Display panel and manufacturing method thereof

Abstract

A display panel according to the idea of the present disclosure may comprise a first assembly and a second assembly. The first assembly may comprise: a cover; an inorganic light-emitting element having a light-emitting surface arranged to face the cover; and a conductive adhesive layer provided to cover the cover and the inorganic light-emitting element. The second assembly may comprise: a substrate body; and a driving layer formed on the substrate body and provided to drive the inorganic light-emitting element. The second assembly may be coupled to the first assembly such that the driving layer faces the conductive adhesive layer.

Description

Display panel and manufacturing method thereof

[0001] The present disclosure relates to a display panel including an inorganic light-emitting element and a method for manufacturing the same.

[0002] A display device is a type of output device that visually displays data information such as characters, shapes, and images.

[0003] Micro-LED display panels (hereinafter referred to as micro-LED panels) are composed of multiple inorganic light-emitting diodes (LEDs), each measuring less than 100 micrometers. Micro-LED panels are self-luminous and do not require a backlight. Furthermore, micro-LED panels are resistant to burn-in and boast superior brightness, resolution, power consumption, and durability.

[0004] Micro LED panels can be manufactured by assembling multiple display modules and can have various resolutions and screen sizes. However, boundaries between the multiple display modules may be visible.

[0005] One aspect of the present disclosure provides a display panel with improved optical efficiency and a method for manufacturing the same.

[0006] One aspect of the present disclosure provides a display panel and a method of manufacturing the same, wherein a phenomenon in which a physical boundary is recognized can be prevented.

[0007] One aspect of the present disclosure provides a display panel with improved yield and productivity and a method for manufacturing the same.

[0008] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0009] A display panel according to the invention may include a first assembly including a cover, an inorganic light-emitting element having a light-emitting surface arranged to face the cover, and a conductive adhesive layer provided to cover the cover and the inorganic light-emitting element; and a second assembly including a substrate body and a driving layer formed on the substrate body and provided to drive the inorganic light-emitting element. The second assembly may be coupled to the first assembly such that the driving layer of the second assembly faces the conductive adhesive layer of the first assembly.

[0010] A display panel according to the invention may include a first assembly including a cover, an inorganic light-emitting element disposed on one side of the cover, and a conductive adhesive layer provided to cover the cover and the inorganic light-emitting element; and a plurality of second assemblies, each of which includes a substrate body and a driving layer formed on one side of the substrate body and provided to drive the inorganic light-emitting element. As the plurality of second assemblies are joined to the first assembly, the inorganic light-emitting element and the driving layer may be provided to be electrically connected through the conductive adhesive layer.

[0011] A method for manufacturing a display according to the invention may include manufacturing a first assembly including a cover, an inorganic light-emitting element disposed on one side of the cover, and a conductive adhesive layer provided to cover the cover and the inorganic light-emitting element; and a second assembly including a substrate body and a driving layer formed on one side of the substrate body and provided to drive the inorganic light-emitting element; and combining the first assembly and the second assembly so that the conductive adhesive layer of the first assembly and the driving layer of the second assembly face each other.

[0012] FIG. 1 is a drawing illustrating a display device according to one embodiment.

[0013] FIG. 2 is a diagram illustrating an exploded view of a portion of a display device according to one embodiment.

[0014] FIG. 3 is a diagram illustrating an exploded view of a display panel according to one embodiment.

[0015] FIG. 4 is an enlarged cross-sectional view of a first assembly according to one embodiment.

[0016] FIG. 5 is an enlarged cross-sectional view of a second assembly according to one embodiment.

[0017] FIG. 6 is a drawing illustrating a first assembly and a second assembly being combined according to one embodiment.

[0018] FIG. 7 is an enlarged cross-sectional view showing the first assembly and the second assembly being combined according to one embodiment.

[0019] FIG. 8 is an enlarged cross-sectional view of a display panel according to one embodiment.

[0020] FIG. 9 is a flowchart illustrating a method for manufacturing a display panel according to one embodiment.

[0021] Fig. 10 is a flowchart illustrating a method for manufacturing a display panel according to one embodiment.

[0022] It should be understood that the various embodiments and terms used in this document are not intended to limit the technical features described in this document to specific embodiments, but rather to include various modifications, equivalents, or substitutes of the embodiments.

[0023] In connection with the description of the drawings, similar reference numerals may be used for similar or related components.

[0024] The singular form of a noun corresponding to an item may include one or more of said items, unless the relevant context clearly indicates otherwise.

[0025] In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof.

[0026] The term "and / or" includes any combination of a plurality of related described elements or any one of a plurality of related described elements.

[0027] The terms "part," "module," and "member" may be implemented in hardware or software. Depending on the embodiments, multiple "parts," "modules," or "members" may be implemented as a single component, or a single "part," "module," or "member" may include multiple components.

