, 110B. Furthermore, by suppressing the outflow of high-frequency current from the signal line connection path 111 to the connection ground layer 113, it is also possible to suppress the outflow of high-frequency current to the first ground plane G1 connected to the connection ground layer 113 via the ground layer 103. This suppresses adverse effects on the phase shift characteristics caused by the outflow of high-frequency current to the first ground plane G1.

[0207] <Modifications> The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

[0208] For example, the configuration of the loop line RP of each digital phase shift circuit B can be changed as appropriate. As an example, the loop line RP may be formed in the layer in which the signal line 10 is formed. Also, the cross lines 22c1 and 22c2 may not have the bent portions CR1 and CR2. In this case, the digital phase shift circuit B ｋ The bent line 22b (second partial line 22b2) of the digital phase shift circuit B ｋ＋１ In other words, the digital phase shift circuit B ｋThe second partial line 22b2 and the digital phase shift circuit B ｋ＋１ The first intersecting line 22c1 may be connected in a T-shape to the first intersecting line 22c1. Alternatively, the loop line RP may not have the bent line 22b, and the second intersecting line 22c2 and the third parallel line 22p3 may be directly connected. The loop line RP may be formed across multiple layers. More specifically, the loop line RP may include a first loop line portion formed on a first layer (e.g., a layer on which the signal line 10, etc., are formed) and a second loop line portion formed on a second layer different from the first layer. The first loop line portion and the second loop line portion may be electrically connected via a via or the like. The configuration of the loop line RP is not limited to the above example. The configuration of the loop line RP may be modified as appropriate, as long as it has a loop shape that is convex in the intersecting direction Y away from the signal line 10. Similarly, the configuration of the return line 152 of the output matching circuit 150 may also be modified as appropriate.

[0209] In the above embodiment, the multiple digital phase shift circuits B in each column R1 and R2 are cascaded such that the first line 21 is located only on the second side of the signal line 10 (the −Y side in the second column R2 and the +Y side in the first column R1) and the second line 22 is located only on the first side of the signal line 10 (the +Y side in the second column R2 and the −Y side in the first column R1). However, the cascading configuration is not limited to this. For example, the multiple digital phase shift circuits B may be cascaded such that the second line 22 is alternately positioned on the first side (the +Y side) and the second side (the −Y side) of the signal line 10 as viewed in the longitudinal direction X. More specifically, the digital phase shift circuits B and inverted digital phase shift circuits rB (not shown), which are obtained by inverting the digital phase shift circuits B with respect to the center line of the signal line 10, may be alternately cascaded.

[0210] In addition, it is possible to replace the components in the above-described embodiments with well-known components as appropriate, and the above-described embodiments and variations may be combined as appropriate, without departing from the spirit of the present invention.

[0211] A...Phase shift device R1...First row R2...Second row B...Digital phase shift circuit 10...Signal line 21...First line 21p1...First parallel line 22...Second line RP...Loop line 22p2...Second parallel line 22c1...First crossing line 22p3...Third parallel line 22b...Bent line 31...First ground conductor 32...Second ground conductor 41...First electronic switch 42...Second electronic switch 50...Connecting conductor 80...Switch control unit (control circuit) 90...Connecting portion 100A...Input transmission line 100B...Output transmission line 101...Signal line 102a, 102b...Ground line 103...Ground layer 110A...First bend connection portion 110B...Second bend connection portion 111...Signal line connecting path 112a, 112b... Ground line connection path 113... Connection ground layer 120... Power supply wiring 130... Decoupling capacitor G1... First ground plane RC... Recess EA... Inner edge G2... Second ground plane