[0028] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish one component from another and do not qualify the components in any other respect (e.g., importance or order).

[0029] When a component (e.g., a first component) is referred to as being "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0030] The terms "include" or "have" are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in this document, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0031] When a component is said to be “connected,” “coupled,” “supported,” or “in contact with” another component, this includes not only cases where the components are directly connected, coupled, supported, or in contact, but also cases where the components are indirectly connected, coupled, supported, or in contact through a third component.

[0032] When we say that a component is "on" another component, this includes not only cases where the component is in contact with the other component, but also cases where there is another component between the two components.

[0033] Meanwhile, the terms “front”, “back”, “left”, “right”, “up”, “down”, etc. related to directions used in the following description are defined based on the drawing, and the shape and position of each component are not limited by these terms. For example, with respect to the display device (1) illustrated in FIG. 1, the direction in which an image is displayed may be defined as the front (+X direction), and the side opposite to the front may be defined as the rear (-X direction). For example, the front (+X direction) may be substantially the same as the light-emitting direction of a plurality of inorganic light-emitting elements (130).

[0034] Fig. 1 is a drawing illustrating a display device according to one embodiment. Fig. 2 is a drawing illustrating a partial configuration of a display device according to one embodiment.

[0035] Some components of the display device (1), including a plurality of inorganic light-emitting elements (130) in the drawing, are micro-unit components having a size of several μm to several hundred μm, and for convenience of explanation, the scale of some components (e.g., a plurality of inorganic light-emitting elements (130)) is exaggerated.

[0036] A display device (1) is a device that displays information, data, and other information in the form of characters, shapes, graphs, images, etc., and a TV, PC, mobile, digital signage, etc. can be implemented as a display device (1).

[0037] Referring to FIGS. 1 and 2, a display device (1) may include a display panel (10) that displays an image. The display device (1) may include a case (20) that supports the display panel (10). The display device (1) may include a main board (30) that controls the overall operation of the display panel (10). The display device (1) may include a power supply device (not shown) that supplies power to the display panel (10).

[0038] The display panel (10) may be configured to display an image on the front surface. The display panel (10) may include a plurality of inorganic light-emitting elements (130, see FIG. 3). A detailed description of the display panel (10) will be provided below.

[0039] The case (20) can accommodate at least a portion of the display panel (10). The case (20) can cover the back of the display panel (10). The case (20) can be provided to support and / or fix the display panel (10). The case (20) can be installed on the floor via a stand (not shown), or can be installed on a wall via a hanger (not shown). For example, the case (20) can also be provided in the form of an assembly in which a plurality of components are combined.

[0040] For example, the case (20) may include a metal material. Accordingly, heat generated from the display panel (10) can be easily conducted to the case (20), thereby increasing the heat dissipation efficiency of the display device (1).

[0041] The case (20) may be referred to as a chassis, frame, mold, rear cover, etc.

[0042] FIG. 3 is an exploded view of a display panel according to one embodiment. FIG. 4 is an enlarged cross-sectional view of a first assembly according to one embodiment. FIG. 5 is an enlarged cross-sectional view of a second assembly according to one embodiment.

[0043] Referring to FIG. 3, the display panel (10) may include a first assembly (100) and a second assembly (200). The display panel (10) may be formed by combining the first assembly (100) and the second assembly (200). The first assembly (100) and the second assembly (200) may be manufactured separately and then joined together.

[0044] The first assembly (100) may be provided as a single configuration. The first assembly (100) may be provided as a single unit. The second assembly (200) may be provided as a plurality of units. That is, the display panel (10) may include a single first assembly (100) and a plurality of second assemblies (200A-200P). The plurality of second assemblies (200A-200P) may be provided to correspond to the first assembly (100).

[0045] The plurality of second assemblies (200A-200P) may have identical configurations. Accordingly, the description of any one second assembly described below may be equally applied to all other second assemblies.

[0046] Since all of the plurality of second assemblies (200A-200P) are formed identically, each of the plurality of second assemblies (200A-200P) may be referred to as a second assembly (200) hereinafter. That is, to avoid redundant description, the description of each of the plurality of second assemblies (200A-200P) may be described as representing the second assembly (200).

[0047] The first assembly (100) may be referred to as a first plate, a first sheet, a first panel, etc. The second assembly (200) may be referred to as a second plate, a second sheet, a second panel, a second assembly, etc. In addition, since the ordinal numbers “first” and “second” do not limit the configuration, the first assembly (100) may be referred to as a second assembly (100), and the second assembly (200) may be referred to as the first assembly (200).

[0048] Referring to FIG. 4, the first assembly (100) may include a cover (110). The first assembly (100) may include a plurality of inorganic light-emitting elements (130). The first assembly (100) may include a conductive adhesive layer (140). The first assembly (100) may include an element adhesive layer (120).

[0049] The cover (110) may include a first cover surface (111). The first cover surface (111) may form the front surface of the display panel (10). The cover (110) may include a second cover surface (112) formed on an opposite side of the first cover surface (111). The second cover surface (112) may be provided to face a plurality of inorganic light-emitting elements (130). The first cover surface (111) of the cover (110) may be referred to as the front surface (111) of the cover (110), and the second cover surface (112) of the cover (110) may be referred to as the back surface (112) of the cover (110).

[0050] Light emitted from multiple inorganic light-emitting elements (130) is incident on the cover (110) through the second cover surface (112), and light incident on the cover (110) can be emitted to the front outside of the display panel (10) through the first cover surface (111).

[0051] The cover (110) may be provided to cover a plurality of inorganic light-emitting elements (130). The cover (110) may protect the plurality of inorganic light-emitting elements (130). For example, the cover (110) may protect the plurality of inorganic light-emitting elements (130) from external force, external moisture, external foreign substances, etc. As will be described later, when the first assembly (100) and the second assembly (200) are coupled, the cover (110) may protect the second assembly (200). For example, the cover (110) may protect the second assembly (200) from external force, external moisture, external foreign substances, etc.

[0052] The cover (110) can be provided as a base for arranging a plurality of inorganic light-emitting elements (130).

[0053] For example, the cover (110) may include glass. For example, the cover (110) may include a functional film having optical performance. For example, the cover (110) may include multiple layers (not shown). However, the present disclosure is not limited to the examples described above, and the cover (110) may include various materials.

[0054] The plurality of inorganic light-emitting elements (130) may include inorganic light-emitting elements formed of inorganic materials and having sizes of several μm to several tens of μm in width, length, and height, respectively. The inorganic light-emitting element may have a size in which the length of a short side among the width, length, and height is 100 μm or less.

[0055] A plurality of inorganic light-emitting elements (130) may be arranged on one side of the cover (110). The plurality of inorganic light-emitting elements (130) may be arranged on the second cover surface (112) of the cover (110). The plurality of inorganic light-emitting elements (130) may be attached to the second cover surface (112) of the cover (110). The plurality of inorganic light-emitting elements (130) may be transferred to the second cover surface (112) of the cover (110).

[0056] Each of the plurality of inorganic light-emitting elements (130) may include a light-emitting surface (136) from which light is emitted. The light-emitting surface (136) may emit light toward the cover (110). The light-emitting surface (136) may be arranged to face the cover (110). The light-emitting surface (136) may be arranged on one side of the cover (110). The light-emitting surface (136) may be attached to a second cover surface (112) of the cover (110). The light-emitting surface (136) may be attached to the second cover surface (112) of the cover (110) via an element adhesive layer (120).

[0057] Each of the plurality of inorganic light-emitting elements (130) may be a light-emitting structure including a first semiconductor (131), an active layer (133), a second semiconductor (132), a first contact electrode (134), and a second contact electrode (135).

[0058] Below, the structure of one inorganic light-emitting element (130) among multiple inorganic light-emitting elements (130) will be described as an example.

[0059] One of the first semiconductor (131) and the second semiconductor (132) may be an n-type semiconductor, and the other of the first semiconductor (131) and the second semiconductor (132) may be a p-type semiconductor. An active layer (133) may be provided between the first semiconductor (131) and the second semiconductor (132). The first semiconductor (131) may form a light-emitting surface (136).

[0060] Although not shown in the drawing, one of the first contact electrode (134) and the second contact electrode (135) may be electrically connected to the first semiconductor (131), and the other of the first contact electrode (134) and the second contact electrode (135) may be electrically connected to the second semiconductor (132).

[0061] The first contact electrode (134) and the second contact electrode (135) may be formed on the opposite side (138) of the light-emitting surface (136) of the inorganic light-emitting element (130). The first contact electrode (134) and the second contact electrode (135) may be arranged to face in the opposite direction (-X direction) to the direction in which light is irradiated (+X direction). The first contact electrode (134) and the second contact electrode (135) may be arranged to face the rear (-X direction). As will be described later, when the first assembly (100) and the second assembly (200) are combined, the first contact electrode (134) and the second contact electrode (135) may be arranged to face the driving layer (220) of the second assembly (200).

[0062] Accordingly, when light generated from the active layer (133) is irradiated toward the cover (110) through the light-emitting surface (136), the light can be irradiated without interference with the first contact electrode (134) and / or the second contact electrode (135).

[0063] For example, the first contact electrode (134) and the second contact electrode (135) may be in the form of a flip chip that is arranged horizontally and facing the same direction (opposite to the light-emitting direction).

[0064] A plurality of inorganic light-emitting elements (130) may include a red light-emitting element (130a), a green light-emitting element (130b), and a blue light-emitting element (130c). The light-emitting elements (130) may be arranged on the cover (110) as a unit, with a series of red light-emitting elements (130a), green light-emitting elements (130b), and blue light-emitting elements (130c). The series of red light-emitting elements (130a), green light-emitting elements (130b), and blue light-emitting elements (130c) may form one pixel. In this case, the red light-emitting element (130a), the green light-emitting element (130b), and the blue light-emitting element (130c) may each form a sub-pixel.