Claims

1. A first string having a plurality of digital phase shift circuits, each of the plurality of digital phase shift circuits including a signal line, a first line including a first parallel line extending parallel to the signal line, a second parallel line extending parallel to the signal line, and a second line including a loop-shaped loop line extending from a first end of the second parallel line to near a second end of the second parallel line and having a convex shape in a direction away from the signal line in a cross direction crossing a longitudinal direction of the signal line, and a first end of the first parallel line and a second end of the second parallel line electrically connected to the first end of the first parallel line and the first end of the second parallel line. a first row including a first ground conductor, a second ground conductor connected to a first end of the second line, a first electronic switch provided between a second end of the first parallel line and the second ground conductor, a second electronic switch provided between the second end of the second parallel line and the second ground conductor, and a control circuit for controlling the first electronic switch and the second electronic switch, wherein the signal line is located between the first parallel line and the second parallel line in each of the plurality of digital phase shift circuits, and the plurality of digital phase shift circuits are cascaded in the longitudinal direction; a second row having the plurality of digital phase shift circuits cascaded in the longitudinal direction and extending parallel to the first row so as to overlap with the first row when viewed from the intersecting direction; a connection portion electrically connecting a first end of the first row to a first end of the second row; and a first ground plane having a recess and surrounding the first row, the second row, and the connection portion in a planar view, wherein the first ground plane and the loop line are not in contact with each other.

2. The phase shift device according to claim 1, further comprising: a power supply wiring that is U-shaped in a plan view and supplies power to the control circuit; and a decoupling capacitor that is arranged between the first ground plane and the power supply wiring, wherein at least a portion of the power supply wiring extends along an inner edge of the recess.

3. The phase shifting device according to claim 1 or 2, wherein in each of the plurality of digital phase shifting circuits, the loop line includes a first intersecting line extending from the first end of the second parallel line in the intersecting direction away from the signal line, a third parallel line extending from the first end of the first intersecting line in parallel to the signal line and having a length shorter than that of the second parallel line, and a bent line connected to the first end of the third parallel line and having a bent portion extending shorter than the length of the first intersecting line so as to approach the signal line in the intersecting direction and then extending parallel to the signal line, and wherein in each of the plurality of digital phase shifting circuits, the control circuit is located in a gap formed between the bent line and the first intersecting line of an adjacent digital phase shifting circuit in a planar view.

4. A phase shift device according to claim 1, wherein the connection portion has a second ground plane, and the first ground plane and the second ground plane are not in contact with each other.

5. A phase shifting device according to claim 1, wherein no ground plane is disposed between the first row and the second row.

6. A phase shift device as claimed in any one of claims 1 to 5, further comprising: an input transmission line having a GND and electrically connected to a second end of the first string; and an output transmission line having a GND and electrically connected to a second end of the second string, wherein the GND of the input transmission line and the GND of the output transmission line are electrically connected to the first ground plane.

7. The phase shift device according to claim 6, wherein each of the input transmission line and the output transmission line has a signal line electrically connected to the signal line, and a pair of ground lines arranged on either side of the signal line with a space therebetween.

8. The phase shift device according to claim 7, wherein each of the input transmission line and the output transmission line further comprises a ground layer disposed above and / or below the signal line and the pair of ground lines, and a connecting conductor connecting the pair of ground lines and the ground layer.

9. The phase shift device according to claim 8, wherein when a distance between the signal line and the ground line is S1 and a distance between the signal line and the ground layer is H1, H1≧3×S1 holds.

10. A phase shift device as claimed in any one of claims 6 to 9, further comprising: a first bend connection portion electrically connecting the second end of the first row and the input transmission line and having a bent shape in a planar view; and a second bend connection portion electrically connecting the second end of the second row and the output transmission line and having a bent shape in a planar view, wherein each of the input transmission line and the output transmission line extends in the intersecting direction.

11. A phase shift device as claimed in any one of claims 7 to 9, further comprising: a first bend connection portion electrically connecting the second end of the first row and the input transmission line and having a bent shape in a planar view; and a second bend connection portion electrically connecting the second end of the second row and the output transmission line and having a bent shape in a planar view, wherein each of the first bend connection portion and the second bend connection portion has a signal line connection path electrically connected to the signal line, and a pair of ground line connection paths electrically connected to the pair of ground lines.

12. A phase shift device as described in claim 11, wherein each of the first bend connection portion and the second bend connection portion further includes a connection ground layer arranged at least either above or below the signal line connection path and the pair of ground line connection paths, and a connection conductor connecting the pair of ground line connection paths and the connection ground layer.

13. The phase shift device according to claim 12, wherein when a distance between the signal line connection path and the ground line connection path is S2 and a distance between the signal line connection path and the connection ground layer is H2, H2 ≧ 3 × S2 is satisfied.

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