[0065] The red light emitting element (130a), the green light emitting element (130b), and the blue light emitting element (130c) may be arranged in a row at a predetermined interval as in the embodiment of the present invention, or may be arranged in a different shape, such as a triangular shape.

[0066] The device adhesive layer (120) may be provided between the cover (110) and the inorganic light-emitting element (130). The device adhesive layer (120) may be formed on one side of the cover (110), and a plurality of inorganic light-emitting elements (130) may be attached to the cover (110) through the device adhesive layer (120). In the drawing, the device adhesive layer (120) is illustrated as being formed on the entire second cover surface (112) of the cover (110), but the present disclosure is not limited thereto. The device adhesive layer (120) may also be formed on a part of the second cover surface (112) of the cover (110). In addition, although the device adhesive layer (120) is described as being a separate component from the cover (110), the present disclosure is not limited thereto, and the device adhesive layer (120) may be provided as a component of the cover (110).

[0067] A conductive adhesive layer (140) may be provided to cover the cover (110). The conductive adhesive layer (140) may be provided to cover the second cover surface (120) of the cover (110).

[0068] The conductive adhesive layer (140) may be provided to cover a plurality of inorganic light-emitting elements (130). The conductive adhesive layer (140) may be provided to cover a first contact electrode (134) and a second contact electrode (135) of each of the plurality of inorganic light-emitting elements (130). The conductive adhesive layer (140) may be provided to cover a side surface (137) of each of the plurality of inorganic light-emitting elements (130). The conductive adhesive layer (140) may be provided to cover an opposite side (138) of a light-emitting surface (136) of each of the plurality of inorganic light-emitting elements (130).

[0069] The conductive adhesive layer (140) may be provided to cover the element adhesive layer (112).

[0070] The conductive adhesive layer (140) can electrically connect the first assembly (100) and the second assembly (200). The conductive adhesive layer (140) can bond the first assembly (100) and the second assembly (200).

[0071] For example, the conductive adhesive layer (140) may have adhesive properties when at least one of heat or light is applied.

[0072] For example, the conductive adhesive layer (140) may have a structure in which an anisotropic conductive adhesive is attached on a protective film and conductive balls (141) are dispersed in an adhesive resin (142). The conductive balls (141) are conductive spheres surrounded by a thin insulating film, and when the insulating film is broken by pressure, the conductors can be electrically connected to each other.

[0073] For example, the conductive adhesive layer (140) may be provided as an anisotropic conductive film (ACF) in the form of a film. For example, the conductive adhesive layer (140) may be provided as an anisotropic conductive paste (ACP) in the form of a paste.

[0074] However, the present disclosure is not limited to the above-described examples, and the first assembly (100) and the second assembly (200) may be joined through metal bonding, and for this purpose, the conductive adhesive layer (140) may have a metal material. For example, the first assembly (100) and the second assembly (200) may be joined through a eutectic bonding method, and the conductive adhesive layer (140) may include a metal thin film having a low melting point and may form an intermetallic compound during the joining process of the first assembly (100) and the second assembly (200).

[0075] Referring to FIG. 5, the second assembly (200) may include a substrate body (210). The second assembly (200) may include a driving layer (220). The second assembly (200) may include pad electrodes (241, 242) corresponding to the contact electrodes (134, 135) of the first assembly (100). As described above, the description of the second assembly (200) may of course be applied to each of a plurality of second assemblies (200A-200P).

[0076] The second assembly (200) may be electrically connected to the first assembly (100). The second assembly (200) may be arranged to drive the first assembly (100).

[0077] For example, the second assembly (200) may be provided with at least one of a TFT substrate, a PCB substrate, and a CMOS substrate. For example, the second assembly (200) may be provided with at least one of a PM (Passive Matrix) type substrate using a TGV (Through Glass Via) process, a TFT substrate using a TGV (Through Glass Via) process, and a substrate including a Micro Pixel IC.

[0078] The substrate body (210) may include a mounting surface (211). The substrate body (210) may include a rear surface (212) formed on the opposite side of the mounting surface (211). The rear surface of the substrate body (210) may form the rear surface of the display panel (10).

[0079] The substrate body (210) may include a glass substrate. The second assembly (200) may include a COG (Chip on Glass) type substrate. However, the present disclosure is not limited thereto. For example, the substrate body (210) may be formed of a silicon wafer.

[0080] The driving layer (220) may be provided to drive a plurality of inorganic light-emitting elements (130). The driving layer (220) may be formed on the substrate body (210). The driving layer (220) may be formed on one side of the substrate body (210). The driving layer (220) may be formed on the mounting surface (211) of the substrate body (210).

[0081] For example, the driving layer (220) may include a TFT (Thin Film Transistor). For example, the driving layer (220) may include at least one of an LTPS (Low Temperature Poly Silicon) TFT, an oxide TFT, an amorphous-silicon TFT, a zinc oxide TFT, an organic TFT, and a graphene TFT. However, the present disclosure is not limited to the above-described examples, and the TFT constituting the driving layer (220) is not limited to a specific structure or type and may be configured in various embodiments. When the driving layer (220) includes a TFT, the driving layer (220) may be referred to as a TFT layer (220).

[0082] In addition, when the substrate body (210) is made of a silicon wafer, the driving layer (220) can be replaced with a CMOS (Complementary Metal-Oxide Semiconductor) type or n-type MOSFET or p-type MOSFET transistor.

[0083] The second assembly (200) may include a first pad electrode (241) and a second pad electrode (242). The first pad electrode (241) and the second pad electrode (242) may be arranged to correspond to the first contact electrode (134) and the second contact electrode (135), respectively. The first pad electrode (241) and the second pad electrode (242) may electrically connect the inorganic light emitting element (130) and the driving layer (220).

[0084] As will be described later, when the first assembly (100) and the second assembly (200) are combined, the first pad electrode (241) and the second pad electrode (242) can be positioned so as to face the first assembly (100). When the first assembly (100) and the second assembly (200) are combined, the first pad electrode (241) and the second pad electrode (242) can be exposed toward the first assembly (100).

[0085] The second assembly (200) may further include a light absorbing layer (230) to absorb external light and improve contrast. The light absorbing layer (230) may be formed on the mounting surface (211) of the second assembly (200). The light absorbing layer (230) may be formed on the driving layer (220).

[0086] Meanwhile, the first assembly (100) may be referred to as a weapon light emitting element substrate (100), and the second assembly (200) may be referred to as a backplane substrate (200).

[0087] FIG. 6 is a drawing illustrating a first assembly and a second assembly being combined according to one embodiment. FIG. 7 is an enlarged cross-sectional view illustrating a first assembly and a second assembly being combined according to one embodiment. FIG. 8 is an enlarged cross-sectional view illustrating a display panel according to one embodiment.

[0088] Referring to FIGS. 6 to 8, a plurality of second assemblies (200A-200P) may be arranged to be coupled to a single first assembly (100). The plurality of second assemblies (200A-200P) may be modularized and tiled to a single first assembly (100).

[0089] For example, each of the plurality of second assemblies (200A-200P) may be separately coupled to one first assembly (100), the plurality of second assemblies (200A-200P) may be coupled to one first assembly (100) in groups, or the plurality of second assemblies (200A-200P) may be coupled to one first assembly (100) as a whole. That is, the plurality of second assemblies (200A-200P) may be coupled to the first assembly (100) in various ways.

[0090] A plurality of second assemblies (200A-200P) may correspond to one first assembly (100). The sizes of the plurality of second assemblies (200A-200P) may be arranged to correspond to the size of one first assembly (100). The size of any one of the second assemblies (200A-200P) may be smaller than the size of the first assembly (100). The size of each of the plurality of second assemblies (200A-200P) may be smaller than the size of the first assembly (100).

[0091] A plurality of second assemblies (200A-200P) can be arranged vertically, horizontally, and adjacent to each other. A plurality of second assemblies (200A-200P) can be arranged in a matrix form of M * N in the first assembly (100). In the present embodiment, 16 of the plurality of second assemblies (200A-200P) are provided and arranged in a matrix form of 4 * 4, but there is no limitation on the number and arrangement method of the plurality of second assemblies (200A-200P).

[0092] The first assembly (100) may be formed in a quadrangle type. The plurality of second assemblies (200A-200P) may be provided in a quadrangle shape, respectively, to correspond to the first assembly (100). The first assembly (100) may be provided in a rectangular shape or a square shape. The plurality of second assemblies (200A-200P) may be provided in a rectangular shape or a square shape, respectively.

[0093] In related technologies, display panels typically include multiple display modules. Each of the multiple display modules includes a substrate and multiple inorganic light-emitting elements mounted on the substrate, and the display panel is manufactured by assembling the multiple display modules. However, perfectly aligning the spacing between the multiple display modules is very difficult. Furthermore, the physical seams between the multiple display modules can be visually visible, and the luminance differences between the screens of the multiple display modules can be significant. Performing image quality compensation to reduce the luminance differences between the screens can deteriorate the substrate. Static electricity can be generated during the assembly of the multiple display modules, and the substrate can be damaged by the static electricity. If even one of the assembled display modules is defective, the entire assembly may be scrapped. Removing a defective element after mounting multiple inorganic light-emitting elements on the substrate can also damage the substrate. Ultimately, manufacturing and repairing the display panel is difficult, and costs can increase accordingly.

[0094] In contrast, according to the present disclosure, the display panel (10) can be formed by combining a plurality of second assemblies (200A-200P) into a single first assembly (100). That is, since the first assembly (100) is provided as a single configuration, a physical seam may not be visible to the eye. The plurality of inorganic light-emitting elements (130) can emit light toward the cover (110) as a single configuration, and the display panel (10) can have uniform brightness as a single screen. That is, the light efficiency of the display panel (10) can be improved. In addition, the first assembly (100) and the second assembly (200) can be manufactured separately. Since the first assembly (100) and the second assembly (200) are manufactured separately and then joined, the process of assembling the plurality of display modules can be omitted. As a result, the time and cost invested in manufacturing the display panel (10) can be reduced. Furthermore, damage to the backplane substrate can be prevented by preventing / reducing the generation of static electricity. Meanwhile, since the first assembly (100) and the second assembly (200) are bonded after confirming normal operation, the defect rate and scrap rate of the display panel (10) can be significantly reduced. In other words, the yield and productivity of the display panel (10) can be improved.

[0095] Referring to FIGS. 7 and 8, the second assembly (200) can be coupled to the first assembly (100) such that the driving layer (220) of the second assembly faces the conductive adhesive layer (140) of the first assembly (100). The conductive adhesive layer (140) of the first assembly (100) and the driving layer (220) of the second assembly (200) can be arranged to face each other.

[0096] When the second assembly (200) is coupled to the first assembly (100), the first contact electrode (134) and the second contact electrode (135) of the first assembly (100) may be arranged to face the driving layer (220) of the second assembly (200). When the second assembly (200) is coupled to the first assembly (100), the first pad electrode (241) and the second pad electrode (242) of the second assembly (200) may be arranged to face the conductive adhesive layer (140) of the first assembly (100). When the second assembly (200) is coupled to the first assembly (100), the first pad electrode (241) and the second pad electrode (242) of the second assembly (200) may be exposed toward the conductive adhesive layer (140) of the first assembly (100).

[0097] The first assembly (100) and the second assembly (200) can be coupled after being aligned with each other. For example, the cover (110) of the first assembly (100) can include a first alignment key (113). For example, the substrate body (210) of the second assembly (200) can include a second alignment key (213). When the first alignment key (113) and the second alignment key (213) are aligned, the second assembly (200) can be coupled to the first assembly (100). Here, the alignment key can mean a type of identifiable pattern, mark, etc.

[0098] The inorganic light-emitting element (130) of the first assembly (100) and the driving layer (220) of the second assembly (200) can be electrically connected through the conductive adhesive layer (140) of the first assembly (100). For example, the conductive adhesive layer (140) can bond the inorganic light-emitting element (130) and the driving layer (220) by applying heat and / or light.

[0099] The first pad electrode (241) and the second pad electrode (242) of the second assembly (200) may be provided to correspond to the first contact electrode (134) and the second contact electrode (135) of the first assembly (100), respectively. The first pad electrode (241) may be electrically connected to the first contact electrode (134) through the conductive adhesive layer (140). The first contact electrode (134) may be electrically connected to the driving layer (220) through the first pad electrode (241). The second pad electrode (242) may be electrically connected to the second contact electrode (135) through the conductive adhesive layer (140). The second contact electrode (135) may be electrically connected to the driving layer (220) through the second pad electrode (242).

[0100] FIG. 9 is a flowchart illustrating a method for manufacturing a display panel according to one embodiment. FIG. 10 is a flowchart illustrating a method for manufacturing a display panel according to one embodiment.

[0101] Referring to FIG. 9, a method for manufacturing a display panel (10) according to one embodiment may include manufacturing a first assembly (100) and a second assembly (200), respectively (1000), and combining the first assembly (100) and the second assembly (200) (2000).

[0102] The first assembly (100) can be manufactured by arranging a plurality of inorganic light-emitting elements (130) on a cover (110), and arranging a conductive adhesive layer (140) to cover the cover (110) and the plurality of inorganic light-emitting elements (130). For example, the first assembly (100) can be manufactured by forming an element adhesive layer (120) on the cover (110), attaching the plurality of inorganic light-emitting elements (130) to the element adhesive layer (120) so that the light-emitting surfaces (136) of the plurality of inorganic light-emitting elements (130) face the cover (110), and attaching a conductive adhesive layer (140) to cover the cover (110), the element adhesive layer (120), and the plurality of inorganic light-emitting elements (130).

[0103] The second assembly (200) can be manufactured by forming a driving layer (220) on a substrate body (210). For example, when the second assembly (200) is provided as a TFT substrate, the second assembly (200) can be manufactured by forming a TFT layer on a glass substrate through a display process.

[0104] In addition, the method for manufacturing a display panel (10) according to one embodiment may further include sealing (3000) the sides of the combined first assembly (100) and second assembly (200). That is, when the second assembly (200) is combined with the first assembly (100), each side (11, 12, 13, 14, see FIG. 2) of the display panel (10) may be provided to be sealed. Accordingly, after the first assembly (100) and the second assembly (200) are joined, the influence of the external environment on the display panel (10) can be minimized. By sealing the sides of the combined first assembly (100) and second assembly (200), the configuration of the display panel (10), such as the plurality of inorganic light emitting elements (130), the substrate body (210), and the driving layer (220), can be protected from external impact, moisture, foreign substances, etc.

[0105] As described above, the first assembly (100) may be provided as one, the second assemblies (200) may be provided as multiple, and the multiple second assemblies (200) may be arranged to correspond to one first assembly (100).

[0106] Referring to FIG. 10, coupling the first assembly (100) and the second assembly (200) (2000) may include aligning the first assembly (100) and the second assembly (200) (2100). By using the first alignment key (113, see FIGS. 7 and 8) of the first assembly (100) and the second alignment key (213, see FIGS. 7 and 8) of the second assembly (200), the second assembly (200) may be aligned to the first assembly (100).

[0107] Referring to FIG. 10, combining the first assembly (100) and the second assembly (200) (2000) may include applying heat and / or light to the conductive adhesive layer (140) to bond the first assembly (100) and the second assembly (200) (2200). By applying at least one of heat and light to the conductive adhesive layer (140), the conductive adhesive layer (140) may electrically connect the inorganic light-emitting element (130) of the first assembly (100) and the driving layer (220) of the second assembly (200). The contact electrodes (134, 135) of the first assembly (100) and the pad electrodes (241, 242) of the second assembly (200) may correspond to each other.

[0108] According to one embodiment of the present disclosure, a display panel (10) may include a first assembly (100) including a cover (110), an inorganic light-emitting element (130) having a light-emitting surface (136) arranged to face the cover, and a conductive adhesive layer (140) provided to cover the cover and the inorganic light-emitting element; and a second assembly (200) including a substrate body (210) and a driving layer (220) formed on the substrate body and provided to drive the inorganic light-emitting element. The second assembly (200) may be coupled to the first assembly (100) such that the driving layer (220) of the second assembly (200) faces the conductive adhesive layer (140) of the first assembly (100).

[0109] According to one embodiment of the present disclosure, the first assembly (100) may be provided as one, and the second assemblies (200) may be provided as a plurality. The plurality of second assemblies may be provided to correspond to the first assembly.

[0110] According to one embodiment of the present disclosure, the plurality of second assemblies may be arranged in a matrix form in the first assembly.

[0111] According to one embodiment of the present disclosure, the size of the second assembly may be smaller than the size of the first assembly.

[0112] According to one embodiment of the present disclosure, the first assembly and the second assembly can be manufactured separately.

[0113] According to one embodiment of the present disclosure, when at least one of heat or light is applied to the conductive adhesive layer (140), the conductive adhesive layer (140) may be arranged to electrically connect the driving layer (220) and the inorganic light-emitting element (130).

[0114] According to one embodiment of the present disclosure, the first assembly (100) may include a contact electrode (134, 135) formed on the opposite side of the light-emitting surface of the inorganic light-emitting element, and the second assembly (200) may include a pad electrode (241, 242) provided to correspond to the contact electrode (134, 135).

[0115] According to one embodiment of the present disclosure, the first assembly may include an element adhesive layer (120) provided between the cover (110) and the inorganic light-emitting element (130).

[0116] According to one embodiment of the present disclosure, when the second assembly (200) is coupled to the first assembly (100), each side (11, 12, 13, 14) of the display panel may be provided to be sealed.

[0117] According to one embodiment of the present disclosure, the cover (110) of the first assembly (100) may include a first alignment key (113). The substrate body (210) of the second assembly (200) may include a second alignment key (213). The second assembly is a display panel coupled to the first assembly while the first alignment key and the second alignment key are aligned.

[0118] According to one embodiment of the present disclosure, the cover (110) may be provided to protect the inorganic light-emitting element (130). The cover (110) may include glass.

[0119] According to one embodiment of the present disclosure, the second assembly (200) may be provided with at least one of a TFT substrate, a PCB substrate, and a CMOS substrate.

[0120] According to one embodiment of the present disclosure, the substrate body (210) may include a glass substrate. The driving layer (220) may include at least one of a low temperature poly silicon (LTPS) TFT, an oxide TFT, an amorphous-silicon TFT, a zinc oxide TFT, an organic TFT, and a graphene TFT.

[0121] According to one embodiment of the present disclosure, a display panel (10) may include a first assembly (100) including a cover (110), an inorganic light-emitting element (130) disposed on one side of the cover, and a conductive adhesive layer (140) provided to cover the cover and the inorganic light-emitting element; and a plurality of second assemblies (200), each of which includes a substrate body (210) and a driving layer (220) formed on one side of the substrate body and provided to drive the inorganic light-emitting element. As the plurality of second assemblies are joined to the first assembly, the inorganic light-emitting element (130) and the driving layer (220) may be provided to be electrically connected through the conductive adhesive layer (140).

[0122] According to one embodiment of the present disclosure, the inorganic light-emitting element (130) may include a light-emitting surface (136) that emits light toward the cover. According to one embodiment of the present disclosure, the inorganic light-emitting element (130) may include a contact electrode (134, 135) formed on an opposite side of the light-emitting surface and arranged to face the driving layer.

[0123] According to one embodiment of the present disclosure, a method for manufacturing a display panel (10) may include manufacturing (1000) a first assembly (100) including a cover (110), an inorganic light-emitting element (130) disposed on one side of the cover, and a conductive adhesive layer (140) provided to cover the cover and the inorganic light-emitting element; and a second assembly (200) including a substrate body (210) and a driving layer (220) formed on one side of the substrate body and provided to drive the inorganic light-emitting element. The method for manufacturing a display panel (10) may include combining the first assembly and the second assembly (2000) such that the conductive adhesive layer (140) of the first assembly and the driving layer (220) of the second assembly face each other.

[0124] According to one embodiment of the present disclosure, the first assembly (100) may be provided as one. The second assembly (200) may be provided as a plurality.

[0125] According to one embodiment of the present disclosure, the sizes of the plurality of second assemblies may be arranged to correspond to the size of the one first assembly.

[0126] According to one embodiment of the present disclosure, it may further include sealing the sides of the combined first assembly and the second assembly (3000).

[0127] According to one embodiment of the present disclosure, coupling the second assembly to the first assembly (2000) may include applying at least one of heat or light to the conductive adhesive layer, thereby electrically connecting the conductive adhesive layer to the inorganic light-emitting element and the driving layer (2200).

[0128] According to the present disclosure, the display panel (10) can have improved light efficiency.

[0129] According to the present disclosure, the display panel (10) may not have a visible seam phenomenon.

[0130] According to the present disclosure, defects in the display panel (10) can be reduced.

[0131] According to the present disclosure, the production of a display panel (10) can be facilitated.

[0132] According to the present disclosure, the manufacturing time and manufacturing cost of the display panel (10) can be reduced.

[0133] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0134] The above illustrates and describes specific embodiments. However, the invention is not limited to the above-described embodiments, and those skilled in the art will readily appreciate that various modifications and implementations can be made without departing from the spirit and scope of the invention as set forth in the claims below.

Claims

1. A first assembly including a cover, an inorganic light-emitting element having a light-emitting surface arranged to face the cover, and a conductive adhesive layer provided to cover the cover and the inorganic light-emitting element; and A second assembly including a substrate body and a driving layer formed on the substrate body and configured to drive the inorganic light-emitting element; The second assembly is a display panel coupled to the first assembly such that the driving layer of the second assembly faces the conductive adhesive layer of the first assembly.

2. In paragraph 1, The above first assembly is provided as one, The above second assembly is provided in multiples, A display panel in which the above plurality of second assemblies are arranged to correspond to the above first assembly.

3. In paragraph 2, A display panel in which the plurality of second assemblies are arranged in a matrix form in the first assembly.

4. In paragraph 1, A display panel having a size of the second assembly smaller than that of the first assembly.

5. In paragraph 1, The above first assembly and the above second assembly are separately manufactured display panels.

6. In paragraph 1, A display panel, wherein the conductive adhesive layer is configured to electrically connect the driving layer and the inorganic light-emitting element when at least one of heat and light is applied to the conductive adhesive layer.

7. In paragraph 6, The above first assembly includes a contact electrode formed on the opposite side of the light-emitting surface of the inorganic light-emitting element, The second assembly is a display panel including a pad electrode arranged to correspond to the contact electrode.

8. In paragraph 1, The first assembly is a display panel including an element adhesive layer provided between the cover and the inorganic light-emitting element.

9. In paragraph 1, A display panel in which each side of the display panel is provided to be sealed while the second assembly is coupled to the first assembly.

10. In paragraph 1, The cover of the first assembly includes a first alignment key, The substrate body of the second assembly includes a second alignment key, The second assembly is a display panel coupled to the first assembly while the first alignment key and the second alignment key are aligned.

11. In paragraph 1, The above cover is provided to protect the inorganic light-emitting element, and is a display panel including glass.

12. In paragraph 1, The second assembly is a display panel provided with at least one of a TFT substrate, a PCB substrate, and a CMOS substrate.

13. In paragraph 1, The above substrate body includes a glass substrate, The driving layer is a display panel including at least one of an LTPS (Low Temperature Poly Silicon) TFT, an oxide TFT, an amorphous-silicon TFT, a zinc oxide TFT, an organic TFT, and a graphene TFT.

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